Lightweight high-reliability curved surface receiving array

Abstract

This invention discloses a lightweight and highly reliable curved receiver array, comprising a support frame, array element hydrophones, a potting compound layer, and a PCB adapter board. Multiple array element hydrophones are mounted on the front of the support frame, and a PCB adapter module is mounted on the back of the support frame. The PCB adapter module includes a mounting bracket and a PCB adapter board. The mounting bracket is installed on the back of the support frame, and the PCB adapter board is mounted on the mounting bracket. The PCB adapter board is connected to the array element hydrophones, a signal processing device, and a power supply via watertight cables. The support frame, array element hydrophones, and PCB adapter module are all covered with a potting compound layer. The advantages of this invention are: reasonable design, easy manufacturing, low cost, light weight, convenient installation and use, high sensitivity of the array element hydrophones, high signal acquisition and transmission efficiency, and good electromagnetic interference resistance and reliability.

Description

Technical Field

[0001] This invention belongs to the field of underwater acoustic transducer technology, and in particular to a lightweight and highly reliable curved receiving array. Background Technology

[0002] As the complexity of underwater unmanned platform missions increases, higher demands are placed on sonar detection range, azimuth resolution, and multi-target resolution capabilities. Curved receiver arrays, due to their ability to cover a wide detection angle and form beams with high spatial gain, have become an ideal configuration for bow-mounted sonar on platforms. However, engineering a theoretically designed curved receiver array within the limited space of a platform presents significant system-level integration challenges.

[0003] Currently, underwater unmanned platforms face significant challenges in deploying their sonar systems due to their limited size and payload capacity. The mainstream approach involves placing the receiver array on the platform's hull. While technically mature, this method is limited by platform width and small array aperture, resulting in low spatial gain, wide beamwidth, and severely insufficient target azimuth resolution. Furthermore, hull-side array elements are susceptible to interference from the platform's own radiated noise (such as from thrusters and mechanical equipment), further degrading the signal-to-noise ratio.

[0004] This invention provides a lightweight and highly reliable curved receiving array for the bow space of an underwater unmanned platform. Without sacrificing the platform's mobility and stealth, it achieves high acoustic transparency, high anti-interference capability, and high reliability integration under vibration and water pressure impact. Summary of the Invention

[0005] The technical problem this invention aims to solve is overcoming the challenge of integrating high sensitivity, high anti-interference capabilities, and high reliability into existing underwater unmanned platform sonar systems within the limited space at the bow. First, due to the extremely limited and curved space at the bow of the platform, it is difficult to achieve higher spatial gain within a given array aperture. Second, the limited size and compact structure of the underwater unmanned platform amplify the interference of broadband mechanical vibrations on the array element hydrophones. Furthermore, as the number of array element hydrophones increases, the numerous components such as hydrophones, wires, and preamplifier circuits make it difficult to achieve high-density, low-interference, robust, and reliable integration within the limited three-dimensional curved space, as well as to ensure the long-term reliability of the curved receiving array. Therefore, this invention provides a lightweight and highly reliable curved receiving array.

[0006] The technical solution of this invention is as follows: A lightweight and highly reliable curved receiver array includes a support frame, array element hydrophones, a potting compound layer, and a PCB adapter board. Multiple array element hydrophones are mounted on the front of the support frame, and a PCB adapter module is mounted on the back of the support frame. The PCB adapter module includes a mounting bracket and a PCB adapter board. The mounting bracket is installed on the back of the support frame, and the PCB adapter board is mounted on the mounting bracket. The PCB adapter board is connected to the array element hydrophones, a signal processing device, and a power supply via watertight cables. The support frame, array element hydrophones, and PCB adapter module are all covered with a potting compound layer.

[0007] Preferably, the PCB adapter module further includes a watertight connector, which is installed on the outside of the fixed bracket, and the PCB adapter board is installed on the inside of the fixed bracket. The watertight connector is electrically connected to the PCB adapter board, and the PCB adapter board is connected to the array element hydrophone via wires. The watertight connector is connected to the signal processing device and power supply via a watertight cable. Except for the watertight cable interface of the watertight connector, the PCB adapter module is covered with a potting compound layer.

[0008] Preferably, the front of the support frame is provided with multiple array element mounting slots, and the array element mounting slots have array element wiring holes. The array element hydrophone is stably installed in the array element mounting slot. The signal line and power line of the array element hydrophone pass through the array element wiring holes and are led out and electrically connected to the PCB adapter module. The outer side of the support frame is also provided with multiple frame mounting holes for installing connectors.

[0009] Preferably, an electromagnetic shielding groove is provided on the back of the support frame, and a copper mesh shielding layer is provided in the layup of the support frame.

[0010] Preferably, the support frame is provided with rubber through holes, and there are multiple rubber through holes that are evenly distributed in the low-stress area outside the array element mounting slot.

[0011] Preferably, the array element hydrophone includes a preamplifier circuit board, a copper backing plate, and a sensing layer disposed within a polyurethane adhesive layer. The preamplifier circuit board is mounted on the back of the copper backing plate by fasteners, and an insulating gasket is provided between the preamplifier circuit board and the copper backing plate. The sensing layer is attached to the front of the copper backing plate and is connected to the preamplifier circuit board by wires. The preamplifier circuit board leads out external wires and is electrically connected to the PCB adapter module.

[0012] Preferably, the sensing layer of the array element hydrophone is composed of three layers of electrode sheets and three layers of piezoelectric copolymer film alternately arranged. The uppermost electrode sheet is connected to the lower copper backing plate through a wire to form a ground line and is connected to the ground signal terminal of the preamplifier circuit board. The middle layer electrode sheet is connected to the preamplifier circuit board through a wire to form a positive signal line. The lowermost electrode sheet is connected to the preamplifier circuit board through a wire to form a negative signal line.

[0013] Preferably, the preamplifier circuit board has a low-noise preamplifier circuit and leads out positive signal lines and negative signal lines connected to the signal area of ​​the PCB adapter board. The preamplifier circuit board also leads out positive lines, negative lines, and ground lines connected to the power supply area of ​​the PCB adapter board.

[0014] Preferably, the PCB adapter board is a signal adapter board without internal circuit components. The PCB adapter board is provided with several signal areas and several power supply areas. The array element hydrophone is provided with signal lines connected to the signal areas of the PCB adapter board and power lines connected to the power supply areas. A watertight connector is installed in the middle of the PCB adapter board.

[0015] Preferably, the signal lines include positive signal lines and negative signal lines, the power lines include positive lines, negative lines, and ground lines, and the watertight connector has multiple signal transmission pins and power transmission pins. The PCB adapter board receives signals from each array element hydrophone through the signal area and transmits the signals outward through the signal transmission pins of the watertight connector. At the same time, the PCB adapter board receives external power supply through the power transmission pins of the watertight connector and delivers electrical energy to each array element hydrophone through the power supply area.

[0016] The advantages of this invention are: 1. From a materials perspective, this invention prioritizes various high-quality materials, including lightweight high-strength composite materials, piezoelectric copolymer materials, and titanium alloy materials. The supporting frame, utilizing lightweight materials and a hollow design, achieves both structural lightness and high acoustic transparency, thus solving the problems of heavy weight and poor sound transmission associated with traditional metal frames. The high voltage constant of the piezoelectric polymer material is utilized to achieve high sensitivity in the array element hydrophone.

[0017] 2. From a structural perspective, the support frame surface is equipped with various holes, such as element positions, rubber through holes, wiring holes, and mounting holes. The use of depth-limited positioning holes provides a precise mechanical reference for each element, fundamentally solving the problem of element phase center drift in curved receiver arrays and ensuring the beamwidth of the receiver array. The rubber through-hole design allows the potting compound to form a three-dimensional interlocking structure, transforming the potting interface from a potentially failing shear surface into a robust three-dimensional anchoring structure, completely eliminating the risk of debonding during long-term use. By incorporating micro-electromagnetic shielding grooves on the inner surface of the support frame, combined with the shielding copper mesh introduced into the frame layup, the electromagnetic interference resistance of the receiver array is significantly improved.

[0018] 3. The sensing elements in the receiving array adopt a dual-integrated potting design, thereby avoiding the direct transmission of broadband mechanical vibrations of the platform to the sensing elements. The damping effect of the potting compound is used to improve the vibration interference resistance of the array element hydrophones. In addition, the dual-integrated potting design reduces the possibility of the sensing elements coming into contact with seawater, thus improving the reliability of the receiving array.

[0019] 4. The overall design is reasonable, easy to manufacture, low in cost, light in weight, easy to install and use, the array element hydrophone has high sensitivity, high signal acquisition and transmission efficiency, and is resistant to electromagnetic interference and has good reliability. Attached Figure Description

[0020] Figure 1 This is a front view of the curved receiving array of the present invention; Figure 2 This is a schematic diagram of the back of the curved receiving array of the present invention; Figure 3 This is a perspective view of the array elements of the curved receiving array of the present invention; Figure 4 This is a schematic diagram of the structure of the array element hydrophone of the present invention; Figure 5 This is a schematic diagram of the PCB adapter board of the present invention; Figure 6 This is a schematic diagram of the installation of the watertight connector and the PCB adapter board in this invention; In the diagram: 1-Support frame, 2-Element hydrophone, 3-Element mounting slot, 4-Element wiring hole, 5-Rubber through hole, 6-Frame mounting hole, 7-Connector, 8-Fixing bracket, 9-PCB adapter board, 10-Watertight connector, 11-Potent layer, 12-Polyurethane layer, 13-Electrode sheet, 14-Piezoelectric copolymer film, 15-Copper backing plate, 16-Front amplifier circuit board, 17-External wire, 18-Signal area 1, 19-Signal area 2, 20-Signal area 3, 21-Power supply area 1, 22-Power supply area 2, 23-Power supply area 3, 24-Connector connection area. Detailed Implementation

[0021] The present invention will be further described below with reference to specific embodiments and accompanying drawings: Currently, there are three main technical solutions for sonar systems on underwater unmanned platforms: bow arrays based on rigid metal frames, side arrays, and stern-towed linear arrays. Bow arrays based on rigid metal frames utilize metal materials such as titanium alloys and aluminum alloys to form a supporting frame 1. Hydrophone elements are fixed to the frame using mechanical fixation or adhesive bonding, and then encapsulated in sound-permeable materials such as polyurethane, forming a shape conformal to the bow. In addition, underwater unmanned platforms often employ side arrays or towed linear arrays, such as the HISAS 1030 synthetic aperture sonar on the HUGIN series platform and the multibeam echo sounder on the American BLUEFIN-21 platform. This approach has some inherent drawbacks, such as limited array aperture, insufficient spatial resolution, and the close proximity of the array elements to the stern thrusters, making the elements susceptible to interference from the platform's own radiated noise. Furthermore, for platforms equipped with towed arrays, the towed array will reduce the platform's mobility and stealth, such as the "Orca" and "Alternative".

[0022] Because the existing receiver array's internal support frame 1 is made of metal, the metal frame results in poor overall sound transmission and low receiver array sensitivity. Furthermore, the complex structure of the metal frame is costly to manufacture and difficult to integrate into a multi-functional structure. The heavy weight of the metal frame is also unfavorable for mounting on underwater unmanned platforms. In addition, underwater unmanned platform receiver arrays are often arranged on the side or towed at the stern. Side-mounted arrays are limited by the platform's space constraints, resulting in smaller apertures, and are susceptible to mechanical vibrations at the stern. Towed arrays, on the other hand, affect the platform's maneuverability and stealth. Therefore, existing curved receiver array systems, either due to insufficient performance of the underlying frame or inherent defects in the system architecture, struggle to achieve high performance, high density, and high reliability integration within the limited bow space of an underwater unmanned platform.

[0023] The curved receiving array of the present invention mainly consists of a multifunctional lightweight composite material support frame 1, high-sensitivity hydrophones, and a fully encapsulated integrated potting compound. The array element hydrophones 2 are placed on the array element positions on the lightweight support frame 1, and then the curved receiving array is integrated into a potting compound using the potting compound.

[0024] The array element hydrophone 2 employs a structural design with three layers of high-performance piezoelectric copolymer film 14 stacked on a rigid backing surface. Furthermore, the hydrophone incorporates a low-noise preamplifier circuit, further enhancing its sound field perception capability. Therefore, the output wires of the array element hydrophone 2 contain both positive and negative output signals, as well as the positive and negative ground signals from the preamplifier circuit.

[0025] The array element hydrophone 2 adopts an integrated design, which integrates the piezoelectric copolymer film 14, rigid backing, and preamplifier circuit into a single encapsulation. On the one hand, this facilitates the performance verification of the array element hydrophone 2 and the screening of the array element hydrophone 2, ensuring the consistency of each array element hydrophone 2 in the receiving array; on the other hand, it provides the first layer of protection for core components such as the sensing unit and preamplifier circuit. Example

[0026] This invention provides a lightweight and highly reliable curved receiver array, comprising a support frame 1, array element hydrophones 2, a potting compound layer 11, and a PCB adapter board 9. Multiple array element hydrophones 2 are mounted on the front of the support frame 1, and a PCB adapter module is mounted on the back of the support frame 1. The PCB adapter module includes a fixing bracket 8 and a PCB adapter board 9. The fixing bracket 8 is mounted on the back of the support frame 1, and the PCB adapter board 9 is mounted on the fixing bracket 8. The PCB adapter board 9 is connected to the array element hydrophones 2, a signal processing device, and a power supply via watertight cables. The support frame 1, array element hydrophones 2, and PCB adapter module are covered with a potting compound layer 11.

[0027] In this embodiment, the PCB adapter module includes a fixed bracket 8, a PCB adapter board 9, and a watertight connector 10. The fixed bracket 8 is installed on the back of the support frame 1. The PCB adapter board 9 and the watertight connector 10 are respectively installed on the inner and outer sides of the fixed bracket 8. The PCB adapter board 9 is connected to the array element hydrophone 2 through wires. The watertight connector 10 is connected to the signal processing device and the power supply through a watertight cable. Except for the watertight cable interface of the watertight connector 10, the PCB adapter module is covered with a potting compound layer 11.

[0028] In this embodiment, the support frame 1 is made of carbon fiber. The front of the support frame 1 is evenly provided with multiple array element mounting slots 3. The depth of the array element mounting slots 3 is 1 / 3 of the thickness of the support frame 1. The array element mounting slots 3 are provided with array element wiring holes 4. The array element hydrophone 2 is stably installed in the array element mounting slots 3. The signal line and power line of the array element hydrophone 2 are led out after passing through the array element wiring holes 4 and electrically connected to the PCB adapter module.

[0029] In this embodiment, a plurality of frame mounting holes 6 are provided on the outer side of the support frame 1, and connectors 7 are installed on the frame mounting holes 6 for integrated installation with the platform and / or other receiving arrays.

[0030] In this embodiment, an electromagnetic shielding groove for leading out the wiring of the array element hydrophone 2 is provided on the back of the support frame 1, and a copper mesh for improving the electromagnetic shielding performance of the receiving array is installed in the layup of the support frame 1.

[0031] In this embodiment, the support frame 1 is provided with rubber through holes 5. There are multiple rubber through holes 5, which are evenly arranged in the low stress area outside the array element mounting groove 3. The potting adhesive layer 11 on the support frame 1 is integrally connected to the support frame 1 through the adhesive material in the rubber through holes 5.

[0032] In this embodiment, the array element hydrophone 2 includes a preamplifier circuit board 16, a copper backing plate 15, and a sensing layer disposed within a polyurethane adhesive layer 12. The preamplifier circuit board 16 is mounted on the back of the copper backing plate 15 by fasteners. An insulating gasket is provided between the preamplifier circuit board 16 and the copper backing plate 15. The sensing layer is attached to the front of the copper backing plate 15 and is connected to the preamplifier circuit board 16 by wires. The preamplifier circuit board 16 leads out an external wire 17 and then connects to the PCB adapter board 9 through wiring to achieve electrical connection.

[0033] In this embodiment, the sensing layer is composed of three layers of electrode sheets 13 and three layers of piezoelectric copolymer film 14 alternately arranged. The piezoelectric copolymer film 14 uses a piezoelectric coefficient piezoelectric copolymer film 14 as the sensing material. The uppermost electrode sheet 13 is connected to the lower copper backing plate 15 through a wire to form a ground line and is connected to the ground signal terminal of the preamplifier circuit board 16. The middle layer electrode sheet 13 is connected to the preamplifier circuit board 16 through a wire to form a positive signal line. The lowermost electrode sheet 13 is connected to the preamplifier circuit board 16 through a wire to form a negative signal line.

[0034] In this embodiment, the preamplifier circuit board 16 has a low-noise preamplifier circuit and leads out positive signal lines and negative signal lines connected to the signal area of ​​the PCB adapter board 9, i.e. signal lines. The gain effect of hydrophone sensitivity is achieved through the signal differential amplification principle. The preamplifier circuit board 16 also leads out positive lines, negative lines, and ground lines connected to the power supply area of ​​the PCB adapter board 9, i.e. power lines.

[0035] In this embodiment, the PCB adapter board 9 is a signal adapter board, containing no internal circuit components, used to collect and transmit signals from each array element hydrophone 2. The PCB adapter board 9 has several signal areas and several power supply areas. Each array element hydrophone 2 has signal lines connected to the signal areas of the PCB adapter board 9 and power lines connected to the power supply areas. The signal lines include positive and negative signal lines, and the power lines include positive, negative, and ground lines. A watertight connector 10 is installed in the middle of the PCB adapter board 9. The watertight connector 10 has multiple signal transmission pins and power transmission pins. The PCB adapter board 9 receives signals from each array element hydrophone 2 through the signal areas and transmits the signals outward through the signal transmission pins of the watertight connector 10. Simultaneously, the PCB adapter board 9 receives external power through the power transmission pins of the watertight connector 10 and delivers electrical energy to each array element hydrophone 2 through the power supply areas.

[0036] Here, in conjunction with the appendix Figure 1 To be continued Figure 6 Further explanation is provided below: like Figure 1 , Figure 2 As shown, the receiver array is designed with a lightweight support frame 1. Array element positions are set on the surface of the frame, and the depth of the array element positions is 1 / 3 of the depth of the frame. The limiting design of the array element positions of the frame improves the positioning accuracy of the array element hydrophone 2 and avoids the risk of misalignment caused by the array element hydrophone 2 being directly attached to the surface of the frame. During installation, the array element hydrophone 2 is precisely embedded in the positioning holes on the frame, realizing quick installation and accurate positioning.

[0037] Furthermore, the lightweight composite material support frame 1 features through holes, wire holes, and mounting holes on its surface. Through holes, located in low-stress areas of the frame surface, create a mechanical interlocking effect after the potting compound cures, enhancing the reliability of the curved receiver array and extending its lifespan. The mounting holes connect the curved receiver array to the platform. Due to the fully encapsulated, integrated potting design, the damping effect of the potting compound between the connecting structures reduces the impact of broadband mechanical vibrations on the platform and the array hydrophone 2, thus improving the receiver array's anti-interference capability.

[0038] This invention combines the three-dimensional digital model of the support frame 1 to plan an optimized electrical channel network. On the support frame 1, an independent micro-groove with electromagnetic shielding is designed for each array element hydrophone 2. Combined with the wire holes on the support frame 1, the path standard of the high-density wire bundle inside the receiving array is realized, which effectively reduces the complexity of wiring.

[0039] In addition, copper mesh is introduced into the layup of the composite material support frame 1 to form a large-area, low-impedance power distribution network and grounding plane, thereby improving the electromagnetic interference resistance of the receiving array.

[0040] The curved receiving array employs an integrated potting design, while simultaneously achieving a fully encapsulated and suspended design for the supporting frame 1. This avoids the risk of corrosion and cracking caused by long-term contact between the internal structures, such as the sensing elements and the supporting frame 1, and seawater. The curved receiving array is as follows... Figure 1 , Figure 2 As shown.

[0041] like Figure 3 As shown, due to the large number of elements in the curved receiving array and the limited internal space, the complex and intertwined wiring can easily lead to parasitic capacitance and inductance, resulting in decreased signal integrity and increased crosstalk. This invention employs a multi-channel PCB adapter board 9 to connect each signal line to the corresponding watertight connector 10. This design reduces the operational difficulty of connecting each array element hydrophone 2 to the corresponding watertight connector 10 within a confined space, while also standardizing the path of the high-density wiring and reducing electromagnetic interference between channels.

[0042] The array element hydrophone 2 adopts a structural design based on a piezoelectric copolymer film 14. Utilizing the high piezoelectric voltage constant of the piezoelectric copolymer film 14, the array element hydrophone 2 achieves high sensitivity. For example... Figure 3 As shown, the internal sensing element of the hydrophone consists of three layers of electrode sheets 13, three layers of piezoelectric copolymer film 14, and a copper backing. The upper and lower surfaces of the sensing element form an electrical ground, and the two electrodes in the middle layer serve as positive and negative signal channels. The gain effect of the hydrophone's sensitivity is achieved by utilizing the signal differential amplification principle. Since the piezoelectric copolymer itself has a very high impedance, the output energy is small, and the output signal is very weak, in order to avoid signal loss caused by long-distance transmission, this invention specifically designs a low-noise preamplifier circuit based on the capacitive impedance of the sensing element.

[0043] In this embodiment, four M2*2 screw holes are provided on the back of the copper backing. Two of these holes are used to connect to the low-noise amplifier circuit board, and the other two are used to connect to the mold during subsequent potting. The low-noise preamplifier circuit board is connected to the copper backing using two screws, which are positioned diagonally. Furthermore, a gasket is provided between the low-noise preamplifier circuit board and the copper backing to prevent electrical continuity between the components on the low-noise preamplifier circuit board and the copper backing, thus preventing circuit problems.

[0044] like Figure 5 As shown, the PCB adapter board 9 is divided into multiple areas, including a power supply area, a signal area, and a connector connection area 24. In this embodiment, there are three power supply areas: power supply area 1 (21), power supply area 22, and power supply area 3 (23). There are also three signal areas: signal area 1 (18), signal area 2 (19), and signal area 3 (20). This divides the 14 array element hydrophones 2 of the receiving array into three areas. Signal area 1 (18) connects to hydrophones 2 of array elements 1, 2, 3, 4, and 5; signal area 2 (19) connects to hydrophones 2 of array elements 6, 7, 10, 11, and 12; and signal area 3 (20) connects to hydrophones 2 of array elements 8, 9, 13, and 14. By dividing the signal areas, mutual interference caused by dense stacking of multiple signals is effectively avoided. Simultaneously, the circuit board provides corresponding connection points for the internal circuitry of the receiving array, effectively reducing the difficulty of signal connection during the development of the receiving array.

[0045] like Figure 4 , Figure 5As shown, the top electrode of the array element hydrophone 2 is connected to the bottom copper backing plate 15 via a wire to form a ground signal. The middle layer electrode is the positive signal position, and the bottom electrode plate 13 is the negative signal position. The signal formed by the sensing element is connected to the circuit board accordingly, with the positive signal position connected to OUT+, the negative signal connected to OUT-, and the ground signal connected to GND. The array element hydrophone 2 has five wires leading out, corresponding to the positive power supply, negative power supply, positive signal, negative signal, and ground wires, respectively. The positive and negative signals of the hydrophone are connected to signal areas 1, 2, and 3 of the PCB adapter board 9, and the positive, negative, and ground signals are connected to the power supply area of ​​the PCB adapter board 9. During operation, the low-noise preamplifier circuit is powered first. The signal of the array element hydrophone 2 is amplified by the low-noise preamplifier circuit and then transmitted to the PCB adapter board 9. From there, it is transmitted to the rear signal aggregation box via the lines in the adapter board.

[0046] In this embodiment, the PCB adapter board 9 serves only as a signal converter and does not contain any internal circuit components. The corresponding holes in the signal and power supply areas of the PCB adapter board 9 are connected to the corresponding holes in the plugs. The leads of the array element hydrophone 2 are connected to the corresponding areas of the PCB adapter board 9. After the watertight connector 10 is connected to the PCB adapter board 9, circuit continuity is achieved, ensuring that the array element signal is transmitted to the back-end signal aggregation box.

[0047] like Figure 6 As shown, in this embodiment of the invention, the watertight connector 10 is connected to the support frame 1 by a fixed bracket 8, which prevents the adhesive layer of the receiving array from falling off the frame after repeated plugging and unplugging of the connector. This design improves the reliability of the receiving array.

[0048] In this embodiment, the watertight connector 10 has a total of 32 pins. Pins 1-28 correspond to the positive and negative signals of the 14 array element hydrophones 2, while pins 29, 30, and 31 correspond to the positive, ground, and negative power supplies, respectively, as shown in the table below: Table 1. Connection table of array element hydrophone and corresponding pins:

[0049] In summary, the present invention has the following characteristics: 1. This invention proposes a "conformal fusion of acoustic-electrical-structural" system architecture, which carries out integrated collaborative design to form an acoustic sensing system, a signal acquisition and transmission system, a mechanical support and platform interface system, and finally forms a lightweight, highly reliable curved receiving array that is physically inseparable and functionally deeply coupled through a specific manufacturing process.

[0050] 2. This invention utilizes a multifunctional lightweight support frame 1 to improve the lightweight design of the curved receiving array. It prioritizes advanced composite materials that are lightweight, have good sound transmission, and high strength, ensuring the structural strength of the receiving array while simultaneously improving its lightweight nature.

[0051] 3. The multifunctional lightweight support frame 1 integrates various hole positions, such as array element mounting slots, array element wiring holes, potting compound through holes, and frame mounting holes. Array element mounting slots are provided on the support frame 1 to achieve dense arraying and precise positioning of the array element hydrophones 2. Furthermore, setting the depth of the array element mounting slots to 1 / 3 helps to improve the lightweight design of the receiving array. Array element wiring holes are correspondingly provided at the array element mounting slots. On the one hand, the bandgap effect is used to block the transmission of bending waves, reducing the impact of frame vibration on the array element hydrophones 2; on the other hand, it further realizes the lightweight design of the frame. In addition, potting compound through holes are provided on the support frame 1. The three-dimensional mechanical interlocking effect after the potting compound cures improves the reliability of the receiving array in harsh application environments.

[0052] 4. Linear array element wiring holes are set on the support frame 1. Combined with the electromagnetic shielding micro-grooves designed on the inner surface of the frame, high-density wire harnesses are laid out in a standardized manner, which improves the anti-electromagnetic interference performance between the array element hydrophones 2. In addition, the shielding copper mesh designed in the frame layup further enhances the anti-electromagnetic interference capability of the receiving array.

[0053] 5. In this invention, the array element hydrophone 2 uses a piezoelectric copolymer film 14 with a high piezoelectric coefficient as the sensitive material, achieving a high-sensitivity design for the array element hydrophone 2, thereby improving the sound field sensing capability of the receiving array. The piezoelectric copolymer film 14 has a high piezoelectric voltage coefficient (g... 33 The piezoelectric copolymer film 14, under hydrostatic pressure, generates a high output voltage and possesses inherent high sensitivity and good wideband response characteristics, ensuring the hydrophone's sound field perception capability in deep diving environments. The characteristic impedance of the piezoelectric copolymer film 14 is close to that of water, improving the sound transmission of the receiving array.

[0054] 6. The receiving array adopts an integrated potting method to achieve a fully encapsulated and suspended design of the supporting frame 1. This is a key integrated process, which is not only the potting protection of internal components and structures, but also a key process for simultaneously completing structural molding, electrical interconnection and fixation, and acoustic interface shaping. The potting colloid is the matrix that ultimately solidifies the three into a unified and continuous medium.

[0055] 7. The integrated potting and encapsulation process is used to protect the internal core components and prevent corrosion and cracking caused by long-term contact with seawater, such as the support frame 1, sensing elements, and preamplifier circuit, thus improving the reliability of the receiving array.

[0056] 8. This invention actually creates a novel composite material system consisting of an interpenetrating continuous fiber-reinforced phase (carbon fiber) and a three-dimensional continuous polymer phase (potting compound).

[0057] 9. This invention is based on the array design of a curved receiving array with an outer radius of 225mm. Determining the number of array elements N is a multi-objective optimization process: while obtaining the best spatial resolution potential, it is necessary to comprehensively consider the surface area of ​​the receiving array, the physical dimensions of the array elements and connectors, the internal cabling space, and the obstruction effect on the sound field. Through this optimization process, under the specific dimensions of this embodiment, the preferred number of array elements N=14 to achieve the best balance between acoustic performance and structural space utilization.

[0058] It should be noted that the above embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Equivalent modifications made based on the above embodiments are all within the scope of protection of the present invention.

Claims

1. A lightweight and highly reliable curved receiving array, characterized in that, The device includes a support frame, array element hydrophones, a potting compound layer, and a PCB adapter board. Multiple array element hydrophones are mounted on the front of the support frame, and a PCB adapter module is mounted on the back of the support frame. The PCB adapter module includes a mounting bracket and a PCB adapter board. The mounting bracket is mounted on the back of the support frame, and the PCB adapter board is mounted on the mounting bracket. The PCB adapter board is connected to the array element hydrophones, a signal processing device, and a power supply via watertight cables. The support frame, array element hydrophones, and PCB adapter module are covered with a potting compound layer.

2. The lightweight and highly reliable curved receiving array according to claim 1, characterized in that: The PCB adapter module also includes a watertight connector, which is installed on the outside of the fixed bracket. The PCB adapter board is installed on the inside of the fixed bracket. The watertight connector is electrically connected to the PCB adapter board. The PCB adapter board is connected to the array element hydrophone through wires. The watertight connector is connected to the signal processing device and power supply through a watertight cable. Except for the watertight cable interface of the watertight connector, the PCB adapter module is covered with a potting compound layer.

3. The lightweight and highly reliable curved receiving array according to claim 1, characterized in that: The front of the support frame is provided with multiple array element mounting slots, and there are array element wiring holes in the array element mounting slots. The array element hydrophone is stably installed in the array element mounting slot. The signal line and power line of the array element hydrophone are led out after passing through the array element wiring holes and electrically connected to the PCB adapter module. The outer side of the support frame is also provided with multiple frame mounting holes for installing connectors.

4. The lightweight and highly reliable curved receiving array according to claim 1, characterized in that: An electromagnetic shielding groove is provided on the back of the support frame, and a copper mesh shielding layer is provided in the layup of the support frame.

5. The lightweight and highly reliable curved receiving array according to claim 1, characterized in that: The support frame is provided with rubber through holes, and there are multiple rubber through holes that are evenly distributed in the low-stress area outside the array element mounting slot.

6. The lightweight and highly reliable curved receiving array according to claim 1, characterized in that: The array element hydrophone includes a preamplifier circuit board, a copper backing plate, and a sensing layer disposed within a polyurethane adhesive layer. The preamplifier circuit board is mounted on the back of the copper backing plate by fasteners, and an insulating gasket is provided between the preamplifier circuit board and the copper backing plate. The sensing layer is attached to the front of the copper backing plate and is connected to the preamplifier circuit board by wires. The preamplifier circuit board leads out external wires and is electrically connected to a PCB adapter module.

7. A lightweight and highly reliable curved receiving array according to claim 6, characterized in that: The sensing layer of the array element hydrophone is composed of three layers of electrode sheets and three layers of piezoelectric copolymer film arranged alternately. The uppermost electrode sheet is connected to the lower copper backing plate through wires to form a ground line and is connected to the ground signal terminal of the preamplifier circuit board. The middle layer electrode sheet is connected to the preamplifier circuit board through wires to form a positive signal line. The lowermost electrode sheet is connected to the preamplifier circuit board through wires to form a negative signal line.

8. A lightweight, highly reliable curved receiving array according to claim 6 or 7, characterized in that: The preamplifier circuit board has a low-noise preamplifier circuit and leads out positive signal lines and negative signal lines connected to the signal area of ​​the PCB adapter board. The preamplifier circuit board also leads out positive lines, negative lines, and ground lines connected to the power supply area of ​​the PCB adapter board.

9. A lightweight and highly reliable curved receiving array according to claim 1, characterized in that: The PCB adapter board is a signal adapter board without internal circuit components. The PCB adapter board is provided with several signal areas and several power supply areas. The array element hydrophone is provided with signal lines connected to the signal areas of the PCB adapter board and power lines connected to the power supply areas. A watertight connector is installed in the middle of the PCB adapter board.

10. A lightweight and highly reliable curved receiving array according to claim 9, characterized in that: The signal lines include positive signal lines and negative signal lines, and the power lines include positive lines, negative lines, and ground lines. The watertight connector has multiple signal transmission pins and power transmission pins. The PCB adapter board receives signals from each array element hydrophone through the signal area and transmits the signals outward through the signal transmission pins of the watertight connector. At the same time, the PCB adapter board receives external power supply through the power transmission pins of the watertight connector and delivers electrical energy to each array element hydrophone through the power supply area.

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