Electro-optical modulator chip, package structure and electronic device

Abstract

This application provides an electro-optic modulator chip, a packaging structure, and an electronic device, relating to the field of optical communication technology. The electro-optic modulator chip includes: a first end connected to an input light source, and a second end connected to an output light source and a monitoring end; the input light source is used to transmit an input optical signal to the electro-optic modulator; the electro-optic modulator modulates the input optical signal to obtain a modulated optical signal and a monitoring optical signal, and transmits the modulated optical signal to the output light source and the monitoring optical signal to the monitoring end; the output light source is used to output the modulated optical signal; the monitoring end is used to output the monitoring optical signal; the transmission direction of the optical signal is parallel to the plane of the substrate. The packaging structure includes: a substrate, a monitor, and the electro-optic modulator chip; the electro-optic modulator chip is fixedly mounted on the substrate; the monitor is fixedly mounted on the substrate; the monitor receives the monitoring optical signal output by the electro-optic modulator chip and performs optical power monitoring based on the monitoring optical signal to obtain the monitoring result.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical communication, in particular to an electro-optical modulator chip, a packaging structure and an electronic device. BACKGROUND

[0002] Lithium niobate and lithium tantalate and other ferroelectric materials have excellent electro-optic modulation characteristics and can be used to manufacture thin-film electro-optic modulators. However, due to the low light absorption coefficient and low carrier mobility of such materials in the optical communication band, they cannot be directly used to manufacture photodetectors. In order to provide a detector for the thin-film electro-optic modulator chip for optical power monitoring and high-speed optical detection, other materials with high light absorption coefficient, such as III-V compounds and germanium, are currently integrated with the thin-film electro-optic modulator chip through chip-level bonding, wafer-level bonding or wafer-level regrowth and other heterogeneous integration processes.

[0003] In the prior art, a thin-film electro-optic modulator is first prepared on a ferroelectric material to obtain a thin-film electro-optic modulator chip, and then a series of III-V monitoring detector chips are flipped and attached to the surface of the thin-film electro-optic modulator chip by means of glue or reflow soldering to achieve optical power monitoring. This structure of attaching a monitoring detector chip with a certain thickness to the surface of the chip will result in inconsistent heights of the surface of the thin-film electro-optic modulator chip, which cannot be further packaged with a carrier board such as a printed circuit board by means of flipping and attaching to obtain the best signal integrity. Moreover, even if a packaging structure that can be flipped and attached is obtained on the carrier board through other means, the high temperature generated in the reflow soldering step in the packaging process will cause the monitoring detector chip that has been attached to the surface of the thin-film electro-optic modulator chip to fall off. Therefore, the existing thin-film electro-optic modulator chip has the problems of large packaging difficulty and poor structural reliability, resulting in poor performance of the thin-film electro-optic modulator chip, which cannot meet the current use requirements. SUMMARY

[0004] Therefore, the purpose of the embodiments of the present application is to provide an electro-optical modulator chip, a packaging structure and an electronic device to solve the problem of poor performance of the existing thin-film electro-optic modulator chip.

[0005] To solve the above problems, in a first aspect, the embodiments of the present application provide an electro-optical modulator chip, which comprises a substrate, an input light end, an electro-optical modulator, an output light end and a monitoring end. The input light end, the electro-optical modulator, the output light end and the monitoring end are fixedly arranged on the substrate. A first end of the electro-optical modulator is connected to the input light end, and a second end of the electro-optical modulator is connected to the output light end and the monitoring end. The input light end is used to transmit an input optical signal to the electro-optical modulator. The electro-optic modulator is used to modulate the input optical signal to obtain a modulated optical signal and a monitoring optical signal, and transmits the modulated optical signal to the output end and the monitoring optical signal to the monitoring end; The light-emitting end is used to output the modulated optical signal; the monitoring end is used to output the monitoring optical signal. The direction of optical signal transmission is parallel to the plane of the substrate.

[0006] In the above implementation process, the substrate of the electro-optic modulator chip is provided with an input end for transmitting the input optical signal and one or more electro-optic modulators for modulating the input optical signal. In order to provide feedback adjustment for the operation of the electro-optic modulator, after the electro-optic modulator modulates the optical signal, it can generate a modulated optical signal for output and a monitoring optical signal for status monitoring. The modulated optical signal is transmitted to the output end and the monitoring optical signal is transmitted to the monitoring end. The output end outputs the modulated optical signal to realize the corresponding communication or control function, and the monitoring end outputs the monitoring optical signal to determine the operating status of the electro-optic modulator, thereby providing feedback adjustment for the operating status of the electro-optic modulator based on actual needs. Furthermore, it should be noted that the transmission direction of various types of optical signals within the electro-optic modulator chip is parallel to the plane of the substrate, i.e., horizontal signal transmission is achieved. This allows for the setting of corresponding monitoring terminals within the electro-optic modulator chip to perform horizontal output processing of the monitored optical signals, eliminating the need to stack corresponding monitors on the upper surface of the electro-optic modulator chip for monitoring and processing. This reduces the packaging difficulty caused by height differences and the adverse effects of monitor detachment due to high temperatures, thereby reducing the packaging difficulty of the thin-film electro-optic modulator chip and optimizing its performance to meet the usage requirements of various application scenarios.

[0007] Optionally, the electro-optic modulator chip further includes: a first type of beam splitter; the light input end and the monitoring end are connected through the first type of beam splitter; The first type of beam splitter is used to split the input optical signal input from the light input end to obtain a portion of the optical signal; The monitoring terminal is also used to output a portion of the optical signal.

[0008] In the above implementation process, to monitor the input optical signal and adjust the operating status of the light source and external optical signal sources, a first-type beam splitter can be set within the electro-optic modulator chip. The light source and monitoring end can be connected through the first-type beam splitter. The first beam splitter can split the input optical signal from the light source to obtain a partial optical signal and a remaining optical signal for powering the electro-optic modulator for modulation. The partial optical signal can be transmitted to the monitoring end, where it is output to monitor the status of the input optical signal. By monitoring and processing the input optical signal, and combining it with actual conditions and requirements, the operating status of the light source and external optical signal sources can be adjusted accordingly, effectively improving the effectiveness and real-time performance of the input optical signal.

[0009] Optionally, the first type of beam splitter is disposed on the optical path connecting the electro-optic modulator to the light-emitting end near the light-inlet end.

[0010] In the above implementation process, when there are multiple electro-optic modulators, considering the loss of optical signals, the farther the output end is from the input end, the greater the optical loss in the corresponding optical path. In order to reduce the adverse effects caused by optical loss, the first type of beam splitter can be set on the connecting optical path between the electro-optic modulator connected to the output end near the input end and the input end, that is, set on the optical path with the least optical loss. This way, the optical signal split out by the first type of beam splitter on the connecting optical path reduces the difference in optical signal loss between multiple optical paths, and further optimizes the quality of the modulated optical signal.

[0011] Optionally, the number of the electro-optic modulators is n, where n is a positive integer greater than or equal to 1; The number of light-emitting ends is n; the number of monitoring ends is n+1.

[0012] In the above implementation process, there can be one or more electro-optic modulators. The number of light output ends is the same as the number of electro-optic modulators. In order to monitor the input optical signal and each electro-optic modulator, the number of monitoring ends is one more than the number of electro-optic modulators, so as to realize targeted optical signal transmission and status monitoring.

[0013] Optionally, when n is greater than or equal to 2, the electro-optic modulator chip further includes: a second type of beam splitter; The electro-optic modulator and the light input end are connected via the second type of beam splitter; The second type of beam splitter is used to split the input optical signal to obtain multiple split signals, and transmits the corresponding split signal to each of the electro-optic modulators; Each of the electro-optic modulators is used to modulate the corresponding split signal to obtain a corresponding sub-modulated optical signal; wherein the modulated optical signal includes a plurality of the sub-modulated optical signals.

[0014] In the above implementation process, when multiple electro-optic modulators are used, a second type of beam splitter can be set in the electro-optic modulator chip to perform modulation processing on the corresponding optical signal input to each electro-optic modulator. Each electro-optic modulator is connected to the input end through a corresponding second type of beam splitter. The second type of beam splitter can split the input optical signal to obtain multiple split signals and transmit the corresponding split signals to each electro-optic modulator. Each electro-optic modulator modulates the corresponding split signals to obtain multiple sub-modulated optical signals, which are then transmitted to the corresponding output end for output. The ability to perform beam splitting processing on the input optical signal through the set second type of beam splitter effectively improves the effectiveness of optical signal modulation by multiple electro-optic modulators.

[0015] Optionally, the setting parameters of the second type of beam splitter are determined based on the number of the electro-optic modulators; The setting parameters include the number of the second type of beam splitters and the setting level of the second type of beam splitters.

[0016] In the above implementation process, the number of second-type beam splitters and the number of setting levels can be determined based on the actual number of electro-optic modulators to achieve multi-channel beam splitting function and obtain multiple split signals.

[0017] Optionally, the electro-optic modulator chip further includes: an optical waveguide; The light-inlet end is connected to the electro-optic modulator via the optical waveguide; The electro-optic modulator is connected to the light-emitting end via the optical waveguide; The electro-optic modulator is connected to the monitoring terminal via the optical waveguide; The optical waveguide is used to transmit optical signals.

[0018] In the above implementation process, multiple devices such as the light input end, electro-optic modulator, light output end, and monitoring end are connected by optical waveguides to realize the corresponding optical path structure. The optical waveguide can transmit various types of optical signals in the transmission direction, thereby realizing the output of optical signals in the horizontal direction. There is no need to set a monitor on the surface of the electro-optic modulator chip to realize the monitoring of the output of optical signals in the vertical direction, thereby reducing the packaging difficulty of the electro-optic modulator chip and improving the reliability of the packaging.

[0019] Optionally, the monitoring end is disposed at the edge of the substrate.

[0020] In the above implementation process, in order to improve the effectiveness of monitoring the output of optical signals, the monitoring end can be set at the edge of the substrate to reduce the adverse effects of abnormal optical signal transmission caused by positional limitations.

[0021] Optionally, the monitoring end includes: a monitoring end face coupler; The light-inlet end includes: a light-inlet end-face coupler; The light-emitting end includes: a light-emitting end face coupler.

[0022] In the above implementation process, in order to achieve optical signal input and output in a plane direction parallel to the substrate, the monitoring end can be set as a monitoring end-face coupler, the light-inlet end can be set as a light-inlet end-face coupler, and the light-outlet end can be set as a light-outlet end-face coupler. The horizontal signal transmission can be achieved through the end-face coupler, so that there is no need to set a monitor on the surface of the electro-optic modulator chip to achieve optical signal transmission in the vertical direction, which effectively reduces the packaging difficulty of the electro-optic modulator chip and improves the reliability of the packaging.

[0023] Secondly, embodiments of this application also provide a packaging structure, the packaging structure comprising: a substrate, a monitor, and an electro-optic modulator chip as described in any one of the first aspects above; The electro-optic modulator chip is fixedly mounted on the substrate; The monitor is fixedly mounted on the base plate; The monitor is used to receive the monitoring optical signal output by the electro-optic modulator chip, and to perform optical power monitoring based on the monitoring optical signal to obtain the monitoring result.

[0024] In the above implementation process, the electro-optic modulator chip is fixedly mounted on the substrate. Since the electro-optic modulator chip can transmit optical signals in a direction parallel to the surface of the substrate, the monitor is also fixedly mounted on the substrate, rather than on the electro-optic modulator chip. The monitor can receive the monitoring optical signal output by the electro-optic modulator chip in the horizontal direction, and perform optical power monitoring based on the monitoring optical signal to obtain the monitoring result. Based on the monitoring result, the operating parameters of the electro-optic modulator chip are adjusted accordingly to adjust the operating state of the electro-optic modulator and other devices. This eliminates the need to stack corresponding monitors on the upper surface of the electro-optic modulator chip for monitoring, thereby reducing the packaging difficulty caused by height differences and the adverse effects of monitor detachment due to high temperatures. It also reduces the packaging difficulty and improves the structural reliability of the packaging structure, and effectively optimizes the operating performance of each device in the packaging structure, meeting the usage requirements of various application scenarios.

[0025] Optionally, the number of the monitors is the same as the number of monitoring terminals in the electro-optic modulator chip; The position of each monitor on the substrate is determined based on the corresponding monitoring terminal, and each monitor is used to receive the monitoring optical signal transmitted by the corresponding monitoring terminal.

[0026] In the above implementation process, considering that the electro-optic modulator chip may have multiple monitoring terminals and be able to output multiple different types of monitoring optical signals, in order to process each monitoring optical signal specifically, the number of monitors is consistent with the number of monitoring terminals to achieve one-to-one monitoring optical signal transmission. Furthermore, the setting position of the monitors on the substrate can be determined according to the actual position of the monitoring terminals to improve the effectiveness of optical signal transmission between the monitoring terminals and the monitors, so that each monitor can receive the monitoring optical signal transmitted by the corresponding monitoring terminal, effectively improving the accuracy of optical signal monitoring, as well as the efficiency and effectiveness of feedback adjustment of the electro-optic modulator chip.

[0027] Thirdly, embodiments of this application also provide an electronic device, which includes the packaging structure described in any one of the second aspects above.

[0028] In summary, the embodiments of this application provide an electro-optic modulator chip, a packaging structure, and an electronic device. This eliminates the need to stack corresponding monitors on the upper surface of the electro-optic modulator chip for monitoring and processing, thereby reducing the packaging difficulty caused by height differences and the adverse situation of monitors falling off due to high temperature. It also reduces the packaging difficulty of the packaging structure and improves the structural reliability of the packaging structure. Furthermore, it can effectively optimize the working performance of each device in the packaging structure and meet the usage requirements of various application scenarios. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of an electro-optic modulator chip provided in an embodiment of this application; Figure 2 This is a schematic diagram of the specific structure of an electro-optic modulator chip provided in an embodiment of this application; Figure 3 This is a schematic diagram of a packaging structure provided in an embodiment of this application.

[0031] Icons: 100-Electro-optic modulator chip; 110-Substrate; 120-Light input end; 130-Electro-optic modulator; 140-Light output end; 150-Monitoring end; 161-Type I beam splitter; 162-Type II beam splitter; 163-Optical waveguide; 200-Substrate; 300-Monitor. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of the embodiments of this application.

[0033] Currently, monitoring detector chips are typically mounted onto the surface of thin-film electro-optic modulator chips using adhesive or reflow soldering. The optical signal transmission direction is perpendicular to the surface of the electro-optic modulator chip, achieving optical power monitoring through vertical coupling. This structure, where a monitoring detector chip of a certain thickness is mounted on the chip surface, results in inconsistent heights across the surface of the thin-film electro-optic modulator chip, making further encapsulation with a printed circuit board or other carrier substrate via flip-mounting to achieve optimal signal integrity. Furthermore, even if a flip-mountable encapsulation structure is obtained on the carrier substrate using other methods, the high temperatures generated during the reflow soldering process can cause the monitoring detector chip already mounted on the surface of the thin-film electro-optic modulator chip to detach. Therefore, existing thin-film electro-optic modulator chips suffer from significant encapsulation difficulties and poor structural reliability, resulting in poor performance and failing to meet current application requirements.

[0034] To address the aforementioned issues, this application provides an electro-optic modulator chip, a packaging structure, and an electronic device. This eliminates the need to stack corresponding monitors on the upper surface of the electro-optic modulator chip for monitoring, thereby reducing packaging difficulties caused by height differences and the risk of monitors detaching due to high temperatures. It also reduces the packaging difficulty and improves the structural reliability of the packaging structure, effectively optimizing the performance of each device within the packaging structure and meeting the needs of various application scenarios.

[0035] Optionally, the packaging structure provided in this application embodiment can be disposed in various types of electronic devices. The electronic devices can be devices in the field of optical communication, such as optical sensing and measurement devices, laser devices, optical communication and information processing devices, imaging and display devices, and other different types of devices.

[0036] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of an electro-optic modulator chip provided in an embodiment of this application. The electro-optic modulator chip may include: a substrate 110, a light-inlet end 120, an electro-optic modulator 130, a light-outlet end 140, and a monitoring end 150.

[0037] Optionally, the substrate 110 can be an organic substrate, an inorganic substrate, such as an organic substrate, or a silicon dioxide substrate, a silicon substrate, silicon-on-insulator, a glass substrate, a ceramic substrate, etc.

[0038] It should be noted that the light input end 120, the electro-optic modulator 130, the light output end 140 and the monitoring end 150 are all fixedly disposed on the substrate 110, and multiple devices can be fabricated on the substrate 110 through processes such as deposition and etching.

[0039] Optionally, the light input end 120, the light output end 140, and the monitoring end 150 can all be couplers with optical signal transmission functions. The electro-optic modulator 130 can be a thin-film electro-optic modulator 130 with excellent electro-optic modulation characteristics.

[0040] The electro-optic modulator 130 has its first end connected to the light input end 120 and its second end connected to the light output end 140 and the monitoring end 150. The light input end 120 transmits an input optical signal to the electro-optic modulator 130, which modulates the input optical signal to obtain a modulated optical signal and a monitoring optical signal. The modulated optical signal is then transmitted to the light output end 140, and the monitoring optical signal is transmitted to the monitoring end 150. The light output end 140 outputs the modulated optical signal, and the monitoring end 150 outputs the monitoring optical signal. The substrate 110 of the electro-optic modulator chip is provided with an input end 120 for transmitting the input optical signal and one or more electro-optic modulators 130 for modulating the input optical signal. In order to provide feedback adjustment for the operation of the electro-optic modulator 130, after the electro-optic modulator 130 modulates the optical signal, it can generate a modulated optical signal for output and a monitoring optical signal for status monitoring. The modulated optical signal is transmitted to the output end 140 and the monitoring optical signal is transmitted to the monitoring end 150. The output end 140 outputs the modulated optical signal to realize the corresponding communication or control function, and the monitoring end 150 outputs the monitoring optical signal to determine the operating status of the electro-optic modulator 130, thereby providing feedback adjustment for the operating status of the electro-optic modulator 130 based on actual needs.

[0041] Optionally, the number of devices such as the light input end 120, the electro-optic modulator 130, the light output end 140, the monitoring end 150, and the electro-optic modulator 130 can be set according to actual needs.

[0042] Optionally, the second end of the electro-optic modulator 130 has a main output port and a secondary output port. The main output port is connected to the output end 140, and the secondary output port is connected to the monitoring end 150. Compared with the modulated optical signal, the monitoring optical signal has less energy and will not affect the normal use of the modulated optical signal.

[0043] It should be noted that the transmission direction of the optical signal is parallel to the plane of the substrate 110. Various types of optical signals can be transmitted parallel to the plane of the substrate 110 within the electro-optic modulator chip, achieving horizontal signal transmission. This allows for the placement of corresponding monitoring terminals 150 within the electro-optic modulator chip to perform horizontal output processing of the monitored optical signals. This eliminates the need to stack corresponding monitors on the upper surface of the electro-optic modulator chip for monitoring and processing, thereby reducing packaging difficulty due to height differences and the adverse effects of monitor detachment due to high temperatures. This reduces the packaging difficulty of the thin-film electro-optic modulator chip and optimizes its performance, meeting the usage requirements of various application scenarios.

[0044] Optionally, please refer to Figure 2 , Figure 2 This is a schematic diagram of the specific structure of an electro-optic modulator chip provided in an embodiment of this application. In a specific application scenario, there are four electro-optic modulators 130, which can output modulated optical signals with four sub-signals.

[0045] Optionally, to monitor the input optical signal and adjust the operating status of the light input terminal 120 and the source of the external optical signal, the electro-optic modulator chip may further include: a first type of beam splitter 161; the light input terminal 120 and the monitoring terminal 150 are connected through the first type of beam splitter 161. The first type of beam splitter 161 is used to split a portion of the optical signal from the input optical signal input to the light input terminal 120, and the monitoring terminal 150 is also used to output a portion of the optical signal. The first beam splitter can perform beam splitting processing on the input optical signal input to the light input terminal 120 to obtain a portion of the optical signal and a remaining optical signal for modulation by the power optical modulator 130. The portion of the optical signal can be transmitted to the monitoring terminal 150, which outputs it to monitor the status of the input optical signal. By monitoring and processing the input optical signal, and combining it with the actual situation and requirements, the operating status of the light input terminal 120 and the source of the external optical signal can be adjusted in feedback, effectively improving the effectiveness and real-time performance of the input optical signal.

[0046] It should be noted that the first type of optical splitter 161 can be a small-ratio optical splitter, in which the energy of a portion of the optical signal is extremely low. For example, the energy ratio of a portion of the optical signal to the input optical signal is 1 / 100. The portion of the optical signal used for monitoring and feedback adjustment of the input optical signal accounts for a very small proportion and will not affect the normal application of the input optical signal.

[0047] Optionally, after receiving and processing the optical signal, the external monitor can adjust the operating power of the optical input 120 or the power of the external signal source according to actual usage requirements, so as to adjust the input optical signal.

[0048] It should be noted that, considering the loss of optical signals when multiple electro-optic modulators 130 are present, the further the output end 140 is from the input end 120, the greater the optical loss in the corresponding optical path. To reduce the adverse effects of optical loss, the first type of beam splitter 161 can be positioned on the optical path connecting the output end 140 (close to the input end 120) to the input end 120. That is, the first type of beam splitter 161 can be positioned on the optical path with the least optical loss, so that the portion of the optical signal split by the first type of beam splitter 161 on the connecting optical path reduces the difference in optical signal loss between multiple optical paths, further optimizing the quality of the modulated optical signal.

[0049] Optionally, with Figure 2 Taking a specific structure as an example, the first type of beam splitter 161 can be set in the connecting optical path between the bottom electro-optic modulator 130 and the light input end 120.

[0050] It should be noted that the number of electro-optic modulators 130 is n, where n is a positive integer greater than or equal to 1; the number of light-emitting terminals 140 is n; and the number of monitoring terminals 150 is n+1. There can be one or more electro-optic modulators 130. The number of light-emitting terminals 140 is the same as the number of electro-optic modulators 130. To monitor the input optical signal and each electro-optic modulator 130, the number of monitoring terminals 150 is one more than the number of electro-optic modulators 130, enabling targeted optical signal transmission and status monitoring.

[0051] Please continue reading. Figure 2When n is greater than or equal to 2, i.e., when there are multiple electro-optic modulators 130, in order to perform modulation processing on the corresponding optical signal input to each electro-optic modulator 130, the electro-optic modulator chip may further include a second type of beam splitter 162. The electro-optic modulator 130 and the light input end 120 are connected through the second type of beam splitter 162. The second type of beam splitter 162 is used to perform beam splitting processing on the input optical signal to obtain multiple beam split signals, and transmits the corresponding beam split signal to each electro-optic modulator 130. Each electro-optic modulator 130 is used to modulate the corresponding beam split signal to obtain the corresponding sub-modulated optical signal; wherein, the modulated optical signal includes multiple sub-modulated optical signals. Each electro-optic modulator 130 is connected to the input end 120 via a corresponding second-type beam splitter 162. The second-type beam splitter 162 can split the input optical signal to obtain multiple split signals and transmit the corresponding split signals to each electro-optic modulator 130. Each electro-optic modulator 130 modulates the corresponding split signals to obtain multiple sub-modulated optical signals, which are then transmitted to the corresponding output end 140 for output. The second-type beam splitter 162 can be used to split the input optical signal, effectively improving the effectiveness of optical signal modulation by multiple electro-optic modulators 130.

[0052] It should be noted that the setting parameters of the second type of beam splitter 162 are determined based on the number of electro-optic modulators 130. These setting parameters include the number of the second type of beam splitter 162 and the number of setting levels for the second type of beam splitter 162. The number of the second type of beam splitter 162 and the number of setting levels can be determined based on the actual number of electro-optic modulators 130 to achieve multi-path beam splitting and obtain multiple split signals.

[0053] For example, in Figure 2 The structure shown includes one first-stage second-type beam splitter 162 and two second-stage second-type beam splitters 162. The first-stage second-type beam splitter 162 first splits the input optical signal into two signals, and then the two second-stage second-type beam splitters 162 further split each signal, resulting in four beam split signals. With two electro-optic modulators 130, a single-stage second-type beam splitter 162 can be used to obtain two beam split signals. With eight electro-optic modulators 130, one first-stage second-type beam splitter 162, two second-stage second-type beam splitters 162, and four third-stage third-type beam splitters can be used to obtain eight beam split signals. This application only shows a feasible structure with four electro-optic modulators 130; structures with other numbers are not described in detail.

[0054] Optionally, the actual beam splitting ratio of each second type beam splitter 162 can be set according to the actual situation. For example, in order to provide a stable and uniform light source for multiple electro-optic modulators 130, the second type beam splitter 162 can split the input optical signal in an equal proportion. That is, multiple second type beam splitters 162 can be set as average beam splitters with a beam splitting ratio of 50:50, or a beam splitting ratio close to 50:50 (such as 51:49) can be set based on the actual loss situation to achieve the equal splitting effect and obtain multiple beam splitting signals with the same energy.

[0055] Optionally, the first type of beam splitter 161 can be disposed between the electro-optic modulator 130 and the second-stage second type of beam splitter 162, or between the second-stage second type of beam splitter 162 and the first-stage second type of beam splitter 162, or between the first-stage second type of beam splitter 162 and the input end 120. Preferably, considering the loss difference between multiple beam splitting signals, the bottom electro-optic modulator 130 receives the beam splitting signal with the least loss, and the top electro-optic modulator 130 receives the beam splitting signal with the greatest loss, such as... Figure 2 As shown, the first type of beam splitter 161 can be placed between the bottom electro-optic modulator 130 and the second type of beam splitter 162 of the second stage. The first type of beam splitter 161 extracts a portion of the optical signal from the beam splitter with the least loss for monitoring and output, which can further reduce the loss difference between multiple beam splitters, thereby reducing the abnormal difference between multiple sub-modulation signals.

[0056] Please continue reading. Figure 2 The electro-optic modulator chip may further include an optical waveguide 163. The input end 120 is connected to the electro-optic modulator 130 via the optical waveguide 163, the output end 140 is connected via the optical waveguide 163, and the monitoring end 150 is connected via the optical waveguide 163. The optical waveguide 163 is used to transmit optical signals. Multiple devices, including the input end 120, the electro-optic modulator 130, the output end 140, and the monitoring end 150, are connected via the optical waveguide 163 to achieve corresponding optical path structures. The optical waveguide 163 can transmit various types of optical signals in the transmission direction, thereby achieving horizontal optical signal output. This eliminates the need to place a monitor on the surface of the electro-optic modulator chip to monitor the vertical optical signal output, thus reducing the packaging difficulty of the electro-optic modulator chip and improving packaging reliability.

[0057] Optionally, the optical waveguide 163 can be configured as a thin-film optical waveguide or other device, which can efficiently transmit various types of optical signals.

[0058] It should be noted that the monitoring end 150 is located at the edge of the substrate 110. In order to improve the effectiveness of monitoring the output of optical signals, the monitoring end 150 can be located at the edge of the substrate 110 to reduce the adverse effects of abnormal optical signal transmission caused by positional limitations.

[0059] Optionally, the specific location of the monitoring end 150 on the edge of the substrate 110 can be set according to the actual distribution of various devices and optical path structures on the substrate 110. For example, it can be set at the edge or boundary of multiple sides of the substrate.

[0060] It should be noted that, in order to achieve optical signal input and output in a plane parallel to the substrate 110, the monitoring end 150 includes a monitoring end-face coupler, the light-inlet end 120 includes a light-inlet end-face coupler, and the light-outlet end 140 includes a light-outlet end-face coupler. Horizontal signal transmission can be achieved through the end-face coupler, i.e., a side-illuminated coupler disposed on the edge end face, thus eliminating the need to place a monitor on the surface of the electro-optic modulator chip to achieve vertical optical signal transmission. This effectively reduces the packaging difficulty of the electro-optic modulator chip and improves packaging reliability.

[0061] For example, with Figure 2Taking the structure shown as an example, the light input end can couple an external light source into the chip. The first-stage second-type beam splitter is connected to the light input end through a thin-film optical waveguide and splits the input light signal into two paths, which are then connected to two second-stage second-type beam splitters through the thin-film optical waveguide. The output port of the first second-stage second-type beam splitter is connected to the first-type beam splitter through a thin-film optical waveguide. The first-type beam splitter separates a small portion of the light to obtain a partial light signal. The first-type beam splitter is connected to the first monitoring end through the thin-film optical waveguide, and a portion of the light signal is output outside the chip through the monitoring end. Most of the remaining light from the first-type beam splitter is input to the first thin-film electro-optic modulator through the thin-film optical waveguide. After modulation by the first thin-film electro-optic modulator, the first sub-modulated signal light is generated. The first thin-film electro-optic modulator mainly... The output optical port is connected to the first output end via a thin-film optical waveguide, through which the first sub-modulation signal light is output to the outside of the chip. The other output port of the first second-stage second-type beam splitter is connected to the second thin-film electro-optic modulator via a thin-film optical waveguide. Similarly, the two output ports of the second second-stage second-type beam splitter are connected to the third and fourth thin-film electro-optic modulators respectively via thin-film optical waveguides. After the second, third, and fourth thin-film electro-optic modulators generate their respective second, third, and fourth sub-modulation signal lights, their main output optical ports are connected to the corresponding second, third, and fourth output ends via thin-film optical waveguides, and each sub-modulation signal is output to the outside of the chip via its corresponding output end. To monitor the status of each thin-film electro-optic modulator, the secondary output optical ports of the four thin-film electro-optic modulators are connected to four monitoring ends via thin-film optical waveguides, so that multiple monitoring optical signals can be output to the outside of the chip via the monitoring ends. This can be used for status monitoring and feedback adjustment of each thin-film electro-optic modulator. This structure corresponds to a four-channel high-speed electro-optic modulator chip. After adjusting the states of multiple thin-film electro-optic modulators to their optimal operating points, the optical signal separated by the first type of beam splitter is output through the monitoring end and can be converted into a corresponding current value by an external monitor. The monitoring optical signal of the secondary output optical port of each thin-film electro-optic modulator is output through the monitoring end and can also be converted into a corresponding current value by an external monitor. The current ratio can be calculated based on multiple current values, and a current ratio can be preset as a target value according to actual needs. In subsequent continuous operation, the state of the thin-film electro-optic modulator can be dynamically adjusted to keep the real-time current ratio near the target value, thereby achieving stable and reliable electro-optic modulation.

[0062] Please see Figure 3 , Figure 3 This is a schematic diagram of a packaging structure provided in an embodiment of the present application. The packaging structure may include: a substrate 200, a monitor 300, and an electro-optic modulator chip 100 as described in any of the above embodiments.

[0063] The electro-optic modulator chip 100 is fixedly mounted on the substrate 200, and the monitor 300 is also fixedly mounted on the substrate 200. The monitor 300 receives the monitoring optical signal output by the electro-optic modulator chip 100 and performs optical power monitoring based on the monitoring optical signal to obtain the monitoring result. Since the electro-optic modulator chip 100 can transmit optical signals in a direction parallel to the surface of the substrate 200, the monitor 300 is also fixedly mounted on the substrate 200, rather than on the electro-optic modulator chip 100. The monitor 300 receives the monitoring optical signal output by the electro-optic modulator chip 100 in the horizontal direction, performs optical power monitoring based on the monitoring optical signal, obtains the monitoring result, and then adjusts the operating parameters of the electro-optic modulator chip 100 according to the monitoring result to adjust the operating state of the electro-optic modulator and other devices therein. There is no need to stack a corresponding monitor 300 on the upper surface of the electro-optic modulator chip 100 for monitoring, thereby reducing the packaging difficulty caused by height differences and the adverse situation of the monitor 300 falling off due to high temperature. This reduces the packaging difficulty of the packaging structure and improves the structural reliability of the packaging structure. It can also effectively optimize the working performance of each device in the packaging structure and meet the usage requirements of various application scenarios.

[0064] Optionally, both the electro-optic modulator chip 100 and the monitor 300 can be fixed on the substrate 200 by mounting or soldering. The substrate 200 can also be set as a corresponding organic substrate, inorganic substrate, such as an organic substrate, or a carrier structure such as a silicon substrate, glass substrate, ceramic substrate, or printed circuit board. During packaging, the electro-optic modulator chip 100 can be fixed on the substrate 200 first, and then the monitor 300 can be fixed on the substrate 200 based on the actual position of the electro-optic modulator chip 100.

[0065] It should be noted that, considering the electro-optic modulator chip 100 may have multiple monitoring terminals capable of outputting multiple different types of monitoring optical signals, the number of monitors 300 is the same as the number of monitoring terminals in the electro-optic modulator chip 100 to achieve one-to-one monitoring optical signal transmission, in order to perform targeted processing on each monitoring optical signal. Furthermore, the placement position of each monitor 300 on the substrate 200 is determined based on the corresponding monitoring terminal, and each monitor 300 is used to receive the monitoring optical signal transmitted from the corresponding monitoring terminal. The placement position of the monitor 300 on the substrate 200 can be determined according to the actual position of the monitoring terminal to improve the effectiveness of optical signal transmission between the monitoring terminal and the monitor 300, enabling each monitor 300 to receive the monitoring optical signal transmitted from the corresponding monitoring terminal, effectively improving the accuracy of optical signal monitoring, as well as the efficiency and effectiveness of feedback adjustment of the electro-optic modulator chip 100.

[0066] Optionally, the monitor 300 can be a III-V group side-illuminated monitoring detector chip, monitoring detector array, or other device with optical power monitoring function and capable of receiving horizontal optical signals. The electro-optic modulator chip 100 can be flip-mounted onto a substrate 200 such as a printed circuit board. The side-illuminated monitoring detector chip or monitoring detector array is surface-mounted onto the side of the electro-optic modulator chip 100 with the monitoring end and aligned with the monitoring end on the electro-optic modulator chip 100. That is, the monitoring end is aligned with the optical path of the monitor 300. The monitoring optical signal inside the electro-optic modulator chip 100 is output through the monitoring end and enters the monitoring detector chip, thereby performing optical power monitoring.

[0067] In summary, this application, through the optical path design on the electro-optic modulator chip, outputs the optical signal to be monitored on one side of the chip and enters the monitor, thereby realizing optical power monitoring without the need to integrate the monitor on the chip. This application solves the problem that existing solutions cannot perform flip-mount packaging of electro-optic modulator chips, and by packaging the electro-optic modulator chip and the monitor on the same substrate, the electro-optic modulator chip can obtain optimal electrical signal integrity.

[0068] In addition, the components in the various embodiments of this application can be integrated together to form an independent part, or each component can exist independently, or two or more components can be integrated to form an independent part.

[0069] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0070] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

[0071] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes said element.

Claims

1. An electro-optic modulator chip, characterized in that, The electro-optic modulator chip includes: a substrate, a light-inlet end, an electro-optic modulator, a light-outlet end, and a monitoring end; The light-inlet end, the electro-optic modulator, the light-outlet end, and the monitoring end are fixedly disposed on the substrate; The first end of the electro-optic modulator is connected to the light input end, and the second end of the electro-optic modulator is connected to the light output end and the monitoring end; The light-inlet end is used to transmit input optical signals to the electro-optic modulator; The electro-optic modulator is used to modulate the input optical signal to obtain a modulated optical signal and a monitoring optical signal, and transmits the modulated optical signal to the output end and the monitoring optical signal to the monitoring end; The light-emitting end is used to output the modulated optical signal; the monitoring end is used to output the monitoring optical signal. The direction of optical signal transmission is parallel to the plane of the substrate.

2. The electro-optic modulator chip according to claim 1, characterized in that, The electro-optic modulator chip further includes: a first type of beam splitter; the light input end and the monitoring end are connected through the first type of beam splitter; The first type of beam splitter is used to split the input optical signal input from the light input end to obtain a portion of the optical signal; The monitoring terminal is also used to output the portion of the optical signal.

3. The electro-optic modulator chip according to claim 2, characterized in that, in, The first type of beam splitter is disposed on the optical path connecting the electro-optic modulator to the light-inlet end, which is located near the light-inlet end.

4. The electro-optic modulator chip according to claim 2, characterized in that, in, The number of electro-optic modulators is n, where n is a positive integer greater than or equal to 1; The number of light-emitting ends is n; the number of monitoring ends is n+1.

5. The electro-optic modulator chip according to claim 4, characterized in that, When n is greater than or equal to 2, the electro-optic modulator chip further includes: a second type of beam splitter; The electro-optic modulator and the light input end are connected via the second type of beam splitter; The second type of beam splitter is used to split the input optical signal to obtain multiple split signals, and transmits the corresponding split signal to each of the electro-optic modulators; Each of the electro-optic modulators is used to modulate the corresponding split signal to obtain a corresponding sub-modulated optical signal; wherein the modulated optical signal includes a plurality of the sub-modulated optical signals.

6. The electro-optic modulator chip according to claim 5, characterized in that, in, The setting parameters of the second type of beam splitter are determined based on the number of electro-optic modulators; The setting parameters include the number of the second type of beam splitters and the setting level of the second type of beam splitters.

7. The electro-optic modulator chip according to any one of claims 1-6, characterized in that, Its features are, The electro-optic modulator chip also includes: an optical waveguide; The light-inlet end is connected to the electro-optic modulator via the optical waveguide; The electro-optic modulator is connected to the light-emitting end via the optical waveguide; The electro-optic modulator is connected to the monitoring terminal via the optical waveguide; The optical waveguide is used to transmit optical signals.

8. The electro-optic modulator chip according to any one of claims 1-6, characterized in that, in, The monitoring terminal is located at the edge of the substrate.

9. The electro-optic modulator chip according to any one of claims 1-6, characterized in that, in, The monitoring end includes: a monitoring end face coupler; The light-inlet end includes: a light-inlet end-face coupler; The light-emitting end includes: a light-emitting end face coupler.

10. A packaging structure, characterized in that, The packaging structure includes: a substrate, a monitor, and an electro-optic modulator chip according to any one of claims 1-9; The electro-optic modulator chip is fixedly mounted on the substrate; The monitor is fixedly mounted on the base plate; The monitor is used to receive the monitoring optical signal output by the electro-optic modulator chip, and to perform optical power monitoring based on the monitoring optical signal to obtain the monitoring result.

11. The packaging structure according to claim 10, characterized in that, in, The number of the monitors is the same as the number of monitoring terminals in the electro-optic modulator chip; The position of each monitor on the substrate is determined based on the corresponding monitoring terminal, and each monitor is used to receive the monitoring optical signal transmitted by the corresponding monitoring terminal.

12. An electronic device, characterized in that, The electronic device includes the packaging structure according to any one of claims 10-11.

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