A multi-channel data acquisition industrial computer interface module
By using a three-dimensional decoupled vibration damping component and a collaborative heat dissipation system, the heat dissipation and reliability issues of high-performance CPUs in complex vehicle vibration environments are solved, achieving CPU temperature stability and the real-time performance and safety of the autonomous driving system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ADVANTECH CHINA
- Filing Date
- 2026-02-27
- Publication Date
- 2026-06-02
Smart Images

Figure CN122131879A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of industrial control computer technology, specifically a multi-channel data acquisition industrial control computer interface module. Background Technology
[0002] Multi-channel data acquisition industrial control computer interface modules are core components of modern automated control systems, especially in the field of autonomous driving. As a domain controller, it is responsible for integrating and processing massive amounts of data from multiple sources of sensors such as LiDAR, cameras, and millimeter-wave radar. These modules are usually equipped with high-performance multi-core CPUs, and their stable operation is directly related to the real-time performance and reliability of the entire system. At the same time, due to the complexity of the vehicle driving environment, the interface module must have good vibration and shock resistance to ensure the physical safety of precision electronic components.
[0003] On the one hand, high-performance CPUs generate enormous heat under sustained high loads, and traditional air-cooling solutions often fail to meet their cooling requirements, easily leading to CPU overheating and triggering frequency reduction protection, thereby affecting the real-time performance of data processing and threatening driving safety. On the other hand, although water cooling is more efficient, the continuous vibration and impact during vehicle operation pose a severe challenge to the connection reliability, sealing performance, and stability of the water cooling pipes and the heat dissipation structure. Traditional rigid installations and simple vibration damping designs cannot balance efficient heat dissipation with structural integrity under dynamic conditions, resulting in a significant reduction in the reliability of the system under complex operating conditions. Therefore, a multi-channel data acquisition industrial control computer interface module is needed to address the existing shortcomings. Summary of the Invention
[0004] The technical problems to be solved; Existing technologies struggle to simultaneously meet the dual requirements of efficient heat dissipation and high-reliability structural protection necessary for high-performance CPUs to operate without downclocking in the complex vibration environment of vehicles.
[0005] Technical solution; To achieve the above objectives, the present invention provides the following technical solution: a multi-channel data acquisition industrial control computer interface module, comprising: The interface module itself is mounted on the industrial control computer chassis; An installation plate is disposed inside the housing to provide an installation station for the interface module body. A three-dimensional decoupled vibration damping component is installed inside the housing to provide decoupled vibration damping in the XYZ directions for the mounting plate; A heat dissipation component is installed inside the enclosure and works in conjunction with the shock absorption component to dissipate the heat of the interface module body to the outside of the enclosure.
[0006] Furthermore, the shock absorption component includes: The first-stage shock absorption unit is installed inside the housing to provide shock absorption for the interface module body in the length direction (X direction) of the housing; The second-stage damping unit is installed on the first-stage damping unit to provide damping for the interface module body in the width direction (Y direction) of the housing; The third-stage damping unit is installed on the second-stage damping unit to provide damping for the interface module body in the height direction (Z direction) of the enclosure.
[0007] Furthermore, the first-stage damping unit includes: The guide frame is fixed inside the box. The movable bar is slidably connected within the guide frame; A pair of folding springs are respectively disposed between the two ends of the moving bar and the inner wall of the guide frame to provide X-direction shock absorption and damping for the moving bar.
[0008] Furthermore, the second-stage damping unit includes: The guide block is fixed on the moving bar; An active frame is fitted onto the guide block and is perpendicular to the guiding direction of the guide frame; A pair of folding springs are respectively disposed between the two ends of the guide block and the inner wall of the movable frame to provide shock absorption and damping in the Y direction for the movable frame.
[0009] Furthermore, the third-stage damping unit includes: The guide rod is movably connected through the movable frame, and its end is fixedly connected to the back side of the mounting plate; A return spring, sleeved on the guide rod, is positioned between the movable frame and the back side of the mounting plate, providing Z-axis support and shock absorption for the mounting plate; The interface module body is fixedly mounted on the mounting plate by screws.
[0010] Furthermore, the collaborative heat dissipation component includes: A rigid heat-conducting module is fixedly connected to the back side of the mounting plate and is used to efficiently dissipate the heat of the interface module body. A flexible heat-absorbing module is connected to the moving part of the shock-absorbing component and receives heat from the rigid heat-conducting module; A heat dissipation module, fixed to the housing, is used to dissipate the heat from the flexible heat absorption module to the outside of the housing. A circulation pipeline connects the flexible heat absorption module and the heat dissipation module. The circulation pipeline is a flexible metal corrugated pipe that can adapt to the displacement of the shock absorption component.
[0011] Furthermore, the flexible heat-absorbing module includes: A support frame is fixed inside the housing and connected to the moving part of the shock-absorbing assembly; A heat dissipation pipe with a planar multi-segment bending structure is fixed on the support frame to absorb heat from the support frame.
[0012] Furthermore, the rigid thermally conductive module includes: Multiple sets of linear array heat-conducting sheets are fixedly connected to the back side of the mounting plate; The heat-conducting sheet moves through the support frame of the flexible heat-absorbing module to directly transfer heat from the mounting plate to the support frame. A gap is left between the heat-conducting sheet and the through hole of the support frame to allow relative displacement, and heat conduction is achieved through a high thermal conductivity interface material or thermal grease.
[0013] Furthermore, the heat dissipation module includes: The heat dissipation air duct is set on the industrial control computer chassis and has an air inlet and an air outlet. The heat sink tube is fixed inside the heat dissipation duct, and both ends of the heat sink tube are connected to the heat sink tube through the pump body. Several heat dissipation fins are disposed on the outer surface of the heat dissipation plate tube and located inside the heat dissipation air duct; At least one cooling fan is used to generate forced airflow; The forced airflow generated by the cooling fan flows through the cooling duct to forcibly remove the heat from the cooling fins and heat sink tubes, and is discharged from the air outlet.
[0014] Furthermore, the heat dissipation plate tube is a liquid-cooled plate tube with internal coolant channels; the cooling fan is located at the air inlet to form a blowing structure.
[0015] Compared with existing technologies, this multi-channel data acquisition industrial control computer interface module has the following advantages: I. This invention designs a three-dimensional decoupled damping component as a damping unit with independent decoupling in three levels (X, Y, and Z), and uses a combination of bellows-type stainless steel springs, high-damping silicone oil, and pre-tensioned compression springs. This invention can effectively absorb and dissipate vibrations and impacts from any direction during vehicle operation, creating a highly stable operating environment for core CPUs and other precision electronic components, and solving the risk of performance degradation or physical damage caused by vibration.
[0016] Second, this invention constructs a synergistic heat dissipation system that integrates rigid heat conduction, flexible heat absorption, and fixed heat dissipation. It also innovatively adopts heat-conducting plates with built-in heat pipes, microchannel water cooling radiators, and flexible metal water pipes. This invention achieves efficient heat transfer and water cooling circulation during dynamic vibration reduction, ensuring that the huge amount of heat generated by the CPU can be quickly and continuously dissipated, thereby ensuring that the CPU temperature remains stable under 100% load and will never throttle due to overheating.
[0017] Third, this invention solves the core technical problem of balancing heat dissipation and vibration resistance in autonomous driving domain controllers under harsh operating conditions by integrating a high-efficiency "water-cooling + air-cooling" composite heat dissipation system with a multi-dimensional anti-vibration structure. It ensures that the equipment can still operate stably without frequency reduction or interruption under continuous high load and severe vibration environment, providing a solid hardware foundation for the real-time performance and safety of autonomous driving decisions. Attached Figure Description
[0018] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a partial cross-sectional structural diagram of the present invention; Figure 3 This is a schematic diagram of the external components of the present invention, excluding the housing. Figure 4 This is a schematic diagram of the exploded structure of the present invention; Figure 5 For the present invention Figure 4 Another perspective structural diagram; Figure 6 This is a schematic diagram of the collaborative heat dissipation component structure of the present invention.
[0019] In the diagram: 1. Interface module body; 2. Housing; 3. Three-dimensional decoupled shock absorption assembly; 301. Guide frame; 302. Moving bar; 303. Folding spring one; 304. Guide block; 305. Movable frame; 306. Folding spring two; 307. Guide rod; 308. Reset spring; 4. Collaborative heat dissipation assembly; 401. Support frame; 402. Heat dissipation pipe; 403. Heat conduction plate; 404. Heat dissipation duct; 405. Heat dissipation plate tube; 406. Heat dissipation fins; 407. Cooling fan; 5. Mounting plate. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] like Figure 1-6 As shown, the present invention provides a technical solution: a multi-channel data acquisition industrial control computer interface module, including an interface module body 1, an industrial control computer chassis 2, a mounting plate 5, a three-dimensional decoupled vibration damping component 3 and a collaborative heat dissipation component 4, with the chassis 2 partially shown in the figure.
[0022] The interface module body 1 is the core functional unit of this device. As an autonomous driving domain controller, it integrates multiple high-speed data acquisition interfaces (such as Gigabit Ethernet and CAN-FD) for connecting LiDAR, cameras, and millimeter-wave radar, as well as a high-performance multi-core CPU (such as NVIDIA Xavier or an equivalent computing power processor). Its design goal is to keep the CPU temperature stable below 85°C under continuous 100% load, never triggering thermal throttling and frequency reduction, thus ensuring the real-time performance and safety of autonomous driving decisions. It is fixed to the mounting plate 5 with screws.
[0023] The industrial control computer enclosure 2 is made of high-strength aluminum alloy (such as 6061-T6) in one piece, with a wall thickness of 5mm and a sealed design to meet the IP67 protection level. It features lightweight and high structural rigidity, providing robust protection for all internal components.
[0024] Mounting plate 5 is made of oxygen-free copper (OFHC) with a purity of 99.9% and a thickness of 8mm. It is tightly attached to the CPU core of the interface module body 1 through an extremely thin liquid metal thermal pad, serving as the first station for heat transfer.
[0025] Implementation method of three-dimensional decoupled vibration damping component 3; like Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, the three-dimensional decoupled shock absorption component 3 is one of the core components of this invention. It provides independent shock absorption in the XYZ directions for the mounting plate 5 and the interface module body 1 on it, ensuring that precision components such as the CPU are always in a stable environment during vehicle operation (such as bumpy roads and emergency lane changes).
[0026] First-stage damping unit (X-direction damping): The guide frame 301 consists of two parallel U-shaped aluminum alloy profiles, which are firmly fixed to the bottom plate of the housing 2 by bolts. The moving strip 302 is a rectangular aluminum alloy strip with self-lubricating copper-based alloy bushings embedded on both sides at the bottom, forming a low-friction sliding pair with the inner wall of the guide frame 301. The folding spring 303 is a bellows-type structure made of SUS304 stainless steel sheet, and there are two of them. They are respectively set between the two ends of the moving strip 302 and the inner wall of the end of the guide frame 301. When longitudinal vibration (X direction) is transmitted during vehicle movement, the moving strip 302 can slide in the guide frame 301, and the folding spring 303 is compressed or stretched to absorb vibration energy and provide damping.
[0027] Second-stage damping unit (Y-direction damping): The guide blocks 304 are two rectangular bosses fixed to the upper surface of the moving strip 302. The movable frame 305 is a U-shaped frame that fits onto the two guide blocks 304. The movable frame 305 is made of wear-resistant engineering plastic (such as POM). There is a small gap between its inner hole and the guide blocks 304 to allow micro-movement in the Y direction. The gap is filled with high-damping silicone oil to form viscous damping, which can quickly dissipate vibration energy. The second folding spring 306 is also a bellows-type stainless steel spring. There are two of them. They are installed on both sides of the guide blocks 304 and between the inner wall of the movable frame 305 to absorb the Y-direction vibration generated by the lateral sway or impact of the vehicle.
[0028] Third-stage damping unit (Z-direction damping): The guide rods 307 are four precision optical shafts with hard chrome plating, passing through the four corners of the movable frame 305. Their upper ends are connected to the back of the mounting plate 5 via threaded fasteners. The return springs 308 are four high-rigidity alloy steel compression springs, each sleeved on one of the four guide rods 307, located between the movable frame 305 and the mounting plate 5. Their preload force is precisely calculated to be equal to 1.2 times the total weight of the mounting plate 5 and the interface module body. They provide upward support for the mounting plate 5 and absorb the Z-axis impact energy from road bumps. Polyurethane buffer pads are installed at both ends of the springs to prevent hard impacts.
[0029] Through the above three-level decoupling structure, the mounting plate 5 and the interface module body 1 on it can effectively isolate vibrations and impacts from any direction.
[0030] Implementation method of collaborative heat dissipation component 4; like Figure 3 , Figure 4 and Figure 6 As shown, the collaborative heat dissipation component 4 and the shock absorption component 3 work together to form an innovative "water cooling + air cooling" composite heat dissipation system, which is designed specifically for CPUs to run without throttling.
[0031] Implementation of the rigid heat-conducting module: The heat-conducting plates 403 are multiple (e.g., 10) copper arrays embedded using heat pipe technology. One end of each heat pipe, the evaporation section, is directly pressed into the CPU hotspot area of the mounting plate 5, while the other end, the condensation section, extends through the support frame 401. Phase change heat transfer is utilized to achieve rapid heat transfer with near-zero thermal resistance. They are securely fixed to the back side of the mounting plate 5 by brazing or bolting. These heat-conducting plates 403 extend vertically downwards.
[0032] Implementation method of flexible heat absorption module (water-cooled core): The support frame 401 is an aluminum alloy frame, fixedly connected to the moving strip 302 of the shock-absorbing component 3, and moves together with the shock-absorbing structure. The heat dissipation pipe 402 is a microchannel water-cooling radiator made of copper, with an internal flow channel equivalent diameter of less than 1mm, which greatly increases the contact area between the coolant and the pipe wall, improving the heat exchange efficiency by more than 50% compared to traditional water channels. It is tightly attached to the upper surface of the support frame 401 by welding or high-polymer thermally conductive adhesive. The lower end of the heat-conducting plate 403 moves through the corresponding through hole on the support frame 401. The diameter of the through hole is slightly larger than the size of the heat-conducting plate 403, forming a gap that allows relative displacement. The gap is filled with graphene thermally conductive paste to ensure that during the shock absorption process, heat can still be efficiently transferred from the heat-conducting plate 403 to the support frame 401, and then to the heat dissipation pipe 402.
[0033] The heat dissipation module (air-cooled core) is implemented as follows: The heat dissipation duct 404 is a sheet metal casing fixed to the side wall of the housing 2, forming a semi-enclosed channel with its opening facing the interior of the housing 2. The heat sink tube 405 is a liquid-cooled plate with internal baffles, fixed deep inside the heat dissipation duct 404. The heat dissipation fins 406 are dozens of aluminum sunflower fins connected by reflow soldering, possessing extremely high fin efficiency and surface area. They are uniformly fixed to the outer surface of the heat sink tube 405 by welding or expansion, greatly increasing the heat dissipation area. The cooling fan 407 is a 12V high static voltage PWM speed-controlled fan, whose speed is intelligently adjusted by the ECU according to the CPU temperature, optimizing noise while ensuring heat dissipation effect. It is a high-power axial fan installed at the opening of the heat dissipation duct 404 (i.e., the air intake), forming a blowing structure.
[0034] Implementation method of circulation pipeline: The circulation pipe consists of two EPDM flexible water pipes reinforced with stainless steel braids. One pipe connects the outlet of the heat sink 402 to the inlet of the heat sink tube 405, and the other pipe connects the outlet of the heat sink tube 405 to the inlet of the heat sink 402. This flexible connection allows the heat absorption module to move with the shock-absorbing structure without causing pipe fatigue or leakage. Pump bodies are installed at the connection points of the heat sink tube 405 and the heat sink 402. The pump bodies are high-speed, low-noise circulating water pumps to drive the coolant (professional-grade coolant, such as a mixture of water and ethylene glycol) to circulate between the heat sink tube 402 and the heat sink tube 405.
[0035] Working Process: When the autonomous vehicle is in motion, the interface module 1 starts working and generates heat. The enormous heat generated by the CPU is rapidly and almost losslessly transferred through the liquid metal pad and oxygen-free copper mounting plate 5 to the microchannel heat dissipation pipe 402, which moves with the shock-absorbing structure, via phase change heat transfer through the heat-conducting fins 403 with built-in heat pipes. A circulating water pump drives the low-temperature coolant into the heat dissipation pipe 402, where it absorbs heat and becomes a high-temperature liquid. The high-temperature liquid is pumped through a flexible water pipe to the heat dissipation plate pipe 405 fixed to the side wall of the housing 2. The ECU intelligently adjusts the speed of the PWM fan 407 according to the CPU temperature. The cooling fan 407 starts, blowing cool air into the cooling duct 404. The cool air flows through the cooling fins 406 and the heat dissipation plate pipe 405, carrying away a large amount of heat, and finally is discharged from the air outlet at the top of the duct to the outside of the housing 2. The cooled liquid is then pumped back to the heat dissipation pipe 402, completing one cooling cycle.
[0036] At the same time, vibrations from any direction on the road surface are absorbed and mitigated step by step by the three-stage damping components, ensuring that the interface module body 1 is always in a stable and cool environment. This enables high-precision, uninterrupted data acquisition and processing without CPU frequency reduction, providing a solid hardware guarantee for the safety and real-time performance of autonomous driving.
[0037] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A multi-channel data acquisition industrial control computer interface module, characterized in that, include: The interface module body (1) is mounted on the industrial control computer chassis (2); Mounting plate (5) is set inside the housing (2) to provide an installation station for the interface module body (1); A three-dimensional decoupled vibration damping component (3) is installed inside the housing (2) to provide decoupled vibration damping in the XYZ directions for the mounting plate (5); The heat dissipation component (4) is installed inside the housing (2) and works in conjunction with the shock absorption component to dissipate the heat of the interface module body (1) to the outside of the housing (2).
2. The multi-channel data acquisition industrial control computer interface module according to claim 1, characterized in that, The shock absorption components include: The first-stage shock absorption unit is installed inside the housing (2) to provide shock absorption for the interface module body (1) in the length direction (X direction) of the housing (2); The second-stage damping unit is installed on the first-stage damping unit to provide damping for the interface module body (1) in the width direction (Y direction) of the housing (2); The third-level shock absorption unit is installed on the second-level shock absorption unit to provide shock absorption for the interface module body (1) in the height direction (Z direction) of the housing (2).
3. The multi-channel data acquisition industrial control computer interface module according to claim 2, characterized in that, The first-stage damping unit includes: The guide frame (301) is fixed inside the housing (2); The movable bar (302) is slidably connected within the guide frame (301); A pair of folding springs (303) are respectively disposed between the two ends of the moving bar (302) and the inner wall of the guide frame (301) to provide X-direction shock absorption and damping for the moving bar (302).
4. The multi-channel data acquisition industrial control computer interface module according to claim 3, characterized in that, The second-stage damping unit includes: Guide block (304) is fixed on the moving bar (302); The movable frame (305) is fitted onto the guide block (304) and is perpendicular to the guiding direction of the guide frame (301); A pair of folding springs (306) are respectively disposed between the two ends of the guide block (304) and the inner wall of the movable frame (305) to provide shock absorption and damping in the Y direction for the movable frame (305).
5. The multi-channel data acquisition industrial control computer interface module according to claim 4, characterized in that, The third-stage damping unit includes: The guide rod (307) is movably connected through the movable frame (305), and its end is fixedly connected to the back side of the mounting plate (5); A reset spring (308) is sleeved on the guide rod (307) and positioned between the movable frame (305) and the back side of the mounting plate (5) to provide Z-axis support and shock absorption for the mounting plate (5). The interface module body (1) is fixedly mounted on the mounting plate (5) by screws.
6. The multi-channel data acquisition industrial control computer interface module according to claim 1, characterized in that, The collaborative heat dissipation component (4) includes: A rigid heat-conducting module is fixedly connected to the back side of the mounting plate (5) and is used to efficiently dissipate the heat of the interface module body (1). A flexible heat-absorbing module is connected to the moving part of the shock-absorbing component and receives heat from the rigid heat-conducting module; A heat dissipation module is fixed on the housing (2) and is used to dissipate the heat from the flexible heat absorption module to the outside of the housing (2); A circulation pipeline connects the flexible heat absorption module and the heat dissipation module. The circulation pipeline is a flexible metal corrugated pipe that can adapt to the displacement of the shock absorption component.
7. A multi-channel data acquisition industrial control computer interface module according to claim 6, characterized in that, The flexible heat absorption module includes: The support frame (401) is fixed inside the housing (2) and connected to the moving part of the shock absorption assembly; A heat dissipation pipe (402) with a planar multi-segment bending structure is fixed on the support frame (401) to absorb heat from the support frame (401).
8. The multi-channel data acquisition industrial control computer interface module according to claim 7, characterized in that, The rigid heat-conducting module includes: Multiple sets of linear array heat-conducting sheets (403) are fixedly connected to the back side of the mounting plate (5); The heat-conducting sheet (403) extends through the support frame (401) of the flexible heat-absorbing module to directly transfer the heat on the mounting plate (5) to the support frame (401). A gap is left between the heat-conducting sheet (403) and the through hole of the support frame (401) to allow relative displacement, and heat conduction is achieved through a high thermal conductivity interface material or thermal grease.
9. A multi-channel data acquisition industrial control computer interface module according to claim 8, characterized in that, The heat dissipation module includes: The heat dissipation duct (404) is installed on the industrial control computer chassis (2) and has an air inlet and an air outlet; The heat sink tube (405) is fixed inside the heat dissipation duct (404), and the two ends of the heat sink tube (402) are connected to the heat sink tube (405) through the pump body respectively; Several heat dissipation fins (406) are disposed on the outer surface of the heat dissipation plate tube (405) and located inside the heat dissipation air duct (404); At least one cooling fan (407) is used to generate forced airflow; The forced airflow generated by the cooling fan (407) flows through the cooling duct (404) to forcibly remove the heat from the cooling fins (406) and the heat sink (405) and discharge it from the outlet.
10. A multi-channel data acquisition industrial control computer interface module according to claim 9, characterized in that, The heat dissipation plate tube (405) is a liquid-cooled plate tube with a coolant channel inside; the heat dissipation fan (407) is set at the air inlet to form a blowing structure.