A phase change enhanced liquid-cooled server in cooperation with thermoelectric refrigeration

By employing a synergistic enhancement architecture combining phase change liquid cooling and thermoelectric refrigeration, and utilizing the enhanced boiling and condensation structure and flow-limiting channels of the heat-conducting components, the overheating problem of phase change liquid cooling under high heat flux density and transient power fluctuations is solved, achieving efficient and reliable thermal management and low PUE value.

CN122131883APending Publication Date: 2026-06-02苏州仿生材料科学与工程中心
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
苏州仿生材料科学与工程中心
Filing Date
2026-05-06
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In existing technologies, phase change liquid cooling has the risk of local overheating in scenarios with high heat flux density and transient power fluctuations. Traditional air cooling and single-phase liquid cooling are approaching their limits, while the dependence on thermoelectric cooling leads to increased power consumption and higher PUE values.

Method used

It adopts a synergistic enhancement architecture with phase change liquid cooling as the main component and thermoelectric cooling as the auxiliary component. By utilizing the enhanced boiling and condensation structure in the heat-conducting components, combined with the flow-limiting channel and thermoelectric cooling device, it achieves the synergistic effect of precise active cooling and passive heat dissipation.

Benefits of technology

It improves heat exchange efficiency, stably adapts to extreme heat flux density scenarios, supports dynamic hotspot suppression, reduces PUE value, reduces power consumption, and improves server reliability and energy efficiency.

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Abstract

This invention discloses a phase change enhanced liquid-cooled server with synergistic thermoelectric cooling, relating to the field of liquid-cooled servers. Key technical features include a chassis, circuit board, chip, and heat-conducting components; the chassis is filled with a first phase change working fluid; the heat-conducting components include a heating part in contact with the chip, a condensing part located on the outside of the chassis, and a transition part disposed between the heating part and the condensing part; a thermoelectric cooling device is disposed on the condensing part. This invention employs a synergistic enhancement architecture with phase change liquid cooling as the primary method and thermoelectric cooling as a secondary method, which can fully leverage the energy efficiency advantages of passive phase change liquid cooling and the temperature control advantages of active thermoelectric cooling. Furthermore, the thermoelectric cooling device only needs to be activated at appropriate times, thereby reducing the server's PUE value.
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