Display panel, manufacturing method thereof and display device

Abstract

This disclosure provides a display panel and its manufacturing method, as well as a display device, relating to the field of display technology. The display panel includes a substrate and a driving circuit layer. The driving circuit layer includes a first region and a second region connected to the first region. The substrate includes a first surface, a second surface, and a first side surface, with the first surface and second surface facing each other, and the first side surface connecting the first surface and the second surface. The first region of the driving circuit layer is located on the first surface of the substrate, and at least a portion of the second region is located on the first surface of the substrate, extending to the first side surface and the second surface of the substrate. A flexible substrate is also included between the second region and the substrate. The first and second regions of the driving circuit layer are manufactured in the same process. This disclosure, while achieving an extremely narrow bezel or bezel-less design, helps reduce the complexity of the display panel's manufacturing process, thereby improving production efficiency and reducing production costs. Simultaneously, it also helps improve the production yield of display products, thereby enhancing reliability.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] With the development of display technology, Micro LED (Micro Light-Emitting Diode) display products are widely used in various fields due to their advantages such as high brightness, high contrast, low power consumption, and long lifespan. In some applications, multiple smaller display panels are spliced ​​together to form large or ultra-large display screens. In this scenario, the smaller display panels are usually frameless. To drive the display panels, metal traces need to be fabricated on the sides and back, leading to increased manufacturing processes, higher costs, and lower production yields.

[0003] Therefore, how to improve the above problems has become one of the urgent technical issues to be addressed at this stage. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a display panel, a method for manufacturing the same, and a display device, which can improve the production yield of display products and reduce production costs.

[0005] In a first aspect, this disclosure provides a display panel, including a substrate and a driving circuit layer; The driving circuit layer includes a first region and a second region connected to the first region; The substrate includes a first surface, a second surface, and a first side surface, wherein the first surface and the second surface are disposed opposite to each other, and the first side surface is connected to the first surface and the second surface; The first region of the driving circuit layer is located on the first surface of the substrate, at least a portion of the second region is located on the first surface of the substrate, at least a portion of the second region extends to the first side surface and the second surface of the substrate, and a flexible substrate is further included between the second region and the substrate; The first and second regions of the driving circuit layer are fabricated in the same process.

[0006] Secondly, based on the same inventive concept, this disclosure provides a method for manufacturing a display panel, comprising: A substrate is provided; wherein the substrate includes a first surface, a second surface, and a first side surface, the first surface and the second surface are disposed opposite to each other, and the first side surface is connected to the first surface and the second surface; A flexible substrate is fabricated in a portion of the first surface of the substrate; A driving circuit layer is formed on the first surface of the substrate and on the side of the flexible substrate away from the substrate; wherein the driving circuit layer includes a first region and a second region connected to the first region, and the first region does not overlap with the flexible substrate along a direction perpendicular to the plane of the substrate, while the second region overlaps with the flexible substrate. At least a portion of the flexible substrate is peeled off from the substrate; Remove the substrate that has been detached from the flexible substrate; The flexible substrate and the driving circuit layer are bent such that at least a portion of the flexible substrate and a portion of the driving circuit layer are located on the first side and the second side of the substrate.

[0007] Thirdly, based on the same inventive concept, this disclosure provides a display device including the display panel described in the first aspect.

[0008] The technical solution provided in this disclosure has the following advantages compared with the prior art: This disclosure provides a display panel and its manufacturing method, as well as a display device. The display panel includes a substrate and a driving circuit layer. The driving circuit layer includes a first region and a second region connected to the first region. The substrate includes a first side, a second side, and a first side surface. In the display panel provided by this disclosure, a flexible substrate is provided, and the second region of the driving circuit layer is disposed on the flexible substrate. In the same process, the first and second regions of the driving circuit layer are fabricated, and then the second region of the driving circuit layer is bent to the first and second side surfaces of the substrate. Compared with related technologies that fabricate metal traces on the front, side, and back of the display product respectively, this disclosure can achieve an extremely narrow bezel or bezel-less design while reducing the complexity of the display panel's manufacturing process, thereby improving production efficiency and reducing production costs. Furthermore, this disclosure does not require directly fabricating traces on the side of the display product; instead, the traces fabricated on the front are bent to the side. This arrangement also helps to improve the production yield of the display product, thereby improving the reliability of signal transmission. Therefore, this disclosure also helps to improve the reliability of the display product. Attached Figure Description

[0009] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0010] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 The image shown is a plan view of a display panel provided in an embodiment of this disclosure; Figure 2 The diagram shown is a schematic diagram of a film layer of a display panel provided in an embodiment of this disclosure; Figure 3 The diagram shown is a schematic diagram of the connection between the driving circuit layer and the light-emitting unit provided in an embodiment of this disclosure; Figure 4 The diagram shown is a schematic diagram of another film layer of the display panel provided in an embodiment of this disclosure; Figure 5 The diagram shown is a schematic diagram of another film layer of the display panel provided in an embodiment of this disclosure; Figure 6 The diagram shown is a schematic diagram of another film layer of a display panel provided in an embodiment of this disclosure; Figure 7 The diagram shown is a schematic diagram of another film layer of a display panel provided in an embodiment of this disclosure; Figure 8 The diagram shown is a schematic diagram of another film layer of a display panel provided in an embodiment of this disclosure; Figure 9 The diagram shown is a schematic diagram of another film layer of a display panel provided in an embodiment of this disclosure; Figure 10 The diagram shown is a schematic diagram of another film layer of a display panel provided in an embodiment of this disclosure; Figure 11 The diagram shown is another plan view of the display panel provided in an embodiment of this disclosure; Figure 12 The diagram shown is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 13 The diagram shown is a disassembly schematic of a method for manufacturing a display panel according to an embodiment of this disclosure; Figure 14 The diagram shown is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 15 The diagram shown is a disassembly schematic of another method for manufacturing a display panel according to an embodiment of this disclosure; Figure 16 The diagram shown is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 17 The diagram shown is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 18 The diagram shown is a disassembly schematic of another method for manufacturing a display panel according to an embodiment of this disclosure; Figure 19The figure shown is a plan view of a display device provided in an embodiment of this disclosure. Detailed Implementation

[0012] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0013] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0014] The inventors discovered in their research that in applications involving large or ultra-large display products, these products are typically formed by splicing together multiple smaller display panels. These panels need to be borderless and also require traces to provide various signals, necessitating traces on the sides and back of the display panel for signal transmission. One embodiment of the related technology involves fabricating metal traces on the sides and back of the display panel in different manufacturing processes. This method requires directly fabricating the traces on the sides and back of the display panel, where side trace fabrication is difficult, has a low yield, and the separate fabrication of metal traces on the sides and back increases the manufacturing process and production costs. Another embodiment involves drilling holes in the glass substrate of the display panel and filling the holes with metal to achieve electrical connection between the front and back traces. This method affects the resistance within the holes, leading to reduced signal transmission reliability. Furthermore, drilling holes in the glass substrate reduces its strength, also affecting the reliability of the display panel, and the process is more difficult, further increasing manufacturing costs.

[0015] In view of this, the present disclosure provides a display panel and a method for manufacturing the same, as well as a display device, to improve the production yield of display products and reduce production costs.

[0016] Figure 1 The image shown is a plan view of a display panel provided in an embodiment of this disclosure. Figure 2 The diagram shown is a schematic representation of a film layer in a display panel according to an embodiment of this disclosure. Please refer to it. Figure 1 and Figure 2 This disclosure provides a display panel 100, including a substrate 10 and a driving circuit layer 20; the driving circuit layer 20 includes a first region 201 and a second region 202 connected to the first region 201; the substrate 10 includes a first surface 101, a second surface 102 and a first side surface 103, the first surface 101 and the second surface 102 are disposed opposite to each other, and the first side surface 103 is connected to the first surface 101 and the second surface 102.

[0017] The first region 201 of the driving circuit layer 20 is located on the first surface 101 of the substrate 10, and at least a portion of the second region 202 is located on the first surface 101 of the substrate 10, and at least a portion of the second region 202 extends to the first side surface 103 and the second surface 102 of the substrate 10. A flexible substrate 30 is also included between the second region 202 and the substrate 10. The first region 201 and the second region 202 of the driving circuit layer 20 are fabricated in the same process.

[0018] It should be noted that, in this disclosure, the first region 201 of the driving circuit layer 20 is the region corresponding to the pixel driving circuit and metal traces used to drive the light-emitting unit 01 to emit light, and the second region 202 of the driving circuit layer 20 is the region corresponding to the traces that provide corresponding signals to the first region 201. Figure 1 This description uses a rectangular display panel 100 as an example only, and does not specifically limit the actual shape of the display panel 100. For example, the display panel 100 can also be a circle, a rounded rectangle, or any other feasible shape. This disclosure Figure 1 The diagram shows only rectangular light-emitting units 01 arranged in a matrix. Rectangles with different filling patterns represent light-emitting units 01 of different colors. The accompanying drawings are for illustrative purposes only and do not represent the actual shape, structure, and number of light-emitting units 01. Optionally, the display panel 100 provided in this embodiment can be a display panel using micro light-emitting diode display technology, i.e., a Micro LED (Micro Light-Emitting Diode) display panel. Figure 3 The diagram shown is a schematic representation of a connection between the driving circuit layer and the light-emitting unit provided in an embodiment of this disclosure. Figure 3 The diagram illustrates the connection between the driving circuit layer 20 and the light-emitting unit 01 in a Micro LED display panel. Please refer to the diagram. Figure 3 The light-emitting unit 01 includes a first electrode 011 and a second electrode 012. The driving circuit layer 20 includes a driving transistor M0. The driving transistor M0 is electrically connected to the first electrode 011 of the light-emitting unit 01 and provides a driving current to the corresponding light-emitting unit 01 to drive the light-emitting unit 01 to emit light.

[0019] Specifically, this disclosure provides a display panel 100, which includes a substrate 10. The substrate 10 includes a first surface 101, a second surface 102, and a first side surface 103, with the first side surface 103 intersecting with both the first surface 101 and the second surface 102. Optionally, the first surface 101 corresponds to the front side of the display panel 100, the second surface 102 corresponds to the back side of the display panel 100, and the first side surface 103 corresponds to the side surface of the display panel 100. It should be noted that the front side refers to the light-emitting surface of the display panel 100, and the back side refers to the non-light-emitting surface of the display panel 100. Optionally, the substrate 10 is made of glass. A substrate 10 made of glass has good flatness and high stability. This arrangement is beneficial for providing a flat substrate for the driving circuit layer 20, and at the same time, provides certain support for the film layers in subsequent processes. It should be noted that this disclosure is only illustrative of the above embodiments and is not limited thereto.

[0020] The display panel 100 also includes a driving circuit layer 20, which is configured to drive light-emitting units 01 in the display panel 100. Exemplarily, the driving circuit layer 20 is used to drive micro-light-emitting diodes in the display panel 100. The driving circuit layer 20 includes a first region 201 and a second region 202. The boundary between the first region 201 and the second region 202 is shown as a dashed line in the accompanying drawings. The first region 201 is located on the first surface 101 of the substrate 10, and the second region 202 is connected to the first region 201. A portion of the second region 202 is located on the first surface 101 of the substrate 10, and a portion extends to the first side surface 103 and the second surface 102 of the substrate 10. In other words, the second region 202 of the driving circuit layer 20 includes three regions located on the first surface 101, the first side surface 103, and the second surface 102 of the substrate 10. A flexible substrate 30 is also included between the second region 202 of the driving circuit layer 20 and the substrate 10. That is, the second region 202 of the driving circuit layer 20 is fabricated on the flexible substrate 30. With this arrangement, the first region 201 and the second region 202 of the driving circuit layer 20 can be fabricated in the same process. Then, based on the bendability of the flexible substrate 30, the second region 202 of the driving circuit layer 20 can be bent to the first side 103 and the second side 102 of the substrate 10.

[0021] It should be noted that the first region 201 and the second region 202 of the driving circuit layer 20 mentioned in this disclosure correspond to different functional areas of the driving circuit layer. Optionally, the traces in the second region 202 provide relevant signals to the first region 201. In some application scenarios, multiple display panels 100 are spliced ​​together to form a large-size display product, thus requiring the display panel 100 to have an extremely narrow bezel or a bezel-less design. In related technologies, the second region 202 of the driving circuit layer 20 needs to be wired on the first side 103 and the second side 102 of the substrate 10 in different processes to transmit relevant signals to the first region 201 of the driving circuit layer 20. However, the method in the related technologies has high process difficulty and complexity, resulting in low production yield and efficiency, and high production costs.

[0022] In the display panel 100 provided in this disclosure, a flexible substrate 30 is provided, and the second region 202 of the driving circuit layer 20 is disposed on the flexible substrate 30. In the same process, the first region 201 and the second region 202 of the driving circuit layer 20 are fabricated, and then the second region 202 of the driving circuit layer 20 is bent to the first side surface 103 and the second side surface 102 of the substrate 10. Compared with related technologies that fabricate metal traces on the front, side and back of the display product respectively, this disclosure can achieve an extremely narrow bezel or bezel-less design while reducing the complexity of the manufacturing process of the display panel 100, thereby improving production efficiency and reducing production costs. Furthermore, this disclosure does not require directly fabricating traces on the side of the display product, but instead bends the traces fabricated on the front (the second region 202 of the driving circuit layer 20) to the side surface (the first side surface 103). This arrangement also helps to improve the production yield of the display product, thereby improving the reliability of signal transmission. Therefore, this disclosure also helps to improve the reliability of the display product.

[0023] Figure 4 The diagram shown is a schematic diagram of another film layer of the display panel provided in this embodiment of the present disclosure. Please refer to [the diagram]. Figure 1 and Figure 4 In one alternative embodiment of this disclosure, the first surface 101 of the substrate 10 includes a groove 11, and at least a portion of the flexible substrate 30 is located in the groove 11.

[0024] Specifically, in this embodiment, a recess 11 is provided on the first surface 101 of the substrate 10 to accommodate the flexible substrate 30 located on the first surface 101 of the substrate 10. In other words, a portion of the second region 202 of the driving circuit layer 20 is located on the first surface 101 of the substrate 10, and the flexible substrate 30 corresponding to this region is located in the recess 11 of the substrate 10. The flexible substrate 30 is not included below the first region 201 of the driving circuit layer 20, and the second region 202 of the driving circuit layer 20 is connected to the first region 201, but the flexible substrate 30 is included below the second region 202. Therefore, there is a height difference between the substrates below the first region 201 and the second region 202, and there is a risk of film breakage at the junction of the first region 201 and the second region 202. This embodiment of the invention provides a certain accommodating space for the flexible substrate 30 by providing a groove 11 on the first surface 101 of the substrate 10. This helps to reduce the height difference between the first surface 101 of the substrate 10 and the side surface of the flexible substrate 30 away from the substrate 10, thereby improving the flatness of the side surface of the driving circuit layer 20 close to the substrate 10. This helps to avoid film layer breakage at the junction of the first region 201 and the second region 202 of the driving circuit layer 20, improving the reliability of the driving circuit layer 20, and thus improving the reliability of the display product.

[0025] Figure 5 The diagram shown is a schematic representation of another film layer of the display panel provided in this embodiment. Please refer to... Figure 1 and Figure 5 In one optional embodiment of this disclosure, the display panel 100 further includes an adhesive layer 40, which is located at least between the first side 103 of the substrate 10 and the flexible substrate 30, and between the second side 102 of the substrate 10 and the flexible substrate 30.

[0026] Specifically, in this embodiment, the first region 201 and the second region 202 of the driving circuit layer 20 are fabricated in the same process. After fabrication, a portion of the second region 202 of the driving circuit layer 20 is bent to the first side surface 103 and the second surface 102 of the substrate 10. To improve the tightness of the bond between the bent area of ​​the driving circuit layer 20 and the substrate 10, this embodiment provides an adhesive layer 40 between the flexible substrate 30 and the substrate 10. The adhesive layer 40 has a certain degree of adhesion, which facilitates fixing the flexible substrate 30 and the driving circuit layer 20 to the first side surface 103 and the second surface 102 of the substrate 10.

[0027] For further information, please continue to refer to [link / reference]. Figure 5In one optional embodiment, the adhesive layer 40 is located between the first side surface 103 of the substrate 10 and the flexible substrate 30, and also between the second side surface 102 of the substrate 10 and the flexible substrate 30. It should be noted that the flexible substrate 30 is made of a liquid material. When the material of the flexible substrate 30 is dripped into the groove portion 11, the flexible substrate 30 can form a good adhesive relationship with the substrate 10. Therefore, in this embodiment, the adhesive layer 40 is provided on the first side surface 103 and the second side surface 102 of the substrate 10, which helps to improve the bonding tightness between the flexible substrate 30 and the substrate 10.

[0028] It should be noted that this disclosure only describes the adhesive layer 40 as being located between the first side 103 of the substrate 10 and the flexible substrate 30, and between the second side 102 and the flexible substrate 30, and is not limited thereto. In some other embodiments, the adhesive layer 40 may also be located between the first side 101 of the substrate 10 and the flexible substrate 30. Such a configuration further facilitates a tighter bond between the flexible substrate 30 and the substrate 10.

[0029] Please refer to Figure 1 and Figure 4 In one optional embodiment of this disclosure, along the first direction F1, the depth H1 of the groove 11 is equal to the thickness H2 of the flexible substrate 30, and the first direction F1 is perpendicular to the plane where the substrate 10 is located. Specifically, this embodiment sets the relationship between the depth H1 of the groove 11 and the thickness H2 of the flexible substrate 30, that is, the depth H1 of the groove 11 is equal to the thickness H2 of the flexible substrate 30. With this setting, the flexible substrate 30 fully fills the groove 11, providing a flush or substantially flush substrate for the driving circuit layer 20, which is beneficial to improving the flatness of the driving circuit layer 20. Furthermore, it is beneficial to avoid film layer breakage at the junction of the first region 201 and the second region 202 of the driving circuit layer 20, thereby improving the reliability of the driving circuit layer 20. Therefore, this embodiment is more conducive to improving the reliability of the display product.

[0030] Please continue to refer to this. Figure 1 and Figure 4 Optionally, along the first direction F1, the depth of the groove 11 is H1, 5μm≤H1≤200μm, and the first direction F1 is perpendicular to the plane of the substrate 10.

[0031] Specifically, when the depth H1 of the groove 11 is less than 5 μm, the depth H1 is relatively small, resulting in a smaller space for the flexible substrate 30. If the flexible substrate 30 needs to be flush with the surface of the substrate 10, the thickness H2 of the flexible substrate 30 will be thinner, affecting its mechanical and support properties and making it difficult for the flexible substrate 30 to provide good support for the driving circuit layer 20. If the thickness of the flexible substrate 30 is designed to be thicker, the space for the flexible substrate 30 to be accommodated in the groove 11 will be smaller, and it may also cause the surface of the flexible substrate 30 away from the substrate 10 to be higher than the surface of the substrate 10, which may cause film layer breakage in subsequent processes and affect the reliability of the display panel 100. When the depth H1 of the groove 11 is greater than 200 μm, the depth H1 of the groove 11 is relatively deep, which has a greater impact on the mechanical properties of the corresponding area of ​​the substrate 10; at the same time, the thickness of the flexible substrate 30 will also affect its bending performance.

[0032] Therefore, this application sets the depth H1 of the groove portion 11 along the first direction F1 to 5μm≤H1≤200μm. This setting is beneficial for providing sufficient accommodation space for the flexible substrate 30, while having a smaller impact on the substrate 10. It is beneficial for providing a flat base for the driving circuit layer 20, improving the flatness of the driving circuit layer 20, avoiding film breakage of the driving circuit layer 20, improving the reliability of the display product, reducing adverse effects on the substrate 10, and also facilitating the bending of the flexible substrate 30 and the driving circuit layer 20. This disclosure provides an optional embodiment in which the depth H1 of the groove portion 11 along the first direction F1 is 50 μm; another optional embodiment in which the depth H1 of the groove portion 11 along the first direction F1 is 100 μm; yet another optional embodiment in which the depth H1 of the groove portion 11 along the first direction F1 is 150 μm; still another optional embodiment in which the depth 30 μm ≤ H1 ≤ 120 μm; and yet another optional embodiment in which the depth 60 μm ≤ H1 ≤ 180 μm. This disclosure is merely illustrative of the above embodiments and is not intended to limit the scope of the disclosure.

[0033] Please continue to refer to this. Figure 1 and Figure 4 In one optional embodiment of this disclosure, one side edge of the groove portion 11 is connected to the first side surface 103 of the substrate 10; optionally, the width of the groove portion 11 along the second direction F2 is W1, W1≥100μm, and the second direction F2 is parallel to the plane of the substrate 10.

[0034] Specifically, the groove 11 is located at the edge of the substrate 10, and a portion of the flexible substrate 30 is located within the groove 11, while another portion extends from the groove 11 to the first side surface 103 and the second side surface 102 of the substrate 10. The width W1 of the groove 11 along the second direction F2 represents the distance between the edge of the groove 11 that connects to the first side surface 103 of the substrate 10 and the opposite edge. When the width W1 of the groove 11 along the second direction F2 is less than 100 μm, the width of the groove 11 is small, resulting in a smaller width of the flexible substrate 30 within the groove 11. When the flexible substrate 30 bends towards the first side surface 103 and the second side surface 102, it is easy for the flexible substrate 30 to detach from the substrate 10, which in turn leads to the breakage of the driving circuit layer 20, affecting the reliability of the display product.

[0035] Therefore, in this disclosure, the width W1 of the groove portion 11 along the second direction F2 is set to W1≥100μm. This setting provides sufficient width for the flexible substrate 30 to be accommodated within the groove portion 11. When the flexible substrate 30 bends towards the first side 103 and the second side 102 of the substrate 10, it helps prevent the flexible substrate 30 from falling out of the groove portion 11, thereby improving the bonding strength between the flexible substrate 30 and the substrate 10. This disclosure provides an optional embodiment where the width W1 of the groove portion 11 along the second direction F2 is 150μm; another optional embodiment where the width W1 of the groove portion 11 along the second direction F2 is 180μm; yet another optional embodiment where the width W1 of the groove portion 11 along the second direction F2 is 240μm; and still another optional embodiment where the width W1 of the groove portion 11 along the second direction F2 is ≥200μm. This disclosure is only illustrative of the above embodiments and is not intended to limit the scope of the disclosure.

[0036] It should be noted that this disclosure Figure 4 In the corresponding embodiment, the flexible substrate 30 is located in the groove portion 11, and the first surface 101 of the substrate 10 is not planar. Please refer to... Figure 2 In some alternative embodiments, the first surface 101 of the substrate 10 is a plane, and the flexible substrate 30 is located on the side of the substrate 10 near the driving circuit layer 20. Specifically, the flexible substrate 30 is directly disposed above the substrate 10, thus eliminating the need to provide a groove on the first surface 101 of the substrate 10, which helps to reduce the complexity of the process and improve production efficiency. At the same time, it also helps to ensure the mechanical and support properties of the substrate 10, thereby improving the reliability of the display product.

[0037] Furthermore, Figure 6 The diagram shown is a schematic representation of another film layer of a display panel provided in this embodiment. Please refer to [the diagram]. Figure 1 and Figure 6In one optional embodiment of this disclosure, the flexible substrate 30 includes a connection region 301 and a folding region 302. The connection region 301 is located on the first surface 101 of the substrate 10, and the folding region 302 is located on the first side surface 103 and the second surface 102 of the substrate 10. The connection region 301 includes a first sub-region 3011 and a second sub-region 3012. Along a second direction F2, the distance between the first sub-region 3011 and the first region 201 of the driving circuit layer 20 is less than the distance between the second sub-region 3012 and the first region 201 of the driving circuit layer 20. The second direction F2 is parallel to the plane of the substrate 10. Along a first direction F1, the thickness of the first sub-region 3011 is less than the thickness of the second sub-region 3012. The first direction F1 is perpendicular to the plane of the substrate 10. It should be noted that the accompanying drawings of this disclosure use dashed lines to indicate the boundary between the first sub-region 3011 and the second sub-region 3012, as well as the boundary between the connection region 301 and the folding region 302.

[0038] This disclosure differentiates the thickness of the flexible substrate 30 at different locations. Specifically, this embodiment differentiates the thickness of the flexible substrate 30 located on the first surface 101 of the substrate 10, that is, differentiates the thickness of the connection region 301 of the flexible substrate 30. The connection region 301 is located on the first surface 101 of the substrate 10. The flexible substrate 30 is directly formed on the first surface 101 of the substrate 10. If the thickness of the connection region 301 at different locations is the same, when the thickness of the connection region 301 of the flexible substrate 30 is thicker, the surface formed by the side of the connection region 301 away from the substrate 10 and the first surface 101 of the substrate 10 will have a large thickness difference at the contact point, which can easily cause film breakage problems in subsequent processes. Therefore, this disclosure differentiates the thickness of the connection region 301 at different locations, specifically, the thickness of the first sub-region 3011 is less than the thickness of the second sub-region 3012. In this embodiment, the first sub-region 3011 and the second sub-region 3012 are regions corresponding to different positions within the connection region 301. The first sub-region 3011 is the region of the flexible substrate 30 closer to the first region 201 of the driving circuit layer 20, while the second sub-region 3012 is the region of the first region 201 farther away from the driving circuit layer 20 compared to the first sub-region 3011. This embodiment effectively forms a stepped connection region 301. With this configuration, the thickness difference between the side of the connection region 301 furthest from the substrate 10 and the first surface 101 of the substrate 10 increases in a stepped manner, which helps prevent film layer breakage in subsequent processes, thereby improving the reliability of the display product.

[0039] Figure 7 The diagram shown is a schematic diagram of another film layer of the display panel provided in an embodiment of this disclosure. Figure 8 The diagram shown is a schematic representation of another film layer of a display panel provided in this embodiment. Please refer to [the diagram]. Figure 1 , Figure 7 and Figure 8 Optionally, the driving circuit layer 20 includes a signal transmission pin 22 and a first trace 21, the first trace 21 being electrically connected to the signal transmission pin 22; at least a portion of the signal transmission pin 22 is located in the first region 201 of the driving circuit layer 20, and at least a portion of the first trace 21 is located in the second region 202 of the driving circuit layer 20.

[0040] Specifically, the driving circuit layer 20 includes signal transmission pins 22 and first traces 21. The first trace 21 transmits corresponding signals to other modules or devices in the driving circuit layer 20 through the signal transmission pins 22. Optionally, the first trace 21 transmits various signals such as power signals, data signals, and gate control signals. It should be noted that the first trace 21 mentioned in this disclosure is a general term for traces that transmit the above-mentioned signals, and the driving circuit layer 20 includes multiple first traces 21. In this disclosure, the signal transmission pins 22 are connected to modules or devices in the driving circuit layer 20 that need to receive corresponding signals. The signal transmission pins 22 need to transmit corresponding signals to modules or devices in the first region 201 of the driving circuit layer 20. Therefore, at least a portion of the signal transmission pins 22 is located in the first region 201. The signal source corresponding to the signal transmitted by the first trace 21 is usually located on the second surface 102 of the substrate 10. After passing through the first trace 21, the signal is transmitted to the first region 201 of the driving circuit layer 20 via the signal transmission pin 22. Therefore, at least a portion of the first trace 21 is located in the second region 202 of the driving circuit layer 20. This arrangement facilitates smooth signal transmission, thereby improving the reliability of the display product.

[0041] Please refer to Figure 7In one optional embodiment of this disclosure, the signal transmission pin 22 is located in the first region 201 of the driving circuit layer 20, and at least a portion of the first trace 21 is located in the first region 201 and at least a portion of the first trace 21 is located in the second region 202 of the driving circuit layer 20. The first end of the first trace 21 overlaps with the side of the signal transmission pin 22 away from the substrate 10, and the second end of the first trace 21 extends to the first side surface 103 and the second side surface 102 of the substrate 10. Specifically, in this embodiment, the signal transmission pin 22 is entirely located in the first region 201 of the driving circuit layer 20, and a portion of the first trace 21 is located in the first region 201 and a portion of the first trace 21 is located in the second region 202 of the driving circuit layer 20. That is, the signal transmission pin 22 is located on the first side surface 101 of the substrate 10, the first end of the first trace 21 is located on the first side surface 101 of the substrate 10, and the second end extends through the first side surface 103 of the substrate 10 to the second side surface 102 of the substrate 10. That is, the first trace 21 connects to the signal transmission pin 22 on the first surface 101 of the substrate 10, extends to the second surface 102 of the substrate 10, and connects to the signal source to receive the corresponding signal. With this configuration, the first trace 21 bends along with the second region 202 of the flexible substrate 30 and the driving circuit layer 20. The bendability of the first trace 21 is generally better than that of the signal transmission pin 22. Therefore, this embodiment is beneficial to improving the signal transmission performance of the signal transmission pin 22, thereby improving the reliability of the display product.

[0042] Please refer to Figure 8In another optional embodiment of this disclosure, at least a portion of the signal transmission pin 22 is located in the first region 201 of the driving circuit layer 20, and at least a portion is located in the second region 202 of the driving circuit layer 20. The first trace 21 is located in the second region 202 of the driving circuit layer 20. Specifically, in this embodiment, a portion of the signal transmission pin 22 is located in the first region 201, a portion is located in the second region 202, and the first trace 21 is entirely located in the second region 202. That is, the signal transmission pin 22 extends from the first surface 101 of the substrate 10, passes through the first side surface 103 of the substrate 10, and extends to the second surface 102 of the substrate 10. The first trace 21 is located on the second surface 102 of the substrate 10. In other words, the first trace 21 is connected to the signal transmission pin 22 on the second surface 102 of the substrate 10 and is connected to the signal source on the second surface 102 to receive the corresponding signal. This arrangement can reduce the space occupied by the signal transmission pin 22 in the first region 201, thereby providing more sufficient space for other modules or devices in the driving circuit layer 20 and further reducing the bezel size. Meanwhile, this embodiment can increase the area of ​​the signal transmission pin 22 on the second surface 102 of the substrate 10 and add more alignment marks, which is more conducive to the connection between the first trace 21 and the signal transmission pin 22, and thus more conducive to improving the reliability of the display product.

[0043] Figure 9 The diagram shown is a schematic representation of another film layer of a display panel provided in this embodiment. Please refer to [the diagram]. Figure 1 , Figure 7 and Figure 9 Optionally, the driving circuit layer 20 includes multiple metal layers 23 and multiple insulating layers 24, with the insulating layers 24 located at least between adjacent metal layers 23. Specifically, the driving circuit layer 20 is configured to drive the light-emitting unit 01 to emit light. The driving circuit layer 20 is a multi-layer stacked structure. Exemplarily, the driving circuit layer 20 includes transistors and metal traces. Therefore, the driving circuit layer 20 includes multiple metal layers 23, which are used at least to set different electrodes of the transistors and different metal traces. Insulating layers 24 are included between different metal layers 23, which at least prevent short circuits between different metal layers 23 and also provide protection for the metal layers 23, which helps to avoid moisture erosion of the metal layers and further improves the reliability of the driving circuit layer 20. In some embodiments, the metal layers 23 are located on the first surface 101 of the substrate 10. Regarding the insulating layer 24, this disclosure provides, but is not limited to, the following two different embodiments: Please refer to Figure 9In one optional embodiment of this disclosure, the insulating layer 24 extends from the first surface 101 of the substrate 10 to the first side surface 103 and the second surface 102 of the substrate 10. Specifically, in this embodiment, the insulating layer 24 is formed not only in the area corresponding to the first region 201 but also in the area corresponding to the second region 202, that is, it is formed relatively completely on the flexible substrate 30. The first surface 101, the second surface 102, and the first side surface 103 of the substrate all include multiple layers of insulating layer 24. In other words, the insulating layer 24 is bent together with the flexible substrate 30 to the first side surface 103 and the second surface 102 of the substrate 10. This arrangement helps to prevent abrupt changes in the film thickness of the second region 202 of the driving circuit layer 20, thereby helping to prevent the breakage of the traces (first trace 21) in the second region 202, and thus helping to improve the reliability of signal transmission.

[0044] Please refer to Figure 7 In another optional embodiment of this disclosure, the insulating layer 24 is located on the first surface 101 of the substrate 10, while the first side surface 103 and the second surface 102 of the substrate 10 do not include the insulating layer 24. Specifically, in this embodiment, the insulating layer 24 is only disposed on the first surface 101 of the substrate 10. When the flexible substrate 30 and the driving circuit layer 20 are bent, the insulating layer 24 does not bend along with the first trace 21. The first trace 21 located above the insulating layer 24 in the second region 202 of the driving circuit layer 20 bends along with the flexible substrate 30 to the first side surface 103 and the second surface 102 of the substrate 10. With this configuration, the total thickness of the film layer in the bending area is smaller. This is beneficial for bending the flexible substrate 30 and the driving circuit layer 20, and also helps to reduce the total thickness of the flexible substrate 30 and the driving circuit layer 20. It also helps to reduce the space occupied by the side surface of the driving circuit layer 20, further reducing the bezel size, and thus making it more conducive to achieving an extremely narrow bezel or bezel-less design.

[0045] Figure 10 The diagram shown is a schematic representation of another film layer of a display panel provided in this embodiment. Please refer to [the diagram]. Figure 1 and Figure 10 Regarding an embodiment where the insulating layer 24 does not bend with the flexible substrate 30, this disclosure provides an optional embodiment in which the insulating layer 24 includes a first type of insulating layer 241 and a second type of insulating layer 242, with the first type of insulating layer 241 located between the substrate 10 and the second type of insulating layer 242; along the second direction F2, the distance S1 between the first type of insulating layer 241 and the first side surface 103 of the substrate 10 is less than the distance S2 between the second type of insulating layer 242 and the first side surface 103 of the substrate 10, and the second direction F2 is parallel to the plane of the substrate 10. It should be noted that this disclosure only uses any two insulating layers 24 as examples for illustration and is not limited thereto.

[0046] The driving circuit layer 20 includes multiple insulating layers 24. In this embodiment, the distances between different insulating layers 24 and the first side surface 103 of the substrate 10 along the second direction F2 are differentiated. Specifically, the insulating layers 24 include a first type of insulating layer 241 and a second type of insulating layer 242. The distance between the first type of insulating layer 241 and the substrate 10 along the first direction F1 is smaller than the distance between the second type of insulating layer 242 and the substrate 10 along the first direction F1. That is, the first type of insulating layer 241 is closer to the substrate 10 than the second type of insulating layer 242. In this embodiment, along the first direction F1, the edge of the first type of insulating layer 241 is closer to the first side surface 103, and the edge of the second type of insulating layer 242 is relatively farther away from the first side surface 103 than the first type of insulating layer 241. In other words, among the multiple stacked insulating layers 24, the edge of the lower first type of insulating layer 241 is closer to the first side surface 103, while the edge of the upper second type of insulating layer 242 is relatively farther away from the first side surface 103. This arrangement creates a stepped structure on the side closest to the first side surface 103, effectively altering the total thickness of the driving circuit layer 20. When subsequent film layers or traces are laid on top of the insulating layers 24, this configuration helps prevent film layer or trace breakage, thereby improving signal transmission reliability and ultimately enhancing the reliability of the display product.

[0047] Figure 11 The diagram shown is another plan view of the display panel provided in an embodiment of this disclosure. Please refer to [the diagram]. Figure 2 and Figure 11 In one optional embodiment of this disclosure, the second region 202 of the driving circuit layer 20 includes one or more independent sub-regions 2020, and the flexible substrate 30 includes one or more independent sub-substrate regions 31, with each sub-region 2020 corresponding to a sub-substrate region 31. It should be noted that, for clear illustration of the sub-regions 2020 and 31, this disclosure... Figure 11 A planar schematic diagram of sub-region 2020 and sub-substrate region 31 before bending is shown.

[0048] Specifically, in this disclosure, the second region 202 of the driving circuit layer 20 is disposed on the flexible substrate 30, thereby allowing the corresponding lines to be bent to the first side 103 and the second side 102 of the substrate 10. Compared to related technologies that fabricate metal traces on the front, side, and back of the display product respectively, this simplifies the process and fabrication of the display panel 100, improves production efficiency, reduces production costs, and increases the production yield of the display product, thus also improving the reliability of the display product. When the size of the display panel 100 is large, the second region 202 of the driving circuit layer 20 can be distributed in multiple independent sub-regions 2020, which is more conducive to signal transmission and trace layout. Correspondingly, the sub-substrate region 31 of the flexible substrate 30 corresponds to the sub-region 2020 of the second region 202 of the driving circuit layer 20. Similarly, please refer to... Figure 4 When the substrate 10 includes a recessed portion 11, the recessed portion 11 includes a plurality of sub-recesses, and the sub-recesses correspond one-to-one with the sub-substrate regions 31.

[0049] Optionally, the orthographic projection shape of the recess 11 onto the plane of the display panel 100 can be any feasible shape such as a rectangle or trapezoid. This disclosure does not impose specific limitations and can be designed according to actual needs. Similarly, the orthographic projection shape of the flexible substrate 30 onto the plane of the display panel 100 and the orthographic projection shape of the second region 202 of the driving circuit layer 20 onto the plane of the display panel 100 follow the shape of the recess 11. When the substrate 10 does not include the recess 11, the orthographic projection shape of the flexible substrate 30 onto the plane of the display panel 100 and the orthographic projection shape of the second region 202 of the driving circuit layer 20 onto the plane of the display panel 100 can also be designed according to actual needs, and this disclosure does not impose specific limitations.

[0050] Based on the same inventive concept, this disclosure provides a method for manufacturing a display panel. Figure 12 The diagram shown is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 13 The diagram shown is a disassembly schematic of a method for manufacturing a display panel according to an embodiment of this disclosure. Please refer to it. Figure 12 and Figure 13 The manufacturing methods for the display panel include: Step S10: Provide a substrate 10; wherein the substrate 10 includes a first surface 101, a second surface 102 and a first side surface 103, the first surface 101 and the second surface 102 are disposed opposite to each other, and the first side surface 103 is connected to the first surface 101 and the second surface 102. Step S20: Fabricate a flexible substrate 30 in a portion of the first surface 101 of the substrate 10; Step S30: A driving circuit layer 20 is fabricated on the first surface 101 of the substrate 10 and the side of the flexible substrate 30 away from the substrate 10; wherein, the driving circuit layer 20 includes a first region 201 and a second region 202 connected to the first region 201. Along the direction perpendicular to the plane of the substrate 10, the first region 201 does not overlap with the flexible substrate 30, and the second region 202 overlaps with the flexible substrate 30. Step S40: Peel at least a portion of the flexible substrate 30 from the substrate 10; Step S50: Remove the substrate 10 that has been peeled off from the flexible substrate 30; In step S60, the flexible substrate 30 and the driving circuit layer 20 are bent so that at least a portion of the flexible substrate 30 and a portion of the driving circuit layer 20 are located on the first side surface 103 and the second side surface 102 of the substrate 10.

[0051] It should be noted that this disclosure provides a method for manufacturing a display panel, including but not limited to steps S10 to S60.

[0052] Specifically, in the display panel manufacturing method provided in this disclosure, a substrate 10 is provided in step S10. The substrate 10 provides support for subsequent processes and mechanical protection for the manufactured display panel. In step S20, a flexible substrate 30 is fabricated. The flexible substrate 30 defines different regions for subsequent film layers. In subsequent steps, the second region 202 of the driving circuit layer 20 is deposited on the flexible substrate 30. In step S30, the first region 201 and the second region 202 of the driving circuit layer 20 are formed in different regions formed by the substrate 10 and the flexible substrate 30. It should be noted that during the fabrication of the flexible substrate 30 and the driving circuit layer 20, the substrate 10 remains underneath to provide support. In step S40, a portion of the flexible substrate 30 corresponding to the second region 202 of the driving circuit layer 20 is peeled off from the substrate 10 to enable subsequent bending of the flexible substrate 30 and the driving circuit layer 20. The peeled area between the flexible substrate 30 and the substrate 10 is indicated by a dashed box in the figure. Optionally, the flexible substrate 30 and the substrate 10 can be peeled off by laser irradiation. In step S50, the substrate 10 peeled off from the flexible substrate 30 is cut off, that is, the substrate 10 within the dashed box in the figure is cut off. At this time, the substrate 10 still exists below part of the flexible substrate 30 and is tightly bonded to the substrate 10, while the substrate 10 has been removed from part of the flexible substrate 30. In step S60, the area of ​​the flexible substrate 30 where the substrate 10 has been removed is bent. Specifically, the flexible substrate 30 and the driving circuit layer 20 are bent to the first side 103 and the second side 102 of the substrate 10. With this configuration, the first region 201 and the second region 202 of the driving circuit layer 20 can be formed in the same process. Compared with related technologies that fabricate metal traces on the front, side and back of the display product respectively, this simplifies the process of display panel fabrication, improves production efficiency and reduces production costs. Furthermore, this disclosure eliminates the need to fabricate traces directly on the side of the display product. Instead, the traces fabricated on the front (second area 202 of the driving circuit layer 20) are bent to the side (first side 103). This arrangement helps to improve the production yield of the display product, thereby improving the reliability of signal transmission and thus also improving the reliability of the display product.

[0053] Figure 14 The diagram shown is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 15 The diagram shown is a disassembly illustration of another method for manufacturing a display panel according to an embodiment of this disclosure. Please refer to the diagram. Figure 14 and Figure 15 In one optional embodiment of this disclosure, before step S20, when a flexible substrate 30 is formed in a portion of the first surface 101 of the substrate 10, the method for manufacturing the display panel further includes: Step S11: A groove 11 is formed on the first surface 101 of the substrate 10; wherein the groove 11 is used to accommodate at least a portion of the flexible substrate 30.

[0054] Specifically, the method for manufacturing a display panel provided in this embodiment includes, but is not limited to, steps S10 to S60. In step S10, a substrate 10 is provided. In step S11, a recess 11 is formed on the surface of the substrate 10, and in the formed display panel, a flexible substrate 30 is located in the recess 11. In step S20, a flexible substrate 30 is fabricated in the recess 11. In step S30, a driving circuit layer 20 is fabricated, wherein the second region 202 of the driving circuit layer 20 is located above the flexible substrate 30. In step S40, a portion of the flexible substrate 30 is peeled off from the substrate 10, specifically, the region within the dashed frame is peeled off. In step S50, the substrate 10 peeled off from the flexible substrate 30 is cut off, that is, the substrate 10 within the dashed frame in the figure is cut off. In step S60, the flexible substrate 30 and the driving circuit layer 20 are bent to the first side surface 103 and the second side surface 102 of the substrate 10. In this embodiment, a groove 11 is formed on the surface of the substrate 10. This arrangement provides a space for the flexible substrate 30, which helps to reduce the height difference between the first surface 101 of the substrate 10 and the side surface of the flexible substrate 30 away from the substrate 10. This improves the flatness of the side surface of the driving circuit layer 20 close to the substrate 10, thereby helping to avoid film breakage of the driving circuit layer 20 and improving the reliability of the driving circuit layer 20. As a result, it helps to improve the reliability of the display product.

[0055] Figure 16 The diagram shown is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Please refer to [link / reference]. Figure 15 and Figure 16 Furthermore, in an optional embodiment of this disclosure, after the flexible substrate 30 is fabricated in a portion of the first surface 101 of the substrate 10 in step S20, the method for fabricating the display panel 100 further includes: Step S21: Confirm the flatness of the first surface 101 of the substrate 10 and the side surface of the flexible substrate 30 away from the substrate 10.

[0056] Specifically, in this embodiment, in step S11, a groove 11 is formed on the first surface 101 of the substrate 10. In step S20, a flexible substrate 30 is fabricated in the groove 11. To provide a flat substrate for the film layers in subsequent processes, the display panel fabrication method further includes step S21. After fabricating the flexible substrate 30, in step S21, the flatness of the surface of the flexible substrate 30 away from the substrate 10 and the first surface 101 of the substrate 10 is detected. That is, whether the first surface 101 of the substrate 10 and the surface of the flexible substrate 30 away from the substrate 10 are flush or substantially flush is detected, so as to provide a flat substrate for the driving circuit layer 20, which is beneficial to improving the flatness of the driving circuit layer 20, further beneficial to avoiding film layer breakage of the driving circuit layer 20, improving the reliability of the driving circuit layer 20, and thus improving the reliability of the display product.

[0057] Figure 17 The diagram shown is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 18 The diagram shown is a disassembly schematic of another manufacturing method of the display panel provided in this embodiment. Please refer to it. Figure 17 and Figure 18 In one optional embodiment of this disclosure, after step S50, which involves removing the substrate 10 that has been peeled off from the flexible substrate 30, the method further includes: Step S51: Apply an adhesive layer 40 to the first side 103 and the second side 102 of the substrate 10.

[0058] Specifically, in this embodiment, step S51, applying an adhesive layer 40, is included between steps S50 and S60. The adhesive layer 40 is located on the first side 103 and the second side 102 of the substrate 10. It should be noted that the flexible substrate 30 is made of liquid material. When the material of the flexible substrate 30 is dripped into the groove portion 11, the flexible substrate 30 can form a good adhesive relationship with the substrate 10. Therefore, in this embodiment, the adhesive layer 40 is applied to the first side 103 and the second side 102 of the substrate 10. In this way, after bending the flexible substrate 30 and the driving circuit layer 20 in subsequent steps, it is beneficial to improve the bonding tightness between the flexible substrate 30 and the substrate 10.

[0059] Based on the same inventive concept, this disclosure provides a display device. Figure 19 The diagram shown is a plan view of a display device provided in this embodiment. Please refer to it. Figure 19 The display device 200 includes a display panel 100. The display panel 100 is any type of display panel 100 provided in the embodiments of this disclosure.

[0060] It should be noted that the accompanying drawings of this disclosure illustrate a splicing display device, wherein the display device 200 includes a plurality of display panels 100. Embodiments of the display device 200 provided in this disclosure can be found in the embodiments of the display panels 100 described above, and repeated descriptions will not be repeated. The display device 200 provided in this disclosure can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, or navigator.

[0061] As can be seen from the above embodiments, the display panel, its manufacturing method, and the display device provided in this disclosure achieve at least the following beneficial effects: This disclosure provides a display panel and its manufacturing method, as well as a display device. The display panel includes a substrate and a driving circuit layer. The driving circuit layer includes a first region and a second region connected to the first region. The substrate includes a first side, a second side, and a first side surface. In the display panel provided by this disclosure, a flexible substrate is provided, and the second region of the driving circuit layer is disposed on the flexible substrate. In the same process, the first and second regions of the driving circuit layer are fabricated, and then the second region of the driving circuit layer is bent to the first and second side surfaces of the substrate. Compared with related technologies that fabricate metal traces on the front, side, and back of the display product respectively, this disclosure can achieve an extremely narrow bezel or bezel-less design while reducing the complexity of the display panel's manufacturing process, thereby improving production efficiency and reducing production costs. Furthermore, this disclosure does not require directly fabricating traces on the side of the display product; instead, the traces fabricated on the front are bent to the side. This arrangement also helps to improve the production yield of the display product, thereby improving the reliability of signal transmission. Therefore, this disclosure also helps to improve the reliability of the display product.

[0062] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0063] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that, Includes the substrate and the driving circuit layer; The driving circuit layer includes a first region and a second region connected to the first region; The substrate includes a first surface, a second surface, and a first side surface, wherein the first surface and the second surface are disposed opposite to each other, and the first side surface is connected to the first surface and the second surface; The first region of the driving circuit layer is located on the first surface of the substrate, at least a portion of the second region is located on the first surface of the substrate, at least a portion of the second region extends to the first side surface and the second surface of the substrate, and a flexible substrate is further included between the second region and the substrate; The first and second regions of the driving circuit layer are fabricated in the same process.

2. The display panel according to claim 1, characterized in that, The first surface of the substrate includes a groove, and at least a portion of the flexible substrate is located in the groove.

3. The display panel according to claim 2, characterized in that, It also includes an adhesive layer, which is located at least between the first side of the substrate and the flexible substrate, and between the second side of the substrate and the flexible substrate.

4. The display panel according to claim 2, characterized in that, Along a first direction, the depth of the groove is equal to the thickness of the flexible substrate, and the first direction is perpendicular to the plane of the substrate.

5. The display panel according to claim 2, characterized in that, Along the first direction, the depth of the groove is H1, 5μm≤H1≤200μm, and the first direction is perpendicular to the plane of the substrate.

6. The display panel according to claim 2, characterized in that, One edge of the groove is in contact with the first side surface of the substrate; Along the second direction, the width of the groove is W1, where W1 ≥ 100 μm, and the second direction is parallel to the plane of the substrate.

7. The display panel according to claim 1, characterized in that, The first surface of the substrate is a plane, and the flexible substrate is located on the side of the substrate closer to the driving circuit layer.

8. The display panel according to claim 7, characterized in that, The flexible substrate includes a connection region and a folding region. The connection region is located on the first surface of the substrate, and the folding region is located on the first side surface and the second surface of the substrate. The connection area includes a first sub-region and a second sub-region. Along the second direction, the distance between the first sub-region and the first region of the driving circuit layer is less than the distance between the second sub-region and the first region of the driving circuit layer. The second direction is parallel to the plane where the substrate is located. Along a first direction, the thickness of the first sub-region is less than the thickness of the second sub-region, and the first direction is perpendicular to the plane where the substrate is located.

9. The display panel according to claim 1, characterized in that, The driving circuit layer includes a signal transmission pin and a first trace, wherein the first trace is electrically connected to the signal transmission pin. At least a portion of the signal transmission pin is located in the first region of the driving circuit layer, and at least a portion of the first trace is located in the second region of the driving circuit layer.

10. The display panel according to claim 9, characterized in that, The signal transmission pin is located in the first region of the driving circuit layer, at least a portion of the first trace is located in the first region of the driving circuit layer, and at least a portion of the trace is located in the second region of the driving circuit layer. The first end of the first trace is attached to the side of the signal transmission pin away from the substrate, and the second end of the first trace extends to the first side and the second side of the substrate.

11. The display panel according to claim 9, characterized in that, At least a portion of the signal transmission pin is located in the first region of the driving circuit layer, and at least a portion of the pin is located in the second region of the driving circuit layer. The first trace is located in the second region of the driving circuit layer.

12. The display panel according to claim 1, characterized in that, The driving circuit layer includes multiple metal layers and multiple insulating layers, wherein the insulating layers are located at least between adjacent metal layers; The insulating layer extends from the first surface of the substrate to the first side surface and the second surface of the substrate.

13. The display panel according to claim 1, characterized in that, The driving circuit layer includes multiple metal layers and multiple insulating layers, wherein the insulating layers are located at least between adjacent metal layers; The insulating layer is located on the first surface of the substrate, and the first side surface and the second surface of the substrate do not include the insulating layer.

14. The display panel according to claim 13, characterized in that, The insulating layer includes a first type of insulating layer and a second type of insulating layer, wherein the first type of insulating layer is located between the substrate and the second type of insulating layer; Along the second direction, the distance between the first type of insulating layer and the first side surface of the substrate is less than the distance between the second type of insulating layer and the first side surface of the substrate, and the second direction is parallel to the plane of the substrate.

15. The display panel according to claim 1, characterized in that, The second region of the driving circuit layer includes one or more independent sub-regions, and the flexible substrate includes one or more independent sub-substrate regions, with each sub-region corresponding to the previous one.

16. A method for manufacturing a display panel, characterized in that, include: A substrate is provided; wherein the substrate includes a first surface, a second surface, and a first side surface, the first surface and the second surface are disposed opposite to each other, and the first side surface is connected to the first surface and the second surface; A flexible substrate is fabricated in a portion of the first surface of the substrate; A driving circuit layer is formed on the first surface of the substrate and on the side of the flexible substrate away from the substrate; wherein the driving circuit layer includes a first region and a second region connected to the first region, and the first region does not overlap with the flexible substrate along a direction perpendicular to the plane of the substrate, while the second region overlaps with the flexible substrate. At least a portion of the flexible substrate is peeled off from the substrate; Remove the substrate that has been detached from the flexible substrate; The flexible substrate and the driving circuit layer are bent such that at least a portion of the flexible substrate and a portion of the driving circuit layer are located on the first side and the second side of the substrate.

17. The method for manufacturing a display panel according to claim 16, characterized in that, Before fabricating a flexible substrate in a portion of the first surface of the substrate, the method further includes: A groove is formed on the first surface of the substrate; wherein the groove is used to accommodate at least a portion of the flexible substrate.

18. The method for manufacturing a display panel according to claim 17, characterized in that, After fabricating a flexible substrate in a portion of the first surface of the substrate, the method further includes: Confirm the flatness of the first surface of the substrate and the side of the flexible substrate away from the substrate.

19. The method for manufacturing a display panel according to claim 16, characterized in that, After the substrate that has been peeled off from the flexible substrate is removed, the method further includes: An adhesive layer is applied to the first side and the second side of the substrate.

20. A display device, characterized in that, The display panel includes any one of claims 1 to 15.

Images