Semiconductor devices and semiconductor device assemblies having inkjet printed conductive pads and methods of making the same
By forming conductive pads and traces on semiconductor device assemblies using inkjet printing technology, the problem of functional testing of stacked assemblies in the prior art is solved. It also enables protection of electrical interconnects and active circuits and fan-out of dense conductor arrays, and is suitable for stacked devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MICRON TECHNOLOGY INC
- Filing Date
- 2024-10-18
- Publication Date
- 2026-06-02
AI Technical Summary
Existing technologies make it difficult to effectively test the functionality of stacked assemblies in semiconductor device assemblies, and photolithography methods are incompatible or inconvenient for positioning probe pads after stacking, which may damage electrical interconnects and active circuits.
Inkjet printing technology is used to form conductive pads on semiconductor device assemblies, directly contacting exposed conductors. Conductive nanoparticles are positioned in different vertical planes through inkjet printing process to form conductive pads and traces for testing circuit functionality. This method is suitable for stacked devices.
It enables functional testing of the assembled components after stacking, protects electrical interconnects and active circuits from mechanical deformation damage, is compatible with stacked devices, and provides fan-out capability for dense conductor arrays.
Smart Images
Figure CN122139499A_ABST