Heat sink for a space vehicle and space vehicle comprising the heat sink

Abstract

The present application relates to a heat dissipation device for a space vehicle and the space vehicle. The heat dissipation device comprises a fixing member installed on a surface of a shell of a heat source, a deformable heat-conducting member comprising a first end fixed to the fixing member, a second end and an intermediate portion between the first end and the second end, and a heat dissipation fin member to which the second end is fixed. The deformable heat-conducting member is configured to switch between a first state in which the deformable heat-conducting member causes the heat dissipation fin member to be close to the surface of the shell and a second state in which the intermediate portion of the deformable heat-conducting member is deformed to cause the heat dissipation fin member to be away from the surface of the shell according to a change in temperature. The heat dissipation device according to the present application can reduce the area and volume of the heat dissipation device, increase the effective heat dissipation area, improve the heat dissipation efficiency, facilitate manufacturing and maintenance, and be applicable to different types of space vehicles and the like.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of spacecraft, and more specifically, to a heat dissipation device, particularly a heat dissipation device for a spacecraft and a spacecraft including the heat dissipation device. Background Technology

[0002] In the field of spacecraft radiative heat dissipation equipment, radiative heat dissipation design and optimization is an important research direction. For example, with the development of satellite platform technology, the integration level of individual units is increasing, and the power density of individual units is also increasing. In order to ensure the stable and reliable operation of individual units, it is required that the operating temperature of individual units be maintained within a low temperature range. Therefore, it is necessary to design more efficient and smaller heat dissipation devices to reduce thermal resistance and control their temperature levels.

[0003] Traditional heat dissipation devices for spacecraft include, for example, spraying a low-absorption, high-emissivity thermal control coating directly onto the surface of the heat dissipation compartment. To further enhance the radiative heat dissipation performance of the compartment surface, heat transfer pipes are typically embedded within the compartment. However, these traditional heat dissipation devices are complex, space-consuming, difficult to maintain, and their shape and structural design are relatively fixed, making them unadjustable based on actual heat dissipation and space requirements.

[0004] Traditional heat dissipation devices for spacecraft often include complex, multi-layered shielding structures designed to mitigate the effects of heat flow from celestial bodies such as Earth or the Sun. However, the need for nested shields in these devices increases overall size and weight, posing a significant challenge for spacecraft with limited space.

[0005] In summary, the shortcomings of traditional heat dissipation devices used in spacecraft are: it is difficult to improve the radiative heat dissipation performance of the heat dissipation device within a limited space, while at the same time being able to adjust the shape of the heat dissipation device according to actual heat dissipation and space requirements. Summary of the Invention

[0006] This invention provides a heat dissipation device for spacecraft, which can improve the radiative heat dissipation performance of the heat dissipation device in a limited space, and at the same time, the shape of the heat dissipation device can be adjusted according to actual heat dissipation and space requirements.

[0007] According to one aspect of the present invention, a heat dissipation device for a spacecraft is provided, the heat dissipation device comprising: a fixing member mounted on the shell surface of a heat source, the spacecraft including the heat source; a deformable thermally conductive member including a first end, a second end, and an intermediate portion located between the first end and the second end, the first end of the deformable thermally conductive member being fixed to the fixing member; and a heat dissipation fin member, the second end of the deformable thermally conductive member being fixed to the heat dissipation fin member, wherein the deformable thermally conductive member is configured to switch between a first state and a second state according to a temperature change, wherein in the first state, the deformable thermally conductive member causes the heat dissipation fin member to be close to the shell surface, and in the second state, the intermediate portion of the deformable thermally conductive member deforms to cause the heat dissipation fin member to be away from the shell surface.

[0008] In some embodiments, the deformable thermally conductive component may be made of shape memory alloy.

[0009] In some embodiments, the housing surface may include a portion where heat accumulates when the heat source is energized, and a fixing member may be fixed to the housing surface at a location corresponding to the portion where heat accumulates.

[0010] In some embodiments, the deformable heat-conducting member may be in the form of a hollow deformable heat pipe, wherein a heat transfer medium is contained within the deformable heat pipe, wherein the deformable heat pipe may be configured to: at a first end, use heat from a fixed member to heat the heat transfer medium to change it from a liquid state to a gaseous state to flow to a second end; at an intermediate portion, use a gaseous heat transfer medium to be heated so that the intermediate portion deforms after reaching a deformation temperature; and at the second end, cool the gaseous heat transfer medium into a liquid state to flow back to the first end.

[0011] In some embodiments, the fixing member may include a fixing plate and a first protrusion protruding from the fixing plate in a direction away from the housing surface, the fixing member being fixed to the housing surface via the fixing plate; and a first hollow channel is provided in the first protrusion, and a first end of the deformable heat-conducting member is fixed in the first hollow channel in a thermally conductive manner.

[0012] In some embodiments, the heat dissipation fin member may include heat dissipation fins and a second protrusion protruding from the heat dissipation fins in a direction away from the housing surface, wherein a second hollow channel is provided in the second protrusion, and a second end of the deformable heat-conducting member is fixed in the second hollow channel in a thermally conductive manner.

[0013] In some embodiments, the outer surface of the heat dissipation fin component may be coated with a thermal control coating.

[0014] In some embodiments, the first state may correspond to the initial shape of the deformable heat-conducting member when it is below the deformation temperature, and the second state may correspond to the target shape of the deformable heat-conducting member when it is at or above the deformation temperature; the spacecraft may also include at least one additional device disposed near the heat source, wherein the target shape is associated with the position of the heat dissipation fin member and the deformable heat-conducting member relative to the heat source and at least one additional device during the deformation of the deformable heat-conducting member.

[0015] According to a second aspect of the present invention, a spacecraft is provided, comprising: a heat dissipation device according to a first aspect of the present invention; a heat source; and at least one additional device disposed adjacent to the heat source and the heat dissipation device.

[0016] In some embodiments, the first state may correspond to the initial shape of the deformable thermally conductive member when it is below the deformation temperature, and the second state may correspond to the target shape of the deformable thermally conductive member when it is at or above the deformation temperature, wherein the target shape is associated with the position of the heat sink fin member and the deformable thermally conductive member relative to the heat source and at least one additional device during the deformation of the deformable thermally conductive member.

[0017] In a heat dissipation device according to an embodiment of the present invention, the deformable heat-conducting member of the heat dissipation device is configured to switch between a first state and a second state according to temperature changes. In the first state, the deformable heat-conducting member brings the heat dissipation fins closer to the shell surface, while in the second state, the middle portion of the deformable heat-conducting member deforms to move the heat dissipation fins away from the shell surface. Therefore, the position of the heat dissipation fins connected to the deformable heat-conducting member relative to the shell surface differs between the deformed and undeformed states, and in the deformed state, the heat dissipation fins are away from the shell surface of the heat source. Thus, the heat dissipation device can increase the effective heat dissipation area while reducing area and volume, improving heat dissipation efficiency, facilitating manufacturing and maintenance, and is suitable for the heat dissipation and space requirements of different types of spacecraft. Therefore, the present invention can improve the radiative heat dissipation performance of the heat dissipation device within a limited space, while also allowing the shape of the heat dissipation device to be adjusted according to actual heat dissipation and space requirements.

[0018] It should be understood that the description in the Summary of the Invention is not intended to limit the key or essential features of the embodiments of the present invention, nor is it intended to restrict the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0019] The above and other features, advantages, and aspects of the various embodiments of the present invention will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein:

[0020] Figure 1 A perspective view of a heat source, additional devices, and a heat dissipation device in a first state is shown according to some embodiments of the present invention.

[0021] Figure 2 A perspective view of a heat source, additional devices, and a heat dissipation device in a second state is shown according to some embodiments of the present invention.

[0022] Figure 3 An exploded schematic diagram of a heat source and a heat dissipation device according to some embodiments of the present invention is shown.

[0023] Figure 4A A schematic diagram of a spacecraft according to some embodiments of the present invention is shown, wherein the heat dissipation device is in a first state.

[0024] Figure 4B A schematic diagram of a portion of the structure of a spacecraft according to some embodiments of the present invention is shown, wherein the solar panel wing is removed to better show the heat dissipation device in a first state.

[0025] Figure 5A A schematic diagram of a spacecraft according to some embodiments of the present invention is shown, wherein the heat dissipation device is in a second state.

[0026] Figure 5B A schematic diagram of a portion of the structure of a spacecraft according to some embodiments of the present invention is shown, wherein the solar panel wing is removed to better show the heat dissipation device in a second state.

[0027] Figure 6 A schematic diagram of an equivalent model of the effective radiation capability of a deformable heat dissipation device according to some embodiments of the present invention is shown. Detailed Implementation

[0028] Various embodiments will now be described with reference to the accompanying drawings, wherein similar reference numerals are used throughout to denote similar elements. In the following description, numerous specific details are set forth for purposes of explanation in order to facilitate a thorough understanding of one or more embodiments. However, it may be apparent in some or all cases that any of the embodiments described below can be practiced without employing the specific design details described below. In other instances, well-known structures and devices are illustrated in block diagram form to facilitate the description of one or more embodiments. A simplified overview of one or more embodiments is given below to provide a basic understanding of the embodiments. This overview is not an exhaustive summary of all contemplated embodiments, is not intended to identify key or essential elements of all embodiments, nor is it intended to define the scope of any or all embodiments.

[0029] References to “embodiment” or “one embodiment” within the framework of this description are intended to indicate that a particular configuration, structure, or feature described with respect to an embodiment is included in at least one embodiment. Therefore, phrases such as “in an embodiment” or “in one embodiment” that may appear at one or more points in this description do not necessarily refer to the same embodiment. Furthermore, in one or more embodiments, particular constructions, structures, or features may be combined in any suitable manner.

[0030] In the following description, one or more specific details are set forth to provide a thorough understanding of examples of embodiments described herein. Embodiments may be obtained without one or more of these specific details, or by utilizing other methods, components, materials, etc. In other instances, known structures, materials, or operations are not illustrated or described in detail so that certain aspects of the embodiments will not be obscured.

[0031] Unless otherwise indicated, when referring to two elements connected together, it means a direct connection without any intermediate element other than a conductor; and when referring to two elements coupled together, it means that the two elements can be connected or they can be coupled via one or more other elements.

[0032] In the following disclosure, unless otherwise indicated, references to absolute positional modifiers (such as the terms "front," "back," "top," "bottom," "left," "right," etc.) or relative positional modifiers (such as the terms "above," "below," "higher," "lower," etc.), or references to orientational modifiers (such as "horizontal," "vertical," etc.), refer to the orientation shown in the figure. Unless otherwise specified, the expressions "about," "approximately," "basically," and "approximately" indicate within 10%, preferably within 5%.

[0033] As mentioned above, with the development of satellite platform technology, the integration level and power density of individual units are increasing. To ensure the stable and reliable operation of individual units, their operating temperature must be maintained within a low temperature range. Therefore, it is necessary to seek good heat dissipation methods and apply various thermal control measures to reduce the thermal resistance of each component and control its temperature level.

[0034] Heat generated by typical electronic equipment within a spacecraft is conducted to the mounting panels via internal radiation. These mounting panels are a crucial component of the spacecraft's interior, typically referring to the bulkhead panels used to mount and secure electronic equipment. During heat dissipation, the mounting panels conduct heat to their heat-dissipating surfaces, which then dissipate the heat into space through radiation or convection. Since space is a near-vacuum environment, heat is primarily lost through radiation. For example, heat can be transferred via heat transfer pipes to designated heat-dissipating surfaces on the spacecraft (e.g., a satellite) and ultimately dissipated as radiation into heat sinks in space.

[0035] Furthermore, to improve the radiative heat dissipation performance of the mounting panel, heat transfer pipes are typically pre-embedded within the panel. However, this process is complex and has low maintainability. Pre-embedding heat transfer pipes within the panel requires precise layout and calculation during the design phase to ensure pipe routing and heat dissipation effectiveness. Simultaneously, ensuring pipe connections and sealing during manufacturing increases difficulty and cost. During installation, the pre-embedded heat transfer pipes need precise coordination with other components to ensure the normal operation of the heat dissipation system. During maintenance, because the pipes are pre-embedded within the panel, direct inspection and repair are difficult, increasing maintenance difficulty and cost. Moreover, their relatively fixed shape and structural design cannot be adjusted according to actual needs, which to some extent limits their application in spacecraft.

[0036] In addition, some spacecraft employ complex multi-layered shielding structures for their radiative heat dissipation devices to mitigate the effects of heat flow from celestial bodies such as Earth or the Sun. This solution often requires designing multiple nested shields, resulting in an increase in overall size and weight.

[0037] Therefore, the shortcomings of traditional heat dissipation devices used in spacecraft are: it is difficult to improve the radiative heat dissipation performance of the heat dissipation device within a limited space, while at the same time being able to adjust the shape of the heat dissipation device according to actual heat dissipation and space requirements.

[0038] In view of at least one of the above-mentioned problems, some embodiments of the present invention provide a heat dissipation device for a spacecraft. The heat dissipation device includes: a fixed member mounted on the shell surface of a heat source, the spacecraft including the heat source; a deformable thermally conductive member including a first end, a second end, and an intermediate portion located between the first and second ends, the first end of the deformable thermally conductive member being fixed to the fixed member; and a heat dissipation fin member, the second end of the deformable thermally conductive member being fixed to the heat dissipation fin member. The deformable thermally conductive member is configured to switch between a first state and a second state according to temperature changes, wherein in the first state, the deformable thermally conductive member causes the heat dissipation fin member to be close to the shell surface, and in the second state, the intermediate portion of the deformable thermally conductive member deforms to cause the heat dissipation fin member to be away from the shell surface. The heat dissipation device according to some embodiments of the present invention can increase the effective heat dissipation area with reduced area and volume, improve heat dissipation efficiency, facilitate manufacturing and maintenance, and is adaptable to the heat dissipation and space requirements of different types of spacecraft.

[0039] The following description, with reference to the accompanying drawings, illustrates a heat dissipation device for a spacecraft according to some embodiments of the present invention.

[0040] Figure 1 A perspective view of a heat source, additional devices, and a heat dissipation device in a first state is shown according to some embodiments of the present invention; Figure 2 A perspective view of a heat source, additional devices, and a heat dissipation device in a second state, according to some embodiments of the present invention, is shown; and Figure 3 An exploded schematic diagram of a heat source and a heat dissipation device according to some embodiments of the present invention is shown.

[0041] like Figure 1 and Figure 2 As shown, a spacecraft (e.g., a satellite, not shown in the figure) or various other devices requiring heat dissipation includes: a heat source 200, a heat dissipation device 100 disposed outside the housing 201 of the heat source 200, and at least one other auxiliary device 300 disposed adjacent to the heat source 200. Various electronic devices carried on a spacecraft (e.g., a satellite), such as communication equipment, navigation equipment, data processing equipment, etc., generate heat during operation. For example, satellites are typically equipped with battery packs to provide power when solar energy is insufficient or unavailable. Battery packs generate heat during charging and discharging, especially under high load conditions. These devices and components can all serve as heat sources according to embodiments of the present invention. These devices and components have different power and heat dissipation requirements, but all require effective heat dissipation to maintain their normal operating temperature range. At least one other auxiliary device is, for example, a device that generates relatively little heat.

[0042] like Figure 1 and Figure 2 As shown, various heat-generating electronic devices are housed within the housing 201. Heat is conducted between the various components and devices inside a spacecraft (e.g., a satellite) via thermally conductive materials (such as thermal paste, thermal pads, etc.) (not shown). These thermally conductive materials have excellent thermal conductivity, allowing heat to be quickly transferred from the various heat-generating electronic devices to specific locations 203 on the surface 202 of the housing 201. These specific locations 203 correspond to areas where heat accumulates, such as... Figure 3 The dashed box indicates this.

[0043] like Figures 1 to 3 As shown, the heat dissipation device 100 disposed outside the housing 201 includes a fixing member 10, a deformable heat-conducting member 20, and a heat dissipation fin member 30. Figure 1 and Figure 2 As shown, the fixing member 10 is fixed to the shell surface 202 of the shell 201, preferably at a position 203 on the shell surface 202 corresponding to the heat accumulation part (e.g., Figure 3 (As shown in the dashed box), this allows for a more precise installation of the fixing member 10, and at that location, higher heat dissipation efficiency can be achieved. It should be understood that the fixing member 10 is made of a thermally conductive material, and the housing 201 is also made of a thermally conductive material; for example, both the fixing member 10 and the housing 201 can be made of materials with good thermal conductivity, such as aluminum alloys or titanium alloys. Although... Figures 1 to 3 The housing 201 and the fixing member 10 shown are two separate parts, but it should be understood that the fixing member 10 can also be part of the housing 201.

[0044] like Figure 3 As shown in the exploded view, the deformable heat-conducting member 20 includes a first end 21, a second end 23, and an intermediate portion 22 between the first end 21 and the second end 23. Figure 1 and Figure 2 As shown, the first end 21 of the deformable heat-conducting member 20 is fixed to the fixing member 10, and the second end 23 of the deformable heat-conducting member 20 is fixed to the heat dissipation fin member 30. For illustrative purposes only, the deformable heat-conducting member 20 is divided into the first end 21, the second end 23, and the intermediate portion 22, and it should be understood that each segment of the deformable heat-conducting member 20 may include the same construction.

[0045] Compare Figure 1 and Figure 2 It can be seen that the deformable heat-conducting component 20 can change with its temperature in the first state ( Figure 1 (as shown) and the second state ( Figure 2The deformable heat-conducting component 20 can be switched between (as shown), meaning it can deform with temperature changes. Specifically, since the middle part 22 is not fastened, it can deform. For example, as shown... Figure 1 The first state shown corresponds to a low-temperature state, and the deformable heat-conducting member 20 is in its initial form under this low-temperature state. In this initial form, the heat dissipation fin member 30, fixed to the second end 23, is held close to the housing surface 202. For example, as... Figure 2 The second state shown corresponds to the high temperature state, in which the deformable heat-conducting member 20 has been heated to the deformation temperature and thus deformed, especially the middle part 22 of the deformable heat-conducting member 20, which causes the heat dissipation fin member 30 to move away from the shell surface 202.

[0046] In a heat dissipation device according to some embodiments of the present invention, the heat-conducting member is deformable (specifically, at least a portion of it is deformable). Therefore, the position of the heat dissipation fin member connected to the deformable heat-conducting member relative to the shell surface differs between the deformed and undeformed states of the deformable heat-conducting member. Specifically, in the deformed state, the heat dissipation fin member is away from the shell surface of the heat source. Since the heat dissipation fin member no longer faces the shell surface of the heat source, the effective heat dissipation area of ​​the heat dissipation fin member (e.g., the area not facing the shell surface) can be increased, thereby improving heat dissipation efficiency. Because the heat dissipation fin member can be away from the surface of the heat source, even if the surface area of ​​the heat dissipation fin member is small, a larger effective heat dissipation area can be obtained compared to the case where the heat dissipation fins face the surface of the heat source. Therefore, compared to conventional heat dissipation devices, this heat dissipation device can have a relatively small surface area and volume while ensuring efficient heat dissipation, and does not require a multi-layered nested heat dissipation structure, making it highly advantageous for spacecraft with limited space.

[0047] Furthermore, in some embodiments of the heat dissipation device according to the present invention, it is not necessary to pre-embed heat transfer pipes in the housing of the heat source; instead, the heat transfer pipes (e.g., deformable heat-conducting members) are provided outside the surface of the housing. This makes it easier to design the layout and routing of the heat transfer pipes during the design phase. Moreover, during manufacturing, the deformable heat-conducting members located outside the housing surface can more easily and precisely mate with other components. During maintenance, the pipes are exposed outside the housing of the heat source, thus facilitating inspection and maintenance, thereby reducing maintenance costs.

[0048] Furthermore, in the heat dissipation device according to some embodiments of the present invention, the deformed second state of the deformable heat-conducting component can be designed or adjusted according to actual needs. That is, for different spacecraft, different second states can be designed for the deformable heat-conducting component, so the heat dissipation device can be applied to different spacecraft. In this way, the deformable state, second state, or target shape can be designed and adjusted according to actual needs (such as the layout and relative positions of various components and equipment within the spacecraft, as well as the orbital type and attitude of the spacecraft, etc.), so that the designed second state is suitable for a specific spacecraft. Therefore, the application scenarios of the heat dissipation device are more extensive.

[0049] For example, in some embodiments, such as Figure 1 and Figure 2 As shown, at least one accessory device 300 is provided near the heat source 200. When designing the second state or target form of the deformable heat-conducting component, it is necessary to consider the relative positions of the heat dissipation fin component 30 and the deformable heat-conducting component 20 with respect to the heat source 200 and the accessory device 300, so that the deformable heat-conducting component 20 in deformation and the heat dissipation fin component 30 attached thereto will not interfere with the heat source 200 and other accessory devices 300.

[0050] Therefore, while ensuring heat dissipation efficiency, to avoid interference between the heat dissipation device and other equipment, the positional relationship between the deformable heat-conducting component and the heat dissipation fin component and other equipment and devices during the deformation process is considered when designing the shape, size, and target form of the heat dissipation device, thus avoiding interference. Therefore, the heat dissipation device according to the present invention can be designed with specific shape transformations for the deformable heat-conducting component based on the layout of various components in a spacecraft, making it suitable for a specific spacecraft. Furthermore, when designing the shape transformation of the deformable heat-conducting component, the orbital type and attitude changes of each spacecraft can also be considered. In this way, the heat dissipation device no longer has a fixed design in terms of shape and structure, but can be adjusted according to actual needs, thereby expanding the application of the heat dissipation device in the field of spacecraft.

[0051] In some embodiments, the deformable thermally conductive component 20 is made of shape memory alloy. Shape memory alloy is a special metallic material capable of undergoing plastic deformation within a certain temperature range and recovering its original macroscopic shape within another temperature range. After the alloy is processed into a certain shape at a high temperature, cooled to a low temperature and its shape artificially altered, and then heated to a high temperature, it will automatically recover its original shape. The principle of shape memory alloy lies in the reversible transformation of the crystal structure within the alloy with temperature changes. At high temperatures, the alloy's crystal structure has high structural symmetry, exhibiting an ordered cubic structure; while at low temperatures, this symmetry decreases, forming martensitic variants with different orientations. When the temperature rises again, the martensitic variants undergo a reverse transformation, recovering to the original high-temperature phase structure, thereby driving the recovery of the alloy's macroscopic shape.

[0052] Although the deformable thermally conductive component in the above embodiments is made of shape memory alloy, those skilled in the art will understand that an actuator can be used to deform the thermally conductive component according to temperature changes, thereby causing the heat sink fin component to move away from the housing surface of the heat source at high temperatures. Therefore, deformable thermally conductive components that can deform at different temperature conditions and cause the position of the heat sink fin component relative to the heat source to change fall within the scope of this invention.

[0053] In some embodiments, the deformable heat-conducting member 20 is in the form of a hollow deformable heat pipe, in which the heat transfer medium can be contained. In these embodiments, the first end 21 can serve as the evaporation section of the heat pipe, the second end 23 can serve as the condensation section of the heat pipe, and capillary structures (not shown) can be provided on the inner surface of the deformable heat pipe. Heat inside the heat source housing is concentrated at the first end 21 (e.g., the evaporation section of the heat pipe) by the fixing member 10. The heat transfer medium inside the deformable heat pipe is heated to its phase transition point after being heated (e.g., at the first end 21, by the concentrated heat). After evaporating into a gaseous state, the heat transfer medium travels from the first end 21 (e.g., the evaporation section of the heat pipe) through the intermediate portion 22 to the second end 23 (e.g., the condensation section of the heat pipe). Subsequently, the heat is diffused through the heat dissipation fin member 30 (e.g., through the heat dissipation plate or heat dissipation fin 31 of the heat dissipation fin member 30), and the heat is ultimately radiated into the deep cold space of space. While heat diffuses to the heat dissipation fins, at the second end 23, the gaseous heat transfer medium is condensed into a liquid state and flows back to the heat pipe evaporation section through the capillary driving force of the capillary structure on the inner surface of the deformable heat pipe, thus starting a new heat cycle.

[0054] During this process, the middle section 22 of the deformable shape memory alloy heat pipe absorbs some of the heat flowing through the working fluid and heats up to its deformation temperature. Afterward, the middle section 22 is deformed into a high-temperature state (design state), and the heat transfer effect of the entire heat dissipation device reaches its maximum design value. Figure 2 As shown in the medium-high temperature state. After the heat source 200 is powered off or de-energized, the various electronic components inside the heat source no longer generate heat, the heat dissipation device 100 gradually cools down, the temperature of the middle part 22 of the shape memory alloy drops below the deformation point, and the shape of the shape memory alloy heat pipe returns to its low-temperature state, as shown. Figure 1 As shown.

[0055] Therefore, in the heat dissipation device according to some embodiments of the present invention, a pipe-type shape memory alloy is used as the main material of the heat pipe. This alloy is in a low-temperature state (unfolded state) below the deformation temperature and transforms into a high-temperature state (folded, designed, or target shape) above or equal to the deformation temperature. When the operating temperature of the deformable heat pipe reaches the deformation temperature, the heat dissipation device automatically changes from the low-temperature state to the high-temperature state. When the operating temperature of the deformable heat pipe is lower than the deformation temperature, the deformable heat pipe automatically returns from the high-temperature state to the low-temperature state. Because a shape memory alloy is used, only the designed or target shape of the shape memory alloy needs to be designed, without the need for other complex mechanisms to deform the heat-conducting components. Therefore, an adaptive heat dissipation shape change mechanism can be achieved according to the disclosed heat dissipation device.

[0056] Furthermore, since deformable thermally conductive components allow the heat sink fins to be moved away from the heat source, this design not only increases the heat dissipation area of ​​the heat sink (e.g., effective heat dissipation area), but also, because the target shape of the shape memory alloy can be designed or adjusted, the shape of the heat sink can be automatically adjusted according to changes in heat dissipation requirements, satisfying different heat dissipation needs while maintaining small temperature fluctuations in the components.

[0057] Although Figure 1 and Figure 2 Only one deformable heat pipe is shown in the illustration, but those skilled in the art will understand that multiple deformable heat pipes can be used, each connected to a heat dissipation fin component to increase the heat dissipation area. A second state (i.e., target shape) can be designed for each deformable heat-conducting component so that they do not interfere with each other when deformed.

[0058] like Figure 3As shown, the fixing member 10 includes a fixing plate 11 and a first protrusion 12 protruding from the fixing plate in a direction toward the housing surface 202 away from the housing 201. The fixing member 10 is fixed to the housing surface 202 via the fixing plate 11. Thermally conductive grease or the like can be filled between the fixing plate 11 and the housing surface 202 to improve thermal conductivity, or the fixing plate 11 can be welded to the housing surface 202. In some embodiments, the fixing plate 11 can be part of the housing surface 202. A first hollow channel 121 (also referred to as a heat pipe evaporation section contact hole) is provided in the first protrusion 12. The first end 21 of the deformable thermally conductive member 20 is fixed in the first hollow channel 121 in a thermally conductive manner. For example, thermally conductive grease is used to fill the space between the first end 21 and the first hollow channel 121, or welding can be used to further improve thermal conductivity. Due to the use of thermally conductive grease or welding, heat from the fixing member 10 can be conducted to the first end 21 and then transferred to the heat transfer medium.

[0059] like Figure 3 As shown, the heat sink fin member 30 includes heat sink fins 31 and a second protrusion 32 protruding from the heat sink fins in a direction toward the housing surface 202 away from the housing. A second hollow channel 321 (also referred to as a heat pipe condenser section contact hole) is provided in the second protrusion 32. The second end 23 of the deformable thermally conductive member 20 is fixed in the second hollow channel 321 in a thermally conductive manner. For example, thermally conductive silicone grease can be used to fill the space between the second end 23 and the second hollow channel 321, or welding can be used to further improve the thermal conductivity. Due to the use of thermally conductive silicone grease or welding, heat from the second end 23 can be conducted to the second protrusion 32 of the heat sink fin member 30, and then transferred to the heat sink fins 31, and then the heat is transferred into space by radiation.

[0060] In some embodiments, the outer surface of the heat dissipation fin member 30 (e.g., the outer surface of the heat dissipation fin 31 and the outer surface of the second protrusion 32) is sprayed with a thermal control coating, such as white paint (KS-ZA), or an adhesive glass secondary surface mirror (OSR).

[0061] Thermal control coatings, especially white paint, are coatings with low absorptivity and high reflectivity. Their main function is to reflect solar radiation heat, reducing heat absorption by the fins and thus lowering fin temperature and temperature fluctuations inside the spacecraft. This coating not only improves heat dissipation efficiency but also protects the electronic equipment and structures inside the spacecraft from the effects of high-temperature environments. The coating maintains stable performance under extreme conditions and is not prone to aging or peeling. KS-ZA white paint can be applied by brushing, rolling, or spraying, requiring no special processes and greatly simplifying the application process.

[0062] Figure 4AA schematic diagram of a spacecraft according to some embodiments of the present invention is shown, wherein the heat dissipation device is in a first state. Figure 4B A schematic diagram of a portion of the structure of a spacecraft according to some embodiments of the present invention is shown, wherein the solar panel wing is removed to better show the heat dissipation device in a first state. Figure 5A A schematic diagram of a spacecraft according to some embodiments of the present invention is shown, wherein the heat dissipation device is in a second state. Figure 5B A schematic diagram of a portion of the structure of a spacecraft according to some embodiments of the present invention is shown, wherein the solar panel wing is removed to better show the heat dissipation device in a second state.

[0063] like Figure 4A and Figure 5A As shown, the spacecraft 1000 includes a spacecraft body 400 (e.g., a satellite body), a heat dissipation device 100 disposed outside the outer shell of the spacecraft body 400, and a heat source (e.g., a data transceiver terminal) 200 (e.g., a satellite body). Figure 1 (as shown), and a data transmission antenna 500 positioned near the heat source 200. Furthermore, as... Figure 4A and Figure 5A As shown, the spacecraft 1000 also includes multiple solar panel wings 600. (As...) Figure 1 At least one other accessory device 300 shown may include, for example Figure 4A and Figure 5A The aircraft body 400 and data transmission antenna 500 shown are located near the heat source 200 and the heat dissipation device 100.

[0064] For example, on a specific type of spacecraft, the external layout includes two data transmission antennas 500 positioned in the direction of flight, with a heat source (e.g., a data transmission terminal) 400 placed between the antennas. The detailed layout is as follows: Figure 4A and Figure 5A As shown.

[0065] exist Figure 4A and Figure 4B In the indicated state, the heat dissipation device 100 is in a first state (corresponding to a low-temperature state, i.e., the heat dissipation device is in a folded state). The deformable heat dissipation device 100 is mounted on the housing 201 of the heat source 200 (e.g., a data transmission terminal). When the data transmission terminal is under low load or not operating, the deformable heat dissipation device 100 is in a low-temperature state, and its deformable heat-conducting component 20 (e.g., a shape memory alloy portion) does not deform. At this time, due to the obstruction of the data transmission antenna and other loads, the effective radiation capability of the heat dissipation device is limited, as shown in the state. Figure 4A and Figure 4B As shown.

[0066] When the data transmission terminal is under medium to high load, heat is conducted from the inside of the terminal through the housing surface 202 to the heat dissipation fin component 30 of the heat dissipation device. In the initial stage of heat conduction, due to the obstruction of the data transmission antenna 500 and other loads, the effective area of ​​the data transmission terminal for external radiation is relatively small, thus the heat of the entire device will accumulate. Until the temperature reaches the operating temperature of the deformable heat-conducting component 20 (e.g., the shape memory alloy part) in the deformable heat dissipation device 100, the shape memory alloy heat pipe deforms, thereby reaching the second state (i.e., the high-temperature operating state), such as... Figure 5A and Figure 5B As shown. When operating at high temperatures, the deformable heat dissipation device 100 reaches its maximum design radiation capacity because the heat dissipation fin component 30 is no longer affected by the data transmission antenna 500 and other payload terminals (e.g., the aircraft body 400 and the heat source 200) when radiating outwards.

[0067] Figure 6 A schematic diagram of an equivalent model of the effective radiation capability of a deformable heat dissipation device according to some embodiments of the present invention is shown.

[0068] The deformable heat dissipation device 100 on the heat source 200 (e.g., a data transmission terminal), and its equivalent model of effective radiation capacity from a low temperature state to a high temperature state are as follows: Figure 6 As shown, the satellite body, the heat dissipation fins of the deformable heat dissipation device 100, and other payload terminals (e.g., the satellite body, data transmission antenna, and heat source) together form a "U-shaped" region. The surface of these three regions exposed to deep space (i.e., the portion exposed to outer space) is defined as the satellite body and labeled A1. The surface opposite the heat dissipation fins of the deformable heat dissipation device 100 and other equipment (e.g., data transmission antenna and heat source) is labeled A2, and the imaginary surface of the deep-space cold background is labeled A3. Since the longitudinal dimension of the device (the direction of solar panel fin extension) is much larger than the lateral dimension, only the influence of the lateral dimension needs to be considered. Figure 6 The dimensions of the load gap D1 and width D2 are shown.

[0069] To simplify the explanation and calculation, the following assumptions are made: (1) the emissivity of all surfaces is ε=1; (2) the temperatures (T1,T2) of surfaces A1 and A2 are the same, both being T; (3) the cosmic background temperature (T3) is zero K.

[0070] The radiation capacity of the entire system at low temperature is equivalent to the net emissivity of the hypothetical surface A3, that is, the rate at which radiation emitted from other surfaces is intercepted by surface A3. The net emissivity of the entire system is shown in formula (1), where q3 represents the net emissivity of surface A3, ε is the surface emissivity, F is the radiation angle coefficient, and σ is the Stefan-Boltzmann constant (5.678 x 10⁻⁶). -8 Wm -2 K -4The constant is given by substituting the conditions of formula (2) into formula (1). This yields the net emissivity of the hypothetical surface A3, as shown in formula (3). Since surfaces A1 and A2 have the same temperature (T), the model can also be considered as a system consisting of the combined surfaces A1 and A2 and surface A3. This derivation shows that, at low temperatures, the radiation capacity of the entire system's heat dissipation device before deformation (at low temperatures) is only equivalent to the size of the opening space exposed in deep space (related to D1), i.e. .

[0071] Under high temperature conditions, the heat dissipation model of the deformed heat dissipation device is equivalent to the heat dissipation surface directly facing the deep cold space of the universe. Therefore, the net radiation rate of the deformed heat dissipation device can be obtained by directly substituting it into formula (4). (Related to D2).

[0072] (1)

[0073] (2)

[0074] (3)

[0075] (4)

[0076] The results show that the radiation capacity of the deformed heat dissipation device... It is only related to its own design width D2, while the load gap D1 is usually much smaller than the width D2. Therefore, it can be seen that the radiation capacity of the deformable heat dissipation device changes significantly before and after deformation within a limited space.

[0077] Without prejudice to the fundamental principles, details and embodiments may vary, even significantly, relative to what has been described by way of example only, without departing from the scope of protection.

[0078] The various embodiments described above can be combined to provide other embodiments. If it is necessary to employ concepts from various patents, applications, and publications to provide further embodiments, aspects of the embodiments can be modified.

[0079] These and other changes can be made to the embodiments based on the detailed description above. Generally, the terminology used in the following claims should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full scope of equivalents to which such claims are given. Therefore, the claims are not limited by the disclosure.

Claims

1. A heat dissipation device for spacecraft, characterized in that, include: A fixed component is mounted on the shell surface of the heat source, and the spacecraft includes the heat source; A deformable heat-conducting member includes a first end, a second end, and an intermediate portion located between the first end and the second end, wherein the first end of the deformable heat-conducting member is fixed to the fixed member; as well as A heat dissipation fin assembly, wherein the second end of the deformable heat-conducting member is fixed to the heat dissipation fin assembly. The deformable thermally conductive member is configured to switch between a first state and a second state according to temperature changes. In the first state, the deformable thermally conductive member brings the heat dissipation fin member closer to the housing surface, and in the second state, the middle portion of the deformable thermally conductive member deforms to move the heat dissipation fin member away from the housing surface.

2. The heat dissipation device according to claim 1, characterized in that, The deformable thermally conductive component is made of shape memory alloy.

3. The heat dissipation device according to claim 1, characterized in that, The surface of the housing includes the area where heat accumulates when the heat source is energized, and The fixing member is fixed to the surface of the housing at the location corresponding to the heat accumulation area.

4. The heat dissipation device according to claim 1, characterized in that, The deformable heat-conducting component is in the form of a hollow deformable heat pipe, wherein the heat transfer medium is contained within the deformable heat pipe. The deformable heat pipe is configured as follows: At the first end, the heat transfer medium is heated by heat from the fixed member to change from a liquid state to a gaseous state so as to flow to the second end; At the intermediate portion, the gaseous heat transfer medium is used to heat the intermediate portion so that it deforms after reaching the deformation temperature. as well as At the second end, the gaseous heat transfer medium is cooled into a liquid state so that it flows back to the first end.

5. The heat dissipation device according to claim 1, characterized in that, The fixing member includes a fixing plate and a first protrusion protruding from the fixing plate in a direction away from the surface of the housing. The fixing member is fixed to the surface of the housing via the fixing plate; as well as A first hollow channel is provided in the first protrusion, and the first end of the deformable heat-conducting member is fixed in the first hollow channel in a heat-conducting manner.

6. The heat dissipation device according to claim 1, characterized in that, The heat dissipation fin component includes heat dissipation fins and a second protrusion protruding from the heat dissipation fins in a direction away from the housing surface. A second hollow channel is provided in the second protrusion, and the second end of the deformable heat-conducting member is fixed in the second hollow channel in a heat-conducting manner.

7. The heat dissipation device according to any one of claims 1 to 6, characterized in that, The outer surface of the heat dissipation fin component is coated with a thermal control coating.

8. The heat dissipation device according to any one of claims 1 to 6, characterized in that, The first state corresponds to the initial state of the deformable thermally conductive member when it is below the deformation temperature, and the second state corresponds to the target state of the deformable thermally conductive member when it is at or above the deformation temperature. The spacecraft further includes at least one additional device disposed near the heat source, wherein the target shape is associated with the position of the heat dissipation fin member and the deformable heat-conducting member relative to the heat source and the at least one additional device during the deformation of the deformable heat-conducting member.

9. A spacecraft, characterized in that, include: The heat dissipation device according to any one of claims 1 to 8; Heat source; and At least one additional device is disposed near the heat source and the heat dissipation device.

10. The spacecraft according to claim 9, characterized in that, The first state corresponds to the initial state of the deformable thermally conductive member when it is below the deformation temperature, and the second state corresponds to the target state of the deformable thermally conductive member when it is at or above the deformation temperature. The target shape is associated with the position of the heat sink fin member and the deformable heat-conducting member relative to the heat source and the at least one additional device during the deformation of the deformable heat-conducting member.

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