Abs compositions, methods for making the same, and articles

Abstract

The application discloses an ABS composition, a preparation method thereof and a part, and belongs to the technical field of polymer materials. The application adds dihydrocarbyl-substituted phosphinic acid salt, mono-hydrocarbyl-substituted phosphinic acid salt and specific brominated epoxy resin into ABS resin, and controls the respective dosages of the components in a specific range, so that the obtained composition has good flame retardance and low mold fouling, and is suitable for preparing an electrified peripheral part of a household appliance or an electronic and electrical product.

Description

Technical Field

[0001] This application relates to the field of polymer materials technology, specifically to ABS compositions and their preparation methods and components. Background Technology

[0002] Currently, flame-retardant ABS materials often suffer from insufficient thermal stability during the preparation and processing stages, leading to degradation reactions at high temperatures and subsequent gas release. These volatile substances easily condense and deposit on the mold surface, eventually forming stubborn mold deposits. Such mold deposits not only directly damage the surface smoothness of the product, causing obvious pits, pinholes, and other appearance defects, reducing product yield, but also require operators to frequently stop the machine to disassemble and clean the mold, severely disrupting production continuity and significantly reducing overall production efficiency.

[0003] CN103387735A discloses a modified flame-retardant ABS resin, wherein the flame retardant is selected from at least one of tetrabromobisphenol A, brominated triazine, and brominated epoxy resin, and the synergist is graphene. Although it can achieve the flame-retardant effect, the resulting composition is prone to mold fouling during processing.

[0004] CN110713684A discloses an ABS composite material, which improves flame retardant properties by adding bromine-based flame retardants and inorganic hypophosphite or inorganic phosphite, but this material also has the problem of easily generating mold fouling.

[0005] Therefore, developing an ABS composition that combines excellent flame retardancy with low mold fouling properties is of significant research value and practical application significance. Summary of the Invention

[0006] Based on the deficiencies of the existing technology, the purpose of this application is to provide an ABS composition, its preparation method and the resulting part, wherein the ABS composition has good flame retardancy and produces less mold residue during the preparation and processing.

[0007] To achieve the above objectives, in a first aspect, this application provides an ABS composition comprising the following components in parts by weight: 62.5 to 79.5 parts of ABS resin, 4 to 13 parts of dialkyl-substituted hypophosphite, 0.4 to 2.5 parts of monoalkyl-substituted hypophosphite, and 14 to 25 parts of brominated epoxy resin. The dialkyl-substituted phosphonate is at least one of the compounds of formula I, and the monoalkyl-substituted phosphonate is at least one of the compounds of formula II. , Among them, R 1 R 2 and R 3Each group is independently selected from the following groups: C1-C8 straight-chain alkyl, C3-C8 branched alkyl, C3-C8 cycloalkyl, C7-C8 aralkyl, and aryl groups. X and Y are each independently selected from Al, Mg, Ca, Zn, Ti, or Fe; n and m are each independently selected from integers between 2 and 4; The brominated epoxy resin is a phenol-terminated brominated epoxy resin, and the termination rate is above 50%.

[0008] The inventors discovered that adding specific amounts of dialkyl-substituted phosphonates, monoalkyl-substituted phosphonates, and specific brominated epoxy resins to ABS resin can synergistically improve flame retardancy and mold fouling resistance. The ABS composition, under the synergistic effect of the above-mentioned substances in specific amounts, possesses both good flame retardancy and low mold fouling, and can be used to manufacture electrical control boxes or components around current-carrying parts in household appliances, as well as electronic and electrical components such as chargers and inverters.

[0009] The end-capping rate of the brominated epoxy resin is above 50%, such as within the range of any two of 50%, 60%, 70%, 80%, 90%, 100%, or above. Preferably, the end-capping rate of the brominated epoxy resin is 50% to 80%, which helps to balance flame retardancy and mold fouling.

[0010] The end-capping ratio of the brominated epoxy resin was determined by the following method: The epoxy equivalent (EV) of the resin before and after the end-capping reaction was determined by the perchloric acid-tetraethylammonium bromide titration method (refer to standard GB / T 4612-2008), and denoted as EV. 封端前 EV 封端后 ; The end-capping ratio is calculated using the following formula: End-capping ratio of brominated epoxy resin = [(EV...] 封端前 - EV 封端后 / EV 封端前 ]× 100%.

[0011] Preferably, the weight-average molecular weight of the brominated epoxy resin is 0.1 million to 1.5 million, such as within the range of 0.1 million, 0.2 million, 0.3 million, 0.4 million, 0.5 million, 0.6 million, 0.7 million, 0.8 million, 0.9 million, 1 million, 1.1 million, 1.2 million, 1.3 million, 1.4 million, 1.5 million, or any two of the above. More preferably, the weight-average molecular weight of the brominated epoxy resin is 0.15 million to 0.5 million. The brominated epoxy resin is determined by gel permeation chromatography.

[0012] When the weight-average molecular weight of the brominated epoxy resin is 0.1 million to 1.5 million, especially 0.15 million to 0.55 million, it is more conducive to the balance between flame retardancy and mold fouling.

[0013] Preferably, the phenolic end-capping in the brominated epoxy resin includes at least one of tribromophenol end-capping, dibromophenol end-capping, monobromophenol end-capping, phenol end-capping, and cresol end-capping.

[0014] Preferably, the brominated epoxy unit in the brominated epoxy resin is a linear molecule obtained by copolymerizing tetrabromobisphenol A and epichlorohydrin.

[0015] The brominated epoxy resin can be commercially available or prepared using conventional methods in the art, including but not limited to the following methods. For example, a method for preparing a brominated epoxy resin includes the following steps: Tetrabromobisphenol A and epichlorohydrin are dissolved in a solvent, and an alkaline solution is added dropwise at 65-70℃. After the addition is complete, the temperature is raised to 85-90℃ and the reaction is maintained for 2-4 hours to obtain the prepolymer. Phenolic end-capping agent and catalyst are added to the above prepolymer, and the temperature is raised to 95-100℃ and the reaction is continued for 1-3 hours. After the reaction is completed, hot water is added for washing, the mixture is allowed to stand and separate into layers, the aqueous phase is removed, and the solvent is recovered by vacuum distillation to obtain brominated epoxy resin. The molar ratio of tetrabromobisphenol A to epichlorohydrin can be selected as 1:(1~2.5); the alkali in the alkaline solution can be selected from at least one of sodium hydroxide and potassium hydroxide; the alkali content in the alkaline solution can be selected as 30wt%~40wt%; the molar ratio of epichlorohydrin to alkali in the alkaline solution is 1:(1.02~1.05); the molar ratio of epoxy groups (i.e. "residual epoxy groups") in the prepolymer to phenolic end-capping agents is 1:(0.5~1.05); the catalyst is 0.1wt%~0.5wt% of the theoretical amount of resin produced; the catalyst can be selected from quaternary ammonium salts, such as tetrabutylammonium bromide; the phenolic end-capping agent can be selected from at least one of tribromophenol, dibromophenol, monobromophenol, phenol, and cresol; the solvent can be selected from at least one of methyl isobutyl ketone (MIBK), acetone, and butanone.

[0016] The ABS resin is present in an amount of 62.5 to 79.5 parts by weight, such as 62.5 parts by weight, 65 parts by weight, 70 parts by weight, 74 parts by weight, 76 parts by weight, 78 parts by weight, 79.5 parts by weight, or any combination thereof. Preferably, the ABS resin accounts for more than 55% of the weight of the ABS composition, such as 55%, 60%, 65%, 70%, 74%, 76%, 78%, or any combination thereof.

[0017] The dialkyl-substituted phosphonate is 4 to 13 parts by weight, such as 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight, 11 parts by weight, 12 parts by weight, 13 parts by weight, or any two of the above ranges.

[0018] The monoalkyl-substituted phosphonate is 0.4 to 2.5 parts by weight, such as 0.4 parts by weight, 0.6 parts by weight, 0.8 parts by weight, 1 part by weight, 1.2 parts by weight, 1.4 parts by weight, 1.6 parts by weight, 1.8 parts by weight, 2 parts by weight, 2.2 parts by weight, 2.4 parts by weight, 2.5 parts by weight, or any two of the above ranges.

[0019] The brominated epoxy resin is 14 to 25 parts by weight, such as 14 parts by weight, 15 parts by weight, 16 parts by weight, 17 parts by weight, 18 parts by weight, 19 parts by weight, 20 parts by weight, 22 parts by weight, 25 parts by weight, or any two of the above ranges.

[0020] In Equations I and II, R 1 R 2 and R 3 They can be completely different, or two or three of them can be the same; X and Y can be the same or different; n and m can be the same or different.

[0021] For example, the C1 to C8 straight-chain alkyl group is at least one of C1, C2, C3, C4, C5, C6, C7 or C8 straight-chain alkyl groups.

[0022] For example, the C3-C8 branched alkyl group is at least one of C3, C4, C5, C6, C7, or C8 branched alkyl groups. In some embodiments, the C3-C8 branched alkyl group is at least one of (CH3)2CH-, (CH3)2CHCH2-, (CH3)3C-, (CH3)2CHCH2CH2-, CH3CH2CH(CH3)CH2-, (CH3)3CCH2-, (CH3)2CHCH2CH2CH2-, CH3CH(CH3)CH2CH2CH2-, (CH3)2CHCH2CH2CH2CH2-, CH3CH2CH2CH2CH(CH3)CH2-, (CH3CH2)2CHCH2CH2-, (CH3)2CHCH2C(CH3)2CH2-, CH3CH2CH(CH2CH3)CH2CH2CH2-, or CH3CH2CH2CH2CH2CH(CH3)CH2-.

[0023] For example, the C3 to C8 cycloalkyl group is at least one of C3, C4, C5, C6, C7 or C8 cycloalkyl groups.

[0024] For example, the C7-C8 aralkyl group is at least one of C7 and C8 aralkyl groups. In the C7-C8 aralkyl group, the alkyl portion can be straight-chain or branched; the aromatic portion can be phenyl.

[0025] For example, aromatic groups include, but are not limited to, phenyl groups.

[0026] For example, n is selected from 2, 3 or 4.

[0027] For example, m is selected from 2, 3 or 4.

[0028] Preferably, R 1 and R 2 Each group is independently selected from the following groups: C1~C8 straight-chain alkyl, C3~C8 branched alkyl or C7~C8 aralkyl, which not only have excellent stability but are also easy to synthesize.

[0029] Preferably, the dialkyl-substituted phosphinate includes aluminum diethylphosphinate, aluminum di-n-propylphosphinate, aluminum diisopropylphosphinate, aluminum di-n-butylphosphinate, aluminum diisobutylphosphinate, aluminum di-n-pentylphosphinate, aluminum diisopentylphosphinate, aluminum di-n-hexylphosphinate, aluminum di-n-heptylphosphinate, aluminum di-n-octylphosphinate, aluminum diphenylethylphosphinate, zinc diethylphosphinate, zinc di-n-propylphosphinate, zinc diisopropylphosphinate, zinc diisopropylphosphinate, zinc diisobutylphosphinate, and aluminum diisopropylphosphinate. Zinc butylphosphinate, zinc di-n-pentylphosphinate, zinc di-isopentylphosphinate, zinc di-n-hexylphosphinate, zinc di-n-heptylphosphinate, zinc di-n-octylphosphinate, zinc diphenylethylphosphinate, magnesium diethylphosphinate, magnesium di-n-propylphosphinate, magnesium di-isopropylphosphinate, magnesium di-n-butylphosphinate, magnesium di-isobutylphosphinate, magnesium di-n-pentylphosphinate, magnesium di-isopentylphosphinate, magnesium di-n-hexylphosphinate, magnesium di-n-heptylphosphinate, magnesium di-n-octylphosphinate, zinc diphenylethylphosphinate Magnesium diphosphinate, titanium diethylphosphinate, titanium di-n-propylphosphinate, titanium diisopropylphosphinate, titanium di-n-butylphosphinate, titanium diisobutylphosphinate, titanium di-n-pentylphosphinate, titanium diisopentylphosphinate, titanium di-n-hexylphosphinate, titanium di-n-heptylphosphinate, titanium di-n-octylphosphinate, titanium diphenylethylphosphinate, calcium diethylphosphinate, calcium di-n-propylphosphinate, calcium diisopropylphosphinate, calcium di-n-butylphosphinate, calcium diisobutylphosphinate, calcium di-n-pentylphosphinate At least one of the following: calcium phosphonate, diisopentyl calcium phosphonate, di-n-hexyl calcium phosphonate, di-n-heptyl calcium phosphonate, di-n-octyl calcium phosphonate, diphenylethyl calcium phosphonate, diethylferric phosphonate, di-n-propylferric phosphonate, diisopropylferric phosphonate, di-n-butylferric phosphonate, diisobutylferric phosphonate, di-n-pentylferric phosphonate, diisopentylferric phosphonate, di-n-heptylferric phosphonate, di-n-octylferric phosphonate, and diphenylethylferric phosphonate.

[0030] Preferably, the monoalkyl-substituted phosphinate includes aluminum ethylphosphinate, aluminum n-propylphosphinate, aluminum isopropylphosphinate, aluminum n-butylphosphinate, aluminum isobutylphosphinate, aluminum n-pentylphosphinate, aluminum isopentylphosphinate, aluminum n-hexylphosphinate, aluminum n-heptylphosphinate, aluminum n-octylphosphinate, aluminum cyclohexylphosphinate, aluminum phenylphosphinate, aluminum benzylphosphinate, aluminum phenylethylphosphinate, zinc ethylphosphinate, zinc n-propylphosphinate, zinc isopropylphosphinate, zinc n-butylphosphinate, zinc isobutylphosphinate, and zinc n-pentylphosphinate. Zinc phosphonate, zinc isopentyl phosphonate, zinc n-hexyl phosphonate, zinc n-heptyl phosphonate, zinc n-octyl phosphonate, zinc cyclohexyl phosphonate, zinc phenyl phosphonate, zinc benzyl phosphonate, zinc phenethyl phosphonate, magnesium ethyl phosphonate, magnesium n-propyl phosphonate, magnesium isopropyl phosphonate, magnesium n-butyl phosphonate, magnesium isobutyl phosphonate, magnesium n-pentyl phosphonate, magnesium isopentyl phosphonate, magnesium n-hexyl phosphonate, magnesium n-heptyl phosphonate, magnesium n-octyl phosphonate, magnesium cyclohexyl phosphonate, magnesium phenyl phosphonate, magnesium benzyl phosphonate, magnesium phenyl phosphonate, magnesium phenethyl phosphonate, magnesium phenyl ... Magnesium phosphinate, Titanium ethyl phosphinate, Titanium n-propyl phosphinate, Titanium isopropyl phosphinate, Titanium n-butyl phosphinate, Titanium isobutyl phosphinate, Titanium n-pentyl phosphinate, Titanium isopentyl phosphinate, Titanium n-hexyl phosphinate, Titanium n-heptyl phosphinate, Titanium n-octyl phosphinate, Titanium cyclohexyl phosphinate, Titanium phenyl phosphinate, Titanium benzyl phosphinate, Titanium phenylethyl phosphinate, Calcium ethyl phosphinate, Calcium n-propyl phosphinate, Calcium isopropyl phosphinate, Calcium n-butyl phosphinate, Calcium isobutyl phosphinate, Calcium n-pentyl phosphinate, Calcium isopentyl phosphinate At least one of the following: calcium hexylphosphonate, calcium heptylphosphonate, calcium octylphosphonate, calcium cyclohexylphosphonate, calcium phenylphosphonate, calcium benzylphosphonate, calcium phenylethylphosphonate, iron ethylphosphonate, iron propylphosphonate, iron isopropylphosphonate, iron butylphosphonate, iron isobutylphosphonate, iron pentylphosphonate, iron isopentylphosphonate, iron hexylphosphonate, iron heptylphosphonate, iron octylphosphonate, iron cyclohexylphosphonate, iron phenylphosphonate, iron benzylphosphonate, and iron phenylethylphosphonate.

[0031] In some embodiments, the di(or mono)alkyl-substituted phosphonates can be commercially available or prepared using conventional methods in the art, including but not limited to the following methods. For example, a method for preparing di(or mono)alkyl-substituted phosphonates includes the following steps: Sodium di(or mono)alkyl-substituted hypophosphonates are mixed with water-soluble salts to undergo a metathesis reaction to obtain di(or mono)alkyl-substituted hypophosphonate products.

[0032] Among them, dialkyl-substituted sodium hypophosphite is at least one of the compounds of formula III. ; Among them, R 1 and R 2Each group is independently selected from the following groups: C1~C8 straight-chain alkyl, C3~C8 branched alkyl, C3~C8 cycloalkyl, C7~C8 aralkyl, and aromatic group.

[0033] In Formula III, R 1 and R 2 They can be the same, yet they can also be different.

[0034] In Equation III, when R 1 and / or R 2 When selected from C1-C8 straight-chain alkyl groups, the C1-C8 straight-chain alkyl groups can be at least one of C1, C2, C3, C4, C5, C6, C7 or C8 straight-chain alkyl groups.

[0035] In Equation III, when R 1 and / or R 2 When selected from C3-C8 branched alkyl groups, the C3-C8 branched alkyl groups can be at least one of C3, C4, C5, C6, C7 or C8 branched alkyl groups. In one embodiment, the C3-C8 branched alkyl group is at least one of (CH3)2CH-, (CH3)2CHCH2-, (CH3)3C-, (CH3)2CHCH2CH2-, CH3CH2CH(CH3)CH2-, (CH3)3CCH2-, (CH3)2CHCH2CH2CH2-, CH3CH(CH3)CH2CH2CH2-, (CH3)2CHCH2CH2CH2CH2-, CH3CH2CH2CH2CH(CH3)CH2-, (CH3CH2)2CHCH2CH2-, (CH3)2CHCH2C(CH3)2CH2-, CH3CH2CH(CH2CH3)CH2CH2CH2-, or CH3CH2CH2CH2CH2CH(CH3)CH2-.

[0036] In Equation III, when R 1 and / or R 2 When selected from C3-C8 cycloalkyl groups, the C3-C8 cycloalkyl group can be at least one of C3, C4, C5, C6, C7, or C8 cycloalkyl groups.

[0037] In Equation III, when R 1 and / or R 2 When selected from C7-C8 aralkyl groups, the C7-C8 aralkyl group can be at least one of C7 and C8 aralkyl groups. In a C7-C8 aralkyl group, the alkyl moiety can be straight-chain or branched; the aromatic moiety can be phenyl.

[0038] In Equation III, when R 1 and / or R 2 When selected from aromatic groups, the aromatic group can be phenyl.

[0039] In some embodiments, the dialkyl-substituted sodium hypophosphite used includes at least one of sodium diethylphosphite, sodium di-n-propylphosphite, sodium diisopropylphosphite, sodium di-n-butylphosphite, sodium diisobutylphosphite, sodium di-n-pentylphosphite, sodium di-n-hexylphosphite, sodium di-n-heptylphosphite, and sodium di-n-octylphosphite.

[0040] Sodium hypophosphite with a monoalkyl substituted group is at least one of the compounds of formula IV. ; R 3 Selected from the following groups: C1~C8 straight-chain alkyl, C3~C8 branched alkyl, C3~C8 cycloalkyl, C7~C8 aralkyl, aromatic group.

[0041] In Equation IV, when R 3 When selected from C1 to C8 straight-chain alkyl groups, the C1 to C8 straight-chain alkyl groups can be C1, C2, C3, C4, C5, C6, C7, or C8 straight-chain alkyl groups.

[0042] In Equation IV, when R 3 When selected from C3-C8 branched alkyl groups, the C3-C8 branched alkyl groups can be C3, C4, C5, C6, C7 or C8 branched alkyl groups. In one embodiment, the C3-C8 branched alkyl group is (CH3)2CH-, (CH3)2CHCH2-, (CH3)3C-, (CH3)2CHCH2CH2-, CH3CH2CH(CH3)CH2-, (CH3)3CCH2-, (CH3)2CHCH2CH2CH2-, CH3CH(CH3)CH2CH2CH2-, (CH3)2CHCH2CH2CH2CH2-, CH3CH2CH2CH2CH(CH3)CH2-, (CH3CH2)2CHCH2CH2-, (CH3)2CHCH2C(CH3)2CH2-, CH3CH2CH(CH2CH3)CH2CH2CH2-, or CH3CH2CH2CH2CH2CH(CH3)CH2-.

[0043] In Equation IV, when R 3 When selected from C3 to C8 cycloalkyl groups, the C3 to C8 cycloalkyl groups can be C3, C4, C5, C6, C7, or C8 cycloalkyl groups.

[0044] In Equation IV, when R 3 When selected from C7-C8 aralkyl groups, the C7-C8 aralkyl group can be at least one of C7 and C8 aralkyl groups. In a C7-C8 aralkyl group, the alkyl moiety can be straight-chain or branched; the aromatic moiety can be phenyl.

[0045] In Equation IV, when R 3 When selected from aromatic groups, the aromatic group can be phenyl.

[0046] In some embodiments, the monoalkyl-substituted sodium hypophosphite used includes at least one of sodium ethyl phosphite, sodium n-propyl phosphite, sodium isopropyl phosphite, sodium n-butyl phosphite, sodium isobutyl phosphite, and sodium phenyl phosphite.

[0047] The water-soluble salt is a water-soluble salt of at least one metal selected from Al, Mg, Ca, Zn, Ti, and Fe. In some embodiments, the water-soluble salt is at least one selected from water-soluble chloride, water-soluble nitrate, and water-soluble sulfate. For example, the water-soluble salt includes at least one selected from aluminum nitrate, aluminum sulfate, magnesium chloride, magnesium nitrate, magnesium sulfate, calcium chloride, calcium nitrate, zinc chloride, zinc nitrate, zinc sulfate, ferric chloride, ferric nitrate, and ferric sulfate.

[0048] In one embodiment, when sodium di(or mono)alkyl-substituted phosphonate undergoes a metathesis reaction with a water-soluble salt, the reaction temperature is controlled at 80-90°C.

[0049] In one embodiment, the molar ratio of di(or mono)alkyl-substituted sodium hypophosphite to the water-soluble salt is (0.5~8):1.

[0050] In one embodiment, before mixing the di(or mono)alkyl-substituted sodium hypophosphite with the water-soluble salt, the di(or mono)alkyl-substituted sodium hypophosphite is diluted with a solvent to a content of 20wt% to 40wt%, and the pH value is adjusted to between 2 and 3 with an acid. The solvent can be water, etc.; the acid used to adjust the pH value can be sulfuric acid, etc.

[0051] In one embodiment, when di(or mono)alkyl-substituted sodium hypophosphite is mixed with a water-soluble salt, the water-soluble salt is introduced in the form of a solution, wherein the content of the water-soluble salt in the solution is 20wt% to 25wt%.

[0052] In one embodiment, the metathesis reaction is carried out under an inert atmosphere. The inert atmosphere may be nitrogen or / or argon.

[0053] In one embodiment, the preparation method of the di(or mono)hydrocarbon substituted phosphonate further includes the following steps: after metathesis reaction, crystallization, solid-liquid separation, washing, and drying.

[0054] Di(or mono) alkyl-substituted phosphonates can also be prepared by other methods, such as the free radical addition method described in the literature (Zhang Mengting. Synthesis Research of Novel Phosphorus Flame Retardants [D]. Southeast University, 2022).

[0055] Preferably, the bromine content in the brominated epoxy resin is 50% to 85% by mass, such as 50%, 55%, 60%, 65%, 70%, 75%, 80%, or 85%.

[0056] The mass percentage of bromine in the brominated epoxy resin was determined by high-temperature alkali fusion-potential titration, as follows: Accurately weigh 0.30 g of brominated epoxy resin sample powder, add 1.0 g of solid Na₂CO₃ and 3.5 g of solid NaOH, heat until the alkali becomes molten, and continue heating until the brominated epoxy resin sample powder is fully absorbed by the alkali (i.e., the brominated epoxy resin sample powder completely disappears). Cool, add water to dissolve the sample, transfer to a 250 mL volumetric flask, dilute to volume, shake well, accurately pipette 5 mL of the sample solution into a titration cup, add 50 mL of water and 10 mL of nitric acid solution (68 wt%), stir to disperse, and titrate to the endpoint with silver nitrate standard titration solution. Calculate the mass percentage of bromine content based on the titration results.

[0057] In some embodiments, the bromine content in the ABS composition is 7% to 15% by mass, such as 7%, 8%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12%, 12.5%, 13%, 13.5%, 14%, 15%, which are ranges formed by any two of the above.

[0058] In some embodiments, the ABS composition further includes an anti-drip agent in an amount of 0 to 0.5 parts by weight. In one embodiment, the anti-drip agent is present in an amount of 0.1 to 0.5 parts by weight to improve anti-drip performance, which is beneficial for achieving thin-walled UL-94 V-0.

[0059] In some embodiments, the anti-dripping agent includes at least one of polytetrafluoroethylene (PTFE), styrene-acrylonitrile random copolymer coated PTFE, styrene-methyl methacrylate copolymer coated PTFE, and silicone resin coated PTFE.

[0060] In some embodiments, the ABS resin includes at least one of a mixture of ABS high-resin powder and SAN resin, and an acrylonitrile-butadiene-styrene terpolymer, wherein the mass ratio of the ABS high-resin powder to the SAN resin in the mixture is 2.2:7.8 to 3.5:6.5, such as 2.2:7.8, 3:7, 3.5:6.5 or any two of the above.

[0061] In some embodiments, the butadiene weight percentage in the ABS high-resin powder is 50% to 65%, such as a range formed by any two of 50%, 55%, 58%, 60%, 62%, 64%, 65%, or more.

[0062] In some embodiments, the melt index of the SAN resin at a temperature of 220°C and a load of 10 kg is 6 to 110 g / 10 min, such as 6 g / 10 min, 10 g / 10 min, 20 g / 10 min, 30 g / 10 min, 40 g / 10 min, 50 g / 10 min, 60 g / 10 min, 70 g / 10 min, 80 g / 10 min, 90 g / 10 min, 100 g / 10 min, 110 g / 10 min, or any two of the above ranges.

[0063] In some embodiments, the acrylonitrile content in the SAN resin is 18% to 32% by weight, such as within the range formed by any two of 18%, 20%, 22%, 24%, 26%, 28%, 30%, 32%, or more.

[0064] In some embodiments, the melt index of the acrylonitrile-butadiene-styrene terpolymer at a temperature of 220°C and a load of 10 kg is 6 to 90 g / 10 min, such as 6 g / 10 min, 10 g / 10 min, 20 g / 10 min, 30 g / 10 min, 40 g / 10 min, 50 g / 10 min, 60 g / 10 min, 70 g / 10 min, 80 g / 10 min, 90 g / 10 min, or any two of the above ranges.

[0065] In some embodiments, the acrylonitrile-butadiene-styrene terpolymer contains acrylonitrile at a weight percentage of 12% to 32%, butadiene at a weight percentage of 8% to 30%, and styrene at a weight percentage of 38% to 80%. Exemplarily, the acrylonitrile-butadiene-styrene terpolymer contains acrylonitrile at a weight percentage within the range of any two of the following: 12%, 15%, 18%, 20%, 22%, 25%, 28%, 30%, 32%. Exemplarily, the acrylonitrile-butadiene-styrene terpolymer contains butadiene at a weight percentage within the range of any two of the following: 8%, 10%, 12%, 15%, 18%, 20%, 22%, 25%, 28%, 30%. Exemplarily, the acrylonitrile-butadiene-styrene terpolymer contains styrene at a weight percentage within the range of any two of the following: 38%, 40%, 50%, 60%, 70%, 80%.

[0066] In some embodiments, the ABS resin has a core-shell structure and / or an island-like structure. The ABS resin can be produced by bulk polymerization or by emulsion polymerization, such as by blending butadiene-grafted SAN copolymer obtained by emulsion polymerization with SAN resin; it can also be commercially available.

[0067] The weight percentage of monomer units in acrylonitrile-butadiene-styrene terpolymer and ABS high-rubber powder was determined by elemental analysis combined with infrared spectroscopy.

[0068] The weight percentage of monomer units in SAN resin was determined by elemental analysis.

[0069] The melt flow index of the acrylonitrile-butadiene-styrene terpolymer and SAN resin was measured according to GB / T 3682-2000.

[0070] Other additives may be added to the ABS composition as needed to improve properties such as thermal stability, processability, weather resistance, and / or color. In some embodiments, the other additives include at least one of antioxidants, weather-resistant agents, colorants, and antistatic agents.

[0071] The antioxidant can be selected with reference to existing technologies, such as at least one of hindered phenolic antioxidants, phosphite antioxidants, divalent sulfur antioxidants, hindered amine antioxidants, benzofuranone antioxidants, etc.

[0072] Specifically, the hindered phenolic antioxidants include, but are not limited to, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (antioxidant 1010), octadecyl β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate (antioxidant 1076), N,N'-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)hexamethylenediamine (antioxidant 1098), 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene (antioxidant 1330), 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)isocyanuric acid (antioxidant 3114), 1,2-bis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hydrazine (antioxidant 1024), and triethylene glycol. Ether-di(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate (antioxidant 245), 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione (antioxidant 1790), 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane (antioxidant CA), 2-tert-butyl-6-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-4-methylphenyl acrylate, 2-(2-hydroxy-3-tert-butyl-5-methylbenzyl)-4-methyl-6-tert-butylphenyl acrylate (antioxidant GM), 2,6-di-tert-butyl-4-methylphenol (antioxidant 264), styrene-modified phenol (anti-aging agent SP), 2, At least one of 2'-methylenebis(4-methyl-6-tert-butylphenol) (antioxidant 2246); The phosphite antioxidants include, but are not limited to, at least one of the following: tris[2,4-di-tert-butylphenyl]phosphite (antioxidant 168), 3,9-bis(2,4-dicumylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane (antioxidant 9228), tris(nonylphenyl)phosphite (antioxidant TNP), bis(4-octylphenol) diphosphate (antioxidant 1093); The divalent sulfur antioxidants include, but are not limited to, at least one of dilaurate thiodipropionate (DLTP), distearate thiodipropionate (DSTP), and pentaerythritol tetra(3-lauryl thiopropionate) (antioxidant 412S); The hindered amine antioxidants include, but are not limited to, at least one of the following: bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate (LS-744), sebacate bis-2,2,6,6-tetramethylpiperidinol ester (LS-770), tris(1,2,2,6,6-pentamethylpiperidinol) phosphite (GW-540), and 4,4'-adipamide diaminobis(2,2,6,6-tetramethylpiperidin-1-oxy) (FlamstabNOR116); The benzofuranone antioxidants include, but are not limited to, at least one of 5,7-bis(1,1-dimethylethyl)-3-[2,3-dimethylphenyl]-2(3H)-benzofuranone (antioxidant 136) and 4-tert-butyl-2-(5-tert-butyl-2-oxo-3H-1-benzofuran-3-yl)phenyl 3,5-di-tert-butyl-4-hydroxybenzoate (antioxidant 501).

[0073] In some embodiments, the antioxidant includes hindered phenolic antioxidants and phosphite antioxidants, wherein the weight ratio of the hindered phenolic antioxidants to the phosphite antioxidants is (1~3):1.

[0074] The weathering agent can be selected with reference to existing technologies, such as at least one of benzophenone-based ultraviolet absorbers and benzotriazole-based ultraviolet absorbers.

[0075] The colorant can be selected with reference to existing technologies, and includes, but is not limited to, at least one of pigments and dyes. Examples of pigments include titanium dioxide, phthalocyanine, ultramarine, iron oxide, or carbon black, and one or more of all organic pigments. Examples of dyes include one or more of azo yellow, quinacridone, perylene red, dioxazine, indolinone, isoindolin, anthraquinone blue, and anthraquinone violet.

[0076] The antistatic agent can be selected with reference to existing technologies, such as at least one of alkyl sulfonates, quaternary ammonium salts, glyceryl monostearate (GMS), ethoxylated alkylamines, polyether block amides (PEBA), carbon nanotubes, graphene, etc.

[0077] In some embodiments, the other adjuvants are 0 to 5 parts by weight, such as 0.1 parts by weight, 0.3 parts by weight, 0.5 parts by weight, 0.7 parts by weight, 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, or any range formed by two or more of the above.

[0078] Secondly, this application provides a method for preparing an ABS composition, comprising the following steps: mixing and dispersing the component raw materials, melt extruding, granulating, and obtaining the ABS composition.

[0079] In one embodiment, melt extrusion and granulation are carried out in a twin-screw extruder when preparing the ABS composition.

[0080] In one embodiment, the melt extrusion meets the following requirements: the melt extrusion temperature is 180~240℃, the screw speed is 200~800rpm, the screw length-to-diameter ratio is 36:1~48:1, and the feeding speed is 30~800kg / h.

[0081] Thirdly, this application provides a part molded from the ABS composition. The molding method can be selected with reference to existing technologies, such as including but not limited to injection molding, extrusion molding, blow molding, rotational molding, and / or compression molding.

[0082] Compared with the prior art, the beneficial effects of this application are as follows: by adding dialkyl-substituted hypophosphite, monoalkyl-substituted hypophosphite and specific brominated epoxy resin to ABS resin, and controlling the amount of the above components within a specific range, the resulting composition has both good flame retardancy and low fouling, and is suitable for manufacturing electrically charged peripheral parts of household appliances or electronic and electrical products. Detailed Implementation

[0083] To better illustrate the purpose, technical solutions, and advantages of this application, the following description, in conjunction with specific embodiments and comparative examples, aims to provide a detailed understanding of the content of this application, rather than limiting it. All other embodiments obtained by those skilled in the art without inventive effort are within the protection scope of this application. Unless otherwise specified, the experimental reagents and instruments involved in the implementation of this application are commonly used reagents and instruments. In this application, the technical features described in an open-ended manner include both closed-ended technical solutions composed of the listed features and open-ended technical solutions that include the listed features.

[0084] The raw materials used in the following embodiments and comparative examples are shown below. Unless otherwise specified, all raw materials are commercially available. In addition, the same raw materials were used in each parallel experiment: Dialkyl-substituted phosphonates 1: Aluminum diethylphosphonate, prepared as follows: Sodium diethylphosphonate is diluted with water to a concentration of 35 wt%, the pH is adjusted to 2.5 with sulfuric acid, and aluminum sulfate solution (aluminum sulfate content is 25 wt%) is added to carry out the reaction. The reaction is carried out under a nitrogen atmosphere and the reaction temperature is controlled at 85℃. After the reaction is completed, crystallize, filter, wash, and dry to obtain aluminum diethylphosphonate.

[0085] Dialkyl-substituted phosphinate 2: di-n-octylphosphinate aluminum, was prepared according to the process described in Sections 3.2.2 to 3.2.3 of the literature (Zhang Mengting. Synthesis Study of Novel Phosphorus Flame Retardants [D]. Southeast University, 2022).

[0086] Dialkyl-substituted phosphonate 3: aluminum diisopropylphosphonate, whose preparation method differs from that of dialkyl-substituted phosphonate 1 in that sodium diisopropylphosphonate is used instead of sodium diethylphosphonate.

[0087] Dihydro-substituted phosphonate 4: Zinc diethylphosphonate, the preparation method of which differs from that of dihydro-substituted phosphonate 1, is that zinc chloride solution (zinc chloride content of 22wt%) is used to completely replace aluminum sulfate solution.

[0088] Monoalkyl-substituted phosphonate 1: Aluminum ethylphosphonate, whose preparation method differs from that of dialkyl-substituted phosphonate 1 in that sodium ethylphosphonate is used instead of sodium diethylphosphonate.

[0089] Monoalkyl-substituted phosphonate 2: aluminum n-butylphosphonate, whose preparation method differs from that of monoalkyl-substituted phosphonate 1 in that sodium n-butylphosphonate is used instead of sodium ethylphosphonate.

[0090] Monoalkyl-substituted phosphinate 3: Aluminum phenylphosphinate, Hubei Chuyuebang New Material Technology Co., Ltd.

[0091] Monoalkyl-substituted phosphonate 4: Zinc ethylphosphonate, the preparation method of which differs from that of monoalkyl-substituted phosphonate 1, is that zinc chloride solution (zinc chloride content of 22wt%) is used to completely replace aluminum sulfate solution.

[0092] Al(H2PO2)3: Fujian Xin'an Technology Co., Ltd., FR605.

[0093] Melamine polyphosphate (MPP): Jinan Jinyingtai Chemical Co., Ltd.

[0094] Brominated epoxy resin 1: Weight average molecular weight 0.25 million, end-capping rate 52%, preparation method as follows: In a reaction vessel equipped with a stirrer, condenser and thermometer, add 544g tetrabromobisphenol A (1 mol) and 130g epichlorohydrin (approximately 1.4 mol), and add 400g methyl isobutyl ketone (MIBK) as solvent. Stir and heat to 60℃ to dissolve the materials evenly. Control the temperature at 67℃, and add 40wt% NaOH aqueous solution (containing approximately 1.4 mol NaOH) dropwise. After the addition is complete, heat to 90℃ and maintain the reaction for 3 hours to obtain the prepolymer. Add 0.52 molar equivalents of tribromophenol (relative to the remaining epoxy groups) and the catalyst tetrabutylammonium bromide (TBAB, amount is 0.1wt% of the theoretical resin yield) to the prepolymer, heat to 98℃ and continue the reaction for 2 hours. Add hot water to wash away the byproduct NaCl, allow to stand and separate the layers, and separate the aqueous phase. The oil phase was subjected to vacuum distillation (160℃, -0.098MPa) to recover MIBK, yielding the brominated epoxy resin product. The epoxy equivalent of the prepolymer and the brominated epoxy resin product was determined using the aforementioned method, thus obtaining the EV. 封端前 and EV 封端后 The end-capping rate is then calculated using the aforementioned formula, and the same applies below. The weight-average molecular weight of the brominated epoxy resin can be adjusted by controlling the molar ratio of tetrabromobisphenol A and epichlorohydrin; the end-capping rate can be adjusted by controlling the amount of tribromophenol added as the end-capping agent. Based on the preparation method of brominated epoxy resin 1, brominated epoxy resins 2 to 8 can be obtained by adjusting the molar ratio of tetrabromobisphenol A and epichlorohydrin and / or the amount of tribromophenol added as the end-capping agent.

[0095] Brominated epoxy resin 2: weight average molecular weight 0.24 million, end-capping rate 61%.

[0096] Brominated epoxy resin 3: weight average molecular weight 0.27 million, end-capping rate 80%.

[0097] Brominated epoxy resin 4: weight average molecular weight 0.25 million, end-capping rate 100%.

[0098] Brominated epoxy resin 5: weight average molecular weight 0.10 million, end-capping rate 60%.

[0099] Brominated epoxy resin 6: weight average molecular weight 0.15 million, end-capping rate 62%.

[0100] Brominated epoxy resin 7: weight average molecular weight 0.52 million, end-capping rate 61%.

[0101] Brominated epoxy resin 8: weight average molecular weight 14,700, end-capping rate 58%.

[0102] Brominated epoxy resin 9: weight average molecular weight 0.25 million, uncapped. Its preparation method differs from that of brominated epoxy resin 1 in that the capping agent tribromophenol and the catalyst tetrabutylammonium bromide are not added for the capping reaction. Instead, the prepolymer is directly subjected to post-treatment such as hot water washing, static separation, and vacuum distillation.

[0103] Bromotriazine: FR-245, ICL-IP.

[0104] Anti-dripping agent 1: Styrene-acrylonitrile random copolymer coated with polytetrafluoroethylene, SN80-SA7, Guangzhou Entropy Energy Innovation Materials Co., Ltd.

[0105] Anti-dripping agent 2: Styrene-methyl methacrylate copolymer coated polytetrafluoroethylene, DB109, Shanghai Puxin Polymer Materials Co., Ltd.

[0106] ABS Resin 1: Emulsion method, HI-121H, Ningbo LG Yongxing Chemical Co., Ltd.

[0107] ABS Resin 2: Bulk method, ABS 8434, Shanghai Gaoqiao Petrochemical.

[0108] ABS / SAN: ABS high-adhesion powder (INEOS Styrolution MAG 50) and SAN resin (Kumho Chemical Co., Ltd. 310 NTR) were mixed and dispersed at a weight ratio of 3.5:6.5.

[0109] Additives: A mixture of hindered phenolic antioxidant pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and phosphite antioxidant tris[2,4-di-tert-butylphenyl]phosphite, with a weight ratio of hindered phenolic antioxidant to phosphite antioxidant of 2:1, commercially available.

[0110] Examples 1-12 and Comparative Examples 1-8 These examples and comparative examples all provide an ABS composition, the preparation method of which includes the following steps: According to the formulations of the ABS compositions in Tables 1 and 2, the raw materials of each component are mixed and dispersed, fed into a twin-screw extruder for melt extrusion and granulation to obtain the ABS composition. The twin-screw temperatures in the twin-screw extruder are 60℃, 120℃, 180℃, 200℃, 200℃, 200℃, 200℃, 200℃, 220℃, the screw speed is 350 rpm, the screw length-to-diameter ratio is 40:1, and the feeding speed is 35 kg / h.

[0111] Table 1 Table 2 The ABS compositions of the above embodiments and comparative examples were subjected to the following performance tests: (1) Flame retardant performance: The ABS composition was injection molded into a standard sample with a thickness of 3.0 mm. The vertical burning flame retardant performance of the sample was tested according to the UL94-2023 standard, and the average value of t1+t2 was determined. (2) Mold Fouling: A KraussMaffei injection molding machine was used to inject a square plate, with an venting groove at the end of the plate. During injection, a small metal sheet was placed in the venting groove. After 250 injections, the decomposition gases cooled through the venting groove and gradually deposited on the metal sheet. Injection process: material temperature 240℃, injection speed medium to high speed, continuous injection of 300 molds, and comparison of the proportion of mold fouling coverage area on the metal sheet. The method for determining the proportion of mold fouling coverage area is as follows: the metal sheet was photographed, the photograph was converted to grayscale and segmented into binary values, and then the area proportion of the color region corresponding to the mold fouling was calculated using ImageJ software to obtain the result of the proportion of mold fouling coverage area.

[0112] The test results are shown in Table 3, where “NG” indicates that the V-2 level was not achieved.

[0113] Table 3 As can be seen from the above data, the ABS compositions in the above embodiments have good flame retardancy and produce less mold fouling during processing. For example, the flame retardancy (thickness 3.0mm) reaches V-0 level, and the mold fouling accounts for less than 15%.

[0114] Comparative Examples 1 and 2, which do not contain brominated epoxy resin or hydrocarbon-substituted phosphonates, resulted in a significant deterioration in the flame retardancy of the compositions, indicating that hydrocarbon-substituted phosphonates and brominated epoxy resins synergistically improve the flame retardancy of the compositions.

[0115] Comparative Examples 3 and 4, which did not contain dialkyl-substituted or monoalkyl-substituted phosphonates, resulted in a significant deterioration in the flame retardancy of the compositions, indicating that dialkyl-substituted and monoalkyl-substituted phosphonates synergistically improve flame retardancy.

[0116] In Comparative Examples 5 and 6, other flame retardants were used to replace the monoalkyl groups that replaced the phosphonates, resulting in more mold fouling in the compositions.

[0117] Comparative Example 7 used uncapped brominated epoxy resin, which had poor stability and resulted in a large amount of mold fouling; Comparative Example 8 used brominated triazine instead of brominated epoxy resin, which had poor stability and resulted in a large amount of mold fouling.

[0118] A comparison of Examples 1-4 shows that when the end-capping rate of brominated epoxy resin is 50%-80%, it is more conducive to the balance between flame retardancy and mold fouling.

[0119] As can be seen from the comparison of Examples 2, 5-8, when the weight-average molecular weight of the brominated epoxy resin is 0.15w-0.55w, it is more conducive to the balance between flame retardancy and mold fouling.

[0120] Examples 13-16 These examples all provide an ABS composition, and their preparation methods differ from those in Example 1 in that the formulations are different, as detailed in Table 4.

[0121] Table 4 Flame retardancy and injection molding fouling tests were conducted on Examples 13-16. The test method here differed from the previous test methods in that the composition was injection molded into a standard sample with a thickness of 1.5 mm for the flame retardancy test. The test results are shown in Table 5.

[0122] Table 5 As shown in Table 5, by adding an appropriate amount of anti-dripping agent, UL-94 V-0 / 1.5mm can be achieved, and less mold fouling is generated during the processing, with a mold fouling ratio of less than 15%, which is suitable for preparing thinner-walled products.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit the scope of protection of this application. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the substance and scope of the technical solutions of this application.

Claims

1. An ABS composition, characterized in that, It includes the following components in parts by weight: 62.5 to 79.5 parts of ABS resin, 4 to 13 parts of dialkyl-substituted hypophosphite, 0.4 to 2.5 parts of monoalkyl-substituted hypophosphite, and 14 to 25 parts of brominated epoxy resin; The dialkyl-substituted phosphonate is at least one of the compounds of formula I, and the monoalkyl-substituted phosphonate is at least one of the compounds of formula II. ， Among them, R 1 R 2 and R 3 Each group is independently selected from the following groups: C1-C8 straight-chain alkyl, C3-C8 branched alkyl, C3-C8 cycloalkyl, C7-C8 aralkyl, and aryl. X and Y are each independently selected from Al, Mg, Ca, Zn, Ti, or Fe; n and m are each independently selected from integers between 2 and 4; The brominated epoxy resin is a phenol-terminated brominated epoxy resin, and the termination rate is above 50%.

2. The ABS composition according to claim 1, characterized in that, The end-capping rate of the brominated epoxy resin is 50%~80%.

3. The ABS composition according to claim 1, characterized in that, The brominated epoxy resin also meets at least one of the following conditions: (1) The weight-average molecular weight of brominated epoxy resin is 0.1 million to 1.5 million; (2) The phenolic end capping of brominated epoxy resin includes at least one of tribromophenol end capping, dibromophenol end capping, monobromophenol end capping, phenol end capping, and cresol end capping.

4. The ABS composition according to claim 1, characterized in that, The dialkyl-substituted phosphines include aluminum diethylphosphines, aluminum di-n-propylphosphines, aluminum diisopropylphosphines, aluminum di-n-butylphosphines, aluminum diisobutylphosphines, aluminum di-n-pentylphosphines, aluminum diisopentylphosphines, aluminum di-n-hexylphosphines, aluminum di-n-heptylphosphines, aluminum di-n-octylphosphines, aluminum diphenylethylphosphines, zinc diethylphosphines, zinc di-n-propylphosphines, zinc diisopropylphosphines, zinc di-n-butylphosphines, and zinc diisobutylphosphines. Zinc phosphonate, di-n-pentyl zinc phosphonate, di-isopentyl zinc phosphonate, di-n-hexyl zinc phosphonate, di-n-heptyl zinc phosphonate, di-n-octyl zinc phosphonate, diphenylethyl zinc phosphonate, diethyl magnesium phosphonate, di-n-propyl magnesium phosphonate, di-isopropyl magnesium phosphonate, di-n-butyl magnesium phosphonate, di-isobutyl magnesium phosphonate, di-n-pentyl magnesium phosphonate, di-isopentyl magnesium phosphonate, di-n-hexyl magnesium phosphonate, di-n-heptyl magnesium phosphonate, di-n-octyl magnesium phosphonate, diphenylethyl zinc phosphonate Magnesium phosphonate, diethylphosphonate titanium, di-n-propylphosphonate titanium, diisopropylphosphonate titanium, di-n-butylphosphonate titanium, diisobutylphosphonate titanium, di-n-pentylphosphonate titanium, diisopentylphosphonate titanium, di-n-hexylphosphonate titanium, di-n-heptylphosphonate titanium, di-n-octylphosphonate titanium, diphenylethylphosphonate titanium, calcium diethylphosphonate, calcium di-n-propylphosphonate, calcium diisopropylphosphonate, calcium di-n-butylphosphonate, calcium diisobutylphosphonate, di-n-pentylphosphonate At least one of the following: calcium phosphite, diisopentyl calcium phosphite, di-n-hexyl calcium phosphite, di-n-heptyl calcium phosphite, di-n-octyl calcium phosphite, diphenylethyl calcium phosphite, diethylferric phosphite, di-n-propylferric phosphite, diisopropylferric phosphite, di-n-butylferric phosphite, diisobutylferric phosphite, di-n-pentylferric phosphite, diisopentylferric phosphite, di-n-hexylferric phosphite, di-n-heptylferric phosphite, and diphenylethylferric phosphite; And / or, the monoalkyl-substituted phosphinates include aluminum ethylphosphinate, aluminum n-propylphosphinate, aluminum isopropylphosphinate, aluminum n-butylphosphinate, aluminum isobutylphosphinate, aluminum n-pentylphosphinate, aluminum isopentylphosphinate, aluminum n-hexylphosphinate, aluminum n-heptylphosphinate, aluminum n-octylphosphinate, aluminum cyclohexylphosphinate, aluminum phenylphosphinate, aluminum benzylphosphinate, aluminum phenylethylphosphinate, zinc ethylphosphinate, zinc n-propylphosphinate, zinc isopropylphosphinate, zinc n-butylphosphinate, zinc isobutylphosphinate, zinc n-pentylphosphinate, and aluminum phenylphosphinate. Zinc phosphonate, zinc isopentyl phosphonate, zinc n-hexyl phosphonate, zinc n-heptyl phosphonate, zinc n-octyl phosphonate, zinc cyclohexyl phosphonate, zinc phenyl phosphonate, zinc benzyl phosphonate, zinc phenethyl phosphonate, magnesium ethyl phosphonate, magnesium n-propyl phosphonate, magnesium isopropyl phosphonate, magnesium n-butyl phosphonate, magnesium isobutyl phosphonate, magnesium n-pentyl phosphonate, magnesium isopentyl phosphonate, magnesium n-hexyl phosphonate, magnesium n-heptyl phosphonate, magnesium n-octyl phosphonate, magnesium cyclohexyl phosphonate, magnesium phenyl phosphonate, magnesium benzyl phosphonate, magnesium phenyl phosphonate, magnesium phenethyl phosphonate, magnesium phenyl ... Magnesium phosphinate, Titanium ethyl phosphinate, Titanium n-propyl phosphinate, Titanium isopropyl phosphinate, Titanium n-butyl phosphinate, Titanium isobutyl phosphinate, Titanium n-pentyl phosphinate, Titanium isopentyl phosphinate, Titanium n-hexyl phosphinate, Titanium n-heptyl phosphinate, Titanium n-octyl phosphinate, Titanium cyclohexyl phosphinate, Titanium phenyl phosphinate, Titanium benzyl phosphinate, Titanium phenylethyl phosphinate, Calcium ethyl phosphinate, Calcium n-propyl phosphinate, Calcium isopropyl phosphinate, Calcium n-butyl phosphinate, Calcium isobutyl phosphinate, Calcium n-pentyl phosphinate, Calcium isopentyl phosphinate At least one of the following: calcium hexylphosphonate, calcium heptylphosphonate, calcium octylphosphonate, calcium cyclohexylphosphonate, calcium phenylphosphonate, calcium benzylphosphonate, calcium phenylethylphosphonate, iron ethylphosphonate, iron propylphosphonate, iron isopropylphosphonate, iron butylphosphonate, iron isobutylphosphonate, iron pentylphosphonate, iron isopentylphosphonate, iron hexylphosphonate, iron heptylphosphonate, iron octylphosphonate, iron cyclohexylphosphonate, iron phenylphosphonate, iron benzylphosphonate, and iron phenylethylphosphonate.

5. The ABS composition according to claim 1, characterized in that, The bromine content in the ABS composition is 7% to 15% by mass.

6. The ABS composition according to claim 1, characterized in that, It also includes an anti-drip agent, wherein the amount of the anti-drip agent is 0.1 to 0.5 parts by weight.

7. The ABS composition according to claim 1, characterized in that, The ABS resin includes at least one of a mixture of ABS high-resin powder and SAN resin, and an acrylonitrile-butadiene-styrene terpolymer, wherein the mass ratio of ABS high-resin powder to SAN resin in the mixture of ABS high-resin powder and SAN resin is 2.2:7.8~3.5:6.

5.

8. The ABS composition according to claim 7, characterized in that, At least one of the following conditions must be met: (A) The butadiene content in the ABS high-resin powder is 50%~65% by weight; (B) The melt index of the SAN resin at a temperature of 220°C and a load of 10 kg is 6~110 g / 10 min; the weight percentage of acrylonitrile in the SAN resin is 18%~32%; (C) The melt index of the acrylonitrile-butadiene-styrene terpolymer at a temperature of 220°C and a load of 10 kg is 6~90 g / 10 min; in the acrylonitrile-butadiene-styrene terpolymer, the weight percentage of acrylonitrile is 12%~32%, the weight percentage of butadiene is 8%~30%, and the weight percentage of styrene is 38%~80%.

9. The method for preparing the ABS composition according to any one of claims 1 to 8, characterized in that, Includes the following steps: The raw materials are mixed and dispersed, melt-extruded, and granulated to obtain an ABS composition.

10. A component, characterized in that, It is formed from the ABS composition as described in any one of claims 1 to 8.

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