Optical module coupling method based on coupling gap detection and related device

Abstract

The application provides a material coupling method based on coupling gap detection and related equipment, and the method is applied to a material coupling equipment including a jig module, a coupling module, an upper laser ranging module, a lower laser ranging module and a dispensing module. The method calibrates the laser ranging of a calibration material and a calibration block to obtain upper and lower laser reference ranging values; the ranging of an OE plate material and a material to be coupled is performed to obtain actual ranging values; the coupling module position is compensated and adjusted according to the difference between the reference ranging values and the actual ranging values to eliminate the influence of the material thickness difference; multi-dimensional scanning is performed at the calibration position, and the optimal coupling position and the coupling gap are determined according to the optical coupling efficiency. The application can adapt to the thickness change of different batches of materials, effectively eliminate the influence of the material difference on the coupling precision, ensure the consistency of the coupling gap, significantly improve the optical coupling efficiency and the product yield, and simultaneously realize the accurate detection and quality tracing of the coupling gap.

Description

Technical Field

[0001] This invention relates to the field of data detection technology, and in particular to an optical module coupling method and related equipment based on coupling gap detection. Background Technology

[0002] Optical modules are core components in optical communication systems. Their manufacturing process requires precise coupling of optical elements such as fiber optic adapters (FA) and lenses with OE (Optical Equip) board materials. During coupling, a specific gap must be maintained between the optical elements and the OE board materials; this gap directly affects optical coupling efficiency and product performance.

[0003] In existing optical module coupling processes, coupling control is typically achieved by pre-setting a fixed gap value. However, due to thickness variations in optical components and OE board materials from different batches, the pre-set fixed gap value cannot adapt to actual material thickness changes, causing the actual coupling gap to deviate from the ideal value, thereby affecting optical coupling efficiency and product yield. Summary of the Invention

[0004] The main objective of this invention is to solve the technical problem that the coupling gap deviates from the ideal value due to differences in material thickness in the existing optical module coupling process.

[0005] This invention provides an optical module coupling method based on coupling gap detection, applied to an optical module coupling device. The optical module coupling device includes a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. The optical module coupling method based on coupling gap detection includes: Laser ranging calibration is performed on the calibration material and calibration block to obtain the upper laser reference ranging value and the lower laser reference ranging value; The upper laser ranging module measures the distance to the OE board material to obtain the actual distance value of the OE board material. The lower laser ranging module measures the distance to the material to be coupled to obtain the actual distance value of the material to be coupled. Position compensation adjustments are made based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material, and the actual distance measurement value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibrated positions. Multi-dimensional scanning is performed at the calibrated position, and the optimal coupling position is determined based on the optical coupling efficiency. The coupling of the material to be coupled to the OE board material is completed at the optimal coupling position.

[0006] This invention also provides an optical module coupling device based on coupling gap detection, applied to an optical module coupling equipment. The optical module coupling equipment includes a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. The optical module coupling device based on coupling gap detection includes: The calibration module is used to perform laser ranging calibration on calibration materials and calibration blocks to obtain upper laser reference ranging values ​​and lower laser reference ranging values. The ranging module is used to measure the distance of the OE board material through the upper laser ranging module to obtain the actual distance value of the OE board material, and to measure the distance of the material to be coupled through the lower laser ranging module to obtain the actual distance value of the material to be coupled. The compensation module is used to perform position compensation and adjustment based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material and the actual distance measurement value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibration positions. The coupling module is used to perform multi-dimensional scanning at the calibrated position, determine the optimal coupling position based on the optical coupling efficiency, and complete the coupling of the material to be coupled with the OE board material at the optimal coupling position.

[0007] The present invention also provides an optical module coupling device based on coupling gap detection, comprising: a memory and at least one processor, wherein the memory stores instructions, and the memory and the at least one processor are interconnected via a line; the at least one processor invokes the instructions in the memory to cause the optical module coupling device based on coupling gap detection to perform the steps of the optical module coupling method based on coupling gap detection described above.

[0008] The present invention also provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the steps of the optical module coupling method based on coupling gap detection described above.

[0009] The aforementioned optical module coupling method and related equipment based on coupling gap detection are applied to material coupling equipment including a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. This method obtains upper and lower laser reference ranging values ​​by performing laser ranging calibration on the calibration material and calibration block; it then measures the distance between the OE board material and the material to be coupled to obtain the actual ranging value; based on the difference between the reference ranging value and the actual ranging value, it compensates and adjusts the position of the coupling module to eliminate the influence of material thickness differences; and it performs multi-dimensional scanning at the calibration position to determine the optimal coupling position and coupling gap based on the optical coupling efficiency. This invention can adapt to thickness variations in different batches of materials, effectively eliminate the influence of material differences on coupling accuracy, ensure the consistency of the coupling gap, significantly improve optical coupling efficiency and product yield, and simultaneously achieve accurate detection and quality traceability of the coupling gap.

[0010] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained in accordance with the structures particularly pointed out in the description, claims and drawings.

[0011] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the first embodiment of the optical module coupling method based on coupling gap detection in the present invention; Figure 2 This is a schematic diagram of a second embodiment of the optical module coupling method based on coupling gap detection in the present invention; Figure 3 This is a schematic diagram of an embodiment of the optical module coupling device based on coupling gap detection in this invention; Figure 4 This is a schematic diagram of an embodiment of an optical module coupling device based on coupling gap detection according to the present invention; Figure 5 This is a schematic diagram of the optical module coupling device in an embodiment of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0014] The terms "comprising" and "having," and any variations thereof, used in the embodiments of this invention are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the steps or units listed, but may optionally include other steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0015] To facilitate understanding of this embodiment, a detailed description of an optical module coupling method based on coupling gap detection disclosed in this invention will be provided first. This optical module coupling method based on coupling gap detection is applied to optical module coupling devices, such as... Figure 5The optical module coupling device includes a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. For example... Figure 1 As shown, this method includes the following steps: 101. Perform laser ranging calibration on the calibration material and calibration block to obtain the upper laser reference ranging value and the lower laser reference ranging value; In this embodiment, the laser ranging calibration of the calibration material and calibration block to obtain upper and lower laser reference ranging values ​​includes: clamping the calibration material through the clamping mechanism of the coupling module and controlling the calibration material to descend until it contacts the calibration block, maintaining its position after detecting the contact signal through a force sensor; with the calibration material in contact with the calibration block, measuring the distance on the surface of the calibration block through the upper laser ranging module to obtain the upper laser reference ranging value; with the calibration material in contact with the calibration block, measuring the distance on the surface of the calibration material through the lower laser ranging module to obtain the lower laser reference ranging value.

[0016] Specifically, when calibrating an optical module coupling device, two standard components are required: a calibration material and a calibration block. In the FA coupling process, the calibration material is a standard FA material, and the calibration block is a standard OE board material; in the Lens coupling process, the calibration material is a standard Lens material, and the calibration block is a standard OE board material. The material, dimensions, and surface quality of these standard components all meet stringent specifications to ensure the accuracy of the calibration results.

[0017] Before the calibration process begins, the calibration block (standard OE board material) is placed on the positioning platform of the fixture module. Precise positioning is achieved through the positioning boss and the edge positioning post, and it is fixed by vacuum adsorption or clamping mechanism. At the same time, the calibration material (standard FA material or standard Lens material) is clamped by the clamping mechanism of the coupling module. The clamping mechanism can use an electrically controlled claw or vacuum adsorption to achieve stable clamping.

[0018] Next, the control coupling module moves the calibration material to the preset calibration starting position Z0. This position Z0 is determined manually through testing. At this position, a reasonable gap is maintained between the calibration material and the calibration block, ensuring that there is no contact while guaranteeing the smooth progress of subsequent coupling processes. This reasonable gap is usually determined based on the specific optical module type and process requirements to ensure good optical coupling efficiency within this gap.

[0019] At the initial calibration position Z0, the upper laser ranging module performs laser ranging on the upper surface of the calibration block (standard OE board material). The upper laser ranging module emits a laser downwards from above, and the measured distance value is recorded as the upper laser reference ranging value L1, which represents the vertical distance from the upper laser ranging module to the upper surface of the calibration block.

[0020] Simultaneously, laser ranging is performed on the lower surface of the calibration material using the lower laser ranging module. The lower laser ranging module emits a laser beam upwards, and the measured distance is recorded as the lower laser reference ranging value L2. This value represents the vertical distance from the lower laser ranging module to the lower surface of the calibration material. Since both the calibration material and the calibration block are standard parts, their thicknesses are known and fixed. At the calibration starting position Z0, a preset reasonable gap is maintained between the calibration material and the calibration block. At this point, the measured upper laser reference ranging value L1 and lower laser reference ranging value L2 establish a reference relationship between the upper and lower laser ranging modules. This reference relationship will be used in subsequent actual production to compensate for height deviations in different batches of materials, ensuring that each coupling starts from the same calibration position.

[0021] It should be noted that, during the calibration process, to improve calibration accuracy, multiple measurements can be taken at the same calibration location, for example, repeating the measurement 3 to 5 times. The average value of the measurement results is then taken as the final upper laser reference distance L1 and lower laser reference distance L2. This can reduce the random error of a single measurement and improve the reliability of the calibration results.

[0022] 102. The upper laser ranging module measures the distance to the OE board material to obtain the actual distance value of the OE board material. The lower laser ranging module measures the distance to the material to be coupled to obtain the actual distance value of the material to be coupled. In this embodiment, the step of measuring the distance of the OE board material using the upper laser ranging module to obtain the actual distance value of the OE board material, and measuring the distance of the material to be coupled using the lower laser ranging module to obtain the actual distance value of the material to be coupled, includes: placing the OE board material on the fixture module and fixing it using the fixture module; measuring the distance of the surface of the OE board material using the upper laser ranging module to obtain the actual distance value of the OE board material; clamping the material to be coupled using the clamping mechanism of the coupling module; and measuring the distance of the surface of the material to be coupled using the lower laser ranging module to obtain the actual distance value of the material to be coupled.

[0023] Specifically, after calibration, the equipment enters the normal production process. The operator places the OE board material to be coupled onto the positioning platform of the fixture module. The OE board material is inserted into the positioning hole through the positioning boss on the fixture module, and precise positioning in the X and Y directions is achieved by the positioning posts along the side. Afterwards, the fixture module uses vacuum suction holes to hold the OE board material in place, or uses spring clamps to mechanically press it, ensuring the OE board material remains stable and does not move during subsequent measurements and coupling. It should be noted that the OE board material is one of the materials that needs to be replaced for each coupling. After coupling each product, a new FA material or Lens material and a new OE board material are replaced simultaneously, rather than using a fixed base.

[0024] After the OE board material is fixed, the upper laser ranging module moves to a preset measurement position above the OE board material through the driving of the coupling module, and performs laser ranging on the upper surface of the OE board material. The measured distance value is recorded as the actual ranging value L1' of the OE board material. This measurement position is generally selected in the central area of ​​the OE board material or the effective optical area to be coupled, so as to ensure that the measurement result can truly reflect the height state of the coupling surface.

[0025] Simultaneously, the operator places the material to be coupled at the material handling position of the coupling module. In the FA coupling process, the material to be coupled is FA material; in the Lens coupling process, the material to be coupled is Lens material. The coupling module clamps the material to be coupled using a clamping mechanism (such as an electrically controlled gripper or a vacuum nozzle). During clamping, the clamping force needs to be controlled within a reasonable range to ensure secure clamping while avoiding deformation or damage to the material. Generally, the clamping force can be set between 2N and 10N, with the specific value determined based on the size and material of the material.

[0026] After the material to be coupled is clamped, the coupling module controls its movement above the measurement area of ​​the lower laser ranging module via its X, Y, and Z axis drive system. It should be noted that all three-dimensional movement within the device is accomplished by the X, Y, and Z axes of the coupling module; the fixture module only has rotational adjustment capabilities. The X, Y, and Z axes of the coupling module are sufficient to ensure relative distance control in all three dimensions. The lower laser ranging module performs laser ranging on the lower surface of the material to be coupled, and the measured distance value is recorded as the actual distance L2' of the material to be coupled. The measurement position is also selected within the effective coupling surface area of ​​the material to be coupled to ensure the accuracy and representativeness of the measurement.

[0027] It should be noted that due to processing errors and material differences in thickness between different batches of OE board materials and the materials to be coupled, the actual distance measurements L1' and L2' often deviate from the reference distance measurements L1 and L2 during calibration. For example, the thickness of a certain batch of OE board material may be 5 μm thicker than the standard OE board material, and the thickness of a certain batch of FA material may be 3 μm thinner than the standard FA material. These deviations will directly affect the subsequent coupling gap. Therefore, this invention provides an accurate data basis for subsequent height compensation by measuring the distance measurements of the actual materials.

[0028] In addition, to ensure measurement stability, the ambient lighting should be stable during laser ranging to avoid strong light interference. Simultaneously, the surface being measured should be kept clean to prevent dust, oil, or other contaminants from affecting laser reflection and causing measurement errors. If abnormal fluctuations in the measurement results are detected, the equipment should issue a warning signal, prompting the operator to check the surface condition of the material or repeat the measurement.

[0029] 103. Based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material, and the actual distance measurement value of the material to be coupled, perform position compensation adjustment so that the OE board material and the material to be coupled move to their respective calibration positions. In this embodiment, the step of performing position compensation adjustment based on the upper laser reference ranging value, the lower laser reference ranging value, the actual ranging value of the OE board material, and the actual ranging value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibration positions, includes: calculating the height deviation of the OE board material based on the upper laser reference ranging value and the actual ranging value of the OE board material; calculating the height deviation of the material to be coupled based on the lower laser reference ranging value and the actual ranging value of the material to be coupled; and performing position compensation control on the multi-axis motion mechanism of the coupling module and the fixture module based on the height deviation of the OE board material and the height deviation of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibration positions.

[0030] Specifically, after acquiring the upper laser reference ranging value L1, the lower laser reference ranging value L2, the actual ranging value L1' of the OE board material, and the actual ranging value L2' of the material to be coupled, the equipment control system calculates the height deviation.

[0031] First, calculate the height deviation ΔH1 of the OE board material. The formula is: ΔH1 = L1' - L1 Where L1 is the distance to the top surface of the OE board material of the standard device measured by the laser ranging module during calibration, and L1' is the distance to the top surface of the OE board material measured by the laser ranging module during actual measurement. If ΔH1 is positive, it means that the OE board material of the current batch is thicker than the calibration block, and the top surface position is higher; if ΔH1 is negative, it means that the OE board material of the current batch is thinner than the calibration block, and the top surface position is lower. For example, in FA coupling equipment, if the thickness of the ceramic sheet of a certain batch of OE board is 8μm thicker than that of the calibration block, then the measured ΔH1 is approximately 8μm.

[0032] Next, calculate the height deviation ΔH2 of the materials to be coupled. The formula is: ΔH2 = L2' - L2 Where L2 is the distance to the lower surface of the calibration optical module measured by the laser ranging module during calibration, and L2' is the distance to the lower surface of the material to be coupled measured by the laser ranging module during actual measurement. Similarly, if ΔH2 is positive, it means that the material to be coupled is thicker than the calibration optical module; if ΔH2 is negative, it means that the material to be coupled is thinner than the calibration optical module.

[0033] It should be noted that, since the position of the laser ranging module remains unchanged during the measurement process, the above deviation value directly reflects the thickness difference between the actual material and the calibrated material. This deviation calculation method based on laser ranging avoids the interference of factors such as contact force and surface roughness in traditional mechanical measurements.

[0034] After calculating the height deviation ΔH1 of the OE board material and the height deviation ΔH2 of the material to be coupled, the control system performs position compensation on the multi-axis motion mechanism of the coupling module. In this embodiment, the coupling module includes a multi-axis motion mechanism, specifically comprising: a coupling X-axis, a coupling Y-axis, a coupling Z-axis, an θX-axis, an θY-axis, and an θZ-axis. These motion axes enable precise positioning and attitude adjustment of the material to be coupled in three-dimensional space.

[0035] For height compensation, since the OE board material is fixed on the fixture module and the material to be coupled is clamped by the coupling module, the height difference between the two needs to be compensated uniformly through the coupling Z-axis of the coupling module. Specifically, the relative height difference ΔH between the OE board material and the material to be coupled is calculated as follows: ΔH = ΔH1 - ΔH2.

[0036] The relative height deviation ΔH reflects the change in the overall height relationship of the current batch of materials relative to the calibration time. The distance ΔH is controlled by moving the coupling Z-axis to maintain the same relative height between the OE plate material and the material to be coupled as at the calibration time. For example, if ΔH1 = 8μm and ΔH2 = -3μm, then ΔH = 11μm. Controlling the coupling Z-axis to descend by 11μm will restore the relative height relationship between the two materials to the state at the calibration time.

[0037] In addition to Z-axis height compensation, in some embodiments, it is also necessary to compensate for the tilt angles of the OE board material and the material to be coupled. The θX-axis on the fixture module can adjust the tilt angle of the OE board material around the X-axis, while the θX-axis and θY-axis on the coupling module can adjust the tilt angles of the material to be coupled around the X-axis and Y-axis. These angle adjustments ensure the parallelism of the coupling surfaces and avoid uneven local gaps caused by tilting.

[0038] After the above compensation adjustments were completed, both the material to be coupled and the OE board material returned to their respective calibration positions. At this point, although the actual material thickness differed from the calibration material, mechanical compensation ensured that their relative positional relationship was completely consistent with that during calibration. This eliminated the impact of batch differences in materials on coupling accuracy, creating favorable initial conditions for subsequent precision coupling.

[0039] Understandably, this embodiment, by measuring and actively compensating for the thickness deviation of the actual material, can adapt to thickness variations in different batches of material compared to the traditional fixed-gap coupling method, significantly improving the flexibility and yield of the coupling process. In actual production, even if OE board materials or FA materials from different suppliers are used, the equipment can automatically complete height compensation without manual adjustment of equipment parameters, reducing material changeover time and debugging costs.

[0040] 104. Perform multi-dimensional scanning at the calibrated position, determine the optimal coupling position based on the optical coupling efficiency, and determine the coupling gap detection result based on the optimal coupling position.

[0041] In this embodiment, the step of performing multi-dimensional scanning at the calibration position, determining the optimal coupling position based on the optical coupling efficiency, and completing the coupling of the material to be coupled to the OE board material at the optimal coupling position includes: performing multi-dimensional scanning and adjustment of the material to be coupled at the calibration position, determining the optimal coupling position based on the optical coupling efficiency; applying adhesive between the material to be coupled and the OE board material at the optimal coupling position using a dispensing module; and curing the adhesive using a curing device to complete the coupling of the material to be coupled to the OE board material.

[0042] Specifically, after the height compensation adjustment was completed, the material to be coupled and the OE board material were in the calibrated position. This vertical height gap remained constant throughout the entire multi-dimensional scanning process.

[0043] The control system drives the multi-axis motion mechanism of the coupling module to perform multi-dimensional scanning and adjustment of the material to be coupled. During the multi-dimensional scanning process, the coupling module mainly uses a combination of the X-axis and Y-axis movements to make minute adjustments to the position of the material to be coupled within the horizontal plane. Simultaneously, adjustments to the θX-axis, θY-axis, and θZ-axis fine-tune the attitude angle of the material to be coupled to optimize optical alignment. During the scanning process, the coupling Z-axis remains at the compensated height position to ensure stable vertical clearance.

[0044] Simultaneously, the light source module emits test light signals to the optical system and monitors the optical coupling efficiency in real time. In the FA coupling process, the test light is transmitted through the FA material and then received by the photodetector on the OE board material. The intensity of the electrical signal output by the photodetector reflects the optical coupling efficiency. In the Lens coupling process, the test light passes through the Lens material and reaches the optical interface of the OE board material. The optical power value at the interface characterizes the coupling efficiency.

[0045] The control system records the optical coupling efficiency value corresponding to each scanning position and finds the position with the highest optical coupling efficiency by comparison. This position is the optimal coupling position. It should be noted that this optimal coupling position is the best optical alignment state obtained by optimizing the horizontal position (X, Y directions) and attitude angles (θX, θY, θZ) given that the vertical height gap is already determined.

[0046] After determining the optimal coupling position, the control system locks all motion axes of the coupling module, keeping the material to be coupled stationary at that position. Then, the dispensing module moves to the preset dispensing position and applies an appropriate amount of adhesive to the gap between the material to be coupled and the OE board material. After dispensing, the adhesive is cured using a UV curing device or a heat curing device, ensuring a firm bond between the material to be coupled and the OE board material, thus completing the coupling process.

[0047] Understandably, this embodiment ensures the consistency of the vertical gap by first performing laser ranging and height compensation, and then performing multi-dimensional scanning optimization under a fixed gap, achieving effective separation of height control and optical alignment. This method avoids the complexity of height and horizontal position coupling adjustment in traditional processes, improving coupling efficiency and yield. Simultaneously, since the vertical gap is precisely determined by laser ranging before scanning, the entire coupling process has better repeatability and stability; even if different batches of materials have different thicknesses, automatic compensation can ensure the same coupling quality.

[0048] Furthermore, the step of performing multi-dimensional scanning and adjustment of the material to be coupled at the calibration position and determining the optimal coupling position based on the optical coupling efficiency includes: performing a zigzag trajectory scan on the material to be coupled to detect the optical coupling efficiency at each position and find the initial weak light signal position; starting from the initial weak light signal position, performing a cross-shaped trajectory scan to find the local maximum value position of the optical coupling efficiency; performing leveling coupling and focusing coupling adjustment on the material to be coupled at the local maximum value position, and performing a small-range fine scan after leveling and focusing to determine the global maximum value position of the optical coupling efficiency as the optimal coupling position.

[0049] Specifically, in order to improve scanning efficiency and ensure that the true optimal coupling position is found when performing multi-dimensional scanning at the calibrated position, this embodiment adopts a three-level scanning strategy.

[0050] The first-level scan is a zigzag trajectory scan. The control system drives the coupling module's X-axis and Y-axis, causing the material to be coupled to move along the zigzag trajectory. The zigzag trajectory scans layer by layer from the outside in, with a scanning range set to ±100μm to ±200μm and a scanning step set to 10μm to 20μm. During the scanning process, the light source configuration varies depending on the coupling process type. In TX coupling mode, the light source on the OE board material emits light; in RX coupling mode, an external light source emits light. The control system collects optical coupling efficiency data in real time. When a non-zero value is detected in the optical coupling efficiency, it indicates that the edge region of the optical signal has been found, and this position is recorded as the initial weak light signal position.

[0051] The second-level scan is a crosshair trajectory scan. Centered on the initial weak light signal position, the coupling X-axis is controlled to reciprocate along the X direction while keeping the Y coordinate constant. The coordinates corresponding to the maximum optical coupling efficiency in the X direction are recorded. Then, with the X coordinate fixed, the coupling Y-axis is controlled to reciprocate along the Y direction, and the coordinates corresponding to the maximum optical coupling efficiency in the Y direction are recorded. The position obtained at this point is the local maximum value position found by the crosshair scan.

[0052] The third stage is leveling and coupling. After finding the location of the local maximum value, leveling and coupling adjustments are made to optimize the relative tilt angle between the material to be coupled and the OE board material.

[0053] The fourth stage is focus-length coupling. After completing the leveling coupling, focus-length coupling adjustment is performed to fine-tune and optimize the height in the focal length direction.

[0054] The fifth level is a small-scale fine scan. Centered on the previously optimized position, a small-scale fine scan is performed to determine the position of the global maximum optical coupling efficiency as the optimal coupling position.

[0055] Understandably, the multi-level scanning strategy employed in this embodiment balances scanning efficiency and positioning accuracy. The coarse zigzag scan quickly locates the optical signal area, the cross-shaped scan rapidly approaches the peak value, the leveling coupling ensures surface matching, the focus-length coupling optimizes the focal length, and the fine scan ensures the accuracy of the final positioning.

[0056] In this embodiment, laser ranging calibration is performed on the calibration optical module and calibration block to obtain upper and lower laser reference ranging values. Then, ranging is performed on the actual OE board material and the material to be coupled to obtain the actual ranging value. The position of the coupling module is compensated and adjusted according to the difference between the reference ranging value and the actual ranging value to eliminate the influence of material thickness differences. Finally, multi-dimensional scanning is performed at the calibration position, and the optimal coupling position and coupling gap are determined based on the optical coupling efficiency. This invention can adapt to the thickness variations of different batches of materials, effectively eliminate the influence of material differences on coupling accuracy, ensure the consistency of coupling gap, significantly improve optical coupling efficiency and product yield, and simultaneously achieve accurate detection and quality traceability of coupling gap.

[0057] Please see Figure 2 Another embodiment of the optical module coupling method based on coupling gap detection in this application includes: 201. Perform laser ranging calibration on the calibration material and calibration block to obtain the upper laser reference ranging value and the lower laser reference ranging value; In this embodiment, step 201 is similar to step 101, and will not be described again here.

[0058] 202. The camera module is used to take pictures of the material to be coupled and identify it to obtain the position and tilt angle of the material to be coupled; In this embodiment, after the coupling module clamps the material to be coupled through the clamping mechanism, it controls the movement of the coupling module along the large Y-axis to transport the material to the camera module's imaging position. The camera module includes a CCD imaging module and a matching light source illumination system. The CCD imaging module is mounted on the X-axis, Y-axis, and Z-axis motion mechanism of the upper camera module, and the imaging position and focal length can be adjusted as needed.

[0059] After the camera module is adjusted to a clear focus position, it takes a picture of the material to be coupled, acquiring an image of the material. Image processing algorithms analyze the captured image to identify feature markers or feature edges of the material to be coupled. In the FA coupling process, the camera module identifies the feature locations of the FA material; in the Lens coupling process, the camera module identifies the feature locations of the Lens material.

[0060] Based on the identified feature information, the feature position coordinates (Xfa, Yfa) of the material to be coupled and the tilt angle θfa of the material relative to the horizontal plane are calculated. Here, the position coordinates (Xfa, Yfa) represent the position of the feature of the material to be coupled in the image coordinate system, and the tilt angle θfa represents the rotation angle of the material to be coupled around the Z-axis.

[0061] 203. The OE board material is photographed and identified using the camera module to obtain the position and tilt angle of the OE board material; In this embodiment, the camera module moves above the photographing position of the OE board material and takes a picture of the OE board material fixed on the fixture module. The photographing process is similar to step 202. After the camera module acquires the image of the OE board material, it identifies the feature information of the OE board material through an image processing algorithm.

[0062] In the FA coupling device, the position of the photodetector or the positioning mark on the ceramic sheet of the OE plate can be identified; in the Lens coupling device, the position of the optical interface of the lens assembly base or the outer contour of the base can be identified. Based on the identified feature information, the center position coordinates (Xbase, Ybase) of the OE plate material and the tilt angle θbase of the OE plate material relative to the horizontal plane are calculated.

[0063] 204. Based on the position and tilt angle of the material to be coupled and the position and tilt angle of the OE board material, calculate the positional deviation and angle deviation, and control the coupling module to perform correction adjustments. In this embodiment, the control system calculates the positional and angular deviations between the material to be coupled and the OE board material obtained in steps 202 and 203.

[0064] Based on the calculated positional and angular deviations, the control system adjusts the multi-axis motion mechanism of the coupling module to compensate for the positional and angular deviations between the material to be coupled and the OE board material. Specifically, the X-axis and Y-axis of the coupling module are adjusted to compensate for positional deviations in the X and Y directions, and the θZ-axis is adjusted to compensate for angular deviations around the Z-axis, so that the position and angle of the material to be coupled and the OE board material are basically aligned in the horizontal plane.

[0065] After the correction adjustment is completed, the relative positions of the material to be coupled and the OE board material are initially corrected, providing a good initial alignment state for subsequent laser ranging and precision coupling.

[0066] 205. The upper laser ranging module measures the distance to the OE board material to obtain the actual distance value of the OE board material. The lower laser ranging module measures the distance to the material to be coupled to obtain the actual distance value of the material to be coupled. 206. Based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material, and the actual distance measurement value of the material to be coupled, perform position compensation adjustment so that the OE board material and the material to be coupled move to their respective calibration positions. 207. Perform multi-dimensional scanning at the calibrated position, determine the optimal coupling position based on the optical coupling efficiency, and complete the coupling of the material to be coupled with the OE board material at the optimal coupling position.

[0067] In this embodiment, steps 205-207 are similar to steps 102-104 in the first embodiment, and will not be described again here.

[0068] In this embodiment, laser ranging calibration is performed on the calibration material and calibration block to obtain upper and lower laser reference ranging values; ranging is performed on the OE board material and the material to be coupled to obtain the actual ranging value; the position of the coupling module is compensated and adjusted according to the difference between the reference ranging value and the actual ranging value to eliminate the influence of material thickness differences; multi-dimensional scanning is performed at the calibration position, and the optimal coupling position and coupling gap are determined based on the optical coupling efficiency. This invention can adapt to the thickness variations of different batches of materials, effectively eliminate the influence of material differences on coupling accuracy, ensure the consistency of the coupling gap, significantly improve optical coupling efficiency and product yield, and simultaneously achieve accurate detection and quality traceability of the coupling gap.

[0069] The optical module coupling method based on coupling gap detection in the embodiments of the present invention has been described above. The optical module coupling device based on coupling gap detection in the embodiments of the present invention is described below. This device is applied to an optical module coupling equipment, and includes a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. For details on the optical module coupling device based on coupling gap detection, please refer to [link to relevant documentation]. Figure 3 One embodiment of the optical module coupling device based on coupling gap detection in this invention includes: The calibration module 301 is used to perform laser ranging calibration on the calibration material and calibration block to obtain the upper laser reference ranging value and the lower laser reference ranging value. The ranging module 302 is used to measure the distance of the OE board material through the upper laser ranging module to obtain the actual distance value of the OE board material, and to measure the distance of the material to be coupled through the lower laser ranging module to obtain the actual distance value of the material to be coupled. The compensation module 303 is used to perform position compensation adjustment based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material and the actual distance measurement value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibration positions. The coupling module 304 is used to perform multi-dimensional scanning at the calibrated position, determine the optimal coupling position based on the optical coupling efficiency, and complete the coupling of the material to be coupled with the OE board material at the optimal coupling position.

[0070] In this embodiment of the invention, the optical module coupling device based on coupling gap detection operates the aforementioned optical module coupling method based on coupling gap detection. This device is applied to a material coupling device comprising a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. The method involves laser ranging calibration of the calibration material and calibration block to obtain upper and lower laser reference ranging values; ranging of the OE board material and the material to be coupled to obtain actual ranging values; compensation adjustment of the coupling module position based on the difference between the reference ranging value and the actual ranging value to eliminate the influence of material thickness differences; and multi-dimensional scanning at the calibration position to determine the optimal coupling position and coupling gap based on the optical coupling efficiency. This invention can adapt to thickness variations in different batches of materials, effectively eliminating the influence of material differences on coupling accuracy, ensuring the consistency of the coupling gap, significantly improving optical coupling efficiency and product yield, while simultaneously achieving accurate detection and quality traceability of the coupling gap.

[0071] above Figure 3 The optical module coupling device based on coupling gap detection in the embodiments of the present invention will be described in detail from the perspective of unitized functional entities. The optical module coupling device based on coupling gap detection in the embodiments of the present invention will be described in detail from the perspective of hardware processing.

[0072] Figure 4 This is a schematic diagram of a fiber optic module coupling device 300 based on coupling gap detection, provided by an embodiment of the present invention. The fiber optic module coupling device 300 based on coupling gap detection can vary significantly due to different configurations or performance characteristics. It may include one or more central processing units (CPUs) 410 (e.g., one or more processors) and a memory 420, and one or more storage media 430 (e.g., one or more mass storage devices) storing application programs 333 or data 432. The memory 420 and storage media 430 can be temporary or persistent storage. The program stored in the storage media 430 may include one or more units (not shown in the diagram), each unit may include a series of instruction operations on the fiber optic module coupling device 400 based on coupling gap detection. Furthermore, the processor 410 may be configured to communicate with the storage media 430 and execute a series of instruction operations on the storage media 430 on the fiber optic module coupling device 400 based on coupling gap detection to implement the steps of the fiber optic module coupling method based on coupling gap detection described above.

[0073] The optical module coupling device 400 based on coupling gap detection may also include one or more power supplies 440, one or more wired or wireless network interfaces 450, one or more input / output interfaces 460, and / or one or more operating systems 431, such as Windows Server, Mac OS X, Unix, Linux, FreeBSD, etc. Those skilled in the art will understand that... Figure 4 The optical module coupling device structure shown does not constitute a limitation on the optical module coupling device based on coupling gap detection provided by the present invention. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0074] The present invention also provides a computer-readable storage medium, which can be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium, wherein the computer-readable storage medium stores instructions that, when the instructions are executed on a computer, cause the computer to perform the steps of the optical module coupling method based on coupling gap detection.

[0075] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the system, device, or unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0076] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0077] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for coupling optical modules based on coupling gap detection, characterized in that, An optical module coupling device is applied to an optical module coupling equipment, which includes a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. The optical module coupling method based on coupling gap detection includes: Laser ranging calibration is performed on the calibration material and calibration block to obtain the upper laser reference ranging value and the lower laser reference ranging value; The upper laser ranging module measures the distance to the OE board material to obtain the actual distance value of the OE board material. The lower laser ranging module measures the distance to the material to be coupled to obtain the actual distance value of the material to be coupled. Position compensation adjustments are made based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material, and the actual distance measurement value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibrated positions. Multi-dimensional scanning is performed at the calibrated position, and the optimal coupling position is determined based on the optical coupling efficiency. The coupling of the material to be coupled to the OE board material is completed at the optimal coupling position.

2. The optical module coupling method based on coupling gap detection according to claim 1, characterized in that, The laser ranging calibration of the calibration material and calibration block to obtain the upper laser reference ranging value and the lower laser reference ranging value includes: The calibration material is clamped by the clamping mechanism of the coupling module and controlled to descend until it contacts the calibration block. After the contact signal is detected by the force sensor, the position remains unchanged. With the calibration material in contact with the calibration block, the upper laser ranging module measures the distance to the surface of the calibration block to obtain the upper laser reference ranging value. With the calibration material in contact with the calibration block, the lower laser ranging module measures the distance to the surface of the calibration material to obtain the lower laser reference ranging value.

3. The optical module coupling method based on coupling gap detection according to claim 1, characterized in that, The process involves measuring the distance to the OE board material using the upper laser ranging module to obtain the actual distance value of the OE board material, and measuring the distance to the material to be coupled using the lower laser ranging module to obtain the actual distance value of the material to be coupled, including: The OE board material is placed on the fixture module and fixed by the fixture module. The surface of the OE board material is measured by the upper laser ranging module to obtain the actual ranging value of the OE board material. The material to be coupled is held by the clamping mechanism of the coupling module, and the distance to the surface of the material to be coupled is measured by the lower laser ranging module to obtain the actual distance value of the material to be coupled.

4. The optical module coupling method based on coupling gap detection according to claim 1, characterized in that, Before measuring the distance to the OE board material using the upper laser ranging module, the following is also included: The camera module takes pictures of the material to be coupled to obtain its position and tilt angle. The OE board material is photographed and identified by the camera module to obtain the position and tilt angle of the OE board material. Based on the position and tilt angle of the material to be coupled and the position and tilt angle of the OE board material, the positional deviation and angle deviation are calculated, and the coupling module is controlled to perform correction adjustments.

5. The optical module coupling method based on coupling gap detection according to claim 1, characterized in that, The step of performing position compensation adjustment based on the upper laser reference ranging value, the lower laser reference ranging value, the actual ranging value of the OE board material, and the actual ranging value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibrated positions, includes: The height deviation of the OE board material is calculated based on the laser reference distance measurement value and the actual distance measurement value of the OE board material. The height deviation of the material to be coupled is calculated based on the lower laser reference ranging value and the actual ranging value of the material to be coupled. Based on the height deviation of the OE board material and the height deviation of the material to be coupled, position compensation control is performed on the multi-axis motion mechanism of the coupling module and the fixture module, so that the OE board material and the material to be coupled move to their respective calibrated positions.

6. The optical module coupling method based on coupling gap detection according to claim 1, characterized in that, The process of performing multi-dimensional scanning at the calibrated location, determining the optimal coupling position based on optical coupling efficiency, and completing the coupling of the material to be coupled to the OE board material at the optimal coupling position includes: The material to be coupled is scanned and adjusted in multiple dimensions at the calibration position, and the optimal coupling position is determined based on the optical coupling efficiency. At the optimal coupling position, adhesive is applied between the material to be coupled and the OE board material via the dispensing module; The adhesive is cured by a curing device to complete the coupling of the material to be coupled with the OE board material.

7. The optical module coupling method based on coupling gap detection according to claim 6, characterized in that, The step of performing multi-dimensional scanning and adjustment of the material to be coupled at the calibration position, and determining the optimal coupling position based on the optical coupling efficiency, includes: The material to be coupled is scanned in a zigzag pattern to detect the optical coupling efficiency at each position and to find the initial weak light signal position. Starting from the initial weak light signal position, a cross-shaped trajectory scan is performed to find the location of the local maximum value of optical coupling efficiency; At the local maximum position, the material to be coupled is leveled and the focal length is adjusted. After leveling and focal length adjustment, a small-range fine scan is performed to determine the global maximum position of optical coupling efficiency as the optimal coupling position.

8. An optical module coupling device based on coupling gap detection, characterized in that, This is applied to an optical module coupling device, which includes a fixture module, a coupling module, an upper laser ranging module, a lower laser ranging module, and a dispensing module. The optical module coupling device based on coupling gap detection includes: The calibration module is used to perform laser ranging calibration on calibration materials and calibration blocks to obtain upper laser reference ranging values ​​and lower laser reference ranging values. The ranging module is used to measure the distance of the OE board material through the upper laser ranging module to obtain the actual distance value of the OE board material, and to measure the distance of the material to be coupled through the lower laser ranging module to obtain the actual distance value of the material to be coupled. The compensation module is used to perform position compensation and adjustment based on the upper laser reference distance measurement value, the lower laser reference distance measurement value, the actual distance measurement value of the OE board material and the actual distance measurement value of the material to be coupled, so that the OE board material and the material to be coupled move to their respective calibration positions. The coupling module is used to perform multi-dimensional scanning at the calibrated position, determine the optimal coupling position based on the optical coupling efficiency, and complete the coupling of the material to be coupled with the OE board material at the optimal coupling position.

9. An optical module coupling device based on coupling gap detection, characterized in that, The optical module coupling device based on coupling gap detection includes: a memory and at least one processor, wherein the memory stores instructions; The at least one processor invokes the instructions in the memory to cause the optical module coupling device based on coupling gap detection to perform the steps of the optical module coupling method based on coupling gap detection as described in any one of claims 1-7.

10. A computer-readable storage medium storing instructions thereon, characterized in that, When the instruction is executed by the processor, it implements the steps of the optical module coupling method based on coupling gap detection as described in any one of claims 1-7.

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