FA mounting device and mounting method in optical module

Abstract

The application provides a FA mounting device and mounting method in an optical module. The optical module mounting device comprises a carrier and a clamp. The carrier comprises a heating section, at least the heating section is provided with a temperature control module, and the heating section comprises a processing position for carrying a material to be mounted. The clamp comprises a clamping module, a positioning module and a base. The carrier is detachably mounted on the base through the positioning module. The clamping module is used for clamping the material to be mounted, and the clamping module is movably arranged on the clamp to adapt to the processing position. In this way, by integrally arranging the temperature control module in the carrier, the heating section of the carrier can be heated, so as to ensure that the glue maintains the best working performance. Meanwhile, the clamp and the carrier are arranged separately, and the positioning module is arranged on the clamp. This enables the carrier after preheating to be accurately mounted on the clamp through the positioning module, effectively improves the overall efficiency of the FA mounting operation in the optical module, reduces the operation complexity, and ensures the positioning accuracy of assembly.

Description

Technical Field

[0001] This invention relates to the field of optical module mounting technology, specifically to an FA mounting device and mounting method for optical modules. Background Technology

[0002] In the field of optical communication device manufacturing, the assembly of fiber arrays (FAs) is one of the key processes. Its core steps include positioning the optical fibers on a V-groove glass substrate, applying adhesive, covering with a cover plate, and then applying pressure for curing. During this process, the carrier holding the materials needs to be preheated and kept at a suitable temperature to maintain optimal adhesive flow.

[0003] In existing technologies, the carriers that hold materials do not have preheating and heat preservation functions, which limits the working performance of the adhesive and affects the overall assembly efficiency. At the same time, there is a contradiction between the preheating process and the assembly process. If the two are integrated into the same station, the assembly station will be idle during the preheating period, resulting in low equipment utilization. If two separate stations are set up, the transfer of materials will lead to temperature loss and positioning errors. Summary of the Invention

[0004] In view of this, the present invention aims to provide a FA mounting device and mounting method in optical modules to solve the problem of low FA assembly efficiency in optical modules in the prior art.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide a FA mounting device for an optical module, comprising: The carrier includes a heating section, at least the heating section is provided with a temperature control module, and the heating section includes a processing position for holding the material to be mounted; The fixture includes a clamping module, a positioning module, and a base; The carrier is detachably mounted on the base via the positioning module; the clamping module is used to clamp the material to be mounted, and the clamping module is movably mounted on the fixture to adapt to the processing position.

[0006] In one embodiment, the positioning module includes a positioning side plate; The positioning side plate is disposed on at least one side of the base along the width direction, and the side wall of the vehicle abuts against the positioning side plate to position the vehicle along the width direction.

[0007] In one embodiment, the positioning module includes a positioning element; The positioning element is disposed on the top surface of the base and protrudes from the top surface; the bottom surface of the carrier is provided with a positioning hole, and the positioning element is inserted into the positioning hole; or, The positioning element is disposed on the bottom surface of the carrier and protrudes from the bottom surface. The top surface of the base is provided with a positioning hole, and the positioning element is inserted into the positioning hole.

[0008] In one embodiment, the clamping module includes a clamp, a mounting component, and a locking component; The mounting component is provided with a receiving groove extending along the length direction, and the clamp passes through the receiving groove and is movable within the receiving groove; The locking member is inserted into the mounting member and is arranged along the height direction; the locking member abuts against the clamp to restrict the movement of the clamp along the length direction.

[0009] In one embodiment, the mounting component includes a limiting block and a connecting block that are interconnected; The receiving groove is formed on the limiting block and / or the connecting block.

[0010] In one embodiment, the chuck includes a first jaw and a second jaw, and the clamping module includes a first mounting component, a second mounting component, and a slide. The first mounting component is provided with a first receiving groove, and the first gripper passes through the first receiving groove; the second mounting component is provided with a second receiving groove, and the second gripper passes through the second receiving groove. The slide is disposed on the base, and the slide has a groove extending along the width direction; the first mounting member and the second mounting member are slidably connected to the groove.

[0011] In one embodiment, the clamping module includes a drive element; The driving member abuts against the first mounting member or the second mounting member to drive the first gripper or the second gripper to move along the width direction.

[0012] In one embodiment, the clamping module includes a first elastic element; The two ends of the first elastic member are respectively connected to the first mounting member and the second mounting member to provide a force that brings the first gripper and the second gripper closer to each other.

[0013] In one embodiment, the temperature control module includes a heating element and a temperature measuring element; the heating section has a first receiving hole and a second receiving hole inside; The heating element passes through the first receiving hole, and the temperature measuring element passes through the second receiving hole.

[0014] In one embodiment, the vehicle includes an insulation section and a main body; The heat insulation section is disposed between the heating section and the main body along the length direction.

[0015] In one embodiment, the optical module mounting equipment includes a pressure holding module, which is rotatably connected to the carrier; The pressure holding module includes a pressing component that abuts against the material to be mounted to provide pressure to the material.

[0016] In one embodiment, the pressure-holding module includes a flip-over pressure plate; One end of the flipping pressure plate is rotatably connected to the carrier, and the pressing component is disposed on the flipping pressure plate; The flip-over pressure plate has a pressing position and a depressurization position; When the flip-over pressure plate is in the pressing position, the pressing component abuts against the material to be mounted; when the flip-over pressure plate is in the depressurization position, the pressing component moves away from the material to be mounted.

[0017] In one embodiment, the pressure-holding module includes a locking element; The locking element is rotatably connected to the flipping pressure plate. The locking element has a locking part, and the carrier is provided with a buckle. When the flipping pressure plate is in the pressing position, the locking part engages with the buckle.

[0018] In one embodiment, the pressure-holding module includes a second elastic element; The second elastic element abuts against the locking element and the flipping pressure plate respectively.

[0019] In one embodiment, at least a portion of the press-fit element is elastic, and the press-fit element elastically presses against the material to be applied.

[0020] To address the aforementioned technical problems, this invention also provides a method for mounting an FA (Fabry-Performance Array) in an optical module, using the FA mounting equipment described above, comprising: Heat and maintain the temperature of the heating section within a preset range; Connect the carrier to the fixture, and adjust the relative position of the clamping module on the fixture and the material to be mounted on the carrier until the clamping module clamps the material to be mounted. Adhesive is applied to the surface of the material to be mounted, and the carrier performs a pressure holding operation; Separate the carrier from the clamp, and after the colloid has cured, remove the cured product.

[0021] Compared with existing optical module mounting tools, the FA mounting equipment in the optical module provided in this embodiment of the invention has the following advantages: This invention provides a FA mounting device for optical modules, including a carrier and a fixture. The carrier includes a heating section, at least one of which is equipped with a temperature control module. The heating section includes a processing position for holding the material to be mounted. The fixture includes a clamping module, a positioning module, and a base. The carrier is detachably mounted on the base via the positioning module. The clamping module is used to clamp the material to be mounted and is movably mounted on the fixture to adapt to the processing position. Thus, by integrating the temperature control module into the carrier, the heating section containing the material can be heated, ensuring the adhesive maintains optimal working performance. Simultaneously, by separating the fixture and carrier and providing the positioning module on the fixture, the preheating process can be continuously performed on an independent carrier, without occupying assembly station time. Furthermore, the preheated carrier can be quickly and accurately mounted onto the fixture via the positioning module, achieving efficient connection from material preheating to assembly. This effectively improves the overall efficiency of FA mounting operations in optical modules, reduces operational complexity, and ensures assembly positioning accuracy. In addition, the clamping module is movably mounted on the fixture, which can adapt to different types of materials to be mounted, and can actively adapt and adjust to the position of the material in a timely manner when there is a deviation in the material placement position, so as to achieve precise clamping of the material. Attached Figure Description

[0022] Figure 1 The diagram shown is a schematic representation of the assembly relationship between the carrier and the fixture provided in an embodiment of the present invention.

[0023] Figure 2 The diagram shown is a structural schematic of the positioning module provided in an embodiment of the present invention.

[0024] Figure 3 The image shown is a front view of the positioning module provided in an embodiment of the present invention.

[0025] Figure 4 The figure shown is a cross-sectional view of the assembly relationship between the carrier and the fixture provided in an embodiment of the present invention.

[0026] Figure 5 The diagram shown is a structural schematic of a carrier and fixture assembly provided in an embodiment of the present invention.

[0027] Figure 6 The diagram shown is another structural schematic of the assembly of the carrier and the fixture provided in an embodiment of the present invention.

[0028] Figure 7 The figure shown is an exploded view of the clamping module provided in an embodiment of the present invention.

[0029] Figure 8 The diagram shown is a schematic of a clamp holding materials according to an embodiment of the present invention.

[0030] Figure 9The figure shown is an exploded view of the temperature control module provided in an embodiment of the present invention.

[0031] Figure 10 The figure shown is a cross-sectional view of the temperature control module provided in an embodiment of the present invention.

[0032] Figure 11 The figure shown is an exploded view of the pressure holding module provided in an embodiment of the present invention.

[0033] Figure 12 The figure shown is a schematic diagram of the pressing component provided in an embodiment of the present invention.

[0034] Figure 13 The diagram shown illustrates the connection between the locking element and the flip-over pressure plate provided in an embodiment of the present invention.

[0035] Figure 14 The diagram shows a flowchart of the FA mounting method in an optical module provided by an embodiment of the present invention.

[0036] Figure 15 The diagram shown is a structural schematic of step S1 in the FA mounting method of the optical module provided in an embodiment of the present invention.

[0037] Figure 16 The diagram shown is a structural schematic of step S2 in the FA mounting method of the optical module provided in an embodiment of the present invention.

[0038] Figure 17 The diagram shown is a structural schematic of the material to be mounted according to an embodiment of the present invention.

[0039] Figure 18 The diagram shown is a structural schematic of step S3 in the FA mounting method of the optical module provided in an embodiment of the present invention.

[0040] The explanations of the reference numerals in the accompanying drawings are as follows: 1-Carrier; 10-Heating section; 11-Insulation section; 12-Main body; 13-Temperature control module; 14-Snap-on; 100 - First receiving hole; 101 - Second receiving hole; 130 - Heating element; 131 - Temperature measuring element; 2-Clamp; 20-Clamping module; 21-Positioning module; 22-Base; 23-Chuck; 24-Mounting component; 25-Locking component; 200-First gripper; 201-Second gripper; 202-First mounting component; 203-Second mounting component; 204-First locking component; 205-Second locking component; 206-Slide table; 207-Slide groove; 208-Drive component; 209-First elastic component; 210-Positioning side plate; 211-Positioning component; 212-Positioning hole; 213-Positioning groove; 2020 - First limiting block; 2021 - First connecting block; 2022 - First receiving groove; 2030 - Second limiting block; 2031 - Second connecting block; 2032 - Second receiving groove; 3-Pressure holding module; 30-Pressure pressing component; 31-Flipping pressure plate; 32-Locking component; 33-Second elastic component; 300 - Spring probe; 301 - Set screw; 302 - Connecting plate; 320 - Locking part; 4-Material to be mounted; 40-Substrate; 41-V-groove; 42-Fiber optic cable; 43-Cover plate. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," and "radial," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] In the assembly process of the FA (Fabry-Performance Array) in an optical module, to achieve the positioning, clamping, and dispensing curing of materials such as V-grooves, optical fibers, and glass covers, it is usually necessary to maintain good adhesive flow and apply precise and controllable clamping and holding forces to the materials. One existing approach is to place the materials to be assembled on a preheating platform to improve adhesive flow, and then transfer the preheated materials to the assembly fixture for positioning, clamping, and subsequent pressure holding operations.

[0045] The above solution presents a contradiction: the continuous heat supply and stable thermal environment required for preheating conflict with the clean, heat-free, and easily adjustable operating space required for assembly, creating a conflict in terms of time, space, and operational procedures. Specifically, during the transfer of the preheated material to be mounted from the preheating platform to the assembly fixture, the temperature of the material may drop due to exposure to room temperature, resulting in poor adhesive flow; or, the heat from the preheating platform may have a thermal impact on the positioning and clamping mechanisms of the assembly fixture, introducing additional positioning errors or thermal stress.

[0046] The root causes of the aforementioned contradictions are multifaceted. On the one hand, when the preheating and assembly functions are spatially adjacent, the conduction and diffusion of heat are difficult to isolate effectively, easily leading to mutual interference of ambient temperatures. On the other hand, the multiple transfers, alignments, and repositionings of the materials to be mounted between the preheating and assembly stations not only increase the operation time but also introduce the loss of accuracy caused by manual operation or repetitive positioning.

[0047] Based on this, please refer to Figure 1 This invention provides a FA mounting device for optical modules, which mainly includes a carrier 1 and a clamp 2. The carrier 1 is used to carry the material 4 to be mounted and to preheat and keep it warm; the clamp 2 is used to position the carrier 1 at the assembly station and to tightly clamp the material 4 to be mounted.

[0048] The carrier 1 includes a heating section 10, which includes a processing position for holding the material 4 to be applied. At least the heating section 10 is provided with a temperature control module 13 for heating and monitoring the temperature of the area to keep the adhesive in the temperature range of optimal flowability (e.g., 35°C to 40°C).

[0049] The fixture 2 includes a clamping module 20, a positioning module 21, and a base 22. The carrier 1 is detachably mounted on the base 22 via the positioning module 21. The clamping module 20 is used to clamp the material 4 to be mounted, and the clamping module 20 is movably mounted on the fixture 2. Specifically, the clamping module 20 can be configured to move along the length direction (usually the long axis direction of the material) and the width direction (usually the short axis direction of the material or the opening and closing direction of the jaws) of the fixture 2, thereby flexibly adapting to materials 4 of different specifications or with positional deviations, and achieving precise and stable clamping.

[0050] Thus, this embodiment of the invention, through the positioning module 21 disposed on the fixture 2, enables the carrier 1 to be detachably installed onto the base 22 of the fixture 2 in a fast, repeatable, and highly accurate manner. This design allows the preheating process to be performed directly on the heating section 10 of the carrier 1 without occupying the assembly station's operating time on the fixture 2. When preheating is complete and assembly is required, the preheated carrier 1 can be quickly transferred and precisely positioned onto the fixture 2, achieving efficient integration and parallel operation of preheating and assembly, further improving the overall assembly efficiency of the FA mounting process in optical modules.

[0051] First, please refer to Figures 2-8 The specific structure of clamp 2 is described below. Optionally, clamp 2 is provided with a positioning module 21, a clamping module 20, and a base 22; wherein, both the positioning module 21 and the clamping module 20 are disposed on the base 22. The base 22 is a plate-shaped structure, providing a stable foundation for the entire clamping operation.

[0052] The positioning module 21 will be introduced first, such as... Figures 2-3 As shown, the positioning module 21 includes a positioning side plate 210. Specifically, a positioning side plate 210 is provided on at least one side of the base 22 along the width direction. When the carrier 1 is pushed into the assembly station of the fixture 2, the side wall of the carrier 1 is tightly fitted with the inner side wall of the positioning side plate 210, thereby restricting the position of the carrier 1 along the width direction. Preferably, positioning side plates 210 are provided on both sides of the base 22 along the width direction to constrain the carrier 1 from both sides, ensuring the stability and repeatability of positioning. The above design can avoid misalignment of the carrier 1 in the width direction, thereby achieving rapid and accurate positioning and installation of the carrier 1.

[0053] Please refer to Figures 4-6 The positioning module 21 includes a positioning element 211. In an optional embodiment, the positioning element 211 can be a positioning bead, which is disposed on the top surface of the base 22 and protrudes from the top surface. Correspondingly, a positioning hole 212 is provided on the bottom surface of the heating section 10 of the carrier 1. When the carrier 1 is placed on the base 22, the ball head of the positioning element 211 is pressed into the positioning hole 212 under the action of a spring (taking the positioning bead as an example, the positioning bead is usually a spring plunger structure with a spring). By means of the guiding effect of the ball surface and the edge of the hole and the final clamping force, the carrier 1 is accurately positioned and initially locked in the length and / or width directions. The above design allows the operator to complete the positioning and fixing simply by pushing the carrier 1 into place, without the need for additional locking operations, thus improving the convenience of operation and clamping efficiency. As an alternative, the protruding positioning element 211 can also be disposed on the bottom surface of the carrier 1, and a corresponding positioning hole 212 can be provided on the top surface of the base 22, with the same principle and effect.

[0054] As an optional embodiment, such as Figure 2 , Figures 5-6 As shown, the positioning module 21 may also include a positioning groove 213. The positioning groove 213 is set on the base 22 of the fixture 2 and is located in the central area of ​​the base 22. Positioning side plates 210 are respectively provided on both sides of the positioning groove 213 along the width direction. Positioning member 211 is set on the bottom surface of the positioning groove 213 and protrudes outward from the bottom surface of the positioning groove 213. The positioning slot 213 further optimizes the positioning operation of the carrier 1. After the operator moves the carrier 1 to a position close to the clamp 2, the operator first positions the carrier 1 in the width direction using the positioning side plates 210 on both sides, and then directly lowers the carrier 1 between the positioning side plates 210 on both sides. Since the positioning side plates 210 are set on both sides of the positioning slot 213 in the width direction, the carrier 1 is directly installed in the positioning slot 213 after contacting the base 22. The operator can directly push the carrier 1 to slide in the positioning slot 213 until the positioning part 211 falls into the positioning hole 212. At this time, the displacement of the carrier 1 in both the length and width directions is limited by the positioning module 21, realizing accurate and rapid positioning of the carrier 1.

[0055] Next, we will focus on one specific implementation of the clamping module 20. For example... Figure 2 , Figure 7 and Figure 8 As shown, the clamping module 20 includes a clamp 23, a mounting component 24, and a locking component 25. Specifically, the mounting component 24 can be a combined component formed by assembling one or more block-shaped components, with a receiving groove or through hole extending along the length direction inside. The clamp 23 can be at least two jaws for directly clamping the material 4 to be mounted, with its tail end passing through the receiving groove and able to move along the length direction within a certain range to coarsely adjust or adapt to the V-groove 41 on materials of different lengths. The locking component 25 can be a locking screw, which passes through the mounting component 24 along the height direction. When it is necessary to lock the jaws, the operator can rotate the locking component so that the end of the locking component 25 abuts against the clamp, applying downward pressure to generate sufficient friction, thereby restricting the movement of the clamp 23 along the length direction. The above method allows the position of the clamp 23 to be adjusted and can achieve reliable locking, ensuring the positioning accuracy of the material 4 to be mounted in the length direction.

[0056] Please continue to refer to this. Figure 2 , Figure 7 and Figure 8For scenarios requiring simultaneous clamping of the material to be mounted 4 from both sides, the clamp 23 further includes a first gripper 200 and a second gripper 201, and the clamping module 20 includes a first mounting member 202, a second mounting member 203, and a slide 206. In this embodiment, the first gripper 200 and the second gripper 201 together constitute a clamp 23 capable of clamping the material to be mounted 4. The first mounting member 202 and the second mounting member 203 are respectively used to fix the first gripper 200 and the second gripper 201. The first mounting member 202 is provided with a first receiving groove 2022, and the first gripper 200 passes through the first receiving groove 2022; the second mounting member 203 is provided with a second receiving groove 2032, and the second gripper 201 passes through the second receiving groove 2032. The slide 206 is disposed on the base 22, and the slide 206 is provided with a sliding groove 207 or guide rail extending in the width direction. The first mounting component 202 and the second mounting component 203 are slidably connected to the slide groove 207 via a slider or directly, allowing them to move towards or away from each other along the width direction. This drives the first gripper 200 and the second gripper 201 to perform clamping or releasing operations on the material to be mounted 4. The above design makes the clamping module 20 adjustable in the width direction, enabling it to adapt to materials 4 of different widths to be mounted.

[0057] As an optional embodiment, the mounting component 24 may include a limiting block and a connecting block connected to each other. The receiving groove of the receiving clamp 23 may be formed separately on the limiting block; it may also be formed separately on the connecting block; or it may be partially formed on the limiting block and partially formed on the connecting block. When the limiting block and the connecting block are connected to each other, they together form a complete receiving groove. The above-mentioned split or integrated structural design facilitates processing and assembly. Specifically, in this embodiment, the first mounting component 202 includes a first limiting block 2020 and a first connecting block 2021 connected to each other, and the first receiving groove 2022 is formed at the bottom of the first limiting block 2020; the second mounting component 203 includes a second limiting block 2030 and a second connecting block 2031 connected to each other, and the second receiving groove 2032 is formed at the bottom of the second limiting block 2030.

[0058] Exemplary, such as Figure 2 , Figures 7-8As shown, to enable the two grippers to actively open, the clamping module 20 includes a drive unit 208, which provides the power for the grippers 23 to engage. In a preferred embodiment, the drive unit 208 can be a pneumatic drive unit, such as a pneumatic gripper. The cylinder of the pneumatic gripper is fixed on the slide 206 or the base 22, and its piston rod or push block abuts against the first mounting member 202 or the second mounting member 203. When the drive unit 208 is ventilated and moves, it drives the mounting member 24 connected to it to move along the width direction, thereby moving the corresponding grippers to achieve clamping or releasing actions. Through pneumatic control, the clamping action can be completed quickly and powerfully. Furthermore, a micrometer can be installed on the cylinder of the drive unit 208, with the probe end of the micrometer abutting against the side of the first mounting member 202 or the second mounting member 203, to further optimize the control of the drive distance by the drive unit 208, thereby achieving precise control of the position of the grippers 23.

[0059] For the best options, please continue to refer to them. Figures 7-8 To enable the two grippers to automatically reset, the clamping module 20 includes a first elastic element 209, which can be a tension spring. The two ends of the first elastic element 209 are connected to the first mounting member 202 and the second mounting member 203, respectively, to provide a force that brings the first gripper 200 and the second gripper 201 closer together. In this embodiment, the first elastic element 209 allows the gripper 23 to be in a closed or clamped state when the drive member 208 is not working. When it is necessary to open the gripper 23 to insert or remove the material 4 to be mounted, the force provided by the drive member 208 overcomes the elasticity of the first elastic element 209 to open the gripper 23. When the drive member 208 removes the force, under the elasticity of the first elastic element 209, the gripper 23 automatically returns to its original position and applies a constant and gentle clamping force to the material 4 to be mounted. The above design not only improves the installability of the clamping module 20 and prevents the material to be mounted 4 from loosening due to the failure of the drive component 208, but also controls the clamping force through elasticity, replacing the excessive impact force that may be caused by relying solely on the cylinder, effectively reducing the breakage rate of the material to be mounted 4, and thus improving the clamping yield.

[0060] Secondly, please refer to Figures 9-13 The specific structure of carrier 1 is described below. Optionally, carrier 1 is equipped with a built-in temperature control module 13 and a pressure holding module 3. Carrier 1 is typically made of a material with good thermal stability and mechanical strength, such as aluminum alloy or stainless steel. Carrier 1 is generally elongated and includes a heating section 10, on which processing positions for supporting the material to be mounted 4 are provided. The top surface of the heating section 10 is typically machined with a groove or support surface that matches the shape and size of the material to be mounted 4 to ensure stable placement of the material to be mounted 4.

[0061] Please refer to Figure 9and Figure 10 This paper introduces an optional embodiment of the temperature control module 13, which is integrated inside the heating section 10 to achieve temperature control. The temperature control module 13 includes a heating element 130 and a temperature sensing element 131, such as... Figure 9 As shown, a first receiving hole 100 and a second receiving hole 101 are provided inside the heating section 10 of the carrier 1. The heating element 130 can be a heating rod, which passes through and is fixed in the first receiving hole 100. The temperature measuring element 131 can be a temperature sensing wire, whose temperature measuring end passes through the second receiving hole 101 to directly sense the temperature of the heating section 10. Optionally, the heating element 130 and the temperature measuring element 131 can be connected to an external controller to form a closed-loop temperature control system. During operation, the controller controls the output power of the heating element 130 according to the actual temperature fed back by the temperature measuring element 131, so that the temperature of the heating section 10 quickly reaches and stabilizes within a preset temperature range (e.g., 35℃~40℃). The preheating function is integrated into the processing position of the carrier 1, which does not occupy the assembly station time. When assembly is required, the preheated carrier 1 can be quickly installed onto the fixture 2. The adhesive maintains excellent fluidity at the preheating temperature, which not only makes the dispensing more uniform, but also speeds up the subsequent curing speed, which can significantly improve the overall assembly efficiency.

[0062] To further optimize thermal management and reduce heat diffusion to other areas of vehicle 1, such as Figures 9-10 As shown, the carrier 1 includes a heating section 10, a heat insulation section 11, and a main body 12. The heat insulation section 11 is preferably made of a material with low thermal conductivity, such as heat-insulating bakelite. The heat insulation section 11 is disposed between the heating section 10 and the main body 12 along its length. The main body 12 is mainly used to support and carry other auxiliary components. The heat insulation section 11 can effectively block the heat transfer from the heating section 10 to the main body 12 and the operator's hands, on the one hand preventing burns to the operator and improving operational safety; on the other hand, reducing heat loss and concentrating heat in the heating section 10, improving preset efficiency and temperature stability, while also preventing the main body 12 from deforming due to heat or causing adverse effects on other components.

[0063] Preferably, in this embodiment, such as Figure 10As shown, the first receiving hole 100 is sequentially disposed along the length of the heating section 10, the heat insulation section 11, and the main body 12. The first receiving hole 100 has a first aperture L1 in the heating section 10 and a second aperture L2 in the heat insulation section 11 and the main body 12, satisfying L1 < L2, and the first aperture matches the size of the heating element 130. In this way, the heating element 130 can be in close contact with the hole wall of the first receiving hole 100 in the heating section 10, thereby achieving efficient heat transfer; while the heating element 130 is spaced apart from the hole wall of the first receiving hole 100 in the heat insulation section 11 and the main body 12, which can reduce the heat transfer of the heating element 130 to the heat insulation section 11 and the main body 12, further optimizing the heat insulation effect on the carrier 1.

[0064] To apply continuous, stable, and uniform holding pressure to the material to be mounted 4 after dispensing, promote adhesive curing, and eliminate air bubbles, please refer to... Figures 11-13 The optical module mounting equipment includes a pressure holding module 3, which is rotatably connected to the carrier 1. Specifically, the pressure holding module 3 includes a flipping pressure plate 31, one end of which is rotatably connected to the main body 12 of the carrier 1 via a hinge. The pressure holding module 3 also includes a pressing component 30, which is disposed on the flipping pressure plate 31. When the material to be mounted 4 is loaded into the processing position of the carrier 1 and glue is applied, the operator flips the flipping pressure plate 31 so that it covers the material to be mounted 4. At this time, the pressing component 30 abuts against the material to be mounted 4 and provides it with uniform and controllable pressure to achieve pressure holding and curing.

[0065] In a preferred embodiment, the flip-over pressure plate 31 has a pressing position and a depressurizing position. When the flip-over pressure plate 31 rotates around the hinge to a horizontal position and covers the material 4 to be applied, the flip-over pressure plate 31 is in the pressing position. At this time, the pressing element 30 provided on the flip-over pressure plate 31 presses against the material 4 to be applied, providing pressure retention. When it is necessary to place or remove the material 4 to be applied, the flip-over pressure plate 31 is flipped upwards, moving away from the material 4 to be applied, i.e., the flip-over pressure plate 31 is in the depressurizing position. At this time, the pressing element 30 is away from the material 4 to make room for operation. Compared with the traditional split clamping plate that requires separate alignment and installation, the above-mentioned integrated flip-over design allows for faster operation. Only one flip-over action is needed to complete the pressing or releasing, further improving clamping efficiency.

[0066] In order to reliably lock the flip-over pressure plate 31 in the pressed position, such as Figure 13As shown, the pressure-holding module 3 includes a locking member 32, which is rotatably connected to the flipping pressure plate 31 via a pivot. The locking member 32 has a locking part 320, which can be a hook-shaped or protruding structure. A latch 14 is provided on the main body 12 of the carrier 1. When the flipping pressure plate 31 is rotated to the pressing position, the operator can move the locking member 32 to engage the locking part 320 with the latch 14, thereby firmly locking the flipping pressure plate 31 in the pressing position and preventing it from popping open due to vibration or accident during the pressure-holding process, thus affecting the pressure-holding effect.

[0067] Furthermore, the pressure-holding module 3 includes a second elastic element 33, specifically, the second elastic element 33 can be a compression spring. The second elastic element 33 is installed between the flipping pressure plate 31 and the locking element 32, with its two ends abutting against the inner walls of the locking element 32 and the flipping pressure plate 31, respectively. The second elastic element 33 can provide the locking element 32 with an elastic force tending towards the carrier 1. When the locking part 320 is engaged with the buckle 14, the elastic force of the second elastic element 33 helps to maintain the stability of the lock, preventing the locking element 32 from accidentally rotating and unlocking due to slight external force, further improving the reliability of the pressure-holding process.

[0068] exist Figure 12 In the illustrated embodiment, at least a portion of the pressing member 30 is elastic to achieve elastic pressure against the material 4 to be applied. In this embodiment, the pressing member 30 may include a set screw 301, a spring probe 300, and a connecting plate 302. The spring probe 300 has a compressible spring inside, and the connecting plate 302 has a mounting hole through which the spring probe 300 passes. The connecting plate 302 is connected to the flipping pressure plate 31. The pressing member 30 may include multiple spring probes 300, which are mounted in an array on the flipping pressure plate 31 and have their initial height adjusted and locked by the set screw 301. When the flipping pressure plate 31 is in the pressing position, the probe head of the spring probe 300 contacts the surface of the material 4 to be applied. If there is a slight difference in the height of the material 4 to be applied, the spring inside the spring probe 300 will compress to varying degrees, thereby providing a constant elastic pressure at each contact point. The above-mentioned elastic pressure method can ensure that the pressure is evenly distributed on the surface of the material to be mounted 4, avoiding excessive local pressure that could damage the material to be mounted 4. At the same time, it can also address the manufacturing tolerances of the material to be mounted 4 itself, ensuring the consistency of the pressure holding effect, which helps to improve product quality and yield.

[0069] Please refer to Figures 14-18 This invention also provides a method for mounting a fiber optic interface (FA) in an optical module, using the FA mounting equipment described above, and includes the following steps: Step S1: Heat and maintain the temperature of heating section 10 within a preset range (e.g., Figure 15 (as shown) For example, in a separate waiting area (i.e., the space where the carrier 1 is not connected to the clamp 2), the temperature of the heating section 10 is maintained between 35°C and 40°C by the temperature control module 13 located inside the heating section 10.

[0070] Step S2: Connect carrier 1 and fixture 2, and adjust the relative position of clamping module 20 on fixture 2 and material 4 to be mounted on carrier 1 until clamping module 20 and material 4 to be mounted are properly clamped (e.g., ...). Figure 16 and Figure 17 (as shown) Optionally, the preheated carrier 1 is docked with the clamp 2, and quickly and accurately positioned and installed onto the base 22 of the clamp 2 using the positioning module 21. Then, the relative position of the clamping module 20 and the material to be mounted 4 is adjusted until the clamping module 20 stably and controllably clamps the material to be mounted 4. The material to be mounted 4 can be a glass substrate 40 with a V-groove 41 on its surface.

[0071] Step S3: Apply adhesive to the surface of the material to be mounted 4, and the carrier 1 performs a pressure holding operation (e.g. Figures 17-18 (as shown) To illustrate, firstly, the optical fiber 42 is arranged in the V-groove 41 and glue is applied. Then, the glass cover plate 43 is placed on top, the pressure holding module 3 is flipped to the pressing position and locked to perform the pressure holding operation.

[0072] Step S4: Separate carrier 1 from clamp 2, and after the colloid has cured, remove the cured finished product.

[0073] Specifically, after carrier 1 is separated from clamp 2, carrier 1 is transferred to curing chamber for light curing. After the colloid is completely cured, the locking is released and the pressure holding module 3 is flipped to the decompression position to remove the cured finished product.

[0074] The FA mounting method in the aforementioned optical module separates the preheating function and assembly operation in time and space through the design of a detachable carrier 1 and clamp 2, reducing mutual interference, achieving high preheating efficiency without affecting the assembly cycle. Simultaneously, the movable clamping module 20 in both length and width directions, along with the elastic control of the clamping force, improves the adaptability of the clamping module 20 to materials 4 of different sizes and positions, and effectively protects the materials 4. Furthermore, the integrated flip-type pressure-holding module 3 simplifies the operation steps, eliminating the need for repeated disassembly. These improvements collectively enhance the overall efficiency and product yield in the optical module mounting process.

[0075] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A FA mounting device for an optical module, characterized in that, include: The carrier includes a heating section, at least the heating section is provided with a temperature control module, and the heating section includes a processing position for holding the material to be mounted; The fixture includes a clamping module, a positioning module, and a base; The carrier is detachably mounted on the base via the positioning module; the clamping module is used to clamp the material to be mounted, and the clamping module is movably mounted on the fixture to adapt to the processing position.

2. The FA mounting equipment in the optical module according to claim 1, characterized in that, The positioning module includes a positioning side plate; The positioning side plate is disposed on at least one side of the base along the width direction, and the side wall of the vehicle abuts against the positioning side plate to position the vehicle along the width direction.

3. The FA mounting equipment in the optical module according to claim 1 or 2, characterized in that, The positioning module also includes a positioning component; The positioning element is disposed on the top surface of the base and protrudes from the top surface; the bottom surface of the carrier is provided with a positioning hole, and the positioning element is inserted into the positioning hole; or, The positioning element is disposed on the bottom surface of the carrier and protrudes from the bottom surface. The top surface of the base is provided with a positioning hole, and the positioning element is inserted into the positioning hole.

4. The FA mounting equipment in the optical module according to claim 1, characterized in that, The clamping module includes a clamp, a mounting component, and a locking component; The mounting component is provided with a receiving groove extending along the length direction, and the clamp passes through the receiving groove and is movable within the receiving groove; The locking member is inserted into the mounting member and is arranged along the height direction; the locking member abuts against the clamp to restrict the movement of the clamp along the length direction.

5. The FA mounting equipment in the optical module according to claim 4, characterized in that, The mounting component includes a limiting block and a connecting block that are interconnected; The receiving groove is formed on the limiting block and / or the connecting block.

6. The FA mounting equipment in the optical module according to claim 4, characterized in that, The chuck includes a first jaw and a second jaw, and the clamping module includes a first mounting component, a second mounting component, and a slide. The first mounting component is provided with a first receiving groove, and the first gripper passes through the first receiving groove; the second mounting component is provided with a second receiving groove, and the second gripper passes through the second receiving groove. The slide is disposed on the base, and the slide has a groove extending along the width direction; the first mounting member and the second mounting member are slidably connected to the groove.

7. The FA mounting equipment in the optical module according to claim 6, characterized in that, The clamping module includes a driving component; The driving member abuts against the first mounting member or the second mounting member to drive the first gripper or the second gripper to move along the width direction.

8. The FA mounting equipment in the optical module according to claim 7, characterized in that, The clamping module includes a first elastic element; The two ends of the first elastic member are respectively connected to the first mounting member and the second mounting member to provide a force that brings the first gripper and the second gripper closer to each other.

9. The FA mounting equipment in the optical module according to claim 1, characterized in that, The temperature control module includes a heating element and a temperature measuring element; the heating section has a first receiving hole and a second receiving hole inside; The heating element passes through the first receiving hole, and the temperature measuring element passes through the second receiving hole.

10. The FA mounting equipment in the optical module according to claim 9, characterized in that, The vehicle includes a heat-insulating section and a main body; The heat insulation section is disposed between the heating section and the main body along the length direction.

11. The FA mounting equipment in the optical module according to claim 1, characterized in that, The FA mounting equipment in the optical module includes a pressure holding module, which is rotatably connected to the carrier; The pressure holding module includes a pressing component that abuts against the material to be mounted to provide pressure to the material.

12. The FA mounting equipment in the optical module according to claim 11, characterized in that, The pressure holding module includes a flip-over pressure plate; One end of the flipping pressure plate is rotatably connected to the carrier, and the pressing component is disposed on the flipping pressure plate; The flip-over pressure plate has a pressing position and a depressurization position; When the flip-over pressure plate is in the pressing position, the pressing component abuts against the material to be mounted; when the flip-over pressure plate is in the depressurization position, the pressing component moves away from the material to be mounted.

13. The FA mounting equipment in the optical module according to claim 12, characterized in that, The pressure-holding module includes a locking mechanism; The locking element is rotatably connected to the flipping pressure plate. The locking element has a locking part, and the carrier is provided with a buckle. When the flipping pressure plate is in the pressing position, the locking part engages with the buckle.

14. The FA mounting equipment in the optical module according to claim 13, characterized in that, The pressure-holding module includes a second elastic element; The second elastic element abuts against the locking element and the flipping pressure plate respectively.

15. The FA mounting equipment in the optical module according to claim 11, characterized in that, At least a portion of the pressing element is elastic, and the pressing element elastically presses against the material to be applied.

16. A method for mounting a fiber optic interface (FA) in an optical module, characterized in that, The FA mounting equipment in the optical module as described in any one of claims 1 to 15 includes: Heat and maintain the temperature of the heating section within a preset range; Connect the carrier to the fixture, and adjust the relative position of the clamping module on the fixture and the material to be mounted on the carrier until the clamping module clamps the material to be mounted. Adhesive is applied to the surface of the material to be mounted, and the carrier performs a pressure holding operation; Separate the carrier from the clamp, and after the colloid has cured, remove the cured product.

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