Array substrate, display panel and repairing method of display panel

Abstract

The application discloses an array substrate, a display panel and a repairing method of the display panel. The array substrate comprises a driving circuit layer and a binding electrode layer arranged on one side of the driving circuit layer. The binding electrode layer comprises a plurality of binding groups, each of which comprises at least three binding positions, each of which comprises a first electrode and a second electrode. Each binding group is provided with a repairing position corresponding to the binding group, and the at least three binding positions of the binding group are arranged around the repairing position. Alternatively, a repairing position is arranged between adjacent binding groups, and at least two binding groups are arranged around the repairing position. The repairing position comprises a first repairing electrode and a second repairing electrode. The first repairing electrode is electrically connected with the first electrode of the adjacent binding position. The second repairing electrode has a gap with the second electrode of each adjacent binding position. The display panel can be repaired through the repairing position, the yield of products is improved, and the pixel density of the display panel is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to an array substrate, a display panel, and a method for repairing the display panel. Background Technology

[0002] With the gradual development of micro LED display technology, the success rate of mass transfer is receiving increasing attention. The transfer yield of mass transfer directly affects the finished product yield and display effect of the panel, and LED repair is an important process to reduce losses and improve yield. Current technologies achieve LED repair by setting repair positions in the display panel. However, the existing repair position setting method results in a low pixel density (pixels per inch, PPI) of the display panel. Summary of the Invention

[0003] This invention provides an array substrate, a display panel, and a method for repairing the display panel, which can repair the display panel through repair points, thereby improving product yield and pixel density of the display panel.

[0004] According to one aspect of the present invention, an array substrate is provided, comprising:

[0005] A driving circuit layer and a bonding electrode layer disposed on one side of the driving circuit layer;

[0006] The bonding electrode layer includes multiple bonding groups, each bonding group includes at least three bonding positions, and each bonding position includes a first electrode and a second electrode; the first electrode and the second electrode are both electrically connected to the driving circuit layer.

[0007] Each of the aforementioned binding groups is provided with a corresponding repair bit, and at least three binding bits of the binding group are arranged around the repair bit; and / or, a repair bit is provided between adjacent binding groups, and at least two binding groups are arranged around the repair bit;

[0008] The repair site includes a first repair electrode and a second repair electrode. The first repair electrode is electrically connected to the first electrode of the adjacent binding site. The second repair electrode has a gap with the second electrode of each adjacent binding site.

[0009] Optionally, a conductive portion is provided at each of the gaps, and a first insulating layer is provided between the second electrode and the second repair electrode and the conductive portion. The vertical projection of the conductive portion on the bonding electrode layer covers the gap between the second repair electrode and the second electrode, and at least partially overlaps with both the second repair electrode and the second electrode.

[0010] Optionally, the first insulating layer is disposed in the same layer as at least one second insulating layer in the driving circuit layer, and the conductive portion is disposed in the same layer as at least one conductive layer in the driving circuit layer.

[0011] Optionally, the thickness of the first insulating layer is less than or equal to 1 micrometer.

[0012] Optionally, the second insulating layer is an organic insulating layer or an inorganic insulating layer.

[0013] Optionally, the second repair electrode includes a plurality of first connection terminals, and the second electrode includes a second connection terminal, with each first connection terminal and a second connection terminal of an adjacent second electrode disposed opposite to each other; the gap is present between the first connection terminal and the second connection terminal of the adjacent second electrode.

[0014] Optionally, the bonding electrode layer includes a plurality of bonding rows arranged sequentially along the second direction, and each bonding row includes a plurality of bonding groups arranged sequentially along the first direction; each bonding group includes three bonding positions, and the line connecting the centers of the three bonding positions in the same bonding group forms a triangle; wherein the first direction and the second direction intersect each other;

[0015] The binding groups in two adjacent binding rows are staggered along the first direction.

[0016] Optionally, in two adjacent binding rows, the binding groups in one binding row are located between two adjacent binding groups in the other binding row.

[0017] Optionally, the line connecting the centers of the three binding bits in the same binding group forms an equilateral triangle.

[0018] Optionally, the repair position is located in the central region of the triangle formed by the center lines connecting the centers of three binding positions in the same binding group; or, the repair position is located in the central region of the area between two adjacent binding groups along the first direction.

[0019] Optionally, the geometric center of the repair bit is located at the geometric center of the triangle formed by the center lines connecting the centers of the three binding bits in the same binding group, or the geometric center of the repair bit is located at the geometric center of the region between two adjacent binding groups along the first direction.

[0020] Optionally, the second electrode further includes a main body portion, which is electrically connected to the second connection terminal;

[0021] The vertical projection of the main body onto the driving circuit layer is trapezoidal, with the upper base of the trapezoid adjacent to the first electrode.

[0022] Optionally, the first electrodes of all binding bits are electrically connected to each other.

[0023] Optionally, the three binding positions of each binding group are located within a triangular region, and the first electrode of the three binding positions of each binding group is located at the three vertices of the triangular region.

[0024] Optionally, when at least three binding bits of the binding group are arranged around the repair bit, the first electrode covers the area between adjacent binding groups.

[0025] Optionally, the three binding bits of each binding group are located within an equilateral triangle region.

[0026] According to another aspect of the present invention, a display panel is provided, comprising a plurality of light-emitting units and an array substrate as described in any embodiment of the present invention;

[0027] Multiple light-emitting units are bound to the binding positions on the array substrate.

[0028] Optionally, at least one of the light-emitting units is bound to a repair bit adjacent to the binding bit to be repaired;

[0029] The first and second electrodes of the light-emitting unit bound to the repair position are electrically connected to the first and second repair electrodes of the repair position, respectively.

[0030] Optionally, the second repair electrode of the repair site is electrically connected to the second electrode of the bonding site to be repaired via a welding material, or the second repair electrode of the repair site is electrically connected to the second electrode of the bonding site to be repaired via a conductive part.

[0031] Optionally, at least three binding bits in each binding group are used to bind light-emitting units with the same emission color, and the light-emitting units bound in adjacent binding groups have different emission colors.

[0032] Optionally, along the first direction, each binding row includes a first binding group, a second binding group, and a third binding group arranged in sequence, wherein the light-emitting units bound in the first binding group, the second binding group, and the third binding group emit different colors.

[0033] According to another aspect of the present invention, a method for repairing a display panel is provided, applicable to the display panel described in any embodiment of the present invention, the repair method comprising:

[0034] Determine the location of the binding bit to be repaired;

[0035] The second repair electrode of the repair bit adjacent to the binding bit to be repaired is electrically connected to the second electrode of the binding bit to be repaired;

[0036] The new light-emitting unit is bound to the repair bit adjacent to the binding bit to be repaired.

[0037] Optionally, electrically connecting the second repair electrode of the repair site adjacent to the bonding site to be repaired and the second electrode of the bonding site to be repaired includes:

[0038] The second repair electrode of the repair position adjacent to the bonding position to be repaired and the second electrode of the bonding position to be repaired are electrically connected by welding material; or, by laser drilling process, holes are drilled in the first insulating layer between the second repair electrode of the repair position adjacent to the bonding position to be repaired and the second electrode of the bonding position to be repaired and the conductive part, so that both the second repair electrode and the second electrode are in contact with the conductive part.

[0039] In this embodiment of the invention, a repair position is set for each bonding group, with at least three bonding positions of the bonding group surrounding the repair position; and / or, a repair position is set between adjacent bonding groups, with at least two bonding groups surrounding the repair position; a first repair electrode is electrically connected to the first electrode of the adjacent bonding position, and a second repair electrode has a gap with the second electrode of each adjacent bonding position. When the repair position is not used, the second repair electrode is insulated from each second electrode. Multiple bonding positions share one repair position. When the light-emitting unit bonded to the bonding position cannot emit light normally or the light-emitting unit is not properly bonded to the bonding position, the light-emitting unit is repaired by bonding the light-emitting unit to the repair position, while reducing the number of repair positions, increasing the density of bonding positions on the array substrate, and increasing the pixel density of the display panel.

[0040] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of a display panel in the prior art.

[0043] Figure 2 This is a schematic diagram of an array substrate provided in an embodiment of the present invention.

[0044] Figure 3 yes Figure 2 A magnified view of a portion of the array substrate.

[0045] Figure 4This is a schematic diagram of another array substrate provided in an embodiment of the present invention.

[0046] Figure 5 yes Figure 4 A magnified view of a portion of the array substrate.

[0047] Figure 6 This is a partial enlarged view of another array substrate provided in an embodiment of the present invention.

[0048] Figure 7 This is a partial enlarged view of another array substrate provided in an embodiment of the present invention.

[0049] Figure 8 This is a cross-sectional view of an array substrate provided in an embodiment of the present invention.

[0050] Figure 9 This is a schematic diagram of a display panel provided in an embodiment of the present invention.

[0051] Figure 10 This is a schematic diagram of another display panel provided in an embodiment of the present invention.

[0052] Figure 11 This is a schematic diagram of a connection method between a second repair electrode and a second electrode provided in an embodiment of the present invention.

[0053] Figure 12 This is a schematic diagram of another connection method between the second repair electrode and the second electrode provided in an embodiment of the present invention.

[0054] Figure 13 This is a flowchart of a method for repairing a display panel provided in an embodiment of the present invention. Detailed Implementation

[0055] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0056] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0057] Figure 1 This is a schematic diagram of a display panel in the prior art, for reference. Figure 1 In existing display panels, the light-emitting units 60 are arranged in a matrix, and each light-emitting unit 60 is set with a corresponding repair position, which makes it impossible for the display panel to achieve a higher PPI.

[0058] To address the above problems, embodiments of the present invention provide an array substrate. Figure 2 This is a schematic diagram of an array substrate provided in an embodiment of the present invention. Figure 3 yes Figure 2 A magnified view of a portion of the array substrate. Figure 4 This is a schematic diagram of another array substrate provided in an embodiment of the present invention. Figure 5 yes Figure 4 A partial enlarged view of the array substrate, for reference. Figures 2-5 The array substrate includes:

[0059] The driving circuit layer 10 and the bonding electrode layer 20 disposed on one side of the driving circuit layer 10;

[0060] The bonding electrode layer 20 includes multiple bonding groups 21, each bonding group 21 includes at least three bonding positions 210, and each bonding position 210 includes a first electrode 211 and a second electrode 212; the first electrode 211 and the second electrode 212 are both electrically connected to the driving circuit layer 10.

[0061] Each binding group 21 is provided with a corresponding repair bit 30, and at least three binding bits 210 of the binding group 21 are provided around the repair bit 30; and / or, a repair bit 30 is provided between adjacent binding groups 21, and at least two binding groups 21 are provided around the repair bit 30;

[0062] The repair position 30 includes a first repair electrode 31 and a second repair electrode 32. The first repair electrode 31 is electrically connected to the first electrode 211 of the adjacent binding position 210. The second repair electrode 32 has a gap with the second electrode 212 of each adjacent binding position 210.

[0063] The driving circuit layer 10 includes multiple driving circuits, each corresponding to a bonding bit 210. The bonding bit 210 is used to bond light-emitting units, which can be LEDs or micro LEDs, etc. The driving circuit outputs a driving signal to the light-emitting unit bonded to the bonding bit 210, driving the light-emitting unit to emit light. A gap exists between the second repair electrode 32 and the second electrode 212 of each adjacent bonding bit 210, ensuring that when the repair bit 30 is not in use, the second repair electrode 32 and adjacent second electrodes 212 are mutually insulated. Multiple bonding bits 210 adjacent to the repair bit 30 can share the repair bit 30.

[0064] When a light-emitting unit bound to a binding bit 210 malfunctions and fails to emit light, or when a light-emitting unit is not bound to a binding bit 210, that binding bit 210 becomes a binding bit to be repaired. A light-emitting unit is bound to a repair bit 30 adjacent to the binding bit to be repaired. The light-emitting unit bound to the repair bit 30 emits the same color as the light-emitting unit bound to the binding bit 210 to be repaired. The second repair electrode 32 of the repair bit 30 is electrically connected to the second electrode 212 of the binding bit 210 to be repaired, enabling the light-emitting unit bound to the repair bit 30 to receive the drive signal sent by the drive circuit connected to the binding bit 210 to be repaired, thus allowing the light-emitting unit on the repair bit 30 to emit light normally. For example, the second repair electrode 32 can be electrically connected to the second electrode 212 of the bonding position 210 to be repaired using welding material. Alternatively, a conductive part 40 can be provided at the gap between the second repair electrode 32 and each adjacent second electrode 212, and an insulating layer can be provided between the conductive part and the second repair electrode 32 and the second electrode 212. When the repair position 30 is not used, the second repair electrode 32 is insulated from the second electrode 212. When the repair position 30 needs to be used, holes are drilled in the insulating layer by laser drilling, so that both the second repair electrode 32 and the second electrode 212 are electrically connected to the conductive part 40, thereby realizing the electrical connection between the second repair electrode 32 and the second electrode 212.

[0065] Each binding group 21 includes at least three binding bits 210, that is, each binding group 21 may include three or more binding bits 210. The at least three binding bits 210 may be arranged in a polygonal arrangement, for example, in a triangular arrangement.

[0066] Each binding group 21 is provided with a corresponding repair bit 30, and at least three binding bits 210 of the binding group 21 are set around the repair bit 30; and / or, a repair bit 30 is set between adjacent binding groups 21, and at least two binding groups 21 are set around the repair bit 30, that is: only one repair bit 30 is provided for each binding group 21, and at least three binding bits 210 of the binding group 21 are set around the repair bit 30; or only one repair bit 30 is set between adjacent binding groups 21, and at least two binding groups 21 are set around the repair bit 30; or each binding group 21 is provided with a corresponding repair bit 30, and at least three binding bits 210 of the binding group 21 are set around the repair bit 30, and a repair bit 30 is set between adjacent binding groups 21, and at least two binding groups 21 are set around the repair bit 30.

[0067] When at least three binding positions 210 of the binding group 21 are set around the repair position 30, the binding positions 210 adjacent to the repair position 30 include each binding position 210 set around the repair position 30. The binding positions 210 of a binding group 21 share a repair position 30. When the light-emitting unit bound on any binding position 210 of the binding group 210 cannot emit light normally or is not bound, that is, when there is a binding position 210 to be repaired in the binding group 21, the light-emitting unit can be bound on the repair position 30 corresponding to the binding group 210, and the second repair electrode 32 of the repair position 30 is electrically connected to the second electrode 212 of the binding position 210 to be repaired in the binding group 21.

[0068] A repair position 30 is provided between adjacent binding groups 21. When at least two binding groups 21 surround the repair position 30, the binding positions 210 adjacent to the repair position 30 in the binding group 21 surrounding the repair position 30 share one repair position 30. When there is a binding position 210 to be repaired among the binding positions 210 surrounding the repair position 30, a light-emitting unit can be bound to the repair position 30, and the second repair electrode 32 of the repair position 30 is electrically connected to the second electrode 212 of the binding position 210 to be repaired in the binding group 21.

[0069] In this embodiment of the invention, each binding group 21 is provided with a corresponding repair position 30, and at least three binding positions 210 of the binding group 21 surround the repair position 30; and / or, a repair position 30 is provided between adjacent binding groups 21, and at least two binding groups 21 surround the repair position 30; the first repair electrode 31 is electrically connected to the first electrode 211 of the adjacent binding position 210, and the second repair electrode 32 has a gap with the second electrode 212 of each adjacent binding position 210. When the repair position 30 is not used, the second repair electrode 32 is insulated from each second electrode 212. Multiple binding positions 210 share one repair position 30. When the light-emitting unit bound on the binding position 210 cannot emit light normally or the light-emitting unit is not properly bound on the binding position 210, the light-emitting unit is bound on the repair position 30, thereby repairing the light-emitting unit, reducing the number of repair positions 30, increasing the density of binding positions 210 on the array substrate, and increasing the pixel density of the display panel.

[0070] Figure 6 This is a partially enlarged view of another array substrate provided in an embodiment of the present invention. Figure 7 This is a partially enlarged view of another array substrate provided in an embodiment of the present invention. Figure 8 This is a cross-sectional view of an array substrate provided in an embodiment of the present invention. Optionally, based on the above embodiment, refer to... Figures 6-8 A conductive part 40 is provided at each gap. A first insulating layer 50 is provided between the second electrode 212 and the second repair electrode 32 and the conductive part 40. The vertical projection of the conductive part 40 on the bonding electrode layer covers the gap between the second repair electrode 32 and the second electrode 212, and at least partially overlaps with the second repair electrode 32 and the second electrode 212.

[0071] Specifically, the conductive part 40 can be made of metal or other conductive materials such as metal oxide. The vertical projection of the conductive part 40 onto the bonding electrode layer covers the gap between the second repair electrode 32 and the second electrode 212, and extends from the gap to both sides of the gap, at least partially overlapping with the second electrode 212. The conductive part 40 can be disposed on the side of the bonding electrode layer adjacent to the driving circuit layer 10, or on the side of the bonding electrode layer away from the driving circuit layer 10. When it is necessary to bond a light-emitting unit to the repair position 30, through-holes can be formed in the first insulating layer 50 between the conductive parts 40 and the second repair electrode 32 by laser drilling, and through-holes can also be formed in the first insulating layer 50 between the second electrode 212 of the bonding position 210 to be repaired and the corresponding conductive part 40, so that the conductive part 40 is electrically connected to the second electrode 212 and the second repair electrode 32. This allows the second repair electrode 32 to receive the driving signal sent by the driving circuit connected to the bonding position 210 to be repaired, enabling the light-emitting unit bonded to the repair position 30 to emit light normally.

[0072] When the conductive part 40 is disposed on the side of the bonding electrode layer adjacent to the driving circuit layer 10, during laser drilling, the laser passes through the second repair electrode 32 and acts on the first insulating layer 50, forming a through-hole in the first insulating layer 50. Simultaneously, the second repair electrode 32 melts and flows into the through-hole, electrically connecting with the conductive part 40. Similarly, when the laser passes through the second electrode 212 and acts on the first insulating layer 50, forming a through-hole in the first insulating layer 50, the second repair electrode 212 melts and flows into the through-hole, electrically connecting with the conductive part 40.

[0073] When the conductive part 40 is disposed on the side of the bonding electrode layer away from the driving circuit layer 10, during laser drilling, the laser passes through the conductive part 40 and acts on the first insulating layer 50, forming a through hole in the first insulating layer 50 adjacent to the second repair electrode 32. At the same time, the conductive part 40 melts and flows into the through hole, electrically connecting with the second repair electrode 32. Similarly, when the laser passes through the conductive part 40 and acts on the first insulating layer 50, forming a through hole in the first insulating layer 50 adjacent to the second electrode 212, the conductive part 40 melts and flows into the through hole, electrically connecting with the second electrode 212.

[0074] In this embodiment, a conductive part 40 is provided at each gap, and a first insulating layer 50 is provided between the conductive part 40 and the second electrode 212 and the second repair electrode 32. This ensures that the second electrode 212 and the second repair electrode 32 are mutually insulated under normal circumstances. When the repair position 30 needs to be used, the second repair electrode 32 of the repair position 30 is connected to the corresponding second electrode 212 as needed, so that the repair position 30 can be shared by multiple binding positions 210. Furthermore, when the repair position 30 needs to be used, the second repair electrode 32 and the second electrode 212 can be electrically connected through the conductive part 40 by laser drilling, making the repair process simple.

[0075] Based on the above embodiments, optionally, the first insulating layer 50 is disposed in the same layer as at least one second insulating layer 11 in the driving circuit layer 10, and the conductive part 40 is disposed in the same layer as at least one conductive layer 12 in the driving circuit layer 10.

[0076] Specifically, the driving circuit layer 10 includes multiple conductive layers 12 and multiple second insulating layers 11. For example, the driving circuit layer 10 may include metal layers such as a gate metal layer, source / drain metal layers, capacitor plate layers, and signal line layers. The conductive portion 40 can be disposed on the same layer as any of the metal layers. A second insulating layer 11 is provided between adjacent metal layers in the driving circuit layer 10, and a second insulating layer 11 for planarization is also provided on the surface of the driving circuit layer 10 adjacent to the bonding electrode layer 20. The first insulating layer 50 can be disposed on the same layer as any of the second insulating layers 11 between the conductive layers 12 and the bonding electrode layer 20 disposed on the same layer as the conductive portion 40.

[0077] By setting the first insulating layer 50 to be disposed in the same layer as at least one second insulating layer 11 in the driving circuit layer 10, and the conductive part 40 to be disposed in the same layer as at least one conductive layer 12 in the driving circuit layer 10, the first insulating layer 50 and the second insulating layer 11 in the driving circuit layer 10 can be made of the same material and prepared in the same process, and the conductive part 40 and the conductive layer 12 in the driving circuit layer 10 can be made of the same material and prepared in the same process, thereby reducing process costs.

[0078] Based on the above embodiments, optionally, the thickness of the first insulating layer 50 is less than or equal to 1 micrometer.

[0079] Specifically, if the thickness of the first insulating layer 50 is too thick, it is not easy to completely penetrate it through processes such as laser drilling, which may affect the connection stability between the conductive part 40 and the second electrode 212 and the second repair electrode 32. By setting the thickness of the first insulating layer 50 to be less than or equal to 1 micrometer, it is ensured that the first insulating layer 50 can be quickly and completely penetrated, so that the second repair electrode 32 and the conductive part 40 are stably connected, and the second electrode 212 and the conductive part 40 are stably connected.

[0080] Based on the above embodiments, optionally, the second insulating layer 60 is an organic insulating layer or an inorganic insulating layer.

[0081] Specifically, the second insulating layer 60 can be an inorganic insulating layer such as silicon oxide or silicon nitride, or an organic insulating layer such as polyimide.

[0082] Based on the above embodiments, optionally, the second repair electrode 32 includes a plurality of first connection ends 71, and the second electrode 212 includes a second connection end 72, with each first connection end 71 and a second connection end 72 of an adjacent second electrode 212 being disposed opposite to each other; there is a gap between the first connection end 71 and the second connection end 72 of the adjacent second electrode 212.

[0083] Specifically, the number of first connection ends 71 ​​of the second repair electrode 32 is equal to the number of second electrodes 212 adjacent to the second repair electrode 32. Each first connection end 71 extends to a second electrode 212 and is disposed opposite to a second connection end 72. By configuring the first connection ends 71 ​​and the second connection ends 72, the gap between the second repair electrode 32 and the second electrode 212 is smaller, making it easier to electrically connect the second repair electrode 32 and the second electrode 212 when the repair position 30 is in use. For example, when the first connection ends 71 ​​and the second connection ends 72 are electrically connected using welding material, less welding material is needed to electrically connect the first connection ends 71 ​​and the second connection ends 72; when the first connection ends 71 ​​and the second connection ends 72 are connected using the conductive part 40, the smaller size of the conductive part 40 is sufficient to electrically connect the first connection ends 71 ​​and the second connection ends 72.

[0084] Based on the above embodiments, optionally, refer to Figure 2 and Figure 3 The bonding electrode layer 20 includes multiple bonding rows 200 arranged sequentially along the second direction Y, and each bonding row 200 includes multiple bonding groups 21 arranged sequentially along the first direction X; each bonding group 21 includes three bonding positions 210, and the line connecting the centers of the three bonding positions 210 in the same bonding group 21 forms a triangle; wherein the first direction X and the second direction Y intersect each other; the bonding groups 21 in two adjacent bonding rows 200 are staggered along the first direction X.

[0085] Specifically, the three binding bits 210 in each binding group 21 can bind light-emitting units of the same color, and adjacent binding groups 21 bind light-emitting units of different colors respectively. The binding groups 21 in two adjacent binding rows 200 are staggered along the first direction X, and the light-emitting units bound by the three adjacent binding bits 210 in three adjacent binding groups 21 in two adjacent binding rows 200 can form a pixel unit.

[0086] The line connecting the centers of the three binding positions 210 in the same binding group 21 forms a triangle, so that when the repair position 30 is set in the binding group 21 surrounded by the three binding positions 210, or when the repair position 30 is set between adjacent binding groups 21, it will not affect the space occupied by the binding positions 210 on the array substrate. This allows more binding positions 210 to be set on the array substrate, increasing the density of binding positions 210 on the array substrate and increasing the PPI of the display panel.

[0087] Based on the above embodiments, optionally, in two adjacent binding rows 200, the binding group 21 in one binding row 200 is located between two adjacent binding groups 21 in the other binding row 200.

[0088] This setting makes the distance between the three adjacent binding bits 210 in the three adjacent binding groups 21 in two adjacent binding rows 200 closer, and the pixel unit composed of the light-emitting units bound on the three binding bits 210 has a better light-emitting effect.

[0089] For example, the geometric center of the binding group 21 in one of the two adjacent binding rows 200 can be set to be located on the perpendicular bisector of the line connecting the geometric centers of the two adjacent binding groups 21 in the other binding row 200.

[0090] Based on the above embodiments, optionally, the line connecting the centers of the three binding bits 210 in the same binding group 21 is an equilateral triangle.

[0091] This configuration makes the arrangement of each bonding position 210 on the array substrate more uniform, the arrangement of light-emitting units bonded to the bonding position 210 more uniform, the arrangement of pixel units more uniform, and the light emission uniformity of the display panel better.

[0092] Based on the above embodiments, optionally, the repair bit 30 is located in the central region of the triangle formed by the center lines connecting the centers of the three binding bits 210 in the same binding group 21; or, the repair bit 30 is located in the central region of the region between two adjacent binding groups 21 along the first direction X.

[0093] The central region of the triangle refers to the area near the geometric center of the triangle. Similarly, the central region between two adjacent binding groups 21 refers to the area near the geometric center of the area between two adjacent binding groups 21. The repair position 30 is positioned within the central region of the triangle formed by the center lines connecting the centers of three binding positions 210 within the same binding group 21, ensuring that the distance between the repair position 30 and the three binding positions 210 in the same binding group 21 is similar or equal, thus achieving a good repair effect for each binding position 210 in that binding group 21. Furthermore, the repair position 30 is positioned within the central region of the area between two adjacent binding groups 21 along the first direction X, ensuring that the distance between the repair position 30 and its adjacent binding positions 210 is similar or equal, thus achieving a good repair effect for each adjacent binding position 210.

[0094] Based on the above embodiments, optionally, the geometric center of the repair bit 30 is located at the geometric center of the triangle formed by the center lines connecting the three binding bits 210 in the same binding group 21, or the geometric center of the repair bit 30 is located at the geometric center of the region between two adjacent binding groups 210 along the first direction X.

[0095] This setting ensures that the distance between the repair bit 30 and each adjacent binding bit 210 is the same, resulting in a better repair effect of the repair bit 30 on each adjacent binding bit 210.

[0096] Based on the above embodiments, optionally, refer to Figure 6 The second electrode 212 also includes a main body 73, which is electrically connected to the second connecting end 72;

[0097] The vertical projection of the main body 73 onto the drive circuit layer 10 is trapezoidal, and the upper base of the trapezoid is adjacent to the first electrode 211.

[0098] Specifically, the upper base of the trapezoid is the shorter base of the trapezoid, and the upper base of the trapezoid is adjacent to the first electrode 211. The longer base of the main body 73 is located on the side away from the first electrode 211. This allows the light-emitting unit to still be bonded to the first electrode 211 and the second electrode 212 even if the position of the light-emitting unit is shifted to a certain extent when bonding the light-emitting unit, thereby improving the transfer yield.

[0099] Based on the above embodiments, optionally, the first electrodes 211 of all binding bits 210 are electrically connected to each other.

[0100] Specifically, the first electrodes 211 of all the binding positions 210 are electrically connected to each other and connected to the same potential. The driving circuit sends a driving signal to the second electrode 212 by adjusting the signal, thereby controlling the light-emitting units bound on the binding positions 210 to emit light of different brightness.

[0101] Based on the above embodiments, optionally, refer to Figure 6 Each binding group 21 has three binding positions 210 located within a triangular region, and the first electrode 211 of the three binding positions 210 is located at the three vertices of the triangular region.

[0102] This configuration allows for a smaller footprint for the bonding group 210, enabling a higher density of bonding groups 21. This further increases the density of bonding positions 210 on the array substrate, improves the density of light-emitting units, and increases the PPI of the display panel. Furthermore, the first electrode 211 is located at the apex of the triangular region, meaning the second electrode 212 is closer to the center of the triangular region, making it easier for the second electrode 212 to connect to the second repair electrode 32. Additionally, the distance between adjacent bonding positions 210 in adjacent bonding groups 21 is greater, avoiding potential interference during the transfer process.

[0103] Optional, see reference Figure 6 When at least three binding positions 210 of the binding group 21 are arranged around the repair position 30, the first electrode 211 covers the area between the binding groups 211.

[0104] This configuration further ensures that even if the position of the light-emitting unit shifts to a certain extent, the light-emitting unit can still be bound to the first electrode 211 and the second electrode 212, thereby improving the transfer yield.

[0105] Based on the above embodiments, optionally, the three binding bits 210 of each binding group 21 are located within an equilateral triangle region.

[0106] This configuration allows for a tighter arrangement of the bonding groups 210, which can further increase the density of the bonding positions 210 on the array substrate, increase the density of the light-emitting units, and increase the PPI of the display panel.

[0107] This invention also provides a display panel. Figure 9 This is a schematic diagram of a display panel provided in an embodiment of the present invention. Figure 10 This is a schematic diagram of another display panel provided in an embodiment of the present invention. (See reference) Figure 9 and Figure 10 The display panel includes multiple light-emitting units 60 and an array substrate as described in any embodiment of the present invention;

[0108] Multiple light-emitting units 60 are bound to the binding positions on the array substrate.

[0109] Specifically, the light-emitting unit 60 is bound to the bonding site by a conductive material.

[0110] In this embodiment of the invention, a repair position is set for each binding group, and at least three binding positions of the binding group surround the repair position 30; and / or, a repair position 30 is set between adjacent binding groups 21, and at least two binding groups surround the repair position 30; the first repair electrode is electrically connected to the first electrode of the adjacent binding position, and there is a gap between the second repair electrode and the second electrode 212 of each adjacent binding position. When the repair position 30 is not used, the second repair electrode is insulated from each second electrode. Multiple binding positions share one repair position 30. When the light-emitting unit 60 bound on the binding position cannot emit light normally or the light-emitting unit 60 is not properly bound on the binding position, the light-emitting unit 60 is bound on the repair position 30, thereby repairing the light-emitting unit 60 while reducing the number of repair positions 30, increasing the density of binding positions in the display panel, increasing the density of light-emitting units 60, and increasing the pixel density of the display panel.

[0111] Based on the above embodiments, optionally, at least one light-emitting unit 60 is bound to a repair position 30 adjacent to the binding position 70 to be repaired;

[0112] The first electrode and the second electrode of the light-emitting unit 60 bound to the repair position 30 are electrically connected to the first repair electrode and the second repair electrode of the repair position 30, respectively.

[0113] For details, please refer to Figure 9 and Figure 10 Light-emitting unit 60 is bound to repair unit 30 adjacent to the binding unit 70 to be repaired. The light-emitting unit 60 on the repair unit 60 has the same light-emitting color as the light-emitting unit 60 on the binding unit 70 to be repaired that failed to be bound.

[0114] Figure 11 This is a schematic diagram illustrating a connection method between a second repair electrode and a second electrode according to an embodiment of the present invention. Figure 12 This is a schematic diagram illustrating another connection method between the second repair electrode and the second electrode provided in an embodiment of the present invention. Optionally, based on the above embodiments, refer to... Figure 11 and Figure 12 The second repair electrode 32 of the repair position is electrically connected to the second electrode 212 of the bonding position to be repaired via the welding material 41, or the second repair electrode 32 of the repair position is electrically connected to the second electrode 212 of the bonding position to be repaired via the conductive part 40.

[0115] For details, please refer to Figure 11 The welding material 41 can be directly placed on the surface of the second electrode 212 and the second repair electrode 32, and between the second electrode 212 and the second repair electrode 32, through a welding process, thereby achieving an electrical connection between the second electrode 212 and the second repair electrode 32. (Reference) Figure 12Alternatively, laser drilling can be used to make the second electrode 212 contact and electrically connect with the conductive part 40, and the second repair electrode 32 contact and electrically connect with the conductive part 40, thereby realizing the electrical connection between the second electrode 212 and the second repair electrode 32.

[0116] Based on the above embodiments, optionally, further reference can be made. Figure 4 and Figure 10 Each binding group 21 has at least three binding bits 210 for binding light-emitting units 60 with the same light emission color, and the light emission colors of the light-emitting units 60 bound in adjacent binding groups 21 are different.

[0117] For details, please refer to Figure 4 and Figure 10 One light-emitting unit group 600 corresponds to one binding group 21. At least three light-emitting units 60 bound to a binding group 21 constitute one light-emitting unit group 600. The light-emitting units 60 within the same light-emitting unit group 600 emit the same color, while the light-emitting units 60 in adjacent light-emitting unit groups 600 emit different colors. Adjacent binding groups 21 include binding groups 21 adjacent along a first direction X and adjacent along a second direction Y. The light-emitting unit groups 600 adjacent along the first direction X and the second direction Y emit different colors. Adjacent light-emitting units 60 within adjacent light-emitting unit groups 600 can form a pixel unit 80.

[0118] Based on the above embodiments, optionally, along the first direction X, each binding row 200 includes a first binding group 61, a second binding group 62 and a third binding group 63 arranged in sequence, and the light-emitting units 60 bound by the first binding group 61, the second binding group 62 and the third binding group 63 have different light-emitting colors.

[0119] Specifically, in two adjacent binding rows 200, three adjacent light-emitting units 60 in the adjacent first binding group 61, second binding group 62 and third binding group 63 form a pixel unit 80.

[0120] This invention also provides a method for repairing a display panel, applicable to the display panel described in any embodiment of this invention. Figure 13 This is a flowchart of a method for repairing a display panel according to an embodiment of the present invention, see reference. Figure 13 The repair method includes:

[0121] S110. Determine the location of the binding bit to be repaired.

[0122] S120. Electrically connect the second repair electrode of the repair site adjacent to the binding site to be repaired and the second electrode of the binding site to be repaired.

[0123] S1310. Bind the new light-emitting unit to the repair bit adjacent to the binding bit to be repaired.

[0124] Specifically, the binding positions to be repaired are either the binding positions where the light-emitting units that are not emitting light are located, or the binding positions where no light-emitting units are bound. After the light-emitting units are transferred, a lighting test can be performed on the display panel to locate the binding positions that are not emitting light and determine the location of the binding positions to be repaired.

[0125] The method for repairing the display panel in this embodiment is based on the same inventive concept as the array substrate provided in any embodiment of the present invention and has the same beneficial effects. For technical details not covered in this embodiment, please refer to the array substrate described in any embodiment of the present invention.

[0126] Based on the above embodiments, optionally, the second repair electrode of the repair site adjacent to the bonding site to be repaired and the second electrode of the bonding site to be repaired are electrically connected, including:

[0127] The second repair electrode of the repair position adjacent to the bonding position to be repaired and the second electrode of the bonding position to be repaired are electrically connected by welding material; or, by laser drilling process, holes are drilled in the first insulating layer between the second repair electrode of the repair position adjacent to the bonding position to be repaired and the second electrode of the bonding position to be repaired and the conductive part, so that both the second repair electrode and the second electrode are in contact with the conductive part.

[0128] Specifically, welding can be used to directly place welding material on the surfaces of the second electrode and the second repair electrode, and between the two electrodes, to achieve electrical connection. Alternatively, laser drilling can be used to make contact and electrical connection between the second electrode and the conductive part, and between the second repair electrode and the conductive part, thus achieving electrical connection between the two electrodes.

[0129] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0130] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An array substrate, characterized in that, include: A driving circuit layer and a bonding electrode layer disposed on one side of the driving circuit layer; The bonding electrode layer includes multiple bonding groups, each bonding group includes at least three bonding positions, and each bonding position includes a first electrode and a second electrode; the first electrode and the second electrode are both electrically connected to the driving circuit layer. Each of the aforementioned binding groups is provided with a corresponding repair bit, and at least three binding bits of the binding group are arranged around the repair bit; and / or, a repair bit is provided between adjacent binding groups, and at least two binding groups are arranged around the repair bit; The repair site includes a first repair electrode and a second repair electrode. The first repair electrode is electrically connected to the first electrode of the adjacent binding site. The second repair electrode has a gap with the second electrode of each adjacent binding site.

2. The array substrate according to claim 1, characterized in that: A conductive portion is provided at each of the gaps, and a first insulating layer is provided between the second electrode and the second repair electrode and the conductive portion. The vertical projection of the conductive portion on the bonding electrode layer covers the gap between the second repair electrode and the second electrode, and at least partially overlaps with both the second repair electrode and the second electrode. Preferably, the first insulating layer is disposed in the same layer as at least one second insulating layer in the driving circuit layer, and the conductive part is disposed in the same layer as at least one conductive layer in the driving circuit layer; Preferably, the thickness of the first insulating layer is less than or equal to 1 micrometer; Preferably, the second insulating layer is an organic insulating layer or an inorganic insulating layer; Preferably, the second repair electrode includes a plurality of first connection ends, and the second electrode includes a second connection end, with each first connection end and a second connection end of an adjacent second electrode disposed opposite to each other; the gap is present between the first connection end and the second connection end of the adjacent second electrode.

3. The array substrate according to claim 1, characterized in that: The bonding electrode layer includes multiple bonding rows arranged sequentially along a second direction, and each bonding row includes multiple bonding groups arranged sequentially along a first direction; each bonding group includes three bonding positions, and the line connecting the centers of the three bonding positions in the same bonding group forms a triangle; wherein the first direction and the second direction intersect each other; The binding groups in two adjacent binding rows are staggered along the first direction; Preferably, in two adjacent binding rows, the binding groups in one binding row are located between two adjacent binding groups in the other binding row; Preferably, the line connecting the centers of the three binding positions in the same binding group forms an equilateral triangle.

4. The array substrate according to claim 3, characterized in that: The repair position is located in the central region of the triangle formed by the center lines connecting the centers of three binding positions in the same binding group; or, the repair position is located in the central region of the area between two adjacent binding groups along the first direction. Preferably, the geometric center of the repair position is located at the geometric center of the triangle formed by the center lines connecting the centers of the three binding positions in the same binding group, or the geometric center of the repair position is located at the geometric center of the region between two adjacent binding groups along the first direction.

5. The array substrate according to claim 2, characterized in that: The second electrode also includes a main body portion, which is electrically connected to the second connection terminal; The vertical projection of the main body on the driving circuit layer is trapezoidal, and the upper base of the trapezoid is adjacent to the first electrode. Preferably, the first electrodes of all binding sites are electrically connected to each other; Preferably, the three binding positions of each binding group are located within a triangular region, and the first electrode of the three binding positions of each binding group is located at the three vertices of the triangular region; Preferably, when at least three bonding positions of the bonding group are arranged around the repair position, the first electrode covers the area between adjacent bonding groups; Preferably, the three binding positions of each binding group are located within an equilateral triangle region.

6. A display panel, characterized in that, It includes multiple light-emitting units and the array substrate as described in any one of claims 1-5; Multiple light-emitting units are bound to binding positions on the array substrate.

7. The display panel according to claim 6, characterized in that: At least one of the light-emitting units is bound to a repair bit adjacent to the binding bit to be repaired; The first electrode and the second electrode of the light-emitting unit bound to the repair position are electrically connected to the first repair electrode and the second repair electrode of the repair position, respectively. Preferably, the second repair electrode of the repair site is electrically connected to the second electrode of the bonding site to be repaired via a welding material, or the second repair electrode of the repair site is electrically connected to the second electrode of the bonding site to be repaired via a conductive part.

8. The display panel according to claim 6, characterized in that: Each binding group has at least three binding bits for binding light-emitting units with the same emission color, and the light-emitting units bound in adjacent binding groups have different emission colors; Preferably, along the first direction, each binding row includes a first binding group, a second binding group, and a third binding group arranged in sequence, and the light-emitting units bound in the first binding group, the second binding group, and the third binding group emit different colors.

9. A method for repairing a display panel, characterized in that, The repair method, applied to the display panel according to any one of claims 6-8, comprises: Determine the location of the binding bit to be repaired; The second repair electrode of the repair bit adjacent to the binding bit to be repaired is electrically connected to the second electrode of the binding bit to be repaired; The new light-emitting unit is bound to the repair bit adjacent to the binding bit to be repaired.

10. The repair method according to claim 9, characterized in that, Electrically connecting the second repair electrode of the repair bit adjacent to the bonding bit to be repaired and the second electrode of the bonding bit to be repaired includes: The second repair electrode of the repair position adjacent to the bonding position to be repaired and the second electrode of the bonding position to be repaired are electrically connected by welding material; or, by laser drilling process, holes are drilled in the first insulating layer between the second repair electrode of the repair position adjacent to the bonding position to be repaired and the second electrode of the bonding position to be repaired and the conductive part, so that both the second repair electrode and the second electrode are in contact with the conductive part.

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