Chip wafer picking and distributing equipment

Abstract

The application discloses a chip wafer taking and distributing equipment, which comprises a support platform, a taking positioning unit, a distributing conveying unit and a taking transfer unit are arranged on the support platform; the taking transfer unit comprises a transfer left-right driving device, a transfer up-down driving device and a transfer seat, a plurality of suction nozzle up-down driving devices are arranged on the transfer seat, and the output ends of the suction nozzle up-down driving devices are connected with transfer suction nozzles; the distributing conveying unit comprises a feeding conveying line and a discharging conveying line which is located below the feeding conveying line; the taking positioning unit comprises a positioning front-rear driving device, and the output end of the positioning front-rear driving device is connected with a support seat. Through the cooperative operation of the three core functional units of the taking positioning unit, the taking transfer unit and the distributing conveying unit, the full-process unmanned operation of high-speed and stable pickup of the wafer from the wafer frame and orderly and automatic distribution of the wafer to the turnover disc for circulation is realized, and the application has the advantages of high reliability, high efficiency and low damage.

Description

Technical Field

[0001] This invention relates to the field of chip wafer technology, and in particular to chip wafer material handling and sorting equipment. Background Technology

[0002] Chip wafers (hereinafter referred to as "wafers") are the basic materials for manufacturing semiconductor devices. After completing the front-end manufacturing processes (such as photolithography, etching, ion implantation, etc.), wafers usually need to undergo a dicing process to be separated into numerous independent dies. In order to facilitate the batch transfer and storage of these micro-sized dies and prepare them for subsequent processes, the industry generally uses a carrier film (such as blue film) as its temporary carrier and fixing medium.

[0003] Specifically, after dicing, the entire wafer is attached to a circular carrier film with specific adhesive properties on its back side. The carrier film itself has a certain degree of flexibility and elasticity, which can support the die and effectively buffer external forces, reducing the risk of die breakage. The annular edge of the carrier film is usually fixed to a rigid support ring, and the two together form the wafer frame, mainly to meet the process requirements of automated equipment for positioning, picking up, and distributing the die.

[0004] In subsequent key processes such as packaging, testing, or assembly, the dies need to be picked up and separated from the carrier film with high precision and efficiency (this process is often called "die picking"), and transferred to the lead frame, substrate, or other target carrier for mounting.

[0005] Currently, mainstream wafer picking devices typically use a fixed support ring to position and clamp the entire wafer frame, then place the wafers one by one into a turntable using a pick-up nozzle. Finally, the turntable is manually transferred to the next processing step for subsequent operations. However, this existing technology has significant drawbacks in practical applications: 1. During the positioning and picking stage, the inherent elastic deformation capability of the carrier film constitutes an adverse mechanical interference to the wafer picking process. When the pick-up nozzle (or other end effector) moves downward and applies vacuum suction force to pick up the target wafer, the carrier film will experience elastic indentation due to localized pressure. This deformation weakens the effective contact area and sealing between the nozzle and the back of the wafer, resulting in insufficient vacuum suction force. Furthermore, the recovery force accumulated by the deformation counteracts the pick-up action of the nozzle, increasing the instantaneous demolding force required for wafer separation from the film surface. The combined effect of these factors easily leads to pick-up failure, specifically manifested as wafers not being successfully picked up, wafer slippage during the pick-up process, or wafer orientation shift. This not only directly reduces the effectiveness of the crystal extraction process, but also severely impacts the efficiency of the production process due to the need for frequent troubleshooting (such as retrying or manual intervention). 2. During the material distribution stage, the turntables require operators to perform loading, changing, and unloading operations, which undoubtedly increases the workload and also affects the efficiency and consistency of production. In addition, manual handling may cause vibration and tilting of the turntables, leading to displacement or even damage of the crystals already placed in the turntables. Furthermore, frequent manual intervention increases the chance of contamination of the clean production environment. Summary of the Invention

[0006] The purpose of this invention is to overcome the above-mentioned problems of the prior art and provide a chip wafer picking and sorting device that achieves highly reliable, efficient and low-damage chip picking and placing operations.

[0007] The objective of this invention is mainly achieved through the following technical solutions:

[0008] A chip wafer picking and sorting device includes a support platform, on which a picking and positioning unit, a sorting and conveying unit, and a picking and transferring unit are installed. The picking and transferring unit includes a left-right transfer drive device, a right-right transfer drive device connected to the output of the left-right transfer drive device, and a transfer base connected to the output of the right-right transfer drive device. The transfer base is equipped with several nozzle right-right drive devices, the outputs of which are connected to transfer nozzles. The sorting and conveying unit includes a loading conveyor line and a unloading conveyor line located below the loading conveyor line. The loading conveyor line includes a loading input section, a sorting working section, and a loading output section arranged at intervals and in sequence. The unloading conveyor line includes an unloading conveying section. Each of the loading input section, sorting working section, loading output section, and unloading conveying section includes conveying components. The material sorting section is also equipped with a material sorting front and rear drive device for driving the conveying components to move back and forth to connect the feeding input section and the feeding output section. The feeding output section is also equipped with a material sorting up and down drive device for driving the conveying components to move up and down to connect the unloading conveying section. Each conveying component includes two transmission belts. The material picking and positioning unit includes a positioning front and rear drive device. The output end of the positioning front and rear drive device is connected to a support base. A positioning seat is rotatably mounted on the support base. A positioning rotation drive component for driving the positioning seat to rotate is also mounted on the support base. The material picking and positioning unit also includes a positioning left and right drive device. The output end of the positioning left and right drive device is connected to an adsorption up and down drive device. The output end of the adsorption up and down drive device is connected to an adsorption component. The adsorption component includes a positioning suction cylinder.

[0009] Furthermore, the conveying assembly includes a conveying base, on which a fixed conveying frame is mounted, and on which a conveying movable drive assembly is also mounted. The output end of the conveying movable drive assembly is connected to a movable conveying frame that cooperates with the fixed conveying frame. The two conveyor belts are respectively driven on the fixed conveying frame and the movable conveying frame.

[0010] Furthermore, both the fixed conveyor frame and the movable conveyor frame are provided with a conveyor positioning top plate located above the conveyor belt; both the fixed conveyor frame and the movable conveyor frame are provided with a conveyor positioning drive device, and the output end of the conveyor positioning drive device is connected to a conveyor positioning support plate that is offset from the conveyor belt and located below the conveyor positioning top plate.

[0011] Furthermore, the top of the positioning suction cylinder is provided with several adsorption ports; the adsorption assembly also includes an adsorption connecting seat, on which an adsorption fixing seat is installed, the positioning suction cylinder is installed on the top of the adsorption fixing seat, and the adsorption fixing seat is provided with a vacuum channel communicating with the adsorption ports; the vacuum channel includes a vacuum transfer section arranged circumferentially between the inner and outer walls of the adsorption fixing seat; the vacuum channel also includes a vacuum flow section one connected to the bottom end of the vacuum transfer section and arranged at an inclination; the vacuum channel also includes several vacuum flow sections two connected to the top end of the vacuum transfer section and arranged vertically; the adsorption fixing seat is connected with a vacuum connector communicating with the vacuum flow section one.

[0012] Furthermore, the top of the positioning suction cylinder is provided with several pin openings; the adsorption assembly also includes a pin up-and-down driving device installed on the adsorption connecting seat. The output end of the pin up-and-down driving device is connected to a movable rod located in the middle of the adsorption fixing seat and passing through the top of the adsorption fixing seat. The top of the movable rod is connected to a pin head, and the pin head is provided with several pins that can pass through several pin openings respectively. The pin up-and-down driving device acts on the movable rod, so that the movable rod can move up and down relative to the adsorption fixing seat. When the movable rod is at the limit position of the upward movement relative to the adsorption fixing seat, the pins pass through the pin openings.

[0013] Furthermore, a ball bearing sleeve is provided between the inner wall of the adsorption fixing seat and the outer surface of the movable rod. The inner and outer walls of the ball bearing sleeve are provided with a number of balls. The bottom end of the ball bearing sleeve is connected to a bottom limiting head sleeved on the movable rod. The bottom end of the movable rod is connected to the upper and lower driving device of the ejector pin through a bottom connector. The bottom connector is also provided with a supporting elastic element for supporting the bottom limiting head. The supporting elastic element makes the ball bearing sleeve maintain an upward movement tendency.

[0014] Furthermore, the top of the positioning seat has a positioning fixing ring, and the top of the positioning seat is also connected to a positioning movable ring assembly located around the positioning fixing ring; it also includes a positioning up-down driving assembly for driving the positioning movable ring assembly to move up and down relative to the positioning fixing ring.

[0015] Furthermore, the positioning up-and-down drive assembly includes a plurality of positioning up-and-down lead screws rotatably connected to the positioning seat, the plurality of positioning up-and-down lead screws being distributed circumferentially along the positioning lower movable ring and connected and engaged with the positioning lower movable ring; each positioning up-and-down lead screw is movably connected to a positioning up-and-down driven gear; the positioning up-and-down drive assembly also includes a positioning up-and-down driving gear rotatably connected to the positioning seat and a positioning up-and-down transmission belt sleeved on the plurality of positioning up-and-down driven gears and the positioning up-and-down driving gear; the positioning up-and-down drive assembly also includes an up-and-down movable drive assembly for driving the positioning up-and-down driving gear to rotate.

[0016] Furthermore, a positioning up-and-down driving driven wheel is also connected to the positioning up-and-down driving gear; the up-and-down movable drive assembly includes a mounting base fixedly mounted on a support base and a movable base rotatably connected to the support base via a positioning up-and-down rotating shaft and located in front of the mounting base; a positioning up-and-down driving driving wheel that can mesh with the positioning up-and-down driving driven driven wheel is rotatably mounted on the movable base, and an up-and-down movable drive device for driving the positioning up-and-down driving driving driving wheel to rotate is mounted on the movable base; a connecting member is provided at the rear end of the movable base, and the outer end of the connecting member has a planar starting section and an oblique section connected in sequence. The device comprises a surface linkage section and a planar termination section; a movable rotary drive device is mounted on the mounting base, and the output end of the movable rotary drive device is connected to a clamping member that can cooperate with the linkage; a torsion spring is provided on the positioning upper and lower rotating shafts, which keeps the movable seat close to the mounting base, and the linkage member is always in contact with the clamping member; when the movable rotary drive device moves the clamping member to face the starting section of the planar segment, the positioning upper and lower drive driving wheel disengages from the positioning upper and lower drive driven wheel; when the movable rotary drive device moves the clamping member to face the ending section of the planar segment, the positioning upper and lower drive driving wheel engages with the positioning upper and lower drive driven wheel.

[0017] Furthermore, the linkage includes linkage plates spaced apart vertically, each linkage plate having a planar starting section, an inclined linkage section, and a planar ending section; the clamping member includes a clamping connecting rod located between the two linkage plates, with clamping rollers rotatably connected to both ends of the clamping connecting rod, and the two clamping rollers slidingly engaging with the two linkage plates respectively.

[0018] This invention has the following beneficial effects: This invention provides a die processing device integrating automatic die picking and automatic transfer of a turntable. Through the coordinated operation of three core functional units—a picking and positioning unit, a picking and transferring unit, and a distributing and conveying unit—it achieves a fully unmanned operation of high-speed and stable die picking from the wafer frame and orderly and automatically distributing it to the turntable for circulation. Specifically:

[0019] 1. Significantly improves the stability and yield of the crystal picking process: The pre-tensioning mechanism effectively suppresses the elastic deformation of the carrier film, creating a flat and stable pick-up interface for the transfer nozzle, fundamentally solving the problem of vacuum adsorption force attenuation and film removal force increase caused by film surface depression; the synergistic effect of adsorption fixation and ejector pin pre-separation greatly reduces the difficulty of picking, significantly reduces defects such as pick-up failure, flyaway pieces and positional deviation, and directly improves the yield and reliability of the crystal picking process.

[0020] 2. Ensures high-quality die placement and significantly improves production efficiency and consistency: The device innovatively integrates automatic die pickup and automatic turntable transfer / positioning into a single unit, enabling continuous operation from wafer frame to a fully loaded turntable. This eliminates efficiency bottlenecks, operational inconsistencies, and human error associated with manual turntable changes, resulting in significantly improved and predictable production speed. The unique combination of the transfer positioning top plate and support plate mechanism instantly transforms the turntable from a dynamic transfer state to a static clamping state during die placement, effectively isolating transfer vibrations and ensuring high repeatability and positioning accuracy for each placement operation. This prevents die placement errors or collision damage caused by tray displacement. Attached Figure Description

[0021] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in describing the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments recorded in the present invention. Those skilled in the art can derive other drawings from the following drawings without any creative effort.

[0022] Figure 1 A schematic diagram of the overall structure of the chip wafer picking and sorting equipment of the present invention;

[0023] Figures 2 to 21 This is a schematic diagram of the material picking and positioning unit described in this invention, specifically:

[0024] Figures 2 to 4 This is a schematic diagram of the overall structure of the material picking and positioning unit; Figure 5 A schematic diagram of the structure for positioning the upper and lower drive components; Figure 6 A schematic diagram of the structure of the driven gear for positioning and rotation. Figure 10 A schematic diagram of the structure for positioning the rotating drive gear; Figure 7 This is a schematic diagram of the positioning seat. Figure 8 , Figure 11 , Figure 12 and Figure 13 These are schematic diagrams of the upper and lower movable drive components; Figure 9 This is a structural diagram of the linkage and clamping components; Figure 14 This is a schematic diagram of the wafer frame and positioning active ring assembly. Figure 15 This is a schematic diagram of the wafer frame when it is pressed and tightened by the positioning movable ring assembly. Figure 16 This is a schematic diagram of the adsorption component. Figure 18 and Figure 19 These are cross-sectional views of the adsorption components; Figure 17 This is a schematic diagram of the adsorption cylinder structure; Figure 20 This is a schematic diagram of the ejector pin's structure; Figure 21 This is a schematic diagram of the structure of a ball bearing sleeve;

[0025] Figures 22 to 23 This is a schematic diagram of the material handling and transfer unit described in this invention, specifically:

[0026] Figure 22 This is a schematic diagram of the overall structure of the material handling and transfer unit; Figure 23 A schematic diagram of the overall structure of the transfer nozzle;

[0027] Figures 24 to 33 This is a schematic diagram of the material distribution and conveying unit described in this invention. Specifically:

[0028] Figure 24 This is a schematic diagram of the overall structure of the material distribution and conveying unit; Figure 25 This is a structural diagram of the material distribution section; Figure 26 This is a schematic diagram of the feeding and output section. Figure 27 This is a schematic diagram of the material feeding conveyor section; Figure 28 A schematic diagram of the structure of the positioning support plate for transmission; Figure 29 This is a schematic diagram of the conveyor belt structure; Figure 30 This is a schematic diagram of the turnover tray structure; Figure 31 and Figure 32 These are schematic diagrams of the blocking drive device and the blocking component, respectively. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments described in the present invention without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1 to 33As shown, the chip wafer picking and sorting equipment includes a support platform 1, on which a picking and positioning unit, a sorting and conveying unit, and a picking and transferring unit are arranged. The picking and transferring unit includes a left and right transfer drive device 54, a right and left transfer drive device 55 connected to the output end of the left and right transfer drive device, and a transfer seat 70 connected to the output end of the right and left transfer drive device 55. The transfer seat 70 is equipped with several nozzle up and down drive devices, and the output end of the nozzle up and down drive devices is connected to a transfer nozzle 56. The sorting and conveying unit includes a loading conveyor line and a unloading conveyor line located below the loading conveyor line. The loading conveyor line includes a loading input section, a sorting working section, and a loading output section arranged at intervals and in sequence. The unloading conveyor line includes an unloading conveying section. The loading input section, the sorting working section, the loading output section, and the unloading conveying section all include conveying components. The material handling section is also equipped with a material distribution front and rear drive device 57 for driving the conveying components to move back and forth to connect the material input section and the material output section. The material output section is also equipped with a material distribution up and down drive device 58 for driving the conveying components to move up and down to connect the material unloading conveying section. Each conveying component includes two transmission belts 59. The material picking and positioning unit includes a positioning front and rear drive device 2. The output end of the positioning front and rear drive device 2 is connected to a support base 3. A positioning seat 4 is rotatably mounted on the support base 3. A positioning rotation drive component for driving the positioning seat 4 to rotate is also mounted on the support base 3. The material picking and positioning unit also includes a positioning left and right drive device 6. The output end of the positioning left and right drive device 6 is connected to an adsorption up and down drive device 73. The output end of the adsorption up and down drive device 73 is connected to an adsorption component. The adsorption component includes a positioning suction cylinder 9.

[0031] In this embodiment, the material handling and positioning unit is used to fix the wafer frame, such as... Figure 15 As shown, the wafer frame includes a carrier film 50, with a support ring 49 fixed to its annular edge. The back side of the entire wafer 51 is attached to the carrier film 50 and cut into numerous independent dies 52. A material conveying unit is used to convey and position a turnover tray, which holds the dies 52 and moves with the material conveying unit into the lower process. Figure 31 As shown, the turntable includes a disc body 66, and the disc body 66 has several sets of placement slots arranged in a front-to-back direction. Each placement slot set includes several placement slots 67 that correspond to several transfer nozzles 56 respectively.

[0032] The material handling and transfer unit is used to adsorb and transfer the crystals 52 one by one to the material dispensing and conveying unit. To facilitate accurate material handling and dispensing, an upward image sensor 59 is installed between the material handling and positioning unit and the material dispensing and conveying unit on the support platform 1. The upward image sensor 59 is used to acquire the position of the transfer nozzle 56, such as... Figure 2As shown. The left-right transfer drive device 54 may have three independent output ends that can move left and right. The up-down transfer drive device 55 is connected to the output end located in the middle. The two output ends at both ends are each connected to a downward image sensor 58. One downward image sensor 58 is used to collect the position status of each crystal 52 at the material picking and positioning unit, so that the transfer nozzle 56 can pick up the material. The other downward image sensor 58 is used to collect the position status of each placement slot 67 at the material dispensing and conveying unit, so that the transfer nozzle 56 can place the crystal 52 into the placement slot 67. Both the upward image sensor 59 and the downward image sensor 58 include cameras.

[0033] The left-right transfer drive 54 and the front-back material distribution drive 57 can be selected from slide table modules; the up-down transfer drive 55, the front-back positioning drive 2, the left-right positioning drive 6, and the up-down suction drive 73 can all be selected from slide table modules or cylinders. The up-down suction nozzle drive can be selected from cylinders (the up-down suction nozzle drive is assembled inside the transfer seat 70, not shown in the figure). The up-down material distribution drive 58 can be selected from slide table modules; alternatively, a combination of a motor, lead screw, and nut seat can be selected, with the nut seat connected to the transmission assembly.

[0034] The positioning rotation drive assembly includes a positioning rotation driven gear 43 sleeved on the positioning seat 4, a positioning rotation driving gear 44 rotatably connected to the support seat 3, and a positioning rotation transmission belt 45 sleeved on the positioning rotation driven gear 43 and the positioning rotation driving gear 44. The positioning rotation drive assembly also includes a rotationally fixed drive assembly for driving the positioning rotation driving gear 44. The rotationally fixed drive assembly may include a geared motor, which can drive the positioning rotation driving gear 44 to rotate via a fixed transmission wheel assembly. Then, under the transmission action of the positioning rotation transmission belt 45, it drives the positioning rotation driven gear 43 to rotate, thereby achieving the purpose of rotating the positioning seat 4 and correcting the orientation of the grain 52. The fixed transmission wheel assembly includes, for example,... Figure 10 The diagram shows a combination of a drive pulley and a drive belt. To improve the reliability of the positioning and rotating drive belt 45, a tensioner 53 can be designed to act on the positioning and rotating drive belt 45. The transmission of the conveyor belt 59 can be driven by a rotary conveyor drive assembly, which includes a combination of a geared motor and a drive pulley, such as... Figure 30 As shown.

[0035] In application, the operator or robot places the wafer frame carrying the die to be picked up on the positioning seat 4 of the picking and positioning unit. The positioning rotation drive assembly drives the positioning seat 4 and the wafer frame on it to rotate as a whole. Through the recognition and feedback of the downward image sensor 58, the azimuth angle of the die is accurately corrected. After positioning the target die, the positioning left and right drive device 6 and the adsorption up and down drive device 73 work together to drive the adsorption component to move directly below the die. The adsorption up and down drive device 73 drives the adsorption component to move upward, so that the top of the positioning suction cylinder 9 gently touches the back of the carrier film. At the same time, the transfer left and right drive device 54 and the transfer up and down drive device 55 in the picking and transfer unit cooperate to drive the transfer seat 70 to move directly above the pre-treated die. The nozzle up-down drive device drives the specific transfer nozzle 56 to descend. In the optimal state where the carrier film has been adsorbed and fixed and the crystals have been pre-lifted, a vacuum adsorption force is applied to easily and reliably pick up the crystals. After each transfer nozzle 56 on the transfer seat 70 has picked up the crystals in the aforementioned manner, the transfer left-right drive device 54 and the transfer up-down drive device 55 drive the transfer seat 70 to leave the material picking and positioning unit and enter the material dispensing and conveying unit area.

[0036] In the material distribution and conveying unit area, the feeding conveyor line is responsible for the supply and positioning of empty turntables. The empty turntables are fed in from the feeding input section. The material distribution front and rear drive device 57 drives the conveying components of the material distribution working section to move back and forth, so that its front end or rear end can accurately dock with the feeding input section and feeding output section respectively, realizing the relay transmission of the turntables on the feeding conveyor line.

[0037] In application, when the turntable is conveyed to the material distribution section, the material transfer unit accurately places the carried dies into the specific placement slot 67 of the turntable at the current station. After all the dies on the transfer seat 70 have been placed, the material distribution up-and-down drive device 58 drives the conveyor assembly of the loading output section to descend as a whole, making it flush with the unloading conveyor section of the unloading conveyor line, thereby automatically transferring the completed turntable to the unloading conveyor line for use in the next process.

[0038] like Figure 24 As shown, during equipment production, to ensure that both the feeding input section and the feeding output section can serve as the entry point for the turntable, both sections can be equipped with a material distribution up-and-down drive device 58. This allows the orientation of the feeding input section and the feeding output section relative to the material distribution section to be adjusted according to the flow direction requirements on site. Preferably, both the feeding input section and the feeding output section are equipped with a connecting conveyor assembly 85 for connecting to external processes, facilitating connection to the turntable.

[0039] Preferably, the conveying assembly includes a conveying base 60, a fixed conveying frame 61 is provided on the conveying base 60, and a conveying movable drive assembly is also provided on the conveying base 60. The output end of the conveying movable drive assembly is connected to a movable conveying frame 62 that cooperates with the fixed conveying frame 61. The two conveying belts 59 are respectively driven on the fixed conveying frame 61 and the movable conveying frame 62.

[0040] In this embodiment, the movable drive assembly can be a combination of a motor, a lead screw, and a nut seat, which is connected to the movable conveyor frame 62. This allows the distance between the movable conveyor frame 62 and the fixed conveyor frame 61 to be adjusted according to the lateral width of the turntable, thereby improving the versatility of the conveyor assembly.

[0041] To prevent excessive movement of the turntable, the input and output ends of the fixed conveyor 61 or the movable conveyor 62 are equipped with blocking components. The blocking components include a blocking drive device 71, and the output end of the blocking drive device 71 is connected to a blocking element 72. The blocking element 72 can move up and down relative to the conveyor belt 59 to achieve the effect of blocking the conveyor belt. The blocking drive device 71 can be a cylinder.

[0042] Preferably, both the fixed conveyor frame 61 and the movable conveyor frame 62 are provided with a conveyor positioning top plate 63 located above the conveyor belt 59 at their top ends; both the fixed conveyor frame 61 and the movable conveyor frame 62 are provided with a conveyor positioning drive device 64, and the output end of the conveyor positioning drive device 64 is connected to a conveyor positioning support plate 65 that is offset from the conveyor belt 59 and located below the conveyor positioning top plate 63.

[0043] When the conveying component needs to position the turntable, that is, when it is not conveying, the conveying positioning drive device 64 can drive the conveying positioning support plate 65 to rise, lift the turntable so that it is separated from the conveyor belt 59, and the conveying positioning top plate 63 limits it from above, thereby achieving precise positioning and stable clamping of the turntable, preventing placement errors caused by the vibration of the conveyor belt, thus improving the accuracy of the die placement.

[0044] To reduce equipment costs, a conveyor positioning top plate 63 and a conveyor positioning support plate 65 can be designed only in each conveyor component of the feeding conveyor line.

[0045] Preferably, the top end of the positioning suction cylinder 9 is provided with a plurality of adsorption ports 10; the adsorption assembly further includes an adsorption connecting seat 7, on which an adsorption fixing seat 8 is installed, the positioning suction cylinder 9 is installed on the top end of the adsorption fixing seat 8, and the adsorption fixing seat 8 is provided with a vacuum channel 11 communicating with the adsorption ports 10; the vacuum channel 11 includes a vacuum transfer section 13 arranged circumferentially between the inner and outer walls of the adsorption fixing seat 8; the vacuum channel 11 also includes a vacuum flow section 12 connected to the bottom end of the vacuum transfer section 13 and arranged at an inclination; the vacuum channel 11 also includes a plurality of vacuum flow sections 14 connected to the top end of the vacuum transfer section 13 and arranged vertically; the adsorption fixing seat 8 is connected with a vacuum connector 15 communicating with the vacuum flow section 12.

[0046] In this embodiment, the vacuum channel 11 is connected to the air generator via the vacuum connector 15. Activating the air generator creates a negative pressure within the vacuum channel 11. The vacuum flow section 14 further creates a negative pressure within the positioning suction cylinder 9, thereby enabling the adsorption port 10 to adsorb the carrier film 50. When a specific area of ​​the carrier film 50 is adsorbed onto the positioning suction cylinder 9, forming a locally rigid support, the target grain 52 can be easily removed from the carrier film 50 when the transfer nozzle 56 picks up the target grain.

[0047] Preferably, the top end of the positioning suction cylinder 9 is provided with a plurality of pin openings 19; the adsorption assembly further includes a pin up-and-down driving device 16 installed on the adsorption connecting seat 7, the output end of the pin up-and-down driving device 16 is connected to a movable rod 17 located in the middle of the adsorption fixing seat 8 and passing through the top end of the adsorption fixing seat 8, the top end of the movable rod 17 is connected to a pin head 18, and the pin head 18 is provided with a plurality of pins 20 that can pass through a plurality of pin openings 19 respectively; the pin up-and-down driving device 16 acts on the movable rod 17, so that the movable rod 17 can move up and down relative to the adsorption fixing seat 8, and when the movable rod 17 is at the limit position of the upward movement relative to the adsorption fixing seat 8, the pins 20 pass through the pin openings 19.

[0048] In this embodiment, the push pin up and down drive device 16 can be a cylinder, a voice coil motor, or the like.

[0049] In application, when the adsorption component is moved upward by the adsorption up and down driving device 73 and the positioning suction cylinder 9 adsorbs the carrier film 50, the ejector pin up and down driving device 16 is activated to move the movable rod 17 upward until the ejector pin 20 passes through the ejector pin through-hole 19 and pushes the carrier film 50 and the corresponding target grain 52. At this time, the carrier film 50 will deform due to the force, causing the target grain 52 to partially detach from the carrier film 50, which is more conducive to the crystal picking operation.

[0050] Preferably, a ball bearing sleeve 21 is further provided between the inner wall of the adsorption fixing seat 8 and the outer surface of the movable rod 17, and a plurality of balls 22 are provided on both the inner and outer walls of the ball bearing sleeve 21; the bottom end of the ball bearing sleeve 21 is connected to a bottom limiting head 23 sleeved on the movable rod 17, and the bottom end of the movable rod 17 is connected to the ejector pin up and down driving device 16 through a bottom connecting head 24; a supporting elastic element 25 for supporting the bottom limiting head 23 is also provided on the bottom connecting head 24, and the supporting elastic element 25 makes the ball bearing sleeve 21 maintain an upward movement trend.

[0051] In this embodiment, the ball bearing sleeve 21 enhances the sensitivity and stability of the movable rod 17's vertical movement relative to the adsorption fixing seat 8. Specifically, the supporting elastic element 25 limits the downward movement of the ball bearing sleeve 21, preventing excessive downward movement; and the bottom limit head 23 limits the upward movement of the ball bearing sleeve 21, preventing excessive upward movement.

[0052] Preferably, the bottom end of the bottom limiting head 23 is provided with a concave top limiting groove 75; the top end of the bottom connecting head 24 is provided with a concave bottom limiting groove 76; and the upper and lower ends of the supporting elastic member 25 are respectively located in the top limiting groove 75 and the bottom limiting groove 76.

[0053] In this embodiment, the stability of the supporting elastic member 25 can be improved by setting the top limiting groove 75 and the bottom limiting groove 76.

[0054] Preferably, the top end of the positioning seat 4 has a positioning fixing ring 5, and the top end of the positioning seat 4 is also connected to a positioning movable ring assembly located around the positioning fixing ring 5; it also includes a positioning up-down driving assembly for driving the positioning movable ring assembly to move up and down relative to the positioning fixing ring 5.

[0055] In this embodiment, the carrier film 50 is first placed on the positioning and fixing ring 5, and the support ring 49 is positioned on the positioning and moving ring assembly. Then, the positioning and moving ring assembly is driven to move down by the positioning and moving up and down driving assembly. In this way, under the support of the positioning and fixing ring 5, the edge area of ​​the carrier film 50 gradually moves down elastically to straighten the middle area of ​​the carrier film 50, that is, the area where the wafer 51 is placed. In this way, the elastic deformation of this area can be reduced.

[0056] Preferably, the positioning movable ring assembly includes a lower positioning movable ring 26 and an upper positioning movable member 27 detachably connected to the lower positioning movable ring 26.

[0057] In this embodiment, when placing the wafer frame, the support ring 49 is first placed on the lower positioning ring 26, and then the upper positioning movable component 27 is assembled on the lower positioning ring 26, thereby improving the overall stability of the wafer frame. Figure 14As shown, the positioning movable part 27 is arc-shaped and there are two of them, which are used to position the two ends of the support ring 49 respectively.

[0058] Preferably, the positioning up-and-down drive assembly includes a plurality of positioning up-and-down lead screws 28 rotatably connected to the positioning seat 4, the plurality of positioning up-and-down lead screws 28 being circumferentially distributed along the positioning lower movable ring 26 and connected and engaged with the positioning lower movable ring 26; each positioning up-and-down lead screw 28 is movably connected to a positioning up-and-down driven gear 29; the positioning up-and-down drive assembly also includes a positioning up-and-down driving gear 30 rotatably connected to the positioning seat 4 and a positioning up-and-down transmission belt 32 sleeved on the plurality of positioning up-and-down driven gears 29 and the positioning up-and-down driving gear 30; the positioning up-and-down drive assembly also includes an up-and-down movable drive assembly for driving the positioning up-and-down driving gear 30 to rotate.

[0059] In this embodiment, the positioning movable ring assembly only needs to be moved up and down when mounting and dismounting the wafer frame. In this case, the positioning movable ring assembly needs to be driven up and down by the positioning up and down drive assembly. However, during the die removal operation, in order to avoid affecting the correction of the die orientation, when the positioning movable ring assembly does not need to be moved, the contact between the external drive structure and the positioning seat 4 and the related structures set on it needs to be released. For this reason, this embodiment is designed with a movable drive assembly.

[0060] Specifically, when it is necessary to drive the positioning movable ring assembly, the up-and-down movable drive assembly is moved so that its output end contacts the positioning up-and-down active gear 30 and drives the positioning up-and-down active gear 30 to rotate; conversely, the up-and-down movable drive assembly is moved so that its output end disengages from the positioning up-and-down active gear 30.

[0061] When the positioning drive gear 30 rotates, under the transmission action of the positioning drive belt 32, it can drive the positioning driven gears 29 to rotate. Then, with the cooperation of the positioning driven gears 29 and the positioning lead screw 28, the positioning movable ring assembly moves up and down.

[0062] Preferably, the positioning up-and-down driving gear 30 is also connected to a positioning up-and-down driven driven gear 31; the up-and-down movable drive assembly includes a mounting base 35 fixedly mounted on the support base 3 and a movable base 33 rotatably connected to the support base 3 via a positioning up-and-down rotating shaft 34 and located in front of the mounting base 35; a positioning up-and-down driving driving gear 39 that can mesh with the positioning up-and-down driven driven gear 31 is rotatably mounted on the movable base 33, and an up-and-down movable drive device 38 for driving the positioning up-and-down driving driving driving gear 39 to rotate is mounted on the movable base 33; a connecting member 40 is provided at the rear end of the movable base 33, and the outer end of the connecting member 40 has a planar starting section 74 and an inclined connecting section 41 connected in sequence. The planar termination section 42; a movable rotary drive device 36 is mounted on the mounting base 35, and the output end of the movable rotary drive device 36 is connected to a clamping member 37 that can cooperate with the linkage member 40; a torsion spring is provided on the positioning upper and lower rotating shaft 34, the torsion spring keeps the movable seat 33 close to the mounting base 35, and the linkage member 40 always abuts against the clamping member 37; when the movable rotary drive device 36 moves the clamping member 37 to face the planar starting section 74, the positioning upper and lower drive driving wheel 39 disengages from the positioning upper and lower drive driven wheel 31; when the movable rotary drive device 36 moves the clamping member 37 to face the planar termination section 42, the positioning upper and lower drive driving wheel 39 engages with the positioning upper and lower drive driven wheel 31.

[0063] In this embodiment, the vertically movable drive device 38 can be a geared motor. The movable rotary drive device 36 can be a cylinder. Activating the movable rotary drive device 36 drives the clamping member 37 to move. Through the cooperation of the clamping member 37 and the linkage member 40, the movable seat 33 can be driven to rotate against the torsion spring, thereby achieving the engagement of the positioning vertical drive driving wheel 39 and the positioning vertical drive driven wheel 31. Otherwise, under the action of the torsion spring, the positioning vertical drive driving wheel 39 and the positioning vertical drive driven wheel 31 remain disengaged. In this state, the positioning seat 4 can rotate independently relative to the vertically movable drive assembly to correct the orientation of the die 52.

[0064] When the positioning up-and-down drive driving wheel 39 meshes with the positioning up-and-down drive driven wheel 31, the up-and-down movable drive device 38 can drive the positioning up-and-down drive driving wheel 39 to rotate via the movable transmission wheel assembly, thereby driving the positioning up-and-down drive gear 30 to rotate. The movable transmission wheel assembly is as follows: Figure 13 As shown, it is composed of helical gears and ordinary gears.

[0065] Preferably, the linkage 40 includes linkage plates 46 spaced apart vertically, each linkage plate 46 having a planar starting section 74, an inclined linkage section 41, and a planar ending section 42; the clamping member 37 includes a clamping connecting rod 47 located between the two linkage plates 46, with clamping rollers 48 rotatably connected to both ends of the clamping connecting rod 47, and the two clamping rollers 48 slidingly engaging with the two linkage plates 46 respectively.

[0066] In this embodiment, activating the movable rotary drive device 36 drives the clamping connecting rod 47 to move relative to the connecting plate 46, which in turn drives the clamping roller 38 to engage sequentially with the planar starting section 74, the inclined connecting section 41, and the planar ending section 42, thereby driving the movable seat 33 to rotate against the torsion spring. The clamping roller 48 reduces the friction between the clamping member 37 and the connecting plate 46.

[0067] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A chip wafer picking and sorting device, characterized in that: Includes a support platform (1), on which a material picking and positioning unit, a material dispensing and conveying unit and a material picking and transfer unit are provided; The material transfer unit includes a transfer left and right drive device (54), a transfer up and down drive device (55) connected to the output end of the transfer left and right drive device, and a transfer seat (70) connected to the output end of the transfer up and down drive device (55). The transfer seat (70) is provided with a number of suction nozzle up and down drive devices, and the output end of the suction nozzle up and down drive device is connected to a transfer suction nozzle (56). The material conveying unit includes a feeding conveyor line and a discharging conveyor line located below the feeding conveyor line. The feeding conveyor line includes a feeding input section, a material discharging working section and a feeding output section arranged at intervals and in sequence. The discharging conveyor line includes a discharging conveying section. The feeding input section, the material discharging working section, the feeding output section and the discharging conveying section all include conveying components. The material discharging working section is also provided with a material discharging forward and backward drive device (57) for driving the conveying components to move back and forth to connect the feeding input section and the feeding output section. The feeding output section is also provided with a material discharging up and down drive device (58) for driving the conveying components to move up and down to connect the discharging conveyor section. Each conveying component includes two transmission belts (59) with transmission. The material picking and positioning unit includes a positioning front and rear drive device (2), the output end of which is connected to a support base (3), a positioning seat (4) is rotatably provided on the support base (3), and a positioning rotation drive assembly for driving the positioning seat (4) to rotate is also provided on the support base (3); the material picking and positioning unit also includes a positioning left and right drive device (6), the output end of which is connected to an adsorption up and down drive device (73), the output end of which is connected to an adsorption assembly, and the adsorption assembly includes a positioning suction cylinder (9).

2. The chip wafer picking and sorting equipment according to claim 1, characterized in that: The transmission component includes a transmission base (60), a fixed transmission frame (61) is provided on the transmission base (60), and a transmission active drive component is also provided on the transmission base (60). The output end of the transmission active drive component is connected to an active transmission frame (62) that cooperates with the fixed transmission frame (61). The two conveyor belts (59) are respectively driven on the fixed conveyor frame (61) and the movable conveyor frame (62).

3. The chip wafer picking and sorting equipment according to claim 2, characterized in that: The top of both the fixed conveyor frame (61) and the movable conveyor frame (62) is provided with a conveyor positioning top plate (63) located above the conveyor belt (59). Both the fixed conveyor frame (61) and the movable conveyor frame (62) are equipped with a conveyor positioning drive device (64). The output end of the conveyor positioning drive device (64) is connected to a conveyor positioning support plate (65) that is offset from the conveyor belt (59) and located below the conveyor positioning top plate (63).

4. The chip wafer picking and sorting equipment according to claim 1, characterized in that: The top of the positioning suction cylinder (9) is provided with several suction ports (10). The adsorption assembly also includes an adsorption connector (7), an adsorption fixing seat (8) is installed on the adsorption connector (7), the positioning suction cylinder (9) is installed on the top of the adsorption fixing seat (8), and a vacuum channel (11) communicating with the adsorption port (10) is opened on the adsorption fixing seat (8). The vacuum channel (11) includes a vacuum transfer section (13) arranged circumferentially between the inner and outer walls of the adsorption fixture (8); The vacuum channel (11) also includes a vacuum flow section (12) that is connected to the bottom of the vacuum transfer section (13) and is inclined. The vacuum channel (11) also includes several vertically arranged vacuum flow sections (14) connected to the top of the vacuum transfer section (13). The adsorption fixture (8) is connected to a vacuum connector (15) that communicates with the vacuum flow section (12).

5. The chip wafer picking and sorting equipment according to claim 4, characterized in that: The top of the positioning suction cylinder (9) is also provided with several pin openings (19). The adsorption assembly also includes a pin up and down driving device (16) installed on the adsorption connector (7). The output end of the pin up and down driving device (16) is connected to a movable rod (17) located in the middle of the adsorption fixing seat (8) and can pass through the top of the adsorption fixing seat (8). The top of the movable rod (17) is connected to a pin head (18). The pin head (18) is provided with a number of pins (20) that can pass through a number of pin openings (19). The ejector pin up and down drive device (16) acts on the movable rod (17), so that the movable rod (17) can move up and down relative to the adsorption fixing seat (8). When the movable rod (17) is at the limit position of moving up relative to the adsorption fixing seat (8), the ejector pin (20) passes through the ejector pin opening (19).

6. The chip wafer picking and sorting equipment according to claim 4, characterized in that: A ball bearing sleeve (21) is also provided between the inner wall of the adsorption fixing seat (8) and the outer surface of the movable rod (17), and a number of balls (22) are provided on both the inner and outer walls of the ball bearing sleeve (21). The bottom end of the ball sleeve (21) is connected to a bottom limiting head (23) sleeved on the movable rod (17), and the bottom end of the movable rod (17) is connected to the ejector pin up and down driving device (16) through the bottom connector (24). The bottom connector (24) is also provided with a support elastic element (25) for supporting the bottom limit head (23), and the support elastic element (25) makes the ball sleeve (21) maintain an upward movement trend.

7. The chip wafer picking and sorting equipment according to claim 1, characterized in that: The top of the positioning seat (4) has a positioning fixing ring (5), and the top of the positioning seat (4) is also connected to a positioning movable ring assembly located around the positioning fixing ring (5). It also includes a positioning up-down drive component for driving the positioning active ring component to move up and down relative to the positioning fixed ring (5).

8. The chip wafer picking and sorting equipment according to claim 7, characterized in that: The positioning up and down drive assembly includes a plurality of positioning up and down lead screws (28) rotatably connected to the positioning seat (4). The plurality of positioning up and down lead screws (28) are distributed circumferentially along the positioning lower movable ring (26) and are connected and cooperated with the positioning lower movable ring (26). Each positioning upper and lower lead screw (28) is connected to a positioning upper and lower driven gear (29). The positioning up and down drive assembly also includes a positioning up and down drive gear (30) rotatably connected to the positioning seat (4) and a positioning up and down transmission belt (32) sleeved on a plurality of positioning up and down driven gears (29) and positioning up and down drive gear (30). The positioning up and down drive assembly also includes an up and down movable drive assembly that can be used to drive the positioning up and down drive gear (30) to rotate.

9. The chip wafer picking and sorting equipment according to claim 8, characterized in that: The positioning up and down driving gear (30) is also connected to the positioning up and down driving driven gear (31). The up-and-down movable drive assembly includes a mounting base (35) fixedly mounted on the support base (3) and a movable base (33) rotatably connected to the support base (3) and located in front of the mounting base (35) via a positioning up-and-down rotating shaft (34). The movable seat (33) is rotatably mounted with a positioning up and down drive drive wheel (39) that can mesh with the positioning up and down drive driven wheel (31). The movable seat (33) is mounted with an up and down movable drive device (38) for driving the positioning up and down drive drive wheel (39) to rotate. The rear end of the movable seat (33) is provided with a linkage (40). The outer end of the linkage (40) has a planar starting section (74), an inclined plane linkage section (41), and a planar ending section (42) connected in sequence. A movable rotary drive device (36) is installed on the mounting base (35), and the output end of the movable rotary drive device (36) is connected to a clamping member (37) that can cooperate with the linkage (40). A torsion spring is provided on the positioning upper and lower rotating shaft (34). The torsion spring keeps the movable seat (33) close to the mounting seat (35), and the linkage (40) always abuts against the clamping member (37). When the movable rotary drive device (36) moves the clamping member (37) to face the starting section (74) of the plane, the positioning up and down drive driving wheel (39) disengages from the positioning up and down drive driven wheel (31); when the movable rotary drive device (36) moves the clamping member (37) to face the ending section (42) of the plane, the positioning up and down drive driving wheel (39) engages with the positioning up and down drive driven wheel (31).

10. The chip wafer picking and sorting equipment according to claim 9, characterized in that: The linkage (40) includes linkage plates (46) arranged at intervals between the upper and lower parts, and each linkage plate (46) is provided with the planar starting section (74), the inclined plane linkage section (41) and the planar ending section (42). The clamping component (37) includes a clamping connecting rod (47) located between the two connecting plates (46). The upper and lower ends of the clamping connecting rod (47) are rotatably connected to clamping rollers (48), and the two clamping rollers (48) are respectively in sliding engagement with the two connecting plates (46).

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