Silicon-based OLED microdisplay device adhesive curing apparatus, curing method and Micro OLED

Abstract

This invention discloses an adhesive curing device for silicon-based OLED microdisplay devices, comprising a lamp module, an illuminance detection module located below the lamp module for collecting illumination data, a lamp rotation drive device for controlling the lamp module to rotate 360° for illumination, and a control system electrically connected to the illuminance detection module and the lamp rotation drive device. This silicon-based OLED microdisplay device adhesive curing device can effectively improve the curing uniformity of the adhesive used to bond the cover glass to the substrate during the curing process. This invention also discloses a method for curing adhesives for silicon-based OLED microdisplay devices and a Micro OLED.

Description

Technical Field

[0001] This invention belongs to the field of optical display technology. Specifically, this invention relates to a silicon-based OLED microdisplay device adhesive curing apparatus, curing method, and Micro OLED. Background Technology

[0002] Micro OLED (Micro-Organic Light-Emitting Diode) displays have advantages such as small size, light weight, high contrast, fast response speed and low power consumption. In recent years, they have been widely used as near-eye displays in the fields of virtual reality (VR) and augmented reality (AR).

[0003] In the current semiconductor micro-display industry, Micro OLED devices are typically fabricated using 8-inch or 12-inch silicon wafers as substrates. After depositing driving and organic light-emitting materials on their surface, they are then protected by TFE encapsulation. However, TFE encapsulation alone is far from meeting performance standards. CG (Cover Glass) is also needed to enhance the protection of the display device, thereby improving durability and providing a flat, smooth surface to improve display performance.

[0004] In the process of large-area lamination, it is often necessary to laminate CG of the same size as the silicon wafer. Before lamination, DAM adhesive (damming adhesive) and FILL adhesive (filling adhesive) need to be applied to improve the adhesion between the CG and the substrate.

[0005] Based on the properties of the adhesive, it requires UV curing after bonding. The irradiation conditions are crucial for adhesive curing, especially for small-sized products. Existing UV LED lamps (ultraviolet light-emitting diodes) suffer from uneven irradiation; some areas do not receive sufficient UV energy, leading to incomplete curing. Conversely, excessive irradiation in some areas can cause adhesive buildup and shrinkage, resulting in product failure and detachment during use.

[0006] In addition, during the use of UV LED lamps, as the usage time increases and the UV LED lamps are not cleaned in time, the curing rate of the irradiated adhesive will be greatly reduced, and the curing uniformity will gradually decrease.

[0007] A device for curing adhesives for silicon-based OLED microdisplay devices is provided, particularly concerning how to effectively improve the curing uniformity of the adhesive used to bond the cover glass and the substrate during the curing process. Summary of the Invention

[0008] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides an adhesive curing apparatus for silicon-based OLED microdisplay devices, the purpose of which is to effectively improve the curing uniformity of the adhesive used to bond the cover glass and the substrate during the curing process, ensuring uniform curing in each area.

[0009] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a silicon-based OLED microdisplay device adhesive curing device, comprising a lamp module, an illuminance detection module located below the lamp module and used for collecting illuminance data, a lamp rotation drive device for controlling the lamp module to perform 360° rotation illuminance, and a control system electrically connected to the illuminance detection module and the lamp rotation drive device.

[0010] The illuminance detection module is configured to perform secondary irradiation data collection when the first preset condition is met.

[0011] The first preset condition is: after the lamp module completes the first irradiation, the control system analyzes the irradiation data collected by the illuminance detection module, obtains the irradiation uniformity result, and determines that the irradiation uniformity does not meet the requirements.

[0012] The lamp group rotation drive device is configured to control the lamp group module to rotate 360° to illuminate when the second preset condition is met.

[0013] The second preset condition is: after the lamp module completes the second irradiation, the control system analyzes the irradiation data collected by the illuminance detection module, obtains the irradiation uniformity result, and determines that the irradiation uniformity does not meet the requirements.

[0014] The lamp group rotation drive device controls the speed at which the lamp group module rotates, and calculates based on the set illumination time, illuminance, and accumulated light amount.

[0015] The lamp module includes a lamp frame and lamp units disposed on the lamp frame. Multiple lamp units are provided, and each lamp unit includes multiple light sources.

[0016] The light source is a UV LED lamp.

[0017] The present invention also provides a method for curing adhesive for silicon-based OLED microdisplay devices, employing the aforementioned adhesive curing apparatus for silicon-based OLED microdisplay devices, and comprising:

[0018] The illuminance detection module is moved to a position below the lamp assembly module;

[0019] The lamp module provides illumination;

[0020] The illuminance detection module transmits the collected irradiance data to the control system;

[0021] The control system determines whether a second irradiation is needed.

[0022] The control system determines whether the lamp module needs to be rotated 360° for illumination.

[0023] The present invention also provides a Micro OLED, which is manufactured using the aforementioned silicon-based OLED microdisplay device adhesive curing method.

[0024] The silicon-based OLED microdisplay device adhesive curing apparatus of the present invention can effectively improve the curing uniformity of the adhesive used to bond the cover glass and the substrate during the curing process. Attached Figure Description

[0025] This manual includes the following figures, which illustrate the following:

[0026] Figure 1 This is a schematic diagram of the adhesive curing device for silicon-based OLED microdisplay devices of the present invention;

[0027] The diagram is marked as follows:

[0028] 1. Lamp assembly module; 2. Illuminance detection module; 3. Control system; 4. Platform; 5. Lamp assembly rotation drive device; 6. Lamp assembly frame; 7. DAM adhesive; 8. Lamp assembly module drive controller. Detailed Implementation

[0029] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the concept and technical solutions of the present invention, and to facilitate its implementation.

[0030] It should be noted that in the following embodiments, the terms "first," "second," and "third" do not represent an absolute distinction in structure and / or function, nor do they represent the order of execution; they are merely for the convenience of description.

[0031] Firstly, such as Figure 1 As shown, this embodiment of the invention provides a silicon-based OLED microdisplay device adhesive curing device, including a lamp module, an illuminance detection module located below the lamp module for collecting illuminance data, a lamp rotation drive device for controlling the lamp module to perform 360° rotation illuminance, and a control system electrically connected to the illuminance detection module and the lamp rotation drive device.

[0032] Specifically, such as Figure 1As shown, the lamp module includes a lamp frame and multiple lamp units mounted on the frame, all evenly distributed. Each lamp unit includes multiple light sources, all evenly distributed, and the light sources are UV LEDs. The light sources are electrically connected to the lamp module drive controller, which controls the on / off state of the light sources and adjusts their power. The lamp module drive controller is also electrically connected to the control system.

[0033] In embodiments of the present invention, such as Figure 1 As shown, the substrate of the silicon-based OLED microdisplay device is placed on a stage, which is located below the lamp module. Adhesive is coated on the substrate, and the adhesive bonds the substrate and the cover glass. The adhesive is cured by the ultraviolet light energy emitted by the UV LED lamp.

[0034] The illuminance detection module is configured to perform a second irradiation data acquisition when a first preset condition is met. In this embodiment of the invention, the first preset condition is: after the lamp module completes the first irradiation, the control system analyzes the irradiation data acquired by the illuminance detection module, obtains an irradiation uniformity result, and determines that the irradiation uniformity does not meet the requirements. After the first preset condition is met, the power of the lamp module is adjusted, and the lamp module performs irradiation again, i.e., a second irradiation. Then, the illuminance detection module acquires irradiation data again, i.e., a second irradiation data acquisition.

[0035] The lamp assembly rotation drive device is configured to control the lamp assembly module to rotate 360° for irradiation when a second preset condition is met. In this embodiment of the invention, the second preset condition is: after the lamp assembly module completes the second irradiation, the system analyzes the irradiation data collected by the contrast detection module, obtains the irradiation uniformity result, and determines that the irradiation uniformity still does not meet the requirements. The second preset condition can also be: after the lamp assembly module completes the second irradiation, it is necessary to further improve the adhesive curing effect.

[0036] In embodiments of the present invention, such as Figure 1 As shown, the lamp assembly rotation drive device is connected to the lamp assembly frame. This device controls the rotation speed of the lamp assembly module, calculated based on theoretical values ​​of parameters such as the set irradiation time t, illuminance I, and accumulated light E. During operation, the lamp assembly module must rotate 360° for irradiation. The rotation speed of the lamp assembly module must be uniform, neither too fast nor too slow. This method ensures that the adhesive in each area of ​​the substrate receives the same light energy, thereby improving the uniformity of adhesive curing in each area.

[0037] In this embodiment of the invention, the light accumulation amount E = I × t. When it comes to the rotation curing operation, in order to ensure the uniformity of the light accumulation amount, the lamp module needs to rotate n times (1 rotation means that the lamp module rotates 360° once for irradiation), n≥1. Therefore, the irradiation time t is the operation cycle T during the rotation operation. Therefore, the rotational angular velocity of the lamp module ω = 2πn / T.

[0038] Secondly, the present invention also provides a method for curing adhesive for silicon-based OLED microdisplay devices, employing the above-described structure for curing adhesive for silicon-based OLED microdisplay devices, and comprising the following steps:

[0039] S1. Initialize the adhesive curing device for silicon-based OLED microdisplay devices;

[0040] S2. The illuminance detection module is moved below the lamp assembly module;

[0041] S3, the lamp module provides illumination;

[0042] S4, the illuminance detection module transmits the collected irradiance data to the control system;

[0043] S5. The control system determines whether a second irradiation is needed.

[0044] S6. The control system determines whether the lamp module needs to be rotated 360° for illumination.

[0045] S7. Place the substrate of the silicon-based OLED microdisplay device on the stage, stack the cover glass on the substrate, and apply adhesive between the substrate and the cover glass.

[0046] S8. Move the illuminance detection module out from under the lamp module so that the cover glass is directly below the lamp module;

[0047] S9. The lamp module illuminates the adhesive according to the set conditions to cure it.

[0048] In step S3 above, the lamp group drive controller controls the lamp group modules to turn on the light source of each lamp group module and adjust it to the set power, and irradiate the illuminance detection module for a certain period of time.

[0049] In step S5 above, after the lamp module completes the first irradiation, the control system analyzes the irradiation data collected by the illuminance detection module. If the irradiation uniformity result is obtained and it is determined that the irradiation uniformity does not meet the requirements, the lamp module needs to perform a second irradiation. After the lamp drive controller adjusts the power of the light source in the area where the illuminance and accumulated light amount on the lamp module do not meet the set values, energy uniformity is achieved. The lamp module then performs a second irradiation, and the illuminance detection module collects irradiation data again, that is, it performs a second irradiation data collection, and obtains the final power data of each light source as one of the curing parameters.

[0050] In step S5 above, after one irradiation is completed, the illuminance detection module sends the irradiation data to the control system for analysis. The system analyzes the accumulated light and illuminance of each area after a certain period of irradiation. If it is determined that the illuminance and accumulated light in a certain area of ​​the lamp module are too low, the module sends the lamp module position command information and adjustment amount that need to be adjusted to the lamp drive controller. The power of the light source in the area of ​​the lamp module where the illuminance and accumulated light do not meet the set value is adjusted.

[0051] In step S6 above, after the lamp module completes the second irradiation, the control system analyzes the irradiation data collected by the contrast detection module and obtains the irradiation uniformity result. If it is determined that the irradiation uniformity still does not meet the requirements, the lamp module needs to be controlled to perform 360° rotation irradiation.

[0052] In step S6 above, after the lamp module is controlled to rotate 360° for illumination, the lamp rotation drive device controls the angular velocity of the lamp module to rotate ω=2πn / T, where n is the number of rotations of the lamp module, T is the time required for the lamp module to complete 360° rotation, and t=T.

[0053] In step S6 above, the final rotational angular velocity and number of rotations of the lamp module are obtained as one of the curing parameters.

[0054] In step S9 above, final curing is performed. The lamp module is irradiated according to the set conditions to cure the adhesive. The lamp module needs to be irradiated by 360° rotation. The set conditions include the power of each light source in the lamp module, the rotational angular velocity ω of the lamp module during irradiation is determined according to the formula ω=2πn / T, and the cumulative light accumulation E is determined according to the formula E=I×t.

[0055] In step S9 above, the lamp rotation drive receives the instruction sent by the control system and makes corresponding adjustments to ensure that the amount of light accumulated in each area is consistent after the product enters the equipment, thereby improving the uniformity of glue curing.

[0056] The aforementioned silicon-based OLED microdisplay device adhesive curing device and curing method collect irradiation data before product deployment via an illuminance detection module. This data is then fed back to the control system. If irradiation uniformity is insufficient, the control system calculates and adjusts the light power based on the actual illuminance at each location, sending the necessary light power compensation signal to the lamp module drive controller. The illuminance detection module then performs a second data acquisition and transmits the collected irradiation data to the control system. If irradiation uniformity still does not meet requirements or better adhesive curing is needed, a rotation adjustment command can be sent to the lamp module rotation drive device. This allows the lamp module to rotate during the curing process. During operation, the lamp module rotates 360°, maintaining a uniform rotation speed. This method ensures that the adhesive in each area of ​​the substrate receives the same light energy, thereby improving the curing uniformity of each area. By utilizing the controllable light power of the UV lamp module and the driving technology that can be calculated and adjusted based on feedback, the adhesive on each small product area on the UV-irradiated substrate can be fully irradiated without over-irradiation. This solves the technical problems of uneven adhesive curing, low curing rate, and adhesive shrinkage or even detachment after the substrate is cured.

[0057] Thirdly, the present invention also provides a Micro OLED, which is manufactured using the above-described adhesive curing method for silicon-based OLED microdisplay devices.

[0058] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A silicon-based OLED microdisplay device adhesive curing apparatus, comprising a lamp assembly module, characterized in that, It also includes an illuminance detection module located below the lamp assembly module for collecting illumination data, a lamp assembly rotation drive device for controlling the lamp assembly module to rotate 360° for illumination, and a control system electrically connected to the illuminance detection module and the lamp assembly rotation drive device.

2. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to claim 1, characterized in that, The illuminance detection module is configured to perform secondary irradiation data collection when the first preset condition is met.

3. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to claim 2, characterized in that, The first preset condition is: after the lamp module completes the first irradiation, the control system analyzes the irradiation data collected by the illuminance detection module, obtains the irradiation uniformity result, and determines that the irradiation uniformity does not meet the requirements.

4. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to claim 2, characterized in that, The lamp group rotation drive device is configured to control the lamp group module to rotate 360° to illuminate when the second preset condition is met.

5. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to claim 4, characterized in that, The second preset condition is: after the lamp module completes the second irradiation, the control system analyzes the irradiation data collected by the illuminance detection module, obtains the irradiation uniformity result, and determines that the irradiation uniformity does not meet the requirements.

6. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to claim 4, characterized in that, The lamp group rotation drive device controls the speed at which the lamp group module rotates, and calculates based on the set illumination time, illuminance, and accumulated light amount.

7. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to any one of claims 1 to 6, characterized in that, The lamp module includes a lamp frame and lamp units disposed on the lamp frame. Multiple lamp units are provided, and each lamp unit includes multiple light sources.

8. The adhesive curing apparatus for silicon-based OLED microdisplay devices according to claim 7, characterized in that, The light source is a UV LED lamp.

9. A method for curing adhesives in silicon-based OLED microdisplay devices, characterized in that, The adhesive curing apparatus for silicon-based OLED microdisplay devices according to any one of claims 1 to 8, and comprising: The illuminance detection module is moved to a position below the lamp assembly module; The lamp module provides illumination; The illuminance detection module transmits the collected irradiance data to the control system; The control system determines whether a second irradiation is needed. The control system determines whether the lamp module needs to be rotated 360° for illumination.

10. A Micro OLED, characterized in that, The Micro OLED is manufactured using the adhesive curing method for silicon-based OLED microdisplay devices as described in claim 9.

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