Ultrasound transducer, method of making same, acoustic array, and sonar probe

By connecting the array elements to the circuit board using wire bonding technology, the problem of the connection between the array elements and the FPC affecting the imaging accuracy of the underwater sonar probe was solved, achieving higher imaging accuracy and stability.

CN122164641APending Publication Date: 2026-06-09JIANGXI ODIWEI NEW MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGXI ODIWEI NEW MATERIALS CO LTD
Filing Date
2026-02-11
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

In existing technologies, the connection process (welding and gluing) between array elements and FPC affects the imaging accuracy of underwater sonar probes, resulting in a decrease in imaging quality.

Method used

The array elements are connected to the circuit board using wire bonding technology. The first electrode of the array element is connected to the signal pad through the first bonding wire, and the second electrode of the array element is connected to the ground pad through the second bonding wire. The solder joints are controlled at the micron level to avoid high-temperature processes.

Benefits of technology

This reduces the interference of solder joints on the vibration modes of the array elements, improves imaging accuracy, avoids the influence of high temperature on the vibration modes of the array elements, and ensures the imaging quality of the product.

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Abstract

This application relates to an ultrasonic transducer, its manufacturing method, an acoustic array, and a sonar probe. The ultrasonic transducer includes a circuit board and array elements. The circuit board has signal electrode pads and a ground pad. The array elements are used to receive or transmit acoustic pulse signals and have a first electrode and a second electrode. The first electrode is electrically connected to the signal electrode pad via a first bonding wire using wire bonding, and the second electrode is electrically connected to the ground pad via a second bonding wire using wire bonding. The aforementioned ultrasonic transducer can improve the imaging accuracy of a sonar probe.
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