Thermal conductive silica gel modification method for heat dissipation of smart grid power transformation equipment

CN122168032APending Publication Date: 2026-06-09DONGGUAN SHUNZHAO ELECTRONIC PLASTIC TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN SHUNZHAO ELECTRONIC PLASTIC TECH CO LTD
Filing Date
2026-04-21
Publication Date
2026-06-09

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Abstract

The application discloses a heat-conducting silica gel modification method for heat dissipation of smart power grid transformer equipment, and belongs to the technical field of transformer equipment thermal management. In view of the problems of disordered distribution of the existing heat-conducting silica gel filler, high interface thermal resistance and no cooperation with the electromagnetic field of the transformer equipment, the application is modified by compounding magnetic ferroferric oxide modified hexagonal boron nitride and gradient particle size spherical alumina, and modifying a double-end vinyl polysiloxane macromolecular coupling agent, and is oriented and solidified in situ in a power frequency alternating electromagnetic field to form a directional heat-conducting channel. The heat-conducting coefficient of the application reaches 9.8 W / (m*K), the volume resistivity is 8.5*10 14 Ω*cm, the temperature drop of a wiring terminal of the transformer equipment is 33 DEG C, and the heat-conducting and insulating performance is improved in cooperation.
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