High-frequency low-loss planar transformer core structure

Abstract

This invention discloses a high-frequency, low-loss planar transformer core structure, relating to the field of planar transformer technology. It includes a multi-layered outer shell; a core support component is adjustable on the top of the multi-layered shell; modular core components are mounted and fixed on the core support component; magnetic flux at the air gap edge is eliminated through a composite magnetic circuit of ferrite and soft magnetic composite materials, reducing eddy current losses; and elastically pre-tightened core columns ensure magnetic circuit stability. A three-stage heat dissipation system is employed, consisting of heat pipe equalization, microchannel liquid cooling, and shell radiation, reducing the hot spot temperature difference to within 5°C and achieving a thermal resistance of only 0.05 K / W. Elastic gaps compensate for assembly tolerances and thermal expansion, guide locking enables precise positioning, and shock absorbers attenuate vibration by more than 80%. Integrated temperature, pressure, and strain sensors provide over-temperature protection, dynamic heat dissipation, and stress warning.

Description

Technical Field

[0001] This invention relates to the field of planar transformer technology, specifically a high-frequency, low-loss planar transformer core structure. Background Technology

[0002] Traditional solutions using a single ferrite core with a concentrated air gap generate significant edge flux, leading to eddy current losses in the windings. Furthermore, ferrite hysteresis losses increase sharply with frequency. Simultaneously, the limited heat dissipation area of ​​planar structures under natural heat dissipation conditions easily creates localized hot spots, accelerating insulation aging and causing a decline in core performance. In addition, ferrite materials are highly brittle and sensitive to external vibrations. Rigid fixing methods cannot effectively buffer vibration energy, and the reliance on manual shims for air gap assembly results in poor consistency. Differences in thermal expansion can also cause inductor drift. Existing products cannot detect internal parameters such as temperature and stress in real time, making predictive maintenance difficult. Summary of the Invention

[0003] Therefore, in order to overcome the above-mentioned shortcomings, the present invention provides a high-frequency, low-loss planar transformer core structure.

[0004] This invention is achieved by constructing a high-frequency, low-loss planar transformer core structure. The device includes a multi-layered outer shell; a core support component is adjustablely mounted on the top of the multi-layered outer shell; a modular core component is mounted and fixed on the core support component; a heat dissipation composite cover plate covers the top of the multi-layered outer shell; and a microchannel liquid-cooled heat sink plate for heat dissipation is attached to the inner bottom of the modular core component.

[0005] Preferably, the modular magnetic core component includes a magnetic core disposed on a microchannel liquid cooling heat sink; the magnetic core is provided with a positioning boss for positioning, and the positioning boss cooperates with the groove on the side of the magnetic core post; a spring washer for compression adjustment is provided between the magnetic core and the magnetic core post; a winding composite plate is superimposed on the inside of the magnetic core and the outside of the magnetic core post.

[0006] Preferably, the winding composite board includes a bottom heat dissipation substrate fixedly mounted on top of the magnetic core; a thermally conductive insulating pad is disposed on top of the bottom heat dissipation substrate; a ferrite core layer is disposed on top of the thermally conductive insulating pad; a primary-side PCB winding board is disposed on top of the ferrite core layer; a polyimide insulating film is disposed on top of the primary-side PCB winding board; a secondary-side PCB winding board is disposed on top of the polyimide insulating film; a soft magnetic composite material layer is disposed on top of the secondary-side PCB winding board; and an upper heat dissipation substrate is disposed on top of the soft magnetic composite material layer; the bottom heat dissipation substrate and the upper heat dissipation substrate are pressed and fixed together by stainless steel rivets and ceramic insulating sleeves.

[0007] Preferably, the magnetic core support component includes a guide locking component slidably disposed on the inner side wall of the multilayered housing; the top of the guide locking component rod is provided with an upper slot plate, and the upper slot plate is fixedly disposed with the upper heat dissipation substrate of the winding composite plate; the inner top side of the multilayered housing is provided with a lower slot plate, and the lower slot plate is fixedly disposed with the bottom heat dissipation substrate of the winding composite plate.

[0008] Preferably, the upper slot plate and the upper heat dissipation substrate are fitted with a clearance of 0.1 mm, and an elastic clamping force is applied by the spring washer; the lower slot plate and the bottom heat dissipation substrate are fitted with a clearance of 0.1 mm.

[0009] Preferably, the magnetic core column is molded from a soft magnetic composite material and is wrapped with a double-layer insulating sleeve, the inner layer being a polyimide film and the outer layer being a PEEK tube.

[0010] Preferably, the spring washer is a wave spring washer with a compression of 0.1mm to 0.2mm and a preload of 5N to 10N.

[0011] Preferably, the microchannel liquid cooling heat sink has a serpentine microchannel flow channel inside; the inlet and outlet of the microchannel liquid cooling heat sink are equipped with M5 quick connectors; thermally conductive silicone grease is applied between the microchannel liquid cooling heat sink and the bottom heat sink substrate, and they are fastened with screws.

[0012] Preferably, the heat dissipation composite cover has a three-layer composite structure: the outer layer is a perforated aluminum alloy plate, the middle layer is a wave-absorbing material, and the inner layer is copper foil; the frame of the heat dissipation composite cover is embedded with a conductive rubber strip, which forms a conductive contact with the top edge of the multi-layered shell; the heat dissipation composite cover is detachably connected to the multi-layered shell by a captive screw.

[0013] Preferably, the multilayer shell is a three-layer composite structure: the inner layer is a soft magnetic composite material molded shell; the middle layer is a graphene thermal conductive film; and the outer layer is an aluminum alloy shell with a black anodized surface. The inner wall of the multilayer shell is provided with a spiral thermal conductive groove, and a wave spring clamping plate is built into the top.

[0014] The present invention has the following advantages: It provides an improved high-frequency, low-loss planar transformer core structure, which, compared to similar devices, has the following improvements:

[0015] The present invention discloses a high-frequency, low-loss planar transformer core structure. This structure eliminates magnetic flux at the air gap edge through a composite magnetic circuit of ferrite and soft magnetic composite materials, reducing eddy current losses. Elastic pre-tightened core columns ensure magnetic circuit stability. It employs a three-stage heat dissipation system: heat pipe equalization, microchannel liquid cooling, and shell radiation, reducing the hotspot temperature difference to within 5°C and achieving a thermal resistance of only 0.05 K / W. Elastic gaps compensate for assembly tolerances and thermal expansion, guide locking enables precise positioning, and shock absorbers attenuate vibrations by more than 80%. Integrated temperature, pressure, and strain sensors provide over-temperature protection, dynamic heat dissipation, and stress warning. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the magnetic core support component and the microchannel liquid cooling heat sink structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the axial structure of the modular magnetic core component of the present invention;

[0019] Figure 4 This is an exploded structural diagram of the modular magnetic core component of the present invention;

[0020] Figure 5 This is an exploded structural diagram of the winding composite plate of the present invention.

[0021] The components include: multi-layered outer shell - 1, magnetic core support component - 2, modular magnetic core component - 3, heat dissipation composite cover plate - 4, microchannel liquid cooling heat dissipation plate - 5, guide locking component - 21, upper slot plate - 22, lower slot plate - 23, magnetic core - 31, positioning boss - 32, spring washer - 33, magnetic core column - 34, winding composite plate - 35, bottom heat dissipation substrate - 351, thermally conductive insulating pad - 352, ferrite magnetic core layer - 353, primary side PCB winding board - 354, polyimide insulating film - 355, secondary side PCB winding board - 356, soft magnetic composite material layer - 357, upper heat dissipation substrate - 358, stainless steel rivet - 359, ceramic insulating sleeve - 3510. Detailed Implementation

[0022] The following is in conjunction with the appendix Figures 1-5 The principles and features of the present invention are described below. The examples given are for illustrative purposes only and are not intended to limit the scope of the invention. The invention is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.

[0023] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The embodiments of this invention will now be described according to its overall structure.

[0025] Example 1:

[0026] Please see Figures 1-5 The present invention discloses a high-frequency, low-loss planar transformer core structure, comprising a multi-layered outer shell 1; a core support component 2 is adjustablely disposed on the top of the multi-layered outer shell 1; a modular core component 3 is mounted and fixed on the core support component 2; a heat dissipation composite cover plate 4 covers the top of the multi-layered outer shell 1; and a microchannel liquid cooling heat dissipation plate 5 for heat dissipation is attached to the inner bottom of the modular core component 3.

[0027] The modular magnetic core component 3 includes a magnetic core 31 disposed on a microchannel liquid cooling heat sink 5; a positioning boss 32 with a positioning function is provided on the magnetic core 31, and the positioning boss 32 cooperates with the side groove of the magnetic core post 34; a spring washer 33 with a compression adjustment function is provided between the magnetic core 31 and the magnetic core post 34, and a micro strain gauge is attached to the end face of the magnetic core post 34; a winding composite plate 35 is superimposed inside the magnetic core 31 and outside the magnetic core post 34.

[0028] The winding composite board 35 includes a bottom heat dissipation substrate 351 fixedly mounted on top of the magnetic core 31; a thermally conductive insulating pad 352 is disposed on top of the bottom heat dissipation substrate 351; a ferrite core layer 353 is disposed on top of the thermally conductive insulating pad 352, and a thermistor is disposed on the surface of the ferrite core layer 353; a primary-side PCB winding board 354 is disposed on top of the ferrite core layer 353; a polyimide insulating film 355 is disposed on top of the primary-side PCB winding board 354; a secondary-side PCB winding board 356 is disposed on top of the polyimide insulating film 355, and a thin-film resistor is disposed inside the secondary-side PCB winding board; a soft magnetic composite material layer 357 is disposed on top of the secondary-side PCB winding board 356; an upper heat dissipation substrate 358 is disposed on top of the soft magnetic composite material layer 357; the bottom heat dissipation substrate 351 and the upper heat dissipation substrate 358 are pressed and fixed together by stainless steel rivets 359 and ceramic insulating sleeves 3510.

[0029] The magnetic core support component 2 includes a guide locking component 21 that is slidably disposed on the inner side wall of the multilayer housing 1; the top of the guide locking component 21 is provided with an upper slot plate 22, and the upper slot plate 22 is fixedly disposed with the upper heat dissipation substrate 358 of the winding composite plate 35; the inner top side of the multilayer housing 1 is provided with a lower slot plate 23, and the lower slot plate 23 is fixedly disposed with the bottom heat dissipation substrate 351 of the winding composite plate 35.

[0030] The upper card slot plate 22 and the upper heat dissipation substrate 358 are fitted with a clearance of 0.1mm, and an elastic clamping force is applied by a spring washer 33; the lower card slot plate 23 and the bottom heat dissipation substrate 351 are fitted with a clearance of 0.1mm.

[0031] The magnetic core post 34 is molded from soft magnetic composite material and is wrapped with a double-layer insulating sleeve, with an inner layer of polyimide film and an outer layer of PEEK tube.

[0032] Spring washer 33 is a wave spring washer with a compression of 0.1mm to 0.2mm and a preload of 5N to 10N; the piezoresistive pressure sensor is located between the upper slot plate 22 and the upper heat dissipation substrate 358.

[0033] The microchannel liquid cooling heat sink 5 has a serpentine microchannel flow channel inside; the inlet and outlet of the microchannel liquid cooling heat sink 5 are equipped with M5 quick connectors; thermally conductive silicone grease is applied between the microchannel liquid cooling heat sink 5 and the bottom heat sink substrate 351, and they are fastened with screws.

[0034] Example 2:

[0035] Please see Figures 1-5The present invention provides a high-frequency, low-loss planar transformer core structure. Compared with Embodiment 1, this embodiment further includes: a heat dissipation composite cover plate 4 with a three-layer composite structure: the outer layer is a perforated aluminum alloy plate, the middle layer is a wave-absorbing material, and the inner layer is a copper foil; the frame of the heat dissipation composite cover plate 4 is embedded with a conductive rubber strip, which forms a conductive contact with the top edge of the multi-layered outer shell 1; the heat dissipation composite cover plate 4 is detachably connected to the multi-layered outer shell 1 by a non-detachable screw.

[0036] The multi-layered shell 1 has a three-layer composite structure: the inner layer is a molded shell of soft magnetic composite material; the middle layer is a graphene thermal conductive film; and the outer layer is an aluminum alloy shell with a black anodized surface. The inner wall of the multi-layered shell 1 is provided with a spiral thermal conductive groove, and a wave spring clamping plate is built into the top.

[0037] The working principle of the high-frequency, low-loss planar transformer core structure described above is as follows:

[0038] First, a high-frequency AC voltage is applied to the primary-side PCB winding board 354 via an external controller, causing the primary-side current to rise. According to Faraday's law of electromagnetic induction, the current establishes a main magnetic flux in the ferrite core layer 353. This layer provides a low magnetic reluctance path to enhance the coupling coefficient between the primary and secondary sides. Some of the magnetic flux enters the soft magnetic composite material layer 357 and the core column 34. Since the soft magnetic composite material layer has a low permeability, its equivalent magnetic reluctance replaces the traditional concentrated air gap, and it has no sharp edges, thus completely eliminating the magnetic flux at the air gap edges and significantly reducing the winding eddy current loss caused by the proximity effect. The core column 34 is engaged with the core groove through the positioning boss 32, and an elastic preload is applied by the spring washer 33 to ensure that the magnetic circuit remains closed at different temperatures, and the equivalent air gap length remains constant. The alternating magnetic flux is finally coupled to the secondary-side PCB winding board 356, inducing an electromotive force, which is then rectified and used to supply power to the load, completing the electromagnetic energy conversion.

[0039] Secondly, during transformer operation, the hysteresis loss of the ferrite core layer 353, the copper loss of the PCB winding, and the small amount of eddy current loss of the soft magnetic composite material layer 357 are converted into heat. This heat is first diffused in-plane through heat pipes or a vapor chamber inside the winding composite plate 35, utilizing phase change heat transfer to rapidly diffuse the heat from the hot spot at the center of the core to the entire composite plate plane, reducing the temperature difference within the layer from 15℃ to below 5℃. Subsequently, the heat is transferred through the bottom heat dissipation substrate 351 to the microchannel liquid-cooled heat dissipation plate 5, and the heat is transferred between the two... Coated with thermally conductive silicone grease, the coolant in the serpentine microchannels inside the liquid cooling plate undergoes forced convection, carrying away most of the heat with a heat transfer coefficient as high as 8000-12000 W / m²·K, with a thermal resistance of only 0.05 K / W. The remaining heat is dissipated into the environment through natural convection and radiation via the three-layer composite structure of the multi-layered outer shell 1 and the perforated aluminum alloy surface of the heat dissipation composite cover plate 4. The spiral heat-conducting grooves on the inner wall of the outer shell increase the heat dissipation area by about 30%, and the 40% opening rate of the cover plate allows hot air to rise and escape.

[0040] Third, during assembly and operation, a 0.1mm gap is reserved between the upper slot plate 22 and the upper heat dissipation substrate 358, and between the lower slot plate 23 and the bottom heat dissipation substrate 351, and an elastic clamping force is applied by the spring washer 33. This elastic element compensates for the assembly tolerance and the thermal expansion difference between the ferrite and the aluminum alloy shell, ensuring stable contact thermal resistance between each layer and avoiding a decrease in contact pressure or change in magnetic circuit gap due to thermal expansion. The guide locking member 21 is slidably set on the inner side wall of the multi-layer shell 1, and the top of its rod is fixed to the upper slot plate 22. When pushed in, it moves along the guide groove and automatically locks, realizing precise positioning and quick disassembly of the magnetic core and winding. At the same time, a rubber and metal composite shock absorber can be set at the bottom of the shell to attenuate more than 80% of the external vibration energy and protect the brittle ferrite core from breakage.

[0041] Fourth, a thermistor is attached to the surface of the ferrite core layer 353 to monitor the core temperature, a thin film resistor is embedded inside the secondary PCB winding board 356 to monitor the winding temperature, a piezoresistive pressure sensor is set between the upper slot plate 22 and the upper heat dissipation substrate 358 to monitor the clamping force, and a micro strain gauge is attached to the end face of the core column 34 to monitor the stress; all sensing signals are output to an external controller through cables; the controller executes closed-loop control according to preset logic.

[0042] This invention provides an improved high-frequency, low-loss planar transformer core structure. It eliminates magnetic flux at the air gap edge and reduces eddy current losses through a composite magnetic circuit of ferrite and soft magnetic composite materials. Elastic pre-tightened core columns ensure magnetic circuit stability. A three-stage heat dissipation system—heat pipe equalization, microchannel liquid cooling, and shell radiation—reduces the hot spot temperature difference to within 5°C and achieves a thermal resistance of only 0.05 K / W. Elastic gaps compensate for assembly tolerances and thermal expansion, guide locking enables precise positioning, and shock absorbers attenuate vibration by over 80%. Integrated temperature, pressure, and strain sensors provide over-temperature protection, dynamic heat dissipation, and stress warning.

[0043] The above description shows and illustrates the basic principles, main features, and advantages of the present invention. Standard parts used in the present invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts, and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0044] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-frequency, low-loss planar transformer core structure, comprising a multi-layered outer shell (1); a core support component (2) is adjustablely disposed on the top of the multi-layered outer shell (1); a modular core component (3) is mounted and fixed on the core support component (2); a heat dissipation composite cover plate (4) covers the top of the multi-layered outer shell (1); and a microchannel liquid-cooled heat dissipation plate (5) for heat dissipation is attached to the inner bottom of the modular core component (3). Its features are: The modular magnetic core component (3) includes a magnetic core (31) disposed on a microchannel liquid cooling heat sink (5); a positioning boss (32) with a positioning function is provided on the magnetic core (31), and the positioning boss (32) cooperates with the side groove of the magnetic core column (34); a spring washer (33) with a compression adjustment function is provided between the magnetic core (31) and the magnetic core column (34); a winding composite plate (35) is superimposed on the inside of the magnetic core (31) and the outside of the magnetic core column (34).

2. The high-frequency, low-loss planar transformer core structure according to claim 1, characterized in that: The winding composite board (35) includes a bottom heat dissipation substrate (351) fixedly installed on top of the magnetic core (31); a thermally conductive insulating pad (352) is provided on top of the bottom heat dissipation substrate (351); a ferrite core layer (353) is provided on top of the thermally conductive insulating pad (352); a primary PCB winding board (354) is provided on top of the ferrite core layer (353); a polyimide insulating film (355) is provided on top of the primary PCB winding board (354); a secondary PCB winding board (356) is provided on top of the polyimide insulating film (355); a soft magnetic composite material layer (357) is provided on top of the secondary PCB winding board (356); an upper heat dissipation substrate (358) is provided on top of the soft magnetic composite material layer (357); the bottom heat dissipation substrate (351) and the upper heat dissipation substrate (358) are pressed and fixed together by stainless steel rivets (359) and ceramic insulating sleeves (3510).

3. The high-frequency, low-loss planar transformer core structure according to claim 2, characterized in that: The magnetic core support component (2) includes a guide locking component (21) slidably disposed on the inner side wall of the multilayer shell (1); the top of the guide locking component (21) is provided with an upper slot plate (22), and the upper slot plate (22) is fixedly disposed with the upper heat dissipation substrate (358) of the winding composite plate (35); the inner top side of the multilayer shell (1) is provided with a lower slot plate (23), and the lower slot plate (23) is fixedly disposed with the bottom heat dissipation substrate (351) of the winding composite plate (35).

4. The high-frequency, low-loss planar transformer core structure according to claim 3, characterized in that: The upper slot plate (22) and the upper heat dissipation substrate (358) are fitted with a clearance of 0.1 mm, and an elastic clamping force is applied by the spring washer (33); the lower slot plate (23) and the bottom heat dissipation substrate (351) are fitted with a clearance of 0.1 mm.

5. The high-frequency, low-loss planar transformer core structure according to claim 4, characterized in that: The magnetic core column (34) is molded from soft magnetic composite material and is wrapped with a double-layer insulating sleeve. The inner layer is a polyimide film and the outer layer is a PEEK tube.

6. The high-frequency, low-loss planar transformer core structure according to claim 5, characterized in that: The spring washer (33) is a wave spring washer with a compression of 0.1mm to 0.2mm and a preload of 5N to 10N.

7. The high-frequency, low-loss planar transformer core structure according to claim 6, characterized in that: The microchannel liquid cooling heat sink (5) has a serpentine microchannel flow channel inside; the inlet and outlet of the microchannel liquid cooling heat sink (5) are equipped with M5 quick connectors; thermally conductive silicone grease is applied between the microchannel liquid cooling heat sink (5) and the bottom heat sink substrate (351), and they are fastened with screws.

8. The high-frequency, low-loss planar transformer core structure according to claim 7, characterized in that: The heat dissipation composite cover (4) is a three-layer composite structure: the surface layer is a perforated aluminum alloy plate, the middle layer is a wave-absorbing material, and the inner layer is a copper foil; the frame of the heat dissipation composite cover (4) is embedded with a conductive rubber strip, which forms a conductive contact with the top edge of the multi-layer shell (1); the heat dissipation composite cover (4) is detachably connected to the multi-layer shell (1) by a non-detachable screw.

9. The high-frequency, low-loss planar transformer core structure according to claim 8, characterized in that: The multi-layered shell (1) is a three-layer composite structure: the inner layer is a soft magnetic composite material molded shell; the middle layer is a graphene thermal conductive film; the outer layer is an aluminum alloy shell with black anodized surface; the inner wall of the multi-layered shell (1) is provided with a spiral thermal conductive groove, and a wave spring clamping plate is built into the top.

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