Cuboid camera module

Abstract

A cube camera module is disclosed. The cube camera module includes a lens, a sensor package assembly mounted to the lens, a positioning bracket, and an adhesive. The lens includes a lens holder and a lens piece, and the lens holder is opaque and has a top surface, a bottom surface opposite to the top surface, and a ring side surface connected to the top surface and the bottom surface. The lens holder includes a receiving groove recessed in the bottom surface and a through hole recessed in the top surface and communicated with the receiving groove. The lens piece and the positioning bracket are stacked in the receiving groove. The adhesive is formed on the bottom surface of the lens holder and covers a ring side edge of the sensor package assembly, and the adhesive has an outer ring side surface which is flush with the ring side surface of the lens holder. Accordingly, by taking the lens holder as the structural basis of the overall architecture, the production yield of the cube camera module can be improved and the size can be smaller.

Description

[0001] This application is a divisional application of the invention patent application with application number 202410723895.5, application date June 5, 2024, and invention title "Cube Camera Module and Manufacturing Method Thereof". Technical Field

[0002] This application relates to the field of camera equipment, and more particularly to a cube camera module. Background Technology

[0003] Existing camera module manufacturing methods involve directly forming multiple packaged components on a wafer, and then mounting a lens and a housing onto each packaged component. However, any camera module manufactured using the wafer as the substrate by existing methods requires a stepped structure in its shape, which is not conducive to further size reduction.

[0004] Therefore, the applicant believes that the above-mentioned defects can be improved. So, the applicant has devoted himself to research and applied scientific principles, and finally proposed a design that is reasonable and effectively improves the above-mentioned defects. Summary of the Invention

[0005] This application provides a cubic camera module and its manufacturing method, which can effectively improve the defects that may arise from existing camera module manufacturing methods.

[0006] This application discloses a method for manufacturing a cube camera module, comprising: a preparation step: providing a lens mount plate, which defines a plurality of lens mounts arranged in a matrix; wherein each lens mount is opaque and has a receiving groove on its bottom surface; a placement step: placing a lens in the receiving groove of each lens mount, collectively defining a lens; an installation step: installing a sensor packaging assembly on each lens, adjacent to the bottom surface of the lens mount; wherein each sensor packaging assembly includes a sensing chip, a light-transmitting layer mounted on the sensing chip, and a layer disposed on the sensing chip and Multiple welded bodies away from the light-transmitting layer; a sealing step: forming an adhesive layer on the lens mount plate, which covers the bottom surface of each lens mount and the circumferential edge of each sensor package assembly; wherein multiple welded bodies of each sensor package assembly are exposed outside the adhesive layer; and a cutting step: cutting the lens mount plate and the adhesive layer so that the lens mount plate is cut into multiple lens mounts that are separated from each other, and the adhesive layer is cut into multiple adhesive bodies that are separated from each other, to separate multiple cubic camera modules; wherein each cubic camera module includes a lens, a corresponding sensor package assembly, and a corresponding adhesive body.

[0007] Optionally, in the preparation step, each lens mount has a through hole on its top surface that communicates with the receiving slot; in the installation step, a central axis of the through hole of each lens mount passes through a sensing area of ​​the corresponding sensor package assembly.

[0008] Optionally, during the placement step, an optical surface of each lens is positioned away from the perforation of the corresponding mount and falls on the central axis of the perforation.

[0009] Optionally, during the placement step, each lens mount has a positioning bracket on the lens within its receiving slot, which together define the lens; during the installation step, each lens is connected to the corresponding sensor packaging assembly via the positioning bracket.

[0010] Optionally, the lens and positioning bracket of each lens are a single-piece structure connected as one piece; during the placement step, the lens and the corresponding positioning bracket are simultaneously placed in the receiving groove of each lens mount.

[0011] Optionally, during the placement step, one end of each positioning bracket protrudes into a corresponding receiving groove; during the installation step, each lens is connected to a corresponding sensor packaging assembly via the end of the positioning bracket.

[0012] Optionally, during the installation process, the bottom surface of each mirror mount is separated from the corresponding sensor package assembly by an annular gap of no more than 60 micrometers.

[0013] Optionally, the end of each positioning bracket is annular; during the installation process, each lens is connected to the corresponding sensor encapsulation assembly with an annular adhesive layer.

[0014] Optionally, during the installation step, a gap is formed between the end of each lens and the corresponding sensor packaging assembly, located outside the annular adhesive layer; during the sealing step, the adhesive layer fills the gap corresponding to each lens but does not penetrate each annular adhesive layer.

[0015] Optionally, the outer surface of each sensor package assembly includes a ring side edge, a first surface located in the light-transmitting layer, and a second surface located on the sensing chip and opposite to the first surface. A plurality of solder bodies are disposed on the second surface, and the ring side edge is connected between the first surface and the second surface. During the installation step, each lens is connected to the first surface of the corresponding sensor package assembly. During the sealing step, the second surface of each sensor package assembly and the plurality of solder bodies are exposed outside the adhesive layer.

[0016] Optionally, each sensor package assembly includes a sensing area located between the first surface and the second surface and surrounded inside it by a ring side edge.

[0017] This application also discloses a cube camera module, comprising: a lens, including: a lens mount, which is opaque and has a top surface, a bottom surface located on the opposite side of the top surface, and an annular side surface connected to the top surface and the bottom surface; wherein the lens mount includes a receiving groove recessed in the bottom surface and a through hole recessed in the top surface and communicating with the receiving groove; and a lens disposed in the receiving groove; a sensor packaging assembly, including: a sensing chip; and a light-transmitting layer mounted on the sensing chip; wherein the outer surface of the sensor packaging assembly has a light-transmitting layer located on the light-transmitting layer. The sensor package includes a first surface, a second surface located on the sensor chip and opposite to the first surface, and an annular side edge connected between the first surface and the second surface; and a plurality of solder bodies disposed on the second surface of the sensor chip; wherein the sensor package assembly is mounted on the lens with the first surface; and an adhesive formed on the bottom surface of the lens mount and covering the annular side edge of the sensor package assembly, wherein the second surface of the sensor package assembly and the plurality of solder bodies are exposed outside the adhesive; wherein the adhesive has an annular outer side surface that is flush with the annular side surface of the lens mount.

[0018] Optionally, the sensor package assembly includes a sensing region located between the first surface and the second surface and surrounded inside by a ring side edge; a central axis of the perforation of the mirror mount passes through the sensing region.

[0019] Optionally, the bottom surface of the lens mount has an annular gap of no more than 60 micrometers between it and the first surface of the sensor packaging assembly, which is filled with colloid.

[0020] Optionally, the lens further includes a positioning bracket disposed within the receiving groove and on the lens, with one end of the positioning bracket protruding from the receiving groove, and the lens being connected to the first surface of the sensor packaging assembly via the end of the positioning bracket to form an annular gap.

[0021] Optionally, the lens and the positioning bracket are a single-piece structure connected as one unit.

[0022] Optionally, the end of the positioning bracket is annular, the lens includes an annular adhesive layer connecting the end to the first surface, and the adhesive does not penetrate the annular adhesive layer.

[0023] Optionally, a slit is formed between the end portion of the lens and the first surface of the sensor packaging assembly, located outside the annular adhesive layer, which communicates with the annular gap and is filled with colloid.

[0024] Optionally, the lens has an optical surface that is away from the perforation and faces the first surface, which lies on a central axis of the perforation.

[0025] Alternatively, the lens and sensor packaging components together form a closed space with air inside.

[0026] Beneficial effects of the invention The cube camera module and its manufacturing method disclosed in this application, by using multiple lens mounts (or lens mount plates) as the structural basis of the entire architecture or process, facilitates the prior manufacturing and production of multiple sensor packaging components and the selection of good products, thereby improving the production yield of multiple cube camera modules and enabling each cube camera module to have a smaller size.

[0027] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0028] Figure 1 This is a flowchart illustrating the manufacturing method of a cube camera module according to an embodiment of this application. Figure 2 for Figure 1 A schematic diagram illustrating the preparation steps of the manufacturing method for a cube camera module. Figure 3 for Figure 2 A schematic cross-sectional view along section line III-III. Figure 4 for Figure 1 A schematic diagram of the component placement steps in the manufacturing method of the cube camera module.

[0029] Figure 5 for Figure 1 A schematic diagram illustrating the installation steps of the manufacturing method for the cube camera module. Figure 6 for Figure 1 A schematic diagram of the sealing steps in the manufacturing method of the cube camera module.

[0030] Figure 7 for Figure 6 An enlarged schematic diagram of region VII. Figure 8 for Figure 1 A schematic diagram of the cutting steps in the manufacturing method of the cube camera module.

[0031] Figure 9 This is a three-dimensional schematic diagram of a cube camera module according to an embodiment of this application. Figure 10 for Figure 9 A cross-sectional view along section line XX. Detailed Implementation The following specific embodiments illustrate the implementation of the "cubic camera module and its manufacturing method" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings of this application are for simple illustrative purposes only and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0032] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0033] Please see Figures 1 to 10 As shown, this is an embodiment of the present application. Figure 1 As shown, this embodiment discloses a method for manufacturing a cube camera module, which sequentially includes (or sequentially implements) a preparation step S110, a component placement step S120, an installation step S130, a sealing step S140, and a cutting step S150.

[0034] This embodiment describes the following steps S110 to S150 of the cubic camera module manufacturing method S100 in sequence, thereby producing multiple cubic camera modules 100 (e.g., ...). Figure 8 However, this application is not limited thereto. For example, in other embodiments not illustrated in this application, the above-described multiple steps S110 to S150 of the cube camera module manufacturing method S100 may be added, removed, or adjusted according to design requirements.

[0035] The preparation step S110: as follows: Figures 1 to 3 As shown, a mirror mount plate 10 is provided, which defines a plurality of mirror mounts 1 arranged in a matrix. Each mirror mount 1 is opaque and has a receiving groove 13 on its bottom surface 12, and each mirror mount 1 has a through hole 14 on its top surface 11 communicating with the receiving groove 13. In this embodiment, the through hole 14 of each mirror mount 1 is generally conical in shape, and its cross-section tapers away from the top surface 11.

[0036] Furthermore, such as Figure 4 and Figure 5 As shown, in this embodiment, the preparation step S110 may further include multiple lenses 2, multiple positioning brackets 3 respectively disposed on the multiple lenses 2, and multiple sensor packaging components 4. In this embodiment, each lens 2 and the corresponding positioning bracket 3 are a single-piece structure connected to each other, and its height is slightly greater than the depth of any of the receiving slots 13, but this application is not limited thereto.

[0037] Furthermore, each of the sensor package components 4 includes a sensing chip 41, a light-transmitting layer 42 mounted on the sensing chip 41, and a plurality of solder bodies 43 (e.g., solder balls) disposed on the sensing chip 41 and away from the light-transmitting layer 42. In each of the sensor package components 4, the upper surface of the sensing chip 41 includes a sensing area 411, and the light-transmitting layer 42 is bonded to the upper surface and surrounds the periphery of the sensing area 411, thus being spaced apart from the sensing area 411. The plurality of solder bodies 43 are fixed to the lower surface of the sensing chip 41 at intervals. In this embodiment, the light-transmitting layer 42 is bonded to the sensing chip 41 through a bonding layer 44 to form a sealed space, and the sensing area 411 is located within the sealed space.

[0038] In other words, the outer surface of each sensor package assembly 4 includes a first surface 4a located on the light-transmitting layer 42, a second surface 4b located on the sensing chip 41 and opposite to the first surface 4a, and an annular side edge 4c connecting the first surface 4a and the second surface 4b. That is, the lower surface of the sensing chip 41 is defined as the second surface 4b, and a plurality of solder bodies 43 are disposed on the second surface 4b, while the sensing area 411 is located between the first surface 4a and the second surface 4b and is surrounded inside by the annular side edge 4c.

[0039] The placement step S120: as follows Figure 1 and Figure 4 As shown, a lens 2 is disposed within the receiving groove 13 of each lens mount 1, and a positioning bracket 3 is disposed on the lens 2, collectively defined as a lens L. However, this application is not limited thereto. For example, in other embodiments not illustrated in this application, a lens 2 may be disposed within the receiving groove 13 of each lens mount 1, but the positioning bracket 3 may not be disposed; that is, the lens 2 may be positioned in the corresponding receiving groove 13 in other ways without using the positioning bracket 3, and each lens mount 1 and the corresponding lens 2 may be collectively defined as the lens L.

[0040] In each lens L of this embodiment, the lens 2 is preferably disposed from top to bottom at the bottom of the receiving groove 13, while the positioning bracket 3 is placed around the periphery of the lens 2, and the lens 2 and the positioning bracket 3 can be bonded to the inner wall of the receiving groove 13. Furthermore, it is preferable that the lens 2 and the corresponding positioning bracket 3 are simultaneously disposed in the receiving groove 13 of each lens mount 1, which is achieved in advance by making the lens 2 and the positioning bracket 3 of each lens L a single piece connected as an integral unit, but this is not a limitation.

[0041] More specifically, an optical surface 21 of each lens 2 is located away from the perforation 14 corresponding to the lens mount 1 and lies on a central axis S of the perforation 14, and the center of curvature C of the optical surface 21 in this embodiment lies approximately within the perforation 14. The portion of the lens 2 supporting the positioning bracket 3 is located outside the optical surface 21. Furthermore, an end portion 31 of each positioning bracket 3 protrudes from the corresponding receiving groove 13; that is, each end portion 31 is annular and protrudes from the bottom surface 12 corresponding to the lens mount 1, and the size of the end portion 31 protruding from the bottom surface 12 is no greater than 5 micrometers (μm).

[0042] The installation step S130: as follows Figure 1 and Figure 5 As shown, a sensor encapsulation assembly 4 is mounted on each lens L, adjacent to the bottom surface 12 of the lens mount 1. Each lens L is connected to the corresponding sensor encapsulation assembly 4 (e.g., the first surface 4a) by the positioning bracket 3 (e.g., the end portion 31). That is, the bottom surface 12 of each lens mount 1 is separated from the corresponding sensor encapsulation assembly 4 (e.g., the first surface 4a) by an annular gap G1 of no more than 60 micrometers.

[0043] More specifically, in this embodiment, each lens L is connected to the end portion 31 and the corresponding sensor package assembly 4 by an annular adhesive layer 5, and a gap G2 is formed between the end portion 31 of each lens L and the corresponding sensor package assembly 4, located outside the annular adhesive layer 5 (and communicating with the annular gap G1). Furthermore, the central axis S of the perforation 14 of each lens mount 1 passes through (and is substantially perpendicular to) the sensing area 411 of the corresponding sensor package assembly 4.

[0044] It should be noted that the components provided in the preparation step S110 can be prepared before the corresponding step is implemented. For example, the multiple sensor packaging components 4 can be provided between the time of the placement step S120 and the time of the installation step S130.

[0045] The sealing step S140: as follows: Figure 1 , Figure 6 ,and Figure 7 As shown, an adhesive layer 60 is formed on the lens mount plate 10, which covers the bottom surface 12 of each lens mount 1 and the annular side edge 4c of each sensor encapsulation assembly 4. Further, the adhesive layer 60 is opaque and fills the annular gap G1 and the slit G2 corresponding to each lens L, but does not penetrate each annular adhesive layer 5, and the second surface 4b of each sensor encapsulation assembly 4 and the plurality of welded bodies 43 are exposed outside the adhesive layer 60.

[0046] The cutting step S150: as follows Figure 1 and Figure 8 As shown, the lens mount plate 10 and the adhesive layer 60 are cut to separate the lens mount plate 10 into multiple lens mounts 1 and the adhesive layer 60 into multiple adhesive bodies 6, thereby separating multiple cubic camera modules 100. Each cubic camera module 100 includes a lens L, a corresponding sensor packaging assembly 4, and a corresponding adhesive body 6.

[0047] It should be further noted that the multiple cube camera modules 100 described in this embodiment are constructed in exactly the same way, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, the multiple cube camera modules 100 may use different components according to design requirements (e.g., the multiple sensor packaging components 4 configured in the multiple cube camera modules 100 may have at least two different sensing functions).

[0048] As described above, in this embodiment, the cubic camera module manufacturing method S100 can use multiple mirror mounts 1 (or mirror mount plates 10) as the structural basis of the entire architecture or process, so that multiple sensor packaging components 4 can be manufactured in advance and selected as good products, thereby improving the production yield of multiple cubic camera modules 100 and enabling each cubic camera module 100 to have a smaller size.

[0049] Furthermore, this embodiment has roughly described the implementation process of the cube camera module manufacturing method S100 based on the above content. The following section will then roughly describe the specific structure of the cube camera module 100 manufactured by the cube camera module manufacturing method S100 from a structural perspective. Accordingly, some technical features of the cube camera module 100 can be referenced from the above-described cube camera module manufacturing method S100, but this application is not limited thereto.

[0050] like Figure 9 and Figure 10 As shown, the cube camera module 100 in this embodiment includes a lens L, a sensor encapsulation assembly 4 mounted on the lens L, and a colloid 6 connecting the lens L and the sensor encapsulation assembly 4. The lens L includes a lens mount 1, a lens 2 and a positioning bracket 3 mounted within the lens mount 1. In this embodiment, the lens 2 and the positioning bracket 3 are a single, integrated structure, but this application is not limited to this.

[0051] More specifically, the mirror base 1 is opaque and has a top surface 11, a bottom surface 12 located on the opposite side of the top surface 11, and an annular side surface 15 connecting the top surface 11 and the bottom surface 12. The mirror base 1 includes a receiving groove 13 recessed in the bottom surface 12 and a through hole 14 recessed in the top surface 11 and communicating with the receiving groove 13.

[0052] Furthermore, the lens 2 is disposed within the receiving groove 13 and covers one side of the perforation 14, the positioning bracket 3 is disposed within the receiving groove 13 and above the lens 2, and one end portion 31 of the positioning bracket 3 is annular and protrudes from the receiving groove 13.

[0053] The sensor packaging assembly 4 includes a sensing chip 41, a light-transmitting layer 42 mounted on the upper surface of the sensing chip 41, and a plurality of solder bodies 43 mounted on the lower surface of the sensing chip 41. In this embodiment, the light-transmitting layer 42 is bonded to the upper surface and surrounds the sensing area 411 of the sensing chip 41, and is thus spaced apart from the sensing area 411, while the plurality of solder bodies 43 are fixed to the lower surface of the sensing chip 41 at intervals from each other.

[0054] In other words, the outer surface of the sensor packaging assembly 4 has a first surface 4a located on the light-transmitting layer 42, a second surface 4b located on the sensing chip 41 and opposite to the first surface 4a, and an annular side edge 4c connecting the first surface 4a and the second surface 4b. The sensing area 411 is located between the first surface 4a and the second surface 4b and is surrounded inside by the annular side edge 4c.

[0055] That is, the lower surface of the sensing chip 41 is defined as the second surface 4b, a plurality of solder bodies 43 are disposed on the second surface 4b of the sensing chip 41, and the sensor packaging assembly 4 is mounted on the lens L with the first surface 4a. The lens L is connected to the first surface 4a of the sensor packaging assembly 4 by the end portion 31 of the positioning bracket 3 to form an annular gap G1. In this embodiment, the bottom surface 12 of the lens mount 1 is separated from the first surface 4a of the sensor packaging assembly 4 by the annular gap G1, which is no more than 60 micrometers.

[0056] Furthermore, in this embodiment, the lens L also includes an annular adhesive layer 5 connecting the end portion 31 and the first surface 4a, and a gap G2 is formed between the end portion 31 and the first surface 4a, located outside the annular adhesive layer 5, which communicates with the annular gap G1. However, this application is not limited thereto. For example, in other embodiments not illustrated in this application, the cube camera module 100 may, according to design requirements, not form at least one of the annular gap G1 and the gap G2.

[0057] Furthermore, the lens L and the sensor packaging assembly 4 together form a closed space E containing air. Moreover, the lens 2 has an optical surface 21 that is away from the perforation 14 and faces the first surface 4a. Both the optical surface 21 and the sensing area 411 lie on a central axis S of the perforation 14, and preferably the center of curvature C of the optical surface 21 lies approximately within the perforation 14 and on the central axis S, but this application is not limited thereto.

[0058] The colloid 6 is formed on the bottom surface 12 of the lens mount 1 and covers the annular side edge 4c of the sensor encapsulation assembly 4, while the second surface 4b of the sensor encapsulation assembly 4 and the plurality of weld bodies 43 are exposed outside the colloid 6. The colloid 6 fills the annular gap G1 and the slit G2, but does not penetrate the annular adhesive layer 5, thereby allowing the lens mount 1, the positioning bracket 3, and the sensor encapsulation assembly 4 to be securely connected to each other through the colloid 6. Furthermore, the colloid 6 has an annular outer side surface 61 that is flush with and coplanar with the annular side surface 15 of the lens mount 1.

[0059] Technical Effects of the Embodiments in this Application In summary, the cube camera module and its manufacturing method disclosed in this application use multiple lens mounts (or lens mount plates) as the structural basis of the entire architecture or process, which facilitates the early manufacturing and selection of good products from multiple sensor packaging components, thereby improving the production yield of multiple cube camera modules and enabling each cube camera module to have a smaller size.

[0060] The content disclosed above is only a preferred and feasible embodiment of this application and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A cube camera module, characterized in that, The cube camera module includes: One shot, including: A mirror base is opaque and has a top surface, a bottom surface opposite to the top surface, and an annular side surface connecting the top surface and the bottom surface; wherein the mirror base includes a receiving groove recessed in the bottom surface and a through hole recessed in the top surface and communicating with the receiving groove; A lens is disposed within the receiving groove; and A positioning bracket is disposed within the receiving groove and on the lens, and one end of the positioning bracket protrudes out of the receiving groove; A sensor packaging assembly comprising: A sensing chip; A light-transmitting layer is mounted on the sensing chip; wherein the outer surface of the sensor packaging assembly has a first surface located on the light-transmitting layer, a second surface located on the sensing chip and opposite to the first surface, and an annular side edge connecting the first surface and the second surface; and Multiple welded bodies are disposed on the second surface of the sensing chip; wherein the sensor packaging assembly is mounted on the end portion of the lens with the first surface attached; and A colloid is formed on the bottom surface of the lens mount and covers the annular side edge of the sensor encapsulation assembly, while the second surface of the sensor encapsulation assembly and the plurality of solder bodies are exposed outside the colloid; wherein the colloid has an annular outer side surface that is flush with the annular side surface of the lens mount. The bottom surface of the lens mount is separated from the first surface of the sensor packaging assembly by an annular gap, which is filled by the colloid.

2. The cube camera module according to claim 1, characterized in that, The sensor packaging assembly includes a sensing region located between the first surface and the second surface and surrounded inside the annular side edge; a central axis of the perforation of the mirror mount passes through the sensing region.

3. The cube camera module according to claim 1, characterized in that, The lens and the positioning bracket are a single-piece structure connected as one unit.

4. The cube camera module according to claim 1, characterized in that, The end portion of the positioning bracket is annular, the lens includes an annular adhesive layer connecting the end portion to the first surface, and the colloid does not penetrate the annular adhesive layer.

5. The cube camera module according to claim 4, characterized in that, A gap is formed between the end portion of the lens and the first surface of the sensor packaging assembly, located outside the annular adhesive layer, the gap communicating with the annular gap and being filled by the colloid.

6. The cube camera module according to claim 1, characterized in that, The lens has an optical surface that is away from the perforation and faces the first surface, and the optical surface lies on a central axis of the perforation.

7. The cube camera module according to claim 1, characterized in that, The lens and the sensor packaging assembly together form a closed space with air inside.

8. A cube camera module, characterized in that, The cube camera module includes: One shot, including: A mirror base is opaque and has a top surface, a bottom surface opposite to the top surface, and an annular side surface connecting the top surface and the bottom surface; wherein the mirror base includes a receiving groove recessed in the bottom surface and a through hole recessed in the top surface and communicating with the receiving groove; A lens is disposed within the receiving groove; and A positioning bracket is disposed within the receiving groove and on the lens, and one end of the positioning bracket protrudes out of the receiving groove; A sensor packaging assembly includes a first surface, a second surface located opposite to the first surface, and an annular side edge connecting the first surface and the second surface; wherein the sensor packaging assembly is mounted on the distal end of a lens with the first surface attached; and A colloid is formed on the bottom surface of the mirror mount and covers the annular side edge of the sensor encapsulation assembly, while the second surface of the sensor encapsulation assembly is exposed outside the colloid; The bottom surface of the lens mount is separated from the first surface of the sensor packaging assembly by an annular gap, which is filled by the colloid.

9. The cube camera module according to claim 8, characterized in that, The colloid has an annular outer side that is flush with the annular side of the mirror mount.

10. The cube camera module according to claim 8, characterized in that, The end portion of the positioning bracket is annular, the lens includes an annular adhesive layer connecting the end portion to the first surface, and the colloid does not penetrate the annular adhesive layer.

11. The cube camera module according to claim 10, characterized in that, A gap is formed between the end portion of the lens and the first surface of the sensor packaging assembly, located outside the annular adhesive layer, the gap communicating with the annular gap and being filled by the colloid.

12. The cube camera module according to claim 8, characterized in that, The annular gap is no greater than 60 micrometers.

13. The cube camera module according to claim 8, characterized in that, The lens and the positioning bracket are a single-piece structure connected as one unit.

14. A cube camera module, characterized in that, The cube camera module includes: One shot, including: A mirror base is opaque and has a top surface, a bottom surface opposite to the top surface, and an annular side surface connecting the top surface and the bottom surface; wherein the mirror base includes a receiving groove recessed in the bottom surface and a through hole recessed in the top surface and communicating with the receiving groove; A lens is disposed within the receiving groove; and A positioning bracket is disposed within the receiving groove and on the lens, and one end of the positioning bracket protrudes out of the receiving groove; A sensor packaging assembly is mounted on the distal end of the lens; and A colloid is formed on the bottom surface of the lens mount and covers the sensor encapsulation assembly, wherein one surface of the sensor encapsulation assembly is away from the lens and exposed outside the colloid; The bottom surface of the mirror mount is separated from the sensor packaging assembly by an annular gap, which is filled with the colloid.

15. The cube camera module according to claim 14, characterized in that, The colloid has an annular outer side that is flush with the annular side of the mirror mount.

16. The cube camera module according to claim 14, characterized in that, The end portion of the positioning bracket is annular, the lens includes an annular adhesive layer connecting the end portion to the sensor encapsulation assembly, and the colloid does not penetrate the annular adhesive layer.

17. The cube camera module according to claim 16, characterized in that, A gap is formed between the end portion of the lens and the sensor packaging assembly, located outside the annular adhesive layer, the gap communicating with the annular gap and being filled by the colloid.

18. The cube camera module according to claim 14, characterized in that, The annular gap is no greater than 60 micrometers.

19. The cube camera module according to claim 14, characterized in that, The lens and the positioning bracket are a single-piece structure connected as one unit.

20. The cube camera module according to claim 14, characterized in that, The lens and the sensor packaging assembly together form a closed space with air inside.

Images