Method for manufacturing a metal-resin bonded body

Abstract

The present application can obtain a metal-resin bonded body having a high bonding strength while maintaining the shape of a synthetic resin member that is pre-formed into a prescribed shape. In a method of manufacturing a metal-resin bonded body 30 obtained by bonding a metal member 20 and a synthetic resin member 10, the following processes are performed: a first process of bringing a metal bonding surface 22 heated to a first temperature T1 and a resin bonding surface 12 into contact and pressing the metal member 20 and the synthetic resin member 10 with a first pressure P1; and a second process of pressing the metal member 20 and the synthetic resin member 10 with a second pressure P2 higher than the first pressure P1 at a second temperature T2 lower than the first temperature T1.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a metal-resin bond. Background Technology

[0002] Metal-resin composites are known to be obtained by joining a metal component made of metal and a synthetic resin component made of synthetic resin (see, for example, Patent Document 1 below). In the case of joining the metal component and the synthetic resin component, the two components are joined by applying pressure to the synthetic resin component and the metal component in a heated state.

[0003] Furthermore, regarding metal-resin composites, in order to improve the bonding strength between the metal component and the synthetic resin component, a roughened portion (anchoring portion) is sometimes formed on the surface of the metal component (metal bonding surface) to which it is bonded to the synthetic resin component by laser irradiation or chemical etching. When manufacturing such a metal-resin composite, in order to fill the interior of the roughened portion formed on the metal bonding surface with resin, the resin material constituting the synthetic resin component is heated and melted, and pressure is applied to both the synthetic resin component and the metal component so that the molten resin material comes into contact with the metal bonding surface of the metal component.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 5998303 Summary of the Invention

[0007] However, in existing manufacturing methods that pressurize synthetic resin parts and metal parts under heated conditions to join them together, it is difficult to maintain the shape of the synthetic resin parts and firmly join the metal parts when joining synthetic resin parts that have been pre-molded into a specified shape with metal parts.

[0008] The present invention was made in view of the above problems, and its object is to provide a method for manufacturing a metal-resin joint that can maintain the shape of a synthetic resin part pre-molded into a predetermined shape and firmly bond the synthetic resin part to a metal part made of a metal material.

[0009] According to this embodiment, the following methods [1] to [7] are provided.

[0010] [1] A method for manufacturing a metal-resin bond, which is a method for manufacturing a metal-resin bond in which a metal bonding surface of a metal component and a resin bonding surface of a resin component molded into a predetermined shape are brought into contact to join the metal component and the resin component, wherein the method for manufacturing the metal-resin bond comprises the following steps: a first step of bringing the resin bonding surface into contact with the metal bonding surface heated to a first temperature and pressurizing the metal component and the resin component with a first pressure; and a second step of pressurizing the metal component and the resin component with a second pressure higher than the first pressure when the metal bonding surface is at a second temperature lower than the first temperature.

[0011] [2] In the manufacturing method of the metal-resin joint described in [1] above, when the first step is performed, the heating of the metal joint surface is stopped or the heating amount is reduced, and the pressure applied to the metal component and the resin component is changed from the first pressure to the second pressure to perform the second step.

[0012] [3] In the manufacturing method of the metal-resin bond described in [1] above, when the first step is performed, after the metal bonding surface is lowered to the second temperature, the pressure applied to the metal component and the resin component is changed from the first pressure to the second pressure and the second step is performed.

[0013] [4] The method for manufacturing a metal-resin bond according to any one of [1] to [3] above, wherein the first temperature is a temperature above the melting point of the resin material constituting the resin component.

[0014] [5] In the method for manufacturing a metal-resin bond described in [4] above, the first temperature is an upper limit temperature that is above the melting point of the resin material and below the melting point of the resin material by 20°C.

[0015] [6] In the method for manufacturing a metal-resin bond described in [3] above, the second temperature is a temperature 10°C or lower than the melting point of the resin material constituting the resin component.

[0016] [7] In the method for manufacturing a metal-resin bond described in [6] above, the first temperature is an upper limit temperature above the melting point of the resin material and below the upper limit temperature that is 20°C higher than the melting point of the resin material, and the second temperature is a lower limit temperature below the melting point of the resin material and above the lower limit temperature that is 10°C higher than the melting point of the resin material and above the lower limit temperature that is 20°C lower than the melting point of the resin material.

[0017] Invention Effects

[0018] According to the above-described method for manufacturing a metal-resin bond, the shape of a pre-molded synthetic resin component can be maintained, and the bonding strength between the metal component and the synthetic resin component can be improved. Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of a metal-resin joint manufactured by a method for manufacturing a metal-resin joint according to an embodiment of the present invention.

[0020] Figure 2 This is a diagram illustrating the first step of a method for manufacturing a metal-resin bond according to an embodiment of the present invention. Detailed Implementation

[0021] Embodiments of the present invention will now be described with reference to the accompanying drawings. The size of components is sometimes exaggerated in the drawings for illustrative purposes. The present invention is not limited to the embodiments described below. The embodiments described below are provided as examples and are not intended to limit the scope of the invention. New embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention.

[0022] (1) Metal-resin composite 30

[0023] First, the metal-resin bond 30 manufactured by the manufacturing method of this embodiment will be described. Figure 1 As shown, the metal-resin bond 30 includes: a synthetic resin component 10 made of thermoplastic synthetic resin; and a metal component 20 made of metal.

[0024] One surface of the synthetic resin component 10 becomes a resin bonding surface 12 that bonds with the metal component 20. One surface of the metal component 20 becomes a metal bonding surface 22 that bonds with the resin bonding surface 12 of the synthetic resin component 10. The metal-resin bond 30 is formed by bonding the resin bonding surface 12 of the synthetic resin component 10 and the metal bonding surface 22 of the metal component 20.

[0025] (2) Synthetic resin component 10

[0026] The synthetic resin component 10 is a component in which thermoplastic resin is molded into a specified shape, such as a block, plate, or line, by known methods such as injection molding, extrusion molding, and compression molding.

[0027] Specific examples of the synthetic resins constituting the synthetic resin component 10 include polypropylene resin (PP resin), polyoxymethylene resin (POM resin), polyphenylene sulfide resin (PPS resin), polyetheretherketone resin (PEEK), acrylonitrile / butadiene / styrene resin (ABS resin), polyethylene resin (PE resin), polybutylene terephthalate resin (PBT resin), nylon 66 and other (PA66) polyamide resin (PA resin), epoxy resin, liquid crystal polymer (LCP resin), modified polyphenylene ether resin (modified PPE), reactive soft polypropylene resin (metallocene reactive TPO resin), and so on. Fluoroalkoxyalkane resins (PFA resin), polyacrylamide resin (PAM resin), acrylic resin (PMMA resin), polycarbonate resin (PC resin), polyvinylidene fluoride resin (PVDF resin), polyvinylidene chloride resin (PVCD resin), polyphenylene sulfide resin (PPS resin), polyvinyl chloride resin (PVC resin), polyethylene terephthalate resin (PET resin), polyvinylidene fluoride resin (PVF resin), polystyrene resin (PS resin), polyvinyl alcohol resin (PVA resin), paraffin resin, polytetrafluoroethylene resin (PTFE resin), hexafluoropropylene resin (HFP resin), etc.

[0028] In addition, the synthetic resin component 10 can be a carbon fiber reinforced thermoplastic resin (CFRTP) that incorporates carbon fiber into the thermoplastic resin described above, or a material that incorporates glass fiber, talc, or other reinforcing materials, flame retardants, anti-deterioration agents, elastomer components, etc., into the thermoplastic resin described above.

[0029] (3) Metal parts 20

[0030] Metal component 20 is a component formed by shaping metal into a specified shape such as a block, plate, or wire. The metal used to constitute metal component 20 is not particularly limited, and various metals can be used.

[0031] For example, the metals constituting the metal component 20 can be copper (Cu), iron (Fe), aluminum (Al), titanium (Ti), nickel (Ni), chromium (Cr), etc. Alternatively, the metal component 20 can be made of alloys containing two or more metals, such as copper alloys, iron alloys (steel materials), aluminum alloys, stainless steel, titanium alloys, nickel alloys, chromium alloys, etc.

[0032] The shape of the metal part 20 can be set to a desired shape according to its application, etc. As for the forming method of the metal part 20, any method can be applied, such as casting in which molten metal or the like flows into a mold of the desired shape, cutting based on machine tools, punching based on stamping machinery, etc.

[0033] Regarding the metal component 20, a roughening process can be performed on the metal bonding surface 22 to form a roughened portion with an uneven shape before performing the first and second processes described later. Various methods can be used for the roughening process. For example, the roughened portion can be formed on the metal bonding surface 22 by laser irradiation, chemical etching, or stamping.

[0034] (4) Method for manufacturing metal-resin bond 30

[0035] The metal-resin bond 30 can be obtained by performing a first process and a second process on the synthetic resin component 10 described in (2) above and the metal component 20 described in (3) above. In this embodiment, using Figure 2 The bonding device 50 shown performs the first and second processes to manufacture the metal-resin bond 30.

[0036] The joining device 50 includes: a stage 51 for placing the metal part 20; a heating device 52 for induction heating the metal part 20 placed on the stage 51; a stamping device 53 for pressurizing the synthetic resin part 10 to join it with the metal part 20; and a control device 60 for controlling the heating device 52 and the stamping device 53.

[0037] The heating device 52 is equipped with an induction heating coil connected to a power supply device (not shown). If a drive power supply is input from the power supply device after receiving an instruction from the control device 60, a magnetic field is generated from the induction heating coil to induction heat the metal joint surface 22 of the metal part 20 placed on the stage 51.

[0038] The heating device 52 includes a temperature sensor 56 that measures the temperature of the metal joint surface 22 of the metal component 20 placed on the stage 51. The temperature of the metal joint surface 22 detected by the temperature sensor 56 is input to the control device 60. The control device 60 controls the output of the heating device 52 based on the detected temperature input from the temperature sensor 56 in a manner that causes the temperature of the metal joint surface 22 to reach a predetermined temperature.

[0039] Furthermore, in this embodiment, the temperature sensor 56 is a non-contact radiation thermometer that measures the temperature of the portion of the induction heating coil of the heating device 52 near the synthetic resin component 10. Regarding this temperature sensor 56, the correlation between the thermocouple disposed between the resin bonding surface 12 and the metal bonding surface 22 and the measured temperature was studied in advance. That is, with the thermocouple disposed between the resin bonding surface 12 and the metal bonding surface 22, the metal bonding surface 22 was heated using the heating device 52, and the temperature of the temperature sensor 56 and the thermocouple was measured, thereby studying the correlation between the measured temperatures of the temperature sensor 56 and the thermocouple. Based on this measurement result, the temperature sensor 56 sets the temperature of the thermocouple, which is inferred from the correlation with the thermocouple, as the temperature of the metal bonding surface 22.

[0040] The stamping device 53 includes: a rod 54 formed of an insulator such as ceramic; a pressure part 55 that moves the rod 54 to press the synthetic resin component 10 against the metal component 20; and a pressure sensor 57 that detects the pressure acting on the synthetic resin component 10 when the rod 54 presses the synthetic resin component 10 against the metal component 20.

[0041] like Figure 2 As shown, rod 54 can be inserted into the hollow portion of the induction heating coil of heating device 52 and is configured to face the synthetic resin component 10.

[0042] The pressurizing unit 55 includes a servo motor capable of varying the pressurizing pressure, an air pressure cylinder controlled by an electro-pneumatic regulator, and a spring-loaded pressurizer. The pressurizing unit 55 can receive commands from the control device 60 to control the speed and position of the synthetic resin component 10 moving together with the rod 54, and the pressure applied when the synthetic resin component 10 is pressed against the metal component 20.

[0043] Pressure sensor 57 detects the pressure acting on synthetic resin component 10 when it comes into contact with metal component 20 and pressure is applied to metal component 20, and inputs the detected pressure to control device 60. Control device 60 controls the output of pressurizing unit 55 of stamping device 53 based on the detected pressure input from pressure sensor 57, in a manner that makes the pressure acting on synthetic resin component 10 reach a predetermined pressure.

[0044] The control device 60 is equipped with a computer and is connected to the heating device 52, the stamping device 53, the temperature sensor 56, and the pressure sensor 57.

[0045] The control device 60 controls the operation of the heating device 52 and the stamping device 53 according to the detection results of the temperature sensor 56 and the pressure sensor 57 and the pre-defined program, thereby making the resin bonding surface 12 bond with the metal bonding surface 22 placed on the stage 51, so that the metal part 20 and the synthetic resin part 10 are integrated.

[0046] Specifically, in order to manufacture the metal-resin joint 30 using the joining device 50, the metal part 20 is placed on the stage 51 such that the metal joining surface 22 is opposite to the synthetic resin part 10 placed thereafter.

[0047] Furthermore, when the metal bonding surface 22 of the metal component 20 is roughened by roughening treatment or when an oxide film is formed on the metal bonding surface 22 by heating oxidation treatment, the roughening treatment or heating oxidation treatment can be performed before the metal component 20 is placed on the stage 51, and the metal component 20 can be arranged such that the treated surface faces the synthetic resin component 10 placed thereafter.

[0048] Next, the resin bonding surface 12 is positioned opposite the metal bonding surface 22 of the metal component 20 placed on the stage 51. Figure 2 As shown, in this embodiment, the synthetic resin component 10 is configured such that the resin bonding surface 12 contacts the metal bonding surface 22.

[0049] Next, the heating device 52 is positioned opposite the metal bonding surface 22 of the metal component 20, separated from the synthetic resin component 10. Figure 2 In the case shown, the heating device 52 is positioned above the synthetic resin component 10, and the synthetic resin component 10 is positioned between the heating device 52 and the metal component 20.

[0050] Next, the following first step is performed: the metal bonding surface 22 is heated to a first temperature T1 using the heating device 52, thereby heating the resin bonding surface 12 in contact with the metal bonding surface 22 to the first temperature T1, and the metal component 20 and the synthetic resin component 10 are pressurized with a first pressure P1 while heated to the first temperature T1.

[0051] Specifically, the control device 60 supplies power to the heating device 52, generating a magnetic field from the induction heating coil disposed in the heating device 52 to heat the metal joint surface 22 of the metal component 20. At this time, the power supply to the heating device 52 and the position of the induction heating coil disposed in the heating device 52 are adjusted in such a way that the temperature of the metal joint surface 22 detected by the temperature sensor 56 reaches a first temperature T1.

[0052] While heating the metal component 20, the stamping device 53 moves the rod 54 to press the synthetic resin component 10 against the metal component 20, thereby pressurizing the synthetic resin component 10 and the metal component 20 so that the pressure detected by the pressure sensor 57 reaches the first pressure P1. Thus, the stamping device 53 brings the resin bonding surface 12 into contact with the metal bonding surface 22, which is heated to the first temperature T1, and pressurizes the synthetic resin component 10 and the metal component 20 with the first pressure P1.

[0053] For example, the stamping device 53 applies pressure to the synthetic resin component 10 and the metal component 20 with a first pressure P1 for a predetermined time Sp1 (e.g., 0.1 seconds to 10 seconds). During the period when the stamping device 53 applies pressure to the synthetic resin component 10 and the metal component 20 with the first pressure P1, the heating device 52 preferably continuously heats the metal component 20 in a manner that maintains the temperature of the metal joint surface 22 at a first temperature T1.

[0054] Furthermore, it can be configured such that while the heating device 52 heats the metal bonding surface 22 to a first temperature T1, the stamping device 53 applies pressure to the synthetic resin component 10 and the metal component 20 with a first pressure P1. For example, the temperature of the metal bonding surface 22 is increased while applying pressure with the first pressure P1 from room temperature to the first temperature T1. By applying pressure to the synthetic resin component 10 and the metal component 20 with the first pressure P1 while the metal bonding surface 22 is heated, heat is easily conducted from the metal bonding surface 22 to the resin bonding surface 12, enabling the resin bonding surface 12 to rapidly heat up to the first temperature T1.

[0055] Alternatively, the stamping device 53 may not apply pressure to the synthetic resin component 10 and the metal component 20 until the temperature of the metal joint surface 22 reaches the first temperature T1, and after reaching the first temperature T1, the stamping device 53 applies pressure to the synthetic resin component 10 and the metal component 20 with the first pressure P1.

[0056] Furthermore, if the stamping device 53 applies pressure to the synthetic resin component 10 and the metal component 20 with the first pressure P1 for a specified time Sp1, the first process ends and the second process begins.

[0057] When entering the second process, the heating device 52 stops heating the metal part 20 or reduces the heating amount. In addition, the stamping device 53 pressurizes the synthetic resin part 10 and the metal part 20 in such a way that the detection pressure of the pressure sensor 57 reaches a second pressure P2 that is higher than the first pressure P1.

[0058] In the second process, if the heating device 52 stops heating the metal component 20 or reduces the heating amount, the first temperature T1 cannot be maintained at the metal joint surface 22, and the temperature will begin to decrease from the first temperature T1. During the period when the temperature of the metal joint surface 22 decreases, the stamping device 53 applies pressure to the synthetic resin component 10 and the metal component 20 with a second pressure P2.

[0059] The stamping device 53 applies a second pressure P2 to the synthetic resin component 10 and the metal component 20 until the temperature of the resin bonding surface 12 and the metal bonding surface 22 drops to at least a second temperature T2. Here, the second temperature T2 refers to a temperature lower than the first temperature T1. Preferably, the stamping device 53 continues to apply pressure to the synthetic resin component 10 and the metal component 20 until the temperature of the synthetic resin component 10 and the metal component 20 drops to a third temperature T3, which is lower than the second temperature T2.

[0060] Furthermore, if the temperature of the synthetic resin component 10 and the metal component 20 drops to a predetermined temperature, the metal-resin joint 30 obtained by joining the synthetic resin component 10 and the metal component 20 is removed from the joining device 50.

[0061] Here, the first temperature T1 can be set to be above the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 and below the decomposition temperature of the thermoplastic resin (i.e., below the temperature at which the thermoplastic resin begins to vaporize). Preferably, the first temperature T1 can be set to a temperature 20°C lower than the decomposition temperature of the thermoplastic resin. More preferably, the first temperature T1 can be set to a temperature 20°C higher than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 (first upper limit temperature) and below (Tm≤T1≤Tm+20°C).

[0062] The second temperature T2 only needs to be lower than the first temperature T1, but preferably it is a temperature 10°C higher than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 (second upper limit temperature) or lower (T2 ≤ Tm + 10°C). More preferably, the second temperature T2 is set to a temperature 20°C lower than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 (lower limit temperature). That is, it is preferable to set the second temperature T2 to be higher than the lower limit temperature and lower than the second upper limit temperature (Tm - 20°C ≤ T2). <Tm+10℃)。

[0063] The third temperature T3 can be any temperature that facilitates the processing of the obtained metal-resin composite 30. For example, it can be set to a temperature lower than the glass transition point of the thermoplastic resin constituting the synthetic resin component 10 or 50°C. Furthermore, in the first step, the first pressure P1 applied to the synthetic resin component 10 and the metal component 20 should be sufficient to achieve contact pressure that allows the heat from the heated metal component 20 to bring the synthetic resin component 10 to the same temperature as the metal component through heat conduction. Preferably, this pressure is below the compressive yield stress of the thermoplastic resin. This first pressure P1 varies depending on the thermoplastic resin constituting the synthetic resin component 10, and therefore cannot be uniformly specified, but it is preferably 10 MPa or less.

[0064] As long as the second pressure P2 applied to the synthetic resin component 10 and the metal component 20 in the second process is higher than the first pressure P1, for example, preferably 10 MPa or more and 100 MPa or less.

[0065] Furthermore, when moving from the first process to the second process, the settings of either the heating device 52 or the stamping device 53 can be changed first, and then the settings of the other device can be changed. Alternatively, the settings of both devices can be changed simultaneously.

[0066] That is, when moving from the first process to the second process, the pressure of the stamping device 53 can be changed from the first pressure P1 to the second pressure P2 after the heating of the heating device 52 is stopped or the heating amount is reduced. Alternatively, the heating of the heating device 52 can be stopped or the heating amount reduced, and the pressure of the stamping device 53 can be changed simultaneously. Alternatively, the heating of the heating device 52 can be stopped or the heating amount reduced immediately after the pressure of the stamping device 53 is changed.

[0067] In addition, in this embodiment, the case where the stamping device 53 moves the synthetic resin component 10 toward the metal component 20 is described, but the metal component 20 may also be moved toward the synthetic resin component 10.

[0068] Furthermore, the synthetic resin component 10 and the metal component 20 can be joined locally or over a larger area. Additionally, the planar shape of the joined area can be any shape, such as a dot, line, or surface.

[0069] (5) Effect

[0070] When the metal bonding surface 22 and the resin bonding surface 12 are brought into contact after being heated to a high first temperature T1, if the synthetic resin component 10 and the metal component 20 are pressurized with high pressure, the synthetic resin component 10, which is heated by the heat from the metal component 20, is prone to significant deformation. However, when bonding the synthetic resin component 10 and the metal component 20, it is preferable to uniformly heat the resin bonding surface 12 of the synthetic resin component 10 by applying pressure and heating the synthetic resin component 10 and the metal component 20 simultaneously, using the heat from the metal component 20.

[0071] In this embodiment, during the first step, a first pressure P1, which is weaker than the second pressure P2, is applied to the synthetic resin component 10 and the metal component 20. This easily suppresses deformation of the synthetic resin component 10 and allows heat from the metal bonding surface 22 to the resin bonding surface 12 to be uniformly conducted. As a result, the thermoplastic resin constituting the resin bonding surface 12 easily spreads uniformly on the metal bonding surface 22 and adheres closely to it. Furthermore, even when the metal bonding surface 22 has a roughened portion, applying pressure with a weaker first pressure P1 easily fills the interior of the roughened portion with the thermoplastic resin constituting the resin bonding surface 12.

[0072] In addition, if the temperature of the thermoplastic resin constituting the synthetic resin component 10 increases, the resin density decreases. Therefore, when the metal component 20 and the synthetic resin component 10 are joined, the resin density near the resin bonding surface 12 of the synthetic resin component 10, which is heated from the metal component 20, tends to decrease.

[0073] In this embodiment, in the second step performed after the first step, the synthetic resin component 10 and the metal component 20 are pressurized at a second temperature T2 lower than the first temperature T1 and a second pressure P2 higher than the first pressure P1. Therefore, undesirable deformation of the synthetic resin component 10, which is molded into a predetermined shape, can be suppressed, and the resin density near the resin bonding surface 12 can be increased.

[0074] That is, in this embodiment, by suppressing the deformation of the synthetic resin component 10 in the first step and uniformly heating the resin bonding surface 12 that is in contact with the metal bonding surface 22, the thermoplastic resin constituting the resin bonding surface 12 is uniformly and closely bonded to the metal bonding surface 22. Moreover, by increasing the pressure in the second step, the adhesion of the thermoplastic resin to the metal bonding surface 22 is further improved, and the resin density of the synthetic resin component 10 near the resin bonding surface 12 is increased, thereby obtaining a metal-resin bond 30 with higher bonding strength.

[0075] In this embodiment, if the first temperature T1 is a temperature above the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10, the fluidity of the thermoplastic resin near the resin bonding surface 12 can be improved during the first process, and the adhesion between the resin bonding surface 12 and the metal bonding surface 22 can be further improved. Furthermore, by setting the first temperature T1 to a temperature 20°C or lower than the upper limit temperature of the thermoplastic resin constituting the synthetic resin component 10, thermal decomposition of the resin material constituting the synthetic resin component 10 and undesirable deformation of the synthetic resin component 10 caused by applying a first pressure P1 to the metal component 20 and the synthetic resin component 10 during the first process can be suppressed.

[0076] In this embodiment, if the second temperature T2 is lower than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10, then even if the synthetic resin component 10 and the metal component 20 are pressurized together with the second pressure P2 during the second process, the synthetic resin component 10 is unlikely to deform into an undesirable shape. Furthermore, by setting the second temperature T2 to a lower limit temperature of 20°C or higher than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10, the resin density near the resin bonding surface 12 can be effectively increased during the second process.

[0077] (6) Change Example

[0078] A variation of the above-described embodiment will be described. In the above-described embodiment, when moving from the first process to the second process, the pressure applied by the stamping device 53 is changed from the first pressure P1 to the second pressure P2, regardless of the temperature of the metal joint surface 22.

[0079] In this modified example, similar to the above embodiment, when the first process has been performed for a predetermined time Sp1, the heating of the heating device 52 is first stopped or the heating amount is reduced. Furthermore, the temperature of the resin bonding surface 12 and the metal bonding surface 22 is reduced (cooled) to a second temperature T2, which is lower than the first temperature T1. If the temperature of the resin bonding surface 12 and the metal bonding surface 22 reaches the second temperature T2, the stamping device 53 changes the pressure applied to the synthetic resin component 10 and the metal component 20 from the first pressure P1 to the second pressure P2 to begin the second process.

[0080] Furthermore, the stamping device 53 continues to pressurize the synthetic resin component 10 and the metal component 20 until the temperature of the synthetic resin component 10 and the metal component 20 drops from the second temperature T2 to the third temperature T3.

[0081] Furthermore, if the temperature of the synthetic resin component 10 and the metal component 20 drops to a predetermined temperature, the metal-resin joint 30 obtained by joining the synthetic resin component 10 and the metal component 20 is removed from the joining device 50.

[0082] Here, the first temperature T1 can be set to be above the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 and below the decomposition temperature of the thermoplastic resin (i.e., below the temperature at which the thermoplastic resin begins to vaporize). Preferably, the first temperature T1 can be set to be above the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 and below a temperature 20°C higher than the melting point Tm of the thermoplastic resin (upper limit temperature) (i.e., Tm≤T1≤Tm+20°C).

[0083] Furthermore, the second temperature T2 can be any temperature lower than the first temperature T1, but it is preferable to be a temperature lower than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10. Preferably, the second temperature T2 is set to a temperature (lower limit temperature) that is 20°C or more lower than the melting point Tm of the thermoplastic resin constituting the synthetic resin component 10 (i.e., Tm-20°C ≤ T2). <Tm)。

[0084] In this modified example, after the temperature of the resin bonding surface 12 and the metal bonding surface 22 drops to the second temperature T2, the pressure of the stamping device 53 is changed from the first pressure P1 to the second pressure P2. Therefore, the pressure of the stamping device 53 can be changed at an appropriate time when the synthetic resin component 10 is not excessively deformed, and a metal-resin joint 30 with high bonding strength that suppresses the deformation of the synthetic resin component 10 can be obtained.

[0085] (7) Examples

[0086] To illustrate the effects of the above embodiments, metal-resin composites (test pieces) of Examples 1-2 and Comparative Examples 1-4 were prepared. However, the present invention is not limited to Examples 1-2.

[0087] In Examples 1 and 2, the first step is performed by applying a first pressure P1 to the synthetic resin component and the metal component for 1 second while the heating device 52 heats the metal bonding surface to a first temperature T1. Then, the heating device 52 is stopped, and the pressure applied by the stamping device 53 is changed from the first pressure P1 to a second pressure P2 to perform the second step, until the temperature of the synthetic resin component 10 and the metal component 20 reaches a third temperature T3. The metal-resin bond of Examples 1 and 2 is produced by applying the second pressure P2 to the synthetic resin component 10 and the metal component 20 using the stamping device 53. Furthermore, in the second step, the heating device 52 is stopped and the pressure applied by the stamping device 53 is changed simultaneously.

[0088] Comparative Examples 1 to 4 are metal-resin composites produced by stopping the heating device 52 without changing the pressure of the stamping device 53 after performing the first process.

[0089] Specifically, regarding Comparative Examples 1 to 4, while the heating device 52 heats the metal bonding surface 22 to a first temperature T1, the stamping device 53 applies a first pressure P1 to the synthetic resin component 10 and the metal component 20 for 1 second to perform the first process. Then, while maintaining the pressure applied by the stamping device 53 to the synthetic resin component 10 and the metal component 20 at the first pressure P1, the heating of the heating device 52 is stopped until the temperature of the synthetic resin component 10 and the metal component 20 reaches a third temperature T3. The metal-resin bond of Modification Examples 1 to 4 is thus produced by applying the first pressure P1 to the synthetic resin component 10 and the metal component 20 using the stamping device 53.

[0090] In Examples 1-2 and Comparative Examples 1-4, a synthetic resin component made of PPS resin and a metal component made of SUS304 with its metal bonding surface roughened by laser irradiation were used. Details of the synthetic resin component, details of the metal component, and the bonding area (overlap area) of the synthetic resin component and the metal component are as follows.

[0091] The first temperature T1, the third temperature T3, the first pressure P1, and the second pressure P2 of Examples 1-2 and Comparative Examples 1-4 are shown in Table 1.

[0092] Synthetic resin components

[0093] Types of thermoplastic resins: PPS resin (FZ-2100 manufactured by DIC Corporation, melting point: 280℃)

[0094] Dimensions (length × width × thickness): 10mm × 50mm × 3mm

[0095] Metal components

[0096] Metal type: SUS304

[0097] Dimensions (length × width × thickness): 18mm × 40mm × 1.5mm

[0098] • Joint area between synthetic resin and metal parts: 5 × 10 mm

[0099] The evaluation method is as follows.

[0100] (a) Bond strength

[0101] In the test method specified in JIS K 6850, the dimensions of the synthetic resin component, the dimensions of the metal component, and the bonding area between the synthetic resin component and the metal component were changed as described above, while other conditions were based on the same standard. The test was conducted using a tensile testing machine (Shimadzu Corporation O-Tograf AGX-V) at a tensile speed of 10 mm / min and a measurement temperature of 25°C. Furthermore, four specimens were prepared for each of Examples 1-2 and Comparative Examples 1-4, and the average of the four measured values ​​was taken as the respective bonding strength.

[0102] (b) Compression deformation

[0103] The thickness of the synthetic resin component portion of the obtained metal-resin bond was measured, and the change in thickness (3 mm) relative to the thickness of the synthetic resin component before bonding was calculated. Furthermore, four specimens were prepared for each of Examples 1-2 and Comparative Examples 1-4, and the average of the four changes was taken as the respective compression change.

[0104] [Table 1]

[0105] Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 First pressure P1 (MPa) 0.5 0.5 10 10 0.5 0.5 Second pressure P2 (MPa) 10 10 - - - - First temperature T1 (°C) 290 265 290 265 290 265 First temperature T2 (°C) 60 60 60 60 60 60 Bond strength (MPa) 34.3 26.3 27.1 25.7 3.5 0 Compression change (mm) 0.18 0.09 1.23 0.89 0.01 0.005

[0106] The results are shown in Table 1. In Example 1, compared with Comparative Example 1, the compression change of the synthetic resin component was significantly suppressed, and a higher bond strength was obtained. In Example 2, the same level of bond strength as Comparative Example 1 and Comparative Example 2 was ensured, and the compression change of the synthetic resin component was significantly suppressed compared with Comparative Example 1 and Comparative Example 2.

[0107] Furthermore, in Comparative Example 3, the amount of compressive deformation was reduced to a small extent, but practical bond strength could not be obtained. In Comparative Example 4, the synthetic resin component was not bonded to the metal component.

[0108] Explanation of reference numerals in the attached figures

[0109] 10…synthetic resin component, 12…resin bonding surface, 20…metal component, 22…metal bonding surface, 30…metal-resin bonding body, 50…bonding device, 51…stage, 52…heating device, 53…stamping device, 54…rod, 55…pressurizing part, 56…temperature sensor, 57…pressure sensor, 60…control device.

Claims

1. A method for manufacturing a metal-resin bond, comprising manufacturing a metal-resin bond obtained by contacting a metal bonding surface of a metal component with a resin bonding surface of a resin component molded into a predetermined shape to bond the metal component and the resin component, wherein, The manufacturing method of the metal-resin bond includes the following steps: A first step of bringing the resin bonding surface into contact with the metal bonding surface heated to a first temperature and applying pressure to the metal component and the resin component with a first pressure; as well as A second step involves applying pressure to the metal component and the resin component at a second pressure higher than the first pressure when the metal joint surface is at a second temperature lower than the first temperature.

2. The method for manufacturing a metal-resin bond according to claim 1, wherein, When the first step is performed, the heating of the metal joint surface is stopped or the heating amount is reduced, and the pressure applied to the metal component and the resin component is changed from the first pressure to the second pressure to perform the second step.

3. The method for manufacturing a metal-resin bond according to claim 1, wherein, When the first step is performed, after the metal bonding surface is cooled to the second temperature, the pressure applied to the metal component and the resin component is changed from the first pressure to the second pressure to perform the second step.

4. The method for manufacturing a metal-resin bond according to any one of claims 1 to 3, wherein, The first temperature is a temperature above the melting point of the resin material constituting the resin component.

5. The method for manufacturing a metal-resin bond according to claim 4, wherein, The first temperature is above the melting point of the resin material and below an upper limit temperature that is 20°C higher than the melting point of the resin material.

6. The method for manufacturing a metal-resin bond according to claim 3, wherein, The second temperature is a temperature 10°C or lower than the melting point of the resin material constituting the resin component.

7. The method for manufacturing a metal-resin bond according to claim 6, wherein, The first temperature is above the melting point of the resin material but below an upper limit temperature that is 20°C higher than the melting point of the resin material. The second temperature is a temperature below 10°C higher than the melting point of the resin material and above a lower limit temperature of 20°C lower than the melting point of the resin material.

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