A low-cost and aging-resistant high-strength adhesive for high-voltage disconnector porcelain shaft assemblies

Abstract

The application discloses a high-pressure disconnector adhesive with reduced cost and aging resistance and high strength, and belongs to the field of auxiliary materials for high-voltage electrical equipment, and solves the problems of high cost, poor aging resistance and insufficient strength of existing adhesives. The adhesive is formed by mixing components A and B at a ratio of 100:8-12; the component A contains 100 parts of epoxy resin, 60-120 parts of modified quartz sand and the like, and the component B is diethylenetriamine; the modified quartz sand is modified by KH-550 and has a particle size of 40-120 meshes. The cost of the adhesive is reduced by 30-50%, the adhesive strength is greater than or equal to 15 MPa, the strength retention rate of the aging resistance test is greater than or equal to 90%, the adhesive is suitable for high-voltage disconnector bonding, the construction is convenient, and the adhesive is suitable for large-scale application.

Description

Technical Field This invention belongs to the field of auxiliary materials for high-voltage electrical equipment, specifically relating to a cost-effective, aging-resistant, and high-strength high-voltage disconnector adhesive, used for bonding metal components, insulators, and housings of disconnectors, suitable for complex outdoor working conditions. Background Technology High-voltage disconnect switches are mostly installed outdoors, and their bonding parts need to withstand complex working conditions. Existing adhesives have problems such as high cost, poor aging resistance, insufficient strength, or poor compatibility between fillers and epoxy resin. They cannot simultaneously achieve cost reduction, aging resistance, and high strength, and urgently need to be solved. Summary of the Invention 3.1 Purpose of the Invention To address the issues of high cost, poor aging resistance, and insufficient strength of existing high-voltage disconnector adhesives, a new adhesive is proposed that balances cost reduction, aging resistance, and high strength, thereby extending service life and lowering costs.

[0001] 3.2 Technical Solution A cost-effective, aging-resistant, and high-strength high-voltage disconnector adhesive is prepared by mixing and curing components A and B in a ratio of 100:8~12. Component A contains 100 parts of epoxy resin and 60~120 parts of modified quartz sand, etc., and component B is diethylenetriamine. The modified quartz sand is modified with KH-550, and the process is as described in claim 1.

[0002] Preferred options: E-51 type epoxy resin; 1010 and UV-327 compound anti-aging agent; KH-550 coupling agent preferred; quartz sand purity ≥98%, 40~120 mesh, and polished to remove impurities.

[0003] The preparation and use method of component A are as described in claims 5 and 6.

[0004] 3.3 Beneficial Effects This invention uses modified quartz sand to replace part of the epoxy resin, reducing costs by 30% to 50%; it has excellent aging resistance and strength, making it suitable for outdoor working conditions; it is easy to construct and uses environmentally friendly raw materials, making it suitable for large-scale applications. Detailed Implementation The following embodiments are for illustrative purposes only and do not limit the scope of protection.

[0005] Example 1 Components A and B are mixed in a 100:9 ratio; Component A consists of 100 parts of E-51 epoxy resin and 80 parts of modified quartz sand, etc.; the modified quartz sand is dried at 90℃ for 2.5h, then 1% KH-550 is added and kept at 70℃ for 1.5h; Component A is prepared by stirring at 30℃ and 400r / min; a 1mm coating is applied and cured at room temperature for 24h; the bonding strength is 18MPa, and it exhibits excellent aging resistance and high and low temperature resistance.

[0006] Example 2 Components A and B are mixed at a ratio of 100:8; Component A: 100 parts of E-51 epoxy resin, 60 parts of modified quartz sand, etc.; the modified quartz sand is dried at 80℃ for 3 hours, then 0.5% KH-550 is added and kept at 60℃ for 2 hours; a 0.5mm coating is applied and cured at 60℃ for 4 hours; the bonding strength is 15MPa, and the performance meets the standards.

[0007] Example 3 Components A and B are mixed at a ratio of 100:12; Component A: 100 parts of E-51 epoxy resin, 120 parts of modified quartz sand, etc.; the modified quartz sand is dried at 100℃ for 2 hours, then 1.5% KH-550 is added and kept at 80℃ for 1 hour; a 2mm coating is applied and cured at 80℃ for 2 hours; the bonding strength is 20MPa, exhibiting excellent performance.

[0008] Comparative Example 1 Pure epoxy resin + diethylenetriamine has a bonding strength of 16 MPa, poor aging resistance, and a cost 40% higher than Example 1.

[0009] Comparative Example 2 Component A contains unmodified quartz sand, with a bonding strength of 12 MPa. It is prone to cracking and delamination and has poor aging resistance.

[0010] The embodiments show that the present invention is superior to the prior art and meets the requirements for the use of disconnecting switches. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the adhesive used in this invention to bond the disconnecting switch insulator to the housing. In the figure: 1-metal body of high-voltage disconnect switch, 2-insulator, 3-adhesive layer of the present invention.

Claims

1. A cost-effective, aging-resistant, and high-strength high-voltage disconnector adhesive, characterized in that: It is formed by mixing and curing component A and component B in a weight ratio of 100:8~12; component A includes the following raw materials by weight: 100 parts epoxy resin, 60~120 parts modified quartz sand, 5~15 parts dibutyl phthalate, 0.5~2 parts anti-aging agent, and 1~3 parts coupling agent; component B is diethylenetriamine curing agent; the modified quartz sand is made by surface modification treatment of quartz sand with silane coupling agent KH-550. The specific modification process is as follows: put quartz sand with a particle size of 40~120 mesh into an oven at 80~100℃ and dry it for 2~3 hours. After cooling to room temperature, add 0.5~1.5% of silane coupling agent KH-550 by weight of quartz sand, stir evenly, keep warm at 60~80℃ for 1~2 hours, and obtain modified quartz sand after cooling.

2. The cost-effective, aging-resistant, and high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The epoxy resin is E-51 type bisphenol A epoxy resin with an epoxy value of 0.48~0.54 eq / 100g.

3. The cost-reducing and aging-resistant high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The anti-aging agent is a compound of hindered phenolic anti-aging agent 1010 and ultraviolet absorber UV-327, with a compound weight ratio of 1:1~2.

4. The cost-reducing and aging-resistant high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The coupling agent is a silane coupling agent KH-560 or KH-550, with KH-550 being preferred.

5. The cost-reducing and aging-resistant high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The preparation method of component A is as follows: epoxy resin, dibutyl phthalate and coupling agent are placed in a stirred tank and stirred at 25~35℃ for 10~20 min at a stirring speed of 300~500 r / min. Then, modified quartz sand and anti-aging agent are added and stirred for another 30~40 min until the mixture is uniform to obtain component A.

6. The cost-reducing and aging-resistant high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The method of using the adhesive is as follows: Mix component A and component B at a weight ratio of 100:8~12, stir evenly, apply to the area to be bonded, with a coating thickness of 0.5~2mm, and cure at room temperature for 24~48h, or at 60~80℃ for 2~4h to complete the bonding.

7. The cost-effective and aging-resistant high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The performance indicators of the adhesive after curing are as follows: bonding strength ≥15MPa, Shore hardness ≥85D, high and low temperature resistance (no cracking or peeling after 100 cycles of -40℃ to 120℃), aging resistance (strength retention rate ≥90% after 1000h xenon lamp aging), and salt spray corrosion resistance (no rust or debonding after 48h neutral salt spray test).

8. The cost-reducing and aging-resistant high-strength high-voltage disconnector adhesive according to claim 1, characterized in that, The quartz sand has a purity of ≥98%, and its particle size is 40~120 mesh before modification. The surface is polished to remove impurities and burrs.

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