Encapsulated filter antenna

Abstract

The present disclosure relates to a packaged filtering antenna, comprising at least one filtering antenna unit, each filtering antenna unit comprising: a dielectric substrate layer, an antenna radiation patch arranged on a first end surface on top of the dielectric substrate layer, an antenna feed point arranged on a second end surface on the bottom of the dielectric substrate layer, and an absorption type filter arranged in the dielectric substrate layer, an input end of the filter corresponding to the antenna feed point in a Z-axis direction perpendicular to the dielectric substrate layer and being connected by a third group of metallized blind holes; and an output end of the filter corresponding to a second radiation patch hole disc in the Z-axis direction and being connected by a second group of metallized blind holes. The packaged filtering antenna of the present disclosure forms a vertical cascade between the antenna feed point and the filter input end, and between the filter output end and the antenna radiation patch, and integrates the antenna and the filter in the vertical direction, thereby effectively reducing the size of the filtering antenna in a two-dimensional plane, and having the performance of filtering, signal radiation and interference signal absorption.

Description

Technical Field

[0001] This disclosure relates to the field of wireless communication technology, and specifically to an encapsulated filter antenna. Background Technology

[0002] With the rapid development of high-frequency wireless technologies such as mobile communication and low-orbit satellite communication, terminal equipment has placed increasingly stringent requirements on phased array antenna systems in terms of miniaturization, high integration, low loss, and strong anti-interference capabilities.

[0003] In phased array antenna systems, the antenna and filter respectively perform the critical functions of electromagnetic wave radiation / reception and frequency selection. However, traditional solutions typically design these two components separately, resulting in a large system size and high interconnection losses, especially in the millimeter-wave band where miniaturization and high integration requirements are difficult to meet. More seriously, in multi-beam systems, when multiple high-power carriers pass through nonlinear active and passive devices, intermodulation products are generated. If these products fall within the passband of the receiver or other high-sensitivity RF products, they will significantly increase the noise level and may even drown out the useful signal, rendering the receiving channel unusable.

[0004] Reflective filters and absorptive filters are two common filter types. Reflective filters exhibit impedance discontinuities along the electromagnetic signal transmission path, causing most of the electromagnetic energy to be reflected back to the signal source. Frequency selection is achieved through impedance mismatch, but they are prone to resonance due to parasitic parameters or impedance mismatch, leading to signal distortion or performance degradation. Furthermore, reflective filters only block or alter the transmission path of interfering signals but do not significantly reduce the power intensity of the interfering signal itself; the interfering signal still carries the risk of radiated leakage during its transmission after reflection. For example, for L-band interference signals, which have low transmission loss, energy cannot be significantly dissipated in the reflection path, greatly increasing the likelihood of radiated leakage. Once radiated leakage occurs, the interference of intermodulation products to other receivers remains unresolved. In contrast, absorptive filters, by employing lossy filtering elements (such as absorbing materials and resistors), dissipate the energy of the interfering signal internally and convert it into heat. This effectively suppresses broadband interference, reduces the impact of reflected signals on the system, and lowers the risk of resonance and radiated leakage. Therefore, absorptive filters are more suitable for electromagnetic compatibility (EMC) designs and other scenarios requiring suppression of broadband interference.

[0005] In phased array antenna systems, integrating filters at the end of the feed network or within the amplitude-phase multifunction module presents significant design challenges. Furthermore, to suppress active and passive intermodulation products, filters should be placed as close to the antenna as possible to eliminate all interference signals before radiation. In this application scenario, miniaturized, lightweight, and highly integrated filter antennas become the optimal choice. Filter antennas can filter signals within a specific frequency band while simultaneously receiving or transmitting signals, achieving both signal selection and interference suppression, thus improving system reliability. Summary of the Invention

[0006] In view of this, the present disclosure provides an encapsulated filter antenna to address the technical deficiencies existing in the prior art.

[0007] According to a first aspect of this disclosure, a packaged filtering antenna is provided, comprising at least one filtering antenna element, each of the filtering antenna elements comprising:

[0008] A dielectric substrate layer, wherein two opposite end faces of the dielectric substrate layer are respectively referred to as the first end face located at the top and the second end face located at the bottom;

[0009] An antenna radiating patch is configured to be disposed on a first end face and to include an arc-shaped metal strip. The metal strip is configured to be disposed around a first radiating patch aperture, a second radiating patch aperture is disposed at the starting end of the metal strip, and a third radiating patch aperture is disposed on the metal strip at a position between its starting end and its ending end. The metal strip is configured to bend and extend from its starting end around the first radiating patch aperture to its ending end.

[0010] Antenna feed point, wherein the antenna feed point is configured to be located on the second end face;

[0011] An absorptive filter is configured to be disposed within the dielectric substrate layer; and the absorptive filter has an input terminal and an output terminal; wherein, the input terminal of the absorptive filter corresponds to the antenna feed point in the Z-axis direction perpendicular to the dielectric substrate layer and is configured to be conductive through a third group of metallized blind vias; the output terminal of the absorptive filter is configured to correspond to the second radiating patch aperture in the Z-axis direction and is configured to be conductive through a second group of metallized blind vias.

[0012] In one embodiment of this disclosure, the absorptive filter includes a first filter coupling structure and a second filter coupling structure arranged sequentially in the Z-axis direction;

[0013] The first filter coupling structure includes a first filter stripline and a first filter aperture disk disposed on the first filter stripline; it also includes a second filter aperture disk, which is configured to be connected to the first filter stripline through a first filter buried resistor.

[0014] The second filter coupling structure includes a second filter stripline and a third filter aperture disk disposed on the second filter stripline; it also includes a fourth filter aperture disk configured to be connected to the second filter stripline via a second filter embedded resistor.

[0015] The third filter aperture is configured to serve as the input terminal of the absorptive filter and to be connected to the antenna feed point through a third group of metallized blind apertures; the first filter aperture is configured to serve as the output terminal of the absorptive filter and to be connected to the second radiating patch aperture through a second group of metallized blind apertures.

[0016] In one embodiment of this disclosure, the fourth filter aperture disk, the second filter aperture disk, and the first radiating patch aperture disk are configured to correspond to each other in the Z-axis direction and are sequentially connected through a second group of metallized vias.

[0017] In one embodiment of this disclosure, a first metal layer is disposed on a first end face of the dielectric substrate layer; a second metal layer is disposed within the dielectric substrate layer at a position between the first metal layer and the first filter coupling structure;

[0018] The antenna radiating patch is formed on the first metal layer, and a first grounding metal surface is located outside the antenna radiating patch; a first metal ground plate and an annular gap isolated from the first metal ground plate are provided on the second metal layer.

[0019] The second group of metallized blind vias connecting the first filter via and the second radiating patch via is configured to pass through the annular gap to isolate it from the first metal ground plane; the second group of metallized vias connecting the fourth filter via, the second filter via, and the first radiating patch via is configured to be connected to the first metal ground plane.

[0020] In one embodiment of this disclosure, a third metal layer and a fourth metal layer are sequentially disposed below the second metal layer within the dielectric substrate layer;

[0021] The first filter coupling structure and a second ground metal surface located outside the first filter coupling structure are formed on the third metal layer.

[0022] The second filter coupling structure and a third ground metal surface located outside the second filter coupling structure are formed on the fourth metal layer.

[0023] The third radiating patch aperture plate, the first metal ground plate, the second ground metal surface, and the third ground metal surface are configured to be connected by a third metallized via group.

[0024] In one embodiment of this disclosure, a fifth metal layer is provided on the second end face of the dielectric substrate layer, a second metal ground plane is formed on the fifth metal layer, and the antenna feed point is isolated from the second metal ground plane.

[0025] In one embodiment of this disclosure, the antenna feed point includes a first aperture disk and a second aperture disk connected to each other, wherein the first aperture disk is configured to be connected to the third filter aperture disk via a third group of metallized blind apertures; and the second aperture disk is configured as an external feed source.

[0026] In one embodiment of this disclosure, the first ground metal surface, the first metal ground plate, the second ground metal surface, the third ground metal surface, and the second metal ground plate are configured to be connected by a first metallized via group; the first metallized via group includes a plurality of first metallized vias distributed on the outside of the antenna radiating patch, the plurality of first metallized vias being arranged at intervals and respectively connecting the first ground metal surface, the first metal ground plate, the second ground metal surface, the third ground metal surface, and the second metal ground plate.

[0027] In one embodiment of this disclosure, a metallized sidewall is provided on the outer side of the dielectric substrate layer; the metallized sidewall is configured to form a first shielding structure with the first group of metallized vias, surrounding the antenna radiating patch and the absorptive filter.

[0028] In one embodiment of this disclosure, the first metal ground, the second ground metal surface, the third ground metal surface, and the second metal ground are configured to be connected by a first group of metallized blind vias; the first group of metallized blind vias includes a plurality of first metallized blind vias distributed on the outside of the absorptive filter, the plurality of first metallized blind vias being arranged at intervals and respectively connected to the first metal ground, the second ground metal surface, the third ground metal surface, and the second metal ground.

[0029] In one embodiment of this disclosure, the first group of metallized blind holes forms a second shielding structure surrounding the absorptive filter.

[0030] In one embodiment of this disclosure, the first shielding structure is located outside the second shielding structure.

[0031] In one embodiment of this disclosure, the metal strip is configured to extend from its starting end in a counterclockwise or clockwise bend around the first radiating patch aperture disk to its ending end.

[0032] In one embodiment of this disclosure, an antenna module is included, the antenna module being configured to include four filtered antenna elements arranged in a matrix; wherein the metal strips in each filtered antenna element have a different rotation angle.

[0033] In one embodiment of this disclosure, multiple antenna modules are provided, and the multiple antenna modules are configured to be arranged at predetermined intervals.

[0034] The beneficial effects of the packaged filter antenna provided in this disclosure are as follows: By placing the absorptive filter within the dielectric substrate layer of the antenna element, the input end of the absorptive filter corresponds to the antenna feed point in the Z-axis direction perpendicular to the dielectric substrate layer and is conducted through a third group of metallized blind vias; and the output end of the absorptive filter corresponds to the second radiating patch aperture in the Z-axis direction and is conducted through a second group of metallized blind vias. This creates a vertical cascade between the input end of the absorptive filter, the antenna feed point, and the output end of the antenna element, effectively reducing the size of the filter antenna in the two-dimensional plane and avoiding the problem of grating lobes under large scanning angle conditions. Furthermore, the packaged filter antenna of this disclosure retains the complete antenna radiation structure and filter structure, thereby effectively ensuring the filtering and radiation performance of the packaged filter antenna. It avoids the influence of reflected signals on the system, reduces the risk of resonance and radiation leakage, and improves the stability of the system.

[0035] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0037] Figure 1 This is a schematic diagram of the overall structure of the encapsulated filter antenna provided in one embodiment of the present disclosure;

[0038] Figure 2 This is a schematic diagram of the structure of a filter antenna unit provided in an embodiment of this disclosure;

[0039] Figure 3 This is a schematic diagram of the structure of a dielectric substrate layer provided in an embodiment of the present disclosure;

[0040] Figure 4 This is a schematic diagram of the structure of the first metal layer provided in an embodiment of this disclosure;

[0041] Figure 5 This is a schematic diagram of the structure of an antenna radiating patch provided in an embodiment of this disclosure;

[0042] Figure 6 This is a schematic diagram of the structure of the second metal layer provided in an embodiment of this disclosure;

[0043] Figure 7 This is a schematic diagram of the structure of the third metal layer provided in an embodiment of this disclosure;

[0044] Figure 8 This is a schematic diagram of the structure of the fourth metal layer provided in an embodiment of this disclosure;

[0045] Figure 9 This is a schematic diagram of the structure of the fifth metal layer provided in an embodiment of this disclosure;

[0046] Figure 10 This is a schematic diagram of the structure of a metallized sidewall provided in an embodiment of this disclosure;

[0047] Figure 11 This is a schematic diagram of the structure of a metallized hole provided in an embodiment of this disclosure;

[0048] Figure 12 This is a schematic diagram of the structure of a first hybrid metallized pore group provided in an embodiment of this disclosure;

[0049] Figure 13 This is a schematic diagram of a vertically cascaded structure of a packaged filter antenna provided in an embodiment of this disclosure;

[0050] Figure 14 This is a simulation result diagram of the operating frequency band provided in Embodiment 1 of this disclosure;

[0051] Figure 15 This is a simulation result diagram of the interference suppression frequency band provided in Embodiment 1 of this disclosure.

[0052] Figures 1 to 15 The one-to-one correspondence between the component names and the reference numerals in the figures is as follows:

[0053] 1. Dielectric substrate layer; 11. First dielectric substrate; 12. Second dielectric substrate; 13. Third dielectric substrate; 14. Fourth dielectric substrate; 15. Fifth dielectric substrate; 16. Sixth dielectric substrate;

[0054] 2. Prepreg; 21. First prepreg; 22. Second prepreg; 23. Third prepreg; 24. Fourth prepreg; 25. Fifth prepreg;

[0055] 3. First metal layer; 31. First grounding metal surface; 32. Antenna radiating patch; 321. First radiating patch aperture; 322. Second radiating patch aperture; 323. Third radiating patch aperture; 324. Metal strip;

[0056] 4. Second metal layer; 41. First metal floor; 42. Circular gap;

[0057] 5. Third metal layer; 51. Second grounding metal surface; 52. First filter coupling structure; 521. First filter aperture plate; 522. Second filter aperture plate; 523. First filter stripline; 524. First filter buried resistor; 525. First filter electrode plate;

[0058] 6. Fourth metal layer; 61. Third grounding metal surface; 62. Second filter coupling structure; 621. Third filter aperture plate; 622. Fourth filter aperture plate; 623. Second filter stripline; 624. Second filter buried resistor; 625. Second filter electrode plate;

[0059] 7. Fifth metal layer; 71. Second metal ground plane; 72. Antenna feed point; 721. First aperture plate; 722. Second aperture plate;

[0060] 8. Metallized sidewalls;

[0061] 9. Metallized via; 91. First group of metallized vias; 92. First group of metallized blind vias; 93. First group of mixed metallized vias; 931. Second group of metallized vias; 932. Second group of metallized blind vias; 933. Third group of metallized blind vias; 934. Third group of metallized vias. Detailed Implementation

[0062] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0063] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0064] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0065] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0066] In this article, terms such as "up," "down," "front," "back," "left," and "right" are used only to indicate the relative positional relationship between related parts, rather than to define the absolute position of these related parts.

[0067] In this article, "first," "second," etc., are used only to distinguish one another, and not to indicate degree of importance, order, or prerequisite for each other.

[0068] In this document, terms such as “equal” and “same” are not strict mathematical and / or geometric limitations, but also include errors that are understandable to those skilled in the art and permissible in manufacturing or use.

[0069] First, the nouns and terms used in one or more embodiments will be explained.

[0070] Grating lobe: A grating lobe is a side lobe with an intensity comparable to the main lobe that appears in an undesired direction due to excessively large element spacing in a phased array.

[0071] This disclosure relates to a packaged filter antenna, including at least one filter antenna element. Each antenna element includes: a dielectric substrate layer, an antenna radiating patch disposed on a first end face at the top of the dielectric substrate layer, an antenna feed point disposed on a second end face at the bottom of the dielectric substrate layer, and an absorptive filter disposed within the dielectric substrate layer.

[0072] The packaged filter antenna disclosed herein establishes a vertical cascade between the input of the absorptive filter and the antenna feed point in the Z-axis direction perpendicular to the dielectric substrate layer, and conducts through a metallized blind aperture; and the output of the absorptive filter is aligned with the second radiating patch aperture in the Z-axis direction, also conducted through a metallized blind aperture. This effectively reduces the size of the filter antenna in the two-dimensional plane and decreases the element spacing. Since excessive element spacing can lead to grating lobes, the vertical cascade structure formed by the antenna and absorptive filter in this disclosure effectively avoids the problem of grating lobes in the packaged filter antenna under large scanning angle conditions. The condition for the phased array antenna to not exhibit grating lobes is: d ≤ λ / (1 + sinθ0), where d is the element spacing; λ is the highest frequency point in the antenna's operating bandwidth; and θ0 is the maximum scanning angle.

[0073] For ease of understanding, please refer to the following: Figures 1 to 15 The specific structure and working principle of the encapsulated filter antenna of this disclosure will be described in detail with reference to one embodiment.

[0074] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 9The present disclosure provides a packaged filtering antenna, including at least one filtering antenna element. Each filtering antenna element includes: a dielectric substrate layer 1, an antenna radiating patch 32, an antenna feed point 72, and an absorptive filter. The two opposite end faces of the dielectric substrate layer 1 are respectively referred to as a first end face located at the top and a second end face located at the bottom. The antenna radiating patch 32 is configured to be disposed on the first end face, and the antenna feed point 72 is configured to be located on the second end face. The absorptive filter is configured to be disposed within the dielectric substrate layer 1.

[0075] For details, please refer to Figure 3 The dielectric substrate layer 1 includes a first dielectric substrate 11, a second dielectric substrate 12, a third dielectric substrate 13, a fourth dielectric substrate 14, a fifth dielectric substrate 15, and a sixth dielectric substrate 16 arranged sequentially from top to bottom along the Z-axis. A prepreg 2 is disposed between adjacent dielectric substrates for bonding them together. For example, the first dielectric substrate 11 and the second dielectric substrate 12 are bonded together by the first prepreg 21; the second dielectric substrate 12 and the third dielectric substrate 13 are bonded together by the second prepreg 22; the third dielectric substrate 13 and the fourth dielectric substrate 14 are bonded together by the third prepreg 23; the fourth dielectric substrate 14 and the fifth dielectric substrate 15 are bonded together by the fourth prepreg 24; and the fifth dielectric substrate 15 and the sixth dielectric substrate 16 are bonded together by the fifth prepreg 25. (Reference) Figure 2 and Figure 3 Antenna radiating patch 32 is disposed on the upper surface of the first dielectric substrate 11, and absorptive filters are disposed within the fourth dielectric substrate 14, the fifth dielectric substrate 15, and the sixth dielectric substrate 16, for reference. Figure 9 The antenna feed point 72 is disposed on the lower surface of the sixth dielectric substrate 16, and the antenna feed point 72 is an inner conductor fan-out structure, through which the signal is input to the packaged filter antenna of this disclosure.

[0076] refer to Figure 4 and Figure 5 The antenna radiating patch 32 specifically includes an arc-shaped metal strip 324, which is configured to be arranged around a first radiating patch aperture 321. A second radiating patch aperture 322 is provided at the starting end of the metal strip 324, and a third radiating patch aperture 323 is provided on the metal strip 324 at a position between its starting end and its ending end. The metal strip 324 is configured to bend and extend from its starting end around the first radiating patch aperture 321 to its ending end.

[0077] For details, please refer to Figure 4 and Figure 5The antenna radiating patch 32 shown in this disclosure has an arc-shaped metal strip 324 that rotates spirally from the inside out. The metal strip 324 surrounds the first radiating patch aperture 321 to excite a spiral magnetic current, causing the current on the metal strip 324 to exhibit traveling wave characteristics, forming a circularly polarized wave with a specific direction of rotation. For example... Figure 5 The antenna radiating patch 32 shown has a fan-shaped structure that can adjust the current matching to minimize the current reflected from the helical terminal, thereby constructing a traveling wave state.

[0078] refer to Figure 2 , Figure 7 , Figure 8 , Figure 9 An absorptive filter is configured to be disposed within the dielectric substrate layer 1. The absorptive filter has an input terminal and an output terminal. The input terminal of the absorptive filter is the fourth filter aperture 622, and the output terminal of the absorptive filter is the first filter aperture 521. The input terminal of the absorptive filter corresponds to the antenna feed point 72 in the Z-axis direction perpendicular to the dielectric substrate layer 1, meaning that its horizontal position in the XY plane is completely aligned with the antenna feed point 72. The two are on the same vertical axis in space and are connected through the third metallized blind aperture group 933. This not only shortens the transmission path of high-frequency signals and effectively reduces the loss in the millimeter-wave band, but also avoids the phase error and impedance mismatch problems caused by the bending or length difference of the traces in traditional planar feed networks. The output terminal of the absorptive filter is configured to correspond to the second radiating patch aperture 322 in the Z-axis direction and is connected through the second metallized blind aperture group 932.

[0079] Furthermore, the antenna of this disclosure is disposed within the dielectric substrate layer 1 and located vertically above the absorptive filter, comprising multiple dielectric substrates stacked from top to bottom, with adjacent dielectric substrates bonded together by a prepreg 2, such as... Figure 13As shown, the antenna includes a first dielectric substrate 11, a second dielectric substrate 12, and a third dielectric substrate 13 arranged sequentially from top to bottom. The first dielectric substrate 11 and the second dielectric substrate 12 are bonded together by a first prepreg 21, and the second dielectric substrate 12 and the third dielectric substrate 13 are bonded together by a second prepreg 22. The antenna and the absorptive filter are vertically cascaded through metallized vias 9, achieving structural sharing of the metallized vias 9. Simultaneously, because the absorptive filter is adjacent to the RF input source, it can efficiently suppress active and passive intermodulation products before signal radiation. These products are dissipated as heat by the buried resistors in the absorptive filter before reaching the antenna radiating patch 32, effectively suppressing the risk of radiation leakage and improving the electromagnetic compatibility performance of the system in high-sensitivity receiving scenarios such as the L-band. Furthermore, this vertically cascaded structure helps to reduce the planar size and achieve miniaturization, enabling its application in phased array antenna systems.

[0080] refer to Figure 7 , Figure 8 , Figure 9 , Figure 13 In one embodiment of this disclosure, the absorptive filter includes a first filter coupling structure 52 and a second filter coupling structure 62 arranged sequentially in the Z-axis direction, such as... Figure 13 As shown, the first filter coupling structure 52 and the second filter coupling structure 62 are symmetrically arranged, which makes the absorption filter reciprocal. The signal can be transmitted from the first filter coupling structure 52 to the second filter coupling structure 62, and from the second filter coupling structure 62 to the first filter coupling structure 52, and the transmission coefficients are equal, so that the filter can simultaneously perform transmission and reception functions. The first filter coupling structure 52 includes a first filter stripline 523 and a first filter aperture 521 disposed on the first filter stripline 523; it also includes a second filter aperture 522, which is configured to be connected to the first filter stripline 523 through a first filter embedded resistor 524; the second filter coupling structure 62 includes a second filter stripline 623 and a third filter aperture 621 disposed on the second filter stripline 623; it also includes a fourth filter aperture 622, which is configured to be connected to the second filter stripline 623 through a second filter embedded resistor 624.

[0081] The third filter aperture 621 is configured as the input terminal of the absorptive filter and is connected to the antenna feed point 72 through a metallized third metallized blind aperture group 933; the first filter aperture 521 is configured as the output terminal of the absorptive filter and is connected to the second radiating patch aperture 322 through a second metallized blind aperture group 932.

[0082] Specifically, the first filter coupling structure 52 includes a first filter stripline 523, on which a first filter aperture 521 is disposed, and is connected to the second radiating patch aperture 322 through a second group of metallized blind vias 932, serving as the output end of the absorptive filter and also as the signal input end from the absorptive filter to the antenna radiating patch 32, for signal input; the second filter aperture 522 is not directly connected to the first filter stripline 523, but is connected to it through a first filter buried resistor 524 located on the upper surface of the fifth dielectric substrate 15, thereby introducing a loss path in the transmission path. Signals outside the working band will be introduced into this path and absorbed by the buried resistor and converted into heat energy, achieving the filtering effect.

[0083] Similarly, the second filter coupling structure 62 includes a second filter stripline 623 on which a third filter aperture 621 is disposed. This third filter aperture 621 can be connected to the antenna feed point 72 via a third group of metallized blind apertures 933, serving as the input terminal of the absorptive filter to input signals from the feed source into the absorptive filter. Simultaneously, a fourth filter aperture 622 is connected to the second filter stripline 623 via a second filter buried resistor 624, forming another dissipative branch with resistive termination. Through the aforementioned first filter coupling structure 52 and second filter coupling structure 62, the absorptive filter of this disclosure can not only achieve low-loss transmission of signals in the operating frequency band but also effectively absorb signals outside the operating band and convert them into heat energy, thereby avoiding problems such as pre-stage instability and radiation leakage caused by signal reflection in traditional filters. Specifically, the first filter buried resistor 524 is mainly used to filter out low-frequency signals input from the first filter aperture 521, and the second filter buried resistor 624 is mainly used to filter out low-frequency signals input from the third filter aperture 621.

[0084] Furthermore, the first filter coupling structure 52 is also provided with a first filter plate 525 connected to the first filter aperture 521, and the second filter coupling structure 62 is also provided with a second filter plate 625 connected to the third filter aperture 621. The first filter plate 525 and the second filter plate 625 are arranged correspondingly in the Z-axis direction, together forming a parallel plate capacitor structure. When the signal from the feed source enters the absorptive filter through the third filter aperture 621, based on the characteristic of the capacitor structure to pass high frequencies and block low frequencies, the high-frequency signal in the signal can pass through the capacitance constructed between the first filter plate 525 and the second filter plate 625, while the low-frequency signal flows into the second filter buried resistor 624 through the inductor path on the second filter coupling structure 62 and is converted into heat energy. Similarly, the signal transmitted to the first filter aperture 521 through the capacitor structure is filtered again, so that the low-frequency signal in it is filtered out a second time through the first filter buried resistor 524, thereby transmitting the high-frequency signal in the working band to the upper antenna radiation area.

[0085] In another embodiment of this disclosure, the absorptive filter may also be provided with absorbing material, which absorbs and suppresses signals in the frequency band without affecting the transmission of signals within the operating band.

[0086] refer to Figure 2 , Figure 5 , Figure 7 and Figure 8 In one embodiment of this disclosure, the fourth filter aperture 622, the second filter aperture 522, and the first radiating patch aperture 321 are configured to correspond to each other in the Z-axis direction and are sequentially connected through the second metallized via group 931.

[0087] Specifically, the fourth filter aperture 622, the second filter aperture 522, and the first radiation patch aperture 321 are aligned with each other in the Z-axis direction perpendicular to the dielectric substrate layer 1, that is, the three are in the same horizontal position in the XY plane, and the three are connected by the second metallized via group 931.

[0088] This vertical interconnection method significantly shortens the transmission path of high-frequency signals, reduces the losses caused by traditional planar traces, and provides structural support for achieving miniaturized, lightweight, and highly integrated packaged filter antennas.

[0089] refer to Figures 3 to 5 , Figures 6 to 8 , Figure 13 In one embodiment of this disclosure, a first metal layer 3 is disposed on a first end face of a dielectric substrate layer 1; a second metal layer 4 is disposed within the dielectric substrate layer 1 at a position between the first metal layer 3 and the first filter coupling structure 52; wherein an antenna radiating patch 32 and a first ground metal surface 31 located outside the antenna radiating patch 32 are formed on the first metal layer 3; a first metal ground plane 41 and an annular gap 42 isolated from the first metal ground plane 41 are disposed on the second metal layer 4; wherein a second metallized blind via group 932 connecting the first filter via 521 and the second radiating patch via 322 is configured to pass through the annular gap 42 to be isolated from the first metal ground plane 41; and a second metallized via group 931 connecting the fourth filter via 622, the second filter via 522, and the first radiating patch via 321 is configured to be conductive to the first metal ground plane 41.

[0090] Specifically, the first metal layer 3 is disposed on the upper surface of the first dielectric substrate 11. The first metal layer 3 consists of a first ground metal surface 31 and an antenna radiating patch 32. The antenna radiating patch 32 consists of a first radiating patch aperture 321, a second radiating patch aperture 322, a third radiating patch aperture 323 near the center, and a spiral metal strip 324. The antenna radiating patch 32 is located in the circular gap left by the first ground metal surface 31. The second metal layer 4 is located on the upper surface of the fourth dielectric substrate 14 and consists of a first metal ground plane 41 and an annular gap 42 isolated from the first metal ground plane 41. The second metal layer 4 is disposed between the top radiating structure and the middle filtering structure. The first metal ground plane 41 serves as a reference ground plane to provide suitable boundary conditions between the antenna element and the absorptive filter, enabling electromagnetic waves to transmit with the required characteristics.

[0091] Furthermore, the second group of metallized blind vias 932 connecting the first filter via 521 and the second radiating patch via 322 can pass through the annular gap 42 on the second metal layer 4, thereby maintaining isolation from the first metal ground plane 41. This prevents the second group of metallized blind vias 932 from forming a short circuit with the large area of ​​the first metal ground plane 41 during vertical interconnection, ensuring that the feed signal can be transmitted from the absorptive filter to the upper antenna radiating patch 32. If the second group of metallized blind vias 932 were directly connected to the first metal ground plane 41, the signal that should have been fed into the antenna radiating patch 32 would be short-circuited with the ground plane, resulting in radiation failure.

[0092] refer to Figure 3 , Figure 6 , Figure 7 , Figure 8 and Figure 13 In one embodiment of this disclosure, a third metal layer 5 and a fourth metal layer 6 are sequentially disposed below the second metal layer 4 within the dielectric substrate layer 1; a first filter coupling structure 52 and a second ground metal surface 51 located outside the first filter coupling structure 52 are formed on the third metal layer 5; a second filter coupling structure 62 and a third ground metal surface 61 located outside the second filter coupling structure 62 are formed on the fourth metal layer 6; wherein the third radiating patch via 323, the first metal ground 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal ground 71 are configured to be connected through a third metallized via group 934.

[0093] Specifically, the third metal layer 5 is located on the upper surface of the fifth dielectric substrate 15, and is composed of the second ground metal surface 51 and the first filter coupling structure 52, with the first filter coupling structure 52 located in the rectangular gap of the second ground metal surface 51; the fourth metal layer 6 is located on the upper surface of the sixth dielectric substrate 16, and is composed of the third ground metal surface 61 and the second filter coupling structure 62, with the second filter coupling structure 62 located in the rectangular gap of the third ground metal surface 61.

[0094] refer to Figure 3 , Figure 9 and Figure 13 In one embodiment of this disclosure, a fifth metal layer 7 is provided on the second end face of the dielectric substrate layer 1, and a second metal ground plane 71 and an antenna feed point 72 isolated from the second metal ground plane 71 are formed on the fifth metal layer 7.

[0095] Specifically, the fifth metal layer 7 is located on the lower surface of the sixth dielectric substrate 16 and consists of a second metal ground plane 71 and an antenna feed point 72. The signal is input to the absorptive filter through the antenna feed point 72. The second metal ground plane 71 serves as the bottom reference ground plane, while the antenna feed point 72, i.e., the inner conductor fan-out structure, directly acts as the feed entrance for the entire antenna system. External radio frequency signals are input through this point and transmitted upwards step by step to the absorptive filter and the top antenna radiating patch 32.

[0096] refer to Figures 1 to 4 In one embodiment of this disclosure, the antenna feed point 72 includes a first aperture disk 721 and a second aperture disk 722 connected to each other, wherein the first aperture disk 721 is configured to be connected to a third filter aperture disk 621 through a third metallized blind aperture group 933; and the second aperture disk 722 is configured as an external feed source.

[0097] Specifically, the antenna feed point 72 is composed of a first aperture plate 721 and a second aperture plate 722 connected to each other, forming a composite feed node that combines internal integration and external interface functions. The second aperture plate 722 serves as the external interface of the antenna feed point 72, configured to connect to an external feed source for receiving input signals. The first aperture plate 721, on the other hand, is connected to the third filter aperture plate 621 in the absorptive filter via a third group of metallized blind apertures 933, thereby efficiently transmitting the signal from the feed source to the absorptive filter for filtering.

[0098] refer to Figures 4 to 13, in one embodiment of the present disclosure, the first ground metal surface 31, the first metal floor 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal floor 71 are configured to be connected by the first metallized via group 91; the first metallized via group 91 includes a plurality of first metallized vias distributed outside the antenna radiation patch 32, and the plurality of first metallized vias are arranged at intervals and are respectively connected to the first ground metal surface 31, the first metal floor 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal floor 71.

[0099] Specifically, referring to Figure 4 and Figure 11 , the plurality of first metallized vias are distributed in the outer region of the antenna radiation patch 32 and are arranged at intervals along the circumferential direction of the first metal layer 3. Each first metallized via passes through each metal layer in sequence and forms a reliable connection with the first ground metal surface 31, the first metal floor 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal floor 71 respectively, so as to integrally integrate a plurality of grounding structures originally located in different layers into a common grounding structure in the Z-axis direction. This common grounding structure, together with the double-conductor transmission system formed by the inner conductor from the top-layer radiation structure to the bottom-layer antenna feed point 72, provides conditions for the transmission of electromagnetic waves.

[0100] Referring to Figures 1 to 4 , Figures 10 to 13 , in one embodiment of the present disclosure, a metallized sidewall 8 is provided outside the dielectric substrate layer 1; the metallized sidewall 8 is configured to enclose, together with the first metallized via group 91, a first shielding structure surrounding the antenna radiation patch 32 and the absorption filter.

[0101] Specifically, referring to Figure 10 , the metallized sidewall 8 is a circular arc metal surface located at one of the corners of the antenna unit, and its height is equal to the height of the packaged filter antenna. Further, referring to Figure 1 , Figure 2 , Figure 11 , Figure 13 , the first metallized via group 91 and the metallized sidewall 8 outside the dielectric substrate layer 1 form a "field" - shaped isolation wall, that is, the first shielding structure. This first shielding structure divides the entire packaged filter antenna into four independent chambers, and each chamber integrates an antenna unit and its corresponding absorption filter, thereby providing a highly isolated electromagnetic environment for the four antenna units. The presence of the first shielding structure effectively suppresses the mutual coupling between adjacent antenna units and significantly improves the anti-interference ability of a single antenna unit.

[0102] Because each antenna element is completely encased within a shield composed of a first group of metallized vias 91 and metallized sidewalls 8, the entire packaged filter antenna possesses excellent modularity. Therefore, the first group of metallized vias 91 not only serves as the vertical interconnection between multiple grounded metal surfaces, but also, through the three-dimensional shielding architecture constructed in conjunction with the metallized sidewalls 8, deeply integrates the antenna radiating patch 32 with the absorptive filter, forming a stable module and providing a compact and reliable hardware foundation for large-scale phased array systems.

[0103] refer to Figures 6 to 8 , Figures 11 to 13 In one embodiment of this disclosure, the first metal ground 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal ground 71 are configured to be connected by a first metallized blind via group 92; the first metallized blind via group 92 includes a plurality of first metallized blind vias distributed on the outside of the absorptive filter, the plurality of first metallized blind vias are arranged at intervals and are respectively connected to the first metal ground 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal ground 71.

[0104] Specifically, the first metal ground plane 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal ground plane 71 are further connected through a group of first metallized blind vias 92 located inside the package. The group of first metallized blind vias 92 does not penetrate the entire dielectric substrate layer 1, but extends downwards from the middle of the first metal ground plane 41 to the second metal ground plane 71, forming a local vertical interconnect. Multiple first metallized blind vias are distributed around the outline of the rectangular gaps of the first filter coupling structure 52 and the second filter coupling structure 62, thus completely surrounding the first filter coupling structure 52 and the second filter coupling structure 62 on the horizontal plane. This allows the group of first metallized blind vias 92, together with the first metal ground plane 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal ground plane 71, to construct a closed vertical electromagnetic barrier, effectively isolating the absorptive filter from its surrounding circuitry, making it an independent, highly integrated filtering module.

[0105] refer to Figure 1 , Figure 2 and Figure 10 , Figure 11 In one embodiment of this disclosure, a first group of metallized blind holes 92 forms a second shielding structure surrounding the absorptive filter.

[0106] Specifically, the first group of metallized blind vias 92 forms a second shielding structure surrounding the absorptive filter. The presence of this second shielding structure suppresses coupling interference between the absorptive filter and adjacent antenna radiation regions. Simultaneously, since the first metallized blind vias only connect the first metal ground plane 41, the second ground metal surface 51, the third ground metal surface 61, and the second metal ground plane 71, without penetrating into the antenna radiation region, the cavity structure required for normal antenna radiation is avoided. Therefore, the first group of metallized blind vias 92 achieves multi-layer grounding integration while simultaneously completing the "electromagnetic encapsulation" of the absorptive filter, giving it modularity, low mutual interference, and high stability.

[0107] refer to Figure 11 and Figure 12 The first hybrid metallized via group 93 includes a second metallized via group 931, a second metallized blind via group 932, a third metallized blind via group 933, and a third metallized via group 934. The metallized vias 9 connecting the fourth filter via disk 622, the second filter via disk 522, and the first radiating patch via disk 321 constitute the second metallized via group 931. The metallized vias 9 connecting the third radiating patch via disk 323, the first metal ground plate 41, the second ground metal surface 51, and the third ground metal surface 61 constitute the third metallized via group 934. The metallized vias 9 connecting the second radiating patch via disk 322 and the first filter via disk 521 constitute the second metallized blind via group 932. The first filter via disk 521 serves as the output terminal of the absorptive filter. The metallized vias 9 connecting the third filter via disk 621 and the antenna feed point 72 constitute the third metallized blind via group 933. The third filter via disk 621 serves as the input terminal of the absorptive filter.

[0108] Furthermore, the spiral magnetic current generated by the antenna radiating patch 32 requires the central conductor to provide corresponding boundary conditions, namely, the grounded first radiating patch aperture 321. Therefore, the second metallized via group 931 needs to connect the fourth filter aperture 622, the second filter aperture 522, the first radiating patch aperture 321, and the first metal ground plate 41. At the same time, since the fourth filter aperture 622, the second filter aperture 522, and the first radiating patch aperture 321 are coaxial on the Z-axis, they can share the same via. The third metallized via group 934 connects the third radiating patch aperture 323, the first metal ground plate 41, the second grounded metal surface 51, and the third grounded metal surface 61. This is because the part of the third metallized via group 934 between the first metal ground plate 41, the second grounded metal surface 51, and the third grounded metal surface 61 is actually a component of the second shielding structure. Connecting the third radiating patch aperture 323 to the first metal ground plate 41 through the third metallized via group 934 can introduce a high-frequency resonant point.

[0109] The absorptive filter structure is contained within the antenna body structure. A first shielding structure, composed of a first group of metallized vias 91 and metallized sidewalls 8, and a second shielding structure, composed of a first group of metallized blind vias 92, provide electromagnetic shielding cavity space for the absorptive filter structure. (Reference) Figure 11 and Figure 13 In one embodiment of this disclosure, the first shielding structure is located outside the second shielding structure.

[0110] refer to Figure 5 In one embodiment of this disclosure, the metal strip 324 is configured to extend from its starting end to its terminating end by bending counterclockwise or clockwise around the first radiating patch aperture 321.

[0111] Specifically, the antenna radiating patch 32 consists of a first radiating patch aperture 321, a second radiating patch aperture 322, a third radiating patch aperture 323 near the center, and a spiral metal strip 324. The metal strip 324 starts from the starting end and extends counterclockwise or clockwise around the first radiating patch aperture 321 in a continuously curved manner until its ending end, forming a spiral conductive path. This makes the current on the metal strip 324 exhibit traveling wave characteristics, which can excite a spiral magnetic current and form a circularly polarized wave with a specific direction of rotation.

[0112] Furthermore, the choice of counterclockwise or clockwise winding direction directly determines the direction of rotation of the generated circularly polarized wave. If the current flows from the inside to the outside in a clockwise spiral, it will usually generate a left-handed circularly polarized wave; conversely, it will generate a right-handed circularly polarized wave. The polarization characteristics can be flexibly selected by changing the winding direction of the metal strip 324 according to the system requirements.

[0113] refer to Figure 1 , Figure 2 , Figure 5 In one embodiment of this disclosure, an antenna module is included, which is configured to include four antenna elements arranged in a matrix; wherein the metal strips 324 in each antenna element have different rotation angles. In actual operation, the individual antenna radiating patches 32 in the four matrix-arranged filter antenna elements are rotated in a 90° sequence. This configuration allows the cross-polarization between the antenna elements to cancel each other out, thereby optimizing the axial ratio. If the rotation angles are the same, it will lead to a poor axial ratio.

[0114] Specifically, the antenna module includes four antenna elements arranged in a 2×2 matrix. The metal strips 324 in the four antenna elements have different rotation angles, which allows each antenna element to generate circularly polarized waves with specific phase relationships during radiation. This enables polarization diversity or the phase gradient required for beamforming at the overall array level. For example, in phased array applications, by controlling the geometric rotation angle of the metal strips 324 in each element, an initial spatial phase offset can be effectively introduced to assist electronic scanning or reduce beam squint effects.

[0115] refer to Figure 4 and Figure 9 In one embodiment of this disclosure, each layer of each antenna element is configured as a common metal layer, and is configured to form corresponding antenna radiating patches 32, filter elements, and antenna feed points 72 on the same metal layer respectively.

[0116] Specifically, each antenna element in the vertically stacked multi-layer structure is constructed to share the same set of metal layers. That is, all four antenna elements share the conductive plane of each metal layer, rather than each occupying an independent metal region. Based on this shared metal layer, functional components such as antenna radiating patches 32, filter elements, and antenna feed points 72 corresponding to each antenna element are constructed at different locations on the same metal layer. Because all antenna elements are formed synchronously in the same process step, the deviations in their geometric dimensions, impedance characteristics, and filtering characteristics are significantly reduced, which is beneficial for achieving a phased array system with high channel consistency.

[0117] Meanwhile, combined with the first shielding structure formed by the first metallized via group 91 and the metallized sidewall 8, and the second shielding structure formed by the first metallized blind via group 92, each antenna element is effectively isolated, achieving both high integration and ensuring high isolation between channels, thereby constructing the entire antenna module into a compact and stable whole.

[0118] In one embodiment of this disclosure, multiple antenna modules are configured to be arranged at predetermined intervals, forming a larger-scale array architecture. These predetermined intervals can be optimized based on the wavelength (λ) of the operating frequency band, typically controlled between 0.5λ and 1.0λ, to achieve a balance between suppressing grating lobes, ensuring wide-angle scanning capability, and improving array gain. Since each antenna module integrates filtering and radiation functions and possesses electromagnetic self-shielding characteristics, maintaining appropriate spacing between each antenna module effectively controls mutual coupling and avoids pattern distortion caused by dense arrangement.

[0119] In practical applications, the height of the first dielectric substrate 11 is denoted as h1, 0.1mm ≤ h1 ≤ 1mm; the height of the second dielectric substrate 12 is denoted as h2, 0.1mm ≤ h2 ≤ 1mm; the height of the third dielectric substrate 13 is denoted as h3, 0.1mm ≤ h3 ≤ 1mm; the height of the fourth dielectric substrate 14 is denoted as h4, 0.1mm ≤ h4 ≤ 1mm; the height of the fifth dielectric substrate 15 is denoted as h5, 0.1mm ≤ h5 ≤ 1mm; the height of the sixth dielectric substrate 16 is denoted as h6, 0.1mm ≤ h6 ≤ 1mm; the antenna element has a length and width of P, 4mm ≤ P ≤ 12mm.

[0120] Example 1

[0121] The structure of the encapsulated filter antenna in this embodiment is as described above. The heights of the first dielectric substrate 11 to the sixth dielectric substrate 16 are, respectively: h1 = 0.762 mm; h2 = 0.762 mm; h3 = 0.762 mm; h4 = 0.508 mm; h5 = 0.129 mm; h6 = 0.508 mm. The relative permittivity of all is 2.94. The element spacing P of the encapsulated filter antenna is 7 mm. The spiral of the metal strip 324 in the antenna radiating patch 32 rotates clockwise from the inside out, used to generate a left-handed circularly polarized wave.

[0122] Example 2

[0123] The structure of this example is the same as that of Example 1, with only the following parameters adjusted:

[0124] The thickness h2 of the second dielectric substrate 12 is 0.508 mm.

[0125] Compared to Embodiment 1, the thickness of the second dielectric substrate 12 is reduced, and the electrical dimension of the antenna in the Z direction is reduced, which allows the operating frequency band to be shifted to a higher frequency.

[0126] Example 3

[0127] The structure of this example is the same as that of Example 1, with only the following parameters adjusted:

[0128] The element spacing of the packaged filter antenna is P=7.4mm.

[0129] Compared to Embodiment 1, the unit spacing is increased, and the two-dimensional planar electrical dimensions of the antenna are increased, which allows the operating frequency band to shift to a lower frequency.

[0130] The effects of this disclosure can be further illustrated by the following simulation results:

[0131] 1. Simulation Content

[0132] The reflection coefficient of the above embodiment one was simulated and calculated using the commercial simulation software HFSS_22. The results are as follows: Figure 14 and Figure 15 As shown.

[0133] 2. Simulation Results

[0134] Reference Figure 14 Within the operating band of 18.3–20.2 GHz, the reflection coefficient |S11| of Example 1 is less than -20 dB, and the gain is greater than 8.6 dBi. This indicates that the encapsulated filter antenna in Example 1 has good matching effect and radiation performance within the operating frequency band. The AiP element spacing is 7 mm, which is equal to 0.47λ. h (λ) h (This refers to the wavelength corresponding to the highest frequency point, i.e., the wavelength corresponding to 20.2 GHz). At this time, when the unit spacing d ≤ λ h / (1+sinθ0), that is, d<0.5λ h When it meets the condition of no grating lobes within the ±90° scanning range, it can be used in phased array antenna systems.

[0135] In a multi-beam phased array system, when two beam signals with frequencies f1 and f2 pass through a nonlinear device, intermodulation will occur, generating new frequency components. The frequency f of the intermodulation product can be expressed as: f = mf1 ± nf2; where m and n are integers.

[0136] For f1 = 19.5 GHz and f2 = 18.3 GHz, the frequency of its second-order intermodulation product is f = f1 - f2 = 1.2 GHz; for f1 = 19 GHz and f2 = 18.3 GHz, the frequency of its fourth-order intermodulation product is f = 2f1 - 2f2 = 1.4 GHz; for f1 = 18.7 GHz and f2 = 18.3 GHz, the frequency of its sixth-order intermodulation product is f = 3f1 - 3f2 = 1.2 GHz; and so on. Within the operating frequency range of the phased array antenna system of Embodiment 1, multiple even-order intermodulation products will fall within the L-band, significantly impacting receivers in the L-band. These intermodulation products in the L-band can be absorbed and filtered out by the absorption filter inherent in Embodiment 1. The absorption and filtering function of the antenna in the L-band will be described below based on simulation results.

[0137] Reference Figure 15 Within the 1-2 GHz frequency range (i.e., L-band) outside the operating band, the reflection coefficient |S11| of Example 1 is less than -14.5 dB, and the gain is less than -70 dBi. This indicates that the encapsulated filter antenna in Example 1 has good matching within the 1-2 GHz frequency range outside the operating band. However, from the perspective of gain, energy radiation in this frequency band is greatly suppressed. This is because the absorptive filter absorbs the 1-2 GHz signal and converts it into heat energy, thereby achieving the filtering effect.

[0138] The embodiment demonstrates that the absorption filtering of L-band signals effectively solves the interference problem of intermodulation products of multi-beam phased array systems on L-band receivers. Furthermore, using an absorption filter instead of a reflection filter reduces interference from reflected signals, lowers the risk of resonance and radiation leakage, and improves system stability.

[0139] The simulation results above demonstrate that the encapsulated filter antenna proposed in this disclosure integrates the antenna and filter in the vertical direction without altering their individual structures. It combines filtering and radiation functions while reducing the planar size, enabling its application in phased array antenna systems. Intermodulation products generated during the operation of a multi-beam phased array antenna system can be filtered out using the absorption filtering function of this disclosure, effectively solving the problem of interference from intermodulation products in multi-beam phased array antenna systems to receivers in other frequency bands.

[0140] The packaged filter antenna provided in this disclosure, by placing an absorptive filter within the dielectric substrate layer of the filter antenna unit, aligns the input of the absorptive filter with the antenna feed point in the Z-axis direction perpendicular to the dielectric substrate layer and conducts through a third group of metallized blind vias; and aligns the output of the absorptive filter with the second radiating patch aperture in the Z-axis direction and conducts through a second group of metallized blind vias. This creates a vertical cascade between the input of the absorptive filter, the antenna feed point, and the output of the antenna unit, effectively reducing the size of the filter antenna in a two-dimensional plane and avoiding the problem of grating lobes in the antenna under large scanning angle conditions.

[0141] Furthermore, the encapsulated filter antenna of this disclosure retains the complete antenna and filter structures, thereby effectively ensuring the filtering and radiation performance of the encapsulated filter antenna. Moreover, the absorptive filter of this disclosure can consume the energy of interference signals inside and convert it into heat energy, thereby effectively suppressing wideband interference, reducing the impact of reflected signals on the system, reducing the risk of resonance and radiation leakage, and improving the stability of the system.

[0142] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, and are not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technical improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of this disclosure is defined by the appended claims.

Claims

1. A packaged filter antenna, characterized in that, Includes at least one filter antenna element, each of the filter antenna elements comprising: The dielectric substrate layer (1) has two opposite end faces, which are respectively referred to as the first end face located at the top and the second end face located at the bottom. Antenna radiating patch (32) is configured to be disposed on the first end face and is configured to include an arc-shaped metal strip (324), the metal strip (324) is configured to be disposed around a first radiating patch aperture (321), a second radiating patch aperture (322) is disposed at the starting end of the metal strip (324), and a third radiating patch aperture (323) is disposed on the metal strip (324) at a position between its starting end and its ending end; the metal strip (324) is configured to bend and extend from its starting end around the first radiating patch aperture (321) to its ending end; Antenna feed point (72), said antenna feed point (72) is configured to be located on the second end face; An absorptive filter is configured to be disposed within the dielectric substrate layer (1); and the absorptive filter has an input terminal and an output terminal; wherein, the input terminal of the absorptive filter corresponds to the antenna feed point (72) in the Z-axis direction perpendicular to the dielectric substrate layer (1), and is configured to be conductive through a third group of metallized blind vias (933); the output terminal of the absorptive filter is configured to correspond to the second radiating patch aperture disk (322) in the Z-axis direction, and is configured to be conductive through a second group of metallized blind vias (932).

2. The encapsulated filter antenna according to claim 1, characterized in that, The absorptive filter includes a first filter coupling structure (52) and a second filter coupling structure (62) arranged sequentially in the Z-axis direction. The first filter coupling structure (52) includes a first filter stripline (523) and a first filter aperture (521) disposed on the first filter stripline (523); it also includes a second filter aperture (522), which is configured to be connected to the first filter stripline (523) through a first filter buried resistor (524); The second filter coupling structure (62) includes a second filter stripline (623) and a third filter aperture (621) disposed on the second filter stripline (623); it also includes a fourth filter aperture (622) configured to be connected to the second filter stripline (623) via a second filter buried resistor (624); The third filter aperture (621) is configured to be the input terminal of the absorptive filter and to be connected to the antenna feed point (72) through a third metallized blind aperture group (933); the first filter aperture (521) is configured to be the output terminal of the filter and to be connected to the second radiating patch aperture (322) through a second metallized blind aperture group (932).

3. The encapsulated filter antenna according to claim 2, characterized in that, The fourth filter aperture (622), the second filter aperture (522), and the first radiation patch aperture (321) are configured to correspond to each other in the Z-axis direction and are sequentially connected through the second metallized via group (931).

4. The encapsulated filter antenna according to claim 3, characterized in that, A first metal layer (3) is provided on the first end face of the dielectric substrate layer (1); a second metal layer (4) is provided in the dielectric substrate layer (1) at the position between the first metal layer (3) and the first filter coupling structure (52). The antenna radiating patch (32) is formed on the first metal layer (3), and a first ground metal surface (31) is located outside the antenna radiating patch (32); a first metal ground plate (41) is provided on the second metal layer (4), and an annular gap (42) is isolated from the first metal ground plate (41). The second group of metallized blind vias (932) connecting the first filter via (521) and the second radiating patch via (322) is configured to pass through the annular gap (42) to be isolated from the first metal floor (41); the second group of metallized vias (931) connecting the fourth filter via (622), the second filter via (522) and the first radiating patch via (321) is configured to be connected to the first metal floor (41).

5. The encapsulated filter antenna according to claim 4, characterized in that, The dielectric substrate layer (1) is provided with a third metal layer (5) and a fourth metal layer (6) in sequence below the second metal layer (4). The first filter coupling structure (52) and the second ground metal surface (51) located outside the first filter coupling structure (52) are formed on the third metal layer (5). The second filter coupling structure (62) and the third ground metal surface (61) located outside the second filter coupling structure (62) are formed on the fourth metal layer (6). The third radiating patch aperture plate (323), the first metal ground plate (41), the second ground metal surface (51), and the third ground metal surface (61) are configured to be connected by a third metallized via group (934).

6. The encapsulated filter antenna according to claim 4, characterized in that, A fifth metal layer (7) is provided on the second end face of the dielectric substrate layer (1), and a second metal ground plane (71) and the antenna feed point (72) isolated from the second metal ground plane (71) are formed on the fifth metal layer (7).

7. The encapsulated filter antenna according to claim 6, characterized in that, The antenna feed point (72) includes a first aperture disk (721) and a second aperture disk (722) connected to each other, wherein the first aperture disk (721) is configured to be connected to the third filter aperture disk (621) through a third metallized blind aperture group (933); and the second aperture disk (722) is configured to be an external feed source.

8. The encapsulated filter antenna according to claim 6, characterized in that, The first ground metal surface (31), the first metal ground plate (41), the second ground metal surface (51), the third ground metal surface (61), and the second metal ground plate (71) are configured to be connected by a first metallized via group (91); The first metallized via group (91) includes multiple first metallized vias distributed on the outside of the antenna radiating patch (32). The multiple first metallized vias are arranged at intervals and are respectively connected to the first ground metal surface (31), the first metal ground plate (41), the second ground metal surface (51), the third ground metal surface (61), and the second metal ground plate (71).

9. The encapsulated filter antenna according to claim 8, characterized in that, A metallized sidewall (8) is provided on the outside of the dielectric substrate layer (1); the metallized sidewall (8) is configured to form a first shielding structure with the first metallized via group (91) surrounding the antenna radiating patch (32) and the absorptive filter.

10. The encapsulated filter antenna according to claim 9, characterized in that, The first metal ground plane (41), the second ground metal surface (51), the third ground metal surface (61), and the second metal ground plane (71) are configured to be connected by a first metallized blind via group (92); the first metallized blind via group (92) includes a plurality of first metallized blind vias distributed on the outside of the absorptive filter, the plurality of first metallized blind vias are arranged at intervals and are respectively connected to the first metal ground plane (41), the second ground metal surface (51), the third ground metal surface (61), and the second metal ground plane (71).

11. The encapsulated filter antenna according to claim 10, characterized in that, The first group of metallized blind holes (92) forms a second shielding structure surrounding the absorptive filter.

12. The encapsulated filter antenna according to claim 11, characterized in that, The first shielding structure is located outside the second shielding structure.

13. The encapsulated filter antenna according to claim 1, characterized in that, The metal strip (324) is configured to extend from its starting end in a counterclockwise or clockwise bend around the first radiating patch aperture (321) to its ending end.

14. The encapsulated filter antenna according to claim 13, characterized in that, The antenna module is configured to include four filtered antenna elements arranged in a matrix; wherein the rotation angle of the metal strip (324) in each filtered antenna element is different.

15. The encapsulated filter antenna according to claim 14, characterized in that, The antenna module is provided in multiple ways, and the multiple antenna modules are configured to be arranged at predetermined intervals.

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