earphone

Abstract

The earphone can solve the problem that the strain sensing module for realizing the function button in the earphone occupies a large space area, realizes the function button of the earphone in a multi-directional pressing mode, and reduces the overall size of the earphone. The earphone comprises a shell and a pressure strain structure arranged in a cavity formed in the shell. Both end portions of the pressure strain structure are in stable contact with the inner wall of the shell. A strain sensor is arranged on the pressure strain structure. In the case of extruding the shell, the pressure strain structure generates strain, and the strain sensor is used for sensing the strain generated by the pressure strain structure.

Description

[0001] This application is a divisional application. The original application has the application number 202110873176.8 and the original application date is July 30, 2021. The entire contents of the original application are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202110379581.4, filed on April 8, 2021, entitled "A Dual-Wing Multidirectional Button, Capacitance and Slide Detection Method for a Tubular Terminal", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic device technology, and more particularly to a pair of headphones. Background Technology

[0004] Typically, for ease of user operation, headphones are equipped with function buttons for triggering actions such as power on, power off, pause, play, and record. Taking wireless headphones as an example, the current industry solution involves placing a strain sensor module within the cavity formed by the headphone stem's shell. This strain sensor module needs to fit snugly against the inner side of the headphone stem's shell. To improve the sensing capability of the strain sensor module, it is usually achieved by adding a planar auxiliary positioning area to the headphone stem's shell or increasing the number of strain detection units in the strain sensor module. This results in a large space occupied by the headphone stem shell, thus limiting the shape and size of the headphone stem. Summary of the Invention

[0005] This application provides an earphone that solves the problem of large space occupied by strain sensing modules that implement function buttons in current earphones, so as to realize the function buttons of the earphone through multi-directional pressing and reduce the overall size of the earphone.

[0006] To achieve the above objectives, this application adopts the following technical solution: This application provides an earphone. The earphone includes a shell. A pressure-strain structure is further disposed within the cavity formed by the shell. Both ends of the pressure-strain structure are in stable contact with the inner wall of the shell. A strain sensor is disposed on the pressure-strain structure. When the shell is compressed, the pressure-strain structure generates strain, and the strain sensor is used to sense the strain generated by the pressure-strain structure.

[0007] It should be understood that both ends of the pressure-strain structure are in stable contact with the inner wall of the outer shell, allowing the pressure-strain structure to generate strain when subjected to the compressive force of the outer shell. Strain refers to the relative deformation of the pressure-strain structure under the compressive force of the outer shell. For example, when a user squeezes the contact points between the outer shell and both ends of the pressure-strain structure, the pressure-strain structure can generate linear strain under the bidirectional compressive force of the outer shell. Specifically, the inner surface of the pressure-strain structure (i.e., the concave surface) undergoes compressive deformation, generating negative strain; the outer surface of the pressure-strain structure (i.e., the convex surface) undergoes tensile deformation, generating positive strain. The headphones can trigger corresponding operations (such as power on, power off, pause, play, etc.) based on the strain generated by the pressure-strain structure.

[0008] In this way, the headphones provided in this application embodiment do not need to be attached to the outer shell, do not need to be set with an auxiliary positioning and pressing area on the outer shell, and do not need to add a strain detection unit. It is only necessary to make stable contact between the two ends of the pressure strain structure and the inner wall of the outer shell, so that the pressure strain structure can adapt to the cavity space formed by the outer shell. This allows the pressure strain structure to make full use of the cavity space formed by the outer shell, thereby reducing the space area occupied by the headphone shell and reducing the overall size of the headphone.

[0009] In one possible implementation, strain sensors are disposed on a first surface (i.e., the outer surface of the pressure-strain structure) and / or a second surface (i.e., the inner surface of the pressure-strain structure). For example, still taking the contact area between the user squeezing the outer shell and both ends of the pressure-strain structure as an example, the strain sensor disposed on the outer surface of the pressure-strain structure is used to sense the positive strain generated on the outer surface of the pressure-strain structure; the strain sensor disposed on the inner surface of the pressure-strain structure is used to sense the negative strain generated on the inner surface of the pressure-strain structure.

[0010] In one possible implementation, the pressure-strain structure includes a base plate and side plates connected to both sides of the base plate. The side plates form an angle with the base plate. The ends of the side plates furthest from the base plate are in stable contact with the inner wall of the outer shell. The side plates and base plate can be integrally formed or connected by welding or other methods. When the outer shell is compressed in the stable contact area with the pressure-strain structure, the pressure-strain structure as a whole is compressed. The side plates on both sides of the pressure-strain structure are brought closer together by the compression from the outer shell, thereby causing compressive deformation and negative strain on the inner surface of the base plate, and tensile deformation and positive strain on the outer surface of the base plate.

[0011] In one possible implementation, the strain sensor is disposed on the first surface (i.e., the outer surface of the base plate) and / or the second surface (i.e., the inner surface of the base plate) of the base plate. It should be understood that the strain generated by the aforementioned pressure-strain structure is mainly reflected on the base plate of the pressure-strain structure; therefore, placing the strain sensor on the base plate can improve the accuracy of strain sensing.

[0012] In one possible implementation, when the contact points between the outer shell and the two ends of the pressure strain structure are squeezed, the strain sensor is used to sense the first strain generated by the pressure strain structure.

[0013] In one possible implementation, a processor is disposed within the cavity formed by the outer shell, and a strain sensor is electrically connected to the processor via a measuring circuit. The measuring circuit outputs a first signal to the processor based on the first strain. The first signal instructs the earphone to perform a first operation. The first operation includes one of powering on, powering off, pausing, playing, or recording. Thus, the user can achieve a function such as powering on, powering off, pausing, playing, or recording by squeezing the contact points at both ends of the outer shell and the pressure strain structure.

[0014] In one possible implementation, when the outer shell is squeezed against the non-contact portion of the pressure strain structure, the strain sensor is used to sense a second strain generated by the pressure strain structure.

[0015] In one possible implementation, a processor is housed within the cavity formed by the outer shell, and a strain sensor is electrically connected to the processor via a measuring circuit. The measuring circuit outputs a second signal to the processor based on the second strain. The second signal instructs the earphone to perform a second operation. This second operation includes one of the following: power on, power off, pause, play, or record. Thus, the user can achieve another function, such as power on, power off, pause, play, or record, by squeezing the non-contact portions at both ends of the outer shell and the pressure strain structure.

[0016] It should be noted that the strain generated by the pressure-strain structure varies depending on the location of the outer shell being squeezed. For example, when the user squeezes the contact points between the outer shell and both ends of the pressure-strain structure, the inner surface of the pressure-strain structure generates negative strain, while the outer surface generates positive strain (i.e., the first strain). However, when the user squeezes the non-contact points between the outer shell and both ends of the pressure-strain structure, the inner surface of the pressure-strain structure generates positive strain, while the outer surface generates negative strain (i.e., the second strain).

[0017] Therefore, squeezing the outer shell causes strain in the pressure strain structure, which does not require aligning the contact area between the outer shell and the pressure strain structure. Squeezing the non-contact area between the outer shell and the pressure strain structure can also cause strain in the pressure strain structure, making the function buttons of the headphones more flexible.

[0018] In one possible implementation, the cavity formed by the housing may also include a printed circuit board. The processor is mounted on the printed circuit board. The strain sensor is electrically connected to the printed circuit board via a flexible circuit board, thereby electrically connecting the strain sensor to the processor.

[0019] In one possible implementation, the outer shell includes an earphone head housing and an earphone stem housing. A pressure-strain structure is disposed within the cavity formed by the earphone stem housing, and both ends of the pressure-strain structure are in stable contact with the inner wall of the earphone stem housing. This facilitates user operation.

[0020] In one possible implementation, a planar positioning area is provided on the outer surface of the earphone stem housing near the contact area between the earphone stem housing and the pressure strain structure. This allows the user to quickly locate the press position of the function buttons.

[0021] In one possible implementation, the outer shell includes an earphone head housing. A pressure-strain structure is disposed within the cavity formed by the earphone head housing, and both ends of the pressure-strain structure are in stable contact with the inner wall of the earphone head housing. This results in a smaller size and easier portability for the user.

[0022] In one possible implementation, a capacitor-assisted detection scheme can be added to the pressure strain structure to help determine the force and direction of the compression by measuring the changes in capacitance at different locations in the pressure strain structure during the compression process.

[0023] Specifically, the first surface of the pressure-strain structure (such as the outer surface of the pressure-strain structure) includes a first region (such as region C) and a second region (such as region D). The first and second regions are located near the contact points between the two ends of the pressure-strain structure and the outer casing. A first capacitance detection contact (such as a copper network) is attached to the first region, and the first capacitance detection contact can be electrically connected to the processor via a flexible circuit board. And / or, a second capacitance detection contact (such as a copper network) is attached to the second region, and the second capacitance detection contact can be electrically connected to the processor via a flexible circuit board.

[0024] When the outer casing is squeezed, the first capacitance detection contact detects the capacitance generated in the first region, and the second capacitance detection contact detects the capacitance generated in the second region. For example, when a user squeezes the contact area between the outer casing and the pressure strain structure, the capacitance in regions C and D of the pressure strain structure changes significantly because the finger approaches and touches the casing. When the user squeezes the non-contact area between the outer casing and the pressure strain structure, the capacitance change in regions C and D is not significant because the finger may be farther away. Thus, the change in capacitance in regions C and D of the pressure strain structure can help determine the force and direction of the squeeze.

[0025] In one possible implementation, the first surface (e.g., the outer surface) of the pressure strain structure further includes a third region. This third region (e.g., region B) is located between the first and second regions. A third capacitance detection contact (e.g., a copper network) is attached to the third region. This third capacitance detection contact can be electrically connected to the processor via a flexible circuit board. When the housing is squeezed, the third capacitance detection contact is used to detect the capacitance generated in the third region. For example, when a user squeezes the contact area between the housing and the pressure strain structure, the capacitance in regions C and D of the pressure strain structure changes significantly due to the finger approaching and touching the housing, while the capacitance in region B changes less. When the user squeezes the non-contact area between the housing and the pressure strain structure, the capacitance in regions C and D changes less because the finger may be farther from regions C and D, while the capacitance in region B changes more significantly. This allows for further analysis of the capacitance changes in regions C and D of the pressure strain structure, aiding in the determination of the squeezing force and direction, and improving the accuracy of the assessment.

[0026] In one possible implementation, a fourth region (e.g., region A) is located on the second surface (e.g., the inner surface) of the pressure-strain structure, opposite to the third region. A fourth capacitance detection contact (e.g., a copper network) is attached to this fourth region. This fourth capacitance detection contact can be electrically connected to the processor via a flexible circuit board. When the housing is squeezed, the fourth capacitance detection contact detects the capacitance generated in the fourth region. For example, when a user squeezes the contact area between the housing and the pressure-strain structure, the change in region A is relatively small because the finger approaches and touches the housing; conversely, when the user squeezes the non-contact area between the housing and the pressure-strain structure, the change in region A may be larger. In this case, regions C and D can also be combined to assist in determining the force and direction of the squeeze, improving the accuracy of the auxiliary judgment.

[0027] In this way, capacitance detection can help determine the direction of compression (i.e., the direction of stress generation). Based on the differences in stress direction and capacitance change caused by different compression directions, the compression of the earphone shell in different directions can be configured as different button functions, thereby expanding the button functions and improving the user experience.

[0028] In one possible implementation, the aforementioned pressure-strain structure can also be used for sliding detection. Specifically, when sliding along the outer wall of the housing, the first capacitance detection contact is also used to detect the capacitance generated in the first region (e.g., region C). The second capacitance detection contact is also used to detect the capacitance generated in the second region (e.g., region D). The third capacitance detection contact is also used to detect the capacitance generated in the third region (e.g., region B). For example, when a user's finger slides along the direction sequentially passing through regions C, B, and D, the finger first approaches region C, then region B, and finally region D. Therefore, the capacitance change times in regions C, B, and D are different. In this way, based on the capacitance change characteristics of regions B, C, and D, and combined with the strain sensor's sensing of strain magnitude in the pressure-strain structure, a certain function of the headphones (such as volume adjustment) can be implemented when sliding on the surface of the headphone housing. Attached Figure Description

[0029] Figure 1A This is a schematic diagram of the structure of a wireless earphone in the prior art; Figure 1B This is a schematic diagram of the structure of a strain sensing module in an earphone in the prior art; Figure 2 A schematic diagram of the architecture of a wireless earphone provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of an earphone body provided in an embodiment of this application; Figure 4 A schematic diagram of the structure for setting the strain sensor according to an embodiment of this application; Figure 5 A schematic diagram of the structure for the location of the strain sensor provided in the embodiments of this application. Figure 2 ; Figure 6 This is a structural schematic diagram of a compression scenario provided in an embodiment of this application; Figure 7 This is a schematic diagram of a pressure-strain structure provided in an embodiment of this application; Figure 8A This is a schematic diagram of another headphone body provided in an embodiment of this application; Figure 8B This is a schematic diagram of the structure of another earphone body provided in an embodiment of this application; Figure 9 A schematic diagram of a pressure strain structure disposed inside an earphone stem, as provided in an embodiment of this application; Figure 10 A schematic diagram of a structure with a capacitive sensing region on a pressure strain structure provided in this application embodiment; Figure 11This is a structural schematic diagram of a compression scenario provided in an embodiment of this application; Figure 12 This is a structural schematic diagram of another extrusion scenario provided in an embodiment of this application; Figure 13 This is a structural schematic diagram of a sliding scenario provided in an embodiment of this application. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0031] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0032] In the description of this application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "vertical", "lateral", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the terms "coupled" or "coupled" can refer to a method of electrical connection for signal transmission. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] Headphones can be used with electronic devices such as mobile phones, laptops, and watches to handle audio services such as media and calls, as well as other data services. For example, the audio services can include playing music, recordings, audio from video files, background music in games, and call notification sounds for the user; it can also include playing the other party's voice data or collecting the user's voice data and sending it to the other party in call scenarios such as telephone calls, WeChat voice messages, audio calls, video calls, games, and voice assistants.

[0035] Typically, headphones have function buttons for user convenience. For example, in wired headphones, the function buttons on the headphone cable can be used to pause or resume music playback, as well as answer and hang up phone calls. In wireless headphones (such as Bluetooth headphones), the function buttons on the wireless headphones can be used to pause or resume music playback, answer and hang up phone calls, and also to control the wireless headphones to turn on or off.

[0036] The aforementioned wireless earbuds can be true wireless stereo (TWS) earbuds. TWS earbuds are typically based on Bluetooth chips. When using TWS earbuds, the electronic device connects to the main earbud, which then wirelessly connects to the secondary earbud, thus achieving true wireless separation of the left and right Bluetooth channels.

[0037] Figure 1 shows a schematic diagram of the structure of a TWS earphone 100 in the prior art. Please refer to it. Figure 1A (a) and Figure 1A In (b), the TWS earphone 100 includes an earphone head 101 (also called an earbud) and an earphone stem 102 connected to the earphone head 101. An audio module is housed within the cavity formed by the earphone head 101's housing, which manages audio data and enables the earphone to input and output audio signals, allowing users to make calls, play music, etc., using the wireless earphone. A strain sensing module 104 is housed within the cavity formed by the earphone stem 102's housing. This strain sensing module 104 typically employs a resistance bridge pressure detection method to achieve strain sensing through direct contact and pinching; therefore, the strain sensing module 104 needs to be fitted to the housing of the earphone stem 102. To ensure the strain sensing module 104 fits snugly against the housing and accurately senses pressure when the user presses the housing of the earphone stem 102, the following two processing methods are commonly used: The first type, such as Figure 1A (a) and Figure 1A As shown in (b), a planar pressing area 103 is provided on the outside of the housing of the earphone stem 102 for auxiliary positioning when the user presses the strain sensing module 104. In this case, the housing of the earphone stem 102 needs to be designed with a planar area, which restricts the shape of the earphone stem 102.

[0038] The second approach is to add a flat pressing area to the outside of the earphone stem 102 housing for auxiliary positioning, then a strain sensing area needs to be added to the strain sensing module 103. For example... Figure 1BAs shown, the strain sensing module 104 includes a connector 1041 coupled to the processor, and at least two sets of strain detection units 1042 (two sets are shown in the illustration, but three or more sets can also be provided) to increase the strain sensing area. In this case, if the number of strain detection units in the strain sensing module 104 increases, the length of the strain sensing module 104 will increase. This will not only increase the manufacturing cost of the strain sensing module 104, but also increase the internal space of the strain sensing module 104 within the cavity formed by the earphone stem 102 housing, resulting in a longer earphone stem housing and a larger space occupied by the earphone housing.

[0039] Therefore, the existing implementation of headphone function buttons may result in the headphone shell having a planar auxiliary positioning area or occupying a large space, thus limiting the shape and size of the headphone shell. Furthermore, the existing headphone function buttons use a resistance bridge pressure detection method that generates strain through direct contact pinching, allowing the strain sensing module 104 to sense the pressing action. The pressing force is mainly transmitted through the contact area between the headphone stem 102 shell and the strain sensing module 104. Therefore, the strain sensing module 104 can only sense a single pressing action, resulting in a limited range of button functions.

[0040] Furthermore, the large space occupied by the shell of existing headphones may make them inconvenient for users to carry or wear. Also, the function buttons on existing headphones rely on a single, sensor-activated press, requiring users to press specific locations on the headphones for them to respond, resulting in inconvenient operation and a poor user experience.

[0041] To address the aforementioned problems, this application provides an earphone. This earphone can utilize a multi-directional pressing method to achieve the corresponding functions of the function buttons, reducing the space occupied by the earphone stem shell and thus lowering the overall size of the earphone. The earphone provided in this application embodiment is described in detail below using a wireless earphone as an example. Multi-directional pressing refers to the user squeezing the earphone shell in two opposite directions, for example, the user pinching the earphone shell with two fingers. Multi-directional pressing can also refer to the user pinching different positions on the earphone shell in different directions, for example, the user pinching any position on the earphone with two fingers.

[0042] For example, Figure 2 This illustration shows a schematic diagram of the architecture of a wireless headset 200 according to an embodiment of this application. The wireless headset 200 may include at least one processor 201, at least one memory 202, a wireless communication module 203, an audio module 204, a power module 205, and an input / output interface 206, etc. The processor 201 may include one or more interfaces for connecting to other components of the wireless headset 200.

[0043] The memory 202 can be used to store program code, such as program code for charging the wireless earphone 200, wireless pairing and connecting the wireless earphone 200 with other electronic devices, or wireless communication between the wireless earphone 200 and electronic devices; or, it can be used to record the user's posture and user habits (such as the pressure applied to the earphone function buttons) to enable button-triggered operations such as power on, power off, pause, play, record, start charging, and stop charging.

[0044] The processor 201 can be used to execute the aforementioned application code and call relevant modules to implement the functions of the wireless headset 200 in this embodiment. For example, it can implement the charging function, wireless communication function, and audio data playback function of the wireless headset 200. The processor 201 may include one or more processing units, which may be independent devices or integrated into one or more processors 201. Specifically, the processor 201 may be an integrated control chip or a circuit comprising various active and / or passive components, and this circuit is configured to perform the functions belonging to the processor 201 described in this embodiment.

[0045] The wireless communication module 203 can be used to support data exchange between the wireless headset 200 and other electronic devices or headphone cases, including Bluetooth (BT), Global Navigation Satellite System (GNSS), Wireless Local Area Networks (WLAN) (such as Wireless Fidelity (Wi-Fi) networks), Frequency Modulation (FM), Near Field Communication (NFC), and Infrared (IR) technologies. In some embodiments, the wireless communication module 203 can be a Bluetooth chip. The wireless headset 200 can pair with and establish a wireless connection with the Bluetooth chips of other electronic devices through this Bluetooth chip to achieve wireless communication between the wireless headset 200 and other electronic devices.

[0046] In addition, the wireless communication module 203 may also include an antenna. The wireless communication module 203 receives electromagnetic waves through the antenna, modulates and filters the electromagnetic wave signal, and sends the processed signal to the processor 201. The wireless communication module 203 may also receive signals to be transmitted from the processor 201, modulate and amplify them, and then convert them into electromagnetic waves for radiation through the antenna.

[0047] The audio module 204 can be used to process audio data, enabling the wireless headset 200 to input and output audio signals. For example, the audio module 204 can acquire audio signals from or transmit audio signals to the wireless communication module 203, enabling functions such as making and receiving calls, playing music, activating / deactivating the voice assistant of an electronic device connected to the headset, and receiving / sending user voice data through the wireless headset. The audio module 204 may include a speaker (or earpiece, receiver) assembly for outputting audio signals, a microphone (or microphone), and a microphone pickup circuit that works with the microphone. The speaker can be used to convert audio electrical signals into sound signals and play them. The microphone can be used to convert sound signals into audio electrical signals. It should be understood that the audio module 204 can be separately located outside the processor 201 or integrated inside the processor 201.

[0048] The power module 205 supplies power to all modules of the wireless headset 200 and supports the wireless headset 200 receiving charging input. The power module 205 may include a power management unit (PMU) and a battery. The PMU may include a charging circuit, a voltage drop regulation circuit, a protection circuit, and a power measurement circuit. The charging circuit can receive external charging input. The voltage drop regulation circuit can transform the electrical signal input to the charging circuit and output it to the battery to complete the charging process. It can also transform the electrical signal input from the battery and output it to other modules such as the audio module 204 and the wireless communication module 203. The protection circuit can prevent overcharging, over-discharging, short circuits, or overcurrent of the battery. In some embodiments, the power module 205 may also include a wireless charging coil for wirelessly charging the wireless headset 200. Additionally, the power management unit can monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance).

[0049] Multiple input / output interfaces 206 can be used to provide a wired connection for charging or communication between the wireless earphone 200 and the earphone case. In some embodiments, the input / output interface 206 may include an earphone electrical connector for conducting and transmitting current. When the wireless earphone 200 is placed in the earphone case, the wireless earphone 200 can establish an electrical connection with an electrical connector in the earphone case through the earphone electrical connector (e.g., the earphone electrical connector makes direct contact with an electrical connector in the earphone case). After this electrical connection is established, the earphone case can charge the battery in the wireless earphone 200 through the current transmission function of the earphone electrical connector and the electrical connector in the earphone case. For example, the earphone electrical connector can be a pogo pin, spring pin, spring, conductive block, conductive patch, conductive sheet, pin, plug, contact pad, jack, or socket, etc. The specific type of electrical connector is not limited in the embodiments of this application.

[0050] Specifically, the wireless earphones 200 may include a pair of earphone bodies for use with the user's left and right ears, and each earphone body may include two earphone electrical connectors. When the earphone bodies are placed in the earphone case, the earphone bodies can establish an electrical connection with the corresponding two electrical connectors in the earphone case through the two earphone electrical connectors. After establishing this electrical connection, the earphone case can charge the battery in the earphone bodies.

[0051] In other embodiments, after the electrical connection is established, the wireless earphone 200 can also communicate data with the earphone case, for example, it can receive pairing instructions from the earphone case.

[0052] Additionally, the wireless earphone 200 may also include a sensor 207. For example, the sensor 207 may be a distance sensor or a proximity light sensor, which can be used to determine whether the wireless earphone 200 is being worn by a user. Exemplarily, the wireless earphone 200 may use the distance sensor to detect whether there is an object nearby, thereby determining whether the wireless earphone 200 is being worn by a user. When it is determined that the wireless earphone 200 is being worn, the wireless earphone 200 may turn on its speaker. In some embodiments, the wireless earphone 200 may also include a bone conduction sensor, forming a bone conduction earphone. Using this bone conduction sensor, the wireless earphone 200 can acquire vibration signals from the vibrating bone segments of the acoustic chamber, decode the speech signals, and realize voice functionality.

[0053] For example, the outer surface of the wireless earphone 200 may also include: a touch sensor for detecting the user's touch operation; a fingerprint sensor for detecting the user's fingerprint and identifying the user's identity; and other sensors, such as a capacitance sensor, for detecting changes in capacitance and adaptively adjusting some parameters (such as volume).

[0054] It is understood that the structure illustrated in the embodiments of this application does not constitute a specific limitation on the wireless earphone 200. It may have more than Figure 2 The wireless headset 200 may include more or fewer components, combinations of two or more components, or different component configurations. For example, the outer surface of the headset 200 may also include a button 208, indicator lights (indicating battery level, incoming / outgoing calls, pairing mode, etc.), a display screen (displaying relevant user information), and a dust filter (for use with the earpiece). The button 208 may be a physical button or a touch button (used in conjunction with a touch sensor), used to trigger operations such as power on / off, pause, play, record, start charging, and stop charging.

[0055] Figure 2 The various components shown can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing or application-specific integrated circuits.

[0056] To enable multi-directional pressing of the headphone's function buttons, the headphone provided in this application embodiment includes a headphone body. For example, as shown... Figure 3 The diagram shown is a structural schematic of an earphone body 300 provided in an embodiment of this application. The earphone body 300 includes a housing 301 and internal components. The internal components are disposed within the cavity formed by the housing 301. The internal components may include the aforementioned... Figure 2 The components in the wireless earphone shown include the processor 201, wireless communication module 203, audio module 204, and power supply module 205.

[0057] A pressure strain structure 302 is also provided inside the cavity formed by the outer shell 301, and the two ends of the pressure strain structure 302 (such as...) Figure 3 The first end 3021 and the second end 3022 shown in (a) are in stable contact with the inner wall of the outer shell 301. For example, this contact can be a spring-loaded contact or a welded contact; this embodiment does not impose any special limitations. When the user bidirectionally squeezes the outer shell (i.e., the user pinches the outer shell with two fingers), the pressure-strain structure 302 will generate strain under the pressure of the outer shell 301. Here, strain refers to the relative deformation of the pressure-strain structure 302 under the pressure of the outer shell 301. Figure 3 Taking the earphone body 300 as an example, when the user squeezes the contact points between the outer shell 301 and the two ends of the pressure strain structure 302 (i.e., according to...) Figure 3 When bidirectional extrusion occurs in the direction of the arrow in (b) shown, the pressure strain structure 302 is subjected to bidirectional extrusion force from the outer shell 301, which can generate linear strain. The inner surface 3023 of the pressure strain structure 302 forms compressive deformation and generates negative strain; the outer surface 3024 of the pressure strain structure 302 forms tensile deformation and generates positive strain.

[0058] For the strain generated by the pressure-sensitive strain structure 302, such as Figure 4 As shown, a strain sensor 303 is provided on the aforementioned pressure strain structure 302. This strain sensor 303 can be electrically connected to the headphone's processor to send the magnitude of the strain generated by the pressure strain structure 302 to the processor, so that the processor can trigger the headphone to perform operations such as power on / off, pause, play, and record based on the magnitude of the strain generated by the pressure strain structure 302. When the user squeezes the outer shell 301, the strain sensor 303 senses the strain generated by the pressure strain structure 302, thereby causing the processor to perform corresponding functional operations (such as pause or play) based on the strain sensed by the strain sensor 303.

[0059] The strain sensor 303 described above can be a resistance strain gauge, which converts changes in strain on a mechanical component into changes in resistance. The resistance strain gauge includes a sensitive grid resistor element and leads. The sensitive grid resistor element can be made by bending a high-resistivity filament with a diameter of 0.01 mm to 0.05 mm into a grid shape, serving as the sensitive part of the resistance strain gauge that senses the mechanical component. The leads can be made of metal wire such as copper wire and are electrically connected to the sensitive grid resistor element, used to connect the sensitive grid resistor element to the measuring circuit.

[0060] During installation, the resistance strain gauge is adhered to the surface of the pressure strain structure 302 using adhesive. When the pressure strain structure 302 is subjected to the compressive force of the outer casing 301, it generates strain. This strain causes strain in the sensitive grid resistor element of the resistance strain gauge, resulting in a change in its resistance value. By measuring the change in resistance of the resistance strain gauge using a measuring circuit, it can be determined whether the pressure strain structure 302 has been subjected to compression.

[0061] It should be understood that the strain sensor 303 is attached to the surface of the pressure strain structure 302, and the strain sensor 303 can be coupled to the processor via a flexible printed circuit (FPC). A measurement circuit for measuring the change in resistance of the strain sensor 303 can be configured on the FPC.

[0062] Therefore, in the earphones of this embodiment, there is no need to include a strain sensing module (i.e., such as...). Figure 3 The pressure strain structure 302 and strain sensor 303 shown are fitted to the outer shell, eliminating the need for auxiliary positioning and pressing areas on the outer shell 301 of the earphone body 300, and eliminating the need for multiple strain detection units. Only the two ends of the pressure strain structure 302 need to be stably in contact with the inner wall of the outer shell 301. Thus, when the outer shell is bidirectionally compressed, the pressure strain structure 302 can generate strain, and the strain sensor 303 can sense the strain generated by the pressure strain structure 302, thereby realizing the corresponding functions of the earphone's function buttons (such as pause or play). In this embodiment, the pressure strain structure 302 is set within the cavity formed by the outer shell 301 of the earphone body 300. This allows the pressure strain structure 302 to be adapted to the cavity space formed by the outer shell 301, thereby fully utilizing the cavity space formed by the outer shell 301, reducing the space occupied by the earphone shell, and thus reducing the overall size of the earphone.

[0063] It should be understood that the strain sensor 303 described above can be disposed on the inner surface 3023 of the pressure strain structure 302, such as... Figure 4As shown. The strain sensor 303 described above can also be disposed on the outer surface 3024 of the pressure strain structure 302, such as... Figure 5 As shown in (a) above. The strain sensor 303 can also be provided on both the inner surface 3023 and the outer surface 3024 of the pressure strain structure 302, as shown in [example missing]. Figure 5 As shown in (b) (where the three circles in the figure represent strain sensors 303 disposed on the inner surface 3023).

[0064] When strain sensors 303 are installed on both the inner surface 3023 and the outer surface 3024 of the pressure strain structure 302, the strain sensors 303 detect the strain generated by the pressure strain structure 302 using a differential detection method. That is, the processor receives the strain generated by the pressure strain structure 302 as the difference between the strain value sensed by the strain sensor 303 on the inner surface 3023 and the strain value sensed by the strain sensor 303 on the outer surface 3024. This improves the accuracy of the detection.

[0065] For example, when using Figure 3 When the contact area between the outer shell 301 and the pressure strain structure 302 is compressed in the direction shown in (b), the pressure strain structure 302 experiences strain due to the compressive force from the outer shell 301. At this time, the strain sensor 303, attached to the inner surface 3023 of the pressure strain structure 302, can sense the negative strain generated on the inner surface 3024 of the pressure strain structure 302. The strain sensor 303, attached to the outer surface 3024 of the pressure strain structure 302, can sense the positive strain generated on the outer surface 3024 of the pressure strain structure 302. In this case, the aforementioned measurement circuit can output an indication signal (i.e., a first signal) to the processor based on the negative strain sensed by the strain sensor 303 on the inner surface 3023 or the positive strain sensed by the strain sensor 303 on the outer surface 3024 of the pressure strain structure 302, to instruct the headphones to perform operations such as power on, power off, pause, play, and record. It should be understood that the indication signal is generally a voltage signal.

[0066] It should also be noted that, in the above Figure 3 In the earphone body 300 shown, when the user squeezes the non-contact portion of the outer shell 301 and the pressure strain structure 302 (for example, according to...), Figure 6 When subjected to bidirectional compression (as indicated by the arrow), the pressure-strain structure 302 can also generate linear strain under the compressive force of the outer shell 301. At this time, the inner surface 3023 of the pressure-strain structure 302 undergoes tensile deformation, resulting in positive strain; the outer surface 3024 of the pressure-strain structure 302 undergoes compressive deformation, resulting in negative strain.

[0067] At this time, the strain sensor 303, mounted on the inner surface 3023 of the pressure strain structure 302, can be used to sense the positive strain generated on the inner surface 3024 of the pressure strain structure 302. The strain sensor 303, mounted on the outer surface 3024 of the pressure strain structure 302, can be used to sense the negative strain generated on the outer surface 3024 of the pressure strain structure 302. In this case, the above-mentioned measurement circuit can output an indication signal (i.e., a second signal) to the processor based on the positive strain sensed by the strain sensor 303 on the inner surface 3023 of the pressure strain structure 302, or the negative strain sensed by the strain sensor 303 on the outer surface 3024 of the pressure strain structure 302, to instruct the headphones to perform operations such as power on, power off, pause, play, and record. It should be understood that the indication signal is generally a voltage signal.

[0068] Therefore, squeezing the outer shell 301 causes strain in the pressure strain structure 302. This can be achieved without aligning the contact area between the outer shell 301 and the pressure strain structure 302. Squeezing the non-contact area between the outer shell 301 and the pressure strain structure 302 can also cause strain in the pressure strain structure 302. In other words, the user can use two fingers to squeeze any part of the earphone (i.e., multi-directional pressing), making the function buttons of the earphone more flexible. For example, squeezing the contact area between the outer shell 301 and the pressure strain structure 302 can realize one function button of the earphone, such as pausing or playing music, while squeezing the non-contact area between the outer shell 301 and the pressure strain structure 302 can realize another function button of the earphone, such as turning the earphone on or off.

[0069] It should be understood that the indication signal (such as a first signal or a second signal) output by the strain sensor 303 to the processor through the measurement circuit is related to the force with which the user squeezes the outer shell, and the first signal or the second signal may indicate different operations to be performed by the headphones, which can be set according to the user's usage habits. Therefore, this application embodiment does not specifically limit the function corresponding to the position of the user's squeezing of the outer shell.

[0070] like Figure 7 The diagram shown is a structural schematic of a pressure strain structure 302 in an earphone according to an embodiment of this application. Please refer to... Figure 7 The pressure-strain structure 302 includes a base plate 701 and side plates 702 connected to both sides of the base plate 701. The side plates 702 and the base plate 701 form an angle and a groove structure. The side plates 702 and the base plate 701 can be integrally formed or connected by welding or other methods. When the pressure-strain structure 302 is installed in... Figure 3 When the earphone shell 301 is inside the cavity formed by the earphone shell, the end 7021 of the side plate 702 away from the bottom plate 701 is in stable contact with the inner wall of the cavity formed by the earphone shell 301.

[0071] In this way, when the contact area between the compressed outer shell 301 and the pressure strain structure 302 (i.e., Figure 3 When the arrow direction is shown in (b) in the figure, the pressure strain structure 302 is compressed as a whole. The side plates 702 on both sides of the pressure strain structure 302 are squeezed and brought closer to each other by the outer shell 301, thereby causing the inner side 7011 of the bottom plate 701 to produce compressive deformation and generate negative strain, and causing the outer side 7012 of the bottom plate 701 to produce tensile deformation and generate positive strain.

[0072] When the non-contact area between the extruded housing 301 and the pressure strain structure 302 (i.e. Figure 6 (As shown by the arrow direction), the pressure strain structure 302 is also stretched as a whole. The side plates 702 on both sides of the pressure strain structure 302 are squeezed away from each other by the outer shell 301, thereby causing the inner side 7011 of the bottom plate 701 to undergo tensile deformation and generate positive strain, and causing the outer side 7012 of the bottom plate 701 to undergo compressive deformation and generate negative strain.

[0073] Therefore, it can be seen that the strain direction generated by the pressure strain structure 302 is related to the part of the shell 301 that is squeezed by the user. Different strain directions can be generated when the user squeezes the shell 301 of the earphone body and the contact part or the non-contact part of the pressure strain structure 302, so that the earphone body 300 can be set with different functions of the function buttons according to different squeezing directions.

[0074] It should be noted that the aforementioned pressure strain structure 302 is not limited to... Figure 7 The groove-shaped structure shown can also be any other shape with two ends, such as an irregular groove structure, an arc-shaped groove structure, etc. The material of the pressure strain structure 302 can be SUS301 stainless steel, or other high-strength elastic materials; this application embodiment does not impose any special limitations.

[0075] It should also be understood that, Figure 7 In the pressure-strain structure 302 shown, since the strain generated by the pressure-strain structure 302 is mainly manifested on the base plate 701, the strain sensor 303 is disposed on the base plate 701 to improve the accuracy of strain sensing. For example, the strain sensor 303 can be disposed on the inner side 7011 of the base plate 701, or on the outer side 7012 of the base plate 701, or on both the inner side 7011 and the outer side 7012 of the base plate 701. This application embodiment does not make any special limitation.

[0076] Figure 8AA schematic diagram of a headphone body 800 is shown. The headphone body 800 may include a headphone stem 801 and a headphone head 802 connected to the top of the headphone stem 801. The cavity formed by the headphone stem 801 and the headphone head 802 may include internal components such as a circuit board 804. The circuit board 804 may be a printed circuit board (PCB). The circuit board 804 may include various components such as a processor, memory, and charging circuit to achieve the above-mentioned functions. Figure 2 The wireless communication module 203, audio module 204, and power module 205 are shown, each with its own functions. For example, the power module 205 can be located inside the cavity formed by the earphone stem 801. The speaker assembly in the audio module 204 can be located inside the cavity formed by the earphone head 802. When a user wears the earphone, they can hear sound signals emitted from the speaker assembly inside the cavity formed by the earphone head 802, thus enabling the user to play music, make / make phone calls, and perform other functions.

[0077] exist Figure 8A In the earphone body 800 shown, the pressure strain structure 803 is disposed inside the cavity formed by the earphone stem 801, which is generally used by the user to hold the earphone body 800 into the user's ear canal. To make the earphone more comfortable and provide a better user experience, the earphone stem 801 is generally designed as a smooth cylindrical rod structure. Considering the convenience of the user squeezing the earphone stem 801 to operate the earphone's function buttons, the pressure strain structure 803 (i.e., as shown in the image) can be disposed within the cavity formed by the earphone stem 801. Figure 7 The pressure strain structure 302 shown is disposed at the tail end of the cavity formed by the earphone stem 801. Normally, as... Figure 2 The power module 205 of the earphone shown is disposed within the cavity formed by the earphone stem 801, near the tail of the earphone stem 801. This allows the power module 205 to be coupled to the earphone electrical connector for charging the earphones, located at the tail of the earphone stem 205. When the wireless earphones are placed in the earphone case, the wireless earphones can establish an electrical connection with the electrical connector in the earphone case via the earphone electrical connector to charge the wireless earphones. Therefore, the pressure strain structure 803 can be disposed within the cavity formed by the earphone stem 801, and disposed close to the power module 205.

[0078] It should be understood that the shape of the earphone stem 801 is not limited to a cylindrical shape, but can also be other shapes, such as a strip shape, a hexagonal prism shape, etc. The embodiments of this application do not impose special limitations on the shape of the earphone stem 801.

[0079] When the pressure strain structure 803 is disposed in the cavity formed by the earphone stem 801, the strain sensor disposed on the pressure strain structure 803 can be coupled to the circuit board 804 through a flexible printed circuit board (FPC) so that the strain sensor can be coupled to the processor.

[0080] It should also be understood that the earphone 800 provided in the embodiments of this application may not have an earphone stem 801, for example, as Figure 8B The earphone shown (processor and other components are not shown in the figure). That is to say, the pressure strain structure 803 and the earphone's processor and other modules are all located inside the earphone head 802. The earphone's function buttons can also be implemented by multi-directional pressing of the pressure strain structure in the earphone. For details, please refer to the description of the above embodiment, which will not be repeated here.

[0081] To reduce structural displacement during long-term use, the pressure strain gauge structure 803 is provided with positioning holes 8031, through which the pressure strain gauge structure 803 can be fixed to the circuit board 804. For example, the pressure strain gauge structure 803 can be fixed to the circuit board 804 by welding, hot melting, or screws.

[0082] To facilitate users squeezing the earphone shell, such as Figure 9 As shown in (a), the housing of the earphone stem 801 is a smooth cylindrical rod structure, and the interior of the earphone stem 801 housing is also a circular arc surface. In this case, the two side plates 8031 ​​in the pressure strain structure 803 can be arranged toward the two sides of the earphone stem 801 housing, and the ends 8032 of the side plates 8031 ​​are in stable contact with the inner wall of the earphone stem 801 housing.

[0083] To facilitate users' quick location of the function button press positions on the earphone body 900, the outer diameter of the earphone stem 801 is partially planarized at the contact area between the earphone stem 801 housing and the end 8032 of the side plate 8031 ​​of the pressure strain structure 803, forming a planar positioning area 8011. Figure 9 As shown in (b) above, when a user squeezes the shell of the earphone stem 801 to use the function buttons, they only need to find and squeeze the planar positioning area 8011, thereby increasing the sense of positioning and improving the user experience. Furthermore, the addition of the planar positioning area 8011 allows the user to accurately locate the position for squeezing the function buttons, improving the detection accuracy and stability of the strain sensor in the pressure strain structure 803 when the user applies bidirectional pressure to it, thus enhancing the overall performance of the earphone.

[0084] It should be noted that, under normal circumstances, for ease of user operation, the contact area between the pressure strain structure 803 in the headphone body 800 and the housing of the headphone stem 801 is located on both sides of the headphone body 800 (within the range of...). Figure 8A For example, the two sides of the 800 on the headphone body refer to Figure 8A The front and rear sides of the earphone stem 801 housing shown.

[0085] Furthermore, the headphone body provided in this application embodiment uses a squeezing method to access the headphone's function buttons, which may lead to accidental touches during user use.

[0086] To reduce accidental touches, exemplarily, in some embodiments, the above... Figure 8A A capacitor-assisted detection scheme can be added to the pressure strain structure 803 shown. The force and direction of the extrusion can be determined by the change in capacitance at different locations in the pressure strain structure 803 during the extrusion process.

[0087] Based on the above Figure 7 Taking the pressure strain structure 302 shown as an example, the pressure strain structure 803 can be divided into four regions: region A 1001, region B 1002, region C 1003, and region D 1004. Region A 1001 is the inner side 7011 of the base plate 701, region B 1002 is the outer side 7012 of the base plate 701, and regions C 1003 and D 1004 are the back sides of the two side plates 702, respectively. Copper meshes are respectively provided on regions A 1001, B 1002, C 1003, and D 1004 of the pressure strain structure 302. These copper meshes are coupled to the capacitive sensing channel via a flexible printed circuit board (FPC). Furthermore, the pressure strain structure 302 is also coupled to the capacitive sensing channel via a flexible printed circuit board (FPC) as a reference terminal for capacitance detection. The aforementioned capacitive sensing channel can be set as follows: Figure 8A It is shown on circuit board 804 and coupled to the processor on circuit board 804.

[0088] Taking the pressure strain structure 302 disposed inside the cavity formed by the earphone stem 801 as an example, the user can use Figure 11 The arrow in (a) indicates that the earphone shell is being squeezed in the direction of the arrow, that is, with... Figure 11 As shown by the arrow in (b), the contact area between the earphone stem 801 housing and the pressure strain structure 302 is compressed. Because the finger approaches and touches the earphone stem 801 housing, the area on the side plate 702 of the pressure strain structure 203 (i.e., as shown by the arrow) is compressed. Figure 10 The capacitance of regions C (1003) and D (1004) shown in the figure undergoes a significant change, and the region on the base plate 701 of the pressure strain structure 203 (i.e., as shown in the figure) also exhibits a significant change. Figure 10The capacitance change in regions A (1001) and B (1002) shown is relative to the region on side plate 702 (i.e., as shown in the figure). Figure 10 The C region (1003) and D region (1004) shown are less numerous.

[0089] It should be understood that when a user accidentally squeezes the outer casing, the above-mentioned... Figure 10 The capacitance changes of the four capacitance regions shown (A region 1001, B region 1002, C region 1003, and D region 1004) are significantly different from those of the same four regions (A region 1001, B region 1002, C region 1003, and D region 1004) when the user actively squeezes the housing of the earphone stem 801. For example, the contact area between the user accidentally squeezes the housing of the earphone stem 801 and one side of the pressure strain structure 302 (e.g., Figure 10 When the capacitance of region C 1003 (as shown on one side) changes significantly, the capacitance change in region C 1003 is substantial; the capacitance change in region D 1014 is smaller, as are the capacitance changes in regions A and B. When the user accidentally touches the non-contact area between the earphone stem 801 housing and the pressure strain structure 302, the following may occur: Figure 10 The capacitance changes in regions A (1001), B (1002), C (1003), and D (1004) shown are all relatively small.

[0090] Therefore, it can be seen that the processor in the headphones analyzes, for example... Figure 10 The magnitude of the capacitance changes in regions A 1001, B 1002, C 1003, and D 1004 shown can help determine the force and direction of the compression. Combined with the strain sensor 303 in the pressure strain structure 302 sensing the strain magnitude, it can be determined whether the user actively squeezes the earphone shell (such as the shell of the earphone stem 801) in order to achieve the purpose of pausing or playing, thereby improving the accuracy of stress detection.

[0091] It should be noted that the four capacitance detection areas mentioned above can be flexibly configured according to the actual situation. For example, only area B 1002, area C 1003, and area D 1004 can be set, or only area B 1002, area C 1003 or area B 1002 and area D 1004 can be set.

[0092] In addition, users can also Figure 12 The arrow in (a) indicates that the earphone shell is being squeezed in the direction of the arrow, that is, with... Figure 12As shown by arrow (b) in the diagram, the non-contact area between the outer shell and the pressure strain structure is compressed. In this case, when the user compresses the outer shell of the earphone (i.e., the shell of the earphone stem 801) from the outside towards the auricle, the inner area of ​​the shell of the earphone stem 801 contacts the human skin (such as the skin of the auricle or cheek), and the outer area of ​​the shell of the earphone stem 801 contacts the user's fingers. At this time, the pressure strain structure 302, as shown by arrow (b), compresses the non-contact area between the outer shell and the pressure strain structure. Figure 10 As shown, regions A (1001) and B (1002) are closer to the human body contact area, resulting in more pronounced and larger capacitance changes. Regions C (1003) and D (1004) are farther from the human body contact area, thus exhibiting smaller capacitance changes. In other words, there are significant differences in capacitance changes between the non-contact area of ​​the earphone shell and the pressure strain structure and the contact area of ​​the earphone shell and the pressure strain structure 302.

[0093] In this way, capacitance detection can help determine the direction of compression (i.e., the direction of stress generation). Based on the differences in stress direction and capacitance change caused by different compression directions, the compression of the earphone shell in different directions can be configured as different button functions, thereby expanding the button functions and improving the user experience.

[0094] It should be understood that when the earphone shell (such as the shell of the earphone stem 801) is not subjected to external pressure, the pressure strain structure 302 remains in its initial position. Figure 10 Regions A 1001, B 1002, C 1003 and D 1004 shown maintain their initial capacitance state.

[0095] Furthermore, the aforementioned pressure strain structure 302 can also be used for slip detection. For example, in a normal wearing scenario, the user can gently slide along the wall of the earphone stem 801 housing, such as... Figure 13 The arrow in (a) indicates the direction. At this time, the housing of the earphone stem 801 does not have obvious compressive force, and the strain generated by the pressure strain structure 302 is not obvious.

[0096] In this case, the user's finger will follow such as Figure 13 As shown by the arrow in (b), slide along the outer wall of the earphone stem 801 housing. The skin of the finger gradually approaches... Figure 10The finger skin gradually moves away from region C 1003 of the pressure strain structure 302. During this movement away from region C 1003, the finger skin gradually approaches region B 1002 of the pressure strain structure 302, and then gradually moves away from region B 1002. During this movement away from region B 1002, the finger skin gradually approaches region D 1004 of the pressure strain structure 302, and then gradually moves away from region D 1004. Therefore, the capacitance change in region B 1002 of the pressure strain structure gradually increases and then gradually decreases, followed by a gradual increase and then decrease in the capacitance of region C 1003, and finally a gradual increase and then decrease in the capacitance of region D 1004. In other words, during the sliding process, the capacitance change occurs first in region B 1002, then in region C 1003, and finally in region D 1004.

[0097] In this way, based on the capacitance change characteristics of region B 1002, region C 1003 and region D 1004, and combined with the strain sensor in the pressure strain structure 302 sensing the strain magnitude, a certain function of the headphones (such as volume adjustment) can be realized when the headphones slide on the surface of the outer shell (such as the shell of the headphone stem 801).

[0098] It should be noted that in order to achieve accurate detection, a certain displacement needs to be formed during the sliding process, that is, the sliding range should be as large as possible.

[0099] The following example illustrates how headphones interact with electronic devices (such as mobile phones) by listening to music.

[0100] Once the headphones establish a communication connection with the phone (such as a Bluetooth connection), the headphones can listen to music played on the phone. For example, if a user wants to pause music playback, they can... Figure 11 Squeeze the earphone shell in the direction shown in (a). In response to the user's squeezing action, the earphone sends a first command to the phone. Upon receiving the first command, the phone stops playing music. For example, if a user wants to record, they can... Figure 12 In the direction shown in (a), the earphone shell is squeezed. In response to the user's squeezing action, the earphone sends a second command to the phone. Upon receiving the second command, the phone initiates a recording operation. For example, if a user wants to adjust the volume, they can... Figure 13 As shown in (a), the earphone slides on the earphone shell in the direction indicated by the user. In response to the user's sliding action on the earphone shell, the earphone sends a third command to the mobile phone. Upon receiving the third command from the earphone, the mobile phone controls the adjustment of the volume (such as increasing or decreasing the volume).

[0101] The above only describes some scenarios of interaction between headphones and mobile phones, so the above examples do not limit the scenarios of interaction between headphones and mobile phones.

[0102] It should be understood that the above embodiments are illustrated using wireless headphones. The function buttons of the headphones implemented by the above pressure strain structure are not limited to wireless headphones, but can also be applied to wired headphones. The embodiments of this application do not make any special limitation on the type of headphones.

[0103] Through the above description of the embodiments, those skilled in the art will clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0104] In the embodiments of this application, the functional units can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0105] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, essentially, or the parts that contribute to the prior art, or all or part of the technical solutions, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as flash memory, portable hard disk, read-only memory, random access memory, magnetic disk, or optical disk.

[0106] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. An earphone, characterized in that, Including the outer casing; A pressure strain structure is also provided inside the cavity formed by the outer shell; The pressure strain structure includes a base plate and side plates on both sides of the base plate, with the side plates forming an angle with the base plate; The end of the side plate contacts the inner wall of the outer casing, and the end of the side plate that contacts the inner wall of the outer casing is away from the bottom plate; A strain sensor is provided on the pressure strain structure. When the outer shell is compressed and strain is generated, the side plate of the pressure strain structure generates strain, which in turn causes the bottom plate to strain. The strain sensor is used to sense the strain generated by the bottom plate.

2. The earphone according to claim 1, characterized in that, The end of the side plate away from the bottom plate contacts the inner wall of the outer shell in a spring-loaded contact or a welded contact.

3. The headphones according to claim 1 or 2, characterized in that, The strain sensor is disposed on the first surface of the base plate and / or the second surface of the base plate.

4. The headphones according to any one of claims 1 to 3, characterized in that, A processor is disposed within the cavity formed by the outer shell, and the strain sensor is electrically connected to the processor through a measurement circuit.

5. The headphones according to any one of claims 1 to 4, characterized in that, When the contact points between the outer shell and both ends of the pressure strain structure are squeezed, the strain sensor is used to sense the first strain generated by the pressure strain structure.

6. The earphone according to claim 5, characterized in that, The measuring circuit is used to output a first signal to the processor based on the first strain; The first signal is used to instruct the earphone to perform a first operation; the first operation includes one of powering on, powering off, pausing, playing, and recording.

7. The headphones according to any one of claims 1 to 5, characterized in that, When the outer shell is squeezed at the non-contact portion of the pressure strain structure, the strain sensor is used to sense the second strain generated by the pressure strain structure.

8. The earphone according to claim 7, characterized in that, A processor is disposed within the cavity formed by the outer shell, and the strain sensor is electrically connected to the processor via a measurement circuit; the measurement circuit is used to output a second signal to the processor based on the second strain; The second signal is used to instruct the headphones to perform a second operation; the second operation includes one of powering on, powering off, pausing, playing, and recording.

9. The headphones according to claim 6 or 8, characterized in that, The cavity formed by the outer casing also includes a printed circuit board; the processor is disposed on the printed circuit board; the strain sensor is electrically connected to the printed circuit board.

10. The headphones according to any one of claims 1 to 9, characterized in that, The outer shell includes an earphone head housing and an earphone stem housing; the pressure strain structure is disposed in the cavity formed by the earphone stem housing, and the two ends of the pressure strain structure are in stable contact with the inner wall of the earphone stem housing.

11. The earphone according to claim 10, characterized in that, A planar positioning area is provided on the outer surface of the earphone stem housing near the contact area between the earphone stem housing and the pressure strain structure.

12. The headphones according to any one of claims 1 to 9, characterized in that, The outer shell includes an earphone head housing; the pressure strain structure is disposed within the cavity formed by the earphone head housing, and the two ends of the pressure strain structure are in stable contact with the inner wall of the earphone head housing.

13. The headphones according to any one of claims 1 to 12, characterized in that, The first surface of the pressure strain structure includes a first region and a second region; The first region is fitted with a first capacitance detection contact; and / or, the second region is fitted with a second capacitance detection contact; When the outer casing is squeezed, the first capacitance detection contact is used to detect the capacitance generated in the first region, and the second capacitance detection contact is used to detect the capacitance generated in the second region.

14. The earphone according to claim 13, characterized in that, The first surface of the pressure strain structure further includes a third region; the third region is located between the first region and the second region; a third capacitance detection contact is attached to the third region; When the outer casing is squeezed, the third capacitance detection contact is used to detect the capacitance generated in the third region.

15. The earphone according to claim 14, characterized in that, On the second surface of the pressure strain structure, a fourth region is located opposite to the third region; a fourth capacitance detection contact piece is attached to the fourth region. When the outer casing is squeezed, the fourth capacitance detection contact is used to detect the capacitance generated in the fourth region.

16. The headphones according to claim 14 or 15, characterized in that, When sliding along the outer wall of the housing, the first capacitance detection contact is also used to detect the capacitance generated in the first region; the second capacitance detection contact is also used to detect the capacitance generated in the second region; and the third capacitance detection contact is also used to detect the capacitance generated in the third region.

17. The headphones according to any one of claims 1 to 16, characterized in that, The extrusion is a multi-directional press, which means pressing the outer shell in two opposite directions.

18. The headphones according to any one of claims 1 to 17, characterized in that, The earphones mentioned are true wireless stereo (TWS) earphones.

19. A system comprising the headphones and electronic device as described in any one of claims 1-18, characterized in that, include: The earphones are wirelessly paired and connected to the electronic device; The electronic device receives instructions sent by the earphones; The electronic device executes the instruction, wherein the instruction includes one of powering on, powering off, pausing, playing, recording, starting charging, and stopping charging.

20. The system according to claim 19, characterized in that, The headphones and / or the electronic device record the user's posture and user habits; The headphones and / or the electronic device execute the instructions according to the record.

21. The system according to claim 19, characterized in that, The earphones mentioned are true wireless stereo (TWS) earphones.

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