A mini LED backlight module, display device and heat dissipation method

Abstract

The application provides a mini LED backlight module, a display device and a heat dissipation method, the mini LED backlight module comprises a frame, a backlight source and a heat dissipation assembly; the heat dissipation assembly comprises a first heat dissipation fin plate, a second heat dissipation fin plate and a phase change material layer; wherein the first heat dissipation fin plate and the second heat dissipation fin plate are both provided with concave-convex fins, and the concave-convex fins are staggered and embedded, and the phase change material layer is sandwiched. The mini LED backlight module provided by the application is characterized in that the first heat dissipation fin plate and the second heat dissipation fin plate are both provided with concave-convex fins, and the concave-convex fins are staggered and embedded to form a three-dimensional staggered interface, the phase change material layer is sandwiched between the two fin plates, and multi-surface contact is formed with the concave-convex surfaces of the two fin plates, so that the heat exchange area is significantly increased; the first heat dissipation fin plate is close to the backlight source and directly absorbs heat; and the second heat dissipation fin plate is away from the backlight source and directly exchanges heat with air.

Description

Technical Field

[0001] This invention relates to the field of mini LED technology, specifically to a mini LED backlight module, a display device, and a heat dissipation method. Background Technology

[0002] Mini LED backlight modules use a large number of miniature LED chips as backlight sources, enabling high dynamic range display and have been widely used in various display devices.

[0003] With the increase in the number of backlight zones and the improvement in brightness, the heat flux density of mini LED modules increases significantly, and the heat dissipation problem becomes increasingly prominent. In the prior art, in order to improve the heat dissipation effect, heat dissipation fins and phase change materials or thermally conductive materials have been stacked. That is, a phase change material layer and a heat dissipation fin layer are sequentially set on the outside of the light source backplate. The latent heat absorption capacity of the phase change material is used to buffer the instantaneous heat peak, and then the heat is dissipated to the environment through the heat dissipation fins. For example, Chinese patent CN201811406082.4 discloses a backlight, a backlight module and a display device. The backlight includes: a substrate, the substrate including a first surface and a second surface opposite to each other; a plurality of light sources arranged in an array on the first surface; and a heat dissipation pattern on the second surface.

[0004] However, in the aforementioned stacked heat dissipation structure, the phase change material only contacts one side surface or a part of the single-layer fin, resulting in a limited heat exchange area. This means that the heat storage and heat dissipation capabilities of the phase change material cannot be fully utilized, making it difficult to meet the heat dissipation requirements in high heat flux density scenarios. Summary of the Invention

[0005] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a mini LED backlight module, display device and heat dissipation method to solve the technical problem that the heat dissipation structure of the existing technology with stacked configuration cannot meet the heat dissipation requirements in high heat flux density scenarios.

[0006] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution: In a first aspect, the present invention provides a mini LED backlight module, comprising: A frame having a receiving cavity; A backlight is installed inside the receiving cavity and is divided into multiple independent thermal zones; A heat dissipation component is installed within the frame and partially embedded in the receiving cavity, covering at least a portion of the backlight. The heat dissipation component includes: The first heat dissipation fin plate is disposed close to the backlight and is used to absorb the heat of the backlight. The second heat dissipation fin plate is positioned away from the backlight source and is used for heat exchange with the outside air; and A phase change material layer is filled between the first heat dissipation fin plate and the second heat dissipation fin plate; The first heat dissipation fin plate and the second heat dissipation fin plate are both provided with concave and convex fins, and the concave and convex fins are interlocked and sandwiched around the phase change material layer.

[0007] In some embodiments, the heat dissipation assembly further includes: Multiple basic water-cooling flow paths are embedded inside the first heat sink fin plate, with one basic water-cooling flow path corresponding to each heat zone; and Multiple external water-cooling flow paths are embedded inside the second heat dissipation fin plate, and each hot zone is provided with an external water-cooling flow path partition; The basic water-cooling flow path in the same partition is connected to the external water-cooling flow path.

[0008] In some embodiments, it also includes: Water-cooled pumps are used to provide power for the circulation of coolant. A fluid connectivity network is provided between the water-cooled pump, the basic water-cooled flow path, and the external water-cooled flow path, connecting the basic water-cooled flow path partitions and the external water-cooled flow path partitions of each hot zone to the water-cooled pump, and controlling the flow path opening and closing and flow direction between each hot zone and between each hot zone and the water-cooled pump.

[0009] In some embodiments, the fluid connectivity network includes: The branch flow path connects the liquid inlet of the basic water-cooled flow path section and the liquid outlet of the external water-cooled flow path section, and is respectively connected to the pumping and discharging ends of the water-cooled pump; A basic liquid inlet valve is installed at the inlet end of the basic water-cooled flow path section to control the on / off state of the basic water-cooled flow path in the hot zone. A basic liquid outlet valve is installed at the outlet end of the basic water-cooled flow path section to control the on / off state of the basic water-cooled flow path outlet in the hot zone. An external liquid inlet valve is installed at the inlet end of the external water cooling flow path section to control the on / off state of the external water cooling flow path in the hot zone. Connecting pipes, linking the outlet ends of the basic water-cooled flow path zones in different hot zones to the inlet ends of the externally guided water-cooled flow path zones; and A connecting valve is installed on a connecting pipeline to control the flow path between different hot zones.

[0010] In some embodiments, the undulating structure of the first heat dissipation fin plate and the second heat dissipation fin plate is an array of protrusions and depressions, and the shape of the protrusions and depressions is selected from one or more of cylindrical, prismatic, and wavy shapes.

[0011] In some embodiments, the phase change material layer is a composite phase change material, comprising a phase change substrate and a thermally conductive reinforcing material mixed in the phase change substrate, wherein the thermally conductive reinforcing material is one or more of graphene, carbon nanotubes, and expanded graphite.

[0012] Secondly, the present invention also provides a display device, including the mini LED backlight module described in any one of the above claims.

[0013] Thirdly, the present invention also provides a heat dissipation method for a miniled backlight module as described in any of the above claims, comprising the following steps: Step 1: Open the basic water cooling flow path and external water cooling flow path of all hot zones, so that the coolant circulates independently in each hot zone. The coolant in each hot zone flows through the basic water cooling flow path and external water cooling flow path of that hot zone in sequence and then flows back. Step 2: Monitor the temperature of each hot zone in real time; Step 3: When the temperature difference between any hot zone and the temperature of another hot zone is found to be greater than the preset temperature difference threshold, or the temperature of any hot zone is greater than the preset high temperature threshold, enter the heat allocation mode. Step 4: In the heat distribution mode, mark the hot zone as the heat source zone and keep the basic water cooling flow path of the heat source zone open; The hot zone with a temperature difference that meets the threshold is marked as the receiving zone. The basic water cooling flow path of the receiving zone is closed, and the external water cooling flow path of the receiving zone is opened. The outlet of the basic water-cooled flow path in the heat source area is connected to the inlet of the external water-cooled flow path in the receiving area to form a circulation path from the basic water-cooled flow path in the heat source area through the external water-cooled flow path in the receiving area and then back. Step 5: When the temperature difference recovers to less than the preset temperature difference threshold and the temperature of the heat source area is lower than the preset high temperature threshold, close the connection between the heat source area and the receiving area, reopen the basic water cooling flow path and the external water cooling flow path of all hot areas, and return to the operating mode of Step 1.

[0014] In some embodiments, in step four, when there are multiple receiving areas, the outlet of the basic water-cooled flow path of the heat source area is simultaneously connected to the inlet of the external water-cooled flow path of multiple receiving areas, so that the coolant is diverted in parallel to the external water-cooled flow path of each receiving area and then flows back respectively.

[0015] In some embodiments, step four further includes receiving area temperature monitoring, which monitors the temperature of each receiving area in real time, and reduces the flow rate of coolant flowing into the receiving area when the temperature rise rate of a certain receiving area exceeds a preset rate threshold or the temperature exceeds a preset adjustment threshold.

[0016] Compared with existing technologies, the mini LED backlight module provided by this invention features concave and convex fins on both the first and second heat dissipation fins, which are interlocked to form a three-dimensional interlocked interface. The phase change material layer is sandwiched between the two fins, forming multi-faceted contact with the concave and convex surfaces of the two fins, significantly increasing the heat exchange area. The first heat dissipation fin is close to the backlight and directly absorbs heat, while the second heat dissipation fin is away from the backlight and directly exchanges heat with the air. The phase change material layer is sandwiched between the two fins, allowing heat to be directly transferred from the first heat dissipation fin to the phase change material layer through the concave and convex fins, while the phase change material layer transfers heat to the second heat dissipation fin. This results in a short heat transfer path and low thermal resistance. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the mini LED backlight module provided in an embodiment of the present invention; Figure 2 This is a cross-sectional structural diagram of the mini LED backlight module provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the fluid connectivity network provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the normal operation flow path of the fluid connectivity network provided in the embodiment of the present invention; Figure 5 This is a schematic diagram of the heat distribution flow path of the fluid connectivity network provided in an embodiment of the present invention; Figure 6 This is a flowchart of the heat dissipation method provided in the embodiments of the present invention; Figure 7 This is a schematic diagram of the basic water-cooling flow path and the external water-cooling flow path of the mini LED backlight module provided in the embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Framework; 2. Backlight; 201. Hot zone; 3. Heat dissipation components; 31. First heat dissipation fin plate; 32. Second heat dissipation fin plate; 33. Phase change material layer; 34. Basic water cooling flow path; 35. External water cooling flow path; 301. Concave and convex fins; 4. Water-cooled pump; 5. Fluid connectivity network; 51. Branch flow path; 511. Main inlet flow path; 512. Main outlet flow path; 52. Basic inlet valve; 53. Basic outlet valve; 54. External inlet valve; 55. Connecting pipeline; 56. Connecting valve. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0020] To address the technical challenge of layered heat dissipation structures failing to meet the heat dissipation requirements in high heat flux density scenarios, this invention provides a mini LED backlight module. Both the first and second heat dissipation fins are equipped with interlocking fins, forming a three-dimensional interlocked interface. A phase change material layer is sandwiched between the two fins, creating multi-faceted contact with their surfaces. This significantly increases the heat exchange area, providing efficient heat conduction and dissipation through the sandwiched structure, thus meeting the heat dissipation requirements in high heat flux density scenarios.

[0021] It should be noted that the mini LED backlight module described in this invention is used in, but not limited to, mini LEDs. For ease of explanation, this invention will only use the application of the mini LED backlight module in mini LEDs as an example. The principle of the mini LED backlight module applied to other types of devices is essentially the same as that applied to mini LEDs, and will not be described in detail here.

[0022] Please see Figure 1-2 This invention provides a mini LED backlight module, comprising a frame 1, a backlight source 2, and a heat dissipation component 3. The frame 1 has a receiving cavity for accommodating and fixing at least a portion of the backlight source 2 and the heat dissipation component 3. The backlight source 2 is mounted within the receiving cavity of the frame 1. The backlight source 2 includes a substrate and multiple mini LED chips arranged in an array on the substrate. To adapt to the brightness requirements of different display areas and achieve refined local dimming control, the backlight source 2 is divided into multiple independent hot zones 201. Each hot zone 201 corresponds to a set of mini LED chips, and its brightness can be independently controlled according to the displayed image, thereby generating different amounts of heat. The heat dissipation component 3 is mounted within the frame 1 and partially embedded in the receiving cavity, covering at least a portion of the backlight source 2, for effectively managing and dissipating the heat generated by the backlight source 2 during operation.

[0023] In this embodiment, the heat dissipation assembly 3 includes a first heat dissipation fin plate 31, a second heat dissipation fin plate 32, and a phase change material layer 33. The first heat dissipation fin plate 31 is a single piece of high thermal conductivity metal plate, located close to the backlight 2, with its side facing the backlight 2 opposite to the back of the backlight 2, used to absorb the heat generated when the backlight 2 is working. The side of the first heat dissipation fin plate 31 facing away from the backlight 2 has concave and convex fins 301. The second heat dissipation fin plate 32 is also a single piece of high thermal conductivity metal plate, located away from the backlight 2, with its side facing the air exposed to the air, used for heat exchange and dissipation with the outside air. The side of the second heat dissipation fin plate 32 facing the first heat dissipation fin plate 31 also has concave and convex fins 301. The concave and convex fins 301 of the first heat dissipation fin plate 31 and the concave and convex fins 301 of the second heat dissipation fin plate 32 are staggered and opposite to each other, forming a continuous gap between the two plates. The cross-sectional shape of the concave-convex fin 301 can be wavy, serrated, arrayed protrusions, or other geometric shapes that can increase the surface area.

[0024] Furthermore, the heat generated during the operation of the backlight 2 is first transferred to the first heat dissipation fin plate 31. Since the first heat dissipation fin plate 31 is a single-plate structure with concave and convex fins 301, heat entering the first heat dissipation fin plate 31 can quickly diffuse laterally along the plate surface and be efficiently transferred to the phase change material layer 33 in contact with it through the large surface area of ​​the concave and convex fins 301. After absorbing heat, the phase change material layer 33 stores some of the heat as latent heat, achieving heat buffering; simultaneously, the phase change material layer 33 transfers heat to the concave and convex fins 301 of the second heat dissipation fin plate 32 in contact with it. The second heat dissipation fin plate 32 is also a single-plate structure with good lateral thermal conductivity. After entering the second heat dissipation fin plate 32, heat quickly diffuses to the entire plate surface and is dissipated into the environment through its exposed surface. Since there is no direct metal contact between the two heat dissipation fins, all heat must pass through the phase change material layer 33 to be transferred from the first heat dissipation fin 31 to the second heat dissipation fin 32. This forces the phase change material layer 33 to participate in the entire heat transfer process, fully utilizing its heat storage capacity. The phase change material layer 33 fills the continuous gap between the first heat dissipation fin 31 and the second heat dissipation fin 32. The first heat dissipation fin 31, the phase change material layer 33, and the second heat dissipation fin 32 form a sandwich structure: the first heat dissipation fin 31 and the second heat dissipation fin 32 are interlocked by interlocking concave and convex fins 301, sandwiching the phase change material layer 33 in the middle. There is no direct metal contact between the two heat dissipation fins; they are completely isolated by the phase change material layer 33.

[0025] Understandably, the phase change material layer 33 uses materials with high latent heat of phase change, such as paraffin, fatty acids, hydrated salts, etc., and can add high thermal conductivity reinforcing materials such as graphene, carbon nanotubes, and expanded graphite to form a composite phase change material to improve its overall thermal conductivity.

[0026] Furthermore, the undulating structure of the first heat dissipation fin plate 31 and the second heat dissipation fin plate 32 is an array of protrusions and depressions, and the shape of the protrusions and depressions is selected from one or more of cylindrical, prismatic, and wavy shapes.

[0027] Furthermore, the phase change material layer 33 is a composite phase change material, including a phase change substrate and a thermally conductive reinforcing material mixed in the phase change substrate. The thermally conductive reinforcing material is one or more of graphene, carbon nanotubes, and expanded graphite.

[0028] In one embodiment, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 7 The heat dissipation assembly 3 also includes multiple basic water-cooling flow paths 34 and multiple external water-cooling flow paths 35, which are used to further improve heat dissipation efficiency through forced convection of coolant. The basic water-cooling flow paths 34 are embedded inside the first heat dissipation fin plate 31, and each heat zone 201 is provided with one basic water-cooling flow path 34. The basic water-cooling flow path 34 is set close to the heat source side and is mainly used to absorb the heat generated when the backlight 2 is working, and actively conduct the heat from the heat source area through the coolant. The external water-cooling flow paths 35 are embedded inside the second heat dissipation fin plate 32, and each heat zone 201 is provided with one external water-cooling flow path 35 section. The external water-cooling flow path 35 is set close to the air side and is mainly used to assist in heat dissipation. When the coolant flows through the external water-cooling flow path 35, it transfers heat to the second heat dissipation fin plate 32, and then the second heat dissipation fin plate 32 dissipates it into the air. Among them, the basic water-cooling flow path 34 and the external water-cooling flow path 35 of the same section are connected to form an independent circulation loop for that heat zone 201.

[0029] Specifically, the basic water-cooled flow path 34 has an inlet end and an outlet end, and the external water-cooled flow path 35 also has an inlet end and an outlet end. Within the same hot zone 201, the outlet end of the basic water-cooled flow path 34 and the inlet end of the external water-cooled flow path 35 are connected by a connecting pipe, allowing the coolant to flow sequentially through the basic water-cooled flow path 34 and the external water-cooled flow path 35 before returning. Under normal operating conditions, the coolant is powered by an external water-cooling pump and flows sequentially through the basic water-cooled flow path 34 of the hot zone 201, absorbing heat from the hot zone 201 and the external water-cooled flow path 35, transferring the heat to the second heat dissipation fin plate 32 for dissipation, forming an independent heat absorption and dissipation cycle.

[0030] Understandably, the basic water-cooled flow path 34 is responsible for heat absorption, while the external water-cooled flow path 35 is responsible for heat dissipation. Each hot zone 201 has an independent basic water-cooled flow path 34 and an external water-cooled flow path 35, which can be differentiated according to the actual temperature of each hot zone 201. The two flow paths are thermally coupled to the phase change material layer 33 from the top and bottom sides, respectively, so that the phase change material layer 33 can both store the heat transferred by the basic flow path and release heat to the external flow path, forming a synergistic effect of passive heat storage and active heat dissipation.

[0031] In one embodiment, please refer to Figure 3 , Figure 4 and Figure 5 To facilitate flow path connectivity and control between the various hot zones 201, a water-cooled pump 4 and a fluid communication network 5 are also included. The water-cooled pump 4 is installed inside or outside the frame 1, with its inlet connected to the return manifold and its outlet connected to the main distribution pipe. It drives the coolant to circulate throughout the system, providing the motive force for coolant circulation. The communication network 5 is located between the water-cooled pump 4, the basic water-cooled flow path 34, and the external water-cooled flow path 35, connecting the basic water-cooled flow path 34 and the external water-cooled flow path 35 of each hot zone 201 to the water-cooled pump 4, and controlling the flow path connectivity and direction between the hot zones 201 and between each hot zone 201 and the water-cooled pump 4.

[0032] Specifically, the fluid connectivity network 5 includes a branch flow path 51, a basic inlet valve 52, a basic outlet valve 53, an external inlet valve 54, a connecting pipeline 55, and a connecting valve 56.

[0033] Understandably, each hot zone 201 is equipped with a temperature sensor, forming a temperature sensor array. A corresponding controller is also installed, electrically connected to the temperature sensor array 6 and the basic inlet valve 52, basic outlet valve 53, external inlet valve 54, and connecting valve 56. This controller receives feedback signals from the temperature sensors and sends control commands to each valve according to preset control logic, automatically adjusting the opening and closing status and degree of each valve.

[0034] Among them, the branch flow path 51 includes the liquid inlet main path 511 and the liquid outlet main path 512, which are respectively connected to the liquid inlet of the basic water-cooled flow path 34 section and the liquid outlet of the external water-cooled flow path 35 section, and are respectively connected to the pumping and discharging ends of the water-cooled pump 4.

[0035] Furthermore, a base inlet valve 52 is located at the inlet end of the base water-cooled flow path 34 section to control the on / off state of the base water-cooled flow path 34 in the hot zone 201. Specifically, it connects the pipe from the outlet of the water-cooled pump 4 in the branch flow path 51 to the inlet of the base water-cooled flow path 34 in the hot zone 201. The base inlet valve 52 controls the on / off state of the base water-cooled flow path 34 in the hot zone 201. When the base inlet valve 52 is open, coolant can flow into the base water-cooled flow path 34 in the hot zone 201; when the base inlet valve 52 is closed, the coolant is cut off, and the base water-cooled flow path 34 in the hot zone 201 does not participate in the circulation.

[0036] Furthermore, a base outlet valve 53 is located at the outlet end of the base water-cooled flow path 34 section to control the opening and closing of the outlet of the base water-cooled flow path 34 in the hot zone 201. That is, it connects the outlet of the base water-cooled flow path 34 in the hot zone 201 to the subsequent pipeline. The base outlet valve 53 controls the opening and closing of the outlet of the base water-cooled flow path 34 in the hot zone 201. The base outlet valve 53 works in conjunction with the base inlet valve 52 to jointly control the opening and closing of the base water-cooled flow path 34 in the hot zone 201. In addition, the base outlet valve 53 also prevents coolant backflow, ensuring unidirectional coolant flow.

[0037] Furthermore, an external liquid inlet valve 54 is located at the inlet end of the external water cooling flow path 35 section to control the on / off state of the external water cooling flow path 35 in the hot zone 201. Specifically, it connects the liquid inlet of the external water cooling flow path 35 in the hot zone 201 to the upstream pipeline. The external liquid inlet valve 54 controls the on / off state of the external water cooling flow path 35 in the hot zone 201. When the external liquid inlet valve 54 is open, coolant can flow into the external water cooling flow path 35 in the hot zone 201; when the external liquid inlet valve 54 is closed, the external water cooling flow path 35 in the hot zone 201 does not participate in circulation.

[0038] Furthermore, the connecting pipes 55 are connected between the outlet ends of the basic water-cooled flow path 34 sections and the inlet ends of the external water-cooled flow path 35 sections of different heat zones 201. Specifically, one end of each connecting pipe 55 is connected to the pipe after the basic liquid outlet valve 53 of a certain heat zone 201, and the other end is connected to the pipe before the external liquid inlet valve 54 of another heat zone 201. The connecting pipes 55 provide a physical channel for heat distribution between different heat zones 201.

[0039] Furthermore, a connecting valve 56 is installed on the connecting pipe 55 to control the flow path between different hot zones 201. When the connecting valve 56 is open, the flow path between the two hot zones 201 is connected; when the connecting valve 56 is closed, the flow path between the two hot zones 201 is disconnected.

[0040] Understandably, to further achieve refined flow regulation, at least some of the basic inlet valve 52, external inlet valve 54, and connecting valve 56 can be proportional control valves, whose opening degree can be continuously adjusted between 0-100%, thereby controlling the coolant flow rate through the valve. The proportional control valve can dynamically adjust its opening degree according to the magnitude of the temperature deviation: the larger the temperature difference, the larger the opening degree; the smaller the temperature difference, the smaller the opening degree. The basic outlet valve 53 can be a check valve or a solenoid valve. When a check valve is used, the control logic can be simplified, and its unidirectional conduction characteristic can be used to prevent coolant backflow; when a solenoid valve is used, more flexible control can be achieved, such as selectively closing the basic outlet valve 53 of certain hot areas in the heat distribution mode to change the flow direction.

[0041] The present invention also provides a display device, including a mini LED backlight module as described in any of the above embodiments.

[0042] The present invention also provides a heat dissipation method for a mini LED backlight module as described in any of the above, comprising the following steps: Step 1: Open the basic water cooling flow path 34 and external water cooling flow path 35 of all hot zones 201, so that the coolant circulates independently in each hot zone 201. The coolant of each hot zone 201 flows through the basic water cooling flow path 34 and external water cooling flow path 35 of that hot zone 201 in sequence and then flows back. Step 2: Monitor the temperature of each hot zone 201 in real time; Step 3: When the temperature difference between the first hot zone 201 and the second hot zone 201 is detected to be greater than the preset temperature difference threshold, or the temperature of the first hot zone 201 is greater than the preset high temperature threshold, the heat distribution mode is entered. Step 4: In the heat distribution mode, mark the first hot zone 201 as the heat source zone and keep the basic water cooling flow path 34 of the heat source zone open. Mark the second hot zone 201 as the receiving zone, close the basic water cooling flow path 34 of the receiving zone, and open the external water cooling flow path 35 of the receiving zone. The outlet of the basic water-cooled flow path 34 in the heat source area is connected to the inlet of the external water-cooled flow path 35 in the receiving area, forming a circulation path from the basic water-cooled flow path 34 in the heat source area through the external water-cooled flow path 35 in the receiving area and then back. Step 5: When the temperature difference recovers to less than the preset temperature difference threshold and the temperature of the heat source area is lower than the preset high temperature threshold, close the connection between the heat source area and the receiving area, reopen the basic water cooling flow path 34 and the external water cooling flow path 35 of all heat zones 201, and return to the operating mode of Step 1.

[0043] It should be noted that the terms "first" and "second" in "first hot zone" and "second hot zone" are used for ease of distinction and refer to one of the hot zones that meets the conditions, and are not intended to be unique.

[0044] Understandably, heat distribution is mainly used when the temperature of a certain hot zone is too high. By using the water cooling flow path, the external water cooling flow path 35 of other hot zones is used as a diversion flow path to allow heat to quickly diffuse into the outer layer of the hot zone.

[0045] Furthermore, in step four, when there are multiple receiving areas, the outlet of the basic water-cooled flow path 34 of the heat source area is simultaneously connected to the inlet of the external water-cooled flow path 35 of multiple receiving areas, so that the coolant is diverted in parallel to the external water-cooled flow path 35 of each receiving area and then flows back respectively.

[0046] Furthermore, step four also includes receiving area temperature monitoring, which monitors the temperature of each receiving area in real time. When the temperature rise rate of a certain receiving area exceeds a preset rate threshold or the temperature exceeds a preset adjustment threshold, the flow rate of coolant flowing into that receiving area is reduced.

[0047] Furthermore, the method includes the following steps: real-time monitoring of the temperature of each receiving zone; when the temperature rise rate of a receiving zone exceeds a preset rate threshold or the temperature exceeds a preset adjustment threshold, the flow rate of coolant flowing into that receiving zone is reduced.

[0048] It is understandable that the flow rate of coolant into the receiving area can be reduced by decreasing the opening of the external inlet valve of the receiving area.

[0049] Furthermore, in step three, the preset temperature difference threshold is 5℃-10℃, and the preset high temperature threshold is 45℃-50℃.

[0050] Furthermore, in step four, the receiving area is at least one hot zone whose temperature is lower than the average temperature of all hot zones and does not exceed the safe temperature threshold, and is preferentially selected in order of temperature from low to high.

[0051] The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A mini LED backlight module, characterized in that, include: A frame having a receiving cavity; A backlight is installed inside the receiving cavity and is divided into multiple independent thermal zones; A heat dissipation component is installed within the frame and partially embedded in the receiving cavity, covering at least a portion of the backlight. The heat dissipation component includes: The first heat dissipation fin plate is disposed close to the backlight and is used to absorb the heat of the backlight. The second heat dissipation fin plate is positioned away from the backlight source and is used for heat exchange with the outside air; and A phase change material layer is filled between the first heat dissipation fin plate and the second heat dissipation fin plate; The first heat dissipation fin plate and the second heat dissipation fin plate are both provided with concave and convex fins, and the concave and convex fins are interlocked and sandwiched around the phase change material layer.

2. The mini LED backlight module according to claim 1, characterized in that, The heat dissipation component also includes: Multiple basic water-cooling flow paths are embedded inside the first heat sink fin plate, with one basic water-cooling flow path corresponding to each heat zone; and Multiple external water-cooling flow paths are embedded inside the second heat dissipation fin plate, and each hot zone is provided with an external water-cooling flow path partition; The basic water-cooling flow path in the same partition is connected to the external water-cooling flow path.

3. The mini LED backlight module according to claim 2, characterized in that, Also includes: Water-cooled pumps are used to provide power for the circulation of coolant; A fluid connectivity network is provided between the water-cooled pump, the basic water-cooled flow path, and the external water-cooled flow path, connecting the basic water-cooled flow path partitions and the external water-cooled flow path partitions of each hot zone to the water-cooled pump, and controlling the flow path opening and closing and flow direction between each hot zone and between each hot zone and the water-cooled pump.

4. The mini LED backlight module according to claim 3, characterized in that, The fluid connectivity network includes: The branch flow path connects the liquid inlet of the basic water-cooled flow path section and the liquid outlet of the external water-cooled flow path section, and is respectively connected to the pumping and discharging ends of the water-cooled pump; A basic liquid inlet valve is installed at the inlet end of the basic water-cooled flow path section to control the on / off state of the basic water-cooled flow path in the hot zone. A basic liquid outlet valve is installed at the outlet end of the basic water-cooled flow path section to control the on / off state of the basic water-cooled flow path outlet in the hot zone. An external liquid inlet valve is installed at the inlet end of the external water cooling flow path section to control the on / off state of the external water cooling flow path in the hot zone. Connecting pipes, linking the outlet ends of the basic water-cooled flow path zones in different hot zones to the inlet ends of the externally guided water-cooled flow path zones; and A connecting valve is installed on a connecting pipeline to control the flow path between different hot zones.

5. The mini LED backlight module according to claim 1, characterized in that, The first heat dissipation fin plate and the second heat dissipation fin plate have an array of protrusions and depressions, and the shape of the protrusions and depressions is selected from one or more of cylindrical, prismatic, and wavy shapes.

6. The mini LED backlight module according to claim 1, characterized in that, The phase change material layer is a composite phase change material, comprising a phase change substrate and a thermally conductive reinforcing material mixed in the phase change substrate, wherein the thermally conductive reinforcing material is one or more of graphene, carbon nanotubes, and expanded graphite.

7. A display device, characterized in that, Includes the mini LED backlight module as described in any one of claims 1-6.

8. A heat dissipation method, characterized in that, Its use in the mini LED backlight module as described in any one of claims 2-6 includes the following steps: Step 1: Open the basic water cooling flow path and external water cooling flow path of all hot zones, so that the coolant circulates independently in each hot zone. The coolant in each hot zone flows through the basic water cooling flow path and external water cooling flow path of that hot zone in sequence and then flows back. Step 2: Monitor the temperature of each hot zone in real time; Step 3: When the temperature difference between any hot zone and the temperature of another hot zone is found to be greater than the preset temperature difference threshold, or the temperature of any hot zone is greater than the preset high temperature threshold, enter the heat allocation mode. Step 4: In the heat distribution mode, mark the hot zone as the heat source zone and keep the basic water cooling flow path of the heat source zone open; The hot zone with a temperature difference that meets the threshold is marked as the receiving zone. The basic water cooling flow path of the receiving zone is closed, and the external water cooling flow path of the receiving zone is opened. The outlet of the basic water-cooled flow path in the heat source area is connected to the inlet of the external water-cooled flow path in the receiving area to form a circulation path from the basic water-cooled flow path in the heat source area through the external water-cooled flow path in the receiving area and then back. Step 5: When the temperature difference recovers to less than the preset temperature difference threshold and the temperature of the heat source area is lower than the preset high temperature threshold, close the connection between the heat source area and the receiving area, reopen the basic water cooling flow path and the external water cooling flow path of all hot areas, and return to the operating mode of Step 1.

9. The heat dissipation method according to claim 8, characterized in that, In step four, when there are multiple receiving areas, the outlet of the basic water-cooled flow path of the heat source area is simultaneously connected to the inlet of the external water-cooled flow path of multiple receiving areas, so that the coolant is diverted in parallel to the external water-cooled flow path of each receiving area and then flows back.

10. The heat dissipation method according to claim 8, characterized in that, Step four also includes receiving area temperature monitoring, which monitors the temperature of each receiving area in real time. When the temperature rise rate of a certain receiving area exceeds a preset rate threshold or the temperature exceeds a preset adjustment threshold, the flow rate of coolant flowing into that receiving area is reduced.

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