Overflow method substrate glass forming temperature field adjusting device and method

Abstract

This invention discloses a device and method for adjusting the temperature field during the molding of substrate glass using an overflow method, belonging to the field of substrate glass manufacturing technology. The overflow method substrate glass molding temperature field adjustment device provided by this invention features reciprocating coil structures on both sides of the substrate glass, with the cooling pipe assembly forming a tubular structure corresponding to the edge of the substrate glass. A thermal insulation structure is provided at one end of the tubular structure near the reciprocating coil structure. By utilizing the central coil to enhance heat transfer and the edge insulation to suppress heat dissipation, the device actively balances the lateral temperature difference. Simultaneously, the rotating function dynamically adjusts the cooling area to adapt to different operating conditions, achieving precise control of the lateral temperature field of the substrate glass. This significantly reduces stress and warpage defects caused by uneven cooling, improving product yield and dimensional stability.

Description

Technical Field

[0001] This invention relates to the field of substrate glass manufacturing technology, and specifically to a device and method for adjusting the temperature field during the molding of overflow-type substrate glass. Background Technology

[0002] In the field of substrate glass manufacturing, the overflow method is the core process for achieving high surface quality substrate glass forming. Its principle is as follows: molten glass flows out from both sides of the overflow brick in the overflow device, converging at the brick tip to form a continuous viscoelastic glass flow. This glass flow needs to be rapidly cooled and shaped to ultimately form a substrate glass with a smooth surface and uniform thickness. As display technology advances towards higher generations (larger size, higher resolution), the required width of substrate glass has increased significantly, and the corresponding forming equipment length has reached several meters. Simultaneously, to improve production efficiency, the board drawing speed continues to accelerate, and downstream applications are placing increasingly stringent requirements on substrate glass quality indicators such as stress control and flatness (warpage). This places higher demands on the precise control of the temperature field during the forming process.

[0003] Currently, the industry commonly uses a "straight-through cooling pipe" solution for cooling and shaping substrate glass formed by overflow method: straight tubular cooling pipes are inserted into the furnace steel structure on both sides of the substrate glass, and cooling is achieved through heat exchange between the cooling pipes and the substrate glass. However, traditional cooling pipes are integral straight-through structures, with their length covering the area from the edge to the middle of the substrate glass, meaning a single cooling pipe runs through the entire width of the substrate glass laterally, aiming to cool the entire substrate glass laterally.

[0004] In the actual molding process, due to the thermal field distribution characteristics of the furnace body and the higher heat exchange rate between the edge of the substrate glass and the furnace steel structure (the edge dissipates heat faster), the initial temperature distribution of the substrate glass exhibits the inherent characteristic of being high in the middle and low at the edge. However, the traditional straight-through cooling pipes have the same cooling rate for the edge and middle of the substrate glass, which cannot enhance cooling of the high-temperature area in the middle, nor can they avoid excessive cooling of the low-temperature area at the edge, further exacerbating the problem of uneven lateral temperature distribution of the substrate glass.

[0005] Therefore, how to achieve differentiated cooling control between the edge and center of the substrate glass during the high-generation substrate glass forming process has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide an overflow method for adjusting the temperature field of substrate glass forming, so as to overcome the problem that the traditional straight-through cooling pipe in the prior art cannot achieve differentiated cooling between the edge and the middle of the substrate glass, resulting in uneven lateral temperature distribution.

[0007] The present invention solves the above-mentioned technical problems through the following technical solution: The present invention provides a temperature field adjustment device for substrate glass forming by overflow method, comprising at least one set of cooling pipe assemblies, wherein the cooling pipe assemblies are distributed on both sides of the substrate glass and penetrate the furnace steel structure; The cooling pipe assembly is configured as a reciprocating coil structure in the middle area of ​​the substrate glass, and as a tubular structure in the edge area of ​​the substrate glass. A heat insulation structure is provided at one end of the tubular structure near the reciprocating coil structure. Both ends of the cooling pipe assembly pass through the furnace steel structure via a rotating fixing device to adjust the angle between the reciprocating coil structure and the substrate glass.

[0008] A further improvement of the present invention is that multiple sets of cooling pipe assemblies are arranged in layers along the downward direction of the substrate glass.

[0009] A further improvement of the present invention is that the reciprocating coil structure is composed of multiple U-shaped bends connected in series.

[0010] A further improvement of the present invention is that the angle between the reciprocating coil structure and the substrate glass is adjustable from 0 to 90°. When the reciprocating coil structure is parallel to the downward direction of the substrate glass, the angle between the reciprocating coil structure and the substrate glass is 0°, and the cooling radiation area is the largest. When the reciprocating coil structure is perpendicular to the downward direction of the substrate glass, the angle between the reciprocating coil structure and the substrate glass is 90°, and the cooling radiation area is the smallest.

[0011] A further improvement of the present invention is that the rotating fixing device includes a clamping seat and a locking member. The clamping seat is fixedly installed on the furnace body steel structure. One end of the cooling pipe assembly passes through the interior of the clamping seat. When the cooling pipe assembly is rotated to a preset angle, it is locked and fixed by the locking member.

[0012] A further improvement of the present invention is that the rotating fixing device includes an angle plate, a rotating handle, and a positioning pin. The angle plate is fixedly mounted on the furnace body steel structure. Several positioning holes corresponding to the angle are arranged along the circumference of the angle plate. One end of the cooling pipe assembly passes through the center of the angle plate. The fixed end of the rotating handle is fixedly connected to the fixed end of the rotating handle. The movable end of the rotating handle is provided with a handle. A through hole is provided between the handle and the fixed end. When the cooling pipe assembly is rotated to a preset angle by rotating the handle, the positioning pin passes through the through hole and the positioning hole in sequence to achieve locking and fixing.

[0013] The present invention also provides a method for adjusting the temperature field during the molding of overflow-type substrate glass, using the overflow-type substrate glass molding temperature field adjustment device as described above, including the following steps: Based on the lateral cooling requirements of the substrate glass, the angle between the reciprocating coil structure and the substrate glass is changed by adjusting the rotation angle of each cooling pipe assembly relative to the substrate glass, so as to control the heat radiation coverage and cooling intensity of the middle and edge areas of the substrate glass. Cooling medium is introduced into the cooling pipe assembly to adjust the temperature field of the overflow method substrate glass forming. The reciprocating coil structure is used to exchange heat in the middle of the substrate glass, and the thermal insulation structure is used to suppress excessive cooling at the edge of the substrate glass.

[0014] A further improvement of the present invention is that the cooling medium is cooling air.

[0015] A further improvement of the present invention is that the cooling medium is cooling water.

[0016] A further improvement of the present invention is that by changing the angle between the reciprocating coil structure and the substrate glass to 45°~0°, the heat radiation coverage and cooling intensity of the middle and edge regions of the substrate glass are enhanced; by changing the angle between the reciprocating coil structure and the substrate glass to 45°~90°, the heat radiation coverage and cooling intensity of the middle and edge regions of the substrate glass are weakened.

[0017] Compared with the prior art, the positive and progressive effects of the present invention are as follows: The overflow method substrate glass forming temperature field adjustment device provided by the present invention sets reciprocating coil structures on both sides of the substrate glass, and sets the cooling pipe assembly in the area corresponding to the edge of the substrate glass as a tubular structure. A heat insulation structure is set on one end of the tubular structure near the reciprocating coil structure. By using the central coil to enhance heat transfer and the edge insulation to suppress heat dissipation, the lateral temperature difference is actively balanced. At the same time, the cooling area is dynamically adjusted by the rotation function to adapt to different working conditions. This achieves precise control of the lateral temperature field of the substrate glass, significantly reduces stress and warping defects caused by uneven cooling, and improves product yield and dimensional stability. Attached Figure Description

[0018] The accompanying drawings are provided to further understand the invention and constitute a part of this invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0019] Figure 1 Figure (a) is a side view; Figure (b) is a front view. Figure 2 Figure (a) shows the original lateral temperature distribution, and Figure (b) shows the adjusted lateral temperature distribution. Figure 3 This is a schematic diagram of the overall structure of the present invention; Figure 4 This is a detailed schematic diagram of the cooling pipe assembly of the present invention; Figure 5 This is a schematic diagram of the structure of Embodiment 1 of the present invention, wherein Figure (a) is a front view and Figure (b) is a side view; Figure 6 This is a schematic diagram of the structure of Embodiment 2 of the present invention, wherein Figure (a) is a front view and Figure (b) is a side view; Figure 7 This is a schematic diagram of the structure of Embodiment 3 of the present invention, wherein Figure (a) is a front view and Figure (b) is a side view; Figure 8 This is a schematic diagram of the installation of a certain rotating fixing device of the present invention; Figure 9 This is a detailed schematic diagram of a rotating fixing device of the present invention.

[0020] Among them, 1. Overflow brick; 2. Substrate glass; 21. First side; 22. Second side; 23. Middle; 3. Cooling pipe assembly; 31. Thermal insulation structure; 32. Reciprocating coil structure; 33. External part of cooling pipe assembly; 3A. First height cooling pipe assembly; 3B. Second height cooling pipe assembly; 321. First cooling zone; 322. Second cooling zone; 4. Furnace body steel structure; 5. Angle plate; 51. Scale line; 52. Positioning hole; 6. Rotating handle; 61. Handle; 62. Positioning pin. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] Furthermore, it should be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. This is an explanation of the present invention and not a limitation thereof.

[0027] In the overflow molding process of high-generation substrate glass 2, due to the large width and high drawing speed of substrate glass 2, its lateral temperature distribution often exhibits a characteristic of high temperature in the center and low temperature at the edges. Traditional straight-through cooling pipes provide uniform cooling for the entire glass surface, making it difficult to achieve differentiated control and easily leading to quality problems such as thermal stress concentration and excessive warping. Existing cooling devices have a simple and non-adjustable structure, and cannot dynamically adjust the cooling intensity and effective area according to the actual temperature field, thus restricting further improvement in product quality.

[0028] See Figure 1 The high-generation substrate glass 2 has a wide width, corresponding to a long forming equipment length. When the molten glass flows down from the overflow brick 1, it needs to be rapidly cooled and shaped. Traditional technology involves inserting a set of cooling straight pipes into the furnace steel structure 4 during the glass's descent. Cooling water enters at one end of the pipe and exits at the other, with the entire cooling straight pipe penetrating the corresponding positions in the middle and edges of the substrate glass 2, thus cooling the entire substrate glass 2 laterally. However, the actual temperature distribution of the substrate glass 2 is... Figure 2 As shown, the temperature is high in the middle and low at the edges. Existing cooling pipe cooling methods make it difficult to balance the temperature adjustment of the middle and edges of the substrate glass 2, which means it is difficult to achieve a uniform distribution of the transverse temperature field of the substrate glass 2.

[0029] Therefore, the present invention provides an overflow method substrate glass 2 forming temperature field adjustment device, including at least one set of cooling pipe assembly 3, the cooling pipe assembly 3 being distributed on both sides of the substrate glass 2 and penetrating the furnace body steel structure 4; Among them, the area of ​​the cooling pipe assembly 3 corresponding to the middle of the substrate glass 2 is set as a reciprocating coil structure 32, and the area of ​​the cooling pipe assembly 3 corresponding to the edge of the substrate glass 2 is a tubular structure. A heat insulation structure 31 is provided at one end of the tubular structure near the reciprocating coil structure 32. The two ends of the cooling pipe assembly 3 pass through the furnace steel structure 4 through the rotating fixing device, which is used to adjust the angle between the reciprocating coil structure 32 and the substrate glass 2.

[0030] The overflow method substrate glass 2 forming temperature field adjustment device provided by the present invention sets reciprocating coil structures 32 on both sides of the substrate glass 2, sets cooling pipe assembly 3 in the area corresponding to the edge of the substrate glass 2 as a tubular structure, and sets a heat insulation structure 31 at one end of the tubular structure near the reciprocating coil structure 32. By using the central coil to enhance heat exchange and the edge insulation to suppress heat dissipation, the lateral temperature difference is actively balanced. At the same time, the cooling area is dynamically adjusted by the rotation function to adapt to different working conditions. This achieves precise control of the lateral temperature field of the substrate glass 2, significantly reduces stress and warping defects caused by uneven cooling, and improves product yield and dimensional stability.

[0031] Preferably, multiple sets of cooling pipe assemblies 3 are arranged in layers along the downward direction of the substrate glass 2.

[0032] The upper layer focuses on rapid temperature control in the initial solidification zone, the middle layer is used to stabilize the main cooling process, and the lower layer is used for fine-tuning in the later stages of molding. Each layer is fixed to the furnace steel structure 4 by an independent rotating fixing device, so they do not interfere with each other. By arranging multiple layers, graded cooling control is achieved along the height of the substrate glass 2. Differential intervention is carried out according to the thermal history and deformation trend of different regions, which enhances the adaptability to complex temperature gradients and improves the temperature uniformity and process flexibility of the entire cooling zone.

[0033] Preferably, the reciprocating coil structure 32 is composed of multiple U-shaped bends connected in series.

[0034] By extending the flow path of the cooling medium, the heat exchange intensity with the central region of the substrate glass 2 is enhanced, enabling targeted cooling of key areas and significantly improving the cooling capacity of the high-temperature central region of the substrate glass 2. This helps to quickly reduce the central temperature and narrow the lateral temperature difference.

[0035] Preferably, the angle between the reciprocating coil structure 32 and the substrate glass 2 is adjustable from 0 to 90°. When the reciprocating coil structure 32 is parallel to the downward direction of the substrate glass 2, the angle between the reciprocating coil structure 32 and the substrate glass 2 is 0°, and the cooling radiation area is the largest. When the reciprocating coil structure 32 is perpendicular to the downward direction of the substrate glass 2, the angle between the reciprocating coil structure 32 and the substrate glass 2 is 90°, and the cooling radiation area is the smallest.

[0036] By changing the relative orientation of the reciprocating coil structure 32 and the substrate glass 2, the effective projected area of ​​its thermal radiation is adjusted, thereby controlling the cooling intensity and the area of ​​action, realizing dynamic regulation, improving the process response speed and control accuracy, and enhancing the adaptability to different temperature distribution patterns.

[0037] Preferably, the rotating fixing device includes a clamping seat and a locking element. The clamping seat is fixedly installed on the furnace body steel structure 4. One end of the cooling pipe assembly 3 passes through the interior of the clamping seat. When the cooling pipe assembly 3 is rotated to a preset angle, it is locked and fixed by the locking element.

[0038] The clamping seat provides support and guidance, while the locking element applies radial pressure to achieve positioning and fixation, ensuring that the cooling pipe does not shift during operation, guaranteeing stability after rotational adjustment, avoiding cooling deviation due to loosening, and improving the long-term reliability of the system.

[0039] Preferably, the locking element is a nut.

[0040] See Figure 8 and Figure 9 Preferably, the rotating fixing device includes an angle plate 5, a rotating handle 6, and a positioning pin 62. The angle plate 5 is fixedly mounted on the furnace body steel structure 4. Several positioning holes 52 corresponding to the angle are arranged along the circumference of the angle plate 5. One end of the cooling pipe assembly 3 passes through the center of the angle plate 5. The fixed end of the rotating handle 6 is fixedly connected to the fixed end of the rotating handle 6. The movable end of the rotating handle 6 is provided with a handle 61. A through hole is provided between the handle 61 and the fixed end. When the cooling pipe assembly 3 is rotated to a preset angle by rotating the handle 6, the positioning pin 62 passes through the through hole and the positioning hole 52 in sequence to achieve locking and fixing.

[0041] By rotating the cooling tube assembly 3, the angle between the reciprocating coil structure 32 and the substrate glass 2 can be changed, which is essentially equivalent to changing the effective projected area of ​​the reciprocating coil structure 32 in the middle of the substrate glass 2. This allows for continuous and precise adjustment of the cooling intensity in the middle region. Operators can easily and quickly rotate the handle 6 to a preset angle and lock it with the positioning pin 62 to achieve "stepless control" of the cooling intensity, greatly improving the device's adaptability to different process conditions and the accuracy of control.

[0042] In a specific embodiment of the present invention, the angle plate 5 is provided with scale lines 51 corresponding to the positioning holes. The angle plate 5 is directly fixed to the furnace body steel structure 4, and the rotating handle 6 is fixed to the cooling pipe assembly 3. The cooling pipe assembly 3 is rotated by the handle 61. When it is rotated to the corresponding scale line 51, the positioning pin 62 is inserted through the through hole into the corresponding positioning hole 52, thereby fixing the working angle of the cooling pipe assembly 3.

[0043] The present invention also provides a method for adjusting the temperature field during the molding of overflow-type substrate glass, using the overflow-type substrate glass 2 molding temperature field adjustment device as described above, including the following steps: According to the lateral cooling requirements of the substrate glass 2, the angle between the reciprocating coil structure 32 and the substrate glass 2 is changed by adjusting the rotation angle of each cooling pipe assembly 3 relative to the substrate glass 2, so as to control the heat radiation coverage and cooling intensity of the middle and edge areas of the substrate glass 2. Cooling medium is introduced into the cooling pipe assembly 3 to adjust the forming temperature field of the overflow substrate glass 2. The reciprocating coil structure 32 is used to exchange heat in the middle of the substrate glass 2, and the thermal insulation structure 31 is used to suppress excessive cooling of the edge of the substrate glass 2.

[0044] In practice, the first step is to use the lateral temperature distribution data of the substrate glass 2 obtained from an online infrared thermometer to determine whether there is overheating in the center or undercooling at the edges. If the temperature in the center is found to be too high, the cooling pipes at the corresponding height are rotated to the 0°–45° range to enhance radiative cooling; at the same time, it is confirmed that the edge insulation blocks are properly covered to prevent excessive heat dissipation. The cooling system is then turned on, and cooling air or cooling water is introduced, with the flow rate automatically adjusted according to the process settings. Temperature changes are continuously monitored throughout the entire board introduction process, and the angle can be finely adjusted for compensation at any time.

[0045] By combining real-time temperature feedback with the adjustable characteristics of the device, a closed-loop control process of "sensing-decision-execution" is formed, realizing dynamic temperature control based on measured data, significantly improving the uniformity of the temperature field, and reducing the incidence of product warping and stress defects.

[0046] Preferably, the cooling medium is cooling water.

[0047] When rapid reduction of glass temperature is required or to cope with sudden high-temperature situations, cooling water is a more effective cooling method due to its high specific heat capacity and high heat exchange efficiency. Utilizing water's high specific heat capacity, it efficiently absorbs radiant heat from the glass, achieving a strong cooling effect and meeting high-intensity cooling demands. It is suitable for rapid shaping during startup or under high-temperature conditions.

[0048] Preferably, the cooling medium is cooling air.

[0049] By using air as a heat transfer medium to remove heat and controlling the cooling power by adjusting the airflow rate, the risk of rapid cooling cracking that may occur with water cooling is avoided, making it suitable for flexible temperature control under sensitive operating conditions.

[0050] Preferably, by changing the angle between the reciprocating coil structure 32 and the substrate glass 2 to 45°~0°, the heat radiation coverage and cooling intensity of the middle and edge regions of the substrate glass 2 are enhanced; by changing the angle between the reciprocating coil structure 32 and the substrate glass 2 to 45°~90°, the heat radiation coverage and cooling intensity of the middle and edge regions of the substrate glass 2 are weakened.

[0051] By continuously changing the angle, the cooling intensity can be steplessly adjusted, forming a dynamic configuration of "strong cooling zone" and "weak cooling zone", which improves the precision of temperature field control, supports the realization of complex process curves, and enhances the intelligent operation capability of the system.

[0052] In a specific embodiment of the present invention, the present invention provides an irregularly shaped cooling pipe assembly 3, wherein the region of the cooling pipe assembly 3 relative to the middle of the substrate glass 2 is a reciprocating coil structure 32, which can achieve different cooling effects on the middle and the edge of the substrate glass 2 through the cooling pipe. The cooling pipe assembly 3 has a rotation function relative to the substrate glass 2 to achieve different cooling effects on the middle and the edge of the substrate glass 2. By rotating the cooling pipe assembly 3 relative to the substrate glass 2, the lateral differential distribution can be overcome by different radiation angles, that is, to achieve the purpose of uniform lateral temperature distribution during the molding of the substrate glass 2.

[0053] like Figure 3 This is a schematic diagram of the overall structure. The cooling pipe assembly 3 is installed at different heights on the furnace body steel structure 4, and on both sides of the overflow brick 1, at a certain distance from the substrate glass 2. Figure 4 As shown, cooling air or water flows through the cooling pipe assembly 3 in the direction of the arrow. The first side 21 and the second side 22 of the cooling pipe assembly 3 are provided with heat insulation boxes through which the cooling pipe assembly 3 passes. The first side 21 and the second side 22 are symmetrically distributed along their length. The middle part of the cooling pipe assembly 3 is designed as a coil structure so that it can fully exchange heat with the glass at high temperature and reduce the temperature of the corresponding position of the substrate glass 2.

[0054] Figure 5 , Figure 6 , Figure 7 Different combinations of methods are used to address different temperature distributions in the substrate glass 2, ultimately achieving uniform lateral temperature. Figure 5 The middle coils of the two sets of cooling pipe assemblies 3 shown are placed horizontally, with an angle of 90° relative to the substrate glass 2, and the cooling radiation area relative to the substrate glass 2 is the smallest. Figure 6The upper cooling pipe assembly 3 is rotated so that the middle part is at an angle of 0° relative to the substrate glass 2, while the lower cooling pipe assembly 3 is placed horizontally. The purpose is to increase the cooling effect of the upper part relative to the substrate glass 2. Figure 7 The upper cooling pipe assembly 3 is rotated 45°, with an angle of 45° relative to the substrate glass 2, and the lower cooling pipe assembly 3 is rotated 90°, with an angle of 0° relative to the substrate glass 2. This can increase the cooling effect of the lower cooling pipe relative to the substrate glass 2. In actual production, various combinations of rotation angles can be used to adjust the temperature distribution of the substrate glass 2 according to different temperature distributions.

[0055] Multiple sets of cooling pipe assembly 3 can be installed. In actual production, they can be combined and adjusted according to the different temperature adjustment requirements of the substrate glass 2. That is, combinations with different rotation angles and different installation quantities can be used. The cooling effect on the substrate glass 2 is different according to the radiation area and distance of the cooling pipe coil relative to the substrate glass 2, so as to achieve the purpose of cooling different parts of the substrate glass 2.

[0056] When the substrate glass 2 flows down from the overflow brick 1, it needs to be rapidly cooled and shaped. Due to the structural characteristics of the equipment itself, the temperature distribution of the substrate glass 2 is generally as follows: Figure 2 The design features a high center and low ends. Multiple sets of cooling pipe assemblies 3 are installed on both sides of the substrate glass 2 below the overflow brick 1, with thermal insulation structures 31 at both ends. The cooling pipe assemblies 3 are inserted into the furnace steel structure 4 and can rotate relative to the substrate glass 2. The reciprocating coil structure 32 in the middle of the cooling pipe assembly corresponds to the middle 23 of the substrate glass 2, and the thermal insulation structure 31 corresponds to the first edge 21 and the second edge 22 of the substrate glass 2. When cooling air or water flows in and out along the outside 33 of the cooling pipe assembly, the temperature of the corresponding first edge 21 and second edge 22 of the substrate glass 2 is less affected by the thermal insulation structure 31. However, the reciprocating coil structure 32 in the middle of the cooling pipe assembly allows for sufficient heat exchange between the cooling air or water and the middle substrate glass 2, significantly reducing its temperature and achieving the goal of lowering the temperature of the middle 23 of the substrate glass 2.

[0057] Implementation Method 1: Small Temperature Adjustment Range for Substrate Glass 2 In a specific embodiment of the present invention, such as Figure 5As shown, an overflow method substrate glass 2 forming temperature field adjustment device includes two sets of cooling pipe assemblies 3. The cooling pipe assemblies 3 are distributed on both sides of the substrate glass 2 and penetrate the furnace body steel structure 4. The area of ​​the cooling pipe assembly 3 corresponding to the middle 23 of the substrate glass 2 is set as a reciprocating coil structure, and the area of ​​the cooling pipe assembly 3 corresponding to the edge of the substrate glass 2 is a tubular structure. A heat insulation structure 31 is provided at one end of the tubular structure near the reciprocating coil structure 32. The two ends of the cooling pipe assembly 3 penetrate the furnace body steel structure 4 through a rotating fixing device to adjust the angle between the reciprocating coil structure 32 and the substrate glass 2. Two sets of cooling pipe assemblies 3 are arranged in layers along the downward direction of the substrate glass 2. The cooling pipe assembly 3 located in the upper layer is the first height cooling pipe assembly 3A, and the cooling area corresponding to the first height cooling pipe assembly 3A is the first cooling area 321. The cooling pipe assembly 3 located in the lower layer is the second height cooling pipe assembly 3B, and the second cooling area corresponding to the second height cooling pipe assembly 3B is 322. The area of ​​the first height cooling pipe assembly 3A corresponding to the middle 23 of the substrate glass 2 is set as a horizontally placed first reciprocating coil structure 32A, and the area of ​​the second height cooling pipe assembly 3B corresponding to the middle 23 of the substrate glass 2 is set as a horizontally placed second reciprocating coil structure 32B. At this time, the angle between the reciprocating coil structure and the downward flow direction of the substrate glass 2 is 90°, and the radiation influence area on the substrate glass 2 is minimized, that is, the temperature field adjustment of the substrate glass 2 is relatively gentle.

[0058] Implementation Method 2: The upper part of the substrate glass 2 requires rapid cooling. In a specific embodiment of the present invention, such as Figure 6 As shown, the difference from Embodiment 1 is that when the upper part of the substrate glass 2 needs to be cooled down quickly, the first height cooling pipe assembly 3A is rotated so that the angle between its first reciprocating coil structure 32A and the substrate glass 2 is adjusted to 0°, so that the first reciprocating coil structure 32A of the entire first height cooling pipe assembly 3A is facing the substrate glass 2. At this time, the radiation influence area relative to the substrate glass 2 is the largest, which can achieve rapid cooling of the upper part of the substrate glass 2.

[0059] Implementation Method 3: Other Combinations In a specific embodiment of the present invention, such as Figure 7 As shown, the difference from Embodiment 1 is that, depending on the actual cooling area required by the substrate glass 2, the angles between the first height cooling pipe assembly 3A and the second height cooling pipe assembly 3B and the substrate glass 2 are rotated to achieve the cooling effect on different areas of the substrate glass 2. In the figure, the angle between the first reciprocating coil structure 32A of the upper first height cooling pipe assembly 3A and the substrate glass 2 is 45°, and the angle between the second reciprocating coil structure 32B of the lower second height cooling pipe assembly 3B and the substrate glass 2 is 0°. At this time, the cooling effect on the lower part of the substrate glass 2 is obvious.

[0060] The above implementation methods are only illustrated with examples of several cooling pipe assemblies. In actual production, various combinations can be used for adjustment. Compared with the original technology, it is more adaptable and simpler to operate.

[0061] Finally, it should be noted that the embodiments listed above are merely one or more specific manifestations of the technical solution of this invention. Their purpose is to clearly illustrate the concept, principle, and application of this invention through specific examples, and is by no means intended to limit the scope of protection of this invention to these specific embodiments. In fact, the true value of this invention lies in its proposed technical ideas and innovations, rather than its manifestations or implementation methods.

[0062] For those skilled in the art, after thoroughly reading and understanding the technical solution of this invention, they are fully capable of making various changes, modifications, or equivalent substitutions to the specific implementation of the invention based on their own professional knowledge and skills. These changes may include, but are not limited to: adjusting the range of technical parameters, optimizing the algorithm flow to improve efficiency, and replacing some technical components to achieve better compatibility or reduce costs. As long as these modified technical solutions substantially retain the technical features claimed by the original invention, that is, they can still achieve the core functions and effects of this invention, then these changes should be considered to fall within the scope of protection of the pending claims of this invention.

[0063] Furthermore, with the continuous progress and development of technology, new technical means and methods are constantly emerging, which provides ample space for further improvement and perfection of this invention. Therefore, the scope of protection of this invention should also include reasonable and foresightful improvements and extensions based on existing technology. As long as these improvements and extensions do not depart from the basic principles and core concepts of this invention, they should be considered equivalents of this invention and are equally protected by patent rights.

Claims

1. A device for adjusting the temperature field during overflow-method substrate glass forming, characterized in that, It includes at least one set of cooling pipe assemblies (3), which are distributed on both sides of the substrate glass (2) and penetrate the furnace steel structure (4). Among them, the area of ​​the cooling pipe assembly (3) corresponding to the middle (23) of the substrate glass (2) is set as a reciprocating coil structure (32), and the area of ​​the cooling pipe assembly (3) corresponding to the edge of the substrate glass (2) is a tubular structure. A heat insulation structure (31) is provided on the tubular structure near the reciprocating coil structure (32). The two ends of the cooling pipe assembly (3) pass through the furnace steel structure (4) through a rotating fixing device to adjust the angle between the reciprocating coil structure (32) and the substrate glass (2).

2. The overflow method substrate glass forming temperature field adjustment device according to claim 1, characterized in that, Multiple sets of cooling pipe assemblies (3) are arranged in layers along the downward direction of the substrate glass (2).

3. The overflow method substrate glass forming temperature field adjustment device according to claim 1, characterized in that, The reciprocating coil structure (32) is composed of multiple U-shaped bends connected in series.

4. The overflow method substrate glass forming temperature field adjustment device according to claim 1, characterized in that, The angle between the reciprocating coil structure (32) and the substrate glass (2) can be adjusted from 0 to 90°. When the reciprocating coil structure (32) is parallel to the downward direction of the substrate glass (2), the angle between the reciprocating coil structure (32) and the substrate glass (2) is 0°, and the cooling radiation area is the largest. When the reciprocating coil structure (32) is perpendicular to the downward direction of the substrate glass (2), the angle between the reciprocating coil structure (32) and the substrate glass (2) is 90°, and the cooling radiation area is the smallest.

5. The overflow method substrate glass forming temperature field adjustment device according to claim 1, characterized in that, The rotating fixing device includes a clamping seat and a locking element. The clamping seat is fixedly installed on the furnace body steel structure (4). One end of the cooling pipe assembly (3) passes through the interior of the clamping seat. When the cooling pipe assembly (3) is rotated to a preset angle, it is locked and fixed by the locking element.

6. The overflow method substrate glass forming temperature field adjustment device according to claim 1, characterized in that, The rotating fixing device includes an angle plate (5), a rotating handle (6) and a positioning pin (62). The angle plate (5) is fixedly installed on the furnace steel structure (4). Several positioning holes (52) corresponding to the angle are arranged along the circumference of the angle plate (5). One end of the cooling pipe assembly (3) passes through the center of the angle plate (5). The fixed end of the rotating handle (6) is fixedly connected to the end of the side. The movable end of the rotating handle (6) is provided with a handle (61). A through hole is provided between the handle (61) and the fixed end. When the cooling pipe assembly (3) is rotated to the preset angle by rotating the handle (6), the positioning pin (62) passes through the through hole and the positioning hole (52) in sequence to achieve locking and fixing.

7. A method for adjusting the temperature field during overflow-type substrate glass forming, characterized in that, The overflow method substrate glass forming temperature field adjustment device as described in any one of claims 1 to 6 includes the following steps: According to the lateral cooling requirements of the substrate glass (2), by adjusting the rotation angle of each cooling pipe assembly (3) relative to the substrate glass (2), the angle between the reciprocating coil structure (32) and the substrate glass (2) is changed, so as to control the heat radiation coverage and cooling intensity of the middle (23) and edge areas of the substrate glass (2). Cooling medium is introduced into the cooling pipe assembly (3) to adjust the forming temperature field of the overflow substrate glass (2). The reciprocating coil structure (32) is used to exchange heat in the middle (23) of the substrate glass (2). The excessive cooling of the edge of the substrate glass (2) is suppressed by the heat insulation structure (31).

8. The overflow method substrate glass forming temperature field adjustment device according to claim 7, characterized in that, The cooling medium is cooling air.

9. The overflow method substrate glass forming temperature field adjustment device according to claim 7, characterized in that, The cooling medium is cooling water.

10. The overflow method substrate glass forming temperature field adjustment device according to claim 7, characterized in that, By changing the angle between the reciprocating coil structure (32) and the substrate glass (2) to 45°~0°, the heat radiation coverage and cooling intensity of the middle (23) and edge regions of the substrate glass (2) are enhanced; by changing the angle between the reciprocating coil structure (32) and the substrate glass (2) to 45°~90°, the heat radiation coverage and cooling intensity of the middle (23) and edge regions of the substrate glass (2) are weakened.

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