Source bottle, gas inlet system and semiconductor coating apparatus

Abstract

This application relates to the field of semiconductor fabrication technology, and discloses a source bottle, including a bottle body, a partition, and a first heating component. The bottle body has a vacuum-structured wall; the partition is disposed inside the bottle body to separate multiple evaporation zones for holding liquid sources and a gas diffusion zone located above the evaporation zones; wherein the partition wall is a vacuum-structured wall; the first heating component is disposed within the vacuum structure of the bottle body and the partition, so that the liquid source in each evaporation zone can evaporate and vaporize and flow to the gas diffusion zone. This effectively increases the heating area of ​​the liquid source, allowing the liquid source to evaporate fully, ensuring a stable output of process gas and improving the subsequent coating effect. This application also discloses an inlet system and semiconductor coating equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, such as a source bottle, an inlet system, and a semiconductor coating apparatus. Background Technology

[0002] Currently, atomic layer deposition (ALD) technology can separately introduce two or more process gases into the reaction chamber, allowing each process gas to undergo a fully saturated surface chemical reaction on the substrate surface, and then be deposited on the substrate surface in the form of a single-atom film. The source bottle, acting as an evaporator to hold the liquid source, allows the liquid source to evaporate into the corresponding process gas, which is then transported into the reaction chamber.

[0003] In related technologies, to ensure sufficient evaporation of process gas in the source bottle, a heating device is typically wrapped around the outside of the source bottle to fully evaporate the liquid source inside. For example, a source bottle heater provided in related technologies includes a heating element comprising an upper arc-shaped heating plate, a lower arc-shaped heating plate, and a cylindrical heating plate, all of which are attached in combination to the outer surface of the source bottle.

[0004] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0005] While the above methods can effectively evaporate the liquid source, heating only the outer shell of the source bottle only heats the external area of ​​the liquid source, which may result in incomplete evaporation and low utilization of the liquid source. In addition, during the continuous intake and exhaust of gas in the source bottle, unstable pressure may occur, or even the process gas may not be output stably, thus affecting the subsequent coating effect.

[0006] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0007] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0008] This disclosure provides a source bottle, an inlet system, and a semiconductor coating apparatus, which can effectively increase the heating area of ​​the liquid source, allowing the liquid source to evaporate fully, thereby ensuring a stable output of process gas and improving the subsequent coating effect.

[0009] In some embodiments, the source bottle includes a bottle body, a partition, and a first heating assembly. The bottle body has a vacuum structure for its walls; the partition is disposed inside the bottle body to separate multiple evaporation zones for holding liquid sources and a gas diffusion zone located above the evaporation zones; wherein the partition wall is a vacuum structure; the first heating assembly is disposed within the vacuum structure of the bottle body and the partition to enable the liquid source in each evaporation zone to evaporate and vaporize and flow to the gas diffusion zone.

[0010] In some embodiments, the heating surface of the first heating component abuts against the inner wall and plate wall of the bottle wall, and has a set distance from the outer wall of the bottle wall.

[0011] In some embodiments, a liquid inlet structure is provided at the bottom of the bottle body. The liquid inlet structure includes a liquid inlet pipe and a first valve body. The liquid inlet pipe has a liquid inlet and a liquid outlet disposed on each evaporation zone side, so as to input liquid source to each evaporation zone through the liquid inlet pipe; the first valve body is disposed on the liquid inlet pipe to control the liquid flow rate of the liquid inlet pipe.

[0012] In some embodiments, the bottom of the evaporation zone is a spherical surface structure, wherein the outlet of the liquid inlet pipe is located on the spherical surface.

[0013] In some embodiments, a distribution chamber is also provided on the liquid inlet pipeline so that an equal amount of liquid source can be uniformly input into each evaporation zone through the distribution chamber.

[0014] In some embodiments, the source bottle further includes: a base, with the bottle body fixedly disposed on the base; wherein, the inlet of the liquid inlet pipeline is disposed on the base, and a second heating component for heating the liquid inlet pipeline is also disposed on the base.

[0015] In some embodiments, an air inlet structure and an air outlet structure are further provided at the top of the bottle body; wherein, the air outlet structure includes an air outlet pipe, a third valve body, and a third heating component. The air outlet pipe includes a first air outlet pipe section disposed on the outside of the bottle body and a second air outlet pipe section disposed in the gas diffusion zone; wherein, a first opening is provided at the bottom of the second air outlet pipe section, and a second opening facing the air inlet structure is provided on the side of the second air outlet pipe section; the third valve body is disposed in the first air outlet pipe section to control the gas flow rate of the air outlet pipe; the third heating component is disposed in the first air outlet pipe section and / or the second air outlet pipe section to heat the air outlet pipe.

[0016] In some embodiments, the source bottle further includes a barometric thermometer, the detection end of which is located in the gas diffusion region and between the outlet of the inlet structure and the first opening of the outlet structure.

[0017] In some embodiments, the air intake structure includes an air intake pipe, a second valve body, and a second heating assembly. The air intake pipe includes a first air intake pipe section disposed on the outside of the bottle body and a second air intake pipe section disposed in the gas diffusion zone; the second valve body is disposed on the first air intake pipe section to control the gas flow rate of the air intake pipe; the second heating assembly is disposed on the first air intake pipe section and / or the second air intake pipe section to heat the air intake pipe.

[0018] In some embodiments, the air intake system includes a source bottle as described in the foregoing embodiments.

[0019] In some embodiments, the semiconductor coating apparatus includes a source bottle as described in the foregoing embodiments or an air intake system as described in the foregoing embodiments.

[0020] The source bottle, air intake system, and semiconductor coating equipment provided in this disclosure can achieve the following technical effects:

[0021] The interior of the bottle is divided into multiple evaporation zones for holding the liquid source by partitions, and both the bottle wall and the partition walls are equipped with first heating components. This effectively increases the contact area between the first heating components and the liquid source, allowing for complete evaporation and improving the utilization rate of the liquid source. Furthermore, both the bottle wall and the partition walls are vacuum structures, minimizing heat loss and maintaining a stable temperature throughout the bottle. This ensures a stable output of process gas and improves subsequent coating effects.

[0022] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0023] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0024] Figure 1 This is a schematic diagram of the structure of a source bottle provided in an embodiment of this disclosure;

[0025] Figure 2 This is a schematic diagram of another source bottle provided in an embodiment of this disclosure;

[0026] Figure 3 yes Figure 2 Schematic diagram of the cross section at point AA;

[0027] Figure 4 This is a schematic diagram of the internal structure of a source bottle provided in an embodiment of this disclosure;

[0028] Figure 5 This is a schematic diagram of the exploded structure of a source bottle provided in an embodiment of this disclosure;

[0029] Figure 6 yes Figure 2 Schematic diagram of the cross section at point BB;

[0030] Figure 7 yes Figure 2 A cross-sectional view at point CC.

[0031] Figure label:

[0032] 10: Bottle body; 11: Evaporation zone; 12: Gas diffusion zone;

[0033] 20: partition;

[0034] 30: First heating component;

[0035] 40: Liquid inlet structure; 41: Liquid inlet pipeline; 411: Liquid inlet; 412: Liquid outlet; 413: Distribution chamber;

[0036] 50: Base; 51: Second heating element;

[0037] 60: Intake structure; 61: Intake pipe; 611: First intake pipe section; 612: Second intake pipe section; 62: Second valve body; 63: Third heating component;

[0038] 70: Exhaust structure; 71: Exhaust pipe; 711: First exhaust pipe section; 712: Second exhaust pipe section; 7121: First opening; 7122: Second opening; 72: Third valve body; 73: Third heating component;

[0039] 80: Barometric thermometer. Detailed Implementation

[0040] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0041] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0042] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this disclosure according to the specific circumstances.

[0043] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0044] Unless otherwise stated, the term "multiple" means two or more.

[0045] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0046] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0047] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0048] Currently, traditional thin film deposition technologies, including Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD), are no longer able to effectively and precisely control film properties and meet increasingly stringent process requirements in some key production steps. Therefore, ALD (Alternating Deposition) demonstrates unique properties such as forming high-quality, pinhole-free, and conformal films on non-planar complex structures and three-dimensional surfaces.

[0049] Currently, atomic layer deposition (ALD) technology, as one of the most advanced thin film deposition technologies, has been widely used in advanced manufacturing industries such as microelectronics, displays, MEMS, sensors, and photovoltaic cells. With the continuous development of modern science and technology, its applications will continue to expand in the near future.

[0050] In the ALD process, the source bottle, as the evaporation vessel carrying the liquid source, is crucial for the film formation effect. Related technologies use heating belts or zone heating to achieve stable vapor output. However, due to poor heating uniformity, this can lead to unstable internal temperature in the source bottle, potentially resulting in incomplete evaporation and unvaporized droplets entering the gas delivery pipeline, thus affecting subsequent coating effects.

[0051] Combination Figures 1 to 7 As shown, this embodiment of the present disclosure provides a source bottle, including a bottle body 10, a partition 20, and a first heating assembly 30. The bottle body 10 has a vacuum structure for its walls; the partition 20 is disposed inside the bottle body 10 to separate multiple evaporation zones 11 for holding liquid sources and a gas diffusion zone 12 located above the evaporation zones 11; wherein, the walls of the partition 20 have a vacuum structure; the first heating assembly 30 is disposed within the vacuum structure of the bottle body 10 and the partition 20, so that the liquid source in each evaporation zone 11 can evaporate and vaporize and flow to the gas diffusion zone 12.

[0052] Using the source bottle provided in this embodiment, the interior of the bottle body 10 is divided into multiple evaporation zones 11 for holding the liquid source by a partition 20. Both the bottle wall of the bottle body 10 and the partition wall 20 are equipped with first heating components. This effectively increases the contact area between the first heating components and the liquid source, allowing the liquid source to fully evaporate and flow to the gas diffusion zone 12, thereby improving the utilization rate of the liquid source. Furthermore, since both the bottle wall of the bottle body 10 and the partition wall 20 are vacuum structures, heat loss is minimized, ensuring that all areas within the bottle body 10 maintain a stable temperature, guaranteeing a stable output of process gas and improving subsequent coating effects.

[0053] In this embodiment, both the bottle wall of the bottle body 10 and the partition wall of the partition 20 are double-layered structures. An air extraction device is used to remove the air from their interiors, creating a vacuum between the bottle wall and the partition wall. Here, the walls of the bottle body 10 and the partition 20 can be made of stainless steel, which is resistant to corrosion from weak corrosive media such as air, steam, and water. Furthermore, the stainless steel outer shell is sturdy and durable, and can effectively resist impacts.

[0054] In this embodiment of the disclosure, the walls of the bottle body 10 and the partition 20 have a certain thickness, or a corresponding support structure is provided inside the bottle wall and the partition wall to prevent the air pump from drawing out the air inside and causing deformation of the bottle wall and the partition wall.

[0055] In this embodiment, the partition 20 can divide the interior of the bottle 10 into multiple evaporation zones 11. Optionally, the partition 20 can be a common flat plate structure, thus dividing the interior into two evaporation zones 11. Optionally, the partition 20 can be a cross-shaped plate structure, thus dividing the interior into four evaporation zones 11. Here, the structure and form of the partition 20 are not limited.

[0056] Since the partition 20 is located inside the bottle body 10, with the first heating component 30 installed, it is equivalent to heating both the inside and outside of the bottle body 10 simultaneously, thus enabling more effective evaporation of the liquid source.

[0057] In this embodiment, the height of the partition 20 is lower than the height of the bottle body 10, and the area above the partition 20 is the gas diffusion zone 12. In this way, the gas in each evaporation zone 11 enclosed by the partition 20 can gather towards the gas diffusion zone 12.

[0058] In this embodiment, the bottle body 10 and the partition 20 can be an integral structure, meaning the bottle wall and the partition wall are connected, which facilitates the placement of the first heating component 30. The first heating component 30 primarily heats the source bottle through heat conduction. Therefore, both the bottle wall of the bottle body 10 and the partition wall of the partition 20 are vacuum structures. After the first heating component 30 heats the bottle to the target temperature, heat loss is minimized, ensuring that all areas within the bottle body 10 maintain a stable temperature.

[0059] In some embodiments, the heating surface of the first heating component 30 abuts against the inner wall and plate wall of the bottle wall, and has a set distance from the outer wall of the bottle wall.

[0060] In this embodiment, since the first heating component 30 heats the source bottle mainly through heat conduction, the heating surface of the first heating component 30 is in direct contact with the bottle wall and plate wall of the evaporation zone 11 and the gas diffusion zone 12. In this way, the heat can be released completely into the bottle to the maximum extent.

[0061] In this embodiment of the present disclosure, the first heating component 30 is at a set distance from the outer wall of the bottle. In this way, under vacuum conditions, its thermal conductivity is poor, which can prevent the heat of the first heating component 30 from being lost from the outer wall of the bottle.

[0062] In some alternative embodiments, the first heating component 30 can be an electric heating rod, which abuts against the inner wall and plate wall of the bottle. The electric heating rod generates heat after being energized, so the heat can be directly transferred to the interior of the bottle 10.

[0063] In some alternative embodiments, the first heating component 30 is an electric heating element. The electric heating element is made of nickel-chromium alloy and can generate heat when energized. Therefore, the heat can be directly transferred to the interior of the bottle 10.

[0064] In some alternative embodiments, the first heating component 30 includes an electric heating wire, which can heat the bottle body 10. Because of its filamentous structure, the electric heating wire is easy to install in a vacuum space. Here, the electric heating wire is wound around the inner wall and plate wall of the bottle. Wrapping allows the electric heating wire to be fixed to the inner wall and plate wall of the bottle, and to have more contact with them, facilitating rapid heat transfer.

[0065] Optionally, when the heating wire is wound around the plate wall and the partition 20 is a cross plate, two sets of heating wires can be provided inside the plate wall of the partition 20. One set of heating wires contacts the two side plates of the vertical plate, and the other set of heating wires contacts the two side plates of the horizontal plate. In this way, on the one hand, the use of heating wires is saved, and on the other hand, the heat of the heating wires can be quickly transferred to the evaporation zone 11.

[0066] Combination Figures 2 to 7 As shown, in some embodiments, a liquid inlet structure 40 is provided at the bottom of the bottle body 10. The liquid inlet structure 40 includes a liquid inlet pipe 41 and a first valve body. The liquid inlet pipe 41 has a liquid inlet 411 and a liquid outlet 412 provided on each evaporation zone 11 side, so as to input liquid source to each evaporation zone 11 through the liquid inlet pipe 41; the first valve body is provided on the liquid inlet pipe 41 to control the liquid flow rate of the liquid inlet pipe 41.

[0067] In this embodiment, to facilitate the replenishment of liquid sources to the evaporation zone 11 of the bottle 10, a liquid inlet structure 40 is provided at the bottom of the bottle 10. Specifically, the liquid inlet pipe 41 is provided with an inlet 411 and an outlet 412. To facilitate the input of liquid sources to multiple evaporation zones 11, an outlet 412 is provided on each evaporation zone 11, so that after the liquid source is input from the inlet 411, it can flow into the evaporation zone 11 from the outlet 412.

[0068] In this embodiment of the present disclosure, in order to facilitate the control of the liquid flow rate of the liquid inlet pipe 41, a first valve body is provided on the liquid inlet pipe 41. The first valve body can adjust the corresponding opening degree to make the liquid flow rate entering the liquid inlet pipe 41 different.

[0069] In this embodiment, a corresponding one-way valve is also provided at the outlet 412 to limit the flow direction from the inlet 411 to the outlet 412.

[0070] Combination Figure 4 , Figure 6 and Figure 7 As shown, in some embodiments, the bottom of the evaporation zone 11 is a spherical surface structure, wherein the liquid outlet 412 of the liquid inlet pipe 41 is located on the spherical surface.

[0071] In this embodiment, to improve the utilization rate of the liquid source, the bottom of the evaporation zone 11 is spherical. This allows more unevaporated liquid to flow to the bottom of the evaporation zone 11 in a timely manner, thus enabling further heating and evaporation. The outlet 412 of the liquid inlet pipe 41 is located on the spherical surface, preventing liquid entering from the inlet pipe 41 from dripping onto the liquid surface, thus avoiding liquid level fluctuations. Furthermore, if the temperature of the liquid source inside the inlet pipe 41 is low, it will not affect the already evaporated process gas above.

[0072] Combination Figure 4 , Figure 6 and Figure 7 As shown, in some embodiments, a distribution cavity 413 is also provided on the liquid inlet pipe 41 so that an equal amount of liquid source can be uniformly input into each evaporation zone 11 through the distribution cavity 413.

[0073] In this embodiment, since liquid sources need to be input into each evaporation zone 11, if the liquid source input flow rates of each evaporation zone 11 are inconsistent, there may be more liquid source in one evaporation zone 11 and less liquid source in another, thus affecting the evaporation effect. Therefore, to ensure that the liquid source in each evaporation zone 11 is equal, a distribution chamber 413 is provided on the liquid inlet pipe 41. In this way, the liquid source in the liquid inlet pipe 41 will pass through the distribution chamber 413 and then be evenly distributed to each liquid outlet 412, thereby ensuring that the liquid source in each evaporation zone 11 is the same.

[0074] Combination Figure 1 and Figure 7 As shown, in some embodiments, the source bottle further includes: a base 50, and the bottle body 10 is fixedly disposed on the base 50; wherein, the inlet 411 of the liquid inlet pipe 41 is disposed on the base 50, and a second heating component 51 for heating the liquid inlet pipe 41 is also disposed on the base 50.

[0075] In this embodiment, the bottle body 10 can be fixedly mounted on the base 50, thereby ensuring the stability of the source bottle. Here, since the liquid inlet pipe 41 is located at the bottom of the bottle body 10, the base 50 can wrap around the liquid inlet pipe 41. At the same time, in order to reduce the temperature difference between the liquid source temperature of the liquid inlet pipe 41 and the liquid source temperature inside the bottle body 10, a second heating component 51 is provided on the base 50, and the second heating component 51 surrounds the liquid inlet pipe 41.

[0076] In this embodiment of the present disclosure, in order to facilitate the connection between external devices and the inlet 411 of the liquid inlet pipeline 41, a groove is provided on the base 50, wherein the inlet 411 is disposed in the groove.

[0077] Combination Figures 2 to 5 As shown, in some embodiments, an air inlet structure 60 and an air outlet structure 70 are further provided on the top of the bottle body 10; wherein, the air outlet structure 70 includes an air outlet pipe 71, a third valve body 72, and a third heating component 73. The air outlet pipe 71 includes a first air outlet pipe section 711 disposed on the outside of the bottle body 10 and a second air outlet pipe section 712 disposed in the gas diffusion zone 12; wherein, a first opening 7121 is provided at the bottom of the second air outlet pipe section 712, and a second opening 7122 facing the air inlet structure 60 is provided on the side of the second air outlet pipe section 712; the third valve body 72 is disposed on the first air outlet pipe section 711 to control the gas flow rate of the air outlet pipe 71 and the internal gas pressure of the bottle body 10; the third heating component 73 is disposed on the first air outlet pipe section 711 and / or the second air outlet pipe section 712 to heat the air outlet pipe 71.

[0078] In this embodiment, the inlet structure 60 can input a corresponding carrier gas into the gas diffusion zone 12 of the bottle 10, and the process gas in the gas diffusion zone 12 can be discharged from the outlet structure 70 side by a corresponding extraction device. The outlet structure 70 includes an outlet pipe 71, which includes a first outlet pipe section 711 and a second outlet pipe section 712. The first outlet pipe section 711 is located on the outside of the bottle 10 and is equipped with a third valve body 72, thus enabling control of the gas flow rate of the outlet pipe 71 and the internal gas pressure of the bottle 10.

[0079] In this embodiment of the present disclosure, if the temperature of the process gas in the gas diffusion zone 12 is low after entering the outlet pipe 71, condensation may occur on the inner wall of the outlet pipe 71, thus forming condensation. Therefore, a third heating component 73 is provided on the first outlet pipe section 711 and / or the second outlet pipe section 712 to heat the outlet pipe 71, so as to avoid condensation of the process gas in the outlet pipe 71 as much as possible.

[0080] In this embodiment of the present disclosure, a first opening 7121 is provided at the bottom of the second outlet pipe section 712, and a second opening 7122 facing the air inlet structure 60 is provided on the side of the second outlet pipe section 712. In this way, the gas flow rate of the outlet pipe 71 and the gas pressure inside the bottle 10 can be effectively increased, so that more process gas can enter the outlet pipe 71 from the first opening 7121 and the second opening 7122.

[0081] In this embodiment, when the extraction device is extracting air and the intake structure 60 is intakeing air, the airflow on the second outlet pipe section 712 side changes abruptly. At this time, if only the first opening 7121 is present, some gas will flow back and forth between the intake structure 60 and the outlet structure. Therefore, a second opening 7122 facing the intake structure 60 is provided on the side of the second outlet pipe section 712, allowing this portion of gas to enter the outlet pipe 71 through the second opening 7122. This effectively increases the flow rate of the process gas discharged.

[0082] Combination Figure 1 and Figure 6 As shown, in some embodiments, the source bottle further includes a barometric thermometer 80, the detection end of which is located in the gas diffusion zone 12 and between the outlet of the inlet structure 60 and the first opening 7121 of the outlet structure 70.

[0083] In this embodiment, a barometric thermometer 80 is used to measure the air pressure and temperature on the side of the gas diffusion zone 12. The sensing end of the barometric thermometer 80 is located between the air outlet of the inlet structure 60 and the first opening 7121 of the outlet structure 70. This allows for further determination of real-time changes in air pressure and temperature, resulting in more accurate detection.

[0084] In some embodiments, the air intake structure 60 includes an air intake pipe 61, a second valve body 62, and a second heating assembly 63. The air intake pipe 61 includes a first air intake pipe section 611 disposed on the outside of the bottle body 10 and a second air intake pipe section 612 disposed in the gas diffusion zone 12; the second valve body 62 is disposed on the first air intake pipe section 611 to control the gas flow rate of the air intake pipe 61 and the internal gas pressure of the bottle body 10; the second heating assembly 63 is disposed on the first air intake pipe section 611 and / or the second air intake pipe section 612 to heat the air intake pipe 61.

[0085] In this embodiment, the air intake structure 60 includes an air intake pipe 61, which includes a first air intake pipe section 611 and a second air intake pipe section 612. The first air intake pipe section 611 is located on the outside of the bottle body 10 and is provided with a second valve body 62, thereby enabling control of the gas flow rate of the air intake pipe 61 and the internal air pressure of the bottle body 10.

[0086] In this embodiment, if the temperature of the carrier gas entering the gas diffusion zone 12 from the inlet pipe 61 is low, it may affect the internal pressure and temperature of the bottle 10. Therefore, a second heating component 63 is provided on the first inlet pipe section 611 and / or the second inlet pipe section 612 to heat the inlet pipe 61, so as to minimize the impact on the internal pressure and temperature of the bottle 10.

[0087] In this embodiment of the present disclosure, one-way valves are provided on both the air inlet pipe 61 and the air outlet pipe 71 to prevent gas backflow.

[0088] In this embodiment, the second heating component 63 and the third heating component 73 can also be constructed using electric heating wires, wound around corresponding pipes to achieve a heating effect. Here, their working principle is the same as that of the first heating component 30, and will not be described again here.

[0089] This disclosure also provides an air intake system, including a source bottle as described in the foregoing embodiments.

[0090] In this embodiment, the air intake system includes the source bottle described above. Referring to the above embodiments, it at least has the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0091] This disclosure also provides a semiconductor coating apparatus, including a source bottle as described in the foregoing embodiments or an air intake system as described in the foregoing embodiments.

[0092] In this embodiment of the disclosure, the semiconductor coating equipment includes the source bottle or air intake system described above. Referring to the above embodiments, it at least has the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0093] In the embodiments disclosed herein, the semiconductor coating equipment includes, but is not limited to, etching equipment, chemical vapor deposition equipment, atomic layer deposition equipment, or physical vapor deposition equipment. However, it should be noted that the coating equipment of this application is not limited to these, and those skilled in the art, after reading the following technical solutions, will obviously be able to apply it to other process equipment.

[0094] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A source bottle, characterized in that, include: The bottle body has a vacuum structure in its walls; A partition is installed inside the bottle to separate multiple evaporation zones for holding liquid sources and a gas diffusion zone located above the evaporation zones; the partition wall is a vacuum structure. The first heating component is located within the vacuum structure of the bottle and partition, so that the liquid source in each evaporation zone can evaporate and vaporize and flow to the gas diffusion zone.

2. The source bottle according to claim 1, characterized in that, The heating surface of the first heating component abuts against the inner wall and plate wall of the bottle, and has a set distance from the outer wall of the bottle.

3. The source bottle according to claim 1, characterized in that, A liquid inlet structure is provided at the bottom of the bottle, and the liquid inlet structure includes: The liquid inlet pipeline has a liquid inlet and a liquid outlet located on the side of each evaporation zone, so as to input liquid source to each evaporation zone through the liquid inlet pipeline; The first valve body is installed in the liquid inlet pipeline to control the liquid flow rate in the liquid inlet pipeline.

4. The source bottle according to claim 3, characterized in that, The bottom of the evaporation zone has a spherical surface structure, and the outlet of the liquid inlet pipe is located on the spherical surface.

5. The source bottle according to claim 3, characterized in that, A distribution chamber is also provided on the liquid inlet pipeline so that an equal amount of liquid source can be evenly supplied to each evaporation zone.

6. The source bottle according to claim 3, characterized in that, Also includes: The base and the bottle body are fixedly mounted on the base; the inlet of the liquid inlet pipe is located on the base, and a second heating component for heating the liquid inlet pipe is also provided on the base.

7. The source bottle according to any one of claims 1 to 6, characterized in that, An air inlet structure and an air outlet structure are also provided at the top of the bottle; the air outlet structure includes: The gas outlet pipe includes a first gas outlet pipe section disposed on the outside of the bottle body and a second gas outlet pipe section disposed in the gas diffusion zone; wherein, a first opening is provided at the bottom of the second gas outlet pipe section, and a second opening facing the gas inlet structure is provided on the side of the second gas outlet pipe section. The third valve body is installed in the first outlet pipe section to control the gas flow rate of the outlet pipe. The third heating component is installed in the first and / or second air outlet pipe sections to heat the air outlet pipes.

8. The source bottle according to claim 7, characterized in that, Also includes: The barometric thermometer has its sensing end located in the gas diffusion zone, between the air outlet of the inlet structure and the first opening of the outlet structure.

9. An intake system, characterized in that, Includes the source bottle as described in any one of claims 1 to 8.

10. A semiconductor coating apparatus, characterized in that, Includes the source bottle as described in any one of claims 1 to 8 or the air intake system as described in claim 9.

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