Indium column deployment method and device, electronic equipment and storage medium

Abstract

This application provides an indium pillar deployment method, apparatus, electronic device, and storage medium. The scheme is as follows: Based on the parallel region between the first and second skeleton lines in the quantum chip layout, a rectangular region satisfying preset conditions is selected as the deployment area; within the deployment area, any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance of half a first preset distance is determined as the first straight line; according to the position of the first straight line, indium pillars are deployed at equal intervals along the first straight line in the deployment area according to a second preset distance; according to the position of the indium pillars on the first straight line, indium pillars are deployed at equal intervals along the second straight line in the deployment area according to a second preset distance; indium pillars located outside the parallel region are discarded. Through the method provided by this application, the densest central deployment of indium pillars in the quantum chip layout can be achieved.

Description

Technical Field

[0001] This application relates to the field of quantum chip fabrication technology, and in particular to an indium pillar deployment method, apparatus, electronic device, and storage medium. Background Technology

[0002] In the layout design of quantum chips, the skeleton lines serve as the baseline for generating coplanar waveguides. To meet the process requirements of quantum chips, a large number of indium pillars need to be deployed between the skeleton lines in the quantum chip layout.

[0003] The deployment of indium pillars described above needs to meet several requirements. For example, the indium pillars need to be centered between adjacent skeleton lines, and the gaps between the deployed indium pillars need to be minimized. Therefore, achieving the densest, centered deployment of indium pillars in the quantum chip layout is particularly important. Summary of the Invention

[0004] The purpose of this application is to provide a method, apparatus, electronic device, and storage medium for deploying indium pillars, so as to achieve the densest, centered deployment of indium pillars in a quantum chip layout. The specific technical solution is as follows:

[0005] This application provides an embodiment of an indium pillar deployment method, the method comprising:

[0006] Based on the parallel region between the first skeleton line and the second skeleton line in the quantum chip layout, a rectangular region that meets the preset conditions is selected as the deployment region, wherein the length of the first right-angled side in the deployment region is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line.

[0007] In the area to be deployed, any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance equal to half a first preset distance is designated as the first straight line. The second right-angled side is perpendicular to the first right-angled side, and the first preset distance is equal to the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars that has been preset;

[0008] Based on the location of the first straight line, indium pillars are deployed at equal intervals along the first straight line in the area to be deployed, according to the second preset distance.

[0009] Based on the position of the indium pillars on the first straight line, indium pillars are deployed at equal intervals on the second straight line in the area to be deployed according to the second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the positions of two adjacent indium pillars on any third straight line in the area to be deployed and its adjacent third straight line. The third straight line includes the first straight line and each second straight line.

[0010] Remove indium pillars located outside the parallel region.

[0011] This application embodiment also provides an indium pillar deployment device, the device comprising:

[0012] The selection module is used to select a rectangular area that meets preset conditions as a deployment area based on the parallel area between the first skeleton line and the second skeleton line in the quantum chip layout. The length of the first right-angled side of the deployment area is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line.

[0013] The determination module is used to determine any straight line in the area to be deployed that is parallel to the line connecting the midpoints of the second right-angled side and is half a first preset distance, as the first straight line. The second right-angled side is perpendicular to the first right-angled side. The first preset distance is √3 / 2 times the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars that is preset.

[0014] The first deployment module is used to deploy indium pillars at equal intervals along the first straight line in the area to be deployed, according to the location of the first straight line and at the second preset distance.

[0015] The second deployment module is used to deploy indium pillars at equal intervals on a second straight line in the area to be deployed, according to the positions of the indium pillars on the first straight line and at a second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the positions of two adjacent indium pillars on any third straight line in the area to be deployed and the adjacent third straight line. The third straight line includes the first straight line and each second straight line.

[0016] The rejection module is used to reject indium pillars located outside the parallel region.

[0017] This application also provides an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus;

[0018] Memory, used to store computer programs;

[0019] When a processor executes a program stored in memory, it implements any of the indium pillar deployment method steps described above.

[0020] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements any of the indium pillar deployment method steps described above.

[0021] This application also provides a computer program product containing instructions that, when run on a computer, cause the computer to perform any of the indium pillar deployment methods described above.

[0022] Beneficial effects of the embodiments in this application:

[0023] The technical solution provided in this application embodiment can determine the deployment area based on the parallel area between the first skeleton line and the second skeleton line, then determine the first straight line in the deployment area, and deploy indium pillars at equal intervals at a second preset distance on the first straight line. Based on the position of the indium pillars on the first straight line, indium pillars are deployed at equal intervals on each second straight line at the same second preset distance, thereby eliminating indium pillars located outside the parallel area.

[0024] In the aforementioned indium pillar deployment process, indium pillars are first deployed along a first straight line at a second preset distance. Then, based on the indium pillars deployed along the first straight line, indium pillars are deployed along a second straight line. Since the distance between the first straight line and the line connecting its midpoint is half of the first preset distance, and there must exist a second straight line in the deployment area that is symmetrical to the first straight line about its midpoint, indium pillars are deployed along both this second and first straight lines, thus achieving the centering requirement for indium pillar deployment. Furthermore, in the deployment area, since an indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting two adjacent indium pillar positions on any third straight line and its adjacent third straight line, and the distance between adjacent straight lines is the first preset distance, i.e. The second preset distance is twice the distance between adjacent indium pillars. Therefore, the distance between any two adjacent indium pillars on any third straight line and the intersection point of adjacent third straight lines on the perpendicular bisector is the preset minimum distance between adjacent indium pillars, i.e., the second preset distance. This ensures that the distance between any two adjacent indium pillars in the deployment area is the second preset distance, achieving the densest deployment requirement of indium pillars. It is evident that the technical solution provided by the embodiments of this application can achieve the densest deployment of indium pillars in the quantum chip layout.

[0025] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a first process for an indium pillar deployment method provided in an embodiment of this application;

[0028] Figure 2 A partial schematic diagram of the quantum chip layout provided in an embodiment of this application;

[0029] Figure 3-a A schematic diagram of the area to be deployed provided in an embodiment of this application;

[0030] Figure 3-b for Figure 3-a The diagram shows the first possible deployment of indium pillars in the area to be deployed.

[0031] Figure 3-c for Figure 3-b A schematic diagram showing the removal of indium pillars in the area to be deployed;

[0032] Figure 3-d for Figure 2 A schematic diagram of indium pillar deployment in the quantum chip layout shown;

[0033] Figure 4 This is a second flowchart illustrating the indium pillar deployment method provided in an embodiment of this application;

[0034] Figure 5 for Figure 3-a The diagram shows a second type of indium pillar deployment in the area to be deployed.

[0035] Figure 6 This is a schematic diagram of a third process for the indium pillar deployment method provided in an embodiment of this application;

[0036] Figure 7 for Figure 3-a The diagram shows a third type of indium pillar deployment in the area to be deployed.

[0037] Figure 8 This is a schematic diagram of the fourth process of the indium pillar deployment method provided in the embodiments of this application;

[0038] Figure 9A schematic flowchart of an indium pillar rejection method provided in an embodiment of this application;

[0039] Figure 10 A schematic diagram of an indium pillar deployment device provided in an embodiment of this application;

[0040] Figure 11 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] In related technologies, with the application of flip-chip bonding technology in quantum chips, quantum chips can adopt a multi-layer design, meaning that a quantum chip is composed of multiple layers of flip-chips. Therefore, in the quantum chip layout design process, in order to ensure ground integrity and adhesion between different chip layers, a large number of indium pillars can be deployed on the quantum chip layout. A known indium pillar structure is composed of indium (In) and titanium nitride (TiN), which can be represented in the form of concentric circles in the quantum chip layout, as shown in the figure below.

[0043] To address the problems in related technologies, embodiments of this application provide an indium pillar deployment method. For example... Figure 1 As shown, Figure 1 This is a schematic flowchart of a first embodiment of the indium pillar deployment method provided in this application. The method can be applied to any electronic device and specifically includes the following steps.

[0044] Step S101: Based on the parallel region between the first skeleton line and the second skeleton line in the quantum chip layout, select a rectangular region that meets the preset conditions as the deployment region, wherein the length of the first right-angled side in the deployment region is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line.

[0045] Step S102: In the area to be deployed, determine any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance equal to half of the first preset distance, as the first straight line. The second right-angled side is perpendicular to the first right-angled side, and the first preset distance is equal to the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars, which is set in advance.

[0046] Step S103: Based on the location of the first straight line, deploy indium pillars at equal intervals along the first straight line in the area to be deployed, according to the second preset distance.

[0047] Step S104: Based on the location of the indium pillars on the first straight line, deploy indium pillars at equal intervals on the second straight line in the area to be deployed according to the second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the locations of two adjacent indium pillars on any third straight line in the area to be deployed and the adjacent third straight line. The third straight line includes the first straight line and each second straight line.

[0048] Step S105: Remove indium pillars located outside the parallel region.

[0049] pass Figure 1 The method shown can determine the deployment area based on the parallel area between the first skeleton line and the second skeleton line, then determine the first straight line in the deployment area, and deploy indium pillars at equal intervals at a second preset distance on the first straight line. Based on the position of the indium pillars on the first straight line, deploy indium pillars at equal intervals on each second straight line at the same second preset distance, thereby eliminating indium pillars located outside the parallel area.

[0050] In the aforementioned indium pillar deployment process, indium pillars are first deployed along a first straight line at a second preset distance. Then, based on the indium pillars deployed along the first straight line, indium pillars are deployed along a second straight line. Since the distance between the first straight line and the line connecting its midpoint is half of the first preset distance, and there must exist a second straight line in the deployment area that is symmetrical to the first straight line about its midpoint, indium pillars are deployed along both this second and first straight lines, thus achieving the centering requirement for indium pillar deployment. Furthermore, in the deployment area, since an indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting two adjacent indium pillar positions on any third straight line and its adjacent third straight line, and the distance between adjacent straight lines is the first preset distance, i.e. The second preset distance is twice the distance between adjacent indium pillars. Therefore, the distance between any two adjacent indium pillars on any third straight line and the intersection point of adjacent third straight lines on the perpendicular bisector is the preset minimum distance between adjacent indium pillars, i.e., the second preset distance. This ensures that the distance between any two adjacent indium pillars in the deployment area is the second preset distance, achieving the densest deployment requirement of indium pillars. It is evident that the technical solution provided by the embodiments of this application can achieve the densest deployment of indium pillars in the quantum chip layout.

[0051] The embodiments of this application will be described below through specific examples.

[0052] For step S101 above, that is, based on the parallel area between the first skeleton line and the second skeleton line in the quantum chip layout, a rectangular area that meets the preset conditions is selected as the deployment area, wherein the length of the first right-angled side in the deployment area is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line.

[0053] In this embodiment, the quantum chip layout includes multiple skeleton lines. For ease of understanding, combined with... Figure 2 Let's take an example to illustrate. Figure 2 This is a partial schematic diagram of a quantum chip layout provided in an embodiment of this application. Figure 2 In the diagram, each purple line represents the skeleton line in the quantum chip layout, such as... Figure 2 The skeleton lines 201 and 202 are shown.

[0054] Each skeleton line in the above quantum chip layout can be a single line or composed of multiple straight lines. For example, the above... Figure 2 The skeleton line 201 shown is composed of skeleton line AD and skeleton line DF, and the skeleton line 202 is composed of skeleton line BC and skeleton line CE.

[0055] When deploying indium pillars, electronic devices can break down the skeleton lines in the quantum chip layout, that is, break down the skeleton lines in the quantum chip layout into straight lines that do not include inflection points. For example, the above... Figure 2 The skeleton line 201 shown is split into two skeleton lines excluding the inflection point D, namely skeleton line AD and skeleton line DF. For ease of distinction, all skeleton lines included in the quantum chip layout after the splitting process are denoted as the fifth skeleton line.

[0056] Regarding the fifth skeleton line in a quantum chip layout, electronic devices can identify the quadrilateral region between two adjacent and parallel fifth skeleton lines as the parallel region between the two fifth skeleton lines. For example, electronic devices can identify... Figure 2 The parallel region between skeleton lines AD and BC is quadrilateral ABCD, and the parallel region between skeleton lines CE and DF is quadrilateral CEFD. For the identification method of the parallel regions between adjacent and parallel fifth skeleton lines in the quantum chip layout, please refer to the identification methods in related technologies; specific details will not be provided here.

[0057] In this embodiment, the parallel region can be a quadrilateral region formed by connecting the corresponding endpoints of the two fifth skeleton lines. Depending on the location of the two fifth skeleton lines, the shape of the parallel region recognized by the electronic device will also differ. The parallel region includes, but is not limited to, rectangles, parallelograms, and trapezoids.

[0058] After determining all parallel regions in the quantum chip layout, for each parallel region, the electronic device can select a rectangular region that meets preset conditions as the deployment area based on the location of that parallel region. For ease of understanding, this embodiment only uses the deployment of an indium pillar in a parallel region of the quantum chip layout as an example. That is, when obtaining the deployment area, the electronic device only selects a rectangular region that meets preset conditions as the deployment area based on the parallel region between the first and second skeleton lines in the quantum chip layout.

[0059] The first and second skeleton lines mentioned above can be any two adjacent and parallel fifth skeleton lines in the quantum chip layout. No specific limitations are imposed on the first and second skeleton lines. Furthermore, the aforementioned preset conditions are used to indicate the selection method of the deployment area.

[0060] In the embodiments of this application, the lengths of the first skeleton line and the second skeleton line may be the same or different. For ease of understanding, the following description only uses the example where the length of the first skeleton line is greater than or equal to the length of the second skeleton line, and does not serve as any limitation.

[0061] In an optional embodiment, when selecting the aforementioned deployment area, the electronic device can select the smallest rectangular area including the parallel area between the first and second skeleton lines in the quantum chip layout as the deployment area. In this case, the aforementioned preset condition is expressed as: the smallest rectangular area including the parallel area.

[0062] For ease of understanding, combined with Figure 3-a Let's take an example to illustrate. Figure 3-a This is a schematic diagram of a deployment area provided in an embodiment of this application. Figure 3-a It includes skeleton line AB (i.e., the first skeleton line mentioned above) and skeleton line CD (i.e., the second skeleton line mentioned above).

[0063] like Figure 3-a As shown, quadrilateral ABCD represents the parallel region between skeleton lines AB and CD. After determining this parallel region, the electronic device can select a rectangular area with skeleton line AB (i.e., the first skeleton line) as its length and the vertical distance between skeleton lines AB and CD as its width as the deployment area. Figure 3-a The rectangle ABC′D′ shown is selected as the area to be deployed. For example... Figure 3-a As shown, rectangle ABC′D′ is the smallest rectangular region that includes quadrilateral ABCD, and this region to be deployed includes parallel regions.

[0064] The area to be deployed includes four right-angled sides: right-angled side AB and right-angled side C′D′ (denoted as the first right-angled side), and right-angled side AD′ and right-angled side BC′ (denoted as the second right-angled side).

[0065] In an optional embodiment, when the parallel area is a rectangular area, the electronic device can directly determine the rectangular area as the area to be deployed.

[0066] In another optional embodiment, when selecting the aforementioned deployment area, the electronic device can select the smallest rectangular area including the parallel area between the first and second skeleton lines in the quantum chip layout as the target area; based on a fourth preset distance, the two third right-angled sides of the target area are reduced to obtain the deployment area, where the third right-angled sides are the sides of the target area excluding the first and second skeleton lines, and the fourth preset distance is a pre-set clearance distance between the indium pillar and the skeleton line. In this case, the aforementioned preset conditions are determined based on the parallel area and the fourth preset distance.

[0067] For ease of understanding, the above will still be used. Figure 3-a Let's take an example to illustrate. Electronic devices can include parallel areas (i.e. Figure 3-a The smallest rectangular region of the quadrilateral ABCD shown, namely rectangle ABC′D′, is defined as the target region. The target region includes four right-angled sides: right-angled sides AD′ and BC′ (denoted as the third right-angled side), and right-angled sides AB and C′D′ (denoted as the fourth right-angled side). The electronic device can reduce the two ends of the two third right-angled sides by a fourth preset distance, that is, reduce... Figure 3-a The ends of the right-angled sides AD′ and BC′ shown are each reduced by a fourth preset distance to obtain the following: Figure 3-a The rectangle A′B′C″D″ shown is the area to be deployed.

[0068] In this embodiment, the electronic device stores a user-defined fourth preset distance. This fourth preset distance is the clearance distance between the indium pillar and the framework line in the quantum chip layout, denoted as distance d. This clearance distance can be expressed as the distance between the edge of the indium pillar and the framework line, or it can be expressed as the distance between the center point of the indium pillar and the framework line. For ease of understanding, the following explanation uses the example of the fourth preset distance being the distance between the center point of the indium pillar and the framework line, and does not constitute any limitation.

[0069] During the process of determining the area to be deployed, the fourth preset distance can effectively exclude areas in the target area where indium pillars cannot be deployed. While ensuring that any position in the determined area to be deployed can be used to deploy indium pillars, effective avoidance between indium pillars and skeleton lines can be achieved.

[0070] In addition, when determining the deployment area, effectively eliminating areas in the target area where indium pillars cannot be deployed can eliminate the need to consider the effective avoidance between indium pillars and skeleton lines during the indium pillar deployment process, thereby shortening the deployment time and improving the deployment efficiency of indium pillars.

[0071] In this embodiment, the determined deployment area will vary depending on the method used to determine the deployment area, specifically the parallel region between the first and second skeleton lines. For ease of understanding, the deployment area will be defined below as the smallest rectangular region including the parallel region (i.e., the one described above). Figure 3-a The example given is a rectangle ABC′D′, and it does not serve any limiting purpose.

[0072] Regarding step S102 above, that is, in the area to be deployed, determine any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance equal to half of the first preset distance, as the first straight line, the second right-angled side being perpendicular to the first right-angled side, and the first preset distance being equal to the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars, which is set in advance.

[0073] The area to be deployed includes two second right-angled sides. The electronic device can determine the midpoints of the two second right-angled sides and record the line connecting the two midpoints as the midpoint line.

[0074] The electronic device stores a second preset distance, which is the minimum distance between adjacent indium pillars, denoted as distance b. The second preset distance can be expressed as the distance between the corresponding center points of adjacent indium pillars.

[0075] After determining the midpoint line mentioned above, the electronic device can determine a straight line in the area to be deployed that is parallel to the midpoint line and is half the distance of the first preset distance, and select any one of the determined straight lines as the first straight line.

[0076] The aforementioned first preset distance is the second preset distance. The first preset distance is times, that is, the first preset distance is Accordingly, the first straight line mentioned above is parallel to the line connecting the midpoints mentioned above, and the distance between them is... In the aforementioned area to be deployed, the line connecting the midpoint is parallel and at a distance of [missing information]. There are two straight lines, and the first straight line mentioned above can be either of these two lines. Here, no specific limitation is made on the first straight line.

[0077] For ease of understanding, combined with Figure 3-b To explain, Figure 3-b for Figure 3-a This is a schematic diagram of the first type of indium pillar deployment in the area to be deployed. Figure 3-bIn the diagram, the area to be deployed is rectangle ABC′D′, and the two second right-angled sides are sides AD′ and BC′ of rectangle ABC′D′. The midpoints of sides AD′ and BC′ are respectively... Figure 3-b Points E and F shown are, i.e. Figure 3-b The straight line 301 shown is the line connecting the midpoints of the area to be deployed.

[0078] exist Figure 3-b In the rectangle ABC′D′ shown, the line parallel to line 301 and at a distance of is... The straight lines include line 302 and line 303. The electronic device can select either line 302 or line 303 as the first straight line.

[0079] Regarding step S103 above, that is, according to the location of the first straight line, indium pillars are deployed at equal intervals on the first straight line in the area to be deployed according to the second preset distance.

[0080] In one optional embodiment, when deploying indium pillars on the first straight line, the electronic device can determine the intersection of the first straight line and any second right-angled side as the first starting point for the deployment of indium pillars based on the location of the first straight line; based on the first starting point, indium pillars are deployed at equal intervals on the first straight line in the area to be deployed according to a second preset distance.

[0081] For ease of understanding, the above will still be used. Figure 3-b Let's take an example to illustrate. Now assume... Figure 3-b The line 302 shown is the first line. The electronic device can determine the intersection point of line 302 and edge AD′ (i.e., point G) as the starting point for deploying indium pillars on the first line (denoted as the first starting point). Starting from the first starting point, the electronic device can deploy indium pillars at equal intervals along the first line according to the aforementioned second preset distance. That is, the first indium pillar is deployed at point G, and based on the position of point G, one indium pillar is deployed at every distance b along the first line. Figure 3-b The distance between the indium pillars corresponding to the midpoint P1 and the point P2 is the distance b.

[0082] In this embodiment, any point on the first straight line can be used as an indium pillar deployment point. The deployment result of the indium pillars on the first straight line will vary depending on the deployment point. Therefore, no specific limitation is made on the deployment method of the indium pillars on the first straight line.

[0083] Regarding step S104 above, that is, according to the position of the indium pillars on the first straight line, indium pillars are deployed at equal intervals on the second straight line in the area to be deployed according to the second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the positions of two adjacent indium pillars on any third straight line in the area to be deployed and the adjacent third straight line. The third straight line includes the first straight line and each second straight line.

[0084] For ease of understanding, in conjunction with the above Figure 3-b Let's take an example to illustrate. Electronic devices in... Figure 3-b After indium pillars are deployed on the straight line 302 shown, indium pillars can be deployed on each of the second straight lines in the area to be deployed according to the second preset distance (i.e., the distance b). For example... Figure 3-b The lines 303, 304 and 305 shown are all second lines in the area to be deployed that are parallel to the first line and whose distance is a positive integer multiple of the first preset distance. Indium pillars are deployed at equal intervals of distance b on each second line.

[0085] The first and second straight lines within the aforementioned deployment area can be denoted as the third straight line. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the locations of adjacent indium pillars on each third straight line and the adjacent third straight line. For example, in... Figure 3-b The indium pillars at points P1 and P2 on line 302 are adjacent indium pillars. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting points P1 and P2 (i.e., the line containing line P3P4) and its adjacent line 303 (i.e., point P3).

[0086] because Figure 3-b The distance between midpoint P3 and point P4 is The distance between points P1 and P2 is b. Therefore, the distance between point P3 and point P1, and the distance between point P3 and point P2, are both b. This means that triangle P1P2P3 is an equilateral triangle. Similarly, in... Figure 3-b In the area to be deployed shown, the distance between any two adjacent indium pillars is the aforementioned distance b, i.e., the second preset distance.

[0087] Using the above method, the distance between any two adjacent indium pillars in the area to be deployed is the second preset distance, which allows the number of indium pillars deployed in the area to be deployed to reach the maximum value, so that the indium pillars deployed in the area to be deployed are the most dense.

[0088] The deployment method for indium pillars in the aforementioned deployment area is described below and will not be repeated here.

[0089] For step S105 above, indium pillars located outside the parallel region are removed.

[0090] In one optional embodiment, when the area to be deployed is the smallest rectangular area including the parallel area, the area to be deployed is greater than or equal to the parallel area. If the area to be deployed is larger than the parallel area, indium pillars may be deployed outside the parallel area when the indium pillars in the area to be deployed are completed. In this case, the electronic device can reject the indium pillars located outside the parallel area.

[0091] For ease of understanding, combined with Figure 3-c Let's take an example to illustrate. Figure 3-c for Figure 3-b This is a schematic diagram illustrating the removal of indium pillars in the area to be deployed. Through the above step S104, the electronic device can be deployed to achieve the desired result. Figure 3-b The indium pillar shown. Due to the parallel region (i.e. Figure 3-b The quadrilateral ABCD shown is smaller than the area to be deployed (i.e., Figure 3-b Given a rectangle ABC′D′, the electronic device can eliminate the indium pillars located outside the quadrilateral ABCD to obtain, as shown below. Figure 3-c The indium pillar shown. In Figure 3-c In the diagram, the indium prism located outside quadrilateral ABCD is... Figure 3-c Medium gray indium pillars (such as indium pillar 306) were all removed. The indium pillars located within quadrilateral ABCD, i.e. Figure 3-c The red indium pillars (such as indium pillar 307) are all retained.

[0092] In an optional embodiment, when the area to be deployed is the same as the parallel area, the electronic device can determine that there are no indium pillars deployed outside the parallel area. In this case, the electronic device may not perform step S105, or the number of indium pillars removed in step S105 may be zero. Here, there is no specific limitation on the execution of step S105 or the number of indium pillars removed in the area to be deployed.

[0093] In the above embodiments, the deployment process of indium pillars in parallel regions between a set of adjacent and parallel fifth skeleton lines in the quantum chip layout is described as an example only. The deployment of indium pillars in other parallel regions between adjacent and parallel fifth skeleton lines in the quantum chip layout can be carried out by referring to the above method. For example, electronic devices can implement the above-described method. Figure 2 The indium pillars are deployed in all parallel regions of the quantum chip layout shown, specifically as follows: Figure 3-d As shown, Figure 3-d for Figure 2 This is a schematic diagram of an indium pillar deployment in a quantum chip layout. Figure 3-d Indium pillars, as shown in indium pillar 308, are deployed between adjacent skeleton lines. The specific deployment process of the indium pillars between the skeleton lines in the above quantum chip layout will not be described here.

[0094] In an optional embodiment, according to the above... Figure 1 The method shown in this application embodiment also provides an indium pillar deployment method. For example... Figure 4 As shown, Figure 4 This is a schematic diagram of a second process for the indium pillar deployment method provided in an embodiment of this application. Figure 4 The above step S104 in the method shown can be further refined into the following steps, namely step S1041.

[0095] Step S1041: For each indium pillar on the first straight line, based on the location of the indium pillar, deploy indium pillars at equal intervals along the first preset direction in the area to be deployed according to the second preset distance. The angle between the first preset direction and the first straight line is π / 3 and 2π / 3.

[0096] In the embodiments of this application, the angle between the above-mentioned angle and the first straight line is described using the counterclockwise angle as an example, and does not serve any limiting function.

[0097] After completing the deployment of indium pillars on the first straight line, the electronic device can, for each indium pillar deployed on the first straight line, based on the location of the indium pillar, deploy indium pillars at equal intervals within the area to be deployed along a straight line passing through that location and with angles of π / 3 and 2π / 3 (i.e., the first preset direction) to the first straight line, according to the second preset distance.

[0098] For ease of understanding, combined with Figure 5 The deployment process of the indium pillars described above will be explained. Figure 5 for Figure 3-a This is a second schematic diagram showing the deployment of indium pillars in the area to be deployed. Figure 5 Within the deployment area shown, after the electronic device completes the deployment of indium pillars on the first straight line (i.e., straight line 501), for each deployed indium pillar, such as the indium pillar at point P2, a straight line 502 passing through point P2 and forming an angle of π / 3 with straight line 501 can be determined. Based on the indium pillar deployed at point P2, an indium pillar is deployed on straight line 502 at intervals of b, resulting in... Figure 5 The indium pillars are shown at points P1, P3, and P4. Similarly, the electronic device can also deploy indium pillars at equal intervals along a straight line passing through point P2 and forming an angle of 2π / 3 with line 501. Through each indium pillar on the first straight line and the first preset direction, the electronic device can deploy indium pillars within the rectangle ABC′D′ (i.e., the deployment area).

[0099] During the indium pillar deployment process described above, to ensure the integrity and accuracy of the indium pillars deployed within the deployment area, the electronic device will deploy the indium pillars in first preset directions with angles of π / 3 and 2π / 3 to the first straight line, respectively. During this process, multiple locations may simultaneously serve as indium pillar deployment points. For example, the aforementioned... Figure 5 The indium pillar at the midpoint P3 can be either an indium pillar deployed on a straight line passing through point P2 and forming an angle of π / 3 with the first straight line, or an indium pillar deployed on a straight line passing through point P5 and forming an angle of 2π / 3 with the first straight line. Therefore, during the above deployment process, once an indium pillar has been deployed at a certain position, the electronic device can ignore deploying an indium pillar at that position when it determines that an indium pillar can be deployed at that position based on other indium pillars on the first straight line.

[0100] In an optional embodiment, the angle between the first preset direction and the first straight line can also be expressed as 4π / 3 and 5π / 3. Here, the first preset direction is not specifically limited.

[0101] Through the above step S1041, the electronic device can complete the deployment of indium pillars in the area to be deployed according to the position of each indium pillar on the first straight line and the first preset direction, so as to achieve the densest deployment of indium pillars in the center.

[0102] In an optional embodiment, when the area to be deployed includes the parallel area, according to the above... Figure 1 The method shown in this application embodiment also provides an indium pillar deployment method. For example... Figure 6 As shown, Figure 6 This is a third flowchart illustrating the indium pillar deployment method provided in an embodiment of this application. The method includes the following steps.

[0103] Step S601: In the second preset direction, determine the first target position at a distance of the second preset distance from the first starting point, wherein the angle between the second preset direction and the first straight line is π / 3 or 5π / 3, and the fourth straight line that passes through the first target position and is parallel to the first straight line is symmetrical to the first straight line about the midpoint.

[0104] In this step, after the electronic device completes the deployment of indium pillars on the first straight line based on the first starting point, it can determine the position that passes through the first starting point and is at a distance of the second preset distance from the first straight line at an angle of π / 3 or 5π / 3 (i.e., the second preset direction), and use this position as the first target position.

[0105] For ease of understanding, combined with Figure 7 Let's take an example to illustrate. Figure 7 for Figure 3-a The diagram shows a third type of indium pillar deployment in the area to be deployed. After the electronic device completes the deployment of indium pillars on the first straight line (i.e., straight line 701) with point G as the first starting point, the position of point H on the straight line that passes through point G and has an angle of π / 3 with straight line 701, and is a distance b from point G as mentioned above, can be determined as the first target position.

[0106] In this embodiment, the straight line passing through the first target position and parallel to the first straight line is designated as the fourth straight line. Since the first straight line is located on one side of the aforementioned midpoint line, when deploying indium pillars, there must exist a straight line on the other side of the midpoint line that is parallel to the first straight line about the midpoint line and can be used for indium pillar deployment. Considering that the length of the second right-angled side of the area to be deployed may be relatively small, only two rows of indium pillars can be deployed on both sides of the midpoint line. In this case, to improve the efficiency of indium pillar deployment, the electronic device can, when determining the first target position, select a second preset direction based on the location of the first starting point and the midpoint line to make the fourth straight line symmetrical to the first straight line about the midpoint line.

[0107] In an optional embodiment, depending on the first starting point, the angle between the second preset direction and the first straight line can be other angles. For example, when the first starting point is... Figure 7 At point J, the angle between the second preset direction and the first straight line can be 2π / 3 or 4π / 3. Here, the second preset direction is not specifically limited.

[0108] Step S602: Using the first target location as the second starting point, deploy indium pillars at equal intervals along the fourth straight line in the area to be deployed, according to the second preset distance.

[0109] For ease of understanding, the above will still be used. Figure 7 Let's take an example to illustrate. Electronic devices in... Figure 7 Once the location of point H is determined as the first target location, the location of point H can be used as the starting point for the deployment of indium pillars (referred to as the second starting point). Indium pillars are then deployed at equal intervals along the fourth straight line that passes through point H and is parallel to the first straight line, according to the distance b mentioned above.

[0110] Step S603: Taking the first straight line and the fourth straight line as target axes of symmetry respectively, when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance, based on the target axis of symmetry, each indium pillar deployed on the fifth straight line is symmetrically deployed to the sixth straight line. The third skeleton line is the first skeleton line or the second skeleton line that is closest to the target axis of symmetry. The third preset distance is the sum of the second preset distance and the fourth preset distance. The fourth preset distance is the pre-set clearance distance between the indium pillar and the skeleton line. The fifth straight line is adjacent to the target axis of symmetry and has indium pillars deployed on it.

[0111] After completing the deployment of indium pillars on the first and fourth straight lines, the electronic device can use the first straight line as the target axis of symmetry. At this point, the electronic device can determine the skeleton line closest to the target axis of symmetry between the first and second skeleton lines as the third skeleton line, and determine whether the distance between the target axis of symmetry and the third skeleton line is greater than or equal to a third preset distance. If this distance is greater than or equal to the third preset distance, the electronic device can symmetrically deploy the indium pillars deployed on the third straight line (denoted as the fifth straight line), which is adjacent to the target axis of symmetry and has indium pillars deployed thereon, to the sixth straight line. At this point, the fifth straight line is the aforementioned fourth straight line.

[0112] For ease of understanding, in conjunction with the above Figure 7 Let's take an example to illustrate. When electronic devices complete... Figure 7 After the indium pillars on lines 701 and 702 are deployed, since the distance between line 701 and the skeleton line AB is greater than the third preset threshold, the electronic device can continue to deploy indium pillars between line 701 and the skeleton line AB. At this time, the electronic device can symmetrically deploy the indium pillars deployed on line 702 to the other side of line 701, using line 701 as the target axis of symmetry, to obtain the following... Figure 7 The indium pillars deployed on the straight line 704 shown.

[0113] Furthermore, after completing the deployment of indium pillars on the first and fourth straight lines, the electronic device can also use the fourth straight line as the target axis of symmetry. At this time, the electronic device can determine the skeleton line closest to the target axis of symmetry among the first and second skeleton lines as the third skeleton line, and determine whether the distance between the target axis of symmetry and the third skeleton line is greater than or equal to a third preset distance. When this distance is greater than or equal to the third preset distance, the electronic device can symmetrically deploy the indium pillars deployed on the third straight line (i.e., the fifth straight line) adjacent to the target axis of symmetry and containing indium pillars, to the sixth straight line. At this time, the fifth straight line is the aforementioned first straight line.

[0114] For ease of understanding, the above will still be used. Figure 7 Let's take an example to illustrate. When electronic devices complete... Figure 7 After the indium pillars on lines 701 and 702 are deployed, since the distance between line 702 and the skeleton line CD is greater than the third preset threshold, the electronic device can continue to deploy indium pillars between line 702 and the skeleton line CD. At this time, the electronic device can symmetrically deploy the indium pillars deployed on line 701 to the other side of line 702, using line 702 as the axis of symmetry, to obtain... Figure 7 The indium pillars deployed on the straight line 703 shown.

[0115] In this embodiment, the third skeleton line determined will vary depending on the different target axes of symmetry. Here, the third skeleton line is not specifically limited. Furthermore, the third preset distance can be expressed as the sum of the second and fourth preset distances, i.e., b+d.

[0116] Step S604: Update the sixth line to the target axis of symmetry, and return to the step of symmetrically deploying each indium pillar deployed on the fifth line to the sixth line based on the target axis of symmetry when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance, until the distance between the target axis of symmetry and the third skeleton line at the current moment is less than the third preset distance.

[0117] In this step, after the electronic device completes the deployment of indium pillars on the sixth straight line, it can use the sixth straight line as the target axis of symmetry and return to the straight line in step S603. That is, it returns to the execution when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance. Based on the target axis of symmetry, each indium pillar deployed on the fifth straight line is symmetrically deployed to the sixth straight line, and the above step S603 is repeated until the distance between the target axis of symmetry and the third skeleton line at the current moment is less than the third preset distance, thus realizing the deployment of indium pillars in the area to be deployed.

[0118] In this embodiment, since the first and fourth straight lines are used as the target axes of symmetry in step S603, the number of sixth straight lines deployed in step S603 can be empty or multiple. Accordingly, the electronic device can return to step S603 based on each sixth straight line when executing step S604.

[0119] Steps S601-S604 above are a refinement of step S104 above.

[0120] Through the above steps S601-S604, after the electronic device completes the deployment of indium pillars on the first straight line and the fourth straight line, it takes the first straight line and the fourth straight line as the target axis of symmetry respectively. When the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance, the indium pillars deployed on one side of the target axis of symmetry are symmetrically deployed to the other side, thereby realizing the deployment of indium pillars in the area to be deployed and improving the deployment efficiency of indium pillars.

[0121] In an optional embodiment, when the area to be deployed includes the parallel area, according to the above... Figure 1 The method shown in this application embodiment also provides an indium pillar deployment method. For example... Figure 8 As shown, Figure 8 This is a schematic diagram of a fourth process for an indium pillar deployment method provided in an embodiment of this application. The method includes the following steps.

[0122] Step S801: In the third preset direction, determine the second target position at a distance of the second preset distance from the position of any indium pillar on the first straight line. The angle between the third preset direction and the first straight line is π / 3 and 5π / 3.

[0123] After the electronic device completes the deployment of indium pillars on the first straight line, it can determine the position (denoted as the second target position) at a distance from the location of any indium pillar on the first straight line, in a third preset direction that passes through the location and has angles of π / 3 and 5π / 3 with the first straight line, respectively.

[0124] For ease of understanding, in conjunction with the above Figure 5 Let's take an example. After the electronic device completes the deployment of indium pillars on line 501, it can select any one of the indium pillars, such as... Figure 5 The indium pillar at point P2 is used as the second target location. Based on the position of the indium pillar (i.e., the position of point P2), the position that passes through the indium pillar and is at an angle of π / 3 with the straight line 501 and is a distance b from point P2 is determined as the second target location.

[0125] In this embodiment of the application, since the third preset direction includes two directions, namely π / 3 and 5π / 3, the number of the second target positions determined above can be two.

[0126] In an optional embodiment, the third preset direction may also be 2π / 3 or 4π / 3. Here, the third preset direction is not specifically limited.

[0127] Step S802: When the vertical distance between the second target position and the fourth skeleton line is greater than or equal to the fourth preset distance, take the second target position as an indium pillar deployment point, and deploy indium pillars at equal intervals on the seventh straight line in the area to be deployed according to the second preset distance. The seventh straight line is parallel to the first straight line. The fourth skeleton line is the first skeleton line or the second skeleton line closest to the second target position. The fourth preset distance is the pre-set avoidance distance between the indium pillar and the skeleton line.

[0128] After determining the second target position, the electronic device can identify the skeleton line closest to the second target position among the first skeleton line and the second skeleton line as the fourth skeleton line, and obtain the vertical distance from the second target position to the fourth skeleton line.

[0129] When the aforementioned vertical distance is greater than or equal to the fourth preset distance, the electronic device can determine that the distance between the second target position and the fourth skeleton line is large enough to allow for the deployment of indium pillars at the second target position. In this case, the electronic device can deploy indium pillars at equal intervals along a straight line (denoted as the seventh straight line) that passes through the second target position and is parallel to the first straight line, using the second target position as a deployment point.

[0130] For ease of understanding, the above will still be used. Figure 5 Let's take an example to illustrate. Electronic devices in... Figure 5 After determining the location of point P3 as the second target location, the skeleton line CD closest to point P3 can be determined as the fourth skeleton line. Since the vertical distance between point P3 and the fourth skeleton line is greater than or equal to the aforementioned fourth preset distance, the electronic device can use the location of point P3 as an indium pillar deployment point. Figure 5 An indium pillar is deployed at a distance b along the straight line 503, resulting in each indium pillar on the straight line 503.

[0131] In an optional embodiment, when the vertical distance is less than the fourth preset distance, the electronic device can determine that the distance between the second target position and the fourth skeleton line is relatively small and insufficient for indium pillar deployment at the second target position. In this case, the electronic device can perform no processing, that is, the electronic device can choose not to deploy indium pillars on the seventh straight line.

[0132] Step S803: Using the seventh straight line as the first straight line, return to the execution of the step of determining the second target position in the third preset direction, with a distance of the second preset distance between the target position and the position of any indium pillar on the first straight line, until the vertical distance at the current moment is less than the fourth preset distance.

[0133] When the electronic device completes the deployment of the indium pillars on the seventh straight line, it can take the seventh straight line as the first straight line and return to execute the above step S801, that is, return to execute the above step of determining the second target position in the third preset direction with a distance of the second preset distance from the position of any indium pillar on the first straight line, and realize the cyclic execution of the above steps S801-S802 until the vertical distance at the current moment is less than the above fourth preset distance.

[0134] In an optional embodiment, regarding step S803 above, considering that the number of determined seventh lines can be two, in order to avoid the same line being determined as the seventh line multiple times during the loop execution, if the second target position is determined based on the third preset direction of π / 3 during the loop execution, then the next second target position is still determined based on the third preset direction of π / 3. Similarly, if the second target position is determined based on the third preset direction of 5π / 3, then the next second target position is also determined based on the third preset direction of 5π / 3.

[0135] Steps S801-S803 above are a refinement of step S104 above.

[0136] Through the above steps S801-S803, the electronic device can deploy indium pillars within the area to be deployed based on the location of any indium pillar on the first straight line, with the second target position in the third preset direction as an indium pillar deployment point. This ensures that the indium pillars within the area to be deployed are deployed in the densest possible position, thus improving the efficiency of indium pillar deployment.

[0137] In the above Figure 6 and Figure 8 The method illustrated here only uses the example of the deployment area including parallel regions, that is, only the smallest rectangular area including parallel regions is used as an example to illustrate the indium pillar deployment process. In addition, when the above-mentioned deployment area is determined based on the above-mentioned target area, the deployment of indium pillars by the electronic device within the deployment area can also be referred to... Figure 6 and Figure 8 The method shown is used to perform the operation. At this time, the electronic device can ignore the comparison process between the distance between the target symmetry axis and the third skeleton line and the third preset distance, as well as the comparison process between the vertical distance between the second target position and the fourth skeleton line and the fourth preset distance. The deployment process of the indium pillars will not be described in detail here.

[0138] In an optional embodiment, according to the above... Figure 1 The method shown in this application embodiment also provides an indium pillar rejection method. For example... Figure 9 As shown, Figure 9 This is a schematic flowchart of an indium pillar rejection method provided in an embodiment of this application. The method includes the following steps.

[0139] Step S901: Divide the parallel region according to any diagonal line in the parallel region to obtain the first triangle and the second triangle.

[0140] In this step, since the parallel region is a quadrilateral region, it includes two diagonals. The electronic device can divide the parallel region according to either diagonal to obtain two triangles (denoted as the first triangle and the second triangle, respectively).

[0141] For ease of understanding, in conjunction with the above Figure 3-c Let's take an example. The parallel region (i.e., quadrilateral ABCD) includes two diagonals, namely diagonal AC and diagonal BD. The electronic device can divide quadrilateral ABCD according to diagonal AC to obtain triangle ABC and triangle ADC.

[0142] Step S902: For each indium pillar in the area to be deployed, calculate the sum of the first areas of all third triangles formed by the third target position and any two vertices of the first triangle, based on the third target position where the indium pillar is located.

[0143] In this step, for each indium pillar in the area to be deployed, the electronic device can determine all the triangles formed by the third target position and any two vertices of the first triangle (denoted as the third triangle) based on the location of the indium pillar (denoted as the third target position), and then calculate the sum of the areas of all the third triangles (denoted as the first area sum).

[0144] For ease of understanding, the above... Figure 3-c Let's take an indium pillar, such as indium pillar 306, as an example. We'll denote the center point of indium pillar 306 as point E (not shown in the figure). Figure 3-c In this diagram, triangle ADC is denoted as the first triangle. Point E, together with the three vertices of triangle ADC (i.e., points A, C, and D), can form three triangles: triangle ADE, triangle ACE, and triangle CDE. The electronic device can calculate the sum of the areas of these three triangles to obtain the first sum of areas.

[0145] In this embodiment of the application, after obtaining the first area sum, the electronic device can compare the first area sum with the first area of ​​the first triangle.

[0146] Step S903: If the sum of the first areas is not equal to the first area of ​​the first triangle, then calculate the sum of the second areas of all fourth triangles formed by the third target position and any two vertices in the second triangle, based on the third target position.

[0147] In this step, for each indium pillar, if the sum of the first areas corresponding to that indium pillar is not equal to the first area of ​​the first triangle (i.e., the sum of the first areas is greater than the first area), the electronic device can determine that the indium pillar is outside the first triangle. At this point, the electronic device can calculate the sum of the second areas of all fourth triangles formed by the third target position and any two vertices of the second triangle, based on the third target position.

[0148] For ease of understanding, the above will still be used. Figure 3-cLet's take an example. The sum of the first areas of triangles ADE, ACE, and CDE is greater than the area of ​​triangle ADC, indicating that point E is outside triangle ADC, meaning indium pillar 306 is outside triangle ADC. At this point, the electronic device can determine that point E, together with the three vertices of the second triangle (i.e., triangle ABC) (i.e., points A, B, and C), forms all triangles: triangles ABE, ACE, and BCE. The electronic device can then calculate the sum of the areas of these three triangles to obtain the second sum of areas.

[0149] In an optional embodiment, after determining the second area sum, the electronic device can compare the second area sum with the second area of ​​the second triangle.

[0150] In this embodiment, the number of the third / fourth triangles will vary depending on the location of the indium pillar. For example, when the indium pillar is not located on the boundary of the parallel region, the number of the third / fourth triangles is 3; when the indium pillar is located on the boundary of the parallel region, the number of the third / fourth triangles is 2. Here, the specific number of the third and fourth triangles is not limited.

[0151] In an optional embodiment, for each indium pillar, when the sum of the first areas corresponding to that indium pillar is equal to the first area of ​​the first triangle, the electronic device can determine that the indium pillar is located within the first triangle. In this case, the electronic device can determine that the indium pillar is located within the parallel region, meaning the electronic device does not need to remove the indium pillar, and the corresponding electronic device may not need to perform the above step S903.

[0152] Furthermore, when comparing the aforementioned first area with the first area, there will be no situation where the sum of the first areas is less than the first area.

[0153] Step S904: If the sum of the second areas is not equal to the second area of ​​the second triangle, then the indium pillar is discarded.

[0154] In this step, for each indium pillar, if the sum of the second areas corresponding to that indium pillar is not equal to the second area of ​​the aforementioned second triangle (i.e., the sum of the second areas is greater than the second area), the electronic device can determine that the indium pillar is not within the second triangle. Since the indium pillar is neither within the first triangle nor the second triangle, the electronic device can determine that the indium pillar is not within the parallel region. At this point, the electronic device can discard the indium pillar.

[0155] Steps S901-S904 above are a refinement of step S105 above.

[0156] Through steps S901-S904, the electronic device can identify each indium pillar within the deployment area, ensuring that the retained indium pillars are located within the parallel area, thus effectively guaranteeing the accuracy and effectiveness of indium pillar deployment. Furthermore, by comparing areas, it can accurately determine whether an indium pillar is located outside the parallel area, effectively ensuring the accuracy of indium pillar location identification and improving the accuracy of indium pillar rejection.

[0157] In this embodiment of the application, the method for distinguishing indium pillars inside and outside the aforementioned parallel area, in addition to Figure 9 Besides the area-based method shown, other methods can also be used, such as the vector product method. Here, the specific method for distinguishing indium pillars inside and outside the parallel regions is not limited.

[0158] Based on the same inventive concept, and according to the indium pillar deployment method provided in the above embodiments of this application, this application also provides an indium pillar deployment apparatus. For example... Figure 10 As shown, Figure 10 This is a schematic diagram of an indium pillar deployment device provided in an embodiment of this application. The device includes the following modules.

[0159] The selection module 1001 is used to select a rectangular area that meets preset conditions as the deployment area based on the parallel area between the first skeleton line and the second skeleton line in the quantum chip layout. The length of the first right-angled side in the deployment area is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line.

[0160] The determining module 1002 is used to determine, within the deployment area, any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance equal to half a first preset distance, as the first straight line, wherein the second right-angled side is perpendicular to the first right-angled side, and the first preset distance is equal to the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars, which is set in advance.

[0161] The first deployment module 1003 is used to deploy indium pillars at equal intervals along the first straight line in the area to be deployed, according to the location of the first straight line and at a second preset distance.

[0162] The second deployment module 1004 is used to deploy indium pillars at equal intervals on the second straight line in the area to be deployed according to the positions of the indium pillars on the first straight line and at a second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. Indium pillars are deployed at the intersection of the perpendicular bisector of the line connecting the positions of two adjacent indium pillars on any third straight line in the area to be deployed and the adjacent third straight line. The third straight line includes the first straight line and each second straight line.

[0163] The rejection module 1005 is used to reject indium pillars located outside the parallel region.

[0164] Optionally, the second deployment module 1004 described above can be used to deploy indium pillars at equal intervals along a first preset direction within the area to be deployed, based on the location of each indium pillar on the first straight line and according to a second preset distance. The angle between the first preset direction and the first straight line is π / 3 and 2π / 3.

[0165] Optionally, the first deployment module 1003 can be used to determine the intersection of the first straight line and any second right-angled side as the first starting point for the deployment of indium pillars based on the location of the first straight line; and deploy indium pillars at equal intervals on the first straight line in the area to be deployed according to a second preset distance based on the first starting point.

[0166] Optionally, the second deployment module 1004 can be specifically used to determine a first target position with a distance of a second preset distance from the first starting point in a second preset direction if the area to be deployed includes a parallel area, wherein the angle between the second preset direction and the first straight line is π / 3 or 5π / 3, and the fourth straight line that passes through the first target position and is parallel to the first straight line is symmetrical to the first straight line about the midpoint.

[0167] Using the first target location as the second starting point, indium pillars are deployed at equal intervals along the fourth straight line in the area to be deployed, according to the second preset distance;

[0168] Using the first and fourth straight lines as target axes of symmetry respectively, when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance, each indium pillar deployed on the fifth straight line is symmetrically deployed to the sixth straight line based on the target axis of symmetry. The third skeleton line is the first or second skeleton line that is closest to the target axis of symmetry. The third preset distance is the sum of the second and fourth preset distances. The fourth preset distance is the pre-set clearance distance between the indium pillar and the skeleton line. The fifth straight line is adjacent to the target axis of symmetry and has indium pillars deployed on it.

[0169] Update the sixth line to the target axis of symmetry, and return to the step of symmetrically deploying each indium pillar deployed on the fifth line to the sixth line based on the target axis of symmetry when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance, until the distance between the target axis of symmetry and the third skeleton line at the current moment is less than the third preset distance.

[0170] Optionally, the second deployment module 1004 described above can be used to determine a second target position in a third preset direction if the area to be deployed includes a parallel area, and the distance between the target position and the position of any indium pillar on the first straight line is a second preset distance, wherein the angle between the third preset direction and the first straight line is π / 3 and 5π / 3.

[0171] When the vertical distance between the second target position and the fourth skeleton line is greater than or equal to the fourth preset distance, the second target position is used as an indium pillar deployment point. Indium pillars are deployed at equal intervals on the seventh straight line in the area to be deployed according to the second preset distance. The seventh straight line is parallel to the first straight line. The fourth skeleton line is the first skeleton line or the second skeleton line closest to the second target position. The fourth preset distance is the avoidance distance between the indium pillar and the skeleton line that is set in advance.

[0172] Using the seventh line as the first line, return to the execution of the step of determining the second target position in the third preset direction, which is a second preset distance from the position of any indium pillar on the first line, until the vertical distance at the current moment is less than the fourth preset distance.

[0173] Optionally, the above-mentioned elimination module 1005 can be used to divide the parallel region according to any diagonal line in the parallel region to obtain a first triangle and a second triangle.

[0174] For each indium pillar in the area to be deployed, based on the third target position where the indium pillar is located, calculate the sum of the first areas of all third triangles formed by the third target position and any two vertices in the first triangle;

[0175] If the sum of the first areas is not equal to the first area of ​​the first triangle, then based on the third target position, calculate the sum of the second areas of all fourth triangles formed by the third target position and any two vertices in the second triangle;

[0176] If the sum of the second areas is not equal to the second area of ​​the second triangle, then the indium pillar is discarded.

[0177] Optionally, the selection module 1001 can be specifically used to select the smallest rectangular area including the parallel area between the first skeleton line and the second skeleton line in the quantum chip layout as the area to be deployed.

[0178] or,

[0179] Based on the parallel region between the first and second skeleton lines in the quantum chip layout, the smallest rectangular region including the parallel region is selected as the target region. Based on the fourth preset distance, the two third right-angled sides in the target region are reduced to obtain the region to be deployed. The third right-angled side is the side in the target region that does not include the first and second skeleton lines. The fourth preset distance is the pre-set avoidance distance between the indium pillar and the skeleton line.

[0180] The apparatus provided in this application embodiment can determine the deployment area based on the parallel area between the first skeleton line and the second skeleton line, then determine a first straight line in the deployment area, and deploy indium pillars at equal intervals along the first straight line at a second preset distance. Based on the position of the indium pillars on the first straight line, indium pillars are deployed at equal intervals along each second straight line at the same second preset distance, thereby eliminating indium pillars located outside the parallel area.

[0181] In the aforementioned indium pillar deployment process, indium pillars are first deployed along a first straight line at a second preset distance. Then, based on the indium pillars deployed along the first straight line, indium pillars are deployed along a second straight line. Since the distance between the first straight line and the line connecting its midpoint is half of the first preset distance, and there must exist a second straight line in the deployment area that is symmetrical to the first straight line about its midpoint, indium pillars are deployed along both this second and first straight lines, thus achieving the centering requirement for indium pillar deployment. Furthermore, in the deployment area, since an indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting two adjacent indium pillar positions on any third straight line and its adjacent third straight line, and the distance between adjacent straight lines is the first preset distance, i.e. The second preset distance is twice the distance between adjacent indium pillars. Therefore, the distance between any two adjacent indium pillars on any third straight line and the intersection point of adjacent third straight lines on the perpendicular bisector is the preset minimum distance between adjacent indium pillars, i.e., the second preset distance. This ensures that the distance between any two adjacent indium pillars in the deployment area is the second preset distance, achieving the densest deployment requirement of indium pillars. It is evident that the technical solution provided by the embodiments of this application can achieve the densest deployment of indium pillars in the quantum chip layout.

[0182] Based on the same inventive concept, and according to the indium pillar deployment method provided in the above embodiments of this application, this application also provides an electronic device, such as... Figure 11 As shown, it includes a processor 1101, a communication interface 1102, a memory 1103, and a communication bus 1104. The processor 1101, communication interface 1102, and memory 1103 communicate with each other via the communication bus 1104.

[0183] Memory 1103 is used to store computer programs;

[0184] When the processor 1101 executes the program stored in the memory 1103, it implements the method steps of deploying indium pillars as described above.

[0185] The communication bus mentioned in the above electronic devices can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus can be divided into address bus, data bus, control bus, etc. For ease of illustration, only one thick line is used to represent it in the diagram, but this does not mean that there is only one bus or one type of bus.

[0186] The communication interface is used for communication between the aforementioned electronic devices and other devices.

[0187] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device. Optionally, the memory may also be at least one storage device located remotely from the aforementioned processor.

[0188] The processors mentioned above can be general-purpose processors, including central processing units (CPUs), network processors (NPs), etc.; they can also be digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0189] Based on the same inventive concept, and according to the indium pillar deployment method provided in the above embodiments of this application, this application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of any of the above indium pillar deployment methods.

[0190] Based on the same inventive concept, and according to the indium pillar deployment method provided in the above embodiments of this application, this application also provides a computer program product containing instructions, which, when run on a computer, causes the computer to execute any of the indium pillar deployment methods in the above embodiments.

[0191] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk (SSD)).

[0192] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0193] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, embodiments such as apparatuses, electronic devices, computer-readable storage media, and computer program products are basically similar to the method embodiments, and therefore the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0194] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A method for deploying indium pillars, characterized in that, The method includes: Based on the parallel region between the first skeleton line and the second skeleton line in the quantum chip layout, a rectangular region that meets the preset conditions is selected as the deployment region, wherein the length of the first right-angled side in the deployment region is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line. In the area to be deployed, any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance equal to half a first preset distance is designated as the first straight line. The second right-angled side is perpendicular to the first right-angled side, and the first preset distance is equal to the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars that has been preset; Based on the location of the first straight line, indium pillars are deployed at equal intervals along the first straight line in the area to be deployed, according to the second preset distance. Based on the position of the indium pillars on the first straight line, indium pillars are deployed at equal intervals on the second straight line in the area to be deployed according to the second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the positions of two adjacent indium pillars on any third straight line in the area to be deployed and its adjacent third straight line. The third straight line includes the first straight line and each second straight line. Remove indium pillars located outside the parallel region.

2. The method according to claim 1, characterized in that, The step of deploying indium pillars at equal intervals along a second straight line in the area to be deployed, based on the positions of the indium pillars on the first straight line and at the second preset distance, includes: For each indium pillar on the first straight line, based on the location of the indium pillar, indium pillars are deployed at equal intervals along a first preset direction within the area to be deployed, according to the second preset distance. The angle between the first preset direction and the first straight line is π / 3 and 2π / 3.

3. The method according to claim 1, characterized in that, The step of deploying indium pillars at equal intervals along the first straight line in the area to be deployed, according to the position of the first straight line and at the second preset distance, includes: Based on the location of the first straight line, the intersection of the first straight line and any of the second right-angled sides is determined as the first starting point for the deployment of the indium pillars; Based on the first starting point, indium pillars are deployed at equal intervals along the first straight line in the area to be deployed, according to the second preset distance.

4. The method according to claim 3, characterized in that, If the area to be deployed includes the parallel area, then the step of deploying indium pillars at equal intervals along the second straight line in the area to be deployed according to the positions of the indium pillars on the first straight line and at the second preset distance includes: In the second preset direction, a first target position is determined at a distance of the second preset distance from the first starting point, wherein the angle between the second preset direction and the first straight line is π / 3 or 5π / 3, and a fourth straight line passing through the first target position and parallel to the first straight line is symmetrical to the first straight line about the midpoint. Using the first target location as the second starting point, indium pillars are deployed at equal intervals along the fourth straight line in the area to be deployed, according to the second preset distance; Using the first straight line and the fourth straight line as target axes of symmetry respectively, when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to a third preset distance, each indium pillar deployed on the fifth straight line is symmetrically deployed to the sixth straight line based on the target axis of symmetry. The third skeleton line is the first skeleton line or the second skeleton line that is closest to the target axis of symmetry. The third preset distance is the sum of the second preset distance and the fourth preset distance. The fourth preset distance is a pre-set clearance distance between the indium pillar and the skeleton line. The fifth straight line is adjacent to the target axis of symmetry and has indium pillars deployed on it. The sixth straight line is updated to the target axis of symmetry. The process then returns to the step of symmetrically deploying each indium pillar deployed on the fifth straight line to the sixth straight line based on the target axis of symmetry when the distance between the target axis of symmetry and the third skeleton line is greater than or equal to the third preset distance, until the distance between the target axis of symmetry and the third skeleton line at the current moment is less than the third preset distance.

5. The method according to claim 1, characterized in that, If the area to be deployed includes the parallel area, then the step of deploying indium pillars at equal intervals along the second straight line in the area to be deployed according to the positions of the indium pillars on the first straight line and at the second preset distance includes: In the third preset direction, a second target position is determined at a distance of the second preset distance from the position of any indium pillar on the first straight line, and the angle between the third preset direction and the first straight line is π / 3 and 5π / 3. When the vertical distance between the second target position and the fourth skeleton line is greater than or equal to the fourth preset distance, the second target position is used as an indium pillar deployment point, and indium pillars are deployed at equal intervals on the seventh straight line in the area to be deployed according to the second preset distance. The seventh straight line is parallel to the first straight line, and the fourth skeleton line is the first skeleton line or the second skeleton line closest to the second target position. The fourth preset distance is the avoidance distance between the indium pillar and the skeleton line that is set in advance. Using the seventh straight line as the first straight line, return to the step of determining the second target position in the third preset direction, with the distance between the target position and the position of any indium pillar on the first straight line being the second preset distance, until the vertical distance at the current moment is less than the fourth preset distance.

6. The method according to claim 1, characterized in that, The step of removing indium pillars located outside the parallel region includes: The parallel region is divided according to any diagonal line to obtain a first triangle and a second triangle; For each indium pillar in the area to be deployed, based on the third target position where the indium pillar is located, calculate the sum of the first areas of all third triangles formed by the third target position and any two vertices of the first triangle; If the sum of the first areas is not equal to the first area of ​​the first triangle, then based on the third target position, calculate the sum of the second areas of all fourth triangles formed by the third target position and any two vertices in the second triangle; If the sum of the second areas is not equal to the second area of ​​the second triangle, then the indium pillar is discarded.

7. The method according to claim 1, characterized in that, The step of selecting a rectangular region that meets preset conditions as the deployment area based on the parallel region between the first and second skeleton lines in the quantum chip layout includes: Based on the parallel region between the first and second skeleton lines in the quantum chip layout, the smallest rectangular region including the parallel region is selected as the deployment area; or, Based on the parallel region between the first skeleton line and the second skeleton line in the quantum chip layout, the smallest rectangular region including the parallel region is selected as the target region. Based on the fourth preset distance, the two third right-angled sides in the target area are reduced to obtain the area to be deployed. The third right-angled side is the side in the target area that does not include the first skeleton line and the second skeleton line. The fourth preset distance is the pre-set avoidance distance between the indium pillar and the skeleton line.

8. An indium pillar deployment device, characterized in that, The device includes: The selection module is used to select a rectangular area that meets preset conditions as a deployment area based on the parallel area between the first skeleton line and the second skeleton line in the quantum chip layout. The length of the first right-angled side of the deployment area is equal to the length of the first skeleton line, and the length of the first skeleton line is greater than or equal to the length of the second skeleton line. The determining module is configured to, within the deployment area, determine any straight line parallel to the line connecting the midpoints of the second right-angled side and at a distance equal to half a first preset distance, as the first straight line, wherein the second right-angled side is perpendicular to the first right-angled side, and the first preset distance is equal to the second preset distance. The second preset distance is the minimum distance between adjacent indium pillars that has been preset; The first deployment module is used to deploy indium pillars at equal intervals along the first straight line in the area to be deployed, according to the location of the first straight line and at the second preset distance. The second deployment module is used to deploy indium pillars at equal intervals on a second straight line in the area to be deployed, according to the positions of the indium pillars on the first straight line and at a second preset distance. The second straight line is parallel to the first straight line, and the distance between the second straight line and the first straight line is a positive integer multiple of the first preset distance. An indium pillar is deployed at the intersection of the perpendicular bisector of the line connecting the positions of two adjacent indium pillars on any third straight line in the area to be deployed and the adjacent third straight line. The third straight line includes the first straight line and each second straight line. The rejection module is used to reject indium pillars located outside the parallel region.

9. An electronic device, characterized in that, It includes a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; Memory, used to store computer programs; A processor, when executing a program stored in memory, implements the steps of the method described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the method described in any one of claims 1-7.

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