Detection processing method, computer device and storage medium

Abstract

This application discloses a detection processing method, computer equipment, and storage medium. The method includes: capturing a first image of a motherboard under test using a first imaging device at a first imaging angle; determining the edge contour and contour length of the first image; if the motherboard under test is determined to have completed grinding based on the contour length, capturing a second image of the motherboard under test using a second imaging device at a second imaging angle; determining the true attribute information of each solder ball in the motherboard under test based on the second image; and determining the detection result of each solder ball based on the true attribute information and preset attribute information. Using this application can improve detection efficiency.

Description

Technical Field

[0001] This application belongs to the field of intelligent control technology, and in particular relates to a detection and processing method, computer equipment and storage medium. Background Technology

[0002] Solder balls are critical connection components in semiconductor chip packaging, and their quality directly affects the performance and reliability of the entire electronic product. Inspecting the solder balls ensures that products meet high quality standards before leaving the factory, preventing product failures or performance degradation caused by solder ball defects.

[0003] In related technologies, X-ray inspection equipment can be used to scan and analyze each solder ball individually. However, the inspection efficiency is low when the number of solder balls is large. Summary of the Invention

[0004] This application provides a detection processing method, computer equipment, and storage medium to solve the problem of low detection efficiency.

[0005] In a first aspect, embodiments of this application provide a detection processing method, the detection processing method comprising: capturing a first image of a motherboard under test using a first imaging device at a first imaging angle; determining the edge contour of the first image and the contour length of the edge contour; if the motherboard under test is determined to have completed grinding based on the contour length, capturing a second image of the motherboard under test using a second imaging device at a second imaging angle; determining the true attribute information of each solder ball in the motherboard under test based on the second image; and determining the detection result of each solder ball based on the true attribute information and preset attribute information.

[0006] In some embodiments, determining the edge contour of the first image and the contour length of the edge contour includes: determining the edge contour of the motherboard under test in the first image; determining a circumscribed rectangle based on the edge contour; and determining the contour length based on the circumscribed rectangle.

[0007] In some embodiments, the method for determining whether the grinding of the motherboard under test is complete includes: if the contour length is the same as the preset contour length, then the grinding of the motherboard under test is determined to be complete; if the contour length is not the same as the preset contour length, then the length difference between the contour length and the preset contour length is determined; if the length difference is greater than or equal to the preset difference, then the grinding of the motherboard under test is continued by a first grinding device; if the length difference is less than the preset difference, then the grinding of the motherboard under test is continued by a second grinding device.

[0008] In some embodiments, before determining the true attribute information of each solder ball in the motherboard under test based on the second image, the method further includes: obtaining a preset calibration position on a motherboard template; determining a positioning area corresponding to the second image based on the calibration position; determining multiple detection areas corresponding to the second image based on the positioning area; and determining the true attribute information of each solder ball in the multiple detection areas.

[0009] In some embodiments, determining the location region corresponding to the second image based on the calibration position includes: determining a template image corresponding to the calibration position; selecting the location region from the second image, wherein the similarity between the location region and the template image is greater than or equal to a preset threshold.

[0010] In some embodiments, determining the plurality of detection regions corresponding to the second image based on the positioning region includes: determining the plurality of detection regions corresponding to the second image based on the preset positional relationship between the positioning region and the detection region.

[0011] In some embodiments, determining the true attribute information of each solder ball in the motherboard under test based on the second image includes: determining the true length, true width, and true area of ​​each solder ball as the true attribute information based on the second image.

[0012] In some embodiments, determining the detection result of each solder ball based on the actual attribute information and the preset attribute information includes: if the actual attribute information of any solder ball is the same as the preset attribute information, then the detection of any solder ball is determined to be normal; if the actual attribute information of any solder ball is different from the preset attribute information, then the detection of any solder ball is determined to be abnormal.

[0013] Secondly, embodiments of this application provide a detection processing apparatus, comprising: a first image capturing module, configured to capture a first image of a motherboard under test using a first capturing device at a first capturing angle; a contour length determining module, configured to determine the edge contour of the first image and the contour length of the edge contour; a second image capturing module, configured to capture a second image of the motherboard under test using a second capturing device at a second capturing angle if the motherboard under test is determined to have completed grinding based on the contour length; a true attribute determining module, configured to determine the true attribute information of each solder ball in the motherboard under test based on the second image; and a detection result determining module, configured to determine the detection result of each solder ball based on the true attribute information and preset attribute information.

[0014] Thirdly, embodiments of this application provide a computer device, including a controller and a memory, wherein the controller is used to execute a computer program stored in the memory to implement the detection processing method described in any one of the above.

[0015] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a controller, implements the detection and processing method described in any one of the above claims.

[0016] The detection processing method provided in this application embodiment utilizes a first imaging device to capture a first image of the motherboard under test from a first imaging angle, and determines the timing of capturing a second image based on the contour length of the edge contour of the first image. By automatically controlling the second imaging device, the acquisition efficiency of the second image can be improved. Furthermore, this application utilizes a second imaging device to capture a second image of the motherboard under test from a second imaging angle, determines the true attribute information of multiple solder balls in the motherboard under test based on the second image, and determines the detection result of each solder ball based on the true attribute information and preset attribute information, thereby improving detection efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the application environment of the detection and processing method provided in the embodiments of this application; Figure 2 This is a schematic flowchart of the detection and processing method provided in the embodiments of this application; Figure 3 This is a schematic diagram of the edge contour provided in the embodiments of this application; Figure 4 This is a flowchart illustrating the method for determining real attribute information provided in an embodiment of this application; Figure 5 This is a schematic diagram of the detection area provided in the embodiments of this application; Figure 6 This is a flowchart illustrating the positioning area determination method provided in an embodiment of this application; Figure 7 This is a schematic diagram of the detection and processing device provided in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of the computer device provided in the embodiments of this application. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "a plurality of" means two or more, unless otherwise explicitly specified.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] The following will describe some embodiments of this application in detail with reference to the accompanying drawings.

[0022] Figure 1 This is an application scenario diagram of the detection and processing method provided in the embodiments of this application. For example... Figure 1 As shown, the application scenario of the detection and processing method includes a carrier device 10, a first imaging device 20, a second imaging device 30, and a computer device 40. Figure 8 (As shown in the diagram). The first imaging device 20 and the second imaging device 30 can communicate with the computer device 40 via a network. The network serves as a medium for providing communication links between the first imaging device 20 and the computer device 40, and between the second imaging device 30 and the computer device 40. The network can include various connection types, such as wired communication links and wireless communication links, and is not limited thereto.

[0023] In some embodiments, the supporting device 10 is used to support and fix the motherboard 50 under test after polishing. The motherboard 50 under test may include a single-layer motherboard or a double-layer motherboard. This embodiment of the application uses a double-layer motherboard as an example for illustration. The motherboard 50 under test can be polished in a specified direction using a polishing platform (not shown in the figure) to detect the solder balls inside the polished motherboard 50. In some embodiments, the polishing platform includes multiple polishing devices, which are used to polish the motherboard 50 under test. Each polishing device has a different polishing precision, and the number of polishing devices can be set according to actual needs. For example, the number of polishing devices can be 2, 3, 4, etc., and is not limited here. This embodiment of the application uses 2 polishing devices as an example for illustration. The polishing platform includes a first polishing device (not shown in the figure) and a second polishing device (not shown in the figure). The first polishing device and the second polishing device have different polishing precisions, and the polishing precision of the first polishing device is less than that of the second polishing device. By setting a first polishing device and a second polishing device with different polishing precisions on the polishing platform, this application can achieve both coarse and fine polishing of the motherboard 50 under test, improving polishing efficiency and accuracy. In some embodiments, the grinding platform further includes a displacement sensor (not shown in the figure), which is used to monitor the moving distance of the grinding equipment (e.g., a first grinding equipment or a second grinding equipment). Based on the moving distance, the grinding length of the motherboard 50 under test can be determined, and the grinding length can represent the length of the motherboard 50 under test that has been ground. This embodiment of the application utilizes a displacement sensor to monitor the grinding length of the motherboard 50 under test, which can improve the grinding accuracy of the motherboard 50 under test.

[0024] In some embodiments, the first imaging device 20 is used to capture a first image of the motherboard 50 under test based on a first imaging angle. The first imaging device 20 can be positioned vertically to the support device 10. Based on the first imaging angle, an image of the upper surface of the motherboard 50 under test can be captured, and this upper surface image is used as the first image.

[0025] In some embodiments, the second imaging device 30 is used to capture a second image of the motherboard 50 under test based on a second imaging angle. The second imaging device 30 can be positioned in the horizontal direction of the supporting device 10. Based on the second imaging angle, a side surface image of the motherboard 50 under test can be captured, and the side surface image is used as the second image.

[0026] In some embodiments, the computer device 10 includes, but is not limited to, any electronic product that can interact with a user via a keyboard, mouse, remote control, touchpad, or voice control device, such as a personal computer, tablet computer, or smartphone.

[0027] In some embodiments, when the motherboard 50 under test is being inspected, the motherboard 50, after being polished by the polishing platform, is placed at a designated position on the carrier device 10. A first image of the motherboard 50 is captured by a first imaging device 20 at a first shooting angle and transmitted to a computer device 40. Based on the first image, the computer device 40 detects whether the polishing of the motherboard 50 is complete, and after confirming that the polishing is complete, sends a shooting command to a second imaging device 30. The second imaging device 30 captures a second image of the motherboard 50 based on the shooting command and transmits the second image to the computer device 40. Based on the second image, the computer device 40 determines the inspection result for each solder ball in the motherboard 50.

[0028] In the application scenarios provided in this application embodiment, the first imaging device 20 captures a first image of the motherboard 50 under test from a first shooting angle, and the computer device 40 determines the timing for capturing the second image based on the first image. By automatically controlling the second imaging device 30, the acquisition efficiency of the second image can be improved. Furthermore, this application utilizes the second imaging device 30 to capture a second image of the motherboard 50 under test from a second shooting angle, and the computer device 40 determines the true attribute information of multiple solder balls in the motherboard 50 under test based on the second image, and determines the detection result of each solder ball based on the true attribute information and preset attribute information, thereby improving detection efficiency.

[0029] Figure 2 This is a schematic flowchart of the detection and processing method provided in the embodiments of this application. The detection and processing method is applied to computer equipment (e.g., Figure 8 Computer equipment 40). For example Figure 2 As shown, it includes the following steps: S11, using a first imaging device to capture a first image of the motherboard under test from a first imaging angle.

[0030] In at least one embodiment of this application, the motherboard under test can refer to a motherboard requiring solder ball detection. The motherboard under test is placed in a polishing platform and polished in a specified direction so that solder balls within the motherboard can be detected. The specified direction can be set according to actual needs and is not limited herein. During the polishing process, a first imaging device captures a first image of the motherboard under test from a first imaging angle. The imaging frequency of the first imaging device can be set according to actual needs; for example, the imaging frequency can be determined based on the polishing speed of the polishing platform. The faster the polishing speed, the higher the imaging frequency; the slower the polishing speed, the lower the imaging frequency. In some embodiments, a correspondence between polishing speed and imaging frequency can be preset, and the imaging frequency of the first imaging device can be determined by querying this correspondence.

[0031] In some embodiments, the first image may represent an image of the upper surface of the motherboard under test, and the first image includes an image of the motherboard under test as well as other interfering images. The first image can be processed by a pre-trained image recognition model to remove interfering images (e.g., an image of a grinding platform) to obtain an image containing only the motherboard under test. The input data of the image recognition model is an image containing both motherboard and interfering information, and the output data is an image with interfering information removed. The training method of the image recognition model can include supervised training and unsupervised training, and is not limited thereto.

[0032] S12, determine the edge contour of the first image and the contour length of the edge contour.

[0033] In at least one embodiment of this application, the edge contour can represent the edge contour of the motherboard under test in the first image. Determining the edge contour of the first image and the contour length of the edge contour includes: determining the edge contour of the motherboard under test in the first image; determining a circumscribed rectangle based on the edge contour; and determining the contour length based on the circumscribed rectangle. The edge contour can be obtained by a contour recognition model. The input data of the contour recognition model is the first image, and the output data is the edge contour of the motherboard in the first image. For example, the edge contour of the motherboard is highlighted in the first image. The training method of the contour recognition model can include supervised learning or unsupervised learning, and is not limited here. Based on the circumscribed rectangle of the motherboard under test, the contour length of the edge contour can be determined. For example, the side length of the circumscribed rectangle can be used as the contour length of the edge contour. Alternatively, the sides of the circumscribed rectangle can be truncated, and the length of the truncated side can be used as the contour length of the edge contour. The truncating rules can be set according to actual needs and are not limited here. The above method determines the circumscribed rectangle with a regular shape based on the edge contour of the motherboard under test, and determines the contour length based on the circumscribed rectangle, which can improve the accuracy of contour length determination and thus improve the accuracy of detection.

[0034] Combination Figure 3 A schematic diagram illustrating the edge contours provided in the embodiments of this application. For example... Figure 3 As shown, based on the edge contour of the motherboard under test, four straight lines are fitted to obtain the intersection points of the lines. Based on these intersection points, a circumscribed rectangle can be obtained. The circumscribed rectangle consists of four sides, each of which can have the same or different lengths; this is not a restriction. Based on the multiple sides of the circumscribed rectangle, multiple contour lengths can be determined, namely contour length a, contour length b, contour length c, and contour length d.

[0035] S13, if the grinding of the motherboard under test is completed based on the contour length, a second image of the motherboard under test is captured by a second imaging device based on a second imaging angle.

[0036] In at least one embodiment of this application, the completion of grinding of the motherboard under test can be detected based on the contour length and a preset contour length. The preset contour length can be set according to the internal structure of the motherboard, and there can be multiple preset contour lengths, with a corresponding preset contour length for each contour length. In some embodiments, if each contour length is the same as its corresponding preset contour length, it is determined that the motherboard under test has completed grinding; if any contour length is different from its corresponding preset contour length, it is determined that the motherboard under test has not completed grinding.

[0037] In some embodiments, after determining that the motherboard under test has not completed grinding, the grinding process is continued using a grinding platform. After determining that the motherboard under test has completed grinding, a second image of the motherboard under test is captured using a second imaging device at a second imaging angle. The second image may represent a side surface image of the motherboard under test and includes images of multiple solder balls on the motherboard under test.

[0038] S14, Based on the second image, determine the true attribute information of each solder ball in the motherboard under test.

[0039] In at least one embodiment of this application, based on a second image, multiple solder balls in the second image can be identified, and the true length, true width, and true area of ​​each solder ball can be determined as the true attribute information.

[0040] In some embodiments, before determining the true attribute information of each solder ball in the motherboard under test based on the second image, the method further includes: detecting whether cracks and bubbles exist in each solder ball in the motherboard under test based on the second image; if the detection result is that no cracks or bubbles exist in any solder ball in the motherboard under test, then determining the true attribute information of each solder ball in the motherboard under test; if the detection result is that any solder ball in the motherboard under test has a crack or has a bubble, then determining that any solder ball is abnormal. A crack recognition model and a bubble recognition model can be trained. The crack recognition model is used to process the second image to detect whether cracks exist in each solder ball in the motherboard under test, and the bubble recognition model is used to process the second image to detect whether bubbles exist in each solder ball in the motherboard under test. The input data of the crack recognition model is an image containing solder balls, and the output data is the detection result of whether cracks exist. The training method of the crack recognition model can include supervised and unsupervised methods, which are not limited here. The input data of the bubble recognition model is an image containing solder balls, and the output data is the detection result of whether bubbles exist. The training methods for bubble recognition models can include supervised and unsupervised methods, and there are no restrictions here.

[0041] S15, based on the real attribute information and the preset attribute information, determine the detection result of each solder ball.

[0042] In at least one embodiment of this application, the detection result may include normal detection and abnormal detection. Determining the detection result of each solder ball based on the actual attribute information and preset attribute information includes: if the actual attribute information of any solder ball is the same as the preset attribute information, then the detection of any solder ball is determined to be normal; if the actual attribute information of any solder ball is different from the preset attribute information, then the detection of any solder ball is determined to be abnormal. The preset attribute information may include a preset length, a preset width, and a preset area. If the actual length of the solder ball is the same as the preset length, the actual width is the same as the preset width, and the actual area is the same as the preset area, then the actual attribute information of the solder ball is determined to be the same as the preset attribute information; if the actual length of the solder ball is different from the preset length, and / or the actual width is different from the preset width, and / or the actual area is different from the preset area, then the actual attribute information of the solder ball is determined to be different from the preset attribute information. The preset length, preset width, and preset area can be preset according to actual needs and are not limited here.

[0043] The detection processing method provided in this application embodiment utilizes a first imaging device to capture a first image of the motherboard under test from a first imaging angle, and determines the timing of capturing a second image based on the contour length of the edge contour of the first image. By automatically controlling the second imaging device, the acquisition efficiency of the second image can be improved. Furthermore, this application utilizes a second imaging device to capture a second image of the motherboard under test from a second imaging angle, determines the true attribute information of multiple solder balls in the motherboard under test based on the second image, and determines the detection result of each solder ball based on the true attribute information and preset attribute information, thereby improving detection efficiency.

[0044] In at least one embodiment of this application, it can be determined whether the motherboard under test has completed grinding based on the contour length and a preset contour length. In some embodiments, the method for determining whether the grinding of the motherboard under test is complete includes: if the contour length is the same as the preset contour length, then the motherboard under test is determined to have completed grinding; if the contour length is not the same as the preset contour length, then the length difference between the contour length and the preset contour length is determined; if the length difference is greater than or equal to the preset difference, then the motherboard under test is ground again using a first grinding device; if the length difference is less than the preset difference, then the motherboard under test is ground again using a second grinding device.

[0045] In some embodiments, the outer rectangle of the motherboard under test includes four sides, and the contour length can be determined based on each side, resulting in four contour lengths. For each contour length, there exists a corresponding preset contour length. In some embodiments, a target side is selected from the outer rectangle of the motherboard under test, and the contour length corresponding to the target side and the preset contour length are determined. The target side can represent a side length highly correlated with the solder ball arrangement within the motherboard under test, and the target side can be determined based on the grinding position of the motherboard under test. Please continue reading. Figure 3 , Figure 3 The white rectangular frame contains multiple solder balls. The side containing the contour length 'b' is designated as the grinding position, and grinding is performed at this position using a grinding platform. Based on this, contour lengths 'c' and 'd' are side lengths highly correlated with the solder ball arrangement within the motherboard under test; the sides containing contour lengths 'c' and 'd' are designated as target sides. If the contour length of the target side is determined to be different from the preset contour length, the grinding platform continues grinding at the designated grinding position on the motherboard under test until the contour length of the target side matches the preset contour length.

[0046] In some embodiments, the grinding platform includes a first grinding device and a second grinding device, wherein the grinding precision of the first grinding device is lower than that of the second grinding device. If the length difference is greater than or equal to a preset difference, it indicates that the motherboard under test needs to be ground over a longer distance. In this case, the first grinding device with lower grinding precision is used to grind the motherboard under test, thereby improving grinding efficiency. If the length difference is less than the preset difference, it indicates that the motherboard under test needs to be ground over a shorter distance. In this case, the second grinding device with higher grinding precision can be used to grind the motherboard under test, thereby improving grinding accuracy.

[0047] In the detection processing method provided in this application embodiment, the grinding of the motherboard under test is determined based on the contour length and the preset contour length, thereby determining the timing of the second image capture. By automatically controlling the second imaging device, the acquisition efficiency of the second image can be improved. Furthermore, when the motherboard under test has not completed grinding, this application determines whether to use the first grinding device or the second grinding device for grinding based on the length difference between the contour length and the preset contour length, which can improve grinding efficiency and accuracy.

[0048] In at least one embodiment of this application, before determining the true attribute information of multiple solder balls in the motherboard under test based on the second image, multiple detection areas of the second image can be determined, each detection area containing multiple solder balls, thereby enabling the detection of solder balls in each detection area. Figure 4 This is a flowchart illustrating the method for determining true attribute information provided in an embodiment of this application. The method for determining true attribute information is applied in computer devices. Figure 4 As shown, it includes the following steps: S21, obtain the preset calibration position on the motherboard template.

[0049] In at least one embodiment of this application, for each motherboard under test, there is a corresponding motherboard template. The layout positions of each component on the motherboard template are the same as the layout positions of each component in the motherboard under test. The components may include a central processing unit (CPU), a battery, a capacitor, and a resistor, etc. The calibration position is a pre-set position used to locate the solder balls.

[0050] S22, Based on the calibration position, determine the positioning area corresponding to the second image.

[0051] In at least one embodiment of this application, a calibration position is determined in the second image, and the area where the calibration position is located is used as the positioning area.

[0052] S23, Based on the positioning area, determine multiple detection areas corresponding to the second image.

[0053] In at least one embodiment of this application, the detection area is the area where solder ball detection is required. Each detection area contains multiple solder balls, and the number of solder balls in each detection area may be the same or different. The number of detection areas can be determined based on the total number of solder balls in the motherboard under test and the field of view of the second imaging device. If the total number of solder balls is larger and the field of view of the second imaging device is smaller, then the number of detection areas is larger; if the total number of solder balls is smaller, then the number of detection areas is smaller.

[0054] In some embodiments, a positional relationship exists between the detection area and the positioning area. By querying this positional relationship, multiple detection areas can be determined. The positional relationship may include orientation information and distance information; for example, the positional relationship includes the orientation information of the detection area within the positioning area and the distance information between the detection area and the positioning area. Based on the orientation and distance information, the detection area corresponding to the positioning area can be determined.

[0055] Combination Figure 5 This is a schematic diagram illustrating the detection area provided in an embodiment of this application. For example... Figure 5 As shown, there is one positioning area and two detection areas, located to the upper right of the positioning area. Each detection area contains multiple solder balls.

[0056] S24, determine the true attribute information of each solder ball in the plurality of detection areas.

[0057] In at least one embodiment of this application, the real attribute information may include at least one of real length, real width and real area. Based on the real attribute information of each solder ball, it is possible to detect whether the solder ball is abnormal.

[0058] In the detection processing method provided in this application embodiment, by determining the positioning area of ​​the motherboard to be tested, multiple detection areas of the second image can be quickly determined based on the positioning area, thereby determining the true attribute information of each solder ball in the multiple detection areas, which can improve the efficiency of solder ball detection.

[0059] In at least one embodiment of this application, a calibration position is determined in the second image, and the area where the calibration position is located is used as the positioning region. The positioning region of the second image can be determined using image similarity. Figure 6 This is a flowchart illustrating the positioning area determination method provided in an embodiment of this application. The positioning area determination method is applied to computer devices. Figure 6 As shown, it includes the following steps: S31, determine the template image corresponding to the calibration position.

[0060] In at least one embodiment of this application, a template image at a marked position on the motherboard template is acquired using a preset imaging device, or a template image corresponding to each motherboard under test is pre-stored.

[0061] S32, Select the positioning region from the second image, wherein the similarity between the positioning region and the template image is greater than or equal to a preset threshold.

[0062] In at least one embodiment of this application, a region in the second image whose similarity to the template image is greater than or equal to a preset threshold is selected as the positioning region. The preset threshold can be set according to actual needs and is not limited here.

[0063] In the detection processing method provided in this application embodiment, a template image corresponding to the calibration position is determined based on the motherboard template, and the positioning region is selected from the second image. The similarity between the positioning region and the template image is greater than or equal to a preset threshold. Determining the positioning region of the second image by means of image similarity can improve the efficiency of positioning region determination, thereby improving the detection efficiency of solder balls.

[0064] Please see Figure 7 , Figure 7This is a schematic diagram of the structure of the detection processing apparatus provided in an embodiment of this application. In some embodiments, the detection processing apparatus 20 may include multiple functional modules composed of computer program segments. The computer programs of each program segment in the detection processing apparatus 20 may be stored in the memory of the computer device 40 and executed by at least one controller to perform the detection processing function (see details). Figure 2 describe).

[0065] In this embodiment, the detection processing device 20 can be divided into multiple functional modules according to the functions it performs. These functional modules may include: a first image capturing module 201, a contour length determination module 202, a second image capturing module 203, a true attribute determination module 204, and a detection result determination module 205. The term "module" in this application refers to a series of computer program segments that can be executed by at least one controller and perform a fixed function, and which are stored in memory. In this embodiment, the functions of each module will be detailed in subsequent embodiments.

[0066] The first image capturing module 201 can be used to capture a first image of the motherboard under test using a first capturing device based on a first capturing angle.

[0067] The contour length determination module 202 can be used to determine the edge contour of the first image and the contour length of the edge contour.

[0068] The second image capturing module 203 can be used to capture a second image of the motherboard under test based on a second shooting angle if the grinding of the motherboard under test is determined based on the contour length.

[0069] The true attribute determination module 204 can be used to determine the true attribute information of each solder ball in the motherboard under test based on the second image.

[0070] The detection result determination module 205 can be used to determine the detection result of each solder ball based on the actual attribute information and the preset attribute information. It is understood that the detection processing device 20 and the detection processing method of the above embodiments belong to the same inventive concept. The specific implementation of each module of the detection processing device 20 corresponds to each step of the detection processing method in the above embodiments, and will not be elaborated here.

[0071] The module division described above is a logical functional division, and other division methods may be used in actual implementation. Furthermore, the functional modules in the various embodiments of this application can be integrated into the same processing unit, or each module can exist physically separately, or two or more modules can be integrated into the same unit. The integrated modules described above can be implemented in hardware or in a combination of hardware and software functional modules.

[0072] Figure 8 This is a schematic diagram of the structure of the computer device 40 provided in an embodiment of this application. Figure 8 As shown, the computer device 40 includes a memory 41, at least one controller 42, and at least one communication bus 43. The controller 42 is used to implement a detection processing method when executing a computer program stored in the memory 41. The at least one communication bus 43 is configured to enable communication between the first imaging device 20, the second imaging device 30, the memory 41, and at least one controller 42.

[0073] Figure 8 The structure of the computer device shown does not constitute a limitation on the embodiments of this application. The computer device 40 may also include more or fewer other hardware or software, or different component arrangements than those shown in the figure.

[0074] In some embodiments of this application, the computer device 40 may also be connected to a client device, which includes, but is not limited to, any electronic product that can interact with the user via a keyboard, mouse, remote control, touchpad or voice control device, such as a personal computer, tablet computer, smartphone, digital camera, etc.

[0075] It should be noted that computer equipment 40 is merely an example. Other existing or future electronic products that are suitable for this application should also be included within the scope of protection of this application and are incorporated herein by reference.

[0076] In some embodiments, the computer device 40 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0077] In some embodiments, the memory 41 stores a computer program, which, when executed by at least one controller 42, implements all or part of the steps in the detection processing method of this application embodiment. The memory 41 includes read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically-erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium capable of carrying or storing data.

[0078] In some embodiments, the computer-readable storage medium may primarily include a stored program area and a stored data area, wherein the stored program area may store an operating system, an application program required for at least one function, etc.; and the stored data area may store data created based on the use of the computer device 40, etc.

[0079] In some embodiments, at least one controller 42 is the control unit of the computer device 40, connecting various components of the computer device 40 via various interfaces and lines. It executes programs or modules stored in the memory 41 and calls data stored in the memory 41 to perform various functions and process data within the computer device 40. For example, when at least one controller 42 executes a computer program stored in the memory, it implements all or part of the steps of the detection processing method in the embodiments of this application. At least one controller 42 may be composed of integrated circuits, such as a single-packaged integrated circuit or multiple integrated circuits with the same or different functions, including one or more central processing units (CPUs), microcontrollers, digital processing chips, graphics controllers, and combinations of various control chips.

[0080] The integrated unit implemented as a software functional module described above can be stored in a computer-readable storage medium. This software functional module, stored in a storage medium, includes several instructions to cause a computer device (which may be a personal computer, computer equipment, or network device, etc.) or controller (processor) to execute portions of the methods of the various embodiments of this application.

[0081] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and other division methods may be used in actual implementation.

[0082] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0083] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional modules.

[0084] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other elements or, and the singular does not exclude the plural. Multiple elements or devices recited in the specification may also be implemented by a single element or device through software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A detection and processing method, characterized in that, The detection and processing method includes: A first image of the motherboard under test is captured using a first imaging device at a first imaging angle. Determine the edge contour of the first image and the contour length of the edge contour; If the grinding of the motherboard under test is determined based on the contour length, a second image of the motherboard under test is captured using a second imaging device at a second imaging angle. Based on the second image, determine the true attribute information of each solder ball in the motherboard under test; Based on the actual attribute information and the preset attribute information, the detection result of each solder ball is determined.

2. The detection and processing method as described in claim 1, characterized in that, Determining the edge contour of the first image and the contour length of the edge contour includes: Determine the edge contour of the motherboard under test in the first image; Based on the edge contour, a circumscribed rectangle is determined, and based on the circumscribed rectangle, the contour length is determined.

3. The detection and processing method as described in claim 1, characterized in that, The method for determining whether the grinding of the motherboard under test is complete includes: If the contour length is the same as the preset contour length, then the motherboard under test is determined to have completed grinding. If the outline length is not the same as the preset outline length, then the length difference between the outline length and the preset outline length is determined; if the length difference is greater than or equal to the preset difference, then the motherboard under test is ground again by the first grinding device; if the length difference is less than the preset difference, then the motherboard under test is ground again by the second grinding device.

4. The detection and processing method as described in claim 1, characterized in that, Before determining the true attribute information of each solder ball in the motherboard under test based on the second image, the method further includes: Obtain the calibration position on the preset motherboard template; Based on the calibration position, the positioning area corresponding to the second image is determined; Based on the location region, multiple detection regions corresponding to the second image are determined; Determine the true attribute information of each solder ball in the multiple detection areas.

5. The detection and processing method as described in claim 4, characterized in that, The step of determining the positioning region corresponding to the second image based on the calibrated position includes: Determine the template image corresponding to the calibration position; The positioning region is selected from the second image, and the similarity between the positioning region and the template image is greater than or equal to a preset threshold.

6. The detection and processing method as described in claim 4, characterized in that, The step of determining multiple detection regions corresponding to the second image based on the positioning region includes: Based on the preset positional relationship between the positioning area and the detection area, the plurality of detection areas corresponding to the second image are determined.

7. The detection and processing method as described in claim 1, characterized in that, The step of determining the true attribute information of each solder ball in the motherboard under test based on the second image includes: Based on the second image, the true length, true width, and true area of ​​each solder ball are determined as the true attribute information.

8. The detection and processing method as described in claim 1, characterized in that, The step of determining the detection result of each solder ball based on the actual attribute information and the preset attribute information includes: If the actual attribute information of any solder ball is the same as the preset attribute information, then the detection of any solder ball is determined to be normal. If the actual attribute information of any solder ball is different from the preset attribute information, then the detection of any solder ball is determined to be abnormal.

9. A computer device, characterized in that, It includes a controller and a memory, wherein the controller is used to implement the detection processing method as described in any one of claims 1 to 8 when executing a computer program stored in the memory.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by the controller, implements the detection processing method as described in any one of claims 1 to 8.

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