reactor

Abstract

A reactor comprising: a ring-shaped magnetic core; a substrate having a plurality of conductor patterns; and a plurality of conductive members formed in a generally U-shape and joined to the substrate in a manner spanning the magnetic core and arranged side-by-side in the extending direction of the magnetic core, wherein the conductive members are connected to the ends of the conductor patterns at their joint portions with the substrate, the conductor patterns being electrically connected to adjacent conductive members in the extending direction, and the plurality of conductor patterns and the plurality of conductive members being arranged to surround the magnetic core and connected in a coil-like manner.

Description

Technical Field

[0001] This invention relates to a reactor. Background Technology

[0002] Japanese Patent Application Publication No. 2017-034012 discloses a structure in which, for a reactor with a winding wound on a magnetic core, the end of the winding is joined to a substrate, thereby integrating the reactor with the substrate. Summary of the Invention

[0003] In the structure described in Japanese Patent Application Publication No. 2017-034012, the manufacturing process includes a step of winding the winding onto a magnetic core and a step of assembling the reactor onto a substrate after winding the winding onto the magnetic core. The step of winding the winding onto the magnetic core is complex and incurs manufacturing costs.

[0004] The present invention was made in view of the above circumstances, and its object is to provide a reactor that can simplify the structure by means of a structure that does not include windings and can reduce manufacturing costs.

[0005] The reactor according to the first aspect of the present invention comprises:

[0006] A ring-shaped magnetic core;

[0007] A substrate having multiple conductor patterns formed thereon; and

[0008] Multiple conductive components, formed in a generally U-shape, are coupled to the substrate in a configuration that spans the magnetic core and are arranged side-by-side in the extending direction of the magnetic core.

[0009] The conductive component is connected to the end of the conductor pattern at the junction with the substrate.

[0010] The conductor pattern electrically connects adjacent conductive components to each other in the extending direction.

[0011] The plurality of conductor patterns and the plurality of conductive components are arranged to surround the magnetic core and are connected in a coil-like manner.

[0012] In this invention, a reactor can be simplified by eliminating the need for windings, and manufacturing costs can be reduced. Attached Figure Description

[0013] Hereinafter, with reference to the accompanying drawings, the features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will be described, in which the same reference numerals denote the same elements, and wherein:

[0014] Figure 1 This is a diagram showing the reactor in the first embodiment.

[0015] Figure 2 This is a diagram illustrating the structure of the reactor in the first embodiment.

[0016] Figure 3 It is a diagram used to illustrate conductor patterns.

[0017] Figure 4 It is a diagram used to illustrate the detailed structure of the copper plate and conductor pattern.

[0018] Figure 5 This is a diagram schematically showing the reactor of the first modified example in the first embodiment.

[0019] Figure 6 This is a diagram schematically showing the reactor of the second variation of the first embodiment.

[0020] Figure 7 This is a diagram showing the reactor in the second embodiment.

[0021] Figure 8 It is a diagram used to illustrate the detailed structure of bypass circuits and semiconductor switches.

[0022] Figure 9 This is a diagram showing the reactor in the third embodiment.

[0023] Figure 10 This is a diagram illustrating the detailed structure of the reactor in the third embodiment.

[0024] Figure 11 It is a diagram used to illustrate the detailed structure of the first copper plate, the second copper plate, the first conductor pattern, and the second conductor pattern.

[0025] Figure 12 This is a diagram showing the reactor in a modified example of the third embodiment. Detailed Implementation

[0026] The reactor in the embodiments of the present invention will be described in detail below. However, the present invention is not limited to the embodiments described below.

[0027] Implementation Method 1

[0028] Figure 1 This diagram schematically illustrates the reactor in the first embodiment. The reactor 1 is a reactor without windings. The reactor 1 includes a magnetic core 2, multiple copper plates 3, and a substrate 4. The reactor 1 has an integrated structure of the copper plates 3 and the substrate 4. Multiple conductor patterns 5 are provided on the substrate 4. The multiple copper plates 3 and the multiple conductor patterns 5 are arranged to surround the magnetic core 2 and are connected in a coil-like manner. The reactor 1 is mounted in a vehicle.

[0029] The magnetic core 2 is a ring-shaped magnetic core made of magnetic material and is formed into a flat cylindrical shape. Viewed from the Z-direction, the magnetic core 2 has a straight portion extending in a straight line and a curved portion extending in a curved line. The magnetic core 2 is positioned opposite the mounting surface 4a of the substrate 4. The magnetic core 2 is separated from the substrate 4 in the Z-direction, and an insulating member (not shown) is placed between the magnetic core 2 and the substrate 4. The magnetic core 2 is supported on the substrate 4 via the insulating member. For example, an insulating member made of a gel-like material is placed between the magnetic core 2 and the mounting surface 4a. Figure 1 , Figure 2 As shown, the magnetic core 2 has a first end face 2a as one side of the Z direction, a second end face 2b as the other side of the Z direction, and a through hole 2c extending through in the Z direction. The second end face 2b is opposite to the mounting surface 4a.

[0030] The copper plate 3 is a conductive component formed in a generally U-shape. The copper plates 3 are bonded to the substrate 4 in a manner that spans the magnetic core 2, and multiple copper plates 3 are arranged side-by-side in the extending direction of the magnetic core 2. In the first embodiment, five copper plates 3 are arranged at predetermined intervals in the extending direction of the magnetic core 2. The copper plates 3 are flat plates perpendicular to the mounting surface 4a, arranged with the Y direction as the thickness direction, the X direction as the width direction, and the Z direction as the height direction. Sometimes, the side in the Z direction is described as the upper side, and the other side in the Z direction as the lower side.

[0031] The copper plate 3 has a first leg 3a, a second leg 3b, and a middle portion 3c. The first leg 3a is disposed on the outer periphery of the magnetic core 2, and its end 3d is engaged with the substrate 4. The second leg 3b is disposed on the inner periphery of the magnetic core 2, and its end 3e is engaged with the substrate 4 when inserted into the through hole 2c of the magnetic core 2. The first leg 3a and the second leg 3b extend in the Z direction, and the end 3d of the first leg 3a and the end 3e of the second leg 3b penetrate the substrate 4. The middle portion 3c is the portion connecting the first leg 3a and the second leg 3b. The copper plate 3 has a pair of legs connected via the middle portion 3c. The middle portion 3c is disposed above the first end face 2a of the magnetic core 2 and extends in the X direction. The first leg 3a, the second leg 3b, and the middle portion 3c are all formed in a straight line. Figure 2 , Figure 3 As shown, the copper plate 3 is connected to the end of the conductor pattern 5 at the joint with the substrate 4.

[0032] The substrate 4 is a printed circuit board on which multiple conductor patterns 5 are formed. In the reactor 1, conductor patterns 5 that serve as part of a coil are provided within the substrate 4. The reactor 1 is configured to achieve the same effect as a winding by electrically connecting the conductor patterns 5 to the copper plate 3. The substrate 4 has through holes that serve as the joining portion with the copper plate 3. The through holes of the substrate 4 extend through the thickness direction of the substrate 4 and are holes through which the legs of the copper plate 3 are inserted. The through holes are formed according to the shape of the legs of the copper plate 3, including a first through hole through which a first leg 3a is inserted and a second through hole through which a second leg 3b is inserted. On the substrate 4, multiple first through holes and multiple second through holes are arranged side by side in the Y direction at different positions in the X direction. Among the multiple through holes, the first through holes and the second through holes that are joined to the same copper plate 3 are arranged at the same position in the Y direction but at separate positions in the X direction. These through holes serve as the joining portion between the copper plate 3 and the substrate 4, and as the connection portion between the copper plate 3 and the conductor patterns 5. The copper plate 3 is connected to the end of the conductor pattern 5 at the joint with the substrate 4. The first leg 3a is joined to the conductor pattern 5 by soldering or welding while inserted through the first through hole. The second leg 3b is joined to the conductor pattern 5 by soldering or welding while inserted through the second through hole.

[0033] Conductor pattern 5 is a coil pattern disposed on substrate 4. Multiple conductor patterns 5 are formed side-by-side on substrate 4 in the extending direction of magnetic core 2. The number of conductor patterns 5 corresponds to the number of copper plates 3. Figure 2 , Figure 3 As shown, a portion of the conductor pattern 5 is disposed inside the substrate 4, and the remaining portion protrudes towards the mounting surface 4b. The mounting surface 4b is the side opposite to the mounting surface 4a. The substrate 4 includes a layer with the conductor pattern 5 formed and a layer without the conductor pattern 5 formed. The two ends of the conductor pattern 5 are respectively connected to different copper plates 3. In the first embodiment, the conductor pattern 5 electrically connects adjacent copper plates 3 to each other in the extending direction of the magnetic core 2. The reactor 1 has a current circuit in which copper plates 3 and conductor patterns 5 are alternately connected. In the reactor 1, by alternately connecting copper plates 3 arranged across the magnetic core 2 and conductor patterns 5 on the substrate 4 side, a coil-shaped conductor arranged to surround the magnetic core 2 is formed.

[0034] like Figure 4As shown, copper plates 3A, 3B, 3C, 3D, and 3E are arranged side-by-side sequentially from one side along the Y direction, and conductor patterns 5A, 5B, 5C, and 5D are also arranged side-by-side sequentially. Adjacent copper plates 3A and 3B are electrically connected via conductor pattern 5A. The two ends of conductor pattern 5A are connected to the first leg 3a of copper plate 3A and the second leg 3b of copper plate 3B. Adjacent copper plates 3B and 3C are electrically connected via conductor pattern 5B. The two ends of conductor pattern 5B are connected to the first leg 3a of copper plate 3B and the second leg 3b of copper plate 3C. Adjacent copper plates 3C and 3D are electrically connected via conductor pattern 5C. The two ends of conductor pattern 5C are connected to the first leg 3a of copper plate 3C and the second leg 3b of copper plate 3D. Adjacent copper plates 3D and 3E are electrically connected via conductor pattern 5D. Both ends of conductor pattern 5D are connected to the first leg 3a of copper plate 3D and the second leg 3b of copper plate 3E. Then, when current is input from the second leg 32b of copper plate 3A, current flows from the first leg 3a of copper plate 3A through conductor pattern 5A to the second leg 3b of copper plate 3B. In the same manner, current flows sequentially through copper plate 3B, conductor pattern 5B, copper plate 3C, conductor pattern 5C, copper plate 3D, conductor pattern 5D, and copper plate 3E, and is output from the first leg 3a of copper plate 3E.

[0035] A projection area for projecting the magnetic core 2 in the Z direction exists on the substrate 4. The projection area is not limited to the mounting surface 4a, but includes the interior of the substrate 4. When the substrate 4 is viewed from the Z direction, there is a projection area with the same shape as the magnetic core 2, and the shape of the projection area becomes flat. The through hole of the substrate 4 is provided outside the projection area, so the ends of the copper plate 3 and the conductor pattern 5 are connected outside the projection area. The conductor pattern 5 extends across the projection area and is connected to the positive side support on one side and the negative side support on the other side of the adjacent copper plate 3. When the first support 3a is the positive side support and the second support 3b is the negative side support, only the negative side support is provided on the outer side of one side relative to the projection area, and only the positive side support is provided on the outer side of the other side.

[0036] As explained above, according to the first embodiment, since the copper plate 3 and the substrate 4 are integrated, it is not necessary to wind the wire onto the magnetic core 2, thus simplifying the structure by eliminating the need for windings. When manufacturing the reactor 1, the process of winding the windings onto the magnetic core 2 is eliminated, thereby reducing manufacturing costs. The conductor pattern 5, which is part of the coil, is directly printed on the substrate 4, thus enabling miniaturization and compact design of the reactor 1.

[0037] Furthermore, the structure is not limited to a portion of the conductor pattern 5 being disposed inside the substrate 4. The entire conductor pattern 5 may also be disposed inside the substrate 4. Alternatively, the entire conductor pattern 5 may be disposed only on the mounting surface 4a or the mounting surface 4b.

[0038] Furthermore, the shape of the magnetic core 2 is not particularly limited. The magnetic core 2 can be circular or quadrilateral.

[0039] Furthermore, there is no particular limitation on the number of copper plates 3 or the portion of the copper plates 3 that cross the magnetic core 2. The copper plates 3 are not limited to the straight portion of the magnetic core 2, but can also be arranged to cross the curved portion.

[0040] Furthermore, reactor 1 can also have a metal conductor instead of copper plate 3. The metal conductor is configured in a U-shape or gate shape.

[0041] Variations of the first embodiment

[0042] In a variation of the first embodiment, the reactor 1 includes multiple magnetic cores 2. The reactor 1 may have, for example... Figure 5 The structure shown, where the two magnetic cores 2 overlap in the Z direction, can also have the following characteristics: Figure 6 The structure shown is formed by arranging two magnetic cores 2 in the X direction.

[0043] like Figure 5 As shown, in the first variation of the first embodiment, the reactor 1 includes a first magnetic core 21 and a second magnetic core 22 opposite to the first magnetic core 21 in the Z direction. Both the first magnetic core 21 and the second magnetic core 22 are disposed on the same mounting surface 4a side and are formed in the same shape. Copper plates 3 are disposed across both the first magnetic core 21 and the second magnetic core 22, and multiple plates are arranged side-by-side in both the extending directions of the first magnetic core 21 and the second magnetic core 22. The first magnetic core 21 is constructed similarly to the magnetic core 2. The second magnetic core 22 is disposed opposite to the first end face of the first magnetic core 21 and is separated from the first magnetic core 21 in the Z direction. An insulating member (not shown) is placed between the second end face of the first magnetic core 21 and the first end face of the first magnetic core 21. The second magnetic core 22 is supported on the first magnetic core 21 via the insulating member. The copper plate 3 and conductor pattern 5 form a coil-shaped conductor arranged to surround both the first magnetic core 21 and the second magnetic core 22 arranged in the Z direction. The conductor pattern 5 extends transversely through both the projection areas of the first magnetic core 21 and the second magnetic core 22. In a first variation, the projection areas of the first magnetic core 21 and the second magnetic core 22 coincide. Furthermore, in... Figure 5 In the example shown, copper plates 3 are arranged in the straight sections of the first magnetic core 21 and the second magnetic core 22. However, in the first modified example, copper plates 3 may also be arranged in the curved sections of the first magnetic core 21 and the curved sections of the second magnetic core 22.

[0044] like Figure 6 As shown, in the second variation of the first embodiment, the reactor 1 includes a first magnetic core 21 and a second magnetic core 22 arranged side-by-side with the first magnetic core 21 in the X direction. In the second variation, the straight portions of the first magnetic core 21 and the second magnetic core 22 are arranged opposite each other in the X direction. The straight portions of the first magnetic core 21 and the second magnetic core 22 are arranged parallel in the Y direction and are positioned at the same location in the Y direction. The second magnetic core 22 is positioned opposite the mounting surface 4a and is separated from the substrate 4 in the Z direction. An insulating member (not shown) is placed between the second end face of the second magnetic core 22 and the mounting surface 4a of the substrate 4. The second magnetic core 22 is supported on the substrate 4 via the insulating member. Copper plates 3 are arranged to span both the first magnetic core 21 and the second magnetic core 22 arranged side-by-side in the X direction, and multiple plates are arranged side-by-side in both the extending directions of the first magnetic core 21 and the second magnetic core 22. With the first leg 3a inserted through the through hole 2c of the first magnetic core 21, its end 3d is engaged with the substrate 4. With the second leg 3b inserted through the through hole 2c of the second magnetic core 22, its end 3e is engaged with the substrate 4. The middle portion 3c is disposed above the first end face 2a of the first magnetic core 21 and the first end face 2a of the second magnetic core 22, and is arranged to span both the straight portions of the first magnetic core 21 and the straight portions of the second magnetic core 22. A plurality of copper plates 3 and a plurality of conductor patterns 5 are arranged to surround the first magnetic core 21 and the second magnetic core 22 arranged in the X direction, and are connected in a coil shape. In the second variation, the projection area of ​​the first magnetic core 21 and the projection area of ​​the second magnetic core 22 are at different positions.

[0045] Implementation Method 2

[0046] The second embodiment comprises mounting a semiconductor switch and a bypass circuit on a conductor pattern 5 embedded in the substrate 4, and optimizing the inductance and coil resistance values ​​as required. Furthermore, descriptions of structures identical to those in the first embodiment are omitted, and reference numerals are used instead.

[0047] like Figure 7 As shown, the reactor 1 of the second embodiment includes a bypass circuit 11, a first semiconductor switch 12, and a second semiconductor switch 13. The bypass circuit 11, the first semiconductor switch 12, and the second semiconductor switch 13 are all disposed on the substrate 4.

[0048] The bypass circuit 11 is a circuit that bypasses a portion of the current circuit formed by the copper plate 3 and the conductor pattern 5. The bypass circuit 11 is used to change the number of coils wound in the current circuit. For example... Figure 8As shown, the bypass circuit 11 is connected to the first pin 3a of copper plate 3C, the first pin 3a of copper plate 3D, and the first pin 3a of copper plate 3E. The bypass circuit 11 connects the first pins 3a of adjacent copper plates 3 to each other.

[0049] The first semiconductor switch 12 is a semiconductor switch connected to the conductor pattern 5, switching the conductor pattern 5 between conduction and deactivation. If the first semiconductor switch 12 is turned on, the connected conductor pattern 5 becomes a conductive state. If the first semiconductor switch 12 is turned off, the connected conductor pattern 5 becomes a non-conductive state.

[0050] The second semiconductor switch 13 is a semiconductor switch connected to the bypass circuit 11, switching the bypass circuit 11 on and off. If the second semiconductor switch 13 is on, the connected bypass circuit 11 becomes conductive. If the second semiconductor switch 13 is off, the connected bypass circuit 11 becomes non-conductive.

[0051] The reactor 1 switches the conduction path composed of copper plates 3 and conductor patterns 5 via a bypass circuit 11 and first and second semiconductor switches 12 and 13. Thus, the reactor 1 can change the number of copper plates 3 and conductor patterns 5 included in the conduction path. In the reactor 1, the number of coil turns is adjusted by switching the first semiconductor switch 12 and the second semiconductor switch 13 as needed.

[0052] like Figure 8 As shown, the bypass circuit 11 and the second semiconductor switch 13 are mounted on the substrate 4 in a vertical configuration. Both the bypass circuit 11 and the second semiconductor switch 13 are arranged perpendicular to the mounting surfaces 4a and 4b, and at least a portion of them is disposed within the substrate 4. The bypass circuit 11 and the second semiconductor switch 13 are partially disposed within the substrate 4, with the remaining portions protruding towards the mounting surface 4b. As a comparative example, when the bypass circuit and the second semiconductor switch are mounted on the substrate in a planar configuration along the XY plane, a large mounting area of ​​the substrate must be ensured to align the bypass circuit and the second semiconductor switch in the XY plane. In contrast, in the second embodiment, since the bypass circuit 11 and the second semiconductor switch 13 are vertically configured, the mounting area of ​​the substrate 4 can be reduced compared to the comparative example.

[0053] According to the second embodiment, by switching the conduction path of the current circuit using the bypass circuit 11 and the first and second semiconductor switches 12 and 13, the number of coil turns in the coil-shaped conductor can be adjusted. This allows for shortening the length of the conductive path as needed, reducing losses caused by current flow. Magnetic losses can be reduced through inductance optimization. The vertical arrangement of the bypass circuit 11 and the second semiconductor switch 13 reduces the area of ​​the mounting surfaces 4a and 4b, enabling miniaturization of the reactor 1.

[0054] Third implementation method

[0055] The reactor 1 in the third embodiment includes two magnetic cores disposed on both sides of the substrate 4. It is configured such that coil-shaped conductors with different current directions are alternately disposed on the substrate 4, and magnetic flux is canceled by changing the direction of the current in each coil-shaped conductor. Furthermore, descriptions of structures identical to those in the first embodiment are omitted, and reference numerals are used instead.

[0056] like Figure 9 As shown, the reactor 1 of the third embodiment includes a first magnetic core 21, a second magnetic core 22, a plurality of first copper plates 31, a plurality of second copper plates 32, a plurality of first conductor patterns 51 and a plurality of second conductor patterns 52.

[0057] like Figure 10 As shown, the first magnetic core 21 is disposed on the mounting surface 4a side of the substrate 4. The second magnetic core 2B is disposed on the mounting surface 4b side of the substrate 4, with its first end face 2a facing the mounting surface 4b of the substrate 4. Both the first magnetic core 21 and the second magnetic core 22 have straight portions and are formed with the same shape. The reactor 1, including the first magnetic core 21 and the second magnetic core 22, can be implemented with the projected area of ​​one magnetic core. The second magnetic core 22 is separated from the substrate 4 in the Z direction. The second magnetic core 22 is supported on the substrate 4 via an insulating member. An insulating member is placed between the first end face 2a of the second magnetic core 22 and the mounting surface 4b.

[0058] The first copper plate 31 and the second copper plate 32 are formed with the same shape. The first copper plate 31 is arranged on the mounting surface 4a side in a straight section spanning the first magnetic core 21, and multiple plates are arranged side-by-side in the extending direction of the first magnetic core 21. The first copper plate 31 has a first support portion 31a, a second support portion 31b, and a middle portion 31c. The second copper plate 32 is arranged on the mounting surface 4b side in a straight section spanning the second magnetic core 22, and multiple plates are arranged side-by-side in the extending direction of the second magnetic core 22. The second copper plate 32 has a first support portion 32a, a second support portion 32b, and a middle portion 32c. The middle portion 32c is located below the second end face 2b of the second magnetic core 22. Figure 11 As shown, the first support portion 31a and the first support portion 32a are alternately arranged in the Y direction and are bonded to the substrate 4. The second support portion 31b and the second support portion 32b are alternately arranged in the Y direction and are bonded to the substrate 4. The first copper plate 31 is connected to the end of the first conductor pattern 51 at the bonding portion with the substrate 4. The second copper plate 32 is connected to the end of the second conductor pattern 52 at the bonding portion with the substrate 4.

[0059] The first conductor pattern 51 and the second conductor pattern 52 are alternately arranged side-by-side in the extending directions of the first magnetic core 21 and the second magnetic core 22. The first conductor pattern 51 electrically connects the first copper plates 31 arranged side-by-side in the extending direction of the first magnetic core 21, which are separated by the second copper plate 32. The first conductor pattern 51 connects to one first support 31a and another second support 31b with respect to the first copper plates 31 arranged on both sides separated by the second copper plate 32. The second conductor pattern 52 electrically connects the second copper plates 32 arranged side-by-side in the extending direction of the second magnetic core 22, which are separated by the first copper plate 31. The second conductor pattern 52 connects to one first support 32a and another second support 32b with respect to the second copper plates 32 arranged on both sides separated by the first copper plate 31.

[0060] The conductor connecting the first conductor pattern 51 and the first copper plate 31 forms a coil-shaped conductor arranged to surround the first magnetic core 21. The conductor connecting the second conductor pattern 52 and the second copper plate 32 forms a coil-shaped conductor arranged to surround the second magnetic core 22.

[0061] exist Figure 9 In the diagram, arrows indicate the direction of the current flowing through the coil-shaped conductor. The direction of the current flowing through the coil-shaped conductor formed by the first conductor pattern 51 and the first copper plate 31 and the direction of the current flowing through the coil-shaped conductor formed by the second conductor pattern 52 and the second copper plate 32 are directions that cancel each other out. When the reactor 1 is viewed from the Y direction, the current flows clockwise in the coil-shaped conductor formed by the first conductor pattern 51 and the first copper plate 31, and the current flows counterclockwise in the coil-shaped conductor formed by the second conductor pattern 52 and the second copper plate 32. In the third embodiment, two coil-shaped conductors with different current directions are configured to alternately arrange the current directions, thereby canceling out the magnetic flux by changing the current directions.

[0062] According to the third embodiment, magnetic flux linked with the substrate 4 can be canceled, thereby reducing noise. By mounting two magnetic cores across the substrate 4, the projected area of ​​one magnetic core can be used for mounting. This minimizes the substrate mounting area, thereby reducing the area of ​​the mounting surfaces 4a and 4b of the substrate 4. Furthermore, this contributes to the miniaturization of the vehicle carrying the reactor 1.

[0063] Variations of the third embodiment

[0064] In a variation of the third embodiment, the two magnetic cores are arranged on the same mounting surface side. For example... Figure 12 As shown, the reactor 1 may have a structure in which two magnetic cores 2 are disposed on the mounting surface 4a side and overlap in the Z direction.

Claims

1. A reactor, characterized in that, have: A ring-shaped magnetic core; A substrate having multiple conductor patterns formed thereon; and Multiple conductive components, formed in a generally U-shape, are coupled to the substrate in a configuration that spans the magnetic core and are arranged side-by-side in the extending direction of the magnetic core. The conductive component is connected to the end of the conductor pattern at the junction with the substrate. The conductor pattern electrically connects adjacent conductive components to each other in the extending direction. The plurality of conductor patterns and the plurality of conductive components are arranged to surround the magnetic core and are connected in a coil-like manner.

2. The reactor according to claim 1, characterized in that, have: A bypass circuit is disposed on the substrate and allows the conductor pattern to bypass; A first semiconductor switch is disposed on the substrate and switches the conduction and blocking of the conductor pattern; and A second semiconductor switch is disposed on the substrate and switches the conduction and interruption of the bypass circuit. The first semiconductor switch is connected to the conductor pattern. The second semiconductor switch is connected to the bypass circuit. By switching the conduction path composed of the conductor pattern and the conductive component using the first semiconductor switch and the second semiconductor switch, the number of the conductive component and the number of the conductor pattern contained in the conduction path can be changed.

3. The reactor according to claim 2, characterized in that, The bypass circuit is configured perpendicular to the mounting surface of the substrate, and at least a portion of it is disposed inside the substrate. The second semiconductor switch is configured perpendicular to the mounting surface of the substrate, and at least a portion of it is disposed inside the substrate.

4. The reactor according to any one of claims 1 to 3, characterized in that, The magnetic core includes: A first magnetic core, disposed on one side of the substrate; and The second magnetic core is arranged side by side with the first magnetic core. The plurality of conductive components are coupled to the substrate in a configuration that spans both the first magnetic core and the second magnetic core, and are arranged side by side in the extension directions of both the first and second magnetic cores. The plurality of conductor patterns and the plurality of conductive components are configured to surround both the first magnetic core and the second magnetic core and are connected in a coil-like manner.

5. The reactor according to claim 1, characterized in that, The magnetic core includes: A first magnetic core, disposed on one side of the substrate; and The second magnetic core is disposed on the other side of the substrate. The plurality of conductive components include: A plurality of first conductive components are disposed on one side of the substrate, spanning the first magnetic core, and arranged side-by-side in the extending direction of the first magnetic core; and A plurality of second conductive components are disposed on another side of the substrate, spanning the second magnetic core, and arranged side-by-side in the extending direction of the second magnetic core. The plurality of conductor patterns include: A plurality of first conductor patterns electrically connect adjacent first conductive components in the extending direction of the first magnetic core; and Multiple second conductor patterns electrically connect adjacent second conductive components in the extending direction of the second magnetic core. The first conductor pattern and the second conductor pattern are alternately arranged side by side in the extension direction of the first magnetic core and the extension direction of the second magnetic core. The first conductive component is connected to the end of the first conductor pattern at the junction with the substrate. The second conductive component is connected to the end of the second conductor pattern at the junction with the substrate. The plurality of first conductor patterns and the plurality of first conductive components are arranged to surround the first magnetic core and are connected in a coil-like manner. The plurality of second conductor patterns and the plurality of second conductive components are arranged to surround the second magnetic core and are connected in a coil-like manner. The direction of the current flowing in the coil-shaped conductor formed by the first conductor pattern and the first conductive component is such that the direction of the current flowing in the coil-shaped conductor formed by the second conductor pattern and the second conductive component cancels out the direction of their magnetic flux.

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