Substrate processing apparatus manufacturing system

Abstract

This invention provides a substrate processing apparatus manufacturing system. The substrate processing apparatus manufacturing system includes a clamping unit comprising: a clamping unit for clamping a bolt module, the bolt module connecting a first plate module and a second plate module of the substrate processing apparatus, the bolt module having a slot formed at its head; and a robot assembly for rotating the clamping unit to fasten the bolt module to the first plate module and the second plate module. The clamping unit includes a clamp whose outer diameter can be increased or decreased to contact or separate from the circumferential surface of the slot.

Description

Cross-reference to related applications

[0001] This application claims priority to Korean Patent Application No. 10-2024-0190051, filed on December 18, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to a substrate processing apparatus manufacturing system. Background Technology

[0003] Plasma refers to an ionized gaseous state composed of ions, electrons, and free radicals, which can be generated by high-temperature or high-frequency electromagnetic fields (RF Electromagnetic Fields). Semiconductor device manufacturing processes may include etching or ashing processes utilizing plasma. Processes that utilize plasma to treat substrates such as wafers are performed by the collision of ions and free radical particles contained in the plasma with the wafer.

[0004] A spray head may be provided in the device utilizing the plasma processing substrate. The spray head may be positioned below a gas distribution plate. The gas distribution plate may be made of metal and may be grounded. The spray head may be made of a material containing silicon (Si).

[0005] The gas distribution plate and the spray head can be connected by bolts. However, directly connecting the bolts to the threads of the spray head may damage it. To prevent this, a bushing can be installed in the spray head. The bushing is threaded onto the bolt, and the spray head and gas distribution plate can be fastened together using the bushing and bolts as a medium.

[0006] To tightly connect the spray heads and gas distribution plate made of different materials, the bushing can be threaded into a groove (cylindrical structure) formed on the upper surface of the spray head. Specifically, the inner circumferential surface of the groove in the spray head is threaded, and the bushing is threaded into this groove to prevent it from detaching after being inserted into the spray head. Furthermore, a bolt is threaded into the bushing inserted into the spray head, thus connecting the spray head and the gas distribution plate.

[0007] In the process of substrate processing using plasma, the substrate processing space needs to be heated. If temperature anomalies occur in the same radius area of ​​the substrate, the substrate quality may be reduced. Therefore, it is necessary to improve the process so that the temperature is uniformly formed within the same radius of the substrate.

[0008] Research and development is underway to achieve this improvement by preventing thermal conductivity differences caused by tightening torque when using bolts to fasten the spray head and gas distribution plate, thereby ensuring uniform temperature distribution to the spray head. Summary of the Invention

[0009] (a) Technical problems to be solved The technical problem to be solved by the present invention is to provide a substrate processing apparatus manufacturing system that improves the connection sequence of the bolts fastening the spray head and the gas distribution plate, so that a uniform temperature is transmitted to the spray head during the process of the heater module of the substrate processing apparatus transmitting temperature to the gas distribution plate and the spray head, and the spray head and the gas distribution plate are not required to be manually assembled, thereby improving productivity.

[0010] The technical problems to be solved by the present invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0011] (II) Technical Solution To address the aforementioned technical problems, according to one aspect of the substrate processing apparatus manufacturing system of the present invention, the substrate processing apparatus manufacturing system includes: a clamping unit for clamping a bolt module, the bolt module connecting a first plate module and a second plate module of the substrate processing apparatus, and the bolt module having a slot formed at its head; and a robot assembly for rotating the clamping unit to fasten the bolt module to the first plate module and the second plate module, wherein the clamping unit includes a clamp whose outer diameter can be increased or decreased to contact or separate from the circumferential surface of the slot.

[0012] To address the aforementioned technical problems, according to another aspect of the substrate processing apparatus manufacturing system of the present invention, the substrate processing apparatus manufacturing system includes: a clamping unit for clamping a bolt module, the bolt module connecting a first plate module and a second plate module of the substrate processing apparatus, and the bolt module having a slot formed at its head; a robot assembly for rotating the clamping unit to fasten the bolt module to the first plate module and the second plate module; and a control unit for controlling the robot assembly, wherein a plurality of first fastening holes are provided in the first plate module along radial and radii, and a plurality of second fastening holes are provided in the second plate module, the second fastening holes having the same central axis as the first fastening holes, the bolt module being engaged with the first fastening holes and the second fastening holes, and the control unit being configured to preferentially set the order in which the bolt module is engaged in the plurality of second fastening holes to a sequence in which at least one second fastening hole is located at a position spaced apart from each other, rather than first setting it to a sequence in which the positions of the second fastening holes are adjacent to each other, thereby controlling the engagement sequence of the second fastening holes.

[0013] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0014] (III) Beneficial Effects According to the substrate processing apparatus manufacturing system of the present invention, by improving the connection sequence of the bolts fastening the spray head and the gas distribution plate, the fastening amount of the spray head and the gas distribution plate becomes uniform, thereby enabling uniform temperature transfer to the spray head during the process of the heater module transferring temperature to the gas distribution plate and the spray head, thereby improving the substrate yield, and the spray head assembly can be automatically assembled, thus improving productivity. Attached Figure Description

[0015] Figure 1 This is a diagram showing a semiconductor device manufacturing apparatus equipped with a substrate processing device.

[0016] Figure 2 This is a diagram showing a substrate processing apparatus equipped with a spray head assembly.

[0017] Figure 3 This is a diagram illustrating the tightening sequence of the bolt modules in the sprinkler head assembly.

[0018] Figure 4 This is a diagram illustrating the tightening sequence of the bolt modules in the first area of ​​the spray head assembly.

[0019] Figure 5 This is a diagram illustrating the tightening sequence of the bolt modules in the third region of the spray head assembly.

[0020] Figure 6 This is a diagram illustrating the tightening sequence of the bolt modules in the second area of ​​the spray head assembly.

[0021] Figure 7 This is a diagram illustrating the tightening sequence of the bolt modules in the fourth region of the spray head assembly.

[0022] Figure 8 This is a diagram illustrating a substrate processing apparatus manufacturing system according to some embodiments of the present invention.

[0023] Figure 9 This is a diagram illustrating a clamping unit and a robot assembly of a substrate processing apparatus manufacturing system according to some embodiments of the present invention.

[0024] Figure 10 This is a diagram showing the state of the clamping unit loosening the bolt unit of the substrate processing apparatus manufacturing system according to the first embodiment of the present invention.

[0025] Figure 11 It is shown Figure 10 The diagram of region A.

[0026] Figure 12 This is a diagram showing the state of the clamping bolt unit of the substrate processing apparatus manufacturing system according to a first embodiment of the present invention.

[0027] Figure 13 It is shown Figure 12 The diagram of region B.

[0028] Explanation of reference numerals in the attached figures 100: Substrate processing device manufacturing system; 110: Clamping unit; 120: Robot component; 150: Sensor unit; 160: Control unit. Detailed Implementation

[0029] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages, features, and methods of achieving these advantages and features will become more apparent from the detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in many different forms. These embodiments are provided only to make the disclosure of the present invention more complete and to fully convey the scope of protection of the present invention to those skilled in the art, the scope of which is defined by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0030] The terminology used in this specification is for descriptive purposes only and is not intended to limit the invention. In this specification, the singular includes the plural unless explicitly stated otherwise. The terms "comprises" and / or "comprising" as used in this specification mean that the mention of a component, step, operation, and / or component does not exclude the presence or addition of one or more other components, steps, operations, and / or components.

[0031] Figure 1 This is a diagram showing a semiconductor device manufacturing apparatus equipped with a substrate processing device.

[0032] Reference Figure 1 The semiconductor device manufacturing equipment 900 may include a load port module 820, an index module 910, a load-lock chamber 920, a transfer chamber 930, and a process chamber. Hereinafter, the process chamber will be referred to as the substrate processing apparatus 1.

[0033] Semiconductor device manufacturing equipment 900 is a system that processes multiple substrates W (e.g., wafers) through various processes such as etching and cleaning. Semiconductor device manufacturing equipment 900 may be a multi-chamber type substrate processing system including transport robots 911 and 931 responsible for transferring substrates and substrate processing modules arranged around them, i.e., multiple substrate processing devices 1.

[0034] The load port module 820 is the location for housing a container 950 (e.g., a front-opening unified pod, FOUP) that houses multiple substrates W. Multiple load port modules 820 may be configured in front of the index module 910.

[0035] When multiple load port modules 820 are arranged in front of the index module 910, different items can be placed in the container 950 on each load port module 820. For example, when three load port modules 820 are arranged in front of the index module 910, a wafer-type sensor (not shown) can be placed in the first container 950a on the first load port 820a on the left, a substrate W can be placed in the second container 950b on the second load port 820b in the middle, and a consumable component (not shown) can be placed in the third container 950c on the third load port 820c on the right. However, this embodiment is not limited to this. The same items can also be placed in the containers 950a, 950b, and 950c on each load port 820a, 820b, and 820c, and can be changed as needed.

[0036] The index module 910 is configured between the load port module 820 and the load locking chamber 920, thereby serving as an interface between the container 950 on the load port module 820 and the load locking chamber 920 for transferring the substrate W. The index module 910 may be a front end module (FEM), but is not limited thereto.

[0037] The index module 910 may include a first transport robot 911 responsible for transferring the substrate W. This first transport robot 911 can operate under normal pressure and can transfer the substrate W between the container 950 and the load locking chamber 920.

[0038] The load-locked chamber 920 can act as a buffer between the input and output ports of the semiconductor device manufacturing equipment 900. The load-locked chamber 920 may contain a buffer station for the substrate W to temporarily wait.

[0039] Multiple load-locking chambers 920 can be provided between the index module 910 and the transmission chamber 930. In this embodiment, for example, two load-locking chambers 921 and 922, such as the first load-locking chamber 921 and the second load-locking chamber 922, can be provided between the index module 910 and the transmission chamber 930.

[0040] The first load locking chamber 921 and the second load locking chamber 922 can be arranged horizontally between the index module 910 and the transmission chamber 930. For example, the first load locking chamber 921 and the second load locking chamber 922 can be a symmetrical single-layer structure arranged side by side in the left-right direction. Alternatively, the first load locking chamber 921 and the second load locking chamber 922 can also be arranged vertically between the index module 910 and the transmission chamber 930.

[0041] The first load-locking chamber 921 can move the substrate W from the index module 910 to the transmission chamber 930, and the second load-locking chamber 922 can move the substrate W from the transmission chamber 930 to the index module 910. However, this embodiment is not limited to this. The first load-locking chamber 921 can also move the substrate W from the transmission chamber 930 to the index module 910, and the second load-locking chamber 922 can also move the substrate W from the index module 910 to the transmission chamber 930.

[0042] The load locking chamber 920 can load or unload the substrate W via the second transport robot 931 of the transfer chamber 930. The load locking chamber 920 can also load or unload the substrate W via the first transport robot 911 of the index module 910.

[0043] The load-locking chamber 920 can be converted to a vacuum or atmospheric pressure environment using a gate valve or similar device to maintain pressure. Therefore, the load-locking chamber 920 can prevent changes in the internal pressure state of the transmission chamber 930.

[0044] Specifically, when the load locking chamber 920 is loaded or unloaded by the second transport robot 931, the interior of the load locking chamber 920 can be formed into a vacuum environment that is the same as (or similar to) that of the transport chamber 930. Furthermore, when the load locking chamber 920 is loaded or unloaded by the first transport robot 911 (i.e., when receiving an unprocessed substrate W from the first transport robot 911, or when transferring a processed substrate W to the indexing module 910), its interior can be formed into an atmospheric pressure environment.

[0045] The transfer chamber 930 is used to transfer the substrate W between the load locking chamber 920 and the substrate processing apparatus 1. For this purpose, the transfer chamber 930 may include at least one second transport robot 931.

[0046] The second transport robot 931 moves the unprocessed substrate W from the load locking chamber 920 to the substrate processing apparatus 1, or moves the processed substrate W from the substrate processing apparatus 1 to the load locking chamber 920. For this purpose, each side of the transport chamber 930 can be connected to the load locking chamber 920 and multiple substrate processing apparatuses 1.

[0047] On the other hand, the second transport robot 931 can operate in a vacuum environment and can rotate freely.

[0048] The substrate processing apparatus 1 can process the substrate W. The substrate processing apparatus 1 can be an etching chamber that processes the substrate W using an etching process, for example, it can be a plasma reaction chamber that processes the substrate W using a plasma process.

[0049] Multiple substrate processing apparatuses 1 can be arranged around the transfer chamber 930. In this case, each substrate processing apparatus 1 can receive the substrate W from the transfer chamber 930, perform process processing on the substrate W, and provide the processed substrate W to the transfer chamber 930.

[0050] The substrate processing apparatus 1 can be formed in a cylindrical shape. The surface of this substrate processing apparatus 1 can be composed of an alumina film with an anodic oxide film, and its interior has an airtight structure. Alternatively, in this embodiment, the substrate processing apparatus 1 can also be formed in shapes other than a cylindrical shape.

[0051] The substrate processing apparatus 1 will now be described in detail with reference to the accompanying drawings.

[0052] Figure 2 This is a diagram showing a substrate processing apparatus equipped with a spray head assembly.

[0053] A substrate processing space 20S may be formed in the chamber 20. The substrate processing space 20S may be an etching processing space for etching the substrate W using plasma etching.

[0054] The chamber 20 can be made of a metal material such as aluminum. That is, the chamber 20 can be made of a conductive material, and the chamber 20 can be grounded. The sidewall of the chamber 20 can be formed with an opening (not shown) for the substrate W to enter and exit, and a door (not shown) can be provided at the opening.

[0055] The bottom surface of chamber 20 may have an exhaust port 22, which can be connected to a vacuum pump (not shown) to discharge reaction byproducts to the outside. During the exhaust process, the substrate processing space 20S can be depressurized to a predetermined pressure. The substrate processing space 20S can maintain a vacuum atmosphere when processing substrate W.

[0056] The upper part of the chamber 20 may have a supply hole 23 for the flow of process gas from the gas supply unit 24. Here, the process gas may be a gas used to process the substrate W using plasma. The process gas supplied by the gas supply unit 24 may be excited into a plasma state by a plasma source, for example, it may be a gas containing fluorine.

[0057] The inner peripheral surface of the chamber 20 and / or the outer peripheral surface of the substrate support unit 30 may be provided with a liner (not shown). The liner can prevent the inner wall of the chamber 20 and the outer peripheral wall of the substrate support unit 30 from being contaminated during the substrate processing process. That is, the liner can prevent reaction byproducts generated during the process from depositing on the inner sidewall of the chamber 20 and the substrate support unit 30.

[0058] The substrate support unit 30 can support the substrate W in the substrate processing space 20S. The substrate support unit 30 may have a support surface for supporting the substrate W. The substrate support unit 30 supports the substrate W and clamps the supported substrate W.

[0059] For example, the substrate support unit 30 can be an electrostatic chuck that uses electrostatic force to hold the substrate W. Alternatively, the substrate support unit 30 can also clamp the substrate W by vacuum adsorption, and various other variations are possible.

[0060] When the substrate support unit 30 is an electrostatic chuck, it may include a dielectric plate 31, an electrode plate 33, and a ring component 34.

[0061] A substrate W can be placed on a dielectric plate 31. The dielectric plate 31 can be disk-shaped and can be made of a dielectric substance. The dielectric plate 31 can receive an external power supply and generate an electrostatic force on the substrate W. An electrostatic electrode 32 can be provided on the dielectric plate 31. The electrostatic electrode 32 can be electrically connected to a first power supply 32P. The first power supply 32P can include a DC power supply. A switch (not shown) can be provided between the electrostatic electrode 32 and the first power supply 32P.

[0062] The electrostatic electrode 32 can be electrically connected to the first power supply 32P by switching the switch on / off (ON / OFF). When the switch is on (ON), a direct current can be applied to the electrostatic electrode 32. By applying the current to the electrostatic electrode 32, an electrostatic force can be generated between the electrostatic electrode 32 and the substrate W. The substrate W can be attracted and / or fixed to the dielectric plate 31 by the electrostatic force.

[0063] Electrode plate 33 can be disposed below dielectric plate 31. The upper surface of electrode plate 33 can contact the lower surface of dielectric plate 31. Electrode plate 33 can be disk-shaped. Electrode plate 33 can be made of a conductive material such as aluminum. Electrode plate 33 can be electrically connected to a second power supply 33P. The second power supply 33P can be a high-frequency power supply that generates high-frequency power. The high-frequency power supply can be a high-bias power radio frequency (RF) power supply. Electrode plate 33 can receive high-frequency power from the second power supply 33P or can be grounded. That is, electrode plate 33 can be used as a lower electrode.

[0064] The ring member 34 can be disposed in the edge region of the substrate support unit 30. The ring member 34 can have a ring shape. The ring member 34 can be configured to surround the dielectric plate 31. The ring member 34 can be a focusing ring.

[0065] Although not shown in the figure, a lifting pin (not shown) may be provided through the substrate support unit 30 so that the height of the substrate (W) can be changed.

[0066] For the substrate W processing, this embodiment can use a plasma source that can excite the process gas in chamber 20 into a plasma state. Capacitively coupled plasma (CCP) can be used as the plasma source.

[0067] The capacitively coupled plasma within chamber 20 may include an upper electrode and a lower electrode. The upper and lower electrodes may be arranged parallel to each other vertically within chamber 20. One of the electrodes may be subjected to high-frequency power, while the other may be grounded. An electromagnetic field is formed in the space between the two electrodes, and the process gas supplied to this space, i.e., the substrate processing space 20S, can be excited into a plasma state.

[0068] This plasma can be used to perform substrate W processing. In this embodiment, the upper electrode can be a spray head assembly 10, and the lower electrode can be an electrode plate 33. For example, high-frequency power can be applied to the upper electrode and the lower electrode can be grounded, or high-frequency power can be applied to the lower electrode and the upper electrode can be grounded. Thus, an electromagnetic field can be generated between the upper and lower electrodes, which can excite the process gas supplied to the inside of the chamber 20 into a plasma state.

[0069] The spray head assembly 10 can exhaust process gas at the top of the substrate processing space 20S and serve as the upper electrode. For example, the spray head assembly 10 may include a gas distribution plate 13GD, a spray head plate 11SH, a bushing unit BS10, and a bolt module BT10.

[0070] The gas distribution plate 13GD can be disposed above the spray head plate 11SH in the upper part of the substrate processing space 20S. The gas distribution plate 13GD can be made of metal. As the upper electrode, the gas distribution plate 13GD can be supplied with a high-frequency power supply or can be grounded.

[0071] Additionally, the gas distribution plate 13GD can distribute the process gas supplied by the gas supply unit 24 to the substrate processing space 20S. The gas distribution plate 13GD can diffuse the process gas supplied from above. A gas inlet hole (not shown) may be formed in the gas distribution plate 13GD. The gas inlet hole may be formed at a position corresponding to the gas supply hole. That is, the gas inlet hole may communicate with the gas supply hole. In other words, the process gas supplied from the upper part of the spray head assembly 10 can be supplied to the lower part of the spray head plate 11SH in sequence through the gas inlet hole and the gas supply hole.

[0072] For engagement with the spray head plate 11SH, a second fastening hole 13H may be formed in the gas distribution plate 13GD. The inner circumferential surface of the second fastening hole 13H may be formed with threads for threaded engagement with the bolt module BT10.

[0073] The spray head plate 11SH can be plate-shaped. To prevent arcing caused by plasma, the bottom surface of the spray head plate 11SH can be anodized. The cross-section of the spray head plate 11SH can have the same shape and cross-sectional area as the substrate support unit 30. Multiple gas supply holes (not shown) can be formed in the spray head plate 11SH. The gas supply holes can be formed vertically through the upper and lower surfaces of the spray head plate 11SH.

[0074] The spray head plate 11SH can be made of silicon (Si) or ceramic. This is to provide a material that reacts with the plasma generated by the process gas supplied by the gas supply unit 24 to generate compounds. Unlike the gas distribution plate 13GD, which is made of metal, the spray head plate 11SH is made of ceramic, which may break when combined with the bolt module BT10. Therefore, it is combined with the gas distribution plate 13GD through the bushing unit BS10. This is to provide a material that reacts with the plasma generated by the process gas supplied by the gas supply unit (24) to generate compounds.

[0075] The spray head plate 11SH may have multiple first fastening holes BS11 in the radial and radii directions. For example, multiple mating grooves 11H1 may be formed in the spray head plate 11SH, and bushings BS10 forming the first fastening holes BS11 are provided in the mating grooves 11H1.

[0076] The first fastening hole BS11 can have the same central axis as the second fastening hole 13H of the gas distribution plate 13GD, and the bolt module BT10 can be combined with the first fastening hole BS11 and the second fastening hole 13H respectively.

[0077] That is, the spray head plate 11SH located below the gas distribution plate 13GD can have a mating groove 11H1 and a first fastening hole BS11 formed at a position opposite to the second fastening hole 13H in the vertical direction. The mating groove 11H1 is provided for mating with the gas distribution plate 13GD through the bushing unit BS10 and the bolt module BT10.

[0078] The spray head plate 11SH and the gas distribution plate 13GD can be combined by fastening the bolt module BT10 to the first fastening hole BS11 and the second fastening hole 13H, thereby forming a spray head assembly 10.

[0079] On the other hand, the bolt module BT10 is made of a non-magnetic material to prevent it from affecting the substrate processing space 20S during the plasma process. In particular, it should be configured not to protrude from the upper surface of the spray head assembly 10, making it difficult to use power tools such as nut runners / electric screwdrivers for tightening ordinary bolts.

[0080] In other words, the bolt module BT10 is different from ordinary bolts not only in material and shape, but also in that the head cannot protrude from the spray head assembly 10 when tightened. Therefore, the assembly of the spray head assembly 10 is usually done manually, which may reduce productivity.

[0081] Conversely, in this embodiment, when tightening the bolt module BT10 in the spray head assembly 10, automatic operation can be achieved. By improving the tightening sequence of the bolt module BT10, the torque tightening amount of the spray head assembly 10 is uniformly formed, and the tightness / gap between the spray head plate 11SH and the gas distribution plate 13GD can be uniformly formed on the entire surface. Therefore, the thermal conductivity difference caused by the difference in tightness / gap between the gas distribution plate 13GD and the spray head plate 11SH can be improved, thereby achieving temperature uniformity of the spray head assembly 10 and improving the substrate yield.

[0082] The following describes, with reference to the accompanying drawings, a substrate processing apparatus manufacturing system 100 that automatically fastens bolt module BT10 to spray head assembly 10.

[0083] Below, the spray head assembly 10 includes a first plate module and a second plate module, wherein the first plate module is provided by the spray head plate 11SH and the second plate module is provided by the gas distribution plate 13GD.

[0084] Furthermore, the bolt module BT10 in this embodiment has improved the tightening sequence in order to achieve temperature uniformity. For ease of explanation, the spray head plate 11SH and the gas distribution plate 13GD are divided into virtual regions from the center to the periphery: a first region A11, a second region A12, a third region A13, and a fourth region A14.

[0085] That is, the first region A11, the second region A12, the third region A13 and the fourth region A14 are distinguished and defined to illustrate the fastening sequence and / or the fastening region sequence of the bolt module BT10.

[0086] Figure 3 This is a diagram illustrating the tightening sequence of the bolt modules in the sprinkler head assembly. Figure 4 This is a diagram illustrating the tightening sequence of the bolt modules in the first area of ​​the sprinkler head assembly. Figure 5 This diagram illustrates the tightening sequence of the bolt modules in the third region of the sprinkler head assembly. Figure 6 This is a diagram illustrating the tightening sequence of the bolt modules in the second region of the sprinkler head assembly. Figure 7 This is a diagram illustrating the tightening sequence of the bolt modules in the fourth region of the spray head assembly.

[0087] also, Figure 8 This is a diagram illustrating a substrate processing apparatus manufacturing system according to some embodiments of the present invention. Figure 9 This is a diagram illustrating a clamping unit and a robot assembly of a substrate processing apparatus manufacturing system according to some embodiments of the present invention.

[0088] and, Figure 10 This is a diagram showing the state of the clamping unit loosening the bolt unit in the substrate processing apparatus manufacturing system according to the first embodiment of the present invention. Figure 11 It is shown Figure 10 The diagram of region A.

[0089] also, Figure 12 This is a diagram showing the state of the clamping bolt unit of the substrate processing apparatus manufacturing system according to a first embodiment of the present invention. Figure 13 It is shown Figure 12 The diagram of region B.

[0090] Reference Figures 3 to 13 The substrate processing apparatus manufacturing system 100 may include a clamping unit 110, a robot assembly 120, a support 141R, a rotation module 143M, a sensor unit 150, and a control unit 160.

[0091] The clamping unit 110 can clamp the bolt module BT10. As is well known, the bolt module BT10 provided in the spray head assembly 10 should not affect the plasma region; therefore, ordinary bolts are not used, but bolts for the spray head assembly 10 are used.

[0092] However, ordinary nut tighteners grip the outside of the bolt head to perform the bolting operation. Therefore, in the substrate processing device 1, where the head of the bolt module BT10 needs to be set so that it does not protrude from the upper surface of the spray head assembly 10, ordinary nut tighteners cannot be used for automatic tightening of the bolt module BT10. Therefore, the bolt module BT10 installed in the spray head assembly 10 is usually tightened into the spray head assembly 10 by manual operation.

[0093] However, in this embodiment, the fastening operation can be performed automatically without the need for manual tightening of the bolt module BT10, thereby making it easy to manufacture the substrate processing device 1.

[0094] For example, the clamping unit 110 may include a clamp 111C, a sliding part 113S, an actuator 115A, and a spring 117S.

[0095] The outer diameter of clamp 111C can be increased or decreased to allow it to contact or be separated from the circumferential surface of slot BT11H. For example, clamp 111C can open or close to increase or decrease its outer diameter.

[0096] For example, clamp 111C may be radially segmented, or its lower end may be radially cut. For example, clamp 111C may include a first sleeve module 111CS1 and a second sleeve module 111CS2 that are radially bisected to be able to close or open. The first sleeve module 111CS1 and the second sleeve module 111CS2 may be symmetrically formed.

[0097] This clamp 111C can be configured such that one end (e.g., the lower part) is openable, for example, one end is connected to the robot assembly 120 and the other end is a free end. Furthermore, the clamp 111C can be configured with a connecting pin between its one end and the other end so that the other end does not fully open, i.e., the opening range is limited, and it can be made of a rigid material such as metal so that even if the other end opens, it can return to its original position without the external force of the sliding part 113S.

[0098] Alternatively, the upper ends of the first sleeve module 111CS1 and the second sleeve module 111CS2 are connected to the robot assembly 120, wherein the upper end of the first sleeve module 111CS1 and the second sleeve module 111CS2 are integrally formed and the lower end is cut open, so that the outer diameter increases or decreases accordingly depending on the opening or closing of the lower end of the first sleeve module 111CS1 and the second sleeve module 111CS2, thus having a variety of structures.

[0099] Furthermore, a first step portion 111ST1 can be formed on the outer side of the other end (lower end) of the clamp 111C. The height H1 of the first step portion 111ST1 can be formed to be equal to or lower than the height of the slot BT11H, so that the length of the clamp 111C inserted into the slot BT11H is controlled by the first step portion 111ST1, thereby achieving a stable connection.

[0100] That is, the lower end of the clamp 111C is held by the first step 111ST1, so that the clamp 111C will not be misaligned with the bolt module BT10 and can maintain the same central axis, thereby preventing the bolt module BT10 from being misaligned during bolting operations.

[0101] The clamp 111C may have a hollow portion for sliding the sliding part 113S. A second step part 111ST2 may be formed in the hollow portion of the clamp 111C, and a spring 117S may be provided on the second step part 111ST2.

[0102] Spring 117S can be installed at the other end inside clamp 111C to restore sliding part 113S towards one end of clamp 111C.

[0103] For the clamps 111C to open and close, the sliding portion 113S can slide inside the clamps 111C, that is, slide within the hollow portion. The sliding portion 113S can be formed into a cone shape whose cross-section decreases towards the other end of the clamps 111C. For example, the sliding portion 113S can be a pin with a sharp end.

[0104] However, the shape and / or operation of the sliding part 113S are not limited thereto. In other words, the sliding part 113S can have various variations that enable the other end of the clamp 111C to open to expand the outer diameter of the clamp 111C.

[0105] The actuator 115A can be operated by pneumatic, hydraulic and / or electric power, and can push the sliding part 113S toward the other end (lower end) of the clamp 111C.

[0106] Reference Figure 10 and Figure 11 This clamping unit 110 can keep the outer diameter of the clamp 111C in a small state, that is, in a state that is separated from the circumferential surface of the slot BT11H, so that the clamp 111C can be inserted into the bolt module BT10.

[0107] At this time, the actuator 115A can reduce the internal pressure of the cylinder by venting air / fluid from inside the cylinder, so that the sliding part 113 moves away from the lower end of the clamp 111C. At this time, the spring 117S returns to its original position, and the position of the sliding part 113S returns to its original position.

[0108] On the other hand, refer to Figure 12 and Figure 13After the clamp 111C is inserted into the slot BT11H of the bolt module BT10, in order to make the outer diameter of the clamp 111C larger, the actuator 115A can increase the internal pressure of the cylinder by supplying air / fluid into the cylinder, thereby pushing the sliding part 113S towards the lower end of the clamp 111C. At this time, the spring 117S contracts, and the sliding part 113S opens the lower end of the clamp 111C.

[0109] When the lower end of the clamp 111C opens, the lower end of the clamp 111C is in close contact with the slot BT11H of the bolt module BT10, so that the bolting operation of the bolt module BT10 can be performed by the operation of the robot component 120.

[0110] The robot assembly 120 may be, for example, a 6-DOF robot, and is equipped with a drive body 121M such as a motor, thereby enabling it to rotate the gripping unit 110. The operation of the drive body 121M of the robot assembly 120 may be the same as / similar to the mechanism of a nut tightener.

[0111] That is, the robot assembly 120 can fasten the bolt module BT10 to the spray head plate 11SH and the gas distribution plate 13GD by rotating the clamping unit 110. For example, the robot assembly 120 may have a rotating plate 123R connected to the clamping unit 110, which rotates in conjunction with the operation of the drive body 121M, thereby enabling the clamping unit 110 that clamps the bolt module BT10 to rotate and automatically perform the bolting operation.

[0112] However, the rotating plate 123R of the robot assembly 120 is just an example, and it can also be connected to the appearance (e.g., the main body) of the gripping unit 110, so that the robot assembly 120 rotates the gripping unit 110.

[0113] In other words, the bolt module BT10 can be clamped / loosened by the opening and closing operation of the clamping unit 110, and the bolt module BT10 can be fastened by the robot component 120, which can have various structures.

[0114] The support portion 141R can be a jig for fixing the spray head assembly 10, and can support the spray head plate 11SH and the gas distribution plate 13GD.

[0115] The support portion 141R can be configured as a circular plate with a radius corresponding to the spray head assembly 10, and has an upward protruding structure to prevent the spray head assembly 10 from detaching (see reference). Figure 3 ).

[0116] The rotation module 143M can be connected to the support 141R shaft. Rotating the support 141R causes the position of the second fastening hole 13H facing the robot assembly 120 to change. For example, the rotation module 143M can be a motor, equipped with a reducer and encoder to control the speed, and can detect the rotation speed and provide the rotation speed data to the control unit 160.

[0117] The sensor unit 150 may include a first sensor 151 and a second sensor 153.

[0118] The first sensor 151 may be a vision camera and / or a profile sensor, which can provide data of the first fastening hole BS11 / second fastening hole 13H to the control unit 160 after identifying the first fastening hole BS11 / second fastening hole 13H, or simultaneously or separately measure the fastening length of the bolt module BT10 and provide the fastening information of the bolt module BT10 to the control unit 160.

[0119] The second sensor 153 can be a gas sensor that uses gas and / or laser to sense the distribution of gas. By measuring the gap between the gas distribution plate 13GD and the spray head plate 11SH, the assembly fastening gap of the spray head assembly 10 can be measured, and the relevant data can be provided to the control unit 160.

[0120] The control unit 160 can control the robot assembly 120 and the rotation module 143M.

[0121] The control unit 160 can set / control the sequence of connecting the bolt module BT10 to the multiple second fastening holes 13H to prevent misalignment of the first fastening hole BS11 and the second fastening hole 13H.

[0122] For example, if the bolt module BT10 is connected to the second fastening hole 13H in the order of adjacent second fastening holes 13H, the central axis of the spray head plate 11SH and the gas distribution plate 13GD will be misaligned during the fastening process of the bolt module BT10 due to the fastening torque of the bolt module BT10. In particular, as the number of bolt modules BT10 connected gradually increases, the misalignment of the central axis of the spray head plate 11SH and the gas distribution plate 13GD will accumulate.

[0123] Therefore, the positions of the second fastening hole 13H and the first fastening hole BS11 of the final fastening bolt module BT10 may be misaligned. In order to improve this problem, the control unit 160 of this embodiment may not fasten the second fastening holes 13H in the order of adjacent to each other, but may set the fastening order of the second fastening holes 13H as follows.

[0124] The control unit 160 can preferentially set the order in which the bolt modules BT10 are engaged in the plurality of second fastening holes 13H to be at least one second fastening hole 13H located at a position spaced apart from each other, rather than preferentially set the order in which the positions of the second fastening holes 13H are adjacent to each other, thereby controlling the engagement order of the second fastening holes 13H.

[0125] For example, the control unit 160 can set / control the sequence of the bolt modules BT10 in the radially arranged plurality of second fastening holes 13H in the gas distribution plate 13GD to be in symmetrical positions.

[0126] Reference Figures 3 to 7 (The numbers indicate the tightening sequence of the radial second fastening hole 13H / bolt module BT10). The order in which the bolt module BT10 is attached to the second fastening hole 13H can be set such that the second fastening hole 13H is located at the furthest position or near the center between the positions of the already tightened bolt modules BT10.

[0127] by Figure 3 and Figure 4 Based on this, in the second fastening hole 13H / bolt module BT10 of the first region A11, when the second fastening hole 13H / bolt module BT10 in the 12 o'clock direction is fastened for the first time, the second fastening hole 13H / bolt module BT10 in the 6 o'clock direction, which is symmetrical to it, is fastened for the second time, thereby forming a symmetrical fastening state. As described above, the second fastening holes 13H / bolt modules BT10 in symmetrical positions can serve to fix the position from both sides to prevent misalignment of the central axes of the spray head plate 11SH and the gas distribution plate 13GD.

[0128] Furthermore, the third fastening second fastening hole 13H / bolt module BT10 is located between the first and second fastening second fastening holes 13H / bolt modules BT10 and is symmetrical with the fourth fastening second fastening hole 13H / bolt module BT10. The first, second, third, and fourth fastening second fastening holes 13H / bolt modules BT10 are symmetrical in the up, down, left, and right directions, thereby forming a uniformly distributed position on the entire surface of the gas distribution plate 13GD, so that the contact and / or gap between the spray head plate 11SH and the gas distribution plate 13GD can be constant.

[0129] This is to prevent thermal conductivity differences caused by the contact area / gap between the spray head plate 11SH and the gas distribution plate 13GD, which consists of two plates, so as to transfer uniform temperature to the spray head plate 11SH, improve the uniformity of plasma density affected by temperature, and prevent the substrate quality from deteriorating.

[0130] In addition, refer to Figures 5 to 7In the remaining areas, namely the second area A12, the third area A13 and the fourth area A14, the order of the second fastening hole 13H / bolt module BT10 can also be set to be the same as / similar to the second fastening hole 13H / bolt module BT10 in the first area A11.

[0131] For example, with Figure 3 and Figure 5 Based on this, in the second fastening hole 13H / bolt module BT10 of the third region A13, when the first second fastening hole 13H / bolt module BT10 in the 1-2 o'clock direction is fastened, the second fastening hole 13H / bolt module BT10 in the 7-8 o'clock direction, which is symmetrical to this, is fastened a second time, thus forming a symmetrical fastening state in the upper right and lower left directions. Then, the third fastening hole 13H / bolt module BT10 is fastened between the first and second fastened second fastening holes 13H / bolt module BT10, and is symmetrical to the fourth fastened second fastening hole 13H / bolt module BT10, so that the bolt modules BT10 form a uniformly distributed position on the entire surface of the gas distribution plate 13GD, so that the contact and / or gap between the spray head plate 11SH and the gas distribution plate 13GD can be constant.

[0132] In order to achieve the purpose / effect of constant contact and / or gap between the spray head plate 11SH and the gas distribution plate 13GD, the control unit 160 can set / control not only the radial sequence, but also the sequence in the radius direction.

[0133] For example, the control unit 160 can set and control the engagement sequence of the second fastening hole 13H / bolt module BT10 in the radial direction of the gas distribution plate 13GD, in a sequence of areas spaced apart from each other rather than in a sequence of adjacent areas.

[0134] For example, the control unit 160 can preferentially set odd-numbered regions (first region A11 and third region A13) or even-numbered regions (second region A12 and fourth region A14) in the first region A11, second region A12, third region A13 and fourth region A14, thereby controlling the engagement sequence of the second fastening hole 13H / bolt module BT10.

[0135] For example, refer to Figures 4 to 7 The control unit 160 can set the engagement sequence of the second fastening hole 13H / bolt module BT10 in the following order: firstly, the first area A11 is set first; after the second fastening hole 13H / bolt module BT10 is fastened in the first area A11, the third area A13 is set, and then the second area A12 (or the fourth area A14) is set.

[0136] For example, you can set it in the following order: first set the second area A12, then set the fourth area A14, and then set the first area A11 (or the third area A13).

[0137] Furthermore, the control unit 160 can control the robot assembly 120 and the rotation module 143M, such that the orientation position control of the robot assembly 120 and the second fastening hole 13H can be achieved by rotating the rotation module 143M to control the position of the second fastening hole 13H in the radial direction of the gas distribution plate 13GD.

[0138] In addition, the control unit 160 can control the position of the second fastening hole 13H in the radial direction of the gas distribution plate 13GD by controlling the horizontal movement of the robot assembly 120.

[0139] Therefore, the robot assembly 120 does not need to move in all directions to fasten the bolt module BT10 in the plurality of second fastening holes 13H arranged in the radial and / or radial directions. Instead, when fastening the bolt module BT10 in the plurality of second fastening holes 13H arranged in the radial direction, it only needs to control the movement in the up and down direction for clamping / loosening while keeping the radial position fixed to perform the fastening operation, thereby making it easier to control the robot assembly 120.

[0140] In other words, compared to 6-DOF motion, the simpler control of the rotation module 143M simplifies the control of the robot component 120 in the control unit 160, thus reducing control errors.

[0141] The unspecified identifier TR10 is part of the bolt module BT10 that can be stored.

[0142] As described above with reference to the accompanying drawings, embodiments of the present invention have been presented. However, those skilled in the art should understand that the present invention can be implemented in other specific forms without altering its technical concept or core features. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus manufacturing system, comprising: A clamping unit is used to clamp a bolt module, which is connected to a first plate module and a second plate module of the substrate processing device, and the head of the bolt module has a slot. A robot assembly for rotating the clamping unit to fasten the bolt module to the first plate module and the second plate module; as well as Control unit, the control unit being used to control the robot component, The clamping unit includes a clamp, the outer diameter of which can be increased or decreased to contact or separate from the circumferential surface of the slot.

2. The substrate processing apparatus manufacturing system according to claim 1, wherein, The clamps are configured to increase or decrease their outer diameter by opening or closing.

3. The substrate processing apparatus manufacturing system according to claim 2, wherein, The clamp is configured to be radially divided, or its lower end is radially cut.

4. The substrate processing apparatus manufacturing system according to claim 3, wherein, The clamp includes a first sleeve module and a second sleeve module that are divided into two equal parts along the radial direction for closing or opening.

5. The substrate processing apparatus manufacturing system according to claim 3, wherein, The outer side of the clamp has a first step, the height of which is equal to or lower than the height of the slot.

6. The substrate processing apparatus manufacturing system according to claim 3, wherein, The gripper is configured such that one end is connected to the robot component, and the other end is a free end.

7. The substrate processing apparatus manufacturing system according to claim 6, wherein, The clamping unit further includes: A sliding part, which slides inside the clamp; and An actuator that pushes the sliding part toward the other end of the clamp.

8. The substrate processing apparatus manufacturing system according to claim 7, wherein, The clamping unit further includes: A spring is disposed at the other end inside the clamp, causing the sliding part to return to one end of the clamp.

9. The substrate processing apparatus manufacturing system according to claim 8, wherein, The clamp has a hollow portion for the sliding part to slide. A second step is formed in the hollow part of the clamp, and the spring is provided on the second step.

10. The substrate processing apparatus manufacturing system according to claim 9, wherein, The sliding part is formed as a cone with a cross-sectional area decreasing towards the other end of the clamp.

11. The substrate processing apparatus manufacturing system according to claim 1, wherein, The first plate module has a plurality of first fastening holes arranged radially and radially, and the second plate module has a plurality of second fastening holes, the second fastening holes having the same central axis as the first fastening holes. The bolt module is coupled to the first fastening holes and the second fastening holes. The control unit is configured to preferentially set the order in which the bolt modules are engaged in the plurality of second fastening holes to a sequence in which at least one second fastening hole is located at a position spaced apart from each other, rather than first setting the order in which the positions of the second fastening holes are adjacent to each other, thereby controlling the engagement sequence of the second fastening holes.

12. The substrate processing apparatus manufacturing system according to claim 11, wherein, The control unit is configured to arrange the bolt module in a radially arranged plurality of second fastening holes of the second plate module in a symmetrical position.

13. The substrate processing apparatus manufacturing system according to claim 11, wherein, The second board module has a first area, a second area, a third area, and a fourth area arranged from the center to the periphery. The control unit is configured to, For the radial direction of the second plate module, the engagement sequence of the second fastening holes is set and controlled according to the order of the regions that are separated from each other rather than the order of the adjacent regions.

14. The substrate processing apparatus manufacturing system according to claim 13, wherein, The control unit is configured to, In the first region, the second region, the third region, and the fourth region, the engagement sequence of the second fastening holes is preferably controlled in odd-numbered regions, or preferably in even-numbered regions.

15. The substrate processing apparatus manufacturing system according to claim 14, wherein, The control unit sets the engagement sequence of the second fastening hole to be: The first region is set first, then the third region is set, and then the second region or the fourth region is set.

16. The substrate processing apparatus manufacturing system according to claim 11, further comprising: A support portion for supporting the first plate module and the second plate module.

17. The substrate processing apparatus manufacturing system according to claim 16, further comprising: A rotating module for rotating the support portion to change the position of the second fastening hole facing the robot assembly.

18. The substrate processing apparatus manufacturing system according to claim 17, wherein, The control unit is configured to, Control the robot component and the rotation module, The orientation position control of the robot assembly and the second fastening hole is achieved by rotating the rotation module to control the position of the second fastening hole in the radial direction of the second plate module, and by controlling the horizontal movement of the robot assembly to control the position of the second fastening hole in the radial direction of the second plate module.

19. The substrate processing apparatus manufacturing system according to claim 1, wherein, The first plate module is provided by a spray head plate, and the second plate module is provided by a gas distribution plate. The robot assembly uses the bolt module to fasten the spray head plate and the gas distribution plate.

20. A substrate processing apparatus manufacturing system, comprising: A clamping unit is used to clamp a bolt module, which is connected to a first plate module and a second plate module of the substrate processing device, and the head of the bolt module has a slot. A robot assembly for rotating the clamping unit to fasten the bolt module to the first plate module and the second plate module; as well as Control unit, the control unit being used to control the robot component, The first plate module has multiple first fastening holes arranged radially and radially, and the second plate module has multiple second fastening holes. The second fastening holes and the first fastening holes have the same central axis. The bolt module is coupled to the first fastening holes and the second fastening holes. The control unit is configured to preferentially set the order in which the bolt modules are engaged in the plurality of second fastening holes to a sequence in which at least one second fastening hole is located at a position spaced apart from each other, rather than first setting the order in which the positions of the second fastening holes are adjacent to each other, thereby controlling the engagement sequence of the second fastening holes.

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