A device, system, and method for tuning impedance uniformity in a multi-cavity semiconductor device

Abstract

This invention discloses an impedance consistency adjustment device, system, and method for multi-cavity semiconductor devices. The impedance consistency adjustment device for multi-cavity semiconductor devices includes: an impedance detection module, multiple first adjustment modules, a second adjustment module, multiple matching devices, and a control module. The impedance detection module is connected to multiple cavities and the control module. Each cavity has a first adjustment module inside, and the second adjustment modules are located outside the cavities and grounded. The control module is connected to each of the first and second adjustment modules, and each matching device is connected to its corresponding cavity. The control module controls the variable elements in each of the first and second adjustment modules based on the detected impedance information to ensure that the impedance of all cavities remains consistent and meets a preset standard, thus adapting to the impedance range that each matching device can handle. This invention ensures impedance consistency in multi-cavity devices, eliminating the need for repeated adjustments to the matching devices.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to an impedance uniformity adjustment device, system, and method for multi-cavity semiconductor devices. Background Technology

[0002] In semiconductor manufacturing processes, radio frequency (RF) power supply systems typically include an RF power supply, a matching circuit, and a cavity. The function of the matching circuit is to achieve impedance matching between the RF power supply and the cavity to ensure efficient power transmission. When the device has a multi-cavity structure (i.e., a device contains multiple independent cavities), the input impedance of the multiple cavities often varies due to mechanical assembly tolerances, batch differences in materials, and subtle differences in structural components.

[0003] In the prior art, patent CN101754570B discloses a method and apparatus for achieving impedance matching in radio frequency transmission. This method achieves impedance matching by measuring the load impedance and then adjusting the variable elements (capacitors, inductors) in the matching circuit. Specifically, it includes a calibration step, a detection step (using sensors to collect voltage and current and calculate impedance magnitude and phase), and an adjustment step.

[0004] However, the existing technology has the following drawbacks: too many testing steps and complex processes; a large amount of simulation calculation is required, which consumes time and computing power; it cannot effectively solve the problem of impedance inconsistency caused by hardware differences between multi-cavity structures; the means of adjusting impedance are limited to the variable components inside the matching unit, the adjustment space is small, and the matching unit of each device needs to be adjusted individually, which cannot be standardized for factory shipment.

[0005] Therefore, there is an urgent need for a simple solution that can pre-measure and adjust the impedance consistency of multiple cavities during the equipment assembly stage, so that the matching circuit does not need to be repeatedly adjusted. Summary of the Invention

[0006] This invention provides an adjustment device, system, and method for impedance consistency of multi-cavity semiconductor devices, to solve the problems of impedance inconsistency in multi-cavity devices, the need for separate adjustment of matching devices, and the single and costly adjustment methods in the prior art.

[0007] According to one aspect of the present invention, an impedance consistency adjustment device for a multi-cavity semiconductor device is provided, the multi-cavity semiconductor device impedance consistency adjustment device comprising: an impedance detection module, a plurality of first adjustment modules, a second adjustment module, a plurality of matching devices, and a control module; The impedance detection module is connected to multiple cavities and the control module, and is used to measure the impedance information of each cavity in an offline state and transmit it to the control module. Each cavity is equipped with one of the first adjustment modules, and the second adjustment module is located outside the plurality of cavities and is grounded; The control module is connected to each of the first adjustment modules and the second adjustment module, and each matching device is connected to the corresponding cavity. The control module is used to control the variable elements in each of the first adjustment modules and the second adjustment modules according to the detected impedance information, so as to make the impedance of all cavities consistent and reach the preset standard, so as to adapt to the adaptable impedance range of each matching device.

[0008] Optionally, the plurality of matching devices include at least a first matching device and a second matching device, and the plurality of first adjustment modules include at least a first adjustable resistor and a second adjustable resistor respectively disposed inside the first cavity and the second cavity; The first end of the first adjustable resistor is connected to the vertically spaced radio frequency coils in the first cavity, and the second end of the first adjustable resistor is connected to the outer shell of the first cavity. The first end of the second adjustable resistor is connected to the vertically spaced radio frequency coils in the second cavity, and the second end of the second adjustable resistor is connected to the outer shell of the second cavity; Alternatively, the first adjustment module includes a first MOSFET and a second MOSFET respectively disposed inside the first cavity and the second cavity; The first terminal of the first MOSFET is connected to the vertically spaced radio frequency coils in the first cavity, the second terminal of the first MOSFET is connected to the outer shell of the first cavity, and the control terminal of the first MOSFET is connected to the control module. The first end of the second MOSFET is connected to the vertically spaced radio frequency coils in the second cavity, the second end of the second MOSFET is connected to the outer shell of the first cavity, and the control end of the second MOSFET is connected to the control module.

[0009] Optionally, the second adjustment module includes: an adjustable grounding air capacitor, wherein the adjustable grounding air capacitor is disposed outside the first cavity and the second cavity; The first end of the adjustable grounded air capacitor is connected to the outer shell of the first cavity and the outer shell of the second cavity, and the second end of the adjustable grounded air capacitor is grounded.

[0010] Optionally, the impedance detection module includes: an impedance measuring instrument connected to the first cavity and the second cavity; The impedance measuring instrument is used to measure the real and imaginary parts of the impedance at the connection between the first matching device and the first cavity, and the real and imaginary parts of the impedance at the connection between the second matching device and the second cavity, and transmits the data to the control module.

[0011] Optionally, the impedance matching adjustment device for a multi-cavity semiconductor device further includes: a first matching terminal and a second matching terminal respectively disposed on the first cavity and the second cavity; The first matcher connection terminal and the second matcher connection terminal are used to connect the first matcher and the second matcher, respectively.

[0012] Optionally, the impedance uniformity adjustment device for multi-cavity semiconductor devices further includes: a first impedance measurement interface and a second impedance measurement interface respectively disposed on the first cavity and the second cavity; The first impedance measurement interface and the second impedance measurement interface are used to connect the impedance measuring instrument to the multi-cavity semiconductor device during the assembly process to measure the impedance of the first cavity and the second cavity offline.

[0013] According to another aspect of the present invention, an impedance uniformity adjustment system for a multi-cavity semiconductor device is provided, comprising at least: a first cavity, a second cavity, and an impedance uniformity adjustment device for a multi-cavity semiconductor device as described in any one of the preceding aspects.

[0014] According to another aspect of the present invention, a method for adjusting the impedance uniformity of a multi-cavity semiconductor device is provided, executed by the impedance uniformity adjustment device for a multi-cavity semiconductor device as described in any one of the preceding aspects, the method comprising: During the assembly of a multi-cavity semiconductor device, the impedance information of multiple cavities is measured separately. Based on the detected impedance information, the variable elements in each of the first and second adjustment modules are controlled to keep the impedance of multiple cavities consistent and reach a preset standard, so as to adapt to the compatible impedance range of each matching device.

[0015] Optionally, during the assembly process of the multi-cavity semiconductor device, measuring the impedance information of each cavity includes: Measure the real and imaginary parts of the impedance at the connection between the first matching device and the first cavity, and measure the real and imaginary parts of the impedance at the connection between the second matching device and the second cavity; The real part of the impedance at the connection between the first matching device and the first cavity is adjusted to the factory standard value by adjusting the first adjustable resistor or the first MOSFET; the real part of the impedance at the connection between the second matching device and the second cavity is adjusted to the factory standard value by adjusting the second adjustable resistor or the second MOSFET. The imaginary impedance at the connection between the first matching unit and the first cavity and / or the imaginary impedance at the connection between the second matching unit and the second cavity are adjusted to the factory standard value by adjusting the adjustable grounding air capacitor.

[0016] Optionally, during the assembly of a multi-cavity semiconductor device, before measuring the impedance information of each cavity separately, the process may further include: Determine the impedance range that the first matching device and the second matching device can be adapted to.

[0017] The technical solution of this invention, by setting a first adjustment module inside the cavity and a second adjustment module outside the cavity, achieves independent and precise adjustment of the impedance of multiple cavities, ensuring impedance consistency. The impedance of multiple cavities is measured and adjusted offline during equipment assembly, eliminating the need for complex online sensors and simulation calculations, making operation simple and cost-effective. Automatic adjustment through the control module achieves high consistency between multiple cavities and different machines, improving process repeatability and product yield. Offline measurement and adjustment of the impedance of multiple cavities through multiple first and second adjustment modules during equipment assembly ensures impedance consistency without requiring separate adjustments to the matching device parameters, and offers diverse adjustment methods. This solves the problems of inconsistent impedance of multiple cavities, the need for separate matching device adjustments, and the high cost and limited adjustment methods in existing technologies. It offers the advantages of ensuring impedance consistency across multiple cavities, eliminating the need for repeated matching device adjustments, and providing multiple adjustment methods at a low cost.

[0018] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of an impedance consistency adjustment device for a multi-cavity semiconductor device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of an impedance consistency adjustment device for a dual-cavity semiconductor device according to an embodiment of the present invention; Figure 3 This is a flowchart of a method for adjusting the impedance consistency of a multi-cavity semiconductor device according to an embodiment of the present invention; Figure 4 This is a flowchart of step S110 in a method for adjusting the impedance consistency of a multi-cavity semiconductor device according to an embodiment of the present invention. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0023] Figure 1 This is a schematic diagram of the structure of an impedance consistency adjustment device for a multi-cavity semiconductor device according to an embodiment of the present invention. (Refer to...) Figure 1 The present invention provides an impedance consistency adjustment device for a multi-cavity semiconductor device, which includes: an impedance detection module 10, a plurality of first adjustment modules 20, a second adjustment module 30, a plurality of matching devices, and a control module 60. Impedance detection module 10 is connected to multiple cavities and control module 60, and is used to measure the impedance information of each cavity in offline state and transmit it to control module 60. Each cavity is equipped with a first adjustment module 20, and a second adjustment module 30 is located outside the multiple cavities and grounded. The control module 60 is connected to each of the first adjustment modules 20 and the second adjustment module 30. Each matching device is connected to its corresponding cavity. The control module 60 is used to control the variable elements in each of the first adjustment modules 20 and the second adjustment module 30 according to the detected impedance information, so that the impedance of all cavities is kept consistent and reaches the preset standard, so as to adapt to the adaptable impedance range of each matching device.

[0024] Specifically, the impedance consistency adjustment device for multi-cavity semiconductor equipment can be applied to plasma etching equipment with three process cavities (first cavity 100, second cavity 200, and third cavity 300) to automatically calibrate the impedance of each cavity during offline maintenance or before power-on, ensuring it matches the compatible impedance range of the corresponding matcher. The adjustment device includes: an impedance detection module 10, three first adjustment modules 20, one second adjustment module 30, three matchers (first matcher 40, second matcher 50, and third matcher 70), and a control module 60.

[0025] Impedance detection module 10 employs a network analyzer, with its test ports connected to the impedance measurement interfaces on the first cavity 100, second cavity 200, and third cavity 300, respectively. In offline mode (i.e., when no process gas is introduced and no radio frequency power is applied), control module 60 controls impedance detection module 10 to sequentially measure the impedance information inside each cavity and transmit the measurement data to control module 60. First adjustment module 20 is an impedance fine-tuning component installed inside each cavity. First adjustment module 20 is connected to control module 60 via an adjustment knob or drive motor. Control module 60 adjusts the variable element in first adjustment module 20 via the adjustment button or drive motor to slightly change the equivalent impedance inside the cavity. Second adjustment module 30 is located outside all cavities and grounded. Second adjustment module 30 is connected to control module 60 via an adjustment knob or drive motor. Control module 60 adjusts the variable element in second adjustment module 30 via the adjustment button or drive motor to significantly adjust the parasitic parameters of each cavity relative to ground, thereby synchronously correcting the impedance offset of all cavities.

[0026] The control module 60 can be a PLC or an embedded controller, internally storing preset standard impedance values ​​and the impedance ranges that each matching device can adapt to. After receiving the impedance data of each cavity uploaded by the impedance detection module 10, the control module 60 first determines whether the impedances of all cavities are consistent and fall within the matching range of the matching device. If the impedance of any cavity deviates from the standard impedance value, the following adjustment strategy is executed: If the impedance difference between the cavities is small but the overall impedance deviates from the standard impedance value, the control module 60 will prioritize adjusting the variable capacitor in the second adjustment module 30 to make the impedance of all cavities synchronously approach the standard impedance value. If there is a significant impedance difference between the cavities, the control module 60 will adjust the variable element in the first adjustment module 20 inside each cavity to independently fine-tune the impedance of each cavity until the impedance difference between any two cavities is less than a preset threshold (such as ±0.5Ω) and the impedance of each cavity is within the range that the matching device can adapt to.

[0027] After adjustment, the control module 60 locks the position of each variable element and sends an impedance calibration completion signal to the main controller of the equipment. At this time, the first matching unit 40, the second matching unit 50, and the third matching unit 70 are connected to their respective cavities. Since the impedance of each cavity is consistent and within the matching standard range, the matching units can quickly and stably match the RF power to the cavity in subsequent processes, significantly reducing reflected power.

[0028] This embodiment uses three cavities as an example for illustration. Those skilled in the art will understand that when there are two or more cavities, the impedance consistency adjustment function described above can also be achieved by reducing or increasing the corresponding number of first adjustment modules and matching devices, while maintaining a shared second adjustment module.

[0029] Based on the above embodiments, the following description uses a dual-cavity semiconductor device as an example: Figure 2 This is a schematic diagram of the structure of an impedance uniformity adjustment device for a dual-cavity semiconductor device according to an embodiment of the present invention. (Refer to...) Figure 2 The impedance consistency adjustment device for dual-cavity semiconductor devices includes: an impedance detection module 10, two first adjustment modules 20, a second adjustment module 30, a first matching device 40, a second matching device 50, and a control module 60. The impedance detection module 10 is connected to the first cavity 100, the second cavity 200 and the control module 60. The impedance detection module 10 is used to measure the impedance information of the first cavity 100 and the second cavity 200 in an offline state and transmit it to the control module 60. The first adjustment module 20 is disposed inside the first cavity 100 and the second cavity 200, and the second adjustment module 30 is disposed outside the first cavity 100 and the second cavity 200 and grounded; The control module 60 is connected to the first adjustment module 20 and the second adjustment module 30. The first matching device 40 and the second matching device 50 are respectively connected to the radio frequency coil L1 in the first cavity 100 and the second cavity 200. The control module 60 is used to control the variable elements in the first adjustment module 20 and the second adjustment module 30 according to the detected impedance information, so that the impedance of the first cavity 100 and the second cavity 200 is kept consistent and reaches a preset standard, so as to adapt to the adaptable impedance range of the first matching device 40 and the second matching device 50.

[0030] Specifically, the first cavity 100 and the second cavity 200 are two symmetrical or independent process cavities. Each cavity contains a first adjustment module 20, and a grounded second adjustment module 30 is located below both cavities. The first matching device 40 and the second matching device 50 are standardized matching devices with a fixed impedance range. Their internal structure is not adjusted for different machines and they are directly connected to the cavities. No additional adjustment to the matching device structure is required, and the matching devices can be manufactured to standardized specifications, saving costs. They are easy to adjust during assembly, controlling the impedance consistency of the two cavities and the consistency between machines.

[0031] In offline mode (i.e., without applied RF power), the impedance detection module 10 measures the input impedance (real and imaginary parts) of the first cavity 100 and the second cavity 200 at the first impedance measurement interface and the second impedance measurement interface, respectively, and transmits the measurement results to the control module 60. The control module 60 compares the dual-cavity impedance with a preset standard value. If there is a deviation in the real part, it controls the variable element in the first adjustment module 20 and / or the second adjustment module 30 to change its resistance value so that the real parts of the two cavities are consistent and meet the standard. If there is a deviation in the imaginary part, it controls the second adjustment module 30 to change its capacitance value so that the imaginary parts of the two cavities are consistent and meet the standard. Ultimately, the impedances of both cavities fall within the adaptable impedance range of the first matching device 40 and the second matching device 50.

[0032] In conventional dual-cavity semiconductor devices, due to machining errors, differences in assembly sequence, and variations in component batches, the input impedance presented at the output of the matching circuit is not entirely the same for each cavity. Current technology requires engineers to manually adjust the variable capacitor or inductor inside the matching circuit connected to each cavity after assembly, adapting the matching circuit to the variable cavity impedance. This means that the matching circuit still needs to be opened and adjusted at the field after leaving the factory, preventing a plug-and-play solution.

[0033] This embodiment adopts a method of adjusting the cavity first and then installing the matching unit, without changing the structure of the matching unit. The internal structure of the first and second matching units is fixed and shipped according to uniform specifications. The real part of the impedance is adjusted by an adjustable resistor, and the imaginary part of the impedance is adjusted by an adjustable grounding air capacitor. By adjusting the adjustable resistor (real part) of each cavity and the shared adjustable grounding capacitor (imaginary part), the impedance differences caused by assembly tolerances in different machines and cavities are leveled to near the same impedance standard value. This allows the matching unit, which originally required parameter adjustment for each piece of equipment, to be used directly like a standard part without further adjustment.

[0034] For the first and second matching units, there is no longer a need to consider the original assembly differences of the cavities, because after adjustment, the impedance presented to the matching units by all cavities is the same (or within a very small range). Therefore, the same matching unit can be installed on any machine that has been adjusted using this solution, without the need to open the cover on-site to adjust the parameters of the matching unit.

[0035] The technical solution of this invention, by setting a first adjustment module inside the cavity and a second adjustment module outside the cavity, achieves independent and precise adjustment of the impedance of multiple cavities, ensuring impedance consistency. The impedance of multiple cavities is measured and adjusted offline during equipment assembly, eliminating the need for complex online sensors and simulation calculations, making operation simple and cost-effective. Automatic adjustment through the control module achieves high consistency between multiple cavities and different machines, improving process repeatability and product yield. Offline measurement and adjustment of the impedance of multiple cavities through multiple first and second adjustment modules during equipment assembly ensures impedance consistency without requiring separate adjustments to the matching device parameters, and offers diverse adjustment methods. This solves the problems of inconsistent impedance of multiple cavities, the need for separate matching device adjustments, and the high cost and limited adjustment methods in existing technologies. It offers the beneficial effects of ensuring impedance consistency across multiple cavities, eliminating the need for repeated matching device adjustments, and providing multiple adjustment methods at a low cost.

[0036] Continue to refer to Figure 2 In one embodiment, optionally, the plurality of matchers include at least: a first matcher 40 and a second matcher 50, and the plurality of first adjustment modules 20 include at least: a first adjustable resistor R21 and a second adjustable resistor R22 respectively disposed inside the first cavity 100 and the second cavity 200. The first end of the first adjustable resistor R21 is connected to the radio frequency coils L1 arranged vertically in the first cavity 100, and the second end of the first adjustable resistor R21 is connected to the outer shell of the first cavity 100. The first end of the second adjustable resistor R22 is connected to the vertically spaced radio frequency coils L1 in the second cavity 200, and the second end of the second adjustable resistor R22 is connected to the outer shell of the second cavity 200.

[0037] In another embodiment, optionally, the first adjustment module includes: a first MOSFET and a second MOSFET respectively disposed inside the first cavity and the second cavity; The first terminal of the first MOSFET is connected to the vertically spaced radio frequency coils in the first cavity, the second terminal of the first MOSFET is connected to the outer shell of the first cavity, and the control terminal of the first MOSFET is connected to the control module. The first terminal of the second MOSFET is connected to the vertically spaced radio frequency coils in the second cavity, the second terminal of the second MOSFET is connected to the outer shell of the first cavity, and the control terminal of the second MOSFET is connected to the control module.

[0038] Specifically, adjustable resistors are located on the lower electrode side of each cavity, connected in series between the RF coil L1 and ground, with an adjustment range of 100Ω to 100KΩ, used to adjust the real part of the impedance. The control module 60 adjusts the resistance values ​​of the first adjustable resistor R21 and the second adjustable resistor R22 via a stepper motor or a digital potentiometer, with an adjustment range of 100Ω to 100KΩ. The control module 60 continuously adjusts the real part of the impedance by changing the channel resistance of the MOSFET through adjusting the gate voltage.

[0039] Continue to refer to Figure 2 Optionally, the second adjustment module 30 includes: an adjustable grounding air capacitor Cg, which is disposed outside the first cavity 100 and the second cavity 200; The first end of the adjustable grounding air capacitor Cg is connected to the outer shell of the first cavity 100 and the outer shell of the second cavity 200, and the second end of the adjustable grounding air capacitor Cg is grounded.

[0040] Specifically, the second adjustment module 30 includes an adjustable grounded air capacitor Cg. This capacitor is located outside the first cavity 100 and the second cavity 200, with its first end connected to both the outer shell of the first cavity 100 and the outer shell of the second cavity 200, and its second end grounded. The adjustable grounded air capacitor Cg has an adjustment range of 500pF to 1000pF. The control module 60 drives the moving plate of the capacitor to rotate via a servo motor, changing the capacitance value and thus adjusting the imaginary part of the impedance.

[0041] Optionally, the adjustment range of the first adjustable resistor is 100Ω-100KΩ, and the adjustment range of the second adjustable resistor is 100Ω-100KΩ.

[0042] Optionally, the adjustable grounding air capacitor can be adjusted within a range of 500pF-1000pF.

[0043] Specifically, an adjustable grounded air capacitor of 500pF-1000pF is placed directly below the second cavity, and an adjustable resistor of 100Ω-100KΩ is placed in each of the first and second cavities. During assembly, an impedance meter is used to measure the current actual impedance of the first and second cavities (e.g., R1+jX1 and R2+jX2). This is compared to the preset optimal matching impedance range of the matching device. If the real part deviation is too large, the adjustable resistor of the corresponding cavity is adjusted to change the real part value to the standard value. If the imaginary part deviation is too large, the adjustable grounded air capacitor is adjusted to change the imaginary part value to the standard value. After adjustment, the impedance of both cavities is calibrated to perfectly match the standard matching range of the matching device.

[0044] In summary, by adjusting the real and imaginary parts of the input impedance of each cavity to a uniform preset standard value during the equipment assembly stage, the first and second matching circuits can be directly adapted for use without requiring internal structural adjustments for impedance differences between different machines or cavities. This makes the matching circuits universally applicable, allowing for standardized, mass-produced shipments, significantly reducing equipment commissioning costs and on-site maintenance difficulties.

[0045] In this embodiment, an adjustable resistor or MOSFET is installed inside the cavity, and an adjustable grounded air capacitor is installed outside the cavity, which enables independent and precise adjustment of the impedance of the two cavities and ensures the consistency of the impedance of the two cavities.

[0046] Optionally, the impedance detection module includes: an impedance measuring instrument connected to the first cavity and the second cavity; The impedance measuring instrument is used to measure the real and imaginary parts of the impedance at the connection between the first matching device and the first cavity, and the real and imaginary parts of the impedance at the connection between the second matching device and the second cavity, and transmits the data to the control module.

[0047] Specifically, an impedance measuring instrument is connected through the first impedance measurement interface and the second impedance measurement interface to measure the real part R1 and the imaginary part X1 of the impedance at the connection between the first matching device and the first cavity, as well as the real part R2 and the imaginary part X2 of the impedance at the connection between the second matching device and the second cavity.

[0048] If R1 and R2 are inconsistent or deviate from the standard value, adjust the first adjustable resistor (or the first MOSFET) and the second adjustable resistor (or the second MOSFET) to bring R1 and R2 to their factory standard values ​​(e.g., 2.5Ω). If X1 and X2 are inconsistent or deviate from the standard value, adjust the adjustable grounding air capacitor to bring X1 and X2 to their factory standard values ​​(e.g., before adjustment, X1 is 10, X2 is 20; after adjustment, X1 is 510, X2 is 520; both X1 and X2 are within the preset range and close to the standard impedance value). Ultimately, ensure that the first cavity impedance Z1 = R1 + jX1 and the second cavity impedance Z2 = R2 + jX2 both fall within the matching impedance range of the matching circuit.

[0049] Optionally, the impedance matching adjustment device for the multi-cavity semiconductor device further includes: a first matching terminal and a second matching terminal respectively disposed on the first cavity and the second cavity; The first matcher connection terminal and the second matcher connection terminal are used to connect the first matcher and the second matcher, respectively.

[0050] Specifically, the first and second matching terminals are connected to the first matching terminal and the second matching terminal, respectively, and RF power is applied to activate the system. Under normal circumstances, the reflected power from the RF power supply to the matching terminal is less than 5%, and the position of the variable element inside the matching terminal is appropriate. The variable element inside the matching terminal does not need to be pushed to its extreme position to adapt to a load with a large deviation, and there is no need to adjust the parameters of the matching terminal separately, saving debugging time and cost.

[0051] Optionally, the impedance uniformity adjustment device for multi-cavity semiconductor devices further includes: a first impedance measurement interface and a second impedance measurement interface respectively disposed on the first cavity and the second cavity; The first impedance measurement interface and the second impedance measurement interface are used to connect an impedance measuring instrument during the assembly process of multi-cavity semiconductor devices to measure the impedance of the first cavity and the second cavity offline.

[0052] Specifically, the first and second impedance measurement interfaces are located near the connection points of the first and second matching devices, respectively. These interfaces are used to temporarily connect an impedance meter (such as an ACA-500) during assembly. The impedance meter measures the input impedance of the first and second cavities through the first and second impedance measurement interfaces to read the input impedance of the two cavities offline. At each stage of device assembly, operators obtain the impedance of the two cavities through the first and second impedance measurement interfaces and adjust the aforementioned adjustable capacitors and resistors to ensure that the impedances of the two cavities are consistent and fall within the matching device's range. The entire device requires no complex sensor arrays or online simulation calculations, making adjustment intuitive and cost-effective.

[0053] Embodiments of the present invention also provide an impedance consistency adjustment system for a multi-cavity semiconductor device. The impedance consistency adjustment system for a multi-cavity semiconductor device includes at least: a first cavity, a second cavity, and an impedance consistency adjustment device for a multi-cavity semiconductor device provided in any embodiment of the present invention.

[0054] Specifically, impedance consistency adjustment systems for multi-cavity semiconductor devices are particularly suitable for dual-cavity process equipment that requires radio frequency power, such as plasma etching and chemical vapor deposition.

[0055] Since the impedance uniformity adjustment system for multi-cavity semiconductor devices includes the impedance uniformity adjustment device for multi-cavity semiconductor devices provided in any embodiment of the present invention, the beneficial effects of the above-mentioned impedance uniformity adjustment system for multi-cavity semiconductor devices and the impedance uniformity adjustment device for multi-cavity semiconductor devices are the same, and will not be repeated here.

[0056] Figure 3This is a flowchart illustrating a method for adjusting the impedance consistency of a multi-cavity semiconductor device according to an embodiment of the present invention. This embodiment is applicable to impedance adjustment and matching in multi-cavity semiconductor devices, and the method can be executed by a device for adjusting the impedance consistency of a multi-cavity semiconductor device. Figure 3 As shown, the method includes: S110. During the assembly of a multi-cavity semiconductor device, the impedance information of multiple cavities is measured respectively.

[0057] Specifically, in combination Figure 2 During the assembly of multi-cavity semiconductor devices, an impedance meter is used to measure the impedance at the connection between the first matching device 40 and the first cavity 100, and at the connection between the second matching device 50 and the second cavity 200.

[0058] S120. Based on the detected impedance information, control the variable elements in each of the first and second adjustment modules to keep the impedance of multiple cavities consistent and reach the preset standard, so as to adapt to the compatible impedance range of each matching device.

[0059] Specifically, in combination Figure 2 In offline mode (i.e., without applied RF power), the impedance detection module 10 measures the input impedance (real and imaginary parts) of the first cavity 100 and the second cavity 200 at the matching terminal, and transmits the measurement results to the control module 60. The control module 60 compares the dual-cavity impedance with a preset standard value. If there is a deviation in the real part, it controls the variable element in the first adjustment module 20 and / or the second adjustment module 30 to change its resistance value so that the real parts of the two cavities are consistent and meet the standard. If there is a deviation in the imaginary part, it controls the second adjustment module 30 to change its capacitance value so that the imaginary parts of the two cavities are consistent and meet the standard. Ultimately, the impedances of both cavities fall within the adaptable impedance range of the first matching module 40 and the second matching module 50.

[0060] The method for adjusting the impedance consistency of a multi-cavity semiconductor device provided in this embodiment of the invention is executed by the device for adjusting the impedance consistency of a multi-cavity semiconductor device provided in this embodiment of the invention. Therefore, the above-mentioned method for adjusting the impedance consistency of a multi-cavity semiconductor device and the device for adjusting the impedance consistency of a multi-cavity semiconductor device have the same beneficial effects, and will not be described again here.

[0061] Based on the above embodiments, the present invention further refines step S110, which will be described in detail below, but this is not intended to limit the present invention.

[0062] Figure 4 This is a flowchart illustrating step S110 of a method for adjusting the impedance consistency of a multi-cavity semiconductor device according to an embodiment of the present invention. (Refer to...) Figure 4 Step S110 specifically includes: S111. Measure the real and imaginary parts of the impedance at the connection between the first matching unit and the first cavity, and measure the real and imaginary parts of the impedance at the connection between the second matching unit and the second cavity.

[0063] Specifically, at a certain intermediate stage of equipment assembly (e.g., after the cavity and lower electrode are assembled but before the matching unit is connected), an impedance meter (e.g., Chamber Analyzer ACA-500) is used to connect to the two cavities via the first and second impedance measurement interfaces, respectively. The measurement frequency is the radio frequency operating frequency, and the real and imaginary parts of the input impedance of each cavity at the matching unit connection are recorded.

[0064] S112. The real part of the impedance at the connection between the first matching device and the first cavity is adjusted to the factory standard value by adjusting the first adjustable resistor or the first MOSFET. The real part of the impedance at the connection between the second matching device and the second cavity is adjusted to the factory standard value by adjusting the second adjustable resistor or the second MOSFET.

[0065] Specifically, the measured impedance values ​​of the first cavity and the second cavity are compared. If the difference between their real parts exceeds a preset threshold (e.g., ±0.5Ω), the first adjustable resistor or the first MOSFET and the second adjustable resistor or the second MOSFET are adjusted to make the real parts of the two cavities tend to be consistent.

[0066] S113. The imaginary part of the impedance at the connection between the first matching unit and the first cavity and / or the imaginary part of the impedance at the connection between the second matching unit and the second cavity are adjusted to the factory standard value by adjusting the adjustable grounded air capacitor.

[0067] Specifically, if the difference in the imaginary part exceeds the threshold, the adjustable grounded air capacitor (adjustment range 500pF~1000pF) reserved directly below the cavity is adjusted to make the imaginary parts of the dual-cavity impedance more consistent.

[0068] Optionally, during the assembly of a multi-cavity semiconductor device, before measuring the impedance information of each cavity separately, the process may further include: Determine the impedance range that the first and second matching circuits can be fitted with.

[0069] Specifically, based on the electrical specifications of the selected standardized matching unit, the optimal load impedance range (e.g., real part R ± ΔR, imaginary part X ± ΔX) is obtained. The internal structure of this matching unit is fixed and does not change with different machine tools.

[0070] First, confirm the impedance range that the first and second matching transformers can accommodate. During each assembly stage, measure the impedance of the dual cavities using an impedance meter, and connect the matching transformers to the matching transformer terminals on the cavities. At this point, adjust the adjustable grounding air capacitor and adjustable resistor to ensure the dual-cavity impedance falls within the impedance range that the matching transformers can accommodate. Since the dual-cavity consistency has been pre-guaranteed, the internal capacitor / inductor positions of the matching transformers are within a suitable range during the initial testing, requiring no additional adjustments to the matching transformer structure.

[0071] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A device for adjusting the impedance uniformity of a multi-cavity semiconductor device, characterized in that, include: Impedance detection module, multiple first adjustment modules, second adjustment modules, multiple matching devices, and control module; The impedance detection module is connected to multiple cavities and the control module, and is used to measure the impedance information of each cavity in an offline state and transmit it to the control module. Each cavity is equipped with one of the first adjustment modules, and the second adjustment module is located outside the plurality of cavities and is grounded; The control module is connected to each of the first adjustment modules and the second adjustment module, and each matching device is connected to the corresponding cavity. The control module is used to control the variable elements in each of the first adjustment modules and the second adjustment modules according to the detected impedance information, so as to make the impedance of all cavities consistent and reach the preset standard, so as to adapt to the adaptable impedance range of each matching device.

2. The apparatus of claim 1, wherein, The plurality of matchers includes at least a first matcher and a second matcher, and the plurality of first adjustment modules includes at least a first adjustable resistor and a second adjustable resistor respectively disposed inside the first cavity and the second cavity; The first end of the first adjustable resistor is connected to the vertically spaced radio frequency coils in the first cavity, and the second end of the first adjustable resistor is connected to the outer shell of the first cavity. The first end of the second adjustable resistor is connected to the vertically spaced radio frequency coils in the second cavity, and the second end of the second adjustable resistor is connected to the outer shell of the second cavity; Alternatively, the first adjustment module includes a first MOSFET and a second MOSFET respectively disposed inside the first cavity and the second cavity; The first terminal of the first MOSFET is connected to the vertically spaced radio frequency coils in the first cavity, the second terminal of the first MOSFET is connected to the outer shell of the first cavity, and the control terminal of the first MOSFET is connected to the control module. The first end of the second MOSFET is connected to the vertically spaced radio frequency coils in the second cavity, the second end of the second MOSFET is connected to the outer shell of the first cavity, and the control end of the second MOSFET is connected to the control module.

3. The apparatus of claim 2, wherein, The second adjustment module includes: an adjustable grounded air capacitor, which is disposed outside the first cavity and the second cavity; The first end of the adjustable grounded air capacitor is connected to the outer shell of the first cavity and the outer shell of the second cavity, and the second end of the adjustable grounded air capacitor is grounded.

4. The apparatus of claim 2, wherein, The impedance detection module includes: an impedance measuring instrument connected to the first cavity and the second cavity; The impedance measuring instrument is used to measure the real and imaginary parts of the impedance at the connection between the first matching device and the first cavity, and the real and imaginary parts of the impedance at the connection between the second matching device and the second cavity, and transmits the data to the control module.

5. The apparatus of claim 2, wherein, Also includes: A first matching device connection end and a second matching device connection end are respectively disposed on the first cavity and the second cavity; The first matcher connection terminal and the second matcher connection terminal are used to connect the first matcher and the second matcher, respectively.

6. The apparatus of claim 4, wherein, Also includes: A first impedance measurement interface and a second impedance measurement interface are respectively provided on the first cavity and the second cavity; The first impedance measurement interface and the second impedance measurement interface are used to connect the impedance measuring instrument to the multi-cavity semiconductor device during the assembly process to measure the impedance of the first cavity and the second cavity offline.

7. A system for tuning the impedance uniformity of a multi-cavity semiconductor device, comprising: At least including: The first cavity, the second cavity, and the impedance uniformity adjustment device for the multi-cavity semiconductor device according to any one of claims 1-6.

8. A method of adjusting impedance uniformity in a multi-cavity semiconductor device, comprising: Performed by the impedance uniformity adjustment device for a multi-cavity semiconductor device according to any one of claims 3-6, the method comprises: During the assembly of a multi-cavity semiconductor device, the impedance information of each of the multiple cavities is measured. Based on the detected impedance information, the variable elements in each of the first and second adjustment modules are controlled to keep the impedance of multiple cavities consistent and reach a preset standard, so as to adapt to the compatible impedance range of each matching device.

9. The method of claim 8, wherein, The process of assembling a multi-cavity semiconductor device, including measuring the impedance information of multiple cavities, includes: Measure the real and imaginary parts of the impedance at the connection between the first matching device and the first cavity, and measure the real and imaginary parts of the impedance at the connection between the second matching device and the second cavity; The real part of the impedance at the connection between the first matching device and the first cavity is adjusted to the factory standard value by adjusting the first adjustable resistor or the first MOSFET; the real part of the impedance at the connection between the second matching device and the second cavity is adjusted to the factory standard value by adjusting the second adjustable resistor or the second MOSFET. The imaginary impedance at the connection between the first matching unit and the first cavity and / or the imaginary impedance at the connection between the second matching unit and the second cavity are adjusted to the factory standard value by adjusting the adjustable grounding air capacitor.

10. The method of claim 8, wherein, Before measuring the impedance information of each cavity in the assembly process of a multi-cavity semiconductor device, the following steps are also included: Determine the impedance range that the first matching device and the second matching device can be adapted to.

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