A headset

Abstract

This application relates to an earphone, specifically to the technical field of electronic devices. The earphone includes a first speaker and a second speaker. The frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker. The first speaker includes a first diaphragm and a first magnetic circuit system for driving the first diaphragm to produce sound. The second speaker includes a second diaphragm and a second magnetic circuit system for driving the second diaphragm to produce sound. The projection of the first magnetic circuit system along the vibration direction of the first diaphragm at least partially overlaps with the second magnetic circuit system, and the second and first magnetic circuit systems are mutually exclusive. This application can ensure the degree of mutual repulsion between the second and first magnetic circuit systems and increase the average magnetic induction intensity, thereby increasing the sound pressure level of the first and / or second speakers.

Description

[0001] This application is a divisional application of Chinese patent application filed on May 27, 2024, with application number 202410675207.2 and invention title "An Earphone". Technical Field

[0002] This application relates to the technical field of electronic devices, specifically to a pair of headphones. Background Technology

[0003] With the development of acoustic technology, headphones have become widely used in people's daily lives. Headphones can employ multiple speaker combinations to output sound, providing users with an auditory feast. In combination, different speakers may be responsible for outputting sound in different frequency bands. The coupling between multiple speakers is one of the important factors affecting the overall acoustic output effect of headphones; if the coupling between multiple speakers is poor, it will actually reduce the acoustic output quality of the headphones. Summary of the Invention

[0004] This application provides an earphone, the earphone including a first speaker and a second speaker, wherein the frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker, the first speaker including a first diaphragm, a first magnetic circuit system for driving the first diaphragm to produce sound, and a support member for supporting the first diaphragm and the first magnetic circuit system, the second speaker including a second diaphragm and a second magnetic circuit system for driving the second diaphragm to produce sound, wherein the projection of the first magnetic circuit system along the vibration direction of the first diaphragm at least partially overlaps with the second magnetic circuit system, and the second magnetic circuit system and the first magnetic circuit system are mutually exclusive.

[0005] In this application, the projection of the first magnetic circuit system along the vibration direction of the first diaphragm is at least partially overlapped with the second magnetic circuit system, ensuring the degree of mutual repulsion between the second magnetic circuit system and the first magnetic circuit system, and increasing the average magnetic induction intensity, thereby improving the sound pressure level of the first speaker and / or the second speaker. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1 These are schematic diagrams of the headphone structure in some embodiments of this application; Figure 2 yes Figure 1A structural schematic diagram of the earphone from another perspective; Figure 3 yes Figure 1 A structural diagram of the headphone from another perspective; Figure 4 This is a schematic diagram of the front outline of the ear of a user or simulator in some embodiments; Figure 5 yes Figure 1 A schematic diagram of the earphone in a wearing state in some embodiments; Figure 6 yes Figure 1 A cross-sectional view of the middle earphone along line VI-VI in some embodiments; Figure 7 yes Figure 1 A cross-sectional view of the middle earphone along line VII-VII in some embodiments; Figure 8 yes Figure 6 A schematic diagram of the structure of the first housing in some embodiments; Figure 9 yes Figure 8 A schematic diagram of the structure of the first shell in the middle from another perspective; Figure 10 yes Figure 9 A schematic diagram of the arrangement of the first and second sound outlets in some other embodiments; Figure 11 yes Figure 10 A schematic diagram of the arrangement of the first and second sound outlets in some other embodiments; Figure 12 yes Figure 1 A cross-sectional view of the middle earphone along line VII-VII in some other embodiments; Figure 13 for Figure 6 A schematic diagram of the structure of the loudspeaker assembly; Figure 14 This is a circuit diagram of a speaker assembly in some embodiments of this application; Figure 15 This is a schematic diagram showing the relationship between the volume of the first front cavity and the resonant frequency of the first front cavity in one embodiment of this application; Figure 16 for Figure 7 A schematic diagram of the structure of the central loudspeaker assembly in some other embodiments; Figure 17 This is a schematic diagram showing the cooperation of the second magnet, the third magnet, and the first speaker in some embodiments of this application; Figure 18 for Figure 17A schematic diagram showing the effect of the ratio of the cross-sectional area of ​​the second magnet perpendicular to the vibration direction of the second diaphragm to the cross-sectional area of ​​the third magnet perpendicular to the vibration direction of the second diaphragm on the magnetic induction intensity at the first coil. Figure 19 for Figure 17 A schematic diagram of the structure of the second loudspeaker in some other embodiments; Figure 20 for Figure 13 The diagram shows the structure of the second loudspeaker when it moves along the long axis CZ. Figure 21 for Figure 20 A schematic diagram showing the effect of the second loudspeaker moving along the long axis CZ on the magnetic induction intensity at the first coil. Detailed Implementation

[0008] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0009] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0010] This application describes an earphone. Please refer to... Figure 1 , Figure 2 and Figure 3 , Figure 1 These are schematic diagrams of the headphone structure in some embodiments of this application. Figure 2 yes Figure 1 A structural diagram of the headphones from another perspective. Figure 3 yes Figure 1 A schematic diagram of the headphone structure from another perspective. The headphone 100 may include a mechanism module 10 and an ear hook 20 connected to the mechanism module 10. The mechanism module 10 provides sound to achieve an auditory experience, and may also provide different experiences by having other functions such as sound pickup, touch control, pressing, and lighting. The mechanism module 10 can be used with the ear hook 20 to achieve wearing.

[0011] Please see Figure 4 , Figure 4This is a schematic diagram of the anterior contour of the ear of a user or simulator in some embodiments. The ear 200 may include physiological parts such as the external auditory canal 2001, the concha 2002, the cymba conchae 2003, the triangular fossa 2004, the antihelix 2005, the scaphoid fossa 2006, the helix 2007, and the antitragus 2008. The external auditory canal 2001 has a certain depth and can extend to the tympanic membrane; however, for ease of description, unless otherwise specified, the external auditory canal 2001 may refer to the ear opening of the ear 200. Additionally, the physiological parts such as the concha 2002, the cymba conchae 2003, and the triangular fossa 2004 may also have a certain volume and depth. The concha 2002 may be directly connected to the external auditory canal 2001; that is, the ear opening can be considered to be located at the bottom of the concha 2002.

[0012] Understandably, individual differences may exist between users, leading to variations in the shape, size, and other dimensions of the earpiece 200. To facilitate description and reduce (or even eliminate) these individual differences, a simulator containing the head and its earpiece (generally a left and right earpiece; here, we'll use one earpiece as an example) 200 can be created based on standards such as ANS: S3.36, S3.25, and IEC: 60318-7. Examples include GRAS 45BC KEMAR, HEADAcoustics, B&K 4128 series, or B&K 5128 series, etc., to simulate the scenario of most users wearing the headphones 100. Using GRAS KEMAR as an example, the earpiece 200 simulator can be any of the GRAS 45AC, GRAS 45BC, GRAS45CC, or GRAS 43AG. Taking HEAD Acoustics as an example, the ear 200 simulator can be any one of HMS II.3, HMS II.3 LN, or HMS II.3LN HEC.

[0013] It should be noted that in fields such as medicine and anatomy, three basic planes—the sagittal plane, the coronal plane, and the horizontal plane—and three basic axes—the sagittal axis, the coronal axis, and the vertical axis—can be defined for the human body or human simulator. The sagittal plane is a plane perpendicular to the ground along the anteroposterior direction of the body, dividing the human body or human simulator into left and right parts. The coronal plane is a plane perpendicular to the ground along the left and right direction of the body, dividing the human body or human simulator into anterior and posterior parts. The horizontal plane is a plane parallel to the ground along the vertical direction of the body, dividing the human body or human simulator into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left and right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear away from the head, while the latter refers to the side of the ear facing the head. Both refer to the ear 200 of the user or simulator. Specifically, when viewing the ear 200 of the human body or human simulator along the coronal axis, it can be as follows... Figure 4 As shown.

[0014] Please see Figure 5 , Figure 5 yes Figure 1 The diagram illustrates the earphone 100 in a wearing state in some embodiments. The mechanism module 10 is located at the front of the ear 200 in the wearing state. At least a portion of the ear hook 20 is located at the rear of the ear 200 in the wearing state, so that the earphone 100 is hooked onto the ear 200 in the wearing state.

[0015] In this application, descriptions of the process or action of wearing headphones 100, such as "wearing headphones 100," "headphones 100 being worn," and "in the wearing state," all refer to headphones 100 being worn on the ear 200. Of course, due to individual differences among users, the way headphones 100 are worn by different users may differ from how they are worn on the ear 200 of a simulator; however, such differences should be tolerable.

[0016] The mechanism module 10 can be configured not to block the outer ear canal 2001 when worn, thus making the earphone 100 an "open-back earphone". Understandably, the earphone 100 may partially cover the outer ear canal 2001 in different wearing states, but the outer ear canal 2001 is still not blocked.

[0017] Please see Figure 1, Figure 2 and Figure 3 The mechanism module 10 may have a connecting end CE that connects to the ear hook 20 and a free end FE that does not connect to the ear hook 20. In the wearing state, the free end FE of the mechanism module 10 may extend into the concha 2002, or may only cover at least a portion of the concha 2002. The mechanism module 10 and the ear hook 20 may be configured to clamp the ear 200 from both the front and rear sides of the ear 200 region corresponding to the concha 2002, thereby increasing the resistance to the earphone 100 falling off the ear 200 and improving the stability of the earphone 100 in the wearing state.

[0018] The movement module 10 may have a thickness direction X and a length direction Y and a width direction Z that are perpendicular to and orthogonal to each other. The length direction Y can be defined as the direction with the maximum extension dimension in the shape of the movement module 10 in the two-dimensional orthographic projection on the plane (two-dimensional projection plane) where the outer surface of the movement module 10 is located (e.g., when the shape of the two-dimensional orthographic projection is a rectangle or approximately a rectangle, the length direction Z is the length direction of the rectangle or approximately a rectangle). The width direction Z can be defined as the direction perpendicular to the length direction Y in the two-dimensional orthographic projection (e.g., when the shape of the two-dimensional orthographic projection is a rectangle or approximately a rectangle, the width direction Z is the width direction of the rectangle or approximately a rectangle). The thickness direction X can be defined as the direction perpendicular to the two-dimensional projection plane that carries the two-dimensional orthographic projection.

[0019] In some embodiments, when the movement module 10 is tilted while in the wearing state, the length direction Y and the width direction Z are still parallel or approximately parallel to the sagittal plane. The length direction Y may have a non-0° angle with the sagittal axis, that is, the length direction Y may also be tilted accordingly. The width direction Z may have a non-0° angle with the vertical axis, that is, the width direction Z is also tilted.

[0020] In some embodiments, the length direction Y can be defined as the direction in which the movement module 10 approaches or moves away from the back of the head when worn; that is, the length direction Y can be parallel to the sagittal axis or have an angle other than 0°. The width direction Z can be defined as the direction in which the movement module 10 approaches or moves away from the top of the head when worn; that is, the width direction Z can be parallel to the vertical axis or have an angle other than 0°. In some embodiments, the free end FE is pressed into the concha 2002 in the thickness direction X. For example, the free end FE abuts against the concha 2002 in the length direction Y and / or the width direction Z. In some embodiments, the direction from the connecting end CE to the free end FE can be the length direction Y, but it may also be different from the length direction Y depending on structural requirements.

[0021] It should be noted that, when worn, the free end FE of the movement module 10 can not only extend into the concha cavity 2002, but also be projected onto the antihelix 2005, or be projected onto the left and right sides of the head and located on the front side of the ear 200 on the sagittal axis.

[0022] Of course, in other scenarios, at least some of the movement modules 10 can be projected onto the antihelix 2005, or onto the left and right sides of the head and located on the front side of the ear 200 on the sagittal axis.

[0023] In other words, the ear hook 20 can support the movement module 10 to be worn in the concha 2002, antihelix 2005, and the front of the ear 200.

[0024] Please see Figure 1 , Figure 2 and Figure 5 When worn and viewed along the coronal axis, the movement module 10 can be shaped like a circle, an ellipse, a rounded square, or a rounded rectangle. Therefore, for ease of description, this embodiment uses a rounded rectangle as an example. In some embodiments, the length of the movement module 10 in the longitudinal direction Y can be greater than its width in the width direction Z.

[0025] The mechanism module 10 may have an inner surface IS facing the ear 200 along the thickness direction X when worn, an outer surface OS facing away from the ear 200, and connecting surfaces (such as a lower surface LS, an upper surface US, and an outer end surface RS) connecting the inner surface IS and the outer surface OS. Specifically, when the mechanism module 10 is worn, the upper surface US connects the inner surface IS and the outer surface OS, the lower surface LS connects the inner surface IS and the outer surface OS, the upper surface US is closer to the top of the user's head along the width direction Z, the lower surface LS is further away from the top of the user's head along the width direction Z, and the outer end surface RS connects the upper surface US and the lower surface LS, and may also connect the inner surface IS and the outer surface OS. The thickness direction X can also be defined as the direction in which the mechanism module 10 approaches or moves away from the ear 200 when worn. At least a portion of the connecting surface, such as the outer end surface RS, is located within the concha 2002 when worn and forms a first contact area with the front of the ear 200 region. That is, the outer end surface RS may be located at one end facing the back of the head along the length direction Y when worn, and is at least partially located within the concha 2002. In some embodiments, the ear hook 20 forms a second contact area with the rear side of the ear 200 region when worn. The second contact area and the first contact area at least partially overlap in the ear thickness direction of the ear 200 region. Furthermore, the mechanism module 10 and the ear hook 20 can jointly clamp the ear 200 from both the front and rear sides, and the clamping force formed is mainly compressive stress, which is beneficial to improving the stability and comfort of the headphones 100 when worn. In some embodiments, when the mechanism module 10 is configured in a circular, elliptical, or other shape, the connecting surface may also refer to the arcuate side of the mechanism module 10.

[0026] It should be noted that the terms "first," "second," "third," etc., used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined by terms such as "first," "second," "third," etc., may explicitly or implicitly include at least one of those features. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] It is understood that the movement module 10 can also be worn directly or through other means, and can even be connected and cooperated with other structures in conjunction with the ear hook 20 to achieve wearing. Therefore, the functionality of the movement module 10 is not limited to the embodiments listed in this application. In some embodiments, the ear hook 20 can be omitted or replaced with other structures.

[0028] Furthermore, when the wearing method of the mechanism module 10 changes, the way the mechanism module 10 interacts with the ear 200 may also change. However, in some embodiments, this does not necessarily alter the internal structure, overall construction, or external structure of the mechanism module 10. Even in some embodiments, terms related to location, such as lower side LS, upper side US, and outer end face RS, may not necessarily correspond to the ear 200. Of course, in some embodiments, terms like connection end CE may simply be terms related to location and do not necessarily imply the inclusion of a specific function.

[0029] Furthermore, when the wearing method of the movement module 10 changes, the movement module 10 can be worn without cooperating with the ear hook 20 or other structures at the connection end CE.

[0030] Please see Figure 6 and Figure 7 , Figure 6 yes Figure 1 A cross-sectional view of the headphone 100 along line VI-VI in some embodiments. Figure 7 yes Figure 1 The middle earphone 100 is shown in a cross-sectional view along line VII-VII in some embodiments. The mechanism module 10 may include a mechanism housing 11, a speaker assembly 12, and a main control circuit board 13. The mechanism housing 11 can be connected to the ear hook 20. The mechanism housing 11 may have a mounting space 101 for mounting the speaker assembly 12 and the main control circuit board 13, and may also be used to mount other electronic components, which will not be elaborated here. The speaker assembly 12 and the main control circuit board 13 may be disposed within the mechanism housing 11, for example, the mounting space 101. The main control circuit board 13 can be electrically connected to the speaker assembly 12 for controlling the operation of the speaker assembly 12. It is understood that the mechanism housing 11 serves as the outer housing of the mechanism module 10, and thus the aforementioned inner surface IS, outer surface OS, and connecting surfaces (e.g., lower surface LS, upper surface US, and rear surface RS, etc.) of the mechanism module 10 are all formed on the mechanism housing 11, serving as the outer surface of the mechanism housing 11.

[0031] The movement housing 11 may include a first housing 111 and a second housing 112 that are snapped together along the thickness direction X to form a mounting space 101. In the wearing state, the first housing 111 is closer to the ear 200 than the second housing 112. A parting surface 102 is provided between the first housing 111 and the second housing 112 to simplify the structure of the movement housing 11 and reduce manufacturing costs. Of course, the movement housing 11 may also have other structural forms and is not limited to the embodiments listed in this application.

[0032] In some embodiments, the housing 11 may be provided with a first sound outlet 1101 and a second sound outlet 1102 communicating with the mounting space 101. The first sound outlet 1101 and the second sound outlet 1102 may respectively cooperate with the speaker assembly 12, so that the sound waves generated by the speaker assembly 12 can propagate through the first sound outlet 1101 and the second sound outlet 1102 respectively. The first sound outlet 1101 and the second sound outlet 1102 may not be connected. Providing two sound outlets can improve the listening experience of the speaker assembly 12 and avoid sound wave interference between multiple speakers.

[0033] Please see Figure 8 , Figure 8 yes Figure 6 The diagram shows the structure of the first housing 111 in some embodiments. In some embodiments, the first sound outlet 1101 and / or the second sound outlet 1102 may be disposed on the first housing 111. For example, the first sound outlet 1101 and the second sound outlet 1102 may both be disposed on the bottom wall 1111 of the first housing 111. In some embodiments, the bottom wall 1111 may correspond to the inner surface IS of the mechanism module 10. When the mechanism module 10 is inserted into the concha 2002, since the concha 2002 has a certain volume and depth, after the free end FE is inserted into the concha 2002, the portion of the inner surface IS corresponding to the bottom wall 1111 of the mechanism housing 11 may have a certain distance from the concha 2002. Furthermore, when worn, the housing 11 can cooperate with the concha 2002 to form an auxiliary cavity communicating with the external auditory canal 2001. The first sound outlet 1101 and the second sound outlet 1102 will at least partially face and communicate with the auxiliary cavity. Furthermore, when worn, the sound waves generated by the speaker assembly 12 and propagating through the first sound outlet 1101 and the second sound outlet 1102 will be limited by the auxiliary cavity. That is, the auxiliary cavity can concentrate the sound waves, allowing more sound waves to propagate into the external auditory canal 2001, thereby improving the volume and sound quality of the sound heard by the user in the near field. This is beneficial for improving the acoustic effect of the headphones 100.

[0034] In some embodiments, the first sound outlet 1101 and the second sound outlet 1102 are both closer to the free end FE than to the connecting end CE, so that the first sound outlet 1101 and the second sound outlet 1102 are closer to the external auditory canal 2001 when worn. In some embodiments, the mechanism module 10 can be configured not to block the external auditory canal 2001 when worn, and the auxiliary cavity can be semi-open.

[0035] Please see Figure 7 and Figure 8The first housing 111 can be made of plastic, or it can be a structure composed of or composite of multiple materials, or it can be a housing structure made of other materials. The first housing 111 may include a first sidewall 1112 extending from the edge of the bottom wall 1111 towards the side near the second housing 112. In some embodiments, a pressure relief hole 1104 and / or a tuning hole 1105 may be provided on the first sidewall 1112, that is, a pressure relief hole 1104 and / or a tuning hole 1105 may be provided on the upper side US or lower side LS corresponding to the movement housing 11. Further, a sound-absorbing mesh and / or a protective steel mesh may be provided at the pressure relief hole 1104 and / or the tuning hole 1105.

[0036] Understandably, the positions of acoustic holes such as the pressure relief hole 1104 and the tuning hole 1105 can be adjusted on the movement housing 11, such as the first housing 111, according to the needs of those skilled in the art. For example, the pressure relief hole 1104 and the tuning hole 1105 can be respectively located on opposite sides of the first sidewall 1112 along the width direction Z.

[0037] Furthermore, since the first sound outlet 1101, the pressure relief hole 1104, and the tuning hole 1105 can all be located on the first housing 111, the structure of the first housing 111 is simplified, which helps to reduce processing costs. In addition, since the pressure relief hole 1104 and the tuning hole 1105 are respectively located on opposite sides of the first sidewall 1112 along the width direction Z, the parting surface 102 can be approximately symmetrically arranged about a reference plane perpendicular to the width direction Z, which helps to improve the appearance quality of the movement module 10.

[0038] Furthermore, the acoustic apertures are not limited to the pressure relief aperture 1104 and the tuning aperture 1105, but may also include other acoustic apertures that mate with the speaker assembly 12. In some embodiments, at least one of the pressure relief aperture 1104 and the tuning aperture 1105 may be omitted.

[0039] Please see Figure 9 , Figure 9 yes Figure 8 A schematic diagram of the first housing 111 from another perspective. The first sound outlet 1101 and the second sound outlet 1102 are arranged adjacent to each other. The reasonable layout of the sound outlet positions ensures that the volume of the sound output from the first sound outlet 1101 and the second sound outlet 1102 is balanced when the device is worn, thereby improving the user's listening experience. In some embodiments, the first sound outlet 1101 can be arranged around the second sound outlet 1102 in a circumferential manner to further enhance the acoustic magnetism of the speaker assembly 12. Of course, compared to a linear arrangement of the first sound outlet 1101, the circumferential arrangement of the first sound outlet 1101 is more conducive to having sufficient opening area of ​​the sound outlet within the limited space on the first housing 111, thereby ensuring consistent listening for different people.

[0040] In some embodiments, a protrusion 1113 extending in the thickness direction X may be provided on the inner surface IS (e.g., the bottom wall 1111 corresponding to the inner surface IS) of the housing 11. A second sound outlet 1102 may be provided on the protrusion 1113, and a portion of the speaker assembly 12 may be accommodated inside the protrusion 1113. This allows the portion of the speaker assembly 12 accommodated in the protrusion 1113 to be closer to the user's ear canal during wear. The sound waves generated by the speaker assembly 12 and propagated through the second sound outlet 1102 are transmitted to the external auditory canal 2001 with a shorter sound path, reducing sound wave loss and increasing the sound pressure level within the external auditory canal 2001. Alternatively, in some embodiments, a first sound outlet 1101 may also be provided on the protrusion 1113. The first sound outlet 1101 can be closer to or directly opposite the concha 2002 through the protrusion 1113, allowing the sound output from the first sound outlet 1101 to be amplified by reflection from physiological sites such as the concha 2002. In some embodiments, the first sound outlet 1101 may be arranged around the periphery of the protrusion 1113, making the structure of the mechanism housing 11 more compact. At the same time, when worn, the sound path difference between the sound transmitted through the first sound outlet 1101 and the second sound outlet 1102 reaching the user's ear canal 2001 is small, ensuring the consistency of listening.

[0041] In some embodiments, the protrusion 1113 extends in a direction away from the inner surface IS of the movement housing 11 (e.g., the bottom wall 1111 corresponding to the inner surface IS) compared to other areas on the inner surface IS. In other embodiments, the protrusion 1113 may also be provided on the lower surface or other connecting surfaces of the aforementioned movement housing 11 to adapt to different wearing scenarios.

[0042] In some embodiments, the cross-sectional area of ​​the protrusion 1113 perpendicular to the thickness direction X may gradually decrease in the direction away from the movement housing 11.

[0043] Please see Figure 9 The first sound outlet 1101 may include a first aperture segment 1114 and a second aperture segment 1115. In some embodiments, the first aperture segment 1114 and the second aperture segment 1115 may be disposed on the inner surface IS. See also... Figure 9The first aperture segment 1114 is located on the side of the second sound outlet 1102 near the lower side LS, and the second aperture segment 1115 is located on the side of the second sound outlet 1102 near the outer end face RS. This arrangement allows the first sound outlet 1101 to be closer to the user's external auditory canal 2001 when the device is in the wearing state (e.g., when the free end FE of the mechanism module 10 extends into the concha 2002), so that more sound output from the mechanism module 10 can be transmitted into the user's external auditory canal 2001, ensuring sufficient listening volume. Alternatively, the first aperture segment 1114 can be located on the side of the second sound outlet 1102 near the lower side LS, and the second aperture segment 1115 can be located on the side of the second sound outlet 1102 away from the outer end face RS. This arrangement prevents the opening of the second aperture segment 1115 from affecting the user's wearing experience.

[0044] In some embodiments, the first hole segment 1114 may also be disposed at the corner where the inner surface IS connects to the lower surface LS, and the second hole segment 1115 may be disposed at the corner where the inner surface IS connects to the outer end face RS. In the wearing state (e.g., the mechanism module 10 rests against the antihelix 2005), the first sound outlet 1101 can point towards the user's external auditory canal 2001, improving sound directivity and increasing listening volume. In other embodiments, the first hole segment 1114 may be disposed on the inner surface IS, and the second hole segment may be disposed at the corner where the inner surface IS connects to the outer end face RS. In some embodiments, the first hole segment 1114 may be disposed on the connecting surface between the inner surface IS and the lower surface LS (e.g., at the corner where the inner surface IS connects to the lower surface LS). In some embodiments, the second hole segment 1115 may be disposed on the connecting surface between the inner surface IS and the outer end face RS (e.g., at the corner where the inner surface IS connects to the outer end face RS).

[0045] In some embodiments, the first hole segment 1114 extends along the length direction Y from the connection point with the second hole segment 1115, and its width in the width direction Z is 1mm-2.5mm. The second hole segment 1115 extends along the width direction Z from the connection point with the first hole segment 1114, and its width in the length direction Y is 1mm-2.5mm. In some embodiments, the first hole segment 1114 extends along the length direction Y from the connection point with the second hole segment 1115, and its width in the width direction Z gradually decreases. At the same time, the second hole segment 1115 extends along the width direction Z from the connection point with the first hole segment 1114, and its width in the length direction Y gradually increases. This arrangement can prevent the first hole segment 1114, which is closer to the lower side LS or the upper side US, from interfering with other acoustic holes opened on the lower side LS or the upper side US, ensuring the air permeability of the first sound outlet 1101 and avoiding affecting the user's listening experience.

[0046] In some embodiments, the pressure relief hole 1104 may be disposed on the upper side US, or it may be disposed on the lower side LS. In addition, when the pressure relief hole 1104 is engaged with the first sound outlet hole 1101, it is beneficial to reduce the mutual influence between the pressure relief hole 1104 and the first sound outlet hole 1101, such as the first hole segment 1114 and the second hole segment 1115.

[0047] In some embodiments, the first sound outlet 1101 may further include a third outlet segment 1116. See also... Figure 10 and Figure 11 , Figure 10 yes Figure 9 A schematic diagram of the arrangement of the first sound outlet 1101 and the second sound outlet 1102 in some other embodiments. Figure 11 yes Figure 10 The diagram illustrates the arrangement of the first sound outlet 1101 and the second sound outlet 1102 in some other embodiments. The third hole segment 1116 can be connected to the end of the second hole segment 1115 away from the first hole segment 1114, and is located on the side of the second sound outlet 1102 opposite to the first hole segment 1114. In some embodiments, the third hole segment 1116 can be disposed on the inner surface IS, located on the side of the second sound outlet 1102 near the upper surface US. In this case, the first hole segment 1114 is located on the side of the second sound outlet 1102 near the lower surface LS. That is, the third hole segment 1116 communicates with the second hole segment 1115, and is located on opposite sides of the second sound outlet 1102, such that the second hole segment 1115 connects the first hole segment 1114 and the third hole segment 1116 to form a single unit. In some embodiments, the third hole segment 1116 can be disposed at the corner where the inner surface IS connects to the upper surface US. In some embodiments, the third hole segment 1116 may be disposed on the connecting surface between the inner side IS and the upper side US (e.g., at the corner where the inner side IS connects to the upper side US).

[0048] In some embodiments, the arrangement of the third hole segment 1116 can make the first sound outlet hole 1101 symmetrical along the length direction Y axis and have a symmetry plane PS arranged along the length direction Y, so that the first sound outlet hole 1101 has a "U-shaped" structure with the opening facing away from the outer end face RS.

[0049] In some embodiments, the third hole segment 1116 is disposed on the side of the second sound outlet 1102 away from the outer end face RS, and the third hole segment 1116 is connected to the end of the first hole segment 1114 away from the second hole segment 1115. In this case, the first sound outlet 1101 has a "U-shaped" structure with its opening facing the upper side US. In some other embodiments, the first hole segment 1114 is located on the side of the second sound outlet 1102 close to the upper side US, and the third hole segment 1116 is disposed on the side of the second sound outlet 1102 away from the outer end face RS. The third hole segment 1116 is connected to the end of the first hole segment 1114 away from the second hole segment 1115. In this case, the first sound outlet 1101 has a "U-shaped" structure with its opening facing the lower side LS.

[0050] Please see Figure 9 , Figure 10 and Figure 11 Along the length direction Y, the distance from the reference point a furthest from the free end FE on the upper edge of the first sound outlet 1101 to the outer end face RS is not less than 9 mm. It should be understood that when the outer end face RS is an arc surface, the distance from the reference point a furthest from the connecting end CE along the length direction Y on the outer end face RS, perpendicular to the length direction Y, to the tangent surface is not less than 9 mm. In some embodiments, along the length direction Y, the distance from the reference point a furthest from the free end FE on the upper edge of the first sound outlet 1101 to the outer end face RS is within 10 mm-20 mm. This configuration optimizes the layout of the first sound outlet 1101 on the mechanism housing 11, ensuring the air permeability of the first sound outlet 1101.

[0051] In some embodiments, along the width direction Z, the distance between the reference point b closest to the upper side US on the edge of the first sound outlet 1101 and the upper side US may be no less than 1.5 mm. It should be understood that when the upper side US is an arc surface, the distance from the reference point b to the tangent perpendicular to the width direction Z at the point connecting the lower side LS along the width direction Z is no less than 1.5 mm. In some embodiments, along the width direction Z, the distance between the reference point b closest to the upper side US on the edge of the first sound outlet 1101 and the upper side US is between 2 mm and 8 mm. This configuration optimizes the layout of the first sound outlet 1101 on the movement housing 11, preventing interference between the sound waves emitted by the first sound outlet 1101 and the sound waves emitted by other acoustic holes on the upper side US, thus ensuring a good listening experience for the user.

[0052] Please see Figure 10 and Figure 11The first sound outlet 1101 and the second sound outlet 1102 can be approximately arranged on a plane perpendicular to the thickness direction X. In some embodiments, the shortest distance L between the orthographic projection edge of the first sound outlet 1101 and the orthographic projection edge of the second sound outlet 1102 on the plane perpendicular to the thickness direction X can constrain the relative positional relationship between the first sound outlet 1101 and the second sound outlet 1102. In some embodiments, the shortest distance L between the orthographic projection edge of the first sound outlet 1101 and the orthographic projection edge of the second sound outlet 1102 is not less than 2mm, thereby avoiding sound wave interference caused by the sound waves propagating from the first sound outlet 1101 and the second sound outlet 1102, which would affect the user's listening experience. In some embodiments, the shortest distance L between the orthographic projection edge of the first sound outlet 1101 and the orthographic projection edge of the second sound outlet 1102 is in the range of 2mm-5mm, ensuring sufficient ventilation area for the first sound outlet 1101 while avoiding sound wave interference.

[0053] Please see Figure 12 , Figure 12 yes Figure 1 The middle earphone 100 is shown in a cross-sectional view along line VII-VII in some embodiments. The second sound outlet 1102 may have a central axis AE, and the direction of the central axis AE away from the side of the housing 11 may be positive. In some embodiments, the extending direction of the second sound outlet 1102 may be the central axis AE. In some embodiments, the centroid of the opening surface on the inner side IS of the second sound outlet 1102 and the centroid of the opening surface on the inner surface within the mounting space 101 of the housing 11 may also be referred to as the central axis AE. In some embodiments, the central axis AE of the second sound outlet 1102 may be perpendicular to the side surface (e.g., the inner side IS) of the housing 11 where the second sound outlet is located. In some embodiments, the positive direction of the central axis AE of the second sound outlet 1102 is set to form an angle of less than 90° with the side surface (e.g., the inner side IS) of the housing 11 where the second sound outlet is located, so as to allow the second sound outlet 1102 to be more biased towards the ear canal 2001, thereby improving the user's listening experience. For example, when the second sound outlet is disposed on the inner side IS of the movement housing 11, the positive direction of the central axis AE of the second sound outlet 1102 can be inclined to the upper side US, the lower side LS, or the outer end face RS. In some embodiments, the angle between the positive direction of the central axis AE of the second sound outlet 1102 and the positive direction of the width direction Z is between 75° and 80°, and the positive direction of the width direction Z can be the direction from the upper side US to the lower side LS along the width direction Z.

[0054] In some embodiments, please refer to Figure 9 , Figure 10 and Figure 11The first sound outlet 1101 has a length Y dimension in the range of 6mm-8mm and a width Z dimension in the range of 5mm-7mm. This setting can ensure that the first sound outlet 1101 has sufficient ventilation area and that the resonant frequency of the speaker cavity coupled with the first sound outlet 1101 is within the ideal range.

[0055] Please see Figure 6 , Figure 7 and Figure 8 A recessed area 1103 is formed on the inner wall of the housing 11 to cooperate with the speaker assembly 12, thereby improving the space utilization of the housing 11, for example, the mounting space 101, and also facilitating the positioning of the speaker assembly 12. In some embodiments, the recessed area 1103 may be disposed around the second sound outlet 1102, such that the space within the recessed area 1103 communicates with the second sound outlet 1102. In some embodiments, the recessed area 1103 may be correspondingly disposed with the protrusion 1113, that is, the protrusion 1113 has a recessed area 1103 on the side of the housing 11 facing the interior of the mounting space 101, in which case the speaker assembly 12 may be at least partially disposed within the recessed area 1103.

[0056] Please see Figure 6 The second housing 112 can be a plastic part, or a structure composed of or composite of multiple materials, or a housing structure made of other materials. The parting surface 102 between the second housing 112 and the first housing 111, for example, the first sidewall 1112, extends or bends towards the side where the first housing 111 is located in a direction near the free end FE. The second housing 112 may include a top wall 1121 disposed opposite to the first housing 111, for example, the bottom wall 1111, and a second sidewall 1122 connected to the top wall 1121 and engaging with the first housing 111, for example, the first sidewall 1112.

[0057] Understandably, due to the configuration of the second sidewall 1122, the free end FE is tapered in the direction away from the connecting end CE, which makes it easier to fit the user's ear contour and improve the wearing experience.

[0058] Please see Figure 6 , Figure 7 and Figure 13 , Figure 13 for Figure 6A schematic diagram of the loudspeaker assembly 12 is shown. The loudspeaker assembly 12 converts received electrical signals into sound signals (sound waves), which are then propagated through a first sound outlet 1101 and / or a second sound outlet 1102 to be transmitted into the external auditory canal 2001. The loudspeaker assembly 12 can be coupled to a main control circuit board 13 to allow operation under the control of the main control circuit board 13. The loudspeaker assembly 12 may include a first loudspeaker 121 and a second loudspeaker 122 disposed within the housing 11, for example, the mounting space 101. The first loudspeaker 121 and the second loudspeaker 122 can be coupled to the main control circuit board 13 respectively to allow operation under the control of the main control circuit board 13. The sound waves generated by the first loudspeaker 121 propagate through the first sound outlet 1101. The sound waves generated by the second loudspeaker 122 propagate through the second sound outlet 1102. In some embodiments, the sound waves generated by the first speaker 121 and the second speaker 122 may also propagate through other acoustic holes (such as the pressure relief hole 1104 and the tuning hole 1105) provided on the housing 11.

[0059] In some embodiments, the sound waves generated by the first speaker 121 can propagate through the first sound outlet 1101 (e.g., the first outlet segment 1114 and the second outlet segment 1115), and the sound waves generated by the second speaker 122 can propagate through the second sound outlet 1102. Of course, the sound waves generated by the first speaker 121 can also propagate through the third outlet segment 1116.

[0060] The frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122. In some embodiments, the frequency range of the sound output by the first speaker 121 may be entirely smaller than the frequency range of the sound output by the second speaker 122. In other embodiments, the frequency ranges of the sound output by the first speaker 121 and the second speaker 122 partially overlap, and the maximum frequency of the sound output by the first speaker is lower than the maximum frequency of the sound output by the second speaker, such that the frequency band of the sound output by the second speaker 122 may be partially larger than the frequency band of the sound output by the first speaker 121.

[0061] In some embodiments, the frequency range of the sound output by the first speaker 121 may include 20Hz-5kHz, and the frequency range of the sound output by the second speaker 122 may include 5kHz-20kHz. In some embodiments, the frequency range of the sound output by the first speaker 121 and the frequency range of the sound output by the second speaker 122 may have different standards based on actual conditions. For example, the frequency range of the sound output by the first speaker 121 may also refer to a frequency range not higher than 1kHz, such as 1Hz-1kHz, 100Hz-800Hz, etc.

[0062] In some embodiments, the frequency range of the sound output by the first speaker 121 may be referred to as the low-frequency band or the mid-low-frequency band, and the frequency range of the sound output by the second speaker 122 may be referred to as the high-frequency band or the mid-high-frequency band. Furthermore, the first speaker 121 may be referred to as a low-frequency speaker, and the second speaker 122 may be referred to as a high-frequency speaker. The low-frequency band may be at least a portion of a frequency band generally from 20Hz to 500Hz, or at least a portion of a frequency band generally from 20Hz to 3kHz. The high-frequency band may be at least a portion of a frequency band generally from 5kHz to 20kHz, or at least a portion of a frequency band from 6kHz to 16kHz. The mid-frequency band may lie between the low-frequency band and the high-frequency band, and may also partially overlap with the low-frequency and / or high-frequency portions. Furthermore, the mid-low-frequency band may be a combination of the low-frequency band and the mid-frequency band, and the mid-high-frequency band may be a combination of the mid-frequency band and the high-frequency band.

[0063] It is understandable that the frequency band distinctions mentioned above are merely examples to provide a general range. The definitions of these frequency bands can vary depending on different industries, application scenarios, and classification standards. For instance, in some application scenarios, low frequency refers to the band roughly between 20Hz and 80Hz, mid-low frequency can refer to the band roughly between 80Hz and 160Hz, mid frequency can refer to the band roughly between 160Hz and 1280Hz, mid-high frequency can refer to the band roughly between 1280Hz and 2560Hz, and high frequency can refer to the band roughly between 2560Hz and 120kHz.

[0064] Please see Figure 6 and Figure 7 The first speaker 121 can be fixed inside the housing 11, and the axial direction of the first speaker 121 can be arranged along the thickness direction X. In some embodiments, the first speaker 121 can be fixed to the first housing 111, for example, the bottom wall 1111, or it can be fixed to the first side wall 1112 or other parts of the housing 11. In some embodiments, the axial direction of the first speaker 121 can be the vibration direction of the first diaphragm 1211.

[0065] In some embodiments, the first speaker 121 is arranged in a strip-shaped structure to match the housing 11, such as the mounting space 101. That is, the first speaker 121 can be extended in the direction from the connecting end CE to the free end FE, so as to facilitate the placement of a sufficiently large first speaker 121 in the housing 11, such as the mounting space 101, thereby enhancing the sound volume generated by the headphones 100, that is, optimizing the arrangement and improving space utilization.

[0066] Please see Figure 7The first loudspeaker 121 may include a first diaphragm 1211 for vibrating to produce sound, and may also include a first magnetic circuit system 1212 for driving the first diaphragm 1211 to vibrate and produce sound, as well as a support member for supporting the first diaphragm 1211 and the first magnetic circuit system 1212. To the extent understood by those skilled in the art, the technical principle of the first magnetic circuit system 1212 driving the first diaphragm 1211 to vibrate and produce sound through the cooperation of a first coil and a magnet will not be described in detail.

[0067] The first loudspeaker 121 is located within the housing 11 (e.g., within the mounting space 101) and cooperates with the housing 11. A first front cavity 1201 is formed on the front side of the first diaphragm 1211 of the first loudspeaker 121, and a first rear cavity 1202 is formed on the rear side of the first diaphragm 1211. The front side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 facing away from the first magnetic circuit system 1212, and the rear side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 facing the first magnetic circuit system 1212. In some embodiments, the first front cavity 1201 is located on the side of the first loudspeaker 121 facing the inner surface IS of the housing 11, for example, the side facing the bottom wall 1111 of the first housing 111, and the first rear cavity 1202 is located on the side of the first loudspeaker 121 facing away from the inner surface IS, for example, the side facing away from the bottom wall 1111 of the first housing 111. In some embodiments, the first front cavity 1201 may be connected to the first sound outlet 1101, so that the sound waves generated by the first speaker 121 in cooperation with the first front cavity 1201 can propagate through the first sound outlet 1101. The first rear cavity 1202 may be coupled to other acoustic holes (such as pressure relief hole 1104 and tuning hole 1105) provided on the housing 11, so that the sound waves generated by the first speaker 121 in cooperation with the first rear cavity 1202 can propagate through the other acoustic holes.

[0068] The second speaker 122 is located inside the housing 11. Please refer to [link / reference]. Figure 6 and Figure 7 The second speaker 122 can be fixed to the first housing 111, such as the bottom wall 1111, in which case the axial direction of the second speaker 122 can be along the thickness direction X. In some embodiments, the second speaker 122 can be located within the first front cavity 1201 of the first speaker 121, in which case the axial direction of the first speaker 121 and the axial direction of the second speaker 122 are parallel. In other embodiments, the second speaker 122 can also be fixed to the first side wall 1112 or other parts of the housing 11, or it can be located outside the first front cavity 1201 based on the setting requirements, and the axial direction of the second speaker 122 can also be arranged to intersect the thickness direction X.

[0069] In some embodiments, the second speaker 122 can be embedded in the inner wall of the housing 11. For example, a groove can be formed on the inner wall of the housing 11 to accommodate the second speaker 122, thereby achieving the embedded configuration of the second speaker 122. Please refer to [link to relevant documentation]. Figure 7 The recess (e.g., recessed area 1103) accommodating the second speaker 122 can be formed on the bottom wall 1111 of the first housing 111. In this case, when worn, the second speaker 122 is located on the inner wall of the inner side 11 of the aforementioned mechanism module 10, and the second speaker 122 is closer to the user's ear. Alternatively, the recess accommodating the second speaker 122 can be provided on the lower side of the aforementioned mechanism module 10 or on the inner wall of each connecting surface to adapt to different wearing scenarios and provide the user with a better listening experience.

[0070] Please see Figure 14 , Figure 14 The diagram below shows a circuit diagram of a speaker assembly 12 in some embodiments of this application. The speaker assembly 12 may have a first terminal 1301 and a second terminal 1302, which are electrically connected to the main control circuit board 13. A first speaker 121 may be connected in series between the first terminal 1301 and the second terminal 1302, thereby emitting sound under the control of the main control circuit board 13. A second speaker 122 may be connected in series between the first terminal 1301 and the second terminal 1302, thereby emitting sound under the control of the main control circuit board 13.

[0071] As described above, the first front cavity 1201 and the first rear cavity 1202 of the first speaker 121 are coupled to the first sound outlet 1101 and other acoustic holes (such as the pressure relief hole 1104) on the housing 11, respectively. Since the first front cavity 1201 and the first rear cavity 1202 are located on both sides of the first diaphragm 1211, the sound waves output by them are naturally out of phase. Therefore, the sound waves output by the first front cavity 1201 and the first rear cavity 1202 can cancel each other out of phase in the far field, thereby reducing the sound leakage of the headphone 100. However, when the frequency of the output sound is high, the wavelength of the high-frequency sound is shorter. Under far-field conditions, the first front cavity 1201 and the first rear cavity 1202 are equivalent to two sound sources, making the distance between the two sound sources non-negligible compared to the wavelength, resulting in the sound signals emitted by the two sound sources not being able to cancel each other out. In addition, when the acoustic transmission structure of the earphone 100 resonates, the phase of the sound signal actually radiated by the first front cavity 1201 and the first rear cavity 1202 has a certain phase difference with the original phase of the sound wave generation position, and adds an extra resonance peak in the transmitted sound wave, resulting in a chaotic sound field distribution and difficulty in ensuring the sound leakage reduction effect in the far field at high frequencies, and may even increase sound leakage.

[0072] Therefore, it is necessary to process the higher-frequency sound output by the first speaker 121 to avoid significant far-field sound leakage in the higher frequency range. Accordingly, some embodiments of this application can make the first speaker 121 output only the lower-frequency sound. In the lower frequency range, the phase of the sound waves generated by the first speaker 121 is basically unaffected by the cavity structure (e.g., the first front cavity 1201 and / or the first rear cavity 1202), and they can cancel each other out in the far field, reducing far-field sound leakage. At the same time, the second speaker 122 can be made to output only the higher-frequency sound. Utilizing the strong directivity of the higher-frequency sound, the higher-frequency sound can be mainly radiated in the direction of the external auditory canal 2001, thereby reducing sound leakage. This ensures that the headphone 100 achieves a sound leakage reduction effect across the entire frequency range.

[0073] In some embodiments, the first front cavity 1201 may have a first resonant frequency, and the first rear cavity 1202 may have a second resonant frequency.

[0074] For illustrative purposes only, the test method for the first resonant frequency can be as follows: a test instrument, such as a microphone, is brought close to and directly facing the earphone 100 (e.g., directly facing the first sound outlet 1101 coupled to the first front cavity 1201) according to measurement methods and standards known to those skilled in the art. The earphone 100 is excited by a signal generator, such as the main control circuit board 13, and the test is completed. The frequency response curve related to the first front cavity 1201 can be obtained by testing, and the first resonant frequency can be further obtained by analyzing the frequency response curve.

[0075] Alternatively, the test method for the second resonant frequency can be as follows: a test instrument, such as a microphone, is brought close to and directly facing the earphone 100 according to measurement methods and standards known to those skilled in the art (e.g., directly facing the acoustic hole, such as the pressure relief hole 1104, coupled to the first rear cavity 1202), and the earphone 100 is excited by a signal generator, such as the main control circuit board 13, to complete the test. The frequency response curve related to the first rear cavity 1202 can be obtained, and the second resonant frequency can be further obtained by analysis from the frequency response curve.

[0076] Understandably, the distance between the test instrument, such as the microphone, and the earphone 100 (e.g., the acoustic port, such as the first sound outlet port 1101, the pressure relief port 1104) should be determined in accordance with the measurement methods and standards known to those skilled in the art. Of course, this distance can also be limited to less than a preset distance threshold (e.g., 5 cm).

[0077] The first front cavity 1201 and the first sound outlet 1101 can be approximated as a Helmholtz resonant cavity model, with the first front cavity 1201 being the body of the model and the first sound outlet 1101 being the neck. In this case, the resonant frequency of the Helmholtz resonant cavity model is the first resonant frequency of the first front cavity 1201. In the Helmholtz resonant cavity model, the volume of the first front cavity 1201 can affect its first resonant frequency. f The specific relationships are as follows: (1) In equation (1), c The speed of sound in air. S The sound output area (also called cross-sectional area) of the neck (e.g., the first sound outlet 1101). V The volume of the cavity (e.g., the first front cavity 1201), L The depth of the neck (e.g., the first sound outlet 1101).

[0078] As can be seen from equation (1), the sound output area of ​​the first sound outlet 1101 can be changed. S Or the volume of the first anterior cavity 1201 V To achieve the first resonant frequency f The adjustment, for example, when the volume of the first front cavity 1201 increases while other conditions remain unchanged, the first resonant frequency... f Shifting to lower frequencies. Similarly, the first rear cavity 1202 and its coupled acoustic aperture can also be approximated as a Helmholtz resonant cavity model, and the second resonant frequency can be adjusted. Further details will not be elaborated here.

[0079] In some embodiments, the second resonant frequency may be lower than the first resonant frequency, and the difference between the first and second resonant frequencies may not exceed 1000Hz. This configuration allows the sound transmitted from the first front cavity 1201 and the first rear cavity 1202 to cancel each other out better in the far field, reducing sound leakage from the headphones and enhancing the user's privacy experience. For example, the range of the first resonant frequency is 4.5kHz-5.5kHz, and the range of the second resonant frequency is 4kHz-5kHz.

[0080] In some embodiments, the first resonant peak of the first front cavity 1201 can be adjusted by changing its volume. In other words, the first resonant peak of the first front cavity 1201 can be shifted to a lower frequency band by increasing its volume. This is because the sound pressure level of the cavity decreases rapidly in the frequency band after the resonant frequency. Therefore, the first resonant frequency of the first front cavity 1201 shifts to a lower frequency band, thereby attenuating the high-frequency sound waves generated by the first speaker 121. This allows the first speaker 121 to output only lower frequency sounds, while the higher frequency sound waves are played by the second speaker 122 as much as possible. With this configuration, ideal sound leakage reduction can be achieved in the headphones across the entire frequency range.

[0081] In some embodiments, the volume of the first front cavity 1201 can be adjusted to 270 mm. 3 -400mm 3 Within the specified range. By limiting the volume of the first front cavity 1201, the first resonant frequency of the first front cavity 1201 is shifted to a lower frequency band, thereby attenuating the high-frequency sound waves generated by the first speaker 121. In other words, low-pass filtering is achieved by adjusting the volume of the first front cavity 1201. In some embodiments, the volume of the first front cavity 1201 may be 290 mm². 3 -350mm 3 In some embodiments, the volume of the first front cavity 1201 may be 300 mm. 3 Or 310mm 3 Understandably, the design of the volume of the first front cavity 1201 is intended to attenuate the high-frequency sound waves generated by the first speaker 121. Furthermore, the volume of the first front cavity 1201 can be adjusted according to the needs of those skilled in the art.

[0082] Please see Figure 15 , Figure 15 This is a schematic diagram showing the relationship between the volume of the first front cavity 1201 and its resonant frequency in one embodiment of this application. The volume V1 is 270 mm². 3 The volume V2 is 310 mm² 3 The volume V3 is 350mm² 3 V1, V2, and V3 each correspond to a cavity frequency response curve. The volume of the first front cavity 1201 is 270 mm². 3 Increased to 350mm 3 During this process, it can be seen from the curves corresponding to volume V1, volume V2, and volume V3 that the first resonant frequency of the first front cavity 1201 decreases from 5.1kHz to 4.8kHz. This shows that as the volume of the first front cavity 1201 increases, its first resonant frequency shifts to lower frequencies.

[0083] It is understandable that, in order to shift the first resonant frequency of the first front cavity 1201 to a lower frequency band, the volume of the first front cavity 1201 is not limited to this; it can also be achieved through methods such as those described in the above embodiments. Figure 9 , Figure 10 and Figure 11 The design of the position and shape of the first sound outlet 1101 is used to shift the first resonant frequency to the lower frequency band.

[0084] In some embodiments, the second speaker 122 may have a third resonant frequency. In some embodiments, the third resonant frequency of the second speaker 122 may be no less than 5.5 kHz. Furthermore, when cooperating with the first speaker 121, the high-frequency sound waves generated by the first speaker 121 can be attenuated, and then effectively supplemented by the second speaker 122, without affecting the overall sound quality of the headphones 100. In some embodiments, the third resonant frequency of the second speaker 122 may be no less than 6 kHz. In some embodiments, the third resonant frequency of the second speaker 122 may be between 6 kHz and 10 kHz.

[0085] In some embodiments, the difference between the third resonant frequency and the first resonant frequency, and the difference between the third resonant frequency and the second resonant frequency, are each not less than 2000Hz. Therefore, when used in conjunction with the first speaker 121, the high-frequency sound waves generated by the first speaker 121 can be attenuated, and then effectively supplemented by the second speaker 122, without affecting the overall sound quality of the headphones 100. In some embodiments, the difference between the third resonant frequency and the first resonant frequency, and the difference between the third resonant frequency and the second resonant frequency, are each not less than 2500Hz.

[0086] Please see Figure 7 and Figure 16 , Figure 16 for Figure 7 The diagram shows the structure of the loudspeaker assembly 12 in some other embodiments. The second loudspeaker 122 may include a second diaphragm 1221 for vibrating to produce sound, a second magnetic circuit system 1222 for driving the second diaphragm 1221 to produce sound, and a loudspeaker housing for supporting and mounting the second diaphragm 1221 and the magnetic circuit system 1222. To the extent understood by those skilled in the art, the technical principle of the second magnetic circuit system 1222 driving the second diaphragm 1221 to vibrate and produce sound through the cooperation of a second coil and a magnet will not be elaborated further. The loudspeaker housing is a housing structure distinct from the mechanism housing 11, allowing for flexible mounting of the second loudspeaker 122 on the mechanism module 10. A portion of the loudspeaker housing may be integrally formed with the mechanism housing 11, while another portion includes a support frame to support the second loudspeaker 122, making the structure of the mechanism module 10 simpler.

[0087] The second speaker 122 is located within the housing 11 (e.g., mounting space 101) and mates with the housing 11. The front side of the second diaphragm 1221 of the second speaker 122 mates with the speaker housing to form a second front cavity 1203, and the rear side of the second diaphragm 1221 mates with the speaker housing to form a second rear cavity 1204. The front side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing away from the second magnetic circuit system 1222, and the rear side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing the second magnetic circuit system 1222. When the second speaker is located on the inner wall of the corresponding inner side IS of the housing module 10, the second front cavity 1203 is located on the side of the second speaker 122 facing the inner side IS, and the second rear cavity 1204 is located on the side of the second speaker 122 facing away from the inner side IS.

[0088] The second front cavity 1203 can communicate with the second sound outlet 1102, allowing sound waves generated by the second speaker 122 to propagate through the second sound outlet 1102. In some embodiments, the first front cavity 1201 and the second front cavity 1203 can communicate, thereby allowing both the first sound outlet 1101 and the second sound outlet 1102 to communicate with the first front cavity 1201 / second front cavity 1203. In other embodiments, the housing 11 may also include a structure such as an isolation plate disposed between the second speaker 122 and the first speaker 121 to isolate the cavity coupled to the first speaker 121 and the cavity coupled to the second speaker 122, such that the first sound outlet 1101 communicates only with the first front cavity 1201, and the second sound outlet 1102 communicates only with the second front cavity 1203.

[0089] In some embodiments, the second speaker 122 may be mounted inside the housing 11 closer to the free end FE. That is, the length of the second speaker 122 in the direction from the connecting end CE to the free end FE is smaller than the length of the first speaker 121 in the same direction. This arrangement allows the second speaker 122 to be closer to the free end FE when worn (e.g., when the free end FE is inserted into the concha 2002), so that the sound output from the second sound outlet 1102 can be better transmitted to the user's ear canal, increasing the listening volume.

[0090] In some embodiments, the second magnetic circuit system 1222 and the first magnetic circuit system 1212 are mutually exclusive to enhance the magnetic induction intensity at the first coil in the first speaker 121. This mutual exclusion can be understood as the second magnetic circuit system 1222 having a north pole (N) relative to the first magnetic circuit system 1212, and the first magnetic circuit system 1212 having a north pole (N) relative to the second magnetic circuit system 1222. This results in the second magnetic circuit system 1222 exerting a force on the first magnetic circuit system 1212 that causes the first magnetic circuit system 1212 to move away from the second magnetic circuit system 1222, and the first magnetic circuit system 1212 exerting a force on the second magnetic circuit system 1222 that causes the second magnetic circuit system 1222 to move away from the first magnetic circuit system 1212. Alternatively, the second magnetic circuit system 1222 having a south pole (S) relative to the first magnetic circuit system 1212, and the first magnetic circuit system 1212 having a south pole (S) relative to the second magnetic circuit system 1222. It is understandable that the second magnetic circuit system 1222 and the first magnetic circuit system 1212 are configured to be mutually exclusive, which can also increase the magnetic induction intensity at the second coil, which will not be elaborated here.

[0091] Furthermore, due to the increased magnetic induction intensity at the first coil / second coil, the driving force for the first coil to drive the first diaphragm 1211 and the second coil to drive the second diaphragm 1221 to vibrate is enhanced, thereby increasing the sound pressure level of the sound waves output by both the first speaker 121 and the second speaker 122. In some embodiments, the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212 can be set such that the sound pressure level of the second speaker 122 is increased by at least 1 dB compared to when the second speaker 122 operates alone (e.g., omitting the first speaker 121 in the above embodiments). In some embodiments, the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212 can be set such that the sound pressure level of the second speaker 122 is increased by at least 2 dB compared to when the second speaker 122 operates alone.

[0092] Similarly, in some embodiments, the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212 can be set such that the sound pressure level of the first speaker 121 is increased by at least 1 dB compared to when the first speaker 121 operates alone (e.g., omitting the second speaker 122 in the above embodiments). In some embodiments, the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212 can be set such that the sound pressure level of the first speaker 121 is increased by 2 dB compared to when the first speaker 121 exists alone.

[0093] The mutually exclusive cooperation between the second magnetic circuit system 1222 and the first magnetic circuit system 1212 can increase the sound pressure level of the first speaker 121 and / or the second speaker 122. Furthermore, by maintaining the sound pressure level of the headphone 100's output sound through this mutual exclusive cooperation, the relative distance between the second speaker 122 and the first speaker 121 can be brought closer, resulting in a smaller and lighter headphone 100 and improved user comfort. In some embodiments, the distance between the second speaker 122 and the first speaker 121 can be reduced to 2mm.

[0094] In some embodiments, the projection of the second magnetic circuit system 1222 along the vibration direction of the second diaphragm 1221 may at least partially overlap with the first magnetic circuit system 1212 to ensure the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212, thereby enhancing the magnetic induction intensity at the first coil / second coil. In some embodiments, the projection of the first magnetic circuit system 1212 along the vibration direction of the first diaphragm 1211 may at least partially overlap with the second magnetic circuit system 1222 to ensure the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212, thereby enhancing the magnetic induction intensity at the first coil and / or the second coil. It is understood that the magnetic induction intensity at the first coil refers to the average magnetic induction intensity of the entire first coil. In some other scenarios, the magnetic induction intensity at the first coil may also refer to the magnetic induction intensity at a specific endpoint or several specific endpoints of the first coil. The same applies to the magnetic induction intensity at the second coil, which will not be elaborated further here.

[0095] In some embodiments, please refer to Figure 16 The first magnetic circuit system 1212 may include a first magnet 1213 for driving a first diaphragm 1211 and a magnetically conductive cover 1214 surrounding the first magnet 1213. The side of the first diaphragm 1211 facing the first magnetic circuit system 1212 is acoustically coupled to other acoustic holes (e.g., pressure relief holes 1104) on the housing 11 to form a first rear cavity 1202. The side of the first diaphragm 1211 facing away from the first magnetic circuit system 1212 is acoustically coupled to a first sound outlet 1101 to form a first front cavity 1201. The second magnetic circuit system 1222 may include a second magnet 1223 for driving a second diaphragm 1221 to produce sound. The side of the second diaphragm 1221 facing the second magnetic circuit system 1222 is defined as a second rear cavity 1204. The side of the second diaphragm 1221 facing away from the second magnetic circuit system 1222 is acoustically coupled to a second sound outlet 1102 to form a second front cavity 1203.

[0096] The aforementioned first magnetic circuit system 1212 and second magnetic circuit system 1222 are mutually exclusive, which may refer to the magnetic poles of the second magnet 1223 and the first magnet 1213 being mutually exclusive. In some embodiments, please refer to... Figure 16 The magnetic pole of the second magnet 1223 facing the first magnet 1213 is the N pole, and the magnetic pole of the first magnet 1213 facing the second magnet 1223 is also the N pole. In this configuration, the magnetic poles of the first magnet 1213 and the second magnet 1223 are mutually repulsive. Similarly, the magnetic pole of the second magnet 1223 facing the first magnet 1213 is the S pole, and the magnetic pole of the first magnet 1213 facing the second magnet 1223 is also the S pole. In this configuration, the magnetic poles of the first magnet 1213 and the second magnet 1223 are also mutually repulsive.

[0097] In some embodiments, in a first reference plane perpendicular to the vibration direction of the second diaphragm 1221, the second magnet 1223 and the first magnet 1213 at least partially overlap. The degree of mutual repulsion can be adjusted by adjusting the overlapping portion of the second magnet 1223 and the first magnet 1213, thereby adjusting the sound pressure level and / or volume of the headphone 100.

[0098] In some embodiments, the second magnetic circuit system 1222 may include a third magnet 1224 that cooperates with the second magnet 1223 to drive the second diaphragm 1221 to produce sound. The second magnet 1223 and the third magnet 1224 cooperate to drive the second diaphragm 1221 to produce sound, thereby enhancing the acoustic performance of the second loudspeaker 122.

[0099] The third magnet 1224 may be disposed around the second magnet 1223 and located on the same side of the second diaphragm 1221 as the second magnet 1223. In some embodiments, along the vibration direction of the second diaphragm 1221, the magnetic poles of the third magnet 1224 facing the second diaphragm 1221 are opposite to the magnetic poles of the second magnet 1223 facing the second diaphragm 1221; that is, the magnetic poles of the second magnet 1223 and the third magnet 1224 are opposite to each other along the vibration direction of the second diaphragm 1221. For example, the magnetic pole of the third magnet 1224 facing the second diaphragm 1221 is the N pole, and the magnetic pole of the third magnet 1224 facing away from the second diaphragm 1221 is the S pole; the magnetic pole of the second magnet 1223 facing the second diaphragm 1221 is the S pole, and the magnetic pole of the second magnet 1223 facing away from the second diaphragm 1221 is the N pole. For example, the magnetic pole of the third magnet 1224 facing the second diaphragm 1221 is the S pole, and the magnetic pole of the third magnet 1224 facing away from the second diaphragm 1221 is the N pole. The magnetic pole of the second magnet 1223 facing the second diaphragm 1221 is the N pole, and the magnetic pole of the second magnet 1223 facing away from the second diaphragm 1221 is the S pole.

[0100] Please see Figure 17 and Figure 18 , Figure 17 This is a schematic diagram of the second magnet 1223, the third magnet 1224 and the first speaker 121 working together in some embodiments of this application. Figure 18 for Figure 17 A schematic diagram showing the effect of the ratio of the cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 to the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221 on the magnetic induction intensity at the first coil.

[0101] Figure 17 In (a), the cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 is smaller than that of the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221, accounting for about 10% of the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221. Figure 17 (b) The cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 is larger than that of the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221, approximately four times the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221. Figure 18 In the diagram, the ratio of the cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 to the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221 is used as the abscissa, and the magnetic induction intensity at the first coil is used as the ordinate. Within the first reference plane perpendicular to the vibration direction of the second diaphragm 1221, it can be seen that as the ratio of the cross-sectional area of ​​the second magnet 1223 to the cross-sectional area of ​​the third magnet 1224 gradually increases from 0.1 to 4, the magnetic induction intensity at the first coil also increases. Therefore, it can be concluded that as the ratio of the cross-sectional area of ​​the second magnet 1223 to the cross-sectional area of ​​the third magnet 1224 increases, the combined magnetic field of the second speaker 122 (e.g., the magnetic field obtained after coupling the magnetic field generated by the second magnet 1223 and the magnetic field generated by the third magnet 1224) continuously enhances the magnetic induction intensity at the first coil, thereby improving the sensitivity of the first speaker 121.

[0102] In some embodiments, to improve the sensitivity of the first speaker 121 while ensuring the acoustic output performance of the second speaker 122, the ratio of the cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 to the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221 may be between 0.5 and 4. In some embodiments, to improve the sensitivity of the first speaker 121 while ensuring the acoustic output performance of the second speaker 122, the ratio of the cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 to the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221 may be between 1 and 2.5. In some embodiments, to improve the sensitivity of the first speaker 121 while ensuring the acoustic output performance of the second speaker 122, the ratio of the cross-sectional area of ​​the second magnet 1223 perpendicular to the vibration direction of the second diaphragm 1221 to the cross-sectional area of ​​the third magnet 1224 perpendicular to the vibration direction of the second diaphragm 1221 may be between 2 and 3.

[0103] In some embodiments, within a first reference plane perpendicular to the vibration direction of the second diaphragm 1221, the overlap area of ​​the second magnet 1223 and the first magnetic circuit system 1212 (e.g., the first magnet 1213) is greater than the overlap area of ​​the third magnet 1224 and the first magnetic circuit system 1212 (e.g., the first magnet 1213). This ensures that the area of ​​the second magnet 1223 influencing the first magnetic circuit system 1212 (e.g., the first magnet 1213) enhances the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212. In some embodiments, within the first reference plane along the vibration direction of the second diaphragm 1221, the overlap area of ​​the second magnet 1223 and the first magnetic circuit system 1212 (e.g., the first magnet 1213) is not less than 90% of the area of ​​the second magnet 1223. In some embodiments, in a first reference plane perpendicular to the vibration direction of the second diaphragm 1221, the overlap area between the second magnet 1223 and the first magnetic circuit system 1212, such as the first magnet 1213, is 100% of the area of ​​the second magnet 1223.

[0104] Please see Figure 19 , Figure 19 for Figure 17 The diagram illustrates the structure of the second loudspeaker 122 in some other embodiments. The second magnetic circuit system 1222 may include a fourth magnet 1225 that cooperates with the second magnet 1223 to drive the second diaphragm 1221 to produce sound. The fourth magnet 1225 cooperates with the second magnet 1223 to drive the second diaphragm 1221 to produce sound, thereby enhancing the acoustic performance of the second loudspeaker 122. In some embodiments, the fourth magnet 1225 cooperates with the second magnet 1223 and a third magnet 1224 to drive the second diaphragm 1221 to produce sound, further enhancing the acoustic performance of the second loudspeaker 122.

[0105] The fourth magnet 1225 can be located on the side of the second diaphragm 1221 opposite to the second magnet 1223, that is, the fourth magnet 1225 and the second magnet 1223 are located on opposite sides of the second diaphragm 1221. In some embodiments, the magnetic pole of the side of the fourth magnet 1225 facing the second diaphragm 1221 is the same as the magnetic pole of the side of the second magnet 1223 facing the second diaphragm 1221. For example, the magnetic pole of the side of the fourth magnet 1225 facing the second diaphragm 1221 is the N pole, and the magnetic pole of the side of the second magnet 1223 facing the second diaphragm 1221 is the N pole. Another example is that the magnetic pole of the side of the fourth magnet 1225 facing the second diaphragm 1221 is the S pole, and the magnetic pole of the side of the second magnet 1223 facing the second diaphragm 1221 is the S pole. This arrangement can further increase the magnetic induction intensity at the second coil of the second speaker 122, thereby enhancing the output sound pressure level of the second speaker 122.

[0106] In some embodiments, the projection of the second speaker 122 along the vibration direction of the second diaphragm 1221 can fall entirely within the first speaker 121. In some embodiments, the projection of the second speaker 122 along the vibration direction of the first diaphragm 1211 can fall entirely within the first speaker 121. This arrangement ensures the mutual repulsion between the first magnetic circuit system 1212 and the second magnetic circuit system 1222, while making the internal space of the headphones more compact and improving space utilization.

[0107] Please see Figure 13 In a second reference plane perpendicular to the vibration direction of the first diaphragm 1211, the first magnetic circuit system 1212 has a major axis direction CZ and a minor axis direction DZ that are orthogonal to each other. The dimension of the first magnetic circuit system 1212 along the major axis direction CZ is larger than the dimension of the first magnetic circuit system 1212 along the minor axis direction DZ. In some embodiments, the major axis direction CZ may be the length direction Y of the mechanism housing 11, that is, the direction along the interval between the connecting end CE and the free end FE, and the minor axis direction DZ may be the width direction Z of the mechanism housing 11. In other embodiments, the major axis direction CZ may also intersect the length direction Y of the mechanism housing 11, and the minor axis direction DZ may also intersect the width direction Z of the mechanism housing 11.

[0108] In some embodiments, the second speaker 122 may be centrally located relative to the first speaker 121 along the minor axis direction DZ. In the second reference plane, the first speaker 121 has a center O1, and the second speaker 122 has a center O2. It is understood that centralization can be defined as the distance between centers O1 and O2 along the minor axis direction DZ not exceeding 10% of the dimension of the first speaker 121 along the minor axis direction DZ. In some embodiments, the distance between centers O1 and O2 along the minor axis direction DZ is 0.

[0109] Please see Figure 13The axial direction of the second speaker 122 can be parallel to the axial direction of the first speaker 121, that is, the angle between the axial direction of the second speaker 122 and the axial direction of the first speaker 121 can be 0°, and the relative postures of the first speaker 121 and the second speaker 122 are consistent. When the second speaker 122 moves relative to the first speaker 121 along the long axis CZ of the first speaker 121, as the overlap area between the second speaker 122 and the first speaker 121 in the axial direction increases, the mutual repulsion force between the second magnetic circuit system 1222 and the first magnetic circuit system 1212 gradually increases, thereby gradually increasing the sound pressure level of the sound radiated by the first speaker 121 and / or the second speaker 122.

[0110] Please see Figure 20 and Figure 21 , Figure 20 for Figure 13 The diagram shown illustrates the structure of the second loudspeaker 122 as it moves along its long axis CZ. Figure 21 for Figure 20 A schematic diagram illustrating the effect of the second loudspeaker 122 moving along its long axis CZ on the magnetic flux density at the first coil. Figure 21 The horizontal axis represents the distance the second speaker 122 moves along the major axis CZ, and the vertical axis represents the magnetic induction intensity at the first coil. The starting point of the movement of the second speaker 122 is the position where, along the axial direction of the first speaker 121, the projections of the second speaker 122 and the first speaker 121 are closest and have zero overlap. Figure 20 The dashed line indicates the location of the second speaker 122. The endpoint can be the point where the center O1 of the first speaker 121 and the center O2 of the second speaker 122 coincide, i.e. Figure 20 The solid line indicates the location of the center O1 on the left side of the second speaker 122. (See reference...) Figure 21 It can be seen that when the second speaker 122 moves relative to the first speaker 121 along the long axis CZ, the magnetic induction intensity at the first coil increases with the increase of the moving distance. Therefore, the relative positional relationship between the first speaker 121 and the second speaker 122 along the long axis CZ affects the magnetic induction intensity at the first coil of the first speaker 121. As the center O1 of the first speaker 121 and the center O2 of the second speaker 122 gradually approach each other along the long axis CZ, the overlap area between the second speaker 122 and the first speaker 121 in the axial direction increases, thereby gradually strengthening the repulsive force between the second magnetic circuit system 1222 and the first magnetic circuit system 1212, thus increasing the sensitivity of the first speaker 121.

[0111] In some embodiments, please refer to Figure 13 Along the major axis CZ, the distance between the center O1 of the first speaker 121 and the center O2 of the second speaker 122 does not exceed 5 mm. This arrangement ensures that the second speaker 122 enhances the magnetic induction intensity at the first coil of the first speaker 121, thereby increasing the output sound pressure level of the first speaker 121. In some embodiments, along the major axis CZ, the distance between the center O1 of the first speaker 121 and the center O2 of the second speaker 122 does not exceed 4.5 mm.

[0112] In some embodiments, please refer to Figure 13 In the long axis direction CZ, the ratio of the distance between the center O1 of the first speaker 121 and the center O2 of the second speaker 122 to the distance of the first speaker 121 along the long axis direction CZ does not exceed 0.3. In some embodiments, the ratio of the distance between the center O1 of the first speaker 121 and the center O2 of the second speaker 122 to the distance of the first speaker 121 along the long axis direction CZ does not exceed 0.25. This configuration ensures that the second speaker 122 enhances the magnetic induction intensity at the first coil of the first speaker 121, thereby increasing the output sound pressure level of the first speaker 121.

[0113] In some embodiments, the maximum distance from the center O2 of the second speaker 122 to the outer end face RS of the free end FE in the long axis direction CZ does not exceed 10 mm. This configuration allows the second speaker 122 to be closer to the free end FE of the housing 11 during wear (e.g., when the free end FE is inserted into the concha 2002), enabling better sound transmission from the second sound outlet 1102 to the user's ear canal and increasing the listening volume. In some embodiments, the maximum distance from the center O2 of the second speaker 122 to the outer end face RS of the free end FE in the long axis direction CZ does not exceed 8 mm. It is understood that when the free end FE is an arc surface, the point on the arc surface furthest from the connecting end CE along the length direction Y of the free end FE is located at a section perpendicular to the length direction Y, and the maximum distance from the center O2 to this section does not exceed 8 mm.

[0114] In some embodiments, along the major axis direction CZ, the first magnetic circuit system 1212 has a first reference point C1 closest to the free end FE. The second magnetic circuit system 1222 has a second reference point C2 closest to the free end FE. The second reference point C2 is located on the side of the first reference point C1 away from the free end FE. In some embodiments, the distance M between the first reference point C1 and the second reference point C2 is greater than or equal to 3 mm to ensure the mutual repulsion between the second magnetic circuit system 1222 and the first magnetic circuit system 1212, thereby improving the output sound pressure level of the first speaker 121 and the second speaker 122. In some embodiments, along the major axis direction CZ, the maximum distance from the center O2 of the second speaker 122 to the point of the first speaker 121 away from the second speaker 122 is less than or equal to 5 mm.

[0115] In some other embodiments described herein, the axial direction of the second speaker 122 can also be adjusted such that the angle between the axial direction of the second speaker 122 and the axial direction of the first speaker 121 is greater than 0° and less than 90°. For example, the angle between the axial direction of the second speaker 122 and the axial direction of the first speaker 121 can also be equal to 90°. It is understood that adjusting the axial direction of the second speaker 122 also adjusts the repulsive force between the second magnetic circuit system 1222 and the first magnetic circuit system 1212.

[0116] Please see Figure 6 and Figure 7 The main control circuit board 13 can be connected to the second housing 112, for example, fixed to a hot-melt column connected to the top wall 1121, and can partially overlap with the second side wall 1122 in the thickness direction X, so as to facilitate the placement of a sufficiently large first speaker 121 inside the core housing 11, thereby enhancing the sound volume generated by the headphones 100, i.e., optimizing the layout and improving space utilization. In some embodiments, the main control circuit board 13 may not overlap with the second side wall 1122 in the thickness direction X. In some embodiments, the thickness direction of the main control circuit board 13 may be the thickness direction X, or it may be arranged intersecting with the thickness direction X.

[0117] Since the main control circuit board 13 is located inside the mechanism housing 11, for example, the main control circuit board 13 is connected to the second housing 112, such as the top wall 1121, so that the main control circuit board 13 can be electrically connected to other electronic components or external devices through flexible metal parts such as pogo pins and metal springs.

[0118] In some embodiments, the main control circuit board 13 is located on the side of the first speaker 121 near the second housing 112. In some embodiments, the main control circuit board 13 may be stacked with the first speaker 121 in the thickness direction of the main control circuit board 13 or in the axial direction of the first speaker 121. In some embodiments, along the axial direction of the first speaker 121, the main control circuit board 13 may overlap with a portion of the first speaker 121 near the connection end CE to optimize the arrangement and improve space utilization.

[0119] Please see Figure 14 The main control circuit board 13 can be electrically connected to terminals such as the first terminal 1301 and the second terminal 1302, and other terminals to control the speaker assembly 12. In some embodiments, terminals such as the first terminal 1301 and the second terminal 1302, and other terminals can be located on the main control circuit board 13.

[0120] The main control circuit board 13 may be provided with a drive circuit 131 to control the speaker components 12, such as the first speaker 121 and the second speaker 122. Furthermore, the drive circuit 131 may mainly consist of a digital-to-analog converter circuit 1311, and may also include a power amplifier circuit, a processor, etc. Specifically, the drive circuit 131 can be formed using at least the digital-to-analog converter circuit 1311 and other circuits according to the prior art, which will not be elaborated further.

[0121] The drive circuit 131 can be electrically connected to terminals such as the first terminal 1301 and the second terminal 1302, and other terminals to achieve electrical connection with the speaker assembly 12, such as the first speaker 121 and the second speaker 122, so as to drive the speaker assembly 12, such as the first speaker 121 and the second speaker 122.

[0122] In some embodiments, the driving circuit 131 can simultaneously drive the first speaker 121 and the second speaker 122 through a digital-to-analog converter circuit 1311, thereby simplifying the circuit setup and reducing costs. That is, the driving circuit 131 can be configured to simultaneously drive the first speaker 121 and the second speaker 122 through the same digital-to-analog converter circuit 1311. Furthermore, when the first speaker 121 and the second speaker 122 cooperate, the high-frequency sound waves generated by the first speaker 121 can be attenuated by the first resonant frequency of the first front cavity 1201, and then effectively supplemented by the second speaker 122 without affecting the overall sound quality.

[0123] Understandably, the earphone 100 may also include electronic components such as batteries, sensors, and antennas to ensure the normal operation of the earphone 100. These electronic components can be set in the mechanism module 10 and / or ear hook 20 as needed, which will not be elaborated here.

[0124] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0125] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0126] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0127] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An earphone, characterized in that, The headphones include a first speaker and a second speaker. The frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker. The first speaker includes a first diaphragm, a first magnetic circuit system for driving the first diaphragm to produce sound, and a support for supporting the first diaphragm and the first magnetic circuit system. The second speaker includes a second diaphragm and a second magnetic circuit system for driving the second diaphragm to produce sound. The projection of the first magnetic circuit system along the vibration direction of the first diaphragm at least partially overlaps with the second magnetic circuit system. The second magnetic circuit system and the first magnetic circuit system are mutually exclusive.

2. The earphone according to claim 1, characterized in that, The earphone includes a core module and an ear hook connected to the core module. The core module is located on the front side of the ear when worn, and at least part of the ear hook is located on the back side of the ear when worn, so that the earphone is hung on the ear when worn. The first speaker and the second speaker are disposed in the mechanism module.

3. The earphone according to claim 2, characterized in that, The mechanism module is designed not to block the external ear canal when worn.

4. The headphones according to claim 2 or 3, characterized in that, The mechanism module also includes a mechanism housing and a main control circuit board. The mechanism housing is connected to the ear hook and has an installation space. The main control circuit board, the first speaker, and the second speaker are disposed in the installation space. The first speaker and the second speaker are respectively coupled to the main control circuit board to allow them to operate under the control of the main control circuit board.

5. The earphone according to claim 4, characterized in that, In a second reference plane perpendicular to the vibration direction of the first diaphragm, the first magnetic circuit system has a major axis direction and a minor axis direction that are orthogonal to each other, and the dimension of the first magnetic circuit system along the major axis direction is larger than the dimension of the first magnetic circuit system along the minor axis direction; The second speaker is centered relative to the first speaker along the short axis.

6. The earphone according to claim 5, characterized in that, In the long axis direction, the distance between the center of the first speaker and the center of the second speaker does not exceed 5 mm.

7. The earphone according to claim 6, characterized in that, The mechanism housing has a connecting end connected to the ear hook and a free end away from the ear hook. When worn, the mechanism housing is located on the front side of the ear. The free end extends into or covers the concha cavity. The long axis direction is arranged along the direction of the interval between the connecting end and the free end. The second speaker is arranged close to the free end.

8. The earphone according to claim 7, characterized in that, When worn, the free end extends into the concha cavity, and in the long axis direction, the maximum distance from the center of the second speaker to the outer end face of the free end does not exceed 10mm.

9. The earphone according to claim 7, characterized in that, The mechanism housing has an inner side facing the ear along the thickness direction when worn, an outer side away from the ear, and a connecting surface connecting the inner side and the outer side; A first sound outlet is provided on the inner side, and the sound waves generated by the first speaker are transmitted through the first sound outlet.

10. The earphone according to claim 9, characterized in that, The inner surface is provided with a protrusion extending in the thickness direction, and the first sound outlet is disposed on the protrusion.

11. The earphone according to claim 1, characterized in that, The mutual repulsion between the second magnetic circuit system and the first magnetic circuit system is set such that the sound pressure level of the first speaker and / or the second speaker is increased by at least 1 dB compared to the sound pressure level when the first speaker or the second speaker is operating alone.

12. The earphone according to claim 1, characterized in that, The first magnetic circuit system includes a first magnet and a magnetically conductive cover surrounding the first magnet. The second magnetic circuit system includes a second magnet and a third magnet surrounding the second magnet. The magnetic poles of the second magnet and the third magnet are opposite to each other along the vibration direction of the second diaphragm. In a first reference plane perpendicular to the vibration direction of the second diaphragm, the area of ​​the second magnet is larger than the area of ​​the third magnet, and the overlap area between the second magnet and the first magnet is larger than the overlap area between the third magnet and the first magnet. The magnetic poles of the first magnet and the second magnet are mutually repulsive.

13. The earphone according to claim 12, characterized in that, The overlap area between the second magnet and the first magnet is not less than 90% of the area of ​​the second magnet.

14. The earphone according to claim 1, characterized in that, The projection of the second magnetic circuit system along the vibration direction of the second diaphragm is at least partially overlapping with the first magnetic circuit system.

15. The earphone according to claim 1, characterized in that, The projection of the second loudspeaker along the vibration direction of the second diaphragm falls entirely into the first loudspeaker.

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