Control method, device and equipment of gas pressure spring and storage medium

Abstract

This invention relates to a control method, apparatus, device, and storage medium for a pneumatic spring, and pertains to the field of die bonding technology. The method includes: determining the target air pressure and target compression amount of the pneumatic spring within the die bonding head based on the pressure value to be output by the die bonding head. Before the die bonding head moves, the air pressure of the pneumatic spring is adjusted to the target air pressure according to a closed-loop control mode. While the die bonding head is moving, the air pressure of the pneumatic spring is stabilized at the target air pressure according to an open-loop control mode, and the pneumatic spring is compressed according to the target compression amount. This reduces the force fluctuation amplitude during force control, improves force control accuracy, and simultaneously maintains die bonding efficiency.

Description

Technical Field

[0001] This invention relates to the field of die bonding technology, and specifically to a control method, device, equipment, and storage medium for a pneumatic spring. Background Technology

[0002] Die bonding is a process in which a chip is bonded to a designated area of ​​a substrate using a colloid to form a thermal or electrical path, providing conditions for subsequent wire bonding. The die bonding process is a core part of the semiconductor packaging process, directly related to the performance and stability of the circuit. By tightly combining the chip and the substrate through materials and technology, the performance and reliability of the chip are ensured.

[0003] In the die bonding process, the effectiveness of die bonding force control is one of the important factors affecting die bonding quality. Currently, the end pressure output of the die bonding head is achieved by adjusting the motor's output current. Specifically, the relationship between motor current and end pressure is calibrated, and after approaching the contact position, the motor is driven to move directly by setting an output current that matches the end pressure to achieve the end pressure output of the die bonding head. This results in significant force fluctuations during the pressing process. Summary of the Invention

[0004] One of the objectives of this invention is to provide a control method, device, equipment, and storage medium for a gas spring, used to reduce the amplitude of force fluctuations during force control.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] According to a first aspect of the present invention, a method for controlling a pneumatic spring is provided. The method includes: determining a target air pressure and a target compression amount of the pneumatic spring within the die-bonding head based on the pressure value to be output by the die-bonding head. Before the die-bonding head moves, the air pressure of the pneumatic spring is adjusted to the target air pressure according to a closed-loop control mode. When the die-bonding head moves, gas is input to the pneumatic spring at the target air pressure according to an open-loop control mode, and the pneumatic spring is compressed according to the target compression amount.

[0007] Based on the aforementioned technical means, the die-bonding pressure is output via a pneumatic spring. Before the die-bonding head moves, the pneumatic spring pressure is adjusted to the target pressure using a closed-loop control mode. Further, while the die-bonding head is moving, the pneumatic spring pressure is stabilized at the target pressure using an open-loop control mode, and the pneumatic spring is compressed according to the target compression amount. In this way, the open-loop and closed-loop switching control of the pneumatic spring pressure ensures that no force overshoot occurs during the compression process due to changes in the internal pressure of the pneumatic spring, thereby reducing the force fluctuation amplitude during force control.

[0008] In one possible approach, the aforementioned "determining the target air pressure and target compression amount of the gas spring inside the die bonder based on the pressure value to be output by the die bonder" includes: determining a first air pressure and a first compression amount of the gas spring based on the pressure value, and determining a second air pressure based on the first air pressure, the first compression amount, and an air pressure determination function. The second air pressure is the air pressure of the gas spring before it is compressed, and the first air pressure is the air pressure of the gas spring after it is compressed according to the first compression amount. The second air pressure is used as the target air pressure, and the first compression amount is used as the target compression amount.

[0009] In one possible approach, the aforementioned "determining the target air pressure and target compression amount of the gas spring inside the die bonder based on the pressure value to be output by the die bonder" includes: determining a first air pressure and a first compression amount of the gas spring based on the pressure value, and determining a second compression amount based on the first air pressure, the first compression amount, and a compression amount function. The pressure value output by the gas spring at the first air pressure and the second compression amount is the same as the pressure value output at the first air pressure and the first compression amount. The first air pressure is used as the target air pressure, and the second compression amount is used as the target compression amount.

[0010] In one possible approach, the aforementioned "determining the first air pressure and the first compression amount of the gas spring based on the pressure value" includes: determining the first air pressure and the first compression amount based on the compression range of the gas spring, the pressure value, and the pressure mapping relationship. The pressure mapping relationship includes multiple pressure values ​​and multiple parameter pairs corresponding to each pressure value. Each parameter pair includes an air pressure and a compression amount, and the first compression amount is within the compression range.

[0011] In one possible approach, the method further includes: increasing the motor's speed while the die-bonding head is in contact with the object to be die-bonded, and decreasing the motor's speed while the compression of the pneumatic spring is equal to a preset compression. The motor is used to compress the pneumatic spring, where the preset compression is less than the target compression.

[0012] In one possible approach, the method further includes: increasing the motor's speed before the die-bonding head contacts the object to be bonded, and reducing the motor's speed to a preset speed when the distance between the die-bonding head and the object to be bonded is less than or equal to a distance threshold. The motor drives the movement of the die-bonding head. When the die-bonding head contacts the object to be bonded, the motor is controlled to move at the preset speed.

[0013] According to a second aspect of the present invention, a control device for a pneumatic spring is provided. The control device includes a determining unit and a processing unit. The determining unit is configured to determine a target air pressure and a target compression amount of the pneumatic spring inside the die-bonding head based on the pressure value to be output by the die-bonding head. The processing unit is configured to adjust the air pressure of the pneumatic spring to the target air pressure according to a closed-loop control mode before the die-bonding head moves. The processing unit is further configured to stabilize the air pressure of the pneumatic spring at the target air pressure according to an open-loop control mode when the die-bonding head moves. The processing unit is further configured to compress the pneumatic spring according to the target compression amount.

[0014] In one possible approach, the determining unit is specifically used to: determine a first air pressure and a first compression amount of the gas spring based on a pressure value, and determine a second air pressure based on the first air pressure, the first compression amount, and a air pressure determination function. The second air pressure is the air pressure of the gas spring before compression, and the first air pressure is the air pressure of the gas spring after compression to the target compression amount. The second air pressure is used as the target air pressure, and the first compression amount is used as the target compression amount.

[0015] In one possible approach, the determining unit is specifically used to: determine a first air pressure and a first compression amount of the gas spring based on the pressure value, and determine a second compression amount based on the first air pressure, the first compression amount, and a compression amount function. The pressure value output by the gas spring under the first air pressure and the second compression amount is the same as the pressure value output under the first air pressure and the first compression amount. The first air pressure is used as the target air pressure, and the second compression amount is used as the target compression amount.

[0016] In one possible approach, the determining unit is specifically used to: determine a first air pressure and a first compression amount based on the compression range, pressure value, and pressure mapping relationship of the gas spring. The pressure mapping relationship includes multiple pressure values ​​and multiple parameter pairs corresponding to each pressure value. Each parameter pair includes an air pressure and a compression amount, and the first compression amount is within the compression range.

[0017] In one possible embodiment, the processing unit is further configured to increase the motor's speed when the die-bonding head is in contact with the object to be die-bonded. The processing unit is also configured to decrease the motor's speed when the compression of the pneumatic spring equals a preset compression. The motor is used to compress the pneumatic spring, where the preset compression is less than the target compression.

[0018] In one possible approach, the processing unit is further configured to increase the motor's speed before the die-bonding head contacts the object to be bonded. The processing unit is also configured to reduce the motor's speed to a preset speed when the distance between the die-bonding head and the object to be bonded is less than or equal to a distance threshold. The motor drives the movement of the die-bonding head. When the die-bonding head contacts the object to be bonded, the motor is controlled to move at the preset speed.

[0019] According to a third aspect of the present invention, an electronic device is provided, comprising: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute instructions to implement the method of the first aspect described above and any possible implementation thereof.

[0020] According to a fourth aspect of the present invention, a computer-readable storage medium is provided, which, when the instructions in the computer-readable storage medium are executed by a processor of a processing device, enables the processing device to perform the methods described in the first aspect and any possible embodiments thereof.

[0021] According to a fifth aspect of the present invention, a computer program product is provided, the computer program product including computer instructions that, when executed on a processing device, cause the processing device to perform the method described in the first aspect and any possible implementation thereof. Attached Figure Description

[0022] Figure 1 A schematic diagram of a control system for a gas spring is shown as an exemplary embodiment of the present invention.

[0023] Figure 2 A schematic diagram of the pressure of a die-bonding tool is shown as an exemplary embodiment of the present invention;

[0024] Figure 3 One of the flowcharts illustrating a control method for a pneumatic spring is provided as an exemplary embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram illustrating the relationship between the speed and position of an electric motor according to an exemplary embodiment.

[0026] Figure 5 A second schematic flowchart illustrating a control method for a pneumatic spring, provided as an exemplary embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram illustrating a control device for a gas spring according to an exemplary embodiment;

[0028] Figure 7 This is a schematic diagram of an electronic device according to an exemplary embodiment. Detailed Implementation

[0029] The embodiments of the present invention will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention and not for limiting the scope of protection of the present invention.

[0030] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0031] Die bonding is a process in which a chip is bonded to a designated area of ​​a substrate using a colloid to form a thermal or electrical path, providing conditions for subsequent wire bonding. The die bonding process is a core part of the semiconductor packaging process, directly related to the performance and stability of the circuit. By tightly combining the chip and the substrate through materials and technology, the performance and reliability of the chip are ensured.

[0032] In the die bonding process, the effectiveness of die bonding force control is one of the important factors affecting die bonding quality. Currently, the end pressure output of the die bonding head is achieved by adjusting the motor's output current. Specifically, the relationship between motor current and end pressure is calibrated, and after approaching the contact position, the motor is driven to move directly by setting an output current that matches the end pressure to achieve the end pressure output of the die bonding head. This results in significant force fluctuations during the pressing process.

[0033] To address the aforementioned technical problems, this invention provides a control method for a pneumatic spring. The method includes: determining the target air pressure and target compression amount of the pneumatic spring inside the die-bonding head based on the pressure value to be output by the die-bonding head. Before the die-bonding head moves, the air pressure of the pneumatic spring is adjusted to the target air pressure according to a closed-loop control mode. When the die-bonding head moves, gas is input to the pneumatic spring at the target air pressure according to an open-loop control mode, and the pneumatic spring is compressed according to the target compression amount.

[0034] Based on the aforementioned technical means, the die-bonding pressure is output via a pneumatic spring. Before the die-bonding head moves, the pneumatic spring pressure is adjusted to the target pressure using a closed-loop control mode. Furthermore, while the die-bonding head is moving, the pneumatic spring pressure is controlled in an open-loop control mode to eventually stabilize at the target pressure, and the pneumatic spring is compressed according to the target compression amount. In this way, the open-loop and closed-loop switching control of the pneumatic spring pressure ensures that no force overshoot occurs during the compression process due to changes in the internal pressure of the pneumatic spring, thereby reducing the force fluctuation amplitude during force control.

[0035] like Figure 1 As shown, Figure 1 This is a schematic diagram of a control system 100 for a gas spring according to an embodiment of the present invention. The control system 100 may include an electronic device 101, a motor 102, and a die bonder head 103. The die bonder head 103 includes a gas spring 1 and a die bonder tool 2 connected to the gas spring 1. The electronic device 101 is communicatively connected to the motor 102 and the die bonder head 103.

[0036] In some embodiments, the electronic device 101 is used to determine the target air pressure and target compression amount of the pneumatic spring inside the die bonder based on the pressure value to be output by the die bonder. The electronic device 101 is also used to adjust the air pressure of the pneumatic spring to the target air pressure according to a closed-loop control mode before the die bonder moves. The electronic device 101 is also used to control the air pressure of the pneumatic spring to eventually stabilize at the target air pressure according to an open-loop control mode when the die bonder moves, and to compress the pneumatic spring according to the target compression amount.

[0037] In some embodiments, the electronic device 101 is also used to calculate the movement speed of the die bonder 103 and control the movement direction and speed of the die bonder 103 by the motor 102.

[0038] In this embodiment, the motor 102 can be a Z-axis motor. The motor 102 is used to drive the die bonder 103 to move up and down.

[0039] In this embodiment, the gas spring 1 in the die-bonding head 103 is a hollow gas spring, and the internal air pressure of the gas spring 1 can be adjusted by inflating or deflating it. The gas spring 1 is used to output spring pressure and gas pressure to generate the force between the die-bonding tool 2 and the surface of the object to be bonded.

[0040] In some embodiments, after the die bonding tool 2 contacts the surface of the object to be bonded, the motor 102 continues to move downwards to compress the pneumatic spring 1, at which point the die bonding tool 2 remains relatively stationary. Thus, combined with... Figure 1 ,like Figure 2 As shown, the total pressure F output by the die bonding tool 2 N =F P +G+FS , of which F N F is the total pressure between the die bonding tool 2 and the surface of the object to be bonded. P and F S These represent the air pressure and spring pressure of the gas spring 1 on the die bonding tool 2, respectively, F. P =P*S, where P is the air pressure inside the air spring 1, S is the contact area between the die-bonding tool 2 and the air spring 1, and F S = k * Δx, where k is the stiffness of the gas spring 1, Δx is the compression of the gas spring 1, and G is the weight of the die-bonding tool 2. That is, F N =f(P,Δx), so the end pressure of the die bonder 103 can be controlled by controlling the compression of the air spring 1 and the internal air pressure.

[0041] In some embodiments, the control system 100 is applied in a die bonder, and the electronic device 101 is a control device in the die bonder, such as a controller or a processor. In other embodiments, the electronic device 101 can be a server. This application does not specifically limit the electronic device 101.

[0042] For ease of understanding, the control method of the pneumatic spring provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0043] Figure 3 A flowchart of a control method for a pneumatic spring is shown according to an exemplary embodiment. The control method includes: S201-S204.

[0044] S201. Determine the target air pressure and target compression amount of the gas spring inside the die bonder based on the pressure value to be output by the die bonder.

[0045] In some embodiments, when the electronic device determines the pressure value to be output by the die bonder, it determines a first air pressure and a first compression amount of the pneumatic spring based on the pressure value, and determines a second air pressure based on the first air pressure, the first compression amount, and a pressure determination function. Further, the electronic device uses the second air pressure as the target air pressure and the first compression amount as the target compression amount. This step is detailed in S2011-S2013 below.

[0046] In some embodiments, when the electronic device determines the pressure value to be output by the die bonder, it determines a first air pressure and a first compression amount of the pneumatic spring based on the pressure value. The electronic device determines a second compression amount based on the first air pressure, the first compression amount, and a compression amount function, and uses the first air pressure as the target air pressure and the second compression amount as the target compression amount. This step is detailed in S2014-S2016 below.

[0047] In some embodiments, the electronic device determines the pressure value to be output based on the properties of the object to be bonded.

[0048] S202. Before the die bonding head moves, adjust the air pressure of the pneumatic spring to the target air pressure according to the closed-loop control mode.

[0049] For example, taking a target air pressure of P1 as an example. Before the die bonding head moves, the electronic device performs closed-loop control on the air pressure in the air spring to stabilize it at P1.

[0050] In another scenario, the electronic device adjusts the air pressure of the air spring to the target air pressure according to a closed-loop control mode before the air spring is compressed.

[0051] S203. When the die bonding head is moving, gas is input to the gas spring at the target gas pressure according to the open-loop control mode.

[0052] For example, taking a target air pressure of P1 as an example. After the die bonding head moves, the electronic device fixes the air pressure control output as P1, and performs open-loop control on the air pressure in the air pressure spring.

[0053] In another scenario, the electronic device, with the pneumatic spring compressed, inputs gas into the pneumatic spring at the target pressure according to the open-loop control mode.

[0054] S204. Compress the air spring according to the target compression amount.

[0055] In some embodiments, when the die bonding head is in contact with the object to be die bonded, the electronic device controls the motor to continue moving to compress the pneumatic spring to the target compression amount, thereby completing force control.

[0056] For example, with the target compression amount as Δx d For example, the electronic device controls the motor to compress the pneumatic spring by Δx. d .

[0057] In other embodiments, the compression speed of the pneumatic spring is adjusted by controlling the movement speed of the motor. Specifically, the control of the motor's movement speed is detailed in steps S205-S209 below.

[0058] Understandably, the gas pressure formula is: P*V = C*T. Where P is the gas pressure, V is the gas volume, C is a constant related to the gas type, and T is the thermodynamic temperature. Since the movement of the die-bonding head is generally very short (tens to hundreds of milliseconds), the gas temperature inside the gas spring remains essentially unchanged. Therefore, before the die-bonding head begins to move, the gas pressure is stabilized to the target pressure, and the output of the pressure control is fixed during the die-bonding head's movement. The spring compression gradually increases from 0 to the target compression, and the gas pressure inside the spring gradually increases to the target pressure. Thus, when the spring compression reaches the target compression, the pressure output by the die-bonding head is the same as the pressure to be output, ensuring that the force control process does not cause force overshoot due to changes in the gas pressure inside the adjustable spring.

[0059] Subsequently, the electronic device controls the die bonding head to disengage from the surface of the object to be bonded.

[0060] The pneumatic spring control method provided in this application provides at least the following beneficial effects: By outputting die-bonding pressure through the pneumatic spring, the air pressure of the pneumatic spring is adjusted to the target air pressure according to a closed-loop control mode before the die-bonding head moves. Furthermore, when the die-bonding head moves, the air pressure of the pneumatic spring is stabilized at the target air pressure according to an open-loop control mode, and the pneumatic spring is compressed according to the target compression amount. Thus, by switching between open-loop and closed-loop control of the air pressure within the pneumatic spring, it is ensured that no force overshoot occurs due to changes in the air pressure within the pneumatic spring during compression, thereby reducing the force fluctuation amplitude during force control.

[0061] In one design, the above S201 includes: S2011-S2013.

[0062] S2011. Determine the first air pressure and the first compression amount of the air spring based on the pressure value.

[0063] As one possible approach, the electronic device determines the first air pressure and the first compression amount based on the compression range, pressure value, and pressure mapping relationship of the gas spring. The pressure mapping relationship includes multiple pressure values ​​and multiple parameter pairs corresponding to each pressure value. Each parameter pair includes an air pressure and a compression amount, with the first compression amount falling within the compression range.

[0064] In some embodiments, the electronic device determines multiple parameter pairs based on pressure values ​​and a pressure mapping table. Further, the electronic device determines a target parameter pair from the multiple parameter pairs based on the compression range, and uses the air pressure and compression amount in the target parameter pair as the first air pressure and the first compression amount, respectively.

[0065] In some embodiments, the electronic device determines the maximum and minimum compression of the pneumatic spring based on the attribute information of the object to be bonded, and determines the compression range based on the maximum and minimum compression. This controls the compression of the pneumatic spring within a reasonable range, avoiding situations where insufficient compression leads to the motor stopping shortly after contact between the bonding tool and the object during force control, resulting in poor stability; or, conversely, avoiding excessive compression which increases the motor's travel distance and leads to decreased efficiency.

[0066] The pressure mapping relationship in this embodiment was obtained by maintenance personnel through multiple tests in advance.

[0067] In some embodiments, before die bonding with the die bonding head, the relationship between the pressure value and the air pressure inside the pneumatic spring and the spring compression is calibrated. Specifically, a pressure sensor is mounted on the surface of the die bonding tool or the object to be bonded, and the air pressure inside the adjustable pneumatic spring is set to P. i The die-bonding tool of the die-bonding head is moved towards the contact surface by a motor. Furthermore, after the die-bonding tool reaches the contact position, the motor moves downward a certain distance Δx. j That is, the air pressure adjustable spring compresses Δx j Wait until the air pressure inside the spring stabilizes at P i And the spring compression stabilizes to Δx j Then, the pressure F between the die bonding tool and the surface of the object to be bonded is measured. Nij Next, choose P. i and Δx j By calculating the value, multiple pressure calibration results (P) can be obtained. i ,Δx j ,F Nij ), where i = 1, 2, ..., m; j = 1, 2, ..., n. Finally, based on multiple pressure calibration results, the pressure mapping relationship is obtained.

[0068] In addition, to improve calibration efficiency, a fixed spring compression Δx is determined based on the required pressure range and the properties of the gas spring. The pressure F between the die-bonding tool and the surface of the object to be bonded is then calibrated at this spring compression Δx. Ni And the air pressure P inside the air spring i The relationship.

[0069] As another possible implementation, the electronic device determines a reference compression amount and, based on the reference compression amount, pressure value, and pressure mapping relationship, determines a first air pressure and a first compression amount. The difference between the first compression amount and the reference compression amount is greater than or equal to a preset threshold.

[0070] As another possible approach, the electronic device inputs the pressure value into preset parameters to determine the model, thereby determining the first air pressure and the first compression amount.

[0071] It should be noted that the preset parameters determine the model as a model pre-trained by the operations and maintenance personnel.

[0072] S2012. Determine the second air pressure based on the first air pressure, the first compression amount, and the air pressure determination function.

[0073] The second air pressure is the air pressure before the air spring is compressed, and the first air pressure is the air pressure after the air spring is compressed according to the first compression amount.

[0074] In some embodiments, the electronic device determines the internal gas volume of the gas spring when it is compressed to a first compression amount: the compressed volume, and the internal volume of the gas spring when it is not compressed: the uncompressed volume. Further, the electronic device inputs the compressed volume, the uncompressed volume, and the first air pressure into a pressure determination function to obtain a second air pressure.

[0075] For example, the air pressure determination function is shown in Formula 1 below.

[0076] P d *V d =P d '*V d Formula 1

[0077] Among them, V d 'V' represents the uncompressed volume. d To compress the volume, P d The first pressure, P d 'This is the second atmospheric pressure.'

[0078] In particular, if the cross-sectional area inside the gas spring is approximately equal at different heights (e.g., approximating a cylinder or cuboid), then the gas pressure determination function can also be P. d '=P d *(x0-Δx d ) / x0, where x0 is the height of the gas inside the spring when the air pressure adjustable spring is not compressed.

[0079] S2013. Take the second air pressure as the target air pressure and the first compression amount as the target compression amount.

[0080] Understandably, after the gas spring is compressed, the volume of gas inside the gas spring will decrease. To avoid changes in gas pressure due to the decrease in gas volume, the first gas pressure is taken as the compressed gas pressure, and the gas pressure for closed-loop control is determined as the second gas pressure. In this way, when the gas spring is compressed to the first compression amount, the gas pressure of the gas spring reaches the first gas pressure, ensuring the accuracy of the solidification force.

[0081] In one design, the above S201 includes: S2014-S2016.

[0082] S2014. Determine the first air pressure and the first compression amount of the air spring based on the pressure value.

[0083] This step is detailed in S2011 above and will not be repeated here.

[0084] S2015. Determine the second compression amount based on the first air pressure, the first compression amount, and the compression amount function.

[0085] The pressure value output by the gas spring under the first air pressure and the second compression amount is the same as the pressure value output under the first air pressure and the first compression amount.

[0086] In some embodiments, the electronic device, after determining the first compression amount and the first air pressure, inputs the contact area between the die bonding tool and the air spring, the first air pressure, the first compression amount, and the uncompressed volume into a compression amount function to obtain a second compression amount.

[0087] For example, the compression function is shown in Formula 2 below.

[0088] (V / V'-1)*P d *S=k*(Δx d -Δx d Formula 2

[0089] Where V is the uncompressed volume, and V' is the compression of the air spring, which is the second compression Δx. d The internal gas volume is ', S is the contact area between the die-bonding tool and the adjustable air pressure spring, and k is the stiffness of the adjustable air pressure spring.

[0090] Specifically, if the cross-sectional area inside the gas spring is approximately equal at different heights (e.g., approximating a cylinder or cuboid), then the compression function can be (x0 / (x0-Δx)). d ')-1)*P d *S=k*(Δx d -Δx d x0 represents the height of the gas inside the adjustable air spring when it is not compressed.

[0091] S2016. Take the first air pressure as the target air pressure and the second compression amount as the target compression amount.

[0092] Understandably, the volume of gas inside the pneumatic spring decreases after compression. To avoid pressure changes due to this reduction in gas volume, the compression amount of the pneumatic spring is adjusted. This ensures that the target pressure is achieved by compressing the pneumatic spring to the second compression level, resulting in the die-bonding tool outputting the target pressure value, thus guaranteeing the accuracy of the die-bonding force.

[0093] In one design, the control method for the gas spring provided in this application embodiment further includes: S205-S206.

[0094] S205. When the die bonding head is in contact with the object to be bonded, increase the speed of the motor.

[0095] The motor is used to compress the pneumatic spring.

[0096] In some embodiments, when the die bonding tool of the die bonding head contacts the object to be bonded, the motor is accelerated according to a first acceleration.

[0097] In some embodiments, the electronic device increases the motor's speed upon determining that the motor has reached a first position. The first position is the position of the motor when the die bonder contacts the object to be bonded.

[0098] It should be noted that the first acceleration is preset in the electronic device by the maintenance personnel, and the embodiments of this application do not specifically limit the first acceleration.

[0099] S206. When the compression of the air spring is equal to the preset compression, reduce the speed of the motor.

[0100] The preset compression amount is less than the target compression amount.

[0101] In some embodiments, the electronic device determines whether the compression of the pneumatic spring is less than or equal to a preset compression. If the compression of the pneumatic spring is equal to the preset compression, the device reduces the speed of the motor. Subsequently, if the compression of the pneumatic spring is equal to the target compression, the device controls the motor to stop moving.

[0102] In another scenario, the electronic device reduces the motor's speed when the motor's speed is greater than or equal to the third speed. Subsequently, the electronic device controls the motor to stop at a target position. The target position is the position of the motor when the gas spring is compressed to the target compression level.

[0103] Understandably, when the die bonding head contacts the object to be bonded, the control motor accelerates and then decelerates and stops with appropriate motion parameters. In this way, the pneumatic spring can be quickly compressed to the target compression amount, thereby ensuring the die bonding efficiency.

[0104] In one design, the control method for the gas spring provided in this application embodiment further includes: S207-S209.

[0105] S207. Increase the speed of the motor before the die bonding head contacts the object to be bonded.

[0106] The motor is used to drive the movement of the die bonder.

[0107] In some embodiments, when the electronic device adjusts the air pressure of the air spring to the target air pressure according to the closed-loop control mode, it controls the motor to move and increases the motor's speed according to the second acceleration.

[0108] In some embodiments, the electronic device increases the speed of the motor when the motor is started.

[0109] In other embodiments, the electronic device controls the motor to increase its speed between a first position and a second position. The first position is the starting position of the motor, and the second position is the position of the motor after it has moved a preset distance from the starting position before the die bonding head contacts the object to be bonded.

[0110] It should be noted that the preset distance is set in the electronic device by the maintenance personnel in advance, and the embodiments of this application do not specifically limit the preset distance.

[0111] S208. When the distance between the die bonding head and the object to be die bonded is less than or equal to the distance threshold, reduce the speed of the motor to the preset speed.

[0112] In some embodiments, the distance between the die bonder and the object to be bonded is calculated, and it is determined whether the distance between the die bonder and the object to be bonded is less than or equal to a distance threshold. Further, if the distance between the die bonder and the object to be bonded is less than or equal to the distance threshold, the motor speed is reduced to a preset speed.

[0113] It should be noted that the preset threshold is a setting pre-selected by maintenance personnel in the electronic device. In another scenario, the electronic device determines whether the motor's speed is greater than or equal to the first speed, and if the motor's speed is equal to the first speed, reduces the motor's speed to the preset speed.

[0114] It should be noted that the first speed and the preset speed are preset in the electronic equipment by the maintenance personnel. This application embodiment does not specifically limit the first speed and the preset speed.

[0115] S209. When the die bonding head contacts the die bonding object, control the motor to move at a preset speed.

[0116] Understandably, the electronic device increases the motor's speed before the die bonder contacts the object to be bonded, thus reducing the motor's travel time. Furthermore, once the die bonder contacts the object, the motor continues to move at a preset speed without needing to reduce its speed, thereby shortening the bonding time and ensuring bonding efficiency.

[0117] In one design, to ensure die bonding efficiency, such as Figure 4 As shown, a schematic diagram illustrating the relationship between the speed and position of an electric motor is presented. Figure 4 In the diagram, the motor's motion is divided into three stages: stage 1, stage 2, and stage 3. The dashed line represents the motor's position, and the solid line represents the motor's speed.

[0118] In stage 1, the die-bonding tool of the die-bonding head is not in contact with the surface of the object to be bonded. To reduce motor movement time and improve motor efficiency, at the starting position corresponding to stage 1, the maximum allowable movement parameter in the compression direction (e.g., Z-axis) is used to increase the motor speed as quickly as possible. Further, after the remaining movement distance in stage 1 is reduced to a preset distance (obtained through a preset calculation method, ensuring that deceleration begins from this position and the speed reaches the preset speed at the end of stage 1), the motor speed begins to decrease. Subsequently, at the end position corresponding to stage 1, the motor speed is reduced to the preset speed.

[0119] In some embodiments, the motor movement is divided into three stages: stage 1, stage 2, and stage 3, based on the initial position of the die bonder and the position of the object to be bonded. Stage 1 is the motor movement stage before the die bonder contacts the object. Stage 2 is the motor movement stage during the contact between the die bonder and the object. Stage 3 is the motor movement stage after the die bonder and the object are in complete contact. That is, the end point of stage 1 is the start point of stage 2, the end point of stage 2 is the start point of stage 3, and the end point of stage 3 is the end point of the entire motor movement stage. This application does not specifically limit stage 1, stage 2, and stage 3; for example, maintenance personnel can divide the motor movement stages based on the initial position of the motor, the final position of the motor, and the attributes of the object to be bonded.

[0120] In some embodiments, before the motor moves, a first distance between the die-bonding head and the object to be die-bonded is determined, and a first speed adjustment position of the motor is obtained based on the first distance and a preset distance algorithm. Further, when the motor starts moving, the motor speed is increased according to a preset acceleration algorithm, and when the motor reaches the first speed adjustment position, the motor speed begins to decrease. Subsequently, at the end position of stage 1, the motor speed is controlled to decrease to a second speed.

[0121] In stage 2, at the starting position corresponding to stage 2, the movement connects with the final speed of stage 1: the second speed. The motor continues to operate at the second speed throughout stage 2. In this way, the die-bonding tool begins to contact the surface of the object to be bonded. To minimize the impact generated during contact, this segment uses a low, constant speed to ensure that the impact generated when the die-bonding tool contacts the surface of the object is within an acceptable range. Furthermore, the movement distance in this segment is determined based on the maximum contact position detection error; that is, it is necessary to ensure that the actual contact position is always within this segment.

[0122] In some embodiments, stage 2 is the process of the die bonding head contacting the object to be bonded. During stage 2, the motor's movement speed is a second speed.

[0123] In stage 3, the motor speed is first increased, then gradually decreased. Furthermore, when the motor reaches the endpoint corresponding to stage 3, the speed is reduced to 0. Thus, after the die-bonding tool makes stable contact with the object to be bonded, both position control stability and motion efficiency need to be considered. By first increasing the motor speed and then gradually decreasing it, the position fluctuation after stopping is kept within an acceptable range while improving motion efficiency.

[0124] In some embodiments, at the starting position of stage 3, the motor accelerates at a preset speed, and when the motor reaches the second speed adjustment position, the motor speed is reduced, and when it is determined that the motor position has reached the target position, the motor is controlled to stop moving.

[0125] It should be noted that the first speed adjustment position and the second speed adjustment position are determined by the electronic device according to a preset position algorithm. This application embodiment does not specifically limit the first speed adjustment position and the preset speed adjustment position.

[0126] It should be noted that the second speed can be preset by maintenance personnel or calculated by electronic equipment. This application embodiment does not specifically limit the second speed.

[0127] Understandably, the motor is always in motion during different stages of operation to avoid stopping during contact between the die-bonding head and the object to be bonded, thus further improving die-bonding efficiency. Additionally, the pneumatic spring control method in this embodiment always has a certain error between the feedback and the command during the control feedback following the command. Therefore, in the design... Figure 4 Based on the motion speed and position curves, the error between the feedback motion curve and the desired motion curve is optimized by iteratively modifying the command curve, thus obtaining a command curve that meets the optimization target requirements. By controlling the die bonding tool to follow the command curve, the feedback motion curve and the desired motion curve are basically consistent.

[0128] Understandably, by setting the motion parameters of the motor at different stages, motion efficiency can be improved, thereby ensuring the efficiency of die bonding. By modifying the command curve, the feedback motion curve and the desired motion curve are made basically consistent, which greatly improves the stability of motion control, thereby ensuring the stability of the force control process.

[0129] To better understand the control method of the gas spring provided in the embodiments of this application, such as Figure 5 The diagram shows a flow chart of a pneumatic spring control method, including steps S11-S16.

[0130] S11. Determine the compression amount of the gas spring based on the pressure range of the solidification process.

[0131] This step can be performed using the parameters mentioned above in S2011.

[0132] S12. Determine the relationship between the output pressure of the die bonder and the internal air pressure of the air spring based on the compression of the air spring.

[0133] This step can be performed using the parameters mentioned above in S2011.

[0134] S13. Determine the target gas pressure and target compression amount based on the output pressure value of the die bonder.

[0135] This step can be performed using the parameters mentioned above in S201.

[0136] S14. Before the die bonding head moves, adjust the air pressure of the pneumatic spring to the target air pressure according to the closed-loop control mode.

[0137] This step can be performed using the parameters mentioned above in S202.

[0138] S15. When the die bonding head is moving, gas is input to the gas spring at the target gas pressure according to the open-loop control mode.

[0139] This step can be performed using the parameters mentioned above in S203.

[0140] S16. Compress the air spring according to the target compression amount.

[0141] This step can be performed using the parameters mentioned above in S204.

[0142] The pneumatic spring control method provided in this application embodiment has at least the following effects: compressing the pneumatic spring according to a motion trajectory that satisfies the requirements of both the position fluctuation and motion efficiency of the die bonding head, reducing the amplitude of force fluctuation during force control, improving force control accuracy, and taking into account die bonding efficiency.

[0143] The foregoing primarily describes the solutions provided by the embodiments of the present invention from a methodological perspective. To achieve the aforementioned functions, the control device includes hardware structures and / or software modules corresponding to the execution of each function. Those skilled in the art should readily recognize that, in conjunction with the units and algorithm steps of the various examples described in the embodiments disclosed herein, the present invention can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0144] Figure 6 This is a control device 30 for a gas spring according to an exemplary embodiment. (See reference...) Figure 6The control device 30 for the gas spring includes a determining unit 301 and a processing unit 302.

[0145] The determining unit 301 is used to determine the target air pressure and target compression amount of the pneumatic spring inside the die bonder based on the pressure value to be output by the die bonder. The processing unit 302 is used to adjust the air pressure of the pneumatic spring to the target air pressure according to the closed-loop control mode before the die bonder moves.

[0146] The processing unit 302 is also configured to input gas to the pneumatic spring at a target gas pressure according to an open-loop control mode while the die-bonding head is moving. The processing unit 302 is also configured to compress the pneumatic spring according to a target compression amount.

[0147] In one possible approach, the determining unit 301 is specifically used to: determine a first air pressure and a first compression amount of the gas spring based on the pressure value, and determine a second air pressure based on the first air pressure, the first compression amount, and an air pressure determination function. The second air pressure is the air pressure of the gas spring before it is compressed, and the first air pressure is the air pressure of the gas spring after it is compressed to the target compression amount. The second air pressure is used as the target air pressure, and the first compression amount is used as the target compression amount.

[0148] In one possible approach, the determining unit 301 is specifically configured to: determine a first air pressure and a first compression amount of the gas spring based on the pressure value, and determine a second compression amount based on the first air pressure, the first compression amount, and a compression amount function. The pressure value output by the gas spring under the first air pressure and the second compression amount is the same as the pressure value output under the first air pressure and the first compression amount. The first air pressure is used as the target air pressure, and the second compression amount is used as the target compression amount.

[0149] In one possible approach, the determining unit 301 is specifically used to: determine a first air pressure and a first compression amount based on the compression range, pressure value, and pressure mapping relationship of the air spring. The pressure mapping relationship includes multiple pressure values ​​and multiple parameter pairs corresponding to each pressure value. Each parameter pair includes an air pressure and a compression amount, and the first compression amount is within the compression range.

[0150] In one possible embodiment, the processing unit 302 is further configured to increase the motor's speed when the die-bonding head is in contact with the object to be die-bonded. The processing unit 302 is also configured to decrease the motor's speed when the compression of the pneumatic spring equals a preset compression. The motor is used to compress the pneumatic spring, where the preset compression is less than the target compression.

[0151] In one possible embodiment, the processing unit 302 is further configured to increase the motor's speed before the die-bonding head contacts the object to be bonded. The processing unit 302 is also configured to reduce the motor's speed to a preset speed when the motor's speed is equal to a first speed. The motor drives the movement of the die-bonding head. When the die-bonding head contacts the object to be bonded, the motor is controlled to move at the preset speed.

[0152] Figure 7 This is a schematic diagram illustrating an electronic device according to an exemplary embodiment. Figure 7 As shown, the electronic device includes, but is not limited to, a processor 401 and a memory 402.

[0153] The memory 402 described above is used to store the executable instructions of the processor 401. It is understood that the processor 401 is configured to execute instructions to implement the model training method and SOC estimation method in the above embodiments.

[0154] It should be noted that those skilled in the art will understand that Figure 7 The processing device structure shown does not constitute a limitation on electronic devices; the processing device may include more than Figure 7 This may indicate more or fewer components, or combinations of certain components, or different component arrangements.

[0155] Processor 401 is the control center of the electronic device. It connects various parts of the processing device via various interfaces and lines. By running or executing software programs and / or modules stored in memory 402, and by calling data stored in memory 402, it performs various functions of the processing device and processes data, thereby providing overall monitoring of the processing device. Processor 401 may include one or more processing units. Optionally, processor 401 may integrate an application processor and a modem processor. The application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into processor 401.

[0156] The memory 402 can be used to store software programs and various data. The memory 402 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, application programs required by at least one functional module (such as a determination unit, processing unit, etc.), etc. Furthermore, the memory 402 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0157] In an exemplary embodiment, a computer-readable storage medium including instructions is also provided, such as a memory 402 including instructions, which can be executed by a processor 401 of a processing device to implement the methods in the above embodiments.

[0158] Optionally, the computer-readable storage medium may be a non-transitory computer-readable storage medium, such as a read-only memory (ROM), random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device.

[0159] In an exemplary embodiment, the present invention also provides a computer program product comprising one or more instructions, which can be executed by a processor 401 of a processing device to perform the methods described above.

[0160] It should be noted that when one or more instructions in the computer-readable storage medium or computer program product are executed by the processor of the processing device, they implement the various processes of the above method embodiments and achieve the same technical effect as the above method. To avoid repetition, they will not be described again here.

[0161] Through the above description of the embodiments, those skilled in the art can clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0162] In the several embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0163] The units described as separate components may or may not be physically separate. A component shown as a unit can be one or more physical units; that is, it can be located in one place or distributed in multiple different locations. Some or all of the classified units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0164] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0165] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiments of the present invention, essentially, or the part that contributes to the prior art, or the entirety or part of the technical solution, can be embodied in the form of a software product. This software product is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute the entirety or part of the steps of the methods of the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0166] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A control method of an air pressure spring, characterized by, The method includes: The target air pressure and target compression amount of the gas spring inside the die bonder are determined based on the pressure value to be output by the die bonder. Before the die bonding head moves, the air pressure of the pneumatic spring is adjusted to the target air pressure according to the closed-loop control mode; When the die bonding head is moving, gas is input to the gas spring at the target gas pressure according to the open-loop control mode, and the gas spring is compressed according to the target compression amount.

2. The method of claim 1, wherein, The step of determining the target air pressure and target compression amount of the gas spring inside the die bonder based on the pressure value to be output by the die bonder includes: The first air pressure and the first compression amount of the air spring are determined based on the pressure value, and the second air pressure is determined based on the first air pressure, the first compression amount, and the air pressure determination function; the second air pressure is the air pressure of the air spring before it is compressed, and the first air pressure is the air pressure of the air spring after it is compressed according to the first compression amount. The second air pressure is taken as the target air pressure, and the first compression amount is taken as the target compression amount.

3. The method of claim 1, wherein, The step of determining the target air pressure and target compression amount of the gas spring inside the die bonder based on the pressure value to be output by the die bonder includes: The first air pressure and the first compression amount of the air spring are determined based on the pressure value, and the second compression amount is determined based on the first air pressure, the first compression amount, and the compression amount function; the pressure value output by the air spring at the first air pressure and the second compression amount is the same as the pressure value output at the first air pressure and the first compression amount. The first air pressure is taken as the target air pressure, and the second compression amount is taken as the target compression amount.

4. The method according to claim 2 or 3, characterized in that, Determining the first air pressure and the first compression amount of the gas spring based on the pressure value includes: Based on the compression range of the air spring, the pressure value, and the pressure mapping relationship, the first air pressure and the first compression amount are determined; the pressure mapping relationship includes multiple pressure values ​​and multiple parameter pairs corresponding to each pressure value, and each parameter pair includes an air pressure and a compression amount, wherein the first compression amount is located within the compression range.

5. The method according to any one of claims 1-3, characterized in that, The method further includes: When the die bonding head contacts the object to be bonded, the speed of the motor is increased, and when the compression of the pneumatic spring is about to reach a preset compression amount, the speed of the motor is reduced; the motor is used to compress the pneumatic spring, and the preset compression amount is less than the target compression amount.

6. The method according to any one of claims 1-3, characterized in that, The method further includes: Before the die bonder head contacts the object to be bonded, the speed of the motor is increased, and when the distance between the die bonder head and the object to be bonded is less than or equal to a distance threshold, the speed of the motor is reduced to a preset speed; the motor is used to drive the movement of the die bonder head; When the die bonding head contacts the die bonding object, the motor is controlled to move at the preset speed.

7. A control device for a gas pressure spring, characterized by The control device includes: a determining unit and a processing unit; The determining unit is used to determine the target air pressure and target compression amount of the gas spring inside the die bonder based on the pressure value to be output by the die bonder. The processing unit is used to adjust the air pressure of the pneumatic spring to the target air pressure according to the closed-loop control mode before the die bonding head moves. The processing unit is also used to input gas into the pneumatic spring at the target gas pressure in an open-loop control mode when the die bonding head is moving. The processing unit is also configured to compress the gas spring according to the target compression amount.

8. The apparatus of claim 7, wherein, The determining unit is specifically used for: The first air pressure and the first compression amount of the air spring are determined based on the pressure value, and the second air pressure is determined based on the first air pressure, the first compression amount, and the air pressure determination function. The second air pressure is the air pressure before the air spring is compressed, and the first air pressure is the air pressure after the air spring is compressed according to the target compression amount; The second air pressure is taken as the target air pressure, and the first compression amount is taken as the target compression amount.

9. An electronic device, comprising: Including memory and processor; The memory and the processor are coupled; The memory is used to store computer program code, which includes computer instructions; When the processor executes the computer instructions, the electronic device performs the control method as described in any one of claims 1-6.

10. A computer-readable storage medium, characterized in that, When the computer-executable instructions stored in the computer-readable storage medium are executed by the processor of the processing device, the processing device is capable of performing the control method as described in any one of claims 1-6.

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