Full-automatic packaging integrated machine
By employing a linear integrated design and servo pneumatic control, the fully automated semiconductor plastic packaging machine addresses the shortcomings of existing equipment in process integration and automation collaboration, achieving efficient, fully automated, and intensive semiconductor packaging production. This improves production efficiency and yield while reducing equipment footprint costs.
CN122249092APending Publication Date: 2026-06-19SUZHOU SEIKEN INTELLIGENT TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU SEIKEN INTELLIGENT TECH CO LTD
- Filing Date
- 2026-05-25
- Publication Date
- 2026-06-19
Smart Images

Figure CN122249092A_ABST
Abstract
This invention discloses a fully automated packaging machine, relating to the field of packaging technology. It includes a frame feeding unit, a frame conveying unit, a preheating unit, an EMC material handling unit, an overall handling and mold cleaning unit, a molding unit, and a finished product post-processing unit, all connected and working in a straight line along the process flow. The output of the frame feeding unit is connected to the input of the frame conveying unit, and the output of the frame conveying unit is connected to the input of the preheating unit. The preheating unit and the EMC material handling unit are connected in parallel to the overall handling and mold cleaning unit. The output of the overall handling and mold cleaning unit is connected to the input of the molding unit, and the output of the molding unit is connected to the finished product post-processing unit. The entire machine achieves automatic feeding, precise conveying, and zoned preheating of semiconductor frames through servo drive and pneumatic control. This invention achieves fully integrated automated operation, with smooth parallel connections between processes, significantly shortening the production cycle time, improving efficiency and yield, and reducing labor and floor space costs.
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