Composition for insulating layer of printed wiring board

By introducing modified polybutadiene into the insulating layer material of printed wiring boards to form phosphorus-containing groups with a specific structure, the problems of dielectric properties and flame retardancy are solved, achieving low loss, high frequency transmission and flame retardancy.

CN122249472APending Publication Date: 2026-06-19NIPPON SODA CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NIPPON SODA CO LTD
Filing Date
2024-11-26
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing technologies cannot provide printed wiring board insulation materials with low dielectric constant, low dielectric loss tangent, and flame retardancy, thus failing to meet the requirements for high-frequency electrical signal transmission and flame retardancy in industrial products.

Method used

A resin composition containing modified polybutadiene is used to prepare a low-loss, high-flame-retardant insulating layer material by introducing phosphorus-containing groups into the polybutadiene to form 1,2-bonded and 1,4-bonded structures in a specific molar ratio, and bonding phosphorus-containing groups on carbon atoms, combined with appropriate polymerization methods and solvent systems.

Benefits of technology

It achieves low dielectric constant and dielectric loss tangent while possessing excellent flame retardancy and moisture resistance, meeting the requirements for high-frequency electrical signal transmission and flame retardancy.

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Abstract

The objective of this invention is to provide a composition for an insulating layer of a printed wiring board that has a low dielectric constant, a low dielectric loss tangent, and flame retardancy. The resin composition for the insulating layer of a printed wiring board contains polybutadiene, wherein the molar ratio of 1,2-bonded structures to 1,4-bonded structures in the polybutadiene is 60:40 to 100:0, and one or more carbon atoms of the polybutadiene are bonded with formula (III) (in formula (III), represents the bonding position, X...). 1 and X 2 Each can independently represent a single bond or an oxygen atom, R 1 and R 2 Each can be used independently to represent an organic group. (The ) represents a phosphorus-containing group.
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