Computer-implemented methods and apparatus for processing a sample using nanomanipulators

Abstract

A computer-implemented method for processing samples (102, 702) disposed on a sample stage (120) using a nanomanipulator (104), the nanomanipulator comprising a tip (106, 706) for processing the sample (102, 702) and a positioning unit (110) for moving the tip (106, 706), the method comprising the steps of: - focusing (S10) an image (146) provided by an image recording device (124, 724) onto the tip (106, 706) and / or the sample (102, 702); - Select (S11) the sample (102, 702) or the tip (106, 706) as the target feature; and automatically set (S12) the focus (726) of the nanomanipulator (104) based on at least one operating parameter of the sample stage (120) and the positioning unit (110), wherein the at least one operating parameter indicates the vertical movement of the sample stage (120) and / or the positioning unit (110) to keep the target feature focused within the image provided by the image recording device (124, 724) during processing.

Description

Technical Field

[0001] The present invention relates to a computer-implemented method and apparatus for processing samples using nanomanipulators.

[0002] The contents of priority application DE 10 2023 129 684.1 are hereby incorporated by reference in their entirety. Background Technology

[0003] Microlithography is used to create microstructured components, such as integrated circuits. Microlithography processes are performed using lithography equipment containing an illumination system and a projection system. Here, the image of a mask (mask master) illuminated by the illumination system is projected onto a substrate (e.g., a silicon wafer) coated with a photosensitive layer (photoresist) and positioned on the image plane of the projection system, to transfer the mask structure onto the photosensitive coating of the substrate.

[0004] Multiple exposures are used here with a mask (i.e., a photolithographic mask) because it is crucial that the mask is free of defects and contaminants. Therefore, significant costs are incurred in inspecting the photolithographic mask for defects and contaminants. Then, attempts are made to repair identified defects or remove contaminants. Defects and contaminants can be extremely small, ranging in size from a few nanometers. Therefore, removing defects and contaminants requires equipment with very high spatial resolution.

[0005] Contaminants are, for example, tiny particles deposited on the mask from the surrounding environment. For instance, transferring the mask between different processing facilities increases the likelihood of this type of contamination. These particles exhibit a wide variety of properties and vary in size and / or shape. They can be, for example, metallic particles, particularly tin, but can also be ceramic particles, polymer particles, and other carbon compounds. The particles are typically adsorbed onto the mask surface; that is, there are no strong chemical bonds, such as atomic bonds, between the particle material and the mask surface.

[0006] If the attractive forces (e.g., Coulomb forces and van der Waals forces) used to remove the particle are greater than the attractive forces (e.g., Coulomb forces and van der Waals forces) of the mask surface, the particle will leave the mask surface. Depending on the type of interaction between the particle and the mask surface, activation energy may be required to break the existing bond with the mask surface.

[0007] Processing devices capable of selectively removing individual particles from a surface (called particle removal tools (PRTs)) are known. For example, nanomanipulators, such as atomic force microscopes, are used for this purpose. In this case, particles are picked up by the measuring tip of the nanomanipulator (measuring and manipulator tip) and adhered to the measuring tip, and then removed from the mask surface. Imaging methods (e.g., image recording via scanning electron microscopy and / or scanning ion microscopy) typically support particle removal, and they require user operation at the nanoscale. In this case, even small user errors can easily lead to damage or destruction of the measuring tip of the nanomanipulator or the sample. Furthermore, this process requires a high degree of user concentration, thus increasing the risk of user error due to fatigue. Summary of the Invention

[0008] In view of the above background, the purpose of this invention is to improve the processing of samples using nanomanipulators.

[0009] Therefore, a method, particularly a computer-implemented method, is proposed for processing samples using a nanomanipulator. The nanomanipulator includes a tip for processing the sample and a positioning unit for moving the tip. The method includes the following steps:

[0010] -Focus the image provided by the image recording device onto the tip and / or the sample;

[0011] - Select the sample or the tip as the target feature; and

[0012] - The focus of the nanomanipulator is automatically set based on at least one operating parameter of the sample stage and the positioning unit, wherein the at least one operating parameter indicates the vertical movement of the sample stage and / or the positioning unit, respectively, so as to keep the target feature focused within the image provided by the image recording device during processing.

[0013] Selectively, when the tip contacts the sample, the image provided by the image recording device is focused on the tip and the sample.

[0014] Selectively, the operator of the nanomanipulator selects the target feature via a human-machine interface.

[0015] Selectively, when the sample is selected as the target feature, the focus is automatically set based on the z-value indicating the vertical position of the sample carrier; and when the tip is selected as the target feature, the focus is automatically set based on the z-value indicating the vertical position of the positioning unit.

[0016] Optionally, this method further includes switching the target feature from the sample to the tip or vice versa, while the tip does not contact the sample.

[0017] Optionally, this method further includes setting the focus of the nanomanipulator based on at least one operating parameter of the corresponding other in the sample stage and the positioning unit after switching the target feature.

[0018] Selectively, the target features can be switched by the operator of the nanomanipulator via a human-machine interface.

[0019] Selectively, the target feature repeatedly switches between the sample and the tip, and the method further includes displaying a first image and a second image simultaneously or alternately and / or in a strobe manner. When the focus is set based on at least one operating parameter of one of the sample carriers, the image recording device provides the first image such that the sample is focused within the first image. When the focus is set based on at least one operating parameter of one of the positioning units, the image recording device provides the second image such that the tip is focused within the second image.

[0020] The above method can be used to track particles to be removed from a sample. The above uses include: focusing an image provided by an image recording device when the tip of the nanomanipulator contacts a particle located on the surface of the sample; selecting the tip as a target feature; and visually verifying whether the tip lifts the particle from the surface of the sample by vertically manipulating the sample stage and / or the positioning unit while keeping the tip focused within the image provided by the image recording device during processing.

[0021] Optionally, the above uses further include: focusing the image provided by the image recording device onto the tip to determine the initial horizontal position of the tip before it contacts the sample; focusing the image provided by the image recording device onto the sample to provide the initial horizontal position of the sample before it contacts the sample; and bringing the tip into contact with the particle by operating the sample stage and / or the positioning unit in a vertical direction, and / or aligning the tip and the sample in a horizontal direction.

[0022] The above method can also be used to follow a replacement tip during a tip replacement procedure, comprising: focusing the image provided by the image recording device onto a tip replacement mask carrying one or more replacement tips; selecting the tip replacement mask as a target feature; and vertically aligning the target tip located on the tip replacement mask in the central region of the image, with the focus of the nanomanipulator set on the tip replacement mask.

[0023] Optionally, the above uses further include: attaching the target tip to the positioning unit; selecting the target tip as a targeted feature; and lifting the target tip attached to the positioning unit from the tip replacement mask while setting the focus of the nanomanipulator on the target tip.

[0024] According to another aspect, a computer-implemented method is proposed for processing a sample using a nanomanipulator. The nanomanipulator includes a measuring tip for processing the sample and a positioning unit for moving the measuring tip. The method includes the following steps:

[0025] a) Provide allowable value ranges for two or more parameters of the nanomanipulator and / or the sample, wherein the two or more parameters span a multidimensional parameter space;

[0026] b) Determine the allowed region in the multidimensional parameter space based on the allowed value range provided by the two or more parameters;

[0027] c) Receive the current values ​​of the two or more parameters and / or determine the future values ​​of the two or more parameters;

[0028] d) Determine whether the state point corresponding to the current value and / or the future value of the two or more parameters in the multidimensional parameter space is outside the allowed region; and

[0029] e) If it is determined that the state point is outside the permitted area, control the positioning unit to stop the movement of the measuring tip and / or to retract the measuring tip relative to the sample.

[0030] This method enables the automatic and simultaneous monitoring of multiple parameters of a nanomanipulator and / or a sample (e.g., process parameters of the nanomanipulator and / or properties of the sample). In particular, the parameters are monitored fully automatically, i.e., without user intervention. For example, control equipment is used to monitor the parameters.

[0031] This method involves determining an allowable region in a multidimensional parameter space spanned by multiple monitored parameters. The allowable region is determined, for example, by a control device. The allowable region is defined such that, for state points within the allowable region, damage to the sample and / or the nanomanipulator's function and / or damage to the nanomanipulator (e.g., a measuring tip, cantilever, or other component of the nanomanipulator) is prevented. The method involves, for example, checking, via a control device, whether the current and / or future state points of the system containing the nanomanipulator and the sample, with respect to the monitored parameters, are located within or outside the allowable region. If the current and / or future state points are outside the allowable region, safety measures for protecting the sample and / or the nanomanipulator are automatically activated, for example, via the control device. Specifically, movement of the measuring tip (e.g., lateral movement, and / or movement in a plane parallel to the main extension plane of the sample and / or approaching movement of the measuring tip relative to the sample) and / or retraction of the measuring tip relative to the sample (e.g., removal from the sample).

[0032] Stopping the movement of the measuring tip (e.g., lateral movement and / or approaching movement along the sample direction) prevents penetration into prohibited regions in the multidimensional parameter space. For example, the multidimensional parameter space may include forces on the measuring tip perpendicular to the sample surface and forces on the measuring tip parallel to the sample surface. Stopping the movement of the measuring tip prevents, for example, penetration into prohibited regions where unacceptably high forces are applied to the measuring tip perpendicular to and / or parallel to the sample surface. For example, the multidimensional parameter space may also additionally or alternatively include the position of the measuring tip relative to the sample (e.g., lateral position and / or distance from the sample). Stopping the movement of the measuring tip (e.g., lateral movement and / or approaching movement along the sample) prevents, for example, harmful interactions with the sample structure (e.g., collisions).

[0033] Retracting the measuring tip relative to the sample, i.e., moving the measuring tip perpendicular to the sample and away from the sample, enables the termination of contact between the measuring tip and the sample and / or increases the distance between the measuring tip and the sample.

[0034] The defined permissible region in the multidimensional parameter space is the region where samples can be safely handled and nanomanipulated using nanomanipulators.

[0035] The sample is, for example, a photolithographic mask having a structure (e.g., an absorber structure). The structural dimensions of said structure are, for example, in the range of 10 nm to 10 μm. These structures are, for example, configured in structural patterns for generating specific types of semiconductor chips. The sample can be, for example, a transmission photolithographic mask for deep ultraviolet (DUV) lithography (operating light wavelength in the range of 30 to 250 nm) or a reflection photolithographic mask for extreme ultraviolet (EUV) lithography (operating light wavelength in the range of 1 to 30 nm, particularly 13.5 nm).

[0036] Samples can also be microelectronic components, such as, for example, integrated circuits, especially central processing units (CPUs), graphics processing units (GPUs), random access memory (RAM), flash memory, etc.

[0037] Nanomanipulators (e.g., atomic force microscopes and / or upper-level devices containing nanomanipulators) include, for example, a sample stage device with a mounting base; a sample stage for placing a sample, which is movably configured on the mounting base; and additional positioning units for moving the sample stage relative to the mounting base. The sample stage can be moved, for example, by means of the additional positioning units, along the x- and y-directions (i.e., laterally) and / or the z-direction (vertically). The sample stage can also be rotatably mounted on the mounting base, for example, so that it can be rotated about the x, y, and / or z-directions using the additional positioning units. The sample stage specifically includes a surface for placing the sample.

[0038] Nanomanipulators (e.g., atomic force microscopes) include, for example, cantilevers on which measurement tips are configured and / or fixed. The cantilever and measurement tip can also be implemented as a single unit. The term "cantilever" also appears as "Cantilever" in German texts. The measurement tip, for example, has a length in the range of 0.5 μm to 1 mm and a diameter in the range of 20 nm to 1 μm. In particular, the measurement tip may taper towards its free end. The measurement tip comprises, for example, materials containing carbon, silicon, one or more noble metals, tungsten, platinum, iridium, and / or platinum-iridium alloys. The measurement tip allows for targeted movement to individual locations on the sample surface, especially even if the sample has a structure with a high aspect ratio. The aspect ratio can be defined, for example, as the ratio of the width to the height of the structure. An example of a structure with a high aspect ratio of 1:10 is a narrow, deep trench, for example, 1 μm wide and 10 μm deep.

[0039] This measuring tip is specifically configured for measurement and manipulation (measuring and manipulating tip).

[0040] The nanomanipulator includes a positioning unit on which a cantilever is movably mounted, enabling the cantilever to move relative to the positioning unit in three spatial directions (translational movement in the three spatial directions). These three spatial directions specifically span three-dimensional space. The positioning unit is, for example, fixed to the housing of the nanomanipulator and / or to an upper device containing the nanomanipulator.

[0041] The cantilever is particularly elongated in shape with a longitudinal axis. Furthermore, the cantilever is movably fixed to a positioning unit at its first end relative to its longitudinal axis. Using this positioning unit, the position of the first end of the cantilever (also called the base point or base end of the cantilever) can therefore be set in three spatial directions. Furthermore, the cantilever has a measuring tip at its second end relative to its longitudinal axis.

[0042] If the measuring tip approaches the sample surface, an interaction occurs between the tip and the surface. This interaction can be based on direct contact, van der Waals interactions, or further physical interactions and combinations thereof. By moving the measuring tip across the sample surface (scanning), a three-dimensional image of the sample surface can be acquired. In this case, for example, for each scan position, the distance between the measuring tip and the sample surface is kept constant by a closed-loop control circuit, and the position of a microactuator used to set the distance is acquired.

[0043] Specifically, particles are foreign matter, such as dust or dirt, deposited on the sample surface. They can also be described as particles adsorbed onto the sample surface. Particles adsorbed on the sample surface can have different compositions and shapes. Particle size can be considered, for example, in the range of 3 nm–50 μm and / or 10 nm–1 μm.

[0044] Such particles can be located on a sample surface, for example, using optical analysis methods, and approached in a targeted manner by a measuring tip. In order to pick up the particles with the measuring tip, the particles must be separated from the sample surface. This means that the forces acting between the sample surface and the particles must be overcome. The strength of the bond between the particles and the sample surface depends on the shape and composition of the particles, as well as the composition of the sample surface, particularly its surface energy. The greater the surface energy, the stronger the particle adsorption.

[0045] To pick up particles with a measuring tip, for example, the measuring tip is brought into contact with the particles. If the attractive force of the measuring tip is greater than the attractive force of the sample surface, the particles can be separated from the sample surface and picked up by the measuring tip.

[0046] Firstly, using a measuring tip to move particles on the sample surface can help break the existing bond between the particles and the sample surface. This can, for example, reduce the binding energy associated with the particle-surface bond. Furthermore, the contact area between the measuring tip and the particles can be increased, for example. If the contact area between the particles and the measuring tip increases, the likelihood that the particles will adhere to the measuring tip and be able to detach from the sample surface increases.

[0047] After the particles are picked up by the measurement tip, they must be removed again to allow continued use of the measurement tip. In this case, the particles should be deposited specifically in undisturbed locations on the sample surface, or on individual deposition cells.

[0048] The nanomanipulator may be part of an upper-level device for processing samples, which includes the nanomanipulator. The upper-level device for processing samples may also include, for example, control devices for performing the proposed method. Furthermore, the upper-level device for processing samples may also include, for example, image recording devices for recording images of the samples, such as scanning electron microscopes and / or scanning ion microscopes.

[0049] To safely handle samples using nanomanipulators, parameters of the nanomanipulator and / or the sample are monitored, such as, for example, the process parameters of the nanomanipulator and the characteristics of the sample. For this purpose, a control device (e.g., the nanomanipulator and / or upper-level device) receives, for example, current values ​​of two or more of these parameters. The control device may also be configured, for example, to determine (i.e., predict) future values ​​of two or more of these parameters based on stored information and / or received information.

[0050] Receiving current values ​​of two or more parameters and / or determining future values ​​occurs especially during sample processing with a measurement tip.

[0051] Furthermore, this method relates to providing permissible value ranges for the two or more parameters. These permissible value ranges are, for example, predetermined permissible value ranges stored in the storage device of the control device and / or received by the control device. In particular, the permissible value ranges for the two or more parameters are, in each case, one-dimensional value ranges. For example, if one of the monitored parameters is a force on a measuring tip perpendicular to the sample surface, then the permissible value range is, for example, from zero force to a force F perpendicular to the sample surface. max The maximum permissible absolute value, and / or the range of the maximum permissible positive or negative force perpendicular to the sample surface.

[0052] For example, the allowable region can be calculated based on the allowable range of two or more parameters and a calculation based on the probability of sample damage (damage probability). In this case, the damage probability is highly non-linearly related to the parameters.

[0053] Two or more monitoring parameters span a multidimensional parameter space, such that a number of n parameters span an n-dimensional parameter space, where n is a natural number greater than or equal to 2.

[0054] The allowed region is specifically a multidimensional allowed region. The allowed region, for example, has the same dimensions as the multidimensional parameter space spanned by the monitored parameters.

[0055] If, for example, four parameters are monitored (n=4), then a four-dimensional parameter space is therefore considered. Furthermore, in this case, the allowed region is, for example, the allowed four-dimensional region in the four-dimensional parameter space.

[0056] The permitted area is determined, for example, based on the range of permissible values ​​provided for two or more monitoring parameters, such that for each monitoring parameter, its associated (one-dimensional) range of permissible values ​​is taken into account.

[0057] Based on the received current values ​​and / or determined future values ​​of two or more parameters, the current and / or future state points of a system containing nanomanipulators and samples are thus determined in a multidimensional parameter space. Given a number of n monitoring parameters spanning an n-dimensional monitoring parameter space, the current and / or future state points are points in this n-dimensional space provided by a number of n coordinates (e.g., uniquely defined).

[0058] By determining whether the current and / or future state points are within the allowed region of the n-dimensional parameter space, and automatically activating countermeasures if the current and / or future state points are outside the allowed region, sample processing using nanomanipulators can be simplified for users.

[0059] In an embodiment, step e) may also be performed based on the duration of stay outside the permitted area (e.g., in a warning area and / or a prohibited area).

[0060] For example, the movement of the measuring tip can be stopped and / or the measuring tip can be withdrawn perpendicular to the sample, only if a predetermined dwell time is determined to be used outside the permitted area. The length of the permitted dwell time may vary for different areas outside the permitted area (e.g., warning area, prohibited area). Specifically, the predetermined first dwell time in the warning area may be longer (e.g., 1 second) than the predetermined second dwell time in the prohibited area (e.g., 0.01 seconds).

[0061] According to one embodiment, future values ​​of two or more parameters are predicted based on received user input and / or based on a determined offset movement of the measuring tip relative to the sample.

[0062] Therefore, the future values ​​of two or more monitored parameters can be determined (i.e., predicted) based on received user input. User input is implemented, for example, using a human-machine interface (HMI), such as a keyboard, mouse pointer, joystick, game controller, touchscreen, etc. By determining the future values ​​of the two or more monitored parameters based on received user input, the target position of the measurement tip, input by the user through the HMI, can be checked relative to the monitored parameters. If executing the user input would leave an allowable area defined in the multidimensional parameter space, then, for example, the movement of the measurement tip can be stopped and the user input cannot be executed or can only be partially executed. Alternatively, the measurement tip can be withdrawn relative to the sample such that the distance between the measurement tip and the sample surface is large enough not to affect the execution of the user input.

[0063] For example, the future values ​​of two or more monitored parameters can be determined (i.e., predicted) based on the determined offset movement of the measuring tip relative to the sample. Thus, offset monitoring (referred to as offset protection) is possible, for example, even without user input. Such offset movement of the measuring tip relative to the sample is known to occur due to thermal offset (e.g., heating of the measuring tip and / or cantilever) or due to electrifying the sample surface using particle beam treatment (e.g., imaging via scanning electron microscopy), thus increasing the force between the measuring tip and the sample, leading to offset. So-called "subsequent creeping" is also known as the movement of the measuring tip to a specific location on the sample.

[0064] The offset movement of the measurement tip relative to the sample can be determined, for example, through image processing of a repeating image record of the sample, which acquires the measurement tip and the structure and / or markings of the sample (e.g., offset markings). If further offset movement would result in the leaving of an allowable area in the multidimensional monitoring parameter space, then the movement of the measurement tip can be stopped and / or the measurement tip can be withdrawn from the sample.

[0065] According to yet another embodiment, the method includes:

[0066] For these two or more parameters, determine the warning region in the multidimensional parameter space;

[0067] Determine whether the current and / or future state point in the multidimensional parameter space is located within the determined warning region; and

[0068] The positioning unit is controlled to decelerate the movement of the measuring tip, and / or the human-machine interface is controlled to output a warning when the current and / or future state point is determined to be within the determined warning area.

[0069] By defining warning zones, a buffer can be provided between the allowed and prohibited regions in the parameter space of the monitored parameter. Therefore, a warning can be issued to the user or the control parameters of the nanomanipulator can be altered before reaching the prohibited region, such as slowing down the movement of the measuring tip.

[0070] For example, the method involves providing (e.g., reading from and / or receiving from a storage unit) a (e.g., predetermined) range of warning values ​​for two or more parameters, and determining a multidimensional warning region based on the provided range of warning values.

[0071] Alternatively, multidimensional warning zones can be determined (e.g., calculated) based on the identified allowable zones. For example, for all monitored parameters, the core range (e.g., 90%) of the provided allowable value range can be used to determine the allowable multidimensional zone. Furthermore, for example, for all monitored parameters, the marginal range (e.g., the remaining 10%) of the provided allowable value range can be used to determine the multidimensional warning zone.

[0072] For example, warning and / or prohibited areas can be determined based on calculations of the probability of damage to samples and / or nanomanipulators for specific parameter values. This probability of damage may depend on the parameter values ​​non-linearly to a large extent.

[0073] The warning region is specifically a multi-dimensional warning region. The size of the warning region is, for example, equivalent to the size of the allowed region and the size of the monitored parameter space.

[0074] A warning region is, for example, a region adjacent to a permitted region. A warning region is, for example, configured between permitted and prohibited regions. For example, a warning region may (e.g., completely) surround a permitted region in a multidimensional parameter space.

[0075] In an embodiment, if it is determined that the current and / or future state point is located within the determined warning area, the positioning unit of the nanomanipulator can also be controlled to move the state point of the monitored parameter from the warning area back to the allowed area.

[0076] According to another embodiment, the allowed region, the warning region, and / or prohibited region of the multidimensional parameter space have discrete restrictions or are continuously merged with each other.

[0077] When permitted, warning, and / or prohibited zones are continuously merged, a stepless, variable safety map (damage probability map) can therefore be defined in a multidimensional parameter space. For example, permitted, warning, and / or prohibited zones can be determined based on calculations of the damage probability of samples and / or measurement tips. For example, the damage probability at each state point in the multidimensional parameter space, or the safety level of the measurement tip and / or the undamaged samples at each state point in the multidimensional parameter space, can be calculated, thus determining the damage probability map or safety map. The damage probability at a state point can, in particular, be highly nonlinearly dependent on the values ​​of the monitored parameters.

[0078] When permitted areas, warning areas, and / or prohibited areas are consecutively merged, step e) can be selectively executed based on the penetration depth into the warning area. For example, in step e), the speed at which the measuring tip is withdrawn from the sample can be greater, and the current state point can travel a greater distance from the permitted area into the warning area.

[0079] Prohibited areas, especially multidimensional prohibited areas.

[0080] According to yet another embodiment, the nanomanipulator includes a cantilever movably fixed to the positioning unit at its base end, with the measuring tip disposed at the free end of the cantilever. Furthermore, two or more parameters of the nanomanipulator and / or the sample include:

[0081] The position of the base end of the cantilever relative to the positioning unit;

[0082] The velocity of the base end of the cantilever relative to the positioning unit;

[0083] The free end of the cantilever is configured to deflect along the z-direction perpendicular to the sample;

[0084] The free end of the cantilever rotates about the x-direction, which is configured perpendicular to the z-direction;

[0085] The bending of the measuring tip relative to the cantilever; and / or

[0086] The location data of the structure of this sample.

[0087] Therefore, it is possible to effectively monitor the multidimensional, complex parameter space related to the process parameters of nanomanipulators (e.g., atomic force microscopes) and / or samples.

[0088] In particular, the following data are collected (e.g., measured): the position of the base of the cantilever relative to the positioning unit (e.g., in three spatial directions across three-dimensional space), the velocity of the base of the cantilever relative to the positioning unit (e.g., in three spatial directions), the deflection of the cantilever at its free end along the z-direction (e.g., the degree of deflection), the rotation of the cantilever at its free end about the x-direction (e.g., the degree of rotation), and / or the bending of the tip relative to the cantilever (e.g., the degree of bending).

[0089] The position and velocity of the cantilever's base relative to the positioning unit can be set, in particular, by controlling the positioning unit. Furthermore, the current values ​​of the cantilever's base position and velocity relative to the positioning unit are, for example, provided by the positioning unit.

[0090] The deflection of the free end of the cantilever along the z-direction is caused by the force acting between the measuring tip and the sample. Furthermore, the deflection of the free end of the cantilever along the z-direction is proportional to the spring constant of the cantilever. In particular, the cantilever bends to varying degrees during sample scanning depending on the force acting between the measuring tip and the sample. For example, the degree of bending or deflection of the free end of the cantilever along the z-direction can be acquired using a light pointer device. This light pointer device is included, for example, in nanomanipulation devices (e.g., atomic force microscopes and / or upper-level devices containing nanomanipulation devices).

[0091] The parameters of the nanomanipulator may also include, for example, the deflection of the free end of the cantilever in a direction that is 30° or less, 20° or less, 10° or less, 5° or less, 3° or less, and / or 1° or less away from the z-direction (the direction perpendicular to the sample).

[0092] A light pointer device includes, for example, a laser source and a position-sensitive photodetector. A laser beam emitted from the laser source is guided to the free end of the cantilever and reflected from it at the undeflected position of the cantilever to the center of the position-sensitive photodetector. The photodetector is subdivided into, for example, four regions: "upper left," "upper right," "lower left," and "lower right." If the bending (deflection) of the cantilever changes, the reflected laser spot moves on the photodetector, just as in the case of a light pointer. By measuring the intensity of the four regions of the photodetector, vertical and horizontal bending signals proportional to the normal and lateral forces, respectively, can be determined.

[0093] The z-direction is configured, for example, perpendicular to the main extension plane of the sample.

[0094] The force acting between the measuring tip and the sample also causes the free end of the cantilever to rotate (torse) about the x-direction. This can also be achieved using the optical pointer device described.

[0095] Furthermore, due to the interaction between the measuring tip and the sample, bending (i.e., elastic deformation) of the measuring tip relative to the cantilever may occur (e.g., lateral movement of the measuring tip when it comes into contact with the sample). The degree of bending of the measuring tip relative to the cantilever can be determined by image processing of recorded images of the measuring tip (e.g., scanning electron microscope images, scanning ion microscope images).

[0096] In an embodiment, the positioning unit may further include a fixed positioning component (e.g., fixed to the housing of the nanomanipulator) and a positioning component movable relative to the fixed positioning component, with the base end of the cantilever fixedly mounted on the positioning component. The position of the base end of the cantilever can then be moved together with the movable positioning component of the positioning unit. Furthermore, the position of the base end of the cantilever, combined with the movable positioning component's movable position relative to the fixed positioning component, may also be considered. In this case, two or more parameters of the nanomanipulator include, for example, the position of the base end of the cantilever relative to the fixed positioning component of the positioning unit, and / or the velocity of the base end of the cantilever relative to the fixed positioning component of the positioning unit.

[0097] Two or more parameters of the nanomanipulator may additionally or alternatively include the spring constant of the cantilever, the opening angle of the measuring tip, and / or the length of the measuring tip.

[0098] According to yet another embodiment, the method further includes:

[0099] Receive images of at least a portion of the sample recorded by a scanning electron microscope.

[0100] The two or more parameters of the nanomanipulator and / or the sample include the amount of charge at the surface of the sample.

[0101] Therefore, it is possible to simultaneously monitor the charge accumulation caused by high-energy electron beams on the sample surface in a multidimensional parameter space.

[0102] In particular, scanning electron microscopy is typically used to monitor the removal of particles from a sample by nanomanipulators, which results in the aforementioned high electron beam dose on the sample surface.

[0103] In an embodiment, if the current and / or future value of the amount of charge on the sample surface is determined to be outside the permissible range of the amount of charge on the sample surface, the scanning electron microscope is controlled to stop recording an image of at least a portion of the sample.

[0104] In an embodiment, if it is determined that the current and / or future value of the charge on the sample surface is outside the allowable range of the charge on the sample surface, the human-machine interface is controlled to output a request for the user to perform a discharge process on the sample surface (e.g., via a plasma source).

[0105] According to yet another embodiment, providing the allowable value range for the two or more parameters includes providing and / or determining location data for the structure of the sample.

[0106] The structure of the sample is, for example, the absorber structure of a photolithographic mask.

[0107] The primary extension plane of the sample is, for example, the xy-plane. The location data of the sample structure is defined, for example, as a range of prohibited values ​​related to the x- and y-positions in the xy-plane. For instance, the xy-positions on the sample surface where a structure exists are prohibited regions. For example, the xy-positions on the sample surface where the edge of a structure exists are prohibited regions. Therefore, the xy-positions on the sample surface where no structure exists are permitted regions or permitted and (near the corresponding structure edge) warning regions.

[0108] According to yet another embodiment, the location data for determining the structure of the sample includes:

[0109] Receive at least a portion of one or more images of the sample, and

[0110] The location data of the structure in the sample is determined by image analysis of the received one or more images and / or by edge recognition of the edges of the structure in the received one or more images.

[0111] In particular, one or more images of the sample are received from an image recording device (e.g., a scanning electron microscope and / or a scanning ion microscope).

[0112] According to yet another embodiment, the location data for determining the structure of the sample includes:

[0113] Receive an image of at least a portion of the sample, wherein the image captures a defect-free region having a first portion of the structure and a defective region having at least one defect and a second portion of the structure, and wherein the geometry of the first portion of the structure corresponds to (e.g., matches) the geometry of the second portion of the structure;

[0114] The geometry of the first portion of the structure in the defect-free region is determined through image analysis; and

[0115] Based on the determined geometry of the first part of the structure in the defect-free region, the location data of the second part of the structure in the defective region is determined.

[0116] Therefore, structural identification and location data determination can be advantageously performed within defect-free areas of the sample. This allows for more accurate determination of structural location data.

[0117] Defects can be, for example, particles (e.g., foreign objects).

[0118] According to yet another embodiment, the method includes:

[0119] Receive at least a portion of the image of the sample;

[0120] Control the display device to present the image;

[0121] Receive the target position of the measuring tip in the image, the target position being input by the user through a graphical user interface; and

[0122] The positioning unit is fully automated to move the measuring tip to the target position.

[0123] Therefore, users can simply select (e.g., click) the target location in the recorded image through a graphical user interface (e.g., a mouse pointer), and then the measuring tip will automatically move to that target location.

[0124] In this case, image processing functions, such as pattern recognition, can be used to determine the measuring tip and its position in the recorded image. Alternatively, the method described in US 7,675,300 B2 can be used to identify the measuring tip and determine its position.

[0125] For example, it can also record and receive multiple images of at least a portion of a sample. Images can be recorded at high speed (video mode) and image processing can be performed in real time.

[0126] According to yet another embodiment, the method includes:

[0127] Determine whether the duration since receiving the last user input exceeds a threshold; and

[0128] If the duration after receiving the last user input exceeds the threshold, the positioning unit is automatically controlled to move the measuring tip to the determined allowable area in the multidimensional parameter space.

[0129] Therefore, a safety switch is provided. In particular, it prevents the system from entering warning and / or prohibited areas.

[0130] The permitted area (safe area) is obtained, for example, by: (i) initiating z-feedback, and thus keeping the force between the measuring tip and the sample constant at low forces; (ii) withdrawing the measuring tip from the sample with fine adjustments (e.g., a few micrometers); (iii) withdrawing the measuring tip from the sample with coarse adjustments (e.g., 100 micrometers); and / or (iv) moving the sample stage away from the measuring tip (e.g., a few millimeters).

[0131] According to yet another embodiment, the method includes:

[0132] Receive multiple images of at least a portion of the sample, wherein the images acquire the structure and / or markings of the sample and the measuring tip; and

[0133] Image analysis of the received images determines the offset movement of the measuring tip relative to the structure and / or the mark of the sample; and / or

[0134] The offset correction is determined based on the determined offset shift and / or predetermined model data; and

[0135] The positioning unit is fully automated to move the measuring tip according to the determined offset correction.

[0136] Therefore, offset movement caused by thermal displacement and / or charging of the sample surface can be corrected automatically without user control.

[0137] This tag is, for example, the offset tag of the sample.

[0138] The model data in the case of hot offset includes, for example, a linear model with a constant offset rate.

[0139] According to yet another embodiment, the method includes:

[0140] The image recording device is controlled to record a first image of the defective portion of the sample, the first image capturing a first structure of the sample and one or more defects of the sample;

[0141] The image recording device is controlled to record a second image of the defect-free portion of the sample, the second image capturing a second structure of the sample whose geometry corresponds to the geometry of the first structure in the first image;

[0142] The difference image is determined by subtracting the second image from the first image;

[0143] Image analysis based on the difference image determines the location data of the one or more defects acquired in the first image; and

[0144] The image recording device is controlled to record a third image of the defective portion of the sample, wherein the one or more defects captured in the first image are positioned at a predetermined location in the image (e.g., at the center of the image).

[0145] The sample is, for example, a microlithography mask. The sample contains, for example, a structural pattern used to generate a specific type of semiconductor chip (die). This structural pattern is repeated multiple times on the lithography mask, for example, to generate multiple semiconductor chips (dies) of the same type using the same lithography mask. For instance, a first structure in a first image is used to generate a first semiconductor chip, and a second structure in a second image is used to generate a second semiconductor chip of the same type. Because the first and second structures correspond to each other, they are eliminated when the difference image is determined ("D2D" stands for die-to-die), so that the difference image contains no structure and images the defect using higher contrast. Therefore, the location of the defect can be determined more accurately based on the difference image. Furthermore, by determining the defect location very precisely, a third image centered on the defect (e.g., a particle) can be recorded fully automatically. This facilitates further processing by the user.

[0146] Image recording devices, for example, are scanning electron microscopes.

[0147] For example, before controlling the image recording device to record the first and second images, “coarse” location data of one or more defects (e.g., particles) in the sample is provided. Furthermore, starting from this “coarse” location data, more accurate location data of one or more defects (e.g., particles) in the sample is determined through the method steps proposed according to this embodiment, particularly more accurate than the “coarse” initial location data.

[0148] Determining a difference image by subtracting a second image from a first image involves, for example, mathematically subtracting the second image from the first image. For instance, the first and second images each contain a two-dimensional arrangement of pixels and an intensity value assigned to each pixel. For example, the first and second images contain the same number of pixels and the same pixel arrangement. In the process of mathematically subtracting the second image from the first image, for example, for each pixel in the first image, the intensity value of the corresponding pixel in the second image is subtracted (eliminated) from the intensity value assigned to that pixel in the first image. The difference between the two intensity values ​​produces the intensity value of the corresponding pixel in the difference image. The difference image specifically contains the same number of pixels and the same pixel arrangement relative to the first and second images.

[0149] Furthermore, determining the difference image based on subtracting the second image from the first image may also include, for example, generating an image extract from the first and / or second images, image registration of the first and second images, and / or applying image filtering to the first and / or second images.

[0150] In an embodiment, the method includes:

[0151] Control the image recording device to record one or more first images of at least a portion of a sample, wherein a reference structure and one or more defects of the sample are captured;

[0152] Image analysis is used to determine the location data of one or more defects relative to a reference structure, acquired in one or more first images; and

[0153] The image recording device is controlled to record one or more second images of at least a portion of a sample, wherein one or more defects acquired in the first image are configured in the image at a predetermined position relative to a reference structure (e.g., at the center of the image).

[0154] Therefore, during the repeated recording of images, defects (such as particles) can be automatically kept in a predetermined position in the image (such as the image center) (in short: particle tracking).

[0155] According to another embodiment, the nanomanipulator includes a cantilever mounted at a fixed angle at a first end to the positioning unit, and the measurement tip positioned at a second end of the cantilever. The sample is positioned on a rotatable sample carrier stage. The method includes:

[0156] Receive an image of at least a portion of the sample, wherein the image captures the structure and defects of the sample;

[0157] Determine the approach angle of the measuring tip to address the defect, such that the approach path using this angle is not limited by the structure of the sample; and

[0158] The sample carrier stage is controlled to rotate based on the determined approach angle, such that the fixed angle of the measuring tip corresponds to the approach angle.

[0159] Therefore, an angle can be set between the measuring tip and the sample that is advantageous for handling defects.

[0160] In particular, the approach angle for measuring the tip to handle defects is determined here, such that the linear approach path with this approach angle is without sample structure.

[0161] The approach path is, for example, a removal trajectory and / or part of a removal trajectory used to remove particles (e.g., defects). The approach path is, for example, arranged in the xy-plane, configured, for example, parallel to the main extension plane of the sample. The approach path is, for example, a linear approach path. For example, the approach angle is also located in the xy-plane. The approach angle is specifically the angle between a first straight line parallel to the longitudinal direction of the cantilever and a second straight line parallel to the approach path. For example, the fixing angle of the cantilever to the positioning unit is also located in the xy-plane.

[0162] Specifically, the nanomanipulator includes a sample stage device with a mounting base, a sample stage movably configured on the mounting base, and an additional positioning unit for moving the sample stage relative to the mounting base. Furthermore, the additional positioning unit is controlled to rotate the sample stage with the sample relative to the mounting base based on a determined approach angle, such that a fixed angle of the measuring tip corresponds to the approach angle.

[0163] In particular, the sample carrier stage is mounted on a mounting base and can rotate around the z-direction.

[0164] In one embodiment, the nanomanipulator includes a cantilever mounted at a fixed angle to a positioning unit at its first end and a measurement tip disposed at its second end. Additionally, the sample is positioned on a rotatable sample support stage. Furthermore, the method includes:

[0165] Receive an image of at least a portion of the sample, wherein the image captures the structure and particles of the sample;

[0166] A linear removal trajectory for the particles is determined based on the received image to remove the particles, such that the removal trajectory intersects with the particles, the length of the removal trajectory is greater than the size of the particles, and the removal trajectory has no sample structure; and

[0167] The sample stage is controlled to rotate based on the determined removal trajectory, such that the fixed angle of the measurement tip is configured perpendicular to the removal trajectory.

[0168] Therefore, particles can be removed along a trajectory configured to be parallel to the direction in which lateral forces can be collected.

[0169] For example, a removal trajectory may be determined such that, on one side of the particle, the removal trajectory protrudes beyond twice the particle size. Alternatively or additionally, for example, a removal trajectory may be determined such that, on the other side of the particle, the removal trajectory protrudes beyond 1.5 times the diameter of the particle measuring tip.

[0170] Remove trajectories, such as those in the xy-plane.

[0171] In an embodiment, the method includes:

[0172] Receive an image of at least a portion of the sample acquired at the measuring tip;

[0173] Control the display device to present the received image;

[0174] Receive user input from the user to change the imaging ratio of the presented image; and

[0175] The positioning unit controls the nanomanipulator to automatically change the speed of the measuring tip according to the imaging scale.

[0176] If the measuring tip is operated at a constant speed and the user magnifies the recorded image (e.g., a scanned electronic image) (i.e., magnifies the imaging scale), the perceived movement of the measuring tip in the recorded image may be too high for convenient use with a mouse pointer, joystick, or equivalent graphical user interface (GUI) tool. Since, in practice, according to this embodiment, the speed of the measuring tip is automatically set as a function of the imaging scale (i.e., the magnification of the presented image), this activity is unnecessary for the user.

[0177] In an embodiment, the method includes:

[0178] Receive user input that identifies the start of macro creation and defines the macro control parameters used for macro creation;

[0179] It receives multiple macro user inputs for controlling the positioning units of the nanomanipulator to move the measurement tip;

[0180] Receive user input indicating the end of macro creation; and

[0181] Store macro control parameters and macro user inputs assigned to macro control parameters.

[0182] In one example of macro creation, receiving multiple macro user inputs includes receiving user input for lateral movement of the measurement tip and receiving user input for retracting the measurement tip perpendicular to the sample (shift and lift movement, "move and lift"). Thus, a move and lift macro can be created for a combination of lateral and perpendicular movement of the measurement tip away from the sample. By applying this move and lift macro, the user brings the measurement tip closer to the particles on the sample; the process of the measurement tip contacting the particles and lifting particles adhered to the measurement tip can be achieved through a single user input.

[0183] In one embodiment, the method includes receiving user input from a game controller as an example of a graphical user interface. The game controller includes, for example, a plurality of programmable buttons and joysticks. The game controller may also include an adaptive trigger that provides haptic feedback via a voice coil actuator, which can change the user's resistance as needed. For example, in this case, the optimal force between the measuring tip and the sample surface can be better set.

[0184] The game controller may include multiple inputs, such as analog joysticks, analog triggers, numeric buttons, directional buttons, and capacitive touchpads with click mechanisms (e.g., dual-impact). These inputs can be used for sample stage movement and measurement tip movement (e.g., adjusting speed via pressure-sensitive joysticks or buttons), and for controlling scanning electron microscopes (e.g., magnification, focusing, astigmatism correction, scanning strategy). Furthermore, the game controller can provide feedback to the user. For example, the game controller may vibrate if the deflection signal (e.g., cantilever deflection) reaches a limit. Additionally, a built-in light bar or a series of LEDs can be used to indicate various information, such as deflection signals, lateral signals, measurement tip limits, measurement tip status (approaching, folding, retracting), and leaving the permitted area.

[0185] Game controllers may also include gyroscopes and / or accelerometers. The data obtained from these devices can be used to determine if the user is fatigued and needs a rest.

[0186] The game controller may also include one or more microphone arrays and / or headphone connections (such as 3.5 mm stereo headphone connections). For example, these devices can provide sound feedback.

[0187] In one embodiment, the nanomanipulator includes a cantilever movably fixed to a positioning unit at its base end, wherein a measuring tip is disposed at the free end of the cantilever. Furthermore, the method includes:

[0188] Receive at least one scanning electron microscope image, which is at least partially acquired from the measurement tip and / or cantilever;

[0189] One or more characteristics of the measuring tip and / or cantilever are determined by image analysis of at least one received image; and

[0190] The type and / or state of the measuring tip are determined based on the defined characteristics of the measuring tip and / or cantilever.

[0191] When processing samples using nanomanipulators, various measurement tips are typically used. Furthermore, these tips can change with use, such as becoming worn or contaminated. The differences between different measurement tips are often so small that they cannot be detected with the naked eye or an optical microscope.

[0192] By recording at least one scanning electron microscope (SEM) image of the measuring tip and / or cantilever, an image with very high spatial resolution, and by processing the SEM image while still determining the type and / or condition of the measuring tip, it is possible to ensure that the correct type of measuring tip is used to process the sample and / or that the measuring tip is in the required condition (e.g., low wear). For example, it can be ensured that the correct type of measuring tip is used for a specific planned treatment of the sample and / or that the measuring tip is in the required condition for that specific planned treatment.

[0193] At least one of the received scanning electron microscope images may also selectively acquire at least a portion of the sample.

[0194] In an embodiment, one or more characteristics of the measuring tip and / or the cantilever include the geometry of the measuring tip, the outer contour of the measuring tip, the length of the measuring tip, the cone angle of the measuring tip, and / or the markings of the measuring tip and / or the cantilever.

[0195] In an embodiment, the type of the measuring tip includes the type of the manufacturer of the measuring tip.

[0196] In an embodiment, the condition of the measuring tip includes the degree of wear and / or contamination of the measuring tip.

[0197] In an embodiment, the cantilever includes markers, particularly identification markers and / or QR codes; determining one or more characteristics of the measuring tip and / or the cantilever includes acquiring the markers through image analysis of received images; and determining the type and / or state of the measuring tip includes decoding the markers.

[0198] For example, the markers are so small that they cannot be captured by the naked eye or an optical microscope. The size of the markers (particularly identification markers and / or QR codes) is, for example, 10 μm or less, 5 μm or less, 1 μm or less, and / or 0.1 μm or less. The structural dimensions of the marker structure (particularly identification markers and / or QR codes) are, for example, 1 μm or less, 0.1 μm or less, 50 nm or less, 30 nm or less, 20 mm or less, 10 mm or less, and / or 1 nm or less. For example, the pixel size of a QR code marker is 1 μm or less, 0.1 μm or less, 50 nm or less, 30 nm or less, 20 nm or less, 10 nm or less, and / or 1 nm or less.

[0199] The marker is positioned, for example, on a cantilever such that it does not interact with the laser beam of the light-pointing device of the nanomanipulator. The marker is positioned on the cantilever, for example, at a distance from the incident position and / or incident area of ​​the laser beam of the light-pointing device, where the laser beam is incident on the cantilever.

[0200] In an embodiment, the type and / or state of the measuring tip are determined based on characteristics determined by image analysis and based on predetermined data containing characteristics assigned to multiple different measuring tips.

[0201] For example, the type and / or condition of a measurement tip is determined by comparing characteristics identified through image analysis with predetermined data. The predetermined data may include, for example, a database. The predetermined data may contain data entries for multiple different measurement tips, for example, each possessing the specified characteristics of a corresponding measurement tip. The specified characteristics of a corresponding measurement tip may include, for example, the type of measurement tip, usage data of the measurement tip (e.g., unused / used, frequency and / or duration of previous use, date of first use), condition of the measurement tip (e.g., degree of wear, contamination, damage), X-ray data of the measurement tip (e.g., data captured using energy-dispersive X-ray spectroscopy (EDX)), and / or atomic force microscopy resonance characteristics of the measurement tip. The resonance curves relating to the atomic force microscopy resonance characteristics of the measurement tip may have, for example, a resonance frequency (i.e., the frequency of the highest and / or maximum oscillation amplitude), a quality factor (e.g., the width of the resonance curve), the maximum oscillation amplitude under constant excitation amplitude, and / or additional peaks appearing alongside the resonance peak.

[0202] In this embodiment, determining the type and / or state of the measurement tip based on the characteristics determined by image analysis and based on predetermined data involves determining whether the predetermined data includes data entries for a measurement tip acquired in the SEM image, or data entries for a measurement tip positioned on a cantilever (hereinafter referred to as: the acquired measurement tip) acquired in the SEM image. If it is determined that the predetermined data includes data entries for the acquired measurement tip, then, for example, the type and / or state of the acquired measurement tip is determined based on a comparison, between the determined characteristics of the acquired measurement tip and the corresponding data entry for the measurement tip in the predetermined data.

[0203] If it is determined that the predetermined data does not contain data entries for the acquired measuring tip, then, for example, data entries for similar measuring tips in the predetermined data are identified, such as those with the greatest commonality to the acquired measuring tip within a group of measuring tips contained in the predetermined data in the form of data entries. Then, for example, based on a comparison of the determined characteristics of the measuring tip with data entries identified as similar measuring tips in the predetermined data, the type and / or state of the acquired measuring tip is determined.

[0204] In one embodiment, the method includes fully automated setting of the process parameters of the nanomanipulator based on the determined type and / or state of the measuring tip.

[0205] Examples of fully automated process parameters set based on the determined type and / or state of the measuring tip include the speed of the measuring tip movement, withdrawing the measuring tip from the sample if it moves near the edge, retrieving the position of the lowest point of the measuring tip from the database, sharpening or replacing the measuring tip if it becomes contaminated and / or dull, and selectively monitoring the possible bending of the measuring tip based on its sharpness or dullness.

[0206] For example, for sharp measuring tips (e.g., those with a small radius of curvature at the tip and / or a small angle), the force between the measuring tip and the sample must not be chosen to be as high as that for blunt measuring tips (e.g., those with a large radius of curvature at the tip and / or a large angle). This is because a larger force is more likely to break a sharp measuring tip. Furthermore, a sharp tip may be more likely to damage the sample. To limit the force, the movement of the measuring tip toward the sample can be slowed down.

[0207] For example, when the measuring tip contacts the sample and is intended to move laterally upwards by one step, the force remains constant through the distance control loop. However, the force peak occurs directly at the step. If the sharp measuring tip moves near the edge, it can be withdrawn as a precaution.

[0208] For example, there exist measurement tips whose lowest point is not visible in SEM images. This is especially true for blunt measurement tips. If the location of the lowest point of the measurement tip is stored in a database, this information can be used to move to particles more accurately.

[0209] For example, if the measuring tip is contaminated or dulled, it is unsuitable for removing small particles. In this case, a further processing step can be introduced before the measuring tip picks up the particles, in which the measuring tip is sharpened or replaced for some other more suitable measuring tips.

[0210] For example, a very sharp and flexible measuring tip may temporarily bend during particle manipulation. This can be observed in SEM images. In cases where the measuring tip becomes blunt, this monitoring can be omitted.

[0211] In one embodiment, the method includes fully automatic control of the positioning unit to move the measuring tip based on a determined type and / or state of the measuring tip.

[0212] In one embodiment, the nanomanipulator includes a loading device comprising a plurality of measuring tips and / or cantilever arms on which the measuring tips are disposed, and the method includes:

[0213] Receive user input regarding particle removal strategies;

[0214] Receive predetermined data regarding the measuring tips available in the loading device;

[0215] Based on a particle removal strategy, data entries for the measurement tip are selected from the predetermined data; and

[0216] The loading device is controlled for:

[0217] The loading device automatically picks up a measuring tip and / or a cantilever with a measuring tip, the measuring tip corresponding to a data entry selected in predetermined data; and

[0218] Fix the picked-up measuring tip to the cantilever and / or fix the picked-up cantilever with the measuring tip to the positioning unit.

[0219] The predetermined data is received, for example, from the storage device and / or loading device of the nanomanipulator.

[0220] According to another aspect, a computer program product is proposed, which includes instructions that, when executed by at least one computer, cause the computer to perform the aforementioned method.

[0221] Computer program products, such as computer program tools, may be provided or supplied as storage media, such as memory cards, USB flash drives, CD-ROMs, DVDs, or in the form of files downloadable from a server on a network. For example, in a wireless communication network, this can be implemented by utilizing computer program products or computer program tools to transmit appropriate files.

[0222] According to another aspect, an apparatus for processing samples is provided. The apparatus includes:

[0223] The nanomanipulator includes a measurement tip for processing the sample and a positioning unit for moving the measurement tip, and

[0224] The control device is configured to implement the methods described above.

[0225] The corresponding unit (e.g., a control device) can be implemented based on hardware and / or software technologies. In the case of hardware-based implementation, the corresponding unit can be implemented as a device or part of a device, such as a computer or microprocessor. In the case of software-based implementation, the corresponding unit can be implemented as a computer program product, function, routine, part of program code, or executable object. Furthermore, the corresponding unit can also be implemented as part of the upper-level control system of a nanomanipulator.

[0226] In this context, "one" should not necessarily be understood as limited to only one element. On the contrary, multiple elements may be provided, such as, for example, two, three, or more. Any other numerical values ​​used herein should also not be construed as limited to the exact number of elements stated. Rather, unless otherwise stated, there may be upward and downward numerical deviations.

[0227] The embodiments and features described regarding the method can be adapted, with necessary modifications, to the proposed computer program and apparatus aspects, and vice versa. The described methods, computer programs, and apparatus aspects can be provided individually or in combination. For example, the two methods described above can be combined to form a new method.

[0228] Further possible implementations of the invention also cover combinations of features or embodiments not explicitly mentioned in the foregoing or following exemplary embodiments. In such cases, those skilled in the art will also add individual aspects as improvements or supplements to the corresponding basic form of the invention.

[0229] Further advantageous configurations and aspects of the invention are the subject of the dependent claims and the exemplary embodiments of the invention described below. The invention will now be explained in more detail based on preferred embodiments with reference to the accompanying drawings. Attached Figure Description

[0230] Figure 1An apparatus for analyzing and / or processing samples is shown according to one embodiment;

[0231] Figure 2 The diagram illustrates a method according to one embodiment. Figure 1 The image is a portion of the sample processed by the device;

[0232] Figure 3 Show along Figure 2 A cross-sectional view of line III-III in the diagram;

[0233] Figure 4 An example is shown. Figure 1 Enlarged view of the equipment and optical pointer device;

[0234] Figure 5 For example Figure 1 An instance of the two-dimensional parameter space of the sample and / or the device, identifying the determined allowable region in the parameter space;

[0235] Figure 6 Showing similarity Figure 5 The diagram shows the defined allowable and warning regions in the parameter space.

[0236] Figure 7 Showing similarity Figure 6 The diagram shows that the permitted areas and warning areas are continuously merged with each other.

[0237] Figure 8 Shown in cross section by Figure 1 The sample to be processed by the equipment has an accumulated charge on its surface;

[0238] Figure 9 An example is shown. Figure 1 The measuring tip of the device is offset relative to the sample to be processed;

[0239] Figure 10 The diagram illustrates a method according to one embodiment. Figure 1 The device is used for edge recognition of the structure of the sample it processes;

[0240] Figure 11 The diagram illustrates a method according to one embodiment. Figure 1 The determination of the structural location data of the sample to be processed by the equipment;

[0241] Figure 12 Showing self-use for control Figure 1 The duration after the last user inputs the device;

[0242] Figure 13 The determination according to one embodiment is shown. Figure 1The equipment needs to process the location data of defects in the sample;

[0243] Figure 14 Showing images recorded by an image recording device from Figure 13 An image of a portion of a sample, wherein the image recording device is... Figure 13 The defect location determined in the text is the center;

[0244] Figure 15 Show confirmation Figure 1 The appropriate approach path of the measuring tip of the device is used to remove defects from the sample;

[0245] Figure 16 An example of using Figure 1 A flowchart of a computer-implemented method for processing samples using a device;

[0246] Figure 17 An example of using Figure 1 A flowchart of another computer implementation method for processing samples using the device;

[0247] Figure 18 Showing according to Figure 17 The first application scenario of the method for processing samples; and

[0248] Figure 19 Showing according to Figure 17 The second application scenario of the method for processing samples. Detailed Implementation

[0249] Unless otherwise specified, identical or functionally equivalent elements have the same reference numerals in the drawings. Furthermore, it should be noted that the illustrations are not necessarily drawn to scale.

[0250] Figure 1 An exemplary embodiment of an apparatus 100 for analyzing and / or processing a sample 102 is illustrated schematically using an atomic force microscope 104 as an example of a nanomanipulator. The atomic force microscope 104 includes a measuring tip 106 for analyzing and / or processing the sample 102. The measuring tip 106 is disposed on a cantilever 108, which is movably fixed to a positioning unit 110 (moving unit). Specifically, the cantilever 108 includes a first end 112 (base end 112) at which the cantilever 108 is movably fixed to the positioning unit 110. Furthermore, the cantilever 108 includes a second end 114 (free end 114) at which the measuring tip 106 is disposed. The measuring tip 106 is movable along three spatial directions (x, y, z) via the positioning unit 110 (translational movement along the x, y, and z directions).

[0251] Although not shown in the figures, the positioning unit 110 may also include a fixed positioning component (fixed to, for example, the housing 116 of the device 100); and a positioning component movable relative to the fixed positioning component, on which the base end 112 of the cantilever 108 is fixedly mounted. In this case, the base end 112 of the cantilever 108, together with the movable positioning component of the positioning unit 110, is movable relative to the fixed positioning component of the positioning unit 110. However, in the embodiments described below, the base end 112 of the cantilever 108 is movably fixed to the positioning unit 110.

[0252] Device 100 includes a housing 116, which can be evacuated to 1-10, for example, by a vacuum pump 118. -10 mbar, for example, 10 -5 -10 -9 The residual gas pressure is mbar. The atomic force microscope 104 is disposed within the housing 116. Furthermore, a sample stage 120 is provided for holding the sample 102. The sample stage 120 is preferably held by the housing 116 via a mounting base 122. The sample stage 120 may further include additional positioning units (not shown), by which the sample stage can be displaced, for example, in three spatial directions x, y, and z, and can, for example, around at least one axis (e.g., Figure 1 Rotate along the z-axis.

[0253] Additionally, an electron column 124 is disposed within the housing 116. The electron column 124 is configured to provide an electron beam 126. The electron column 124 is particularly suitable for implementation as an electron microscope and for monitoring particles 128 picked up using a measuring tip 106 (see [link to microscope]). Figure 2 ).

[0254] In conjunction with the process gas supply unit 130, the electron column 124 can be attached for a particle beam induced processing procedure on the sample 102. For this purpose, for example, process gas 132 is supplied through the process gas supply unit 130 and irradiated with a particle beam 126.

[0255] The measuring tip 106 can be used to pick up particles 128 adhering to the sample surface 134 of the sample 102. Figure 2 For this purpose, the measuring tip 106 is thus moved accordingly, for example, by the positioning unit 110. Additionally, the sample stage 120 can also be moved by its additional positioning unit (not shown). In particular, the pickup of particles 128 by the measuring tip 106 is monitored in real time using an electron microscope 124.

[0256] Subsequently, the measuring tip 106 is moved to the storage unit (not shown) via the positioning unit 110, where the particles 128 are transferred from the measuring tip 106 to the storage unit.

[0257] Figure 1 Additionally, a control device 136 for controlling the atomic force microscope 104, sample stage 120, electron microscope 124, and / or process gas supply unit 130 is shown. A human-machine interface 138 may be configured as part of the control device 136 or connected to the control device 136 via wired or wireless means for data transmission. The human-machine interface 138 may include, for example, a display device 140, a speaker (not shown), a keyboard 142, a mouse pointer 144, a joystick, a game controller (not shown), etc.

[0258] The illustrated device 100 includes several optional components that are not necessarily required. These components include, in particular, a housing 116, a vacuum pump 118, a sample stage 120, an electron column 124, a process gas supply unit 130, and a human-machine interface 138.

[0259] Figure 2 Image 146 (e.g., scanning electron microscope image 146, or simply SEM image 146) showing a portion of an exemplary sample 102. Figure 3 Along Figure 2 The cross-sectional view of line III-III in the middle is shown as follows Figure 2 Image 146 shows a portion of sample 102. Sample 102 includes, for example, a structure 148 (e.g., absorber structure 148) having a central groove 150. Furthermore, exemplary particles 128 are shown on sample 102, which are located in one of the grooves 150 at the edge of one of the absorber structures 148 and need to be removed. Figure 3 Reference numeral 152 in the figure indicates the substrate of sample 102.

[0260] Removing particles 128 using an atomic force microscope 104 requires manipulating the measuring tip 106 with nanometer-level precision. This may require repeatedly moving the user-controlled measuring tip 106 to the particles 128 and tracking the process in the SEM image 146 until the particles 128 finally adhere to the measuring tip 106 and are removed from the sample 102. This is a cumbersome activity, where even small errors on the user's side can easily lead to damage or destruction of the measuring tip 106 and / or the sample 102.

[0261] The following is for reference Figures 1 to 16 A computer-implemented method for processing sample 102 using an atomic force microscope 104 is described.

[0262] This method enables the use of control device 136 ( Figure 1 Automatic and simultaneous monitoring of numerous parameters A1 to A6 of the atomic force microscope 104 and / or sample 102. Figure 2 , 35). Specifically, this method can automatically monitor the process parameters A1 and A2 of the atomic force microscope 104. The process parameters A1 and A2 of the atomic force microscope 104 are, for example, the positions P of the base 112 of the cantilever 108 along the three spatial directions x, y, and z. x P y P z ( Figure 4 The position is set by the positioning unit 110 and / or the deflection D of the cantilever 108 at its free end 114 in the z-direction.

[0263] Furthermore, this method can automatically monitor parameters A3 to A5 of sample 102. Parameters A3 to A5 of sample 102 are, for example, structure 148 of sample 102. Figure 2 , Figure 3 Location data, such as, for example, the x, y, and z coordinates of structure 148.

[0264] Figure 4 Show Figure 1 Magnified image from atomic force microscope 104.

[0265] The parameters A1 to A6 monitored in this method include, for example, two or more of the following parameters A1 to A6 of the atomic force microscope 104 and sample 102.

[0266] For example, this method can be used to monitor the position P of the base end 112 of the cantilever 108 relative to the positioning unit 110. x P y P z Furthermore, the velocity V of the base end 112 of the cantilever 108 relative to the positioning unit 110 can also be monitored. x V y V z The base end 112 of the cantilever 108 is positioned relative to the positioning unit 110 along the three spatial directions x, y, and z by position P. x P y P z and speed V x V y V z The positioning unit 110 is used specifically to set these parameters P. x P y P z V x V y and V z The current value is provided, for example, by the positioning unit 110 and / or captured using a position sensor, a velocity sensor and / or an acceleration sensor (not shown).

[0267] Furthermore, for example, this method can be used to monitor the deflection D of the free end 114 of the cantilever 108 along the z-direction. Figure 4 The z-direction is configured to be perpendicular to sample 102, specifically perpendicular to the principal extension plane E of sample 102. Figure 2 (xy-plane in the figure). The deflection D of the free end 114 of the cantilever 108 along the z-direction is caused by the force acting between the measuring tip 106 and the sample 102, and is proportional to the spring constant of the cantilever 108. Therefore, the force acting on the cantilever 108 along the z-direction can be determined by capturing the deflection D.

[0268] The force acting between the measuring tip 106 and the sample 102 can also cause the free end 114 of the cantilever 108 to rotate R (torsion R, see [link]) about the x-direction. Figure 4 The rotation R can also be monitored using the method presented here.

[0269] The atomic force microscope 104 includes, for example, a light pointer device 154 for capturing the degree of deflection D of the free end 114 of the cantilever 108 along the z-direction, such as... Figure 4 As shown. The optical pointer device 154 can also be used to capture the degree of rotation R of the free end 114 of the cantilever 108 about the x-direction.

[0270] The optical pointer device 154 includes, for example, a laser source 156 and a position-sensitive photodetector 158. A laser beam 160 emitted by the laser source 156 is guided to the free end 114 of the cantilever 108 and reflected therefrom onto the position-sensitive photodetector 158. The position-sensitive photodetector 158 includes, for example, four photosensitive areas ul, ur, bl, and br. In the undeflected position of the cantilever 108, the laser beams 160 and 162 are reflected to the center of the photodetector 156, such as... Figure 4 As shown. However, if the cantilever 108 deflects along the positive or negative z-direction (deflection D), the reflected laser beam 162 is deflected on the position-sensitive photodetector 158, as in the case of a light pointer. The vertical and horizontal deflection signals (bending signals) of the cantilever 108 can be determined by measuring the received intensity in the four regions ul, ur, bl, and br of the position-sensitive photodetector 158. The deflection signals are proportional to the force (normal force) acting on the cantilever 108 along the z-direction and also proportional to the lateral force acting along the x-direction or y-direction.

[0271] Furthermore, for example, the bending B of the tip 106 relative to the cantilever 108 is measured. Figure 4 This method can also be used to monitor [the situation]. Specifically, the interaction between the measuring tip 106 and the sample 102 can cause the measuring tip 106 to bend (i.e., elastically deform) relative to the cantilever 108. For example, the measuring tip 106 can be affected by lateral movement of the measuring tip 106 (in [the context of the cantilever 108]). Figure 4 The measuring tip 106 bends in the x-direction and / or y-direction while simultaneously contacting the sample 102. The degree of bending B of the measuring tip 106 is determined by image processing in the recorded image 146 (e.g., SEM image 146) of the measuring tip 106.

[0272] Furthermore, for example, parameters A3 to A6 of sample 102 can also be automatically monitored using this method. Parameters A3 to A6 of sample 102 include, for example, structure 148 of sample 102 (…). Figure 2 , 3 The location data A3 to A5 are, for example, the x-coordinates and y-coordinates of structure 148. Figure 2 ) and / or the height A5 of structure 148 along the z-direction ( Figure 3 Furthermore, the charge Q (A6) at surface 134 of sample 102 can be monitored. Figure 8 ).

[0273] Monitoring two or more of the aforementioned parameters A1 to A6 of the atomic force microscope 104 and / or sample 102 enables effective monitoring of the multidimensional parameter space 164. Figure 5 ).

[0274] The first step S1 of this method involves providing the permissible range of values ​​for two or more parameters A1 to A6 of the atomic force microscope 104 and / or the sample 102. The two or more parameters A1 to A6 span a multidimensional parameter space 164.

[0275] Figure 5 An example is shown illustrating the monitoring of two parameters A1 and A2 (e.g., the Px and Py positions of the base 112 of the cantilever). The two parameters A1 and A2 span a two-dimensional parameter space 164.

[0276] Although not shown in the figure, it is preferable to monitor two or more parameters A1 to A6. For example, the position and velocity of the base 112 of the cantilever 108 in all three spatial directions x, y, and z (corresponding to six parameters), the deflection D and rotation R of the free end 114 of the cantilever 108 (corresponding to two other parameters), the bending B of the measuring tip 106 (corresponding to one other parameter), the position A3, A4, and A5 of the structure 148 of the sample 102 in the three spatial directions x, y, and z (corresponding to three other parameters), and the charge Q at the sample surface 134 (corresponding to one other parameter) can be monitored simultaneously. In this example, this method can be used to monitor a three-dimensional parameter space.

[0277] The provided allowable value range is, for example, a predetermined allowable value range stored in a storage device (not shown) of the control device 136 and / or received by the control device 136. In particular, in each case, the allowable value range of two or more parameters A1 to A6 is a one-dimensional value range.

[0278] Based on the provided allowable value range of two or more parameters A1 to A6, the second step S2 of the method involves determining an allowable region 166 in the multidimensional parameter space 164.

[0279] For example, based on the allowable range of two or more parameters, the allowable region 166 can also be determined by calculating the probability of damage to sample 102.

[0280] For example, in step S2, the control device 136 determines the permitted area 166. Furthermore, in step S2, the permitted area 166 may be determined, for example, automatically, meaning no user intervention is required.

[0281] exist Figure 5 In this context, the defined allowable region 166 has a polygonal shape. In other instances, the defined allowable region 166 may also have different shapes. Furthermore, the dimension of the allowable region 166 may, for example, be exactly equal to the dimension of the monitoring parameter space 164 (in...). Figure 5 (In the example, it is two-dimensional).

[0282] Figure 5 In the attached figure, reference numeral 168 indicates a prohibited area in the monitored parameter space 164.

[0283] The selective third step S3 of this method involves determining the warning region 170 in the parameter space 164. Figure 6 Warning zone 170 is specifically configured between permitted zone 166 and prohibited zone 168'.

[0284] In the fourth step S4 of this method, the current values ​​Z1, Z2 (of two or more monitoring parameters A1 to A6) are received. Figure 5 And / or determine the future values ​​Z'1, Z'2 of two or more parameters A1 to A6.

[0285] For example, the current values ​​Z1, Z2 of two or more monitoring parameters A1 to A6 can be obtained from the positioning unit 110, the light pointer device 154, or from image processing based on the image 146 from the scanning electron microscope 124.

[0286] For example, based on received user input G, the future values ​​Z'1, Z'2 of two or more parameters A1 to A6 are predicted. The user input G is, for example, utilized via human-machine interface 138 (…). Figure 1This can be implemented by, for example, checking the target position T of the measuring tip 106 as input by the user through the human-machine interface 138 with respect to monitoring parameters A1 to A6. Figure 2 ).

[0287] The future values ​​Z'1, Z'2 of two or more parameters A1 to A6 can be predicted, for example, additionally or alternatively, based on the determined offset shift 172 of the measuring tip 106 relative to the sample 202, such as... Figure 9 As shown. Figure 9 Image 246 shows a portion of sample 202, capturing the measuring tip 106 and the structure 248 of sample 202. Figure 9 In the diagram, the position of the measuring tip 106' after the measuring tip 106, 106' has shifted 172 (e.g., due to thermal shift) is shown by a dashed line.

[0288] Based on the current values ​​Z1, Z2 and / or future values ​​Z'1, Z'2, the fifth step S5 of this method involves determining the multidimensional parameter space 164 ( Figure 5 The corresponding current state point Z and / or future state point Z' in ). In addition, step S5 involves determining whether the current and / or future state points Z and Z' are outside the allowed area 166.

[0289] State points Z and Z' are determined by control device 136, for example, in step S5. Furthermore, state points Z and Z' are determined fully automatically, especially in step S5.

[0290] exist Figure 5 In the example shown, the determined current state point Z is located within the permitted region 166. Furthermore, the determined future state point Z' is located outside the permitted region 166, specifically within the prohibited region 168.

[0291] If selective step S3 is performed, where permitted region 166 and warning region 170 are identified ( Figure 6 Then, the subsequent selective steps S6 and S7 are also implemented.

[0292] The selective sixth step S6 of this method involves determining whether the current and / or future state points Z, Z', Z" are located within the determined warning area 170.

[0293] In the selective seventh step S7 of the method, the positioning unit 110 ( Figure 1 The movement of the measuring tip 106 is slowed down if the current and / or future state points Z, Z', Z” are determined to be within the determined warning area 170 in step S6.

[0294] Alternatively, in step S7, if it is determined in step S6 that the current and / or future state points Z, Z', Z” are located within the determined warning area 170, the human-machine interface 138 can also be controlled to output a warning to the user.

[0295] In the eighth step S8 of the method, if it is determined that the current and / or future state points Z, Z', Z” are outside the allowed area 166, for example, within the warning area 170 and / or the prohibited areas 168, 168”, the positioning unit 110 is automatically controlled to stop the movement of the measuring tip 106 (e.g., stop the lateral movement of the measuring tip 106, that is, stop the base end 112 of the cantilever 108 from moving). Figure 4 (moving along the x- and y- directions), and / or withdrawing the measuring tip 106 relative to the sample 102 (i.e., along) Figure 4 The base end 112 of the cantilever 108 moves along the positive z-direction. For example, the control in step S8 is implemented fully automatically by the control device 138.

[0296] Stopping the movement of the measuring tip 106 and / or withdrawing the measuring tip 106 relative to the sample 102 enables fully automatic prevention of penetration into the prohibited areas 168, 168', i.e., without user intervention. This prevents damage to the measuring tip 106 and / or the sample 102.

[0297] The determined allowable region 166, the determined warning region 170, and / or the determined prohibited regions 168 and 168' in the monitored multidimensional parameter space 164 may have discrete restrictions G1 and G2, such as Figure 5 and Figure 6 As shown.

[0298] Alternatively, the identified permitted area 166", the identified warning area 170", and / or the identified prohibited area 168" may be consecutively merged together, such as... Figure 7 As shown. For example, the permitted area 166”, warning area 170”, and / or prohibited area 168” can be determined based on a calculation of the probability of sample 102 being damaged (damage probability). For example, based on the damage probability (e.g., a damage probability greater than a predetermined threshold), a warning can be output and / or the positioning unit 110 can be controlled to stop the movement of the measuring tip 106 and / or to retract the measuring tip 106 relative to sample 102. For example, the positioning unit 110 can be controlled based on the damage probability such that the greater the speed at which the measuring tip 106 is withdrawn from sample 102, the greater the damage probability.

[0299] In this method, one or more images 146 of at least a portion of sample 102 may be selectively recorded by an image recording device. Figure 2 Image recording devices such as, for example, scanning electron microscopes 124 ( Figure 1 ).

[0300] The electron beam 126 used in the process and the high electron beam dose applied can cause charge Q to accumulate on the sample surface 134, such as Figure 8 As shown.

[0301] In the proposed method, one of the monitored parameters A1 to A6 of the atomic force microscope 104 and / or the sample 102 can be selectively made to accumulate charge Q at the surface 134 of the sample 102. If it is determined in step S5 that the current and / or future value of the charge Q accumulation at the sample surface 134 is outside the allowable range, then the scanning electron microscope 124 can be selectively controlled to stop recording the image 146 of the sample 102, and / or the human-machine interface 138 can be controlled to output a request to the user to perform discharge treatment on the sample surface 134.

[0302] Furthermore, in the method of step S1, by providing and / or determining the location data A3 to A5 of the structure 148 of sample 102 ( Figure 2 , Figure 3 ( ), can selectively provide the allowed value range or a portion of the allowed value range for two or more monitoring parameters A1 to A6.

[0303] For example, by performing image analysis on one or more received images 146 of at least a portion of sample 102, the location data A3 to A5 of structure 148 of sample 102 can be determined.

[0304] Figure 10 An example is shown in which the location data A3 to A5 of the structure 348 of sample 302 are determined by analyzing at least a portion of image 346 (e.g., SEM image 346) of sample 302. Figure 10 During image analysis, edge identification of edge K of structure 348 in image 346 is performed. Edge K of structure 348 in sample 302 typically appears as the brightest element in SEM image 346, making it possible to perfectly determine its position in the x-direction and y-direction on sample 302 in SEM image 346.

[0305] Figure 11 Another example is shown, in which the location data A3 to A5 of the structure 448 of sample 402 are determined by analyzing at least a portion of image 446 (e.g., SEM image 446) of sample 402. Figure 11 In this example, defect 428 (e.g., particle 428) is located on sample 402. The presence of one or more such defects 428 (e.g., particles 428) in the region of structure 448 of sample 402 makes it more difficult to identify and locate structure 448. Therefore, in Figure 11 In the example, control device 136 ( Figure 1An image 446 is received of at least a portion of sample 402, capturing both a defect-free region 174 and a defective region 176. Specifically, a first portion 178 of structure 448 is captured in the defect-free region 174. Furthermore, at least one defect 428 (e.g., particle 428) and a second portion 180 of structure 448 are captured in the defective region 176. Moreover, the geometry 182 of the first portion 178 of structure 448 corresponds to the geometry 184 of the second portion 180 of structure 448.

[0306] The defect-free region 174 allows for a better and more accurate determination of structure 448. Therefore, the geometry 182 of the first portion 178 of structure 448 in the defect-free region 174 of image 446 is first determined through image analysis. Then, the geometry 182 of structure 178 determined for the defect-free region 174 of sample 402 can be applied to the defective region 176 of sample 402. Specifically, based on the determined geometry 182 of the first portion 178 of structure 448 in the defect-free region 174 of image 446, the positional data A3, A4 (e.g., x-position and y-position) of the second portion 180 of structure 448 in the defective region 176 of sample 402 can be determined.

[0307] Optionally, in the proposed method, the target position T in image 146 (e.g., SEM image 146) can also be automatically moved. Figure 2 Specifically, the system automatically moves to the target position T based on the target position T input by the user via a graphical user interface 144. The graphical user interface 144 may be, for example, a mouse pointer 144. Figure 1 Or a joystick, game controller (not shown), etc. For this purpose, the control device 136 receives at least a portion of an image 146 of the sample 102. Figure 2 ) and control the display device 140 ( Figure 1 The received image 146 is displayed on the display device 140. A user viewing the image 146 can identify (e.g., click) the target position T of the measuring tip 106 via the graphical user interface 144. The control device 136 then receives the target position T of the measuring tip 106 from the image 146, which has been input by the user via the graphical user interface 144. Subsequently, the control device 136 automatically controls the positioning unit 110 of the atomic force microscope 104, causing the measuring tip 106 to move to the target position T.

[0308] Optionally, the proposed method may also provide a disability protection function, which involves monitoring the duration Δt since the last user input G was received, such as... Figure 12 As shown. Figure 12 Time t is shown using a timeline. Figure 12In this example, the last user input G occurs at time point t1. For instance, at time point t2, control device 136 checks the duration Δt since the last user input G was received. If control device 136 determines that the duration Δt is greater than a predetermined threshold Th (predetermined duration Th), it actuates the disability protection function. Specifically, control device 136 then automatically controls the positioning unit 110 of atomic force microscope 104 to bring the measuring tip 106 into the determined allowable region 166, 166" of the multidimensional parameter space 164. Figures 5 to 7 ) and / or bring into the predetermined safety state C ( Figure 6 ).

[0309] Optionally, the proposed method may also provide fully automatic offset correction, such as... Figure 9 As shown. For this purpose, control device 136 receives multiple images 246 of at least a portion of sample 202. Images 246 capture the structure 248 and / or markings of sample 202 and measuring tip 106. For example, the position of measuring tip 106 relative to structure / marker 248 may change over time due to thermal displacement. Figure 9 In the image, the position of the measuring tip 106' after an offset movement 172 occurs is shown by a dashed line. The control device 136 determines the offset movement 172 of the measuring tip 106 relative to the structure / marker 248 by image analysis received from image 246. Based on the determined offset movement 172, the control device 136 then determines an offset correction 172' and automatically controls the positioning unit 110 to move the measuring tips 106, 106' according to the determined offset correction 172'.

[0310] Optionally, based on the image analysis, fully automatic migration correction can also be implemented using predetermined model data. For example, a linear model can be used to approximate thermal migration.

[0311] Optionally, the proposed method can also provide fully automated particle identification and image centering, such as... Figure 13 and Figure 14 As shown. For this purpose, control device 136 controls image recording device 124 (e.g., Figure 1 A scanning electron microscope 124 is used to record a first image 546 of the defective portion 198 of the sample 502. The first image 546 captures a first structure 188 of the sample 502 and one or more defects 528. Furthermore, the control device 136 controls the image recording device 124 to record a second image 546' of the defect-free portion 190 of the sample 502. The second image 546' captures a second structure 192 of the sample 502, the geometry of which 196 corresponds to the geometry 194 of the first structure 188 in the first image 546.

[0312] An example where the geometry 194 of the first structure 188 of sample 502 corresponds to the geometry 196 of the second structure 192 of sample 502 is that the first and second structures 188 and 192 are part of a repeating pattern formed by the structures 188 and 192 of sample 502. Another example where the geometry 194 of the first structure 188 of sample 502 corresponds to the geometry 196 of the second structure 192 of the same sample 502 is that multiple semiconductor chips of the same type are generated using the same sample 502 (e.g., a photolithographic mask 502). For example, in this case, the first structure 188 in the first image 546 is used to generate a first semiconductor chip (bare die), and the second structure 192 in the second image 546' is used to generate a second semiconductor chip of the same type.

[0313] In the next step, control device 136 determines the difference image 546” by subtracting the second image 546” from the first image 546”. Since the first structure 188 and the second structure 192 correspond to each other (i.e., have the same geometry 194, 196), they are eliminated during the determination of the difference image 546”, making structures 188, 192 invisible in the difference image 546”. Furthermore, the defect 528 is imaged with greater contrast in the difference image 546”. Ultimately, the location P of the defect 528 can be determined more accurately based on the difference image 546”. P Therefore, image analysis based on the difference image 546 is used to determine the location data P of one or more defects 528 acquired in the first image 546. P .

[0314] Then the image recording device 124 is controlled to record a third image 546”' of the defective portion 198 of the sample 502, such that the defect 528 is positioned at a predetermined location in the third image 546”' (e.g., within the image center M).

[0315] Optionally, the proposed method can also automatically determine the approach angle β of a specific particle 628, such as... Figure 15 As shown. The background is that the cantilever 108 is configured at a fixed angle α relative to the positioning unit 110 (in Figure 15 In the example, angle α equals 0. Therefore, the orientation of the measuring tip 106 relative to the cantilever 108 and the positioning unit 110 is fixed. Then, as Figure 15 As shown at the top, from the perspective of the measuring tip 106, the particle 628 can be configured in the shadow of the structure 648 of the sample 602, such that direct access of the measuring tip 106 is blocked by the structure 648.

[0316] Control device 136 can then control image recording device 124 (e.g., scanning electron microscope 124) to record an image 646 of at least a portion of sample 602, the image capturing the structure 648 and particles 628 of sample 602. Control device 136 can then determine the possible approach angle β of measuring tip 106 for handling particles 628, such that the approach path W with approach angle β does not contain the structure 648 of sample 602. Control device 136 can then control sample stage 120 (… Figure 1 The positioning unit (not shown) of the sample stage 120 is used to rotate the sample stage 120 about the z-axis. Specifically, the positioning unit (not shown) of the sample stage 120 is controlled based on the determined approach angle β, such that the fixed angle α of the measuring tip 106 corresponds to the approach angle β. Therefore, as Figure 15 As shown at the bottom, the measuring tip 106 can approach the particle 628 without obstruction.

[0317] Therefore, firstly, the aforementioned method enables fully automated monitoring of the high-dimensional parameter space 164 related to the process parameters A1 to A6 of the atomic force microscope 104 and / or the properties of the sample 102. This prevents damage to the atomic force microscope 104 (e.g., the measuring tip 106) and the sample 102. Furthermore, as mentioned above, the control device 136 of the device 100 can selectively perform various fully automated controls, allowing for safer and easier handling of the sample 102 at the nanoscale using the atomic force microscope 104.

[0318] Alternatively or alternatively, the proposed method or system provides an improved focusing method for image recording devices (e.g., scanning electron microscope 124) attached to nanomanipulators (e.g., atomic force microscope 104) or portions thereof, such as... Figures 17 to 19 As shown.

[0319] Figure 17 An example of using Figure 1 A flowchart of another computer-implemented method for processing a sample (e.g., sample 102) using a device (e.g., device 100). This method can be used to focus an image recording device (e.g., scanning electron microscope 124) on a specific feature of interest during both manual and automatic processing of the sample. The method may include actions performed by a control unit (e.g., control device 136). Figure 17 Steps S10 to S12 are shown.

[0320] In step S10, the image provided by the image recording device 724 is focused on the tip 706 (e.g., the measuring tip 106) and / or the sample 702 (e.g., a photolithographic mask). Focusing can be performed manually, i.e., under the control of a human operator; or automatically, i.e., using an autofocus routine of the control unit, such as a gradient detection algorithm or a combination thereof based on the image received from the image recording device 724. Selectively, the image provided by the image recording device 724 is simultaneously focused on the measuring tip 706 and the sample 702, for example, when the tip 706 contacts the sample 702, i.e., when both the tip 706 and the sample 702 are substantially at the same focal plane, i.e., within the focal depth of the image recording device 724.

[0321] In step S11, an element shown within the focused image is selected as a target feature. For example, sample 702 or tip 706 is selected as a target feature. Alternatively or additionally, a defect in sample 702 may be selected as a targeted feature, such as particles 728 located on the surface 734 of sample 702 facing the image recording device 724. Note that the selection can be direct or indirect. That is, when the user intends to follow particles 728 attached to surface 734, the user may select to follow sample 702; or when the user intends to follow particles 728 attached to tip 706, the user may select tip 706. This selection can be performed manually by the user. For example, the user may use the corresponding physical or virtual selection switch of the user interface (e.g., human-machine interface 138) of nanomanipulator 104 and / or image recording device 724 to select sample 702 or tip 706 as a target feature. Alternatively, the selection may be performed in a (semi-)automatic or programmed manner. For example, selection can be made under the control of an automatic image analysis and / or object detection algorithm executed by the control device 136.

[0322] The selection steps can be performed according to the user's preferences or the needs of the specific task to be performed. For example, in the particle removal process, such as based on the aforementioned fully automated particle identification process, the following can be considered: Figure 18 The selection is performed by describing the first application scenario in detail. For another example, during probe replacement (e.g., tip 706), the following can be used... Figure 18 The selection is performed in a detailed description of the second application scenario. For another example, in the process of guiding sample 102 (e.g., a photolithographic mask), the selection can be performed as detailed below.

[0323] In step S12, the focus 726 of the image recording device 724 is automatically set based on at least one operating parameter of either the sample stage 120 of the nanomanipulator 104 or the positioning unit 110. This at least one operating parameter can indicate the vertical movement of either the sample stage 120 or the positioning unit (110). For example, operating parameters indicating the absolute position of the sample stage 120 and / or the positioning unit 110 along the z-direction can be used. Alternatively, the initial position along the z-direction can be combined with operating parameters indicating the relative position or movement (i.e., position change) along the z-direction. For example, motor speeds or pulse sequences used to control stepper motors or piezoelectric actuators can be used to track the movement of the sample stage 120 and / or the positioning unit 110 along the z-direction. By tracking the position of the sample stage 120 and / or the tip 706 attached to the positioning unit 110 along the z-direction, the image recording device 724 can maintain focus on the target feature selected in step S11 during processing without requiring manual refocusing or conventional autofocusing routines.

[0324] For example, if sample 702 is selected as the targeted feature and the sample stage is moved 100 μm along the negative z-direction, i.e., further away from the measuring tip 106, the focus 726 of the image recording device 724 is adjusted by the same amount; for example, the focus 726 is set to a plane 100 μm further away from the image recording device 724 than before. As another example, if tip 704 is selected as the targeted feature and the tip is moved 50 μm along the positive z-direction, i.e., further away from the surface 734 of sample 702, the focus 726 of the image recording device 724 is adjusted by the same amount; for example, the focus 726 is set to a plane 50 μm closer to the image recording device 724.

[0325] Figure 18 Showing according to Figure 17 The first application scenario for processing sample 702 using this method. Specifically, Figure 18 This illustrates the automatic focus adjustment process during particle removal.

[0326] exist Figure 18 In the first stage shown in a), the focus 726 of the image recording device 724 is focused on the tip 706 of the nanomanipulator (e.g., nanomanipulator 104). This can be performed manually or automatically, as described above. This stage can be useful for characterizing the tip 706. For example, the operator can verify whether the correct tip is attached to the positioning unit 110 of the nanomanipulator 104 and / or whether the tip 704 is damaged.

[0327] exist Figure 18 In the second stage shown in b), the focal point 726 of the image recording device 724 focuses on the sample 702. For example, a photolithographic mask can be used as the sample. Figure 18 As shown in a) through c), one or more particles 728 may be located on surface 734 of sample 702. As previously described, focusing can be performed manually or automatically. This stage is useful for locating and / or characterizing particles 728. For example, an operator can verify that particles 728 are located in critical areas of the sample (e.g., photolithographic masks) and can remove particles using the tip 706 characterized in the first stage. Optionally, sample 702 may be aligned horizontally (i.e., in the x / y plane) within the working area of ​​nanomanipulator 104, for example, close to the center of the image provided by image recording device 724.

[0328] exist Figure 18 In the third stage shown in c), the tip 706 descends to the sample 702. If the focus 726 of the image recording device 724 is set to follow the sample 702, the tip will slowly enter the focus of the sample 702. Conversely, if the focus 726 of the image recording device 724 is set to follow the tip 706, the sample 702 with particles 728 will slowly enter the focus as the tip 706 descends. Once the tip 706 approaches or contacts the surface 734 of the sample 702, the depth of focus of the image recording device 724 is generally sufficient to simultaneously focus on the tip 706, the particles 728, and the sample 702, as... Figure 18 As shown in c).

[0329] exist Figure 18 In the fourth stage shown in d), the user selects focus 726 to follow the tip 704 of the nanomanipulator 104. The operator then moves the tip 706 to bring it into contact with the particle 728. The particle can then be moved horizontally and / or lifted away from the surface 734, as shown. For example, the tip 706 can be lifted 1 to 100 μm in an attempt to remove the particle 728 from the surface 734. Note that if the particle 728 successfully attaches to the tip 706, the particle will remain in focus on the image recording device 724 during the lifting away, and if attachment is unsuccessful, the particle 728 will deviate from focus, thereby providing the operator with visual feedback on the particle removal operation.

[0330] It should be noted that the described focus-following mechanism may be more reliable than conventional autofocus procedures. For example, in the case where both sample 702 and tip 706 are currently in focus, for example, in Figure 18 In the case shown in c), and where one of the multiple features moves away from the focal plane, it may be difficult to determine whether the autofocus routine should follow sample 702 or tip 706. Therefore, by synchronizing focus adjustment with the movement of the targeted feature (e.g., sample 702 or tip 706 respectively), the autofocus routine can be prevented from accidentally locking onto the wrong feature (i.e., a feature other than the targeted feature).

[0331] Figure 19Showing according to Figure 17 The second application scenario for methods to process samples. In particular, Figure 19 The process of autofocus adjustment during tip replacement is shown.

[0332] exist Figure 19 In the first stage shown in 19a) and 19b), the focus 726 of the image recording device 724 is focused on the replacement tip 706 or the newly attached tip 706 of the nanomanipulator (e.g., nanomanipulator 104). The tip 706 is selected as a targeted feature. Thus, if the replacement tip 706 is lowered to or picked up from the tip replacement mask 702', the operator can inspect the corresponding tip 706. During this stage, the focus of the image recording device 724 remains focused on the tip 706, as shown in 19a) and 19b).

[0333] exist Figure 19 In the second stage shown in c) and 19d), the focus 726 of the image recording device 724 is focused on the tip replacement mask 702'. The tip replacement mask 702' is selected as a targeted feature. During tip replacement, the tip replacement mask 702' is typically moved away from the nanomanipulator 104, for example, lowered by several millimeters. The tip replacement mask 702' is moved horizontally to select a new tip 706 and / or align the selected tip 706 with the attachment point of the nanomanipulator (e.g., positioning unit 110). The tip replacement mask 702' with the new tip 706 is then raised upwards again. Selectively, the horizontal allocation (e.g., refinement) can be repeated once the tip replacement mask 702' is closer to the attachment point along the vertical z-direction. During this stage, the focus of the image recording device 724 remains focused on the tip replacement mask 702', as Figure 19 As shown in c) and 19d).

[0334] Further details of the processing of the tip 706 using the tip replacement mask 702' have been disclosed in International Patent Application WO 2016 / 193331A1, the entire contents of which are incorporated herein by reference.

[0335] It is worth noting that automatically following the focus 726 of the image recording device 724 is also useful during significant movement and / or rotation of the sample 702 in the horizontal direction (not shown). For example, if an operator moves from one area of ​​a photolithographic mask to another area of ​​the same mask, such as to a different circuit area or system component of a system-on-a-chip (SoC). In such a process, the mask is typically lowered away from the nanomanipulator 104 to avoid accidental contact with the tip 706. By selecting the sample (i.e., the mask) as a targeted feature, the photograph (e.g., a SEM image) captured by the image recording device 724 remains in focus, allowing the operator to easily identify the desired target area or feature.

[0336] In another embodiment (not shown), the focal point 726 of the imaging device 724 can be repeatedly changed between the focal plane of the tip 706 and the focal plane of the sample 702, for example, at fixed intervals of, for example, milliseconds of view. Thus, the two images can be generated and displayed alternately (e.g., in a stroboscopic manner), adjacent to each other (e.g., in two different windows of the human-machine interface 138), or selectively based on operator selection. In this way, the operator can essentially monitor both the sample 702 and the tip 706 simultaneously, further improving the control of the system 100.

[0337] Although the invention has been described based on exemplary embodiments, it can be modified in many ways.

[0338] List of reference numerals

[0339] 100 devices

[0340] 102 samples

[0341] 104 nanometer manipulator (atomic force microscope)

[0342] 106' and 106' measuring tips

[0343] 108 cantilever

[0344] 110 Positioning Unit

[0345] 112 end

[0346] 114 terminal

[0347] 116 Casing

[0348] 118 pump

[0349] 120 Sample Support Platform

[0350] 122 Mounting Base

[0351] 124 electron columns

[0352] 126 electron beam

[0353] 128 Defects (Particles)

[0354] 130 Process Gas Supply Unit

[0355] 132 Process Gases

[0356] 134 surface

[0357] 136 Control Equipment

[0358] 138 Human-Computer Interface

[0359] 140 Display device

[0360] 142 Keyboard

[0361] 144 Mouse pointer

[0362] 146 images

[0363] 148 Structure

[0364] 150 trench

[0365] 152 substrate

[0366] 154 Optical Pointer Device

[0367] 156 laser sources

[0368] 158 photodetector

[0369] 160 laser beam

[0370] 162 laser beams

[0371] 164 parameter space

[0372] 166, 166'' area

[0373] 168, 168', 168” area

[0374] 170, 170” area

[0375] 172 Offset Movement

[0376] 172' Offset Correction

[0377] Area 174

[0378] Area 176

[0379] Part 178

[0380] Part 180

[0381] 182 Shape

[0382] 184 Shapes

[0383] Part 186

[0384] 188 Structure

[0385] Part 190

[0386] 192 Structure

[0387] 194 Shapes

[0388] 196 Shapes

[0389] Part 198

[0390] 202 samples

[0391] 246 images

[0392] 248 Structure

[0393] 302 samples

[0394] 346 images

[0395] 348 Structure

[0396] 402 samples

[0397] 428 Defects (Particles)

[0398] 448 Structure

[0399] 502 samples

[0400] 528 Defects (Particles)

[0401] Images 546, 546', 546”, 546”'

[0402] 602 samples

[0403] 628 particles (particles)

[0404] 646 images

[0405] 648 Structure

[0406] 702 samples

[0407] 702' Tip replacement mask

[0408] 706 tip

[0409] 724 Image Recording Device

[0410] 726 Focus

[0411] 728 particles

[0412] 734 surface

[0413] A1-A6 parameters

[0414] α angle

[0415] bl region

[0416] br region

[0417] B bend

[0418] β angle

[0419] C. Safe State

[0420] D deflection

[0421] Δt duration

[0422] E plane

[0423] G User Input

[0424] G1, G2 Limits

[0425] K edge

[0426] M Center

[0427] Positions of Px, Py, and Pz

[0428] P P Location

[0429] Q charge

[0430] R rotation

[0431] S1-S8 Method Steps

[0432] t time

[0433] t1, t2 time

[0434] T target position

[0435] Th critical value

[0436] ul region

[0437] ur region

[0438] Vx, Vy, Vz speed

[0439] W path

[0440] x, y, z directions

[0441] Z, Z', Z” state points

[0442] Z1, Z1', Z1” values

[0443] Z2, Z2', Z2” values

Claims

1. A method, particularly a computer-implemented method, for processing samples (102, 702) disposed on a sample stage (120) using a nanomanipulator (104), the nanomanipulator comprising a tip (106, 706) for processing the sample (102, 702) and a positioning unit (110) for moving the tip (106, 706), the method comprising the following steps: -Focus (S10) the image (146) provided by the image recording device (124, 724) on the tip (106, 706) and / or the sample (102, 702); - Select (S11) the sample (102, 702) or the tip (106, 706) as the target feature; and - Based on at least one operating parameter of the sample stage (120) and the positioning unit (110), the focus (726) of the nanomanipulator (104) is automatically set (S12), wherein the at least one operating parameter indicates the vertical movement of the sample stage (120) and / or the positioning unit (110) to keep the target feature focused in the image (146) provided by the image recording device (124, 724) during processing.

2. The method of claim 1, wherein when the tip (106, 706) contacts the sample (102, 702), the image (146) provided by the image recording device (124, 724) is focused on the tip (106, 706) and the sample (102, 702).

3. The method of claim 1 or 2, wherein the operator of the nanomanipulator (104) selects the target feature via a human-machine interface (138).

4. The method according to any one of claims 1 to 3, wherein - When the sample (102, 702) is selected as the target feature, the focus (726) is automatically set based on the z-value indicating the vertical position of the sample stage (120); and - When the tip (106, 706) is selected as the target feature, the focus (726) is automatically set based on the z value that indicates the vertical position of the positioning unit (110).

5. The method according to any one of claims 1 to 4, further comprising: - Switch the target feature from the sample (102, 702) to the tip (106, 706) or vice versa, while the tip (106, 706) does not contact the sample (102, 702).

6. The method of claim 5, further comprising: - After switching the target feature, the focus (726) of the nanomanipulator (104) is set based on at least one operating parameter of the other of the sample stage (120) and the positioning unit (110).

7. The method of claim 5 or 6, wherein the target feature is switched by the operator of the nanomanipulator (104) via a human-machine interface (138).

8. The method of claim 5, wherein the target feature repeatedly switches between the sample (102, 702) and the tip (106, 706), the method further comprising displaying the first image and the second image simultaneously or alternately and / or in a strobe manner, wherein - When the focus (726) is set based on at least one operating parameter of one of the sample stage (120), the image recording device (124, 724) provides the first image, such that the sample (102, 702) is focused within the first image; and When the focus (726) is set based on at least one of the operating parameters of the positioning unit (110), the image recording device (124, 724) provides the second image, such that the tip (106, 706) is focused within the second image.

9. Use of the method as described in any one of claims 1 to 8 for tracking particles (128, 728) to be removed from the sample (102, 702), comprising: - When the tip (106, 706) of the nanomanipulator (104) contacts the particles (128, 728) on the surface (134, 734) of the sample (102, 702), the image (146) provided by the image recording device (124, 724) is focused. - Select this tip (106, 706) as the target feature; and - By operating the sample stage (120) and / or the positioning unit (110) in the vertical direction to separate the tip (106, 706) from the sample (102, 702), while keeping the tip (106, 706) focused on the image provided by the image recording device (124, 724) during processing, visual verification is made to see whether the tip (106, 706) lifts the particle (128, 728) from the surface (134, 734) of the sample (102, 702).

10. The use of the method of claim 9, further comprising: -The image (146) provided by the image recording device (124, 724) is focused on the tip (106, 706) to determine the initial horizontal position of the tip (106, 706) before it contacts the sample (102, 702); - The image (146) provided by the image recording device (124, 724) is focused onto the sample (102, 702) to provide the initial horizontal position of the sample (102, 702) before the tip (106, 706) contacts the sample (102, 702); and - The tip (106, 706) is brought into contact with the particle (128, 728) by operating the sample stage (120) and / or the positioning unit (110) in the vertical direction, and / or the tip (106, 706) is aligned with the horizontal position of the sample (102, 702) by operating the sample stage (120) and / or the positioning unit (110) in the horizontal direction.

11. The use of the method as described in any one of claims 1 to 8, for following a replacement tip (706) during a tip replacement procedure, further comprising: - The image (146) provided by the image recording device (124, 724) is focused onto the tip replacement mask (702'), which carries one or more replacement tips (706); - Select the tip replacement mask (702') as the target feature; and - The target tip (706) located on the tip replacement mask (702') in the central area of ​​the image (146) is vertically aligned, and the focus (726) of the nanomanipulator (104) is set on the tip replacement mask (702').

12. The use of the method as claimed in claim 11, further comprising: - Attach the target tip (706) to the positioning unit (110); - Select the target tip (706) as a targeted feature; and - The target tip (706) attached to the positioning unit (110) is lifted from the tip replacement mask (702') while the focus (726) of the nanomanipulator (104) is set on the target tip (706).

13. A computer-implemented method for processing a sample (102) using a nanomanipulator (104), the nanomanipulator comprising a measuring tip (106) for processing the sample (102, 702) and a positioning unit (110) for moving the measuring tip (106), the method comprising the following steps: a) Provide (S1) allowable value ranges for two or more parameters (A1, A2) of the nanomanipulator (104) and / or the sample (102), wherein the two or more parameters (A1, A2) span a multidimensional parameter space (164); b) Determine (S2) the allowed region (166) in the multidimensional parameter space (164) based on the allowed value range provided for the two or more parameters (A1, A2); c) Receive (S4) the current values ​​(Z1, Z2) of the two or more parameters (A1, A2) and / or determine the future values ​​(Z'1, Z2') of the two or more parameters (A1, A2); d) Determine (S5) whether the state point (Z, Z') corresponding to the current value and / or future value (Z1, Z2, Z'1, Z2') of the two or more parameters (A1, A2) in the multidimensional parameter space (164) is outside the allowed region (166); and e) If it is determined that the state point (Z, Z') is outside the allowed area (166), control (S8) the positioning unit (110) to stop the movement of the measuring tip (106) and / or to withdraw the measuring tip (106) relative to the sample (102).

14. The method of claim 13, wherein the future values ​​(Z'1, Z2') of the two or more parameters (A1, A2) are predicted based on the received user input (G) and / or based on the determined offset movement (172) of the measuring tip (106) relative to the sample (202).

15. The method of claim 13 or 14, comprising: For the two or more parameters (A1, A2), determine (S3) the warning region (170) in the multidimensional parameter space (164); Determine (S6) whether the current and / or future state point (Z, Z') in the multidimensional parameter space (164) is located within the determined warning region (170); and The positioning unit (110) is controlled (S7) to decelerate the movement of the measuring tip (106) and / or the human-machine interface (138) is controlled to output a warning when the current and / or future state point (Z, Z') is determined to be within the determined warning area (170).

16. The method of any one of claims 13 to 15, wherein the allowed region (166, 166”), the warning region (170, 170”), and / or the prohibited region (168, 168”) of the multidimensional parameter space (164) have discrete restrictions (G1, G2) or are continuously merged with each other.

17. The method of any one of claims 13 to 16, wherein the nanomanipulator (104) comprises a cantilever (108) movably fixed at its base end (112) to the positioning unit (110), the measuring tip (106) is disposed at the free end (114) of the cantilever (108), and the two or more parameters (A1, A2) of the nanomanipulator (104) and / or the sample (102) comprise: The position (Px, Py, Pz) of the base end (112) of the cantilever (108) relative to the positioning unit (110); The velocity (Vx, Vy, Vz) of the base end (112) of the cantilever (108) relative to the positioning unit (110); The free end (114) of the cantilever (108) is deflected (D) along the z-direction configured to be perpendicular to the sample (102); The free end (114) of the cantilever (108) rotates (R) about the x-direction which is configured perpendicular to the z-direction; The bending (B) of the measuring tip (106) relative to the cantilever (108); and / or The location data (A3-A5) of the structure (148) of the sample (102).

18. The method of any one of claims 13 to 17, further comprising: Receive an image (146) of at least a portion of the sample (102) recorded by a scanning electron microscope (124). The two or more parameters (A1, A2) of the nanomanipulator (104) and / or the sample (102) include the amount of charge (Q) at the surface (134) of the sample (102).

19. The method of any one of claims 13 to 18, wherein providing the allowable range of values ​​for the two or more parameters (A1, A2) includes providing and / or determining the location data (A3-A5) of the structure (148) of the sample (102).

20. The method of claim 19, wherein determining the location data (A3-A5) of the structure (348) of the sample (302) comprises: One or more images (346) of at least a portion of the sample (302), and The positional data (A3-A5) of the structure (348) of the sample (302) are determined by image analysis of the received one or more images (346) and / or by edge recognition of the edge (K) of the structure (348) in the received one or more images (356).

21. The method of claim 19 or 20, wherein determining the location data (A3-A5) of the structure of the sample (402) comprises: Receive an image (446) of at least a portion of the sample (402), wherein the image (446) captures a defect-free region (174) of a first portion (178) of the structure (448) and a defective region (176) of a second portion (180) of the structure (448) having at least one defect (428), and wherein the geometry (182) of the first portion (178) of the structure (448) corresponds to the geometry (184) of the second portion (180) of the structure (448); The geometry (182) of the first portion (178) of the structure (448) in the defect-free region (174) is determined by image analysis; and Based on the determined geometry (182) of the first portion (178) of the structure (448) in the defect-free region (174), the location data of the second portion (180) of the structure (448) in the defective region (176) is determined.

22. The method of any one of claims 13 to 21, comprising: Receive at least a portion of the image (146) of the sample (102); Control the display device (140) to display the image (146); Receive the target position (T) of the measuring tip (106) in the image (146), the target position being input by the user through the graphical user interface (144); and The positioning unit (110) is fully automatically controlled to move the measuring tip (106) to the target position (T).

23. The method of any one of claims 13 to 22, comprising: Determine whether the duration (Δt) after receiving the last user input (G) is greater than a threshold value (Th); and If the duration (Δt) after receiving the last user input (G) is greater than the threshold value (Th), the positioning unit (110) is automatically controlled to move the measuring tip (106) into the determined allowable area (166) of the multidimensional parameter space (164).

24. The method of any one of claims 13 to 23, comprising: Receives a plurality of images (246) of at least a portion of the sample (202), wherein the images (246) acquire the structure (248) and / or markings of the sample (202) and the measuring tip (106); and Image analysis of the received image (246) is used to determine the offset movement (172) of the measuring tip (106) relative to the structure (248) and / or the mark of the sample (202); and / or The offset correction is determined based on the determined offset shift (172) and / or predetermined model data; and The positioning unit (110) is fully automatically controlled to move the measuring tip (106) according to the determined offset correction.

25. The method of any one of claims 13 to 24, comprising: The image recording device (124) is controlled to record a first image (546) of the defective portion (198) of the sample (502), the first image capturing a first structure (188) of the sample (502) and one or more defects (528) of the sample (502); The image recording device (124) is controlled to record a second image (546') of the defect-free portion (190) of the sample (502), the second image capturing a second structure (192) of the sample (502), the geometry (196) of which corresponds to the geometry (194) of the first structure (188) in the first image (546); The difference image (546”) is determined by subtracting the second image (546') from the first image (546); Image analysis based on the difference image (546”) determines the location data (P) of the one or more defects (528) acquired in the first image (546). P );as well as The image recording device (124) is controlled to record a third image (546''') of the defective portion (186) of the sample (502), wherein the one or more defects (528) captured in the first image (546) are positioned at a predetermined position (M) in the image (546).

26. The method of any one of claims 13 to 25, wherein the nanomanipulator (104) comprises a cantilever (108) mounted at a fixed angle (α) on the positioning unit (110) at a first end (112), and the measuring tip (106) is disposed at a second end (114) of the cantilever, and the sample (102, 602) is disposed on a rotatable sample stage (120), the method comprising: Receive an image (646) of at least a portion of the sample (102, 602), wherein the image (646) captures the structure (648) and defects (628) of the sample (102, 602); Determine the approach angle (β) of the measuring tip (106) to address the defect (628) such that the approach path (W) using the approach angle (β) is not limited by the structure (648) of the sample (102, 602); and The sample carrier stage (120) is controlled to rotate based on the determined approach angle (β), such that the fixed angle (α) of the measuring tip (106) corresponds to the approach angle (β).

27. An apparatus (100) for processing a sample (102), comprising: The nanomanipulator (104) includes a measurement tip (106) for processing the sample (102) and a positioning unit (110) for moving the measurement tip (106), and A control device (136) is configured to perform the method as claimed in any one of claims 1 to 8 or 13 to 26.

Images