Chip fracture property prediction device, control device, and chip fracture property prediction method

Abstract

The chip breakage prediction device includes: a storage unit that stores information related to the workpiece and tool used in the cutting process; a receiving unit that receives information related to the workpiece and tool used in the cutting process selected from the workpiece and tool information stored in the storage unit, and receives information indicating the feed rate and depth of cut; a calculation unit that uses the information received by the receiving unit to derive information for predicting whether the chip will break; and a display unit that displays the information for predicting whether the chip will break derived by the calculation unit.

Description

Technical Field

[0001] This invention relates to a chip fracture prediction device, a control device, and a chip fracture prediction method. Background Technology

[0002] Regarding chip breakage, one can usually refer to the appropriate range of chip breaker grooves listed in the tool manufacturer's product catalog. However, this appropriate range varies significantly depending on the material, so it should not be applied indiscriminately. Therefore, suitable conditions are generally determined gradually by changing the conditions and tools and conducting numerous experiments.

[0003] Furthermore, at the research level, studies have been conducted, such as Non-Patent Literature 1 below, using FEM (Finite Element Method) analysis software to predict whether chips will fracture. Non-Patent Literature 1 indicates that by using the thermo-elastic-plastic finite element method to analyze the chip fracture process, it confirmed consistency with experimental results. However, FEM analysis requires a long analysis time for each condition; therefore, FEM analysis is not suitable for predicting whether chips will fracture across a large number of tools or a wide range of conditions.

[0004] In addition, there are studies that theoretically understand chip fracture (for example, see Non-Patent Document 2 below). As disclosed in Non-Patent Document 2, the conditions for chip fracture can be obtained by using the chip fracture strain determined by the chip material and the tensile strain generated in the chip based on the chip thickness and the initial curl radius of the chip.

[0005] Non-patent document 1 presents a theoretical investigation using the thermo-elastic-plastic finite element method, while non-patent document 2 presents a theoretical understanding of chip fracture. However, these non-patent documents only present general theoretical investigations. Therefore, when setting cutting conditions for a specific workpiece in the machining process, these theoretical investigations may not be directly applicable.

[0006] Existing technical documents

[0007] Non-patent literature

[0008] Non-Patent Literature 1: Thermo-elastic-plastic finite element simulation of chip fracture process caused by chip breaker groove, Shinotsuka et al., Journal of the Institute of Precision Engineering, Vol. 62, No. 8, pp. 1161-1166, 1996

[0009] Non-Patent Literature 2: Research on Chip Breakers, Kazuo Nakayama, Proceedings of the Japan Society of Mechanical Engineers (Vol. 3), Vol. 27, No. 178, pp. 833-843, June 1961 Summary of the Invention

[0010] The purpose of this invention is to enable easy setting of cutting conditions during machining.

[0011] A chip breakage prediction device according to one aspect of the present invention includes: a storage unit storing information related to the workpiece and tool being cut; a receiving unit configured to receive information related to the workpiece and tool being cut, selected from the workpiece and tool stored in the storage unit, and to receive information indicating the feed rate and depth of cut of the cutting operation; a calculation unit configured to derive information for predicting whether the chip will break using the information received by the receiving unit; and a display unit configured to display the information for predicting whether the chip will break derived by the calculation unit.

[0012] One aspect of the present invention relates to a control device provided in a prediction system for predicting the fracturing property of chips during cutting, and connectable to an input / output device in a manner capable of communicating with the input / output device, and comprising: a storage unit storing information related to the workpiece and tool being cut; a receiving unit configured to receive from the input / output device information related to the workpiece and tool selected by the input / output device from the workpiece and tool stored in the storage unit, and to receive from the input / output device information indicating the feed rate and depth of cut of the cutting operation; a calculation unit configured to derive information for predicting whether chips will fracture using the information received by the receiving unit; and a communication unit configured to communicate with the input / output device such that the information for predicting whether chips will fracture derived by the calculation unit is displayed on the display unit of the input / output device.

[0013] The chip breakage prediction method according to one aspect of the present invention involves receiving information related to the workpiece and tool used in the cutting process, which is selected from the information stored in the storage unit, by a receiving unit. The receiving unit also receives information indicating the feed rate and depth of cut of the cutting process. Using the information received by the receiving unit, a calculation unit derives information for predicting whether the chip will break, and displays the information derived by the calculation unit on a display unit.

[0014] One aspect of the present invention relates to a chip fracture prediction method that receives information related to the workpiece and tool used in a cutting process, selected from information stored in a storage unit, from an input / output device. It also receives information from the input / output device indicating the feed rate and depth of cut in the cutting process. A calculation unit derives information predicting whether chips will fracture under the conditions of the workpiece, tool, feed rate, and depth of cut indicated by the information received from the input / output device. A communication unit communicates with the input / output device in such a way that the information derived by the calculation unit is displayed on the display unit of the input / output device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram illustrating the chip fracture prediction device according to the first embodiment.

[0016] Figure 2 This diagram shows an example of a display screen provided in the display section of the input / output unit included in the chip fracture prediction device.

[0017] Figure 3 This is a diagram used to illustrate the chamfer width b.

[0018] Figure 4 This is a diagram used to illustrate the chip thickness h.

[0019] Figure 5 This is a diagram used to illustrate the direction of chip outflow θd.

[0020] Figure 6 This is a diagram used to illustrate the cutting thickness t when the depth of cut d is greater than the tool tip radius R.

[0021] Figure 7 This is a graph used to illustrate the cutting thickness t when a is negative, as calculated by equation (6).

[0022] Figure 8 This is a diagram used to illustrate the cutting thickness t when using equation (8).

[0023] Figure 9 This is a diagram illustrating the calculation method for the rake angle α of the chip outflow direction θd and the chip breaking groove shape β (initial curl radius r0 of the chip).

[0024] Figure 10 This diagram illustrates the method for deriving the rake face and the bevel of the chip breaker groove.

[0025] Figure 11A This is a diagram used to illustrate a parallel blade.

[0026] Figure 11B This is a diagram used to illustrate a clamping type blade.

[0027] Figure 12 It is used to describe the fracture strain ε of the chip. c The diagram shows the method of decision-making.

[0028] Figure 13 This diagram represents the case where the chip thickness h is greater than the distance L from the tool tip to the apex of the chip breaker groove.

[0029] Figure 14 This is a diagram used to illustrate a method for predicting the fracture properties of chips.

[0030] Figure 15 This is a diagram illustrating an example of the prediction results obtained by the chip fracture prediction device.

[0031] Figure 16A This is a figure illustrating an example of the prediction results when the corrected tensile strain is used instead of the tensile strain.

[0032] Figure 16B This is a figure illustrating an example of the prediction results when the corrected tensile strain is used instead of the tensile strain.

[0033] Figure 16C This is a figure illustrating an example of the prediction results when the corrected tensile strain is used instead of the tensile strain.

[0034] Figure 17 This is a figure illustrating an example of the prediction results when the corrected tensile strain is used instead of the tensile strain.

[0035] Figure 18 This is a diagram showing an example of the prediction results when the chip thickness h is greater than the distance L from the tool tip to the apex of the chip breaker groove.

[0036] Figure 19 This is a diagram showing an example of the prediction results when the chip thickness h is greater than the distance L from the tool tip to the apex of the chip breaker groove.

[0037] Figure 20 This is a diagram schematically illustrating a prediction system that includes the control device involved in the second embodiment. Detailed Implementation

[0038] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0039] (First Embodiment)

[0040] like Figure 1As shown, the chip fracture prediction device 10 according to the first embodiment includes a control unit 12 for performing calculations, a storage unit 14 for storing processing programs and data, and an input / output unit 16 for inputting and outputting information. The control unit 12 has a central processing unit (CPU), which performs various calculations. During calculations, the control unit 12 appropriately utilizes the information input from the input / output unit 16 and the information stored in the storage unit 14.

[0041] The storage unit 14 stores information related to the workpiece being cut (workpiece information 14a) and information related to the tool (tool information 14b). The workpiece information 14a includes information related to the name of the workpiece, the value of the fracture strain, the shear angle, etc. The tool information 14b includes information related to the name of the tool holder, information related to the name of the insert, data indicating the cross-sectional shape of the insert in a specified direction, etc.

[0042] In addition, the storage unit 14 may also temporarily store information input through the input / output unit 16, as well as data and / or information used in calculations performed by the arithmetic unit 12b, which will be described later.

[0043] The input / output unit 16 includes a display unit 16a configured to display cutting conditions and calculation results. For example... Figure 2 As shown, the display screen 20 of the display unit 16a includes an input area 21 and a result output area 22. In the input area 21, information corresponding to the operation performed via the input unit 16b, such as a keyboard, is input. Furthermore, the input unit 16b may also be integrally formed with the display unit 16a.

[0044] The input area 21 includes a column 21a for workpiece, a column 21b for tool holder shape, a column 21c for insert shape, a column 21d for cutting conditions, and a column 21e for coolant conditions. In the workpiece column 21a, various workpieces are displayed in a drop-down list. Workpieces that can be selected as the cutting target can be chosen from this list. Based on the workpiece-related information stored in the storage unit 14, the workpieces displayed in the workpiece column 21a are retrieved. Information indicating the workpiece selected via the input / output unit 16 is input to the receiving unit 12a, described later.

[0045] In the tool holder shape section 21b, various tool holders are displayed in a drop-down menu. Users can select the tool holder from this list. Alternatively, the cross-cutting angle and cutting inclination angle can be manually entered. Information indicating the cross-cutting angle and cutting inclination angle is entered into the receiving unit 12a, described later.

[0046] In the blade shape section 21c, various blades are displayed in a drop-down list. The blade to be used can be selected from this list. Based on the information of the display tool stored in the storage unit 14, the blades displayed in the blade shape section 21c are retrieved. Additionally, the blade tip radius and tip angle can be specified. Information indicating the blade selected in section 21c, and information indicating the blade tip radius and tip angle specified in section 21c, are input to the receiving unit 12a, described later.

[0047] The cutting conditions section 21d includes an input box 21d1 for entering cutting speed, feed rate, and depth of cut, and an adjustment bar 21d2 located next to the input box 21d1. The feed rate is the amount of feed per revolution, and the depth of cut is the amount of cut in the radial direction.

[0048] The values ​​of cutting speed, feed rate, and depth of cut are input into input box 21d1. However, regarding feed rate and depth of cut, the values ​​input into input box 21d1 can be fine-tuned by moving the slider displayed in adjustment bar 21d2. Furthermore, the cutting speed is not used to calculate the tensile strain generated in the chips, which will be described later. Therefore, the input box 21d1 for cutting speed can be omitted. The information related to feed rate and depth of cut entered in this field 21d is input into the receiving unit 12a, which will be described later.

[0049] In the coolant condition section 21e, enter whether coolant is used. Furthermore, this entered information may not be used for chip breakage prediction. Therefore, the coolant condition section 21e can be omitted.

[0050] The results output area 22 includes sections 22a for contour plots, 22b for whether a fracture has occurred, 22c for fracture prediction values, 22d for fracture boundaries, and 22e for candidate tools. The contour plot displayed in section 22a is a graphical representation using a coordinate system with the cutting conditions as the axes. The contour plot uses contour lines to represent the distribution of tensile strain generated in the chips and shows the fracture boundary 22f where chips are present.

[0051] Figure 2 The contour plot shown uses the feed rate as the horizontal axis and the depth of cut as the vertical axis. Alternatively, the horizontal axis can be set to the depth of cut and the vertical axis to the feed rate.

[0052] In the contour map, the ranges of the displayed feed rate and depth of cut are set such that the feed rate and depth of cut shown in the information input in the input area 21 and received by the receiving unit 12a (described later) are located at the center of the contour map. Furthermore, it is determined that the range of displayed feed rate and depth of cut includes at least a range that is predicted to be actually adjustable, and the displayed range will not become excessively large relative to that range. Therefore, a contour map is created that makes it easy to determine the adjustment amount when adjusting the feed rate or depth of cut. This display control is performed through the display control function included in the control unit 12, and the control unit 12 provides the control information obtained through the display control function to the input / output unit 16 via the communication unit 12c.

[0053] The contour map displays symbols indicating the feed rate and depth of cut input in input area 21 and processed by the receiving unit 12a (described later). Figure 2 The symbol in the middle is "+", and the fracture boundary 22f is shown as a dashed line. The fracture boundary 22f represents the tensile strain generated in the chip when the feed rate and depth of cut are changed, which becomes the fracture strain ε. c The conditions are as follows. Additionally, the contour map shows contour lines representing the ratio of tensile strain to fracture strain. Furthermore, the distribution of tensile strain is displayed by differentiating the magnitude of the ratio according to specified values ​​using one or more methods selected from color, hue intensity, and brightness. Alternatively, differential values ​​can be used instead of ratios.

[0054] In the section 22b indicating whether the chip has broken, based on information derived from the calculation unit 12b (described later), a symbol is displayed indicating whether the chip is predicted to break, not break, or a value between breakage and non-breakage. This allows for a visual understanding of whether the chip has broken.

[0055] In the fracture prediction value section 22c, the tensile strain ε is displayed numerically under the conditions of feed rate and depth of cut, as input in the input area 21 and processed by the receiving unit 12a (described later). Additionally, in the fracture boundary section 22d, the fracture strain ε is displayed numerically. c The value of .

[0056] In the candidate tool section 22e, based on information derived from the calculation unit 12b (described later), a list of tools predicted to cause chip breakage is displayed. That is, regarding the workpiece selected in the input area 21, the calculation unit 12b calculates whether chip breakage will occur for all tools included in the information stored in the storage unit 14. Therefore, through this calculation, all tools are displayed in the candidate tool section 22e in a manner that prioritizes tools with high predicted chip breakage. In other words, the chip breakage potential of each tool is displayed in a summary. This display control is also performed through the display control function included in the control unit 12, which provides the control information obtained through the display control function to the input / output unit 16 via the communication unit 12c.

[0057] like Figure 1 As shown, the functions performed by the control unit 12 include a receiving unit 12a, a calculation unit 12b, and a communication unit 12c. The receiving unit 12a receives information related to factors affecting whether chips will break, such as cutting conditions. Specifically, information related to the workpiece and tool selected in the input area 21 of the input / output unit 16 is input from the input / output unit 16 to the receiving unit 12a. In addition, information indicating the feed rate and depth of cut input in the input area 21 of the input / output unit 16 is input from the input / output unit 16 to the receiving unit 12a. That is, the receiving unit 12a receives information related to the workpiece and tool selected from the workpiece and tool information 14b shown in the workpiece and tool information stored in the workpiece information 14a in the storage unit 14, and receives information indicating the feed rate and depth of cut input in the input / output unit 16.

[0058] The arithmetic unit 12b uses the information received by the receiving unit 12a to derive information for predicting whether the chip will break.

[0059] The communication unit 12c communicates with the input / output unit 16 in such a way that the information derived from the calculation unit 12b for predicting whether the chip will break is displayed in the result output area 22 of the display screen 20 of the display unit 16a included in the input / output unit 16. The information for predicting whether the chip will break includes the information displayed in the contour plot column 22a, the mark displayed in the breakage prediction column 22b, the tensile strain value displayed in the breakage prediction value column 22c, and the breakage strain value displayed in the breakage boundary column 22d.

[0060] Here, the derivation of information for predicting whether a chip will break, and the prediction and judgment of whether a chip will break, performed by the arithmetic unit 12b, will be explained in detail.

[0061] 30 chips Figure 3Whether fracture has occurred can be determined by comparing the tensile strain ε generated in the chips 30 during machining with the fracture strain ε of the material used in the machining process. c And based on the ratio of tensile strain ε to fracture strain ε c How much can be predicted?

[0062] The tensile strain ε generated in the chip 30 is obtained by the following equation (1). Here, h is the chip thickness and r0 is the initial curl radius of the chip. That is, the tensile strain ε is calculated based on the initial curl radius r0 and the chip thickness h of the chip 30.

[0063]

[0064] The tensile strain ε can also be replaced by the corrected tensile strain ε', which is corrected according to equations (2) and (3) below. Here, t is the cutting thickness, and b is the chamfer width or the tool tip radius. That is, the tensile strain ε can also be corrected to the corrected tensile strain ε' according to the relationship that represents the ratio of the cutting thickness t to the chamfer width or the tool tip radius b. However, since the upper limit of A is set to 1, A = 1 is set when the cutting thickness t is greater than the chamfer width or the tool tip radius b.

[0065]

[0066] Furthermore, although A squared is used in equation (2), A first or A cubed can also be used instead. Figure 3 As shown, the chamfer width *b* is the width of the flat surface portion formed by chamfering at the edge of the cutting edge. The cutting edge fillet radius *b* is the fillet radius at the edge of the cutting edge.

[0067] The chip thickness h is determined by... Figure 4 The geometric relationships shown determine that the calculation is performed according to the following equation (4). Here, t is the cutting thickness, Φ is the shear angle, and α is the rake angle.

[0068]

[0069] The cutting thickness t is calculated geometrically based on the cutting conditions and tool posture. Firstly, as... Figure 6 As shown, when the depth of cut d is greater than the tool tip radius R (refer to...) Figure 5 In the case of ), the cutting thickness t is calculated using the feed rate f, the cross-cutting angle θ, and equation (5). Furthermore, when the value of a calculated using the depth of cut d and the tool tip radius R according to equation (6) is negative, the cutting thickness t becomes the same as the depth of cut d; therefore, equation (7) is used. In addition, the case where the value of a calculated according to equation (6) is negative is... Figure 7The situation shown. In other cases, that is, when the depth of cut d is less than the tool tip radius R, and the value of a calculated according to equation (6) is positive, the cutting thickness t is calculated according to equation (8). Furthermore, in Figure 8 In the case shown, when using equation (8), the cutting thickness t is determined by the tool tip radius R, depth of cut d and feed rate f, regardless of the cross-cutting angle θ.

[0070]

[0071] The rake angle α is obtained based on the cross-sectional shape data of the cutting blade in a specified direction stored in the storage unit 14. The rake angle α is not constant at all points on the rake face. Therefore, the rake angle α is calculated using the outflow direction θd along the chip 30 (refer to...). Figure 5 The front angle α in the cross section of θd is obtained by the calculation unit 12b. Therefore, the front angle α in the cross section along the direction θd is derived by the calculation unit 12b and the front angle α is temporarily stored in the storage unit 14.

[0072] Assuming the chip 30 flows out in a direction perpendicular to the following straight line connecting the two ends of the insert (the two ends of the circumferential direction of the tool tip) in contact with the workpiece, the outflow direction θd of the chip 30 can be calculated using Colwell's approximation. That is, once the depth of cut d, feed rate f, and tool tip radius R are determined, it is as follows: Figure 5 As shown, based on these geometric relationships, the outflow direction θd of the chip 30 can be calculated.

[0073] The storage unit 14 stores the rake angle α1 in the cross section along the direction θ1 perpendicular to the cutting edge, and the rake angle α2 in the cross section along the direction θ2, which is the bisecting line of the blade tip angle. Therefore, the calculation unit 12b uses these rake angles α1 and α2 to calculate the rake angle α in the outflow direction θd corresponding to the cutting conditions (see reference). Figure 9 In addition, in Figure 9 In the diagram, θ2 on the horizontal axis corresponds to the direction along the bisecting line of the blade tip angle, and θ1 corresponds to the direction perpendicular to the cross-cutting edge.

[0074] Furthermore, the chip breaker shape is also derived in the same way. That is, the storage unit 14 stores data representing the chip breaker shape in a specified direction. This specified direction is the direction θ1 perpendicular to the cross-cutting edge and the direction θ2 along the bisecting line of the blade tip angle. Moreover, the calculation unit 12b calculates the chip breaker shape β (or the initial chip curl radius r0) in the chip outflow direction θd corresponding to the cutting conditions by interpolation or extrapolation based on the chip breaker shapes β1 and β2 (or the initial chip curl radius r0) in the two directions θ1 and θ2 stored in the storage unit 14.

[0075] like Figure 10As shown, the rake angles α1 and α2 are calculated based on the gradient of the cross section in the corresponding direction of the rake face 27 of the insert when the rake face 27 is linearly approximated (or, the gradient of the flat portion) and the distance calculated from the tip position (i.e., the intercept value when the tip position is taken as the origin position). Furthermore, the chip breaker shapes β1 and β2 are calculated based on the gradient of the cross section in the corresponding direction of the chip breaker slope 28 of the insert when the chip breaker slope 28 is linearly approximated (or, the gradient of the flat portion).

[0076] The shear angle Φ is obtained by conducting a cutting test and is stored in the storage unit 14. Table 1 shows an example of the cutting speed, cutting thickness t, and rake angle α used in the cutting test. The storage unit 14 also stores information representing the shear angle Φ, which also includes data on the shear angle Φ obtained from cutting tests conducted under other conditions.

[0077]

[0078] In the cutting test, the actual thickness of the chip 30 was measured. The shear angle Φ was calculated by substituting the actual measured chip thickness into the chip thickness h in equation (4). Table 2 shows an example of the chip thickness and calculated shear angle obtained by cutting test for S45C as the workpiece.

[0079]

[0080] The initial curl radius r0 of the chip 30 is calculated based on the blade and... Figure 11A and Figure 11B The difference lies in which of the parallel and clamping patterns is matched. For Figure 11A In the parallel type shown, because the chip breaker groove slope 28 is small, the chip 30 contacts the portion of the cutting edge 32 in the rake face 27 and the vertex 29 of the chip breaker groove. Therefore, the initial curl radius r0 is geometrically calculated as the radius of the arc that contacts the cutting edge 32 and the vertex 29 of the chip breaker groove. On the other hand, for Figure 11B In the clamping type shown, the chip 30 contacts the portion of the cutting edge 32 in the rake face 27 and the chip breaker groove slope 28. Therefore, the initial curl radius r0 is calculated geometrically as the radius of the arc that contacts the cutting edge 32 and the chip breaker groove slope 28. Furthermore, the shape of the chip breaker groove derived from the calculation unit 12b is used to determine whether it is a parallel type or a clamping type.

[0081] Furthermore, similar to the rake angle α, the initial curl radius r0 in the chip outflow direction θd corresponding to the cutting conditions is used as the initial curl radius. That is, the storage unit 14 stores the initial curl radius r1 in the cross section in the direction θ1 perpendicular to the cross-cutting edge (refer to...). Figure 9 ), and the initial curl radius r2 in the cross section along the direction θ2 of the bisecting line of the blade tip angle (refer to Figure 9 Furthermore, the calculation unit 12b uses these initial curling radii r1 and r2 to calculate the initial curling radius r0 in the outflow direction θd corresponding to the cutting processing conditions by interpolation or extrapolation.

[0082] As described above, the tensile strain ε is derived from equation (1). On the other hand, the chip fracture strain ε can be obtained through cutting tests performed with gradually changing conditions. c The storage section 14 stores the fracture strain ε obtained from cutting tests for each workpiece. c The value of ε. That is, the fracture strain ε obtained by cutting tests with different cutting conditions (depth of cut d and feed rate f). c The value is stored in storage unit 14 in association with the material being cut.

[0083] Figure 12 This is an example of determining whether chip 30 has broken. This example is a result of using S45C as the workpiece. A case where chip 30 has not broken is marked as "×", a case where chip 30 has partially broken but has more than 10 turns is marked as "△", and a case where chip 30 has broken within 10 turns is marked as "〇".

[0084] Regarding the tensile strain ε of the chip 30 calculated in each cutting test, the value at which the tensile strain ε is at its minimum when the chip 30 is judged to have fractured (denoted as "0") is set as the chip fracture strain ε. c The chip fracture strain ε of each workpiece c The value is stored in storage unit 14 in association with the name of the material being cut.

[0085] As described above, the tensile strain ε is calculated according to equation (1), and this tensile strain ε is compared with the fracture strain ε. c By making comparisons, the fracturing property can be predicted. However, as... Figure 13 As shown, when the chip thickness h is greater than the distance L from the tool tip 32 to the apex 29 of the chip breaker groove, that is, when

[0086] h>L ···Equation (9)

[0087] If this condition is met, the arithmetic unit 12b outputs information indicating that the chip 30 is predicted not to break. That is, based on the tensile strain ε and the fracture strain ε... c In the fracture prediction comparison, it was determined that the smaller the distance L from the tool tip 32 to the apex 29 of the chip breaker groove, the easier it is to fracture. However, in reality, if the chip breaker groove is too small, then... Figure 13As shown, the chip 30 will not bend due to the chip breaker groove, but will pass through the chip breaker groove, and the chip 30 will not break. In order to improve the predictability of fracture when this phenomenon occurs, a fracture prediction is added when Equation (9) holds.

[0088] Next, refer to Figure 14 This describes a method for predicting the fracture properties of a chip 30 using the chip fracture prediction device 10 according to the first embodiment.

[0089] To perform cutting operations on the workpiece, cutting conditions need to be set. A chip fracture prediction device 10 is used to set these conditions. The user uses the chip fracture prediction device 10 to input necessary information to the input / output unit 16, which then outputs the chip fracture prediction result. The cutting conditions are then determined based on this prediction result.

[0090] First, the user selects the workpiece to be cut in the workpiece field 21a of the input area 21 in the input / output unit 16, and selects the tool holder and blade to be used in the tool holder shape field 21b and blade shape field 21c (step ST11). Then, information related to the selected workpiece and tool is retrieved from the information stored in the storage unit 14 related to the workpiece and tool, and this information is input to the receiving unit 12a. At this time, if the user inputs values ​​for the cross-cutting angle, cutting angle, tool tip radius R, and tool tip angle, this information is also input to the receiving unit 12a.

[0091] Additionally, the user inputs the cutting speed, feed rate f, and depth of cut d in the cutting conditions section 21d (step ST12). This information is also input to the receiving unit 12a. Furthermore, these cutting condition values ​​are provisional; if it is predicted that the chip 30 will not break, the cutting conditions are re-entered. It is also possible to change the tool holder and inserts based on the prediction results.

[0092] After the information required for the cutting process is input to the receiving unit 12a, the calculation unit 12b uses the information received by the receiving unit 12a to derive information for predicting whether the chip 30 will break. Specifically, the calculation unit 12b first calculates the cutting thickness t based on the relationship between the depth of cut d and the tool tip radius R, using any one of equations (5), (7) and (8) (step ST13).

[0093] Furthermore, the calculation unit 12b uses the depth of cut d, feed rate f, and cutting edge radius R to calculate the chip outflow direction θd (step ST14). The chip outflow direction θd is calculated using an approximation, such as Colwell's formula, stored in the storage unit 14. The calculation unit 12b then uses the calculated chip outflow direction θd, the rake angles α1 and α2 stored in the storage unit 14, and the initial curl radii r1 and r2 of the chip to calculate the rake angle α and the initial curl radius r0 of the chip in that direction θd (steps ST15 and ST16).

[0094] Next, the calculation unit 12b calculates the chip thickness h by substituting the cutting thickness t obtained in step ST13, the rake angle α obtained in step ST15, and the shear angle Φ stored in the storage unit 14 into equation (4) (step ST17). In addition, the calculation unit 12b derives the tensile strain ε by substituting the initial curl radius r0 obtained in step ST16 and the chip thickness h obtained in step ST17 into equation (1) (step ST18).

[0095] At this point, if it is determined that the chamfer width or tip radius b of the selected insert is larger than the cutting thickness t, the corrected tensile strain ε' calculated according to Equation (2) is used instead as the tensile strain ε of Equation (1) (step ST19).

[0096] The derived tensile strain ε (or, the corrected tensile strain ε') is displayed in the fracture prediction value column 22c of the result output area 22 of the input / output unit 16. Additionally, the fracture strain ε... c The value is displayed in the fracture boundary column 22d of the result output area 22 of the input / output unit 16 (step ST20).

[0097] Next, the calculation unit 12b compares the tensile strain ε (or the corrected tensile strain ε') derived in step ST18 with the fracture strain ε stored in the storage unit 14. c Determine the fracture properties of chip 30 (step ST21).

[0098] The communication unit 12c communicates with the input / output unit 16. Therefore, based on the derived tensile strain ε (or, the corrected tensile strain ε') and the fracture strain ε... c The comparison results are displayed in the "Whether it is fractured" column 22b of the result output area 22 of the input / output unit 16, showing symbols such as 〇, △, × indicating fracture (step ST22). For example, if the value of the tensile strain ε (or, the corrected tensile strain ε') is higher than the fracture strain ε, the fracture result is displayed. c If the value is above the specified value, "0" will be displayed. That is, in this case, the result predicting that the chip will break will be displayed.

[0099] Furthermore, the calculation unit 12b derives the tensile strain ε (or, corrected tensile strain ε') not only when the depth of cut d and feed rate f are selected, but also when the depth of cut d and feed rate f are within a specified range including these values. That is, the calculation unit 12b derives information for predicting whether the chip will break for various cases where the cutting conditions are changed within the range of feed rate and depth of cut shown in the contour plot. Additionally, the calculation unit 12b extracts the fracture strain ε for the depth of cut d and feed rate f within these ranges. c .

[0100] Next, the communication unit 12c outputs information for generating a contour plot related to the tensile strain ε (or, corrected tensile strain ε') for the specified depth of cut d and feed rate f. Additionally, the communication unit 12c communicates with the input / output unit 16 by outputting information for displaying the contour plot image on the display screen 20 of the display unit 16a in the input / output unit 16 (step ST23). The contour plot is then displayed on the display screen 20 of the display unit 16a. The fracture strain ε at each depth of cut d and feed rate f is also displayed in the contour plot image. c That is, the communication unit 12c communicates with the input / output unit 16 based on the information derived from the arithmetic unit 12b. As a result, the display unit 16a of the input / output unit 16 displays an image that shows the distribution of tensile strain ε generated in the chip using contour lines in a coordinate system with the cutting conditions as the coordinate axis, and shows the fracture boundary 22f of the chip.

[0101] Furthermore, the calculation unit 12b compares the tensile strain ε (or, the corrected tensile strain ε') with the fracture strain ε for all tools included in the tool information 14b stored in the storage unit 14, based on the selected workpiece. c Therefore, for each tool, it is calculated whether the chip 30 will break. As a result, all registered tools are displayed in the candidate tool column 22e in the order in which the chip is determined to be prone to breakage (step ST24).

[0102] If it is determined that chip 30 will break under the input cutting conditions, the user can simply perform cutting of the workpiece under the input cutting conditions. Conversely, if it is determined that chip 30 will not break under the input cutting conditions, the user can simply refer to the displayed contour map and change to the cutting conditions predicted to cause breakage. Alternatively, the cutting conditions can be changed, and the chip breakage prediction device 10 can be used again to predict chip breakage. Alternatively, the user can change to the tool displayed as a candidate tool and perform cutting of the workpiece.

[0103] Next, we will introduce an example of fracture prediction results obtained by changing the depth of cut d and feed rate f. Figure 15 It is Figure 12 The diagram shown is formed by superimposing the symbols (〇△×) representing the chip fracture state onto the contour map obtained by the chip fracture prediction device 10. Thus, the prediction results are largely consistent with the experimental results. Furthermore, as the depth of cut decreases from around 1.2 mm, the fracture site curves smoothly. This is because when the depth of cut d is less than or equal to the tool tip radius R (1.2 mm), the chip exit angle changes drastically. However, it is known that because the chip breaker groove shape (initial curl radius r0) and the rake angle α on the chip exit direction θd are used, the chip fracture characteristic can be predicted.

[0104] Figures 16A-16C This represents the prediction result when the corrected tensile strain ε' is used instead of the tensile strain ε. When the chamfer width b is large, the prediction results related to whether fracture occurs will be biased. However, it is evident that using the corrected tensile strain ε' instead of the tensile strain ε improves the prediction accuracy. Furthermore, it is known that using A... 2 The correction value is different from using A or A 3 Compared to the case of corrected values, the prediction accuracy is improved.

[0105] in addition, Figure 17 This also represents the prediction result when the corrected tensile strain ε' is used instead of the tensile strain ε. Figure 17 This represents actual chip photographs, contour plots based on tensile strain ε, and contour plots based on corrected tensile strain ε'. For example, the results of test case No. 4, where chip 30 did not fracture, show that fracture was predicted in the fracture prediction based on tensile strain ε, but not in the fracture prediction based on corrected tensile strain ε'. Therefore, it can be seen that the prediction accuracy is improved by using corrected tensile strain ε' instead of tensile strain ε.

[0106] Figure 18 This illustrates an example of a result when the chip thickness h is greater than the distance L from the tip 32 to the apex 29 of the chip breaker groove. In this case, the arithmetic unit 12b outputs information indicating that the chip 30 will not break. The upper right portion of the figure represents the area where breakage will not occur. Furthermore, regarding the 0△× obtained from the experimental results, △ is displayed within this area. Therefore, it can be said that it is possible to predict that the chip 30 will not break due to excessive thickness.

[0107] in addition, Figure 19This is also an example of the result when the chip thickness h is greater than the distance L from the tool tip 32 to the apex 29 of the chip breaker groove. This example shows the result when the tool is changed, and a photograph of the chip is also shown. It can be seen that the photograph of the chip is consistent with the predicted result.

[0108] As explained above, in the chip breakage prediction device 10 according to this embodiment, the receiving unit 12a receives information related to the workpiece and tool, and information indicating the feed rate and depth of cut. Then, the calculation unit 12b derives information for predicting whether the chip 30 will break, based on the workpiece, tool, feed rate f, and depth of cut d indicated by the information received by the receiving unit 12a. This derived information is displayed on the display unit 16a. Therefore, the tester can determine whether the chip 30 will break based on the information displayed on the display unit 16a. Furthermore, even if the chip 30 is predicted not to break, by changing at least one of the feed rate f and depth of cut d, information related to breakage prediction can be obtained again. Therefore, the conditions for performing cutting operations can be easily set.

[0109] Furthermore, in this embodiment, when the tool's chamfer width or tip radius b is large relative to the cutting thickness t, the tensile strain ε is replaced by the corrected tensile strain ε'. That is, the influence of the tool's chamfer width or tip radius b on the tensile strain ε of the chip 30 is taken into account. Therefore, the predictability of chip 30 fracture can be further improved.

[0110] Furthermore, although the result output area 22 of the display unit 16a displays a contour plot, a determination of whether a fracture has occurred, a fracture prediction value, and a fracture boundary 22f, this is not a limitation. The display unit 16a may, for example, only display the contour plot, or only display the determination of whether a fracture has occurred, or only display the fracture prediction value and the fracture boundary 22f. Additionally, the display of candidate tools may be omitted.

[0111] Furthermore, although in this embodiment, the tensile strain ε is replaced by the corrected tensile strain ε', this process can be omitted when the known cutting thickness t is less than or equal to the chamfer width or the tool tip radius b.

[0112] In this embodiment, the calculation unit 12b calculates the initial curl radius r0 and rake angle α in the chip outflow direction θd of the cutting process, and uses the calculated initial curl radius r0 and rake angle α to perform a calculation to predict the fracture rate. However, it is not limited to this. That is, although the prediction accuracy may decrease, it is also possible not to derive the initial curl radius r0 and rake angle α in the chip outflow direction θd. In this case, for example, the initial curl radius r0 and rake angle α in the direction θ1 perpendicular to the cross-cutting edge can be used, or the initial curl radius r0 and rake angle α in the direction θ2 along the bisecting line of the blade tip angle can be used.

[0113] (Second Implementation)

[0114] The second implementation method is as follows: Figure 20 As shown, a control device 41 is provided in a prediction system 40 for predicting the fracture properties of chips during cutting. Furthermore, the same reference numerals are used for the same components as in the first embodiment, and their detailed descriptions are omitted.

[0115] The control device 41 can be connected to the input / output device 42, for example, via a computer network NW, in a manner that enables communication with the input / output device 42. The control device 41 includes a control unit 12 for performing arithmetic processing and a storage unit 14 for storing processing programs and data.

[0116] The input / output device 42 includes a display unit 16a with a display screen 20 and an input unit 16b such as a keyboard. The display unit 16a displays cutting conditions and calculation results. (Refer to the display screen 20 of the first embodiment). Figure 2 Similarly, the display screen 20 of the display unit 16a includes an input area 21 and a result output area 22. In the input area 21, information input through the operation of the input unit 16b is displayed. This input information is temporarily stored in the storage unit 14 of the control device 41, for example, via a computer network NW. Furthermore, the input unit 16b may also be integrally formed with the display unit 16a.

[0117] The storage unit 14 stores information related to the workpiece being cut (workpiece information 14a) and information related to the tool (tool information 14b). In addition, the storage unit 14 may also temporarily store information sent from the input / output device 42, and / or data and / or information used in calculations performed by the arithmetic unit 12b.

[0118] The functions performed by the control unit 12 include a receiving unit 12a, a calculation unit 12b, and a communication unit 12c. The communication unit 12c sends necessary control information to the input / output device 42 so that the workpiece and tool represented by the information stored in the storage unit 14 are displayed on the display screen 20 of the input / output device 42.

[0119] When performing calculations, the control unit 12 utilizes the information stored in the storage unit 14, as well as the information output from the input / output device 42 and temporarily stored in the storage unit 14 via the computer network NW.

[0120] The receiving unit 12a receives information from the input / output device 42 regarding factors affecting whether chips will break, such as cutting conditions. Specifically, information about the workpiece and tool selected in the input area 21 of the input / output device 42 is input from the storage unit 14 to the receiving unit 12a. Additionally, information indicating the feed rate f and depth of cut d input in the input area 21 of the input / output device 42 is input from the input / output device 42 to the receiving unit 12a. In other words, the receiving unit 12a receives information related to the workpiece and tool selected in the input / output device 42 that is the object of cutting, as indicated by the information stored in the storage unit 14, and also receives information indicating the feed rate f and depth of cut d.

[0121] The arithmetic unit 12b uses the information received by the receiving unit 12a to derive information for predicting whether the chip will break.

[0122] The communication unit 12c communicates with the input / output device 42 in such a way that the information derived by the calculation unit 12b for predicting whether the chip will break is displayed in the result output area 22 of the display screen 20 of the display unit 16a of the input / output device 42.

[0123] The control device 41 involved in the second embodiment performs... Figure 14 The control steps shown are steps ST13 to ST19 and ST21. In addition, the control device 41 communicates with the input / output device 42 in such a way that the input / output device 42 performs steps ST20, ST22 to ST24.

[0124] Although descriptions of other structures, functions, and effects are omitted, the description of the first embodiment can be referenced in the second embodiment.

[0125] (Other implementation methods)

[0126] Furthermore, the embodiments disclosed herein should be considered illustrative in all respects and not limiting. The present invention is not limited to the described embodiments, and various modifications and improvements can be made without departing from its spirit.

[0127] Here, the implementation method is described in summary.

[0128] (1) The chip breakage prediction device according to the embodiment includes: a storage unit that stores information related to the workpiece and tool of the cutting process; a receiving unit that is configured to receive information related to the workpiece and tool of the cutting process selected from the workpiece and tool stored in the storage unit, and to receive information indicating the feed rate and depth of cut of the cutting process; a calculation unit that is configured to derive information for predicting whether the chip will break using the information received by the receiving unit; and a display unit that is configured to display the information for predicting whether the chip will break derived by the calculation unit.

[0129] In the chip fracture prediction device, the receiving unit receives information related to the workpiece and the tool being cut, as well as information indicating the feed rate and depth of cut. Then, the calculation unit derives information predicting whether the chip will fracture, based on the information received by the receiving unit regarding the workpiece, tool, feed rate, and depth of cut. This derived information is displayed on the display unit, thus allowing determination of whether the chip will fracture based on the information displayed. Furthermore, even if chip fracture is predicted not to occur, information related to fracture prediction can be obtained again by changing at least one of the feed rate and depth of cut. Therefore, conditions for the cutting process can be easily set.

[0130] (2) The calculation unit may also be configured to: calculate the tensile strain generated in the chip of the cutting process based on the initial curl radius and chip thickness of the chip, and be configured to: correct the tensile strain by using the chamfer width or tip radius of the tool represented by the information received by the receiving unit, and the cutting thickness obtained by the tip radius of the tool, the cross-cutting angle of the tool, the feed rate and the depth of cut represented by the information received by the receiving unit.

[0131] In this technical solution, the influence of the tool's chamfer width or tip radius and cutting thickness on the tensile strain of the chip is considered, thus further improving the predictability of chip fracture.

[0132] In other words, when there is a large chamfer or tool tip radius compared to the cutting thickness determined by the cutting conditions, the chip shape is determined by the chamfer or tool tip radius, regardless of the chip breaker located behind it. Therefore, contrary to the initial assumption (that the initial curl radius of the chip is determined geometrically by the chip breaker), the accuracy of predicting whether the chip will break may decrease. In contrast, in this technical solution, tensile strain is corrected, thus avoiding such a decrease in prediction accuracy.

[0133] (3) The calculation unit may also be configured to: obtain the initial curl radius and rake angle in each section based on the cross section of the tool perpendicular to the cross-cutting edge and the bisection of the tool tip angle represented by the information received by the receiving unit, and be configured to: calculate the initial curl radius and rake angle in the chip outflow direction of the cutting process by interpolation or extrapolation based on the initial curl radius and rake angle in each obtained cross section.

[0134] In this technical solution, the initial curl radius and rake angle of the chip outflow direction are taken into account, thus further improving the predictability of chip breakage.

[0135] In other words, even when using the same tool, the chip outflow direction varies depending on the cutting conditions or the workpiece. Therefore, because the tool profile changes in the chip outflow direction, the shape of the chip breaker groove, which affects chip fracture properties, also changes. Thus, while a three-dimensional understanding of the tool shape is practically necessary, in this case, saving 3D data and processing it according to the cutting conditions requires complex steps. In contrast, in this technical solution, the initial curl radius and rake angle in the chip outflow direction during cutting are calculated by interpolation or extrapolation based on the initial curl radius and rake angle obtained from each profile. Therefore, complex steps are eliminated. Furthermore, the analysis time for each condition is not increased as with the FEM analysis method.

[0136] (4) The display unit may also be configured to display an image as information for predicting the fracture properties of the chip, wherein the image is in a coordinate system with the cutting conditions as the coordinate axis, showing the distribution of tensile strain generated in the chip represented by contour lines, and showing the fracture boundary of the chip.

[0137] In this technical solution, if the information derived from the calculation unit predicts that the chip will not break, the cutting conditions for chip breakage can be easily inferred by referring to the image displayed on the reference display unit.

[0138] (5) The display unit may also be configured to display the distribution of tensile strain generated in the chip by selecting one or more methods from color, hue intensity and brightness.

[0139] In this technical solution, the distribution of tensile strain can be easily identified in the image displayed on the display unit.

[0140] (6) The calculation unit may also be configured to compare the distance from the tip of the tool to the top of the chip breaker groove with the chip thickness, and predict that the chip will not break if the chip thickness is large.

[0141] When the chip thickness is large relative to the chip breaker groove shape, the chip rigidity is too high, and the chip will not enter the bottom of the chip breaker groove. Therefore, the chip will not form the expected shape along the chip breaker groove, and the accuracy of fracture prediction may decrease. In contrast, in this technical solution, fracture prediction is made by comparing the distance from the cutting tool tip to the apex of the chip breaker groove with the chip thickness during cutting. Therefore, a decrease in prediction accuracy can be prevented.

[0142] (7) The arithmetic unit may also be configured to calculate the chip fracture characteristics of all tools represented by the information stored in the storage unit. Furthermore, the display unit may also be configured to display the chip fracture characteristics of each tool at a glance based on the information derived from the arithmetic unit.

[0143] In this technical solution, the fracture properties of the chips from each tool are displayed in a single view on the display unit. Therefore, even if the information derived from the calculation unit predicts that the chips will not fracture, it is possible to determine which tool has the potential to improve fracture properties based on the overview of tool fracture properties displayed on the display unit. Thus, it is expected that the fracture properties of the chips can be improved.

[0144] (8) The control device according to the embodiment is provided in a prediction system for predicting the fracturing property of chips in cutting processes, and can be connected to the input / output device in a manner that enables communication with the input / output device, and includes: a storage unit that stores information related to the workpiece and tool in the cutting process; a receiving unit configured to receive from the input / output device information related to the workpiece and tool selected by the input / output device from the workpiece and tool stored in the storage unit, and to receive from the input / output device information indicating the feed rate and depth of cut in the cutting process; a calculation unit configured to derive information for predicting whether the chips will fracture using the information received by the receiving unit; and a communication unit configured to communicate with the input / output device in a manner that displays the information for predicting whether the chips will fracture derived by the calculation unit on the display unit of the input / output device.

[0145] In the control device, the receiving unit receives information related to the workpiece and the tool used for cutting, as well as information indicating the feed rate and depth of cut. Next, the calculation unit derives information for predicting whether the chip will break, based on the information received from the receiving unit regarding the workpiece, tool, feed rate, and depth of cut. This derived information is output from the communication unit and input to the input / output device. It is possible to determine whether the chip will break based on the information displayed on the display unit of the input / output device. Furthermore, even if chip breakage is predicted not to occur, by changing at least one of the feed rate and depth of cut, information related to chip breakage prediction can be obtained again. Therefore, the conditions for performing cutting operations can be easily set.

[0146] (9) The calculation unit may also be configured to: calculate the tensile strain generated in the chip of the cutting process based on the initial curl radius and chip thickness of the chip, and be configured to: correct the tensile strain using the chamfer width or tip radius of the tool represented by the information received by the receiving unit, and the cutting thickness obtained based on the tip radius of the tool, the cross-cutting angle of the tool, the feed rate and the depth of cut represented by the information received by the receiving unit.

[0147] (10) The calculation unit may also be configured to: obtain the initial curl radius and rake angle in each section based on the cross section of the tool perpendicular to the cross-cutting edge and the bisection of the tool tip angle represented by the information received by the receiving unit, and be configured to: calculate the initial curl radius and rake angle in the chip outflow direction of the cutting process by interpolation or extrapolation based on the initial curl radius and rake angle in each obtained cross section.

[0148] (11) The communication unit may also be configured to communicate with the input / output device in such a way that an image is displayed on the display unit, the image showing the distribution of tensile strain generated in the chip by contour lines in a coordinate system with the cutting conditions as the coordinate axis, and showing the fracture boundary of the chip.

[0149] (12) The communication unit may also be configured to communicate with the input / output device by displaying the distribution of tensile strain generated in the chips on the display unit by selecting one or more methods from color, hue intensity and brightness.

[0150] (13) The calculation unit may also be configured to compare the distance from the tip of the tool to the top of the chip break groove with the chip thickness, and predict that the chip will not break if the chip thickness is large.

[0151] When the chip thickness is large relative to the chip breaker groove shape, the chip rigidity is too high, and the chip will not enter the bottom of the chip breaker groove. Therefore, the chip will not form the expected shape along the chip breaker groove, and the accuracy of fracture prediction may decrease. In contrast, in this technical solution, fracture prediction is made by comparing the distance from the cutting tool tip to the apex of the chip breaker groove with the chip thickness during cutting, thus preventing a decrease in prediction accuracy.

[0152] (14) The arithmetic unit may also be configured to calculate the chip breakage characteristics of all tools represented by the information stored in the storage unit. Furthermore, the communication unit may be configured to communicate with the input / output device in such a way that an overview of the chip breakage characteristics of each tool based on the calculation results of the arithmetic unit is displayed on the display unit.

[0153] (15) The chip breakage prediction method according to the embodiment receives information related to the workpiece and tool of the cutting process selected from the information stored in the storage unit, and receives information indicating the feed rate and depth of cut of the cutting process. Using the information received by the receiving unit, the calculation unit derives information for predicting whether the chip will break, and displays the information derived by the calculation unit on the display unit.

[0154] In the chip fracture prediction method, the receiving unit receives information related to the workpiece and tool, as well as information indicating the feed rate and depth of cut. The calculation unit uses the information received by the receiving unit to derive information for predicting whether the chip will fracture. This derived information is displayed on the display unit. Therefore, it is possible to determine whether the chip will fracture based on the information displayed on the display unit. Furthermore, even if chip fracture is predicted not to occur, information related to fracture prediction can be obtained again by changing at least one of the feed rate and depth of cut. Therefore, it is easy to set the conditions for the cutting process.

[0155] (16) In the chip fracture prediction method, the calculation unit may also calculate the tensile strain generated in the chip during the cutting process based on the initial curl radius and chip thickness of the chip. In this case, the tensile strain may also be corrected by the calculation unit using the chamfer width or tip radius of the tool indicated by the information received by the receiving unit, and the cutting thickness obtained based on the tip radius of the tool, the cross-cutting angle of the tool, the feed rate, and the depth of cut indicated by the information received by the receiving unit.

[0156] (17) In the chip breakage prediction method, the calculation unit may obtain the initial curl radius and rake angle in each section based on the cross section of the tool perpendicular to the cross cutting edge and the bisection of the tool tip angle represented by the information received by the receiving unit. Furthermore, the calculation unit may calculate the initial curl radius and rake angle in the chip outflow direction of the cutting process by interpolation or extrapolation based on the initial curl radius and rake angle in each obtained cross section.

[0157] (18) In the chip breakage prediction method, the calculation unit may compare the distance from the cutting tool tip to the top of the chip breaker groove with the chip thickness, and predict that the chip will not break if the chip thickness is large.

[0158] When the chip thickness is large relative to the chip breaker groove shape, the chip rigidity is too high, and the chip will not enter the bottom of the chip breaker groove. Therefore, the chip will not form the expected shape along the chip breaker groove, and the accuracy of fracture prediction may decrease. In contrast, in this technical solution, fracture prediction is made by comparing the distance from the cutting tool tip to the apex of the chip breaker groove with the chip thickness during cutting, thus preventing a decrease in prediction accuracy.

[0159] (19) The chip breakage prediction method according to the embodiment receives information related to the workpiece and tool of the cutting process selected from the information stored in the storage unit from the input / output device, and receives information indicating the feed rate and depth of cut of the cutting process from the input / output device. The calculation unit derives information for predicting whether the chip will break under the conditions of the workpiece, tool, feed rate and depth of cut indicated by the information received from the input / output device. The communication unit communicates with the input / output device in such a way that the information derived by the calculation unit is displayed on the display unit of the input / output device.

[0160] In the chip breakage prediction method, information representing the workpiece, tool, feed rate, and depth of cut is received, and information for predicting whether the chip will break under the conditions of the workpiece, tool, feed rate, and depth of cut indicated by the information is derived. This derived information is displayed on a display unit via communication with the display unit of an input / output device. It is possible to determine whether the chip will break based on the displayed information. Furthermore, even if chip breakage is predicted not to occur, information related to the breakage prediction can be obtained again by changing at least one of the feed rate and depth of cut. Therefore, the conditions for performing cutting operations can be easily set.

[0161] As explained above, according to the described embodiment, cutting conditions can be easily set during cutting operations.

[0162] This application is based on Japan Patent Application No. 2023-198389 filed with the Japan Patent Office on November 22, 2023, the contents of which are incorporated herein by reference.

Claims

1. A chip fracture prediction device, characterized in that... include: The storage section stores information related to the workpiece and tools used in the cutting process; The receiving unit is configured to receive information related to the workpiece and the tool used, which are selected from the workpiece and the tool stored in the storage unit, and to receive information indicating the feed rate and depth of cut of the cutting process. The arithmetic unit is configured to use the information received by the receiving unit to derive information for predicting whether the chip will break. as well as The display unit is configured to display information derived by the calculation unit for predicting whether the chip will break.

2. The chip fracture prediction device according to claim 1, characterized in that, The calculation unit is configured to: calculate the tensile strain generated in the chips during the cutting process based on the initial curl radius and chip thickness of the chips, and is configured to: correct the tensile strain using the chamfer width or tip radius of the tool represented by the information received by the receiving unit, and the cutting thickness obtained based on the tip radius of the tool, the cross-cutting angle of the tool, the feed rate, and the depth of cut represented by the information received by the receiving unit.

3. The chip fracture prediction device according to claim 1, characterized in that, The calculation unit is configured to: obtain the initial curl radius and rake angle in each cross section based on the cross section of the tool perpendicular to the cross-cutting edge and the bisecting line of the tool's tip angle represented by the information received by the receiving unit; and is configured to: calculate the initial curl radius and rake angle in the chip outflow direction of the cutting process by interpolation or extrapolation based on the initial curl radius and rake angle in each obtained cross section.

4. The chip fracture prediction device according to claim 1, characterized in that, The display unit is configured to display an image as information for predicting the fracture properties of the chip, the image showing the distribution of tensile strain generated in the chip represented by contour lines in a coordinate system with the cutting conditions as the coordinate axes, and showing the fracture boundary of the chip.

5. The chip fracture prediction device according to claim 4, characterized in that, The display unit is configured to display the distribution of tensile strain generated in the chips by selecting one or more methods from color, hue intensity, and brightness.

6. The chip fracture prediction device according to claim 1, characterized in that, The calculation unit is configured to compare the distance from the tip of the tool to the apex of the chip breaker groove with the chip thickness, and predict that the chip will not break if the chip thickness is large.

7. The chip fracture prediction device according to claim 1, characterized in that, The arithmetic unit is configured to represent all tools for the information stored in the storage unit, and to handle the fragmentation of computational chips. The display unit is configured to display the fracturing properties of the chips from each tool at a glance, based on information derived from the calculation unit.

8. A control device, characterized in that, A prediction system is configured for predicting the fracture properties of chips during machining, and is connectable to an input / output device in a manner capable of communicating with the input / output device, and includes: The storage section stores information related to the workpiece and tools used in the cutting process; The receiving unit is configured to: receive from the input / output device information related to the workpiece and tool selected by the input / output device from the workpiece and tool stored in the storage unit; and receive from the input / output device information indicating the feed rate and depth of cut of the cutting process. The arithmetic unit is configured to: derive information for predicting whether a chip will break using the information received by the receiving unit; and The communication unit is configured to communicate with the input / output device in such a way that information derived by the calculation unit for predicting whether the chip will break is displayed on the display unit of the input / output device.

9. The control device according to claim 8, characterized in that, The calculation unit is configured to: calculate the tensile strain generated in the chips during the cutting process based on the initial curl radius and chip thickness of the chips, and is configured to: correct the tensile strain using the chamfer width or tip radius of the tool represented by the information received by the receiving unit, and the cutting thickness obtained based on the tip radius of the tool, the cross-cutting angle of the tool, the feed rate, and the depth of cut represented by the information received by the receiving unit.

10. The control device according to claim 8, characterized in that, The communication unit is configured to communicate with the input / output device in such a way that an image is displayed on the display unit, the image showing the distribution of tensile strain generated in the chip by contour lines in a coordinate system with the cutting conditions as the coordinate axes, and showing the fracture boundary of the chip.

11. The control device according to claim 10, characterized in that, The communication unit is configured to communicate with the input / output device by displaying the distribution of tensile strain generated in the chips on the display unit using one or more methods selected from color, hue intensity, and brightness.

12. The control device according to claim 8, characterized in that, The arithmetic unit is configured to represent all tools for the information stored in the storage unit, and to handle the fragmentation of computational chips. The communication unit is configured to communicate with the input / output device in such a way that a list of the fracturing characteristics of the chips of each tool based on the calculation results of the calculation unit is displayed on the display unit.

13. A method for predicting chip fracture properties, characterized in that, The receiving unit receives information related to the workpiece and tools selected from the information stored in the storage unit, and also receives information indicating the feed rate and depth of cut for the cutting process. Using the information received by the receiving unit, the calculation unit derives information for predicting whether the chip will break. The information derived from the arithmetic unit is displayed on the display unit.

14. The chip fracture prediction method according to claim 13, characterized in that, The calculation unit calculates the tensile strain generated in the chips during the cutting process based on the initial curl radius and chip thickness. The tensile strain is corrected by the calculation unit using the chamfer width or tip radius of the tool indicated by the information received by the receiving unit, and the cutting thickness obtained based on the tip radius of the tool, the cross-cutting angle of the tool, the feed rate, and the depth of cut indicated by the information received by the receiving unit.

15. A method for predicting chip fracture properties, characterized in that, The system receives information from the input / output device related to the workpiece and tool selected from the information stored in the storage unit, and also receives information from the input / output device indicating the feed rate and depth of cut. The arithmetic unit derives information to predict whether chips will break under the conditions of the workpiece, tool, feed rate, and depth of cut indicated by the information received from the input / output device. The communication unit communicates with the input / output device in such a way that the information derived by the calculation unit is displayed on the display unit of the input / output device.

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