Reconfigurable intelligent surface with dual-mode signal propagation in transmission and reflection space

Abstract

A reconfigurable smart surface is disclosed. This reconfigurable smart surface includes a switching layer that can transition from an insulating state to a metallic state and from a metallic state to an insulating state based on its temperature. A voltage is applied to the switching layer to control the temperature and thus control the state of the switching layer. Controlling the state of the switching layer allows the reconfigurable smart surface to operate in a transmission mode when the switching layer is in an insulating state and in a reflection mode when the switching layer is in a metallic state.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to reconfigurable smart surfaces. More specifically, at least some embodiments of the present invention relate to systems, hardware, software, computer-readable media, and methods for reconfigurable smart surfaces for reflecting and / or transmitting incident signals. Background Technology

[0002] Cellular wireless communication is primarily based on 5G technology. 5G wireless networks are generally designed to provide gigabit-level data speeds, very low latency, and a better user experience. These goals have largely been achieved. However, the telecommunications industry is now working to deliver sixth-generation (6G) wireless communication.

[0003] The advancement to 6G wireless communication will have stringent requirements, including extremely high spectrum and energy efficiency, microsecond-level latency, and full-dimensional network coverage. Current communication technologies, such as ultra-large-scale multiple-input multiple-output (UM-MIMO) and ultra-dense networks (UDN), are being expanded to meet these requirements.

[0004] However, these technological enhancements are not without challenges. The increased number of antennas / base stations and the use of high carrier frequencies could potentially lead to increased power consumption and hardware costs due to the need for more power-intensive and expensive radio frequency (RF) chains. Furthermore, the introduction of numerous active components operating at high frequencies can generate complex interference scenarios, pilot contamination, and severe hardware damage.

[0005] To address these issues, it is imperative to develop cost-effective wireless communication system strategies, and reconfigurable smart surfaces (RIS) are seen as a potential solution.

[0006] Traditional reconfigurable smart surfaces primarily focus on reflecting incident signals. Therefore, both the signal source and the signal target need to be on the same side of the reconfigurable smart surface, limiting its flexibility. Purely reflective reconfigurable smart surfaces are mainly used as passive relay nodes to adjust the direction of incident wireless signals, thereby improving the performance of wireless communication systems. While reconfigurable smart surfaces offer significant advantages, one limitation is their topological constraints. Because they only reflect event signals, the source (e.g., an access point or base station) and the destination (e.g., a user equipment) must be on the same side of the reconfigurable smart surface. This constraint reduces the flexibility of deploying these surfaces in various real-world scenarios where the transmitter and receiver may not be located on the same side of the reconfigurable smart surface. Furthermore, traditional reconfigurable smart surfaces cannot provide continuous beamforming. Attached Figure Description

[0007] To describe how at least some advantages and features of the present invention can be obtained, embodiments of the invention will be described in more detail with reference to the accompanying drawings. It should be understood that these drawings depict only typical embodiments of the invention and should not be considered as limiting its scope. Embodiments of the invention will be described and explained more specifically and in detail using the drawings, wherein:

[0008] Figure 1 Several aspects of a reconfigurable smart surface capable of operating in both transmission and reflection modes are disclosed.

[0009] Figure 2A Several aspects of a top view of a unit of a reconfigurable smart surface, including a patterned top layer, are disclosed;

[0010] Figure 2B Multiple aspects of the panel, which includes multiple units, have been disclosed;

[0011] Figure 2C It was made public. Figure 2B Multiple aspects of a partial cross-sectional view of a portion of a reconfigurable smart surface panel;

[0012] Figure 3 Several aspects of using lattice pairs and Floquet port simulation units are disclosed;

[0013] Figure 4 Several aspects of the resistivity versus temperature relationship of the cell, including the switching layer formed by VO2, are disclosed;

[0014] Figure 5 Several aspects of the time constant when the switching layer transitions from an insulating state to a metallic state or from a metallic state to an insulating state are disclosed;

[0015] Figure 6 Several aspects of the simulated reflection amplitude of cells of various sizes (e.g., S2 values) associated with the pattern of the metal layer on top of the cell are disclosed at 40 GHz.

[0016] Figure 7 Several aspects of the simulated transmission amplitude of cells with different S2 values ​​at 40 GHz were disclosed.

[0017] Figure 8 Several aspects of the simulated transmission phase response for units with different S2 values ​​are disclosed;

[0018] Figure 9 Several aspects of the method for using the operation panel are disclosed; and

[0019] Figure 10 Multiple aspects of the computing device, system, or entity have been disclosed. Detailed Implementation

[0020] Embodiments of the present invention generally relate to reconfigurable smart surfaces. More specifically, at least some embodiments of the present invention relate to systems, hardware, software, computer-readable media, and methods for selectively reflecting or transmitting signals incident on a reconfigurable smart surface.

[0021] Embodiments of the present invention also relate to reconfigurable smart surfaces capable of transmitting and reflecting wireless signals. A reconfigurable smart surface according to an embodiment of the present invention can operate as a relay node or a reflective node, which transmits signals to the other side of the reconfigurable smart surface. This provides greater flexibility for deploying reconfigurable smart surfaces and expanding their potential applications.

[0022] A reconfigurable smart surface is an engineered two-dimensional surface equipped with passive elements or cells, and may include metamaterials. A panel comprising a grid or cell arrangement is an example of a reconfigurable smart surface. Reconfigurable smart surfaces operate by manipulating the phase response of each cell. This modulates the propagation of incident wireless signals and enables a smart radio environment (SRE).

[0023] Embodiments of the present invention more specifically relate to reconfigurable smart surfaces capable of reflecting or transmitting wireless signals (electromagnetic waves). The reconfigurable smart surface can dynamically switch between a transmission mode and a reflection mode, thereby providing reconfigurable 360° environmental coverage. When operating in reflection mode, the reconfigurable smart surface behaves like an RF (radio frequency) reflector, reflecting the incident beam back to the same side. When operating in transmission mode, the reconfigurable smart surface operates as a lens, projecting the incident beam with high directionality to the other side. The reconfigurable smart surface can be deployed or mounted on surfaces such as windows, thereby selectively enhancing radio coverage on both sides of the surface or window.

[0024] Figure 1 Several aspects of reconfigurable smart surfaces have been disclosed. Figure 1 A reconfigurable smart surface 104 is shown, configured to operate in either a transmission mode 100 or a reflection mode 102. In transmission mode 102, an incident signal 106 is transmitted through the reconfigurable smart surface 104 and transmitted by the reconfigurable smart surface 104 as a signal 108. In reflection mode 102, an incident signal 110 is reflected by the reconfigurable smart surface 104 as a signal 112.

[0025] Reconfigurable smart surfaces typically comprise a structure of numerous elements / units. Because reconfigurable smart surfaces do not require a radio frequency (RF) chain, they offer a more economical and environmentally friendly alternative to traditional multi-antenna and repeater technologies. Embodiments of this invention relate to a reconfigurable smart surface including a switching layer that allows the reconfigurable smart surface to switch from a transmission mode to a reflection mode and from a reflection mode to a transmission mode.

[0026] Generally, a switching layer comprises a material configured to transition from a metallic state to an insulating state and vice versa. The transition can occur based on the material's temperature. Electrical energy can be used to change the temperature, for example, by applying a voltage. In one example, the switching layer comprises a vanadium dioxide (VO2) layer. This material, VO2, undergoes a phase transition from a metallic state to an insulating state depending on the material's temperature. In one example, electrical energy (e.g., an applied voltage) can be used to heat the switching layer. By controlling the temperature of the switching layer through an external voltage, the reconfigurable smart surface can dynamically switch in real time between a transmission mode (when VO2 is in the insulating state) and a reflection mode (when VO2 is in the metallic state).

[0027] In transmission mode, the reconfigurable smart surface simulates a lens to guide the incident beam to the other side with high precision. In reflection mode, the reconfigurable smart surface simulates an RF reflector to redirect the incident beam to the same side with high directivity along the reflection direction.

[0028] In transmission mode, which functions similarly to an optical lens, the reconfigurable smart surface modifies the phase shift of different lens sections during transmission, thereby collimating the incident wave. In reflection mode, the reflected signal from each element / unit is provided with a certain phase shift, so that constructive interference guides the reflected beam to the desired angle relative to the incident beam.

[0029] To allow for arbitrary phase across the aperture, a minimum phase range of 360° can be provided by each cell. Variations in the reflection phase of each cell are achieved by sizing the cell geometry. In one example, cells are arranged on a reconfigurable smart surface panel according to the desired phase distribution, thereby achieving constructive reflection signal gain in the desired direction. Embodiments of the invention provide desirable characteristics such as wide bandwidth, low reflection loss, low insertion loss, and a compact physical profile.

[0030] Figure 2A Several aspects of the unit are disclosed. A reconfigurable smart surface (e.g., a panel) may include multiple units arranged in a grid or other pattern and may be monolithically formed. Figure 2AA metallic pattern formed on the top surface of cell 200 is shown. By way of example only, the pattern includes a central portion 208 surrounded by concentric rings 206 and 204. In this example, the central portion 208 has a square shape. The concentric rings 206 and 204 also have square shapes in this example. The central portion 208 and the concentric rings 206 and 204 are collectively referred to as the ring or annular pattern 210. In one example, the construction of the metallic pattern for each cell can include any shape / number of discrete components, as long as the pattern resonates at the desired operating frequency. Therefore, the metallic pattern can include concentric constructions, solid shapes (e.g., cross-shaped or X-shaped), etc.

[0031] The following example describes a specific pattern and illustrates how that pattern can be changed. This example is presented as an example only and not as a limitation. In one example, the dimensions (S3 x S3) of the outer ring 204 and the dimensions (S1 x S1) of the center portion 208 are constant. The dimensions (S2 x S2) of the inner ring or middle ring 206 in the unit of the panel can vary in different embodiments. Other embodiments allow variations in the dimensions of the center portion 208, as well as the rings 206 and 204. More generally, for any given embodiment, the dimensions satisfy the following condition: Furthermore, the thickness 212 of rings 204 and 206 can also vary, and can be the same or different.

[0032] Generally, the central portion 208, along with rings 206 and 204, is constructed (e.g., sizing, shaping, and positioning) to resonate with a specific frequency or frequency range. By way of example and not limitation, embodiments of the invention relate to the transmission and reflection of signals (electromagnetic radiation) in the range of 30 GHz to 300 GHz. In one example, the cell design / pattern can be frequency-independent and can depend on the size of the cells and the spacing between them. Therefore, the design of the cells or reconfigurable smart surface can be scaled to operate at lower or higher frequencies, including terahertz frequencies.

[0033] Figure 2B Several aspects of the panel, which includes multiple units, have been disclosed. Figure 2C A top view 252 and a bottom view 254 of panel 250 are shown in more detail. Panel 250 includes a plurality of cells, such as cell 256, arranged in a pattern. The pattern of the cells in panel 250 is typically grid-shaped. However, the pattern of the cells can vary.

[0034] Panel 250 can be monolithically formed or heterogeneously integrated. Therefore, the top metal layer of each individual unit is physically isolated from each other. The patterns in the top metal layer of the units can be identical or different. The size of the patterns can be varied to achieve a specific response (e.g., reflection in a certain direction or phase).

[0035] Top view 254 ( Figure 2B The diagram shows an activation contact 258, which is connected to the switching layer 226 via an insulating layer 228. More specifically, the activation contact 258 is configured to pass through the insulating layer 228 and make physical and electrical contact with the switching layer 226. As shown, the dimensions of the switching layer 226 are larger than the dimensions of the insulating layer 228 in the X and Y directions.

[0036] In this example, panel 250 includes four contact points 258. By applying a voltage to the contact points in a manner that applies a voltage across the switching layer 226, the temperature of the switching layer 226 rises. Controlling the temperature of the switching layer 226 allows it to switch from a metallic state to an insulating state, and vice versa. In other words, when the switching layer 226 is in a conductive or metallic state, panel 250 is in reflective mode. When the switching layer 226 is in an insulating state, panel 250 is in transmissive mode.

[0037] The panel 250 can be operated by controlling the voltage as needed. For example, voltage can be applied to the switching layer 226 using contact point 258. The voltage can be applied continuously according to the duty cycle, etc. If the temperature of the switching layer 226 is measured, voltage can be applied as needed to keep the switching layer 226 at or above the temperature required for the switching layer 226 to be in a metallic state. Removing the voltage allows the temperature of the switching layer to drop, and the switching layer becomes an insulating state.

[0038] In one example, panel 250 may be connected to a controller (e.g., a computing device or system) that allows panel 250 to be controlled and operated in a metallic or insulating state. Panel 250 may also include or be configured to be connected to a power supply or voltage source. If the controller is remote, multiple panels in the environment may be controlled by the same controller or server.

[0039] Figure 2C As further illustrated, in one example, the metal pattern of the cell corresponding to position 260, which corresponds to contact or activation pad 258, is not present in the cell array of panel 250. In other words, position 260 is not a cell of panel 250. Figure 2B The top view 252 shows that position 260 has no metal pattern and is opposite to contact point 258.

[0040] Figure 2C It was made public. Figure 2BThe diagram shows several aspects of a partial cross-sectional view of panel 250. View 250 may be a monolithic structure manufactured in a laminated manner. In this example, view 250 shows substrate 224. Switching layer 226 is formed on the bottom surface of substrate 224, and top layer 222 is formed on the top surface of substrate 224. In this example of view 250, top layer 222 shows patterns 262 and 264 of two separate units. Patterns 262 and 264, which are examples of pattern 210, may be the same or different and are isolated from each other. Since view 250 is shown relative to the contact point of actuation layer 230, in one embodiment, there is no top layer 222 or metal pattern on substrate 224 above actuation layer 230. Insulating layer 228 is formed on the bottom surface of switching layer 226. Actuation layer 230 is formed on a portion of insulating layer 228. The insulating layer 228 is etched or patterned such that the actuation layer 230 passes through the insulating layer 228 during formation and contacts the switching layer 226 at a designated location (e.g., an electrical contact point).

[0041] In one example, substrate 224 is silicon or FR4. Other substrates include, but are not limited to, glass, sapphire, quartz, Rogers RF, etc. In one example, the substrate includes a dielectric material. Switching layer 226 is, for example, a thin layer of vanadium dioxide (VO2). Top layer 222 and actuation layer 230 may be formed of copper or other suitable metals or suitable conductive materials.

[0042] In one example, an embodiment of the invention is illustrated experimentally. In this example, a three-dimensional model of the element was generated, and a full-wave EM (electromagnetic) simulation was performed using a commercial finite element modeler electromagnetic simulation application. Specific boundary conditions were defined to simulate the element. These boundary conditions were derived from two sets of lattice pairs. In this case, a lattice refers to an ordered structure of the element arrangement. By introducing these lattice pairs, an infinite element mesh can be simulated in both the X and Y directions.

[0043] In effect, this means that when simulating a single cell, that single cell is considered as part of an infinitely repeating array along both the X and Y axes. This assumption allows the properties and behavior of the cells to predict the behavior of the entire panel. Under these conditions, the cell's response will accurately reflect the behavior of cells in a larger array and allows for detailed analysis of how variations in cell design can affect the overall panel performance.

[0044] In general, the reflection and transmission properties of a unit cell allow for understanding how panels or reconfigurable smart surfaces interact with electromagnetic waves. These properties are examined using two Floquet ports. Floquet ports allow for simulating wave behavior when waves interact with an infinitely repeating structure.

[0045] Figure 3Several aspects of lattice pairs and Floquet ports have been disclosed. Figure 3 The diagram shows lattice pairs 302 (e.g., lattice pairs 1 and 2) and Floquet ports 304 (port 1 and port 2). The first lattice pair is positioned on opposite sides of the cell in the X direction, and the second lattice pair is positioned on opposite sides of the cell in the Y direction. The Floquet ports 304 are positioned on opposite sides of the cell, or on the reflective / transmitting side of the cell, in the Z direction.

[0046] When electromagnetic (EM) waves are incident on a cell, a portion of the EM waves is reflected (bounced), while a portion is transmitted (passed through). These behaviors are quantified as reflection coefficients and transmission coefficients, respectively, which are parameters used in the design and analysis of reconfigurable smart surfaces.

[0047] More specifically, in one example, the switching layer 226 includes VO2, as discussed in a previous embodiment. VO2 is a material that exhibits a temperature-induced phase transition at around 67 degrees Celsius (or 152 degrees Fahrenheit), such as... Figure 4 The curve is shown in Figure 402. Below this temperature, VO2 acts as an insulator or remains in an insulating state. When the temperature rises above this threshold, VO2 transitions to a metallic state, thus significantly altering its electrical and optical properties. As shown in Figure 402, above a certain temperature threshold, the resistivity decreases significantly (and thus the conductivity increases). As previously mentioned, by applying a voltage to the switching layer (in this example, the VO2 layer), the switching layer is heated and undergoes a phase transition, as shown in Figure 402.

[0048] When the switching layer 226 includes VO2, the insulator-to-metal phase transition can occur within 100 femtoseconds. Switching VO2 from the metallic phase to the insulator phase requires less thermal energy and can be done within 50 femtoseconds.

[0049] Figure 5 Several aspects of the phase transition of VO2 from an insulating state to a metallic state are disclosed. Graph 502 shows the time constants for the transition of a switching layer (such as VO2) to the metallic and insulating phases.

[0050] Figure 6 Several aspects of the simulated reflection amplitude of the cell at 40 GHz for different sizes S2 of the middle ring in the top layer pattern are disclosed. More specifically, when the VO2 or switching layer is in a metallic state, at 40 GHz, the cell reflects most of the EM signal incident on the cell. Graph 602 shows the S2 as the size S2 of the middle ring (e.g., ring 206 in Figure 2) varies from 0.8 mm to 3.2 mm in increments of 0.4 mm. 11Response (e.g., input reflectance coefficient). Response 604 corresponds to an S² dimension of 3.2 mm, and response 606 corresponds to an S² dimension of 0.8 mm. The other curves in graph 602 correspond to S² dimensions between 0.8 mm and 3.2 mm.

[0051] Figure 7 Several aspects of the simulated transmission amplitude of the cell at 40 GHz, considering different sizes of S2 in the middle ring of the top layer pattern, are disclosed. When the VO2 layer or the switching layer is in an insulating state, the cell transmits most of the incident EM signal, such as... Figure 7 When the value of S2 increases from 0.8 mm to 3.2 mm, S 21 The amplitude is shown. Response 704 corresponds to a response with an S² value of 0.8 mm, and response 706 corresponds to a response with an S² value of 3.2 mm. The other curves in graph 702 correspond to S² dimensions between 0.8 mm and 3.2 mm. Graph 702 shows the S-parameter S... 21 The forward transmission coefficient.

[0052] Figure 8 Several aspects of the simulated transmission phase response of the element for different S² values ​​are disclosed. Graph 802 shows a 330-degree phase variation for different S² values ​​from 0.8 mm to 3.2 mm. Response 804 corresponds to an S² value of 3.2 mm, and response 806 corresponds to an S² value of 3.2 mm.

[0053] Return to Figure 2B In one embodiment, panel 250 can be configured for millimeter-wave electromagnetic waves or signals (e.g., scaled). As previously described, the panel (or cells) can be scaled to operate at lower or higher frequencies. In this example, the millimeter-wave reflective surface is designed to include a two-dimensional periodic array of cells. The direction of the reflected beam depends on the phase distribution on surface 252. Therefore, the reflection phase of each cell is selected to provide constructive interference in the desired direction. The desired reflection phase from the cells is achieved through a square inner ring (S2) of a specific size. In one example, panel 250 may include an array of cells. However, the cells will have different S2 dimensions. Some cells will have the same S2 size. More generally, the pattern, including the S2 dimensions, is configured to provide the constructive interference required to reflect the incident signal in a specific or desired direction.

[0054] Therefore, panel 250 can be configured and operated to selectively transmit or reflect signals such as electromagnetic waves. Thus, panel 250 provides access to both sides of the space surrounding panel 250. The panel configuration and / or cell configuration provides a small physical profile, a wide operating bandwidth, and a large phase tuning range. Furthermore, embodiments of the invention do not require complex feed networks and do not present manufacturing / assembly problems such as soldering a large number of on-chip components.

[0055] Reconfigurable smart surfaces can enhance the coverage and quality of wireless networks, including in scenarios where obstacles (such as trees, buildings, or metal casings (of vehicles)) impede the link between the base station or access point and the end user or user equipment. For example, these obstacles may include roadside trees, buildings, walls, or the metal casing of a vehicle.

[0056] For example, in outdoor communications, reconfigurable smart surfaces can be integrated into windows (e.g., car windows, airplane windows, ship windows) to increase signal strength by utilizing the transmission capabilities of the reconfigurable smart surfaces discussed in this paper.

[0057] Embodiments of the present invention also improve indoor-to-outdoor communication. In these scenarios, particularly at millimeter-wave and terahertz frequencies, building walls cause severe penetration loss, significantly limiting the coverage provided by outdoor base stations. Reconfigurable smart surfaces can serve as a bridge between outdoor and indoor environments.

[0058] In indoor communications, reconfigurable smart surfaces capable of both transmission and reflection are more advantageous than surfaces that only reflect signals and provide only half-space coverage. Due to their ability to provide both transmission and reflection, embodiments of the present invention can achieve full-space coverage. This reduces propagation distance, thereby enhancing the received signal power.

[0059] Figure 9 Several aspects of methods for transmitting and / or reflecting signals, including electromagnetic waves, are disclosed. Method 900 includes deploying a panel 902 in an environment. In one example, the panel may include connectors allowing the panel to be connected to a power supply or other controller. The controller (e.g., a computing device, a server) may be local or remote relative to the panel. The controller then controls the operation of the panel 904. Operation is controlled by placing the panel in a specific mode (e.g., a transmission mode or a reflection mode). This is achieved by controlling the voltage applied to the switching layer. Controlling the voltage allows the switching layer of the panel to transition from a metallic state to an insulating state or from an insulating state to a metallic state. The panel's mode can be changed by the controller as needed, in response to user input, or for other reasons.

[0060] It should be noted that embodiments of the present invention, whether or not claimed, cannot be actually performed in human thought or otherwise. Therefore, nothing herein should be construed as teaching or suggesting that any aspect of any embodiment of the invention can be actually performed in human thought or otherwise. Furthermore, unless otherwise expressly stated herein, the disclosed methods, processes, and operations are contemplated for implementation by a computing system that may include hardware and / or software. That is, these methods, processes, and operations are defined as computer-implemented.

[0061] The following is a discussion of several aspects of example operating environments for various embodiments of the present invention. This discussion is not intended to limit the scope of the invention or the applicability of the embodiments in any way.

[0062] Generally, embodiments of the present invention can be implemented in combination with systems, software, and components that individually and / or collectively implement and / or result in signal processing operations, wireless coverage operations, signal modulation, or reflection operations, etc. More generally, the scope of the present invention includes any operating environment in which the disclosed concepts may be useful.

[0063] It should be noted that any operation(s) of any method disclosed herein may be performed in response to, due to, and / or based on the execution of any prior operation(s). Accordingly, for example, the execution of one or more operations may be a prerequisite or trigger for the subsequent execution of one or more additional operations. Thus, for example, various operations that can constitute a method may be linked together or otherwise associated with each other through relationships such as those described in the examples just mentioned. Finally, although not required, in some embodiments, the various operations constituting the various example methods disclosed herein are executed in the specific order described in those examples. In other embodiments, the various operations constituting the disclosed method may be executed in an order different from the specific order described herein.

[0064] The following are some other exemplary embodiments of the present invention. These embodiments are presented by way of example only and are not intended to limit the scope of the invention in any way.

[0065] Embodiment 1. A panel, comprising: a substrate; a metal top layer formed on a first surface of the substrate; a switching layer formed on a second surface of the substrate; an insulating layer formed on the switching layer such that the switching layer is between the insulating layer and the substrate; and an actuation layer including activation contacts formed on the surface of the insulating layer, wherein the activation contacts are connected to the switching layer through the insulating layer.

[0066] Embodiment 2: The panel as described in Embodiment 1, wherein the substrate comprises a dielectric material.

[0067] Embodiment 3: A panel as described in Embodiments 1 and / or 2, wherein the metal top layer includes a pattern for each unit included in the panel, wherein the pattern of each unit includes a central portion, a middle ring, and an outer ring.

[0068] Embodiment 4: A panel as described in Embodiments 1, 2 and / or 3, wherein the central portion, the middle ring, and the outer ring are configured to resonate at a desired frequency.

[0069] Embodiment 5: A panel as described in Embodiments 1, 2, 3 and / or 4, wherein the switching layer comprises a material configured to transition from a metallic state to an insulating state and from an insulating state to a metallic state.

[0070] Embodiment 6: A panel as described in Embodiments 1, 2, 3, 4 and / or 5, wherein the voltage applied to the switching layer through the activation contact is controlled to cause the panel to be in a reflective mode or to cause the panel to be in a transmissive mode.

[0071] Embodiment 7: A panel as described in Embodiments 1, 2, 3, 4, 5 and / or 6, wherein the voltage is controlled to change the temperature of the switching layer.

[0072] Embodiment 8, the panel as described in Embodiments 1, 2, 3, 4, 5, 6 and / or 7, further includes a controller configured to change the voltage.

[0073] Embodiment 9: A panel comprising: a plurality of units formed as a monolithic structure, the monolithic structure comprising: a substrate; a metal layer including a metal pattern for each of the plurality of units, wherein the metal layer is formed on a first surface of the substrate; a switching layer formed on a second surface of the substrate; an insulating layer formed on the switching layer such that the switching layer is located between the insulator and the substrate; and an activation contact exposed on the insulating layer and configured to contact the switching layer, wherein the pattern is configured to generate constructive interference when the panel is in a reflective mode, such that incident signals are reflected in a specific direction.

[0074] Embodiment 10: The panel as described in Embodiment 9, wherein the active contact point is located at the corner of the insulating layer.

[0075] Embodiment 11: A panel as described in Embodiments 9 and / or 10, wherein each of the active contact points corresponds to a position of the panel that is not associated with a metal pattern in the metal layer.

[0076] Embodiment 12: A panel as described in Embodiments 9, 10 and / or 11, wherein the metal pattern includes a central portion, a middle ring, and an outer ring.

[0077] Embodiment 13: A panel as described in Embodiments 9, 10, 11 and / or 12, wherein the central portion, the middle ring, and the outer ring are configured to resonate at a desired frequency.

[0078] Embodiment 14: A panel as described in Embodiments 9, 10, 11, 12 and / or 13, wherein the substrate comprises a dielectric material.

[0079] Embodiment 15: A panel as described in Embodiments 9, 10, 11, 12, 13 and / or 14, wherein the switching layer comprises a material configured to transition from a metallic state to an insulating state and from an insulating state to a metallic state, and wherein the size of the switching layer is larger than the size of the insulating layer.

[0080] Embodiment 16: A panel as described in Embodiments 9, 10, 11, 12, 13, 14 and / or 15, wherein the material of the switching layer includes VO2.

[0081] Embodiment 17: A panel as described in Embodiments 9, 10, 11, 12, 13, 14, 15 and / or 16, wherein the voltage applied to the switching layer through the activation contact determines whether the switching layer is in a metallic state or an insulating state.

[0082] Embodiment 18: A panel as described in Embodiments 9, 10, 11, 12, 13, 14, 15, 16 and / or 17, wherein the panel is in a transmissive mode when the switching layer is in an insulating state, the panel is in a reflective mode when the switching layer is in a metallic state, and a control voltage is used to change the temperature of the switching layer.

[0083] Embodiment 19, the panel as described in Embodiments 9, 10, 11, 12, 13, 14, 15, 16, 17 and / or 18, further includes a controller configured to control the voltage applied to the active contact point and to switch the panel from the reflective mode to the transmissive mode or from the transmissive mode to the reflective mode.

[0084] Embodiment 20: A panel as described in Embodiments 9, 10, 11, 12, 13, 14, 15, 16, 17, 18 and / or 19, wherein the pattern includes a central portion having a size S1, a middle ring having a size S2, and an outer ring having a size S3, wherein... .

[0085] The embodiments disclosed herein may include the use of a dedicated or general-purpose computer, which includes various computer hardware or software modules, as discussed in more detail below. The computer may include a processor and a computer storage medium carrying instructions that, when executed by the processor and / or causing the processor to execute the instructions, perform any or more of the methods disclosed herein, or any one or more portions of any of the disclosed methods.

[0086] As described above, embodiments within the scope of this invention also include a computer storage medium, which is a physical medium for carrying or having computer-executable instructions or data structures stored thereon. Such a computer storage medium can be any available physical medium that can be accessed by a general-purpose or special-purpose computer.

[0087] By way of example, and not limitation, such computer storage media may include hardware memory such as solid-state drives (SSDs), RAM, ROM, EEPROM, CD-ROM, flash memory, phase-change memory (“PCM”), or other optical disk storage, magnetic disk storage, or other magnetic storage devices, or any other hardware storage device that can be used to store program code in the form of computer-executable instructions or data structures that can be accessed and executed by general-purpose or special-purpose computer systems to perform the functions disclosed herein. Combinations of the above should also be included within the scope of computer storage media. These media are also examples of non-transitory storage media, and non-transitory storage media also include cloud-based storage systems and architectures, although the scope of the invention is not limited to these examples of non-transitory storage media.

[0088] Computer-executable instructions include, for example, instructions and data that, when executed, cause a general-purpose computer, a special-purpose computer, or a special-purpose processing device to perform a function or a set of functions. Therefore, some embodiments of the present invention can be downloaded, for example, from a website, mesh topology, or other source to one or more systems or devices. Similarly, the scope of the present invention includes any hardware system or device that includes instances of an application program containing the disclosed executable instructions.

[0089] Although the subject matter has been described in language specific to structural features and / or methodological actions, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions disclosed herein are disclosed as exemplary forms for implementing the claims.

[0090] As used herein, the terms “module,” “component,” “engine,” “agent,” “service,” etc., can refer to software objects or routines that execute on a computing system. These can be implemented as objects or processes that execute on a computing system, for example, as independent threads. Although the systems and methods described herein can be implemented in software, implementation in hardware or a combination of software and hardware is also feasible and contemplated. In this invention, a “computing entity” can be any computing system as defined herein, or any module or combination of modules running on a computing system.

[0091] In at least some instances, a hardware processor is provided that is operable to execute executable instructions for performing methods or processes, such as those disclosed herein. The hardware processor may or may not include elements of other hardware, such as elements of computing devices and systems disclosed herein.

[0092] Regarding the computing environment, embodiments of the present invention can be executed in a client-server environment (whether a network environment or a local environment) or any other suitable environment. Suitable operating environments for at least some embodiments of the present invention include cloud computing environments, in which one or more of the client, server, or other machines can reside in and run within the cloud environment.

[0093] Now for a brief reference Figure 10 Any one or more entities disclosed or implied by the accompanying drawings and / or elsewhere herein may take the form of, include, or be implemented on, or hosted by a physical computing device, one example of which is indicated by 1000. Similarly, if any of the foregoing elements includes or consists of a virtual machine (VM), then that VM may constitute Figure 10 Virtualization of any combination of physical components disclosed in the documentation.

[0094] exist Figure 10In the example, physical computing device 1000 includes memory 1002, one or more hardware processors 1006, non-transitory storage medium 1008, UI device 1010, and data storage 1012. Memory 1002 may include one, some, or all of random access memory (RAM), non-volatile memory (NVM) 1004 (e.g., NVRAM), read-only memory (ROM), and persistent memory. One or more of the memory components 1002 of physical computing device 1000 may take the form of solid-state drive (SSD) memory. Similarly, one or more application programs 1014 may be provided, comprising instructions executable by one or more hardware processors 1006 to perform any or part of the operations disclosed herein.

[0095] Such executable instructions can take various forms, including, for example, instructions executable to perform any method or part thereof disclosed herein, and / or instructions executable by / at any storage site, whether on-premises or cloud computing site, client, data center, data protection site including cloud storage site, or backup server, to perform any function disclosed herein. Similarly, such instructions can be executable to perform any other operations and methods disclosed herein and any part thereof.

[0096] The invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered illustrative rather than restrictive in all respects. Therefore, the scope of the invention is indicated by the appended claims rather than by the foregoing description. All variations within the meaning and equivalent scope of the claims should be included within their scope.

Claims

1. A panel, comprising: substrate; A metal top layer is formed on the first surface of the substrate; A switching layer is formed on the second surface of the substrate; An insulating layer is formed on the switching layer such that the switching layer is between the insulating layer and the substrate; as well as An actuation layer, the actuation layer including activation contacts formed on the surface of the insulating layer, wherein the activation contacts extend through the insulating layer and are connected to the switching layer.

2. The panel as claimed in claim 1, wherein, The substrate includes a dielectric material.

3. The panel as claimed in claim 1, wherein, The metal top layer includes a pattern for each unit included in the panel, wherein the pattern of each unit includes a central portion, a middle ring, and an outer ring.

4. The panel as claimed in claim 3, wherein, The central portion, the middle ring, and the outer ring are configured to resonate at the desired frequency.

5. The panel as claimed in claim 1, wherein, The switching layer includes a material configured to transition from a metallic state to an insulating state and from an insulating state to a metallic state.

6. The panel as claimed in claim 1, wherein, The voltage applied to the switching layer through the activation contact is controlled to put the panel in either a reflective or a transmissive mode.

7. The panel as claimed in claim 6, wherein, The voltage is controlled to change the temperature of the switching layer.

8. The panel of claim 7, further comprising a controller configured to change the voltage.

9. A panel, comprising: Multiple units formed as a monolithic structure, the monolithic structure including: substrate; A metal layer comprising a metal pattern for each of the plurality of cells, wherein the metal layer is formed on a first surface of the substrate; A switching layer is formed on the second surface of the substrate; An insulating layer formed on the switching layer, such that the switching layer is located between the insulator and the substrate; and An activation contact point is formed, which is exposed on the insulating layer and configured to contact the switching layer. The pattern is configured such that when the panel is in reflective mode, constructive interference is generated, causing the incident signal to be reflected in a specific direction.

10. The panel as claimed in claim 9, wherein, The activation contact point is located at the corner of the insulating layer.

11. The panel of claim 10, wherein, Each of the activated contact points corresponds to a position on the panel that is not associated with the metal pattern in the metal layer.

12. The panel as claimed in claim 9, wherein, The metal pattern includes a central portion, a middle ring, and an outer ring.

13. The panel of claim 12, wherein, The central portion, the middle ring, and the outer ring are configured to resonate at the desired frequency.

14. The panel as claimed in claim 9, wherein, The substrate includes a dielectric material.

15. The panel as claimed in claim 9, wherein, The switching layer includes a material configured to transition from a metallic state to an insulating state and from an insulating state to a metallic state, wherein the size of the switching layer is larger than the size of the insulating layer.

16. The panel of claim 15, wherein, The material of the switching layer includes VO2.

17. The panel of claim 9, wherein, The voltage applied to the switching layer by the activation contact determines whether the switching layer is in a metallic state or an insulating state.

18. The panel of claim 17, wherein, When the switching layer is in the insulating state, the panel is in a transmissive mode; when the switching layer is in the metallic state, the panel is in a reflective mode; and, a control voltage is used to change the temperature of the switching layer.

19. The panel of claim 9, further comprising a controller configured to control the voltage applied to the active contact and to switch the panel from the reflective mode to the transmissive mode or from the transmissive mode to the reflective mode.

20. The panel as claimed in claim 9, wherein, The pattern includes a central portion with size S1, a middle ring with size S2, and an outer ring with size S3, wherein, .

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