Integrated injection molding and on-line complex impedance quality control during dwell period of all-dielectric ion skin module

Abstract

The application belongs to the technical field of manufacturing process and online quality control of ion conductive intelligent skin module, and particularly relates to integrated injection molding and online complex impedance quality control process of full dielectric ion skin module. In view of the problems of insufficient bonding force, invisible micro air gap and pollution of the flexible electrode-ion conductive continuous medium interface in injection molding, the application completes in-situ injection molding of ion conductive continuous medium within the free radical decay time window Δt after plasma activation to induce molecular-level fusion of the interface; micro air gap is eliminated under high pressure during the injection molding pressure maintaining period, multi-frequency complex impedance sweep is performed on the edge electrode, and contact impedance Rc, equivalent series resistance Rs and phase angle peak frequency f_peak are extracted as release criteria; the pressure maintaining time, pressure maintaining pressure and mold temperature are adjusted in real time according to the sweep result, active closed-loop optimization and traceable quality control of the interface quality are realized, the consistency and yield of the ion skin module are improved, and production history data is provided for life compensation algorithm.

Description

Technical Field

[0001] This invention belongs to the field of manufacturing process and online quality control technology of ion-conductive smart skin modules, specifically involving the integrated injection molding and online impedance quality control process of all-dielectric ion skin modules during the holding pressure period. Background Technology

[0002] Ion skin modules offer advantages such as minimalist structure and large-area coverage in robotic tactile and multimodal perception. However, their greatest vulnerability in commercialization lies in the soft-hard interface: insufficient electrode-dielectric interface bonding, contact impedance drift caused by micro-gaps / contamination, and electrical failures due to moisture or ion migration. Current injection molding processes typically rely on process parameters such as pressure and temperature for quality control, making it difficult to directly observe the interface's electrical quality. Even with identical formulations, unseen interface defects can lead to low yields. Plasma activation can increase interface energy and introduce free radicals / reaction sites, but the high-energy states decay rapidly over time, resulting in a narrow process window and difficulty in stable reproducibility.

[0003] Therefore, there is an urgent need for a process method that can simultaneously ensure molecular-level fusion at the interface and achieve online observability and closed-loop optimization during mass production. Summary of the Invention

[0004] To address the problems existing in the prior art, this invention provides an integrated injection molding and online complex impedance quality control process for an all-dielectric ion skin module. In-situ injection molding is completed within the free radical decay time window Δt to induce molecular-level fusion at the interface; during the holding pressure period, high pressure in the mold cavity is used to eliminate micro-gaps and online measurement of complex impedance is performed to determine the true interface quality; the measurement results are coupled with process parameter feedback control to achieve a passive detection to active closed-loop optimization, thereby establishing a yield barrier for large-scale mass production.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: The first aspect of this invention provides an integrated injection molding and online impedance quality control process for a full-dielectric ion skin module, comprising: (1) Electrode assembly pre-positioning: The edge electrode assembly with flexible structure is pre-positioned at the designated position in the injection mold cavity and the positioning is completed; (2) Desorption pretreatment: Vacuum baking is performed on the interface to be bonded of the edge electrode assembly to remove adsorbed water vapor and organic pollutants; (3) Plasma activation: Plasma activation is performed on the interface to be bound to generate active sites or free radicals; (4) Time-window controlled in-situ injection molding: Under the condition that the time interval Δt from the end of plasma activation to the completion of injection molding of the ion-conducting continuous medium is less than the predetermined activity decay threshold, in-situ injection molding of the ion-conducting continuous medium is performed in the mold cavity, so that the edge electrode assembly and the ion-conducting continuous medium form a molecular-level fusion at the interface. (5) Online complex impedance frequency sweep during the holding pressure period: During the holding pressure period of injection molding, the edge electronic module is used to perform multi-frequency complex impedance frequency sweep on the edge electrode assembly and simultaneously collect amplitude and phase information to construct a complex impedance spectrum and extract interface electrical characteristics. The interface electrical characteristics include at least one of contact impedance Rc, equivalent series resistance Rs, phase angle ∠Z and phase angle peak frequency f_peak. (6) Release judgment and feedback closed loop: The interface electrical characteristic quantity is compared with the preset release window to generate a qualified / unqualified release judgment, and the process parameters of the injection molding machine are adjusted in real time based on the interface electrical characteristic quantity: holding time, holding pressure, and mold temperature, so that the contact impedance Rc and the phase angle peak frequency f_peak enter or remain in the predetermined range. (7) Traceability record: The complex impedance spectrum, release judgment and corresponding process parameters are written into the production history for traceability.

[0006] This invention employs plasma activation to introduce high-energy free radicals and polar functional groups onto the surface of the edge electrode, thereby increasing the surface energy and promoting subsequent interfacial reactions. This high-energy state rapidly decays due to free radical annihilation, adsorption contamination, and water vapor rearrangement. Setting a time window of Δt < 30 min essentially captures the optimal kinetic window for interfacial chemical bonding, enabling the interface to evolve from "contact" to "molecular-level fusion."

[0007] During the injection molding holding pressure stage, the melt adheres tightly to the electrode interface under high pressure in the mold cavity, and microscopic air gaps are compressed and eliminated. At this time, the measured complex impedance is closest to the ideal interface. Online complex impedance frequency sweep transforms invisible interface defects into quantifiable electrical characteristics, thereby achieving a direct mapping between process and quality.

[0008] This invention further uses the frequency sweep result during the holding pressure period as a feedback signal to adjust key parameters such as holding pressure, holding time, and mold temperature in real time, optimizing the contact impedance Rc to a predetermined window; if necessary, it triggers a secondary activation or rework process. This closed-loop system enables the process to be adaptive, significantly different from the open-loop control of traditional injection molding.

[0009] Furthermore, during the injection molding holding period, the mold cavity clamping force and holding pressure are used as standard test stresses. Multi-frequency complex impedance sweep is performed on the edge electrode assembly to obtain the curve of phase angle ∠Z changing with frequency. The extreme value or peak frequency of phase angle f_peak is extracted as a judgment feature of the degree of interface crosslinking and micro-gap residue. Based on the judgment feature, the holding time, holding pressure, and mold temperature are adjusted in a closed loop. The peak frequency of phase angle f_peak is defined as the frequency corresponding to when the phase angle ∠Z reaches its minimum value or its spectral derivative amplitude reaches its maximum value.

[0010] Furthermore, the predetermined activity decay threshold is preferably 30 minutes, and is dynamically corrected according to the ambient temperature and / or relative humidity, and an automatic secondary activation process is triggered when Δt exceeds the threshold.

[0011] Furthermore, the vacuum baking temperature is 40℃-120℃, and the time is 10min-120min; the plasma activation is selected from air, oxygen, nitrogen or argon plasma, and the activation power is 50W-500W, and the activation time is 5s-180s.

[0012] Furthermore, the predetermined frequency set of the multi-frequency complex impedance sweep covers at least one frequency point from 10Hz to 100kHz; the multi-frequency complex impedance sweep uses multiple sine waves or sweep signals with an excitation amplitude of 0.1V-2V and does not introduce DC bias.

[0013] Furthermore, the edge electronics module includes a phase-locked demodulator or a quadrature demodulator for simultaneously extracting the real and imaginary features of the complex impedance.

[0014] Furthermore, the preset release window includes at least a target range for contact impedance Rc and a target range for the peak phase angle frequency f_peak, and the target range is associated with the calibration results of product specifications or interface peel strength; the real-time adjustment includes extending the holding time, increasing or decreasing the holding pressure, and / or adjusting the mold temperature during the holding period to minimize the fluctuation of contact impedance Rc at a predetermined frequency point set; when a non-conformity is determined, a rework path is triggered, and the rework path includes at least one of secondary activation, glue replenishment, repeated injection molding, or scrapping.

[0015] Furthermore, the ion-conducting continuous medium is an ion-liquid elastomer or an ion gel, and the injection molding temperature is 80℃-220℃.

[0016] Furthermore, the online complex impedance quality control is time-synchronized with the pressure / displacement / temperature sensing data of the injection molding machine and used as a release criterion.

[0017] A second aspect of the present invention provides an application of the above-described process in the large-scale manufacturing of an ion-conductive smart skin module for a humanoid robot.

[0018] A third aspect of this invention provides an integrated injection molding and online complex impedance quality control system for an all-dielectric ion skin module, comprising: A mold assembly having a mold cavity, wherein the mold cavity is provided with a positioning structure for pre-positioning an edge electrode assembly with a flexible structure; An interface processing unit is used to perform desorption pretreatment and plasma activation on the interface to be bonded of the edge electrode assembly. The injection unit is used to inject an ion-conducting continuous medium into the mold cavity to form an integrated injection molding process; An edge electronics module, electrically connected to the edge electrode assembly within the mold cavity, is used to perform multi-frequency complex impedance sweep on the edge electrode assembly and extract interface electrical characteristics during the holding pressure period of the injection unit. The process closed-loop control unit is communicatively connected to the interface processing unit, the injection molding unit, and the edge electronics module, respectively. The process closed-loop control unit is configured to execute the following control logic: monitor the time interval Δt from the end of plasma activation to the completion of injection molding by the injection molding unit, and ensure that it is less than a predetermined activity decay threshold; receive the interface electrical feature quantity extracted by the edge electronics module, and compare it with a preset release window to generate a release decision; and adjust the holding time, holding pressure, and / or mold temperature of the injection molding unit in real time based on the interface electrical feature quantity.

[0019] Furthermore, the mold assembly also includes an embedded temperature and pressure resistance test probe or conductive insert; the detection end of the temperature and pressure resistance test probe or conductive insert abuts against the reserved test contact of the edge electrode assembly when the mold is locked, and the output end extends out of the mold assembly and connects to the edge electronic module; and the mating point between the temperature and pressure resistance test probe or conductive insert and the mold assembly is provided with a high temperature and high pressure resistant insulating sealing structure to isolate the injection molten metal.

[0020] Furthermore, the edge electronics module includes a multi-frequency AC excitation source and a phase-locked demodulator or a quadrature demodulator; the process closed-loop control unit is configured to extract at least one of the contact impedance Rc, equivalent series resistance Rs, phase angle ∠Z, and phase angle peak frequency f_peak from the edge electronics module as the interface electrical characteristic quantity.

[0021] Furthermore, the process closed-loop control unit also includes an environmental compensation and traceability module; the environmental compensation and traceability module is used to dynamically correct the predetermined activity attenuation threshold based on ambient temperature and / or relative humidity sensor data, and write the spectrum data of the multi-frequency complex impedance sweep, the release judgment result and the synchronous injection molding unit process parameters into the production history database.

[0022] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention limits the window of chemical activity of the captured and activated surface by Δt time window, realizes molecular-level fusion of electrode and ion-conducting continuous medium, improves peel strength and reduces interface drift; (2) The present invention performs online complex impedance frequency sweep during the pressure holding period, which can extract verifiable electrical characteristic quantities such as contact impedance Rc, equivalent series resistance Rs, phase angle ∠Z and phase angle peak frequency f_peak under high voltage ideal contact conditions, so as to realize real-time observation of interface quality; (3) The present invention uses the online complex impedance frequency sweep results to adjust the voltage holding parameters in a closed loop, thereby achieving process self-optimization and high consistency release; (4) The present invention can simultaneously generate traceable electrical quality history data, providing a foundation for life compensation and digital factories. Attached Figure Description

[0023] Figure 1 This is a flowchart illustrating the integrated injection molding and online impedance quality control process of the all-dielectric ion skin module of the present invention.

[0024] Figure 2 This is an example comparison curve showing the change of contact impedance Rc over time during the pressure holding period.

[0025] Figure 3 This is a schematic diagram showing the phase angle ∠Z spectrum curve and the peak frequency f_peak of the phase angle.

[0026] Figure 4 This is a schematic diagram showing the relationship between the activation-injection time interval Δt and the peel strength and contact resistance Rc drift rate. Detailed Implementation

[0027] The specific embodiments of the present invention will be further described below. It should be noted that these descriptions are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] Unless otherwise specified, the experimental methods used in the following embodiments are conventional methods, and the experimental materials used in the following embodiments are all available through conventional commercial channels.

[0029] The process flow diagram of the integrated injection molding and online impedance quality control during the holding period of the all-dielectric ion skin module of this invention is as follows: Figure 1 As shown.

[0030] The integrated injection molding and holding pressure period online complex impedance quality control system for the all-dielectric ion skin module of the present invention includes at least: an injection molding machine host, a mold / mold cavity, an edge electrode assembly (pre-placed in a positioning groove at the edge of the mold cavity), an ion-conductive continuous dielectric injection unit, an edge electronic module, and a process closed-loop control unit that communicates with the injection molding machine controller. The edge electronic module is electrically connected to the edge electrode assembly and is used to apply multi-frequency AC excitation to the electrodes during the holding pressure period and synchronously acquire response signals to obtain the complex impedance spectrum Z(f)=|Z(f)|∠Z(f). The process closed-loop control unit compares the interface electrical characteristics extracted from Z(f) (e.g., contact impedance Rc, equivalent series resistance Rs, phase angle ∠Z, and phase angle peak frequency f_peak) with a preset release window and outputs adjustment commands for holding pressure time, holding pressure, and / or mold temperature to the injection molding machine.

[0031] After plasma activation, the high-energy sites at the interface to be bonded by the edge electrodes rapidly decay due to free radical annihilation, adsorption contamination, and water vapor rearrangement. To capture the interfacial reaction kinetic window, this invention limits the time interval Δt from the end of activation to the completion of injection molding of the ion-conducting continuous medium to be less than a predetermined threshold (e.g., 30 min). In a preferred embodiment, Δt can be dynamically corrected according to ambient temperature and relative humidity; when Δt exceeds the threshold or an interfacial contamination risk is detected, an automatic secondary activation process is triggered to maintain interfacial chemical activity. Figure 4 The diagram illustrates the correlation between Δt and peel strength as well as Rc drift rate: under controlled Δt conditions, the interfacial bonding strength increases and the subsequent Rc drift decreases.

[0032] During the injection molding holding pressure stage, the melt adheres tightly to the edge electrode interface under the action of clamping force and holding pressure, and the microscopic air gaps are compressed and eliminated. Therefore, the complex impedance measured during this stage is closest to the ideal interface state. This invention utilizes an edge electronic module to perform multi-frequency AC excitation (which can be frequency sweep or multi-sine) during the holding pressure period. The frequency set covers at least one frequency point from 10Hz to 100kHz (preferably including 1kHz), and the excitation amplitude is, for example, 0.1V-2V without introducing DC bias.

[0033] like Figure 3 As shown, the edge electronics module can use phase-locked demodulation or quadrature demodulation (I / Q) structures to simultaneously extract the real and imaginary parts of the complex impedance, thereby obtaining the phase angle versus frequency curve ∠Z(f). In a preferred embodiment, f_peak is defined as the frequency corresponding to when ∠Z(f) reaches its minimum value, or the frequency corresponding to when its spectral derivative amplitude reaches its maximum value; f_peak reflects the comprehensive characteristics of the degree of interfacial crosslinking and the micro-gap / permeability state.

[0034] like Figure 2As shown, Rc can be defined as the interfacial contact impedance or the interfacial resistance component obtained by fitting an equivalent circuit. Unlike monitoring only injection pressure / temperature, Rc can directly characterize the actual contact state and defect sensitivity of the electrode-ion-conductive continuous medium interface. Figure 2 Exemplary comparisons show that under the qualified process window, Rc converges rapidly and remains within the release window during the pressure holding period; when the interface is under-fused or there are micro-gaps, Rc is higher and fluctuates significantly over time.

[0035] This invention associates the interface electrical characteristics extracted by online complex impedance frequency sweep during the holding period with a preset release window. The preset release window includes at least the Rc target interval and the f_peak target interval, and the target interval can be calibrated and established through peel strength, long-term drift, and reliability tests.

[0036] In one implementation, when Rc exceeds the target upper limit or f_peak deviates from the calibrated range, the process closed-loop control unit adjusts the injection molding machine's holding time, holding pressure, and / or mold temperature in real time to ensure that Rc and f_peak enter or remain within the predetermined range. For example, extending the holding time promotes interfacial bonding and penetration, increasing the holding pressure eliminates residual micro-gaps, or adjusting the mold temperature improves interfacial flow and reaction kinetics. If the release window cannot be met even after closed-loop adjustment, a rework path is triggered (e.g., secondary activation, refilling, repeated injection molding, or scrapping).

[0037] This invention records the complex impedance spectrum Z(f), release judgment results, and corresponding process parameters (pressure, temperature, displacement, timestamp, etc.) in the production history, thereby forming a traceable chain of electrical quality evidence. This production history can be used for quality traceability and failure analysis, and can also serve as input for subsequent life compensation or online health management algorithms, realizing a digital closed loop on the factory side.

[0038] Through the above specific implementation methods, the present invention couples "interfacial chemical fusion with controlled activation window" with "online complex impedance sweep frequency electrical criterion under standard stress during holding period" and further introduces process feedback closed loop to achieve observable, controllable and traceable manufacturing of flexible electrode-ion conductive continuous medium interface, thereby significantly improving the consistency and yield of mass production.

[0039] Example 1: Δt-controlled in-situ injection molding and online complex impedance sweep frequency release during holding pressure period The edge electrode assembly (conductive fabric electrode is carbon black / graphene composite coated nylon base fabric with a surface resistivity of approximately) , with a thickness of 0.3 mm); the interconnection is a polyimide FPC (copper thickness 26 μm), and the end is gold-plated) is placed in the positioning groove at the edge of the mold cavity, and vacuum baking desorption is carried out at 60 °C for 30 min and -0.08 MPa to remove adsorbed water vapor and volatile substances and reduce interface contamination. The bonding interface is activated by oxygen plasma for 60 s (200 W, nozzle-surface distance 10 mm), introducing polar groups / free radicals to increase the surface energy. Within 10 min after the activation is completed, an ion-conductive continuous medium (using addition-type silicone rubber A / B components as the matrix (vinyl PDMS + hydrogen-containing PDMS), adding 18 wt% of a reactive ion-conductive component (containing alkenyl imidazolium salt), and adding 5 wt% of a hydrophobic plasticizer; 30 ppm of platinum catalyst) is in-situ injection molded to capture the reaction window before the free radicals decay. The barrel temperature is 150 °C, the mold temperature is 75 °C, the injection pressure is 75 MPa, and the injection speed is 55 mm / s to ensure mold filling and interface wetting, and to stabilize the reaction kinetics and shrinkage. After entering the holding pressure period, the edge electronic module performs a sweep frequency within the range of 10 Hz - 100 kHz, exciting 1 V AC, and using I / Q phase-locked demodulation to extract the real and imaginary parts of the complex impedance, with a sampling rate of 1 kSa / s, and calculating Rc, Rs, and f_peak. When Rc falls within the preset window and f_peak is within the calibrated range, it is judged as qualified and released; if Rc is too high, the holding pressure time is automatically extended or the holding pressure is increased until Rc enters the window. Finally, the holding pressure is 45 MPa; the holding pressure time is 40 s, Rc is 8.5 Ω, and f_peak is 1.8 kHz. The above complex impedance sweep spectrum and process parameters are written into the production record. After sampling verification, the 180° peel strength is 1.20 N / mm, meeting the product requirements, and the drift rate of Rc during continuous aging (10k cycles) is 6%, lower than the predetermined threshold. Finally, edge encapsulation is carried out (a low surface energy silicone elastomer overmolding material, including a 100 μm migration-resistant interface coating).

[0040] Example 2: Online complex impedance sweep during the holding pressure period - Closed-loop optimization of process parameter feedback Based on Example 1, real-time communication was established between the edge electronics module and the injection molding machine controller. Injection molding was completed within 25 minutes after plasma activation. After entering the holding pressure period, the first frequency sweep yielded Rc=15Ω (higher than the release limit of 10Ω) and f_peak=0.9 kHz, indicating a risk of underfusion. The closed-loop control unit automatically adjusted: the holding pressure was increased from 45 MPa to 55 MPa, the holding time was extended from 40 s to 70 s, and the mold temperature was increased from 75℃ to 85℃. In the adjusted second frequency sweep, Rc converged to 9.2Ω and f_peak=1.6 kHz, meeting the release window, and the mold was ejected. Sampling verification showed that the 180° peel strength was 1.15 N / mm, meeting product requirements, and the Rc drift rate during continuous aging (10k cycles) was 7%, lower than the predetermined threshold.

[0041] Comparative Example 1: Δt overwindow causes interface under-blending Except for extending Δt to 60 min, the other conditions were the same as in Example 1. Online complex impedance sweep showed Rc at 25.0 Ω, significantly high, and f_peak at 0.7 kHz, significantly low / peak blunted. Even with adjustments to the holding voltage parameters, it was difficult to enter the release window; peel strength (0.50 N / mm) decreased and long-term Rc drift rate (30%) increased. This comparative example illustrates the necessity of the Δt time window limitation and the closed-loop online complex impedance sweep during the holding voltage period.

[0042] Comparative Example 2: Traditional process of online impedance-based release without a holding period The plasma activation and Δt=10 min process were performed in the same manner as in Example 1, but online complex impedance frequency sweep and release judgment were not performed during the holding pressure period, nor was parameter feedback adjustment performed. The mold was only demolded according to the fixed holding pressure parameters (45 MPa, 40 s). After 10k cycles of compression, the Rc drift rate increased to about 18%, the 180° peel strength was 0.95 N / mm, and local edge leakage occurred, indicating that it is difficult to ensure batch consistency by simply fixing the process parameters.

[0043] The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. An integrated injection molding and online impedance quality control process for a full-dielectric ion skin module, characterized in that, include: (1) Electrode assembly pre-positioning: The edge electrode assembly with flexible structure is pre-positioned at the designated position in the injection mold cavity and the positioning is completed; (2) Desorption pretreatment: Vacuum baking is performed on the interface to be bonded of the edge electrode assembly to remove adsorbed water vapor and organic pollutants; (3) Plasma activation: Plasma activation is performed on the interface to be bound to generate active sites or free radicals; (4) Time-window controlled in-situ injection molding: Under the condition that the time interval Δt from the end of plasma activation to the completion of injection molding of the ion-conducting continuous medium is less than the predetermined activity decay threshold, in-situ injection molding of the ion-conducting continuous medium is performed in the mold cavity, so that the edge electrode assembly and the ion-conducting continuous medium form a molecular-level fusion at the interface. (5) Online complex impedance frequency sweep during the holding pressure period: During the holding pressure period of injection molding, the edge electronic module is used to perform multi-frequency complex impedance frequency sweep on the edge electrode assembly and simultaneously collect amplitude and phase information to construct a complex impedance spectrum and extract interface electrical characteristics. The interface electrical characteristics include at least one of contact impedance Rc, equivalent series resistance Rs, phase angle ∠Z and phase angle peak frequency f_peak. (6) Release judgment and feedback closed loop: The interface electrical characteristic quantity is compared with the preset release window to generate a qualified / unqualified release judgment, and the process parameters of the injection molding machine are adjusted in real time based on the interface electrical characteristic quantity: holding time, holding pressure, and mold temperature, so that the contact impedance Rc and the phase angle peak frequency f_peak enter or remain in the predetermined range. (7) Traceability record: The complex impedance spectrum, release judgment and corresponding process parameters are written into the production history for traceability.

2. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, During the injection molding holding period, the mold cavity clamping force and holding pressure are used as standard test stresses. Multi-frequency complex impedance sweep is performed on the edge electrode assembly to obtain the curve of phase angle ∠Z changing with frequency. The extreme value or peak frequency of phase angle f_peak is extracted as a judgment feature of the degree of interface crosslinking and micro-gap residue. Based on the judgment feature, the holding time, holding pressure, and mold temperature are adjusted in a closed loop. The peak frequency of phase angle f_peak is defined as the frequency corresponding to when the phase angle ∠Z reaches its minimum value or its spectral derivative amplitude reaches its maximum value.

3. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The predetermined activity decay threshold is preferably 30 minutes, and is dynamically corrected according to the ambient temperature and / or relative humidity, and an automatic secondary activation process is triggered when Δt exceeds the threshold.

4. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The vacuum baking temperature is 40℃-120℃, and the time is 10min-120min; the plasma activation is selected from air, oxygen, nitrogen or argon plasma, and the activation power is 50W-500W, and the activation time is 5s-180s.

5. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The predetermined frequency set of the multi-frequency complex impedance sweep covers at least one frequency point from 10Hz to 100kHz; the multi-frequency complex impedance sweep uses multiple sine waves or sweep signals with an excitation amplitude of 0.1V-2V and does not introduce DC bias.

6. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The edge electronics module includes a phase-locked demodulator or a quadrature demodulator for simultaneously extracting the real and imaginary parts of the complex impedance.

7. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The preset release window includes at least the target range of contact impedance Rc and the target range of phase angle peak frequency f_peak, and the target range is associated with the calibration results of product specifications or interface peel strength; the real-time adjustment includes extending the holding time, increasing or decreasing the holding pressure, and / or adjusting the mold temperature during the holding period to minimize the fluctuation of contact impedance Rc under the predetermined frequency point set; when the product is deemed unqualified, a rework path is triggered, and the rework path includes at least one of secondary activation, glue replenishment, repeated injection molding, or scrapping.

8. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The ion-conducting continuous medium is an ion-liquid elastomer or an ion gel, and the injection molding temperature is 80℃-220℃.

9. The integrated injection molding and online impedance quality control process for a full-dielectric ion skin module according to claim 1, characterized in that, The online complex impedance quality control is time-synchronized with the pressure / displacement / temperature sensing data of the injection molding machine and used as a release criterion.

10. The application of the process described in any one of claims 1-9 in the mass production of an ion-conductive smart skin module for a humanoid robot.

11. An integrated injection molding and online complex impedance quality control system for an all-dielectric ion skin module, characterized in that, include: A mold assembly having a mold cavity, wherein the mold cavity is provided with a positioning structure for pre-positioning an edge electrode assembly with a flexible structure; An interface processing unit is used to perform desorption pretreatment and plasma activation on the interface to be bonded of the edge electrode assembly. The injection unit is used to inject an ion-conducting continuous medium into the mold cavity to form an integrated injection molding process; An edge electronics module, electrically connected to the edge electrode assembly within the mold cavity, is used to perform multi-frequency complex impedance sweep on the edge electrode assembly and extract interface electrical characteristics during the holding pressure period of the injection unit. The process closed-loop control unit is communicatively connected to the interface processing unit, the injection molding unit, and the edge electronics module, respectively. The process closed-loop control unit is configured to execute the following control logic: monitor the time interval Δt from the end of plasma activation to the completion of injection molding by the injection molding unit, and ensure that it is less than a predetermined activity decay threshold; receive the interface electrical feature quantity extracted by the edge electronics module, and compare it with a preset release window to generate a release decision; and adjust the holding time, holding pressure, and / or mold temperature of the injection molding unit in real time based on the interface electrical feature quantity.

12. The system according to claim 11, characterized in that, The mold assembly also includes an embedded temperature and pressure resistance test probe or conductive insert; the probe or conductive insert's detection end abuts against the reserved test contact of the edge electrode assembly when the mold is locked, and the output end extends out of the mold assembly and connects to the edge electronic module; and the mating point between the temperature and pressure resistance test probe or conductive insert and the mold assembly is provided with a high-temperature and high-pressure resistant insulating and sealing structure to isolate the injection molten metal.

13. The system according to claim 11, characterized in that, The edge electronics module includes a multi-frequency AC excitation source and a phase-locked demodulator or a quadrature demodulator; the process closed-loop control unit is configured to extract at least one of the contact impedance Rc, equivalent series resistance Rs, phase angle ∠Z and phase angle peak frequency f_peak from the edge electronics module as the interface electrical characteristic quantity.

14. The system according to claim 11, characterized in that, The process closed-loop control unit also includes an environmental compensation and traceability module; the environmental compensation and traceability module is used to dynamically correct the predetermined activity attenuation threshold based on ambient temperature and / or relative humidity sensor data, and write the spectrum data of the multi-frequency complex impedance sweep, the release judgment result and the synchronous injection molding unit process parameters into the production history database.

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