Display module, display device and manufacturing method of display module

Abstract

The application discloses a display module, a display device and a manufacturing method of a display panel. The display module comprises a display area and a non-display area. The non-display area is arranged around the display area. The display module comprises an array substrate and a flexible circuit board. The array substrate comprises a first substrate body, a pad group and an alignment mark. The pad group is arranged on one side of the first substrate body and located in the non-display area. The alignment mark is located in the display area. The alignment mark is configured to mark the position of the pad group. The flexible circuit board is arranged on the side surface of the array substrate and is bound to the pad group.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a display module, a display device, and a method for manufacturing the display module. Background Technology

[0002] In display technology applications, video walls are widely used due to their large screen size. However, user demands for the visual experience of video walls are constantly increasing, with a growing emphasis on image continuity and immersion. This makes the seam issue a key challenge. The seam of a video wall refers to the physical border and gap between two adjacent display modules, and its size primarily depends on the bezel width of a single display module. Related technologies utilize COF (Chip On Film) technology to bond the display driver chip to a flexible circuit board. Taking advantage of the flexible circuit board's bendability, the display driver chip can be folded under the display panel, reducing the bezel width of the display module. However, when bonding the flexible circuit board, alignment markers are needed to mark the bonding position. Currently, the method of setting these alignment markers requires the display module to have a sufficient bezel width, thus limiting the reduction of the display module's bezel width. Summary of the Invention

[0003] To address the aforementioned technical problems, this application provides a display module, a display device, and a method for manufacturing the display module, which can effectively reduce the bezel width of the display module.

[0004] The technical solution adopted to achieve the purpose of this application is as follows: This application embodiment provides a display module, including a display area and a non-display area, wherein the non-display area is disposed outside the display area; the display module includes: An array substrate includes a first substrate body and a pad group and an alignment mark disposed on one side of the first substrate body. The pad group is located in the non-display area; the alignment mark is located in the display area and is configured to identify the position of the pad group. A flexible circuit board is disposed on the side surface of the array substrate, and the flexible circuit board is bonded to the pad group.

[0005] In some embodiments, the pad group includes a plurality of pads spaced apart along the extension direction of the edge of the first substrate body, and the alignment marks are spaced apart along the extension direction of the edge of the first substrate body.

[0006] In some embodiments, the array substrate includes a plurality of pad groups and alignment marks corresponding to each pad group, the plurality of pad groups being arranged along the extension direction of the edge of the first substrate body, and the alignment marks being disposed on opposite sides of the corresponding pad groups along the extension direction of the edge of the first substrate body.

[0007] In some embodiments, the alignment mark located on the same side of the corresponding pad group is equal to the shortest distance of the corresponding pad group in the direction of extension of the edge of the first substrate body.

[0008] In some embodiments, the array substrate includes a plurality of sub-pixel regions spaced apart in the display area, and the orthographic projection of the alignment mark on the first substrate body is located within the sub-pixel regions.

[0009] In some embodiments, the plurality of said sub-pixel regions are arranged in multiple rows along a first direction and in multiple columns along a second direction; the first direction is parallel to a first edge of the first substrate body, the second direction is parallel to a second edge of the first substrate body, and the second direction intersects with the first direction; The pad group is located at the first edge, and the orthographic projection of the alignment mark on the first substrate body is located within the column of sub-pixel areas closest to the first edge; and / or, The pad group is located at the second edge, and the orthographic projection of the alignment mark on the first substrate body is located in the row of sub-pixel areas closest to the second edge.

[0010] In some embodiments, the display module further includes a color filter substrate, which is disposed opposite to the array substrate; the color filter substrate includes a second substrate body and a color filter layer disposed on one side of the second substrate body, the color filter layer includes a color resist disposed corresponding to the sub-pixel area, and the orthographic projection of the alignment mark on the first substrate body is located within the orthographic projection of the color resist on the first substrate body.

[0011] In some embodiments, the color resist includes a red sub-color resist, a green sub-color resist, and a blue sub-color resist, and the orthographic projection of the alignment mark on the first substrate body is located within the orthographic projection of the green sub-color resist on the first substrate body.

[0012] In some embodiments, the color filter substrate further includes a black matrix, which is disposed on the same side of the second substrate body as the color filter layer. The orthographic projection of the black matrix on the second substrate body partially overlaps with the orthographic projection of the color filter on the second substrate body. Pixel openings are provided on the black matrix at positions corresponding to the sub-pixel areas. The orthographic projection of the alignment mark on the first substrate body lies within the orthographic projection of the pixel opening on the first substrate body; or... The orthographic projection of the alignment mark on the first substrate body is at least partially located within the orthographic projection of the black matrix on the first substrate body.

[0013] In some embodiments, the array substrate further includes a gate layer disposed on one side of the first substrate body, and the alignment mark is disposed on the same layer as the gate layer.

[0014] In some embodiments, the display module further includes two polarizers and light-shielding ink disposed on the edges of the polarizers. The color filter substrate and the array substrate are located between the two polarizers. A first gap region is formed between the side of the polarizer on the side of the array substrate away from the color filter substrate and the edge of the first substrate body. A second gap region is formed between the side of the polarizer on the side of the color filter substrate away from the array substrate and the edge of the second substrate body. The light-shielding ink is disposed in the first gap region and the second gap region.

[0015] In some embodiments, the light-blocking ink is an elastic ink.

[0016] In some embodiments, the display module further includes a sealing adhesive, which is connected between the color filter substrate and the array substrate and is located in the non-display area; the orthographic projection of the sealing adhesive on the first substrate body includes the orthographic projection of the pad group on the first substrate body, and the side of the sealing adhesive opposite to the display area is aligned with the edge of the first substrate body and the edge of the second substrate body.

[0017] In some embodiments, the array substrate includes a gate layer, a gate insulating layer, and a source / drain layer stacked on the first substrate body; the pad group includes a first connection portion and a second connection portion stacked on top of each other, the first connection portion and the second connection portion being in direct contact and connection, the first connection portion being disposed on the same layer as the gate layer, and the second connection portion being disposed on the same layer as the source / drain layer; the sides of the first connection portion and the second connection portion opposite to the display area are both aligned with the edge of the first substrate body, and the flexible circuit board is bonded to the sides of the first connection portion and the second connection portion opposite to the display area.

[0018] This application also provides a display device, including at least two display modules spliced ​​together as described above.

[0019] This application embodiment also provides a method for manufacturing a display module, including: An array substrate is provided, the array substrate including a first substrate body and a pad group and an alignment mark disposed on one side of the first substrate body, the pad group being located in a non-display area and the alignment mark being located in a display area; the non-display area is disposed around the display area; Place the array substrate on the support platform; Alignment light is emitted toward the array substrate using an alignment device. The alignment light is reflected by the alignment mark and then received by the alignment device to determine the position of the alignment mark. Based on the position of the alignment mark, the position of the pad group is determined, and the flexible circuit board is bound to the pad group.

[0020] In some embodiments, before placing the array substrate on the support stage, the following steps are also included: A color filter substrate is provided, and a sealing adhesive is applied to a non-display area on one side of the color filter substrate or the array substrate. The color filter substrate and the array substrate are placed opposite each other, so that the array substrate and the color filter substrate are connected by the sealing adhesive, and the orthogonal projection of the sealing adhesive on the first substrate body covers the orthogonal projection of the pad group on the first substrate body. The edges of the array substrate, the color filter substrate, and the sealant are ground to align the edges of the first substrate body, the pad group, the color filter substrate, and the sealant.

[0021] As can be seen from the above technical solution, this application integrates the alignment mark into the display area, eliminating the need to reserve additional space for the alignment mark in the non-display area of ​​the array substrate, thereby effectively freeing up space in the non-display area. Consequently, the overall bezel width of the display module is reduced, achieving a narrow bezel design while ensuring bonding accuracy. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the side of the display module where the array substrate is located, provided in an embodiment of this application; Figure 3 This is a schematic diagram illustrating the corresponding positions of a pad group and a color resist as provided in an embodiment of this application. Figure 4 A schematic diagram of the layout structure of a pad group and a fan-out area provided in an embodiment of this application; Figure 5 Provided for the embodiments of this application Figure 4 A schematic diagram of the cross-sectional structure from the perspective of the middle BB (British Biological Building). Figure 6A schematic diagram of the existing pad group and fan-out area layout; Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure from the perspective of the middle AA (analogous to ... Figure 8 This is a schematic diagram of the layout structure of an existing flexible circuit board; Figure 9 A schematic diagram of the layout structure of a flexible circuit board provided in an embodiment of this application; Figure 10 This is a schematic diagram of the wiring layout in the non-display area of ​​an existing display module; Figure 11 This application provides a schematic diagram of the wiring layout in a non-display area of ​​a display module. Figure 12 This is a schematic diagram of the structure of an existing display module; Figure 13 This is a schematic diagram of the structure of the side where the array substrate is located in an existing display module; Figure 14 This is a schematic cross-sectional view of a display module after assembly, provided in an embodiment of this application. Figure 15 Provided for the embodiments of this application Figure 14 Enlarged structural diagram of region A in the middle; Figure 16 This is an exploded view of a display module provided in an embodiment of this application; Figure 17 A schematic diagram of the assembly structure of a display panel and a flexible circuit board in a display module provided in an embodiment of this application; Figure 18 Provided for the embodiments of this application Figure 17 Enlarged structural diagrams of the four corner positions; Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of this application; Figure 20 A flowchart illustrating a method for manufacturing a display module as provided in this application embodiment; Figure 21 A schematic diagram illustrating the identification process of a positioning identifier provided in an embodiment of this application; Figure 22 Provided for the embodiments of this application Figure 20 Flowchart of the process prior to step S200; Figure 23 This is a schematic diagram of the structure after the existing array substrate and color filter substrate are assembled. Figure 24 This is a schematic diagram of the SEM image after grinding when using an organic film to cover the pad assembly. Figure 25 This is a schematic diagram of the post-cell grinding process of an array substrate and a color filter substrate provided in an embodiment of this application; Figure 26 This is a SEM image of a pad assembly after grinding, provided as an embodiment of this application.

[0023] Explanation of reference numerals in the attached figures: 1-Display module; A1-Display area; A2-Non-display area; 20-Array substrate; 21-First substrate body; 211-First edge; 212-Second edge; 22-Pad group; 221-Pad; 222-First connection portion; 223-Second connection portion; 23-Alignment mark; 24-Gate layer; 25-Gate insulating layer; 251-Contact hole; 26-Source / drain layer; 27-Fan-out region; 28-Common electrode trace; 29-Ground line; 201-Sub-pixel region; 30-Color filter substrate; 31-Color filter layer; 311-Color resist; 3111-Red sub-color resist; 3112-Green sub-color resist; 3113-Blue sub-color resist; 32-Second substrate body; 33-Black matrix; 331-Pixel aperture.

[0024] 40 - Polarizing film; B1 - First spacing zone; B2 - Second spacing zone; 50 - Sealing adhesive; 60 - Light-blocking ink; 70 - Display panel; 80 - Flexible circuit board; 90 - Backlight; 100 - Diffuser plate; 110 - Mid-frame structure; 120 - Organic film; 130 - Conductive adhesive; Y - First direction; X - Second direction; 2- Display device; 3-Supporting platform; 4-Alignment device; 41-Light source; 42-Lens. Detailed Implementation

[0025] To enable those skilled in the art to better understand this application, the technical solution of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] In traditional display module manufacturing, COF (Copy-on-Flight) technology is used to bond flexible circuit boards to pad groups, thereby reducing bezel width. During the bonding process, the alignment device relies on alignment markers to determine the pad group positions. However, since these markers are located outside the display area, a bezel area must be reserved during manufacturing to protect them from the grinding process. Consequently, the bezel width of the display module is limited to a level that cannot meet the requirements for extremely narrow bezels.

[0027] In this regard, an embodiment of this application proposes a display module, please refer to... Figure 1The display module 1 includes a display area A1 and a non-display area A2, with the non-display area A2 surrounding the display area A1. The display area A1 is the area for displaying images, while the non-display area A2 is configured to carry driving circuits, connection ports, or bezel structures.

[0028] The display module 1 includes an array substrate 20, which includes a first substrate body 21 and a pad group 22 and an alignment mark 23 disposed on one side of the first substrate body 21. The pad group 22 is located in the non-display area A2 and is configured to be electrically connected to external circuitry. The pad group 22 can be designed as a series of metal contacts, which can be formed on the edge region of one side of the first substrate body 21 by photolithography and etching processes. The alignment mark 23 is located in the display area A1 and is configured to identify the position of the pad group 22. The alignment mark 23 can be designed as a geometric shape that is easy to detect and identify during the manufacturing process, such as a T-shape, cross shape, circle, or square.

[0029] The display panel 70 includes a flexible circuit board 80 disposed on the side surface of the array substrate 20 and bonded to the pad group 22. The flexible circuit board 80 can be bonded to the pad group 22 in various ways, such as thermoforming with conductive adhesive 130 or achieving electrical connection through soldering. The flexible circuit board 80 can be designed with a pin layout matching the pad group 22, and bonded after alignment. The flexible circuit board 80 can also be designed with a certain redundant length to allow for bending or folding after bonding, thereby reducing the overall size of the display module 1. When bonding the flexible circuit board 80, the center point or edge of the alignment mark 23 can be identified by the alignment device 4 to determine the precise coordinates of the pad group 22, facilitating accurate alignment of the flexible circuit board 80.

[0030] During the assembly of display module 1, when it is necessary to bond the flexible circuit board 80 to the array substrate 20, the array substrate 20 can be placed under the alignment device 4. The alignment device 4 emits alignment light, which passes through the display area A1 of the array substrate 20 and is reflected by the alignment mark 23 set in the display area A1. The reflected light is received by the alignment device 4, thereby determining the position of the alignment mark 23 on the array substrate 20. Since there is a preset geometric relationship between the alignment mark 23 and the pad group 22, the alignment device 4 can calculate the precise position of the pad group 22 based on the determined position of the alignment mark 23. Subsequently, the flexible circuit board 80 can be precisely aligned with the pad group 22 and bonded, for example, by using hot-pressing conductive adhesive 130 to achieve electrical connection.

[0031] In this embodiment, by integrating the alignment mark 23 into the display area A1, the non-display area A2 of the array substrate 20 no longer needs to reserve additional space for the alignment mark 23. This arrangement allows the identification of the alignment mark 23 to be completed within the display area A1 during the bonding operation between the flexible circuit board 80 and the array substrate 20, thereby effectively freeing up space in the non-display area A2. As a result, the overall bezel width of the display module 1 is reduced, achieving a narrow bezel design while ensuring bonding accuracy.

[0032] In some embodiments, please refer to Figure 2 The pad group 22 includes a plurality of pads 221 spaced apart along the extension direction of the edge of the first substrate body 21, and alignment marks 23 spaced apart along the extension direction of the edge of the first substrate body 21. The extension direction of the edge of the first substrate body 21 can be either the long side direction or the short side direction of the first substrate body 21 to accommodate specific wiring or structural designs. Each pad 221 is an independent conductive unit constituting a complete pad group 22. The plurality of pads 221 can be arranged at a certain spacing along the extension direction of the edge of the first substrate body 21 to meet the connection requirements of high-density pins on the flexible circuit board 80. This design enables the pad group 22 to achieve finer signal transmission. The plurality of pads 221 can be formed on the first substrate body 21 through processes such as photolithography and etching. By aligning the distribution direction of the alignment marks 23 with the distribution direction of the plurality of pads 221, it helps the alignment marks 23 to identify the corresponding positions of the pad group 22.

[0033] In some embodiments, please refer to Figure 2 The array substrate 20 includes multiple pad groups 22 and alignment marks 23 corresponding to each pad group 22. The multiple pad groups 22 can be arranged linearly, for example, configured to connect multiple drive signals, or arranged in a matrix or L-shape to adapt to different wiring requirements. Each pad group 22 can be configured to be bonded to a flexible circuit board 80. The alignment marks 23 corresponding to each pad group 22 are markers specifically set for each pad group 22 and configured to indicate its precise position. The center or specific edge of these alignment marks 23 has a preset positional relationship with the center or specific edge of the corresponding pad group 22, so as to determine the precise coordinate position of the pad group 22 through the alignment marks 23.

[0034] Multiple pad groups 22 are arranged along the extension direction of the edge of the first substrate body 21, and alignment marks 23 are provided on opposite sides of the corresponding pad group 22 along the extension direction of the edge of the first substrate body 21. That is, each pad group 22 has one alignment mark 23 on one side and another alignment mark 23 on the other side along the extension direction of the edge of the first substrate body 21. For example, if the pad groups 22 are arranged laterally, alignment marks 23 are provided on both the left and right sides of each pad group 22; if the pad groups 22 are arranged longitudinally, alignment marks 23 are provided on both the top and bottom sides of each pad group 22. This arrangement on both sides can provide a more accurate alignment reference, which helps to calibrate the position and angle of the pad group 22 along the extension direction of the edge of the first substrate body 21.

[0035] By setting multiple pad groups 22 on the first substrate body 21 and configuring corresponding alignment marks 23 for each pad group 22, with these alignment marks 23 located on both sides of the corresponding pad group 22 along the extension direction along the edge of the first substrate body 21, the alignment device 4 can obtain richer and more accurate alignment information when the flexible circuit board 80 is bonded to the array substrate 20. When multiple flexible circuit boards 80 need to be bonded to these multiple pad groups 22 arranged along the extension direction along the edge of the first substrate body 21, the alignment device 4 can use the alignment marks 23 located on both sides of each pad group 22 to accurately determine the position and angle of the pad group 22 along the extension direction along the edge of the first substrate body 21. This arrangement of double-sided alignment marks 23 can provide a more comprehensive position reference, effectively detect and correct minor rotational or translational deviations that may occur during the bonding process of the flexible circuit board 80, thereby ensuring high-precision alignment and reliable electrical connection between the flexible circuit board 80 and the corresponding pad group 22.

[0036] For example, multiple pad groups 22 are arranged horizontally along one edge of the first substrate body 21 of the array substrate 20, each configured to connect different flexible circuit boards 80. To achieve precise bonding, a T-shaped alignment mark 23 is set on the left and right sides of each pad group 22 within the display area A1. During the bonding process of the flexible circuit board 80, the alignment device 4 uses an optical system to detect the alignment marks 23 on both sides of each pad group 22. By analyzing the relative positions of these marks, the alignment device 4 can calculate the precise position of each pad group 22; based on this alignment information, the alignment device 4 can adjust the position and angle of the flexible circuit board 80 in real time to ensure optimal alignment with the corresponding pad group 22, and then perform the bonding operation.

[0037] In some embodiments, please refer to Figure 3The alignment mark 23 located on the same side of the corresponding pad group 22 has the shortest distance to the corresponding pad group 22 in the direction extending from the edge of the first substrate body 21. That is, there is a fixed and quantifiable spatial reference between the alignment mark 23 and the pad 221 inside the corresponding pad group 22. The alignment mark 23 can be designed as a pattern with specific geometric features (e.g., a center point or an edge), and the shortest distance between this feature and the corresponding geometric feature (e.g., a center point or an edge) of the nearest pad 221 in the pad group 22 can be set to be equal. For example, the alignment mark 23 can be a T-shape, and the vertical distance between its edge closer to the pad group 22 and the edge of the nearest pad 221 in the direction extending from the edge of the first substrate body 21 is set to a fixed value. Alternatively, the vertical distance between the center point of the alignment mark 23 and the center point of the nearest pad 221 in the direction extending from the edge of the first substrate body 21 can be set to be equal. This equidistant relationship provides the automated alignment device 4 with a clear, consistent, and highly accurate reference point, enabling it to quickly and accurately identify and position the precise location of each pad group 22.

[0038] Please continue reading. Figure 3 In the extending direction along the edge of the first substrate body 21, the pad group 22 has a first side and a second side. The alignment mark 23 located on the same side of the corresponding pad group 22 is equal to the shortest distance between the corresponding pad group 22 and the edge of the first substrate body 21 in the extending direction. This means that for multiple pad groups 22, each pad group 22 has two unique alignment marks 23 on both sides of the extending direction along the edge of the first substrate body 21. The alignment mark 23 located on the first side of the corresponding pad group 22 is equal to the shortest distance between the corresponding pad group 22 and the edge of the first substrate body 21 in the extending direction. Figure 3 In this context, d1 is a fixed value. Each alignment mark 23 located on the second side of the corresponding pad group 22 is equal to the shortest distance of the corresponding pad group 22 along the extension direction along the edge of the first substrate body 21. Figure 3 d2 is a fixed value. For a pad group 22, the shortest distance between the alignment marks 23 on its opposite sides and the pad group 22 along the extension direction along the edge of the first substrate body 21 can be equal or unequal. Figure 3 In this context, d1 and d2 can be equal or unequal; no special restrictions are imposed here.

[0039] When bonding multiple flexible circuit boards 80 to the array substrate 20, the alignment device 4 first detects the position of the alignment mark 23 in the display area A1 using an optical recognition system. Because there is a precise geometric relationship between the alignment mark 23 and the pad group 22, with equal shortest distances, the alignment mark 23 for each pad group 22 can provide a unified reference. In this way, when positioning the bonding location of the flexible circuit board 80 using the alignment device 4, the parameter adjustment of the alignment device 4 can be simplified, and the flexible circuit board 80 can be accurately aligned and bonded to the corresponding pad group 22, thereby ensuring the stability of the bonding of the flexible circuit board 80 and improving the bonding efficiency of the flexible circuit board 80.

[0040] In some embodiments, please refer to Figure 2 The array substrate 20 includes multiple sub-pixel regions 201 spaced apart in the display area A1. The orthographic projection of the alignment mark 23 onto the first substrate body 21 is located within the sub-pixel region 201. The array substrate 20 has multiple gate lines and multiple data lines. The orthographic projections of the gate lines and data lines onto the first substrate body 21 form a mesh structure. The multiple regions enclosed by the gate lines and data lines in this mesh structure constitute the multiple sub-pixel regions 201 of the array substrate 20. By placing the alignment mark 23 within the area of ​​the sub-pixel region 201, the reflection from the gate lines and data lines can be avoided from affecting the identification of the alignment mark 23, thereby ensuring that the alignment mark 23 can be effectively identified, improving the identification accuracy of the alignment mark 23, and thus ensuring the bonding accuracy between the flexible circuit board 80 and the corresponding pad group 22.

[0041] In some embodiments, please refer to Figure 2 Multiple sub-pixel regions 201 are arranged in multiple rows along a first direction Y and in multiple columns along a second direction X. The first direction Y is parallel to the first edge 211 of the first substrate body 21, and the second direction X is parallel to the second edge 212 of the first substrate body 21. The first direction Y and the second direction X intersect. That is, the sub-pixel regions 201 in the array substrate 20 are arranged in a matrix.

[0042] The pad group 22 is disposed at the first edge 211 of the first substrate body 21, and the orthographic projection of the alignment mark 23 on the first substrate body 21 is located within a column of sub-pixel areas 201 closest to the first edge 211; and / or, the pad group 22 is disposed at the second edge 212 of the first substrate body 21, and the orthographic projection of the alignment mark 23 on the first substrate body 21 is located within a row of sub-pixel areas 201 closest to the second edge 212. That is, the pad group 22 configured to connect the flexible circuit board 80 is concentrated in a specific edge area of ​​the first substrate body 21, such as the long edge and / or short edge of the first substrate body 21. This layout is beneficial for the bonding connection of the flexible circuit board 80. The alignment mark 23 is precisely placed in the display area A1 and is located in the area of ​​a column or row of sub-pixel areas 201 adjacent to the pad group 22.

[0043] By concentrating the pad groups 22 on a specific edge of the first substrate body 21, the external connection area is clearly defined. By placing the alignment mark 23 within a column or row of sub-pixel areas 201 closest to the edge of the pad group 22, the alignment mark 23 is physically closer to the corresponding pad group 22. Therefore, when bonding the flexible circuit board 80 to the pad group 22, the alignment device 4 can obtain the relative position information of the pad group 22 using the alignment mark 23 located in the display area A1. Since the alignment mark 23 is adjacent to the pad group 22, alignment errors caused by distance are effectively reduced, thereby ensuring precise bonding between the flexible circuit board 80 and the pad group 22.

[0044] In some embodiments, please refer to Figure 1 The display module 1 also includes a color filter substrate 30, which is disposed opposite to the array substrate 20. As an important component of the display module 1, the color filter substrate 30, together with the array substrate 20, constitutes the core structure of the display panel 70. The main function of the color filter substrate 30 is to provide a color filter layer, enabling the light-emitting pixels to display different colors.

[0045] The color filter substrate 30 includes a second substrate body 32 and a color filter layer 31 disposed on one side of the second substrate body 32. The color filter layer 31 includes color resists 311 disposed corresponding to the sub-pixel areas 201. The color filter layer 31 is the functional layer of the color filter substrate 30, mainly responsible for realizing the color display function of the display module 1. The color resists 311 are color filter units in the color filter layer 31, configured to selectively transmit light of specific wavelengths, thereby producing primary colors such as red, green, and blue. The color resists 311 can be in the form of strips and arranged in multiple columns along the second direction X. Each column of color resists 311 corresponds to a column of sub-pixel areas 201. The color resists 311 can be made by mixing photoresist and pigments and formed through a precise patterning process. For example, the color resists 311 can include red sub-color resists 3111, green sub-color resists 3112, and blue sub-color resists 3113, or can be composed of other color combinations.

[0046] The alignment mark 23 is projected onto the first substrate body 21 within the projection of the color resist 311 onto the first substrate body 21. That is, along the thickness direction of the first substrate body 21, the alignment mark 23 is covered by the area where the color resist 311 is located. This structural configuration allows the alignment mark 23 to be cleverly hidden below the color resist 311 within the display area A1, effectively avoiding any impact on the layout of the driving circuit within the array substrate 20. Furthermore, due to the small size of the alignment mark 23, its placement does not significantly affect the display image of the display module 1, thus enabling precise marking of the pad group 22's position without compromising display quality. This integration method not only maintains the advantage of a narrow bezel in the display module 1 but also optimizes the internal space utilization of the array substrate 20.

[0047] In some embodiments, please refer to Figure 1 and Figure 3 The color resist 311 includes a red sub-color resist 3111, a green sub-color resist 3112, and a blue sub-color resist 3113, which can be arranged alternately along the second direction X. The orthographic projection of the alignment mark 23 on the first substrate body 21 is located within the orthographic projection of the green sub-color resist 3112 on the first substrate body 21. That is, the alignment mark 23 is set in the area covered by the green sub-color resist 3112. Since the green sub-color resist 3112 has high light transmittance, by setting the alignment mark 23 correspondingly to the green sub-color resist 3112, the impact of the setting of the alignment mark 23 on the display effect of the display module 1 can be minimized, thereby ensuring the display quality of the display module 1.

[0048] In some embodiments, the color filter substrate 30 further includes a black matrix 33, which is disposed on the same side of the second substrate body 32 as the color filter layer 31. The black matrix 33 is an opaque area in the color filter substrate 30 and can be made of black resin material. The orthographic projection of the black matrix 33 on the second substrate body 32 partially overlaps with the orthographic projection of the color resist 311 on the second substrate body 32, and a pixel opening 331 is provided on the black matrix 33 at the position corresponding to the sub-pixel area 201. That is, the black matrix 33 can be configured as a mesh structure, and its mesh structure can be consistent with the mesh structure formed by the gate lines and data lines. Moreover, the orthographic projection of the black matrix 33 on the first substrate body 21 covers the orthographic projection of the gate lines and data lines on the first substrate body 21 to avoid reflection from the gate lines and data lines and improve display contrast. The black matrix 33 located in the edge region can also prevent light leakage of the display module 1 and improve the visual effect of the displayed image. The hollowed-out areas in the black matrix 33 mesh structure correspond to the sub-pixel areas 201 to form pixel openings 331 in the sub-pixel areas 201, which are used to ensure that light passes through smoothly and realize the display of the image.

[0049] In some embodiments, the orthographic projection of the alignment mark 23 on the first substrate body 21 is located within the orthographic projection of the pixel opening 331 on the first substrate body 21. That is, the alignment mark 23 is located in the area where the pixel opening 331 is located, so as to avoid the influence of reflection from the gate line and data line on the identification of the alignment mark 23, thereby ensuring that the alignment mark 23 can be effectively identified, improving the identification accuracy of the alignment mark 23, and ensuring the bonding accuracy between the flexible circuit board 80 and the corresponding pad group 22; at the same time, setting the alignment mark 23 in the area where the pixel opening 331 is located can also avoid the setting of the alignment mark 23 affecting the layout of the gate line and data line.

[0050] In some embodiments, the orthographic projection of the alignment mark 23 on the first substrate body 21 is at least partially located within the orthographic projection of the black matrix 33 on the first substrate body 21. Since the orthographic projection of the black matrix 33 on the first substrate body 21 covers the orthographic projections of the gate lines and data lines on the first substrate body 21, and the linewidth of the network structure of the black matrix 33 is greater than the linewidth of the gate lines and data lines, the alignment mark 23 can be positioned within the sub-pixel area 201 near the gate lines or data lines and is at least partially covered by the black matrix 33. This arrangement can minimize the potential impact of the alignment mark 23 on the display of the display module 1, thereby improving the display quality of the display module 1 while ensuring that the alignment mark 23 is effectively identified.

[0051] It should be noted that the orthographic projection of the alignment mark 23 on the first substrate body 21 can be partially or entirely located within the orthographic projection of the black matrix 33 on the first substrate body 21. The specific setting method can be selected and adjusted according to the actual size relationship between the black matrix 33, the gate line, the data line and the alignment mark 23, and no special restrictions are imposed here.

[0052] In some embodiments, the array substrate 20 further includes a gate layer 24, which is disposed on one side of the first substrate body 21, with the alignment mark 23 disposed on the same layer as the gate layer 24. The gate layer 24, as one of the key functional layers in the array substrate 20, can be formed by depositing a metal material (such as molybdenum, titanium, aluminum, copper, or their alloys) through sputtering, evaporation, or other methods, and then forming a specific pattern through photolithography, etching, or other processes. The main function of the gate layer 24 is to form the gate electrode and gate line of the thin-film transistor, controlling the conduction and cutoff of the thin-film transistor, thereby driving the pixel display. The gate layer 24 can be composed of a single metal layer or multiple stacked metal layers.

[0053] By setting the alignment mark 23 in the same layer as the gate layer 24 in the array substrate 20, the same materials and photomasks can be used to simultaneously form the alignment mark 23 in the display area A1 in the same process step of forming the gate layer 24. This can effectively avoid the extra steps of deposition and photolithography etching for the alignment mark 23 separately, thereby helping to simplify the fabrication process of the array substrate 20 and reduce production costs.

[0054] In some embodiments, please refer to Figure 4 and Figure 5 The array substrate 20 includes a gate layer 24, a gate insulating layer 25, and a source / drain layer 26 stacked on a first substrate body 21. The gate layer 24 is configured to form a gate electrode and a gate line, the source / drain layer 26 is configured to form a source, a drain, and a data line, and the gate insulating layer 25 is configured to isolate the gate layer 24 and the source / drain layer 26. The gate insulating layer 25 can be made of an inorganic insulating material, such as silicon nitride or silicon oxide, and can be formed on the gate layer 24 by processes such as chemical vapor deposition. The source / drain layer 26 can be made of a conductive metal material, such as molybdenum, aluminum, copper, titanium, or alloys thereof, and can be formed on the gate insulating layer 25 by processes such as sputtering or evaporation.

[0055] To achieve the narrow bezel design of the display module 1, the flexible circuit board 80 can be bonded to the array substrate 20 using a side-bonding method, that is, the side surface of the pad group 22 is used to achieve electrical connection with the flexible circuit board 80. Since the thickness of a single metal layer is only 0.4 micrometers to 0.5 micrometers, a double-layer metal design can be used to increase the contact area between the flexible circuit board 80 and the pad group 22.

[0056] The pad group 22 includes a first connection portion 222 and a second connection portion 223 stacked together. The first connection portion 222 and the second connection portion 223 are in direct contact and connection, meaning that there is no gate insulating layer 25 between the first connection portion 222 and the second connection portion 223 in the direction perpendicular to the first substrate body 21. The first connection portion 222 is disposed on the same layer as the gate layer 24, and the second connection portion 223 is disposed on the same layer as the source-drain layer 26. That is, the first connection portion 222 is the lower layer of the pad group 22, and its material and formation process are the same as those of the gate layer 24 or completed in the same process step, serving as the bottom conductive structure of the pad group 22. The second connection portion 223 is the upper layer of the pad group 22, and its material and formation process are the same as those of the source-drain layer 26 or completed in the same process step, serving as the top conductive structure of the pad group 22. The first connection portion 222 and the second connection portion 223 are stacked in the vertical direction to form a multilayer structure pad group 22.

[0057] When fabricating the gate insulating layer 25, the gate insulating layer 25 on the surface of the first connection portion 222 can be removed by photolithography and etching processes, so that the subsequently formed second connection portion 223 can directly cover the surface of the first connection portion 222, thereby ensuring the electrical continuity and mechanical stability inside the pad group 22. Since the second connection portion 223 is directly in contact with and stacked with the first connection portion 222, it is possible to avoid forming contact holes 251 configured for electrical connection between the second connection portion 223 and the first connection portion 222 in the non-display area A2 by photolithography and etching processes on the gate insulating layer 25 (e.g., ...). Figure 6 and Figure 7 This helps to reduce the width of the non-display area A2, thus enabling the narrow bezel design of display module 1.

[0058] The sides of the first connecting portion 222 and the second connecting portion 223 facing away from the display area A1 are both aligned with the edge of the first substrate body 21. The flexible circuit board 80 is bonded to the side of the first connecting portion 222 and the second connecting portion 223 facing away from the display area A1. That is, the side of the pad group 22 facing away from the display area A1 is on the same plane as the physical cutting edge of the first substrate body 21, so that the connecting end of the flexible circuit board 80 can be closely aligned with the side surface of the pad group 22. This allows the flexible circuit board 80 to be connected to the side surface of the first substrate body 21 in close contact, thereby reducing the overall size of the display module 1 and realizing the narrow bezel design of the display module 1. The flexible circuit board 80 can directly establish electrical and mechanical connections with the side surface of the pad group 22 through conductive adhesive 130, thermoforming, or anisotropic conductive film.

[0059] When the alignment mark 23 is disposed on the same layer as the gate layer 24 (or the source-drain layer 26), the alignment mark 23 can be formed synchronously with the first connection portion 222 (or the second connection portion 223) of the pad group 22 in the same process step to ensure the alignment accuracy of the relative position of the alignment mark 23 and the pad group 22, thereby improving the accurate alignment of the bonding position between the flexible circuit board 80 and the pad group 22, and ensuring the bonding stability and reliability between the flexible circuit board 80 and the pad group 22.

[0060] It should be noted that you should refer to [link / reference]. Figures 4 to 7 By adopting this solution, the width occupied by the via area can be omitted in the embodiments of this application, so that the width occupied by the pad group 22 in the non-display area A2 can be reduced from L3 to L1, for example, from 120μm to 60μm. That is, the border of the display module 1 can be compressed by about 60μm while achieving the same conduction effect.

[0061] Because the width of the non-display area A2 of display module 1 is compressed, the traces located in the non-display area A2 need to be re-laid out to meet the design requirements of a narrow bezel. For example, the fan-out region 27 is a critical wiring area in the array substrate 20 that connects the dense pixel electrodes of the display area A1 to the relatively sparse pins of the driver chip on the flexible circuit board 80. In some embodiments, this application can compress the fan-out region 27 by increasing the number of flexible circuit boards 80. Please refer to... Figure 8 and Figure 9 Taking a 55-inch display module 1 as an example, on the side of the array substrate 20 parallel to the second direction X, the number of flexible circuit boards 80 can be increased from 24 to 28, while the width d1 of the flexible circuit boards 80 can remain basically unchanged, the spacing d2 of the flexible circuit boards 80 can be reduced from 10.57mm to 3.42mm, and the number of channels of a single flexible circuit board 80 can be reduced from 240 to 206. On the side of the array substrate 20 parallel to the first direction Y, the number of flexible circuit boards 80 can be increased from 9 to 11, while the width d3 of the flexible circuit boards 80 can remain basically unchanged, the spacing d4 of the flexible circuit boards 80 can be reduced from 35.71mm to 29.49mm, and the number of channels of a single flexible circuit board 80 can be reduced from 120 to 98.

[0062] As the number of flexible circuit boards 80 increases, the number of channels in a single flexible circuit board 80 decreases, meaning the number of pixel electrodes within the array substrate 20 connected to a single flexible circuit board 80 decreases. This allows the spacing between the inclined segments of the traces in the Fan-out region 27 to be narrowed from 10μm to 5.6μm, while ensuring the resistance difference (signal delay) in the Fan-out region 27, thus achieving a maximum Fan-out region 27 size of 240μm. At this point, the width of the non-display area A2 of the array substrate 20 is the sum of the width L1 (e.g., 60μm) occupied by the pad group 22 and the width L2 (e.g., 240μm) occupied by the Fan-out region 27. In other words, the width of the non-display area A2 (the width of the edge black matrix 33) can be reduced to 0.3mm (e.g., ...). Figure 4 ).

[0063] Furthermore, on the other side of the array substrate 20 parallel to the first direction Y or the second direction X, although the pad group 22 and the flexible circuit board 80 may not be provided, a grounding line 29 will be provided at the position corresponding to the non-display area A2 to serve as electrostatic protection. Since the width of the non-display area A2 of the display module 1 is compressed, the common electrode trace 28 and the grounding line 29 located in the non-display area A2 also need to be re-laid out to meet the design requirements of the narrow bezel.

[0064] Please see Figure 10 Taking a 55-inch display module 1 as an example, in the traditional design, the grounding wire 29 and the common electrode trace 28 can be designed with a line width of 20μm, the spacing p1 between adjacent common electrode traces 28 can be designed to be 15μm, and the spacing p2 between the grounding wire 29 and adjacent common electrode traces 28 can be designed to be 25μm. The distance p3 from which the edge is ground away during subsequent polishing can be designed to be 150μm. After polishing, one grounding wire 29 is retained to meet the requirements of electrostatic discharge protection.

[0065] Please see Figure 11 In this embodiment, the grounding wire 29 and the common electrode trace 28 can also be designed with a line width of 20μm. However, the spacing p1 between adjacent common electrode traces 28 can be narrowed to 10μm, and the spacing p2 between the grounding wire 29 and adjacent common electrode traces 28 can also be narrowed to 10μm. The grinding distance p3 during subsequent grinding can be increased to 200μm to achieve a narrow bezel design of 0.3mm. One grounding wire 29 can still be retained after grinding to meet the requirements of electrostatic protection.

[0066] In some embodiments, please refer to Figure 1The display module 1 also includes two polarizers 40 and light-shielding ink 60 disposed on the edge of the polarizers 40. The color filter substrate 30 and the array substrate 20 are located between the two polarizers 40. The polarizer 40 located on the side of the array substrate 20 away from the color filter substrate 30 has a first gap region B1 between the side facing the flexible circuit board 80 and the edge of the first substrate body 21. The polarizer 40 located on the side of the color filter substrate 30 away from the array substrate 20 has a second gap region B2 between the side facing the flexible circuit board 80 and the edge of the second substrate body 32. The light-shielding ink 60 is disposed in the first gap region B1 and the second gap region B2.

[0067] The polarizer 40 is an optical element configured to selectively transmit light with a specific polarization direction. Its main function is to improve display contrast, eliminate glare, and ensure the clarity of displayed content. The light-shielding ink 60 is an opaque material that can be composed of resin, pigments (such as carbon black), and solvents. In the display module 1, the main function of the light-shielding ink 60 is to block light and prevent it from leaking from non-display areas A2 (such as the bezel area), thereby avoiding interference with the display effect. In addition, the light-shielding ink 60 also protects internal components and enhances structural stability.

[0068] Since the flexible circuit board 80 is located on the side surface of the array substrate 20, to avoid interference between the flexible circuit board 80 and the polarizer 40 when it is bonded to the array substrate 20, the polarizer 40 cannot be attached beyond the edges of the first substrate body 21 and the second substrate body 32. Furthermore, because the flexible circuit board 80 reaches a high temperature when bonded to the array substrate 20, to prevent the polarizer 40 from being burned by the high-temperature probe during the bonding process, the polarizer 40 needs to maintain a certain distance from the edges of the first substrate body 21 and the second substrate body 32. This results in the formation of a first gap region B1 and a second gap region B2 between the sides of the two polarizers 40 facing the flexible circuit board 80 and the edges of the first substrate body 21 and the second substrate body 32, respectively. This may cause light leakage in the first gap region B1 and the second gap region B2.

[0069] By applying light-shielding ink 60 to the first interval B1 and the second interval B2, the light-shielding ink 60 is tightly bonded to the polarizer 40, forming an effective barrier that blocks light leakage that may occur from the edge area of ​​the display module 1. The light-shielding ink 60 not only prevents light leakage but also protects the edge of the polarizer 40, enhancing the overall structural stability and reliability of the display module 1. This arrangement effectively solves the edge light leakage and protection problems of the narrow-bezel display module 1 while ensuring display performance.

[0070] In some embodiments, the light-shielding ink 60 is an elastic ink. Elastic ink refers to ink with good flexibility, elasticity, and resistance to deformation. Unlike traditional hard inks, elastic inks can deform along with the substrate without cracking or peeling when subjected to mechanical stresses such as tension, bending, or compression. For example, a highly elastic polymer such as silicone-based resin can be used as the ink's base material, mixed with black pigment and a curing agent. After coating, it is cured at high temperature. The elongation at break after curing can reach over 300%, exhibiting a certain degree of elasticity and flexibility.

[0071] By designing the light-shielding ink 60 as an elastic ink, it can adapt to the deformation that the display module 1 may undergo during actual use. For example, when the display module 1 is subjected to deformation caused by temperature changes, the elastic ink can elastically deform along with the polarizer 40 without cracking, peeling, or falling off due to stress concentration. This ensures that the light-shielding ink 60 maintains its complete light-shielding function under various operating conditions, effectively preventing light leakage in the non-display area A2. The introduction of elastic ink enhances the overall structural stability and environmental adaptability of the display module 1, thereby improving the long-term reliability and display performance of the display module 1.

[0072] It should be noted that when the alignment mark 23 is set in the non-display area A2, the polarizer 40 located on one side of the array substrate 20 must expose the alignment mark 23 for the device to recognize it. For example, please refer to... Figure 12 and Figure 13 The distance from the inner side of the alignment mark 23 to the edge of the array substrate 20 is d, and the distance from the polarizer 40 to the edge of the array substrate 20 is a. The polarizer 40 needs to be attached using laser cutting with a cutting tolerance of ±100μm. Considering that the polarizer 40 will have a black edge within a range of ±70μm after cutting, it is necessary to satisfy a-100>d+70, i.e., a>d+170. The maximum design value of the distance d from the inner side of the alignment mark 23 to the edge of the array substrate 20 is 100μm (the alignment mark 23 itself is 70μm in size, and its outer distance from the edge e of the array substrate 20 is 30μm). Therefore, to ensure that the polarizer 40 exposes the alignment mark 23, the minimum design value of the distance a from the polarizer 40 to the edge of the array substrate 20 needs to be 270μm.

[0073] Since the width of the edge black matrix 33 in this embodiment is 300μm (a+b=300μm), even if the design value of a is set to the minimum limit of 270μm, considering the cutting tolerance of the polarizer 40 is ±100μm, the minimum value of b is -70μm. This means the edge of the polarizer 40 may be within 70μm of the display area A1, causing edge light leakage. Therefore, if the alignment mark 23 is placed in the non-display area A2, edge light leakage of the polarizer 40 will inevitably occur, provided that the alignment mark 23 can be identified. Please refer to... Figure 2 In this embodiment of the application, by setting the alignment mark 23 in the display area A1, the setting of the polarizer 40 does not need to consider the setting position of the alignment mark 23. This ensures that the alignment mark 23 can be identified, while also effectively preventing light leakage at the edge of the polarizer 40.

[0074] In some embodiments, please refer to Figure 1 The display module 1 also includes a sealing adhesive 50, which connects the color filter substrate 30 and the array substrate 20 and is located in the non-display area A2. The sealing adhesive 50 is a material configured to bond and seal the array substrate 20 and the color filter substrate 30 of the display module 1, and its main function is to provide mechanical support and sealing. The sealing adhesive 50 is disposed between the color filter substrate 30 and the array substrate 20, forming a sealed cavity that isolates the display medium (e.g., liquid crystal) and internal circuitry from the external environment, preventing external moisture and oxygen from entering the display medium and protecting the internal circuitry. Simultaneously, the sealing adhesive 50 is located within the non-display area A2, ensuring that it does not obstruct the display area A1, thereby not affecting the normal display function of the display module 1.

[0075] Sealing adhesive 50 can be in liquid or paste form and can be applied to the substrate by dispensing, printing, or other methods. It is then cured by heating or ultraviolet light to form a robust sealing layer. For example, sealing adhesive 50 can be made from epoxy resin-based materials, which have good adhesive strength, resistance to damp heat, and chemical stability. Sealing adhesive 50 can also be made from acrylic ester-based materials, which have a fast curing speed and are suitable for high-efficiency production environments.

[0076] The orthographic projection of the sealant 50 onto the first substrate body 21 includes the orthographic projection of the pad group 22 onto the first substrate body 21. The side of the sealant 50 facing away from the display area A1 is aligned with the edge of the first substrate body 21 and the edge of the second substrate body 32. The pad group 22 is a critical electrical connection area on the array substrate 20 configured to bond with the flexible circuit board 80. It is susceptible to corrosion from moisture, oxygen, or other external contaminants, which can affect the reliability of the connection. By ensuring that the sealant 50 completely covers the area where the pad group 22 is located in the vertical projection direction, the sealant 50 provides an additional physical barrier and chemical protection for the pad group 22, significantly improving the long-term stability and reliability of the connection of the pad group 22.

[0077] By precisely aligning the outer edge of the sealant 50 with the edges of the first substrate body 21 and the second substrate body 32, the sealant 50 can be prevented from protruding outwards, thereby effectively controlling the width of the non-display area A2 and achieving a narrower bezel. Simultaneously, this precise alignment also helps to create neat and aesthetically pleasing module edges. When applying the sealant 50, high-precision equipment can be used to ensure that its outer edge coincides with the edges of the first substrate body 21 and the second substrate body 32; alternatively, after the sealant 50 has cured, a precise grinding process can be used to simultaneously process the sealant 50 with the edges of the color filter substrate 30 and the array substrate 20 to achieve alignment.

[0078] In some embodiments, please refer to Figures 14 to 16 The display module 1 also includes a backlight 4190, a diffuser plate 100, and a mid-frame structure 110. The array substrate 20 and the color filter substrate 30 are assembled to form the display panel 70 of the display module 1. The backlight 4190 is disposed on the side of the array substrate 20 facing away from the color filter substrate 30 and is installed on the bottom surface within the mid-frame structure 110. The backlight 4190 can be a direct-lit type, and can be an LED strip with a diffuser lens structure or a Mini LED panel. The backlight 4190 is configured to provide the backlight source 41 required for the liquid crystal display.

[0079] A diffuser plate 100 is positioned between the backlight 4190 and the display panel 70. The diffuser plate 100 can be made by double-sided screen-printing diffusion ink on a glass substrate, with the light-emitting surface bonded to an optical brightness enhancement film. The brightness enhancement film can be a BEF, DBEF, or a composite of both. The glass substrate and the brightness enhancement film can be fully bonded using optical adhesive. The diffuser plate 100 can convert the LED array light source 41 into a uniform surface light source 41 through the scattering effect of the diffusion ink on the upper / lower surfaces of the glass substrate, thereby achieving light mixing. The diffuser plate 100 can also enhance the brightness of the backlight 4190 through the prism-like light-focusing effect of the brightness enhancement film, or enhance the light transmittance through the reflective polarizing effect of the DBEF. The diffuser plate 100 also serves as a structural support. Due to the high strength and low coefficient of thermal expansion of the glass substrate, it can be directly bonded and fixed to the mid-frame structure 110, and simultaneously bonded to the display panel 70 to secure it. Furthermore, since the backlight 4190, diffuser 100 and display panel 70 are assembled by bonding, the edge of diffuser 100 is the edge of display module 1, and there is no structure below the edge of display panel 70 that blocks light, which helps to achieve an ultra-narrow bezel design.

[0080] The mid-frame structure 110 can be made of extruded aluminum and secured to the bent edges of the metal backplate with screws. The top of the mid-frame structure 110 can be glued to the diffuser plate 100, and the display panel 70 is then glued to the diffuser plate 100 using a frame adhesive. By using the mid-frame structure 110 to support the diffuser plate 100 and the display panel 70, the dimensional accuracy and straightness of the backlight 4190 can be ensured, thus preventing pixel obstruction caused by the edge structure of the backlight 4190 entering the display area A1. Please refer to [link to relevant documentation]. Figure 17 and Figure 18 In the display module 1 of this application embodiment, the single-side width of the black matrix 33 located in the edge region of the display panel 70 can be reduced to 0.3mm.

[0081] This application also proposes a display device 2, which includes a display module 1. The specific structure of the display module 1 is as described in the above embodiments. Since this display device 2 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0082] Please see Figure 19 The display device 2 includes at least two interconnected display modules 1. Alignment marks 23 are disposed within the display area A1 of each display module 1. The array substrate 20 of the display module 1 does not need to reserve an additional border area for the alignment marks 23 to avoid damage during manufacturing, which allows for a significant reduction in the border width of the display module 1. When multiple display modules 1 are interconnected, the seams between adjacent display modules 1 are also reduced, effectively enhancing the immersive experience and integrity of the display device 2.

[0083] It should be noted that, in this embodiment of the application, the single-sided width of the black matrix 33 located in the edge region on the color filter substrate 30 of the display module 1 can be reduced to 0.3mm. Combined with the flexible circuit board 80 and the adhesive tape used to splice the two display modules 1, the seam between the two spliced ​​display modules 1 can be reduced to 0.9mm. Since only the width of the edge black matrix 33 needs to be calculated when determining the seam, the seam between the two spliced ​​display modules 1 in this embodiment of the application can be reduced to 0.6mm.

[0084] This application also proposes a method for manufacturing a display module. Please refer to [link to relevant documentation]. Figure 20 The method mainly includes the following steps: S100. An array substrate 20 is provided. The array substrate 20 includes a first substrate body 21 and a pad group 22 and an alignment mark 23 disposed on one side of the first substrate body 21. The pad group 22 is located in the non-display area A2, and the alignment mark 23 is located in the display area A1. The non-display area A2 is disposed around the display area A1.

[0085] When fabricating the array substrate 20, a first substrate body 21 can be provided first. Then, a gate layer 24 is deposited on the first substrate body 21, and the gate layer 24 is patterned to form alignment marks 23 and deleting electrodes in the display area A1, and a first connection portion 222 of the pad group 22 is formed in the non-display area A2. Next, a gate insulating layer 25 is deposited on the gate layer 24, and the gate insulating layer 25 is patterned to remove the gate insulating layer 25 on the surface of the first connection portion 222, exposing the first connection portion 222. After that, a source-drain layer 26 is deposited on the gate insulating layer 25, and the source-drain layer 26 is patterned to form the source and drain in the display area A1, and a second connection portion 223 of the pad group 22 is formed in the non-display area A2. The second connection portion 223 directly covers the surface of the first connection portion 222, and the second connection portion 223 and the first connection portion 222 together constitute the pad group 22.

[0086] Since the alignment mark 23 is located in the display area A1, the array substrate 20 does not need to reserve an additional border area for the alignment mark 23 to avoid damage during manufacturing, which allows the border width of the display module 1 to be significantly reduced. Since the second connection portion 223 is directly contacted and stacked with the first connection portion 222, it is possible to avoid forming contact holes 251 configured to electrically connect the second connection portion 223 and the first connection portion 222 in the non-display area A2 through photolithography and etching processes on the gate insulating layer 25. This also helps to reduce the width of the non-display area A2 and realize the narrow border design of the display module 1.

[0087] S200, Place the array substrate 20 on the support stage 3.

[0088] S300: Alignment light is emitted to array substrate 20 by alignment device 4. The alignment light is reflected by alignment mark 23 and received by alignment device 4 to determine the position of alignment mark 23.

[0089] S400: Based on the position of the alignment mark 23, determine the position of the pad group 22 and bind the flexible circuit board 80 to the pad group 22.

[0090] After the array substrate 20 is fabricated, it is placed on the support stage 3 with one side of the first substrate body 21 facing the alignment device 4 to perform bonding connection between the flexible circuit board 80 and the pad group 22 on the array substrate 20. This process mainly includes the following: Please see Figure 21 First, the array substrate 20 is aligned with the alignment device 4, which includes a lens 42 and a light source 41. Alignment light is emitted from the light source 41 of the alignment device 4 onto the array substrate 20. This light passes through the first substrate body 21 and illuminates the alignment mark 23. After being reflected by the alignment mark 23, it is received by the lens 42 of the alignment device 4. The position of the alignment mark 23 can be determined based on the light signal received by the alignment device 4. Since there is a preset positional relationship between the alignment mark 23 and the pad group 22 corresponding to each pad group 22, the position of the pad group 22 can be determined based on this preset positional relationship after determining the position of the alignment mark 23. Then, according to the determined position of the pad group 22, the flexible circuit board 80 is moved to the target position, and the flexible circuit board 80 is bonded to the side surface of the pad group 22 using conductive adhesive 130, thermoforming, or anisotropic conductive film, thereby achieving electrical and mechanical connection between the flexible circuit board 80 and the array substrate 20.

[0091] In some embodiments, please refer to Figure 22 Before placing the array substrate 20 on the support stage 3, the following steps are also included: S110. A color filter substrate 30 is provided, and a sealing adhesive 50 is applied to a non-display area A2 on one side of the color filter substrate 30 or the array substrate 20.

[0092] S120. Place the color filter substrate 30 and the array substrate 20 opposite to each other, so that the array substrate 20 and the color filter substrate 30 are connected by the sealant 50, and make the orthogonal projection of the sealant 50 on the first substrate body 21 cover the orthogonal projection of the pad group 22 on the first substrate body 21.

[0093] Before bonding the flexible circuit board 80 to the array substrate 20, the array substrate 20 and the color filter substrate 30 need to be aligned. This process mainly includes the following: First, a color filter substrate 30 is provided. The color filter substrate 30 includes a second substrate body 32, and a color filter layer 31 and a black matrix 33 disposed on one side of the second substrate body 32. Then, a sealant 50 is applied to the non-display area A2 on the side where the color filter layer 31 is located or on the side where the pad group 22 of the array substrate 20 is located. For example, the liquid sealant 50 can be precisely applied to the edge of the non-display area A2 of the color filter substrate 30 or the array substrate 20 by a dispensing machine. The dispensing machine can automatically apply the sealant according to the preset path and thickness, ensuring the uniformity and accuracy of the application. Alternatively, the sealant 50 can be applied to the non-display area A2 of the color filter substrate 30 or the array substrate 20 by screen printing.

[0094] Next, the color filter substrate 30 and the array substrate 20 are placed opposite each other, with the side of the color filter layer 31 of the color filter substrate 30 facing the side of the pad group 22 of the array substrate 20, and the array substrate 20 and the color filter substrate 30 are connected by the sealant 50. This process can use a high-precision vision alignment system to accurately align the color filter substrate 30 and the array substrate 20, and then apply appropriate pressure and / or heat to cure the sealant 50, thereby achieving the connection between the color filter substrate 30 and the array substrate 20; alternatively, a vacuum bonding device can be used to bond the color filter substrate 30 and the array substrate 20 in a vacuum environment, reducing the generation of air bubbles and ensuring that the sealant 50 is evenly distributed and cured.

[0095] The sealant 50 firmly bonds the array substrate 20 and the color filter substrate 30 together, forming a barrier to prevent external moisture, oxygen, or other contaminants from penetrating the display area A1, thereby protecting the internal display medium (liquid crystal) and circuitry. Simultaneously, by ensuring the orthographic projection of the sealant 50 covers the orthographic projection of the pad group 22, the area containing the pad group 22 is effectively protected from external environmental influences, providing a stable and protected connection interface for subsequent bonding of the flexible circuit board 80.

[0096] S130: Grind the edges of the array substrate 20, color filter substrate 30 and sealant 50 to align the edges of the first substrate body 21, pad group 22, color filter substrate 30 and sealant 50.

[0097] After completing the cell alignment operation between the array substrate 20 and the color filter substrate 30, the edges of the array substrate 20, the color filter substrate 30, and the sealant 50 need to be ground to align the edges of the first substrate body 21, the pad group 22, the color filter substrate 30, and the sealant 50. This process can be performed using mechanical grinding equipment, such as a grinding wheel mill or a diamond mill, to finely grind the edges of the display module 1. Coolant can be used during the grinding process to prevent overheating damage to the array substrate 20, the color filter substrate 30, and the sealant 50. Alternatively, laser cutting or laser grinding technology can be used to precisely remove edge material using a high-energy laser beam, achieving edge flatness and alignment.

[0098] By grinding, the edges of the pad group 22 are aligned with the edges of the first substrate body 21 and the color filter substrate 30, which can provide a neat contact surface for the bonding of the flexible circuit board 80, thus improving bonding accuracy and reliability.

[0099] Please see Figure 23 and Figure 24 In traditional designs, an organic film 120 is additionally placed around the edge of the sealing adhesive 50 to cover the pad assembly 22. However, the organic film 120 is relatively soft, and after grinding, the edges of the organic film 120 and the pad assembly 22 may lift or break. Please refer to... Figure 25 and Figure 26 In this embodiment, encapsulating adhesive is directly used to cover the pad assembly 22. After grinding, the pad assembly 22 can remain intact without lifting, which helps to improve the reliability of the display module 1 in high temperature and high humidity environments.

[0100] Please continue reading. Figure 25 In this embodiment, there is a certain gap between the sealant 50 and the display area A1. For example, this gap can be designed to be about 0.1 mm. If the gap is too small, the sealant 50 may overflow or spread during coating or cell assembly, thereby contacting and contaminating the liquid crystal. When applying the sealant 50, the initial coating width of the sealant 50 can be set to the limit achievable by the process, 0.3 mm. After the array substrate 20 and the color filter substrate 30 are assembled, about 0.1 mm of the sealant 50 width can be removed by cutting and grinding processes, thereby achieving a non-display area A2 width of 0.3 mm while controlling the width of the sealant 50 to about 0.2 mm. Tests have shown that the pull-out force of the sealant 50 at this width can meet the design requirements for preventing leakage.

[0101] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0102] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0103] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0104] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0105] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that, The display module includes a display area and a non-display area, wherein the non-display area is disposed around the display area; the display module includes: An array substrate includes a first substrate body and a pad group and an alignment mark disposed on one side of the first substrate body. The pad group is located in the non-display area; the alignment mark is located in the display area and is configured to identify the position of the pad group. A flexible circuit board is disposed on the side surface of the array substrate, and the flexible circuit board is bonded to the pad group.

2. The display module according to claim 1, characterized in that, The pad group includes a plurality of pads spaced apart along the extension direction of the edge of the first substrate body, and the alignment marks are spaced apart along the extension direction of the edge of the first substrate body.

3. The display module according to claim 2, characterized in that, The array substrate includes a plurality of pad groups and alignment marks corresponding to each pad group; the plurality of pad groups are arranged along the extension direction of the edge of the first substrate body, and the alignment marks are disposed on opposite sides of the corresponding pad groups along the extension direction of the edge of the first substrate body.

4. The display module according to claim 3, characterized in that, The alignment mark located on the same side of the corresponding pad group is equal to the shortest distance of the corresponding pad group in the extension direction of the first substrate body edge.

5. The display module according to claim 1, characterized in that, The array substrate includes a plurality of sub-pixel areas spaced apart in the display area, and the orthographic projection of the alignment mark on the first substrate body is located within the sub-pixel areas.

6. The display module according to claim 5, characterized in that, The multiple sub-pixel regions are arranged in multiple rows along a first direction and in multiple columns along a second direction; the first direction is parallel to the first edge of the first substrate body, the second direction is parallel to the second edge of the first substrate body, and the second direction intersects with the first direction; The pads are located at the first edge, and the orthographic projection of the alignment mark on the first substrate body is located within the column of sub-pixel areas closest to the first edge; and / or The pad group is located at the second edge, and the orthographic projection of the alignment mark on the first substrate body is located in the row of sub-pixel areas closest to the second edge.

7. The display module according to claim 5, characterized in that, The display module further includes a color filter substrate, which is disposed opposite to the array substrate. The color filter substrate includes a second substrate body and a color filter layer disposed on one side of the second substrate body. The color filter layer includes a color resist disposed corresponding to the sub-pixel area. The orthographic projection of the alignment mark on the first substrate body is located within the orthographic projection of the color resist on the first substrate body.

8. The display module according to claim 7, characterized in that, The color resist includes a red sub-color resist, a green sub-color resist, and a blue sub-color resist, and the orthographic projection of the alignment mark on the first substrate body is located within the orthographic projection of the green sub-color resist on the first substrate body.

9. The display module according to claim 7, characterized in that, The color filter substrate also includes a black matrix, which is disposed on the same side of the second substrate body as the color filter layer. The orthographic projection of the black matrix on the second substrate body partially overlaps with the orthographic projection of the color filter on the second substrate body. A pixel opening is provided on the black matrix at the position corresponding to the sub-pixel area. The orthographic projection of the alignment mark on the first substrate body is located within the orthographic projection of the pixel opening on the first substrate body; or, The orthographic projection of the alignment mark on the first substrate body is at least partially located within the orthographic projection of the black matrix on the first substrate body.

10. The display module according to claim 1, characterized in that, The array substrate further includes a gate layer, which is disposed on one side of the first substrate body, and the alignment mark is disposed on the same layer as the gate layer.

11. The display module according to claim 7, characterized in that, The display module further includes two polarizers and light-shielding ink disposed on the edges of the polarizers. The color filter substrate and the array substrate are located between the two polarizers. A first gap region is formed between the side of the polarizer on the side of the array substrate away from the color filter substrate and the edge of the first substrate body. A second gap region is formed between the side of the polarizer on the side of the color filter substrate away from the array substrate and the edge of the second substrate body. The light-shielding ink is disposed in the first gap region and the second gap region.

12. The display module according to claim 11, characterized in that, The light-blocking ink is an elastic ink.

13. The display module according to claim 7, characterized in that, The display module further includes a sealing adhesive, which is connected between the color filter substrate and the array substrate and is located in the non-display area; the orthographic projection of the sealing adhesive on the first substrate body includes the orthographic projection of the pad group on the first substrate body, and the side of the sealing adhesive away from the display area is aligned with the edge of the first substrate body and the edge of the second substrate body.

14. The display module according to claim 1, characterized in that, The array substrate includes a gate layer, a gate insulating layer, and a source / drain layer stacked on the first substrate body; the pad group includes a first connection portion and a second connection portion stacked on top of each other, the first connection portion and the second connection portion being in direct contact and connection, the first connection portion being disposed on the same layer as the gate layer, and the second connection portion being disposed on the same layer as the source / drain layer; the sides of the first connection portion and the second connection portion opposite to the display area are aligned with the edge of the first substrate body, and the flexible circuit board is bonded to the sides of the first connection portion and the second connection portion opposite to the display area.

15. A display device, characterized in that, It includes at least two display modules as described in any one of claims 1 to 14, which are spliced ​​together.

16. A method for manufacturing a display module, characterized in that, include: An array substrate is provided, the array substrate including a first substrate body and a pad group and an alignment mark disposed on one side of the first substrate body, the pad group being located in a non-display area and the alignment mark being located in a display area; the non-display area is disposed around the display area; Place the array substrate on the support platform; Alignment light is emitted toward the array substrate using an alignment device. The alignment light is reflected by the alignment mark and then received by the alignment device to determine the position of the alignment mark. Based on the position of the alignment mark, the position of the pad group is determined, and the flexible circuit board is bound to the pad group.

17. The method for manufacturing a display module according to claim 16, characterized in that, Before placing the array substrate on the support stage, the method further includes: A color filter substrate is provided, and a sealing adhesive is applied to a non-display area on one side of the color filter substrate or the array substrate. The color filter substrate and the array substrate are placed opposite each other, so that the array substrate and the color filter substrate are connected by the sealing adhesive, and the orthogonal projection of the sealing adhesive on the first substrate body covers the orthogonal projection of the pad group on the first substrate body. The edges of the array substrate, the color filter substrate, and the sealant are ground to align the edges of the first substrate body, the pad group, the color filter substrate, and the sealant.

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