Connection device and connection method

Abstract

The connection device is a device for connecting a frame and a mask. The connection device has a first pressing plate, a suction device, a second pressing plate, and a pressing device. The first pressing plate has a first support surface that supports the mask. A first suction hole is formed in the first pressing plate to open in the first support surface. The suction device performs suction in the first suction hole. The second pressing plate has a second support surface that supports the frame. The second support surface is opposite the first support surface. The pressing device moves the first pressing plate and / or the second pressing plate and presses the first pressing plate and the second pressing plate against each other.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a connection device and a connection method for connecting a frame to a mask. Background Technology

[0002] Vapor deposition is a known method for forming precision patterns. In vapor deposition, firstly, a mask with openings is assembled with a substrate. Then, a vapor deposition material is deposited onto the substrate through the openings of the mask. As a result, a vapor deposition layer containing the vapor deposition material is formed on the substrate with a pattern corresponding to the pattern of the openings of the mask. Vapor deposition is used, for example, as a method for forming pixels in an organic EL display device. A mask for vapor deposition is disclosed in Patent Document 1.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-062565 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] If the opening is formed near the outer edge of the mask, the outer edge is prone to breakage, making mask processing difficult. Furthermore, when the opening is formed near the outer edge, the outer edge of the mask is narrow. As a result, when holding the mask, not only the outer edge is held, but also the area inside the outer edge—the area where the opening is formed—may be held. In this case, the area where the opening is formed may become contaminated. On the other hand, there is a requirement that by forming the opening near the outer edge of the mask, a vapor-deposited layer can be formed over a larger area of ​​the substrate using a single mask.

[0008] It is possible to suppress mask breakage by mounting a frame on the outer edge of the mask. However, if the mask is mounted on the frame in a flexed or deformed state, a large gap may be generated between the mask and the substrate during the vapor deposition process. If a gap is generated, it may be impossible to deposit the vapor deposition material onto the substrate with high precision. In fact, according to the inventors' understanding, in framed masks manufactured by manually connecting the mask and the frame, the surface of the mask facing the substrate is not flat. For example, the height difference between various parts of the surface of the mask facing the substrate is more than 50 μm at the maximum value. Therefore, it is necessary to improve the flatness of the mask in framed masks.

[0009] The purpose of this disclosure is to provide a connection device and connection method that can effectively solve such problems.

[0010] Methods for solving problems

[0011] One embodiment of the present disclosure is a connecting device for connecting a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region. The connecting device may include: a first pressing plate having a first support surface supporting the mask and forming a first suction hole opening in the first support surface; a suction device for suction into the first suction hole; a second pressing plate having a second support surface supporting the frame and facing the first support surface; and a pressing device for moving the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other.

[0012] One embodiment of this disclosure provides a connection method for connecting a frame to an outer region of a mask using the connection device described in the first embodiment. The mask includes an inner region with multiple openings and an outer region surrounding the inner region. The connection method may include the following steps: placing the mask on a first support surface of a first pressing plate; using a suction device to suction into the first suction hole, thereby adsorbing the mask onto the first support surface; placing the frame on a second support surface of a second pressing plate; forming a connection layer in the outer region of the mask or in the region of the frame facing the outer region; and moving the first pressing plate holding the mask and / or the second pressing plate supporting the frame using the pressing device to press the first pressing plate and the second pressing plate against each other, thereby connecting the mask and the frame via the connection layer.

[0013] One embodiment of the present disclosure provides a variation of a connecting device that connects a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region. The connecting device may include: a first pressing plate having a first support surface supporting the mask; a second pressing plate having a second support surface supporting the frame and facing the first support surface; and a pressing device that moves the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other, at least a portion of the first support surface of the first pressing plate being covered by a bonding layer.

[0014] A modified embodiment of this disclosure provides a connection method for connecting a frame to an outer region of a mask using a connection device described in the modified embodiment. The mask includes an inner region having multiple openings and an outer region surrounding the inner region. The connection method may include the following steps: placing the mask on a first support surface of a first pressing plate to engage the mask with the bonding layer; placing the frame on a second support surface of a second pressing plate; forming a bonding layer in the outer region of the mask or in the region of the frame facing the outer region; and pressing the first pressing plate and the second pressing plate relative to each other by moving the first pressing plate and / or the second pressing plate supporting the frame using the pressing device, thereby connecting the mask and the frame via the bonding layer.

[0015] Invention Effects

[0016] According to embodiments of this disclosure, the flatness of the mask in a framed mask can be improved. Attached Figure Description

[0017] Figure 1 This is a top view showing an example of an organic device.

[0018] Figure 2 This is a diagram showing an example of a vapor deposition apparatus equipped with a framed mask.

[0019] Figure 3 This is a top view showing an example of a framed mask as viewed from the incident plane side.

[0020] Figure 4 This is a top view showing an example of a framed mask as viewed from the exit surface side.

[0021] Figure 5A yes Figure 3 A cross-sectional view of a framed mask along the VV line.

[0022] Figure 5B It is Figure 5A The enlarged view shows the section of the cross-section enclosed by the double-dotted line.

[0023] Figure 6A This is a cross-sectional view showing the overall structure of the connecting device.

[0024] Figure 6B This is a cross-sectional view showing the overall structure of the connecting device.

[0025] Figure 6C This is a cross-sectional view showing the overall structure of the connecting device.

[0026] Figure 6DThis is a cross-sectional view showing the overall structure of the connecting device.

[0027] Figure 6E This is a cross-sectional view showing the overall structure of the connecting device.

[0028] Figure 7 It is Figure 6A The enlarged view shows the section of the cross-section enclosed by the double-dotted line.

[0029] Figure 8A This is a top view showing an example of the first support surface of the first pressing plate.

[0030] Figure 8B This is a top view showing an example of the first support surface of the first pressing plate.

[0031] Figure 9 This is a top view showing an example of the second support surface of the second pressing plate.

[0032] Figure 10 Is with Figure 7 The corresponding figure shows a modified example of the connecting device.

[0033] Figure 11 Is with Figure 7 The corresponding figure shows a modified example of the connecting device.

[0034] Figure 12 Is with Figure 7 The corresponding figure shows a modified example of the connecting device. Detailed Implementation

[0035] In this specification and accompanying drawings, unless otherwise specified, the terms “substrate,” “sheet,” “film,” etc., used to refer to the material that forms the basis of a structure are not distinguished from each other merely based on different names.

[0036] In this specification and accompanying drawings, unless otherwise specified, terms such as “parallel” or “orthogonal”, or values ​​of length or angle, relating to the determination of shape, geometric conditions and their degree, are not limited to a strict meaning, but are interpreted to include the extent to which the same function can be expected.

[0037] In this specification and accompanying drawings, unless otherwise specified, the terms "above" or "below," "upper side" or "lower side," or "above" or "below" of a component or region or other structure include cases where the structure is directly connected to the other structure. Furthermore, it also includes cases where another structure is involved between the structure and the other structure, i.e., cases where they are indirectly connected. Additionally, unless otherwise specified, the vertical direction of terms such as "above," "upper side," "above," "below," "lower side," or "below" may be reversed.

[0038] In this specification and accompanying drawings, unless otherwise specified, the state of "opposite" between the face of element A and the face of element B includes not only the case where the face of element A is connected to the face of element B, but also the case where element C is located between the faces of element A and element B. That is, the term "opposite" is used to indicate the orientation of the two faces.

[0039] In this specification and accompanying drawings, unless otherwise specified, the same or similar reference numerals are used to denote the same parts or parts having the same function, and sometimes repeated descriptions are omitted. Additionally, for ease of explanation, the dimensional ratios in the drawings sometimes differ from the actual ratios, and sometimes a part of the structure is omitted from the drawings.

[0040] In this specification and accompanying drawings, unless otherwise specified, one embodiment of this specification can be combined with other examples without contradiction. Furthermore, other examples can also be combined with each other without contradiction.

[0041] Unless otherwise specified in this specification and accompanying drawings, where more than two steps or processes are disclosed regarding manufacturing methods, other undisclosed steps or processes may be performed between the disclosed steps or processes. Furthermore, the order of the disclosed steps or processes is arbitrary as long as it does not create contradictions.

[0042] In one embodiment of this specification, an example of using a mask to form an organic layer or electrodes on a substrate during the manufacture of an organic EL display device will be described. However, the application of the mask is not particularly limited, and this embodiment can be applied to masks used for various purposes. For example, the mask of this embodiment can also be used to form electrodes for devices used to display or project images or videos representing virtual reality (VR) or augmented reality (AR). Furthermore, the mask of this embodiment can also be used to form electrodes for display devices other than organic EL display devices, such as electrodes for liquid crystal display devices. Additionally, the mask of this embodiment can also be used to form electrodes for organic devices other than display devices, such as electrodes for pressure sensors.

[0043] The first aspect of this disclosure is a connecting device that connects a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein... The connecting device includes: A first pressing plate has a first support surface that supports the mask and a first suction hole that opens in the first support surface; A suction device that suctions from the first suction hole; A second pressing plate having a second support surface supporting the frame and facing the first support surface; and The pressing device moves the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other.

[0044] In the connection device according to the first method and the second method described above, at least a portion of the first support surface of the first pressing plate may be covered by a porous layer.

[0045] In the connection device according to the first or second method described above, The second pressing plate may have a second suction hole that opens into the second support surface. The suction device can also perform suction within the second suction hole.

[0046] The fourth aspect of this disclosure is a connecting device that connects a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein... The connecting device includes: A first pressing plate has a first support surface that supports the mask; A second pressing plate having a second support surface supporting the frame and facing the first support surface; and A pressing device that moves the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other. At least a portion of the first support surface of the first pressing plate is covered by a bonding layer.

[0047] In the connection device according to the fourth method and the fifth method described above, The second pressing plate may have a second suction hole that opens into the second support surface. The connecting device may also include a suction device for suctioning the second suction hole.

[0048] In the connection device according to any one of the first to fifth methods described above, a first recess in the thickness direction for receiving the mask may also be formed on the first support surface.

[0049] In the seventh connection device according to the sixth method described above, the depth of the first recess may be greater than 0 μm and less than 1000 μm.

[0050] In the eighth type of connection device according to any one of the first to seventh types described above, a second recess in the thickness direction of receiving the frame may also be formed on the second support surface.

[0051] In the ninth connection device according to the eighth method described above, the depth of the second recess may be 500 μm or more and 30 mm or less.

[0052] The connecting device according to the tenth method according to any one of the first to ninth methods described above may also include a heating heater disposed inside the first pressing plate and / or the second pressing plate.

[0053] The connecting device according to any one of the first to tenth methods described above, in the eleventh method, may also further include: A chamber that houses the first and second pressure plates; and A pressure-reducing device that reduces pressure within the chamber.

[0054] In the twelfth-method connection device according to any one of the first to eleventh methods described above Alternatively, an alignment opening can be formed in the second pressing plate, extending through the second pressing plate in the thickness direction. Alternatively, the connecting device may also include an alignment camera capable of taking pictures of the area between the second support surface and the first support surface through the alignment opening.

[0055] The thirteenth aspect of this disclosure is a connection method that uses the connection device of the first aspect described above to connect a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein... The connection method includes the following steps: The mask is placed on the first support surface of the first pressing plate, and the suction device is used to suction the first suction hole, thereby causing the mask to adhere to the first support surface. The frame is positioned on the second support surface of the second pressing plate; A connecting layer is formed in the outer region of the mask or in the region of the frame facing the outer region; and The first pressing plate, which holds the mask, and / or the second pressing plate, which supports the frame, are moved by the pressing device to press the first pressing plate and the second pressing plate against each other, thereby connecting the mask and the frame via the connecting layer.

[0056] The connection method according to the thirteenth and fourteenth methods described above may also include the following steps: after connecting the mask and the frame, stop the suction device from suctioning the first suction hole.

[0057] The fifteenth aspect of this disclosure is a connection method that uses the connection device of the fourth aspect described above to connect a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein... The connection method includes the following steps: The mask is positioned on the first support surface of the first pressing plate, such that the mask is bonded to the bonding layer; The frame is positioned on the second support surface of the second pressing plate; A connecting layer is formed in the outer region of the mask or in the region of the frame facing the outer region; and The first pressing plate and the second pressing plate, which are engaged with the mask, are moved by the pressing device to press the first pressing plate and the second pressing plate, which support the frame, against each other, thereby connecting the mask and the frame via the connecting layer.

[0058] In the connection method of the sixteenth method according to any one of the thirteenth to fifteenth methods described above, The second pressing plate may have a second suction hole that opens into the second support surface. The connecting device may include a suction device for suctioning the second suction hole. The connection method may further include the following steps: after the frame is placed on the second pressing plate, the suction device is used to suction the second suction hole.

[0059] In the connection method of the seventeenth method according to any one of the thirteenth to the sixteenth methods described above, A heater for heating can be provided inside the first pressing plate and / or the second pressing plate. It is possible that, in the process of pressing the first pressing plate and the second pressing plate against each other, the first pressing plate and / or the second pressing plate are heated by the heating heater.

[0060] In the connection method of the eighteenth method according to any one of the thirteenth to seventeenth methods described above, The connecting device may also include: A chamber that houses the first and second pressure plates; and A pressure-reducing device that reduces pressure within the chamber. Alternatively, during the process of pressing the first pressing plate and the second pressing plate against each other, the chamber is depressurized by the depressurization device.

[0061] In the connection method of the nineteenth method according to any one of the thirteenth to eighteenth methods described above, Alignment marks can be formed on the mask and the frame respectively. An alignment opening can be formed in the second pressing plate, extending through the second pressing plate in the thickness direction. The connecting device may further include an alignment camera, which is capable of taking pictures of the area between the second support surface and the first support surface through the alignment opening. It is possible that, during the process of placing the frame on the second support surface of the second pressing plate, the alignment camera is used to photograph the alignment marks of the mask and the frame through the alignment opening to align the mask and the frame.

[0062] Reference Figures 1 to 9 An embodiment will now be described. First, an organic device 100 will be described, wherein the organic device 100 includes an organic layer formed by using a mask. Figure 1 This is a cross-sectional view showing an example of an organic device 100.

[0063] Organic device 100 includes a substrate 110 and a plurality of elements 115 arranged in an in-plane direction along the substrate 110. The substrate 110 includes a first surface 111 and a second surface 112 located on the opposite side of the first surface 111. Elements 115 are located on the first surface 111. Elements 115 are, for example, pixels. The substrate 110 may also include two or more elements 115. For example, the substrate 110 may include a first element 115A and a second element 115B. Although not shown, the substrate 110 may also include a third element. The first element 115A, the second element 115B, and the third element are, for example, red pixels, blue pixels, and green pixels.

[0064] Component 115 may have a first electrode 120, an organic layer 130 on the first electrode 120, and a second electrode 140 on the organic layer 130.

[0065] The organic device 100 may include an insulating layer 160 located between two adjacent first electrodes 120 when viewed from above. The insulating layer 160 may, for example, contain polyimide. The insulating layer 160 may also overlap with the ends of the first electrodes 120. "View from above" refers to viewing the object along the normal direction of the surface of a plate-like component such as a substrate 110.

[0066] The substrate 110 can also be an insulating component. Materials used for the substrate 110 include, for example, rigid materials without flexibility such as silicon, quartz glass, Pyrex glass, and synthetic quartz sheets, or flexible materials such as resin films, optical resin sheets, and thin glass. The substrate 110 can have the same planar shape as a silicon wafer used in semiconductor manufacturing. In this case, the substrate 110 can be processed using apparatus for performing semiconductor manufacturing processes. For example, the first electrode 120, insulating layer 160, etc., can be formed on the substrate 110 using such apparatus.

[0067] Element 115 is configured to perform a certain function by applying a voltage between the first electrode 120 and the second electrode 140, or by flowing a current between the first electrode 120 and the second electrode 140. For example, if element 115 is a pixel of an organic EL display device, element 115 can emit light that constitutes an image.

[0068] The first electrode 120 comprises a conductive material. For example, the first electrode 120 comprises a metal, a conductive metal oxide, or other conductive inorganic materials. The first electrode 120 may also comprise a transparent and conductive metal oxide such as indium tin oxide.

[0069] Organic layer 130 contains organic materials. When an electric current is applied to organic layer 130, organic layer 130 can perform a certain function. Applying an electric current means applying a voltage to organic layer 130 or allowing current to flow through organic layer 130. As organic layer 130, a light-emitting layer that emits light when an electric current is applied, or a layer that changes the transmittance or refractive index of light when an electric current is applied, can be used. Organic layer 130 may also contain organic semiconductor materials.

[0070] like Figure 1As shown, organic layer 130 may include a first organic layer 130A and a second organic layer 130B. The first organic layer 130A is included in the first element 115A. The second organic layer 130B is included in the second element 115B. Although not shown, organic layer 130 may also include a third organic layer included in a third element. The first organic layer 130A, the second organic layer 130B, and the third organic layer may be, for example, a red light-emitting layer, a blue light-emitting layer, and a green light-emitting layer.

[0071] When a voltage is applied between the first electrode 120 and the second electrode 140, the organic layer 130 located between them is activated. If the organic layer 130 is a light-emitting layer, light is emitted from the organic layer 130, and the light is extracted to the outside from either the side of the second electrode 140 or the side of the first electrode 120.

[0072] The organic layer 130 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc.

[0073] The second electrode 140 may also comprise a conductive material such as a metal. Examples of materials that can be used for the second electrode 140 include platinum, gold, silver, copper, iron, tin, chromium, aluminum, indium, lithium, sodium, potassium, calcium, magnesium, carbon, and alloys thereof. Figure 1 As shown, the second electrode 140 can extend across two adjacent organic layers 130 when viewed from above.

[0074] Next, the method for forming an organic layer 130 on the substrate 110 by vapor deposition will be described. Figure 2 This is a diagram showing the vapor deposition apparatus 10. The vapor deposition apparatus 10 performs a vapor deposition process in which a vapor deposition material is deposited onto the object.

[0075] like Figure 2 As shown, the vapor deposition apparatus 10 may also include a vapor deposition source 6, a heater 8, and a framed mask 15 inside. The vapor deposition apparatus 10 may also include an exhaust mechanism for creating a vacuum atmosphere inside the apparatus. The vapor deposition source 6 is, for example, a crucible. The vapor deposition source 6 contains vapor deposition materials 7, such as organic or metallic materials. The heater 8 heats the vapor deposition source 6, causing the vapor deposition material 7 to evaporate under a vacuum atmosphere.

[0076] The framed mask 15 includes a mask 20 and a frame 60 mounted on the mask 20. The mask 20 includes an incident surface 201, an exit surface 202, and a second opening 41. The exit surface 202 is located on the opposite side of the incident surface 201. The framed mask 15 is supported by a mask holder 9. The framed mask 15 is configured such that the incident surface 201 faces the vapor deposition source 6, and the exit surface 202 faces the first surface 111 of the substrate 110. A portion of the vapor deposition material 7 entering the mask 20 from the exit surface 202 exits through the second opening 41 from the exit surface 202. The vapor deposition material 7 exiting from the exit surface 202 adheres to the first surface 111 of the substrate 110. The exit surface 202 of the mask 20 can be in contact with the first surface 111 of the substrate 110.

[0077] like Figure 2 As shown, the vapor deposition apparatus 10 may also include a magnet 5 disposed on the second surface 112 side of the substrate 110. When the mask 20 contains a metallic material, the magnet 5 can attract the mask 20 toward the substrate 110 by magnetic force. As a result, the gap between the mask 20 and the substrate 110 can be reduced or eliminated. Therefore, the generation of shadows during the vapor deposition process can be suppressed. In this application, shadow refers to the phenomenon where the thickness of the organic layer 130 formed near the wall of the second opening 41 is smaller than the thickness of the organic layer 130 formed at the center of the second opening 41. Shadows are caused by the vapor deposition material 7 adhering to the wall of the mask 20, the vapor deposition material 7 entering the gap between the mask 20 and the substrate 110, etc.

[0078] Next, the framed mask 15 will be described in detail. Figure 3 This is a top view showing an example of a framed mask 15 as viewed from the incident surface 201 side. Figure 4 This is a top view showing an example of a framed mask 15 as viewed from the exit surface 202 side. Figure 5A yes Figure 3 A cross-sectional view of the framed mask 15 along the VV line. Figure 5B It is Figure 5A The enlarged view shows the section of the cross-section enclosed by the double-dotted line.

[0079] First, mask 20 will be described in detail. For example... Figure 5A As shown, the mask 20 includes a first layer 30 and a second layer 40 arranged sequentially from the incident surface 201 towards the exit surface 202. The first layer 30 contains, for example, silicon, a silicon compound, glass, or alumina (Al2O3). The silicon compound is, for example, silicon carbide (SiC). Figure 5A As shown, the mask 20 may further include an intermediate layer 50. The intermediate layer 50 is disposed between the first layer 30 and the second layer 40. The layers will be described below.

[0080] like Figure 5B As clearly shown, the first layer 30 includes a first surface 301, a second surface 302, a first opening 31, and a first wall surface 32. The first surface 301 may also form an incident surface 201. The second surface 302 is located on the opposite side of the first surface 301.

[0081] The first opening 31 extends from the first surface 301 to the second surface 302, penetrating the first layer 30. (Example) Figure 3 As shown, the first layer 30 may also include multiple first openings 31. These multiple first openings 31 may also be arranged in the first direction D1 and the second direction D2. The second direction D2 may also be orthogonal to the first direction D1.

[0082] The first opening 31 can also correspond to a screen of an organic EL display device. Figure 3 The mask 20 shown can simultaneously form patterns of organic layers corresponding to multiple images on the substrate 110. For example... Figure 3 As shown, the first opening 31 can also have a rectangular outline when viewed from above.

[0083] The first wall surface 32 is the surface of the first layer 30 facing the first opening 31. Figure 3 In the example shown, the first wall 32 extends along the normal direction of the first surface 301.

[0084] like Figure 3 As shown, the area of ​​the first layer 30 where the first opening 31 is not formed can also be divided into an outer region 35 and an inner region 36. The inner region 36 is the area located between two adjacent first openings 31 when viewed from above. The outer region 35 is the area located between the outer edge 303 of the first layer 30 and the first opening 31 when viewed from above. Figure 3 As shown, the inner region 36 may also extend in the first direction D1 and the second direction D2. The outer region 35 includes the connecting region 37 of the connecting frame 60.

[0085] like Figure 4 As shown, the first layer 30 may also include alignment marks 39. Alignment marks 39 are formed, for example, on the first surface 301. Alignment marks 39 are used, for example, to adjust the relative position of the frame 60 with respect to the mask 20. If the frame 60 has the property of allowing visible light to pass through, the alignment marks 39 can be visually confirmed through the frame 60.

[0086] like Figure 3 and Figure 4 As shown, alignment mark 39 can also have a circular outline when viewed from above. Although not shown, alignment mark 39 can also have an outline other than a circle, such as a rectangle or a cross. Alignment mark 39 can also be located in the outer region 35.

[0087] When the first layer 30 contains silicon or a silicon compound, the first layer 30 can be fabricated, for example, by processing a silicon wafer. Figure 3 As shown, the outer edge 303 of the first layer 30 may also include a straight section. This straight section is also called an orientation plane. Although not shown, a notch may also be formed on the outer edge 303. This notch is also called a notch. In the case of fabricating the first layer 30 by processing a silicon wafer, the orientation plane and the notch represent the crystal orientation of the silicon wafer.

[0088] The maximum dimension S1 of the first layer 30 when viewed from above can be, for example, 100mm or more, 150mm or more, or 200mm or more. Dimension S1 can be, for example, less than 300mm, less than 400mm, or less than 500mm. The range of dimension S1 can be determined by a first group consisting of 100mm, 150mm, and 200mm and / or a second group consisting of 300mm, 400mm, and 500mm. The range of dimension S1 can be defined by a combination of any one value from the first group and any one value from the second group. The range of dimension S1 can be defined by a combination of any two values ​​from the first group. The range of dimension S1 can be defined by a combination of any two values ​​from the second group. Size S1 can be, for example, 100mm or more and 500mm or less, 100mm or more and 400mm or less, 100mm or more and 300mm or less, 100mm or more and 200mm or less, 100mm or more and 150mm or less, 150mm or more and 500mm or less, 150mm or more and 400mm or less, 150mm or more and 300mm or less, 150mm or more and 200mm or less, 200mm or more and 500mm or less, 200mm or more and 400mm or less, 200mm or more and 300mm or less, 300mm or more and 500mm or less, 300mm or more and 400mm or less, or 400mm or more and 500mm or less.

[0089] The size S2 of the first opening 31 in the direction of the first opening 31 arrangement can be, for example, 3mm or more, 10mm or more, or 20mm or more. The size S2 can be, for example, less than 30mm, less than 50mm, or less than 100mm. The range of size S2 can be defined by a first group consisting of 3mm, 10mm, and 20mm and / or a second group consisting of 30mm, 50mm, and 100mm. The range of size S2 can be defined by a combination of any one value from the first group and any one value from the second group. The range of size S2 can be defined by a combination of any two values ​​from the first group. The range of size S2 can be defined by a combination of any two values ​​from the second group. Size S2 can be, for example, 3mm or more and less than 100mm, 3mm or more and less than 50mm, 3mm or more and less than 30mm, 3mm or more and less than 20mm, 3mm or more and less than 10mm, 10mm or more and less than 100mm, 10mm or more and less than 50mm, 10mm or more and less than 30mm, 10mm or more and less than 20mm, 20mm or more and less than 100mm, 20mm or more and less than 50mm, 20mm or more and less than 30mm, 30mm or more and less than 100mm, 30mm or more and less than 50mm, or 50mm or more and less than 100mm.

[0090] The interval S3 between two first openings 31 in the direction of their arrangement can be, for example, 0.1 mm or more, 0.5 mm or more, or 1.0 mm or more. The interval S3 can be, for example, less than 10 mm, less than 15 mm, or less than 20 mm. The range of the interval S3 can be determined by a first group consisting of 0.1 mm, 0.5 mm, and 1.0 mm and / or a second group consisting of 10 mm, 15 mm, and 20 mm. The range of the interval S3 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the interval S3 can be defined by a combination of any two values ​​from the first group. The range of the interval S3 can be defined by a combination of any two values ​​from the second group. The interval S3 can be, for example, 0.1mm or more and 20mm or less, 0.1mm or more and 15mm or less, 0.1mm or more and 10mm or less, 0.1mm or more and 1.0mm or less, 0.1mm or more and 0.5mm or less, 0.5mm or more and 20mm or less, 0.5mm or more and 15mm or less, 0.5mm or more and 10mm or less, 0.5mm or more and 1.0mm or less, 1.0mm or more and 20mm or less, 1.0mm or more and 15mm or less, 1.0mm or more and 10mm or less, 10mm or more and 20mm or less, 10mm or more and 15mm or less.

[0091] The thickness of the first layer 30 is defined as the maximum thickness T1 of the outer region 35. Thickness T1 can be, for example, 50 μm or more, 100 μm or more, or 200 μm or more. Thickness T1 can be, for example, less than 600 μm, less than 800 μm, or less than 1000 μm. The range of thickness T1 can be defined by a first group consisting of 50 μm, 100 μm, and 200 μm and / or a second group consisting of 600 μm, 800 μm, and 1000 μm. The range of thickness T1 can be defined by a combination of any one value from the first group and any one value from the second group. The range of thickness T1 can be defined by a combination of any two values ​​from the first group. The range of thickness T1 can be defined by a combination of any two values ​​from the second group. Thickness T1 can be, for example, 50μm or more and 1000μm or less, 50μm or more and 800μm or less, 50μm or more and 600μm or less, 50μm or more and 200μm or less, 50μm or more and 100μm or less, 100μm or more and 1000μm or less, 100μm or more and 800μm or less, 100μm or more and 600μm or less, 100μm or more and 200μm or less, 200μm or more and 1000μm or less, 200μm or more and 800μm or less, 200μm or more and 600μm or less, 600μm or more and 1000μm or more, 600μm or more and 800μm or less.

[0092] Next, the second layer 40 will be described. The second layer 40 includes a third surface 401, a fourth surface 402, and a plurality of second openings 41. The third surface 401 is opposite to the second surface 302 of the first layer 30. The fourth surface 402 is located on the opposite side of the third surface 401.

[0093] The second opening 41 extends from the third surface 401 to the fourth surface 402 through the second layer 40. One second opening 41 corresponds to one organic layer 130. A group of regularly arranged second openings 41 corresponds to one screen of an organic EL display device. For example... Figure 3 and Figure 4 As shown, a group of multiple second openings 41 arranged regularly can also overlap with a first opening 31 when viewed from above. The multiple groups of second openings 41 are supported by a first layer 30 formed by processing a single component such as a silicon wafer.

[0094] The second layer 40 can also be divided into a peripheral region 43 and an effective region 44. The peripheral region 43 is the area that overlaps with the first layer 30 when viewed from above. The effective region 44 is the area where a group of regularly arranged second openings 41 are distributed. The peripheral region 43 can be further divided into an outer region 45 and an inner region 46. The outer region 45 is the area that overlaps with the outer region 35 of the first layer 30 when viewed from above. The inner region 46 is the area that overlaps with the inner region 36 of the first layer 30 when viewed from above.

[0095] The thickness of the second layer 40 is less than the thickness T1 of the first layer 30. The thickness of the second layer 40 can be, for example, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more. The thickness of the second layer 40 can be, for example, less than 5 μm, less than 10 μm, or less than 25 μm. The thickness range of the second layer 40 can be defined by a first group consisting of 0.5 μm, 1.0 μm, and 2.0 μm and / or a second group consisting of 5 μm, 10 μm, and 25 μm. The thickness range of the second layer 40 can be defined by a combination of any one value from the first group and any one value from the second group. The thickness range of the second layer 40 can be defined by a combination of any two values ​​from the first group. The thickness range of the second layer 40 can be defined by a combination of any two values ​​from the second group. The thickness of the second layer 40 can be, for example, 0.5 μm or more and 25 μm or less, 0.5 μm or more and 10 μm or less, 0.5 μm or more and 5 μm or less, 0.5 μm or more and 2.0 μm or less, 0.5 μm or more and 1.0 μm or less, 1.0 μm or more and 25 μm or less, 1.0 μm or more and 10 μm or less, 1.0 μm or more and 5 μm or less, 1.0 μm or more and 2.0 μm or less, 2.0 μm or more and 25 μm or less, 2.0 μm or more and 10 μm or less, 2.0 μm or more and 5 μm or less, 5 μm or more and 25 μm or less, 5 μm or more and 10 μm or more, or 10 μm or more and 25 μm or less. By making the thickness of the second layer 40 less than 25 μm, the generation of shadows can be suppressed. By making the thickness of the second layer 40 greater than 0.5 μm, it is possible to suppress defects such as pinholes or deformation in the second layer 40.

[0096] The size S4 of the second opening 41 when viewed from above can be, for example, 1 μm or more, 2 μm or more, or 3 μm or more. The size S4 can be, for example, 5 μm or less, 10 μm or less, or 25 μm or less. The range of size S4 can be defined by a first group consisting of 1 μm, 2 μm, and 3 μm and / or a second group consisting of 5 μm, 10 μm, and 25 μm. The range of size S4 can be defined by a combination of any one value from the first group and any one value from the second group. The range of size S4 can be defined by a combination of any two values ​​from the first group. The range of size S4 can be defined by a combination of any two values ​​from the second group. Size S4 can be, for example, 1μm or larger and 25μm or smaller, 1μm or larger and 10μm or smaller, 1μm or larger and 5μm or smaller, 1μm or larger and 3μm or smaller, 1μm or larger and 2μm or smaller, 2μm or larger and 25μm or smaller, 2μm or larger and 10μm or smaller, 2μm or larger and 5μm or smaller, 2μm or larger and 3μm or smaller, 3μm or larger and 25μm or smaller, 3μm or larger and 10μm or smaller, 3μm or larger and 5μm or smaller, 5μm or larger and 25μm or smaller, 5μm or larger and 10μm or larger, 10μm or larger and 25μm or smaller.

[0097] The interval S5 between two second openings 41 in the direction of their arrangement can be, for example, 1 μm or more, 2 μm or more, or 3 μm or more. The interval S5 can be, for example, 5 μm or less, 10 μm or less, or 25 μm or less. The range of the interval S5 can be defined by a first group consisting of 1 μm, 2 μm, and 3 μm and / or a second group consisting of 5 μm, 10 μm, and 25 μm. The range of the interval S5 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the interval S5 can be defined by a combination of any two values ​​from the first group. The range of the interval S5 can be defined by a combination of any two values ​​from the second group. The interval S5 can be, for example, greater than or equal to 1 μm and less than 25 μm, greater than or equal to 1 μm and less than 10 μm, greater than or equal to 1 μm and less than 5 μm, greater than or equal to 1 μm and less than 3 μm, greater than or equal to 1 μm and less than 2 μm, greater than or equal to 2 μm and less than 25 μm, greater than or equal to 2 μm and less than 10 μm, greater than or equal to 2 μm and less than 5 μm, greater than or equal to 2 μm and less than 3 μm, greater than or equal to 3 μm and less than 25 μm, greater than or equal to 3 μm and less than 10 μm, greater than or equal to 3 μm and less than 5 μm, greater than or equal to 5 μm and less than 25 μm, greater than or equal to 5 μm and less than 10 μm, and greater than or equal to 10 μm and less than 25 μm.

[0098] Next, the intermediate layer 50 will be described. The intermediate layer 50 includes a layer that functions in some way for the first layer 30 or the second layer 40. For example, the intermediate layer 50 may function as a barrier layer to stop etching during a process of etching the first layer 30. When the intermediate layer 50 is a barrier layer, it may contain aluminum, an aluminum alloy, titanium, or a titanium alloy. When the intermediate layer 50 is a barrier layer, it may contain an inorganic compound such as silicon oxide. Alternatively, the intermediate layer 50 may also function to bond the first layer 30 and the second layer 40. For example, the intermediate layer 50 may also be a bonding layer containing an adhesive.

[0099] The thickness of the intermediate layer 50 is not particularly limited as long as it performs the aforementioned functions. For example, the thickness of the intermediate layer 50 can be less than or greater than the thickness of the second layer 40. The thickness of the intermediate layer 50 can, for example, be 5 nm or more, 50 nm or more, or 75 nm or more. The thickness of the intermediate layer 50 can, for example, be less than 1 μm, less than 10 μm, or less than 100 μm. The range of the thickness of the intermediate layer 50 can be defined by a first group consisting of 5 nm, 50 nm, and 75 nm and / or a second group consisting of 1 μm, 10 μm, and 100 μm. The range of the thickness of the intermediate layer 50 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the thickness of the intermediate layer 50 can be defined by a combination of any two values ​​from the first group. The range of the thickness of the intermediate layer 50 can be defined by a combination of any two values ​​from the second group. The thickness of the intermediate layer 50 can be, for example, greater than 5 nm and less than 100 μm, greater than 5 nm and less than 10 μm, greater than 5 nm and less than 1 μm, greater than 5 nm and less than 75 nm, greater than 5 nm and less than 50 nm, greater than 50 nm and less than 100 μm, greater than 50 nm and less than 10 μm, greater than 50 nm and less than 1 μm, greater than 50 nm and less than 75 nm, greater than 75 nm and less than 100 μm, greater than 75 nm and less than 10 μm, greater than 75 nm and less than 1 μm, greater than 1 μm and less than 100 μm, greater than 1 μm and less than 10 μm, greater than 10 μm and less than 100 μm.

[0100] Preferably, the intermediate layer 50 is located in a position that does not overlap with the second opening 41 when viewed from above. As a result, it is possible to suppress the generation of shadows caused by the intermediate layer 50.

[0101] In the mask 20 described above, the region including the area where the first opening 31 is formed, the region where the second opening 41 is formed (effective region 44), and the inner regions 36 and 46 will be referred to as the inner region 26 of the mask 20. The region including the outer regions 35 and 45 will also be referred to as the outer region 25 of the mask 20. The outer region 25 surrounds the inner region 26.

[0102] Next, the frame 60 will be described in detail. The frame 60 is mounted on the mask 20 for the purpose of holding it during processing, for example, when moving the mask 20. Figure 3As shown, a second opening 41 is formed on the mask 20 up to near its outer edge, thus forming a first opening 31. When handling the mask 20, for example, when moving the mask 20, it is desirable to hold the outer region 35 of the first layer 30 to prevent deformation of the second opening 41 of the second layer 40 or to prevent contamination of the second layer 40. However, since the first opening 31 is formed near the outer edge 303 of the first layer 30, the width of the outer region 35 is insufficient to hold the outer region 35. Furthermore, since the first opening 31 is formed near the outer edge 303 of the first layer 30, the outer region 35 is narrow. The narrow outer region 35 is prone to breakage. The outer region 35 is particularly prone to breakage when the first layer 30 contains silicon or silicon compounds. By mounting a frame 60 on the outer region 25 of such a mask 20, the frame 60 can be held when handling the mask 20, and the possibility of breakage of the first layer 30 is also reduced. As a result, the handling of the mask 20 becomes easier.

[0103] As from Figures 3 to 5B As understood herein, frame 60 includes a fifth face 601 and a sixth face 602. The fifth face 601 faces the same side as the fourth face 402. The sixth face 602 is located on the opposite side of the fifth face 601. In the illustrated example, the fifth face 601 is opposite the first face 301.

[0104] like Figure 5A and Figure 5B As shown, the frame 60 is connected to the first surface 301 of the outer region 35 of the first layer 30. In the illustrated example, a connecting layer 70 is disposed between the first surface 301 of the outer region 35 and the fifth surface 601 of the frame 60. The frame 60 is connected to the first layer 30 via the connecting layer 70. In a top view, the frame 60 does not overlap with the first opening 31. Furthermore, in a top view, at least a portion of the frame 60 extends to the outside of the outer edge 303 of the first layer 30. Therefore, the area for holding the mask 20 is expanded by the frame 60.

[0105] Frame 60 may be made of glass or metal. Glass materials may include quartz glass, borosilicate glass, alkali-free glass, or soda glass. Metal materials may include Invar alloy or stainless steel such as SUS430 or SUS304. By incorporating these materials, frame 60 can achieve a higher rigidity than the first layer 30. The material of frame 60 can be determined by considering the gripping force of the operator or robot handling the framed mask 15 to ensure the required rigidity.

[0106] Furthermore, the linear thermal expansion coefficient of the frame 60 is preferably the same as that of the first layer 30. As a result, the elongation of the frame 60 and the first layer 30 when the framed mask 15 is heated is made to be similar. Therefore, the possibility of breakage of the first layer 30 is suppressed. Specifically, the absolute value of the difference between the linear thermal expansion coefficient of the frame 60 and that of the first layer 30 is 15 ppm / ℃ or less, or it can be 10 ppm / ℃ or less, or it can be 5.0 ppm / ℃ or less.

[0107] In the illustrated example, the frame 60 is formed in a ring shape. The frame 60 has a region extending circumferentially outside the outer edge 303 of the first layer 30 when viewed from above. Therefore, the possibility of damage to the outer region 35 of the first layer 30 when processing the mask 20 is effectively suppressed. More specifically, a third opening 61 is formed in the center of the frame 60, extending from the fifth surface 601 to the sixth surface 602. In the illustrated example, the third opening 61 has a similar shape to the outer edge 303 of the first layer 30. The maximum size S9 of the third opening 61 is smaller than the maximum size S1 of the outer edge 303 of the first layer 30. When viewed from above, the third opening 61 overlaps with the inner region 26 of the mask 20.

[0108] The shape and size of the outer edge 603 of the frame 60 are not particularly limited. The shape and size S10 of the outer edge 603 of the frame 60 can be determined based on the size or shape of the operator's hand or robotic arm handling the framed mask 15, and the size or shape of the mask holder 9 of the vapor deposition apparatus 10. The outer edge 603 of the frame 60 can be quadrilateral or other polygonal shapes. The size S10 of the outer edge 603 of the frame 60 can, for example, be 100 mm or more, 150 mm or more, or 200 mm or more. The size S10 can, for example, be less than 300 mm, less than 400 mm, or less than 500 mm. The range of size S10 can be determined by a first group consisting of 100 mm, 150 mm, and 200 mm and / or a second group consisting of 300 mm, 400 mm, and 500 mm. The range of size S10 can be defined by a combination of any one value from the first group and any one value from the second group. The range of dimension S10 can be defined by any combination of two values ​​from the first group of values ​​mentioned above. The range of dimension S10 can be defined by any combination of two values ​​from the second group of values ​​mentioned above. Size S10 can be, for example, 100mm or more and 500mm or less, 100mm or more and 400mm or less, 100mm or more and 300mm or less, 100mm or more and 200mm or less, 100mm or more and 150mm or less, 150mm or more and 500mm or less, 150mm or more and 400mm or less, 150mm or more and 300mm or less, 150mm or more and 200mm or less, 200mm or more and 500mm or less, 200mm or more and 400mm or less, 200mm or more and 300mm or less, 300mm or more and 500mm or less, 300mm or more and 400mm or less, or 400mm or more and 500mm or less.

[0109] The distance S11 between the outer edge 603 of the frame 60 and the outer edge 303 of the first layer 30 can also be determined based on the size or shape of the operator's hand or robot arm handling the framed mask 15, and the size or shape of the mask holder 9 of the vapor deposition apparatus 10. The distance S11 can be, for example, 5 mm or more, 10 mm or more, or 15 mm or more. The distance S11 can be, for example, less than 30 mm, less than 60 mm, or less than 100 mm. The range of the distance S11 can be determined by a first group consisting of 5 mm, 10 mm, and 15 mm and / or a second group consisting of 30 mm, 60 mm, and 100 mm. The range of the distance S11 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the distance S11 can be defined by a combination of any two values ​​from the first group. The range of the distance S11 can be defined by a combination of any two values ​​from the second group. The distance S11 can be, for example, 5mm or more and less than 100mm, 5mm or more and less than 60mm, 5mm or more and less than 30mm, 5mm or more and less than 15mm, 5mm or more and less than 10mm, 10mm or more and less than 100mm, 10mm or more and less than 60mm, 10mm or more and less than 30mm, 10mm or more and less than 15mm, 15mm or more and less than 100mm, 15mm or more and less than 60mm, 15mm or more and less than 30mm, 30mm or more and less than 100mm, 30mm or more and less than 60mm, or 60mm or more and less than 100mm.

[0110] like Figure 5BAs shown, the frame 60 includes a connection area 67 around the third opening 61 for the mask 20 to connect to. The connection area 67 overlaps with the connection area 37 of the first layer 30 when viewed from above. The width S12 of the connection areas 37 and 67 can be determined, for example, by considering the bonding strength between the mask 20 and the frame 60. The width S12 can be, for example, 1 mm or more, 5 mm or more, or 10 mm or more. The width S12 can be, for example, less than 20 mm, less than 25 mm, or less than 30 mm. The range of the width S12 can be defined by a first group consisting of 1 mm, 5 mm, and 10 mm and / or a second group consisting of 20 mm, 25 mm, and 30 mm. The range of the width S12 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the width S12 can be defined by a combination of any two values ​​from the first group. The range of width S12 can be defined by any combination of two values ​​included in the second group above. For example, width S12 can be 1 mm or more and 30 mm or less, 1 mm or more and 25 mm or less, 1 mm or more and 20 mm or less, 1 mm or more and 10 mm or less, 1 mm or more and 5 mm or less, 5 mm or more and 30 mm or less, 5 mm or more and 25 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 25 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 30 mm or more, 20 mm or more and 25 mm or less.

[0111] The thickness T2 of the frame 60 is not particularly limited. Thickness T2 can also be determined based on the size or shape of the operator's hand or robotic arm handling the framed mask 15, or the size or shape of the mask holder 9 of the vapor deposition apparatus 10. Thickness T2 can, for example, be 500 μm or more, 2 mm or more, or 5 mm or more. Thickness T2 can, for example, be less than 10 mm, less than 20 mm, or less than 30 mm. The range of thickness T2 can be defined by a first group consisting of 500 μm, 2 mm, and 5 mm, and / or a second group consisting of 10 mm, 20 mm, and 30 mm. The range of thickness T2 can be defined by a combination of any one value from the first group and any one value from the second group. The range of thickness T2 can be defined by a combination of any two values ​​from the first group. The range of thickness T2 can be defined by a combination of any two values ​​from the second group. Thickness T2 can be, for example, 500μm or more and 30mm or less, 500μm or more and 20mm or less, 500μm or more and 10mm or less, 500μm or more and 5mm or less, 500μm or more and 2mm or less, 2mm or more and 30mm or less, 2mm or more and 20mm or less, 2mm or more and 10mm or less, 2mm or more and 5mm or less, 5mm or more and 30mm or less, 5mm or more and 20mm or less, 5mm or more and 10mm or less, 10mm or more and 30mm or less, 10mm or more and 20mm or less, 20mm or more and 30mm or less.

[0112] By determining the shape and size of the outer edge 603 of the frame 60 and the thickness T2 of the frame 60 based on the size or shape of the robot handling the framed mask 15 and the size or shape of the mask holder 9 of the vapor deposition apparatus 10, the shape and size of the framed mask 15 can be adapted to the existing robot or the existing vapor deposition apparatus 10. In other words, it is not necessary to set the shape and size of the mask 20 to be adapted to the existing robot or the existing vapor deposition apparatus 10, thus increasing the design freedom of the mask 20.

[0113] In the illustrated example, the fifth surface 601 of the frame 60 is closer to the first surface 301 of the first layer 30 than the fourth surface 402 of the second layer 40. In other words, the second layer 40 protrudes from the fifth surface 601 of the frame 60. Therefore, when a vapor-deposited layer is formed on the substrate 110 or on a structural element on the substrate 110 through the mask 20, the second layer 40 can be made to contact the substrate 110 or the structural element on the substrate 110.

[0114] like Figure 3As shown, frame 60 may also include alignment marks 69. As a result, when frame 60 is mounted on mask 20, mask 20 can be easily positioned relative to frame 60. For example, the position of frame 60 relative to mask 20 can be adjusted while observing alignment marks 69 of frame 60 and alignment marks 39 of mask 20.

[0115] like Figure 5A and Figure 5BAs shown, the frame 60 is connected to the first layer 30 via a connecting layer 70. The connecting layer 70 fixes the frame 60 relative to the first layer 30 by bonding, adhesive, or welding. The connecting layer 70 may contain glass, inorganic, metallic, or resin materials. The connecting layer 70 may be formed from glass powder, glass paste, solder paste, conductive paste, epoxy resin, polyimide, acrylic resin, etc. The connecting layer 70 may be formed from UV-curable adhesives, thermosetting adhesives, etc. In this case, for example, UV-curable epoxy resin "XNR5516Z-B1" manufactured by Nagase ChemteX can be used as a UV-curable adhesive. Alternatively, for example, NK Ester "BEP-500" manufactured by Shin-Nakamura Chemical Industry Co., Ltd., and "ASF400" manufactured by Nippon Steel Chemical Co., Ltd. can be used as thermosetting adhesives. Furthermore, to suppress venting from the bonding layer 70 during the vapor deposition process within the vapor deposition apparatus 10, materials for forming the bonding layer 70 can be used, for example, such as the high heat-resistant epoxy adhesive "Aremco-bond 526N" manufactured by Aremco Products, or the UV-curable adhesive "WORLDROCK 5910" or "WORLDROCK 8723K9B" manufactured by Kyoritsu Chemical Industry Co., Ltd. Additionally, by using a material with high solvent resistance as the bonding layer 70, concerns can be prevented regarding deformation of the bonding layer 70 in contact with the cleaning solution, causing the frame 60 to separate from the mask 20, when cleaning the framed mask 15 used for the vapor deposition process to remove the vapor deposition material. In this case, for example, the UV-curable adhesive "ThreeBond 3026E" manufactured by ThreeBond can be used as the material for forming the bonding layer 70. Furthermore, by using a material that can be peeled off from the frame 60 or the mask 20 as the connecting layer 70, the frame 60 or the mask 20 can be reused. In this case, for example, the double-sided peel-off adhesive "BBX100" manufactured by Cemedine Co., Ltd., the visible light curing adhesive "Clear Presto (registered trademark) CP4374" or "Clear Presto (registered trademark) K40" manufactured by Sekisui-fuller Co., Ltd., and the cyanoacrylate-based instant adhesive "Skyrock (registered trademark) R-4" manufactured by Nippon Ka Seiko Co., Ltd. can be used as the material forming the connecting layer 70.

[0116] The thickness of the connecting layer 70 can be, for example, 0.05 μm or more, 5 μm or more, or 10 μm or more. The thickness of the connecting layer 70 can be, for example, 20 μm or less, 50 μm or less, or 100 μm or less. The range of the thickness of the connecting layer 70 can be defined by a first group consisting of 0.05 μm, 5 μm, and 10 μm and / or a second group consisting of 20 μm, 50 μm, and 100 μm. The range of the thickness of the connecting layer 70 can be defined by a combination of any one value from the first group and any one value from the second group. The range of the thickness of the connecting layer 70 can be defined by a combination of any two values ​​from the first group. The range of the thickness of the connecting layer 70 can be defined by a combination of any two values ​​from the second group. The thickness of the connecting layer 70 can be, for example, 0.05μm or more and 100μm or less, 0.05μm or more and 50μm or less, 0.05μm or more and 20μm or less, 0.05μm or more and 10μm or less, 0.05μm or more and 5μm or less, 5μm or more and 100μm or less, 5μm or more and 50μm or less, 5μm or more and 20μm or less, 5μm or more and 10μm or less, 10μm or more and 100μm or less, 10μm or more and 50μm or less, 10μm or more and 20μm or less, 20μm or more and 100μm or less, 20μm or more and 50μm or less.

[0117] like Figure 4 As shown, the framed mask 15 may further include alignment marks 16. Alignment marks 16 are formed, for example, on the exit surface 202 of the mask 20. Alignment marks 16 are used to adjust the relative position of the framed mask 15 relative to the substrate 110. That is, alignment marks 16 are used to adjust the relative position of the mask 20 relative to the substrate 110. If the substrate 110 has the property of allowing visible light to pass through, the alignment marks 16 can be visually confirmed through the substrate 110. Alignment marks 16 may also be formed on the second layer 40, or on a layer other than the second layer 40. Alignment marks 16 may be located in the outer region 25 or the inner region 26 of the mask 20.

[0118] The thickness of each layer, the size of each component, and the spacing can be measured by observing the cross-sectional image of the mask 20 using a scanning electron microscope.

[0119] (Adhesion device)

[0120] Next, refer to Figures 6A to 9The connecting device 80 of this embodiment will be described. The connecting device 80 is used to connect the mask 20 to the frame 60. Figures 6A to 6E This is a cross-sectional view of the connecting device 80. Figure 7 It is Figure 6A The enlarged view shows the portion enclosed by the double-dotted line. Figure 7 The heating heater 89, the alignment camera 88, and the alignment opening 825, which will be described later, are omitted from the illustration.

[0121] exist Figures 6A to 6E In the illustrated example, the connecting device 80 includes a first pressing plate 81, a second pressing plate 82, a pressing device 83, and a suction device 84. The first pressing plate 81 and the second pressing plate 82 are positioned opposite each other. In the illustrated example, the first pressing plate 81 is positioned above the second pressing plate 82. The pressing device 83 presses the first pressing plate 81 and the second pressing plate 82 against each other. The connecting device 80 may also include a chamber 85, an opening and closing device 86, a pressure reducing device 87, and a camera 88 for alignment. The chamber 85 houses the first pressing plate 81 and the second pressing plate 82. The opening and closing device 86 opens and closes the chamber 85. The pressure reducing device 87 reduces pressure within the chamber 85. The connecting device 80 may also include a support body 99 that supports the pressing plates 81 and 82, the pressing device 83, the chamber 85, the opening and closing device 86, etc.

[0122] The first pressing plate 81 supports the mask 20. The first pressing plate 81 is integrally formed as a flat plate and has a first support surface 811 on which the mask 20 is disposed. The mask 20 is disposed on the first support surface 811 with its exit surface 202 facing the first support surface 811. The first support surface 811 has an inner region 812 on which the mask 20 is disposed and an outer region 813 surrounding the inner region 812 (see reference). Figure 8A and Figure 8B The inner region 812 of the first support surface 811 is flat. (For example...) Figure 7 As shown, a first suction hole 814 is formed in the first pressing plate 81, opening into the first support surface 811. The first suction hole 814 opens into the inner region 812 of the first support surface 811. By using the suction device 84 to suction the interior of the first suction hole 814, the mask 20 can be adsorbed onto the first support surface 811. By adsorbing the mask 20 onto the first support surface 811, the mask 20 can be held on the first pressing plate 81. Therefore, the possibility of the mask 20 accidentally falling off the first pressing plate 81 and breaking can be suppressed. Furthermore, by adsorbing the mask 20 onto the flat inner region 812, the exit surface 202 of the mask 20 can be made flat.

[0123] Figure 8A and Figure 8B This is a top view showing the first support surface 811. Figure 8A and Figure 8B In the image, mask 20 is represented by a dashed line. For example... Figure 8A As shown, the first suction hole 814 can open in the area of ​​the first support surface 811 facing the outer region 45 of the second layer 40. Alternatively, as... Figure 8B As shown, an opening can be made in the first support surface 811 facing the peripheral region 43 of the second layer 40. Therefore, the suction device 84 can suction the gap between the first support surface 811 and the second layer 40 through the first suction hole 814, thereby adsorbing the exit surface 202 of the mask 20 onto the first support surface 811.

[0124] The second pressing plate 82 is supported by a frame 60. The second pressing plate 82 is integrally formed as a flat plate and has a second support surface 821 on which the frame 60 is disposed. The frame 60 is disposed on the second support surface 821 with its sixth surface 602 facing the second support surface 821. The second support surface 821 has an inner region 822 on which the frame 60 is disposed and an outer region 823 surrounding the inner region 822 (see reference). Figure 9 The inner region 822 of the second support surface 821 is flat. (For example...) Figure 7 As shown, a second suction hole 824 is formed in the second pressing plate 82, opening onto the second support surface 821. The second suction hole 824 opens into the inner region 822 of the second support surface 821. By using the suction device 84 to suction the interior of the second suction hole 824, the frame 60 can be adsorbed onto the second support surface 821. By adsorbing the frame 60 onto the second support surface 821, the frame 60 can be held on the second pressing plate 82. As a result, the possibility of the frame 60 accidentally falling off the second pressing plate 82 and breaking can be suppressed. Furthermore, by adsorbing the frame 60 onto the second support surface 821, the mask 20 can be separated from the first pressing plate 81 after it has been attached to the frame 60.

[0125] Figure 9 This is a top view showing the second support surface 821. Figure 9 In the diagram, frame 60 is represented by a dashed line. (For example...) Figure 9 As shown, the second suction hole 824 can open in the area of ​​the second support surface 821 facing the frame 60. Therefore, the suction device 84 can suction the gap between the second support surface 821 and the frame 60 through the second suction hole 824, and can adsorb the frame 60 onto the second support surface 821.

[0126] In the illustrated example, an alignment opening 825 is formed in the second pressing plate 82. The alignment opening 825 extends through the second pressing plate 82 in the thickness direction. The alignment opening 825 is formed on the frame 60 at a position facing the alignment mark 69. Furthermore, an alignment camera 88 is disposed opposite the alignment opening 825. The alignment camera 88 can capture images between the second support surface 821 and the first support surface 811 through the alignment opening 825. When the frame 60 is transparent, by using the alignment camera 88, the alignment mark 69 of the frame 60 and the alignment mark 39 of the mask 20 disposed on the second support surface 821 can be observed, and the position of the frame 60 relative to the mask 20 can be adjusted.

[0127] like Figure 6A As shown, a heating heater 89 can be installed inside the first pressing plate 81 and / or the second pressing plate 82. In this case, the mask 20 and the frame 60 can be connected while heating is being performed using the heating heater 89.

[0128] The first pressing plate 81 and the second pressing plate 82 are made of cast iron, for example. In this case, the first pressing plate 81 and the second pressing plate 82 have high rigidity. Therefore, concerns about deformation of the first pressing plate 81 and the second pressing plate 82 when they are pressed against each other can be suppressed. In addition, the first pressing plate 81 and the second pressing plate 82 made of cast iron have high heat resistance. Therefore, the possibility of thermal deformation of the first pressing plate 81 and the second pressing plate 82 when heated by the heater 89 can be suppressed. Of course, the materials used to construct the first pressing plate 81 and the second pressing plate 82 are not limited to cast iron. Other materials such as metals other than cast iron can also be used to construct the first pressing plate 81 and the second pressing plate 82.

[0129] In the illustrated example, the first pressing plate 81 is fixed relative to the support body 99. The first pressing plate 81 is fixed inside the first chamber element 851, described later. The second pressing plate 82 is not fixed relative to the support body 99. The second pressing plate 82 is disposed inside the second chamber element 852, described later.

[0130] The pressing device 83 moves the first pressing plate 81 and / or the second pressing plate 82, pressing the first pressing plate 81 and the second pressing plate 82 against each other. By pressing the first pressing plate 81 of the supporting mask 20 and the second pressing plate 82 of the supporting frame 60 against each other, the mask 20 and the frame 60 are pressed against each other. In the illustrated example, the pressing device 83 is capable of moving the second pressing plate 82 towards and away from the first pressing plate 81. The pressing device 83 may be a driving device such as a cylinder.

[0131] By pressing the frame 60 against the mask 20 while the mask 20 is attached to the first pressing plate 81, the mask 20 can be connected to the frame 60 in a flat state. As a result, the flatness of the mask 20 in the framed mask 15 is improved. By pressing the mask 20 and the frame 60 against each other using the pressing plates 81 and 82, a uniform pressing force can be applied to the connection areas 37 and 67 of the mask 20 and the frame 60. This also improves the flatness of the mask 20 in the framed mask 15.

[0132] The chamber 85 has a first chamber element 851 and a second chamber element 852. The first chamber element 851 houses a first pressing plate 81. In the illustrated example, the first chamber element 851 is fixed to the support 99 together with the first pressing plate 81. The second chamber element 852 houses a second pressing plate 82. The second chamber element 852 is not fixed to the support 99.

[0133] The opening and closing device 86 moves the first chamber element 851 and / or the second chamber element 852, thereby bringing the first chamber element 851 and the second chamber element 852 into contact with each other or separating them from each other. By bringing the first chamber element 851 and the second chamber element 852 into contact with each other, the chamber 85 is closed, forming a sealed space inside the chamber 85. In the illustrated example, the opening and closing device 86 moves the second chamber element 852 towards and away from the first chamber element 851. The opening and closing device 86 can be a driving device such as a cylinder.

[0134] In the illustrated example, the movement of the second chamber element 852 based on the opening and closing device 86 and the movement of the second pressing plate 82 based on the pressing device 83 are performed independently. In other words, the opening and closing of the chamber 85 based on the opening and closing device 86 and the pressing of the pressing device 83 on the first and second pressing plates 81 and 82 are performed independently of each other. Therefore, in the example shown... Figure 6B As shown, the opening and closing device 86 is activated to bring the second chamber element 852 into close contact with the first chamber element 851, thereby closing the chamber 85. Figure 6C As shown, the pressing device 83 can be activated to press the second pressing plate 82 relative to the first pressing plate 81. Additionally, as... Figure 6D As shown, after the pressing device 83 is activated and the second pressing plate 82 is disengaged from the first pressing plate 81, as... Figure 6E As shown, the opening and closing device 86 is activated to cause the second chamber element 852 to leave the first chamber element 851, thereby opening the chamber 85.

[0135] The pressure-reducing device 87 reduces pressure within the enclosed chamber 85. By connecting the mask 20 to the frame 60 while the chamber 85 is under pressure, the possibility of air bubbles forming between the connecting layer 70 and the mask 20 or the frame 60 can be suppressed. This also improves the flatness of the mask 20 in the framed mask 15.

[0136] (Methods for connecting masks and frames)

[0137] Next, refer to Figures 6A to 6E The connection method between the mask 20 and the frame 60 in this embodiment will be described.

[0138] First, prepare the mask 20 and the frame 60. Then, activate the opening / closing device 86 to separate the first chamber element 851 and the second chamber element 852, opening the chamber 85. Next, activate the pressing device 83 to separate the first pressing plate 81 and the second pressing plate 82.

[0139] Next, as Figure 6A As shown, the mask 20 is disposed on the first support surface 811 of the first pressing plate 81 with its exit surface 202 facing the first support surface 811. The mask 20 is disposed in the inner region 812 of the first support surface 811. Then, the suction device 84 is activated to suction into the first suction hole 814, causing the mask 20 to adhere to the first pressing plate 81. As a result, the mask 20 is held on the first pressing plate 81. In addition, by adhering the mask 20 to the first pressing plate 81, the exit surface 202 of the mask 20 becomes flat due to its close contact with the flat inner region 812 of the first pressing plate 81.

[0140] Furthermore, the frame 60 is disposed on the second support surface 821 of the second pressing plate 82 with its sixth surface 602 facing the second support surface 821. The frame 60 is disposed in the inner region 822 of the second support surface 821.

[0141] Next, the alignment mark 39 of the mask 20 and the alignment mark 69 of the frame 60 are observed through the alignment opening 825. The alignment marks 39 and 69 are observed using the alignment camera 88. Then, the position of the frame 60 on the second pressing plate 82 is adjusted so that the alignment mark 39 overlaps with the alignment mark 69. Then, suction is applied to the second suction hole 824 using the suction device 84, causing the frame 60 to adhere to the second pressing plate 82. As a result, the frame 60 is held on the second pressing plate 82.

[0142] Additionally, a connecting layer 70 is formed in the connecting region 37 of the mask 20 or the connecting region 67 of the frame 60. The connecting layer 70 is formed on the first surface 301 of the first layer 30 or the fifth surface 601 of the frame 60. The formation of the connecting layer 70 can be performed before and after the mask 20 and / or the frame 60 are disposed on the first pressing plate 81 and / or the second pressing plate 82.

[0143] Next, as Figure 6B As shown, the opening and closing device 86 is activated, causing the second chamber element 852 to come into close contact with the first chamber element 851, thus sealing the chamber 85. Then, the pressure reducing device 87 is activated to reduce the pressure inside the chamber 85.

[0144] Next, as Figure 6C As shown, the pressing device 83 is activated, pressing the second pressing plate 82 against the first pressing plate 81. As a result, the frame 60 is connected to the mask 20 via the connecting layer 70. At this time, since the exit surface 202 of the mask 20 is adsorbed onto the first pressing plate 81, the mask 20 is pressed against the frame 60 with the exit surface 202 flat. In addition, the first pressing plate 81 and the second pressing plate 82 apply a uniform pressing force to the connection areas 37, 67 of the mask 20 and the frame 60. As a result, the mask 20 is also connected to the frame 60 with the exit surface 202 flat. Moreover, since the frame 60 and the mask 20 are connected in a depressurized state within the chamber 85, the possibility of air bubbles forming between the connecting layer 70 and the mask 20 or the frame 60 can be suppressed. When the second pressing plate 82 is pressed against the first pressing plate 81, the first pressing plate 81 and the second pressing plate 82 can also be heated by the heating heater 89.

[0145] Next, the suction device 84 stops suctioning into the first suction hole 814. Afterwards, as... Figure 6D As shown, while the suction device 84 continues to suction into the second suction hole 824, the second pressing plate 82 is separated from the first pressing plate 81. As a result, the mask 20 separates from the first pressing plate 81 and moves together with the second pressing plate 82 while connected to the frame 60. Afterwards, the suction device 84 stops suction into the second suction hole 824.

[0146] Next, as Figure 6E As shown, the opening and closing device 86 is activated, causing the second chamber element 852 to separate from the first chamber element 851, opening the chamber 85. Then, the connecting layer 70 is cured by cooling or the like, fixing the mask 20 and the frame 60 together. In this way, a framed mask 15 can be obtained.

[0147] Various modifications can be made to the above-described embodiment. Hereinafter, variations will be described with reference to the accompanying drawings. In the following description and the accompanying drawings used in the description, parts that can be constructed in the same manner as the corresponding parts in the above-described embodiment will be referred to by the same reference numerals. Repeated descriptions will be omitted. Furthermore, where the effects obtained in the above-described embodiment are clearly also obtainable in the variations, their descriptions will sometimes be omitted.

[0148] For example, such as Figure 10 As shown, a first recess 816, representing at least a portion in the thickness direction of the mask 20, may also be formed on the first support surface 811 of the first pressing plate 81. The first recess 816 is formed in the inner region 812 of the first pressing plate 81. By forming the first recess 816, the position of the mask 20 on the first support surface 811 can be easily adjusted when the mask 20 is positioned on the first support surface 811. That is, the position of the mask 20 on the first support surface 811 can be approximately adjusted simply by inserting the mask 20 into the first recess 816. The first suction hole 814 may also open within the first recess 816.

[0149] In addition, such as Figure 10 As shown, a second recess 826, representing at least a portion of the thickness of the frame 60, may also be formed on the second support surface 821 of the second pressing plate 82. The second recess 826 is formed in the inner region 822 of the second pressing plate 82. By forming the second recess 826, the position of the frame 60 on the second support surface 821 can be easily adjusted when the frame 60 is positioned on the second support surface 821. That is, the position of the frame 60 on the second support surface 821 can be approximately adjusted simply by inserting the frame 60 into the second recess 826. The second suction hole 824 and the alignment opening 825 may also open within the second recess 826.

[0150] By roughly adjusting the position of the mask 20 on the first support surface 811 and the position of the frame 60 on the second support surface 821, the positions of the mask 20 and the frame 60 relative to each other can be roughly adjusted. In other words, the mask 20 and the frame 60 can be roughly aligned with each other. As a result, the positions of the mask 20 and / or the frame 60 on the pressing plates 81 and 82 can be easily adjusted by overlapping the alignment marks 39 and 69.

[0151] Regarding the depth of the first recess 816, it is acceptable as long as it is equal to the thickness of the mask 20 or does not hinder the fit between the mask 20 and the frame 60. That is, the depth of the first recess 816 is acceptable as long as it is greater than 0 mm and less than the thickness of the mask 20, or less than the sum of the thickness of the mask 20 and the thickness of the connecting layer 70 when the connecting layer 70 is formed on the mask 20. For example, the depth of the first recess 816 can be greater than 0.01 mm, greater than 0.05 mm, or greater than 0.1 mm. For example, the depth of the first recess 816 can be less than 0.8 mm, less than 1 mm, or less than 2 mm. The range of the depth of the first recess 816 can be determined by a first group consisting of 0.01 mm, 0.05 mm, and 0.1 mm and / or a second group consisting of 0.8 mm, 1 mm, and 2 mm. The depth of the first recess 816 can be defined by a combination of any one value from the first group and any one value from the second group. The depth of the first recess 816 can be defined by a combination of any two values ​​from the first group. The depth of the first recess 816 can be defined by a combination of any two values ​​from the second group. The depth of the first recess 816 can be, for example, 0.01mm or more and 2mm or less, 0.01mm or more and 1mm or less, 0.01mm or more and 0.8mm or less, 0.01mm or more and 0.1mm or less, 0.01mm or more and 0.05mm or less, 0.05mm or more and 2mm or less, 0.05mm or more and 1mm or less, 0.05mm or more and 0.8mm or less, 0.05mm or more and 0.1mm or less, 0.1mm or more and 2mm or less, 0.1mm or more and 1mm or less, 0.1mm or more and 1mm or less, 0.1mm or more and 0.8mm or less, 0.8mm or more and 2mm or less, 0.8mm or more and 1mm or less, or 1mm or more and 2mm or less.

[0152] The depth of the second recess 826 is only required to be equal to the thickness T2 of the frame 60 or to a depth that does not impede the fit between the mask 20 and the frame 60. That is, the depth of the second recess 826 is only required to be greater than 0 mm and less than the thickness T2 of the frame 60; in the case where a connecting layer 70 is formed on the frame 60, it is less than the sum of the thickness T2 of the frame 60 and the thickness of the connecting layer 70. For example, the depth of the second recess 826 can be 500 μm or more, 2 mm or more, or 5 mm or more. For example, the depth of the second recess 826 can be less than 10 mm, less than 20 mm, or less than 30 mm. The range of the depth of the second recess 826 can be defined by a first group consisting of 500 μm, 2 mm, and 5 mm and / or a second group consisting of 10 mm, 20 mm, and 30 mm. The range of the depth of the second recess 826 can be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The depth of the second recess 826 can be defined by a combination of any two values ​​included in the first group described above. The depth of the second recess 826 can be defined by a combination of any two values ​​included in the second group described above. For example, the depth of the second recess 826 can be 500 μm or more and 30 mm or less, 500 μm or more and 20 mm or less, 500 μm or more and 10 mm or less, 500 μm or more and 5 mm or less, 500 μm or more and 2 mm or less, 2 mm or more and 30 mm or less, 2 mm or more and 20 mm or less, 2 mm or more and 10 mm or less, 2 mm or more and 5 mm or less, 5 mm or more and 30 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 20 mm or less, and 20 mm or more and 30 mm or less.

[0153] In addition, such as Figure 11 As shown, at least a portion of the first support surface 811 of the first pressing plate 81 may be covered by the porous layer 90. In the illustrated example, the porous layer 90 covers the entire inner region 812 of the first support surface 811. In this case, the suction device 84 can suction the first suction hole 814 and the holes of the porous layer 90, adsorbing the mask 20 onto the first pressing plate 81 through the porous layer 90. By adsorbing the mask 20 onto the first pressing plate 81 through the porous layer 90, a uniform adsorption force can be applied to the entire surface of the exit surface 202 of the mask 20, thereby improving the flatness of the mask 20.

[0154] In addition, such as Figure 12As shown, at least a portion of the first support surface 811 of the first pressing plate 81 may be covered by a bonding layer 91. The bonding layer 91 may be an adhesive layer or a bonding layer. The bonding layer 91 may be formed of a material capable of bonding at low temperatures. In the illustrated example, the bonding layer 91 covers the entire inner region 812 of the first support surface 811. In this case, by using the bonding layer 91 to bond the mask 20 to the first support surface 811, the mask 20 can be held on the first pressing plate 81. Furthermore, by bonding the mask 20 to the flat inner region 812, the exit surface 202 of the mask 20 can be made flat. Therefore, in Figure 12 In the example shown, the first suction hole 814 may not be formed in the first pressing plate 81. Furthermore, the bonding layer 91 is preferably micro-adhesive. As a result, after the mask 20 is bonded to the connecting layer 70, the mask 20 can be separated from the first pressing plate 81. Alternatively, the bonding layer 91 can be weakened by applying heat, ultraviolet light, or laser light. In this case, after the mask 20 is bonded to the connecting layer 70, the mask 20 can be separated from the first pressing plate 81 by applying heat, ultraviolet light, or laser light to the bonding layer 91. For the mask 20, after bonding to the connecting layer 70, the second pressing plate 82 can be separated from the first pressing plate 81 while the frame 60 is adsorbed onto the second pressing plate 82, thereby separating the mask 20 from the first pressing plate 81.

[0155] The connecting device 80 described above, in one embodiment, is a device for connecting the frame 60 to the mask 20. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31, 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connecting device 80 has a first pressing plate 81, a suction device 84, a second pressing plate 82, and a pressing device 83. The first pressing plate 81 has a first support surface 811 supporting the mask 20. A first suction hole 814 is formed in the first pressing plate 81, opening into the first support surface 811. The suction device 84 suctions into the first suction hole 814. The second pressing plate 82 has a second support surface 821 supporting the frame 60. The second support surface 821 is opposite to the first support surface 811. The pressing device 83 moves the first pressing plate 81 and / or the second pressing plate 82, pressing the first pressing plate 81 and the second pressing plate 82 against each other.

[0156] Furthermore, one embodiment of the connection method described above uses the connection device 80 of the above embodiment to connect the frame 60 to the mask 20. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31, 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The above connection method includes the following steps: placing the mask 20 on the first support surface 811 of the first pressing plate 81, and using the suction device 84 to suction into the first suction hole 814, thereby causing the mask 20 to adhere to the first support surface 811. In addition, the above connection method includes the step of placing the frame 60 on the second support surface 821 of the second pressing plate 82. In addition, the above connection method includes the step of forming a connection layer 70 in the outer region 25 of the mask 20 or in the region 67 of the frame 60 facing the outer region 25. In addition, the above connection method includes the following steps: using the pressing device 83 to move the first pressing plate 81 on which the mask 20 is adsorbed and / or the second pressing plate 82 on which the support frame 60 is attached, the first pressing plate 81 and the second pressing plate 82 are pressed against each other, thereby connecting the mask 20 and the frame 60 via the connecting layer 70.

[0157] According to the connecting device 80 and connecting method of such an embodiment, the flatness of the mask 20 in the framed mask 15 can be improved.

[0158] Additionally, in a variation of one embodiment described above, the connecting device 80 connects the frame 60 to the mask 20. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31, 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connecting device 80 has a first pressing plate 81, a second pressing plate 82, and a pressing device 83. The first pressing plate 81 has a first support surface 811 supporting the mask 20. The second pressing plate 82 has a second support surface 821 supporting the frame 60. The second support surface 821 is opposite to the first support surface 811. The pressing device 83 moves the first pressing plate 81 and / or the second pressing plate 82, pressing the first pressing plate 81 and the second pressing plate 82 against each other. At least a portion of the first support surface 811 of the first pressing plate 81 is covered by a bonding layer 91.

[0159] Furthermore, a modified embodiment described above describes a method for connecting a frame 60 to a mask 20 using a modified embodiment's connecting device 80. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31, 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connection method includes a step of placing the mask 20 on a first support surface 811 of a first pressing plate 81 and engaging the mask 20 with a bonding layer 91. Additionally, the connection method includes a step of placing the frame 60 on a second support surface 821 of a second pressing plate 82. Furthermore, the connection method includes a step of forming a bonding layer 70 in the outer region 25 of the mask 20 or in the region 67 of the frame 60 facing the outer region 25. In addition, the above connection method includes the following steps: using the pressing device 83 to move the first pressing plate 81 and / or the second pressing plate 82, which are engaged with the mask 20, and press the first pressing plate 81 and the second pressing plate 82 against each other, thereby connecting the mask 20 and the frame 60 via the connecting layer 70.

[0160] According to a variation of such an embodiment, the connecting device 80 and the connecting method can improve the flatness of the mask 20 in the framed mask 15.

[0161] The constituent elements disclosed in the above embodiments and modifications can also be appropriately combined as needed. Alternatively, several constituent elements can be deleted from all the constituent elements shown in the above embodiments and modifications.

Claims

1. A connecting device for connecting a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein, The connecting device includes: A first pressing plate has a first support surface that supports the mask and a first suction hole that opens in the first support surface; A suction device that suctions from the first suction hole; The second pressing plate has a second support surface that supports the frame and is opposite to the first support surface; as well as The pressing device moves the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other.

2. The connecting device according to claim 1, wherein, At least a portion of the first support surface of the first pressing plate is covered by a porous layer.

3. The connecting device according to claim 1, wherein, A second suction hole with an opening in the second support surface is formed in the second pressing plate. The suction device performs suction into the second suction hole.

4. A connecting device for connecting a frame to an outer region of a mask, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein, The connecting device includes: A first pressing plate has a first support surface that supports the mask; The second pressing plate has a second support surface that supports the frame and is opposite to the first support surface; as well as A pressing device that moves the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other. At least a portion of the first support surface of the first pressing plate is covered by a bonding layer.

5. The connecting device according to claim 4, wherein, A second suction hole with an opening in the second support surface is formed in the second pressing plate. The connecting device also includes a suction device for suctioning the second suction hole.

6. The connecting device according to claim 1 or 4, wherein, A first recess is formed on the first support surface to receive at least a portion of the mask in the thickness direction.

7. The connecting device according to claim 6, wherein, The depth of the first recess is greater than 0 μm and less than 1000 μm.

8. The connecting device according to claim 1 or 4, wherein, A second recess is formed on the second support surface to receive at least a portion of the frame in the thickness direction.

9. The connecting device according to claim 8, wherein, The depth of the second recess is greater than 0 μm and less than 30 mm.

10. The connecting device according to claim 1 or 4, wherein, The connecting device also includes a heating heater disposed inside the first pressing plate and / or the second pressing plate.

11. The connecting device according to claim 1 or 4, wherein, The connecting device also includes: A chamber that houses the first and second pressure plates; and A pressure-reducing device that reduces pressure within the chamber.

12. The connecting device according to claim 1 or 4, wherein, An alignment opening is formed in the second pressing plate, extending through the second pressing plate in the thickness direction. The connecting device also includes an alignment camera capable of taking pictures of the area between the second support surface and the first support surface through the alignment opening.

13. A connection method comprising connecting a frame to an outer region of a mask using the connection device of claim 1, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein, The connection method includes the following steps: The mask is placed on the first support surface of the first pressing plate, and the suction device is used to suction the first suction hole, thereby causing the mask to adhere to the first support surface. The frame is positioned on the second support surface of the second pressing plate; A connecting layer is formed in the outer region of the mask or in the region of the frame that faces the outer region; as well as The first pressing plate, which holds the mask, and / or the second pressing plate, which supports the frame, are moved by the pressing device to press the first pressing plate and the second pressing plate against each other, thereby connecting the mask and the frame via the connecting layer.

14. The connection method according to claim 13, wherein, The connection method further includes the following steps: after connecting the mask and the frame, stop the suction device from suctioning the first suction hole.

15. A connection method comprising connecting a frame to an outer region of a mask using the connection device of claim 4, the mask comprising an inner region having a plurality of openings and an outer region surrounding the inner region, wherein, The connection method includes the following steps: The mask is positioned on the first support surface of the first pressing plate, such that the mask is bonded to the bonding layer; The frame is positioned on the second support surface of the second pressing plate; A connecting layer is formed in the outer region of the mask or in the region of the frame that faces the outer region; as well as The first pressing plate and the second pressing plate, which are engaged with the mask, are moved by the pressing device to press the first pressing plate and the second pressing plate, which support the frame, against each other, thereby connecting the mask and the frame via the connecting layer.

16. The connection method according to claim 13 or 15, wherein, A second suction hole with an opening in the second support surface is formed in the second pressing plate. The connecting device includes a suction device for suctioning the second suction hole. The connection method further includes the following steps: after the frame is placed on the second pressing plate, the suction device is used to suction the second suction hole.

17. The connection method according to claim 13 or 15, wherein, A heater is provided inside the first pressing plate and / or the second pressing plate for heating. In the process of pressing the first pressing plate and the second pressing plate against each other, the first pressing plate and / or the second pressing plate are heated by the heating heater.

18. The connection method according to claim 13 or 15, wherein, The connecting device also includes: A chamber that houses the first and second pressure plates; and A pressure-reducing device that reduces pressure within the chamber. During the process of pressing the first pressing plate and the second pressing plate against each other, the chamber is depressurized by the depressurization device.

19. The connection method according to claim 13 or 15, wherein, Alignment marks are formed on the mask and the frame, respectively. An alignment opening is formed in the second pressing plate, extending through the second pressing plate in the thickness direction. The connecting device also includes an alignment camera, which is capable of taking pictures of the area between the second support surface and the first support surface through the alignment opening. In the process of placing the frame on the second support surface of the second pressing plate, the alignment camera is used to photograph the alignment marks of the mask and the frame through the alignment opening to align the mask and the frame.

Images