Lens driving apparatus, and camera device and optical instrument including the same

Abstract

Implementations include a fixed part including a cover member, a base coupled to the cover member, and a coil disposed on the base, a moving part including a magnet facing the coil and movable by interaction between the magnet and the coil, a first heat dissipation member disposed on the base, and a second heat dissipation member connected to the first heat dissipation member and exposed from the cover member.

Description

Technical Field

[0001] The embodiments relate to a lens moving device and a camera module and optical instruments including the lens moving device. Background Technology

[0002] The voice coil motor (VCM) technology used in conventional general-purpose camera module is difficult to apply to miniature camera module designed to demonstrate low power consumption, and research related to low-power miniature camera module has been actively carried out.

[0003] The demand for and manufacture of electronic products equipped with cameras, such as smartphones and cellular phones, is increasing. Cameras used in cellular phones are becoming increasingly higher resolution and smaller in size, and consequently, actuators for cellular phones are becoming smaller, larger in diameter, and more functional. To achieve high-resolution cellular phone cameras, improvements are needed in the performance of the cellular phone camera itself, as well as additional features such as autofocus, shutter stabilization, and zoom. Summary of the Invention [Technical Issues]

[0004] The embodiments provide lens moving devices, camera devices, and optical instruments that can improve the dissipation of heat generated by heat sources such as coils and image sensors. [Technical Solutions]

[0005] The lens moving device according to an embodiment includes: a cover member; a fixing unit including a base coupled to the cover member and a coil disposed on the base; a moving unit including a magnet facing the coil, the moving unit being configured to be movable by the interaction between the magnet and the coil; a first heat dissipation member disposed on the base; and a second heat dissipation member connected to the first heat dissipation member and exposed from the cover member.

[0006] The fixing unit may include a circuit board disposed on the base, a coil may be disposed on the circuit board, and at least a portion of the circuit board may be connected to a first heat dissipation member. The first heat dissipation member may be exposed from the lower surface of the base. At least a portion of the first heat dissipation member may be integrally formed with the base.

[0007] The lens moving device may include a ball member disposed between the base and the moving unit. The cover member may include an opening through which a second heat dissipation member is exposed.

[0008] The cover member may include an upper plate and a side plate, the base may include a side portion and a lower portion positioned below the side portion, the first heat dissipation member may include a side plate disposed on the side portion of the base and a lower plate disposed on the lower portion of the base, and a second heat dissipation member may be disposed on the side plate of the first heat dissipation member. A portion of the lower plate may protrude from the lower surface of the lower portion of the base. The second heat dissipation member may include metal or graphite.

[0009] The fixing unit may include a circuit board disposed on the base, a coil may be disposed on the circuit board, and at least a portion of the circuit board may be connected to the first heat dissipation component.

[0010] The fixing unit may include a circuit board disposed on the base, a coil may be disposed on the circuit board, and the circuit board may include an opening formed to allow a second heat dissipation member to pass through the opening or be disposed in the opening.

[0011] According to another embodiment, the lens moving device includes: a cover member; a fixing unit including a base coupled to the cover member and a coil disposed on the base; a moving unit including a magnet facing the coil, the moving unit being configured to move by the interaction between the magnet and the coil; a metal member disposed on the base; and a heat dissipation member connected to the metal member and the cover member.

[0012] The camera device according to the embodiment includes: a first circuit board; an image sensor disposed on the first circuit board; a sensor base disposed on the first circuit board; a first heat dissipation member disposed on the sensor base; a base disposed on the sensor base; a second heat dissipation member disposed on the base and connected to the first heat dissipation member; a cover member disposed on the base; a coil disposed in the cover member and a magnet facing the coil; and a third heat dissipation member connected to at least one of the first heat dissipation member or the second heat dissipation member.

[0013] The second heat dissipation component may include an exposed area protruding from the lower surface of the base, and the first heat dissipation component may include an exposed area protruding from the upper surface of the sensor base, and the exposed areas of the first heat dissipation component and the exposed areas of the second heat dissipation component may be connected to each other.

[0014] The second heat dissipation component can be integrally formed with the base, and the first heat dissipation component can be integrally formed with the sensor base. The camera device may include a ball component disposed between the base and the moving unit.

[0015] The first circuit board may include a heat sink connected to a second heat sink component. The heat sink may be configured to surround the image sensor. The heat sink may be connected to a ground plane of the first circuit board.

[0016] The cover member may include an upper plate and a side plate, the base may include a side portion and a lower portion positioned below the side portion, the second heat dissipation member may include a side plate disposed on the side portion of the base and a lower plate disposed on the lower portion of the base, and a third heat dissipation member may be disposed on the side plate of the second heat dissipation member. The side plate of the cover member may include an opening to expose the third heat dissipation member.

[0017] In the camera device, the fixing unit may include a second circuit board disposed on the second heat dissipation member, and the coil may be disposed on the second circuit board. [Beneficial Effects]

[0018] The implementation can effectively dissipate heat generated by heat sources such as coils and / or image sensors.

[0019] The implementation method can prevent or suppress excessive temperature rise of the lens moving device and / or the camera device.

[0020] The implementation method can prevent image loss and / or quantitative and qualitative degradation of the image quality of the image sensor caused by heat generated by the coil and image sensor.

[0021] The implementation method can suppress the demagnetization of the drive magnet caused by heat generated by the coil and / or image sensor.

[0022] The implementation method can prevent a decrease in the accuracy and / or reliability of the position sensor, and can improve the reliability of autofocus operation and / or optical image stabilization operation. Attached Figure Description

[0023] Figure 1 This is a perspective view of the camera device according to the embodiment.

[0024] Figure 2 This is a perspective view of the camera device with the cover component removed.

[0025] Figure 3A is a first exploded perspective view of the camera device excluding the lens module.

[0026] Figure 3B is a second exploded perspective view of the camera device excluding the lens module.

[0027] Figure 4A is a first exploded perspective view of the lens module, lens moving device, filter, sensor base, image sensor and circuit board.

[0028] Figure 4B is a second exploded perspective view of the lens module, lens moving device, filter, sensor base, image sensor, and circuit board.

[0029] Figure 5A is along Figure 2 The cross-sectional view taken along direction AB in the middle.

[0030] Figure 5B is along Figure 2 The cross-sectional view taken from the direction CD in the middle.

[0031] Figure 5C is along Figure 2 The cross-sectional view taken in the direction EF.

[0032] Figure 5D is along Figure 2 A cross-sectional view taken in the direction GH.

[0033] Figure 6 This is a bottom perspective view of the cover component.

[0034] Figure 7 This is a perspective view of the lens moving device for removing the cover component.

[0035] Figure 8A is a first perspective view of the first moving unit and the fixed unit.

[0036] Figure 8B is a second perspective view of the first moving unit and the fixed unit.

[0037] Figure 8C is a third perspective view of the first moving unit and the fixed unit.

[0038] Figure 9A is a first exploded perspective view of the first moving unit.

[0039] Figure 9B is a second exploded perspective view of the first moving unit.

[0040] Figure 9C is a third exploded perspective view of the first moving unit.

[0041] Figure 10A is a coupled perspective view of the spool, reinforcing member, spherical member, and supporting member.

[0042] Figure 10B is a coupled perspective view of the spool, reinforcing member, spherical member, supporting member, and elastic member.

[0043] Figure 11A is an exploded perspective view of the frame and base.

[0044] Figure 11B is a first coupled perspective view of the base, frame, and heat dissipation components.

[0045] Figure 11C is a second coupled perspective view of the base, frame, and heat dissipation components.

[0046] Figure 11D is a third coupled perspective view of the base, frame, and heat dissipation components.

[0047] Figure 12 It is a perspective view of the coupling of the circuit board, coil, position sensor and capacitor.

[0048] Figure 13 This is an exploded perspective view of the sensor base and frame.

[0049] Figure 14A is a first perspective view of a lens moving device according to another embodiment.

[0050] Figure 14B is a second perspective view of the lens moving device shown in Figure 14A.

[0051] Figure 15 This is an exploded perspective view of a camera device according to yet another embodiment.

[0052] Figure 16 yes Figure 15 An exploded perspective view of the fixed unit and filter of the camera device shown.

[0053] Figure 17 yes Figure 15 The coupling diagram of the fixed unit shown is illustrated.

[0054] Figure 18 yes Figure 15 The bottom perspective view of the fixed unit shown.

[0055] Figure 19 yes Figure 15 The diagram shows the coupling between the fixed unit and the filter.

[0056] Figure 20A is Figure 15 The camera device shown is along Figure 2 The cross-sectional view taken along the AF direction.

[0057] Figure 20B is Figure 15 The camera device shown is along Figure 2 The cross-sectional view taken from the direction CD in the middle.

[0058] Figure 20C is Figure 15 The camera device shown is along Figure 2 The cross-sectional view taken in the direction EF.

[0059] Figure 20D is Figure 15 The camera device shown is along Figure 2 A cross-sectional view taken in the direction GH.

[0060] Figure 21 This is a cross-sectional view of a camera device according to yet another embodiment.

[0061] Figure 22 This is a cross-sectional view of a camera device according to yet another embodiment.

[0062] Figure 23 It is a perspective view of an optical instrument according to an embodiment.

[0063] Figure 24 yes Figure 23 The diagram shows the configuration of the optical instruments. Detailed Implementation

[0064] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0065] The technical spirit of this disclosure is not limited to the embodiments described, and can be implemented in various other forms. One or more components can be selectively combined and replaced for use without departing from the scope of the technical spirit of this disclosure.

[0066] Furthermore, unless specifically defined and explicitly described, the terms (including technical and scientific terms) used in the embodiments of this disclosure should be interpreted as having meanings that would be commonly understood by one of ordinary skill in the art to which this disclosure pertains, and the meanings of commonly used terms, such as those defined in dictionaries, should be interpreted in the context of the relevant art.

[0067] Furthermore, the terminology used in the embodiments of this disclosure is for illustrative purposes and is not intended to limit the scope of this disclosure. In this specification, unless otherwise specifically stated in the phrase, the singular form may also include the plural form, and where “at least one (or more) of A, B, or C” is stated, it may include one or more of all possible combinations of A, B, and C.

[0068] Furthermore, when describing components of embodiments of this disclosure, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. Such terms are used only to distinguish one component from another, without specifying the nature, order, or procedure of the corresponding constituent elements.

[0069] Furthermore, when describing a component as "connected," "coupled," or "joined" to another component, the description can include not only direct "connection," "coupling," or "joining" to the other component, but also "connection," "coupling," or "joining" to another component through which the component is connected to the other component. Additionally, when describing a component as being formed or disposed "above" or "below," the description includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or disposed between the two components. Furthermore, when expressed as "above" or "below," it can refer to both the downward and upward directions relative to a single element.

[0070] In the following text, the lens moving device may alternatively be referred to as a lens moving unit, a voice coil motor (VCM), an actuator, or a lens moving device. In the following text, "coil" may alternatively be referred to as a coil unit, and "elastic member" may alternatively be referred to as an elastic unit or a spring.

[0071] Additionally, in the following description, "terminal" may be alternatively referred to as pad, electrode, conductive layer, or bonding unit.

[0072] For ease of description, a Cartesian coordinate system (x, y, z) will be used to describe the lens moving device according to the embodiment. However, the embodiment is not limited to this, and other coordinate systems may be used to describe the lens moving device according to the embodiment. In each figure, the x-axis and y-axis may be directions perpendicular to the z-axis, which is the optical axis (OA) direction. The z-axis direction, which is the optical axis (OA) direction, can be defined as any one of a first direction, a second direction, and a third direction; the x-axis direction can be defined as another one of the first direction, the second direction, and the third direction; and the y-axis direction can be defined as the remaining one of the first direction, the second direction, and the third direction.

[0073] The optical axis direction can be defined as the optical axis direction of the lens and / or image sensor coupled to the lens moving device. Alternatively, the optical axis direction can be a direction perpendicular to the sensor surface (imaging area) of the image sensor.

[0074] The lens moving device according to the embodiment can perform an autofocus function. Furthermore, the lens moving device according to the embodiment can perform an optical image stabilization function.

[0075] "Autofocus (AF)" is defined as the function of automatically focusing on the subject by adjusting the distance between the image sensor and the lens (or spool) in the optical axis direction according to the distance to the subject, thereby forming a sharp image of the subject on the image sensor. Furthermore, "Closed-Loop AF (CLAF) control" refers to receiving the output signal of a position sensor as feedback. This position sensor detects the displacement or position of the AF movement unit (e.g., spool or magnet) in the optical axis direction and uses the received output signal to adjust or control the drive signal supplied to the drive unit (e.g., coil) in real time, which moves the AF movement unit. This improves the accuracy of focus adjustment. Optical image stabilization (OIS) is defined as the function of moving or tilting the lens in a direction perpendicular to the optical axis to counteract vibrations (movements) in the image sensor caused by external forces.

[0076] In the following text, one of "magnet 130" and "magnet 25" may be referred to as "first magnet" and the other as "second magnet". Alternatively, one of "magnet 130", "first magnet unit 25A" and "second magnet unit 25B" may be referred to as "first axis drive magnet", another as "second axis drive magnet", and the remaining one as "third axis drive magnet". In the following text, one of "coil 120" and "coil 230" may be referred to as "first coil" and the other as "second coil". In the following text, one of "ball member 510" and "ball member 52" may be referred to as "first ball member" and the other as "second ball member". Furthermore, one of frames 50 and 60 may be referred to as "first frame", and the other of frames 50 or 60 may be referred to as "second frame".

[0077] Furthermore, frame 50 may be referred to as one of the first to third heat dissipation components, frame 60 may be referred to as another of the first to third heat dissipation components, and heat dissipation component 40 or 45 may be referred to as the remaining one of the first to third heat dissipation components.

[0078] Figure 1 This is a perspective view of the camera device 200 according to the embodiment. Figure 2 Figure 3A is a perspective view of the camera device 200 with the cover member 300 removed. Figure 3B is a first exploded perspective view of the camera device 200 excluding the lens module 400. Figure 4A is a first exploded perspective view of the lens module 400, lens moving device 100, filter 610, sensor base 600, image sensor 810, and circuit board 800. Figure 4B is a second exploded perspective view of the lens module 400, lens moving device 100, filter 610, sensor base 600, image sensor 810, and circuit board 800. Figure 5A is a perspective view of the camera device 200 with the cover member 300 removed. Figure 2 Figure 5B is a cross-sectional view taken along direction AB. Figure 2 Figure 5C is a cross-sectional view taken along the direction CD. Figure 2 Figure 5D is a cross-sectional view taken along the direction EF. Figure 2 A cross-sectional view taken in the direction GH. Figure 6 This is a bottom perspective view of cover component 300. Figure 7Figure 8A is a perspective view of the lens moving device 100 with the cover member 300 removed. Figure 8B is a first perspective view of the first moving unit and the fixed unit. Figure 8C is a third perspective view of the first moving unit and the fixed unit. Figure 9A is a first exploded perspective view of the first moving unit. Figure 9B is a second exploded perspective view of the first moving unit. Figure 9C is a third exploded perspective view of the first moving unit. Figure 10A shows the spool 110, the reinforcing member 150, the ball member 510, and the support. Figure 10B is a coupled perspective view of the support member 220, the spool 110, the reinforcing member 150, the ball member 510, the support member 220, and the elastic member 160; Figure 11A is an exploded perspective view of the frame 60 and the base 210; Figure 11B is a first coupled perspective view of the base 210, the frame 60, and the heat dissipation member 40; Figure 11C is a second coupled perspective view of the base 210, the frame 60, and the heat dissipation member 40; and Figure 11D is a third coupled perspective view of the base 210, the frame 60, and the heat dissipation member 40. Figure 12 This is a perspective view showing the coupling of circuit board 190, coils 120 and 230, position sensors 170 and 240, and capacitors 19A to 19C. Figure 13 This is an exploded perspective view of the sensor base 600 and the frame 50.

[0079] Reference Figures 1 to 12 The camera device 200 may include a lens moving device 100, a sensor base 600, a filter 610, and a circuit board 800. The camera device 200 may include a lens module 400. The lens module 400 may include lenses and / or lens barrels. The lens module 400 may be coupled to the lens moving device 100. The lens module 400 may include one or more lenses and a lens barrel configured to accommodate one or more lenses.

[0080] The lens moving device 100 can be a voice coil motor (VCM). The lens moving device 100 can be a lens moving motor. The lens moving device 100 can be an actuator or a lens moving actuator.

[0081] The lens moving device 100 may include an AF module to move the lens module 400 in the optical axis direction. The lens moving device 100 may also include an OIS module to move the lens module in a direction intersecting the optical axis direction or in a direction perpendicular to the optical axis direction.

[0082] The sensor base 600 may be disposed below the lens moving device 100. The sensor base 600 may be disposed between the lens moving device 100 and the circuit board 800. The sensor base 600 may include an opening 601 corresponding to at least one of the image sensor 810, the filter 610, or the lens module 400. The opening 601 may be formed through the sensor base 600 in the optical axis direction. The opening 601 allows light passing through the lens module 400 or the filter 610 to be incident on the image sensor 810.

[0083] The sensor base 600 may include a mounting portion 620, in which a filter 610 is disposed or mounted. For example, the mounting portion 620 may be a recess recessed into the upper surface of the sensor base 600. The mounting portion 620 may include a bottom surface 621 and a side surface 622 (or sidewall), the bottom surface 621 having a step relative to the upper surface of the sensor base 600 in the optical axis direction, and the side surface 622 being disposed between the bottom surface 621 and the upper surface of the sensor base 600. For example, an opening 601 may be formed in the bottom surface 621 of the mounting portion 620. In another embodiment, the mounting portion may be a protrusion projecting from the upper surface of the sensor base 600.

[0084] The sensor base 600 may include a recess 605 formed in the lower surface of the sensor base 600 to avoid spatial interference with the image sensor 810. The recess 605 may be recessed into the lower surface of the sensor base 600. The recess 605 may face the image sensor 810 in the optical axis direction.

[0085] Filter 610 may be disposed on or coupled to sensor base 600. Filter 610 can be used to prevent light within a specific frequency band of light passing through lens module 400 from incident on image sensor 810. Filter 610 may be configured to be parallel to the xy plane. Filter 610 may be disposed between lens module 400 and image sensor 810. In a modified example, filter 610 may be disposed on base 210 of lens moving device 100. Filter 610 may include an infrared filter. The infrared filter can block light in the infrared region from incident on image sensor 60.

[0086] The camera device 200 may include an adhesive (not shown) disposed between the lens moving device 100 and the sensor base 600 to couple the lens moving device 100 to the sensor base 600. For example, the adhesive may couple the base 210 of the lens moving device 100 to the sensor base 600. The adhesive may include at least one of epoxy resin, thermosetting adhesive, or UV-curing adhesive. The adhesive may also be used to prevent foreign objects from entering the lens moving device 100.

[0087] Refer to Figures 4A, 4B and Figure 13 The camera device 200 may include a frame 50 disposed on a sensor base 600. The frame 50 may be coupled to the sensor base 600. For example, at least a portion of the frame 50 may be recessed into the sensor base 600, and at least another portion of the frame 50 may be exposed from the sensor base 600. The frame 50 may be integrally formed with the sensor base 600. For example, the frame 50 may be integrally formed with the sensor base 600 by an insertion injection molding method. At least a portion of the frame 50 may be embedded in the sensor base 600.

[0088] The frame 50 may include an opening 701 or a hollow portion that corresponds to, faces, or overlaps with the opening 601 of the sensor base 600. The opening 701 may be a through hole formed through the frame 50.

[0089] Frame 50 may include a heat-dissipating material with high thermal conductivity. For example, the thermal conductivity of frame 50 may be greater than that of sensor base 600. For example, sensor base 600 may be formed by injection molding of a material such as resin or plastic. Frame 50 may be formed of metal. For example, frame 50 may include graphite. For example, frame 50 may be a conductive component. In another embodiment, frame 50 may be a non-conductive component. For example, frame 50 may include a graphite layer or graphite sheet. Frame 50 may alternatively be referred to as a "heat sink," "heat-dissipating component," "metal component," "graphite component," "heat-dissipating frame," "heat sink," or "heat fin."

[0090] Referring to FIG5B, at least a portion 50A of the frame 50 may be exposed from the upper surface of the sensor base 600. At least another portion 50B of the frame 50 may be exposed from the lower surface of the sensor base 210. Furthermore, the frame 50 may include a portion 50C connecting portion 50A to portion 50B. Portion 50A may be one of the first to third portions, portion 50B may be another of the first to third portions, and portion 50C may be the remaining one of the first to third portions. The frame 50 may include at least one bend.

[0091] The frame 50 may include a body 81. The body 81 may include a top plate 81A and a side plate 81B. At least a portion of the top plate 81A may be disposed on the upper surface of the sensor base 600. At least a portion of the top plate 81A may protrude from the upper surface of the sensor base 600. At least a portion of the side plate 81B may be embedded in the sensor base 600. At least another portion of the side plate 81B may protrude from the lower surface of the sensor base 600.

[0092] The frame 50 may include an extension 82 extending from the body 81. At least a portion of the extension 82 may be exposed from the lower surface of the sensor base 600. The lower surface of the extension 82 may be exposed from the lower surface of the sensor base 600. The extension 82 is configured to increase the contact area with the circuit board 800. For example, the extension 82 may extend from the side plate 91B in a direction perpendicular to the optical axis. The extension 82 may extend from the lower end of the side plate 91B. The extension 82 may be configured to surround an opening 601 of the sensor base 600. The extension 82 may be configured to surround a recess 605 of the sensor base 600. When viewed along the optical axis or from below, the extension 82 may have a linear shape with a predetermined width. In another embodiment, the portion of the extension 82 exposed from the lower surface of the sensor base 600 may include a plurality of regions spaced apart from each other.

[0093] Frame 50 is described as a component separate from sensor base 600. However, in another embodiment, frame 50 may be described as part of the construction of sensor base 600, or sensor base 600 may include frame 50.

[0094] Refer to Figures 4A, 4B and Figure 13 The frame 50 is shown inserted into the sensor base 600. However, in another embodiment, the frame 50 may be coupled to the sensor base 600 using coupling members or adhesives. For example, the frame 50 may be coupled, attached, or secured to at least one of the lower or side surfaces of the sensor base 600 using coupling members or adhesives. For example, the frame 50 may include a first portion disposed on or coupled to the lower surface of the sensor base 600 and a second portion disposed on or coupled to the upper surface of the sensor base 600. Furthermore, the frame 50 may include a third portion connecting the first portion to the second portion and disposed on the side surface of the sensor base 600.

[0095] The circuit board 800 may be disposed below the sensor base 600. The sensor base 600 may be disposed on the circuit board 800. The circuit board 800 may be a board, a printed circuit board, or a flexible printed circuit board (FPCB). The sensor base 600 may be disposed between the lens moving device 100 and the circuit board 800. The lens moving device 100 may be electrically connected to the circuit board 800. The circuit board 800 may include a plurality of terminals 811 electrically connected to the lens moving device 100.

[0096] The circuit board 800 may include: a first region 801 in which an image sensor 810, a sensor base 600, or a lens moving device 100 are disposed; and a third region 803 in which a connector 804 for electrical connection to an external device is disposed (see [link to relevant documentation]). Figure 21 Multiple terminals 811 can be located in the first region 801.

[0097] Frame 50 can be connected to circuit board 800. Frame 50 can contact circuit board 800. Frame 50 can be connected to or contact the upper surface of circuit board 800. Frame 50 can be connected to or contact the upper surface of the first region 801 of circuit board 800.

[0098] The circuit board 800 may include a heat sink 805. The heat sink 805 may be connected to the frame 50 of the sensor base 600. The heat sink 805 may contact the frame 50 of the sensor base 600. For example, the heat sink 805 may be connected to or contact the side plate 81B of the frame 50. For example, the heat sink 805 may be connected to or contact the extension 82 of the frame 50. Alternatively, in another embodiment, the heat sink 805 may be connected to or contact the first portion of the frame 50.

[0099] The camera device 200 may include a thermally conductive adhesive or a heat-dissipating adhesive disposed between the heat dissipation portion 805 and the frame 50. For example, the adhesive may be epoxy resin or a thermally conductive epoxy resin. The thermally conductive adhesive can couple or attach the heat dissipation portion 805 and the frame 50 to each other, and can allow heat to be effectively transferred from the heat dissipation portion 805 to the frame 50. The thermally conductive adhesive can couple or attach the extension 82 of the frame 50 and the heat dissipation portion 805 to each other. In another embodiment, the thermally conductive adhesive can couple or attach the heat dissipation portion 805 and a first portion of the frame 50 to each other.

[0100] The heat sink 805 can be disposed in the first region 801 of the circuit board 800. The heat sink 805 can correspond to, face, or overlap with the frame 50 in the optical axis direction.

[0101] The heat dissipation portion 805 may include a heat dissipation material. The heat dissipation portion 805 may be formed of metal. For example, the heat dissipation portion 805 may be copper foil. For example, the heat dissipation portion 805 may be formed of a metal such as copper, silver, gold or aluminum, or may be formed of a metal alloy including at least one of these materials.

[0102] For example, heat sink 805 may include graphite. For example, heat sink 805 may be a conductive component. In another embodiment, heat sink 805 may be a non-conductive component. For example, heat sink 805 may include a conductive layer, a metal layer, a graphite layer, or a graphite sheet. Heat sink 805 may alternatively be referred to as a "heat sink," "heat dissipation metal," "heat radiator component," "heat dissipation pad," "heat dissipation terminal," "heat dissipation layer," "metal layer," or "heat sink fin."

[0103] A heat sink 805 may be disposed at the edge of the upper surface of the first region 801. The heat sink 805 may be disposed around the image sensor 810. The heat sink 805 may have a polygonal or circular annular shape. In another embodiment, the heat sink 805 may include a plurality of heat sinks spaced apart from each other. In another embodiment, the heat sink 805 may be positioned on one side or the other side of the image sensor 810.

[0104] The heat sink 805 may be connected to the ground plane of the circuit board 800. In another embodiment, the heat sink 805 may not be connected to the ground plane of the circuit board 800.

[0105] Image sensor 810 can be disposed on circuit board 800. Image sensor 810 can be disposed in a first region 801 of circuit board 800. For example, image sensor 810 can be located inside heat sink 805.

[0106] Image sensor 810 can be a component that allows light passing through lens and filter 610 to be incident on it and form an image thereon. Image sensor 810 can be electrically connected to circuit board 800. Image sensor 810 can convert light radiated to the effective image area or active area (or imaging area) of image sensor 810 into electrical signals.

[0107] Image sensor 810 can be configured to correspond to, face, or overlap with lens module 400 (or lens) or filter 610 in the optical axis direction. Image sensor 810 can be configured such that its optical axis is aligned with the optical axis of the lens.

[0108] The heat generated by the image sensor 810 can be transferred to the frame 50 of the sensor base 600 through the heat dissipation part 805 of the circuit board 800.

[0109] The camera device 200 may also include a motion sensor (not shown). The motion sensor may be set or mounted on a circuit board 800. The motion sensor may output information about the rotational angular velocity generated by the motion of the camera device 200. The motion sensor may include a gyroscope sensor or an angular velocity sensor with two or more axes.

[0110] The camera device 200 may also include a controller (not shown). The controller may be mounted on a circuit board 800. The controller may be electrically connected to the circuit board 800. The controller may be electrically connected to a motion sensor. The controller may be electrically connected to a lens moving device 100. The controller may be electrically connected to at least one of the coils included in the lens moving device 100. The controller may individually control the direction, magnitude, and amplitude of the current supplied to at least one of the coils of the lens moving device 100. The controller may be electrically connected to at least one of the position sensors included in the lens moving device 100. The controller may control at least one of the position sensors included in the lens moving device 100. The controller may control the lens moving device 100 to perform autofocus and / or optical image stabilization functions. Furthermore, the controller may perform autofocus feedback control and / or optical image stabilization feedback control relative to the lens moving device 100.

[0111] Referring to FIG8A, the lens moving device 100 may include a moving unit 10 and a fixing unit 20. The fixing unit 20 may be a part or element that remains relatively fixed during the movement of the moving unit 10. In addition, the lens moving device 100 may include a "drive unit" configured to move the moving unit 10.

[0112] The moving unit 10 is movable relative to the fixed unit 20. The moving unit 10 may include a "first moving unit" that moves during AF driving. The moving unit 10 may also include a "second moving unit" that moves during OIS driving. The second moving unit can move during both AF driving and OIS driving. The first moving unit may include the second moving unit. A lens may be coupled to the second moving unit. The first moving unit may be disposed between the second moving unit and the fixed unit 20.

[0113] The lens moving device 100 may include a cover member 300. The cover member 300 may be a housing or a cover. The cover member 300 may accommodate at least one of a first moving unit or a second moving unit. The cover member 300 may be disposed on the base 210.

[0114] For example, cover member 300 may accommodate at least one of housing 140 or spool 110. Cover member 300 may accommodate at least one of circuit board 190, coils 120 and 230, sensors 170 and 240, capacitors 19A to 19C, magnets 130 and 25, spool 110, housing 140, and components or ball members 510 and 52 coupled to spool 110 and housing 140.

[0115] The cover member 300 may alternatively be referred to as a shielding member or shielding cap. The cover member 300 can block electromagnetic interference (EMI). In this case, the cover member 330 can be an EMI shielding canister.

[0116] The cover member 300 may have a box shape with an opening at the bottom. The cover member 300 may include an upper plate 301 and a side plate 302. The upper plate 301 may be disposed above at least one of a first moving unit or a second moving unit. The upward movement of the first moving unit may be limited by contact between the first moving unit and the upper plate 301. The upper plate 301 may include an opening 303 or a hollow portion through which light passes. The opening 303 may be a hole formed through the upper plate 301.

[0117] Side plate 302 can extend from upper plate 301. Side plate 302 can be coupled to base 210. Side plate 302 can be coupled to step portion 211 protruding from the lower end of the outer surface of base 210. Side plate 302 can include a plurality of side plates 302A to 302D. Side plate 302 can include: a first side plate 302A and a second side plate 302B, the first side plate 302A and the second side plate 302B being positioned relative to each other in a second direction (e.g., the y-axis direction), and a third side plate 302C and a fourth side plate 302D, the third side plate 302C and the fourth side plate 302D being positioned relative to each other in a third direction (e.g., the x-axis direction).

[0118] The cover member 300 may include at least one hole 3 formed in at least one of the upper plate 301 or the side plate 302. For example, at least one hole 3 may be formed in the side plate 302 of the cover member 300. At least one hole 3 may be formed through the side plate 302. In another embodiment, at least one hole 3 may include an opening facing the lower end of the side plate 302. For example, the cover member 300 may include at least one hole 3A to 3G formed in at least one of the side plates 302A to 302D. The holes 3 in the cover member 300 may have a shape corresponding to or matching the heat dissipation member 40 described later, and may face or overlap with the heat dissipation member 40.

[0119] In another embodiment, the cover member 300 may include at least one hole (not shown) formed in at least one of the upper plate 301 or the side plate 302 to allow for the injection of adhesive.

[0120] The lens moving device 100 may include a base 210. The base 210 may include a cavity for receiving a first moving unit. For example, the base 210 may include a cavity for receiving a housing 140. For example, the base 210 may have a box shape with an open upper portion. The base 210 may be disposed outside the housing 140. At least a portion of the base 210 may be disposed between the housing 140 and the cover member 300. The base 210 may be coupled to or fixed to the cover member 300.

[0121] The base 210 may include a side portion 65. The base 210 may include a lower portion 64 (or lower plate) disposed below the side portion 65. For example, the side portion 65 of the base 210 may include a plurality of sides 65A to 65D. The first side portion 65A and the second side portion 65B may be positioned relative to each other in a second direction (e.g., the y-axis direction), and the third side portion 65C and the fourth side portion 65D may be positioned relative to each other in a third direction (e.g., the x-axis direction).

[0122] The base 210 may include a recess 67 in which the circuit board 190 is seated or disposed. The recess 67 may be disposed on a side 65 of the base 210. The recess 67 may be recessed into the outer surface of the side 26 of the base 210. For example, the recess 67 may be disposed on sides 65A, 65C, and 65D of the base 210. In another embodiment, the recess 67 may be omitted.

[0123] The base 210 may include an opening 201 or a hollow portion that corresponds to, faces, or overlaps with the spool 110 or the lens module 400. The opening 201 may be formed through the base 210 in the optical axis direction. For example, the opening 201 may be formed in the lower portion 64 of the base 210.

[0124] The base 210 may include a recess 44 in which at least a portion of the ball member 52 is received or disposed. The recess 44 may alternatively be referred to as a receiving recess, guiding recess, guide, track, or guide track. The number of recesses 44 may be one or more. The recess 44 may be recessed into the inner surface of a side portion of the base 210. The recess 44 may be disposed on at least one of the first side portions 65A to the fourth side portions 65D of the base 210. One or more recesses 44 may be formed in any one side portion of the base 210. In another embodiment, one or more recesses 44 may be formed in different sides of the base 210. For example, the recess 44 may include a first recess 44A and a second recess 44B formed in one side portion (e.g., 65D) of the base 210. For example, two recesses 44A and 44B may be disposed on opposite sides of the coil 120. For example, at least a portion of the magnet 130 may be disposed between the first recess 44A and the second recess 44B. At least a portion of the magnet 130 may overlap with the recesses 44A and 44B in a second direction. For example, when viewed from above, the recess 44 may have a polygonal shape (e.g., a triangular, quadrilateral, or pentagonal shape). Alternatively, in another embodiment, the recess 117 may have a V-shape or a U-shape.

[0125] Referring to Figures 8A, 8B, and 11C, the base 210 may include a protrusion 113. The protrusion 113 may be formed on the upper surface of the lower portion 64 of the base 210. The protrusion 113 may prevent lubricant (e.g., grease) applied to the ball member 52 from overflowing. The protrusion 113 may protrude from the upper surface of the lower portion 64. At least a portion of the protrusion 113 may be formed as an opening 201 surrounding the base 210. The protrusion 1130 may alternatively be referred to as a "barrier" or "dam".

[0126] The base 210 may include at least one protrusion 114 corresponding to, facing, or overlapping the lower stop 215 of the housing 140. The protrusion 114 may protrude from the upper surface of the lower portion 64 of the base 210. The protrusion 114 may be spaced apart from the protrusion 113. The protrusion 114 may include a plurality of protrusions. The protrusion 113 may alternatively be referred to as a "stop".

[0127] When the first moving unit moves in the optical axis direction, the lower stop 215 of the housing 140 can contact the protrusion 114 of the base 210. That is, the protrusion 114 of the base 210 and the lower stop 215 of the housing 140 can be used as a stop to limit the downward movement of the first moving unit (e.g., the housing 140).

[0128] The base 210 may include a seating portion 66, in which coils 120 and 230 are disposed. The seating portion 66 may be formed in at least one of the side portions 65A to 65D of the base 210. Referring to FIG11B, the seating portion 66 may have a hole shape that penetrates the side portion (e.g., 65A, 5C, or 65D) of the base 210. In another embodiment, the seating portion 66 may have a recess or groove shape that is recessed into the outer or inner surface of the side portion of the base 210.

[0129] For example, the base 210 may include a mounting portion 66A in which a first coil unit 230A in which a coil 230 is disposed, a mounting portion 66B in which a second coil unit 230B is disposed, and a mounting portion 66C in which a coil 120 is disposed.

[0130] The base 210 may include a stepped portion 211 that corresponds to, faces, or overlaps with the side plate 302 of the cover member 300. The stepped portion 211 may protrude from the outer surface of the side 65 of the base 210. The stepped portion 211 may be positioned on the underside or lower part of the side 65.

[0131] The base 210 may include a recess 68, in which an extension 94 of the circuit board 190 is disposed. The recess 68 may be disposed on a side portion 65A of the base 210. The recess 68 may be recessed into the outer surface of the side portion 65A. For example, the recess 68 may be positioned below the seat portion 66A of the base 210. For example, the recess 68 may be recessed into the stepped portion 211.

[0132] The base 210 may include a coupling portion 144 coupled to the circuit board 190. The coupling portion 144 may be coupled to a hole 59 in the circuit board 190. The coupling portion 144 may be disposed on a side of the base 210 on which the circuit board 190 is disposed (e.g., 65A, 65C, or 65D). The coupling portion 144 may have a protruding shape that protrudes from the outer surface of the side of the base 210 (e.g., 65A, 65C, or 65D).

[0133] Referring to Figures 11A to 11D, the lens moving device 100 may include a frame 60 disposed on the base 210. The frame 60 may be coupled to the base 210.

[0134] At least a portion of the frame 60 may correspond to, face, or overlap with at least a portion of the frame 50 disposed on the sensor base 600 in the optical axis direction.

[0135] Frame 60 can be connected to frame 50. At least a portion of frame 60 can be connected to at least a portion of frame 50 disposed on sensor base 600. At least a portion of frame 60 can contact at least a portion of frame 50 disposed on sensor base 600. At least a portion of frame 60 can be coupled or attached to at least a portion of frame 50 disposed on sensor base 600 using an adhesive or thermally conductive adhesive. The adhesive can be epoxy resin or thermally conductive epoxy resin. Heat transferred from heat dissipation portion 805 to frame 50 can be transferred from frame 50 to frame 60 disposed on base 210 of lens moving device 100.

[0136] For example, at least a portion of the frame 60 may be recessed into the base 210, and at least another portion of the frame 60 may be exposed from the base 210. The frame 60 may be integrally formed with the base 210. For example, the frame 60 may be integrally formed with the base 210 by an insertion injection molding method. At least a portion of the frame 60 may be embedded in the base 210.

[0137] The frame 60 may include a heat-dissipating material with high thermal conductivity. For example, the thermal conductivity of the frame 60 may be greater than that of the base 210. For example, the base 210 may be formed by injection molding of a material such as resin or plastic. For example, the frame 60 may be formed of metal. The frame 60 may include openings 60A or hollow portions corresponding to, facing, or overlapping the opening 201 of the base 210. The opening 60A may be a through-hole formed through the frame 60.

[0138] For example, frame 60 may include graphite. For example, frame 60 may be a conductive component. In another embodiment, frame 60 may be a non-conductive component.

[0139] For example, frame 60 may include a graphite layer or graphite sheet. Frame 60 may alternatively be referred to as a "heat sink", "heat sink component", "heat sink frame", "metal component", "graphite component", "radiator" or "heat sink fin".

[0140] The frame 60 may include a body 24. The body 24 may alternatively be referred to as a "lower plate" or "plate". The body 24 may be disposed on the lower portion 64 of the base 210. The body 24 may be coupled to the lower portion 64 of the base 210. Referring to FIG4B, at least a portion 60B of the body 24 may be exposed or open from the base 210. The frame 60 may have a flat plate shape to increase the contact area with the circuit board 190. In another embodiment, the frame 60 may include irregular portions or bends.

[0141] Referring to FIG11D, at least a portion of the lower surface 60B of the body 24 may be exposed or open from the lower surface of the base 210. The upper surface of the body 24 may be recessed into the base 210. The area of ​​the lower surface 60B of the body 24 exposed from the lower surface of the base 210 (exposed area) may be configured to surround the opening 201 of the base 210. This is used to increase the exposed area of ​​the lower surface 60B of the body 24, thereby improving heat dissipation efficiency. In another embodiment, the lower surface 60B of the body 24 may include a plurality of exposed areas exposed from the lower surface of the base 210, and the plurality of exposed areas may be configured to be spaced apart from each other.

[0142] At least a portion 60B of the frame 60 exposed from the lower surface of the base 210 can be connected to the frame 50 disposed on the sensor base 600. At least a portion 60B of the frame 60 can contact the frame 50 disposed on the sensor base 600. At least a portion 60B of the frame 60 can be coupled or attached to the frame 50 disposed on the sensor base 600 using an adhesive or a thermally insulating adhesive. At least a portion 60B of the frame 60 can be connected to at least a portion of the upper plate 81A of the frame 50. At least a portion 60B of the frame 60 can contact the upper plate 81A of the frame 50. At least a portion 60B of the frame 60 can be coupled or attached to the upper plate 81A of the frame 50 using an adhesive or a thermally insulating adhesive.

[0143] Frame 60 may include a side plate 26 connected to body 24. The lower portion or lower end of side plate 26 may be connected to an edge of body 24. Side plate 26 may alternatively be referred to as an "extension". At least a portion of side plate 26 may be coupled to base 210. Side plate 26 may be disposed on side 65 of base 210. Side plate 26 may be coupled to side 65 of base 210. At least a portion of side plate 26 may be exposed or open from base 210. At least a portion of side plate 26 may be exposed or open from the outer surface of side 65 of base 210.

[0144] The number of side panels 26 can be one or more. For example, the frame 60 may include multiple side panels 26A to 26D. The multiple side panels 26A to 26D may correspond to multiple sides 65A to 65D of the base 210.

[0145] Multiple side plates 26A to 26D may be spaced apart from each other. At least a portion of the base 210 may be disposed between the spaced-apart side plates 26A to 26D. Therefore, the coupling between the base 210 and the side plates 26A to 26D can be enhanced. In another embodiment, at least two of the side plates 26A to 26D may be connected to or in contact with each other.

[0146] Each of the plurality of side plates 26A to 26D may be disposed on a corresponding one of the sides 65A to 65D of the base 210. At least a portion of each of the plurality of side plates 26A to 26D may be exposed or open from the outer surface of the corresponding one of the sides 65A to 65D of the base 210.

[0147] The side plate 26 may include an opening 8 corresponding to a seating portion 66 formed in the side portion 65 of the base 210. For example, the opening 8 may be a hole formed through the side plate 26. A first opening 8A may be formed in the first side plate 26A, a second opening 8B may be formed in the third side plate 26C, and a third opening 8C may be formed in the fourth side plate 26D.

[0148] The side plate 26 may include at least one escape portion 5A to avoid spatial interference with the coupling portion 144 of the base 210. For example, the escape portion 5A may be a recess formed through the side plate 26. However, in another embodiment, the escape portion 5A may be formed as a recess shape.

[0149] Frame 60 is described as a component separate from base 210. However, in another embodiment, frame 60 may be described as part of the construction of base 210, or base 210 may include frame 60.

[0150] The lens moving device 100 may include a heat dissipation member 40. The heat dissipation member 40 may be connected to at least one of the frame 60 or the frame 50.

[0151] The heat dissipation member 40 can be connected to the frame 60. The lens moving device 100 may include at least one heat dissipation member 40 disposed on the frame 60. At least a portion of the heat dissipation member 40 may be exposed from the cover member 300. The heat dissipation member 40 can be connected to the cover member 300. For example, the heat dissipation member 40 can be connected to the side plate 302 of the cover member 300.

[0152] The heat dissipation component 40 may include a heat dissipation material with high thermal conductivity. For example, the thermal conductivity of the heat dissipation component 40 may be higher than that of the base 210. The description of the material of the frame 60 may be applied directly or similarly to the heat dissipation component 40.

[0153] For example, the heat dissipation component 40 may include graphite. For example, the heat dissipation component 40 may be a conductive component. In another embodiment, the heat dissipation component 40 may be a non-conductive component. The heat dissipation component 40 may alternatively be referred to as a "heat sink," "heat bridge," "thermal conductive part," "heat dissipation section," or "heat strip."

[0154] The heat dissipation component 40 can be coupled to the frame 60 using an adhesive or a thermally conductive adhesive. For example, the heat dissipation component 40 can be coupled to the frame 60 using a thermally conductive epoxy resin. The heat dissipation component 40 can be coupled to the side plate 26 of the frame 60. For example, the heat dissipation component 40 can be disposed on a surface (e.g., a side surface) of the side plate 26 that is exposed or open from the base 210. One or more heat dissipation components 40 can be disposed on each of the side plates 26A to 26D.

[0155] For example, two heat dissipation components 40A and 40B can be disposed on the first side plate 26A. Heat dissipation components 40A and 40B can be disposed on opposite sides of the coil unit 230A. Two heat dissipation components 40C and 40D can be disposed on the third side plate 26C. Heat dissipation components 40C and 40D can be disposed on opposite sides of the coil unit 230B. At least one heat dissipation component 40G can be disposed on the fourth side plate 26D.

[0156] The heat dissipation components disposed on each of the side plates 26A to 26D may be the same number or different numbers. Furthermore, the heat dissipation components disposed on each of the side plates 26A to 26D may have the same size or area, or may have different sizes or areas. The number of heat dissipation components 40 disposed on each of the side plates 26A to 26D may be one, two, or more. According to another embodiment, the frame may include side plates on which no heat dissipation components 40 are disposed.

[0157] Referring to Figures 11A to 11D, the frame 60 is shown inserted into the base 210. However, in another embodiment, the frame 60 may be coupled to the base 210 using coupling members or adhesives. The frame 60 may be coupled, attached, or secured to at least one of the lower portion 64 or the side portion 65 of the base 210 using coupling members or adhesives. For example, the body 24 may be coupled, attached, or secured to the lower portion 64 of the base 210. The body 24 may be coupled, attached, or secured to the lower surface of the lower portion 64 of the base 210. The side plate 26 may be coupled, attached, or secured to the side portion 65 of the base 210. The side plate 26 may be coupled, attached, or secured to the outer surface of the side portion 65 of the base 210.

[0158] The heat dissipation member 40 may pass through at least a portion of the circuit board 190 and may protrude from the cover member 300. For example, the heat dissipation member 40 may pass through an opening 85 in the circuit board 190, and at least a portion of the heat dissipation member 40 may be disposed in a hole 3 in the cover member 300. The heat dissipation member 40 may protrude from or open through the hole 3 in the cover member 300 from the side plate 302 of the cover member 300. The heat dissipation member 40 may contact the cover member 300. For example, the heat dissipation member 40 may contact the side plate 302 of the cover member 300. In another embodiment, the heat dissipation member 40 may not contact the cover member 300.

[0159] In another embodiment, the cover member 300 may not include the hole 3, and the heat dissipation member 40 may contact the side plate 302 of the cover member 300. For example, the heat dissipation member 40 may contact the inner surface of the side plate 302. In yet another embodiment, some of the heat dissipation members may pass through the hole 3 in the side plate 302 of the cover member 300, and others may contact the inner surface of the side plate 302 of the cover member 300.

[0160] Heat transferred from frame 50 to frame 60 disposed on base 210 of lens moving device 100 can be transferred to heat dissipation member 40 and dissipated to the outside of cover member 300 by heat dissipation member 40.

[0161] In another embodiment where the cover member 300 does not include the hole 3 and the heat dissipation member 40 contacts the side plate 302 of the cover member 300, heat transferred from the frame 60 to the heat dissipation member 40 can be dissipated through the heat dissipation member 40 and the cover member 300.

[0162] The lens moving device 100 may include a circuit board 190. The circuit board 190 may be included in the fixing unit. The circuit board 190 may be disposed on or coupled to the base 210. At least a portion of the circuit board 190 may be connected to the frame 60.

[0163] Circuit board 190 may be disposed on side 65 of base 210. For example, circuit board 190 may be disposed on sides 65A, 65C and 65D of base 210. Circuit board 190 may include a first board 191, a second board 192 and a third board 193. For example, circuit board 190 may be coupled to side 65 of base 210.

[0164] The first plate 191 may be disposed on the first side 65A of the base 210. The second plate 192 may be disposed on the third side 65C of the base 210. The first plate 193 may be disposed on the fourth side 65D of the base 210. The circuit board 190 may include bent portions or flexed portions. For example, the circuit board 190 may include bent portions positioned between the first plate 191 and the second plate 192 and between the first plate 191 and the third plate 193.

[0165] Circuit board 190 may be disposed on or coupled to frame 60. Circuit board 190 may be disposed on at least a portion of frame 60. Circuit board 190 may be disposed on or coupled to side plate 26 of frame 60. For example, circuit board 190 may be disposed on the outer surface of side plate 26. Circuit board 190 may be disposed on at least a portion of frame 60 exposed from base 210. Circuit board 190 may be in contact with frame 60.

[0166] The first plate 191 to the third plate 193 can be disposed on the side plate 26 of the frame 60. Each of the first plate 191 to the third plate 193 can be disposed on or coupled to a corresponding one of the side plates 26A, 26C and 26D. In another embodiment, at least a portion of the circuit board 190 can be coupled to the side 65 of the base 210.

[0167] The circuit board 190 may include an end portion 91. The terminal portion 91 may include a plurality of terminals B1 to B7. The number of terminals in the terminal portion 91 may be two or more.

[0168] Circuit board 190 can be a printed circuit board or a flexible printed circuit board (FPCB).

[0169] Circuit board 190 can be electrically connected to circuit board 800. Terminal portion 91 of circuit board 190 can be electrically connected to a plurality of terminals 811 of circuit board 800 using solder or conductive adhesive. To facilitate electrical connection to terminals 811, circuit board 190 may include an extension 94 extending from one of the first plate 191 to the third plate 193 (e.g., 191). Terminal portion 91 may be formed on extension 94. A plurality of terminals B1 to B7 of terminal portion 91 may be arranged in a straight line at the lower end of extension 94.

[0170] The circuit board 190 may include at least one opening 85. For example, the opening 85 may be a hole formed through the circuit board 190. For example, the opening 85 may be located at a position corresponding to the heat sink 40, and the heat sink 40 may pass through the opening 85 of the circuit board 190. The opening 85 can prevent spatial interference between the heat sink 40 and the circuit board. Because the heat sink 40 passes through the opening 85, at least a portion of the heat sink 40 and the circuit board 190 can be arranged to overlap in the optical axis direction. Therefore, the length of the lens moving device 100 in the second or third direction can be reduced, and the size of the imaging device in the direction perpendicular to the optical axis can be reduced.

[0171] For example, the first plate 191 may include at least one opening 85A and 85B. For example, two openings 85A and 85B may be located on opposite sides of the coil unit 230A. The second plate 192 may include at least one opening 85C and 85D. For example, two openings 85C and 85D may be located on opposite sides of the coil unit 230B. The third plate 193 may include at least one opening 85E and 85F. For example, two openings 85E and 85F may be located on opposite sides of the coil 120.

[0172] The circuit board 190 may include at least one hole 59, which is coupled to at least one coupling portion 144 of the base 210.

[0173] In another embodiment, the circuit board 190 may not include the opening 85, and the heat dissipation member 40 may be disposed on the circuit board 190. For example, the heat dissipation member 40 may be disposed on the outer surface of the circuit board 190. The heat dissipation member 40 may be disposed on one surface of the side plate 302 of the circuit board 190 facing the cover member 300. The heat dissipation member 40 may be positioned relative to the coil 120.

[0174] The lens moving device 100 may include a pressing member 95 to press the ball member 52. The pressing member 95 enables the ball member 52 to come into close contact with the fixed unit (e.g., base 210) and the first moving unit (e.g., housing 140). Furthermore, the pressing member 95 can pull the first moving unit (e.g., housing 140) toward the fixed unit (e.g., base 210). The pressing member 95 may alternatively be referred to as a "contact member" or an "attraction member".

[0175] The pressing member 95 can be disposed on the fixing unit. For example, the pressing member 95 can be disposed on the base 210. For example, the pressing member 95 can be disposed on the circuit board 190. For example, the pressing member 95 can be disposed on the outer surface of the circuit board 190. The pressing member 95 can be coupled to the base 210 or the circuit board 190. The pressing member 95 can be disposed on or coupled to the fourth side 65D of the base 210. The pressing member 95 can be disposed on or coupled to the third plate 193. The pressing member 95 can be disposed between the side plate 302d of the cover member 300 and the side 65D of the base 210.

[0176] The pressing member 95 may correspond to, face, or overlap with the magnet 130 disposed on the first moving unit. For example, the pressing member 95 may face or overlap with the magnet 130 in a third direction (e.g., the x-axis direction).

[0177] The magnet 130 can apply an attractive force to the pressing member 95. For example, the attractive force can act between the pressing member 95 and the magnet 130 in a third direction (x-axis direction).

[0178] The pressing member 95 may be formed of a material attracted by a magnet. The pressing member 95 may be a magnetic body or may include a magnetic body. For example, the pressing member 75 may include a metal attracted by a magnet. Alternatively, for example, the pressing member 95 may include a magnetized metal. Alternatively, for example, the pressing member 95 may be a magnet. The pressing member 95 may be alternatively referred to as a "yoke," a "magnetic member," or a "metal plate."

[0179] The pressing member 95 can be disposed opposite to the coil 120 relative to the circuit board 190. Due to the attraction between the pressing member 95 and the magnet 130, the ball member 52 can be pressed by the housing 140 and the base 210, and contact can be maintained between the housing 140 and the ball member 52 and between the base 210 and the ball member 52.

[0180] The cover member 300, base 210, frame 40, heat dissipation member 40, and pressing member 95 may be included in the fixing unit. In addition, at least one of the components coupled to the base 210, such as coils 120 and 230, position sensors 170 and 240, and capacitors 19A and 19B, may be included in the fixing unit.

[0181] The first moving unit can be moved by the AF driving unit. The first moving unit can move in the optical axis direction. The first moving unit can be spaced apart from the fixed unit. The ball member 52 can be disposed between the first moving unit and the fixed unit. The first moving unit can be disposed on the fixed unit. The first moving unit can be disposed within the fixed unit. The first moving unit can be disposed within the fixed unit to be able to move along the optical axis direction.

[0182] The first moving unit may include a housing 140. The housing 140 may alternatively be referred to as a "retainer". The housing 140 may be disposed within the base 210. The housing 140 may be disposed outside the linear axis 110. The housing 140 may be disposed between the linear axis 110 and the base 210. The housing 140 may be disposed within the base 210 to be movable along the optical axis. The housing 140 may be movable during AF driving. The housing 140 may not be movable during OIS driving.

[0183] Referring to Figures 9A and 9B, housing 140 may include a cavity for receiving spool 110. Housing 140 may include an opening 401 through which light passes. For example, housing 140 may have a box shape including opening 401, and its lower portion may be open.

[0184] The housing 140 may include an upper portion 53 (or "upper plate"). The upper portion 53 may be disposed above the spool 110. The upper portion 53 may contact the ball member 510. The lower surface of the upper portion 53 may contact the ball member 510. An opening 401 may be formed in the upper portion 53 of the housing 140.

[0185] The housing 140 may include a side portion 55 (or "side plate") disposed below the upper portion 53. The side portion 55 may be connected to the upper portion 53. The side portion 55 may extend from the upper portion 53. The side portion 55 of the housing 140 may include: a first side portion 55A and a second side portion 55B, the first side portion 55A and the second side portion 55B being positioned relative to each other in a second direction (e.g., the y-axis direction), and may include a third side portion 55C and a fourth side portion 55D, the third side portion 55C and the fourth side portion 55D being positioned relative to each other in a third third direction (e.g., the x-axis direction).

[0186] A mounting portion 51 in which the magnet 130 is disposed may be formed in the side portion 55 of the housing 140. For example, the mounting portion 51 may be formed in the fourth side portion 55D of the housing 140. The mounting portion 51 may be a recess that is recessed into the side portion 55 of the housing 140.

[0187] Side portions 55A and 55C of the housing 140 may include through holes 28A and 28B at positions corresponding to the magnet units 25A and 25B. For example, at least a portion of each of the magnet units 25A and 25B may be positioned in a corresponding one of the through holes 28A and 28B in the side portions 55A and 55C. A portion of the spool 110 accommodating the magnet units 25A and 25B may be disposed in the through holes 28A and 28B. Due to the through holes 28A and 28B, spatial interference between the housing 140 and the spool can be avoided, and thus the size of the lens moving device 100 can be reduced.

[0188] The housing 140 may include an upper stop 145 disposed on the upper portion 53 of the housing 140. The upper stop 145 may be disposed on the upper portion 53 or the upper surface of the housing 140. The upper stop 145 may restrict the upward movement of the housing 140. When the housing 140 moves upward in the optical axis direction, the upper stop 145 may contact the upper plate 301 of the cover member 300. The upper stop 145 may include a plurality of protrusions. The upper stop 145 may be formed at each of the four corner regions of the upper surface of the upper portion 53 of the housing 140.

[0189] The housing 140 may include recesses 39 in which at least a portion of the ball members 52 is received. The number of recesses 39 may be the same as the number of ball members 52. For example, the recesses 39 may include recess 39A for receiving ball member 52A and recess 39B for receiving ball member 52B. In another embodiment, the number of recesses 39 may be one or more. Recesses 39A and 39B may be located on opposite sides of the magnet 130. The description of the shape of the recess 44 of the base 210 may be applied directly or similarly to the recesses 39 of the housing 140.

[0190] The housing 140 may include a lower stop 215. The lower stop 215 may be formed on the lower end or lower surface of the side portion 55 of the housing 140. The lower stop 215 may restrict downward movement of the housing 140. When the housing 140 moves downward in the optical axis direction, the lower stop 215 may contact a protrusion of the base 210 or the lower portion 64 of the base 210. The lower stop 215 may include multiple protrusions. The lower stop 215 may include four stops. The lower stop 215 may be formed at each of the four corner regions of the housing 140.

[0191] The housing 140 may include a coupling portion 9A for coupling to a cover 70, which will be described later. The coupling portion 9A may be disposed on a side 55 of the housing 140 and may include a recess in which a portion of the cover 70 is disposed or inserted. For example, the coupling portion 9A may be located at each of the four corner regions of the side 55 of the housing 140.

[0192] The coupling portion 72 of the cover 70 can be coupled to the coupling portion 9A of the housing 140 using an adhesive. In another embodiment, the cover 70 can be hooked to the housing 140. For example, the coupling portion 9A of the housing 140 may include a hook (not shown) or a protrusion, and the coupling portion 72 of the cover 70 may include a hole formed to engage with the hook.

[0193] Referring to FIG9C, the housing 140 may include a recess 38 in which at least a portion of the ball member 510 is accommodated. The recess 38 may be disposed in a region of the upper portion 53 of the housing 140 that corresponds to, faces, or overlaps with the ball member 510 in the optical axis direction. The recess 38 may be recessed into the lower surface of the upper portion 53 of the housing 140. For example, the housing 140 may include a protrusion 37 protruding from the lower surface of the upper portion 53 of the housing 140, and the recess 38 may be formed in the protrusion 37 of the housing 140. The protrusion 37 may prevent spatial separation between the ball member 510 and the housing 140 and the spool 110.

[0194] Referring to Figures 9A and 10A, the lens moving device 100 may include a reinforcing member 150. The first moving unit may include the reinforcing member 150. The reinforcing member 150 may be disposed on the housing 140. The reinforcing member 150 may be coupled to the housing 140. The reinforcing member 150 may be disposed on or coupled to the upper portion 53 of the housing 140.

[0195] At least a portion of the reinforcing member 150 may be inserted into or embedded in the housing 140. The reinforcing member 150 may be inserted into the housing 140 by an insertion injection molding process. In another embodiment, the reinforcing member 150 may be coupled to the upper part of the housing 140 using an adhesive or a coupling member.

[0196] At least a portion of the reinforcing member 150 may be exposed from the housing 140. At least another portion of the reinforcing member 150 may be embedded in the housing 140. The reinforcing member 150 may include a metal member. The reinforcing member 150 may alternatively be referred to as a "metal member" or a "coupler".

[0197] The reinforcing member 150 may include at least one region 150A to 150D that protrudes or opens from the housing 140 and is coupled to the support member 220. At least one region 150A to 150D may protrude from both the upper and lower surfaces of the housing 140. For example, the upper surface of at least one region 150A to 150D may protrude or open from the upper surface of the upper portion 53 of the housing 140. The lower surface of at least one region 150A to 150D may protrude or open from the lower surface of the upper portion 53 of the housing 140. The number of exposed regions of the reinforcing member 150 may be one or more. For example, the reinforcing member 150 may include four regions 150A to 150D. Each of the four regions 150A to 150D may be positioned adjacent to a corresponding corner region of the upper portion 53 of the housing 140.

[0198] The reinforcing member 150 may include a hole 153 formed to couple to one end (e.g., the upper end) of the support member 220. The hole 153 may be provided in at least one region 150A to 150D. The support member 220 may be spaced apart from the housing 210.

[0199] The reinforcing member 150 may comprise a material having higher rigidity than the housing 140 formed by injection molding of a material such as resin or plastic. Therefore, the durability of the housing 140 can be improved by the reinforcing member 150. The reinforcing member 150 may be directly coupled to the support member 220 using solder or adhesive, and may distribute stresses or forces applied to the support member 220 that supports the heavy lens.

[0200] The lens moving device 100 may include a pressing member 31 for applying pressure to the ball member 510. The first moving unit may include the pressing member 31. The pressing member 31 allows the ball member 510 to come into close contact with both the first and second moving units. For example, the pressing member 31 allows the ball member 510 to come into close contact with the spool 110 and the housing 210. Furthermore, the pressing member 31 can pull the second moving unit (e.g., the spool 110) toward the first moving unit (e.g., the housing 140). The pressing member 31 may alternatively be referred to as a "contact member" or an "attraction member".

[0201] The pressing member 31 may be disposed on the housing 140. The pressing member 31 may be coupled to the housing 140. At least a portion of the pressing member 31 may be embedded or inserted into the housing 140. At least a portion of the pressing member 31 may be configured to be invisible from the outside of the housing 140.

[0202] The pressing member 31 may be disposed on the upper part 53 of the housing 140. The pressing member 31 may be coupled to the upper part 53 of the housing 140. The pressing member 31 may be embedded or inserted into the upper part 53 of the housing 140.

[0203] The pressing member 31 may be formed of a material attracted by a magnet. The pressing member 31 may be a magnetic body or may include a magnetic body. For example, the pressing member 31 may include a metal attracted by a magnet. Alternatively, for example, the pressing member 31 may include a magnetized metal. Alternatively, for example, the pressing member 31 may be a magnet. The pressing member 31 may be alternatively referred to as a "yoke," a "magnetic member," or a "metal plate."

[0204] The pressing member 31 can be disposed on the magnet 25. The pressing member 31 can correspond to, face, or overlap with the magnet 25 in the optical axis direction. The pressing member 31 can pull the magnet 25 upward. An attractive force can act between the pressing member 31 and the magnet 25. The number of pressing members 31 can be one or more. Due to the attractive force between the pressing member 31 and the magnet 25, the ball member 510 can remain in contact with the upper part 53 of the housing 140 and the spool 110, and can stably support the spool 110.

[0205] The pressing member 31 may include a first pressing member 31A corresponding to, facing or overlapping with, the first magnet unit 25A, and a second pressing member 31B corresponding to, facing or overlapping with, the second magnet unit 25B. For example, the first pressing member 31A may be disposed in a first region of the upper part 53 corresponding to the first side part 55A of the housing 140, and the second pressing member 31B may be disposed in a second region of the upper part 53 corresponding to the third side part 55C of the housing 140.

[0206] For example, the first pressing member 31A can be positioned between the two exposed areas 150A and 150B of the reinforcing member 150. The second pressing member 31B can be positioned between the other two exposed areas 150B and 150C of the reinforcing member 150.

[0207] The pressing member 31 may be disposed on the reinforcing member 150. The pressing member 31 may face or overlap at least a portion of the reinforcing member 150 in the optical axis direction. In another embodiment, the pressing member 31 may be disposed below the reinforcing member 150.

[0208] The pressing member 31 may contact the reinforcing member 150. In another embodiment, the pressing member 31 may be spaced apart from the reinforcing member 150. The pressing member 31 may be formed as a member separate from the reinforcing member 150. In another embodiment, the pressing member 31 may be omitted. When the pressing member 31 is omitted, the pressing force applied to the ball member 510 may be generated by the supporting member 220 and the elastic member 160.

[0209] The reinforcing member 150 and the pressing member 31 are described as components separate from the housing 140. However, in another embodiment, at least one of the reinforcing member 150 or the pressing member 31 may be described as part of the construction of the housing 140, and the housing 140 may include at least one of the reinforcing member 150 or the pressing member 31.

[0210] The lens moving device 100 may include a ball member 52 disposed between the base 210 and the housing 140. The ball member 52 may be an "AF ball". The ball member 52 may overlap with the upper plate 301 of the cover member 300 in the optical axis direction. The ball member 52 may be disposed between the base 110 and the housing 210 in a direction perpendicular to the optical axis. The ball member 52 may contact the base 210 and the housing 140.

[0211] The ball member 52 can guide the movement of the housing 140 relative to the base 210 in the optical axis direction (z-axis direction). The ball member 52 can be supported by the base 210 and can be pressed inward from the housing 140. Therefore, the ball member 52 can remain in contact with the base 210 and the housing 140. A lubricant can be applied to the ball member 52. The ball member 52 can be formed of metal. Alternatively, the ball member 52 can be formed by injection molding. The number of ball members 52 can be one, two or more. For example, a plurality of ball members 52A and 52B can be disposed between one side of the base 210 (e.g., 65D) and one side of the housing 140 (e.g., 55D). For example, two ball members 52A and 52B can be disposed on opposite sides of the magnet 130. In another embodiment, the ball member 52 can be disposed on each of different sides of the base or different sides of the housing.

[0212] The spherical component 52 may include a plurality of spheres B1 to B3. The spheres B1 to B3 may be positioned or arranged along the optical axis. The spheres may have the same diameter. However, in another embodiment, at least one of the spheres may have a different diameter. In another embodiment, the number of spheres included in the spherical component 52 may be one, two, or more. The spherical component 52 can be used to reduce friction with the housing 140 and the base 210, allowing the housing 140 to move smoothly along the optical axis.

[0213] The second moving unit of the lens moving device 100 can move in a direction perpendicular to the optical axis. The second moving unit can be disposed on the first moving unit. The second moving unit can be disposed inside the first moving unit. The second moving unit can be disposed inside the fixed unit. The second moving unit can be disposed inside the first moving unit so that it can move in a direction perpendicular to the optical axis. The second moving unit can be disposed inside the fixed unit so that it can move in a direction perpendicular to the optical axis.

[0214] The lens moving device 100 may include a spool 110. The second moving unit may include the spool 110. The second moving unit may include components coupled to the spool 110 (e.g., magnet 25 and yoke 35).

[0215] The spool 110 may alternatively be referred to as a "lens holder" or "lens carrier". The spool 110 may be disposed in the housing 210. The spool 110 may be disposed in the base 210. The spool 110 may be disposed in the cover member 300. The spool 110 may be configured to move in a direction perpendicular to the optical axis. The spool 110 may be disposed in the housing 140 to be movable in a direction perpendicular to the optical axis. The spool 110 may be disposed in the base 210 to be movable in a direction perpendicular to the optical axis. The spool 110 may be disposed in the cover member 300 to be movable in a direction perpendicular to the optical axis.

[0216] The spool 110 may include an opening 101 coupled to the lens module 400. The opening 101 may be a hole or a hollow portion formed through the spool 110 in the optical axis direction.

[0217] The spool 110 may include sides 110A to 110D that correspond to, face, or overlap with the sides 55A to 55D of the housing 140 (or the sides 65A to 65D of the base 210).

[0218] The spool 110 may include a mounting portion 112 in which a magnet 25 is disposed or accommodated. The mounting portion 25 may be a recess. The mounting portion 25 may be a recessed portion in the outer surface of the spool 110.

[0219] For example, the spool 110 may include a first mounting portion in which a first magnet unit 25A is disposed and a second mounting portion 112B in which a second magnet unit 25B is disposed. The first mounting portion 112A may be disposed on a side portion 110A of the spool 110, and the second mounting portion 112B may be disposed on a third side portion 110C of the spool 110.

[0220] The spool 110 may include protrusions 310 projecting from its side surface (or outer surface). For example, the protrusions 310 may be located in corner regions or at corners of the spool 110. When viewed along the optical axis or from above, the protrusions 310 may have a polygonal shape (e.g., a quadrilateral shape) or a circular shape. Multiple protrusions 310 may be provided. For example, the spool 110 may include four protrusions 310 located at its four corners. The protrusions 310 may be positioned below the upper surface of the spool 110. The protrusions 310 may be positioned above the lower surface of the spool 110. The protrusions 310 may be positioned spaced apart from the upper and lower surfaces of the spool 110.

[0221] The protrusion 310 may include a hole 311 through which at least a portion of the support member 220 passes. The hole 311 may be a through hole formed in the protrusion 310 in the optical axis direction. For example, the number of holes 311 may be the same as the number of support members 220 provided at the various corners of the spindle 110. For example, two holes spaced apart from each other may be formed in the protrusion 310. In another embodiment, the protrusion 310 may include a single hole.

[0222] The lens moving device 110 may include a damper (not shown) disposed between the protrusion 310 of the spool 110 and the support member 220. The damper may contact or be attached to the protrusion 310 and the support member 220. The damper may be formed of a damping material such as silicone. The damper may absorb or mitigate vibrations of the spool 110 during OIS actuation and may suppress oscillations of the spool 110.

[0223] The lens moving device 100 may include a reinforcing member 320 disposed on a spool 110. The reinforcing member 320 may be coupled to the spool 110. At least a portion of the reinforcing member 320 may be inserted into or embedded in the spool 110. The reinforcing member 320 may be inserted into the spool 110 by an insertion injection molding process. In another embodiment, the reinforcing member 320 may be coupled to the outer peripheral surface of the spool 110 using an adhesive or coupling member.

[0224] At least a portion of the reinforcing member 320 may be exposed from the spool 110. At least another portion of the reinforcing member 320 may be embedded in the spool 110. The reinforcing member 320 may include a metal member. The reinforcing member 320 may alternatively be referred to as a "metal member," a "support," or a "coupler."

[0225] The reinforcing member 320 may include at least one region 32A to 32D that protrudes from or opens into the spool 110 and supports the ball member 520. At least one region 32A to 32D may be exposed from the upper surface of the spool 110. For example, the upper surface of at least one region 32A to 32D may be exposed from or open into the upper surface of the spool 110. The number of exposed regions of the reinforcing member 320 may be one or more. For example, the reinforcing member 320 may include four regions 32A to 32D. At least one region may be located in a corner region of the spool 110.

[0226] For example, at least one region 32A to 32D may be located below the upper surface of the spool 110. At least one region 32A to 32D may have a step relative to the upper surface of the spool 110 in the optical axis direction.

[0227] The lens moving device 100 may include a ball member 510. The ball member 510 may be disposed between a first moving unit and a second moving unit. The ball member 510 may be disposed between a housing 140 and a spool 110. The ball member 510 may be disposed between the upper portion 53 of the housing 140 and the spool 110. At least a portion of the ball member 510 may be disposed in a recess 38 of the housing 140. A lubricant, such as grease, may be applied to the ball member 510. The ball member 510 may be formed of metal. Alternatively, the ball member 510 may be formed by injection molding of a material such as resin or plastic.

[0228] The ball member 510 may be disposed below the reinforcing member 150 exposed from the bottom of the recess 38. At least a portion of the ball member 510 may contact the reinforcing member 150.

[0229] The ball member 510 may be disposed on the reinforcing member 320. The ball member 510 may be disposed in at least one region 32A to 32D of the reinforcing member 320. The ball member 510 may contact at least one region 32A to 32D.

[0230] The spherical member 510 may be disposed between the recess 38 of the housing 140 and the reinforcing member 320. The spherical member 510 may be disposed between at least a portion of the reinforcing member 150 and at least a portion of the reinforcing member 320. The spherical member 510 may be disposed between the lower surface of at least a portion of the reinforcing member 150 and the upper surface of at least a portion of the reinforcing member 320.

[0231] The ball member 510 may be configured to roll on the upper surface of at least one region 32A to 32D. The ball member 510 may be configured to roll on the lower surface of at least a portion of the reinforcing member 150.

[0232] The flatness of the surface on which the ball component 510 rolls can be easily controlled by the reinforcing members 150 and 320. In addition, the reinforcing members 150 and 320 can prevent the ball component 510 and / or the housing 140 and / or the spool 110 from being damaged or dented due to external impacts.

[0233] The ball member 510 can guide the movement of the spool 110 in the x-axis or y-axis direction. The ball member 510 can be formed as a single unit, where the x-axis ball and y-axis ball are indistinguishable and integrated into a single ball. When the ball member 510 is formed as a single unit, crosstalk between the x-axis and y-axis driving forces can be problematic. In this embodiment, crosstalk can be minimized by the support member 220. The ball member 510 can be positioned between the housing 140 and the spool 110 in the optical axis direction. The ball member 510 can connect the housing 140 to the spool 110. The ball member 510 can be supported by the upper portion 53 of the housing 140 and can be pressed down from below by the spool 110. Therefore, the ball member 510 can remain in contact with the upper portion 53 of the housing 140 and the spool 110.

[0234] A spherical component 510 can be disposed on the upper surface of the spool 110. The spherical component 510 can be disposed on the spool 110. The spherical component 510 can be disposed in a corner region of the upper surface of the spool 110. The spherical component 510 can be disposed in each of the four corner regions of the upper surface of the spool 110. The spherical component 510 can be disposed opposite to the image sensor 810 relative to the spool 110. The spherical component 510 can include multiple spheres. The multiple spheres can be disposed on a virtual plane perpendicular to the optical axis. The spherical component 510 can include four spheres. The four spheres can be disposed corresponding to the four corner regions of the upper surface of the spool 110. The spheres of the spherical component 510 can be respectively disposed in the four regions 32A to 32D of the reinforcing member 320.

[0235] In another embodiment, the reinforcing member 320 may be omitted. The reinforcing member 320 can be used to prevent damage to the spool 110 caused by impact, and the flatness of the surface on which the ball member 510 rolls can be easily controlled by the reinforcing member 320.

[0236] The reinforcing member 320 is described as a component separate from the spool 110. However, in another embodiment, the reinforcing member 320 may be described as part of the construction of the spool 110, and the spool 110 may include the reinforcing member 320.

[0237] The spool 110 may include a lateral stop 312. The lateral stop 312 may be formed on a side surface (or outer surface) of the spool 110. The lateral stop 312 may protrude from the side surface (or outer surface) of the spool 110. The lateral stop 312 may restrict the lateral movement of the spool 110. When the spool 110 moves in a direction perpendicular to the optical axis, the lateral stop 312 may contact the housing 140. Multiple lateral stops 312 may be provided. The lateral stop 312 may be provided on at least one of the sides 110A to 110D of the spool 110.

[0238] The lens moving device 100 may include a support member 220. The support member 220 can connect a first moving unit to a second moving unit. The support member 220 can support the spool 110 relative to the housing 140. The support member 220 can be an elastic member. For example, the support member 220 can be a wire, suspension wire, leaf spring, or coil spring. The support member 220 can be formed of a conductive material. The support member 220 can be formed of metal. The support member 220 can movably support the spool 310 relative to the housing 140.

[0239] Support member 220 may be coupled to reinforcing member 150. Support member 220 may be coupled to resilient member 160, which will be described later. One end (e.g., upper end) of support member 220 may be coupled to reinforcing member 150, and the other end (e.g., lower end) of support member 220 may be coupled to resilient member 160.

[0240] Using solder or conductive adhesive, one end of the support member 220 can be coupled to the reinforcing member 150, and the other end of the support member 220 can be coupled to the elastic member 160. One end of the support member 220 can pass through or be inserted into a hole 153 in the reinforcing member 150. The other end of the support member 220 can pass through or be inserted into a hole in the second coupling portion 162 of the elastic member 160.

[0241] The support member 220 can be configured to extend in a direction parallel to the optical axis. From the perspective of OIS driving, the housing 140 can correspond to the fixed unit, and the spool 110 can correspond to the moving unit. The lower end of the support member 220, coupled to the moving unit, can move in a direction perpendicular to the optical axis, relative to the upper end of the support member 220 coupled to the fixed unit. Furthermore, when the driving force is removed, the lower end of the support member 220 can return to the position corresponding to the upper end of the support member 220 in the optical axis direction.

[0242] The support member 220 may be disposed in the corner region of the housing 140 or the corner region of the upper part 53 of the housing 140. The support member 220 may include multiple lines. The multiple lines may be disposed in the corner region of the housing 140 or the corner region of the upper part 53 of the housing 140.

[0243] Two lines may be provided in one corner region of the housing 140. However, in another embodiment, one line may be provided in one corner region of the housing 140. For example, one or two lines may be provided in each of the four corner regions of the housing 140. In another embodiment, three or more lines may be provided in one corner region of the housing 140. The support member 220 may be provided on the opposite side of the first magnet unit 25A. For example, the first magnet unit 25A may overlap with the support member 220 in a third direction (e.g., the x-axis direction). Furthermore, the support member 220 may be provided on the opposite side of the second magnet unit 25B. The second magnet unit 25B may overlap with the support member 220 in a second direction (e.g., the y-axis direction).

[0244] The lens moving device 100 may include an elastic member 160 coupled to a spool 110. The elastic member 160 may connect the spool 110 to a support member 220. The elastic member 160 may be spaced apart from a fixing unit. The elastic member 160 may be spaced apart from a housing 140. The elastic member 160 may be spaced apart from a base 210. The elastic member 160 may be spaced apart from a circuit board 190. The elastic member 160 may be positioned in a direction perpendicular to the optical axis. The elastic member 160 may be positioned in a direction intersecting with the support member 220. The elastic member 160 may be conductive. The elastic member 160 may include metal. The elastic member 160 may include a leaf spring. In another embodiment, the elastic member 160 may be a wire.

[0245] The elastic member 160 may be disposed below the spool 110. The elastic member 160 may be coupled to the lower portion, lower end, or lower surface of the spool 110. The elastic member 160 may include a first coupling portion 161 coupled to the spool 110. For example, the first coupling portion 161 may include an annular body surrounding an opening 101 of the spool 110. In another embodiment, the first coupling portion 161 may include a plurality of portions spaced apart from each other. The first coupling portion 161 may be coupled to the lower portion, lower end, or lower surface of the spool 110. The first coupling portion 161 may include extensions 161A extending from the body. The first coupling portion 161 may include four extensions 161A extending to various corner regions of the spool 110.

[0246] The elastic member 160 may include a second coupling portion 162 coupled to the support member 220. The elastic member 160 may include a connecting portion 163 connecting the first coupling portion 161 to the second coupling portion 162. The connecting portion 163 may be an elastic portion, an extension, or a leg. The connecting portion 163 may be elastic. The connecting portion 163 may include a bend or flex at least once. The second coupling portion 162 may include a hole through which the support member 220 passes. The connecting portion 163 may connect an extension 161A of the first coupling portion 161 to the second coupling portion 162. The number of connecting portions disposed in a corner region of the spool 110 may be the same as the number of support members 220. For example, two connecting portions may be connected to one extension 161A. The second coupling portion 162 may be spaced apart from the spool 110, and at least a portion of the connecting portion 163 may be spaced apart from the spool 100.

[0247] The lens moving device 100 may include a cover 70. The cover 70 may be disposed below the housing 140. The cover 70 may be disposed below the spool 110. The cover 70 may be coupled to the housing 140. The cover 70 may function as an AF stop. The cover 70 may be coupled to a side 55 of the housing 140. The cover 70 may be coupled to a coupling portion 9A formed on the side 55 of the housing 140. The cover 70 may be fixed to the housing 210. The cover 70 may be disposed in the optical axis direction between the spool 110 and the base 210. The cover 70 may prevent the spool 110 from separating from the housing 140 due to impact or falling downwards from the housing 140. The cover 70 may alternatively be referred to as a "retainer," "lower cover," "protective member," or "anti-separation member."

[0248] Referring to FIG9A, the cover 70 may include a body 71 and a coupling portion 72 extending from the body 71. The body 71 may be disposed below the housing 140. The body 71 may be disposed below the spool 110. The body 71 may have a plate shape. The cover 70 may include an opening 73 formed in the body 71. The opening 73 may correspond to, face, or overlap with the opening 101 of the spool 110. The opening 73 may be a through hole or a hollow portion formed through the body 71.

[0249] The coupling portion 72 can extend from the body 71 toward the housing 140 and can be coupled to the housing 140. The coupling portion 72 can be coupled to the coupling portion 9A of the housing 140. The coupling portion 72 of the cover 70 and the coupling portion 9A of the housing 140 can be coupled using an adhesive or hooked together.

[0250] For OIS drive, the spool 110 and the cover 70 can be spaced apart from each other in the optical axis direction. When an external impact is applied, the spool 110 can move in the optical axis direction within the space between the spool 110 and the cover 70. The downward movement distance of the spool 110 may be limited by the cover 70. Therefore, excessive deformation of the elastic member 160 coupled to the spool 110 can be prevented. The cover 70 can prevent deformation of the elastic member 160. The deformation of the elastic member 160 can be controlled by the cover 70 to be equal to or less than the yield stress.

[0251] The lens moving device 100 may include a "driving unit". The driving unit can move the moving unit relative to the fixed unit.

[0252] The driving unit may include a first driving unit configured to move a first moving unit. The first driving unit can move the first moving unit in the optical axis direction. The first driving unit may include an AF driving unit. The lens module 400 can move together with the first moving unit and the second moving unit.

[0253] The driving unit may include a second driving unit configured to move the second moving unit. The second driving unit can move the second moving unit in a direction perpendicular to the optical axis. The second driving unit may include an OIS driving unit. The driving unit may include a coil and a magnet.

[0254] The first driving unit may include a coil 120 disposed on the fixed unit. The first driving unit may include a magnet 130 disposed on the first moving unit (e.g., housing 140). The coil 120 may be disposed on the base 210. In another embodiment, the magnet 130 may be disposed on the fixed unit, and the coil 120 may be disposed on the housing 140.

[0255] Magnet 130 may be disposed on side 55 of housing 210. For example, magnet 130 may be disposed on one side (e.g., 55D) of housing 140. Magnet 130 may be coupled to or fixed to housing 140. Magnet 130 may be disposed between side plate 302 of cover member 300 and side 55 of housing 140. For example, magnet 130 may be disposed in seat portion 51 of housing 140.

[0256] Magnet 130 may be a quadrupole magnet comprising two N poles and two S poles. Magnet 130 may include: a first magnet portion comprising N and S poles, a second magnet portion comprising S and N poles, and a partition wall positioned between the first and second magnet portions. The first and second magnet portions may be positioned relative to each other in the optical axis direction relative to the partition wall. The first and second magnets may be configured such that opposite polarities face each other in the optical axis direction. The partition wall may be a neutral zone.

[0257] For example, the outer surface of the upper part of the magnet 130 can be an N pole (or a S pole), and the inner surface of the upper part of the magnet 130 can be an S pole (or an N pole). The outer surface of the lower part of the magnet 130 can be an S pole (or an N pole), and the inner surface of the lower part of the magnet 130 can be an N pole (or a S pole).

[0258] In another embodiment, the magnet 130 may be a dipole magnet comprising an N pole and a S pole. For example, the N pole and S pole of the dipole magnet 130 may be positioned along the optical axis.

[0259] The lens moving device 100 may include a yoke 15A. The yoke 15A may be included in a first driving unit. The yoke 15A may be disposed on the first moving unit (e.g., housing 140). The yoke 15A may be coupled to the housing 140. The yoke 15A may be disposed between the magnet 130 and the housing 140. The yoke 15A may be positioned relative to the magnet 130 and the coil 120. For example, the yoke 15A may be disposed in a seating portion 51 of the housing 140. For example, at least a portion of the yoke 15A may be embedded or inserted into the housing 140. At least a portion of the yoke 15A may protrude from the housing 140. In another embodiment, the yoke 15A may be attached to the magnet 130, or may be coupled or attached to the housing 140 using an adhesive.

[0260] The yoke 15A can concentrate the magnetic force of the magnet 130 toward the coil 120. The yoke 15A can minimize the leakage of the magnetic flux of the magnet 130 in the opposite direction to the coil 120. The yoke 15A can increase the electromagnetic force between the magnet 130 and the coil 120, thereby enhancing the AF driving force.

[0261] Coil 120 can be disposed on a fixed unit. Coil 120 can be disposed on base 210. Coil 120 can be disposed on or mounted on circuit board 190. Coil 120 can be disposed on or mounted on a third plate 193 of circuit board 190. Coil 120 can be electrically connected to circuit board 190.

[0262] The coil 120 may have a ring shape and may be wound around a first axis, and the coil 120 may have a hollow portion. The first axis may be a straight line perpendicular to the optical axis and parallel to a third direction. Alternatively, the first axis may be perpendicular to the side 65D of the base 210 or the third plate 193. Alternatively, the first axis may be perpendicular to the side 65C of the base 210 or the second plate 192.

[0263] A drive signal for AF driving can be supplied to coil 120. Coil 120 can move the first moving unit (e.g., housing 140) in the optical axis direction through interaction with magnet 130. Coil 120 can generate electromagnetic force through electromagnetic interaction with magnet 130. Coil 120 can be positioned corresponding to, facing, or overlapping magnet 130. Coil 120 can face or overlap magnet 130 in a direction perpendicular to the optical axis (e.g., in the third direction).

[0264] The second driving unit may include a coil 230 and a magnet 25.

[0265] Magnet 25 can be disposed on a moving unit. The moving unit may include magnet 25. Magnet 25 can be disposed on spool 110. Magnet 25 can be coupled to or fixed to spool 110. Magnet 25 can be disposed on the side of spool 110. For example, magnet 25 can be disposed in the seat portion 112 of spool 110. Magnet 25 can be disposed in housing 210. Magnet 25 can be disposed between spool 110 and side plate 302 of cover member 300.

[0266] The magnet 250 may include a first magnet unit 25A and a second magnet unit 25B. The first magnet unit 25A and the second magnet unit 25B may be disposed on different sides (e.g., 110A and 110C) of the spindle 110. For example, the first magnet unit 25A and the second magnet unit 25B may be disposed on adjacent different sides (e.g., 110A and 110C) of the spindle 110.

[0267] For example, the line connecting the optical axis and the first magnet unit 25A and the line connecting the optical axis and the second magnet unit 25B can intersect each other. For example, the first magnet unit 25A and the optical axis can face each other in a second direction, and the second magnet unit 25B and the optical axis can face each other in a third direction.

[0268] The second magnet unit 25B can be positioned relative to the optical axis and the magnet 130. For example, the driving magnet may not be positioned relative to the optical axis and the first magnet unit 25B.

[0269] Each of the first magnet unit 25A and the second magnet unit 25B can be a dipole magnet comprising an N pole and a S pole. The outer surface of each magnet unit 25A and 25B facing the coil 230 can be an N pole (or an S pole), and the inner surface opposite the outer surface can be an S pole (or an N pole). For example, the N pole and S pole of each of the magnet units 25A and 25B can be arranged to face each other in a direction perpendicular to the optical axis. In another embodiment, the N pole and S pole of each of the magnet units 25A and 25B can be arranged to face each other in the optical axis direction.

[0270] In another embodiment, each of the first magnet unit 25A and the second magnet unit 25B may be a bipolar magnetized magnet having two N poles and two S poles. For example, each of the first magnet unit 25A and the second magnet unit 25B may include: a first magnet portion including N poles and S poles, a second magnet portion including S poles and N poles, and a partition wall positioned between the first magnet portion and the second magnet portion. The first magnet portion and the second magnet portion may be positioned relative to each other in a direction perpendicular to the optical axis with respect to the partition wall. The first magnet portion and the second magnet portion may be configured such that opposite polarities face each other in a direction perpendicular to the optical axis. The partition wall may be a neutral zone.

[0271] Coil 230 can be disposed on a fixed unit. Coil 230 can be disposed on a base 210. Coil 230 can be disposed on or mounted on a circuit board 190. The first coil unit 230A of coil 230 can be disposed on or mounted on the first plate 191 of circuit board 190. The second coil unit 230B can be disposed on or mounted on the second plate 192 of circuit board 190. Coil 230 can be electrically connected to circuit board 190.

[0272] The first coil unit 230A may have a ring shape and may be wound around a second axis. The first coil unit 230A may have a hollow portion. The second axis may be a straight line perpendicular to the optical axis and parallel to a second direction. Alternatively, the second axis may be perpendicular to the side portion 65A of the base 210 or the first plate 191. The second coil unit 230B may have a ring shape and may be wound around a first axis. The second coil unit 230B may have a hollow portion.

[0273] The first coil unit 230A may correspond to, face, or overlap with the first magnet unit 25A. The first coil unit 230A may face or overlap with the first magnet unit 25A in a direction perpendicular to the optical axis (e.g., in a second direction).

[0274] The second coil unit 230B can correspond to, face, or overlap with the second magnet unit 25B. The second coil unit 230B can face or overlap with the second magnet unit 25B in a direction perpendicular to the optical axis (e.g., in the third direction).

[0275] A first drive signal for OIS driving can be supplied to the first coil unit 230A, and a second drive signal for OIS driving can be supplied to the second coil unit 230B.

[0276] The coil 230 can move the second moving unit (e.g., spool 110) in a direction perpendicular to the optical axis through interaction with the magnet 25. The coil 230 can generate electromagnetic force through electromagnetic interaction with the magnet 25.

[0277] For example, the second moving unit (e.g., spool 110) can move in a third direction (x-axis direction) through the interaction between the first coil unit 230A and the first magnet unit 25A. For example, the second moving unit (e.g., spool 110) can move in a second direction through the interaction between the second coil unit 230B and the second magnet unit 25B.

[0278] The lens moving device 100 may include a yoke 35. A second driving unit may include a yoke 35. The yoke 35 may be disposed on the second moving unit (e.g., spool 110). The yoke 35 may be coupled to the spool 110.

[0279] A yoke 35 may be disposed between the spool 110 and the magnet 25. The yoke 35 may be positioned relative to the magnet 25 and the coil 230. The yoke 35 may be disposed within the seat portion 112 of the spool 110. For example, at least a portion of the yoke 35 may be embedded or inserted into the spool 110. At least a portion of the yoke 35 may protrude from the spool 110. In another embodiment, the yoke 35 may be attached to the magnet 25, or may be coupled or attached to the spool 110 using an adhesive.

[0280] The yoke 35 may include a first yoke 35A that corresponds to, faces or overlaps with the first magnet unit 25A and a second yoke 35B that corresponds to, faces or overlaps with the second magnet unit 25B. At least a portion of the first yoke 35A may be disposed in the first mounting portion 112A of the wire shaft 110, and at least a portion of the second yoke 35B may be disposed in the second mounting portion 112B of the wire shaft 110.

[0281] The yoke 35 can concentrate the magnetic force of the magnet 25 toward the coil 230. The yoke 35 can minimize the leakage of the magnetic flux of the magnet 330 in the opposite direction to the coil 230. The yoke 315 can increase the electromagnetic force between the magnet 35 and the coil 230, thereby enhancing the OIS driving force.

[0282] The lens moving device 100 may include a position sensor 170. The position sensor 170 may be included in the drive unit. The position sensor 170 can detect the displacement or position of the first moving unit in the optical axis direction. The position sensor 170 can detect the magnetic force of the magnet 130. The position sensor 170 may be configured to correspond to, face, or overlap with the magnet 130. The position sensor 170 may be disposed on a fixing unit, such as the base 210. The position sensor 170 may be disposed on or mounted on a circuit board 190. The position sensor 170 may be electrically connected to the circuit board 190. The position sensor 170 may be disposed on or mounted on a third plate 193. The position sensor 170 may overlap with at least a portion of the magnet 130 in a third direction. The position sensor 170 may be disposed between the side plate 302 of the cover member 300 and the magnet 130.

[0283] The position sensor 170 can be disposed within the hollow portion of the coil 120. In another embodiment, the position sensor 170 can be disposed outside the hollow portion of the coil 120.

[0284] Position sensor 170 can be implemented as a Hall sensor. For example, a Hall sensor can be a magnetic sensing element used for position detection. Position sensor 170 implemented as a Hall sensor may include two input terminals for inputting a power or drive signal and two output terminals for outputting an output signal. Controller 830 or 780 can use the output signal of position sensor 170 to adjust or control the drive signal of coil 120, and thus can perform autofocus feedback control.

[0285] In another embodiment, the position sensor 170 may be a driver IC including a Hall sensor. The position sensor 170 in the form of a driver IC can receive power signals VDD and VSS from controller 830 or 780 via data communication using a protocol (e.g., I2C communication), and can send clock signals SCL and data signals SDA to and receive clock signals SCL and data signals SDA from controller 830 or 780. In this case, the power signal VSS may be ground voltage or 0 V, and the power signal VDD may be a preset voltage for driving the driver IC, and may be a DC voltage and / or an AC voltage. The position sensor 170 in the form of a driver IC may include a first terminal to a sixth terminal. The first and second terminals of the position sensor 170 may be terminals for receiving power signals, the third terminal may be a terminal for sending and receiving clock signals, and the fourth terminal may be a terminal for sending and receiving data signals. Furthermore, the fifth and sixth terminals of the position sensor 170 may be terminals for supplying drive signals to coil 120. The position sensor 170 in the form of a driver IC can supply drive signals to coil 120 via circuit board 190. The controller 830 or 780 can use the data signals sent to and received from the position sensor 170 to adjust or control the drive signal of the coil 120, and thus can perform autofocus feedback control.

[0286] The lens moving device 100 may include a position sensor 240. The driving unit may also include a position sensor 240. The position sensor 240 can detect the displacement or position of the second moving unit (e.g., spool 110). The position sensor 240 can detect the displacement of the second moving unit (e.g., spool 110) in a direction perpendicular to the optical axis. The position sensor 240 can detect the magnetic field of the magnet 25. The position sensor 240 may correspond to, face, or overlap with the magnet 25.

[0287] Position sensor 240 can be disposed on a fixed unit, such as base 210. Position sensor 240 can be disposed on or mounted on circuit board 190. Position sensor 240 can be electrically connected to circuit board 190.

[0288] The position sensor 240 may include a first sensor 240A and a second sensor 240B.

[0289] The first sensor 240A can be set or mounted on the first board 191. The second sensor 240B can be set or mounted on the second board 192.

[0290] The first sensor 240A can detect the displacement of the second moving unit (e.g., spool 110) in the second direction (y-axis direction). The second sensor 240B can detect the displacement of the second moving unit (e.g., spool 110) in the third direction (x-axis direction).

[0291] The first sensor 240A can detect the displacement of the first magnet unit 25A. The first sensor 240A can detect the magnetic force of the first magnet unit 25A. The second sensor 240B can detect the displacement of the second magnet unit 25B. The second sensor 240B can detect the magnetic force of the second magnet unit 25B.

[0292] The first sensor 240A may correspond to, face, or overlap with the first magnet unit 25A. The second sensor 240B may correspond to, face, or overlap with the second magnet unit 25B. The first sensor 240A may overlap with at least a portion of the first magnet unit 25A in a second direction. The second sensor 240B may overlap with at least a portion of the second magnet unit 25B in a third direction. The first sensor 240A may be disposed between the side plate 302 of the cover member 300 and the first magnet unit 25A, and the second sensor 240B may be disposed between the side plate 302 and the second magnet unit 25B.

[0293] The first sensor 240A can be disposed in the hollow portion of the first coil unit 230A, and the second sensor 240B can be disposed in the hollow portion of the first coil unit 230B. In another embodiment, the first sensor 240A and the second sensor 240B can be disposed outside the hollow portions of the coil units 230A and 230B.

[0294] Each of the first sensor 240A and the second sensor 240B can be a Hall sensor. The description of the case where the position sensor 170 is implemented as a Hall sensor can be applied directly or similarly to the first sensor 240A and the second sensor 240B. The controller 830 or 780 can use the output signal of the first sensor 240A to regulate or control the drive signal supplied to the first coil unit 230A, and can use the output signal of the second sensor 240B to regulate or control the drive signal supplied to the second coil unit 230B. Therefore, OIS feedback control can be performed.

[0295] The description of the position sensor 170 being implemented as a driver IC including a Hall sensor can be directly or similarly applied to the first sensor 240A and the second sensor 240B. In this case, the controller 830 or 780 can use the data signals sent to and received from the first sensor 240A and the first sensor 240B to adjust or control the drive signal of the first coil unit 230A, and can use the data signals sent to and received from the second sensor 240B to adjust or control the drive signal of the second coil unit 230B. Therefore, OIS feedback control can be performed.

[0296] The lens moving device 100 may include capacitors 19A to 19C. In another embodiment, the lens moving device 100 may include at least one of capacitors 19A to 19C. Capacitors 19A, 19B, and 19C may be disposed on or mounted on circuit board 190. Capacitors 19A to 19C may be electrically connected to circuit board 190. Capacitor 19A may be disposed on or mounted on a first board 191, capacitor 19B may be disposed on or mounted on a second board 192, and capacitor 19C may be disposed on or mounted on a third board 193.

[0297] Capacitor 19A can be disposed in the hollow portion of the first coil unit 230A, capacitor 19B can be disposed in the hollow portion of the second coil unit 230B, and capacitor 19C can be disposed in the hollow portion of the coil 120. In another embodiment, capacitors 19A to 19C can be disposed outside the hollow portions of the coil 120 and the hollow portions of the coil units 230A and 230B.

[0298] Capacitor 19A can be connected to the two terminals of the first sensor 240A for supplying power or driving signals. Capacitor 19B can be connected to the two terminals of the second sensor 240B for supplying power or driving signals. Capacitor 19C can be connected to the two terminals of the position sensor 170 for supplying power or driving signals.

[0299] For example, capacitors 19A, 19B, and 19C can be connected in parallel to the two terminals of the power supply or drive signal for each of sensors 240A, 240B, and 170. Capacitors 19A to 19C can serve as smoothing circuits, removing ripple or high-frequency components from the power signal supplied externally to each of sensors 240A, 240B, and 170, and thus supplying a stable and constant power signal to each of sensors 240B, 240A, and 170.

[0300] Referring to Figure 4A, the thickness T1 of the portion of the base 210 positioned below the side plate 302 of the cover member 300 can be greater than the thickness T2 of the sensor base 600. T1 can be the length of the portion of the base 210 in the optical axis direction, and T2 can be the length of the sensor base 600 in the optical axis direction. The length of the imaging device 200 in the optical axis direction can be reduced by reducing the thickness T2 of the sensor base 600. Furthermore, by setting T1 to be greater than T2, the durability of the base 210 and the frame 60 can be improved, and deformation or breakage caused by impact can be prevented.

[0301] The AF operation of the lens moving device according to this embodiment will now be described.

[0302] In the initial position where no drive signal (e.g., drive current) is applied to coil 120, the first moving unit can be positioned on the upper surface of the lower portion 64 of base 210. When a drive signal is applied to coil 120, magnet 30 can move upward along the optical axis due to the electromagnetic interaction between coil 120 and magnet 130. In this case, the first moving unit, the second moving unit, and lens module 400 can move together with magnet 130. Therefore, the distance between lens module 400 and image sensor 810 can be changed, allowing adjustment of the focus of the image formed on image sensor 810 through lens module 400.

[0303] Simultaneously, during the movement of magnet 130, position sensor 170 can detect the strength of the magnetic field of magnet 130 to detect the displacement or amount of movement of magnet 130. An output signal (or data signal) corresponding to the displacement or amount of movement of magnet 130 detected by position sensor 170 can be sent to controller 830 or 780, and controller 830 or 780 can use the sent output signal (or data signal) to control the drive signal applied to coil 120. Therefore, automatic focusing feedback control can be performed.

[0304] Next, the optical image stabilization function of the lens moving device according to the embodiment will be described.

[0305] At the initial position where no drive signal (e.g., drive current) is applied to coil 230, the second moving unit can be positioned spaced apart from the first moving unit. When a drive signal is applied to at least one of the first coil unit 230A or the second coil unit 230B of coil 230, the second moving unit (e.g., spool 110 and magnet 25) can move in a direction perpendicular to the optical axis due to the interaction between the first coil unit 230A and the first magnet unit 25A and the interaction between the second coil unit 230B and the second magnet unit 25B.

[0306] When the second moving unit moves, the first sensor 240A can detect the strength of the magnetic field of the first magnet unit 25A, and can detect the displacement or movement of the first magnet unit 25A in a direction perpendicular to the optical axis (e.g., in the y-axis direction). The second sensor 240B can detect the strength of the magnetic field of the second magnet unit 25B, and can detect the displacement or movement of the second magnet unit 25B in a direction perpendicular to the optical axis (e.g., in the x-axis direction).

[0307] An output signal (or data signal) corresponding to the displacement or movement of magnet units 25A and 25B detected by the first sensor 240A and the second sensor 240B can be sent to a controller 830 or 780, and the controller 830 or 780 can use the sent output signal (or data signal) to control the drive signal applied to the first coil unit 230A and the second coil unit 230B. Therefore, optical image stabilization feedback control can be performed.

[0308] As the size of the image sensor and lens increases, the amount of heat generated by the image sensor may also increase. Furthermore, increased travel of the first moving unit for autofocus and the second moving unit for optical image stabilization may increase the amount of heat generated by the AF coil and the coil used for optical image stabilization. The resulting increase in temperature of the imaging device due to the image sensor and coils acting as heat sources may cause demagnetization of the AF drive magnet and the OIS drive magnet, and thus potentially lead to errors in the AF drive and OIS drive processes.

[0309] Furthermore, increased temperature in the camera device can cause variations in the output signals of the AF position sensor and OIS position sensor. Consequently, the accuracy and reliability of the AF drive and OIS drive may decrease. Additionally, increased controller temperature can lead to increased image sensor temperature, resulting in image loss, noise generation, reduced resolution, and quantitative and qualitative degradation of the image quality of the image sensor.

[0310] The embodiment provides a structure that can effectively dissipate the heat generated by the coils 120 and 230 and the image sensor 810, which are heat sources.

[0311] First, the heat generated by coils 120 and 230 can be transferred to circuit board 190 and to frame 60 in contact with circuit board 190, and the heat transferred to frame 60 can be dissipated to the outside of cover member 300 by heat dissipation member 40. In another embodiment where cover member 300 does not include hole 3 and heat dissipation member 40 contacts side plate 302 of cover member 300, the heat transferred from frame 60 to heat dissipation member 40 can be dissipated by heat dissipation member 40 and cover member 300.

[0312] Next, the heat generated by the image sensor 810 can be transferred to the frame 50 of the sensor base 600 via the heat sink 805 of the circuit board 800. The heat transferred from the heat sink 805 to the frame 50 can be transferred to the frame 60 provided on the base 210 of the lens moving device 100. The heat transferred to the frame 60 can be transferred to the heat dissipation member 40, and can be dissipated to the outside of the cover member 300 via the heat dissipation member 40.

[0313] In another embodiment where the cover member 300 does not include the hole 3 and the heat dissipation member 40 contacts the side plate 302 of the cover member 300, heat transferred from the frame 60 to the heat dissipation member 40 can be dissipated through the cover member 300.

[0314] In the implementation, as described above, the heat generated by the coils 120 and 230 and the image sensor 810, which are heat sources, can be effectively dissipated, and excessive temperature rise of the lens moving device 100 and the imaging device 200 can be prevented or suppressed. Therefore, in the implementation, image loss and quantitative and qualitative degradation of the image quality of the image sensor may occur due to the heat generated by the coils and the image sensor.

[0315] Furthermore, in this embodiment, demagnetization of the drive magnet caused by heat generated by the coil and image sensor can be suppressed, and a decrease in the accuracy and reliability of the position sensors 170 and 240 can be prevented. Therefore, this embodiment can improve the reliability of autofocus operation and optical image stabilization operation.

[0316] Figure 14A is a first perspective view of a lens moving device according to another embodiment, and Figure 14B is a second perspective view of the lens moving device shown in Figure 14A. The embodiments shown in Figures 14A and 14B may include a heat dissipation member 41, instead of... Figure 7 The lens moving device 100 shown includes a heat dissipation member 40. That is, the heat dissipation member 41 can be... Figure 7 A modified embodiment of the heat dissipation component 40 shown.

[0317] A heat dissipation component 41 may be disposed on a circuit board 190. The heat dissipation component 41 may be connected to the circuit board 190. The heat dissipation component 41 may be in contact with the circuit board 190. The heat dissipation component 41 may be positioned relative to the circuit board 190 and opposite to the coils 120 and 230. The heat dissipation component 41 may be disposed on a second surface of the circuit board 190, which faces a first surface of the circuit board 190 on which the coils 120 and 230 are disposed. The heat dissipation component 40 may include a plurality of heat dissipation components 41A to 41D. In another embodiment, the lens moving device may include at least one of a plurality of heat dissipation components. The description of the materials and functions of the heat dissipation component 40 may be applied directly or similarly to the heat dissipation component 41.

[0318] The lens moving device may include a heat dissipation member 41A disposed on the first plate 191. The heat dissipation member 41A may be connected to or in contact with the first plate 191. The heat dissipation member 41A may be positioned above the extension 94. The heat dissipation member 41A may be positioned above the terminal portion 91. For example, the heat dissipation member 41A may face or overlap with the first coil unit 230A in a direction perpendicular to the optical axis, and be oriented from the optical axis toward the first coil unit 230A. At least a portion of the heat dissipation member 41A may overlap with at least a portion of the first coil unit 230A in a direction in which the first magnet unit 25A and the first coil unit 230A face each other. At least a portion of the heat dissipation member 41A may overlap with at least a portion of the first coil unit 230A in a second direction. At least a portion of the heat dissipation member 41A may face or overlap with the first sensor 240A. At least a portion of the heat dissipation member 41A may face or overlap with the capacitor 19A.

[0319] In the embodiment shown in Figure 14A, the heat dissipation component 41A can be arranged to overlap with the first coil unit 230A and can have an increased area, thereby improving heat dissipation efficiency and performance. Furthermore, since the heat dissipation component 41A overlaps with the first sensor 240A, the heat generated by the first sensor 230A can be effectively dissipated.

[0320] The lens moving device may include a heat dissipation member 41B disposed on the second plate 192. The heat dissipation member 41B may be connected to or in contact with the second plate 192. The heat dissipation member 41B may face or overlap with the second coil unit 230B in a direction perpendicular to the optical axis, and be oriented from the optical axis toward the second coil unit 230B. At least a portion of the heat dissipation member 41B may overlap with at least a portion of the second coil unit 230B in a direction in which the second magnet unit 25B and the second coil unit 230B face each other. At least a portion of the heat dissipation member 41B may overlap with at least a portion of the second coil unit 230B in a second direction. At least a portion of the heat dissipation member 41B may face or overlap with the second sensor 240B. At least a portion of the heat dissipation member 41B may face or overlap with the capacitor 19B.

[0321] In the embodiment shown in Figure 14A, the heat dissipation component 41B can be arranged to overlap with the second coil unit 230B and can have an increased area, thereby improving heat dissipation efficiency and performance. Furthermore, since the heat dissipation component 41B overlaps with the second sensor 240B, the heat generated by the second sensor 230B can be effectively dissipated.

[0322] The lens moving device may include a heat dissipation member 41C disposed on a third plate 192. The heat dissipation member 41C may be disposed on a pressing member 95. The heat dissipation member 41C may be connected to or in contact with the pressing member 95. The heat dissipation member 41C may face or overlap with the coil 120 in a direction perpendicular to the optical axis and be oriented from the optical axis toward the coil 120. At least a portion of the heat dissipation member 41C may overlap with at least a portion of the coil 120 in a direction in which the magnet 130 and the coil 120 face each other. At least a portion of the heat dissipation member 41C may overlap with at least a portion of the coil 120 in a third-order direction. At least a portion of the heat dissipation member 41C may face or overlap with the position sensor 170. At least a portion of the heat dissipation member 41C may face or overlap with the capacitor 19C. In the embodiment shown in FIG. 14A, the heat dissipation member 41C may be configured to overlap with the coil 120 and may have an increased area, thereby improving heat dissipation efficiency and performance. Furthermore, since the heat dissipation component 41C overlaps with the position sensor 170, the heat generated by the position sensor 170 can be effectively dissipated.

[0323] The lens moving device may include a heat dissipation member 41D disposed on the base 210. A heat dissipation member 41C may be disposed on the third side portion 65C of the base 210. The heat dissipation member 41C may be disposed on the outer surface of the third side portion 65C of the base 210. The heat dissipation member 41D may be connected to or in contact with the third side portion 65C of the base 210. The heat dissipation member 41D may be disposed in or inserted into a hole 3G in the cover member 300, and may protrude from the cover member 300.

[0324] Figure 15 This is an exploded perspective view of the camera device 200-1 according to another embodiment. Figure 16 yes Figure 15 An exploded perspective view of the mounting unit and filter 610 of the camera device 200-1 shown. Figure 17 yes Figure 15 The coupling diagram of the fixed unit shown is as follows. Figure 18 yes Figure 15 Bottom perspective view of the fixed unit shown. Figure 19 yes Figure 15 The coupling diagram of the fixing unit and filter 610 shown in Figure 20C is... Figure 15 The camera device 200-1 shown is along Figure 2 Figure 20B is a cross-sectional view taken in the direction AF. Figure 15 The camera device 200-1 shown is along Figure 2 The cross-sectional view taken in the direction CD, Figure 20C is Figure 15 The camera device 200-1 shown is along Figure 2 The cross-sectional view taken in the direction EF, and Figure 20D is... Figure 15 The camera device 200-1 shown is along Figure 2 A cross-sectional view taken along the direction GH in the middle. Figures 15 to 2 In 0D, with Figures 1 to 1 In Figure 4, the same reference numerals indicate the same parts, and descriptions of the same parts will be omitted.

[0325] Reference Figures 15 to 2 The 0D camera device 200-1 may include a lens module 400, a lens moving device 100-1, a filter 610, a circuit board 800, and an image sensor 810. The lens moving device 100-1 may include a fixing unit 20-1 and a moving unit 10.

[0326] Reference Figure 16Frame 60-1 may be a modified embodiment of frame 60 shown in FIG. 11A. Frame 60-1 may include opening 60B. Frame 60-1 may include side plates 126. Side plates 126 may include a plurality of side plates 126A to 126D corresponding to the sides of base 210-1. Side plates 126A to 126D may be connected to each other. An escape portion 127 (e.g., a recess) may be formed in the first side plate 126A to avoid spatial interference with the extension 94 of circuit board 190. In another embodiment, side plates 126A to 126D may be spaced apart from each other. The description of base 210 may be applied directly or similarly to base 210-1.

[0327] Frame 60-1 may have a structure that inserts into base 210-1. In another embodiment, frame 60-1 may be coupled to base 210-1 using coupling members or adhesives. For example, frame 60-1 may be coupled, attached, or fixed to at least one of the lower surface or side surface of base 210 using coupling members or adhesives. For example, frame 60-1 may include a first portion disposed on or coupled to the lower surface of base 210-1 and a second portion disposed on side 65 of base 210-1. Furthermore, frame 60-1 may also include a third portion connecting the first portion to the second portion.

[0328] The camera device 200-1 may include a heat dissipation member 45 disposed on a circuit board 190. The heat dissipation member 45 may be connected to the circuit board 190. The heat dissipation member 45 may be in contact with the circuit board 190. The heat dissipation member 45 may be positioned relative to the circuit board 190 and opposite to the coils 120 and 230. The heat dissipation member 45 may be disposed on a second surface of the circuit board 190, which faces a first surface of the circuit board 190 on which the coils 120 and 130 are disposed. The heat dissipation member 45 may include a plurality of heat dissipation members 45A to 45D. In another embodiment, the lens moving device may include at least one of the plurality of heat dissipation members.

[0329] The descriptions of the heat dissipation components 41A to 41D shown in Figures 14A and 14B can be directly or similarly applied to... Figure 16 The heat dissipation structures shown are 45A to 45D.

[0330] In another embodiment, the lens moving device 200-1 may include at least one of the heat dissipation members 40 shown in FIG8A and FIG8B, instead of the heat dissipation member 45.

[0331] The description of the material and function of heat dissipation component 40 can be directly or similarly applied to heat dissipation component 41.

[0332] exist Figures 15 to 2In the embodiment shown in 0D, the sensor base 600 shown in FIG4A can be omitted, and the filter 610 can be disposed on the base 210 of the lens moving device 100.

[0333] Reference Figures 17 to 19 The frame 60-1 may include a portion 126E disposed on the lower surface of the base 210-1. The frame 60-1 may include an area 126E exposed from the lower surface of the base 210-1. The base 210-1 may include a recess 218 formed in the lower surface of the base 210-1 to avoid spatial interference with the image sensor 810. The recess 218 may be recessed into the lower surface of the sensor base 600.

[0334] Filter 610 can be connected to base 210. Filter 610 can be coupled to or attached to base 210-1. Filter 610 can be disposed on or coupled to the lower surface of base 210-1. Base 210-1 may include a seating portion 219 in which filter 610 is disposed or seated. Sealing portion 219 may be a recess in the lower surface of base 210 (210-1). Sealing portion 219 may include a bottom surface 219A and a side surface 219B. For example, seating portion 219 may be recessed in the bottom surface of recess 218 of base 210-1. Sealing portion 219 may be formed in the bottom surface of recess 218 of base 210-1. An opening 201 may be formed in the bottom surface 219A of seating portion 219. The filter 610 can be coupled to the seat of the base 210-1 using an adhesive.

[0335] exist Figures 15 to 2 In the embodiment shown in 0D, since the sensor base 600 shown in FIG4A is omitted, the base 210-1 can be disposed on the circuit board 800. The base 210-1 can be connected to the circuit board 800. The frame 60-1 can be connected to the circuit board 800. The frame 60-1 can contact the circuit board 800. The exposed area 126E of the frame 60-1 can contact the circuit board 800.

[0336] The base 210-1 can be connected to the heat sink 805 of the circuit board 800. The frame 60-1 can be connected to the heat sink 805 of the circuit board 800. The frame 60-1 can contact the heat sink 805 of the circuit board 800. The exposed area 126E of the frame 60-1 can contact the heat sink 805 of the circuit board 800.

[0337] Figures 15 to 2The heat transfer path in the embodiment shown in 0D is as follows. The heat generated by the image sensor 810 can be transferred to the frame 60-1 of the base 210-1 through the heat dissipation part 805 of the circuit board 800. The heat transferred from the heat dissipation part 805 to the frame 60-1 can be transferred to the heat dissipation members 40 and 45, and can be dissipated to the outside of the cover member 300 through the heat dissipation members 40 and 45.

[0338] Figure 21 This is a cross-sectional view of a lens imaging device 200-2 according to yet another embodiment.

[0339] Reference Figure 21 The camera device 200-2 may include a lens moving device 100-3, a lens module 400, a sensor base 1600, a heat dissipation member 1601 disposed on the sensor base 1600, a circuit board 800, and an image sensor 810. The camera device 200-2 may include an adhesive 1612 disposed between the sensor base 1600 and the circuit board 800 to couple the sensor base 1600 to the base 1210. The adhesive 1612 may be epoxy resin or thermally conductive epoxy resin.

[0340] The camera device 200-2 may include a filter 610 disposed on the sensor base 1600.

[0341] The lens moving device 100-3 may include a cover member 1300, a housing 1140 disposed in the cover member 1300, a spool 1110 disposed in the housing 1140 for movement in the optical axis direction, a base 1210 disposed below the housing 140, a heat dissipation member 1211 disposed on the base 110, and a heat dissipation member 1401 disposed on the housing 140. The description of the material of the frame 60 can be applied directly or similarly to the heat dissipation members 1211 and 1401.

[0342] The lens moving device 100-2 may further include a coil 1120 and a magnet 1130, which move the spool 1110 in the optical axis direction. For example, the coil 1120 may be disposed on the spool 1110, and the magnet 1130 may be disposed on the housing 1140. In another embodiment, the coil may be disposed on the housing 1140, and the magnet may be disposed on the spool 1110.

[0343] The lens moving device 100-2 may include an upper elastic member 1150, which is coupled to the upper part or upper surface of the spool 1110 and to the upper part or upper surface of the housing. The lens moving device 100-2 may include a lower elastic member 1160, which is coupled to the lower part or lower surface of the spool 1110 and to the lower part or lower surface of the housing.

[0344] The heat dissipation member 1211 may be coupled to the base 210. At least a portion of the heat dissipation member 1211 may be embedded or inserted into the base 210. In another embodiment, the heat dissipation member 1211 may be attached or coupled to the base 210 using an adhesive.

[0345] The heat dissipation component 1401 may be coupled to the housing 140. At least a portion of the heat dissipation component 1401 may be embedded or inserted into the housing 1140. In another embodiment, the heat dissipation component 1401 may be attached or coupled to the housing 1140 using an adhesive.

[0346] The sensor base 1600 can be disposed between the lens moving device 100-3 and the circuit board 800. The sensor base 1600 can be disposed on the circuit board 800. The sensor base 1600 can be disposed below the base 1210. The sensor base 1600 can be coupled to the circuit board 800. The sensor base 1600 can be attached to the circuit board 800 using adhesive or thermally conductive adhesive.

[0347] Heat dissipation component 1601 may be connected to or in contact with heat dissipation portion 801 of circuit board 800. Heat dissipation component 1601 may be connected to or in contact with heat dissipation component 1211. Heat dissipation component 1211 may be connected to or in contact with heat dissipation component 1401. Heat dissipation component 1401 may be exposed outside cover component 1300. For example, heat dissipation component 1401 may pass through cover component 1300 and may be exposed from cover component 1300. Cover component 1300 may include an opening for exposing heat dissipation component 1401. Heat dissipation component 1401 may be connected to or in contact with cover component 1300. In another embodiment, heat dissipation component 1401 may not be exposed from cover component 1300 and may be connected to or in contact with side plate 301 of cover component 1300.

[0348] The heat generated by the image sensor 810 can be transferred to the heat dissipation member 1601 of the sensor base 1600 through the heat dissipation part 805 of the circuit board 800. Then, the heat can be dissipated to the outside of the cover member 300 through the heat dissipation member 1601 of the sensor base 1600, the heat dissipation member 1211 of the base 1210 and the heat dissipation member 1401 of the housing 1140.

[0349] Figure 22 This is a cross-sectional view of a camera device according to yet another embodiment.

[0350] Figure 22 The camera device shown may be a modified embodiment of the camera device 200 shown in FIG4A.

[0351] Reference Figure 22 The circuit board 800A may include an opening 807. For example, the opening 807 may be a through-hole or hollow portion formed through the circuit board 800A (e.g., the first region 801). The opening 807 may expose the image sensor 810. The opening 807 may expose at least a portion of the heat dissipation member 380.

[0352] At least a portion of the image sensor 810 may be disposed in the opening 807 of the circuit board 800A. Figure 22 The imaging device shown may include a heat sink 380 disposed below the circuit board 800A. An image sensor 810 may be disposed on, attached to, or coupled to the heat sink 380. The image sensor 810 may be disposed on, attached to, or coupled to at least a portion of the heat sink 380 exposed by the opening 807.

[0353] The heat dissipation component 380 may include a metal. The heat dissipation component 380 may be formed of a metal having high thermal conductivity and high heat dissipation efficiency. For example, the heat dissipation component 380 may include at least one of SUS, aluminum, nickel, phosphorus, bronze, or copper.

[0354] The heat dissipation component 380 may include a body 381 disposed below the circuit board 800A and a protrusion 382 (or protruding area) protruding from the body 381 to be disposed in an opening 807 of the circuit board 800A.

[0355] Image sensor 810 may be disposed on, coupled to, or fixed to protrusion 382. For example, image sensor 810 may be disposed on, coupled to, or attached to the upper surface of protrusion 382. For example, the upper surface of protrusion 382 may be positioned below the upper surface of circuit board 800A. In another embodiment, the upper surface of protrusion 382 may be positioned at the same height as the upper surface of circuit board 800A or at a higher position than the upper surface of circuit board 800A.

[0356] The heat dissipation component 380 can stably support the circuit board 800A and can also be used as a reinforcing component to suppress damage to the circuit board 800B caused by external impacts or contact. The heat dissipation component 380 may alternatively be referred to as a "reinforcing component".

[0357] Figure 22 The descriptions of the circuit board 800A, heat sink 380, and image sensor 810 shown can be directly or similarly applied to... Figure 15 The embodiment 200-1 shown is illustrated.

[0358] also, Figure 22 The descriptions of the circuit board 800A, heat sink 380, and image sensor 810 shown can also be applied directly or similarly to... Figure 21 The embodiment shown is 200-2.

[0359] Furthermore, for the purpose of forming an image of an object existing in space by utilizing the properties of light such as reflection, refraction, absorption, interference, and diffraction, for the purpose of improving visibility, for the purpose of using a lens to record and reproduce an image, or for the purpose of optical measurement or image propagation or transmission, the imaging device according to the embodiment may be included in an optical instrument.

[0360] For example, the optical instrument according to the embodiment may be a cellular phone, mobile phone, smartphone, portable terminal, portable smart device, digital camera, laptop computer, digital broadcast terminal, personal digital assistant (PDA), portable multimedia player (PMP), navigation device, etc., but is not limited thereto, and may also be any device used to capture images or pictures.

[0361] Figure 23 This is a perspective view of the optical instrument 200A according to the embodiment, and Figure 24 yes Figure 23 The diagram shows the configuration of the optical instrument 200A.

[0362] Reference Figure 23 and Figure 24 The optical instrument 200A may include a main body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory 760, an interface unit 770, a controller 780, and a power supply unit 790.

[0363] Figure 23 The body 850 shown may have a strip shape, but is not limited thereto, and may be any of a variety of types such as sliding, folding, swinging or turning, in which two or more sub-bodies are coupled to be able to move relative to each other.

[0364] The main body 850 may include a shell (outer shell, housing, cover, etc.) defining its appearance. In the example, the main body 850 may be divided into a front shell 851 and a rear shell 852. Various electronic components of the terminal may be installed in the space defined between the front shell 851 and the rear shell 852.

[0365] The wireless communication unit 710 may include one or more modules capable of wireless communication between the optical instrument 200A and the wireless communication system, or between the optical instrument 200A and the network in which the optical instrument 200A resides. In an example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near-field communication module 714, and a location information module 715.

[0366] The audio / video (A / V) input unit (720) is used to input audio signals or video signals and may include a camera device 721 and a microphone 722.

[0367] The camera device 721 may include a camera device apparatus according to the embodiment.

[0368] The sensing unit 740 can sense the current state of the optical instrument 200A, such as whether the optical instrument 200A is on or off, its position, whether a user touch is present or absent, its orientation, or its acceleration / deceleration. The sensing unit 740 can also generate sensing signals to control the operation of the optical instrument 200A. For example, when the optical instrument 200A is a slider phone, it can detect whether the slider phone is on or off. Additionally, the sensing unit 740 is used to sense whether power is supplied from the power supply unit 790 or whether the interface unit 770 is coupled to an external device.

[0369] The input / output unit 750 is used to generate visual, auditory, or tactile inputs or outputs. The input / output unit 750 can generate input data to control the operation of the optical instrument 200A, and can display the information processed in the optical instrument 200A.

[0370] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 can generate input data in response to input to the keyboard.

[0371] Display module 751 may include a plurality of pixels, the colors of which change in response to electrical signals. In the example, display module 751 may include at least one of a liquid crystal display, a thin-film transistor liquid crystal display, an organic light-emitting diode, a flexible display, or a 3D display.

[0372] The audio output module 752 can output audio data received from the wireless communication unit 710 in call signal receiving mode, call mode, recording mode, voice recognition mode or broadcast receiving mode, or it can output audio data stored in the memory 760.

[0373] The touchscreen panel 753 can convert the capacitance change caused by the user touching a specific area of ​​the touchscreen into an electrical input signal.

[0374] The memory 760 can store programs for processing and control of the controller 780, and can temporarily store input / output data (e.g., phone books, messages, audio, still images, pictures, and moving images). For example, the memory 760 can store images captured by the camera device 721, such as pictures or moving images.

[0375] Interface unit 770 serves as a channel for connection between optical instrument 200A and external devices. Interface unit 770 can receive data or power from external devices and can transmit data or power to corresponding components within optical instrument 200A, or can transmit data from within optical instrument 200A to external devices. For example, interface unit 770 may include a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting devices with identification modules, an audio input / output (I / O) port, a video input / output port, and a headphone port.

[0376] The controller 780 can control the overall operation of the optical instrument 200A. For example, the controller 780 can perform control and processing related to voice calls, data communications, and video calls.

[0377] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be located within the controller 780 or may be located separately from the controller 780.

[0378] The controller 780 can perform pattern recognition processing, through which handwriting or drawing input to the touch screen is perceived as characters or images.

[0379] The power supply unit 790 can supply the power required to operate the corresponding components when receiving external or internal power under the control of the controller 780.

[0380] The features, structures, and effects described above in the embodiments are included in at least one embodiment of this disclosure, but are not necessarily limited to only one embodiment. Furthermore, the features, structures, and effects exemplified in the respective embodiments can be combined with other embodiments or modified by those skilled in the art. Therefore, anything related to such combinations and modifications should be interpreted as falling within the scope of this disclosure. [Industrial Applicability]

[0381] The implementation can be applied to lens moving devices, camera devices, and optical instruments that can improve the dissipation of heat generated by heat sources such as coils and image sensors.

Claims

1. A lens moving device, comprising: Cover components; A fixing unit, the fixing unit comprising a base coupled to the cover member and a coil disposed on the base; A moving unit, the moving unit including a magnet facing the coil, the moving unit being configured to move by the interaction between the magnet and the coil; A first heat dissipation component is disposed on the base; as well as A second heat dissipation component is connected to the first heat dissipation component and protrudes from the cover component.

2. The lens moving device according to claim 1, wherein, The fixing unit includes a circuit board disposed on the base. The coil is disposed on the circuit board, and At least a portion of the circuit board is connected to the first heat dissipation component.

3. The lens moving device according to claim 1, wherein, The first heat dissipation component is exposed from the lower surface of the base.

4. The lens moving device according to claim 1, wherein, At least a portion of the first heat dissipation component is integrally formed with the base.

5. The lens moving device according to claim 1, comprising a ball member disposed between the base and the moving unit.

6. The lens moving device according to claim 1, wherein, The cover member includes an opening through which the second heat dissipation member is exposed.

7. The lens moving device according to claim 1, wherein, The cover component includes an upper plate and side plates. The base includes a side portion and a lower portion positioned below the side portion. The first heat dissipation component includes a side plate disposed on the side portion of the base and a lower plate disposed on the lower portion of the base. The second heat dissipation component is disposed on the side plate of the first heat dissipation component.

8. The lens moving device according to claim 7, wherein, A portion of the lower plate of the first heat dissipation member is exposed from the lower surface of the lower part of the base.

9. The lens moving device according to claim 1, wherein, The second heat dissipation component comprises metal or graphite.

10. The lens moving device according to claim 1, wherein, The fixing unit includes a circuit board disposed on the base. The coil is disposed on the circuit board, and At least a portion of the circuit board is connected to the first heat dissipation component.

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