A resin composition for a low dielectric loss copper clad plate of an optical module and a preparation method thereof

Abstract

This invention relates to the field of copper clad laminate (CCL) technology and discloses a low dielectric loss CCL resin composition for optical modules and its preparation method. The CCL resin composition mainly comprises the following raw materials in parts by weight: 100 parts by weight of epoxy resin, 20-40 parts by weight of modified epoxy resin, 50-100 parts by weight of modified petroleum resin, 10-20 parts by weight of polytetrafluoroethylene, 20-50 parts by weight of MED-type maleimide resin, 5-10 parts by weight of spherical silica, 1-2 parts by weight of methyl ethyl ketone (MEK), 3-5 parts by weight of 2-ethyl-4-methylimidazolium curing agent, and 0.05-0.07 parts by weight of 2-methylimidazolium accelerator. By using these raw materials as the composition raw materials, the CCL prepared in this application has excellent heat resistance, flame retardant properties, and dielectric properties.

Description

Technical Field

[0001] This invention relates to the field of copper clad laminate technology, specifically to a low dielectric loss copper clad laminate resin composition for optical modules and its preparation method. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence, cloud computing, and big data, global data center traffic is growing exponentially, placing unprecedented demands on data transmission rates. Currently, optical modules within data centers are rapidly evolving from 400G to 800G, 1.6T, and even higher speeds. AI computing platforms, represented by NVIDIA, have begun adopting 224G transmission technology. This poses stringent challenges to the performance of upstream core substrates. As the core device in optical communication systems that realizes photoelectric signal conversion, the performance of optical modules directly affects the transmission quality and reliability of the entire data link.

[0003] Copper-clad laminate (CCL) is the core substrate of printed circuit boards (PCBs). It is composed of resin, reinforcing materials (such as fiberglass cloth), and copper foil. In optical module applications, CCL not only needs to provide mechanical support and electrical insulation, but more importantly, it must ensure the integrity and low attenuation characteristics of high-speed signals during transmission. When signals are transmitted in PCB circuitry, some energy is absorbed by the substrate material and converted into heat. This energy loss is called dielectric loss. The higher the dielectric loss, the more severe the signal attenuation, the higher the bit error rate, and the greater the module power consumption.

[0004] Currently, the resin systems mainly used in high-frequency and high-speed copper clad laminates include polyphenylene oxide (PPO / PPE), petroleum resin (PCH), polytetrafluoroethylene (PTFE), and epoxy resin. Petroleum resin has extremely low dielectric loss due to the low polarity of the CH molecular structure, but its heat resistance and mechanical strength are relatively insufficient. Although PTFE has the best high-frequency performance, its preparation process is complex and costly, which limits its large-scale application. Although the traditional epoxy resin system is low in cost and mature in process, its dielectric loss is high (Df is usually above 0.01), which makes it difficult to meet the stringent requirements of high-speed optical modules.

[0005] Furthermore, with increasingly stringent environmental regulations, halogen-free flame retardancy has become a basic requirement for copper-clad laminates. While traditional halogenated flame retardants offer high flame retardancy, they release toxic gases during combustion and have been restricted from use by directives such as the EU RoHS. Developing resin compositions that combine low dielectric loss, high heat resistance, and halogen-free flame retardancy has become a pressing technical challenge for the industry. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this invention provides a low dielectric loss copper-clad laminate resin composition for optical modules and its preparation method. The copper-clad laminate composition prepared in this application has excellent heat resistance, flame retardant properties, and dielectric properties.

[0008] (II) Technical Solution

[0009] A low dielectric loss copper-clad laminate resin composition for optical modules, the copper-clad laminate resin composition mainly comprising the following raw materials in parts by weight: 100 parts by weight of epoxy resin, 20-40 parts by weight of modified epoxy resin, 50-80 parts by weight of modified petroleum resin, 10-20 parts by weight of polytetrafluoroethylene, 20-50 parts by weight of MED type maleimide resin, 5-10 parts by weight of spherical silica, 1-2 parts by weight of methyl ethyl ketone, 3-5 parts by weight of 2-ethyl-4-methylimidazolium curing agent, and 0.05-0.07 parts by weight of 2-methylimidazolium accelerator.

[0010] Preferably, the preparation method of the modified epoxy resin includes the following steps:

[0011] Epoxy resin was added to a flask, followed by ethylene glycol butyl ether and n-butanol. After stirring and mixing thoroughly, the temperature was controlled at 90°C. Then, 1,3-bis(trifluoromethyl)-5-vinylbenzene and benzoyl peroxide were added, and the temperature was raised to 110°C. The reaction was maintained at this temperature for 4-6 hours. After the reaction was completed, the solvent was removed, and n-butanol was added. The mixture was then sonicated to dissolve the resin and dried to obtain the modified epoxy resin. In this reaction step, the alkenyl group contained in 1,3-bis(trifluoromethyl)-5-vinylbenzene was grafted onto the carbon bonds of the epoxy resin aliphatic chain through free polymerization under the action of an initiator. This introduced a rigid benzene ring structure and fluorine element into the epoxy resin. The introduction of the rigid benzene ring structure greatly increased the rotational energy barrier of the main chain. The polymer chain segments could hardly undergo large-scale cooperative motion at room temperature, making it difficult to move with high frequency. When the electric field rapidly changes direction, the hysteresis effect of the dipole is greatly reduced, cutting off the main channel for high-frequency loss, thus significantly reducing dielectric loss. Fluorine, being the most electronegative element, has a strong electron-withdrawing effect, which pulls the π electron cloud on the benzene ring. This leads to a decrease in the electron cloud density of the large π bond of the benzene ring, which is originally highly delocalized and easily polarized by the electric field, and its distribution becomes more localized. This "electron locking" effect directly reduces the amplitude of π electrons following the electric field oscillation at high frequencies, thereby significantly reducing dielectric loss and frequency dependence of dielectric constant caused by electronic polarization. In summary, the rigid benzene ring "locks" the dipole motion through the physical binding of molecular chain segments, while fluorine "passivates" the polarizability at the electronic structure level. The two work together to achieve a significant reduction in dielectric loss at high frequencies. Introducing both into epoxy resin compensates for the high dielectric loss of epoxy resin.

[0012] Preferably, the mass ratio of the epoxy resin, ethylene glycol butyl ether, n-butanol, 1,3-bis(trifluoromethyl)-5-vinylbenzene, and benzoyl peroxide is 100:40-50:60-70:5-15:2-4.

[0013] Preferably, the method for preparing the modified petroleum resin includes the following steps:

[0014] A1. Allylamine and paraformaldehyde were added to tetrahydrofuran solvent and stirred at room temperature for 20-30 min. Then, tris(4-hydroxyphenyl)phosphine oxide was added, and the temperature was controlled at 80-85℃. The reaction was allowed to proceed for 12-15 h. After the reaction was completed, the mixture was rotary evaporated, washed with deionized water, and dried to obtain the modifier. A modifier was prepared by using allylamine, paraformaldehyde, and tris(4-hydroxyphenyl)phosphine oxide as raw materials via the Manniene reaction. The reaction formula is as follows:

[0015] ;

[0016] A2. Add petroleum resin to a flask, place it in a sand bath, and heat until the petroleum resin is in a molten state. Add the modifier, stir and disperse for 10-15 minutes, then add the initiator, controlling the temperature at 140-150℃, and react for 3-5 hours. After the reaction is complete, dissolve the xylene and precipitate the acetone. Extract the precipitate with acetone under reflux in a Soxhlet extractor for 6 hours to obtain the modified petroleum resin. In this step, a melt method is used to graft the petroleum resin with the modifier. On the one hand, the modifier prepared by this invention contains a triene structure, which is beneficial to the initiator. Under the action of the modifier, a large number of free radicals are generated. These free radicals attack the unsaturated bonds of the petroleum resin and then graft onto the petroleum resin, increasing the crosslinking density of the modified petroleum resin and thus improving its mechanical properties. On the other hand, the modifier contains a large number of rigid benzene ring structures and heterocyclic structures, which can not only physically bind the movement of dipoles to improve the dielectric properties of the copper clad laminate composition, but also improve the heat resistance of the petroleum resin through the heterocyclic and rigid benzene ring structures. Furthermore, the modifier contains phosphorus and nitrogen elements, which can improve the flame retardant properties of the copper clad laminate composition.

[0017] Preferably, in A1, the mass ratio of allylamine, paraformaldehyde, and tris(4-hydroxyphenyl)phosphine oxide is 0.55-0.6:0.6-0.65:1.

[0018] Preferably, in A2, the mass ratio of petroleum resin, modifier, and initiator is 100:2-4:0.15-0.25.

[0019] Preferably, in A2, the initiator is one or more of dicumyl peroxide, di-tert-butyl peroxide, and benzoyl peroxide.

[0020] More preferably, the preparation method of the low dielectric loss copper clad laminate resin composition for the optical module includes the following steps:

[0021] Epoxy resin, modified epoxy resin, modified petroleum resin, polytetrafluoroethylene, MED type maleimide resin, spherical silicone, butanone, and 2-ethyl-4-methylimidazole curing agent are added to a reaction vessel and stirred for 3-4 hours. Then, 2-methylimidazole accelerator is added and stirred for 30-40 minutes to obtain a copper-clad laminate resin composition.

[0022] (iii) Beneficial technical effects

[0023] This application grafts 1,3-bis(trifluoromethyl)-5-vinylbenzene into epoxy resin, utilizing the rigid benzene ring structure and fluorine element contained in 1,3-bis(trifluoromethyl)-5-vinylbenzene to compensate for the high dielectric loss of epoxy resin. Specifically, the rigid benzene ring "locks" the dipole motion through physical binding of molecular chain segments, while the fluorine element "passivates" the polarizability at the electronic structure level. The two work together to improve the dielectric properties of epoxy resin.

[0024] This application describes a modifier prepared from allylamine, paraformaldehyde, and tris(4-hydroxyphenyl)phosphine oxide using the Manniene reaction. This modifier is then grafted onto petroleum resin using a melt grafting method. On one hand, the rigid benzene ring structure and heterocyclic structure restrict the movement of the petroleum resin main chain, reducing dielectric loss and improving dielectric properties. On the other hand, the multi-crosslinked structure increases the mechanical and heat resistance properties of the petroleum resin, compensating for its poor heat resistance and mechanical properties. Furthermore, the modifier contains phosphorus and nitrogen elements. At high temperatures, phosphorus decomposes to generate strong acids such as phosphoric acid, metaphosphoric acid, and polyphosphoric acid. These acids catalyze the dehydration and carbonization of polymer materials (such as epoxy resin), forming a dense, expanded carbon layer on the material surface. This carbon layer effectively isolates heat and oxygen and inhibits the escape of combustible volatiles. Nitrogen decomposes upon heating to produce non-combustible gases such as ammonia (NH3) and nitrogen (N2). These gases dilute the concentration of oxygen and combustible gases in the flame zone. Simultaneously, this decomposition reaction is endothermic, lowering the material surface temperature. Both factors synergistically enhance the flame-retardant properties of the copper-clad laminate composition. Furthermore, this flame retardancy is halogen-free and releases no toxic gases during combustion. In addition, during high-temperature hot pressing (temperatures greater than 200°C), the hydroxyl groups generated by the benzoxazine structure of the copper-clad laminate react with the epoxy groups in the epoxy resin to form a complex cross-linked network structure. This increases the cross-linking density of the composition, improving heat resistance and mechanical properties. Moreover, the rigid structure formed by the high-density cross-linked network restricts the free movement of molecular chains, inhibiting the diverting ability of dipoles under an electric field, thus helping to reduce dielectric loss and improve dielectric performance.

[0025] In this application, epoxy resin is the main matrix resin of the entire composition. Through chemical reaction, it forms a three-dimensional network structure, constructing the skeleton of the board and providing crucial adhesion and mechanical strength. Polytetrafluoroethylene (PTFE) plays a key role in significantly reducing the dielectric loss of the board, ensuring the integrity and low attenuation of high-frequency signals during transmission. MED-type maleimide resin combines high heat resistance with excellent dielectric properties. Spherical silica, as a functional filler, plays a key role in reducing the coefficient of thermal expansion of the board to improve dimensional stability and optimizing high-frequency performance by reducing the dielectric constant and loss. By utilizing these raw materials as compositional ingredients, this application produces copper-clad laminates with excellent heat resistance, flame retardancy, and dielectric properties. Detailed Implementation

[0026] The present invention will be specifically described below through embodiments to facilitate understanding of the present invention by those skilled in the art. It is important to note that the embodiments are only for further illustration of the present invention and should not be construed as limiting the scope of protection of the present invention. Non-essential improvements and adjustments made to the present invention by those skilled in the art based on the above-described invention should still fall within the scope of protection of the present invention. In addition, the raw materials mentioned below that are not described in detail are all commercially available products, and the process steps or preparation methods not mentioned in detail are all process steps or preparation methods known to those skilled in the art.

[0027] Tris(4-hydroxyphenyl)phosphine oxide was prepared by referring to the method in the journal article "A New Synthetic Method for Monomer Tris(4-fluorophenyl)phosphine Oxide and Tris(4-hydroxyphenyl)phosphine Oxide" published in the June 2010 issue of Fine Chemical Intermediates, Volume 40, Issue 3.

[0028] Example 1

[0029] A1. Add 18g of allylamine and 19.5g of paraformaldehyde to tetrahydrofuran solvent, stir at room temperature for 30min, then add 32.6g of tris(4-hydroxyphenyl)phosphine oxide, control the temperature at 80℃, react for 15h, after the reaction is completed, rotary evaporate, wash with deionized water, dry, and obtain the modifier.

[0030] A2. Add 100g of petroleum resin to a flask, place it in a sand bath and heat until the petroleum resin is in a molten state. Add 2g of modifier and stir to disperse for 10min. Then add 0.2g of benzoyl peroxide initiator and control the temperature at 140℃. React for 5h. After the reaction is complete, xylene dissolves and acetone precipitates. Extract with acetone under reflux in a Soxhlet extractor for 6h to obtain modified petroleum resin.

[0031] A3. Add 50g of bisphenol A epoxy resin to a flask, then add 25g of ethylene glycol butyl ether and 33g of n-butanol. Stir and mix evenly, control the temperature at 90℃, add 2.5g of 1,3-bis(trifluoromethyl)-5-vinylbenzene and 1g of benzoyl peroxide, raise the temperature to 110℃, and keep the reaction at this temperature for 6 hours. After the reaction is complete, remove the solvent, add n-butanol, sonicate to dissolve, and dry to obtain the modified epoxy resin.

[0032] A4. According to the weight parts, 100 parts of epoxy resin E-44, 20 parts of modified epoxy resin, 50 parts of modified petroleum resin, 15 parts of polytetrafluoroethylene, 50 parts of MED type maleimide resin, 5 parts of spherical silicone, 1 part of methyl ethyl ketone, and 5 parts of 2-ethyl-4-methylimidazolium curing agent are added to a reaction vessel and stirred for 3 hours. Then, 0.05 parts of 2-methylimidazolium accelerator are added and stirred for 35 minutes to obtain the copper-clad laminate resin composition.

[0033] Example 2

[0034] A1. Add 19g of allylamine and 20g of paraformaldehyde to tetrahydrofuran solvent, stir at room temperature for 20min, then add 32.6g of tris(4-hydroxyphenyl)phosphine oxide, control the temperature at 85℃, react for 12h, after the reaction is completed, rotary evaporate, wash with deionized water, dry, and obtain the modifier.

[0035] A2. Add 100g of petroleum resin to a flask, place it in a sand bath and heat until the petroleum resin is in a molten state. Add 3g of modifier and stir to disperse for 15min. Then add 0.15g of benzoyl peroxide initiator and control the temperature at 150℃. React for 4h. After the reaction is complete, xylene dissolves and acetone precipitates. Extract with acetone under reflux in a Soxhlet extractor for 6h to obtain modified petroleum resin.

[0036] A3. Add 50g of bisphenol A epoxy resin to a flask, then add 25g of ethylene glycol butyl ether and 33g of n-butanol. Stir and mix evenly, control the temperature at 90℃, add 5g of 1,3-bis(trifluoromethyl)-5-vinylbenzene and 1.5g of benzoyl peroxide, raise the temperature to 110℃, and keep the reaction at this temperature for 5 hours. After the reaction is complete, remove the solvent, add n-butanol, sonicate to dissolve, and dry to obtain the modified epoxy resin.

[0037] A4. By weight, 100 parts of epoxy resin E-44, 30 parts of modified epoxy resin, 60 parts of modified petroleum resin, 10 parts of polytetrafluoroethylene, 30 parts of MED type maleimide resin, 8 parts of spherical silicone, 2 parts of butanone, and 4 parts of 2-ethyl-4-methylimidazolium curing agent are added to a reaction vessel and stirred for 4 hours. Then, 0.06 parts of 2-methylimidazolium accelerator are added and stirred for 30 minutes to obtain the copper-clad laminate resin composition.

[0038] Example 3

[0039] A1. Add 19.5g of allylamine and 21g of paraformaldehyde to tetrahydrofuran solvent, stir at room temperature for 25min, then add 32.6g of tris(4-hydroxyphenyl)phosphine oxide, control the temperature at 80℃, react for 14h, after the reaction is completed, rotary evaporate, wash with deionized water, dry, and obtain the modifier.

[0040] A2. Add 100g of petroleum resin to a flask, place it in a sand bath and heat until the petroleum resin is in a molten state. Add 4g of modifier and stir to disperse for 12 minutes. Then add 0.25g of benzoyl peroxide initiator and control the temperature at 145℃. React for 3 hours. After the reaction is complete, xylene dissolves and acetone precipitates. Extract the precipitate with acetone under reflux in a Soxhlet extractor for 6 hours to obtain the modified petroleum resin.

[0041] A3. Add 50g of bisphenol A epoxy resin to a flask, then add 25g of ethylene glycol butyl ether and 33g of n-butanol. Stir and mix evenly, control the temperature at 90℃, add 7.5g of 1,3-bis(trifluoromethyl)-5-vinylbenzene and 2g of benzoyl peroxide, raise the temperature to 110℃, keep the temperature for 4h, after the reaction is completed, remove the solvent, add n-butanol, sonicate to dissolve, dry, and obtain modified epoxy resin.

[0042] A4. According to the weight parts, 100 parts of epoxy resin E-44, 40 parts of modified epoxy resin, 80 parts of modified petroleum resin, 20 parts of polytetrafluoroethylene, 20 parts of MED type maleimide resin, 10 parts of spherical silicone, 2 parts of methyl ethyl ketone, and 3 parts of 2-ethyl-4-methylimidazolium curing agent are added to a reaction vessel and stirred for 4 hours. Then, 0.05-0.07 parts of 2-methylimidazolium accelerator are added and stirred for 40 minutes to obtain the copper-clad laminate resin composition.

[0043] Comparative Example 1

[0044] The steps for preparing the copper-clad laminate composition in this comparative example are the same as those in Example 1, except that:

[0045] By weight, 100 parts of epoxy resin E-44, 20 parts of bisphenol A epoxy resin, 50 parts of modified petroleum resin, 15 parts of polytetrafluoroethylene, 50 parts of MED type maleimide resin, 5 parts of spherical silicone, 1 part of methyl ethyl ketone, and 5 parts of 2-ethyl-4-methylimidazolium curing agent were added to a reaction vessel and stirred for 3 hours. Then, 0.05 parts of 2-methylimidazolium accelerator were added and stirred for 35 minutes to obtain the copper-clad laminate resin composition.

[0046] Comparative Example 2

[0047] The steps for preparing the copper-clad laminate composition in this comparative example are the same as those in Example 1, except that:

[0048] By weight, 100 parts of epoxy resin E-44, 20 parts of modified epoxy resin, 50 parts of petroleum resin, 15 parts of polytetrafluoroethylene, 50 parts of MED type maleimide resin, 5 parts of spherical silicone, 1 part of methyl ethyl ketone, and 5 parts of 2-ethyl-4-methylimidazole curing agent were added to a reaction vessel and stirred for 3 hours. Then, 0.05 parts of 2-methylimidazole accelerator were added and stirred for 35 minutes to obtain the copper-clad laminate resin composition.

[0049] Comparative Example 3

[0050] The comparative example follows the same steps as Example 1 in preparing the copper-clad laminate composition, except that in step A2, allylamine is used instead of the modifier.

[0051] Impregnate fiberglass cloth with copper-clad laminate resin composition for 5 minutes, place in an oven at 100°C and dry for 5 minutes to obtain a prepreg. Then, laminate the prepreg and cover both sides with copper foil. Hot press at 240°C and 2MPa for 120 minutes to obtain copper-clad laminate.

[0052] The dielectric properties were tested using an impedance material tester. The test conditions were 25℃, 1MHz, and the sample size was 50mm×50mm×1.6mm. Three prepregs were tested.

[0053] Thermogravimetric analysis was performed using a thermogravimetric analyzer under a nitrogen atmosphere. The sample weight was 10g, the test temperature range was 50-800℃, and the heating rate was 10℃ / min.

[0054] Table 1:

[0055] Dielectric constant Dielectric loss <![CDATA[Td 5% (℃) <!-- 5 -->]]> Example 1 3.6 0.007 436.7 Example 2 3.3 0.005 452.0 Example 3 3.1 0.004 461.2 Comparative Example 1 3.9 0.010 419.6 Comparative Example 2 4.6 0.018 372.9 Comparative Example 3 4.3 0.016 391.4

[0056] As shown in the table, the copper-clad laminate prepared in this application has excellent dielectric and heat resistance properties. The dielectric properties of Comparative Example 3 are better than those of Comparative Example 2. It is speculated that this is because allylamine was used in Comparative Example 3 instead of a modifier. Allylamine contains an amino structure that can form hydrogen bonds with other polar structures. Compared with Comparative Example 2, this increases the crosslinking density, restricts the movement of molecular chains, and thus restricts the movement of dipoles, thereby improving the dielectric and heat resistance properties of the composition.

[0057] According to the international standard UL-94, the flame retardant performance was tested, with 8 prepreg sheets tested.

[0058] According to IPC-TM650 2.6.16, a high-pressure cooking test was conducted. The prepared sample was placed in a pressure cooker and cooked for several hours at a pressure of 105±3 kPa. After the hot sample was cooled and dried, the thermal stress of the sample was tested according to IPC-TM650 2.4.13.1. The sample size was 100 mm × 100 mm × 1.6 mm, and three samples were tested.

[0059] The longitudinal bending strength was tested using a material testing machine.

[0060] Flame retardant rating (level) High-pressure cooking test results <![CDATA[Flexural strength (N / mm 2 )]]> Example 1 V-0 No layering, no bubbling, no white spots 526 Example 2 V-0 No layering, no bubbling, no white spots 540 Example 3 V-0 No layering, no bubbling, no white spots 551 Comparative Example 1 V-0 Layered, no bubbling, no white spots 463 Comparative Example 2 / Layering, foaming 401 Comparative Example 3 / Layering, foaming 439

[0061] As shown in the table, the copper-clad laminate prepared by this invention has good flame retardant properties, mechanical properties and hydrolysis resistance, and good stability under long-term humid and hot conditions.

[0062] The present invention has been described in detail above with reference to the embodiments. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A low dielectric loss copper-clad laminate resin composition for optical modules, characterized in that, The copper clad laminate resin composition mainly comprises the following raw materials in parts by weight: 100 parts by weight of epoxy resin, 20-40 parts by weight of modified epoxy resin, 50-80 parts by weight of modified petroleum resin, 10-20 parts by weight of polytetrafluoroethylene, 20-50 parts by weight of MED type maleimide resin, 5-10 parts by weight of spherical silica, 1-2 parts by weight of methyl ethyl ketone, 3-5 parts by weight of 2-ethyl-4-methylimidazolium curing agent, and 0.05-0.07 parts by weight of 2-methylimidazolium accelerator.

2. The low dielectric loss copper-clad laminate resin composition for optical modules according to claim 1, characterized in that, The preparation method of the modified epoxy resin includes the following steps: Epoxy resin was added to a flask, followed by ethylene glycol butyl ether and n-butanol. After stirring and mixing evenly, the temperature was controlled at 90°C. 1,3-bis(trifluoromethyl)-5-vinylbenzene and benzoyl peroxide were added, and the temperature was raised to 110°C. The reaction was maintained at this temperature for 4-6 hours. After the reaction was completed, the solvent was removed, and n-butanol was added. The mixture was then dissolved by ultrasonication and dried to obtain the modified epoxy resin.

3. The low dielectric loss copper-clad laminate resin composition for optical modules according to claim 2, characterized in that, The mass ratio of the epoxy resin, ethylene glycol butyl ether, n-butanol, 1,3-bis(trifluoromethyl)-5-vinylbenzene, and benzoyl peroxide is 100:40-50:60-70:5-15:2-4.

4. The low dielectric loss copper-clad laminate resin composition for optical modules according to claim 1, characterized in that, The preparation method of the modified petroleum resin includes the following steps: A1. Allylamine and paraformaldehyde are added to tetrahydrofuran solvent and stirred at room temperature for 20-30 min. Then tris(4-hydroxyphenyl)phosphine oxide is added to the mixture and the temperature is controlled at 80-85℃. The reaction is carried out for 12-15 h. After the reaction is completed, the mixture is rotary evaporated, washed with deionized water, and dried to obtain the modifier. A2. Add petroleum resin to a flask, place it in a sand bath and heat until the petroleum resin is in a molten state. Add the modifier and stir to disperse for 10-15 minutes. Then add the initiator and control the temperature at 140-150℃. React for 3-5 hours. After the reaction is complete, dissolve the xylene and precipitate the acetone. Extract the precipitate with acetone under reflux in a Soxhlet extractor for 6 hours to obtain the modified petroleum resin.

5. The low dielectric loss copper-clad laminate resin composition for optical modules according to claim 4, characterized in that, In A1, the mass ratio of allylamine, paraformaldehyde, and tris(4-hydroxyphenyl)phosphine oxide is 0.55-0.6:0.6-0.65:

1.

6. The low dielectric loss copper-clad laminate resin composition for optical modules according to claim 4, characterized in that, In A2, the mass ratio of petroleum resin, modifier, and initiator is 100:2-4:0.15-0.

25.

7. The low dielectric loss copper-clad laminate resin composition for optical modules according to claim 4, characterized in that, In A2, the initiator is one or more of dicumyl peroxide, di-tert-butyl peroxide, and dibenzoyl peroxide.

8. The low dielectric loss copper-clad laminate resin composition for optical modules according to any one of claims 1-7, characterized in that, The preparation method includes the following steps: Epoxy resin, modified epoxy resin, modified petroleum resin, polytetrafluoroethylene, MED type maleimide resin, spherical silicone, butanone, and 2-ethyl-4-methylimidazole curing agent are added to a reaction vessel and stirred for 3-4 hours. Then, 2-methylimidazole accelerator is added and stirred for 30-40 minutes to obtain a copper-clad laminate resin composition.