Defect repair methods, devices, electronic equipment and storage media

Abstract

This disclosure relates to a defect repair method, apparatus, electronic device, and storage medium. The method includes determining a second defect position based on a first defect position and a first defect on a photomask, using a first offset; determining a second distance parameter based on a second offset and a first distance parameter; and controlling a repair device to repair the first defect using a repair beam based on the second defect position and the second distance parameter. This disclosure can use the first offset to calibrate the positional deviation between the defect detection device and the repair device, correcting the positioning error between the two devices and improving the accuracy of defect positioning. Furthermore, the second offset can achieve successful and precise focusing on the defect, thereby improving the success rate of defect repair and obtaining a photomask with better performance.

Description

Technical Field

[0001] This disclosure relates to the field of photomasks, and more specifically to a defect repair method, apparatus, electronic device, and storage medium. Background Technology

[0002] Defects may occur during the manufacturing process of photomasks. These defects can degrade the photomask's optical performance and exposure process quality. Therefore, to improve photomask performance, defects are repaired. However, in related technologies, repairing photomasks can be problematic due to inaccurate positioning and focusing issues, leading to repair failures or errors and ultimately, poor photomask performance. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides a defect repair method, apparatus, electronic device, and storage medium.

[0004] According to a first aspect of the present disclosure, a defect repair method is provided, comprising: Based on the first offset and the first defect position of the first defect on the photomask, the second defect position is determined; the first defect position is the defect position of the first defect detected by the defect detection device, and the second defect position is the defect position used by the repair device when repairing the first defect; the first offset is used to characterize the average position offset between the position of the marker point on the photomask detected by the defect detection device and the position detected by the repair device. The second distance parameter is determined based on the second offset and the first distance parameter; the first distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the reference beam; the second distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the repair beam; the second offset is used to characterize the distance offset between the lens and the photomask when the repair device focuses on the same defect under the reference beam and the repair beam, respectively. Based on the second defect location and the second distance parameter, the repair device is controlled to repair the first defect using the repair beam.

[0005] In some embodiments, the photomask is provided with a plurality of the marker points, and the method further includes: Obtain a first position and a second position for each of the plurality of marker points; the first position is the position of the marker point detected by the defect detection device, and the second position is the position of the marker point detected by the repair device; The first offset is determined based on the first position and the second position of each of the marker points.

[0006] In some embodiments, determining the first offset based on the first position and the second position of each of the marker points includes: Determine a third offset between the first and second positions of the same marker point to obtain multiple third offsets; The average of the plurality of third offsets is determined as the first offset.

[0007] In some embodiments, the method further includes: Based on each of the multiple repair sizes, the distance between the lens and the photomask is adjusted to obtain a third distance parameter corresponding to each repair size; the third distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the reference beam, and the repair size is the repair size of the second defect; Based on the image sharpness of each region where the second defect is located on the photomask, the distance between the lens and the photomask is adjusted to obtain a fourth distance parameter corresponding to each repair size; the fourth distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the repair beam; Based on the third distance parameter and the fourth distance parameter corresponding to each of the repair dimensions, a second offset corresponding to each of the repair dimensions is determined.

[0008] In some embodiments, the method further includes: For each of the second defects, focus on the second defect; In response to the matching of the size of the focusing area of ​​the reference beam on the photomask and the repair size of the second defect, the repair device is determined to focus on the second defect under the reference beam.

[0009] In some embodiments, the method further includes: For each of the second defects, focus on the second defect; In response to the fact that the image sharpness of the area where the second defect is located, obtained by the repair device, is greater than a preset sharpness threshold, the repair device is determined to focus on the second defect under the repair beam.

[0010] In some embodiments, the method further includes: Based on the defect size of the first defect, the repair size of the first defect is determined; the repair size of the first defect is larger than the defect size of the first defect. Based on the repair size of the first defect and the second offset corresponding to each of the plurality of repair sizes, the second offset corresponding to the repair size of the first defect is determined; The determination of the second distance parameter based on the second offset and the first distance parameter includes: The second distance parameter is determined based on the second offset corresponding to the repair size of the first defect and the first distance parameter.

[0011] In some embodiments, controlling the repair device to repair the first defect using the repair beam based on the second defect location and the second distance parameter includes: The repair device is controlled to emit the repair beam toward the second defect location at the second distance parameter.

[0012] According to a second aspect of the present disclosure, a defect repair apparatus is provided, comprising: The determination module is configured to determine a second defect position based on a first offset and a first defect position of a first defect on a photomask; the first defect position is the defect position of the first defect detected by a defect detection device, and the second defect position is the defect position used by a repair device when repairing the first defect; the first offset is used to characterize the average positional offset between the position of the marker point on the photomask detected by the defect detection device and the position detected by the repair device. The determining module is further configured to determine a second distance parameter based on a second offset and a first distance parameter; the first distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the reference beam; the second distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the repair beam; the second offset is used to characterize the distance offset between the lens and the photomask when the repair device focuses on the same defect under the reference beam and the repair beam, respectively. The processing module is configured to control the repair device to repair the first defect using the repair beam based on the second defect location and the second distance parameter.

[0013] According to a third aspect of the present disclosure, an electronic device is provided, including a memory and a processor, the memory storing a computer program, the processor executing the computer program to implement the steps of the method described in the first aspect.

[0014] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the method described in the first aspect.

[0015] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: This disclosure introduces a first offset and a second offset, so that the positional deviation between the defect detection device and the repair device can be calibrated by the first offset, the positioning error between the two devices can be corrected, and the positioning accuracy of the defect can be improved. Furthermore, the second offset can be used to achieve successful and precise focusing on the defect, thereby improving the success rate of defect repair and obtaining a photomask with better performance.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] Figure 1 This is a flowchart illustrating a defect repair method according to an exemplary embodiment.

[0019] Figure 2 This is a schematic diagram illustrating a marker point according to an exemplary embodiment.

[0020] Figure 3 This is a schematic diagram illustrating a marker point according to an exemplary embodiment.

[0021] Figure 4 This is a schematic diagram illustrating a focusing method according to an exemplary embodiment.

[0022] Figure 5 This is a flowchart illustrating a defect repair method according to an exemplary embodiment.

[0023] Figure 6 This is a block diagram illustrating a defect repair device according to an exemplary embodiment.

[0024] Figure 7 This is a block diagram of an electronic device according to an exemplary embodiment. Detailed Implementation

[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0026] Defects may occur during the manufacturing process of photomasks. These defects can degrade the photomask's optical performance and exposure process quality. Therefore, to improve photomask performance, defects are repaired. However, in related technologies, repairing photomasks can be problematic due to inaccurate positioning and focusing issues, leading to repair failures or errors and ultimately, poor photomask performance.

[0027] For example, when the defect size is smaller than the resolution of the repair equipment's lens, technicians cannot directly observe the defect in the real-time image and cannot manually fine-tune its location using the image. In this case, relying on the defect location provided by the defect detection equipment for movement and repair will result in positioning errors between devices, causing the repair laser to fail to accurately hit the defect center, leading to repair failure or introducing new errors. Another example is when the defect area is a non-graphical region (such as a blank quartz area). Focusing based on image contrast will fail due to the lack of high-contrast features, resulting in focusing failure or inaccurate focus. If the repair laser is fired directly without precise focus, the suboptimal energy density distribution of the laser spot or defocusing will lead to repair failure or damage to other areas.

[0028] To address the aforementioned issues, this disclosure provides a defect repair method. This disclosure introduces a first offset and a second offset, thereby enabling the calibration of the positional deviation between the defect detection device and the repair device through the first offset, correcting the positioning error between the two devices, and improving the positioning accuracy of the defect. Furthermore, the second offset enables successful and precise focusing on the defect, ensuring that the repair beam is accurately focused on the defect location, thereby improving the success rate of defect repair and obtaining a photomask with better performance.

[0029] This disclosure provides an exemplary embodiment of a defect repair method that can be applied to electronic devices, specifically smart devices such as mobile phones, tablets, laptops, smart robots, and smart wearable devices. Furthermore, the electronic device also includes various hardware resources and energy storage devices that provide power for the operation of these hardware resources.

[0030] like Figure 1 As shown in the figure, the defect repair method illustrated in this embodiment includes: Step S101: Determine the position of the second defect based on the first offset and the position of the first defect on the photomask.

[0031] Wherein, the first defect position is the defect position of the first defect detected by the defect detection device, the second defect position is the defect position used by the repair device when repairing the first defect, and the first offset is used to characterize the average position offset between the position of the marker point on the photomask detected by the defect detection device and the position detected by the repair device.

[0032] In one example, the first defect can be a defect whose size is smaller than the resolution of the lens of the repair device and / or a defect whose area is a non-graphical area, that is, the first defect can be a defect that the repair device cannot locate and / or a defect that the repair device cannot focus.

[0033] Optionally, defects on the photomask can include various types, such as redundant defects and missing defects. Redundant defects can include excess chromium, black spots, burrs, and extended lines, while missing defects can include notches, holes, and insufficient chromium. Accordingly, the type of the first defect can be any of the above types.

[0034] In some embodiments, the defect detection equipment can be used to detect and locate defects on a photomask. Optionally, the defect detection equipment may include an automated optical defect detection device, such as a bright-field mask defect detection device, a dark-field mask defect detection device, etc., and may also include an electron beam defect detection device, an electron microscope, etc.

[0035] In some embodiments, the defect detection device is provided with a first coordinate system. The defect detection device can acquire an image of the photomask and determine the position of the defect on the photomask in the first coordinate system based on the first coordinate system and the image of the photomask. Accordingly, the first defect position of the first defect on the photomask can be determined in the manner described above.

[0036] In some embodiments, when the repair equipment cannot determine the location of the defect, it can repair the defect on the photomask based on the defect location and a first offset detected by the defect detection equipment. This improves both the detection and repair accuracy of the defect.

[0037] In some embodiments, a plurality of marker points are provided on the photomask. A defect detection device can detect a first position of each marker point, a repair device can detect a second position of each marker point, and an electronic device can acquire the first position and the second position of each marker point among the plurality of marker points, and determine a first offset based on the first position and the second position of each marker point.

[0038] In some embodiments, a plurality of marker points are disposed on the photomask. The defect detection device can detect a first position of each marker point, and the repair device can detect a second position of each marker point. Then, the repair device can determine a first offset based on the first position and the second position of each marker point. Accordingly, the electronic device can interact with the defect detection device to obtain the first offset.

[0039] Optionally, the number of markers and their distribution can be set and selected based on actual needs, for example, such as... Figure 2 The diagram shows one type of marker point. The number of marker points can be up to 25, and they are evenly distributed in a 5×5 pattern on the photomask. Optionally, the shape of the marker points can also be set and selected based on actual needs; for example, the marker points can be circular, rectangular, or irregular shapes, such as... Figure 3 The diagram shown illustrates a type of marker point. The marker point can be... Figure 3 The shape shown.

[0040] In some embodiments, a third offset between the second position and the first position of the same marker point can be determined, the third offset of all marker points can be obtained, and the average of the third offsets of all marker points can be determined as the first offset. Here, the third offset can refer to a positional difference; the third offset between the second position and the first position can refer to the positional difference between the second position and the first position, or the positional difference between the first position and the second position.

[0041] In some embodiments, the repair device is provided with a second coordinate system. The repair device can acquire an image of the photomask and, based on the second coordinate system and the image of the photomask, determine the position of a marker point on the photomask in the second coordinate system. For each marker point, a first position of the marker point detected by the defect detection device in the first coordinate system can be acquired. Similarly, for each marker point, a second position of the marker point detected by the repair device in the second coordinate system can be acquired. In some embodiments, the position difference between the first and second positions of the same marker point can be calculated to obtain multiple position differences. Based on the multiple position differences, a first offset can be determined, thus obtaining the average position offset between the first and second coordinate systems.

[0042] Below is an example of determining the first offset.

[0043] The photomask has 1-25 marker points, which are evenly distributed in a 5×5 pattern. The defect detection equipment and the repair equipment can image the photomask separately and determine the positions of the marker points on the photomask.

[0044] For each marker point, a first position (X1, Y1) can be determined using a defect detection device, and a second position (X2, Y2) can be determined using a repair device. The positional difference (ΔX, ΔY) between the first and second positions is then determined. Multiple positional differences are obtained in this way. The average of these multiple positional differences (ΔX_avg, ΔY_avg) can then be determined as the first offset. It should be noted that the difference between the first and second positions can be either the difference between the first and second positions relative to the first position, or vice versa; the calculation method for the positional difference is consistent for each marker point.

[0045] In some embodiments, the above process can be performed before defect repair and after maintenance of the repair equipment to obtain a first offset, and subsequent repair processes can be performed based on the first offset.

[0046] In some embodiments, in response to the first offset representing the positional difference between the first position and the second position, the difference between the first defect position and the first offset can be determined as the second defect position. For example, X_repair = X_inspect - ΔX_avg, where X_repair represents the second defect position, X_inspect represents the first defect position, and ΔX_avg represents the first offset. Alternatively, in response to the first offset representing the positional difference between the second position and the first position, the sum of the first defect position and the first offset can be determined as the second defect position. For example, X_repair = X_inspect + ΔX_avg.

[0047] In some embodiments, the defect detection device can detect at least one defect on the photomask and determine the defect location of each defect. Accordingly, referring to the process of determining the second defect location, the defect location used by the repair device to repair each defect can be determined based on the first offset and the defect location of each defect detected by the defect detection device.

[0048] In this disclosure, two devices can locate multiple marker points, thereby determining the positioning error between the two devices based on the two positions of each marker, which can improve the accuracy of the second defect location determined by the repair device.

[0049] Step S102: Determine the second distance parameter based on the second offset and the first distance parameter.

[0050] The first distance parameter is the distance between the lens and the photomask of the repair device when the repair device focuses on the first defect under the reference beam, the second distance parameter is the distance between the lens and the photomask of the repair device when the repair device focuses on the first defect under the repair beam, and the second offset is used to characterize the distance offset between the lens and the photomask when the repair device focuses on the same defect under the reference beam and the repair beam, respectively.

[0051] In some embodiments, the distance parameter between the lens and the photomask can be the distance between the center point of the lens and the point on the photomask that is vertically / horizontally mapped from the center point of the lens.

[0052] It should be noted that when repairing defects on a photomask, if the repair beam is out of focus or not focused on the defect, the repair may be incomplete or damage other areas of the photomask. Therefore, it is necessary to focus on the area of ​​the defect on the photomask to ensure that the energy density of the repair beam emitted by the repair equipment falls on the defect area, thus repairing only the defect without damaging the surrounding area.

[0053] In some embodiments, the reference beam can be a slit beam, which refers to a strip-shaped parallel beam after being limited and shaped by a narrow rectangular slit aperture. When the slit beam is out of focus, the light band will widen significantly, the edges will be blurred, and the light intensity will decrease. Therefore, the slit beam is more sensitive to focus and has a faster focus feedback. In some embodiments, the repair beam can be a repair laser. For redundant defects, the laser can ablate and remove the defects; for missing defects, the laser can deposit and repair the defects.

[0054] In some embodiments, during the focusing process of the defect, the distance between the lens and the photomask of the repair device can be adjusted, thereby adjusting the focal point and focal plane of the repair device. The focal point can refer to the point where all light beams converge and contract to their smallest, brightest, and most concentrated point when emitted from the lens; the plane containing the focal point is called the focal plane. In some embodiments, focusing on the defect refers to successfully focusing on the defect so that it is located on the optimal focal plane of the repair device, which is the focal plane coinciding with the photomask.

[0055] Thus, by adjusting the distance between the lens of the repair device and the photomask, the position of the focal plane is adjusted until the focal plane and the photomask coincide, allowing the repair device to focus on the defect on the photomask. It should be noted that the photomask may be non-planar, and the position of the focal plane may differ depending on the location of the defect. The focal plane coinciding with the photomask can mean that the focal plane and the tangential plane at the location of the defect on the photomask coincide. Therefore, during use, for different defects, it is necessary to control the repair device to emit a reference beam to determine the initial distance parameter.

[0056] In some embodiments, the distance between the lens and the photomask of the repair device can be adjusted under the reference beam until the repair device focuses on the first defect under the reference beam. At this point, the distance between the lens and the photomask can be determined as the first distance parameter.

[0057] In some embodiments, the repair device can be controlled to emit a reference beam, and the distance between the lens of the repair device and the photomask can be adjusted based on the repair size of the first defect. In some embodiments, the first defect can be focused based on the distance between the lens of the repair device and the photomask, and the focus of the repair device on the first defect under the reference beam is determined in response to the matching of the size of the focusing area of ​​the reference beam on the photomask and the repair size of the first defect.

[0058] In some embodiments, the distance between the lens and the photomask can be adjusted by adjusting the Z-axis, which can refer to the coordinate axis corresponding to the height of the lens.

[0059] The process of determining the second offset is briefly explained below.

[0060] In some embodiments, based on each of the plurality of repair sizes, the distance between the lens and the photomask is adjusted to obtain a third distance parameter corresponding to each repair size; the third distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the reference beam, and the repair size is the repair size of the second defect; based on the graphic sharpness of the region where each second defect is located on the photomask, the distance between the lens and the photomask is adjusted to obtain a fourth distance parameter corresponding to each repair size; the fourth distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the repair beam; based on the third distance parameter and the fourth distance parameter corresponding to each repair size, a second offset corresponding to each repair size is determined.

[0061] In some embodiments, defects on a photomask can be detected by a defect detection device, and a second offset corresponding to each repair size can be determined by the defects at different repair sizes on the photomask.

[0062] In some embodiments, different defects on the photomask can correspond to multiple repair sizes. In some embodiments, the repair size of a defect can be determined based on the defect size. Accordingly, multiple defect sizes can be defined, and a correspondence between each defect size and repair size can be established, where the repair size is larger than the defect size.

[0063] In one example, when any side length of the defect is less than 0.3 μm, the repair size can be 0.5 μm × 0.5 μm; when any side length of the defect is between 0.3 μm and 0.5 μm, the repair size can be 1 μm × 1 μm; when any side length of the defect is between 0.5 μm and 0.7 μm, the repair size can be 2 μm × 2 μm; and when any side length of the defect is between 0.7 μm and 1 μm, the repair size can be 3 μm × 3 μm. For example, when the defect size is 0.6 μm × 0.7 μm, the repair size can be 2 μm × 2 μm. It should be noted that if the side length of the defect involves different ranges, the repair size can be based on the longer side length. For example, when the defect size is 0.3 μm × 0.6 μm, the repair size can be 2 μm × 2 μm.

[0064] In some embodiments, the repair device can be controlled to emit a reference beam, and under the reference beam, the distance between the lens and the photomask can be adjusted based on each of the multiple repair sizes to obtain a third distance parameter corresponding to each repair size.

[0065] In some embodiments, for each second defect, the second defect can be focused based on the distance between the lens and the photomask. In response to matching the size of the focusing area of ​​the reference beam on the photomask with the repair size of the second defect, it is determined that the repair device is focused on the second defect under the reference beam. Then, when determining that the repair device is focused on the second defect under the reference beam, a distance parameter between the lens and the photomask can be obtained to obtain a third distance parameter, and this third distance parameter can be correlated with the repair size of the second defect. Accordingly, the third distance parameter corresponding to each repair size can be determined in the manner described above.

[0066] For example, if the repair size for the second defect is repair size 1, the distance between the lens and the photomask can be adjusted to match the size of the focusing area of ​​the reference beam on the photomask with repair size 1. In this case, the distance between the lens and the photomask can be obtained and determined as the third distance parameter corresponding to repair size 1. As another example, if the repair size for the second defect is repair size 2, the distance between the lens and the photomask can be adjusted to match the size of the focusing area of ​​the reference beam on the photomask with repair size 2. In this case, the distance between the lens and the photomask can be obtained and determined as the third distance parameter corresponding to repair size 2.

[0067] Optionally, the size of the focusing area can be determined by referencing the size of the light spot on the photomask. For example... Figure 4 The diagram shown illustrates one method of focusing. Figure 4 The area corresponding to the gray box in the image can be the repair area, and the size of the area corresponding to the gray box can be the repair size. Figure 4The area corresponding to the white light spot in the image can refer to the focus area. In this case, the size of the focus area matches the size of the repair.

[0068] Optionally, matching the size of the focus area and the repair size may include the size of the focus area and the repair size being the same, or the matching degree of the size of the focus area and the repair size being greater than a preset matching degree threshold. The preset matching degree threshold can be set by the user, for example, it can be any value between 80% and 100%.

[0069] In some embodiments, the repair device can be controlled to emit a repair beam, and under the repair beam, the distance between the lens and the photomask can be adjusted based on the graphic sharpness of the area where each second defect is located on the photomask to obtain a fourth distance parameter corresponding to each repair size.

[0070] In some embodiments, for each second defect, the second defect can be focused based on the distance between the lens and the photomask. In response to the image sharpness of the area where the second defect is located, obtained by the repair device, being greater than a preset sharpness threshold, it is determined that the repair device is focused on the second defect under the repair beam. Then, when determining that the repair device is focused on the second defect under the repair beam, a distance parameter between the lens and the photomask can be obtained to obtain a fourth distance parameter, and this fourth distance parameter can be correlated with the repair size of the second defect. Accordingly, the fourth distance parameter corresponding to each repair size can be determined in the manner described above.

[0071] In some embodiments, for each second defect, the repair device can acquire an image of the area where the second defect is located and determine the image sharpness of the defect. The preset sharpness threshold can be set based on actual conditions; for example, the preset sharpness threshold can be any value between 80% and 100%.

[0072] That is, by adjusting the distance between the lens and the photomask, a clearer image of the photomask can be obtained. When the image clarity of the area where the second defect is located is greater than the preset clarity threshold, the repair device is determined to focus on the second defect under the repair beam.

[0073] Optionally, the area where the second defect is located may include a preset area centered on the defect location of the second defect. The shape and size of the preset area can be set by the user. For example, the shape of the preset area can be a square, and the size of the preset area can be 5μm×5μm.

[0074] In some embodiments, a third distance parameter and a fourth distance parameter corresponding to the same repair size can be determined, and a second offset corresponding to the repair size can be determined.

[0075] Optionally, the second offset can represent the distance difference between the third distance parameter and the fourth distance parameter, or the second offset can represent the distance difference between the fourth distance parameter and the third distance parameter. In some embodiments, in response to the second offset representing the distance difference between the third distance parameter and the fourth distance parameter, the difference between the first distance parameter and the second offset can be determined as the second distance parameter. For example, Z_repair = Z_slit - ΔZ, where Z_repair represents the second distance parameter, Z_slit represents the first distance parameter, and ΔZ represents the second offset. In response to the second offset representing the distance difference between the fourth distance parameter and the third distance parameter, the sum of the first distance parameter and the second offset can be determined as the second distance parameter. For example, Z_repair = Z_slit + ΔZ.

[0076] In some embodiments, each repair size may correspond to at least one second defect. When there are multiple second defects, the repair device can focus on each second defect under both the reference beam and the repair beam to obtain multiple third distance parameters and multiple fourth distance parameters corresponding to the repair size. Accordingly, a fourth offset can be determined based on the third and fourth distance parameters when focusing on the same second defect, resulting in multiple fourth offsets corresponding to each repair size, and a second offset can be determined based on these multiple fourth offsets. Optionally, the second offset corresponding to each repair size can be obtained by averaging the multiple fourth offsets corresponding to each repair size. This can improve the accuracy of the determined second offset.

[0077] Below is a specific example of determining the second offset.

[0078] If a defect with a size of 0.3μm × 0.3μm is detected, then the repair size for that defect is 0.5μm × 0.5μm. The electronic device can control the repair equipment to emit a reference beam, adjusting the distance between the lens and the photomask, thereby adjusting the size of the focusing area of ​​the reference beam on the photomask. When the size of the focusing area of ​​the reference beam on the photomask is 0.5μm × 0.5μm, the size of the focusing area matches the repair size, confirming that the repair equipment is focused on the defect under the reference beam. At this point, the distance between the lens and the photomask can be obtained, for example, 10cm, and this distance of 10cm is defined as the third distance parameter corresponding to 0.5μm × 0.5μm. The beam emitted by the repair equipment is switched from the reference beam to the repair beam, and the distance between the lens and the photomask is adjusted, thereby adjusting the image sharpness of the area where the defect is located on the photomask. When the image sharpness of the area where the defect is located, obtained by the repair equipment, is greater than a preset sharpness threshold, it can be confirmed that the repair equipment is focused on the defect under the repair beam. At this point, the distance between the lens and the photomask can be obtained, for example, 15cm, and this distance of 15cm is defined as the fourth distance parameter corresponding to 0.5μm×0.5μm. Then, by calculating the distance difference between the fourth distance parameter and the third distance parameter, the second offset can be determined to be 5cm, and correspondingly, the second offset corresponding to the repair size of the defect can be determined to be 5cm.

[0079] In some embodiments, the repair size of the first defect can be determined based on the defect size of the first defect, and the second offset corresponding to the repair size of the first defect can be determined based on the repair size of the first defect and the second offset corresponding to each of the plurality of repair sizes. For example, the second offsets corresponding to repair sizes of 0.5μm×0.5μm, 1μm×1μm, 2μm×2μm and 3μm×3μm are 5cm, 6cm, 4cm and 5.5cm respectively. If the repair size of the first defect is 0.3μm×0.6μm, the repair size can be 2μm×2μm, and then the second offset corresponding to the repair size of the first defect can be determined to be 4cm.

[0080] In this disclosure, a second offset can be calibrated for different repair sizes, thereby adapting to focusing problems of different defect sizes and improving focusing stability for different repair sizes. Furthermore, using the matching of the reference beam's focusing area size with the defect repair size as a focusing criterion ensures that the reference optical path's focusing area matches the area of ​​the defect to be repaired; and using the sharpness of the defect area's image as the basis for focusing the repair beam aligns with the actual focusing logic of microscopic vision.

[0081] Step S103: Based on the second defect location and the second distance parameters, control the repair device to repair the first defect using a repair beam.

[0082] In some embodiments, the repair device is controlled to emit a repair beam toward the second defect location at a second distance parameter. Thus, the repair device can repair the first defect by passing through the second defect location while focusing on the first defect, thereby improving the repair success rate and repair effect.

[0083] In this disclosure, a repair beam is emitted at a calibrated precise position and a corrected distance, so that the focus of the repair beam is stably located at the defect position, removing or repairing mask defects, reducing accidental damage to surrounding normal film layers and substrates, and improving the quality and consistency of photomask repair.

[0084] In some embodiments, the repair device can align the defect on the photomask with the second defect position determined in step S101 and focus on the defect on the photomask to obtain a second distance parameter, thereby controlling the repair device to repair the first defect with a repair beam based on the second defect position and the second distance parameter.

[0085] In some embodiments, for other defects on the photomask, the steps for repairing the first defect can be referred to to repair other defects, and the specific details will not be elaborated here.

[0086] The method provided in this disclosure introduces a first offset and a second offset. The first offset can be used to calibrate the positional deviation between the defect detection device and the repair device, correct the positioning error between the two devices, and improve the positioning accuracy of the defect. The second offset can be used to achieve successful and precise focusing on the defect, ensuring that the repair beam is accurately focused on the defect position, thereby improving the success rate of defect repair and obtaining a photomask with better performance.

[0087] according to Figure 5 A flowchart of a defect repair method is shown, as follows: Figure 5 As shown, the method includes the following steps: Step S501: Determine the third offset between the first and second positions of the same marker point, and obtain multiple third offsets.

[0088] Step S502: Determine the average of multiple third offsets as the first offset.

[0089] Step S503: Based on each of the multiple repair dimensions, adjust the distance between the lens and the photomask to obtain the third distance parameter corresponding to each repair dimension.

[0090] Step S504: Based on the image sharpness of the region where each second defect is located on the photomask, adjust the distance between the lens and the photomask to obtain the fourth distance parameter corresponding to each repair size.

[0091] Step S505: Based on the third distance parameter and the fourth distance parameter corresponding to each repair size, determine the second offset corresponding to each repair size.

[0092] Step S506: Determine the location of the second defect based on the first offset corresponding to the repair size of the first defect and the first defect location of the first defect on the photomask.

[0093] Step S507: Determine the second distance parameter based on the second offset and the first distance parameter.

[0094] Step S508: Control the repair equipment to emit a repair beam towards the second defect location under the second distance parameter.

[0095] Step S509: Determine if there are other defects. If yes, then identify the defect as the first defect and proceed to step 506; otherwise, end.

[0096] Exemplary embodiments of this disclosure provide a defect repair apparatus, such as Figure 6 As shown in the figure, this disclosure discloses a block diagram of a defect repair device, which includes: The determination module 601 is configured to determine the second defect position based on the first offset and the first defect position of the first defect on the photomask; the first defect position is the defect position of the first defect detected by the defect detection device, and the second defect position is the defect position used by the repair device when repairing the first defect; the first offset is used to characterize the average position offset between the position of the marker point on the photomask detected by the defect detection device and the position detected by the repair device. The determining module 601 is further configured to determine the second distance parameter based on the second offset and the first distance parameter; the first distance parameter is the distance between the lens and the photomask of the repair device when the repair device focuses on the first defect under the reference beam, the second distance parameter is the distance between the lens and the photomask of the repair device when the repair device focuses on the first defect under the repair beam, and the second offset is used to characterize the distance offset between the lens and the photomask when the repair device focuses on the same defect under the reference beam and the repair beam, respectively; The processing module 602 is configured to control the repair device to repair the first defect using a repair beam based on the second defect location and the second distance parameters.

[0097] In some embodiments, a plurality of marker points are provided on the photomask, and the determining module 601 is further configured to: Obtain the first position and the second position of each of the multiple marker points; the first position is the position of the marker point detected by the defect detection device, and the second position is the position of the marker point detected by the repair device. The first offset is determined based on the first position and the second position of each marker point.

[0098] In some embodiments, the determining module 601 is configured to: Determine the third offset between the first and second positions of the same marker point, and obtain multiple third offsets; The average of multiple third offsets is used to determine the first offset.

[0099] In some embodiments, the determining module 601 is further configured to: Based on each of the multiple repair sizes, the distance between the lens and the photomask is adjusted to obtain a third distance parameter corresponding to each repair size; the third distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the reference beam, and the repair size is the repair size of the second defect; Based on the image sharpness of the region where each second defect is located on the photomask, the distance between the lens and the photomask is adjusted to obtain a fourth distance parameter corresponding to each repair size; the fourth distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the repair beam; Based on the third distance parameter and the fourth distance parameter corresponding to each repair size, the second offset corresponding to each repair size is determined.

[0100] In some embodiments, the determining module 601 is further configured to: For each second defect, focus on the second defect; In response to the size of the focus area of ​​the reference beam on the photomask and the repair size of the second defect, the repair device is determined to focus on the second defect under the reference beam.

[0101] In some embodiments, the determining module 601 is further configured to: For each second defect, focus on the second defect; In response to the fact that the image sharpness of the area where the second defect is located, obtained by the repair equipment, is greater than a preset sharpness threshold, the repair equipment is determined to focus on the second defect under the repair beam.

[0102] In some embodiments, the determining module 601 is further configured to: Based on the defect size of the first defect, determine the repair size of the first defect; the repair size of the first defect is larger than the defect size of the first defect. Based on the repair size of the first defect and the second offset corresponding to each repair size among multiple repair sizes, determine the second offset corresponding to the repair size of the first defect; Module 601 is configured as follows: The second distance parameter is determined based on the second offset corresponding to the repair size of the first defect and the first distance parameter.

[0103] In some embodiments, the processing module 602 is configured to: The repair equipment is controlled to emit a repair beam toward the second defect location at the second distance parameter.

[0104] Each module in the aforementioned defect repair device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of the electronic device in hardware form or independently of it, or stored in the memory of the electronic device in software form, so that the processor can call and execute the operations corresponding to each module.

[0105] In one exemplary embodiment, an electronic device is provided, including a processor and a memory, the memory storing a computer program, the processor executing the computer program to implement the steps of any of the above-described defect repair methods.

[0106] In one exemplary embodiment, a computer-readable storage medium is provided, on which a computer program is stored, which, when executed by a processor, implements the steps of any of the defect-repairing methods described above. The computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, or optical data storage device, etc.

[0107] refer to Figure 7 The following description serves as a structural block diagram of the electronic device 700 disclosed herein. The electronic device 700 includes a computing unit 701, which can perform various appropriate actions and processes based on a computer program stored in a read-only memory (ROM) 702 or a computer program loaded from a storage unit 708 into a random access memory (RAM) 703. The RAM 703 may also store various programs and data required for the operation of the electronic device 700. The computing unit 701, ROM 702, and RAM 703 are interconnected via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0108] Multiple components in electronic device 700 are connected to I / O interface 705, including: input unit 706, output unit 707, storage unit 708, and communication unit 709. Input unit 706 can be any type of device capable of inputting information to electronic device 700. Input unit 706 can receive input digital or character information and generate key signal inputs related to user settings and / or function control of electronic device 700, and may include, but is not limited to, a mouse, keyboard, touchscreen, trackpad, trackball, joystick, microphone, and / or remote control. Output unit 707 can be any type of device capable of presenting information, and may include, but is not limited to, a monitor, speaker, video / audio output terminal, vibrator, and / or printer. Storage unit 708 may include, but is not limited to, a hard disk and an optical disk. Communication unit 709 allows electronic device 700 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks, and may include, but is not limited to, modems, network cards, infrared communication devices, wireless communication transceivers, and / or chipsets, such as Bluetooth™ devices, WiFi devices, WiMaX devices, cellular communication devices, and / or the like.

[0109] The computing unit 701 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 701 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 701 performs the various methods and processes described above, such as defect repair methods. For example, in some embodiments, the defect repair method may be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 708. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 700 via ROM 702 and / or communication unit 709. When the computer program is loaded into RAM 703 and executed by the computing unit 701, one or more steps of the defect repair method described above may be performed. Alternatively, in other embodiments, the computing unit 701 may be configured to perform defect repair methods by any other suitable means (e.g., by means of firmware).

[0110] The electronic device 700 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the aforementioned defect repair methods.

[0111] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0112] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A defect repair method, characterized in that, include: The location of the second defect is determined based on the first offset and the location of the first defect on the photomask; The first defect location is the defect location of the first defect detected by the defect detection device, the second defect location is the defect location used by the repair device when repairing the first defect, and the first offset is used to characterize the average position offset between the location of the marker point on the photomask detected by the defect detection device and the location detected by the repair device. The second distance parameter is determined based on the second offset and the first distance parameter; the first distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the reference beam; the second distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the repair beam; the second offset is used to characterize the distance offset between the lens and the photomask when the repair device focuses on the same defect under the reference beam and the repair beam, respectively. Based on the second defect location and the second distance parameter, the repair device is controlled to repair the first defect using the repair beam.

2. The defect repair method according to claim 1, characterized in that, The photomask has multiple marker points, and the method further includes: Obtain a first position and a second position for each of the plurality of marker points; the first position is the position of the marker point detected by the defect detection device, and the second position is the position of the marker point detected by the repair device; The first offset is determined based on the first position and the second position of each of the marker points.

3. The defect repair method according to claim 2, characterized in that, Determining the first offset based on the first position and the second position of each of the marker points includes: Determine a third offset between the first and second positions of the same marker point to obtain multiple third offsets; The average of the plurality of third offsets is determined as the first offset.

4. The defect repair method according to claim 1, characterized in that, The method further includes: Based on each of the multiple repair sizes, the distance between the lens and the photomask is adjusted to obtain a third distance parameter corresponding to each repair size; the third distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the reference beam, and the repair size is the repair size of the second defect; Based on the image sharpness of each region where the second defect is located on the photomask, the distance between the lens and the photomask is adjusted to obtain a fourth distance parameter corresponding to each repair size; the fourth distance parameter is used to characterize the distance between the lens and the photomask when the repair device focuses on the second defect under the repair beam; Based on the third distance parameter and the fourth distance parameter corresponding to each of the repair dimensions, a second offset corresponding to each of the repair dimensions is determined.

5. The defect repair method according to claim 4, characterized in that, The method further includes: For each of the second defects, focus on the second defect; In response to the matching of the size of the focusing area of ​​the reference beam on the photomask and the repair size of the second defect, the repair device is determined to focus on the second defect under the reference beam.

6. The defect repair method according to claim 4, characterized in that, The method further includes: For each of the second defects, focus on the second defect; In response to the fact that the image sharpness of the area where the second defect is located, obtained by the repair device, is greater than a preset sharpness threshold, the repair device is determined to focus on the second defect under the repair beam.

7. The defect repair method according to claim 4, characterized in that, The method further includes: Based on the defect size of the first defect, the repair size of the first defect is determined; the repair size of the first defect is larger than the defect size of the first defect. Based on the repair size of the first defect and the second offset corresponding to each of the plurality of repair sizes, the second offset corresponding to the repair size of the first defect is determined; The determination of the second distance parameter based on the second offset and the first distance parameter includes: The second distance parameter is determined based on the second offset corresponding to the repair size of the first defect and the first distance parameter.

8. The defect repair method according to claim 1, characterized in that, The step of controlling the repair device to repair the first defect using the repair beam based on the second defect location and the second distance parameter includes: The repair device is controlled to emit the repair beam toward the second defect location at the second distance parameter.

9. A defect repair device, characterized in that, include: The determination module is configured to determine the second defect location based on a first offset and the first defect location of a first defect on a photomask; The first defect location is the defect location of the first defect detected by the defect detection device, the second defect location is the defect location used by the repair device when repairing the first defect, and the first offset is used to characterize the average position offset between the location of the marker point on the photomask detected by the defect detection device and the location detected by the repair device. The determining module is further configured to determine a second distance parameter based on a second offset and a first distance parameter; the first distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the reference beam; the second distance parameter is the distance between the lens of the repair device and the photomask when the repair device focuses on the first defect under the repair beam; the second offset is used to characterize the distance offset between the lens and the photomask when the repair device focuses on the same defect under the reference beam and the repair beam, respectively. The processing module is configured to control the repair device to repair the first defect using the repair beam based on the second defect location and the second distance parameter.

10. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 8.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

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