Electronic device

Abstract

This application discloses an electronic device, including an antenna radiator, a display module, and a current blocking component. The display module includes a frame and a flexible display panel, with a portion of the flexible display panel located on one side of the frame. The flexible display panel is provided with a first connecting piece, which is electrically connected to the frame. The current blocking component is electrically connected to a reference ground of the flexible display panel and the first connecting piece, respectively, and is used to block the coupling current at the connection point between the first connecting piece and the frame. The electronic device of this application, by adding a current blocking component, impedes and suppresses the coupling current formed at the connection point between the first connecting piece and the frame, thereby making it less prone to harmonic generation at the connection point, avoiding spurious radiation problems, ensuring the stability of the fundamental signal of the electronic device, and without affecting the radiation efficiency of the antenna and the system efficiency.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices. Background Technology

[0002] A smartphone display module typically consists of a frame, a flexible display board (FDI), and a display driver integrated circuit (DDIC), which is usually located on the FDI. To improve the noise immunity of the DDI, in addition to shielding the DDI, the reference ground of the FDI also needs to be electrically connected to the frame using conductive adhesive.

[0003] In addition, smartphones typically have an antenna radiator to support their wireless communication functions. When the antenna radiator radiates electromagnetic waves corresponding to its operating frequency band, based on the principle of electromagnetic induction, coupling currents corresponding to those electromagnetic waves may be induced on metal components located within the antenna's radiation range. For example, when the antenna radiator is operating, coupling currents may be generated on the reference ground and frame of the display's flexible flex panel near the antenna radiator.

[0004] When the conductive adhesive malfunctions, preventing sufficient electrical connection between the reference ground of the display screen's flexible board and the frame, harmonics will be generated at the electrical connection point due to the passive intermodulation (PIM) effect. These harmonics will be radiated outward through the cavity formed between the mid-frame and the frame, or through the phone's original antenna radiator, leading to radiated spurious emission (RSE) and affecting the stability of the phone's fundamental signal. Summary of the Invention

[0005] The purpose of this application is to provide an electronic device that, by adding a current-blocking component, obstructs and suppresses the coupling current formed at the connection between the first connecting piece and the frame, thereby making it less likely for harmonics to be generated at the connection between the first connecting piece and the frame.

[0006] In a first aspect, this application provides an electronic device, which includes an antenna radiator, a display module, and a current blocking element.

[0007] The display module includes a frame and a display flexible plate. Part of the display flexible plate is located on one side of the frame. The display flexible plate is provided with a first connecting piece, which is electrically connected to the frame.

[0008] The current blocking component is electrically connected to the reference ground of the display screen flex plate and the first connecting piece, respectively. The current blocking component is used to block the coupling current at the connection between the first connecting piece and the frame.

[0009] The electronic device in this application, by adding a current-blocking element between the first connecting piece of the display screen flexible plate and the reference ground, and then electrically connecting the first connecting piece to the frame, thereby blocking and suppressing the coupling current formed at that point by the antenna radiator or other components (such as charging coils, linear motors, etc.). Even if the first connecting piece and the frame cannot be fully electrically connected, the coupling current flowing to the connection point between the first connecting piece and the frame is reduced, so harmonics are not easily generated at that point, avoiding spurious radiation problems and ensuring the stability of the fundamental wave signal of the electronic device.

[0010] Furthermore, simulation tests have shown that adding a suitable current-blocking device to the electronic device in this application will not affect the radiation efficiency of the electronic device antenna or the system efficiency. Under the premise of ensuring the basic function of the electronic device antenna, it can effectively suppress the generation of harmonics.

[0011] In one possible design, the coupling current is the current generated at the connection point between the first connecting piece and the frame when the antenna radiator is operating.

[0012] In one possible design, the current blocking element is located on the flexible panel of the display screen.

[0013] By directly mounting the current blocking component onto the flexible display board, it can be encapsulated on the board during the manufacturing process. This simplifies the circuit routing of the current blocking component, reducing its assembly difficulty in the overall device. Furthermore, the integrated structure of the current blocking component and the flexible display board enhances the board's integration, making it more suitable for miniaturized and thinner applications.

[0014] In one possible design, on the side facing the frame, the display flexible panel has a first isolation layer and a first metal layer stacked from the outside to the inside, the first metal layer constituting the reference ground of the display flexible panel; the first isolation layer and the first metal layer have a first receiving groove, and the first connecting piece and the current blocking element are both located in the first receiving groove.

[0015] After the first connecting piece is electrically connected to the frame through the adhesive, since the current blocking element is located in the first receiving groove, it will not protrude from the surface of the first insulating layer, thereby avoiding interference and obstruction of the frame by the current blocking element. This makes the distance between the first connecting piece and the frame close enough and the gap small, making it easier to establish the electrical connection between the first connecting piece and the frame using the adhesive.

[0016] In one possible design, the reference ground of the display flex panel is also directly electrically connected to the frame.

[0017] This further improves the noise leakage prevention and noise immunity capabilities of the driver chip.

[0018] In one possible design, on the side facing the frame, the display flexible panel has a first isolation layer and a first metal layer stacked from the outside to the inside. The first metal layer constitutes a reference ground for the display flexible panel, and the first isolation layer has a cutout area to expose a portion of the first metal layer. The exposed portion of the first metal layer is electrically connected to the frame through a connector.

[0019] The exposed portion of the first metal layer is directly electrically connected to the frame via a connector. Compared to designing wiring separately, this method is less difficult to design and manufacture, and easier to implement.

[0020] In one possible design, the antenna radiator is positioned at a corner of the electronic device; the distance from the geometric center of the first connecting piece to the corner is less than the distance from the geometric center of the exposed portion to the corner.

[0021] The exposed portions of the first connecting piece and the first metal layer are designed in such a way that harmonics can be avoided between the exposed portion of the first metal layer and the frame due to coupling current.

[0022] In one possible design, the first connecting piece and the exposed portion are arranged side by side along the length or width of the electronic device.

[0023] In one possible design, a driver chip is located on the side of the flexible display panel facing away from the frame, and the driver chip is covered with a shield; there are two first connecting pieces arranged such that, along the width direction of the electronic device, the projections of the two first connecting pieces on the frame are located on both sides of the projection of the driver chip on the frame; a current blocking element is provided between each first connecting piece and the reference ground of the flexible display panel.

[0024] The first connecting pieces on both sides of the driver chip are electrically connected to the frame, which is more beneficial for improving the driver chip's noise leakage prevention and noise immunity. In addition, a current blocking element is provided between each first connecting piece and the reference ground of the display flexible board, which can ensure that all first connecting pieces are not affected by coupling current and avoid generating harmonics.

[0025] In one possible design, the current-impeding component includes at least one of a resistor, an inductor, and a capacitor.

[0026] In one possible design, the current-blocking element is a resistor with a resistance value greater than or equal to 0.05Ω and less than or equal to 10Ω.

[0027] While reducing the coupling current at the connection point between the first connecting piece and the frame, the radiation efficiency of the antenna and the system efficiency can be guaranteed.

[0028] In one possible design, the first connecting piece is electrically connected to the frame via a connector, which includes at least one of solder paste, conductive adhesive, and conductive silver paste.

[0029] Secondly, this application also provides an electronic device, which includes an antenna radiator, a display module, a circuit board, electrical connectors, and current blocking components.

[0030] The display module includes a frame.

[0031] The circuit board is located on one side of the frame and has a second connecting piece.

[0032] Electrical connectors are located between the frame and the circuit board, and are electrically connected to the frame and the second connecting piece respectively.

[0033] The current blocking component is electrically connected to the reference ground of the circuit board and the second connecting piece, respectively. The current blocking component is used to block the coupling current at the connection between the second connecting piece and the frame.

[0034] The electronic device in this application, by adding a current-blocking element between the second connecting piece of the circuit board and the reference ground, and then electrically connecting the second connecting piece to the frame through an electrical connector, thereby blocking and suppressing the coupling current formed by the antenna radiator or other components at that location. Even if the contact interface between the frame and the electrical connector is abnormal, preventing sufficient contact between the electrical connector and the frame, the current flowing to the contact point between the electrical connector and the frame is small. Therefore, harmonics are not easily generated at the contact point between the electrical connector and the frame, avoiding spurious radiation problems and ensuring the stability of the fundamental signal of the electronic device.

[0035] Furthermore, simulation tests have shown that adding a suitable current-blocking device to the electronic device in this application will not affect the radiation efficiency of the electronic device antenna or the system efficiency. Under the premise of ensuring the basic function of the electronic device antenna, it can effectively suppress the generation of harmonics.

[0036] In one possible design, the coupling current is the current generated when the antenna radiator is operating at the connection point between the second connecting piece and the frame.

[0037] In one possible design, the current blocking element is located on the circuit board.

[0038] By directly mounting the current barrier on the circuit board, the current barrier can be packaged on the circuit board during the manufacturing stage. This facilitates the circuit routing of the current barrier and reduces the assembly difficulty of the current barrier in the whole device. At the same time, the current barrier and the circuit board are integrated into one structure, which can improve the integration of the flexible board and is more conducive to miniaturization and thinner applications.

[0039] In one possible design, on the side facing the frame, the circuit board has a second isolation layer and a second metal layer stacked from the outside to the inside, the second metal layer constituting the reference ground of the circuit board; the second isolation layer and the second metal layer have a second receiving groove, and the second connecting piece and the current blocking element are both located in the second receiving groove.

[0040] Since the current blocking element is located in the second receiving groove, it will not protrude from the surface of the second isolation layer, thereby avoiding interference and obstruction of the current blocking element in the installation process of the conductive spring, which is more conducive to the implementation of the assembly process.

[0041] In one possible design, the electronic device also includes a mid-frame located on the side of the circuit board facing away from the frame; the circuit board is a small board for setting current-blocking components, and the circuit board is fixed to the mid-frame.

[0042] The circuit board is a small board specifically designed for mounting current-blocking components. This design is flexible and makes it easy to install the small board. After the small board is fixed to the middle frame, the middle frame can provide good support, allowing the small board to fit firmly with the frame and compress the electrical connectors.

[0043] In one possible design, the second metal layer is electrically connected to the mid-frame.

[0044] After electrically connecting the second metal layer to the middle frame, the grounding effect of the small board can be further improved. The specific reason is that after the second metal layer is electrically connected to the middle frame, the static electricity and interference current accumulated on the display module flow through the frame, conductive spring, and small board to the metal middle frame, and then the metal middle frame conducts the current to the user's hand or the external environment, so as to reduce the impact of static electricity and interference current on the display module and ensure the normal operation of the display module.

[0045] In one possible design, the electronic device also includes a mid-frame located between the circuit board and the frame; the circuit board is the motherboard of the electronic device, and the mid-frame is provided with clearance holes through which electrical connectors pass and are electrically connected to the second connecting piece.

[0046] Circuit boards are the motherboards of electronic devices. It is convenient to set current-blocking components on the motherboard. The current-blocking components can be prefabricated during the motherboard manufacturing stage, which can improve the integration of devices and make them more suitable for use in miniaturization and thinning scenarios.

[0047] In one possible design, the electrical connector is a conductive spring or conductive foam.

[0048] In one possible design, when the electrical connector is a conductive spring, the base of the conductive spring is fixed to and electrically connected to the second connecting piece.

[0049] In one possible design, the current-impeding component includes at least one of a resistor, an inductor, and a capacitor.

[0050] In one possible design, the current-blocking element is a resistor with a resistance value greater than or equal to 0.05Ω and less than or equal to 10Ω.

[0051] While reducing the coupling current at the connection between the second connecting piece and the frame, the radiation efficiency of the antenna can be guaranteed. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of a smartphone provided in an embodiment of this application;

[0053] Figure 2 This is an exploded view of a smartphone provided in an embodiment of this application;

[0054] Figure 3 yes Figure 1 Sectional view of AA;

[0055] Figure 4 This is a partial cross-sectional view of the display screen flexographic panel and frame in related technologies;

[0056] Figure 5 This is a top view of the display flex panel and mid-frame in related technologies;

[0057] Figure 6 This is a partial schematic diagram of an example of a flexible display panel provided in an embodiment of this application;

[0058] Figure 7 yes Figure 6 A schematic diagram showing the usage status of the flexible display panel in the overall machine;

[0059] Figure 8 This is a partial schematic diagram of another example of the flexible display panel provided in the embodiments of this application;

[0060] Figure 9 yes Figure 8 A cross-sectional view of an example of CC;

[0061] Figure 10 yes Figure 9 A schematic diagram showing the first connecting piece in the middle being electrically connected to the frame;

[0062] Figure 11 yes Figure 8 A cross-sectional view of another example of CC;

[0063] Figure 12 yes Figure 8 A schematic diagram showing the usage status of the flexible display panel in the overall machine;

[0064] Figure 13 This is a partial schematic diagram of another example of the flexible display panel provided in the embodiments of this application;

[0065] Figure 14 yes Figure 13 Sectional view of DD;

[0066] Figure 15 yes Figure 14 A schematic diagram showing the exposed portion of the first metal layer electrically connected to the frame.

[0067] Figure 16 This is a partial schematic diagram of another example of the flexible display panel provided in the embodiments of this application;

[0068] Figure 17 This is a schematic diagram of the display screen flexible panel and antenna radiator provided in the embodiments of this application;

[0069] Figure 18 yes Figure 1 Sectional view of BB;

[0070] Figure 19 This is a top view of the electrical connector and the middle frame in the embodiments of this application;

[0071] Figure 20 yes Figure 18 Enlarged view of an example of the frame, conductive spring, circuit board, and middle frame;

[0072] Figure 21 yes Figure 18 Enlarged view of the frame, conductive spring, circuit board, and another example of the middle frame;

[0073] Figure 22 This is a cross-sectional view of the frame, conductive spring, circuit board, and middle frame provided in the embodiments of this application;

[0074] Figure 23 This is a cross-sectional view of an example of the frame, conductive foam, circuit board, and middle frame provided in the embodiments of this application;

[0075] Figure 24 This is a cross-sectional view of another example of the frame, conductive foam, circuit board, and middle frame provided in the embodiments of this application;

[0076] Figure 25 This is a schematic diagram of the current distribution of a display screen flexible panel in related technologies and the display screen flexible panel in the embodiments of this application;

[0077] Figure 26 This is a schematic diagram of the current curve of an example of a display screen flexible plate in related technologies and a display screen flexible plate in the embodiments of this application;

[0078] Figure 27 This is a schematic diagram of the current curve of a display screen flexible panel in an embodiment of this application when using different resistors;

[0079] Figure 28 This is a schematic diagram illustrating an example of the impact of using a current-blocking element on antenna radiation efficiency and antenna system efficiency of the flexible display panel in this application embodiment.

[0080] Figure 29 This is a schematic diagram of the current curve of a display screen flexible panel in an embodiment of this application before the use of a current blocking element;

[0081] Figure 30 This is a schematic diagram of the current curve of an example of the flexible display panel in this application after adopting a current blocking element;

[0082] Figure 31 This is a schematic diagram of the current curve of another example of the display screen flexible plate in the embodiments of this application before the use of the current blocking element;

[0083] Figure 32 This is a schematic diagram of the current curve of another example of the flexible display panel in the embodiments of this application after adopting a current blocking element;

[0084] Figure 33 This is a schematic diagram illustrating an example of the impact of using a current-blocking element on antenna radiation efficiency and antenna system efficiency of the flexible display panel in this application embodiment.

[0085] Figure 34 This is a schematic diagram of the current curve of another example of the flexible display panel in the embodiments of this application when using different resistors;

[0086] Figure 35 This is a schematic diagram of the current curves of the circuit board in the embodiments of this application when using different resistors;

[0087] Figure 36 This is a schematic diagram of the antenna radiation efficiency curve of the circuit board in the embodiment of this application after adopting a current blocking element;

[0088] Figure 37 This is a schematic diagram of the antenna system efficiency curve after the circuit board in the embodiment of this application adopts a current blocking element.

[0089] Figure label:

[0090] 11', Frame; 12', Display Flexographic Panel; 122', Reference Ground; 14', Driver Chip; 141', Shielding Cover; 20', Antenna Radiator; 40', Conductive Adhesive; 71', Middle Frame;

[0091] 10. Display module; 11. Frame; 12. Display flexible plate; 121. First connecting piece; 123. First metal layer; 123a. Exposed part; 124. First isolation layer; 125. First receiving groove; 13. Light-transmitting cover; 14. Driver chip; 141. Shielding cover;

[0092] 20. Antenna radiator;

[0093] 30. Current-blocking components; 31. Metal wire; 32. Solder paste;

[0094] 40. Connecting agent;

[0095] 50. Circuit board; 51. Second connecting piece; 53. Second metal layer; 54. Second isolation layer; 55. Second receiving groove; 56. Solder pad;

[0096] 60. Electrical connectors; 61. Conductive springs; 62. Conductive foam;

[0097] 70. Housing; 71. Mid-frame; 711. Clearance hole; 72. Rear cover. Detailed Implementation

[0098] The following are exemplary descriptions of relevant content that may be involved in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0099] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0100] In the description of this application, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0101] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or part as an example in the figure. It should be understood that the reference numerals are also applicable to other identical parts or parts.

[0102] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0103] The electronic device provided in this application embodiment may also be referred to as a mobile device, terminal device, mobile terminal, or terminal. This electronic device includes, but is not limited to, handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem. For example, the electronic device may include a smartwatch, smart wristband, smartphone, personal digital assistant (PDA) computer, tablet computer, laptop computer, in-vehicle computer, smart glasses, handheld game console, and other electronic devices with antenna radiators that require harmonic suppression.

[0104] To more conveniently illustrate the electronic devices provided in the embodiments of this application, and as an example rather than a limitation, the technical solutions of this application will be described in detail below using a smartphone as an example. The smartphones provided in the embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0105] Figure 1 This is a schematic diagram of a smartphone provided in an embodiment of this application. Wherein, Figure 1 (a) in the image is a front view of a smartphone; Figure 1 (b) is a schematic diagram of the back of a smartphone. Figure 2 This is an exploded view of a smartphone provided in an embodiment of this application. Figure 3 yes Figure 1 A cross-sectional view of AA. For the convenience of the following description of the embodiments, an XYZ coordinate system is established for the smartphone. Specifically, the extension direction of the short side of the smartphone is defined as the X direction, the extension direction of the long side of the smartphone is defined as the Y direction, and the thickness direction of the smartphone is defined as the Z direction, and the X, Y, and Z directions are all perpendicular to each other.

[0106] like Figures 1-3As shown, the smartphone provided in this embodiment includes a display module 10 and a housing 70. The housing 70 further includes a mid-frame 71 and a back cover 72 (or battery cover). The display module 10 is fixedly mounted on the front end of the mid-frame 71, and the back cover 72 is fixedly mounted on the rear end of the mid-frame 71. The display module 10, the mid-frame 71, and the back cover 72 together define the accommodating space of the smartphone, which is used to install various functional components of the smartphone, such as the current blocking element 30, the electrical connector 60, the circuit board 50, and other functional components mentioned later.

[0107] The middle frame 71 can be made of metal and includes a middle plate and a frame surrounding the middle plate. The back cover 72 can be attached to the frame by means of screwing, snapping, or gluing. A sealing ring can be provided between the back cover 72 and the frame to improve the sealing and waterproof effect at the joint between the back cover 72 and the frame. The sealing ring can be made of highly elastic materials such as silicone or rubber.

[0108] In addition, smartphones may also include functional components such as a processor, a universal serial bus (USB) interface, a charging management module, a power management module, a mobile communication module, a wireless communication module, an audio module, a headphone jack, a sensor module, buttons, and a subscriber identification module (SIM) card interface.

[0109] These functional components can be modified according to user needs. It is understood that the specific embodiments described above are only one specific implementation of this application. Other ways to implement the solution of this application are also within the scope of protection of this application, and will not be elaborated here.

[0110] Continue as Figure 3 As shown, the display module 10 can be a liquid crystal display (LCD) module, which has the advantages of low power consumption, low radiation, thin body and soft screen. It has become the mainstream display in the field of display technology and is widely used in electronic devices such as smartphones, smartwatches, tablets, laptops, and televisions.

[0111] The display module 10 includes a thin film transistor (TFT), a light guide plate (LGP), and a light source. Since the thin film transistor itself does not emit light, it needs to be backlit by a side-lit light source. The light guide plate is used to disperse the light emitted by the light source so that the point light emitted by the light source can be uniformly irradiated onto the thin film transistor as a planar light.

[0112] In addition, the display module 10 also includes a light-transmitting cover plate 13, a frame 11, a display flexible plate 12, and a driver chip 14. The light guide plate, light source, and other components are located inside the frame 11, which is made of metal or a combination of plastic and metal. The frame 11 supports and protects the light guide plate and light source, while also providing shielding and heat dissipation. The display flexible plate 12 connects the thin-film transistor and the driver chip 14, thereby achieving electrical interconnection between them. The main function of the driver chip 14 is to send drive signals and data to the thin-film transistor in the form of electrical signals, enabling image information such as letters and pictures to be displayed on the display module 10.

[0113] The flexible display PCB 12 is curved after being led out from the thin-film transistor, with its end extending to the back side of the frame 11 and electrically connected to the motherboard. The driver chip 14 is disposed on the side of the frame 11 opposite to the light-transmitting cover 13 via the flexible display PCB 12. This design allows the driver chip 14 to be stacked with the frame 11, thereby reducing the number and size of components around the frame 11, which is beneficial for the narrow black border design of the display.

[0114] The driver chip 14 is located on the side of the display flexible panel 12 facing away from the frame 11, and a shield 141 is provided on the outside of the driver chip 14 to prevent the noise generated by the driver chip 14, such as shot noise, thermal noise, flicker noise, burst noise, and avalanche noise, from affecting other functional components of the smartphone, such as the antenna and camera module. The shield 141 also reduces noise generated by the external environment, decreasing noise from external electromagnetic fields and radio frequency interference, thereby improving the noise immunity of the driver chip 14 and ensuring its normal operation. In addition to improving the noise leakage prevention and noise immunity of the driver chip 14 through the shield 141, related technologies also use special grounding designs to improve the noise leakage prevention and noise immunity of the driver chip 14, which will be described in detail below with reference to the accompanying drawings.

[0115] Figure 4 This is a partial cross-sectional view of the display screen flexographic panel 12' and the frame 11' in the related technology. Figure 5 This is a top view of the display flex panel 12' and the middle frame 71' in related technologies. It should be noted that, for ease of display of the display flex panel 12', the curved portion of the display flex panel 12' has been cut off. Figure 5 Only the portion of the display flex panel 12' between the frame 11' and the middle frame 71' is shown.

[0116] like Figures 4-5As shown, in related technologies, the reference ground 122' of the display flexible plate 12' is located on the side of the display flexible plate 12' facing the frame 11'. The reference ground 122' of the display flexible plate 12' is directly electrically connected to the frame 11' by conductive adhesive 40'. This allows noise generated by the external environment to be conducted to the frame 11', making it less likely to enter the shielding cover 141' and affect the driver chip 14'. At the same time, even if the noise generated by the driver chip 14' leaks out from the shielding cover 141', it can be conducted to the frame 11', thereby avoiding the impact on other functional components of the smartphone.

[0117] See also Figure 5 As shown, smartphones typically include an antenna radiator 20', which supports the smartphone's wireless communication functions, enabling 2G, 3G, 4G, and / or 5G-based wireless communication. In related fields, insert molding is commonly used to integrate the mid-frame 71' and the antenna radiator 20' into a single structure, thereby reducing the overall size of both and simplifying subsequent phone assembly. Alternatively, the frame of the mid-frame 71' can be designed as a metal frame, serving as either the antenna radiator 20' or a part of it, radiating electromagnetic waves outwards. In either case, the antenna radiator 20' is typically positioned at the corners and edges of the mid-frame 71'.

[0118] When the antenna radiator 20' radiates electromagnetic waves corresponding to its operating frequency band, based on the principle of electromagnetic induction, a coupling current corresponding to that electromagnetic wave may be excited on a metal component located within the antenna's radiation range. For example, Figure 5 As shown, when the antenna radiator 20' is working, a coupling current will be formed on the reference ground 122' and the frame 11' of the display flexible board 12' located near the antenna radiator 20'. When the conductive adhesive 40' between the reference ground 122' and the frame 11' of the display flexible board 12' is insufficient due to tolerance, or when the conductive adhesive 40' ages, or when the entire device is dropped and the conductive adhesive 40' falls off, the reference ground 122' of the display flexible board 12' and the frame 11' will not be able to achieve sufficient electrical connection through the conductive adhesive 40'. At this time, harmonics will be generated at the electrical connection point due to passive intermodulation effect. These harmonics will be radiated outward through the cavity formed between the middle frame 71' and the frame 11', or through the original antenna radiator 20' of the mobile phone. This will cause radiation spurious problems, which will affect the stability of the mobile phone's fundamental wave signal.

[0119] In view of this, in order to solve the above-mentioned technical problems, this application provides a smartphone that, by adding a current blocking component 30, obstructs and suppresses the coupling current formed at the connection between the first connecting piece 121 and the frame 11, thereby making it less likely for harmonics to be generated at the connection between the first connecting piece 121 and the frame 11.

[0120] The design scheme of adding a current blocking element 30 between the first connecting piece 121 and the reference ground in the embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0121] Figure 6 This is a partial schematic diagram of an example of the flexible display panel 12 provided in the embodiments of this application. It should be noted that... Figure 6 The portion of the flexible display panel 12 that is curved in an arc shape has been cut off. A similar illustrative effect is also used in the accompanying drawings of the flexible display panel 12 in the embodiments described later. The illustrative description of this part will not be repeated in the following text. Figure 7 yes Figure 6 A schematic diagram showing the usage status of the flexible display panel 12 in the whole machine.

[0122] like Figures 6-7 As shown, in the smartphone provided in this application embodiment, the display flexible plate 12 is provided with a first connecting piece 121, and the first connecting piece 121 is electrically connected to the frame 11 through a connector 40. Figures 6-7 (The frame 11 and connector 40 are not shown). The antenna radiator 20 is disposed near the first connecting piece 121. The current blocking element 30 is electrically connected to the reference ground of the display screen flexographic plate 12 and the first connecting piece 121, respectively. The current blocking element 30 is used to block the coupling current at the connection between the first connecting piece 121 and the frame 11. The coupling current is the current generated at the connection between the first connecting piece 121 and the frame 11 when the antenna radiator 20 is working.

[0123] In addition to being electrically connected by the adhesive 40, the first connecting piece 121 and the frame 11 can also be electrically connected by mutual abutment.

[0124] The smartphone provided in this application embodiment adds a current blocking element 30 between the first connecting piece 121 of the display flexible plate 12 and the reference ground, and then electrically connects the first connecting piece 121 and the frame 11 through a connector 40, or the first connecting piece 121 and the frame 11 are electrically connected by mutual abutment. The current blocking element 30 can block and suppress the coupling current formed by the antenna radiator 20. Even if the connector 40 is abnormal, or the first connecting piece 121 and the frame 11 cannot abut each other, making it impossible to fully electrically connect the first connecting piece 121 and the frame 11, the coupling current flowing to the connection point of the first connecting piece 121 and the frame 11 is reduced, so harmonics are not easily generated at that point, avoiding radiation spurious problems and ensuring the stability of the smartphone's fundamental wave signal.

[0125] Furthermore, simulation tests have shown that adding an adapted current blocking component 30 to the smartphone provided in this application embodiment does not affect the radiation efficiency and system efficiency of the mobile phone antenna. Under the premise of ensuring the basic functions of the mobile phone antenna, it can effectively suppress the generation of harmonics.

[0126] In addition to the coupling current generated when the antenna radiator 20 is working, some components inside the mobile phone also generate electromagnetic waves under the mutual stimulation of changing electric and magnetic fields, and generate coupling current between the reference ground of the display flex board and the frame, such as charging coils, linear motors, etc. The technical solution in this application embodiment can also hinder and suppress the coupling current generated when these components are working.

[0127] Optionally, the reference ground of the display screen flexographic plate 12 and the reference ground of the circuit board 50 in the following embodiments can be a metal layer therein. The metal layer can be any one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium, or an alloy of multiple metals.

[0128] In some embodiments provided in this application, the connector 40 can be solder paste, conductive adhesive, conductive silver paste, etc. Specifically, in one embodiment provided in this application, the connector 40 is a conductive adhesive, which is mainly composed of conductive particles (which conduct electricity) and an adhesive (which bonds), and has the advantages of low cost, high conductivity stability and durability.

[0129] In some embodiments provided in this application, the current blocking element 30 can be a resistor, an inductor, or a capacitor. Resistors, inductors, and capacitors can all impede the current in the circuit, thereby reducing the coupling current flowing to the connection point between the first connecting piece 121 and the frame 11, and thus avoiding the generation of harmonics.

[0130] In order to avoid the resistor from adversely affecting the radiation efficiency and system efficiency of the mobile phone antenna, in some embodiments provided in this application, when the current blocking element 30 is a resistor, the resistance value of the resistor is greater than or equal to 0.05Ω and less than or equal to 10Ω. For example, resistors with resistance values ​​of 0.05Ω, 1Ω, 3Ω, 5Ω, 8Ω, 10Ω, etc. can be selected as the current blocking element 30. While achieving the purpose of reducing the coupling current at the connection between the first connecting piece 121 and the frame 11, the radiation efficiency and system efficiency of the antenna can be guaranteed.

[0131] In addition to resistors, current-impeding components 30 can also be inductors and capacitors. An inductor is a component that converts electrical energy into magnetic energy and stores it. When the circuit is connected, the inductor impedes the flow of current. In this embodiment, the inductance value of the inductor is less than or equal to 10nH. A capacitor is mainly used to store charge and electrical energy. It consists of two conductors close together with a non-conductive insulating medium in between. When a voltage is applied across the capacitor, it stores charge, thereby impeding the flow of current. In this embodiment, the capacitance value of the capacitor is less than or equal to 10nF.

[0132] The current blocking element 30 can be disposed outside the display flexible board 12, for example, on the mobile phone motherboard, or on a small board such as the camera module. Alternatively, the current blocking element 30 and the display flexible board 12 can be designed as an integrated structure; that is, in one embodiment provided in this application, the current blocking element 30 is disposed on the display flexible board 12.

[0133] In this embodiment, the current blocking component 30 is directly disposed on the flexible display board 12. The current blocking component 30 can be directly encapsulated on the flexible display board 12 during the processing and manufacturing stage of the flexible display board 12. This facilitates the circuit routing of the current blocking component 30, thereby reducing the assembly difficulty of the current blocking component 30 in the whole machine. At the same time, the current blocking component 30 and the flexible display board 12 are integrated structures, which can improve the integration of the flexible board and is more conducive to miniaturized and thinner application scenarios.

[0134] Figure 8 This is a partial schematic diagram of another example of the flexible display panel 12 provided in the embodiments of this application. Figure 9 yes Figure 8 A cross-sectional view of an example of CC.

[0135] like Figures 8-9 As shown, in one embodiment provided in this application, on the side facing the frame 11, the display screen flexible panel 12 is provided with a first isolation layer 124 and a first metal layer 123 stacked from the outside to the inside. The first metal layer 123 constitutes the reference ground of the display screen flexible panel 12. The first isolation layer 124 and the first metal layer 123 have a first receiving groove 125, and the first connecting piece 121 and the current blocking member 30 are both located in the first receiving groove 125.

[0136] Figure 10 yes Figure 9 A schematic diagram showing the first connecting piece 121 electrically connected to the frame 11. (See diagram below.) Figure 10As shown, in this embodiment, after the first connecting piece 121 is electrically connected to the frame 11 by the connector 40, since the current blocking member 30 is located in the first receiving groove 125, it will not protrude from the surface of the first isolation layer 124, thereby avoiding interference and obstruction of the frame 11 by the current blocking member 30. This makes the distance between the first connecting piece 121 and the frame 11 close enough and the gap small, making it easier to establish the electrical connection between the first connecting piece 121 and the frame 11 using the connector 40.

[0137] Optionally, the material of the first connecting piece 121 can be the same as that of the first metal layer 123. In this way, when the first connecting piece 121 is set on the flexible display panel 12, an annular notch can be cut directly on the entire first metal layer 123 to isolate the middle part of the first metal layer 123 to form the first connecting piece 121, thus eliminating the need for separate installation of the first connecting piece 121; or, the material of the first connecting piece 121 is different from that of the first metal layer 123, and the first connecting piece 121 is set on the flexible display panel 12 by separate mounting.

[0138] Optionally, the isolation layer (first isolation layer 124 and second isolation layer 54 in the embodiments described later) can be solder resist or solder mask, which is a green coating applied to the surface of a flexible circuit board or printed circuit board. Its main function is to provide insulation and protection for the circuit, and it can also prevent etching during the soldering process.

[0139] In one embodiment provided in this application, when the current blocking element 30 establishes an electrical connection with the first connecting piece 121 and the first metal layer 123, a wire bonding process can be directly used, such as... Figure 9 As shown, by using hot pressing or ultrasonic energy, the electrodes of the current blocking element 30 are welded and bonded to the first connecting piece 121 and the first metal layer 123 by the metal wire 31, thereby realizing the electrical conduction between the current blocking element 30 and the first connecting piece 121 and the first metal layer 123.

[0140] Figure 11 yes Figure 8 Another example of a cross-sectional view of CC. (See example...) Figure 11As shown, optionally, when the current blocking element 30 establishes an electrical connection with the first connecting piece 121 and the first metal layer 123, it can also be electrically connected via solder paste 32. The composition of the solder paste 32 is preferably one of lead-tin alloy (Pb-Sn), gold-tin alloy (Au-Sn), tin-silver alloy (Sn-Ag), or tin-silver-copper alloy (Sn-Ag-Cu). During the manufacturing process, the electrodes of the current blocking element 30 are provided with solder paste 32. Due to the "self-alignment" effect of the surface tension of the solder paste 32 when it melts, the electrodes of the current blocking element 30 can be accurately aligned and connected with the first connecting piece 121 and the first metal layer 123, avoiding the loss of metal wire 31 due to deformation during the wire bonding process, thereby greatly improving the processing yield.

[0141] Optionally, the current blocking element 30 can also establish an electrical connection with the first connecting piece 121 and the first metal layer 123 through a circuit coating. This circuit coating can be formed in the first receiving groove 125 by laser direct forming (LDS) technology; or it can be formed in the first receiving groove 125 by printing direct structure (PDS) process.

[0142] Figure 12 yes Figure 8 A schematic diagram illustrating the usage of the flexible display panel 12 within the overall device. (See diagram below.) Figure 12 As shown, regardless of how the first connecting piece 121 and the current blocking element 30 are disposed on the flexible display panel 12, the presence of the current blocking element 30 hinders and suppresses the coupling current formed by the antenna radiator 20 at the electrical connection between the first connecting piece 121 and the frame 11. The coupling current flowing to the connection between the first connecting piece 121 and the frame 11 is reduced, so harmonics are not easily generated at that point, thereby solving the problem of spurious radiation in smartphones.

[0143] As mentioned earlier, related technologies employ a special grounding design to improve the noise leakage prevention and noise immunity of the driver chip 14. Specifically, the reference ground 122' of the display flexible board 12' is directly electrically connected to the frame 11' via conductive adhesive 40'. To further improve the noise leakage prevention and noise immunity of the driver chip 14, the reference grounds on both sides of the driver chip 14 can be electrically connected to the frame 11. In this case, the design of the first connecting piece 121 in this application also needs to be improved accordingly, as follows.

[0144] See also Figure 8As shown, in one embodiment provided in this application, there are two first connecting pieces 121 arranged such that, along the width direction of the smartphone, the projections of the two first connecting pieces 121 on the frame 11 are located on either side of the projection of the driver chip 14 on the frame 11. A current blocking element 30 is provided between each first connecting piece 121 and the reference ground (first metal layer 123) of the display flexible board 12. The width direction of the smartphone can be understood as... Figure 8 The X direction in the equation.

[0145] In this embodiment, the first connecting pieces 121 on both sides of the driver chip 14 are electrically connected to the frame 11, which is more beneficial for improving the noise leakage prevention and noise immunity of the driver chip 14. In addition, a current blocking element 30 is provided between each first connecting piece 121 and the reference ground (first metal layer 123) of the display flexible board 12, which can ensure that all the first connecting pieces 121 and the frame 11 are not affected by the coupling current and avoid the generation of harmonics.

[0146] To further improve the noise leakage prevention and noise immunity of the driver chip 14, in one embodiment provided in this application, the reference ground of the display flexible board 12 is electrically connected to the frame 11 through the current blocking element 30 and the first connecting piece 121, and the reference ground (first metal layer 123) of the display flexible board 12 is also directly electrically connected to the frame 11. The reference ground (first metal layer 123) of the display flexible board 12 can be directly electrically connected to the frame 11 through a separate trace, or it can be directly electrically connected to the frame 11 through the connector 40. Specific design schemes are described in the following embodiments.

[0147] Figure 13 This is a partial schematic diagram of another example of the flexible display panel 12 provided in the embodiments of this application. Figure 14 yes Figure 13 A sectional view of DD.

[0148] like Figures 13-14 As shown, in one embodiment provided in this application, on the side facing the frame 11, the flexible display panel 12 is provided with a first isolation layer 124 and a first metal layer 123 stacked from the outside to the inside. The first metal layer 123 constitutes the reference ground of the flexible display panel 12, and the first isolation layer 124 has a cutout area to expose a portion of the first metal layer 123. The exposed portion 123a of the first metal layer 123 is electrically connected to the frame 11 by a connector 40.

[0149] Figure 15 yes Figure 14 A schematic diagram showing the exposed portion 123a of the first metal layer 123 electrically connected to the frame 11. (See diagram below.) Figure 15As shown, in this embodiment, the exposed portion 123a of the first metal layer 123 is directly electrically connected to the frame 11 through the connector 40. Compared with designing wiring separately, this method is easier to design and manufacture and more convenient to implement.

[0150] See also Figure 13 As shown, in one embodiment provided in this application, the first connecting piece 121 and the exposed portion 123a are arranged side by side along the length direction of the smartphone. The length direction of the smartphone can be understood as... Figure 13 in the Y direction.

[0151] Figure 16 This is a partial schematic diagram of another example of the flexible display panel 12 provided in this application embodiment. For example... Figure 16 As shown, in another embodiment provided in this application, the first connecting piece 121 and the exposed portion 123a are arranged side by side along the width direction of the smartphone.

[0152] In order to avoid harmonics between the exposed portion 123a of the first metal layer 123 and the frame 11 due to coupling current, the distance between the first connecting piece 121 and the antenna radiator 20 should be smaller than the distance between the exposed portion 123a of the first metal layer 123 and the antenna radiator 20. The specific design scheme is as follows:

[0153] Figure 17 This is a schematic diagram of the flexible display panel 12 and the antenna radiator 20 provided in an embodiment of this application. Wherein, Figure 17 (a) is a schematic diagram showing the first connecting piece 121 and the exposed portion 123a arranged side by side along the length of the smartphone; Figure 17 (b) is a schematic diagram showing the first connecting piece 121 and the exposed portion 123a arranged side by side along the width direction of the smartphone.

[0154] like Figure 17 As shown, in one embodiment provided in this application, the antenna radiator 20 is disposed at the corner of the smartphone. The corner of the smartphone can be understood as... Figure 17 The location indicated by G in the middle. The distance from the geometric center of the first connecting piece 121 to the corner is less than the distance from the geometric center of the exposed portion 123a to the corner. For ease of understanding, specific examples will be used to explain this below.

[0155] For example, such as Figure 17 As shown in (a), the first connecting piece 121 and the exposed portion 123a are both rectangular in shape. The intersection of the diagonals of the rectangle is the geometric center. The distance between the geometric center of the first connecting piece 121 and the corner of the smartphone is d1, and the distance between the geometric center of the exposed portion 123a and the corner of the smartphone is d2, where d1 < d2.

[0156] For example, such as Figure 17 As shown in (b), the first connecting piece 121 is rectangular in shape, and the intersection of the diagonals of the rectangle is the geometric center. The exposed part 123a is elliptical in shape, and the intersection of the major axis and minor axis of the ellipse is the geometric center. The distance between the geometric center of the first connecting piece 121 and the corner of the smartphone is d3, and the distance between the geometric center of the exposed part 123a and the corner of the smartphone is d4, where d3 < d4.

[0157] As mentioned earlier, in related technologies, when the antenna radiator 20' is working, it will form a coupling current on the reference ground 122' of the display flexible board 12' and the frame 11' located near the antenna radiator 20'. Due to various factors, the conductive adhesive 40' cannot fully electrically connect the reference ground 122' of the display flexible board 12' and the frame 11'. At this time, harmonics will be generated at the electrical connection point due to the PIM effect, which may lead to the risk of failing the RSE regulatory test. In addition, in the area near the antenna radiator 20', there are usually electrical connectors 60 such as springs or foam between the frame 11' and the middle frame 71' or between the frame 11' and the motherboard. These electrical connectors 60 have different functions and purposes. For example, they are used in the grounding scenario of the display module 10; or they are used to shield the fundamental wave of the antenna radiation from propagating inward, which can prevent the fundamental wave from affecting the signal of functional devices such as camera modules and system-on-chips (SOCs); or they are used to de-clutter the antenna.

[0158] Regardless of its function, the electrical connector 60 is commonly found in areas near the antenna radiator 20' in actual projects. The electrical connector 60 is typically fixed to the motherboard or mid-frame 71' on one side and directly abuts against the surface of the frame 11' on the other. When impurities or rust are present at the contact interface between the frame 11' and the electrical connector 60, poor contact can easily occur. In this case, similar to the conductive adhesive 40', if there is coupling current between the electrical connector 60 and the frame 11', harmonics will be generated at the electrical connection due to the PIM effect. This can also lead to the risk of the phone failing RSE regulatory tests.

[0159] In view of this, in order to solve the above problems, this application embodiment also provides another smartphone, mainly to block and suppress the coupling current at the connection between the electrical connector 60 and the frame 11, thereby avoiding the generation of harmonics at the connection between the two, as detailed below.

[0160] Figure 18 yes Figure 1 A cross-sectional view of BB. Figure 19This is a top view of the electrical connector 60 and the middle frame 71 in the embodiments of this application.

[0161] like Figures 18-19 As shown, and in combination Figures 1-2 As shown in the embodiment of this application, the smartphone includes an antenna radiator 20, a display module 10, a circuit board 50, an electrical connector 60, and a current blocking component 30.

[0162] The display module 10 includes a frame 11.

[0163] The circuit board 50 is located on one side of the frame 11, and the circuit board 50 is provided with a second connecting piece 51.

[0164] Electrical connector 60 is disposed between frame 11 and circuit board 50, and is electrically connected to frame 11 and second connecting piece 51 respectively.

[0165] The current blocking element 30 is electrically connected to the reference ground of the circuit board 50 and the second connecting piece 51 respectively. The current blocking element 30 is used to block the coupling current at the connection between the second connecting piece 51 and the frame 11. The coupling current is the current generated when the antenna radiator 20 is working at the connection between the second connecting piece 51 and the frame 11.

[0166] The smartphone provided in this application embodiment adds a current blocking element 30 between the second connecting piece 51 of the circuit board 50 and the reference ground, and then connects the second connecting piece 51 to the frame 11 through an electrical connector 60. This causes the coupling current formed by the antenna radiator 20 at that location to be blocked and suppressed. Even if the contact interface between the frame 11 and the electrical connector 60 is abnormal and the electrical connector 60 and the frame 11 cannot make sufficient contact, the current flowing to the part where the electrical connector 60 and the frame 11 make contact is small. Therefore, the part where the electrical connector 60 and the frame 11 make contact is less likely to generate harmonics, avoids radiation spurious problems, and ensures the stability of the smartphone's fundamental wave signal.

[0167] Furthermore, simulation tests have shown that adding an adapted current blocking component 30 to the smartphone provided in this application embodiment does not affect the radiation efficiency and system efficiency of the mobile phone antenna. Under the premise of ensuring the basic functions of the mobile phone antenna, it can effectively suppress the generation of harmonics.

[0168] In addition to the coupling current generated when the antenna radiator 20 is working, the technical solution in this application embodiment can also hinder and suppress the coupling current generated when components such as charging coils and linear motors are working.

[0169] Optionally, the reference ground of the circuit board 50 can be an internal metal layer, which can be any one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium, or an alloy of multiple metals.

[0170] In some embodiments provided in this application, the current blocking element 30 can be a resistor, an inductor, or a capacitor. Resistors, inductors, and capacitors can all impede the current in the circuit, thereby reducing the coupling current flowing to the connection point between the first connecting piece 121 and the frame 11, and thus avoiding the generation of harmonics.

[0171] In order to avoid the resistor from adversely affecting the antenna radiation efficiency of the mobile phone antenna, in some embodiments provided in this application, when the current blocking element 30 is a resistor, the resistance value of the resistor is greater than or equal to 0.05Ω and less than or equal to 10Ω. For example, resistors with resistance values ​​of 0.05Ω, 1Ω, 3Ω, 5Ω, 8Ω, 10Ω, etc. can be selected as the current blocking element 30. While achieving the purpose of reducing the coupling current at the connection between the second connecting piece 51 and the frame 11, the radiation efficiency of the antenna can be guaranteed.

[0172] When the current-limiting element 30 is an inductor, the inductance value of the inductor used is less than or equal to 10nH. When the current-limiting element 30 is a capacitor, the capacitance value of the capacitor used is less than or equal to 10nF.

[0173] The current blocking element 30 can be disposed outside the circuit board 50, or the current blocking element 30 and the circuit board 50 can be designed as an integrated structure, that is, in one embodiment provided in this application, the current blocking element 30 is disposed on the circuit board 50.

[0174] In this embodiment, the current blocking component 30 is directly disposed on the circuit board 50. The current blocking component 30 can be directly packaged on the circuit board 50 during the processing and manufacturing stage of the circuit board 50. This facilitates the circuit routing of the current blocking component 30, thereby reducing the assembly difficulty of the current blocking component 30 in the whole machine. At the same time, the current blocking component 30 and the circuit board 50 are integrated structures, which can improve the integration of the flexible board and is more conducive to miniaturized and thinner application scenarios.

[0175] Optionally, the electrical connector 60 may be a conductive spring 61 or a conductive foam 62.

[0176] The conductive spring 61 includes a base and a spring arm. The spring arm has a protrusion for abutting against the frame 11. The protrusion can be hemispherical or semi-cylindrical. In this application, the conductive spring 61 can achieve electrical connection between the two by abutting against the frame 11 through the protrusion. The base and the spring arm can be connected together by welding, adhesive bonding, snap-fitting, bolting, etc.; or, the base and the spring arm can be integrally formed, specifically by metal plate bending process.

[0177] The convex bulge can be formed onto the spring arm by stamping. This method is simple and allows for mass production. Alternatively, the convex bulge can be formed onto the spring arm using laser etching. Laser etching produces convex bulges with extremely high dimensional accuracy, improving the fit between the convex bulge and the frame 11 and resulting in a higher yield rate for the electronic device. The convex bulge can also be a separately machined protrusion structure, installed and fixed onto the spring arm by welding, adhesive bonding, or snap-fitting.

[0178] The conductive spring 61 can be made of any one of the following metals: copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium, or an alloy of multiple metals.

[0179] Conductive foam 62 typically consists of a foam core, adhesive, and conductive fabric, with the conductive fabric bonded to the outside of the foam core using adhesive. When conductive foam 62 comes into contact with a device to be connected, the current is primarily conducted through the conductive fabric. When conductive foam 62 is compressed, the deformation is mainly caused by the shrinkage of the pores in the foam core. The conductive fabric is woven from warp and weft threads; at a microscopic level, the warp and weft threads can be slightly compressed, but the amount of compression is relatively small.

[0180] The materials of the foam core include, but are not limited to, foamed polyurethane, foamed polypropylene, foamed polyethylene, specialty rubber, ethylene-vinyl acetate copolymer, and EPDM rubber. Adhesives include, but are not limited to, thermosetting adhesives, pressure-sensitive adhesives, and photosensitive adhesives. The cross-section of the conductive foam 62 includes, but is not limited to, D-shaped, L-shaped, T-shaped, and P-shaped. In addition, the cross-sectional shape of the conductive foam 62 can also be rectangular, triangular, circular, elliptical, polygonal, and other irregular shapes.

[0181] In the following embodiments, the electrical connector 60 will be described as an example of a conductive spring 61.

[0182] Figure 20 yes Figure 18 An enlarged view of an example of the frame 11, conductive spring 61, circuit board 50, and middle frame 71.

[0183] like Figure 20As shown, in one embodiment provided in this application, on the side facing the frame 11, the circuit board 50 is provided with a second isolation layer 54 and a second metal layer 53 stacked from the outside to the inside. The second metal layer 53 constitutes the reference ground of the circuit board 50. The second isolation layer 54 and the second metal layer 53 have a second receiving groove 55, and the second connecting piece 51 and the current blocking member 30 are both located in the second receiving groove 55.

[0184] In this embodiment, since the current blocking element 30 is located in the second receiving groove 55, it will not protrude from the surface of the second isolation layer 54, thereby avoiding interference and obstruction of the current blocking element 30 to the installation process of the conductive spring 61, which is more conducive to the implementation of the assembly process.

[0185] Optionally, the material of the second connecting piece 51 can be the same as that of the second metal layer 53. In this way, when the second connecting piece 51 is set on the circuit board 50, an annular notch can be cut directly on the entire second metal layer 53 to isolate the middle part of the second metal layer 53 to form the second connecting piece 51, thus eliminating the need for separate installation of the second connecting piece 51; or, the material of the second connecting piece 51 is different from that of the second metal layer 53, and the second connecting piece 51 is set on the circuit board 50 by separate mounting.

[0186] Optionally, when the current blocking element 30 establishes an electrical connection with the second connecting piece 51 and the second metal layer 53, a wire bonding process can be directly used, such as... Figure 20 As shown, by using hot pressing or ultrasonic energy, the electrodes of the current blocking element 30 are welded and bonded to the second connecting piece 51 and the second metal layer 53 by metal wire, thereby realizing the electrical conduction between the current blocking element 30 and the second connecting piece 51 and the second metal layer 53.

[0187] Optionally, when the current blocking element 30 establishes an electrical connection with the second connecting piece 51 and the second metal layer 53, it can also be electrically connected by solder paste; or, the current blocking element 30 can also establish an electrical connection with the second connecting piece 51 and the second metal layer 53 by a circuit coating.

[0188] See also Figure 20 As shown, in one embodiment provided in this application, the middle frame 71 is located on the side of the circuit board 50 facing away from the frame 11. The circuit board 50 is a small board for setting the current blocking element 30, and the circuit board 50 is fixed to the middle frame 71. The base of the conductive spring 61 is fixed and electrically connected to the second connecting piece 51.

[0189] In this embodiment, the circuit board 50 is a small board specifically designed for mounting the current blocking component 30. This design is more flexible and easier to install. After the small board is fixed to the middle frame 71, the middle frame 71 can provide good support, allowing the small board to fit stably with the frame 11 and compress the conductive spring 61.

[0190] Alternatively, the small board can be a flexible printed circuit board (FPC) or a printed circuit board (PCB).

[0191] Figure 21 yes Figure 18 Enlarged view of another example of the frame 11, conductive spring 61, circuit board 50 and middle frame 71.

[0192] like Figure 21 As shown, based on the aforementioned embodiment, the second metal layer 53 is electrically connected to the middle frame 71.

[0193] In this embodiment, the middle frame 71 is a metal middle frame 71. After the second metal layer 53 is electrically connected to the middle frame 71, the grounding effect of the small board can be further improved. The specific reason is that after the second metal layer 53 is electrically connected to the middle frame 71, the static electricity and interference current accumulated on the display module 10 flow to the metal middle frame 71 through the frame 11, the conductive spring 61, and the small board. Then, the metal middle frame 71 conducts the current to the user's hand or the external environment, so as to reduce the impact of static electricity and interference current on the display module 10 and ensure the normal operation of the display module 10.

[0194] Optionally, when the second metal layer 53 is electrically connected to the middle frame 71, a pad 56 can be designed on the surface of the small board facing the middle frame 71. The pad 56 is electrically connected to the second metal layer 53 through the internal traces of the small board. Then, the pad 56 is electrically connected to the metal middle frame 71 through conductive adhesive, solder paste or other bonding agents, thereby realizing the electrical connection between the second metal layer 53 and the metal middle frame 71.

[0195] Figure 22 This is a cross-sectional view of the frame 11, conductive spring 61, circuit board 50, and middle frame 71 provided in the embodiments of this application.

[0196] like Figure 22 As shown, in one embodiment provided in this application, the middle frame 71 is located between the circuit board 50 and the frame 11. The circuit board 50 is the motherboard of a smartphone, and the middle frame 71 is provided with a clearance hole 711. The conductive spring 61 passes through the clearance hole 711 and is electrically connected to the second connecting piece 51.

[0197] In this embodiment, the circuit board 50 is a mobile phone motherboard. It is convenient to set the current blocking component 30 on the mobile phone motherboard. The current blocking component 30 can be prefabricated during the manufacturing stage of the motherboard, which can improve the integration of the device and is more conducive to use in miniaturization and thinning scenarios.

[0198] Figure 23 This is a cross-sectional view of an example of the frame 11, conductive foam 62, circuit board 50, and middle frame 71 provided in the embodiments of this application.

[0199] like Figure 23 As shown, in one embodiment provided in this application, on the side facing the frame 11, the circuit board 50 has a second isolation layer 54 and a second metal layer 53 stacked from the outside to the inside. The second metal layer 53 constitutes the reference ground of the circuit board 50. The second isolation layer 54 and the second metal layer 53 have a second receiving groove 55, in which the second connecting piece 51 and the current blocking member 30 are both located. The circuit board 50 is a small board for setting the current blocking member 30. The middle frame 71 is located on the side of the circuit board 50 facing away from the frame 11. The circuit board 50 is fixed to the middle frame 71, and the second metal layer 53 is electrically connected to the middle frame 71. Conductive foam 62 is compressed and disposed between the frame 11 and the second connecting piece 51.

[0200] Figure 24 This is a cross-sectional view of another example of the frame 11, conductive foam 62, circuit board 50, and middle frame 71 provided in the embodiments of this application.

[0201] like Figure 24 As shown, in one embodiment provided in this application, the middle frame 71 is located between the circuit board 50 and the frame 11. The circuit board 50 is the motherboard of a smartphone, and the middle frame 71 is provided with a clearance hole 711. The conductive foam 62 passes through the clearance hole 711 and is compressed and disposed between the frame 11 and the second connecting piece 51.

[0202] Alternatively, since mobile phones typically have multiple electrical connectors 60, conductive foam 62 and conductive spring 61 can be used in combination.

[0203] Optionally, since electrical connector 60 and connector 40 may coexist in the same mobile phone, the harmonic problems caused by these two components may coexist. Therefore, the above-mentioned two technical solutions, namely, the current blocking component 30 is disposed between the reference ground of the display flexible plate 12 and the first connecting piece 121, and the current blocking component 30 is disposed between the reference ground of the circuit board 50 and the second connecting piece 51, can coexist in the same mobile phone.

[0204] Next, in order to verify the function and effect of the current blocking element 30 in the embodiments of this application, simulation tests were performed on the antenna radiator 20, display screen flexographic plate 12, circuit board 50, current blocking element 30 and other components of the smartphone shown in the embodiments of this application.

[0205] Figure 25 This is a schematic diagram of the current distribution of the display flexible plate 12' in related technologies and the display flexible plate 12 in the embodiments of this application. Wherein, Figure 25 (a) is a schematic diagram of the current distribution of the flexible display panel 12' in the related technology. The parts indicated by F1 and F2 are used to apply conductive adhesive 40' and make electrical connections with the frame 11'. Figure 25(b) is a schematic diagram of the current distribution of the display screen flexographic plate 12 in the embodiment of this application. The parts indicated by F3 and F4 are used to apply the connector 40 (such as conductive glue) and make electrical connections with the frame 11. Figure 25 In the display screen flex panel 12' and the display screen flex panel 12, light-colored areas represent areas with strong current and dark-colored areas represent areas with weak current.

[0206] contrast Figure 25 As can be seen from (a) and (b) in the related art, when the mobile phone antenna is working normally, the light-colored area of ​​the display flexible plate 12' in the locations indicated by F1 and F2 is larger, and the dark-colored area is smaller, so these two locations have stronger current. In the same locations, the light-colored area of ​​the display flexible plate 12 in the embodiments of this application is smaller and the dark-colored area is larger in the locations indicated by F3 and F4, so these two locations have weaker current, indicating that the current blocking element 30 can effectively block and suppress coupling current.

[0207] Figure 26 This is a schematic diagram of the current curve of an example of the flexible display panel 12' in related technologies and the flexible display panel 12 in the embodiments of this application. Figure 26 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 26 The vertical axis in the figure represents the current (dBA). Figure 26 The L1 curve in the figure represents the coupling current curve generated by the reference ground 122' of the display flexible panel 12' in the related art as the antenna frequency changes. Figure 26 The L2 curve in the figure represents the coupling current curve generated by the first connecting piece 121 on the display flexible plate 12 in this embodiment as the antenna frequency changes.

[0208] contrast Figure 26 As can be seen from the L1 and L2 curves, when the antenna frequency is 1.86 GHz, the coupling current of the reference ground 122' of the display flexible plate 12' in the related technology is 0.103 dBA, while the coupling current of the first connecting piece 121 on the display flexible plate 12 in this embodiment is 0.04 dBA, which is about 60% lower.

[0209] Figure 27 This is a schematic diagram of current curves for an example of the flexible display panel 12 in this application embodiment when using different resistors. Wherein, Figure 27 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 27 The vertical axis in the graph represents the current value (dBA). Figure 27 The L3 curve in the figure represents the coupling current curve of the reference ground 122' of the display flexible plate 12' in the related art as the antenna frequency changes. Figure 27The L4-L7 curves in the figure represent the coupling current curves generated by the first connecting piece 121 on the display flexible plate 12 in this embodiment of the application as the antenna frequency changes when different resistors are used.

[0210] contrast Figure 27 As can be seen from the L3 and L4-L7 curves, at an antenna frequency of 1.88 GHz, the coupling current of the reference ground 122' of the display flexible board 12' in the related technology is 0.102 dBA, while the coupling current of the first connecting piece 121 on the display flexible board 12 in this embodiment is about 0.034 dBA, a decrease of about 67%. It should be noted that the display flexible board 12 in this embodiment uses four resistors ranging from 0.5 Ω to 3 Ω. Since the current change on the display flexible board 12 is small, the four curves L4-L7 overlap.

[0211] Figure 28 This is a schematic diagram illustrating an example of the impact of the flexible display panel 12 in this embodiment of the application, after employing the current blocking element 30, on the antenna radiation efficiency and antenna system efficiency. Wherein, Figure 28 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 28 The vertical axis in the figure represents efficiency (dB). Figure 28 The L10 curve in the figure represents the variation curve of antenna radiation efficiency in related technologies. Figure 28 The L11 curve in the figure represents the change in antenna radiation efficiency after the use of current damping element 30. Figure 28 The L8 curve in the figure represents the change curve of antenna system efficiency in related technologies. Figure 28 The L9 curve in the figure represents the change in antenna system efficiency after the addition of current damping element 30. Current damping element 30 is a 3Ω resistor.

[0212] contrast Figure 28 The L10 and L11 curves in the image are almost completely overlapping regardless of the antenna frequency. Therefore, it can be concluded that, compared with related technologies, the use of the current blocking element 30 has no impact on the radiation efficiency of the mobile phone antenna. Similarly, compared with... Figure 28 The L8 and L9 curves show that using the current blocking element 30 has no impact on the system efficiency of the mobile phone antenna.

[0213] Figure 29 This is a schematic diagram of the current curve of the display flexible panel 12 in this embodiment before the use of the current blocking element 30. Figure 28 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 28 The vertical axis in the figure represents the current (dBA). Figure 28The L14 curve in the figure represents the coupling current curve of the exposed portion 123a of the first metal layer 123 on the flexible display panel 12 in this embodiment of the application. Figure 28 The L13 curve in the figure represents the coupling current curve of the first connecting piece 121 on the flexible display panel 12 in this embodiment of the application. The exposed portion 123a and the first connecting piece 121 are distributed vertically, which is the same as the arrangement along the length of the electronic device mentioned above.

[0214] It is important to note that Figure 29 The L13 curve in the figure is the current curve when the display flexographic plate 12 does not use the current blocking element 30.

[0215] Figure 30 This is a schematic diagram of the current curve of an example of the flexible display panel 12 in this application embodiment after employing the current blocking element 30. Wherein, Figure 30 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 30 The vertical axis in the figure represents the current (dBA). Figure 30 The L16 curve in the figure is the coupling current curve of the exposed portion 123a of the first metal layer 123 on the flexible display panel 12. Figure 30 The L15 curve in the figure is the coupling current curve of the first connecting piece 121 on the flexible plate 12 of the display screen.

[0216] It is important to note that Figure 30 The L15 curve in the figure is the current curve after the display flexographic plate 12 uses the current blocking element 30.

[0217] Will Figure 30 and Figure 29 In summary, comparing curves L14 and L16 shows that the use of the current-blocking element 30 has little impact on the coupling current of the exposed portion 123a of the first metal layer 123; therefore, curves L14 and L16 exhibit roughly the same trend. Comparing curves L13 and L15 shows that at antenna frequencies of 1.89 GHz to 1.91 GHz, the coupling current value of the first connecting piece 121 decreases from 0.094 dBA to 0.059 dBA, indicating that the current-blocking element 30 significantly suppresses the current at the connection between the first connecting piece 121 and the frame 11.

[0218] Similarly, the exposed portion 123a of the first metal layer 123 and the first connecting piece 121 are distributed left and right, which is the same as mentioned above when they are arranged side by side along the width direction of the electronic device. Current simulation tests were also performed before and after the current blocking element 30 was used in the flexible display panel 12, as shown below.

[0219] Figure 31 This is a schematic diagram of the current curve of another example of the display screen flexographic plate 12 in the embodiments of this application before the use of the current blocking element 30. Figure 32 This is a schematic diagram of the current curve of another example of the flexible display panel 12 in this application embodiment after employing the current blocking element 30. Figure 31 and Figure 32 In summary, comparing curves L18 and L19 shows that the use of the current-blocking element 30 has little impact on the current value of the exposed portion 123a of the first metal layer 123; therefore, curves L18 and L19 exhibit roughly the same trend. Comparing curves L17 and L20 shows that at antenna frequencies of 2.2 GHz to 2.43 GHz, the coupling current value of the first connecting piece 121 decreases from a maximum of 0.206 dBA to approximately 0.05 dBA, demonstrating the significant effect of the current-blocking element 30 in suppressing the current at the connection between the first connecting piece 121 and the frame 11.

[0220] When the exposed portion 123a of the first metal layer 123 and the first connecting piece 121 are distributed left and right, an antenna efficiency simulation test was also performed on the flexible display panel 12, as shown below.

[0221] Figure 33 This is a schematic diagram illustrating an example of the impact of the flexible display panel 12 in this embodiment of the application, after employing the current blocking element 30, on the antenna radiation efficiency and antenna system efficiency. Wherein, Figure 33 The L21 curve in the figure represents the variation curve of antenna radiation efficiency in related technologies. Figure 33 The L22 curve in the figure represents the change in antenna radiation efficiency after the use of current-impeding device 30. Figure 33 The L23 curve in the figure represents the change curve of antenna system efficiency in related technologies. Figure 33 Curve L24 in the figure represents the change in antenna system efficiency after the addition of current damper 30. Current damper 30 is a resistor of 0.5Ω.

[0222] contrast Figure 33 The L21 and L22 curves in the data show that when the antenna frequency is between 0.6 GHz and 3 GHz, the L21 and L22 curves almost completely overlap. When the antenna frequency is between 3 GHz and 4 GHz, the L21 and L22 curves show a slight difference, with a variation of no more than 0.2 dB. Therefore, it can be concluded that, compared with related technologies, the use of the current blocking element 30 has a very small impact on the radiation efficiency of the mobile phone antenna. Similarly, compared with... Figure 33 The L23 and L24 curves are almost completely overlapping when the antenna frequency is between 0.6 GHz and 3 GHz. When the antenna frequency is between 3 GHz and 4 GHz, the L23 and L24 curves are slightly different, with a variation of no more than 0.1 dB. Therefore, it can be concluded that, compared with related technologies, the use of current blocking device 30 has a very small impact on the system efficiency of mobile phone antenna.

[0223] Figure 34 This is a schematic diagram of the current curves for another example of the flexible display panel 12 in this application embodiment when using different resistors. Wherein, Figure 34 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 34 The vertical axis in the figure represents the current (dBA).

[0224] Figure 34 The L25 curve in the figure represents the coupling current curve of the reference ground 122' of the display flexible plate 12' in the related art.

[0225] Figure 34 The L26 curve in the figure represents the coupling current curve at the first connecting piece 121 on the flexible plate 12 of the display screen when the current blocking element 30 uses a 1Ω resistor. Figure 34 The L27 curve in the figure represents the coupling current curve at the first connecting piece 121 on the flexible plate 12 of the display screen when the current blocking element 30 uses a 3Ω resistor. Figure 34 The L28 curve in the figure represents the coupling current curve at the first connecting piece 121 on the flexible plate 12 of the display screen when the current blocking element 30 uses a 5Ω resistor. Figure 34 The L29 curve in the figure represents the coupling current curve at the first connecting piece 121 on the flexible plate 12 of the display screen when the current blocking element 30 uses a 10Ω resistor.

[0226] contrast Figure 34 As shown in curves L25-L29, when the antenna frequency is between 1.79 GHz and 1.99 Hz, the coupling current value of the reference ground 122' of the flexible display panel 12' in the related technology is 0.133 dBA. In this embodiment, if a 1 Ω resistor is used, the coupling current value at the first connecting piece 121 on the flexible display panel 12 can be reduced to 0.101 dBA. If a 3 Ω resistor is used, the coupling current value at the first connecting piece 121 on the flexible display panel 12 can be reduced to 0.067 dBA. If a 5 Ω resistor is used, the coupling current value at the first connecting piece 121 on the flexible display panel 12 can be reduced to approximately 0.05 dBA. If a 10 Ω resistor is used, the coupling current value at the first connecting piece 121 on the flexible display panel 12 can be reduced to approximately 0.038 dBA. It can be seen that when the current blocking component 30 uses a resistor of 1Ω to 10Ω, it can suppress the coupling current by about 25% to 75%. The current blocking component 30 has a significant effect on suppressing the current at the connection between the first connecting piece 121 and the frame 11.

[0227] Figure 35 This is a schematic diagram of the current curves of the circuit board 50 in this embodiment when using different resistors.

[0228] Figure 35The horizontal axis in the graph represents the antenna frequency (GHz). Figure 35 The vertical axis in the figure represents the current (dBA). Figure 35 The L30 curve in the figure represents the coupling current curve of the portion on the circuit board 50' or the middle frame 71' used to install the electrical connector 60' in the related art. Figure 35 The L31 curve in the figure represents the coupling current curve at the second connecting piece 51 on the circuit board 50 when the current blocking element 30 in this embodiment of the application uses a 5Ω resistor. Figure 35 The L32 curve in the figure represents the coupling current curve at the second connecting piece 51 on the circuit board 50 when the current blocking element 30 in this embodiment of the application uses a 10Ω resistor.

[0229] contrast Figure 35 As shown by the L30-L32 curves, when the antenna frequency is between 2.28 GHz and 2.30 Hz, the coupling current value at the location of the electrical connector 60' on the circuit board 50' or the middle frame 71' in the related technology is 0.128 dBA. In this embodiment, if a 5Ω resistor is used, the coupling current value at the second connecting piece 51 on the circuit board 50 can be reduced to 0.102 dBA. If a 10Ω resistor is used, the coupling current value at the second connecting piece 51 on the circuit board 50 can be reduced to 0.078 dBA. It can be seen that when the current blocking element 30 uses a resistor of 5Ω to 10Ω, the coupling current can be suppressed by about 20% to 40%, thus effectively suppressing the coupling current flowing to the connection between the electrical connector 60 and the frame 11.

[0230] Figure 36 This is a schematic diagram of the antenna radiation efficiency curve of the circuit board 50 in this embodiment of the application after incorporating the current blocking element 30. Wherein, Figure 36 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 36 The vertical axis in the figure represents efficiency (dB). Figure 36 The L34 curve in the figure represents the variation curve of antenna radiation efficiency in related technologies. Figure 36 The L33 curve in the figure represents the change in antenna radiation efficiency after the current damper 30 is applied. The current damper 30 uses a 5Ω resistor.

[0231] contrast Figure 36 As can be seen from the L33 and L34 curves, when the antenna frequency is between 0.5 GHz and 1.88 GHz, the L33 and L34 curves are basically completely overlapping. When the antenna frequency is between 1.88 GHz and 2.4 GHz, the L33 and L34 curves are slightly different, with a variation range of less than 0.3 dB. Therefore, it can be concluded that, compared with related technologies, the use of current blocking device 30 has a very small impact on the radiation efficiency of mobile phone antennas.

[0232] Figure 37 This is a schematic diagram showing the efficiency curve of the antenna system after incorporating the current blocking element 30 in the circuit board 50 of this embodiment. Figure 37 The horizontal axis in the graph represents the antenna frequency (GHz). Figure 37 The vertical axis in the figure represents efficiency (dB). Figure 37 The L35 curve in the figure represents the change curve of antenna system efficiency in related technologies. Figure 37 The L36 curve in the figure represents the change in antenna system efficiency after the addition of current damper 30. Current damper 30 uses a 5Ω resistor.

[0233] contrast Figure 37 As can be seen from the L35 and L36 curves, the L35 and L36 curves are basically completely overlapping. Therefore, it can be concluded that, compared with related technologies, the impact of using the current blocking element 30 on the system efficiency of the mobile phone antenna is very small.

[0234] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: Antenna radiator (20); The display module (10) includes a frame (11) and a display flexible plate (12). Part of the display flexible plate (12) is located on one side of the frame (11). The display flexible plate (12) is provided with a first connecting piece (121), and the first connecting piece (121) is electrically connected to the frame (11). The current blocking element (30) is electrically connected to the reference ground of the display screen flexible plate (12) and the first connecting piece (121) respectively. The current blocking element (30) is used to block the coupling current at the connection between the first connecting piece (121) and the frame (11).

2. The electronic device according to claim 1, characterized in that, The coupling current is the current generated at the connection between the first connecting piece (121) and the frame (11) when the antenna radiator (20) is working.

3. The electronic device according to claim 1 or 2, characterized in that, The current blocking element (30) is disposed on the flexible plate (12) of the display screen.

4. The electronic device according to claim 3, characterized in that, On the side facing the frame (11), the display screen flexible plate (12) is provided with a first isolation layer (124) and a first metal layer (123) stacked from the outside to the inside, and the first metal layer (123) constitutes the reference ground of the display screen flexible plate (12); The first isolation layer (124) and the first metal layer (123) are provided with a first receiving groove (125), and the first connecting piece (121) and the current blocking member (30) are both located in the first receiving groove (125).

5. The electronic device according to any one of claims 1-4, characterized in that, The reference ground of the display screen flexible plate (12) is also directly electrically connected to the frame (11).

6. The electronic device according to claim 5, characterized in that, On the side facing the frame (11), the display screen flexible plate (12) is provided with a first isolation layer (124) and a first metal layer (123) stacked from the outside to the inside. The first metal layer (123) constitutes the reference ground of the display screen flexible plate (12), and the first isolation layer (124) has a hollow area to expose part of the first metal layer (123). The exposed portion (123a) of the first metal layer (123) is electrically connected to the frame (11) by a connector (40).

7. The electronic device according to claim 6, characterized in that, The antenna radiator (20) is located at the corner of the electronic device; The distance from the geometric center of the first connecting piece (121) to the corner is less than the distance from the geometric center of the exposed portion (123a) to the corner.

8. The electronic device according to claim 7, characterized in that, The first connecting piece (121) and the exposed portion (123a) are arranged side by side along the length or width of the electronic device.

9. The electronic device according to any one of claims 1-8, characterized in that, A driving chip (14) is provided on the side of the flexible display panel (12) facing away from the frame (11), and a shielding cover (141) is provided on the outside of the driving chip (14). The number of the first connecting pieces (121) is two and the arrangement is as follows: along the width direction of the electronic device, the projections of the two first connecting pieces (121) on the frame (11) are located on both sides of the projection of the driving chip (14) on the frame (11); Each of the first connecting pieces (121) is provided with a current blocking element (30) between it and the reference ground of the display flexible plate (12).

10. The electronic device according to any one of claims 1-9, characterized in that, The current blocking element (30) includes at least one of a resistor, an inductor, and a capacitor.

11. The electronic device according to claim 10, characterized in that, The current blocking element (30) is a resistor, and the resistance value of the resistor is greater than or equal to 0.05Ω and less than or equal to 10Ω.

12. The electronic device according to any one of claims 1-11, characterized in that, The first connecting piece (121) is electrically connected to the frame (11) by a connector (40), the connector (40) including at least one of solder paste, conductive adhesive, and conductive silver paste.

13. An electronic device, characterized in that, include: Antenna radiator (20); The display module (10) includes a frame (11); A circuit board (50) is located on one side of the frame (11), and the circuit board (50) is provided with a second connecting piece (51); An electrical connector (60) is disposed between the frame (11) and the circuit board (50), and the electrical connector (60) is electrically connected to the frame (11) and the second connecting piece (51) respectively; The current blocking element (30) is electrically connected to the reference ground of the circuit board (50) and the second connecting piece (51) respectively. The current blocking element (30) is used to block the coupling current at the connection between the second connecting piece (51) and the frame (11).

14. The electronic device according to claim 13, characterized in that, The coupling current is the current generated at the connection point between the second connecting piece (51) and the frame (11) when the antenna radiator (20) is working.

15. The electronic device according to claim 13 or 14, characterized in that, The current blocking element (30) is disposed on the circuit board (50).

16. The electronic device according to claim 15, characterized in that, On the side facing the frame (11), the circuit board (50) is provided with a second isolation layer (54) and a second metal layer (53) stacked from the outside to the inside, and the second metal layer (53) constitutes the reference ground of the circuit board (50); The second isolation layer (54) and the second metal layer (53) are provided with a second receiving groove (55), and the second connecting piece (51) and the current blocking member (30) are both located in the second receiving groove (55).

17. The electronic device according to claim 16, characterized in that, The electronic device also includes a mid-frame (71) located on the side of the circuit board (50) opposite to the frame (11); The circuit board (50) is a small board used to set the current blocking element (30), and the circuit board (50) is fixed to the middle frame (71).

18. The electronic device according to claim 17, characterized in that, The second metal layer (53) is electrically connected to the middle frame (71).

19. The electronic device according to claim 16, characterized in that, The electronic device also includes a mid-frame (71) located between the circuit board (50) and the frame (11); The circuit board (50) is the motherboard of the electronic device. The middle frame (71) is provided with a clearance hole (71). The electrical connector (60) passes through the clearance hole (71) and is electrically connected to the second connecting piece (51).

20. The electronic device according to any one of claims 13-19, characterized in that, The electrical connector (60) is a conductive spring (61) or a conductive foam (62).

21. The electronic device according to claim 20, characterized in that, When the electrical connector (60) is a conductive spring (61), the base of the conductive spring (61) is fixed and electrically connected to the second connecting piece (51).

22. The electronic device according to any one of claims 19-21, characterized in that, The current blocking element (30) includes at least one of a resistor, an inductor, and a capacitor.

23. The electronic device according to claim 22, characterized in that, The current blocking element (30) is a resistor, and the resistance value of the resistor is greater than or equal to 0.05Ω and less than or equal to 10Ω.

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