Camera module

Abstract

The camera module includes: a housing; a circuit board on which an image sensor is mounted; a drive member connected to the circuit board and configured to move the circuit board; an elastic member connected to the housing and configured to support the circuit board; and a guide member configured to guide the movement of the circuit board.

Description

Technical Field

[0001] This disclosure relates to camera modules. Background Technology

[0002] Ultra-compact camera modules are used in vehicles. For example, they can be used in dashcam cameras for vehicle protection or objective data recording in traffic accidents, rear-view cameras that allow drivers to monitor blind spots behind the vehicle via a screen to ensure safety when reversing, and perimeter detection cameras that can monitor the vehicle's surroundings.

[0003] Automotive camera modules can be exposed to a wide range of environments, from sub-zero temperatures to intense heat. When an automotive camera module is exposed to temperature variations, the distance from the lens to the image module can change significantly. That is, as the ambient temperature around the camera module increases, internal components of the camera module (such as the lens) may expand, causing a change in focal length. Therefore, a technology may be needed to compensate for this change in focal length.

[0004] Previously, voice coil motor (VCM) actuators were used to compensate for focal length changes. However, VCM actuators have the following disadvantages: they are susceptible to foreign objects due to the gap between the lens barrel and the housing; they are expensive; and they make the camera module larger.

[0005] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention

[0006] The summary portion of this invention is intended to provide a brief overview of the chosen concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0007] In one general aspect, the camera module includes: a housing; a circuit board on which an image sensor is mounted; a drive member coupled to the circuit board and configured to move the circuit board; an elastic member connected to the housing and configured to support the circuit board; and a guide member configured to guide the movement of the circuit board.

[0008] The guiding member can be configured to guide the circuit board to move in the optical axis direction and prevent the circuit board from moving in a direction intersecting the optical axis direction.

[0009] The driving component may include shape memory alloy.

[0010] The drive component can be connected to the guide component and the upper surface of the circuit board.

[0011] The driving component can gradually expand as the temperature decreases, at least within a certain temperature range.

[0012] The elastic component can be located below the circuit board.

[0013] The guide member may include a main body connected to the lower part of the housing, a neck disposed on the main body, and a head disposed on the neck.

[0014] The neck can have a shape that widens from the body towards the head.

[0015] One side of the drive component can be connected to the lower surface of the head.

[0016] The drive component can be connected to the guide component and the lower surface of the circuit board.

[0017] The driving component can gradually expand as the temperature increases, at least within a certain temperature range.

[0018] The elastic component can be mounted on the circuit board.

[0019] The guide member may include a main body attached to the upper part of the housing, a neck disposed below the main body, and a head located below the neck.

[0020] One side of the drive component can be connected to the upper surface of the head.

[0021] Other features and aspects will become apparent from the following detailed description and accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment.

[0023] Figure 2 This is an exploded perspective view of the camera module according to the implementation method.

[0024] Figure 3 This is a schematic diagram illustrating the state of a camera module at high temperatures according to an embodiment.

[0025] Figure 4 This is a schematic diagram showing the state of the camera module at room temperature according to an embodiment.

[0026] Figure 5 yes Figure 3 and Figure 4 Enlarged view of the guiding component.

[0027] Figure 6 This is a schematic diagram illustrating the state of a camera module at high temperatures according to another embodiment.

[0028] Figure 7 This is a schematic diagram illustrating the state of a camera module according to another embodiment at low temperatures.

[0029] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0030] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0031] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.

[0032] The features described herein may be implemented in various forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will become apparent upon understanding this disclosure.

[0033] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.

[0034] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.

[0035] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.

[0036] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0037] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0038] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.

[0039] It should be noted that in this document, the term "may" is used relative to examples, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.

[0040] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.

[0041] Figure 1 This is a perspective view showing the appearance of the camera module 10 according to an embodiment. Figure 2 This is an exploded perspective view of the camera module 10 according to the embodiment.

[0042] Reference Figure 1 and Figure 2 According to this embodiment, the camera module 10 may include a lens barrel 100, a housing 200, a heating part 300, an insulating member 400, and a substrate part 600.

[0043] The lens barrel 100 can be disposed within the housing 200. The lens barrel 100 can be at least partially housed within the housing 200. The lens barrel 100 can be partially inserted into an opening in the housing 200 and located inside the housing 200, while another portion can be disposed on the housing 200.

[0044] The lens barrel 100 may have different diameters at its upper and lower portions. That is, when measured in a direction perpendicular to the optical axis, the lens barrel 100 may have different widths at its upper and lower portions. The lens barrel 100 may have a larger diameter at its upper portion than at its lower portion. The lens barrel 100 may have a step formed between the upper and lower portions, and a first surface 100a (which is a stepped surface) may be located between the upper and lower portions. The first surface 100a may be perpendicular to the optical axis direction (Z-axis direction). The first surface 100a may be supported by the housing 200.

[0045] For example, the lens barrel 100 can be threaded to the inner circumference of the housing 200. Corresponding threads for the threaded connection can be formed on the outer circumference of the lens barrel 100 and the inner circumference of the housing 200, which face each other.

[0046] The lens barrel 100 can house at least one lens. Each lens housed in the lens barrel 100 can be made of synthetic resin, glass, or quartz. However, the material of the lens is not limited to these.

[0047] The camera module 10 may include a housing 200. The housing 200 may form at least a portion of the exterior of the camera module 10. A portion of the lens barrel 100 and the substrate portion 600 may be disposed inside the housing 200. An insulating member 400 may be disposed on the housing 200.

[0048] The housing 200 may include an upper housing 210 and a lower housing 220. The upper housing 210 may be disposed on the lower housing 220. An opening may be formed on the upper surface of the upper housing 210, through which a portion of the lens barrel 100 may be inserted into the housing 200. The inner surface of the housing 200 may be spaced apart from the lens barrel 100 located within the housing 200 by a predetermined distance.

[0049] The lower housing 220 may be disposed below the upper housing 210. The lower housing 220 may be connected to the upper housing 210. The upper housing 210 may be integrally formed with the lower housing 220.

[0050] An insulating member 400 may be disposed on the housing 200. The heating substrate 310 of the heating unit 300 may be disposed on the insulating member 400. The insulating member 400 can prevent heat loss by blocking the heat generated by the heating substrate 310 from being transferred to the housing 200. In other words, the insulating member 400 can increase the ratio of heat generated by the heating substrate 310 to the lens barrel 100.

[0051] The insulating member 400 may be disposed along at least a portion of the circumference of the lens barrel 100. The insulating member 400 may be disposed around at least a portion of the lens barrel 100. A portion of the insulating member 400 may be inserted into and connected to the housing 200. The insulating member 400 may have a donut shape in which a hollow space is formed. The lens barrel 100 may be inserted into this hollow space. The insulating member 400 may have a shape corresponding to the heating substrate 310. Therefore, the contact area between the insulating member 400 and the heating substrate 310 is increased, making it more effective to block heat generated by the heating substrate 310 from being transferred to the housing 200. However, the shape of the insulating member 400 is not limited to this, and the shape of the insulating member 400 may be any shape in which the lens barrel 100 may be inserted.

[0052] The insulating member 400 may have a second surface 400a facing the first surface 100a. The insulating member 400 may have a shape extending outward from the inserted lens barrel 100 in a direction perpendicular to the optical axis. The second surface 400a may be perpendicular to the optical axis direction (Z-axis direction). The second surface 400a may extend in a direction perpendicular to the optical axis.

[0053] For example, the insulating member 400 may be formed of a ceramic-based material, a plastic-based material, or a silicon-based material. However, this is merely an example, and the material of the insulating member 400 can be any material with a low thermal conductivity.

[0054] The heating unit 300 may include a heating substrate 310 and an electrical transmission member 320.

[0055] The heating substrate 310 may be located on the insulating member 400. The heating substrate 310 may be disposed around the lens barrel 100. The heating substrate 310 may be configured to surround a portion of the lens barrel 100. The heating substrate 310 may have an annular shape. The lens barrel 100 may be inserted into the heating substrate 310. That is, a hollow space is formed in the heating substrate 310, and the heating substrate 310 may have a shape extending outward from the outer periphery of the lens barrel 100 inserted into the hollow space. The heating substrate 310 may have a shape corresponding to the insulating member 400. The heating substrate 310 may have a third surface 310a facing the first surface 100a and a fourth surface 310b facing the second surface 400a. The third surface 310a may be connected to the first surface 100a of the lens barrel 100, and the fourth surface 310b may be connected to the second surface 400a of the insulating member 400. The third surface 310a may be bonded to the first surface 100a of the lens barrel 100 by an adhesive member. The fourth surface 310b can be bonded to the second surface 400a of the insulating member 400 via an adhesive member. Figure 2 In the diagram, the heating substrate 310 is shown as having an annular shape, but is not limited thereto. The shape of the heating substrate 310 can be any shape in which an opening is formed into which the lens barrel 100 can be inserted. The electrical transmission member 320 can be electrically connected to the heating substrate 310. The electrical transmission member 320 can be coupled to the circuit board 610. The electrical transmission member 320 can be electrically connected to the circuit board 610. The electrical transmission member 320 can be connected to a power supply disposed on the circuit board 610. The electrical transmission member 320 can transmit electricity from the circuit board 610 to the heating substrate 310.

[0056] The electrical transport member 320 can be connected to the heating substrate 310 on the inner side of the heating substrate 310. The electrical transport member 320 can be connected to the heating substrate 310 through a portion forming a hollow space in the heating substrate 310. The electrical transport member 320 can have a portion extending from the heating substrate 310 in the optical axis direction (Z-axis direction). The electrical transport member 320 can have a portion located within the internal space of the insulating member 400. The electrical transport member 320 can have a portion located within the internal space of the housing 200. The electrical transport member 320 can extend from the heating substrate 310 toward the substrate portion 600 along the internal spaces of the insulating member 400 and the housing 200. The electrical transport member 320 can be connected to the edge portion of the circuit board 610. The electrical transport member 320 can have at least a partially curved shape. The shape into which the electrical transport member 320 is curved can correspond to the internal shape of the housing 200.

[0057] The substrate portion 600 may be disposed inside the housing 200. The substrate portion 600 may include a circuit board 610 and an image sensor 620.

[0058] The substrate 600 may include a circuit board 610. The circuit board 610 may be disposed below the lens barrel 100. The circuit board 610 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0059] Image sensor 620 can be mounted on circuit board 610. Image sensor 620 can be electrically connected to circuit board 610. Image sensor 620 can be disposed on the front surface or the top surface of circuit board 610. For example, surface mount technology (SMT) can be used to attach image sensor 620 to circuit board 610. As another example, flip chip technology can be used to bond image sensor 620 to circuit board 610. Image sensor 620 can be aligned with lens barrel 100 in the optical axis direction (Z-axis direction).

[0060] Figure 3 This is a schematic diagram showing the state of the camera module 10 according to this embodiment at high temperature. Figure 4 This is a schematic diagram showing the state of the camera module 10 according to this embodiment at low temperatures. Figure 5 yes Figure 3 and Figure 4 Enlarged view of guide component 630.

[0061] Reference Figure 3 and Figure 4 The substrate 600 includes a circuit board 610, a guide member 630, a drive member 640, and an elastic member 650.

[0062] The guide member 630 guides the circuit board 610 to move in the optical axis direction (Z-axis direction). Additionally, the guide member 630 prevents the circuit board 610 from moving in a direction intersecting the optical axis direction (Z-axis direction). The guide member 630 can pass through a hole 611 in the circuit board 610 and connect to the housing 200. That is, by inserting the guide member 630 into the hole 611 in the circuit board 610, the horizontal position of the circuit board 610 can be fixed (i.e., its position in a direction intersecting the optical axis direction (Z-axis direction) or perpendicular to the optical axis direction (Z-axis direction)). The guide member 630 can guide the movement of the circuit board 610. The circuit board 610 can move along the guide member 630 in the optical axis direction (Z-axis direction). The guide member 630 can be coupled to the lower part of the housing 200. For example, the guide member 630 can be threaded into a cavity formed in the lower part of the housing 200. In this case, corresponding threads can be formed in the guide member 630 and the cavity formed in the lower part of the housing 200. As another example, the guide member 630 can be inserted into a cavity formed in the lower part of the housing 200 and attached to the housing 200 by an adhesive.

[0063] Reference Figure 5 The guide member 630 may include a main body 631, a head 633, and a neck 632.

[0064] According to this embodiment, the main body 631 of the guide member 630 is located at the lower part of the guide member 630. The main body 631 can be inserted into the hole 611 of the circuit board 610. The circuit board 610 can move along the main body 631 in the optical axis direction (Z-axis direction).

[0065] The shape of the main body 631 can correspond to the shape of the hole 611 in the circuit board 610. For example, the hole 611 in the circuit board 610 can be formed in a circular shape, and the main body 631 can have a cylindrical shape corresponding to the shape of the hole 611. However, the shape of the main body 631 is not limited to this, and the main body 631 can have a cylindrical shape with a polygonal cross-section (such as a quadrilateral).

[0066] The lower part of the main body 631 can be connected to the housing 200. The lower part of the main body 631 can be inserted into a hole formed in the lower part of the housing 200 and fixed to the housing 200. For example, the main body 631 can be attached to the hole in the housing 200 using adhesive. As another example, corresponding threads are formed in the lower part of the main body 631 and the hole in the housing 200, so that the main body 631 and the hole in the housing 200 can be threadedly connected. By fixing the main body 631 to the housing 200, the planar (XY plane) position of the circuit board 610 can be fixed.

[0067] The neck 632 of the guide member 630 is located on the main body 631. The neck 632 may have a shape that gradually widens from the main body 631 toward the head 633. When the circuit board 610 is raised, the neck 632 can act as a stop. Because the neck 632 has a shape that gradually widens toward the head 633, the impact when the circuit board 610 is lifted and then stops passing through the neck 632 can be mitigated.

[0068] The head 633 of the guide member 630 is located on the neck 632. The head 633 may have a planar area larger than the planar area of ​​the upper surface of the neck 632. The head 633 may completely cover the neck 632. The head 633 may include a protrusion 633a that further protrudes outward based on the upper surface of the neck 632.

[0069] The drive member 640 may be located on the upper surface of the circuit board 610. Additionally, the drive member 640 may be coupled to the guide member 630. In other words, the drive member 640 may be connected to both the upper surface of the circuit board 610 and the guide member 630. The drive member 640 may have one side contacting the upper surface of the circuit board 610 and another side attached to the lower surface of the protrusion 633a of the guide member 630. When one side of the drive member 640 is fixed to the guide member 630, the drive member 640 may apply pressure to the circuit board 610 as it expands.

[0070] The drive component 640 may include a shape memory alloy (SMA). (See reference...) Figure 4 The drive member 640 can apply downward pressure to the circuit board 610 by utilizing the extension of the shape memory alloy. For example, the drive member 640 can expand to have an arched shape at room temperature and contract to have a flat shape at high temperature. That is, at least within a certain temperature range, the drive member 640 can gradually expand as the temperature decreases.

[0071] The elastic member 650 may be located below the circuit board 610. The elastic member 650 may be connected to the lower part of the housing 200 and support the circuit board 610 from below. The circuit board 610 may be lifted by the elastic member 650. When the drive member 640 retracts, the circuit board 610 may be lifted by the elastic force of the elastic member 650. For example, the elastic member 650 may have a cavity formed therein. The main body 631 of the guide member 630 may be inserted into the cavity inside the elastic member 650.

[0072] For example, if the interior of camera module 10 is exposed to a high-temperature environment, drive member 640 can retract. In a low-temperature environment, drive member 640 can expand and apply pressure to circuit board 610. The compressed circuit board 610 can descend along the body portion 631 of guide member 630. The degree of expansion of drive member 640 can be correlated with the temperature inside camera module 10. As the internal temperature of camera module 10 rises, drive member 640 can contract, and circuit board 610 can rise along the body portion 631 of guide member 630 due to the restoring force of elastic member 650.

[0073] Each component of the camera module 10 may expand in high-temperature environments and contract in low-temperature environments. Therefore, the distance between the lens and the image module may be longer in low-temperature environments than in high-temperature environments. As described above, the change in distance can be compensated for by moving the circuit board 610 up and down by driving the member 640 and the elastic member 650.

[0074] Below, refer to Figure 6 and Figure 7 Describes a camera module according to another embodiment.

[0075] Figure 6 This is a schematic diagram showing the state of the camera module according to this embodiment at high temperatures. Figure 7 This is a schematic diagram illustrating the state of the camera module according to this embodiment at low temperatures. The camera module according to this embodiment is similar to that in the reference diagram. Figures 3 to 5 The camera module of the described embodiment. Detailed descriptions of identical components are omitted.

[0076] Reference Figure 6 and Figure 7 The base plate portion 600 of the camera module in this embodiment includes a circuit board 610, a guide member 660, a drive member 670, and an elastic member 680.

[0077] The guide member 660 guides the circuit board 610 to move in the optical axis direction (Z-axis direction). Additionally, the guide member 660 prevents the circuit board 610 from moving in a direction intersecting the optical axis direction (Z-axis direction). The guide member 660 can pass through a hole 611 in the circuit board 610 and connect to the housing 200. That is, by inserting the guide member 660 into the hole 611 in the circuit board 610, the horizontal position of the circuit board 610 can be fixed (i.e., its position in a direction intersecting the optical axis direction (Z-axis direction) or perpendicular to the optical axis direction (Z-axis direction)). The guide member 660 can guide the movement of the circuit board 610. The circuit board 610 can move along the guide member 660 in the optical axis direction (Z-axis direction). The guide member 660 can be coupled to the upper part of the housing 200. For example, the guide member 660 can be threaded into a cavity formed in the upper part of the housing 200. In this case, corresponding threads can be formed in the guide member 660 and the cavity formed in the upper part of the housing 200. As another example, the guide member 660 can be inserted into a cavity formed in the upper part of the housing 200 and attached to the housing 200 by an adhesive. The guide member 660 can at least partially pass through the elastic member 680.

[0078] The guide member 660 may include a main body 661, a neck 662, and a head 663.

[0079] One side of the main body 661 of the guide member 660 can be connected to the housing 200. One side of the main body 661 can be inserted into a hole formed in the upper part of the housing 200 and fixed to the housing 200. For example, the main body 661 can be attached to the hole in the housing 200 using adhesive. As another example, corresponding threads are formed on one side of the main body 661 and the hole in the housing 200, allowing the main body 661 and the hole in the housing 200 to be threadedly connected. By fixing the main body 661 to the housing 200, the planar (XY plane) position of the circuit board 610 can be fixed. For example, the main body 661 of the guide member 660 can be at least partially inserted into the interior of the elastic member 680.

[0080] The neck 662 of the guide member 660 can extend downward from the other side of the main body 661. The neck 662 can have a shape that gradually widens from the main body 661 toward the head 663. When the circuit board 610 moves downward, the neck 662 can act as a stop. Because the neck 662 has a shape that gradually widens toward the head 663, the impact when the circuit board 610 descends and then stops passing through the neck 662 can be mitigated.

[0081] The head 663 of the guide member 660 extends downward from the neck 662. The head 663 may have a planar area larger than the planar area of ​​the upper surface of the neck 662. The head 663 may include a protrusion 633a that further projects outward from the upper surface of the neck 662.

[0082] The drive member 670 may be located on the lower surface of the circuit board 610. Additionally, the drive member 670 may be coupled to the guide member 660. The drive member 670 may have one side contacting the lower surface of the circuit board 610 and the other side attached to the upper surface of the protrusion 633a of the guide member 660.

[0083] The drive member 670 may include a shape memory alloy (SMA). The drive member 670 can apply upward pressure to the circuit board 610 by utilizing the extension of the shape memory alloy. For example, the drive member 670 can expand to have an arched shape at high temperature and contract to have a flat shape at room temperature. That is, at least within a certain temperature range, the drive member 670 can gradually expand as the temperature increases.

[0084] The elastic member 680 may be located on the circuit board 610. The elastic member 680 may be connected to the upper part of the housing 200 and support the circuit board 610 from above. The circuit board 610 may be lifted by the elastic member 680. When the drive member 670 retracts, the circuit board 610 may be lowered by the elastic force of the elastic member 680. For example, the elastic member 680 may have a cavity formed therein. The main body 661 of the guide member 660 may be inserted into the cavity inside the elastic member 680.

[0085] For example, if the interior of the camera module is exposed to a high-temperature environment, the drive member 670 can expand. As the drive member 670 expands, the circuit board 610 can be pressed and lifted along the body 661 of the guide member 660. The degree of expansion of the drive member 670 can be correlated with the temperature inside the camera module 10. As the temperature inside the camera module 10 decreases, the drive member 670 can contract. When the drive member 670 contracts, the circuit board 610 can descend along the body 661 of the guide member 660 by the restoring force of the elastic member 680.

[0086] According to at least one embodiment of this disclosure, the focal length can be adjusted by moving a circuit board up and down using a shape memory alloy. Therefore, the focal length can be adjusted in a VCM-type actuator without any gap between the lens barrel and the housing.

[0087] Furthermore, since the drive components expand and contract in response to temperature changes, focal length compensation based on temperature variations can be performed without the need for a separate temperature sensor or controller. When no temperature sensor or controller is required, the reliability of focal length compensation can be maintained even at high temperatures.

[0088] Furthermore, compared to VCM drive types, the camera module can be miniaturized because the components required for the drive circuit board are relatively small.

[0089] One or more embodiments attempt to provide a camera module capable of adjusting the focal length by moving a substrate up and down using a shape memory alloy.

[0090] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. Camera module, including: case; The lens barrel is at least partially housed within the housing; A circuit board on which an image sensor is mounted; A drive component is connected to the circuit board and configured to move the circuit board; An elastic member is connected to the housing and configured to support the circuit board; as well as A guiding component configured to guide the movement of the circuit board.

2. The camera module according to claim 1, wherein, The guiding member is configured to guide the circuit board to move in the optical axis direction and prevent the circuit board from moving in a direction intersecting the optical axis direction.

3. The camera module according to claim 1, wherein, The driving component includes a shape memory alloy.

4. The camera module according to claim 1, wherein, The drive component is connected to the guide component and the upper surface of the circuit board.

5. The camera module according to claim 4, wherein, The driving component expands gradually as the temperature decreases, at least within a certain temperature range.

6. The camera module according to claim 5, wherein, The elastic member is located below the circuit board.

7. The camera module according to claim 5, wherein, The guiding component includes: The main body is connected to the lower part of the housing. The neck is located on the main body, and The head is positioned on the neck.

8. The camera module according to claim 7, wherein, The neck has a shape that widens from the body portion toward the head.

9. The camera module according to claim 7, wherein, One side of the drive member is connected to the lower surface of the head.

10. The camera module according to claim 1, wherein, The drive component is connected to the guide component and the lower surface of the circuit board.

11. The camera module according to claim 10, wherein, The driving component expands gradually with increasing temperature, at least within a certain temperature range.

12. The camera module according to claim 11, wherein, The elastic member is disposed on the circuit board.

13. The camera module according to claim 11, wherein, The guiding component includes: The main body is connected to the upper part of the housing. The neck is located below the main body, and The head is located below the neck.

14. The camera module according to claim 13, wherein, One side of the drive member is connected to the upper surface of the head.

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