Steel Mesh Cleaning Methods and Devices
By applying microbubble foam cleaning solution to the stencil and utilizing the capillary effect to dissolve solder paste, combined with wiping and drying units, the problems of high cleaning solution consumption and long cleaning time in existing technologies are solved, achieving a highly efficient and environmentally friendly stencil cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU OUFANG ELECTRONICS TECH
- Filing Date
- 2026-04-15
- Publication Date
- 2026-06-30
AI Technical Summary
Existing stencil cleaning methods consume a large amount of cleaning fluid, the cleaning effect decreases as the fluid becomes dirtier, and the cleaning time is long, making it difficult to efficiently remove solder paste residue.
Microbubble foam cleaning fluid is applied to the stencil surface, and the capillary effect allows the cleaning fluid to enter the micropores to dissolve the solder paste. Combined with wiping unit and compressed air drying, the cleaning fluid usage is reduced and the efficiency is improved.
It achieves efficient cleaning of steel mesh, saves cleaning fluid, reduces waste liquid generation, shortens cleaning time, and improves cleaning efficiency.
Smart Images
Figure CN122298731A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of machinery, and more particularly to a method and apparatus for cleaning steel mesh. Background Technology
[0002] In the field of SMT (Surface Mount Technology) manufacturing, stencils are widely used for applying solder paste. After use, solder paste residue remains on the stencil surface and within the micropores, requiring timely cleaning. Common cleaning methods typically involve spraying with a solder paste-dissolving cleaning solution or immersion followed by ultrasonic cleaning. Both methods suffer from drawbacks such as high cleaning solution consumption, decreased cleaning effectiveness with repeated use as the solution becomes contaminated, and the need for waste drainage. Furthermore, the cleaning solution spends a short time in the stencil's micropores during rinsing, resulting in poor dissolution and necessitating repeated rinsing, leading to prolonged cleaning times. Summary of the Invention
[0003] The purpose of this invention is to provide a method for cleaning steel mesh that solves or partially solves the above-mentioned technical problems.
[0004] To achieve the above objectives, the present invention provides the following technical solution: A method for cleaning steel mesh includes the following steps: S1. Foam the cleaning solution to form a foam cleaning solution with microbubbles, wherein the diameter of the microbubbles in the foam cleaning solution is smaller than the micropore diameter of the steel mesh, and the lifespan of the microbubbles is less than 60 seconds. S2. Place the steel mesh horizontally and apply the foam cleaning solution to the upper surface of the steel mesh to be cleaned, forming a cleaning solution coating with a preset thickness on the surface of the steel mesh. S3. Allow the foam cleaning solution to stand for a preset time, so that the bubbles in the foam cleaning solution gradually break down, and the cleaning solution in the cleaning solution coating flows into the micropores of the stencil under the capillary effect and remains there, so as to dissolve the solder paste in the micropores. S4. Wipe the cleaning fluid coating using the wiping unit to remove solder paste and residual cleaning fluid from the stencil; S5. Clean the steel mesh with water or alcohol; S6. Dry the steel mesh by blowing it with compressed air.
[0005] Preferably, the average diameter of the microbubbles is 100μm to 800μm. Preferably, in step S4, a vacuum device is provided below the steel mesh to simultaneously draw the cleaning liquid from the micropores of the steel mesh when wiping the cleaning liquid coating.
[0006] Preferably, in step S4, the cleaning fluid coating is wiped with a wiping paper.
[0007] Preferably, the wiping unit includes a mounting frame and a driving device for moving the mounting frame on a horizontal plane. The mounting frame is provided with a front rotating drum, a rear rotating drum, a front motor, a rear motor, and a pressing member. The wiping paper is wound on the rear rotating drum, and the front part of the wiping paper is wound on the front rotating drum. The pressing member is disposed between the front rotating drum and the rear rotating drum and is used to press the wiping paper against the surface of the steel mesh.
[0008] Preferably, the wiping unit further includes a dripping device, and step S4 specifically includes the following sub-steps: S41. Wiping the cleaning fluid coating: The drive device drives the mounting frame to move horizontally back and forth, wiping the cleaning fluid coating on the steel mesh with wiping paper; at the same time, the front motor drives the front drum to rotate, rolling the wiped wiping paper onto the front drum; S42. Cleaning the steel mesh: The dripping device drips water or alcohol onto the wiping paper to wet the wiping paper; the driving device drives the mounting frame to move horizontally back and forth, cleaning the steel mesh through the wetted wiping paper; at the same time, the front motor drives the front drum to rotate, rolling the wiped wiping paper onto the front drum; S43. Drying and wiping: The drive device drives the mounting frame to move horizontally back and forth, wiping the steel mesh with wiping paper; at the same time, the front motor drives the front drum to rotate, rolling the wiped wiping paper onto the front drum, and recording the amount of wiping paper used in this process; S44. Recycling the wiping paper: The rear motor drives the rear drum to rotate, recycling the wiping paper used in step S43.
[0009] Preferably, the method further includes step S0: reading the steel mesh file to obtain the location and shape information of the micropores in the steel mesh; in step S2, applying the foam cleaning solution to the area where the micropores are located according to the location of the micropores.
[0010] The present invention also provides a steel mesh cleaning device for implementing the method, comprising: A foaming unit is used to foam the cleaning liquid to form a foam cleaning liquid with microbubbles, wherein the diameter of the microbubbles in the foam cleaning liquid is smaller than the micropore diameter of the steel mesh, and the lifespan of the microbubbles is less than 90 seconds. The coating unit is used to apply the foam cleaning liquid to the surface of a horizontally placed steel mesh to form a cleaning liquid coating with a preset thickness. The wiping unit is used to wipe the cleaning fluid coating to remove solder paste and residual cleaning fluid from the stencil; The drying unit is used to dry the steel mesh by blowing it with compressed air. The inspection unit is used to photograph each opening of the stencil to check the shape and size of the opening and to confirm whether the opening is clean by comparing it with the original information in the stencil file.
[0011] The beneficial effects of this invention are as follows: By applying a foam cleaning solution, a cleaning solution coating of a certain thickness can be formed on the stencil, with the foam particles smaller than the pore size of the stencil. The shape of the cleaning solution coating has a certain degree of durability and can be maintained for a certain period of time. As the bubbles gradually burst, due to capillary effect, the cleaning solution in the coating flows into the micropores of the stencil and remains there, allowing for prolonged dissolution of the solder paste. After a certain period of dissolution, the cleaning solution is wiped off with a wiping paper, followed by rinsing with clean water; finally, it is purged with compressed air. This method saves cleaning solution and generates only solid waste, without producing liquid waste, and also has a short cleaning time and high cleaning efficiency. Attached Figure Description
[0012] Figure 1 This is a flowchart of the present invention; Figure 2 This is a three-dimensional structural schematic diagram of a steel mesh cleaning device according to an embodiment of the present invention; Figure 3 This is a three-dimensional structural diagram of a portion of the wiping unit; Figure 4 This is a front view of part of the structure of the wiping unit. Detailed Implementation
[0013] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.
[0014] In the description of this invention, it should be noted that the terms "inner", "outer", "upper", "lower", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0015] like Figures 1 to 4 As shown, a steel mesh cleaning method of the present invention includes the following steps: S0. Read the stencil file to obtain the location and shape information of the micro-holes in the stencil; In the fields of PCB design and SMT (Surface Mount Technology) manufacturing, the file that records the shape, location and size of each micro-hole (i.e., pad opening) in the stencil is usually called a stencil file or Gerber file, which can be obtained from the manufacturer; S1. The cleaning solution is foamed to form a foam cleaning solution with microbubbles. The diameter of the microbubbles in the foam cleaning solution is smaller than the micropore diameter of the steel mesh, and the lifespan of the microbubbles is less than 60 seconds. The average diameter of the microbubbles is 100μm to 800μm. The foaming of the cleaning solution is carried out by mixing air into the cleaning solution through tiny vents at a predetermined ratio and pressure to form bubbles. The bubbles are then evenly distributed by stirring and slowly flowed out through a coating nozzle 18. The coating nozzle 18 has a flat or conical structure. The cleaning solutions commonly used in the industry have a certain viscosity, which is suitable for forming a foam-like structure. S2. Place the stencil horizontally. Based on the micropore locations obtained from the stencil file, apply foam cleaning solution to the micropore areas on the surface of the stencil to be cleaned, forming a cleaning solution coating with a preset thickness on the stencil surface. The preset thickness is usually 0.5-1cm, which is determined through testing based on the type of cleaning solution used. Too thick a coating will waste cleaning solution, while too thin a coating will make it difficult to maintain its shape, reducing the time for the cleaning solution to soak the solder paste. The application nozzle 18 is driven by a common XYZ axis slide, or a servo motor-driven XYZ platform that can move on a plane, or a robotic arm, to move horizontally back and forth and left and right on the stencil to achieve the application. Placing the stencil horizontally helps the cleaning solution stay on the stencil for a longer period of time. S3. Set a preset set time (usually 30-90 seconds, depending on the lifespan of the bubbles) to allow the bubbles in the foam cleaning solution to come into contact with the air and gradually break from the outside to the inside. The cleaning solution in the cleaning solution coating flows into the micropores of the stencil under the capillary effect to dissolve the solder paste in the micropores. The unbroken bubbles maintain the shape of the cleaning solution coating and can also provide tension to ensure that the cleaning solution in the micropores does not drip. S4. Wipe the cleaning fluid coating with the wiping paper 30 of the wiping unit 20 to remove solder paste and residual cleaning fluid from the stencil; set a vacuum device below the stencil to simultaneously draw the cleaning fluid from the micropores of the stencil while wiping the cleaning fluid coating, thereby accelerating the removal of the cleaning fluid and residual solder paste. S5. Clean the steel mesh with water or alcohol; S6. Dry the steel mesh by blowing it with compressed air.
[0016] S7. Inspection: Take a picture of the stencil with a CCD camera and compare the shape of each micro-hole in the picture with the corresponding shape of the micro-hole in the stencil file to confirm whether they are consistent. If they are inconsistent, it means that there is still solder paste inside the micro-hole. Steps S2-S7 need to be repeated for further cleaning. At the same time, when applying the cleaning solution coating, only the corresponding micro-hole needs to be locally coated.
[0017] Specifically, the wiping unit 20 includes a mounting frame 22 and a drive device (not shown) for moving the mounting frame 22 on a horizontal plane. The mounting frame 22 is equipped with a front rotating drum 24, a rear rotating drum 26, a front motor (not shown), a rear motor (not shown), and a pressing member 28. The wiping paper 30 is wound onto the rear rotating drum 26, and the front part of the wiping paper 30 is wound onto the front rotating drum 24. The pressing member 28 is positioned between the front rotating drum 24 and the rear rotating drum 26 to press the wiping paper 30 against the surface of the steel mesh. The front motor drives the front rotating drum 24 to rotate, thus feeding the wiping paper 30; the rear motor drives the rear rotating drum 26 to rotate, thus retrieving the wiping paper 30. It also includes a dripping device 32 for dripping water or alcohol onto the wiping paper 30. In this embodiment, the dripping device 32 includes a storage tank, a storage trough 36 horizontally disposed on the wiping paper 30, and an infusion pump (not shown) that pumps water or alcohol from the storage tank into the storage trough 36. The storage trough 36 has multiple overflow holes 38, through which water or alcohol delivered by the infusion pump flows and drips onto the wiping paper 30 below, thus wetting the wiping paper 30. According to the principles of the present invention, the dripping device 32 can also be a nozzle (not shown) connected to the infusion pump. The driving device can be a common XY-axis slide 14, or an XY platform driven by a servo motor that can move on a plane.
[0018] With the support of this structure, step S4 specifically includes the following sub-steps: S41. Wiping the cleaning fluid coating: The drive unit drives the mounting bracket 22 to move horizontally back and forth, wiping the cleaning fluid coating on the steel mesh with wiping paper 30; at the same time, the front motor drives the front drum 24 to rotate, rolling the wiped wiping paper 30 onto the front drum 24; the used wiping paper 30 forms solid waste, which is a less polluting form of waste disposal compared to the liquid cleaning fluid, and is also easier to handle; moreover, the cleaning fluid used each time is clean, rather than recycled, so there is no decline in cleaning quality; S42. Cleaning the steel mesh: The dripping device 32 drips water or alcohol onto the wiping paper 30 to wet the wiping paper 30; the drive device drives the mounting frame 22 to move horizontally back and forth, cleaning the steel mesh through the wetted wiping paper 30; at the same time, the front motor drives the front drum 24 to rotate, rolling the wiped wiping paper 30 onto the front drum 24. S43. Drying and wiping: The drive unit drives the mounting bracket 22 to move horizontally back and forth, wiping the steel mesh with wiping paper 30; at the same time, the front motor drives the front drum 24 to rotate, rolling the wiped wiping paper 30 onto the front drum 24, and recording the amount of wiping paper 30 used in this process; S44. Recycling the wiping paper 30: The rear motor drives the rear drum 26 to rotate, recycling the wiping paper 30 used in step S43. The wiping paper 30 used in step S43 is relatively dry and clean, so the rear drum 26 winds it up for repeated use, thereby saving the wiping paper 30.
[0019] refer to Figure 2-4 The present invention also provides a steel mesh cleaning device, comprising: Rack 10; The frame 10 is equipped with a clamp 12 for fixing the steel mesh and a foaming unit (not shown). An XY axis slide 14 is provided on the frame 10, a first Z axis slide 16 is provided on the XY axis slide 14, and a coating nozzle 18 is provided on the first Z axis slide 16. The coating nozzle 18 is connected to the foaming device through a hose. The wiping unit 20 includes a mounting frame 22 and a drive device for moving the mounting frame 22 on a horizontal plane. In this embodiment, the drive device is a second Z-axis slide (not shown) mounted on the XY-axis slide 14. The mounting frame 22 is equipped with a front rotating drum 24, a rear rotating drum 26, a front motor, a rear motor, and a pressing member 28. The wiping paper 30 is wound on the rear rotating drum 26, and the front part of the wiping paper 30 is wound on the front rotating drum 24. The pressing member 28 is disposed between the front rotating drum 24 and the rear rotating drum 26 and is used to press the wiping paper 30 against the surface of the stencil. The pressing member 28 is a W-shaped plastic part that abuts against the wiping paper 30, thereby pressing the wiping paper 30 against the stencil. It also includes a dripping device 32 for dripping water or alcohol onto the wiping paper 30. By dripping water or alcohol, the wiping paper 30 is moistened, allowing the wet wiping paper 30 to wipe away solder paste and cleaning fluid. This method effectively avoids the risk of alcohol accumulating directly on the stencil and causing combustion. In this embodiment, the dripping device 32 includes a storage tank, a storage trough 36 horizontally positioned on the wiping paper 30, and a pump (not shown) that pumps water or alcohol from the storage tank (not shown) into the storage trough 36. The storage trough 36 has multiple overflow holes 38. Water or alcohol delivered by the pump flows out from the overflow holes 38 and drips onto the wiping paper 30 below, thus wetting the wiping paper 30. Wetting the wiping paper 30 allows for better wiping of solder paste and residual cleaning fluid. Furthermore, two wiping units 20 can be configured, one positioned above and the other correspondingly positioned below, to wipe both the upper and lower surfaces of the stencil.
[0020] The drying unit is a compressed air machine (not shown) installed on the XY axis slide table 14, which is used to blow and dry the steel mesh with compressed air. The inspection unit consists of a CCD camera (not shown) mounted on the XY-axis slide 14. This camera is used to photograph each micro-hole of the stencil to check the shape and size of the micro-holes and to confirm whether the micro-holes are clean by comparing them with the information in the stencil file.
[0021] Of course, the present invention also includes a control system for controlling the XY-axis slide 14, the drying unit, the inspection unit, the front motor, the rear motor, etc., so that they perform each step according to the method of the present invention. The implementation of the control system is itself a conventional method in the art, and therefore is not described in detail.
[0022] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A method for cleaning steel mesh, characterized in that, Includes the following steps: S1. Foam the cleaning solution to form a foam cleaning solution with microbubbles, wherein the diameter of the microbubbles in the foam cleaning solution is smaller than the micropore diameter of the steel mesh, and the lifespan of the microbubbles is less than 60 seconds. S2. Place the steel mesh horizontally and apply the foam cleaning solution to the upper surface of the steel mesh to be cleaned, forming a cleaning solution coating with a preset thickness on the surface of the steel mesh. S3. Allow the foam cleaning solution to stand for a preset time, so that the bubbles in the foam cleaning solution gradually break down, and the cleaning solution in the cleaning solution coating flows into the micropores of the stencil under the capillary effect and remains there, so as to dissolve the solder paste in the micropores. S4. Wipe the cleaning fluid coating using the wiping unit to remove solder paste and residual cleaning fluid from the stencil; S5. Wipe and clean the steel mesh with water or alcohol; S6. Dry the steel mesh by blowing it with compressed air.
2. The steel mesh cleaning method according to claim 1, characterized in that: The average diameter of the microbubbles is 100μm to 800μm.
3. The steel mesh cleaning method according to claim 1, characterized in that: In step S4, a vacuum device is installed below the steel mesh to simultaneously draw the cleaning fluid from the micropores of the steel mesh while wiping the cleaning fluid coating.
4. The steel mesh cleaning method according to claim 1, characterized in that: In step S4, the cleaning fluid coating is wiped with a wiping paper.
5. The steel mesh cleaning method according to claim 4, characterized in that: The wiping unit includes a mounting frame and a driving device for moving the mounting frame on a horizontal plane. The mounting frame is provided with a front rotating drum, a rear rotating drum, a front motor, a rear motor, and a pressing component. The wiping paper is wound on the rear rotating drum, and the front part of the wiping paper is wound on the front rotating drum. The pressing component is disposed between the front rotating drum and the rear rotating drum and is used to press the wiping paper against the surface of the steel mesh.
6. The steel mesh cleaning method according to claim 5, characterized in that: The wiping unit further includes a dripping device, and step S4 specifically includes the following sub-steps: S41. Wiping the cleaning fluid coating: The drive device drives the mounting frame to move horizontally back and forth, wiping the cleaning fluid coating on the steel mesh with wiping paper; at the same time, the front motor drives the front drum to rotate, rolling the wiped wiping paper onto the front drum; S42. Cleaning the steel mesh: The dripping device drips water or alcohol onto the wiping paper to wet the wiping paper; the driving device drives the mounting frame to move horizontally back and forth, cleaning the steel mesh through the wetted wiping paper; at the same time, the front motor drives the front drum to rotate, rolling the wiped wiping paper onto the front drum; S43. Drying and wiping: The drive device drives the mounting frame to move horizontally back and forth, wiping the steel mesh with wiping paper; at the same time, the front motor drives the front drum to rotate, rolling the wiped wiping paper onto the front drum, and recording the amount of wiping paper used in this process; S44. Recycling the wiping paper: The rear motor drives the rear drum to rotate, recycling the wiping paper used in step S43.
7. The steel mesh cleaning method according to claim 1, characterized in that: It also includes step S0: reading the steel mesh file to obtain the location and shape information of the micropores in the steel mesh; in step S2: applying the foam cleaning liquid to the area where the micropores are located according to the location of the micropores.
8. A steel mesh cleaning device for implementing the method of claim 7, characterized in that, include: A foaming unit is used to foam the cleaning liquid to form a foam cleaning liquid with microbubbles, wherein the diameter of the microbubbles in the foam cleaning liquid is smaller than the micropore diameter of the steel mesh, and the lifespan of the microbubbles is less than 90 seconds. The coating unit is used to apply the foam cleaning liquid to the surface of a horizontally placed steel mesh to form a cleaning liquid coating with a preset thickness. The wiping unit is used to wipe the cleaning fluid coating to remove solder paste and residual cleaning fluid from the stencil; The drying unit is used to dry the steel mesh by blowing it with compressed air.
9. The steel mesh cleaning device according to claim 8, characterized in that, Also includes: The inspection unit is used to photograph each micropore of the stencil to check the shape and size of the micropores and to confirm whether the micropores are clean by comparing them with the information in the stencil file.