A core-shell composite structure assembly for cryogenic electronic device housing and its preparation method

Abstract

This invention discloses a core-shell composite structure component for the housing of low-temperature electronic devices and its preparation method. It relates to the field of organic polymer materials technology. Its microstructure adopts a core-shell composite material structure, including a core as the processing phase and a shell as the toughening phase. The core is highly dispersed nano-sized polybutadiene rubber, and the shell is SAN glass fiber reinforced resin. The nano-sized polybutadiene rubber powder is highly dispersed with a particle size of 50-150 nm. The SAN glass fiber reinforced resin is a premixed modified material of SAN resin and 5-10% alkali-free glass fiber, forming a dual-core structure of the core-shell composite material. This core-shell composite structure component for the housing of low-temperature electronic devices achieves a comprehensive balance of cold resistance, mechanical strength, heat resistance, weather resistance, chemical stability, and recyclability through material formulation design including dual-core structure modification, interfacial compatibility strengthening, synergistic nano-toughening, and UV-resistant directional modification. Combined with process optimization such as microwave drying, high-performance mixing, three-stage injection molding, and optimized post-treatment, it also solves problems such as uneven drying of raw materials, high internal stress, and uneven flash during preparation.

Description

Technical Field

[0001] This invention belongs to the technical field of electronic functional materials and communication equipment structural components, and particularly relates to a core-shell composite structure component for the outer shell of low-temperature electronic devices and its preparation method. Background Technology

[0002] Electronic devices used in low-temperature environments (such as outdoor sensors, cryogenic control cabinets, automotive electronic modules, 5G remote units, etc.) must have housings that simultaneously meet requirements such as -40℃ low-temperature impact resistance, high rigidity, heat resistance, flame retardancy, UV aging resistance, antistatic properties, solvent resistance, and dimensional stability. Traditional electronic housing materials are prone to brittleness at low temperatures, have low heat distortion temperatures, are prone to yellowing and cracking after long-term outdoor use, and it is difficult to achieve both flame retardancy and low-temperature toughness. They also have poor recyclability. Furthermore, the manufacturing process suffers from problems such as uneven drying of raw materials, insufficient mixing, high internal stress during injection molding, and uneven flash, which restricts their reliable application in extremely cold, outdoor, and complex working conditions.

[0003] To address the aforementioned challenges, existing technologies employ methods such as core-shell structure toughening, interface compatibility, and nano-modification to improve low-temperature toughness. However, these technologies still suffer from drawbacks including decreased rigidity and heat resistance, insufficient weather resistance, a conflict between flame retardancy and cold resistance, poor recyclability, and poor process stability, failing to meet the comprehensive performance requirements of cryogenic electronic device housings. Therefore, there is an urgent need to develop a housing component and its fabrication method that is suitable for cryogenic electronic devices, balances high toughness and comprehensive performance, and offers stable and controllable processing. Summary of the Invention

[0004] This invention addresses the technical deficiencies and insufficient manufacturing processes of existing low-temperature electronic casing materials by providing a core-shell composite structure component for low-temperature electronic device casings and its manufacturing method. Through a dual-core structure design, interface compatibility enhancement, synergistic nano-toughening, UV-resistant directional modification, and a balanced flame-retardant-cold-resistant formulation, combined with microwave drying, high-performance mixing, three-stage injection molding, and optimized post-treatment processes, it achieves a comprehensive performance balance at -40℃, exhibiting high toughness, high rigidity, heat resistance, flame retardancy, UV resistance, antistatic properties, solvent resistance, and recyclability. It also solves problems such as uneven raw material drying, high internal stress, uneven flash, and surface defects during the manufacturing process, making it suitable for long-term reliable use in low-temperature electronic devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A core-shell composite structure component for the housing of a low-temperature electronic device has a microstructure that adopts a core-shell composite material structure, including a core as a processing phase and a shell as a toughening phase. The core is highly dispersed nano-sized polybutadiene rubber, and the shell is SAN glass fiber reinforced resin. The nano-sized polybutadiene rubber powder is highly dispersed with a particle size of 50-150nm. The SAN glass fiber reinforced resin is a premixed modified material of SAN resin and 5-10% alkali-free glass fiber, forming a dual-core structure of core-shell composite material.

[0006] This invention designs a dual-core structure of core-shell composite material, using nano-sized polybutadiene rubber powder as the core and the main processing phase. Its highly dispersed nano-properties effectively disperse external stress, significantly improving impact resistance at low temperatures. The outer shell uses SAN glass fiber reinforced resin as the toughening phase. This resin is a premix of SAN resin and 5-10% coupling agent-modified glass fiber, ensuring compatibility with the core rubber phase while also enhancing the material's rigidity and heat resistance, thus solving the problem of traditional core-shell structures struggling to balance cold resistance and rigidity. As a preferred embodiment of the present invention, the product is prepared by weight from the following raw materials: 25-60 parts of ternary copolymer matrix resin, 10-30 parts of SAN resin, 20-35 parts of nano-grade polybutadiene rubber powder, 1-4 parts of interface compatibilizer, 3-8 parts of composite toughening agent, 5-12 parts of composite heat-resistant flame-retardant charring agent, 0.5-3 parts of anti-UV additive, 0.5-2 parts of antistatic agent / carbon nanotube, 0.1-2 parts of functional additive, and 0.3-1 parts of biodegradable and recyclable additive.

[0007] Furthermore, the interface compatibilizer is one or a combination of two of Silesol or PCT801; the UV-resistant additive is one or a combination of two of Nipermid or PEG.

[0008] By selecting one or two of Silesol or PCT801, the binding force between the core and shell and between the molecular chains of each raw material in the dual-core structure can be specifically improved, the interfacial viscoelastic properties can be enhanced, the components of the material can be tightly bound at low temperatures, and stress concentration caused by poor interfacial bonding can be avoided. At the same time, the compatibility of the material with ketone and ester organic solvents can be improved.

[0009] By selecting one or two of Nipermid or PEG, the UV resistance of the material can be effectively improved without significantly affecting its mechanical properties, thus extending its outdoor service life and resolving the contradiction between traditional UV-resistant modification and mechanical properties.

[0010] Furthermore, the composite toughening agent is a compound of organomontmorillonite and core-shell structure MBS, with a weight ratio of 1:(3-5); the core of the core-shell structure MBS is butadiene-styrene rubber, and the shell is styrene-methyl methacrylate copolymer, with a core-shell weight ratio of 7:3.

[0011] It is composed of nano-sized polybutadiene rubber powder and composite toughening agent (organo-montmorillonite + MBS). The high dispersibility of the nano-rubber powder and the nano-sheet structure of the organo-montmorillonite form a network support. Combined with the core-shell toughening effect of MBS, it significantly improves the rigidity and impact resistance of the material, while effectively reducing the heat distortion temperature and linear expansion coefficient of the material and optimizing the dimensional stability of the material.

[0012] Furthermore, the composite heat-resistant and flame-retardant charring agent is a compound of pentaerythritol phosphate, melamine cyanurate and ammonium polyphosphate, with a weight ratio of (2-3):(1-2):1 and a phosphorus content of 25-30%; the biodegradable and recyclable additive is a compound of polycaprolactone and tributyl citrate, with a weight ratio of (2-3):1.

[0013] The combination of pentaerythritol phosphate, melamine cyanurate and ammonium polyphosphate works synergistically to form a dense carbon layer on the material surface. This not only controls the heat distortion temperature within a reasonable range of 96℃-110℃, but also achieves halogen-free flame retardancy. At the same time, it reduces the internal stress of the flame retardant and the resin matrix, thus resolving the core contradiction between flame retardancy and cold resistance.

[0014] The combination of polycaprolactone and tributyl citrate can effectively reduce molecular weight loss during the material recycling process, allowing the recycled material to maintain good mechanical properties and improving the environmental recycling performance of the material.

[0015] In a preferred embodiment of the present invention, the functional additive is a compound of antioxidant, lubricant and release agent, wherein, by weight, the antioxidant is 0.05-0.8 parts, the lubricant is 0.03-0.6 parts and the release agent is 0.02-0.6 parts; the antioxidant is a compound of antioxidant 1010 and antioxidant 168 in a weight ratio of 1:2; the lubricant is zinc stearate; and the release agent is polyethylene wax.

[0016] Antistatic agents / carbon nanotubes achieve a synergistic improvement in antistatic and mechanical properties; functional additives (antioxidants + lubricants + release agents) improve the processing performance and aging resistance of materials and prevent thermal degradation during processing.

[0017] In a preferred embodiment of the present invention, the ternary copolymer matrix resin is an emulsion-polymerized ternary copolymer matrix resin with a weight-average molecular weight of 150,000-250,000 and a butadiene content of 20-30%; the SAN glass fiber reinforced resin has an acrylonitrile content of 25-30%, a weight-average molecular weight of 80,000-150,000, and the glass fiber is an alkali-free glass fiber treated with silane coupling agent KH550 / KH560 with a length of 0.2-0.5 mm.

[0018] This invention also provides a method for preparing a core-shell composite structure assembly for a cryogenic electronic device casing, characterized by comprising the following steps: S1. Raw material pretreatment: Microwave drying technology is used to dry the ternary copolymer matrix resin, SAN glass fiber reinforced resin, and nano-grade polybutadiene rubber powder at a temperature of 80℃-90℃ for 2-4 hours, controlling the moisture content of the raw materials within the range of 0.5%-1%. The remaining solid raw materials are placed in a vacuum drying oven at 60-70℃ for 3-5 hours for later use. S2. Mixing and kneading: Add all the pretreated raw materials to a high-performance rotary mixer according to the formula ratio and knead for 10-15 minutes to ensure that the raw materials are fully mixed and the molecular chains are fully cross-linked to obtain a homogeneous mixture. S3. Injection Molding: Add the mixture into the injection molding machine, use a special mold and a general-purpose screw, control the mold temperature at 65℃-70℃, and the screw speed at 30-60rpm, and use three-stage injection molding technology: initially fill the mold at a medium speed, and then appropriately reduce the speed in the later stage to obtain a semi-finished product; S4. Post-processing: The semi-finished product is subjected to pressure holding treatment, with the pressure controlled at 0.3-0.5 MPa and the holding time ≥10 minutes. At the same time, the flow rate of the flash cooling water is controlled at ≥20 liters / minute. According to the product requirements, the semi-finished product is annealed at 60℃-70℃ for 1-2 hours to eliminate internal stress. The annealing treatment uses a hot air circulating oven with a heating rate of 5-10℃ / min. After annealing, it is cooled by natural cooling at a cooling rate ≤8℃ / min. After natural cooling to room temperature, the core-shell composite structure component for low-temperature electronic device housing is obtained.

[0019] Furthermore, in step S1, the microwave frequency of the microwave drying technology is 2450MHz, the power is 500-1000W, and the raw materials are stirred at a constant speed during the drying process; in step S2, the mixing speed of the high-performance rotary mixer is 800-1200rpm, and the material temperature is controlled at 40-50℃ during the mixing process.

[0020] Furthermore, in step S3, the barrel temperature of the injection molding machine is 180-200℃, and the back pressure is 0.3-0.5MPa; the specific parameters of the three-stage injection technology are: first-stage injection speed 30-40mm / s, filling 1 / 3 of the mold cavity; second-stage injection speed 40-50mm / s, filling 2 / 3 of the mold cavity; third-stage injection speed 20-30mm / s, completing the full filling of the mold cavity.

[0021] In summary, the beneficial technical effects of the present invention are as follows: 1. Through the synergistic effect of dual-core structure modification and nano-toughening system, the impact strength of the material at -40℃ is increased by about 30% compared with ordinary ternary copolymer matrix resin, while maintaining excellent mechanical properties such as tensile strength ≥50MPa and flexural strength ≥80MPa, effectively solving the problem of low-temperature embrittlement of ordinary ternary copolymer matrix resin; at the same time, the SAN glass fiber reinforced resin in the outer shell of the dual-core structure, together with the nano-toughening system, significantly improves the rigidity of the material, while precisely controlling the heat distortion temperature at 96℃-110℃, greatly reducing the coefficient of linear expansion, and the material has excellent dimensional stability, solving the pain points of poor rigidity and heat resistance of traditional cold-resistant ternary copolymer matrix resin.

[0022] 2. Using Nipermid / PEG-specific UV-resistant additives, the material's UV resistance is enhanced and its outdoor service life is extended without significantly affecting its mechanical properties, resolving the contradiction between traditional UV-resistant modification and mechanical properties. At the same time, Silesol / PCT801 interface compatibilizer is added to improve the bonding force between molecular chains, giving the material good compatibility with organic solvents such as ketones and esters, making it suitable for applications in complex chemical environments and solving the problem of poor solvent resistance of traditional ternary copolymer matrix resins.

[0023] 3. The composite heat-resistant flame-retardant charring agent achieves halogen-free flame retardancy without increasing the internal stress of the material, and there is no cracking at low temperatures; the biodegradable and recyclable additives effectively reduce molecular weight loss during the recycling process, and the recycled material still maintains good mechanical properties, meeting environmental protection requirements; and the integration of microwave drying technology enables rapid and uniform drying of raw materials, high-performance rotary mixing ensures full cross-linking of material molecular chains, and three-stage injection molding and optimized post-processing effectively reduce the internal stress of the product, solving problems such as uneven flash size, surface ripples and flow marks, and significantly improving the consistency and stability of product performance. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the invention and form part of the specification, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic flowchart of a method for preparing a core-shell composite structure component for a cryogenic electronic device casing according to this embodiment. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to the accompanying drawings.

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] All raw materials used in this embodiment are commercially available conventional raw materials, including: Ternary copolymer matrix resin: emulsion polymerization type, weight average molecular weight 200,000, butadiene content 25%; SAN glass fiber reinforced resin: a premix of SAN resin (acrylonitrile content 28%, weight average molecular weight 100,000) and 8% KH560 treated alkali-free glass fiber (length 0.3mm); Nano-grade polybutadiene rubber powder: highly dispersed, particle size 100nm; Interface compatibilizer: PCT801; UV resistant additive: Nipermid; Composite toughening agent: organomontmorillonite:MBS = 1:4 (MBS core-shell ratio 7:3); Composite heat-resistant and flame-retardant charring agent: pentaerythritol phosphate: melamine cyanurate: ammonium polyphosphate = 2.5:1.5:1, phosphorus content 28%; Biodegradable and recyclable additives: PCL:TBC = 2.5:1; Functional additives: Antioxidant 1010: Antioxidant 168 = 1:2, zinc stearate, polyethylene wax.

[0028] Example 1 A high-performance, cold-resistant ternary copolymer matrix resin material, by weight, comprises: 40 parts of ternary copolymer matrix resin, 20 parts of high-temperature resistant SAN glass fiber reinforced resin, 25 parts of nano-grade polybutadiene rubber powder, 2 parts of interface compatibilizer PCT801, 5 parts of composite toughening agent, 8 parts of composite heat-resistant flame-retardant charring agent, 1.5 parts of UV-resistant additive Nipermid, 1 part of carbon nanotubes, 1 part of functional additives (0.4 parts of antioxidant, 0.3 parts of zinc stearate, 0.3 parts of polyethylene wax), and 0.6 parts of biodegradable and recyclable additives.

[0029] Preparation method: S1. Raw material pretreatment: The ternary copolymer matrix resin, SAN glass fiber reinforced resin, and nano-grade polybutadiene rubber powder were dried using microwave drying technology (2450MHz, 800W) at 85℃ for 3 hours with uniform stirring to control the moisture content to 0.8%; the remaining raw materials were vacuum dried at 65℃ for 4 hours. S2. Mixing and kneading: Add all raw materials to a high-performance rotary mixer and knead at 1000 rpm for 12 minutes, while controlling the material temperature at 45℃, to obtain a homogeneous mixture. S3. Injection Molding: A special mold and a general-purpose screw are used. The mold temperature is 68℃, the barrel temperature is 190℃, the back pressure is 0.4MPa, and the screw speed is 45rpm. Three-stage injection parameters: stage 35mm / s (1 / 3 cavity), stage 45mm / s (2 / 3 cavity), stage 25mm / s (full injection). The injection molding process yields a semi-finished product. S4. Post-processing: Holding pressure 0.4MPa, holding time 12 minutes, flash cooling water flow rate 22 liters / minute; annealing with hot air circulation at 65℃ for 1.5 hours, heating rate 8℃ / min, natural cooling rate 6℃ / min, to obtain the finished product.

[0030] Example 2 A core-shell composite structure component for the housing of a high-performance cryogenic electronic device, comprising, by weight, the following raw materials: 25 parts ternary copolymer matrix resin, 10 parts SAN glass fiber reinforced resin, 20 parts nano-grade polybutadiene rubber powder, 1 part interface compatibilizer Silesol, 3 parts composite toughening agent, 5 parts composite heat-resistant flame-retardant charring agent, 0.5 parts UV-resistant PEG, 0.5 parts antistatic agent, 0.1 parts functional additive, and 0.3 parts biodegradable and recyclable additive.

[0031] The preparation method is the same as in Example 1, only the process parameters are adjusted: Step S1: Microwave drying at 80℃ for 2 hours, moisture content 1.0%; Step S2: Mixing speed 800 rpm for 10 minutes, material temperature 40℃; Step S3: Three-stage injection speed 30 / 40 / 20 mm / s; Step S4: Holding time 10 minutes, cooling water flow rate 20 liters / minute, annealing at 60℃ for 1 hour.

[0032] Example 3 A high-performance, cold-resistant ternary copolymer matrix resin material, by weight, comprises: 60 parts of ternary copolymer matrix resin, 30 parts of SAN glass fiber reinforced resin, 35 parts of nano-grade polybutadiene rubber powder, 4 parts of interface compatibilizer Silesol+PCT801 (1:1), 8 parts of composite toughening agent, 12 parts of composite heat-resistant flame-retardant charring agent, 3 parts of UV-resistant additive Nipermid+PEG (2:1), 2 parts of carbon nanotubes, 2 parts of functional additives, and 1 part of biodegradable and recyclable additives.

[0033] The preparation method is the same as in Example 1, only the process parameters are adjusted: Step S1: microwave drying at 90℃ for 4 hours, moisture content 0.5%; Step S2: mixing speed 1200 rpm for 15 minutes, material temperature 50℃; Step S3: three-stage injection speed 40 / 50 / 30 mm / s; Step S4: holding time 15 minutes, cooling water flow rate 25 liters / minute, annealing at 70℃ for 2 hours.

[0034] Comparative Example The existing conventional cold-resistant ternary copolymer matrix resin material, by weight, consists of: 40 parts ternary copolymer matrix resin, 20 parts SAN resin, 25 parts ordinary high-rubber powder, 2 parts ordinary compatibilizer, 1 part antistatic agent, 8 parts heat resistant agent, and 1 part functional additive. It is prepared by conventional hot air drying, conventional mixing, and conventional injection molding processes.

[0035] The materials of Examples 1-3 and the comparative examples were subjected to performance tests. The test standards and results are shown in the table below:

[0036] The test results show that the core-shell composite structure components for low-temperature electronic device housings prepared in Examples 1–3 of this invention have an impact strength of about 30% higher than that of conventional materials at -40℃, while maintaining excellent tensile and flexural strength. The heat distortion temperature is controlled between 96℃ and 110℃, and the coefficient of linear expansion is significantly reduced. The components meet the UL94 V-0 flame retardant standard, have excellent UV aging resistance, no stress cracking in ketone solvents, and a tensile strength retention rate of ≥82% after three recycling cycles. Moreover, the product surface is free of defects such as ripples and flow marks, and the performance stability and consistency are greatly improved, achieving synergistic optimization of various properties.

[0037] The core-shell composite structure component for cryogenic electronic device housings prepared by this invention possesses comprehensive properties such as high toughness at -40℃, high rigidity, heat resistance, flame retardancy, UV resistance, antistatic properties, solvent resistance, and recyclability. It also exhibits good molding performance and high dimensional stability. The preparation method uses conventional and universal equipment, and the process parameters are simple and controllable, overcoming the shortcomings of existing processes. It is suitable for large-scale industrial production and can be widely used in cryogenic electronic device housings such as outdoor sensors, cryogenic control cabinets, automotive electronic modules, and 5G remote units, demonstrating extremely high industrial application value and market prospects.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A core-shell composite structure assembly for cryoelectronic device housing, characterized by, Made of a core-shell composite polymer material; the material has a core-shell dual-core composite structure, with the core being a 50–150 nm highly dispersed nano-polybutadiene rubber phase and the shell being a glass fiber reinforced SAN resin phase; the glass fiber reinforced SAN resin is a premix of SAN resin and 5–10% silane-coupled modified alkali-free glass fiber; by weight, the core-shell composite polymer material is prepared from the following raw materials: 25–60 parts of ternary copolymer matrix resin, 10–30 parts of SAN resin, 20–35 parts of nano-sized polybutadiene rubber powder, 1–4 parts of interface compatibilizer, 3–8 parts of composite toughening agent, 5–12 parts of composite heat-resistant flame-retardant charring agent, 0.5–3 parts of UV-resistant additive, 0.5–2 parts of antistatic agent / carbon nanotube, 0.1–2 parts of functional additive, and 0.3–1 parts of biodegradable and recyclable additive; The component is suitable for protecting electronic equipment in low-temperature environments of -40℃, and has high toughness, flame retardancy and antistatic properties.

2. The core-shell composite structural assembly for cryogenic electron device enclosures of claim 1, wherein, By weight, it is prepared from the following raw materials: 25-60 parts of ternary copolymer matrix resin, 10-30 parts of SAN resin, 20-35 parts of nano-grade polybutadiene rubber powder, 1-4 parts of interface compatibilizer, 3-8 parts of composite toughening agent, 5-12 parts of composite heat-resistant flame-retardant charring agent, 0.5-3 parts of anti-UV additive, 0.5-2 parts of antistatic agent / carbon nanotube, 0.1-2 parts of functional additive, and 0.3-1 parts of biodegradable and recyclable additive.

3. The core-shell composite structural assembly for cryogenic electron device enclosures of claim 2, wherein, The interface compatibilizer is one or a combination of two of Silesol or PCT801; the UV-resistant additive is one or a combination of two of Nipermid or PEG.

4. The core-shell composite structure assembly for cryogenic electronic device housing according to claim 2, characterized in that, The composite toughening agent is a compound of organomontmorillonite and core-shell structured MBS, with a weight ratio of 1:(3-5); the core of the core-shell structured MBS is butadiene-styrene rubber, and the shell is styrene-methyl methacrylate copolymer, with a core-shell weight ratio of 7:

3.

5. The core-shell composite structure assembly for cryogenic electronic device housing according to claim 2, characterized in that, The composite heat-resistant and flame-retardant charring agent is a compound of pentaerythritol phosphate, melamine cyanurate and ammonium polyphosphate, with a weight ratio of (2-3):(1-2):1 and a phosphorus content of 25-30%; the biodegradable and recyclable additive is a compound of polycaprolactone and tributyl citrate, with a weight ratio of (2-3):

1.

6. The core-shell composite structure assembly for cryogenic electronic device housing according to claim 2, characterized in that, The functional additive is a compound of antioxidant, lubricant and release agent, with the following proportions by weight: antioxidant 0.05-0.8 parts, lubricant 0.03-0.6 parts, and release agent 0.02-0.6 parts; the antioxidant is a compound of antioxidant 1010 and antioxidant 168 in a weight ratio of 1:2; the lubricant is zinc stearate; and the release agent is polyethylene wax.

7. The core-shell composite structure assembly for cryogenic electronic device housing according to claim 1, characterized in that, The ternary copolymer matrix resin is an emulsion-polymerized ternary copolymer matrix resin with a weight-average molecular weight of 150,000-250,000 and a butadiene content of 20-30%; the SAN glass fiber reinforced resin has an acrylonitrile content of 25-30%, a weight-average molecular weight of 80,000-150,000, and the glass fiber is an alkali-free glass fiber treated with silane coupling agents KH550 / KH560 with a length of 0.2-0.5 mm.

8. A method for preparing a core-shell composite structure assembly for a cryogenic electronic device housing as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. Raw material pretreatment: Microwave drying technology is used to dry the ternary copolymer matrix resin, SAN glass fiber reinforced resin, and nano-grade polybutadiene rubber powder at a temperature of 80℃-90℃ for 2-4 hours, controlling the moisture content of the raw materials within the range of 0.5%-1%. The remaining solid raw materials are placed in a vacuum drying oven at 60-70℃ for 3-5 hours for later use. S2. Mixing and kneading: Add all the pretreated raw materials to a high-performance rotary mixer according to the formula ratio and knead for 10-15 minutes to ensure that the raw materials are fully mixed and the molecular chains are fully cross-linked to obtain a homogeneous mixture. S3. Injection Molding: Add the mixture into the injection molding machine, use a special mold and a general-purpose screw, control the mold temperature at 65℃-70℃, and the screw speed at 30-60rpm, and use three-stage injection molding technology: initially fill the mold at a medium speed, and then appropriately reduce the speed in the later stage to obtain a semi-finished product; S4. Post-processing: The semi-finished product is subjected to pressure holding treatment, with the pressure controlled at 0.3-0.5 MPa and the holding time ≥10 minutes. At the same time, the flow rate of the flash cooling water is controlled at ≥20 liters / minute. According to the product requirements, the semi-finished product is annealed at 60℃-70℃ for 1-2 hours to eliminate internal stress. The annealing treatment uses a hot air circulating oven with a heating rate of 5-10℃ / min. After annealing, it is cooled by natural cooling at a cooling rate ≤8℃ / min. After natural cooling to room temperature, the core-shell composite structure component for low-temperature electronic device housing is obtained.

9. The preparation method according to claim 6, characterized in that, In step S1, the microwave drying technology uses a microwave frequency of 2450MHz and a power of 500-1000W, and the raw materials are stirred at a constant speed during the drying process. In step S2, the high-performance rotary mixer has a mixing speed of 800-1200rpm, and the material temperature is controlled at 40-50℃ during the mixing process.

10. The preparation method according to claim 6, characterized in that, In step S3, the barrel temperature of the injection molding machine is 180-200℃, and the back pressure is 0.3-0.5MPa. The specific parameters of the three-stage injection technology are: first-stage injection speed 30-40mm / s, filling 1 / 3 of the mold cavity; second-stage injection speed 40-50mm / s, filling 2 / 3 of the mold cavity; third-stage injection speed 20-30mm / s, completing the full filling of the mold cavity.

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