An ultrasonic sensor
By designing a resistive protruding ring and an irregularly shaped inner bushing in the ultrasonic sensor, the problems of adhesive overflow and residual vibration were solved, resulting in cost reduction and process simplification, while ensuring the normal use of the sensor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WHETRON ELECTRONICS (SUZHOU) CO LTD
- Filing Date
- 2026-04-30
- Publication Date
- 2026-06-30
AI Technical Summary
Traditional ultrasonic sensors are prone to overflow during potting process, and the foam material causes sound wave reflection and residual vibration, which increases cost and process complexity.
A novel inner liner structure is designed, comprising an adhesive-blocking convex ring and an irregularly shaped structure. The groove disrupts the sound wave reflection path and achieves a seal without foam, thereby reducing residual vibration.
It reduces material costs and process steps, minimizes the risk of adhesive overflow and residual vibration, and improves the efficiency and reliability of the sensor.
Smart Images
Figure CN122306125A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an ultrasonic sensor. Background Technology
[0002] Ultrasonic sensors are widely used in intelligent vehicles as sensing components. As a result, the structure of the sensors themselves is becoming increasingly miniaturized and efficient. In order to reduce costs, the design of sensor structures has become mature and the manufacturing process has been fixed. However, there are still areas for improvement in traditional processes.
[0003] In traditional manufacturing processes, potting compound is required after the ultrasonic sensor is assembled. To prevent the potting compound from overflowing into the bottom of the ultrasonic sensor through the gap between the inner bushing and the body before curing, a foam pad needs to be pre-installed at the bottom of the ultrasonic sensor, which increases the manufacturing process and production costs.
[0004] Meanwhile, due to the material properties of foam, the distance between the bottom of the ultrasonic sensor and the inner liner changes elastically after potting. Traditional ultrasonic sensors without distance will reflect the sound waves after they are emitted, causing residual vibration. Therefore, foam can not only prevent glue overflow, but also eliminate the reflection of the ultrasonic sensor and reduce residual vibration.
[0005] Therefore, if we want to remove the foam and reduce material costs, we need to deal with residual vibration. However, the traditional structure can no longer meet the requirements, so we need to make new improvements to reduce material costs and process steps while ensuring the normal use of the ultrasonic sensor. Summary of the Invention
[0006] The technical problem to be solved by the present invention is to provide an ultrasonic sensor that, by redesigning the structure of the inner liner, not only prevents glue overflow but also eliminates sound wave reflection and reduces residual vibration.
[0007] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: An ultrasonic sensor includes a body for supporting the entire ultrasonic sensor; a circuit board and a potting compound are disposed on one side of the body; the circuit board is fixed to the body by the potting compound; an inner sleeve, a probe, and an outer sleeve are disposed on the other side of the body; the inner sleeve is disposed between the body and the probe; at least one pin extends from the bottom surface of the probe toward the circuit board, the pin penetrating the body to connect to the circuit board; the outer sleeve is combined with the inner sleeve to partially cover the probe; at least one groove is provided on the surface of the inner sleeve corresponding to the bottom surface of the probe, the groove disrupting the ultrasonic wave reflection path between the inner sleeve and the probe, thereby reducing the residual vibration of the ultrasonic sensor; a connection hole is provided on the bottom surface of the inner sleeve corresponding to the circuit board, the connection hole containing a resistive ring located on the inner wall of the connection hole; a connector extends from the probe corresponding to the connection hole, cooperating with the probe and forming a seal with the connector to seal the interior of the inner sleeve.
[0008] Furthermore, the adhesive-resistant protruding rings are arranged in a ring around the connecting hole, with no fewer than two rings continuously arranged on the inner wall of the connecting hole.
[0009] Furthermore, the adhesive-resistant protrusion protrudes towards the probe, and its cross-sectional shape is rectangular, semi-circular, or serrated.
[0010] Furthermore, the protrusion height of the adhesive-resistant protrusion ring is 0.2-0.4mm.
[0011] Furthermore, the bottom surface of the inner liner is provided with an irregular structure, which is recessed into the bottom surface of the inner liner to form an irregular groove.
[0012] Furthermore, the irregular structure is formed by processing the bushing through chemical etching.
[0013] Furthermore, the distance between the groove and the bottom of the probe does not exceed 2mm, so as to suppress the acoustic vibration of the ultrasonic sensor and reduce the residual vibration time of the ultrasonic sensor.
[0014] Furthermore, the assembly steps of the ultrasonic sensor described above are as follows: The first step is to insert the probe along the axis into the inner sleeve, and the adhesive-resistant protrusion ring and the connector are deformed under pressure to form a seal; The second step is to press the connected probe and inner sleeve into the body. The third step is to place the circuit board inside one side of the main body and solder it to the probe pins and the main body. The fourth step is to inject the potting compound into the body along one side of the circuit board and cure it inside the body to fix the circuit board and the bushing. Fifth step: After the potting compound has fully cured, combine the outer bushing with the inner bushing to cover part of the probe.
[0015] Compared with the prior art, the ultrasonic sensor provided by the present invention can reduce material consumption and lower product costs by removing foam. At the same time, the use of adhesive-resistant protruding rings can directly perform the assembly of sensor components, reducing the risk of adhesive leakage. Furthermore, the textured surface of the inner bushing can create a gap between the bottom of the probe and the surface of the inner bushing, reducing residual vibration. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of the present invention.
[0017] Figure 2 This is a cross-sectional view of the inner liner of the present invention.
[0018] Figure 3 for Figure 2 Enlarged view of point A in the image.
[0019] Figure 4 This is a schematic diagram of the assembly of the probe and the inner liner of the present invention.
[0020] Figure 5 This is a top view of the inner sleeve of the present invention.
[0021] Figure 6 This is a residual vibration test table for traditional foam structures.
[0022] Figure 7 This is a residual vibration test table for the novel lining structure of the present invention.
[0023] The components are: 1. Probe, 2. Outer sleeve, 3. Inner sleeve, 4. Body, 5. Circuit board, 6. Encapsulant, 7. Connecting plug, 8. Connecting hole, 9. Resistant ring, 10. Irregular structure, 11. Pin, 12. Groove, H. Protrusion height of the resistant ring, d. Groove depth of the irregular structure. Detailed Implementation
[0024] In one embodiment, such as Figure 1 , 4As shown, an ultrasonic sensor includes a body 4 for supporting the entire ultrasonic sensor; a circuit board 5 and a potting compound 6 are disposed on one side of the body 4; the circuit board 5 is fixed inside the body 4 by the potting compound 6; an inner sleeve 3, a probe 1 and an outer sleeve 2 are disposed on the other side of the body 4, the inner sleeve 3 is disposed between the body 4 and the probe 1, the probe 1 extends outward with at least one pin 11, the outer sleeve 2 is combined with the inner sleeve 3 to partially cover the probe 1; the pin 11 penetrates the body 4 to connect to the circuit board 5, characterized in that the surface of the inner sleeve 3 has at least one groove 12 corresponding to the bottom surface of the probe 1. like Figure 1 , 2 As shown in Figure 4, the inner sleeve 3 is provided with a connection hole 8 for connecting the probe 1 and the circuit board 5. A connection plug 7 extends outward from the bottom surface of the probe 1 and passes through the connection hole 8. The connection hole 8 is provided with an adhesive-resistant protrusion 9; the adhesive-resistant protrusion 9 is located on the inner wall of the connection hole 8, and together with the probe 1, it forms a seal with the connection plug 7 to achieve a seal on the inside of the inner sleeve 3.
[0025] In one embodiment, such as Figures 2-4 As shown, the adhesive-resistant protruding rings 9 are arranged in a ring around the connecting hole 8, with no fewer than two rings continuously arranged on the inner wall of the connecting hole 8. This ensures a sealing effect without obstructing the insertion of the probe 1.
[0026] In one embodiment, the adhesive-resistant protrusion 9 protrudes towards the probe 1, and its cross-sectional shape is rectangular, semi-circular, or serrated. After experimentation, the semi-circular cross-section was found to be optimal.
[0027] In one embodiment, the protrusion height of the adhesive-resistant protrusion ring 9 is 0.2-0.4mm, which ensures that the deformation of the connector 7 fills the internal space of the connector hole 8, forming a seal.
[0028] In one embodiment, such as Figure 5As shown, the bottom surface of the inner sleeve 3 is provided with an irregularly shaped structure 10 formed by several grooves 12. The irregularly shaped structure 10 is recessed into the bottom surface of the inner sleeve 3, forming irregular grooves. The irregularly shaped structure 10 is designed with a textured pattern. The textured pattern of the irregularly shaped structure 10 is processed on the inner sleeve 3 by chemical etching. The distance between the grooves 12 of the irregularly shaped structure 10 and the bottom of the probe is less than or equal to 2 mm. This allows for maintaining a distance between the probe 1 and the bottom of the inner sleeve 3 without the need for foam, and the grooves 12 disrupt the ultrasonic wave reflection path between the inner sleeve 3 and the probe 1, thereby reducing residual vibration.
[0029] In one embodiment, taking an ultrasonic sensor with a diameter of 15.6 mm as an example, such as... Figure 4 As shown, the assembly steps of the ultrasonic sensor described above are as follows: The first step is to insert the probe 1 into the inner sleeve 3 along the axis, and the adhesive-resistant protruding ring 9 and the connecting plug 7 are deformed under pressure to form a seal; The second step is to press the connected probe 1 and inner sleeve 3 into the body 4. The third step is to place the circuit board 5 inside one side of the body 4 and solder it to the pin 11 of the probe 1 and the body 4. The fourth step is to inject the potting compound 6 into the body 4 along one side of the circuit board 5 to fix the circuit board 5 and the inner bushing 3. Fifth step: After the potting compound 6 has completely cured, combine the outer sleeve 2 with the inner sleeve 3 to cover part of the probe 1.
[0030] The entire assembly process requires no foam placement, and the assembly cycle time is increased by an average of 1-2 seconds per piece.
[0031] In one embodiment, to verify that a foam-free ultrasonic sensor can effectively disperse, attenuate, and absorb sound waves, the following comparative experiment was conducted: A traditional foam structure, combining a conventional mass-produced inner liner and foam, was applied to a mass-produced AEB probe. The residual vibration amplitude was measured within a 1.152ms test time. Through three parallel tests, the results were as follows: Figure 6 As shown.
[0032] This invention employs a novel inner liner in a foam-free design for use in mass-produced AEB probes. The residual vibration amplitude was measured within a 1.152 ms test time. Results were obtained through three parallel tests. Figure 7 As shown.
[0033] pass Figure 6 and Figure 7 The comparison shows that, in a foam-free structure, the novel lining structure of this invention can achieve the same residual vibration amplitude as a traditional foam structure, thus exhibiting the same wave absorption effect. (Because the horizontal and vertical axis markings are not clearly visible in the attached images, they are not explained in the specification; only the result of identical waveforms is shown.) Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of the present invention without departing from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.
Claims
1. An ultrasonic sensor, comprising a body for supporting the entire sensor; a circuit board and a potting compound are disposed on one side of the body; the circuit board is fixed to the body by the potting compound; an inner sleeve, a probe, and an outer sleeve are disposed on the other side of the body, the inner sleeve being disposed between the body and the probe, the probe having a pin extending toward the circuit board, the pin penetrating the body to connect to the circuit board; the outer sleeve combining with the inner sleeve to partially cover the probe; characterized in that... The inner liner has at least one groove on its surface corresponding to the bottom surface of the probe. The groove disrupts the ultrasonic wave reflection path between the inner liner and the probe, thereby reducing the residual vibration of the ultrasonic sensor.
2. An ultrasonic sensor according to claim 1, characterized in that, The bottom surface of the inner liner has a connection hole corresponding to the circuit board, and an adhesive-resistant protrusion is provided inside the connection hole. The adhesive-resistant protrusion is located on the inner wall of the connection hole, and the probe extends a connection plug corresponding to the connection hole. The probe and the connection plug form a seal to seal the inside of the inner liner.
3. An ultrasonic sensor according to claim 1, characterized in that, The adhesive-resistant protruding rings are arranged in a ring around the connecting hole, with no fewer than two rings continuously arranged on the inner wall of the connecting hole.
4. An ultrasonic sensor according to claim 3, characterized in that, The adhesive-resistant protrusion protrudes towards the probe, and its cross-sectional shape is rectangular, semi-circular, or serrated.
5. An ultrasonic sensor according to claim 4, characterized in that, The protrusion height of the adhesive-resistant protrusion ring is 0.2-0.4mm.
6. An ultrasonic sensor according to claim 1, characterized in that, The bottom surface of the inner liner is provided with an irregular structure, which is recessed into the bottom surface of the inner liner to form an irregular groove.
7. An ultrasonic sensor according to claim 6, characterized in that, The irregular structure is formed by processing the inner liner surface through chemical etching.
8. An ultrasonic sensor according to claim 6, characterized in that, The distance between the groove and the bottom of the probe is no more than 2mm, so as to suppress the acoustic vibration of the ultrasonic sensor and reduce the residual vibration time of the ultrasonic sensor.
9. An ultrasonic sensor according to any one of claims 1-8, characterized in that, The sensor assembly steps are as follows: The first step is to insert the probe along the axis into the inner sleeve, and the adhesive-resistant protrusion ring and the connector are deformed under pressure to form a seal; The second step is to press the connected probe and inner sleeve into the body. The third step is to place the circuit board inside one side of the main body and solder it to the probe pins and the main body. The fourth step is to inject the potting compound into the body along one side of the circuit board and cure it inside the body to fix the circuit board and the inner bushing. Fifth step: After the potting compound has fully cured, combine the outer bushing with the inner bushing to cover part of the probe.