A beam quality intelligent monitoring device and measurement method

By installing a beam detector and data processing unit at the beam exit, the beam dose, angle, and position are monitored in real time, solving the real-time and accuracy problems of beam quality monitoring in existing technologies, and realizing efficient and accurate beam quality measurement.

CN122307625APending Publication Date: 2026-06-30SHAANXI WEIFENG NUCLEAR ELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHAANXI WEIFENG NUCLEAR ELECTRONICS
Filing Date
2026-06-01
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing technologies cannot monitor beam quality in real time and accurately, and are greatly affected by physical factors, resulting in low monitoring accuracy and efficiency.

Method used

A beam detector is directly installed at the beam outlet. The current signal is collected in real time using a flat-panel array ionization chamber and a data processing unit to determine the beam dose, angle and position. The beam quality is then compared in real time with an imaging detector.

Benefits of technology

It improves the accuracy and efficiency of beam quality monitoring, and provides high-precision, high-efficiency beam quality measurement, which is applicable to customs inspection, radiotherapy and other fields.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122307625A_ABST
    Figure CN122307625A_ABST
Patent Text Reader

Abstract

This invention belongs to the field of radiation measurement technology, specifically relating to an intelligent beam quality monitoring device and measurement method. The device consists of a beam detector and a data processing unit. The beam detector employs a flat-panel array ionization chamber design, with its detection electrode assembly composed of high-voltage plates and arrayed collecting plates. The beam detector is installed at the exit port of the radiation source to receive the beam. The beam ionizes the gas within the ionization chamber, and under the influence of a high-voltage electric field, each collecting electrode independently generates a current signal proportional to the local beam intensity. The data processing unit acquires these signals and, by analyzing the distribution and intensity of the current signals from each collecting electrode, calculates the beam dose, width, and center position in real time. This invention achieves direct, online, and real-time monitoring of beam quality, with high measurement accuracy and fast response, effectively overcoming the limitations of existing technologies such as large errors and low efficiency. It provides reliable technical support for precise beam control and safety interlocking in fields such as customs security inspection and radiotherapy.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention belongs to the field of radiation measurement technology, specifically relating to an intelligent beam quality monitoring device and measurement method. Background Technology

[0002] In fields such as customs inspection, radiotherapy, high-energy physics experiments, and other areas utilizing particles for imaging, radiotherapy, and physics research, the high-speed beam generated by the radiation source requires external focusing systems to adjust the position of the radiation source and collimator to control the beam's angle, shape, and dose, thereby controlling the beam quality and enabling its utilization. Therefore, monitoring the beam quality directly restricts the development and utilization of the beam.

[0003] Conventional methods for beam monitoring involve using radiation detectors within the radiation source system to monitor the radiation source dose. By combining this with the relative positional distance between the collimator and the radiation source, information such as the dose, angle, and position of the output beam from the radiation source is calculated, providing feedback on beam quality. However, this method requires substituting the positional data of the collimator and other components into the calculations. This not only fails to provide real-time beam quality monitoring but also results in significant errors due to the influence of environmental and positional factors on the calculation results, thus limiting the effectiveness of beam quality monitoring. Summary of the Invention

[0004] To address the problems existing in the prior art, the purpose of this invention is to provide an intelligent beam quality monitoring device and measurement method that can acquire information on beam quality feedback, such as dose, angle, and position of the output beam from the radiation source, in real time during the measurement process. This avoids the influence of physical factors, resulting in higher measurement accuracy and faster efficiency.

[0005] The technical solution of this invention is: A beam quality intelligent monitoring device, comprising: The beam output assembly includes a radiation source shielding shell, a radiation source, and a collimating shield. The radiation source is fixed inside the radiation source shielding shell to generate a beam. A beam output port is provided on one side of the radiation source shielding shell. The collimating shield is fixed at the beam output port to shield stray signals and realize stable output of the beam from the beam output port. A beam detector is disposed on the side of the collimating shield opposite to the beam outlet, and the beam detector is directly opposite the collimating shield. The beam detector includes a planar array ionization chamber, which has multiple arrayed collecting electrodes. The planar array ionization chamber is used to generate ionization inside it after beam irradiation. Each of the collecting electrodes is used to acquire the corresponding ionization signal and convert it into a current signal. The data processing unit, electrically connected to the beam detector, is used to acquire the current signals of each collecting electrode, process the acquired current signals into digital signals, and obtain the beam dose at the beam exit based on the magnitude of the current value corresponding to the digital signal of each collecting electrode and the relative position of each collecting electrode at the beam exit. Based on the strength of the beam dose, combined with the size and spacing of the collecting electrodes, the width of the beam at the beam exit is obtained. Based on the position of the collecting electrode with the largest current value at the beam exit, the beam center position is determined to achieve beam quality monitoring.

[0006] Preferably, the planar array ionization chamber comprises: Detector housing; The detection electrode assembly includes a collecting electrode plate, an electrode support frame, two high-voltage electrodes, and two electrode pressure plates. The collecting electrode plate is fixed inside the electrode support frame, and multiple collecting electrodes are arranged in an array on the collecting electrode plate. The two high-voltage electrodes are respectively disposed on opposite sides of the collecting electrode plate and fixed to the electrode support frame. The two electrode pressure plates are respectively disposed on opposite sides of the two high-voltage electrodes and fixed by fasteners. Both the high-voltage electrodes and the collecting electrodes are made of polyimide film substrate, with copper and gold films plated on the surface to form flexible electrodes. An electrical connector and a lead plate are provided, wherein the lead plate is electrically connected to the electrical connector and the collecting electrode plate respectively, for realizing the conduction of electrode signals between the collecting electrode, the high voltage electrode on the high voltage plate and the electrical connector.

[0007] Preferably, the side of the detector housing facing the collimating shield is the beam penetration surface, and the wall thickness of the beam penetration surface is 0.98mm~1.02mm. The side of the detector housing away from the collimating shield is the beam exit surface, and the wall thickness of the beam exit surface is 0.49mm~0.51mm.

[0008] Preferably, an imaging detector is disposed on the side of the beam detector away from the beam output assembly, and the imaging detector and the beam detector are used to place the object to be scanned, and the imaging detector is used to measure the beam dose and width data after passing the object to be scanned.

[0009] Preferably, a smart beam quality measurement method, implemented according to any of the above-described devices, includes the following steps: The beam output from the radiation source is shielded from stray signals by a collimating shield and then irradiates the beam detector. The beam enters the ionization chamber of the beam detector's flat array and is ionized, forming current signals on each collecting electrode. The current signal of each collecting electrode is acquired by the data processing unit and processed into a digital signal; Based on the digital signals corresponding to each collecting electrode, the dose distribution, beam width, and beam center position of the beam are determined. The distance between the beam detector and the radiation source is obtained based on the installation position of the beam detector and the radiation source corresponding to the model of the beam output component. The sector angle of the output beam is obtained based on the beam width and the distance between the beam detector and the radiation source. The beam quality is determined based on the dose distribution, beam center position, and beam sector angle of the beam.

[0010] Preferably, the method for determining the beam width includes the following steps: Based on the current value corresponding to the digital signal of each collecting electrode and the relative position of each collecting electrode at the exit port, the distribution of the beam dose at the exit port is obtained. Based on the strength of the beam dose and in combination with the size and spacing of the collecting electrodes, the width of the beam at the exit port is obtained.

[0011] Preferably, the method for determining the beam center position includes the following steps: Based on the fan-shaped propagation path of the beam within the beam exit assembly, the beam dose distribution at the exit port is measured by the beam detector, and the location of the collecting electrode with the largest current value corresponding to the digital signal at the exit port is obtained, i.e., the beam center position.

[0012] Preferably, the method for determining the dose distribution of the beam includes the following steps: The output beam path of the radiation source is fan-shaped due to the constraint control of the beam output assembly. The dose distribution of the beam is determined by the fact that the current signal collected by each array collecting electrode on the beam detector is proportional to the dose intensity irradiated to each collecting electrode; the beam intensity is inversely proportional to the square of the distance between the radiation source and the beam detector.

[0013] Preferably, the sector angle of the beam is determined according to the following formula: , in, A It is the fan-shaped angle of the beam; a It is the beam width; b It is the distance between the radiation source and the beam detector.

[0014] Preferably, the intelligent beam quality measurement method also includes safety control steps: The upper and lower limits of the preset beam dose are used as predetermined values; The beam dose is monitored in real time. If it exceeds the predetermined value, a safety interlock control is triggered to stop the radiation source from emitting the beam.

[0015] Compared with the prior art, the intelligent beam quality monitoring device and measurement method of the present invention have the following advantages: This invention, firstly, by directly installing the beam detector at the beam outlet and directly measuring the beam, abandons the traditional indirect mode that relies on external position parameters for theoretical calculation. This fundamentally eliminates calculation biases introduced by physical factors, thus significantly improving measurement accuracy. Secondly, by acquiring and processing the current signals of each collecting electrode in real time, this method can instantly respond to changes in beam quality, achieving online real-time monitoring of beam dose, angle, and position. This provides a timely and reliable data foundation for precise beam control and system safety interlocking, greatly improving monitoring efficiency. Therefore, this invention transforms beam quality monitoring from a "lagging" and "approximate" calculation to an "instantaneous" and "real" measurement. This not only directly overcomes the limitations of monitoring accuracy but also provides a high-precision, high-efficiency direct beam quality measurement solution for applications such as customs inspection and radiotherapy, laying a solid technical foundation for improving imaging quality, treatment accuracy, and experimental reliability. Attached Figure Description

[0016] Figure 1 This is a flowchart of the measurement method in an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the external structure of the beam detector in an embodiment of the present invention.

[0018] Figure 3 This is a cross-sectional view of the beam detector in an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the longitudinal cross-sectional structure of the probe electrode assembly in an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the transverse cross-sectional structure of the probe electrode assembly in an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the high-voltage electrode plate in an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the collecting plate in an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram illustrating the working principle of the measuring device in an embodiment of the present invention.

[0024] Explanation of reference numerals in the attached figures: 1. Electrical connector, 2. Junction box, 3. Detection unit, 4. Sealing ring 1, 5. Base, 6. Box cover, 7. Shielding plate, 8. Fastening screw 1, 9. Lead plate, 10. Fastening screw 2, 11. Sealing ring 2, 12. Detector electrode assembly, 13. Detector housing, 14. Detector end cap, 15. Electrode pressure plate A, 16. High voltage electrode plate A, 17. Collecting electrode plate, 18. Electrode support frame, 19. High voltage electrode plate B, 20. Electrode pressure plate B, 21. Fastening screw 3, 22. Fixing pin, 23. High voltage electrode base plate, 24. High voltage electrode, 25. Pin fixing hole, 26. Screw fixing hole, 27. Collecting electrode base plate, 28. Collecting electrode, 29. Radiation source shielding shell, 30. Radiation source, 31. Collimation shield, 32. Beam detector, 33. Scanned object, 34. Imaging detector. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0026] Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention.

[0027] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0028] See Figures 1 to 8 As shown, in order to obtain real-time information on the dose, angle, and position of the output beam from the radiation source during the measurement process, thereby avoiding the influence of physical factors and achieving higher measurement accuracy and faster efficiency, this embodiment provides an intelligent beam quality monitoring device and measurement method.

[0029] The intelligent beam quality measurement method includes the following steps: S1. A beam detector is installed at the exit port of the radiation source on the beam output assembly. The beam detector is a planar array ionization chamber with multiple arrayed collecting electrodes, and each collecting electrode independently outputs a current signal.

[0030] S2. The beam output from the radiation source is irradiated onto the beam detector. The beam interacts with the gas medium inside the beam detector to generate ionization, forming a current signal on each collecting electrode.

[0031] S3. The current signals of each collecting electrode are acquired by the data processing unit and processed into digital signals.

[0032] S4. Based on the digital signals corresponding to each collecting electrode, determine the dose distribution, beam width, and beam center position of the beam.

[0033] S5. Based on the beam detector installation location and the radiation source installation location corresponding to the beam output component model, obtain the distance between the beam detector and the radiation source. Based on the beam width and the distance between the beam detector and the radiation source, obtain the sector angle of the output beam.

[0034] S6. Determine the beam quality based on the dose distribution, beam center position, and beam sector angle of the beam.

[0035] Furthermore, the method for determining the beam width in step S4 includes the following steps: Based on the current signal output by each collecting electrode 28 (i.e. the current value corresponding to the digital signal of each collecting electrode) and the relative position of each collecting electrode 28 at the exit port, the distribution of the beam dose at the exit port is obtained. Based on the strength of the beam dose and combined with the size and spacing of the collecting electrodes 28, the width of the beam at the exit port is obtained.

[0036] Furthermore, the method for determining the beam center position in step S4 includes the following steps: Based on the fan-shaped propagation path of the beam within the beam exit assembly, the beam dose distribution at the exit port is measured by the beam detector 32, and the location of the collecting electrode 28 with the largest current value (strongest beam dose) corresponding to the digital signal at the exit port is obtained, which is the current center position of the beam.

[0037] Furthermore, the method for determining the beam dose distribution in step S4 includes the following steps: The radiation source outputs a beam controlled by collimators, shielding, etc., and the beam path is fan-shaped. The beam passes through a beam detector 32 installed at the beam exit assembly port. The current signal collected by each array of collecting electrodes 28 on the beam detector 32 is proportional to the dose intensity irradiated to each collecting electrode 28. The beam intensity is inversely proportional to the square of the distance between the radiation source and the beam detector 32.

[0038] Furthermore, the beam sector angle in step S5 is determined according to the following formula: , in, A It is the angle between the beams. a It is the beam width. b It is the distance between the radiation source and the beam detector 32.

[0039] Furthermore, this method also includes a comparison step: An imaging detector 34 is installed on the side of the beam detector 32 away from the beam output assembly. The imaging detector 34 measures the beam dose and width data after passing through the scanned object 33, and compares this data in real time with the beam dose and width data measured by the beam detector 32. Based on the comparison results and the known absorption rate of the material to the beam, the composition information of the scanned object 33 is obtained.

[0040] Furthermore, this method also includes safety control steps: The upper and lower limits of the preset beam dose are used as predetermined values.

[0041] The beam dose is monitored in real time. If it exceeds the predetermined value, a safety interlock control is triggered to stop the radiation source from emitting the beam.

[0042] This invention provides an intelligent beam quality monitoring device for implementing the above-mentioned method, specifically including a beam output assembly, a beam detector 32, and a data processing unit. Figure 7 As shown, the beam output assembly includes a radiation source shielding shell 29, a radiation source 30, and a collimating shield 31. The radiation source 30 is fixed inside the radiation source shielding shell 29, and a beam exit port is provided on one side of the radiation source shielding shell 29. The collimating shield 31 is fixed at the beam exit port. The beam detector 32 is located on the side of the collimating shield 31 opposite to the beam exit port, and the beam detector 32 is directly opposite the collimating shield 31. The beam detector 32 is a planar array ionization chamber with multiple arrayed collecting electrodes 28, and each collecting electrode 28 independently outputs a current signal. The data processing unit is electrically connected to the beam detector 32 and is used to collect the current signals of each collecting electrode 28 and process the collected current signals into digital signals to obtain the beam dose, width, and center position in real time.

[0043] The following description, with reference to the accompanying drawings, provides a further detailed explanation of the structural composition, working principle, and method of the intelligent beam quality monitoring device provided by the present invention: See Figure 2 and Figure 3As shown, the beam detector 32 further includes an electrical connector 1, a junction box 2, and a detection unit 3. The junction box 2 includes a sealing ring 4, a base 5, a cover 6, a shielding plate 7, a fastening screw 8, and a lead plate 9. The base 5 is a housing with a cavity. The cover 6 is fixed to the opening of the base 5 with screws. The sealing ring 4 is installed between the base 5 and the cover 6 to ensure a tight seal between them, making the junction box 2 completely sealed. The shielding plate 7 is fixed inside the base 5 with fastening screws to shield interference signals from entering the lead plate 9 from the electrical connector 1. The lead plate 9 is located inside the base 5 and horizontally positioned on the side of the shielding plate 7 facing away from the electrical connector 1, and is fixed to the base 5. The detection unit 3 includes a second fastening screw 10, a second sealing ring 11, a detection electrode assembly 12, and a detector housing 13. The detector housing 13 is fitted over the detector electrode assembly 12 and secured to one side of the base 5 by fastening screws 10. A sealing ring 11 is provided between the detector housing 13 and the base 5 to maintain an airtight connection. The electrical connector 1 is connected to the lead plate 9 by soldering thin wires. The lead plate 9 and the shielding plate 7 are installed in the junction box 2 using screws. The collecting electrode plate 17 is soldered to the lead plate 9 by thin wires, enabling the collecting electrodes 28 of the beam detector 32 and the high-voltage electrodes 24 on the high-voltage plate to conduct electricity to the electrical connector 1. The shielding plate 7 supports the thin wires in a regular shape, preventing tangling and vibration-induced signal interference. The electrical connector 1 is a multi-core shielded connector.

[0044] See Figures 4 to 5 As shown, the detection electrode assembly 12 further includes a detection end cap 14, an electrode pressure plate A15, a high-voltage electrode plate A16, a collecting electrode plate 17, an electrode support frame 18, a high-voltage electrode plate B19, an electrode pressure plate B20, three fastening screws 21, and a fixing pin 22. The detection end cap 14, electrode pressure plate A15, and electrode pressure plate B20 are fixed together by the three fastening screws 21, with electrode pressure plates A15 and B20 arranged opposite to each other. The collecting electrode plate 17 is clamped in the middle of the electrode support frame 18, which is inserted between electrode pressure plates A15 and B20. The high-voltage electrode plate A16 is inserted between and fixed to electrode support frame 18 and electrode pressure plate A15. The high-voltage electrode plate B19 is inserted between and fixed to electrode support frame 18 and electrode pressure plate B20. Electrode pressure plate A15, high-voltage electrode plate A16, collecting electrode plate 17, electrode support frame 18, and high-voltage electrode plate B19 are all provided with pin fixing holes 25 and screw fixing holes 26. Electrode pressure plate B20 is also provided with pin fixing holes 25, and internal thread holes are provided at the corresponding positions of screw fixing holes 26. The high-voltage electrode plate A16, collecting electrode plate 17, and high-voltage electrode plate B19 are positioned and laid flat by fixing pins 22, and the electrode pressure plate A15 and electrode pressure plate B20 are locked on the electrode support frame 18 by fastening screws 21, so that they clamp and fix the parts.

[0045] See Figure 6 As shown, high-voltage plates A16 and B19 have the same structure, including a high-voltage electrode substrate 23 and a high-voltage electrode 24. A pin fixing hole 25 and a screw fixing hole 26 are formed on the high-voltage electrode substrate 23. The high-voltage electrode substrate 23 is an insulating material; in this example, a polyimide film is used. The high-voltage electrode 24 is a conductor plated on one side of the high-voltage electrode substrate 23; in this embodiment, 2μm~3μm copper is used. High-voltage plates A16 and B19 are two high-voltage plates symmetrical about the collecting electrode plate 17, and are fixed to the electrode support frame 18 and the corresponding electrode pressure plate A15 or electrode pressure plate B20 respectively by fastening screws 21 and fixing pins 22. The plated high-voltage electrodes 24 all face the collecting electrode plate 17.

[0046] See Figure 7 As shown, the collecting electrode 17 comprises a collecting electrode substrate 27 and a collecting electrode 28. The collecting electrode substrate 27 has a pin fixing hole 25 and a screw fixing hole 26. The collecting electrode 17 is sandwiched between high-voltage electrode plates A16 and B19, and is fixed to the electrode support frame 18 by fastening screws 21 and fixing pins 22. The collecting electrode substrate 27 is also an insulating material; in this embodiment, a polyimide film is used. The collecting electrode 28 is a conductor plated on both sides of the collecting electrode substrate 27; in this embodiment, 2μm~3μm copper is used.

[0047] Furthermore, to improve measurement accuracy and reduce detector attenuation of the beam, the high-voltage electrode A16, high-voltage substrate B, and collecting electrode 17 are all made of high-polymer radiation-resistant and high-temperature-resistant thin film materials. The electrodes are coated with copper film using a coating process to minimize material thickness while ensuring conductivity. The high-voltage substrate 23 and collecting substrate 27 use polyimide film as the substrate, and the high-voltage electrode 24 and collecting electrode 28 are processed using a copper film coating process. The high-voltage electrode A16 and high-voltage substrate B are processed using a single-sided coating method, meaning the high-voltage electrode 24 is coated only on one side of the high-voltage substrate. The collecting electrode 17 is processed using a perforated double-sided coating method, meaning that the collecting substrate 27 is perforated at the center point of each collecting electrode 28, and copper film is coated on both sides to ensure conductivity and stability on both sides of each collecting electrode. The size and number of collecting electrodes 28 on the collecting electrode 17 are adjusted according to the size of the beam outlet and the beam width, and there can be one or more collecting electrodes 28.

[0048] Furthermore, to improve measurement accuracy, the electrode support frame 18, electrode pressure plate A15, electrode pressure plate B20, and detector end cap are all made of low-density metal materials with small atomic numbers. In this embodiment, aluminum alloy is used, with a conductive anodized surface. The use of low-density metal materials with small atomic numbers not only makes the structure more stable but also allows for the discharge of weak interference currents between the collecting electrode 17 and the high-voltage electrode, improving the detector's anti-interference capability and reducing the detector's detection line.

[0049] Furthermore, considering the engineering applications and the flexible electrode plates used in the beam detector 32, the size of the beam detector 32 and the array orientation of the collecting electrodes can be adjusted and modified. The beam detector 32 can also be made into shapes such as rings, discs, cubes, and square frames.

[0050] Furthermore, to improve measurement accuracy, in this embodiment, the detector housing 13 is made of aluminum alloy, with a beam penetration surface thickness of 0.98mm~1.02mm and an exit surface thickness of 0.49mm~0.51mm. Both the high-voltage electrode substrate 23 and the collector electrode are made of 10μm polyimide film. The high-voltage electrode 24 is plated with 5μm copper and 1μm gold on one side (first 5μm copper is plated, then 1μm gold is plated on the copper surface), and the collector electrode 28 is plated with 5μm copper and 1μm gold on both sides. A 100μm polyimide film frame is added to the non-sensitive areas of the substrate for reinforcement.

[0051] Specifically, the working principle of the beam detector 32 is as follows: The beam detector 32 in this invention is a flat-panel array sealed atmospheric pressure ionization chamber detector. When the beam passes through the gas medium of the ionization chamber, it collides with gas molecules, causing the gas molecules to ionize and form positive ions and free electrons. The gas medium is air or an inert gas (such as argon or xenon). To improve monitoring accuracy, an inert gas is generally injected. By applying high voltage to the high-voltage electrode 24 on the high-voltage plate A16 and the high-voltage substrate B, an internal electric field is formed with the collecting electrode 28 on the collecting plate 17. Under the influence of the electric field, positive ions and free electrons move towards the high-voltage electrode 24 and the collecting electrode 28, respectively, forming a current signal on each collecting electrode 28. The magnitude of the current is proportional to the beam intensity. By acquiring the magnitude of the current signal on each collecting electrode 28, the beam dose and beam width can be reflected.

[0052] Engineering Implementation Examples like Figure 8 As shown, in use, the beam detector 32 is installed at the outlet of the beam output assembly, and the beam detector 32 is electrically connected to the data processing unit via wires. The object to be scanned 33 is placed on the side of the beam detector 32 away from the beam outlet, and the imaging detector 34 is placed on the side of the object to be scanned 33 away from the beam detector 32.

[0053] The beam detector 32 directly measures the beam dose and beam width in real time at the beam exit point. While monitoring the scanned object 33, the imaging detector 34 measures the beam dose and width data after passing through the object 33. The beam dose and width data measured by the beam detector 32 are compared with the measurement data by the imaging detector 34 in real time, and beam emission is immediately stopped if the emitted beam exceeds a predetermined value. The composition of the scanned object 33 can be obtained based on the physical properties of different materials, such as beam absorption and shielding. This inspection method is particularly suitable for the detection and inspection of unidentified objects in customs, ports, and other similar settings.

[0054] The core of this invention also lies in: 1) Material and process innovation: The collecting electrode 17 and the high-voltage electrode 18 utilize a high-polymer, radiation-resistant, and highly insulating polyimide film, solving the operational requirements of high insulation and radiation resistance for the electrode substrate. The high-voltage electrode 24 and the collecting electrode 28 employ a copper-plated film + gold-plating process, resolving issues related to electrode conductivity and flexible installation. The film + plating process minimizes the impact of the electrode material itself on beam absorption and shielding.

[0055] 2) Structural Innovation 1: Both the collecting electrode 17 and the high-voltage electrode are made of long, flexible strip materials. However, the electrode spacing directly affects the electric field distribution and effective ionization volume within the detector. Therefore, ensuring the electrode spacing is one of the key factors for detector consistency and measurement accuracy. In this embodiment, an electrode support structure is formed by electrode pressure plate A15, electrode support frame 18, and electrode pressure plate B20. The collecting electrode 17, high-voltage electrode A16, and high-voltage electrode B19 are fixed at multiple points using fastening screws and fixing pins 22, keeping them in a taut and straight state, ensuring the electrode spacing, and improving detector consistency and measurement accuracy.

[0056] 3) Structural Innovation 2: In this embodiment, the detector uses a structure where the detector electrode assembly 12 is tightened by fastening screws, causing the detector housing, sealing ring 11, and base 5 to press against each other, thus achieving the required seal. The sealing ring, which has poor radiation resistance, is placed in the beam output dead zone, effectively solving the problem of the detector's radiation resistance lifespan. Electrodes with a thin-film surface coating are used, and the electrode conductors are coated and processed together with the electrodes. The electrical connector 1 and lead plate 9 are connected inside the base 5 by welding thin wires. This structural form and sealing method provide a structural design reference for small-sized radiation detectors with high radiation resistance requirements.

[0057] 4) Innovative Measurement Method: The collecting electrodes 28 are arranged in an array, with each electrode independently outputting a current signal. This enables the detector to measure not only the beam dose but also the beam width and range. This provides a new measurement method for monitoring the location, distance, and range of nuclear facilities, in addition to providing a radiation detector for radiation imaging and radiation safety monitoring.

[0058] 6. The advantages of this invention are as follows: 1) The detector has a compact structure, small size, and light weight, making it suitable for use in various installation and layout spaces.

[0059] 2) Wide range of needs: It enables the measurement of beam and radiation width, and can monitor radiation process flow in real time in nuclear facilities, reprocessing and other places through radiation measurement, solving practical problems in engineering applications.

[0060] 3) It provides a direct beam measurement solution for radiation imaging, and provides direct measurement data for beam output control in applications such as customs security inspection, which can effectively improve the efficiency and accuracy of security inspection.

[0061] 4) The detector is resistant to high temperatures (0℃~200℃) and high radiation (≥10℃). 5 Gy) has high stability and long service life.

[0062] 5) Flexible electrode plate: The flexible electrode plate, made of polyimide film substrate and surface coating process, provides an electrode solution for the development of irregular ionization chamber radiation detectors.

[0063] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A beam quality intelligent monitoring device, characterized in that, include: The beam output assembly includes a radiation source shielding shell, a radiation source, and a collimating shield. The radiation source is fixed inside the radiation source shielding shell to generate a beam. A beam output port is provided on one side of the radiation source shielding shell. The collimating shield is fixed at the beam output port to shield stray signals and realize stable output of the beam from the beam output port. A beam detector is disposed on the side of the collimating shield opposite to the beam outlet, and the beam detector is directly opposite the collimating shield. The beam detector includes a planar array ionization chamber, which has multiple arrayed collecting electrodes. The planar array ionization chamber is used to generate ionization inside it after beam irradiation. Each of the collecting electrodes is used to acquire the corresponding ionization signal and convert it into a current signal. The data processing unit, electrically connected to the beam detector, is used to acquire the current signals of each collecting electrode, process the acquired current signals into digital signals, and obtain the beam dose at the beam exit based on the magnitude of the current value corresponding to the digital signal of each collecting electrode and the relative position of each collecting electrode at the beam exit. Based on the strength of the beam dose, combined with the size and spacing of the collecting electrodes, the width of the beam at the beam exit is obtained. Based on the position of the collecting electrode with the largest current value at the beam exit, the beam center position is determined to achieve beam quality monitoring.

2. The beam quality intelligent monitoring device according to claim 1, wherein, The flat-plate array ionization chamber includes: Detector housing; The detection electrode assembly includes a collecting electrode plate, an electrode support frame, two high-voltage electrodes, and two electrode pressure plates. The collecting electrode plate is fixed inside the electrode support frame, and multiple collecting electrodes are arranged in an array on the collecting electrode plate. The two high-voltage electrodes are respectively disposed on opposite sides of the collecting electrode plate and fixed to the electrode support frame. The two electrode pressure plates are respectively disposed on opposite sides of the two high-voltage electrodes and fixed by fasteners. Both the high-voltage electrodes and the collecting electrodes are made of polyimide film substrate, with copper and gold films plated on the surface to form flexible electrodes. An electrical connector and a lead plate are provided, wherein the lead plate is electrically connected to the electrical connector and the collecting electrode plate respectively, for realizing the conduction of electrode signals between the collecting electrode, the high voltage electrode on the high voltage plate and the electrical connector.

3. The beam quality intelligent monitoring device according to claim 2, wherein, The side of the detector housing facing the collimating shield is the beam penetration surface, and the wall thickness of the beam penetration surface is 0.98mm~1.02mm. The side of the detector housing away from the collimating shield is the beam exit surface, and the wall thickness of the beam exit surface is 0.49mm~0.51mm.

4. The beam quality intelligent monitoring device according to claim 1, wherein, An imaging detector is disposed on the side of the beam detector away from the beam output assembly. The imaging detector and the beam detector are used to place the object to be scanned. The imaging detector is used to measure the beam dose and width data after passing the object to be scanned.

5. A beam quality intelligent measurement method, used for realizing the device according to any one of claims 1-4, characterized in that, Includes the following steps: The beam output from the radiation source is shielded from stray signals by a collimating shield and then irradiates the beam detector. The beam enters the ionization chamber of the beam detector's flat array and is ionized, forming current signals on each collecting electrode. The current signal of each collecting electrode is acquired by the data processing unit and processed into a digital signal; Based on the digital signals corresponding to each collecting electrode, the dose distribution, beam width, and beam center position of the beam are determined. The distance between the beam detector and the radiation source is obtained based on the installation position of the beam detector and the radiation source corresponding to the model of the beam output component. The sector angle of the output beam is obtained based on the beam width and the distance between the beam detector and the radiation source. The beam quality is determined based on the dose distribution, beam center position, and beam sector angle of the beam.

6. The beam quality intelligent measurement method according to claim 5, wherein, The method for determining the beam width includes the following steps: Based on the current value corresponding to the digital signal of each collecting electrode and the relative position of each collecting electrode at the exit port, the distribution of the beam dose at the exit port is obtained. Based on the strength of the beam dose and in combination with the size and spacing of the collecting electrodes, the width of the beam at the exit port is obtained.

7. The beam quality intelligent measurement method according to claim 6, wherein, The method for determining the beam center position includes the following steps: Based on the fan-shaped propagation path of the beam within the beam exit assembly, the beam dose distribution at the exit port is measured by the beam detector, and the location of the collecting electrode with the largest current value corresponding to the digital signal at the exit port is obtained, i.e., the beam center position.

8. The beam quality intelligent measurement method of claim 5, wherein, The method for determining the dose distribution of the beam includes the following steps: The output beam path of the radiation source is fan-shaped due to the constraint control of the beam output assembly. The dose distribution of the beam is determined by the fact that the current signal collected by each array collecting electrode on the beam detector is proportional to the dose intensity irradiated to each collecting electrode; the beam intensity is inversely proportional to the square of the distance between the radiation source and the beam detector.

9. The beam quality intelligent measurement method of claim 5, wherein, The sector angle of the beam is determined according to the following formula: , in, A It is the fan-shaped angle of the beam; a It is the beam width; b It is the distance between the radiation source and the beam detector.

10. The intelligent beam quality measurement method according to claim 5, characterized in that, It also includes safety control steps: The upper and lower limits of the preset beam dose are used as predetermined values; The beam dose is monitored in real time. If it exceeds the predetermined value, a safety interlock control is triggered to stop the radiation source from emitting the beam.