Semiconductor device and method for forming a semiconductor device
By designing first and second redistribution layers (RDLs) and conductive bump electrical couplings in a semiconductor device, combined with a glass lens and sealant, the integration limitations of photonic semiconductor packages in system-level packaging are overcome, achieving efficient integration of signal transmission and reception, and improving the performance and reliability of the package.
CN122307822APending Publication Date: 2026-06-30XINGKE JINPENG MANAGEMENT PTE LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XINGKE JINPENG MANAGEMENT PTE LTD
- Filing Date
- 2024-12-27
- Publication Date
- 2026-06-30
Smart Images
Figure CN122307822A_ABST
Abstract
This application provides a semiconductor device and a method for forming the semiconductor device. The semiconductor device may include: a first redistribution layer (RDL) having a first side and a second side opposite to the first side; at least one electronic element attached to the first side of the first RDL; a photonic element attached to the second side of the first RDL; a first plurality of conductive bumps formed on the second side of the first RDL and electrically coupled to the first RDL; a second RDL having a first side and a second side opposite to the first side, wherein the first side of the second RDL is electrically coupled to the first plurality of conductive bumps; and a second plurality of conductive bumps formed on the second side of the second RDL and electrically coupled to the second RDL.
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