Communication device for testing and test system

Abstract

The application relates to a communication device and a test system for testing, comprising a resistance simulation circuit and a connecting end for connecting a target object; the resistance simulation circuit comprises a resistance simulation feedback module and an electric parameter control module, the electric parameter control module is directly or indirectly connected with a processing module; the processing module is configured to be directly or indirectly communicated with a host computer; the resistance simulation feedback module is used for detecting at least one specified electric parameter of the connecting end and feeding back a detection result to the electric parameter control module; and the electric parameter control module is used for controlling the specified electric parameter based on resistance simulation target information output by the processing module and the detection result.

Description

Technical Field

[0001] This application relates to the field of testing, and more particularly to a communication device and testing system for testing. Background Technology

[0002] In the testing field, especially in HIL (Hardware-in-the-Loop) testing and RCP (Rapid Prototyping), I / O boards are often required. I / O boards have various channels, and the host can generate the information to be sent. The information is then fed back to the target object (such as the device under test, actuator, test bench, etc.) through the channels.

[0003] This includes resistor simulation circuits. Existing resistor simulation circuits are usually implemented using resistor matrices. However, the resistance values ​​that a resistor matrix can simulate are relatively limited and are positively correlated with the size of the resistor matrix. In order to satisfy the diverse resistance value possibilities, the size of the resistor matrix is ​​often relatively large. Summary of the Invention

[0004] Therefore, it is necessary to provide a communication device and a testing system for testing, addressing the aforementioned technical problems.

[0005] In a first aspect, this application provides a communication device for testing, connected between a host and a target object, the target object including: a device under test and / or auxiliary equipment for testing;

[0006] The communication device includes a resistance simulation circuit and a connection terminal for connecting to the target object; the resistance simulation circuit includes a resistance simulation feedback module and an electrical parameter control module, the electrical parameter control module being directly or indirectly connected to the processing module; the processing module is configured to communicate directly or indirectly with the host; the resistance simulation feedback module is used to detect at least one specified electrical parameter of the connection terminal and feed the detection result back to the resistance simulation control module; the at least one specified electrical parameter includes voltage and / or current;

[0007] The electrical parameter control module is used to control the specified electrical parameters based on the resistance simulation target information output by the processing module and the detection results, so that the target object can detect the required simulated resistance information based on the specified electrical parameters.

[0008] Secondly, this application provides a testing system, including the communication device of the first aspect and the host; the processing module is used to obtain simulated resistance information from the host or to generate associated information of the simulated resistance information.

[0009] In the aforementioned communication device and testing system, the resistance simulation no longer uses a resistance matrix to form the required resistance value. Instead, it uses a resistance simulation feedback module and an electrical parameter control module to construct the electrical parameters required for the resistance simulation. When faced with different possible resistance values ​​of the simulated resistor, it is only necessary to control the formation of the corresponding electrical parameters. Therefore, since there is no need to use a resistance matrix, the size will not increase significantly with the diversification of resistance value possibilities, unlike a resistance matrix. This makes it easier to achieve diverse resistance simulations through a relatively stable and finite circuit structure. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram illustrating the construction of an application scenario in one embodiment of this application;

[0012] Figure 2 This is a schematic diagram of the structure of the resistor simulation circuit and processing module in one embodiment of this application;

[0013] Figure 3 This is a schematic diagram of the resistor simulation circuit in one embodiment of this application. Figure 1 ;

[0014] Figure 4 This is a schematic diagram of the resistor simulation circuit in one embodiment of this application. Figure 2 ;

[0015] Figure 5 This is a circuit diagram of a resistor simulation circuit in one embodiment of this application;

[0016] Figure 6 This is a schematic diagram of the construction of a test system in one embodiment of this application. Figure 1 ;

[0017] Figure 7 This is a circuit diagram of the first channel in one embodiment of this application;

[0018] Figure 8 This is a schematic diagram of the construction of a test system in one embodiment of this application. Figure 2 ;

[0019] Figure 9 This is a schematic diagram of the construction of a test system in one embodiment of this application. Figure 3 ;

[0020] Figure 10This is a schematic diagram of the construction of a test system in one embodiment of this application. Figure 4 . Detailed Implementation

[0021] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0023] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0024] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is transmission of electrical signals or data between the connected objects.

[0025] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0026] The application scenarios of the embodiments of this application can be, for example, Figure 1 As shown in the diagram, the resistance simulation circuit and / or the communication device containing the resistance simulation circuit are located between the target object and the host. The resistance simulation circuit can be connected to the target object through connection terminals (including a first connection terminal and / or a second connection terminal), thereby simulating resistance relative to the target object and allowing the target object to obtain simulated resistance information through the resistance simulation circuit. The simulated resistance information can be, for example, the resistance value or resistance range of the simulated resistor. Of course, other information (such as resistor rating information) can also be used to express the resistance value or resistance range.

[0027] The target object typically has its own logic for detecting resistance. In some examples, the target object can determine the resistance by detecting the voltage at the connection points (e.g., the voltage between the first and second connection points). The common detection logic is that, given a current, the voltage across the two ends is directly proportional to the resistance, so the resistance can be determined by detecting the voltage. In other examples, the target object can determine the resistance by detecting the current at the connection points (e.g., the current flowing through the first and second connection points). The common detection logic is that, given a voltage, the current across the two ends is inversely proportional to the resistance, so the resistance can be determined by detecting the current.

[0028] In some scenarios, the simulated resistance information can, for example, simulate the detection results of a sensor. Such sensors typically have a resistor whose resistance value changes with the detected object (temperature, pressure, etc.). The simulation of the detection results can be understood as a simulation of the resistance value of the resistor. In the embodiments of this application, the simulation of the resistance value can also be further regarded as a simulation of the electrical parameters used when the resistance value of the measured resistor is measured.

[0029] Regardless of the type of logic used to detect the resistor, the application remains within the scope of the embodiments described herein.

[0030] The target object can be any object or combination of objects that needs to receive information (especially simulated resistor information) during the test process. The object usually refers to a hardware object.

[0031] In one example, the target object can be a device under test (DUT), specifically the hardware under test, such as a controller during the development and / or verification phases. This controller could be suitable for application in vehicles after development, such as a vehicle-mounted domain controller, or a controller for low-altitude aircraft or drones. In a further example, the DUT can refer to the hardware-in-the-loop (HIL) test device, and the host computer can include a real-time computer (RTPC) used in HIL testing, which can also be understood as an industrial control computer (ICC), typically configured with an embedded operating system. In other further examples, even if the target object is the DUT, the host computer can be a host computer running a desktop operating system (e.g., Windows), which interacts with the DUT via a signal generation device to achieve simulation testing. In yet another example, the host computer can also include both an ICC and a host computer.

[0032] In another example, the target object can be the actuator during rapid prototyping (RCP) testing. The host computer can be an industrial control computer used for RCP testing, which is usually equipped with an embedded operating system. The software under test (e.g., algorithm, model, etc.) can be located on the industrial control computer. The industrial control computer needs to control the actuator to test the functionality of the software. Thus, the actuator can be understood as an auxiliary device used for testing (testing the software under test).

[0033] In one example, the target object can also be an auxiliary device used for testing that provides corresponding auxiliary functions to the industrial control computer in the testing process (such as HIL testing, RCP testing, etc.). For example, it can be a test bench, simulation device, simulation bench, etc., used to simulate corresponding sensors and structural functions.

[0034] Therefore, the host computer can include an industrial control computer configured with an embedded operating system, a host computer configured with a desktop operating system, or both an industrial control computer and a host computer. The target object includes at least one of the following: a device under test (DUT), or an auxiliary device for testing (e.g., testing the DUT).

[0035] The industrial control computer and host computer mentioned here can be any circuit, circuit board, or device equipped with a processor. For example, an industrial control computer or host computer can refer to one or more circuit boards containing a processor. Furthermore, an industrial control computer or host computer can include not only the circuit board containing the processor but also mechanical structures such as a casing. The processor refers to a processor that can run an operating system.

[0036] In one example, taking HIL testing, the industrial control computer runs the test and needs to interact with the user through a host computer. The user can then monitor and / or influence the test run by the industrial control computer through the host computer. The influence can include pre-test influence, such as configuring the test environment and test cases, or during the test.

[0037] Furthermore, the testing system can have one or more industrial control computers and one or more host computers. The testing system can be at least one of the following: a HIL testing system, an RCP testing system, a simulation testing system, or a back-injection testing system.

[0038] In the embodiments of this application, please refer to Figure 2 This application provides a resistor simulation circuit, a communication device including the resistor simulation circuit, and a test system including the communication device.

[0039] The resistance simulation circuit used for testing includes: a connection terminal, a resistance simulation feedback module, and an electrical parameter control module. The connection terminal is used to connect to the target object; the connection terminal may include a first connection terminal and / or a second connection terminal.

[0040] The resistance simulation feedback module is connected to the connection terminal to detect at least one specified electrical parameter of the connection terminal; the at least one specified electrical parameter includes voltage and / or current; furthermore, any direct or indirect connection method that can realize the detection does not depart from the scope of the embodiments of this application.

[0041] The resistance simulation feedback module is connected to the resistance simulation control module to feed back the detection results of the at least one specified electrical parameter to the resistance simulation control module; furthermore, any direct or indirect connection method that can achieve feedback does not depart from the scope of the embodiments of this application.

[0042] As can be seen, the resistance simulation feedback module can be used to detect at least one specified electrical parameter of the connection terminal and feed the detection result back to the resistance simulation control module.

[0043] The electrical parameter control module is directly or indirectly connected to the processing module to receive the resistance simulation target information output by the processing module; the resistance simulation target information is used to indicate the value or range of the specified electrical parameter required when simulating the simulated resistance information; thus, any direct or indirect connection method for receiving information can be implemented without departing from the scope of the embodiments of this application.

[0044] The resistance simulation control module is connected to the connection terminal to generate the specified electrical parameters at the connection terminal, allowing the target object to detect the required simulated resistance information based on the specified electrical parameters. Furthermore, any direct or indirect connection method by which the resistance simulation control module controls the specified electrical parameters at the connection terminal can be implemented without departing from the scope of the embodiments of this application.

[0045] As can be seen, the electrical parameter control module is used to control the specified electrical parameters based on the resistance simulation target information output by the processing module and the detection results, so that the target object can detect the required simulated resistance information based on the specified electrical parameters.

[0046] The processing module is configured to communicate directly or indirectly with the host.

[0047] The processing module can be implemented using any circuit module with data processing capabilities. In one example, it can be executed using one or more FPGA circuits. In other examples, the FPGA circuit can be replaced with or supplemented with other processor circuits. The processing module may also include other peripheral devices.

[0048] The simulated resistance information can be the resistance value, the range of resistance values, or the detection result of the simulated sensor as reflected by the resistance value. Since they can all directly or indirectly reflect the magnitude or range of the resistance to be simulated, they can all be understood as a way of realizing simulated resistance information.

[0049] In the above scheme, the resistance simulation no longer uses a resistance matrix to form the required resistance value. Instead, it uses a resistance simulation feedback module and an electrical parameter control module to construct the electrical parameters required for the resistance simulation. When faced with different possible resistance values ​​of the simulated resistor, it is only necessary to control the formation of the corresponding electrical parameters. Therefore, since there is no need to use a resistance matrix, the size will not increase significantly with the diversification of resistance value possibilities as a resistance matrix does. This makes it easier to achieve diverse resistance simulations through a relatively stable and finite circuit structure.

[0050] The electrical parameter control module can be any circuit capable of controlling a specified electrical parameter. For example, if only one specified electrical parameter is considered, the electrical parameter control module can be configured to control only that one specified electrical parameter; or, if both voltage and current parameters are considered simultaneously, the electrical parameter control module can be configured to control both voltage and current.

[0051] In one example, the electrical parameter control module can have two modes: a voltage control mode, which controls the voltage at the connection point, and a current control mode, which controls the current at the connection point.

[0052] Furthermore, if the target object detects the simulated resistance information by detecting voltage, then the specified electrical parameter is voltage, and the electrical parameter control module is in voltage control mode; if the target object detects the simulated resistance information by detecting current, then the specified electrical parameter is current, and the electrical parameter control module is in current control mode.

[0053] In another example, the electrical parameter control module may include independent voltage control unit and current control unit; when voltage needs to be controlled, the voltage control unit controls the voltage at the connection terminal, and the current control unit does not function; when current needs to be controlled, the current control unit controls the current at the connection terminal, and the voltage control unit does not function.

[0054] Regardless of whether the technical solution can control one or two specified electrical parameters, the voltage control solution can be referenced. Figure 3 As shown.

[0055] The resistor simulation control module includes a DAC module, a first operational amplifier OP1, a first resistor R1, and a second resistor R2;

[0056] The first resistor R1 is connected to the second input terminal and the output terminal of the first operational amplifier OP1. The input terminal of the DAC module is connected to the processing module, so that it can receive the resistance simulation target information from the processing module. The output terminal of the DAC module is connected to the first input terminal of the first operational amplifier OP1 via the second resistor R2. The output terminal of the first operational amplifier is also directly or indirectly connected to the connection terminal.

[0057] One reference input terminal of the DAC module is connected to the resistor simulation feedback module. Therefore, as the voltage at the reference input terminal (which matches the voltage difference between the two connected terminals) changes, the signal output by the DAC module changes accordingly, thereby achieving closed-loop control and regulating the voltage as a resistor simulation electrical parameter. Furthermore, if the DAC module includes one or more digital-to-analog converters (DACs), the resistor simulation feedback module can be directly or indirectly connected to the reference input terminal of one of the DACs.

[0058] Through the above closed-loop control, the purpose of voltage control can be achieved, thereby ensuring that the voltage at the connection end can form the voltage of the resistance simulation target information.

[0059] In addition, in an example not shown, the first resistor may also be connected between the first input terminal and the output terminal of the first operational amplifier.

[0060] In a further example, if the electrical parameter control module has both voltage control mode and current control mode, then, Figure 3 The circuit shown can be considered as an implementation circuit of voltage control mode.

[0061] To implement current control mode, and to switch between voltage control mode and current control mode, please refer to [link / reference]. Figure 4 The resistance simulation control module may also include a capacitor C1, a current detection feedback circuit, a first switch module K1, a second switch module K2, a first transistor T1, a second transistor T2, and a detection resistor R4.

[0062] The capacitor C1 is connected between the second input terminal and the output terminal of the first operational amplifier OP1; the first switch module K1 is configured to selectively connect the capacitor C1 or the first resistor R1 between the second input terminal and the output terminal of the first operational amplifier; specifically, in voltage control mode, the resistor R1 is connected between the second input terminal and the output terminal of the first operational amplifier, and in current control mode, the capacitor C1 is connected between the second input terminal and the output terminal of the first operational amplifier.

[0063] The output terminal of the first operational amplifier OP1 is also connected to the control terminals (e.g., gate or base) of the first transistor T1 and the second transistor T2. The first terminal of the first transistor T1 is connected to a power supply, and the second terminal of the first transistor T1 is connected to the first terminal of the second transistor T2. The second terminal of the second transistor T2 is grounded, either directly or indirectly. The first terminal of the sensing resistor R4 is connected to the second terminal of the first transistor T1, and the second terminal of the sensing resistor R4 is directly or indirectly connected to the connection terminal. The current detection feedback circuit is used to detect the voltage of the sensing resistor R4 and, when the current detection feedback circuit is connected to the second input terminal of the first operational amplifier OP1, feeds back the detection result to the second input terminal of the first operational amplifier OP1. The voltage of the sensing resistor R4 reflects the magnitude of the current flowing through it, and thus reflects the magnitude of the current output through the connection terminal. The voltage at the output terminal of the first operational amplifier OP1 can control the transistor, thereby changing the magnitude of the current output through the transistor. Furthermore, due to the feedback from the detection feedback circuit, the voltage at the output terminal of the first operational amplifier OP1 changes according to the detected current of the sensing resistor R4, thereby achieving the purpose of current feedback control.

[0064] The second switch module K2 is used to control whether the current detection feedback line is connected to the second input terminal of the first operational amplifier OP1.

[0065] in:

[0066] When the first switch module K1 switches to connect the first resistor R1 between the second input terminal and the output terminal of the first operational amplifier OP1, and the second switch module K2 does not connect the current detection feedback line to the second input terminal of the first operational amplifier OP1, the electrical parameter control module is in voltage control mode, realizing voltage control of the connection terminal.

[0067] When the first switch module K1 switches to connect capacitor C1 between the second input terminal and the output terminal of the first operational amplifier OP1, and the second switch module K2 connects the current detection feedback line to the second input terminal of the first operational amplifier OP1, the electrical parameter control module is in current control mode, realizing current control of the connection terminal.

[0068] The first switch module K1 can be implemented by one or more switches and connected between the first resistor R1, capacitor C1 and the second input terminal of the first operational amplifier OP1; the second switch module K2 can be implemented by one or more switches and connected between the current detection feedback module and the second input terminal of the first operational amplifier OP1.

[0069] In a further example, the current detection feedback circuit may include a second operational amplifier OP2 and a third resistor R3. The two input terminals of the second operational amplifier OP2 are directly or indirectly connected to the two ends of the detection resistor R4, and the output terminal of the second operational amplifier OP2 is connected to the second input terminal of the first operational amplifier OP1 via the third resistor R3 and the second switch module K2. Furthermore, direct connections or other devices may be provided between the second operational amplifier OP2 and the third resistor R3, between the third resistor R3 and the first operational amplifier OP1, and between the second operational amplifier OP2 and the detection resistor R4. In a scheme not shown, the second switch module K2 may also be connected to other locations in the detection feedback circuit. At least one of other switch modules, resistors, fault simulation modules, etc., may be provided between the detection resistor R4 and the connection terminal.

[0070] In one embodiment, if the resistance simulation feedback module detects only the voltage at the connection end, then in one example, the electrical parameter control module may only have a voltage control mode. In another example, the electrical parameter control module has both a voltage control mode and a current control mode, but only the voltage control mode is used during resistance simulation. The current control mode can be used for other purposes of the electrical parameter control module, such as for outputting analog current signals or digital current signals.

[0071] As can be seen, current control and voltage control can be achieved by using two modes of the same electrical parameter control module. As a result, devices such as the DAC module and the first operational amplifier OP1 can be reused, which fully realizes the reuse of the circuit part, effectively reduces the number of devices, makes efficient use of the space on the circuit board, helps to reduce the size of the circuit board, meets the design requirements of smaller circuit board standards, and also helps to accommodate more functions and / or channels in a limited circuit board space.

[0072] The resistance simulation feedback module can be any circuit capable of detecting and feeding back electrical parameters.

[0073] like Figure 5 As shown, the connection terminal includes a first connection terminal and a second connection terminal. The resistance simulation feedback module includes a voltage feedback operational amplifier OP0. The two input terminals of the voltage feedback operational amplifier OP0 are directly or indirectly connected to the first connection terminal and the second connection terminal, respectively. The output terminal of the voltage feedback operational amplifier OP0 is directly or indirectly connected to the resistance simulation control module.

[0074] If the resistance simulation feedback module detects the current at the first and second connection terminals, for example, if the target object provides current at the first and second connection terminals, and then detects the voltage at the first and second connection terminals to determine the simulated resistance information, in an example not shown, the resistance simulation feedback module may include a resistance simulation current sensing resistor between the first and second connection terminals, with voltage feedback operational amplifiers connected to both ends. The voltage fed back at this time is the voltage across the resistance simulation current sensing resistor, which is also the voltage at the connection terminal. The voltage across the resistance simulation current sensing resistor can be fed back to the resistance simulation control module via the voltage feedback operational amplifier.

[0075] In some embodiments, please refer to Figure 6 The communication device may include a first channel, which may have a resistor simulation circuit.

[0076] The first channel can be understood as either a primary channel or an information output channel, and it can possess at least one state. For example, the at least one state includes a resistor simulation state, and the working principle of the first channel in the resistor simulation state can be found in [reference needed]. Figures 2 to 5 Understanding the relevant explanations of the medium resistance simulation circuit.

[0077] When the first channel is in the resistance simulation state, the resistance simulation feedback module is connected between the connection terminal and the electrical parameter control module, so that the electrical parameter control module can control the specified electrical parameter based on the detection result; furthermore, in some examples, when the first channel is in the resistance simulation state (e.g., in other states), the resistance simulation feedback module can be disconnected from the connection terminal and the electrical parameter control module, thereby avoiding the resistance simulation feedback module from affecting the electrical parameter control in other states.

[0078] The first channel is configured to switch between multiple states; wherein, in addition to a resistor simulation state, the multiple states may also include an analog output state and / or a digital output state;

[0079] When in the analog output state, the first channel (e.g., the electrical parameter control module) generates an analog signal in response to the output signal of the processing module, and outputs the analog signal through the connection terminal; furthermore, when outputting the analog signal, the signal output by the processing module can at least characterize the magnitude or range of the analog signal; in a further example, the signal output by the processing module may further include a signal characterizing whether the output is voltage or current, such as a signal transmitted to the electrical parameter control circuit, specifically a signal that can control the mode of the electrical parameter control circuit (voltage control mode or current control mode).

[0080] When in the digital output state, the first channel (e.g., the electrical parameter control module) generates a digital signal in response to the output signal of the processing module and outputs the digital signal through the connection terminal; furthermore, when outputting the digital signal, the signal output by the processing module can at least characterize the 0 / 1 state (or can be understood as a high / low level state) of the digital signal. In a further example, the signal output by the processing module may further include a signal characterizing what voltage (or current) or what voltage (or current) range is used in the 0 or 1 state, such as a signal transmitted to the electrical parameter control circuit in the digital output state.

[0081] Since the signal generation device is connected between the host and the target object, the processing module can at least be used to obtain the information to be sent from the host or to generate the basic information of the information to be sent, and to feed back the simulation test signal representing the information to be sent to the target object through the first channel. The simulation test signal includes the analog signal and / or the digital signal, which can be used to represent (or can be understood as being used to transmit) the information to be sent.

[0082] It is evident that a single first channel in the communication device possesses a resistance simulation state, as well as at least one of an analog output state and a digital output state. Consequently, a single channel can be used to achieve diverse output functions, thus enriching the functionality of a single output channel.

[0083] Furthermore, regarding the analog output states, the state of the first channel includes at least one of the following: a voltage analog output state for outputting a voltage analog signal through the connection terminal; and a current analog output state for outputting a current analog signal through the connection terminal.

[0084] In some examples, the voltage analog output state can be realized using a voltage analog output circuit, the current analog output circuit can be realized using a current analog output circuit, and the resistance simulation circuit, voltage analog output circuit, and current analog output circuit can be separate and independent circuits. In this way, by switching different circuits to the connection terminal, the switching of different states can be realized.

[0085] In other examples, various circuit devices and modules can also be reused. For example, the output status of analog voltage and analog current can be implemented using an electrical parameter control module.

[0086] Specifically, if we take Figure 4 , Figure 5 Based on the electrical parameter control module shown, each state is implemented. Therefore:

[0087] When in the voltage analog output state, the electrical parameter control module can output the voltage analog signal in response to the output signal of the processing module; at this time, the electrical parameter control module is in voltage control mode.

[0088] When in the current analog output state, the electrical parameter control module can output the current analog signal in response to the output signal of the processing module; at this time, the electrical parameter control module is in the current control mode.

[0089] As can be seen, the electrical parameter control module enables full reuse of circuit components under different states, effectively reducing the number of components, making efficient use of space on the circuit board, helping to reduce the size of the circuit board, meeting the design requirements of smaller circuit board standards, and also helping to accommodate more functions and / or channels in a limited circuit board space.

[0090] The digital output status of the first channel includes at least one of the following:

[0091] Voltage digital output status used to output a voltage digital signal through the connection terminal;

[0092] The current digital output status is used to output a current digital signal through the connection terminal.

[0093] The first channel can be equipped with a digital output circuit to... Figure 7 As shown in the example, the digital output circuit may include a driver, an upper transistor T3, and a lower transistor T4; the driver is connected to the control electrode (e.g., gate or base) of the upper transistor T3 and the lower transistor T4, the first terminal of the upper transistor T3 is connected to a power supply (including a voltage source and / or a current source), the second terminal of the upper transistor T3 is connected to the first terminal of the lower transistor T4, the second terminal of the lower transistor T4 is directly or indirectly grounded, and the connection terminal is directly or indirectly connected to the second terminal of the upper transistor;

[0094] In some examples, the voltage source and / or current source can be an independent voltage source and current source, separate from the electrical parameter control module.

[0095] In other examples, the voltage source and / or current source can be implemented using an electrical parameter control module, which is then used as the voltage source when the voltage digital output state is in progress; the driver controls the switching of the upper and lower transistors in response to the control of the processing module to form the voltage digital signal at the connection terminal;

[0096] When in the voltage digital output state, the electrical parameter control module is used as the current source; the driver responds to the control of the processing module to control the on / off state of the upper and lower transistors to form the voltage digital signal at the connection terminal.

[0097] In some examples where the upper transistor T3 and the lower transistor T4 are introduced, the electrical parameter control module can output an analog signal through the upper transistor T3 and the connection terminal when the analog output state is in progress. In other examples, the electrical parameter control module can also be directly connected to the connection terminal through a switch. Thus, when the analog output state is in progress, the electrical parameter control module can output an analog signal through the connection terminal without going through the upper transistor T3.

[0098] It is evident that by multiplexing the output digital signals of the electrical parameter control module, the number of components is effectively reduced, and the space on the circuit board is utilized efficiently. This helps to reduce the size of the circuit board for the signal generation device, while also meeting the design requirements of smaller circuit board standards. It also helps to accommodate more functions and / or channels within a limited circuit board space. In particular, it avoids or reduces the overhead of providing separate, more complex voltage and current sources for the digital output circuit.

[0099] In addition, a third switch module K3 is provided between the resistance simulation feedback module and the connection terminal to control whether the resistance simulation feedback module is connected to the connection terminal. Specifically, when performing resistance simulation, the third switch module K3 can connect the resistance simulation feedback module to the connection terminal. When not performing resistance simulation, one or more lines of the resistance simulation feedback module can be disconnected from the connection terminal. Of course, it can also remain connected.

[0100] A fourth switch module K4 can be provided between the resistance simulation feedback module and the reference input terminal of the DAC module of the electrical parameter control module. This switch module K4 controls whether the resistance simulation feedback module is connected to the reference input terminal of the DAC module. Specifically, during resistance simulation, the fourth switch module K4 connects the resistance simulation feedback module to the reference input terminal. When not in resistance simulation mode, the fourth switch module K4 can disconnect the resistance simulation feedback module from the reference input terminal. At the same time, other reference circuits that provide a reference can be connected to the reference input terminal to provide a more stable voltage as a reference. This avoids the reference from fluctuating with the voltage detection result of the connection terminal when the electrical parameter control module performs other functions (such as outputting analog signals and / or outputting digital signals), which would affect the accurate generation of signals for other applications.

[0101] Furthermore, in existing test systems and communication devices, the first channel for signal output generally only considers digital voltage and analog voltage. In the specific example of this application, the generation of digital current and analog current signals is also taken into account, which broadens the channel function and facilitates a wider range of simulation test possibilities.

[0102] In this system, voltage and current sources can provide adjustable power for digital signal generation. For example, an electrical parameter control module can form adjustable voltage and current sources to meet different digital signal specifications. In some examples, the first channel may also include other non-adjustable power sources providing voltage or current. Furthermore, the voltage and / or current sources, along with the non-adjustable power sources, can be connected to the digital output circuit (e.g., connected to the first terminal of transistor T3) via a switching module. In this case, the switching module allows selective connection of one of the voltage, current, or non-adjustable power sources to the digital signal generation circuit (e.g., connected to the first terminal of transistor T3) to power it. There can be only one type of non-adjustable power source or multiple types.

[0103] Furthermore, in some embodiments, the multiple states of the first channel for signal output may not be limited to voltage digital output state, current digital output state, voltage analog output state, current analog output state, and resistance simulation state. For example, it may also include customized signal output states, etc.

[0104] In a specific example, a communication device with multiple first channels can be a signal generating device. The number of first channels can be one or more, allowing for arbitrary configuration of their states to meet diverse testing requirements. For instance, assuming the communication device has four first channels, some tests require two channels for analog voltage output and two channels for digital voltage output. In such cases, two channels can be configured for analog voltage output, and two for digital voltage output. In other tests, the requirement changes to three channels for analog voltage output and one channel for resistance simulation output; in this case, three channels can be configured for analog voltage output, and the other for resistance simulation. Therefore, a limited number of channels can be used to meet diverse and changing testing needs.

[0105] In some embodiments, the communication device, please refer to Figure 8 The system includes a motherboard and a first daughterboard (e.g., daughterboard 1) and a second daughterboard (e.g., daughterboard N). The motherboard is equipped with a host communication module, which is used to communicate directly or indirectly with the host. The resistor simulation circuit is located on the first daughterboard. Both the first daughterboard and the second daughterboard communicate with the host through the motherboard.

[0106] The second sub-board is provided with a second channel for connecting the target object. The second channel includes at least one of the following: a bus communication channel, a serial communication channel, a signal acquisition channel, a unidirectional transmission channel for signals with customized characteristics, and a unidirectional transmission channel for non-standard special signals.

[0107] The host communication module can refer to any circuit module capable of communicating with the host. This can be achieved through a network port (and corresponding network chip), such as an RJ45 module, a USB module, or even through PCIe or other communication methods. Host communication modules may also include, for example, RS233 modules, I2C modules, etc.

[0108] A bus communication channel can be understood as any circuit module that can communicate with a target object in a manner that meets the bus protocol of the corresponding bus and realize information interaction. The bus communication channel on the sub-board may include at least one of the following: CAN bus communication channel, LIN bus communication channel, Flexray bus communication channel, automotive Ethernet bus communication channel, DSI bus communication channel, PSI bus communication channel, and SENT bus communication channel.

[0109] The serial communication channel can be any circuit module that implements serial communication, such as a UART module.

[0110] The transmission channels for non-standard special signals can be understood as input and / or output channels for signals without industry standards (such as voltage magnitude standards or frequency standards).

[0111] The signal transmission channel with customized features can be understood as a signal input and / or output channel that is customized based on user needs. It may or may not meet certain industry standards.

[0112] In one embodiment, the subboard is mounted on the substrate via a connector. When the subboard is mounted on the substrate, its external communication module can communicate with the substrate processing module and with the host via the substrate processing module and the host communication module.

[0113] The communication device is designed as a separate design of the baseboard and the daughterboard. Because it is separate, the host communication module in the baseboard usually does not change with different needs, which facilitates the design and production of mass-produced and standardized products. This eliminates the need to customize the design and production of the entire board for each change in needs, thus helping to avoid the high costs brought about by the customization of the entire circuit board.

[0114] Furthermore, since the sub-board and substrate are designed separately, it facilitates the assembly of different sub-boards into a bus communication device to meet different needs. In other words, the separate design architecture means that customizing the entire circuit board is no longer the only necessary solution for addressing differentiated customization requirements. Customizing and assembling the sub-boards becomes another optional solution to meet these needs, and this approach is less costly than requiring a completely custom-designed circuit board. Simultaneously, it allows for the adaptive disassembly and reassembly of the sub-boards on the substrate as requirements change, thus adapting to meet evolving needs. The specific solution of this application is suitable for meeting requirements through sub-board combinations, eliminating the need to redesign the entire circuit board each time.

[0115] Furthermore, the circuitry within the substrate includes common functions shared by the daughterboards, such as communication with the host computer and power supply. By integrating these functions into the substrate, it is possible to cover a wide range of needs, making it suitable for standardized mass production and thus reducing production costs.

[0116] In one implementation method, please refer to Figure 8 The processing module of the daughter board is configured to communicate with the processing module of the mother board. Furthermore, communication between the base board and the daughter board can be achieved based on their respective processing modules, facilitating the construction of a unified and standardized communication method between the base board and the daughter board. In one example, the base board processing module includes a base board FPGA circuit, and the processing module in the daughter board includes a daughter board FPGA circuit. In other examples, the base board processing module may include other peripheral circuits besides the base board FPGA circuit, such as an MCU and memory, and the daughter board processing module may also include other peripheral circuits, such as an MCU and memory.

[0117] The testing system provided in this application includes the communication device and the host involved in the embodiments of this application and its optional solutions; the processing module is used to obtain simulated resistance information from the host or to generate associated information of the simulated resistance information.

[0118] In some embodiments, please refer to Figure 9 The testing system also includes a selective switching device and a signal acquisition channel; the selective switching device is connected to the signal generation channel, the signal acquisition channel, and the general connection part.

[0119] The general-purpose connecting part can be, for example... Figure 9 , Figure 10The connecting parts P1, P2, and P3 shown can be interfaces or terminals for selectively connecting devices to the outside, interfaces on the panel of the test system cabinet, or interfaces or terminals on connectors used to mate with the target object. Any medium that can achieve direct or indirect connection to the line of the target object can be considered a connecting part and can be used as a general-purpose connecting part.

[0120] The general connection unit is used to: connect the signal output line of the first target object corresponding to the first test task when performing the first test task; and connect the signal input line of the second target object corresponding to the second test task when performing the second test task.

[0121] The selective connection device is used to: connect the general connection unit to the signal acquisition channel when performing the first test task, so that the information to be reported sent by the first target object can be transmitted to the host through the signal acquisition channel; and connect the general connection unit to the signal generation channel when performing the second test task, so that the corresponding information to be sent can be transmitted to the second target object through the signal generation channel.

[0122] The information to be sent can be, for example, resistor simulation information, information that needs to be transmitted using digital signals, or information that needs to be transmitted using analog signals. Furthermore, the signal generation channel can be the first channel involved in the embodiments of this application, that is, the channel with resistor simulation circuit, which can have only one state or multiple states. The signal generation channel can also be a channel used to output digital signals and / or analog signals without implementing resistor simulation.

[0123] It is evident that even if the same universal connector is used to connect the signal output line and the signal input line respectively during different tests, the selective switching device can still meet the signal transmission requirements of each test by selectively switching on the corresponding channels.

[0124] In contrast, existing technologies typically distinguish between different connection points in the external interfaces of testing systems, such as DI (Digital Input), DO (Digital Output), AI (Analog Input), and AO (Analog Output). These different connection points correspond to different channels within the testing system. For example, the DI connection point internally connects to the digital signal acquisition channels of each signal acquisition channel and externally connects to the digital signal output lines of the target object. The DO connection point internally connects to the digital signal output channels of each signal generation channel and externally connects to the digital signal input lines of the target object. The AI ​​connection point internally connects to the analog signal acquisition channels of each signal acquisition channel and externally connects to the analog signal output lines of the target object. The AO connection point internally connects to the analog signal output channels of each signal generation channel and externally connects to the analog signal input lines of the target object. If digital and analog signals are further categorized into digital and analog voltage and current signals, the number of such connection point and channel classifications becomes even greater. Wiring requires distinguishing between different connection points to connect the target object's lines, making the operation complex and prone to errors.

[0125] In the above-described solution of this application, a single universal connector can simultaneously handle digital / analog signal input and output functions, making full and effective use of connector resources. It also facilitates wiring and provides a high degree of flexibility in wiring. Specifically, the lines of the target object can be arbitrarily connected to any universal connector; only the selective connection device needs to be configured to ensure that the universal connector can be connected to the corresponding channel (signal generation channel or signal acquisition channel).

[0126] In some embodiments, the test system further includes a bus communication channel; the selective switching device connects the signal generation channel, the bus communication channel, and the general connection unit.

[0127] The general connection unit is used to: connect the bus interaction line of the third target object corresponding to the third test task when the third test task is executed, and connect the signal input unit of the fourth target object corresponding to the fourth test task when the fourth test task is executed;

[0128] The selective connection device is used to connect the general connection unit to the bus communication channel when the third test task is performed, so that the host can communicate with the third target object using the bus communication channel. When the fourth test task is performed, the general connection unit is connected to the first channel so that the corresponding information to be sent can be transmitted to the fourth target object through the first channel.

[0129] It is evident that even if the same universal connector is used to connect the signal output line and the bus interaction line respectively during different tests, the selective connection device can still meet the communication requirements of each test by selectively connecting the corresponding channels.

[0130] In contrast, in existing technologies, the external interfaces of testing systems typically distinguish between DI (digital input), DO (digital output), AI (analog input), and AO (analog output) connection points, and also include bus interaction connection points, such as those for CAN bus, LIN bus, Flexray bus, and DSI bus. These bus interaction lines are used to connect the target object to the corresponding bus. When wiring, it is necessary to distinguish between different connection points and connect the target object's lines, which is more complicated and prone to errors.

[0131] In the above-described solution of this application, a single universal connector can simultaneously perform digital / analog signal output and bus interaction functions, making full and effective use of connector resources. It also facilitates wiring and provides a high degree of flexibility in wiring. Specifically, the lines of the target object can be arbitrarily connected to any universal connector; only the selective connection device needs to be configured to ensure that the universal connector can be connected to the corresponding channel (signal generation channel or signal acquisition channel).

[0132] Since a bus is an interactive communication method and signal generation is a one-way communication method, the connection parts are generally not shared. However, the above-mentioned solution of this application creatively conceives of the sharing of the interactive communication medium and the one-way communication medium, and ensures that the signal transmission requirements can be met no matter how the wiring is done through a selective connection device. For example, a certain bus interactive line can be connected to a matching bus channel.

[0133] In some embodiments, the test system includes a selective switching device that connects a resistance simulation circuit, a target channel, and a general connection; the target channel is at least one of the following: a signal generation channel (e.g., a first channel), a signal acquisition channel, or a bus communication channel; the selective switching device is configured to selectively connect the general connection to the resistance simulation circuit or the target channel.

[0134] The general connection unit is used to: connect the detection line of the fifth target object corresponding to the fifth test task when executing the fifth test task, and connect the target line of the sixth target object corresponding to the sixth test task when executing the sixth test task;

[0135] The selective connection device is used to connect the general connection part to the resistance simulation circuit when performing the fifth test task, so that the host can simulate the simulated resistance information to the fifth target object through the resistance simulation circuit, and connect the general connection part to the target channel when performing the sixth test task.

[0136] It is evident that even when using the same universal connector to connect different types of lines during different tests, the selective connection device can meet the communication requirements of each test by selectively connecting the corresponding channels. This allows for the full and effective utilization of connector resources. It also facilitates wiring and provides a high degree of flexibility in wiring. Specifically, the target object's line can be arbitrarily connected to any universal connector; only the selective connection device needs to be configured to ensure that the universal connector can connect to the corresponding circuit. In particular, it achieves compatibility and switchability between resistance simulation and other unidirectional and bidirectional communication methods. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this application.

[0137] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A communication device for testing, connected between a host and a target object, the target object comprising: The test piece and / or auxiliary equipment used for testing; characterized in that, The communication device includes a resistance simulation circuit and a connection terminal for connecting to the target object; the resistance simulation circuit includes a resistance simulation feedback module and an electrical parameter control module, the electrical parameter control module being directly or indirectly connected to the processing module; the processing module is configured to communicate directly or indirectly with the host. The resistance simulation feedback module is used to detect at least one specified electrical parameter of the connection terminal and feed the detection result back to the resistance simulation control module; the at least one specified electrical parameter includes voltage and / or current; The electrical parameter control module is used to control the specified electrical parameters based on the resistance simulation target information output by the processing module and the detection results, so that the target object can detect the required simulated resistance information based on the specified electrical parameters.

2. The communication device according to claim 1, characterized in that, The electrical parameter control module includes: a voltage control mode for controlling the voltage of the connection terminal and a current control mode for controlling the current of the connection terminal. If the target object detects the simulated resistance information by detecting voltage, then the specified electrical parameter is voltage, and the electrical parameter control module is in voltage control mode; If the target object detects the simulated resistance information by detecting the current, then the specified electrical parameter is current, and the electrical parameter control module is in current control mode.

3. The communication device according to claim 1, characterized in that, The system includes a first channel with the resistance simulation circuit, the first channel having at least one state, the at least one state including a resistance simulation state. When the first channel is in the resistance simulation state, the resistance simulation feedback module is connected between the connection terminal and the electrical parameter control module, so that the electrical parameter control module can control the specified electrical parameter based on the detection result.

4. The communication device according to claim 3, characterized in that, The at least one state also includes at least one of the following: Voltage analog output status used to output voltage analog signals through the connection terminal; Current analog output status used to output current analog signals through the connection terminal; When in the voltage analog output state, the electrical parameter control module can output the voltage analog signal in response to the output signal of the processing module; When in the current analog output state, the electrical parameter control module can output the current analog signal in response to the output signal of the processing module.

5. The communication device according to claim 3, characterized in that, The first channel further includes a driver, an upper transistor, and a lower transistor; the driver is connected to the control terminals of the upper transistor and the lower transistor, the first end of the upper transistor is connected to a power supply, the second end of the upper transistor is connected to the first end of the lower transistor, the second end of the lower transistor is directly or indirectly grounded, and the connection terminal is directly or indirectly connected to the second end of the upper transistor; the power supply includes a voltage source and / or a current source; The at least one state also includes at least one of the following: Voltage digital output status used to output a voltage digital signal through the connection terminal; Current digital output status used to output a current digital signal through the connection terminal; When in the voltage digital output state, the electrical parameter control module is used as the voltage source; the driver responds to the control of the processing module to control the on / off state of the upper and lower transistors to form the voltage digital signal at the connection terminal; When in the voltage digital output state, the electrical parameter control module is used as the current source; the driver responds to the control of the processing module to control the on / off state of the upper and lower transistors to form the voltage digital signal at the connection terminal.

6. The communication device according to claim 1, characterized in that, It includes a motherboard, a first daughterboard, and a second daughterboard. The motherboard is equipped with a host communication module, which is used to communicate directly or indirectly with a host. The resistor simulation circuit is located on the first daughterboard. Both the first daughterboard and the second daughterboard communicate with the host through the motherboard. The second sub-board is provided with a second channel for connecting the target object. The second channel includes at least one of the following: a bus communication channel, a serial communication channel, a signal acquisition channel, a unidirectional transmission channel for signals with customized characteristics, and a unidirectional transmission channel for non-standard special signals.

7. A testing system, characterized in that, The system includes the communication device as described in any one of claims 1 to 6 and the host computer; the processing module is used to obtain simulated resistance information from the host computer or to generate associated information of the simulated resistance information.

8. The testing system according to claim 7, characterized in that, It also includes a selective switching device and a signal acquisition channel; the selective switching device is connected to the signal generation channel, the signal acquisition channel and the general connection part; The general connection unit is used to: connect the signal output line of the first target object corresponding to the first test task when performing the first test task; and connect the signal input line of the second target object corresponding to the second test task when performing the second test task. The selective connection device is used to: connect the general connection unit to the signal acquisition channel when performing the first test task, so that the information to be reported sent by the first target object can be transmitted to the host through the signal acquisition channel; and connect the general connection unit to the signal generation channel when performing the second test task, so that the corresponding information to be sent can be transmitted to the second target object through the signal generation channel.

9. The testing system according to claim 7, characterized in that, It also includes a selective switching device and a bus communication channel; the selective switching device is connected to the signal generation channel, the bus communication channel and the general connection unit; The general connection unit is used to: connect the bus interaction line of the third target object corresponding to the third test task when performing the third test task, and connect the signal input unit of the fourth target object corresponding to the fourth test task when performing the fourth test task; The selective connection device is used to connect the general connection unit to the bus communication channel when performing the third test task, so that the host can communicate with the third target object using the bus communication channel. When performing the fourth test task, the general connection unit is connected to the signal generation channel, so that the corresponding information to be sent can be transmitted to the fourth target object through the signal generation channel.

10. The testing system according to claim 7, characterized in that, It also includes a selective switching device, which connects the resistance simulation circuit, the target channel, and the general connection part; the target channel is at least one of the following: a first channel, a signal acquisition channel, and a bus communication channel; The general connection unit is used to: connect the detection line of the fifth target object corresponding to the fifth test task when executing the fifth test task, and connect the target line of the sixth target object corresponding to the sixth test task when executing the sixth test task; The selective connection device is used to connect the general connection part to the resistance simulation circuit when performing the fifth test task, so that the host can simulate the simulated resistance information to the fifth target object through the resistance simulation circuit, and connect the general connection part to the target channel when performing the sixth test task.

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